Aerosol generation system

Abstract

[Problem] To provide a mechanism capable of further improving the quality of user experience. [Solution] An aerosol generation system comprising: a cylindrical body that accommodates a base material containing an aerosol source; a plurality of resistive heating layers that are layered on the outer side of a side wall of the cylindrical body; a plurality of first electrical insulation layers that are layered on the outer side of the side wall of the cylindrical body further inward than the resistive heating layers; and a power source unit that supplies electrical power to the resistive heating layers, wherein the cylindrical body is composed of a material having conductivity, and at least one end part of two end parts of each resistive heating layer protrudes from the corresponding first electrical insulation layer, is connected to the cylindrical body, is electrically connected, via the cylindrical body, to another resistive heating layer adjacent to said resistive heating layer, and is electrically connected to the power source unit via the other resistive heating layer.

Description

Aerosol Generation System

[0001] The present disclosure relates to an aerosol generating system.

[0002] Inhalation devices, such as electronic cigarettes and nebulizers, that generate substances to be inhaled by users are widely used. For example, inhalation devices generate aerosols containing flavor components using a substrate containing an aerosol source for generating aerosols and a flavor source for imparting flavor components to the generated aerosol. Users can enjoy the flavor by inhaling the flavor-imparted aerosol generated by the inhalation device. The action of a user inhaling an aerosol is hereinafter also referred to as a puff or a puffing action.

[0003] In suction devices that generate aerosols by heating a substrate, improvements in heating efficiency are required. For example, Patent Document 1 listed below discloses a technique in which a coating of an electrically insulating material is formed on the surface of a heating chamber having an opening for receiving the substrate, and a coating of an electrically conductive material that acts as a Joule heater is further formed thereon.

[0004] International Publication No. 2022 / 167261

[0005] However, the technology disclosed in the above-mentioned Patent Document 1 has only recently been developed, and there is still room for improvement in various respects.

[0006] Therefore, the present disclosure has been made in consideration of the above problems, and an object of the present disclosure is to provide a mechanism that can further improve the quality of the user experience.

[0007] In order to solve the above problem, according to one aspect of the present invention, an aerosol generation system is provided, comprising: a cylindrical body that contains a substrate containing an aerosol source; a plurality of resistive heating layers stacked on the outside of the side wall of the cylindrical body; a plurality of first electrical insulating layers that are stacked inside the resistive heating layers and on the outside of the side wall of the cylindrical body; and a power supply unit that supplies power to the resistive heating layers, wherein the cylindrical body is made of a conductive material, and at least one of the two ends of the resistive heating layer extends beyond the first electrical insulating layer and is connected to the cylindrical body, is electrically connected to another resistive heating layer adjacent to the resistive heating layer via the cylindrical body, and is electrically connected to the power supply unit via the other resistive heating layer.

[0008] The side walls of the cylindrical body may include a plurality of first side walls having flat outer surfaces and a plurality of second side walls different from the first side walls, the first side walls and the second side walls being arranged alternately along the circumferential direction of the cylindrical body, the first electrical insulation layer being stacked on the outside of the first side walls, and the two resistive heating layers being stacked on the outside of the two first side walls on either side of the second side wall, spaced apart on the second side walls.

[0009] The resistive heating layer and the first electrical insulating layer may each be deposited using a vapor deposition process or a printing process.

[0010] The portion of the outer periphery of the cylindrical body on which the first electrical insulating layer is laminated may occupy less than 50% of the outer periphery of the cylindrical body.

[0011] The first electrically insulating layer may have a shape that conforms to the resistive heating layer.

[0012] The aerosol generating system may further include a plurality of second electrically insulating layers laminated outside the resistive heating layer using a vapor deposition process or a printing process, and at least a portion of the resistive heating layer may be sandwiched between the first electrically insulating layer and the second insulating layer.

[0013] A conductor connected to the power supply unit may be connected to the cylindrical body, and one of the two ends of the resistance heating layer may extend beyond the first electrical insulation layer and be connected to the cylindrical body, and may be electrically connected to the conductor connected to the cylindrical body via the cylindrical body.

[0014] The end of the resistive heating layer that protrudes from the first electrical insulating layer may be connected to the first side wall.

[0015] Of the two ends of the resistive heating layer, the end that protrudes from the first electrical insulating layer may protrude from the first side wall and be connected to the second side wall.

[0016] A conductor connected to the power supply unit may be connected to one of the two ends of the resistance heating layer.

[0017] A conductor connected to the power supply may be connected to each of two ends of the resistive heating layer.

[0018] Of the two ends of the resistance heating layer, the end to which the conductor connected to the power supply unit is connected may be configured to be wider than the other portions.

[0019] The aerosol generation system may further include a first thermal diffusion layer that is laminated using a plating process on the outside of the side wall of the cylindrical body and inside the resistance heating layer.

[0020] The aerosol generation system may further include a second thermal diffusion layer wrapped around and laminated on the outside of the side wall of the cylindrical body, outside the resistance heating layer.

[0021] The aerosol generation system may further include a heat insulating layer wrapped around and laminated on the outside of the side wall of the cylindrical body, outside the resistance heating layer.

[0022] The insulating layer may be laminated so as to cover a portion of the side wall of the cylindrical body in the axial direction of the cylindrical body, and the end of the insulating layer in the axial direction of the cylindrical body and the portion exposed from the insulating layer may be sealed by a sealing portion.

[0023] The resistance heating layer may be disposed at a position of the substrate accommodated in the cylindrical body corresponding to a portion where the aerosol source is distributed.

[0024] The first side wall may be a flat plate, the second side wall may be a curved plate curved outward from the cylindrical body along the circumferential direction of the cylindrical body, and the substrate contained in the cylindrical body may be pressed by the first side wall.

[0025] The first side wall may be a flat plate, the second side wall may be a flat plate, the length of the first side wall may be longer than the length of the second side wall in the circumferential direction of the cylindrical body, and the substrate contained in the cylindrical body may be pressed by the first side wall.

[0026] The aerosol generating system may further comprise the substrate.

[0027] As described above, the present disclosure provides a mechanism that can further improve the quality of the user experience.

[0028] 10 is a schematic diagram showing an example of a configuration of a suction device. FIG. 11 is a perspective view of an example of a heating system for a suction device according to an embodiment of the present disclosure. FIG. 12 is a perspective view of a storage unit shown in FIG. 2. FIG. 13 is a cross-sectional view of a storage unit taken along arrows 4-4 shown in FIG. 3. FIG. 14 is a cross-sectional view of a storage unit taken along arrows 5-5 shown in FIG. 4. FIG. 15 is a longitudinal cross-sectional view of a storage unit including a non-pressing unit with a stick-shaped substrate held in the holding unit. FIG. 16 is a longitudinal cross-sectional view of a storage unit including a pressing unit with a stick-shaped substrate held in the holding unit. FIG. 17 is a cross-sectional view of a storage unit taken along arrows 7-7 shown in FIG. 7. FIG. 18 is a diagram showing an example of a manufacturing process for a heating system according to the embodiment. FIG. 19 is a diagram showing the configuration of an outer thermal diffusion layer shown in FIG. 10. FIG. 19 is a diagram showing the configuration of a heat insulating unit shown in FIG. 19. FIG. 20 is a diagram showing an example of a manufacturing process for a heating system according to a first modified example. FIG. 21 is a diagram showing an example of a manufacturing process for a heating system according to a second modified example. FIG. 22 is a diagram showing an example of a manufacturing process for a heating system according to a third modified example. FIG. 23 is a diagram showing an example of a manufacturing process for a heating system according to a fourth modified example. FIG. 24 is a diagram showing an example of a manufacturing process for a heating system according to a fifth modified example. FIG. 25 is a diagram showing an example of a configuration of a storage unit and stick-shaped substrates according to a sixth modified example. FIG. 26 is a diagram showing an example of a manufacturing process for a heating system according to a seventh modified example.

[0029] Preferred embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0030] Furthermore, in this specification and drawings, elements having substantially the same functional configuration may be distinguished by assigning an index containing different letters or numbers after the same reference numeral. For example, multiple elements having substantially the same functional configuration may be distinguished as necessary, such as devices 1-1, 1-2, and 1-3. However, when there is no particular need to distinguish between multiple elements having substantially the same functional configuration, only the same reference numeral is assigned. For example, when there is no particular need to distinguish between devices 1-1, 1-2, and 1-3, they may also be simply referred to as device 1.

[0031] 1. Configuration Example of Inhalation Device The inhalation device is a device that generates a substance to be inhaled by a user. In the following description, the substance generated by the inhalation device is described as an aerosol. Alternatively, the substance generated by the inhalation device may be a gas.

[0032] 1 is a schematic diagram showing an example of the configuration of a suction device. As shown in Fig. 1, a suction device 100 according to this example configuration includes a power supply unit 111, a sensor unit 112, a notification unit 113, a memory unit 114, a communication unit 115, a control unit 116, a heating unit 40, a storage unit 50, and a heat insulating unit 70.

[0033] The power supply unit 111 stores electric power and supplies electric power to each component of the suction device 100 under the control of the control unit 116. The power supply unit 111 may be configured by, for example, a rechargeable battery such as a lithium ion secondary battery.

[0034] The sensor unit 112 acquires various types of information related to the suction device 100. As one example, the sensor unit 112 is configured with a pressure sensor such as a condenser microphone, a flow rate sensor, a temperature sensor, or the like, and acquires values ​​associated with suction by the user. As another example, the sensor unit 112 is configured with an input device such as a button or a switch that accepts information input from the user.

[0035] The notification unit 113 notifies the user of information. The notification unit 113 is configured by, for example, a light emitting device that emits light, a display device that displays an image, a sound output device that outputs sound, or a vibration device that vibrates.

[0036] The storage unit 114 stores various types of information for the operation of the suction device 100. The storage unit 114 is configured by a non-volatile storage medium such as a flash memory, for example.

[0037] The communication unit 115 is a communication interface capable of performing communication conforming to any wired or wireless communication standard, such as Wi-Fi (registered trademark), Bluetooth (registered trademark), BLE (Bluetooth Low Energy (registered trademark)), NFC (Near Field Communication), or LPWA (Low Power Wide Area).

[0038] The control unit 116 functions as an arithmetic processing unit and a control unit, and controls the overall operation of the suction device 100 in accordance with various programs. The control unit 116 is realized by an electronic circuit such as a CPU (Central Processing Unit) or a microprocessor.

[0039] The storage unit 50 has an internal space 80 and holds the stick-shaped substrate 150 while accommodating a portion of the stick-shaped substrate 150 in the internal space 80. The storage unit 50 has an opening 52 that connects the internal space 80 to the outside and accommodates the stick-shaped substrate 150 inserted into the internal space 80 through the opening 52. For example, the storage unit 50 is a cylindrical body with the opening 52 and a bottom wall 56 as its bottom surface, and defines a columnar internal space 80. An air flow path that supplies air to the internal space 80 may be connected to the storage unit 50. An air inlet, which is an air inlet to the air flow path, is arranged, for example, on a side surface of the suction device 100. An air outlet, which is an air outlet from the air flow path to the internal space 80, is arranged, for example, on the bottom wall 56.

[0040] The stick-shaped substrate 150 includes a substrate portion 151 and a mouthpiece portion 152. The substrate portion 151 includes an aerosol source. The aerosol source includes a tobacco-derived or non-tobacco-derived flavor component. When the inhalation device 100 is a medical inhaler such as a nebulizer, the aerosol source may include a medicament. The aerosol source may be, for example, a liquid such as a polyhydric alcohol, such as glycerin or propylene glycol, or water, containing a tobacco-derived or non-tobacco-derived flavor component, or a solid containing a tobacco-derived or non-tobacco-derived flavor component. When the stick-shaped substrate 150 is held in the storage portion 50, at least a portion of the substrate portion 151 is housed in the internal space 80, and at least a portion of the mouthpiece portion 152 protrudes from the opening 52. When a user holds the mouthpiece portion 152 protruding from the opening 52 in their mouth and inhales, air flows into the internal space 80 via an air flow path (not shown) and reaches the user's mouth along with the aerosol generated from the substrate portion 151.

[0041] The heating unit 40 generates aerosol by heating the aerosol source and atomizing the aerosol source. In the example shown in FIG. 1 , the heating unit 40 is configured in a film shape and is arranged to cover the outer periphery of the storage unit 50. When the heating unit 40 generates heat, the substrate unit 151 of the stick-shaped substrate 150 is heated from the outer periphery, generating aerosol. The heating unit 40 generates heat when power is supplied from the power supply unit 111. As an example, power may be supplied when the sensor unit 112 detects that the user has started inhaling and / or that predetermined information has been input. Power supply may be stopped when the sensor unit 112 detects that the user has stopped inhaling and / or that predetermined information has been input.

[0042] The heat insulating section 70 prevents heat transfer from the heating section 40 to other components. For example, the heat insulating section 70 is made of a vacuum heat insulating material, an aerogel heat insulating material, or the like.

[0043] The above describes an example of the configuration of the suction device 100. Of course, the configuration of the suction device 100 is not limited to the above, and various configurations such as those exemplified below may be used.

[0044] As an example, the storage unit 50 may include an opening / closing mechanism such as a hinge that opens and closes a portion of the outer shell that forms the internal space 80. The storage unit 50 may then open and close the outer shell to store the stick-shaped substrate 150 inserted into the internal space 80 while clamping it. In this case, the heating unit 40 may be provided at the clamping location in the storage unit 50, and may heat the stick-shaped substrate 150 while pressing it.

[0045] The intake and exhaust form of the container 50 may be a so-called counterflow. In this case, as the user puffs, air flows into the internal space 80 from the opening 52. The air then passes through the inside of the stick-shaped substrate 150 from the tip of the stick-shaped substrate 150 and reaches the user's mouth together with the aerosol.

[0046] The stick-shaped substrate 150 is an example of an aerosol-generating substrate containing an aerosol source. The inhalation device 100 and the stick-shaped substrate 150 work together to generate an aerosol that is inhaled by a user. Therefore, the combination of the inhalation device 100 and the stick-shaped substrate 150 may be considered an aerosol-generating system.

[0047] 2. Technical Features 2.1. Basic Configuration The basic configuration of the suction device 100 according to this embodiment, with respect to heating the stick-shaped substrate 150, will be described below with reference to FIGS.

[0048] FIG. 2 is a perspective view of an example of the heating system 30 of the inhalation device 100 according to the present embodiment. The heating system 30 is a system consisting of components involved in heating the stick-shaped substrate 150. The heating system 30 shown in FIG. 2 includes a heating unit 40 and a storage unit 50. In addition to the heating unit 40 and storage unit 50 shown in FIG. 2, the heating system 30 also includes an outer thermal diffusion layer 90 and a heat-shrinkable tube 99, which will be described later, as well as an insulating unit 70. As shown in FIG. 2, the heating unit 40 is disposed outside the storage unit 50. Therefore, when the heating unit 40 generates heat, the storage unit 50 is heated from the outside, and the stick-shaped substrate 150 is heated by heat transfer from the storage unit 50. This makes it possible to generate an aerosol from the stick-shaped substrate 150.

[0049] FIG. 3 is a perspective view of the storage unit 50 shown in FIG. 2. FIG. 4 is a cross-sectional view of the storage unit 50 taken along arrows 4-4 in FIG. 3. FIG. 5 is a cross-sectional view of the storage unit 50 taken along arrows 5-5 in FIG. 4. As shown in FIGS. 3 to 5, the storage unit 50 is a cylindrical body with a bottom, including an opening 52, a side wall 54, and a bottom wall 56 that closes the end opposite the opening 52. The side wall 54 has an inner surface 54a and an outer surface 54b. The bottom wall 56 has an inner surface 56a and an outer surface 56b. The stick-shaped substrate 150 is inserted into the storage unit 50 through the opening 52 and is housed in the internal space 80 surrounded by the side wall 54 and bottom wall 56. The storage unit 50 is preferably made of a metal with high thermal conductivity, such as SUS (stainless steel). This allows for efficient heating of the stick-shaped substrate 150.

[0050] The stick-shaped substrate 150 is inserted and removed along the axial direction of the cylindrical storage unit 50. Within the axial direction, the direction in which the stick-shaped substrate 150 is inserted is also referred to as "downward," and the direction in which the stick-shaped substrate 150 is removed is also referred to as "upward." The axial direction is also referred to as the up-down direction. The up-down direction may be the longitudinal direction of the storage unit 50. Among directions perpendicular to the up-down direction, the direction toward the central axis of the storage unit 50 is also referred to as "inward," and the direction away from the central axis is also referred to as "outward."

[0051] As shown in FIGS. 3 to 5 , the storage unit 50 has a holding unit 60 that holds the stick-shaped substrate 150. The holding unit 60 includes a pressing unit 62 that presses a portion of the stick-shaped substrate 150, and a non-pressing unit 66. The pressing unit 62 has an inner surface 62a and an outer surface 62b. The non-pressing unit 66 has an inner surface 66a and an outer surface 66b. The pressing unit 62 and the non-pressing unit 66 are part of the side wall 54 of the storage unit 50. The pressing unit 62 is an example of a first side wall. The non-pressing unit 66 is an example of a second side wall that is different from the first side wall.

[0052] The opening 52 of the storage unit 50 is preferably able to receive the stick-shaped substrate 150 without applying pressure. In other words, the opening 52 of the storage unit 50 is preferably configured to be larger than the stick-shaped substrate 150 in a plane perpendicular to the vertical direction. The shape of the opening 52 of the storage unit 50 in a plane perpendicular to the vertical direction may be polygonal or elliptical, but is preferably circular.

[0053] 2, the heating section 40 is disposed on the outer surface 62b of the pressing section 62. The heating section 40 is preferably disposed without any gaps on the outer surface 62b of the pressing section 62. The heating section 40 is also preferably disposed over the entire outer surface 62b of the pressing section 62. However, the heating section 40 is preferably disposed so as not to protrude beyond the outer surface 62b of the pressing section 62. Of course, the heating section 40 may be disposed so as to protrude from the outer surface 62b of the pressing section 62 onto the outer surface 66b of the non-pressing section 66.

[0054] As shown in Figure 2, the heating unit 40 has a heat-generating region 44 and a non-heat-generating region 45. The heat-generating region 44 is a region that generates heat when a current is applied to the heating unit 40. The non-heat-generating region 45 is a region that does not generate heat or generates very little heat even when a current is applied to the heating unit 40. The heat-generating region 44 is located on the outer surface 62b of the pressing unit 62. With this configuration, it is possible to efficiently heat the stick-shaped substrate 150 while pressing the stick-shaped substrate 150 with the pressing unit 62.

[0055] As shown in FIGS. 3 to 5 , in this embodiment, the storage unit 50 has two pressing portions 62 and two non-pressing portions 66. The pressing portions 62 and the non-pressing portions 66 are alternately arranged along the circumferential direction of the storage unit 50. In particular, the two pressing portions 62 of the holding unit 60 face each other. The distance between at least a portion of the inner surfaces 62 a of the two pressing portions 62 is smaller than the width of the portion of the stick-shaped substrate 150 inserted into the storage unit 50 that is located between the pressing portions 62. With this configuration, the stick-shaped substrate 150 can be pressed by the two opposing pressing portions 62.

[0056] 3 to 5, the inner surface 66a of the non-pressing portion 66 of the holding portion 60 is curved in a plane perpendicular to the longitudinal direction of the accommodating portion 50. The shape of the inner surface 66a of the non-pressing portion 66 in the plane perpendicular to the longitudinal direction of the accommodating portion 50 is preferably the same as the shape of the opening 52 in the plane perpendicular to the longitudinal direction of the accommodating portion 50 at any position in the longitudinal direction of the accommodating portion 50. In other words, the inner surface 66a of the non-pressing portion 66 is preferably formed by extending the inner surface of the accommodating portion 50 that forms the opening 52 in the longitudinal direction. The outer surface 66b of the non-pressing portion 66 of the holding portion 60 is curved parallel to the inner surface 66a.

[0057] As shown in FIG. 5 , the inner surface 62a of the pressing portion 62 has a pair of opposing flat pressing surfaces. On the other hand, the inner surface 66a of the non-pressing portion 66 has a pair of opposing curved non-pressing surfaces connecting both ends of the pair of flat pressing surfaces. As shown, the curved non-pressing surfaces may have an overall arc-shaped cross section in a plane perpendicular to the longitudinal direction of the storage portion 50. The outer surface 62b of the pressing portion 62 and the outer surface 66b of the non-pressing portion 66 are connected to each other at an angle, and a boundary 68 may be formed between the outer surface 62b of the pressing portion 62 and the outer surface 66b of the non-pressing portion 66. As shown in FIG. 5 , the pressing portion 62 and the non-pressing portion 66 (i.e., the side wall 54 of the storage portion 50) may have a uniform thickness. For example, the pressing portion 62 may be a flat plate. Alternatively, the non-pressing portion 66 may be a curved plate that curves outward from the storage portion 50 along the circumferential direction of the storage portion 50.

[0058] 3 and 4 , the storage part 50 preferably has a first guide part 58 equipped with a tapered surface 58a that connects the inner surface of the storage part 50 (i.e., the non-holding part 69) that forms the opening 52 with the inner surface 62a of the pressing part 62. The first guide part 58 smoothly connects the pressing part 62 and the non-holding part 69, making it possible to suitably guide the stick-shaped substrate 150 into the holding part 60 during the process of inserting the stick-shaped substrate 150 into the storage part 50.

[0059] As shown in Figure 4, the storage unit 50 preferably has a cylindrical non-holding portion 69 between the opening 52 and the holding portion 60. The non-holding portion 69 is a portion of the storage unit 50 that does not contribute to holding the stick-shaped substrate 150. For example, in a plane perpendicular to the longitudinal direction of the storage unit 50, the non-holding portion 69 can be formed to be larger than the stick-shaped substrate 150. This makes it possible to easily insert the stick-shaped substrate 150 into the storage unit 50.

[0060] Fig. 6 is a longitudinal cross-sectional view of the storage unit 50 including the non-pressing portion 66, with the stick-shaped substrate 150 held by the holding portion 60. Fig. 7 is a longitudinal cross-sectional view of the storage unit 50 including the pressing portion 62, with the stick-shaped substrate 150 held by the holding portion 60. Fig. 8 is a cross-sectional view of the storage unit 50 taken along the arrows 7-7 shown in Fig. 7. Note that Fig. 8 shows a cross-section of the stick-shaped substrate 150 before it is pressed, so that it is easy to see that the stick-shaped substrate 150 is pressed by the pressing portion 62.

[0061] As shown in Fig. 6, the stick-shaped substrate 150 is pressed by the pressing portion 66, and the inner surface 66a of the pressing portion 66 is in close contact with the stick-shaped substrate 150. On the other hand, as shown in Fig. 7, a gap 67 is formed between the inner surface 66a of the non-pressing portion 66 and the stick-shaped substrate 150.

[0062] 8 , the gap 67 between the inner surface 66 a of the non-pressing portion 66 and the stick-shaped substrate 150 is substantially maintained even when the stick-shaped substrate 150 is held by the holding portion 60 and is deformed by being pressed by the pressing portion 62. When the intake and exhaust mode of the storage portion 50 is counterflow, this gap 67 can form an air flow path that connects the opening 52 and the tip of the stick-shaped substrate 150.

[0063] As shown in FIG. 8, when the stick-shaped substrate 150 is held by the holding part 60, the distance L between the inner surface 62a of the pressing part 62 and the center of the stick-shaped substrate 150 is Ａ is the distance L between the inner surface 66a of the non-pressure portion 66 and the center of the stick-shaped substrate 150 ＢWith this configuration, the distance between the heating unit 40 arranged on the outer surface 62b of the pressing unit 62 and the center of the stick-shaped substrate 150 can be made shorter than when the pressing unit 62 is not provided. This makes it possible to improve the heating efficiency of the stick-shaped substrate 150.

[0064] 3 to 8, it is preferable that the outer peripheral surface of the holding part 60 has the same shape and size (the outer peripheral length of the holding part 60 in a plane perpendicular to the longitudinal direction of the holding part 60) over the entire longitudinal length of the holding part 60. This makes it possible to ensure a gap 67 while uniformly pressing the stick-shaped substrate 150 over the entire vertical area of ​​the holding part 60.

[0065] As described above, the suction device 100 according to this embodiment heats the stick-shaped substrate 150 while pressing it with the pressing part 62. This configuration makes it possible to improve the heating efficiency of the stick-shaped substrate 150 compared to when the stick-shaped substrate 150 is heated without being pressed.

[0066] 2.2. Configuration of heating system 30 The heating system 30 according to this embodiment is manufactured by sequentially stacking components that constitute the heating system 30 on the outside of the side wall 54 of the accommodation section 50. Below, the manufacturing process of the heating system 30 will be described with reference to FIGS. 9 and 10 , and the configuration of the heating system 30 will be described.

[0067] 9 and 10 are diagrams showing an example of a manufacturing process for the heating system 30 according to this embodiment. The manufacturing process for the heating system 30 according to this embodiment proceeds sequentially through manufacturing steps S11 to S17 shown in FIGS. 9 and 10. Hereinafter, the two pressing portions 62 of the holding portion 60 may be referred to as pressing portion 62-1 and pressing portion 62-2. Similarly, the two non-pressing portions 66 of the holding portion 60 may be referred to as non-pressing portion 66-1 and non-pressing portion 66-2. In FIGS. 9 and 10, each manufacturing process is illustrated in a developed view in which the side wall 54 of the storage portion 50 (particularly the portion corresponding to the holding portion 60) is divided and developed at the center of the non-pressing portion 66-2. The left-right direction in these developed views corresponds to the circumferential direction of the storage portion 50.

[0068] In the manufacturing process S11 of FIG. 9, the accommodation section 50 is shown before other components are stacked on the holding section 60.

[0069] In manufacturing process S12 of FIG. 9 , first, the first electrical insulating layer 41 (41-1 and 41-2) is laminated on the pressing portion 62. Specifically, the first electrical insulating layer 41-1 is laminated on the outer side of the pressing portion 62-1, and the first electrical insulating layer 41-2 is laminated on the outer side of the pressing portion 62-2. The first electrical insulating layer 41 is made of a material having electrical insulating properties. Examples of materials that can be used to form the first electrical insulating layer 41 include glass and ceramic. The first electrical insulating layer 41 is laminated using a vapor deposition process or a printing process. The vapor deposition process is a process in which a substance is evaporated onto the surface of a target object to form a thin film coating. The printing process is a process in which a liquid is sprayed onto the surface of a target object to form a thin film coating.

[0070] In manufacturing step S13 of FIG. 9 , the resistive heating layers 42 (42-1 and 42-2) are laminated on the outer surface of the pressing portion 62 of the heating system 30 undergoing manufacturing step S12. Specifically, the resistive heating layer 42-1 is laminated on the outer surface of the first electrical insulating layer 41-1 laminated on the pressing portion 62-1, and the resistive heating layer 42-2 is laminated on the outer surface of the first electrical insulating layer 41-2 laminated on the pressing portion 62-2. In particular, the resistive heating layer 42 is laminated on the first electrical insulating layer 41 in the shape of a single line that moves back and forth up and down while leaving a gap between the left and right. The resistive heating layer 42 is made of a conductive material. Examples of materials that constitute the resistive heating layer 42 include metallic materials such as SUS and non-metallic materials such as silicon carbide. The resistive heating layer 42 may also be made of a conductive paste-like material. One example of such a material is a material primarily composed of silver and a resistance adjuster. When a current is applied to the resistive heating layer 42, the resistive heating layer 42 generates Joule heat according to the electrical resistance. The resistive heating layer 42 is laminated using a vapor deposition process or a printing process.

[0071] 9, the resistive heating layer 42-1 forms an open circuit with a first end 46-1 and a second end 47-1 as its two ends. The resistive heating layer 42-2 forms an open circuit with a first end 46-2 and a second end 47-2 as its two ends. The first end 46 (46-1 and 46-2) is disposed within the first electrical insulating layer 41. Specifically, the first end 46 is disposed at the lower end of the first electrical insulating layer 41. Meanwhile, the second end 47 (47-1 and 47-2) is disposed protruding from the first electrical insulating layer 41. Specifically, the second end 47 protrudes from the first electrical insulating layer 41 and further protrudes from the pressing portion 62 to be disposed in the non-pressing portion 66.

[0072] 9, a second electrical insulating layer 43 (43-1 and 43-2) is laminated on the outer side of the pressing unit 62 of the heating system 30 in the process of manufacture after the manufacturing process S13. Specifically, the second electrical insulating layer 43-1 is laminated on the outer side of the first electrical insulating layer 41-1 and the resistance heating layer 42-2 laminated on the pressing unit 62-1, and the second electrical insulating layer 43-2 is laminated on the outer side of the first electrical insulating layer 41-2 and the resistance heating layer 42-2 laminated on the pressing unit 62-2. The second electrical insulating layer 43 is made of an electrically insulating material, similar to the first electrical insulating layer 41. The second electrical insulating layer 43 is laminated using a vapor deposition process or a printing process.

[0073] Furthermore, in manufacturing process S14, a conductor 48-1 is connected to the resistive heating layer 42-1, and a conductor 48-2 is connected to the resistive heating layer 42-2. More specifically, the conductor 48-1 is connected to a first end 46-1 of the resistive heating layer 42-1, and the conductor 48-2 is connected to a first end 46-2 of the resistive heating layer 42-2. The conductors 48 (48-1 and 48-2) are connected to a power supply 111. As an example, the first end 46-1 of the resistive heating layer 42-1 is connected to the negative electrode of the power supply 111 via the conductor 48-1. On the other hand, the first end 46-2 of the resistive heating layer 42-2 is connected to the positive electrode of the power supply 111 via the conductor 48-2. The power supply 111 then supplies power to the resistive heating layer 42 under control of the control unit 116, causing the resistive heating layer 42 to generate heat.

[0074] The housing portion 50 is made of a conductive material, such as stainless steel.

[0075] The second end 47-1 of the resistive heating layer 42-1 protrudes from the first electrical insulating layer 41-1 and is connected to the housing 50, and is electrically connected to the power supply 111 via the housing 50. Similarly, the second end 47-2 of the resistive heating layer 42-2 protrudes from the first electrical insulating layer 41-2 and is connected to the housing 50, and is electrically connected to the power supply 111 via the housing 50. More specifically, the second end 47-1 of the resistive heating layer 42-1 and the second end 47-2 of the resistive heating layer 42-2 adjacent to the resistive heating layer 42-1 are electrically connected via the housing 50. The first end 46-1 of the resistive heating layer 42-1 is electrically connected to the power supply 111 via a conductor 48-1, and the first end 46-2 of the resistive heating layer 42-2 is electrically connected to the power supply 111 via a conductor 48-2. With the configuration described above, the conducting wire 48-1, the resistive heating layer 42-1, the housing portion 50, the resistive heating layer 42-2, and the conducting wire 48-2 form a single series circuit connected to the power supply unit 111. When the power supply unit 111 supplies power to this series circuit, it becomes possible to cause the resistive heating layers 42-1 and 42-2 to generate heat.

[0076] As described above, the first electrical insulating layer 41-1, the resistive heating layer 42-1, and the second electrical insulating layer 43-1 constitute the heating unit 40-1. The first electrical insulating layer 41-2, the resistive heating layer 42-2, and the second electrical insulating layer 43-2 constitute the heating unit 40-2. The components constituting the heating unit 40 (40-1 and 40-2) are laminated using a printing process or a vapor deposition process. Therefore, compared to other manufacturing methods, such as manufacturing the heating unit 40 separately and then attaching it to the housing unit 50, the manufacturing precision of the heating system 30 can be improved by preventing defects such as misalignment and peeling of the heating unit 40. As a result, the heating efficiency of the stick-shaped substrate 150 can be improved, improving the quality of the user experience.

[0077] The following provides additional information about the characteristics of the heating unit 40.

[0078] Referring back to manufacturing steps S12 to S14, the first electrical insulating layer 41-1 is laminated inside the resistive heating layer 42-1, and the second electrical insulating layer 43-1 is laminated outside the resistive heating layer 42-1. At least a portion of the resistive heating layer 42-1 is sandwiched between the first electrical insulating layer 41-1 and the resistive heating layer 42-2. This configuration makes it possible to prevent short circuits within the resistive heating layer 42-1 via components inside the heating unit 40 (e.g., the housing 50) or components outside the heating unit 40 (e.g., the outer thermal diffusion layer g1, described below). The same applies to the first electrical insulating layer 41-2, the resistive heating layer 42-2, and the second electrical insulating layer 43-2.

[0079] Referring back to manufacturing step S13, the resistive heating layer 42-1 and the resistive heating layer 42-2 are stacked on the outside of the pressurized portions 62-1 and 62-2 on either side of the non-pressurized portion 66-1, while being spaced apart at the non-pressurized portion 66-1. This configuration allows the resistive heating layer 42 to be disposed on a flat surface on the pressurized portion 62. Therefore, compared to disposing the resistive heating layer 42 on a curved surface on the non-pressurized portion 66, defects such as misalignment and peeling can be prevented, improving the manufacturing accuracy of the heating system 30. As a result, the heating efficiency of the stick-shaped substrate 150 can be improved, improving the quality of the user experience.

[0080] Referring back to manufacturing step S13, the second end 47-1 of the resistive heating layer 42-1, which extends beyond the first electrical insulating layer 41-1, extends beyond the pressing portion 62-1 and is connected to the non-pressing portion 66-1. On the other hand, the second end 47-2 of the resistive heating layer 42-2, which extends beyond the first electrical insulating layer 41-2, extends beyond the pressing portion 62-2 and is connected to the non-pressing portion 66-1. That is, the second end 47-1 of the resistive heating layer 42-1 and the second end 47-2 of the resistive heating layer 42-2 are positioned so that they protrude toward each other from the left and right ends of the non-pressing portion 66-1. This configuration minimizes the distance between the second end 47-1 of the resistive heating layer 42-1 and the second end 47-2 of the resistive heating layer 42-2. This facilitates electrical conduction between the resistive heating layer 42-1 and the resistive heating layer 42-2.

[0081] Referring again to manufacturing process S13, the resistive heating layer 42 laminated in the heat-generating region 44 is configured to be thin. This increases the electrical resistance of the resistive heating layer 42 laminated in the heat-generating region 44, making it possible to generate high Joule heat when power is applied. On the other hand, the resistive heating layer 42 laminated in the non-heat-generating region 45 of the heating unit 40 is configured to be wider than the resistive heating layer 42 laminated in the heat-generating region 44. This decreases the electrical resistance of the resistive heating layer 42 laminated in the non-heat-generating region 45, making it possible to generate no Joule heat or very little Joule heat when power is applied.

[0082] Referring again to manufacturing step S14, the first end 46 to which the conductor 48 is connected is configured on the resistance heating layer 42 in the non-heat generating region 45, which is configured to be wider than the resistance heating layer 42 in the heat generating region 44. This makes it possible to prevent heat transfer to the conductor 48 and to prevent the connection portion between the conductor 48 and the resistance heating layer 42 from being damaged by heat.

[0083] Referring back to manufacturing step S14, the conductor 48 is connected to only one of the ends of the resistive heating layer 42. This configuration allows for a reduction in the number of conductors 48 compared to when the conductors 48 are connected to both ends of the resistive heating layer 42. This reduces the occurrence of poor connections between the conductors 48 and the resistive heating layer 42, thereby improving the quality of the user experience.

[0084] The resistance heating layer 42 is disposed in a position corresponding to the substrate portion 151, in which the aerosol source is distributed, of the stick-shaped substrate 150 contained in the containing portion 50. More specifically, as shown in Fig. 7 , with the stick-shaped substrate 150 contained in the containing portion 50, a heat-generating region 44, on which the resistance heating layer 42 is laminated, is disposed in a position corresponding to the substrate portion 151 of the pressing portion 62. This configuration makes it possible to improve the heating efficiency of the stick-shaped substrate 150.

[0085] It is desirable that the portion of the outer periphery of the housing portion 50 on which the first electrical insulating layer 41 is laminated occupies less than 50% of the outer periphery of the housing portion 50. More simply, it is desirable that the pressing portion 62 occupies less than 50% of the outer periphery of the housing portion 50. With this configuration, it is possible to reduce the area of ​​the heat generating region 44 and increase the watt density. As a result, it is possible to improve the heating efficiency of the stick-shaped substrate 150.

[0086] The control unit 116 can estimate and control the temperature of the resistive heating layer 42 based on the electrical resistance of the resistive heating layer 42, thereby controlling the temperature at which the stick-shaped substrate 150 is heated. The electrical resistance of the resistive heating layer 42 is measured based on the amount of voltage drop between the conductors 48-1 and 48-2. In this embodiment, it is possible to estimate the temperature of the resistive heating layer 42 as a temperature close to the temperature of the housing unit 50 to the extent that the resistive heating layers 42-1 and 42-2 are electrically connected via the housing unit 50. Considering that the stick-shaped substrate 150 is directly heated by the housing unit 50, this configuration makes it possible to more effectively control the temperature of the stick-shaped substrate 150 and improve the quality of the user experience.

[0087] The above is a supplementary explanation of the features of the heating unit 40. Next, the subsequent manufacturing process will be described with reference to FIG.

[0088] In manufacturing step S15 of Figure 10, an outer thermal diffusion layer 90 is laminated on the outside of the heating system 30 in the middle of manufacturing after manufacturing step S14. Specifically, the outer thermal diffusion layer 90 is wrapped around and laminated on the outside of the side wall 54 of the storage unit 50, outside the heating unit 40. The outer thermal diffusion layer 90 is an example of a second thermal diffusion layer that diffuses heat from the heating unit 40 outside the heating unit 40. With this configuration, the heat of the heating unit 40 laminated on the pressing unit 62 can be diffused throughout the entire storage unit 50, including the non-pressing unit 66. As a result, the stick-shaped substrate 150 stored in the storage unit 50 can be efficiently heated. The configuration of the outer thermal diffusion layer 90 will be described with reference to Figure 11.

[0089] Fig. 11 is a diagram showing the configuration of the outer thermal diffusion layer 90 shown in Fig. 10. As shown in Fig. 11, the outer thermal diffusion layer 90 includes a graphite sheet 91, a vertically elongated PI tape 92, and a horizontally elongated PI tape 93.

[0090] Graphite sheet 91 is a sheet-like member made of graphite. The thermal conductivity of graphite sheet 91 is at least higher than the thermal conductivity of housing unit 50. With this configuration, graphite sheet 91 can efficiently diffuse heat from heating unit 40. Note that instead of graphite sheet 91, a sheet-like member made of silicon, acrylic, or the like may be used.

[0091] Vertically elongated PI tape 92 and horizontally elongated PI tape 93 are formed by applying an adhesive to one surface of a film-like member made of PI (Polyimide). The tensile strength of vertically elongated PI tape 92 and horizontally elongated PI tape 93 is higher than the tensile strength of graphite sheet 91. Therefore, vertically elongated PI tape 92 and horizontally elongated PI tape 93 can fix graphite sheet 91 to the periphery of housing portion 50 while preventing graphite sheet 91 from tearing.

[0092] The outer thermal diffusion layer 90 is formed by bonding a graphite sheet 91 as the bottom layer, a vertically elongated PI tape 92 as the middle layer, and a horizontally elongated PI tape 93 as the top layer in an overlapping state. The vertically elongated PI tape 92 and the horizontally elongated PI tape 93 are overlapped with their adhesive surfaces facing the bottom layer. Here, the layer that will be on the inside when the outer thermal diffusion layer 90 is wrapped around the housing 50 is referred to as the bottom layer, and the layer that will be on the outside is referred to as the top layer. Then, in manufacturing step S15 shown in FIG. 10 , the outer thermal diffusion layer 90 is wrapped around the heating unit 40, which is located outside the housing 50, with the graphite sheet 91 on the inside and the horizontally elongated PI tape 93 on the outside, so as to cover the outside of the heating unit 40. This configuration allows the graphite sheet 91 to be in close contact with the heating unit 40 or the housing 50. As a result, the thermal diffusion effect from the heating unit 40 to the housing 50 via the graphite sheet 91 can be improved. Furthermore, with this configuration, graphite sheet 91 that is in close contact with heating unit 40 or housing unit 50 can be protected from the outside by horizontally elongated PI tape 93. As a result, it is possible to improve the effect of horizontally elongated PI tape 93 in preventing graphite sheet 91 from tearing.

[0093] Here, it is desirable that graphite sheet 91 be laminated so as to overlap heat-generating region 44 of heating unit 40. This configuration makes it possible to efficiently diffuse heat from heating unit 40. On the other hand, it is desirable that graphite sheet 91 be laminated so as to avoid non-heat-generating region 45 of heating unit 40. This configuration makes it possible to prevent heat transfer to conductor 48 and to prevent damage due to heat to the connection between conductor 48 and resistance heating layer 42.

[0094] Graphite sheet 91 is formed to be longer in the left-right direction than the outer periphery of housing unit 50 (particularly, holding unit 60). As a result, graphite sheet 91 is wrapped around the outer surface of housing unit 50 one or more times. With this configuration, graphite sheet 91 completely covers the outer periphery of housing unit 50, making it possible to diffuse heat from heating unit 40 throughout housing unit 50.

[0095] As shown in FIG. 11 , the vertically elongated PI tape 92 is formed longer than the graphite sheet 91 in the vertical direction, and is positioned so that both ends in the vertical direction protrude beyond the graphite sheet 91. Referring back to manufacturing step S15 in FIG. 10 , these protruding portions 95-1 and 95-2 are directly bonded to the non-pressing portion 66 where the heating element 40 is not disposed. This configuration firmly fixes the outer thermal diffusion layer 90 to the housing portion 50, preventing misalignment of the outer thermal diffusion layer 90. Furthermore, compared to when the vertically elongated PI tape 92 is bonded to the heating element 40 on the pressing portion 62, the load on the heating element 40 when the outer thermal diffusion layer 90 is wound around the outer thermal diffusion layer 90 is reduced, preventing damage to the heating element 40.

[0096] As shown in Figure 11, horizontally elongated PI tape 93 is formed to be longer than graphite sheet 91 in the left-right direction, and is positioned so that its right end protrudes from graphite sheet 91. Referring again to manufacturing step S15 in Figure 10, this protruding portion 94 is adhered to horizontally elongated PI tape 93, which is wound one circumference inward from protruding portion 94. With this configuration, the position of graphite sheet 91 can be firmly fixed by horizontally elongated PI tape 93. As a result, it is possible to prevent the graphite sheet 91 from being broken due to excessive force being applied to the graphite sheet 91.

[0097] Next, in manufacturing step S16 of FIG. 10 , a heat insulating section 70 is laminated on the outside of the heating system 30 in the middle of manufacturing after manufacturing step S15. Specifically, the heat insulating section 70 is wrapped around and laminated on the outside of the sidewall 54 of the accommodation section 50, outside the heating section 40 and the outer thermal diffusion layer 90. The heat insulating section 70 is an example of a heat insulating layer that blocks heat from the heating section 40. This configuration prevents heat from the heating section 40 from diffusing to the outside. As a result, it is possible to prevent malfunctions caused by high temperatures, such as malfunctions of electronic circuits. Here, the heat insulating section 70 is laminated so as to cover a portion of the sidewall 54 of the accommodation section 50 in the vertical direction. It is desirable for the heat insulating section 70 to completely cover the heat-generating region 44 of the heating section 40 and the outer thermal diffusion layer 90. Meanwhile, the vertical ends of the heat insulating section 70 and the portions of the sidewall 54 of the accommodation section 50 that are exposed from the heat insulating section 70 are sealed with a sealing member 73. The sealing member 73 is made of a material having a predetermined heat resistance, such as silicon. This configuration can improve the heat insulating effect of the heat insulating section 70. The configuration of the heat insulating section 70 will be described with reference to FIG. 12 .

[0098] FIG. 12 is a diagram illustrating the configuration of the heat insulating unit 70 shown in FIG. 10 . As shown in FIG. 12 , the heat insulating unit 70 is configured by laminating a heat insulating sheet 71 and PI tapes 72 (72-1 and 72-2). The heat insulating sheet 71 is a heat insulating member. For example, the heat insulating sheet 71 may be configured from a glass material, a vacuum insulating material, or an aerogel insulating material. The PI tape 72 is a tape configured from PI. The PI tape 72 is configured by applying an adhesive to one surface of a film-like member configured from PI. Then, in manufacturing step S16 shown in FIG. 10 , the heat insulating unit 70 is configured by wrapping the heat insulating sheet 71 on the inside and the PI tape 72 on the outside, with the adhesive surface of the PI tape 72 facing inward, so as to cover the outside of the outer thermal diffusion layer 90 disposed outside the housing unit 50. This configuration allows the heat insulating sheet 71 to be closely attached to the outer thermal diffusion layer 90. As a result, the heat insulating effect of the heat insulating sheet 71 can be improved.

[0099] The heat insulating sheet 71 is formed to be longer than the graphite sheet 91 in the vertical direction, and is positioned so that the vertical ends of the heat insulating sheet 71 protrude beyond the graphite sheet 91. With this configuration, the heat insulating sheet 71 can completely cover the graphite sheet 91 in the vertical direction. Furthermore, the heat insulating sheet 71 is formed to be longer than the periphery of the accommodating unit 50 (particularly the holding unit 60) in the left-right direction. As a result, the heat insulating sheet 71 is wrapped around the outer surface of the accommodating unit 50 one or more times. With this configuration, the heat insulating sheet 71 can completely cover the periphery of the accommodating unit 50. As a result, it is possible to prevent the heat from the heating unit 40 diffused by the outer thermal diffusion layer 90 from diffusing outside the heat insulating unit 70.

[0100] The PI tape 72-1 is positioned at the left end of the heat insulating sheet 71 so that about half of it protrudes to the left from the heat insulating sheet 71. The PI tape 72-1 is then adhered to the outer thermal diffusion layer 90 (for example, the horizontally elongated PI tape 93) wrapped around the holding part 60. With this configuration, the position of the heat insulating part 70 can be fixed, preventing the heat insulating part 70 from shifting.

[0101] The PI tape 72-2 is positioned at the right end of the heat insulating sheet 71 so that about half of it protrudes to the right from the heat insulating sheet 71. The protruding portion of the PI tape 72-2 is then adhered to the heat insulating part 70 (for example, the heat insulating sheet 71) that is wrapped around the heat insulating part 70 one circumference inward from the protruding portion. This configuration makes it possible to fix the position of the heat insulating part 70 and prevent the heat insulating part 70 from shifting out of position.

[0102] In manufacturing step S17 of Figure 10, a heat-shrinkable tube 99 is laminated on the outside of the heating system 30 in the process of manufacture that has undergone manufacturing step S16. The heat-shrinkable tube 99 is a tubular member that shrinks when heat is applied. For example, the heat-shrinkable tube 99 is made of a resin material. The heat-shrinkable tube 99 shrinks when heated while positioned so as to completely cover the heating system 30 in the process of manufacture that has undergone manufacturing step S16, thereby fixing each component laminated on the outside of the accommodating section 50. This configuration makes it possible to prevent the components laminated on the outside of the accommodating section 50 from becoming misaligned.

[0103] The manufacturing process of the heating system 30 and the configuration of the heating system 30 have been described above.

[0104] <3. Modifications> (1) First Modification In the above embodiment, an example has been described in which the second end 47 of the resistance heating layer 42 is connected to the non-pressure portion 66, but the present disclosure is not limited to such an example. The second end 47 of the resistance heating layer 42 may be connected to the pressure portion 62. This modification will be described with reference to FIG. 13 .

[0105] Figure 13 is a diagram showing an example of the manufacturing process of the heating system 30 according to this modified example. The manufacturing process of the heating system 30 according to this modified example proceeds in order from manufacturing steps S21 to S24 shown in Figure 13 to manufacturing steps S15 to S17 shown in Figure 10. That is, the manufacturing process of the heating system 30 according to this modified example includes manufacturing steps S21 to S24 instead of manufacturing steps S11 to S14 in Figure 9. Below, differences from manufacturing steps S11 to S14 will be mainly described, and a description of similarities will be omitted.

[0106] The manufacturing step S21 in FIG. 13 is the same as the manufacturing step S11 in FIG.

[0107] 13, the first electrical insulating layer 41 is laminated on the pressing portion 62. However, in this modification, a notch 49-1 is provided in the lower part of the first electrical insulating layer 41-1, exposing a part of the pressing portion 62-1. Similarly, a notch 49-2 is provided in the lower part of the first electrical insulating layer 41-2, exposing a part of the pressing portion 62-2.

[0108] 13 , the resistive heating layer 42 is laminated on the outside of the first electrical insulating layer 41, which has been laminated on the pressing portion 62 of the heating system 30 during manufacturing after manufacturing step S22. However, in this modification, the second end 47-1 of the resistive heating layer 42-1 protruding from the first electrical insulating layer 41-1 is connected to the pressing portion 62-1 exposed at the cutout 49-1 in the first electrical insulating layer 41-1. Similarly, the second end 47-2 of the resistive heating layer 42-2 protruding from the first electrical insulating layer 41-2 is connected to the pressing portion 62-2 exposed at the cutout 49-2 in the first electrical insulating layer 41-1. This configuration allows the resistive heating layer 42 to be laminated only on the outside of the flat pressing portion 62. Therefore, compared to when the second end 47 of the resistance heating layer 42 is connected to the curved non-pressure portion 66, it is possible to better prevent problems such as misalignment and peeling of the resistance heating layer 42.

[0109] 13 , a second electrical insulating layer 43 is laminated on the outside of the first electrical insulating layer 41 and the resistance heating layer 42 that have been laminated on the pressing unit 62 of the heating system 30 in the process of being manufactured after the manufacturing step S23. However, in this modification, a notch 49-1 is also provided in the lower part of the second electrical insulating layer 43-1, similar to the first electrical insulating layer 41-1. Similarly, a notch 49-2 is also provided in the lower part of the second electrical insulating layer 43-2, similar to the first electrical insulating layer 41-2.

[0110] In addition, in manufacturing step S24, a lead wire 48-1 is connected to the resistance heating layer 42-1, and a lead wire 48-2 is connected to the resistance heating layer 42-2.

[0111] (2) Second Modification The first and second electrical insulating layers 41 and 43 may have any shape as long as they are configured to sandwich and cover the resistance heating layer 42 from both sides. Below, as a second modification, another example of a shape that the first and second electrical insulating layers 41 and 43 may have will be described with reference to Fig. 14. Note that below, the second modification will be described as a further modification of the first modification.

[0112] Figure 14 is a diagram showing an example of the manufacturing process of the heating system 30 according to this modified example. The manufacturing process of the heating system 30 according to this modified example proceeds in order from manufacturing steps S31 to S34 shown in Figure 14 to manufacturing steps S15 to S17 shown in Figure 10. That is, the manufacturing process of the heating system 30 according to this modified example includes manufacturing steps S31 to S34 instead of manufacturing steps S21 to S24 in Figure 13. Below, differences from manufacturing steps S21 to S24 will be mainly described, and similarities will not be described.

[0113] The manufacturing step S31 in FIG. 14 is the same as the manufacturing step S11 in FIG.

[0114] In manufacturing step S32 of Figure 14, the first electrical insulating layer 41 is laminated on the pressing section 62. However, in this modification, the first electrical insulating layer 41-1 has a shape that conforms to the resistance heating layer 42-1 that will be laminated later. That is, the first electrical insulating layer 41-1 is laminated on the pressing section 62-1 in the shape of a single line that moves back and forth up and down with a space between the left and right. Similarly, the first electrical insulating layer 41-2 has a shape that conforms to the resistance heating layer 42-2 that will be laminated later. That is, the first electrical insulating layer 41-2 is laminated on the pressing section 62-2 in the shape of a single line that moves back and forth up and down with a space between the left and right.

[0115] In manufacturing process S33 of Figure 14, similar to manufacturing process S23 of Figure 13, a resistance heating layer 42 is laminated on the outside of the first electrical insulation layer 41 laminated on the pressing portion 62 of the heating system 30 in the middle of manufacturing after manufacturing process S32.

[0116] 14 , a second electrical insulating layer 43 is laminated on the outside of the first electrical insulating layer 41 and the resistance heating layer 42 that are laminated on the pressing portion 62 of the heating system 30 in the middle of manufacture after the manufacturing step S33. However, in this modification, the second electrical insulating layer 43-1 has the same shape as the first electrical insulating layer 41-1. Similarly, the second electrical insulating layer 43-2 has the same shape as the first electrical insulating layer 41-2.

[0117] Furthermore, in manufacturing step S34, a lead wire 48-1 is connected to the resistance heating layer 42-1, and a lead wire 48-2 is connected to the resistance heating layer 42-2.

[0118] As described above, the first electrical insulating layer 41 and the second electrical insulating layer 43 according to this modification have the shape of a single line that moves back and forth up and down with a lateral gap between them. Therefore, the outer thermal diffusion layer 90, which is laminated later, comes into direct contact with the pressing portion 62 exposed in the lateral gap between the first electrical insulating layer 41 and the second electrical insulating layer 43. Therefore, the thermal diffusion effect of the outer thermal diffusion layer 90 is exerted on the pressing portion 62 as well, making it possible to further improve heating efficiency.

[0119] (3) Third Modification Example In the above, the resistive heating layer 42-1 and the resistive heating layer 42-2 form a series circuit. However, the present disclosure is not limited to this example. The resistive heating layer 42-1 and the resistive heating layer 42-2 may form a parallel circuit. This modification example will be described with reference to FIG. 15.

[0120] Figure 15 is a diagram showing an example of the manufacturing process of the heating system 30 according to this modified example. The manufacturing process of the heating system 30 according to this modified example proceeds in order from manufacturing steps S41 to S44 shown in Figure 15 to manufacturing steps S15 to S17 shown in Figure 10. That is, the manufacturing process of the heating system 30 according to this modified example includes manufacturing steps S41 to S44 instead of manufacturing steps S11 to S14 in Figure 9. Below, differences from manufacturing steps S11 to S14 will be mainly described, and a description of similarities will be omitted.

[0121] The manufacturing step S41 in FIG. 15 is the same as the manufacturing step S11 in FIG.

[0122] The manufacturing step S42 in FIG. 15 is the same as the manufacturing step S12 in FIG.

[0123] In manufacturing process S43 of Figure 15, similar to manufacturing process S13 of Figure 9, resistive heating layers 42-1 and 42-2 are laminated on the outside of the first electrical insulating layers 41-1 and 41-2 laminated on the pressing portion 62 of the heating system 30 in the middle of manufacture after manufacturing process S42.

[0124] Furthermore, in this modification, in manufacturing step S43, a rectangular resistive heating layer 42-3 is laminated below the non-pressure portion 66-1. The resistive heating layer 42-3 is laminated in the non-heat-generating region 45. That is, the resistive heating layer 42-3 is configured to be wide, similar to the first end portion 46-1 of the resistive heating layer 42-1 and the first end portion 46-2 of the resistive heating layer 42-2. This prevents heat generation in the resistive heating layer 42-3, prevents heat transfer to the conductor 48, and prevents heat damage to the connection between the conductor 48 and the resistive heating layer 42.

[0125] In manufacturing process S44 of Figure 15, similar to manufacturing process S14 of Figure 9, a second electrical insulating layer 43 is laminated on the outside of the first electrical insulating layer 41 and the resistance heating layer 42 laminated on the pressing portion 62 of the heating system 30 in the middle of manufacturing after manufacturing process S43.

[0126] 9, a conductor 48-1 is connected to the resistance heating layer 42-1, and a conductor 48-2 is connected to the resistance heating layer 42-2. However, each of the conductors 48-1 and 48-2 is connected to the negative pole of the power supply unit 111.

[0127] Furthermore, in this modified example, in manufacturing process S44, a conductor 48-3 is connected to the resistance heating layer 42-3. The conductor 48-3 is connected to the positive electrode of the power supply unit 111. As a result, the conductor 48-3 connected to the power supply unit 111 is connected to the housing 50. The second end 47-1 of the resistance heating layer 42-1 is electrically connected to the conductor 48-3 connected to the housing 50 (more precisely, the resistance heating layer 42-3) via the housing 50. Therefore, the conductor 48-1, the resistance heating layer 42-1, the housing 50, the resistance heating layer 42-3, and the conductor 48-3 form a first circuit connected to the power supply unit 111. On the other hand, the second end 47-2 of the resistance heating layer 42-2 is electrically connected to the conductor 48-3 connected to the housing 50 (more precisely, the resistance heating layer 42-3) via the housing 50. Therefore, the conductive wire 48-2, the resistive heating layer 42-2, the housing 50, the resistive heating layer 42-3, and the conductive wire 48-3 form a second circuit connected to the power supply unit 111. The first circuit and the second circuit described above form a single parallel circuit. When the power supply unit 111 supplies power to this parallel circuit, it becomes possible to heat the resistive heating layers 42-1 and 42-2.

[0128] (4) Fourth Modification Example In the above, an example in which the resistive heating layer 42 is connected to the power supply unit 111 via the housing unit 50 has been described, but the present disclosure is not limited to such an example. The resistive heating layer 42 may be connected to the power supply unit 111 without via the housing unit 50. This modification example will be described with reference to FIG. 16 .

[0129] Figure 16 is a diagram showing an example of the manufacturing process of the heating system 30 according to this modified example. The manufacturing process of the heating system 30 according to this modified example proceeds in order from manufacturing steps S51 to S54 shown in Figure 16 to manufacturing steps S15 to S17 shown in Figure 10. That is, the manufacturing process of the heating system 30 according to this modified example includes manufacturing steps S51 to S54 instead of manufacturing steps S11 to S14 in Figure 9. Below, differences from manufacturing steps S11 to S14 will be mainly described, and a description of similarities will be omitted.

[0130] The manufacturing step S51 in FIG. 16 is the same as the manufacturing step S11 in FIG.

[0131] The manufacturing step S52 in FIG. 16 is the same as the manufacturing step S12 in FIG.

[0132] 16 , a resistive heating layer 42 is laminated on the outside of the first electrically insulating layer 41 that has been laminated on the pressing unit 62 of the heating system 30 in the middle of manufacture after manufacturing step S52. However, in this modification, both ends of the resistive heating layer 42, that is, a first end 46 and a second end 47, are disposed within the first electrically insulating layer 41. In particular, the first end 46 and the second end 47 are disposed at the lower end of the first electrically insulating layer 41.

[0133] In manufacturing process S54 of Figure 16, similar to manufacturing process S14 of Figure 9, a second electrical insulating layer 43 is laminated on the outside of the first electrical insulating layer 41 and the resistance heating layer 42 laminated on the pressing portion 62 of the heating system 30 in the middle of manufacturing after manufacturing process S53.

[0134] In this modification, in manufacturing step S54, a conductor 48 connected to the power supply 111 is connected to each of the first end 46 and the second end 47 of the resistive heating layer 42. More specifically, a conductor 48-1 connected to the positive electrode of the power supply 111 is connected to the first end 46-1 of the resistive heating layer 42-1. A conductor 48-4 connected to the negative electrode of the power supply 111 is connected to the second end 47-1 of the resistive heating layer 42-1. Thus, the conductor 48-1, the resistive heating layer 42-1, and the conductor 48-4 form a first circuit connected to the power supply 111. On the other hand, a conductor 48-2 connected to the negative electrode of the power supply 111 is connected to the first end 46-2 of the resistive heating layer 42-2. A conductor 48-5 connected to the positive electrode of the power supply 111 is connected to the second end 47-2 of the resistive heating layer 42-2. Therefore, the conductor 48-2, the resistance heating layer 42-2, and the conductor 48-5 form a second circuit connected to the power supply unit 111. The first circuit and the second circuit described above form one parallel circuit. When the power supply unit 111 supplies power to this parallel circuit, it becomes possible to heat the resistance heating layers 42-1 and 42-2.

[0135] The operations of the first circuit and the second circuit constituting the parallel circuit may be controlled individually or collectively, i.e., different powers or the same power may be supplied to the first circuit and the second circuit.

[0136] (5) Fifth Modification In the above embodiment, an example in which the outer thermal diffusion layer 90 is laminated on the outside of the heating unit 40 has been described, but the present disclosure is not limited to such an example. A thermal diffusion layer may be laminated on the inside of the heating unit 40. This modification will be described with reference to FIG. 17 .

[0137] FIG. 17 is a diagram showing an example of the manufacturing process of the heating system 30 according to this modification. The manufacturing process of the heating system 30 according to this modification proceeds in the following order: manufacturing steps S61 and S62 shown in FIG. 17 , then manufacturing steps S12 to S14 shown in FIG. 9 , and then manufacturing steps S15 to S17 shown in FIG. 10 . That is, the manufacturing process of the heating system 30 according to this modification includes manufacturing steps S61 and S62 instead of manufacturing step S11 shown in FIG. 9 . Manufacturing step S65 shown in FIG. 17 illustrates the state of the heating system 30 during manufacturing, having undergone manufacturing steps S61, S62, and S12 to S14. The following mainly describes differences from the manufacturing steps S11 to S17 shown in FIGS. 9 and 10 , and a description of similarities will be omitted.

[0138] The manufacturing step S61 in FIG. 17 is the same as the manufacturing step S11 in FIG.

[0139] In manufacturing step S62 of FIG. 17 , an inner thermal diffusion layer 96 is laminated on the outer side of the sidewall 54 of the storage unit 50 using a plating process. The inner thermal diffusion layer 96 is laminated on the outer side of the sidewall 54 of the storage unit 50, inside the heating unit 40, and is an example of a first thermal diffusion layer that diffuses heat from the heating unit 40 inside the heating unit 40. Plating is a process of thinly coating the surface of the target object with metal. The inner thermal diffusion layer 96 is made of a material that can be plated and has a higher thermal conductivity than the material that constitutes the storage unit 50. Furthermore, the inner thermal diffusion layer 96 is preferably made of a material that has a higher electrical conductivity than the material that constitutes the storage unit 50. An example of a material that constitutes the inner thermal diffusion layer 96 is silver. This configuration allows heat from the heating unit 40, which will later be laminated on the pressing unit 62, to be diffused throughout the entire storage unit 50, including the non-pressing unit 66. As a result, the stick-shaped substrate 150 contained in the storage unit 50 can be efficiently heated. The inner thermal diffusion layer 96 may be formed by any method other than plating, such as thermal spraying, which sprays metal particles to form a coating, or applying a paste-like material and then baking it. The inner thermal diffusion layer 96 may also be plated with nickel, gold, or the like, which can prevent the inner thermal diffusion layer 96 from being deteriorated, such as by oxidation.

[0140] Here, it is desirable that the inner thermal diffusion layer 96 be laminated so as to overlap the region where the heat-generating region 44 of the heating unit 40 is located. This configuration makes it possible to efficiently diffuse the heat from the heating unit 40. On the other hand, it is desirable that the inner thermal diffusion layer 96 be laminated so as to avoid the region where the non-heat-generating region 45 of the heating unit 40 is located. This configuration makes it possible to prevent heat transfer to the conductor 48 and to prevent damage due to heat to the connection between the conductor 48 and the resistance heating layer 42.

[0141] 9 , the heating system 30 in the process of manufacture, shown in manufacturing step S63 of FIG. 17 , is manufactured. Specifically, the first electrical insulation layer 41, the resistive heating layer 42, and the second electrical insulation layer 43 are sequentially laminated on the outer side of the inner thermal diffusion layer 96 laminated on the outer side of the pressing portion 62 using a printing process or a vapor deposition process. If the electrical conductivity of the inner thermal diffusion layer 96 is higher than that of the accommodating portion 50, the second end 47 of the resistive heating layer 42 is preferably connected to the inner thermal diffusion layer 96, as shown in manufacturing step S63. In this case, the second end 47 may be connected to the inner thermal diffusion layer 96 on the pressing portion 62 or the inner thermal diffusion layer 96 on the non-pressing portion 66. This configuration facilitates electrical conduction between the resistive heating layers 42-1 and 42-2. Of course, this modification may be combined with the third modification, and the conductor 48 connected to the power supply 111 may be connected to the housing 50. In this case, the resistance heating layer 42 is connected to the power supply 111 via the inner thermal diffusion layer 96 and the housing 50.

[0142] Alternatively, the second end 47 of the resistance heating layer 42 may be connected to the housing 50 exposed from the inner thermal diffusion layer 96, avoiding the inner thermal diffusion layer 96. For example, the housing 50 and the resistance heating layer 42 may be made of the same SUS and electrically connected by welding. This configuration makes it possible to prevent a decrease in durability due to intermetallic corrosion or solid solution.

[0143] (6) Sixth Modification Example Although the above describes an example in which the storage unit 50 is a cylindrical body, the present disclosure is not limited to such an example. The storage unit 50 may have any shape as long as it has a pressing portion 62 that is a flat plate. This modification example will be described with reference to FIG. 18 .

[0144] FIG. 18 is a schematic diagram illustrating an example of the configuration of the storage unit 50 and stick-shaped substrate 150 according to this modification. As shown in FIG. 18 , the storage unit 50 may be a rectangular tube with a bottom, in which the surface perpendicular to the vertical direction is rectangular. In this modification, not only the pressing portion 62 but also the non-pressing portion 66 are configured as flat plates. That is, the storage unit 50 according to this modification is configured by connecting the bottom wall 56 to the lower end of a side wall 54 formed by alternately connecting a pair of flat pressing portions 62 and a pair of flat non-pressing portions 66. However, it is desirable that the length of the non-pressing portion 66 in the circumferential direction of the storage unit 50 be shorter than the length of the pressing portion 62. That is, it is desirable that the storage unit 50 be configured such that the surface perpendicular to the vertical direction is rectangular, with the pressing portion 62 forming the long side and the non-pressing portion 66 forming the short side. It is also desirable that the heating unit 40 be disposed in the pressing portion 62.

[0145] 18, the stick-shaped substrate 150 may be configured in the shape of a prism with a square cross section to match the shape of the storage section 50. For example, the stick-shaped substrate 150 may be configured in the shape of a thin card.

[0146] According to this configuration, the thin stick-shaped substrate 150 can be heated while being sandwiched between the heating parts 40, so that the temperature of the stick-shaped substrate 150 can be easily raised all the way to the center thereof.

[0147] (7) Seventh Modification Example In the above, an example has been described in which the resistive heating layer 42 protrudes from the first electrical insulating layer 41 in a direction along the outer peripheral surface of the housing portion 50, but the present disclosure is not limited to such an example. For example, the resistive heating layer 42 may protrude from the first electrical insulating layer 41 in a direction perpendicular to the outer peripheral surface of the housing portion 50. This modification example will be described with reference to FIG. 19 .

[0148] FIG. 19 is a diagram showing an example of the manufacturing process of the heating system 30 according to this modified example. The manufacturing process of the heating system 30 according to this modified example proceeds in the order of manufacturing steps S71 to S74 shown in FIG. 19 , followed by manufacturing steps S15 to S17 shown in FIG. 10 . That is, the manufacturing process of the heating system 30 according to this modified example includes manufacturing steps S71 to S74 instead of manufacturing steps S11 to S14 shown in FIG. 9 . The following mainly describes differences from manufacturing steps S11 to S14, and a description of similarities will be omitted. Furthermore, the following mainly describes the manufacturing process for one of the two heating units 40, but the other heating unit 40 may also be manufactured using the same manufacturing process.

[0149] In manufacturing process S71 of Figure 19, via processing is performed on the first electrical insulating layer 41 to form through-holes 41a. The first electrical insulating layer 41 according to this modification may be a ceramic substrate, such as a green sheet, before firing. Then, the through-holes 41a of the first electrical insulating layer 41 are filled with a conductive material 42a. The conductive material 42a is made of any conductive material. The material of the conductive material 42a may be the same as the material of the resistance heating layer 42.

[0150] 19, a resistive heating layer 42 is laminated on the first electrical insulating layer 41 that has been subjected to the manufacturing step S71. Here, the second end 47 of the resistive heating layer 42 is disposed on the through-hole 41a. The second end 47 of the resistive heating layer 42 is connected to the conductive material 42a filled in the through-hole 41a.

[0151] 19 , a second electrical insulating layer 43 is laminated on the first electrical insulating layer 41 and the resistance heating layer 42 that have been subjected to manufacturing step S72. For example, the second electrical insulating layer 43 is bonded to the first electrical insulating layer 41 so as to sandwich the resistance heating layer 42, with the first end 46 of the resistance heating layer 42 exposed. The second electrical insulating layer 43 in this modification may be a pre-fired ceramic substrate such as a green sheet.

[0152] The heating unit 40 according to this modified example is manufactured by the manufacturing process described above.

[0153] 19 , the heating unit 40 that has undergone manufacturing step S73 is laminated on the outside of the pressing portion 62 of the accommodating unit 50. For example, the heating unit 40 is attached to the outside of the pressing portion 62 of the accommodating unit 50 and then fired. As a result, the second end 47 of the resistance heating layer 42 is connected to the accommodating unit 50 via the conductive material 42a disposed in the through-hole 41a. On the other hand, a conductive wire 48 is connected to the first end 46 of the resistance heating layer 42.

[0154] The manufacturing process for the heating system 30 according to this modified example has been described above.

[0155] According to this modification, similar to the above embodiment, the resistive heating layer 42 is electrically connected to the power supply unit 111 via the accommodation portion 50. The conductive material 42a arranged in the through hole 41a can also be considered as part of the resistive heating layer 42. That is, the resistive heating layer 42 may protrude from the first electrical insulating layer 41 in the direction penetrating the first electrical insulating layer 41 and be connected to the accommodation portion 50. The through hole 41a in this modification corresponds to the notch 49 in the above embodiment in that it is configured to expose the pressing portion 62 formed in the first electrical insulating layer 41.

[0156] 19 illustrates an example in which the heating unit 40 is manufactured separately and then attached to the outside of the housing unit 50, but the present disclosure is not limited to such an example. As in the above embodiment, the first electrical insulating layer 41, the resistance heating layer 42, and the second electrical insulating layer 43 may be laminated in this order on the housing unit 50.

[0157] <4. Supplementary Information> Although preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art to which the present disclosure pertains can conceive of various modified or altered examples within the scope of the technical ideas described in the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure.

[0158] There are various conceivable methods for manufacturing the cylindrical storage unit 50. As one example, the cylindrical storage unit 50 may be formed by drawing a plate material. As another example, the cylindrical storage unit 50 may be formed by bending a plate material and welding the seams. In the latter case, the heating unit 40 may be stacked on the plate material. Then, the plate material on which the heating unit 40 is stacked may be bent and the seams may be welded to form the storage unit 50 with the heating unit 40 stacked on it.

[0159] Although the above describes an example in which the holding portion 60 has two pressing portions 62 and two non-pressing portions 66, the present disclosure is not limited to such an example. For example, the holding portion 60 may have three or more pressing portions 62 and three or more non-pressing portions 66.

[0160] Although the above describes an example in which the first electrical insulating layer 41, the resistive heating layer 42, and the second electrical insulating layer 43 constituting the heating unit 40 are laminated using a printing process or a vapor deposition process, the present disclosure is not limited to such an example. As an example, the first electrical insulating layer 41 and the second electrical insulating layer 43 may be laminated by applying or transferring a paste-like material. As another example, the resistive heating layer 42 may be a metal foil processed into a predetermined shape and placed on the first electrical insulating layer 41. When the resistive heating layer 42 is a metal foil, the metal foil may be placed on a carrier tape, and the first electrical insulating layer 41 may be printed on top of it, and then transferred to the housing 50. When the resistive heating layer 42 is a metal foil, the resistive heating layer 42 and the housing 50 may be electrically connected by welding. Alternatively, for example, the heating unit 40 may be manufactured separately and attached to the outside of the housing 50.

[0161] Although the example described above is one in which the connection portion between the resistance heating layer 42 and the conductive wire 48 is exposed and not covered by the second electrical insulating layer 43, the present disclosure is not limited to such an example. The connection portion between the resistance heating layer 42 and the conductive wire 48 may also be covered by the second electrical insulating layer 43.

[0162] Although the above describes an example in which the resistive heating layer 42 and the conductive wire 48 are directly connected, the present disclosure is not limited to such an example. The resistive heating layer 42 and the conductive wire 48 may be indirectly connected. As an example, the conductive wire 48 may be connected to the resistive heating layer 42 via a conductive leaf spring. As another example, the conductive wire 48 may be connected to the resistive heating layer 42 via a pogo pin. The suction device 100 may be manufactured by assembling multiple components including the heating system 30. During the assembly process, the heating system 30 may be fitted into a main body including the power supply unit 111 and other components. At this time, the lower part of the heating system 30 may be fitted into a socket provided in the main body, and the above-mentioned leaf spring or pogo pin may be provided in the socket. In this case, the resistive heating layer 42 and the power supply unit 111 can be electrically connected when the lower part of the heating system 30 is fitted into the socket, thereby simplifying the manufacturing process of the suction device 100. When the resistance heating layer 42 and the conductive wire 48 are indirectly connected, it is desirable to plate the entire resistance heating layer 42, or at least the first end 46 that serves as the contact point with the conductive wire 48, with nickel, gold, or the like. This configuration makes it possible to further strengthen the electrical connection between the resistance heating layer 42 and the leaf spring or pogo pin. Similarly, the housing 50 and the conductive wire 48 may be connected directly or indirectly.

[0163] Although the example in which the contact point (i.e., the first end 46) between the resistive heating layer 42 and the conductive wire 48 is located on the pressing portion 62 has been described above, the present disclosure is not limited to such an example. For example, the first electrical insulation layer 41 and the resistive heating layer 42 may extend to the bottom wall 56 of the housing portion 50, and the conductive wire 48 may be directly or indirectly connected to the resistive heating layer 42 at the bottom wall 56 of the housing portion 50.

[0164] Although the example in which the outer thermal diffusion layer 90 covers the holding portion 60 has been described above, the outer thermal diffusion layer 90 may cover not only the holding portion 60 but also the non-holding portion 69. Similarly, although the example in which the heat insulating sheet 71 covers the holding portion 60 has been described above, the heat insulating sheet 71 may cover not only the holding portion 60 but also the non-holding portion 69.

[0165] Although the example in which the vertically elongated PI tape 92 is adhered to the non-pressure portion 66 when the outer thermal diffusion layer 90 is laminated on the housing portion 50 has been described above, the present disclosure is not limited to such an example. The vertically elongated PI tape 92 may also be adhered to the second electrical insulating layer 43 laminated on the pressure portion 62.

[0166] Although the example described above describes stick-shaped substrate 150 having base portion 151 and suction port portion 152, the present disclosure is not limited to such an example. Stick-shaped substrate 150 may have only base portion 151. And suction device 100 may have suction port portion 152. For example, suction port portion 152 may be detachably attached to opening 52 of storage portion 50.

[0167] Two or more of the above-described embodiments and modified examples may be combined as appropriate. As an example, the above-described embodiment may be combined with the fifth modified example. That is, the heating system 30 may have both the outer thermal diffusion layer 90 and the inner thermal diffusion layer 96. As another example, the accommodation unit 50 may have four or more pressing units 62, and any two types of heating units 40 among those shown in FIGS. 9 and 13 to 17 may be arranged in one accommodation unit 50. As another example, any one type of heating unit 40 among those shown in FIGS. 9 and 13 to 17 may be arranged in the accommodation unit 50 shown in FIG. 18.

[0168] Although the above describes an example in which the conductive wire 48 is connected to at least one of the ends of the resistive heating layer 42, the present disclosure is not limited to such an example. As an example, the accommodating unit 50 may have three or more pressing portions 62, and both ends of the resistive heating layer 42 arranged in the central pressing portion 62 of the three pressing portions 62 may be connected to the accommodating unit 50. Resistive heating layers 42 with one end connected to the power supply 111 may be arranged in each of the two adjacent pressing portions 62, and these three resistive heating layers 42 may form a series circuit. As another example, the accommodating unit 50 may have two pressing portions 62, and a resistive heating layer 42 with both ends connected to the accommodating unit 50 may be arranged in each of the two pressing portions 62, and a conductive wire connected to the power supply 111 may be connected to each of the two non-pressing portions 66. In this case, the two resistive heating layers 42 form a parallel circuit.

[0169] Note that the following configurations also fall within the technical scope of the present disclosure: (1) An aerosol generation system comprising: a cylindrical body that accommodates a substrate containing an aerosol source, a plurality of resistance heating layers laminated on the outside of a side wall of the cylindrical body, a plurality of first electrical insulating layers that are laminated on the outside of the side wall of the cylindrical body and inside the resistance heating layers, and a power supply unit that supplies power to the resistance heating layers, wherein the cylindrical body is made of a conductive material, and at least one end of the resistance heating layer protrudes from the first electrical insulating layer and is connected to the cylindrical body, is electrically connected to another resistance heating layer adjacent to the resistance heating layer via the cylindrical body, and is electrically connected to the power supply unit via the other resistance heating layer. (2) The aerosol generation system according to (1), wherein the side walls of the cylindrical body include a plurality of first side walls having flat outer surfaces and a plurality of second side walls different from the first side walls, the first side walls and the second side walls being alternately arranged along the circumferential direction of the cylindrical body, the first electrically insulating layer being laminated on the outer side of the first side walls, and the two resistive heating layers being laminated on the outer sides of two first side walls on both sides of the second side wall, with a space between them on the second side walls. (3) The aerosol generation system according to (2), wherein the resistive heating layer and the first electrically insulating layer are each laminated using a vapor deposition process or a printing process. (4) The aerosol generation system according to any one of (1) to (3), wherein the portion of the outer periphery of the cylindrical body where the first electrically insulating layer is laminated occupies less than 50% of the outer periphery of the cylindrical body. (5) The aerosol generating system according to any one of (1) to (4), wherein the first electrical insulating layer has a shape that conforms to the resistive heating layer. (6) The aerosol generating system according to any one of (1) to (5), further comprising a plurality of second electrical insulating layers that are laminated outside the resistive heating layer using a vapor deposition process or a printing process, and at least a portion of the resistive heating layer is sandwiched between the first electrical insulating layer and the second insulating layer.(7) The aerosol generation system according to any one of (1) to (6), wherein a conductor connected to the power supply is connected to the cylindrical body, and one of the two ends of the resistance heating layer protrudes from the first electrical insulating layer and is connected to the cylindrical body, and is electrically connected via the cylindrical body to the conductor connected to the cylindrical body. (8) The aerosol generation system according to any one of (3) to (7), which cites (2), wherein the end of the two ends of the resistance heating layer that protrudes from the first electrical insulating layer is connected to the first side wall. (9) The aerosol generation system according to any one of (3) to (7), which cites (2), wherein the end of the two ends of the resistance heating layer that protrudes from the first electrical insulating layer protrudes from the first side wall and is connected to the second side wall. (10) The aerosol generation system according to any one of (1) to (9), wherein one of the two ends of the resistance heating layer is connected to a conductor connected to the power supply. (11) The aerosol generation system according to any one of (1) to (10), wherein a conductor connected to the power supply unit is connected to each of two ends of the resistance heating layer. (12) The aerosol generation system according to (10) or (11), wherein, of the two ends of the resistance heating layer, the end to which the conductor connected to the power supply unit is connected is configured wider than the remaining portions. (13) The aerosol generation system according to any one of (1) to (12), further comprising a first thermal diffusion layer laminated by plating on the outside of the side wall of the cylindrical body and on the inside of the resistance heating layer. (14) The aerosol generation system according to any one of (1) to (13), further comprising a second thermal diffusion layer laminated by wrapping around the outside of the side wall of the cylindrical body and on the outside of the resistance heating layer. (15) The aerosol generation system according to any one of (1) to (14), further comprising an insulating layer wrapped around and laminated on the outside of the side wall of the cylindrical body and outside the resistance heating layer.(16) The aerosol generation system according to (15), wherein the heat insulating layer is laminated so as to cover a portion of the side wall of the cylindrical body in the axial direction of the cylindrical body, and an end of the heat insulating layer in the axial direction of the cylindrical body and a portion exposed from the heat insulating layer are sealed by a sealing portion. (17) The aerosol generation system according to any one of (1) to (16), wherein the resistance heating layer is arranged at a position corresponding to a portion of the substrate housed in the cylindrical body where the aerosol source is distributed. (18) The aerosol generation system according to any one of (3) to (17), which cites (2), wherein the first side wall is a flat plate, and the second side wall is a curved plate curved outward from the cylindrical body along the circumferential direction of the cylindrical body, and the substrate housed in the cylindrical body is pressed by the first side wall. (19) The aerosol generation system according to any one of (3) to (17) citing (2), wherein the first side wall is a flat plate, the second side wall is a flat plate, the length of the first side wall is longer than the length of the second side wall in the circumferential direction of the cylindrical body, and the substrate housed in the cylindrical body is pressed by the first side wall. (20) The aerosol generation system according to any one of (1) to (19), further comprising the substrate.

[0170] 100 Suction device 111 Power supply unit 112 Sensor unit 113 Notification unit 114 Memory unit 115 Communication unit 116 Control unit 150 Stick-shaped substrate 151 Substrate unit 152 Suction nozzle unit 30 Heating system 40 Heating unit 41 First electrical insulating layer 42 Resistance heating layer 43 Second electrical insulating layer 44 Heat generating region 45 Heat generating region 46 First end 47 Second end 48 Conductive wire 49 Notch 50 Storage unit 52 Opening 54 Side wall (54a: inner surface, 54b: outer surface) 56 Bottom wall (56a: inner surface, 56b: outer surface) 58 First guide unit (58a: tapered surface) 60 Holding unit 62 Pressing unit (62a: inner surface, 62b: outer surface) 66 Non-pressure portion (66a: inner surface, 66b: outer surface) 67 Gap 68 Boundary 69 Non-holding portion 70 Heat insulating portion 71 Heat insulating sheet 72 PI tape 73 Sealing member 80 Internal space 90 Outer thermal diffusion layer 91 Graphite sheet 92 Vertically elongated PI tape 93 Horizontally elongated PI tape (94: protruding portion, 95: protruding portion) 96 Inner thermal diffusion layer 99 Heat shrinkable tube

Claims

1. A cylindrical body that accommodates a substrate containing an aerosol source; A plurality of resistive heating layers laminated on the outside of the sidewall of the cylindrical body; a plurality of first electrical insulating layers laminated on the outer side of the side wall of the cylindrical body and inside the resistance heating layer; A power supply unit for supplying power to the resistive heating layer; Equipped with The cylindrical body is made of a conductive material, At least one of the two ends of the resistive heating layer protrudes from the first electrical insulation layer and is connected to the cylindrical body, is electrically connected to another resistive heating layer adjacent to the resistive heating layer via the cylindrical body, and is electrically connected to the power supply unit via the other resistive heating layer. Aerosol generation systems.

2. The side walls of the cylindrical body include a plurality of first side walls having a flat outer surface and a plurality of second side walls different from the first side walls, The first side walls and the second side walls are alternately arranged along a circumferential direction of the cylindrical body, the first electrically insulating layer is laminated on an outer side of the first side wall; The two resistive heating layers are stacked on the outsides of the two first side walls adjacent to the second side wall in a state where the two resistive heating layers are spaced apart from each other on the second side wall.

10. The aerosol generating system of claim 1.

3. Each of the resistive heating layer and the first electrically insulating layer is laminated using a deposition process or a printing process.

3. The aerosol generating system of claim 2.

4. The portion of the outer periphery of the cylindrical body on which the first electrical insulating layer is laminated occupies less than 50% of the outer periphery of the cylindrical body.

10. The aerosol generating system of claim 1.

5. the first electrically insulating layer has a shape conforming to the resistive heating layer; 10. The aerosol generating system of claim 1.

6. The aerosol generating system further comprises a plurality of second electrically insulating layers laminated on an outer side of the resistive heating layer by a deposition process or a printing process, At least a portion of the resistive heating layer is sandwiched between the first electrically insulating layer and the second electrically insulating layer.

10. The aerosol generating system of claim 1.

7. A conductor connected to the power supply unit is connected to the cylindrical body, One of the two ends of the resistance heating layer is protruding from the first electrical insulation layer and connected to the cylindrical body, and is electrically connected to the conductive wire connected to the cylindrical body via the cylindrical body.

7. An aerosol generation system according to any one of claims 1 to 6.

8. The end of the resistive heating layer that protrudes from the first electrical insulating layer is connected to the first side wall.

3. The aerosol generating system of claim 2.

9. The end of the resistive heating layer that protrudes from the first electrical insulating layer protrudes from the first side wall and is connected to the second side wall.

3. The aerosol generating system of claim 2.

10. A conductor connected to the power supply unit is connected to one end of the two ends of the resistance heating layer.

10. The aerosol generating system of claim 1.

11. A conductor connected to the power supply is connected to each of the two ends of the resistance heating layer.

10. The aerosol generating system of claim 1.

12. Of the two ends of the resistance heating layer, the end to which the conductor connected to the power supply unit is connected is configured to be wider than the other parts.

12. An aerosol generating system as claimed in claim 10 or 11.

13. The aerosol generating system further includes a first thermal diffusion layer that is laminated by plating on the outer side of the side wall of the cylindrical body and on the inner side of the resistance heating layer.

10. The aerosol generating system of claim 1.

14. The aerosol generation system further includes a second thermal diffusion layer that is wrapped around and laminated on the outside of the side wall of the cylindrical body and outside the resistance heating layer.

10. The aerosol generating system of claim 1.

15. The aerosol generation system further includes a heat insulating layer that is wrapped around and laminated on the outside of the side wall of the cylindrical body and outside the resistance heating layer.

10. The aerosol generating system of claim 1.

16. The heat insulating layer is laminated so as to cover a part of the side wall of the cylindrical body in the axial direction of the cylindrical body, An end of the insulating layer in the axial direction of the cylindrical body and a portion exposed from the insulating layer are sealed by a sealing portion.

16. The aerosol generating system of claim 15.

17. The resistive heating layer is disposed at a position corresponding to a portion of the base material contained in the cylindrical body where the aerosol source is distributed.

10. The aerosol generating system of claim 1.

18. the first side wall is a flat plate; the second side wall is a curved plate curved outwardly of the cylindrical body along a circumferential direction of the cylindrical body, The base material accommodated in the cylindrical body is pressed by the first side wall.

3. The aerosol generating system of claim 2.

19. the first side wall is a flat plate; the second side wall is a flat plate; In a circumferential direction of the cylindrical body, a length of the first side wall is longer than a length of the second side wall, The base material accommodated in the cylindrical body is pressed by the first side wall.

3. The aerosol generating system of claim 2.

20. The aerosol generating system further comprises the substrate.

10. The aerosol generating system of claim 1.