Electronic device

Abstract

This electronic device (101) is provided with: a plurality of semiconductor modules (11-16) that are arranged in a first arrangement direction, or are arranged in a second arrangement direction orthogonal to the first arrangement direction and the first arrangement direction; a plurality of control wires (21-26); and at least one wiring attachment member (31-33) that attaches at least two of the control wires (21-26) to a heat reception block (10) while being disposed adjacent to each other. Two of the control wires (21-26) attached to the heat reception block (10) by the same wiring attachment members (31-33) extend from control circuits (2a, 2b) toward the wiring attachment members (31-33) in a state of being disposed adjacent to each other, are separated at the center of a gap between two of the semiconductor modules (11-16) in the first arrangement direction, or at a position shifted from a contact point of the center or the two semiconductor modules (11-16) in the second direction, extend in different directions from each other, and are connected to the semiconductor modules (11-16).

Description

electronic equipment

[0001] The present disclosure relates to electronic devices.

[0002] An electronic device including an inverter and mounted on a railway vehicle includes a plurality of semiconductor modules, each housing at least one switching element. A control circuit for controlling the switching element of each semiconductor module is connected to the plurality of semiconductor modules via a plurality of control wirings. An example of this type of electronic device is disclosed in Patent Document 1. In the conversion circuit disclosed in Patent Document 1, one gate drive circuit is connected to two switching elements connected in parallel with each other.

[0003] International Publication No. 2018 / 116527

[0004] In the conversion circuit disclosed in Patent Document 1, a member for fixing the gate wiring extending from the gate drive circuit needs to be provided each time the gate wiring is routed to each switching element, and therefore, as the number of switching elements increases, the number of members for fixing the gate wiring also increases, resulting in an increase in the number of components in the conversion circuit.

[0005] The present disclosure has been made in consideration of the above circumstances, and aims to provide an electronic device with a simple configuration.

[0006] To achieve the above object, the electronic device of the present disclosure includes a plurality of semiconductor modules, at least one control circuit, a plurality of control wires, and at least one wire attachment member. The plurality of semiconductor modules are attached to a heat receiving block, arranged one-dimensionally in a first arrangement direction or two-dimensionally in a second arrangement direction perpendicular to the first arrangement direction. The control circuit controls at least one switching element included in each of the semiconductor modules. The plurality of control wires are associated with different semiconductor modules and connect the associated semiconductor modules to the control circuit that controls the switching elements of the semiconductor modules. The wire attachment member attaches at least two control wires associated with at least two semiconductor modules, including two semiconductor modules arranged adjacent to each other in the first arrangement direction, to the heat receiving block together in an adjacent state. Of the at least two control wirings attached to the heat receiving block by the same wiring attachment member, the two control wirings associated with two semiconductor modules arranged adjacent to each other in the first arrangement direction extend from the control circuit toward the wiring attachment member while being arranged adjacent to each other, and branch off at the center in the first arrangement direction of the gap between the two associated semiconductor modules or at a position shifted in the second arrangement direction from the center or the contact point of the two associated semiconductor modules, extend in directions different from each other, and are connected to the associated semiconductor modules.

[0007] The electronic device according to the present disclosure includes at least one wiring attachment member for attaching at least two control wires together to the heat receiving block. The two control wires attached to the heat receiving block by the same wiring attachment member extend from the control circuit to the wiring attachment member while being arranged adjacent to each other, and then split at the center of the gap between the two semiconductor modules or at a position offset from the center or the contact point of the two semiconductor modules, extending in different directions from each other and connected to the semiconductor modules. This configuration allows for a simple electronic device to be obtained.

[0008] FIG. 1 is a circuit diagram of a power conversion circuit included in an electronic device according to a first embodiment; FIG. 2 is a diagram showing an example of implementation of an electronic device according to the first embodiment; FIG. 3 is a diagram showing another example of implementation of an electronic device according to the first embodiment; FIG. 4 is a diagram showing an example of implementation of an electronic device according to the second embodiment;

[0009] Hereinafter, electronic devices according to embodiments of the present disclosure will be described in detail with reference to the drawings, in which the same or equivalent parts are designated by the same reference numerals.

[0010] 1 is a power conversion device that converts supplied power into power to be supplied to a load device and supplies the converted power to the load device. The electronic device 101 is, for example, a DC-to-three-phase conversion device that is mounted on a railway vehicle and supplies power to a traction motor, which is a load device.

[0011] The electronic device 101 includes a power conversion circuit 1 that converts power supplied from a power source (not shown) into power to be supplied to a load device, and control circuits 2a and 2b that control the power conversion circuit 1. An input terminal 1a of the power conversion circuit 1 is connected to a power source, specifically, a current collector that acquires power from a substation via a power supply line. The input terminal 1b is grounded. Output terminals 1c, 1d, and 1e are connected to the load devices. The power conversion circuit 1 converts power supplied from the current collector connected to the input terminal 1a into power to be supplied to the load device, and supplies the converted power to the load device via the output terminals 1c, 1d, and 1e.

[0012] The power conversion circuit 1 has semiconductor modules 11 and 14 corresponding to the U phase, semiconductor modules 12 and 15 corresponding to the V phase, and semiconductor modules 13 and 16 corresponding to the W phase. The semiconductor modules 11 and 14 are connected in series. The semiconductor modules 12 and 15 are connected in series. The semiconductor modules 13 and 16 are connected in series. The semiconductor modules 11 and 14, the semiconductor modules 12 and 15, and the semiconductor modules 13 and 16 are connected in parallel with each other between input terminals 1a and 1b. The semiconductor modules 11, 12, and 13 are controlled by a control circuit 2a. The semiconductor modules 14, 15, and 16 are controlled by a control circuit 2b.

[0013] Since the semiconductor modules 11-16 have the same configuration, only the configuration of the semiconductor module 11 will be described in detail. The semiconductor module 11 has a switching element SW1 and a freewheeling diode D1 connected in parallel to the switching element SW1. The switching element SW1 is, for example, an IGBT (Insulated Gate Bipolar Transistor).

[0014] The collector terminals C1 of the switching elements SW1 of the semiconductor modules 11, 12, and 13 are electrically connected to the input terminal 1a. The emitter terminals E1 of the switching elements SW1 of the semiconductor modules 11, 12, and 13 are electrically connected to the collector terminals C1 of the switching elements SW1 of the semiconductor modules 14, 15, and 16, respectively. The emitter terminals E1 of the switching elements SW1 of the semiconductor modules 14, 15, and 16 are electrically connected to the input terminal 1b. The connection point of the semiconductor modules 11 and 14, the connection point of the semiconductor modules 12 and 15, and the connection point of the semiconductor modules 13 and 16 are electrically connected to the output terminals 1c, 1d, and 1e, respectively.

[0015] A control signal output from the control circuit 2a is input to the gate terminal G1 of the switching element SW1 of the semiconductor modules 11, 12, and 13. A control signal output from the control circuit 2b is input to the gate terminal G1 of the switching element SW1 of the semiconductor modules 14, 15, and 16.

[0016] As shown in FIG. 2, the electronic device 101 comprises semiconductor modules 11-16 arranged two-dimensionally and attached to the heat receiving block 10, a control circuit 2a that controls the switching element SW1 of the semiconductor module 11-13, a control circuit 2b that controls the switching element SW2 of the semiconductor module 14-16, control wiring 21-26 that is provided in correspondence with the semiconductor module 11-16, and wiring attachment members 31, 32, and 33 that attach at least two of the control wirings 21-26 to the heat receiving block 10 while they are arranged adjacent to each other.

[0017] In FIG. 2, the first arrangement direction of the semiconductor modules 11-16 is indicated by the X-axis, and the second arrangement direction of the semiconductor modules 11-16 is indicated by the Z-axis. The axis perpendicular to each of the X-axis and Z-axis is the Y-axis. The X-axis, Y-axis, and Z-axis are perpendicular to each other. This also applies to subsequent figures. The electronic device 101 is mounted, for example, under the floor of the railway vehicle in an orientation in which the X-axis direction can be considered to coincide with the direction of travel of the railway vehicle, and the Y-axis direction can be considered to coincide with the width direction of the railway vehicle. In this case, when the railway vehicle is positioned horizontally, the Z-axis indicates the vertical direction.

[0018] The heat receiving block 10 is formed from a plate-shaped member. The semiconductor modules 11-16 are attached to one main surface of the heat receiving block 10. A cooling device (not shown), such as a heat sink or heat pipe, is attached to the other main surface of the heat receiving block 10. The heat receiving block 10 is formed from a member having a high thermal conductivity that allows heat generated in the semiconductor modules 11-16 to be transferred to the cooling device, such as a metal such as aluminum or iron.

[0019] The semiconductor module 11 has a casing 11a that houses the switching element SW1 and the freewheeling diode D1, a control terminal 11b that is electrically connected to the gate terminal G1 of the switching element SW1 and exposed to the outside of the casing 11a, a collector main terminal 11c that is electrically connected to the collector terminal C1 of the switching element SW1 and exposed to the outside of the casing 11a, and an emitter main terminal 11d that is electrically connected to the emitter terminal E1 of the switching element SW1 and exposed to the outside of the casing 11a.

[0020] Similarly, semiconductor modules 12, 13, 14, 15, and 16 each include a casing 12a, 13a, 14a, 15a, and 16a that houses switching element SW1 and freewheeling diode D1, and control terminals 12b, 13b, 14b, 15b, and 16b that are electrically connected to the gate terminal G1 of switching element SW1 and are exposed to the outside of the casing 12a, 13a, 14a, 15a, and 16a. The semiconductor modules 12, 13, 14, 15, and 16 each have a collector main terminal 12c, 13c, 14c, 15c, and 16c that is electrically connected to the collector terminal C1 of the switching element SW1 and exposed to the outside of the casings 12a, 13a, 14a, 15a, and 16a, and an emitter main terminal 12d, 13d, 14d, 15d, and 16d that is electrically connected to the emitter terminal E1 of the switching element SW1 and exposed to the outside of the casings 12a, 13a, 14a, 15a, and 16a, respectively.

[0021] The casings 11a, 12a, 13a, 14a, 15a, and 16a are arranged two-dimensionally in the X-axis direction and the Z-axis direction at intervals from one another and attached to the heat receiving block 10. The casings 11a, 12a, 13a, 14a, 15a, and 16a are attached to the heat receiving block 10 by any method, such as fastening with fastening members or bonding with an adhesive.

[0022] The control terminals 11b, 12b, 13b, 14b, 15b, and 16b are formed of a conductive material. For example, the control terminals 11b, 12b, 13b, 14b, 15b, and 16b are formed with screw holes for attaching the control wires 21, 22, 23, 24, 25, and 26, respectively.

[0023] Specifically, the crimp terminal at one end of control wiring 21 connecting semiconductor module 11 and control circuit 2a is attached to control terminal 11b by a fastening member that screws into a screw hole. Similarly, the crimp terminal at one end of control wiring 22 connecting semiconductor module 12 and control circuit 2a is attached to control terminal 12b by a fastening member that screws into a screw hole. Similarly, the crimp terminal at one end of control wiring 23 connecting semiconductor module 13 and control circuit 2a is attached to control terminal 13b by a fastening member that screws into a screw hole. Similarly, the crimp terminal at one end of control wiring 24 connecting semiconductor module 14 and control circuit 2b is attached to control terminal 14b by a fastening member that screws into a screw hole. Similarly, the crimp terminal at one end of control wiring 25 connecting semiconductor module 15 and control circuit 2b is attached to control terminal 15b by a fastening member that screws into a screw hole. Similarly, a crimp terminal at one end of a control wire 26 that connects the semiconductor module 16 and the control circuit 2b is attached to the control terminal 16b by a fastening member that screws into a screw hole.

[0024] The collector main terminals 11c, 12c, 13c, 14c, 15c, and 16c are formed of conductive materials. The emitter main terminals 11d, 12d, 13d, 14d, 15d, and 16d are also formed of conductive materials. Bus bars (not shown) connected to the input terminal 1a are attached to the collector main terminals 11c, 12c, and 13c. The emitter main terminals 11d, 12d, and 13d are connected to the collector main terminals 14c, 15c, and 16c, respectively, by bus bars (not shown). The connection point between the emitter main terminal 11d and the collector main terminal 14c, the connection point between the emitter main terminal 12d and the collector main terminal 15c, and the connection point between the emitter main terminal 13d and the collector main terminal 16c are connected to the output terminals 1c, 1d, and 1e, respectively, by bus bars (not shown). A bus bar (not shown) connected to the input terminal 1b is attached to the emitter main terminals 14d, 15d, and 16d.

[0025] The control circuits 2a and 2b are attached to the heat receiving block 10 by any method, such as fastening with fastening members or bonding with an adhesive. The control circuit 2a controls the switching elements SW1 of the semiconductor modules 11, 12, and 13 by sending control signals to the gate terminals G1 of the switching elements SW1 of the semiconductor modules 11, 12, and 13 via control wirings 21, 22, and 23, respectively. The control circuit 2b controls the switching elements SW1 of the semiconductor modules 14, 15, and 16 by sending control signals to the gate terminals G1 of the switching elements SW1 of the semiconductor modules 14, 15, and 16 via control wirings 24, 25, and 26, respectively. The control circuits 2a and 2b are preferably provided near the semiconductor modules 11-16.

[0026] Control wiring 21, 22, 23 are associated with semiconductor modules 11, 12, 13, respectively, and connect the associated semiconductor modules 11, 12, 13 to control circuit 2a that controls switching elements SW1 of semiconductor modules 11, 12, 13. Control wiring 24, 25, 26 are associated with semiconductor modules 14, 15, 16, respectively, and connect the associated semiconductor modules 14, 15, 16 to control circuit 2b that controls switching elements SW1 of semiconductor modules 14, 15, 16.

[0027] In the example of Figure 2, each of the control wirings 21-26 is shown as a single line, but if the control wirings 21-26 have multiple core wires, for example, if each of the control wirings 21-26 has two core wires, then each core wire of the control wirings 21-26 can be connected to each of the multiple control terminals 11b-16b, as shown in Figure 3.

[0028] The wiring attachment members 31-33 attach at least two control wires corresponding to at least two semiconductor modules, including two semiconductor modules arranged adjacent to each other in the first arrangement direction, among the semiconductor modules 11-16, to the heat receiving block 10 together in a state where they are arranged adjacent to each other.

[0029] In detail, the wiring attachment member 31 attaches the control wirings 21, 24 associated with the semiconductor modules 11, 14 arranged adjacent to each other in the first arrangement direction to the heat receiving block 10 in a state where they are arranged adjacent to each other. For example, as shown in Fig. 4, the wiring attachment member 31 has a shape that clamps the control wirings 21, 24 and fixes them to the heat receiving block 10. The wiring attachment member 31 is formed of any member having any shape that can attach the control wirings 21, 24 to the heat receiving block 10. As an example, the wiring attachment member 31 is formed of a resin or metal member having a U-shape that fits into a hole formed in the heat receiving block 10.

[0030] 2, the control wires 21 and 24 attached to the heat receiving block 10 by the same wire attachment member 31 are arranged adjacent to each other and extend from the control circuits 2a and 2b toward the wire attachment member 31. The control wires 21 and 24 extend from the control circuits 2a and 2b toward the wire attachment member 31, for example, with a gap of 20 millimeters or less between them. The control wires 21 and 24 branch off at a position offset in the second arrangement direction from the center of the gap between the semiconductor modules 11 and 14 in the first arrangement direction, extend in different directions, and are connected to the associated semiconductor modules 11 and 14. More specifically, the control wire 21 is bent from the position where it is attached to the heat receiving block 10 by the wire attachment member 31 at a position offset in the second arrangement direction, specifically, in the negative X-axis direction, and extends in the positive Z-axis and negative Y-axis directions to be routed to the semiconductor module 11. The control wiring 24 is bent from the position where it is attached to the heat receiving block 10 by the wiring mounting member 31 at a position shifted in the second array direction, specifically, in the negative X-axis direction, and extends in the negative Z-axis direction and the negative Y-axis direction, and is pulled through to the semiconductor module 14.

[0031] The control wirings 21, 24 associated with the semiconductor modules 11, 14 arranged adjacent to each other in the first arrangement direction extend to the wiring attachment member 31 while arranged adjacent to each other, then separate at the center of the gap between the semiconductor modules 11, 14 in the first direction, extend in different directions, and are connected to the semiconductor modules 11, 14. This reduces the difference in wiring length between the control wirings 21, 24 corresponding to the same phase compared to a conversion circuit in which gate wiring is routed for each switching element. The ratio of the length of one of the control wirings 21, 24 corresponding to the U phase to the other is preferably, for example, 0.9 or more and 1.1 or less. By reducing the difference in wiring length between the control wirings 21, 24 corresponding to the same phase, it is possible to suppress variations in the control accuracy of the switching elements SW1 of the same phase.

[0032] The wiring attachment member 32 attaches the control wirings 21, 24 associated with the semiconductor modules 11, 14 arranged adjacent to each other in the first arrangement direction and the control wirings 22, 25 associated with the semiconductor modules 12, 15 arranged adjacent to each other in the first arrangement direction together to the heat receiving block 10. Specifically, the wiring attachment member 32 attaches the control wirings 21, 22 overlapped in the Y-axis direction and the control wirings 24, 25 overlapped in the Y-axis direction and arranged adjacent to the control wirings 21, 22, together to the heat receiving block 10.

[0033] Of the control wires 21, 22, 24, and 25 attached to the heat receiving block 10 by the same wire attachment member 32, the control wires 22 and 25 are arranged adjacent to each other and extend from the control circuits 2a and 2b toward the wire attachment member 32. The control wires 22 and 25 extend from the control circuits 2a and 2b toward the wire attachment member 32, for example, with a spacing of 20 millimeters or less. The control wires 22 and 25 branch off at a position offset in the second arrangement direction from the center of the gap between the semiconductor modules 12 and 15 in the first arrangement direction, extend in different directions, and are connected to the associated semiconductor modules 12 and 15. More specifically, the control wire 22 is bent from the position where it is attached to the heat receiving block 10 by the wire attachment member 32 at a position offset in the second arrangement direction, specifically, in the negative X-axis direction, and extends in the positive Z-axis and negative Y-axis directions to be routed to the semiconductor module 12. The control wiring 25 is bent from the position where it is attached to the heat receiving block 10 by the wiring mounting member 32 at a position shifted in the second array direction, specifically, in the negative X-axis direction, and extends in the negative Z-axis direction and the negative Y-axis direction, and is pulled through to the semiconductor module 15.

[0034] The control wirings 22, 25 associated with the semiconductor modules 12, 15 arranged adjacent to each other in the first arrangement direction extend to the wiring attachment member 32 while arranged adjacent to each other, then separate at the center of the gap between the semiconductor modules 12, 15 in the first direction, extend in different directions, and are connected to the semiconductor modules 12, 15. This reduces the difference in wiring length between the control wirings 22, 25 corresponding to the same phase compared to a conversion circuit in which gate wiring is routed for each switching element. The ratio of the length of one of the control wirings 22, 25 corresponding to the V phase to the other is preferably, for example, 0.9 or more and 1.1 or less. By reducing the difference in wiring length between the control wirings 22, 25 corresponding to the same phase, it is possible to suppress variations in the control accuracy of the switching elements SW1 of the same phase.

[0035] The control wires 21 and 24 extend from the position where they are attached to the heat receiving block 10 by the wire attachment member 32 toward the wire attachment member 31, and are attached to the heat receiving block 10 by the wire attachment member 31 as described above.

[0036] The wiring attachment member 33 attaches the control wirings 21, 24 associated with the semiconductor modules 11, 14 arranged adjacent to each other in the first arrangement direction, the control wirings 22, 25 associated with the semiconductor modules 12, 15 arranged adjacent to each other in the first arrangement direction, and the control wirings 23, 26 associated with the semiconductor modules 13, 16 arranged adjacent to each other in the first arrangement direction, all adjacent to each other, to the heat receiving block 10. Specifically, the wiring attachment member 33 attaches the control wirings 21, 22, 23 overlapped in the Y-axis direction and the control wirings 24, 25, 26 overlapped in the Y-axis direction and arranged adjacent to the control wirings 21, 22, 23, respectively, to the heat receiving block 10.

[0037] Of the control wires 21-26 attached to the heat receiving block 10 by the same wire attachment member 33, the control wires 23 and 26 are arranged adjacent to each other and extend from the control circuits 2a and 2b toward the wire attachment member 33. The control wires 23 and 26 extend from the control circuits 2a and 2b toward the wire attachment member 33, for example, with a spacing of 20 millimeters or less. The control wires 23 and 26 branch off at a position offset in the second arrangement direction from the center of the gap between the semiconductor modules 13 and 16 in the first arrangement direction, extend in different directions, and are connected to the associated semiconductor modules 13 and 16. More specifically, the control wire 23 is bent from the position where it is attached to the heat receiving block 10 by the wire attachment member 33 at a position offset in the second arrangement direction, specifically, in the negative X-axis direction, and extends in the positive Z-axis direction and the negative Y-axis direction, and is routed to the semiconductor module 13. The control wiring 26 is bent from the position where it is attached to the heat receiving block 10 by the wiring mounting member 33 at a position shifted in the second array direction, specifically, in the negative X-axis direction, and extends in the negative Z-axis direction and the negative Y-axis direction, and is pulled through to the semiconductor module 16.

[0038] The control wirings 23, 26 associated with the semiconductor modules 13, 16 arranged adjacent to each other in the first arrangement direction extend to the wiring attachment member 33 while arranged adjacent to each other, then split at the center of the gap between the semiconductor modules 13, 16 in the first direction, extend in different directions, and are connected to the semiconductor modules 13, 16. This reduces the difference in wiring length between the control wirings 23, 26 corresponding to the same phase compared to a conversion circuit in which gate wiring is routed for each switching element. The ratio of the length of one of the control wirings 23, 26 corresponding to the W phase to the other is preferably, for example, 0.9 or more and 1.1 or less. By reducing the difference in wiring length between the control wirings 23, 26 corresponding to the same phase, it is possible to suppress variations in the control accuracy of the switching elements SW1 of the same phase.

[0039] The control wires 21, 24 extend from the position where they are attached to the heat receiving block 10 by the wire attachment member 33 toward the wire attachment member 32, and are attached to the heat receiving block 10 by the wire attachment member 32 as described above. Thereafter, the control wires 21, 24 extend from the position where they are attached to the heat receiving block 10 by the wire attachment member 32 toward the wire attachment member 31, and are attached to the heat receiving block 10 by the wire attachment member 31 as described above.

[0040] The control wires 22 and 25 extend from the position where they are attached to the heat receiving block 10 by the wire attachment member 33 toward the wire attachment member 32, and are attached to the heat receiving block 10 by the wire attachment member 32 as described above.

[0041] As described above, in the electronic device 101 according to the first embodiment, the control wires 21 and 24 corresponding to the semiconductor modules 11 and 14 are attached to the heat receiving block 10 by the wire attachment member 31. Similarly, the control wires 22 and 25 corresponding to the semiconductor modules 12 and 15 are attached to the heat receiving block 10 by the wire attachment member 32. The control wires 23 and 26 corresponding to the semiconductor modules 13 and 16 are attached to the heat receiving block 10 by the wire attachment member 33. With the above configuration, an increase in the number of wire attachment members is prevented, and an electronic device 101 with a simple configuration is obtained.

[0042] Furthermore, by reducing the difference in wiring length between the control wirings corresponding to the same phase, specifically, between the control wirings 21 and 24, the control wirings 22 and 25, and the control wirings 23 and 26, it is possible to suppress variations in control accuracy.

[0043] Second Embodiment The configuration of the power conversion circuit provided in the electronic device is not limited to the above example. In a second embodiment, an electronic device 102 including a power conversion circuit 3 different from that of the first embodiment will be described, focusing on the differences from the first embodiment.

[0044] The electronic device 102 shown in FIG. 5 includes a power conversion circuit 3 that converts power supplied from a power supply (not shown) into power to be supplied to a load device, and a control circuit 2 that controls the power conversion circuit 3.

[0045] An input terminal 3a of the power conversion circuit 3 is connected to a current collector that acquires power from a substation via a power supply line. An input terminal 3b is grounded. An input voltage divided by a resistor (not shown) is applied to an input terminal 3c. Output terminals 3d, 3e, and 3f are connected to load devices. The power conversion circuit 3 converts power supplied from the current collector connected to the input terminal 3a into power to be supplied to the load devices, and supplies the converted power to the load devices via the output terminals 3d, 3e, and 3f.

[0046] The power conversion circuit 3 has semiconductor modules 51, 54, and 57 corresponding to the U phase, semiconductor modules 52, 55, and 58 corresponding to the V phase, and semiconductor modules 53, 56, and 59 corresponding to the W phase. The semiconductor modules 51 and 54 are connected in series, and the semiconductor modules 54 and 57 are connected in series. The semiconductor modules 52 and 55 are connected in series, and the semiconductor modules 55 and 58 are connected in series. The semiconductor modules 53 and 56 are connected in series, and the semiconductor modules 56 and 59 are connected in series.

[0047] The semiconductor modules 51, 54, and 57, the semiconductor modules 52, 55, and 58, and the semiconductor modules 53, 56, and 59 are connected in parallel between the input terminals 3a and 3b. The semiconductor modules 51 to 59 are controlled by the control circuit 2.

[0048] Since the semiconductor modules 51, 52, and 53 have the same configuration, the following describes the details of the configuration of the semiconductor module 51. The semiconductor module 51 has a switching element SW1 controlled by the control circuit 2, a freewheeling diode D1 connected in parallel to the switching element SW1, and a clamp diode D5 connected in series to the switching element SW1. The switching element SW1 is, for example, an IGBT.

[0049] The collector terminal C1 of the switching element SW1 of each of the semiconductor modules 51, 52, and 53 is electrically connected to the input terminal 3a. The emitter terminal E1 of the switching element SW1 of each of the semiconductor modules 51, 52, and 53 is electrically connected to the cathode of the clamp diode D5 and to each of the semiconductor modules 54, 55, and 56. The anode of the clamp diode D5 is electrically connected to the input terminal 3c.

[0050] Since the semiconductor modules 54, 55, and 56 have the same configuration, only the configuration of the semiconductor module 54 will be described in detail. The semiconductor module 54 has switching elements SW2 and SW3 controlled by the control circuit 2, and freewheeling diodes D2 and D3 connected in parallel to the switching elements SW2 and SW3, respectively. The switching elements SW2 and SW3 are, for example, IGBTs.

[0051] The collector terminal C2 of the switching element SW2 of each of the semiconductor modules 54, 55, and 56 is connected to the emitter terminal E1 of the switching element SW1 of each of the semiconductor modules 51, 52, and 53. The emitter terminal E2 of the switching element SW2 is electrically connected to the collector terminal C3 of the switching element SW3. The connection points of the switching elements SW2 and SW3 of each of the semiconductor modules 54, 55, and 56 are electrically connected to the output terminals 3d, 3e, and 3f, respectively. The emitter terminal E1 of the switching element SW3 of each of the semiconductor modules 54, 55, and 56 is electrically connected to the semiconductor modules 57, 58, and 59, respectively.

[0052] Since the semiconductor modules 57, 58, and 59 have the same configuration, the following describes the details of the configuration of the semiconductor module 57. The semiconductor module 57 has a switching element SW4 controlled by the control circuit 2, a freewheeling diode D4 connected in parallel to the switching element SW4, and a clamp diode D6 connected in series to the switching element SW4. The switching element SW4 is, for example, an IGBT.

[0053] The collector terminal C4 of the switching element SW4 of each of the semiconductor modules 57, 58, and 59 is electrically connected to the anode of the clamp diode D6 and the emitter terminal E3 of the switching element SW3 of each of the semiconductor modules 54, 55, and 56. The emitter terminal E4 of the switching element SW4 of each of the semiconductor modules 57, 58, and 59 is electrically connected to the input terminal 3b. The cathode of the clamp diode D6 is electrically connected to the input terminal 3c.

[0054] A control signal output from the control circuit 2 is input to the gate terminal G1 of the switching element SW1 of the semiconductor modules 51-53, the gate terminals G2 and G3 of the switching elements SW2 and SW3 of the semiconductor modules 54-56, and the gate terminal G4 of the switching element SW4 of the semiconductor modules 57-59.

[0055] 6, the electronic device 102 includes semiconductor modules 51-59 arranged two-dimensionally and attached to the heat receiving block 10, a control circuit 2 that controls the switching element SW1 of the semiconductor modules 51-53, the switching elements SW2 and SW3 of the semiconductor modules 54-56, and the switching element SW4 of the semiconductor modules 57-59, control wiring 21-23, 24a, 24b, 25a, 25b, 26a, 26b, 27-29 that are provided corresponding to the semiconductor modules 51-59, wiring attachment members 31-36 that attach at least two of the control wiring 21-23, 24a, 24b, 25a, 25b, 26a, 26b, 27-29 to the heat receiving block 10 while they are arranged adjacent to each other, and substrates 61-69 that are attached to the semiconductor modules 51-59, respectively.

[0056] The semiconductor module 51 has a casing 51a that houses the switching element SW1, the freewheeling diode D1, and the clamp diode D5, a control terminal 51b that is electrically connected to the gate terminal G1 of the switching element SW1, a collector main terminal 51c that is electrically connected to the collector terminal C1 of the switching element SW1 and exposed to the outside of the casing 51a, an intermediate terminal 51d that is connected to the anode of the clamp diode D5 and exposed to the outside of the casing 51a, and an emitter main terminal 51e that is electrically connected to the emitter terminal E1 of the switching element SW1 and exposed to the outside of the casing 51a.

[0057] Similarly, the semiconductor modules 52 and 53 each have a casing 52a or 53a that houses the switching element SW1, the freewheeling diode D1, and the clamp diode D5, control terminals 52b or 53b that are electrically connected to the gate terminal G1 of the switching element SW1, collector main terminals 52c or 53c that are electrically connected to the collector terminal C1 of the switching element SW1 and exposed to the outside of the casings 52a or 53a, intermediate terminals 52d or 53d that are connected to the anode of the clamp diode D5 and exposed to the outside of the casings 52a or 53a, and emitter main terminals 52e or 53e that are electrically connected to the emitter terminal E1 of the switching element SW1 and exposed to the outside of the casings 52a or 53a.

[0058] The semiconductor module 54 has a casing 54a that houses the switching elements SW2 and SW3, a control terminal 54b that is electrically connected to the gate terminals G2 and G3 of the switching elements SW2 and SW3, respectively, a collector main terminal 54c that is attached to the casing 54a, electrically connected to the collector terminal C2 of the switching element SW2, and exposed to the outside of the casing 54a, an emitter main terminal 54d that is electrically connected to the emitter terminal E3 of the switching element SW3 and exposed to the outside of the casing 54a, and an intermediate terminal 54e that is connected to the connection point of the switching elements SW2 and SW3 and exposed to the outside of the casing 54a.

[0059] Similarly, the semiconductor modules 55, 56 have casings 55a, 56a that house the switching elements SW2, SW3, control terminals 55b, 56b that are electrically connected to gate terminals G2, G3 of the switching elements SW2, SW3, respectively, collector main terminals 55c, 56c that are attached to the casings 55a, 56a, electrically connected to the collector terminal C2 of the switching element SW2, and exposed to the outside of the casings 55a, 56a, emitter main terminals 55d, 56d that are electrically connected to the emitter terminal E3 of the switching element SW3 and exposed to the outside of the casings 55a, 56a, and intermediate terminals 55e, 56e that are connected to the connection point of the switching elements SW2, SW3, and exposed to the outside of the casings 55a, 56a.

[0060] The semiconductor module 57 has a casing 57a that houses the switching element SW4, the freewheeling diode D4, and the clamp diode D6, a control terminal 57b that is electrically connected to the gate terminal G4 of the switching element SW4, an intermediate terminal 57c that is electrically connected to the cathode of the clamp diode D6 and exposed to the outside of the casing 57a, an emitter main terminal 57d that is electrically connected to the emitter terminal E4 of the switching element SW4 and exposed to the outside of the casing 57a, and a collector main terminal 57e that is electrically connected to the anode of the clamp diode D6 and the collector terminal C4 of the switching element SW4 and exposed to the outside of the casing 57a.

[0061] Similarly, the semiconductor modules 58, 59 have casings 58a, 59a that accommodate the switching element SW4, the freewheeling diode D4, and the clamp diode D6, control terminals 58b, 59b that are electrically connected to the gate terminal G4 of the switching element SW4, intermediate terminals 58c, 59c that are electrically connected to the cathode of the clamp diode D6 and exposed to the outside of the casings 58a, 59a, emitter main terminals 58d, 59d that are electrically connected to the emitter terminal E4 of the switching element SW4 and exposed to the outside of the casings 58a, 59a, and collector main terminals 58e, 59e that are electrically connected to the anode of the clamp diode D6 and the collector terminal C4 of the switching element SW4 and exposed to the outside of the casings 58a, 59a.

[0062] The casings 51a, 52a, 53a, 54a, 55a, 56a, 57a, 58a, and 59a are arranged two-dimensionally in the X-axis direction and the Z-axis direction at intervals from one another and attached to the heat receiving block 10. The casings 51a, 52a, 53a, 54a, 55a, 56a, 57a, 58a, and 59a are attached to the heat receiving block 10 by any method, such as fastening with fastening members or bonding with an adhesive.

[0063] The collector main terminals 51c, 52c, 53c, 54c, 55c, 56c, 57e, 58e, and 59e are made of conductive materials. The emitter main terminals 51e, 52e, 53e, 54d, 55d, 56d, 57d, 58d, and 59d are made of conductive materials. The intermediate terminals 51d, 52d, 53d, 54e, 55e, 56e, 57c, 58c, and 59c are made of conductive materials.

[0064] The collector main terminals 51c, 52c, and 53c are attached with bus bars (not shown) that are connected to the input terminal 3a. The emitter main terminals 51e, 52, and 53e are connected to the collector main terminals 54c, 55c, and 56c by bus bars (not shown). The emitter main terminals 54d, 55d, and 56d are connected to the collector main terminals 57e, 58e, and 59e by bus bars (not shown). The intermediate terminals 54e, 55e, and 56e are connected to the output terminals 3d, 3e, and 3f by bus bars (not shown). The intermediate terminals 51d, 52d, 53d, 57c, 58c, and 59c are attached with bus bars (not shown) that are connected to the input terminal 3c. The emitter main terminals 57d, 58d, and 59d are attached with bus bars (not shown) that are connected to the input terminal 3b.

[0065] The substrates 61, 62, and 63 are attached to the casings 51 a, 52 a, and 53 a, respectively, and are electrically connected to the gate terminal G1 of the switching element SW1 via the control terminals 51 b, 52 b, and 53 b. The substrates 61, 62, and 63 have connectors 61 a, 62 a, and 63 a, respectively, each having the shape of a socket to which the control wiring 21, 22, and 23 can be attached.

[0066] The substrates 64, 65, and 66 are attached to the casings 54a, 55a, and 56a, respectively. The substrate 64 is electrically connected to the gate terminals G2 and G3 of the switching elements SW2 and SW3 via the control terminals 54b. The substrate 64 has connectors 64a and 64b shaped like sockets to which the control wires 24a and 24b can be attached. The substrate 65 is electrically connected to the gate terminals G2 and G3 of the switching elements SW2 and SW3 via the control terminals 55b. The substrate 65 has connectors 65a and 65b shaped like sockets to which the control wires 25a and 25b can be attached. The substrate 66 is electrically connected to the gate terminals G2 and G3 of the switching elements SW2 and SW3 via the control terminals 56b. The substrate 66 has connectors 66a and 66b shaped like sockets to which the control wires 26a and 26b can be attached.

[0067] The substrates 67, 68, and 69 are attached to the casings 57 a, 58 a, and 59 a, respectively, and are electrically connected to the gate terminal G4 of the switching element SW4 via the control terminals 57 b, 58 b, and 59 b. The substrates 67, 68, and 69 have connectors 67 a, 68 a, and 69 a, respectively, each having the shape of a socket to which the control wiring 27, 28, and 29 can be attached.

[0068] The control wiring 21, 22, 23 are provided corresponding to the semiconductor modules 51, 52, 53, respectively. One ends of the control wiring 21, 22, 23 are attached to connectors 61 a, 62 a, 63 a included in the boards 61, 62, 63 of the corresponding semiconductor modules 51, 52, 53, thereby connecting the semiconductor modules 51, 52, 53 to the control circuit 2. One ends of the control wiring 21, 22, 23 have a shape that allows them to be inserted into the connectors 61 a, 62 a, 63 a. The control wiring 21, 22, 23 each have, for example, a five-core wire, and one end has a plug shape that fits into the slot shape of the connectors 61 a, 62 a, 63 a. The control wirings 21, 22, and 23 connect the gate terminal G1 of the switching element SW1 to the control circuit 2 via connectors 61a, 62a, and 63a, substrates 61, 62, and 63, and control terminals 51b, 52b, and 53b, respectively.

[0069] The control wiring 24a, 24b is provided in association with the semiconductor module 54. One end of the control wiring 24a, 24b is attached to a connector 64a, 64b included in the substrate 64 of the associated semiconductor module 54, connecting the semiconductor module 54 and the control circuit 2. One end of the control wiring 24a, 24b has a shape that allows it to be inserted into the connector 64a, 64b. Each of the control wiring 24a, 24b has, for example, five core wires, and one end has a plug shape that fits into the slot-shaped connector 64a, 64b. The control wiring 24a connects the gate terminal G2 of the switching element SW2 to the control circuit 2 via the connector 64a, the substrate 64, and the control terminal 54b. The control wiring 24b connects the gate terminal G3 of the switching element SW3 to the control circuit 2 via the connector 64b, the substrate 64, and the control terminal 54b.

[0070] The control wiring 25a, 25b is provided in association with the semiconductor module 55. One end of the control wiring 25a, 25b is attached to a connector 65a, 65b included in the substrate 65 of the associated semiconductor module 55, connecting the semiconductor module 55 to the control circuit 2. One end of the control wiring 25a, 25b has a shape that allows it to be inserted into the connector 65a, 65b. Each of the control wiring 25a, 25b has, for example, five core wires, and one end has a plug shape that fits into the slot-shaped connector 65a, 65b. The control wiring 25a connects the gate terminal G2 of the switching element SW2 to the control circuit 2 via the connector 65a, the substrate 65, and the control terminal 55b. The control wiring 25b connects the gate terminal G3 of the switching element SW3 to the control circuit 2 via the connector 65b, the substrate 65, and the control terminal 55b.

[0071] The control wiring 26a, 26b is provided in association with the semiconductor module 56. One end of the control wiring 26a, 26b is attached to a connector 66a, 66b included in the substrate 66 of the associated semiconductor module 56, connecting the semiconductor module 56 to the control circuit 2. One end of the control wiring 26a, 26b has a shape that allows it to be inserted into the connector 66a, 66b. Each of the control wiring 26a, 26b has, for example, five core wires, and one end has a plug shape that fits into the slot-shaped connector 66a, 66b. The control wiring 26a connects the gate terminal G2 of the switching element SW2 to the control circuit 2 via the connector 66a, the substrate 66, and the control terminal 56b. The control wiring 26b connects the gate terminal G3 of the switching element SW3 to the control circuit 2 via the connector 66b, the substrate 66, and the control terminal 56b.

[0072] The control wiring 27, 28, 29 are provided corresponding to the semiconductor modules 57, 58, 59, respectively. One ends of the control wiring 27, 28, 29 are attached to connectors 67 a, 68 a, 69 a included in the boards 67, 68, 69 of the corresponding semiconductor modules 57, 58, 59, thereby connecting the semiconductor modules 57, 58, 59 to the control circuit 2. One ends of the control wiring 27, 28, 29 have a shape that allows them to be inserted into the connectors 67 a, 68 a, 69 a. The control wiring 27, 28, 29 each have, for example, a five-core wire, and one end has a plug shape that fits into the slot-shaped connectors 67 a, 68 a, 69 a. The control wirings 27, 28, and 29 connect the gate terminal G4 of the switching element SW4 to the control circuit 2 via connectors 67a, 68a, and 69a, substrates 67, 68, and 69, and control terminals 57b, 58b, and 59b, respectively.

[0073] The wiring attachment member 31-36 attaches at least two control wires corresponding to at least two semiconductor modules, including two semiconductor modules arranged adjacent to each other in the first arrangement direction, among the semiconductor modules 51-59, to the heat receiving block 10 together in a state where they are arranged adjacent to each other.

[0074] In detail, the wiring mounting member 31 mounts the control wiring 21, 24a corresponding to the semiconductor modules 51, 54 arranged adjacent to each other in the first arrangement direction together on the heat receiving block 10 in a state where they are arranged adjacent to each other.

[0075] The control wires 21, 24a attached to the heat receiving block 10 by the same wire attachment member 31 are arranged adjacent to each other and extend from the control circuit 2 toward the wire attachment member 31. The control wires 21, 24 extend from the control circuit 2 toward the wire attachment member 31, for example, with a gap of 20 millimeters or less between them. The control wires 21, 24a branch off at a position offset in the second arrangement direction from the center of the gap between the semiconductor modules 51, 54 in the first arrangement direction, extend in different directions, and are connected to the associated semiconductor modules 51, 54. More specifically, the control wire 21 is bent from the position where it is attached to the heat receiving block 10 by the wire attachment member 31 at a position offset in the second arrangement direction, specifically, in the negative X-axis direction, and extends in the positive Z-axis direction and the negative Y-axis direction to be routed to the semiconductor module 51. The control wiring 24a is bent from the position where it is attached to the heat receiving block 10 by the wiring mounting member 31 at a position shifted in the second array direction, specifically, in the negative X-axis direction, and extends in the negative Z-axis direction and the negative Y-axis direction, and is pulled through to the semiconductor module 54.

[0076] The connectors 61a, 64a to which the control wires 21, 24a attached to the heat receiving block 10 by the same wire attachment member 31 are preferably opposed in the first arrangement direction. By positioning the connectors 61a, 64a opposite each other, the control wires 21, 24a extend in opposite directions on the XZ plane from near the positions where the control wires 21, 24a are attached to the heat receiving block 10 by the wire attachment member 31. As a result, the wiring paths of the control wires 21, 24a are simplified, simplifying the configuration of the electronic device 102. Furthermore, the wiring work for the control wires 21, 24a is facilitated.

[0077] The wiring mounting member 32 mounts the control wiring 21, 24a associated with the semiconductor modules 51, 54 arranged adjacent to each other in the first arrangement direction, and the control wiring 22, 25a associated with the semiconductor modules 52, 55 arranged adjacent to each other in the first arrangement direction, together to the heat receiving block 10 in a state where they are arranged adjacent to each other.

[0078] Of the control wires 21, 22, 24a, and 25a attached to the heat receiving block 10 by the same wire attachment member 32, the control wires 22 and 25a are arranged adjacent to each other and extend from the control circuit 2 toward the wire attachment member 32. The control wires 22 and 25a branch off at a position shifted in the second arrangement direction from the center of the gaps between the semiconductor modules 52 and 55 in the first arrangement direction, extend in different directions, and are connected to the associated semiconductor modules 52 and 55. More specifically, the control wire 22 is bent from the position where it is attached to the heat receiving block 10 by the wire attachment member 32 at a position shifted in the second arrangement direction, specifically in the negative X-axis direction, and extends in the positive Z-axis direction and the negative Y-axis direction to be routed to the semiconductor module 52. The control wiring 25a is bent from the position where it is attached to the heat receiving block 10 by the wiring mounting member 32 at a position shifted in the second array direction, specifically, in the negative X-axis direction, and extends in the negative Z-axis direction and the negative Y-axis direction, and is pulled through to the semiconductor module 55.

[0079] Of the control wires 21, 22, 24a, and 25a attached to the heat receiving block 10 by the same wire attachment member 32, the connectors 62a and 65a to which the control wires 22 and 25a are attached preferably face each other in the first arrangement direction. By positioning the connectors 62a and 65a opposite each other, the control wires 22 and 25a extend in opposite directions on the XZ plane from near the positions where the control wires 22 and 25a are attached to the heat receiving block 10 by the wire attachment member 32. As a result, the wiring paths of the control wires 22 and 25a are simplified, simplifying the configuration of the electronic device 102. Furthermore, the wiring work for the control wires 22 and 25a is facilitated.

[0080] The control wires 21 and 24a extend from the position where they are attached to the heat receiving block 10 by the wire attachment member 32 toward the wire attachment member 31, and are attached to the heat receiving block 10 by the wire attachment member 31 as described above.

[0081] The wiring mounting member 33 mounts the control wiring 21, 24a associated with the semiconductor modules 51, 54 arranged adjacent to each other in the first arrangement direction, the control wiring 22, 25a associated with the semiconductor modules 52, 55 arranged adjacent to each other in the first arrangement direction, and the control wiring 23, 26a associated with the semiconductor modules 53, 56 arranged adjacent to each other in the first arrangement direction, all to the heat receiving block 10 in a state where they are arranged adjacent to each other.

[0082] Of the control wires 21, 22, 23, 24a, 25a, and 26a attached to the heat receiving block 10 by the same wire attachment member 33, the control wires 23 and 26a are arranged adjacent to each other and extend from the control circuit 2 toward the wire attachment member 33. The control wires 23 and 26a branch off at a position shifted in the second arrangement direction from the center of the gap between the semiconductor modules 53 and 56 in the first arrangement direction, extend in different directions, and are connected to the associated semiconductor modules 53 and 56. More specifically, the control wire 23 is bent from the position where it is attached to the heat receiving block 10 by the wire attachment member 33 at a position shifted in the second arrangement direction, specifically in the negative X-axis direction, and extends in the positive Z-axis and negative Y-axis directions to be routed to the semiconductor module 53. The control wiring 26a is bent from the position where it is attached to the heat receiving block 10 by the wiring mounting member 33 at a position shifted in the second array direction, specifically, in the negative X-axis direction, and extends in the negative Z-axis direction and the negative Y-axis direction, and is pulled through to the semiconductor module 56.

[0083] Of the control wires 21, 22, 23, 24a, 25a, and 26a attached to the heat receiving block 10 by the same wire attachment member 33, the connectors 63a and 66a to which the control wires 23 and 26a are attached preferably face each other in the first arrangement direction. By positioning the connectors 63a and 66a opposite each other, the control wires 23 and 26a extend in opposite directions on the XZ plane from near the positions where the control wires 23 and 26a are attached to the heat receiving block 10 by the wire attachment member 33. As a result, the wiring paths of the control wires 23 and 26a are simplified, simplifying the configuration of the electronic device 102. Furthermore, the wiring work for the control wires 23 and 26a is facilitated.

[0084] The control wiring 21, 24a extends from the position where it is attached to the heat receiving block 10 by the wiring attachment member 33 toward the wiring attachment member 32, and is attached to the heat receiving block 10 by the wiring attachment member 32 as described above. Thereafter, the control wiring 21, 24a extends from the position where it is attached to the heat receiving block 10 by the wiring attachment member 32 toward the wiring attachment member 31, and is attached to the heat receiving block 10 by the wiring attachment member 31 as described above.

[0085] The control wires 22 and 25a extend from the position where they are attached to the heat receiving block 10 by the wire attachment member 33 toward the wire attachment member 32, and are attached to the heat receiving block 10 by the wire attachment member 32 as described above.

[0086] The wiring attachment member 34 attaches the control wirings 24b, 27 associated with the semiconductor modules 54, 57 arranged adjacent to each other in the first arrangement direction to the heat receiving block 10 in a state in which they are arranged adjacent to each other.

[0087] The control wires 24b and 27 attached to the heat receiving block 10 by the same wire attachment member 34 extend adjacent to each other from the control circuit 2 toward the wire attachment member 34. The control wires 24b and 27 branch off at a position offset in the second arrangement direction from the center of the gap between the semiconductor modules 54 and 57 in the first arrangement direction, extend in different directions, and are connected to the associated semiconductor modules 54 and 57. More specifically, the control wire 24b is bent from the position where it is attached to the heat receiving block 10 by the wire attachment member 31 at a position offset in the second arrangement direction, specifically, in the negative X-axis direction, and extends in the positive Z-axis and negative Y-axis directions to reach the semiconductor module 54. The control wire 27 is bent from the position where it is attached to the heat receiving block 10 by the wire attachment member 34 at a position offset in the second arrangement direction, specifically, in the negative X-axis direction, and extends in the negative Z-axis and negative Y-axis directions to reach the semiconductor module 57.

[0088] The connectors 64b and 67a to which the control wires 24b and 27 attached to the heat receiving block 10 by the same wire attachment member 34 are preferably opposed in the first arrangement direction. By positioning the connectors 64b and 67a opposite each other, the control wires 24b and 27 extend in opposite directions on the XZ plane from near the positions where the control wires 24b and 27 are attached to the heat receiving block 10 by the wire attachment member 34. As a result, the wiring paths of the control wires 24b and 27 are simplified, simplifying the configuration of the electronic device 102. Furthermore, the wiring work for the control wires 24b and 27 is facilitated.

[0089] The wiring mounting member 35 mounts the control wiring 24b, 27 associated with the semiconductor modules 54, 57 arranged adjacent to each other in the first arrangement direction, and the control wiring 25b, 28 associated with the semiconductor modules 55, 58 arranged adjacent to each other in the first arrangement direction, together to the heat receiving block 10 in a state where they are arranged adjacent to each other.

[0090] Of the control wires 24b, 25b, 27, and 28 attached to the heat receiving block 10 by the same wire attachment member 35, the control wires 25b and 28 are arranged adjacent to each other and extend from the control circuit 2 toward the wire attachment member 35. The control wires 25b and 28 branch off at a position shifted in the second arrangement direction from the center of the gaps between the semiconductor modules 55 and 58 in the first arrangement direction, extend in different directions, and are connected to the associated semiconductor modules 55 and 58. More specifically, the control wire 25b is bent from the position where it is attached to the heat receiving block 10 by the wire attachment member 35 at a position shifted in the second arrangement direction, specifically in the negative X-axis direction, and extends in the positive Z-axis direction and the negative Y-axis direction to be routed to the semiconductor module 52. The control wiring 28 is bent from the position where it is attached to the heat receiving block 10 by the wiring mounting member 35 in the second array direction, specifically, at a position shifted in the negative X-axis direction, and extends in the negative Z-axis direction and the negative Y-axis direction, and is pulled through to the semiconductor module 58.

[0091] Of the control wires 24b, 25b, 27, and 28 attached to the heat receiving block 10 by the same wire attachment member 35, the connectors 65b and 68a to which the control wires 25b and 28 are attached preferably face each other in the first arrangement direction. By positioning the connectors 65b and 68a opposite each other, the control wires 25b and 28 extend in opposite directions on the XZ plane from near the positions where the control wires 25b and 28 are attached to the heat receiving block 10 by the wire attachment member 35. As a result, the wiring paths of the control wires 25b and 28 are simplified, simplifying the configuration of the electronic device 102. Furthermore, the wiring work for the control wires 25b and 28 is facilitated.

[0092] The control wires 24b and 27 extend from the position where they are attached to the heat receiving block 10 by the wire attachment member 32 toward the wire attachment member 31, and are attached to the heat receiving block 10 by the wire attachment member 31 as described above.

[0093] The wiring mounting member 36 mounts the control wirings 24b, 27 associated with the semiconductor modules 54, 57 arranged adjacent to each other in the first arrangement direction, the control wirings 25b, 28 associated with the semiconductor modules 55, 58 arranged adjacent to each other in the first arrangement direction, and the control wirings 26b, 29 associated with the semiconductor modules 56, 59 arranged adjacent to each other in the first arrangement direction together to the heat receiving block 10 in a state where they are arranged adjacent to each other.

[0094] Of the control wires 24b, 25b, 26b, 27, 28, and 29 attached to the heat receiving block 10 by the same wire attachment member 36, the control wires 26b and 29 are arranged adjacent to each other and extend from the control circuit 2 toward the wire attachment member 36. The control wires 26b and 29 branch off at a position shifted in the second arrangement direction from the center of the gaps between the semiconductor modules 56 and 59 in the first arrangement direction, extend in different directions, and are connected to the associated semiconductor modules 56 and 59. More specifically, the control wire 26b is bent from the position where it is attached to the heat receiving block 10 by the wire attachment member 36 at a position shifted in the second arrangement direction, specifically in the negative X-axis direction, and extends in the positive Z-axis and negative Y-axis directions to be routed to the semiconductor module 56. The control wiring 29 is bent from the position where it is attached to the heat receiving block 10 by the wiring mounting member 36 at a position shifted in the second array direction, specifically, in the negative X-axis direction, and extends in the negative Z-axis direction and the negative Y-axis direction, and is pulled through to the semiconductor module 59.

[0095] Of the control wires 24b, 25b, 26b, 27, 28, and 29 attached to the heat receiving block 10 by the same wire attachment member 36, the connectors 66b and 69a to which the control wires 26b and 29 are attached preferably face each other in the first arrangement direction. By positioning the connectors 66b and 69a opposite each other, the control wires 26b and 29 extend in opposite directions on the XZ plane from near the positions where the control wires 26b and 29 are attached to the heat receiving block 10 by the wire attachment member 36. As a result, the wiring paths of the control wires 26b and 29 are simplified, simplifying the configuration of the electronic device 102. Furthermore, the wiring work for the control wires 26b and 29 is facilitated.

[0096] The control wires 24b and 27 extend from the position where they are attached to the heat receiving block 10 by the wire attachment member 36 toward the wire attachment member 35, and are attached to the heat receiving block 10 by the wire attachment member 35 as described above. Thereafter, the control wires 24b and 27 extend from the position where they are attached to the heat receiving block 10 by the wire attachment member 35 toward the wire attachment member 34, and are attached to the heat receiving block 10 by the wire attachment member 34 as described above.

[0097] The control wires 25b and 28 extend from the position where they are attached to the heat receiving block 10 by the wire attachment member 36 toward the wire attachment member 35, and are attached to the heat receiving block 10 by the wire attachment member 35 as described above.

[0098] As described above, in the electronic device 102 according to the second embodiment, of the semiconductor modules 51-59, the two control wires corresponding to two semiconductor modules adjacent in the first arrangement direction are attached together by the same wire attachment member to the heat receiving block 10. With the above configuration, an increase in the number of wire attachment members is prevented, and the electronic device 101 having a simple configuration can be obtained.

[0099] Furthermore, by having connectors 61a, 64a, connectors 62a, 65a, connectors 63a, 66a, connectors 64b, 67a, connectors 65b, 68a, and connectors 66b, 69a facing each other in the first arrangement direction, the wiring paths of control wiring 21-23, 24a, 24b, 25a, 25b, 26a, 26b, 27-29 are simplified, making wiring work easier.

[0100] By inserting the control wiring 21, 22, 23, 24a, 24b, 25a, 25b, 26a, 26b, 27, 28, and 29 into the connectors 61a, 62a, 63a, 64a, 64b, 65a, 65b, 66a, 66b, 67a, 68a, and 69a, the semiconductor modules 51-59 and the control circuit 2 are connected, thereby eliminating the need to screw the control wiring 21, 22, 23, 24a, 24b, 25a, 25b, 26a, 26b, 27, 28, and 29 to the control terminals, and making the wiring work easier.

[0101] Furthermore, by reducing the difference in wiring length between the control wirings corresponding to the same phase, specifically, the control wirings 21 and 24a, the control wirings 22 and 25a, the control wirings 23 and 26a, the control wirings 24b and 27, the control wirings 25b and 28, and the control wirings 26b and 29, it is possible to suppress variations in control accuracy.

[0102] The present disclosure is not limited to the above-described embodiments. The structure and shape of the semiconductor module are not limited to the above-described examples, and any structure and shape may be used as long as it can accommodate switching elements and allow control wiring to be connected.

[0103] 7 includes semiconductor modules 71, 72, 73, 74, 75, and 76 that are arranged two-dimensionally and attached to the heat receiving block 10. The semiconductor modules 71, 72, 73, 74, 75, and 76 include casings 71a, 72a, 73a, 74a, 75a, and 76a that house the switching element SW1 and the freewheeling diode D1, and collector main terminals 71c, 72c, 73c, 74c, 75c, and 76c that are electrically connected to the collector terminal C1 of the switching element SW1 and exposed to the outside of the casings 71a, 72a, 73a, 74a, 75a, and 76a, respectively.

[0104] The semiconductor modules 71, 72, 73, 74, 75, and 76 each have an emitter main terminal 71d, 72d, 73d, 74d, 75d, and 76d that is electrically connected to the emitter terminal E1 of the switching element SW1 and exposed to the outside of the casings 71a, 72a, 73a, 74a, 75a, and 76a, and a connector 71f, 72f, 73f, 74f, 75f, and 76f that is electrically connected to the gate terminal G1 of the switching element SW1 and is provided on the outer surface of the casings 71a, 72a, 73a, 74a, 75a, and 76a, and to which the control wiring 21, 22, 23, 24, 25, and 26 are connected. The connectors 71f, 72f, 73f, 74f, 75f, and 76f have the shape of any socket into which the control wires 21, 22, 23, 24, 25, and 26 are inserted.

[0105] The substrate may be attached to the casings of the plurality of semiconductor modules and electrically connected to the switching elements of the plurality of semiconductor modules. As an example, an electronic device 102 shown in Fig. 8 includes semiconductor modules 51-59 arranged two-dimensionally and attached to a heat receiving block 10, a substrate 61 corresponding to the semiconductor modules 51-53, a substrate 62 corresponding to the semiconductor modules 54-56, and a substrate 63 corresponding to the semiconductor modules 57-59.

[0106] The substrate 61 is electrically connected to the gate terminal G1 of the switching element SW1 of the semiconductor modules 51, 52, and 53 via the control terminals 51b, 52b, and 53b, respectively. The substrate 62 is electrically connected to the gate terminals G2 and G3 of the switching elements SW2 and SW3 of the semiconductor modules 54, 55, and 56 via the control terminals 54b, 55b, and 56b, respectively. The substrate 63 is electrically connected to the gate terminal G4 of the switching element SW4 of the semiconductor modules 57, 58, and 59 via the control terminals 57b, 58b, and 59b, respectively.

[0107] The control wiring 21 has one end attached to a connector 61 a included in a substrate 61 associated with the semiconductor modules 51, 52, and 53, and connects the switching elements SW1 of the semiconductor modules 51, 52, and 53 to the control circuit 2. The control wiring 24 a has one end attached to a connector 62 a included in a substrate 62 associated with the semiconductor modules 54, 55, and 56, and connects the switching elements SW2 of the semiconductor modules 54, 55, and 56 to the control circuit 2. The control wiring 24 b has one end attached to a connector 62 b included in the substrate 62 associated with the semiconductor modules 54, 55, and 56, and connects the switching elements SW3 of the semiconductor modules 54, 55, and 56 to the control circuit 2. The control wiring 27 has one end attached to a connector 67 a included in a substrate 63 associated with the semiconductor modules 57, 58, and 59, and connects the switching elements SW4 of the semiconductor modules 57, 58, and 59 to the control circuit 2. Since control wiring only needs to be provided for each board, by associating boards with multiple semiconductor modules, the number of control wirings can be reduced, and the configuration of electronic device 102 can be simplified.

[0108] The configuration of the electronic device is not limited to the above example, and any configuration including a switching element is possible. As an example, the electronic device 103 shown in FIG. 9 is a switching regulator and includes two semiconductor modules 11, 14 arranged linearly in a first direction. The control circuit 2 is provided in the gap between the semiconductor modules 11, 14. This shortens the length of the control wiring 21, 24 running from the control circuit 2 to the semiconductor modules 11, 14, making it possible to reduce the influence of noise on the control signal as it travels from the control circuit 2 to the semiconductor modules 11, 14.

[0109] As another example, electronic device 103 shown in Figure 10 is a switching regulator and includes two semiconductor modules 51, 54 aligned linearly in a first direction. A control circuit 2 is provided at a position offset in the second direction from the gap between semiconductor modules 51, 54. Electronic device 103 includes substrates 61, 64 attached to casings 51a, 54a of semiconductor modules 51, 54, respectively. Control wiring 21, 24 are connected to control terminals 51b, 54b that are electrically connected to substrates 61, 64. In this case, control circuit 2 is preferably provided at a position where the lengths of control wiring 21, 24 routed from control circuit 2 to control terminals 51b, 54b of semiconductor modules 51, 54 can be considered to be the same.

[0110] The semiconductor modules 11-16, 51-59, and 71-76 may be arranged in contact with each other. In this case, two control wirings 21 and 24 associated with two semiconductor modules arranged adjacent to each other in the first arrangement direction, for example, the semiconductor modules 11 and 14, are separated at a position shifted in the second arrangement direction from the contact point of the semiconductor modules 11 and 14, extend in different directions, and are connected to the semiconductor modules 11 and 14. The control circuit 2 is preferably provided at a position shifted in the second direction from the semiconductor modules arranged adjacent to each other in the first direction, for example, the contact point of the semiconductor modules 11 and 14.

[0111] The orientation of the semiconductor modules 11-16, 51-59, and 71-76 is not limited to the above example and may be any orientation. For example, the semiconductor modules 51-59 may be attached to the heat receiving block 10 in an orientation rotated by 90 degrees from the state shown in FIG.

[0112] The shapes of the wiring attachment members 31-36 are not limited to the above examples, and may be any shape that allows multiple control wires to be attached to the heat receiving block together. As one example, the wiring attachment member 31 may be a rod-shaped member having through holes formed at one end through which the control wires 21, 24 are inserted, and the other end fixed to the heat receiving block 10 by any method, such as fitting, bonding with an adhesive, or fastening with a fastening member. As another example, the wiring attachment member 31 may be a rod-shaped member having through holes formed at one end through which a bundling member for fixing the control wires 21, 24 is inserted, and the other end fixed to the heat receiving block 10 by any method, such as fitting, bonding with an adhesive, or fastening with a fastening member.

[0113] The present disclosure allows various embodiments and modifications without departing from the broad spirit and scope of the present disclosure. Furthermore, the above-described embodiments are intended to illustrate the present disclosure and do not limit the scope of the present disclosure. That is, the scope of the present disclosure is defined by the claims, not the embodiments. Various modifications made within the scope of the claims and the meaning of equivalent disclosures are considered to be within the scope of the present disclosure.

[0114] 1, 3 Power conversion circuit, 1a, 1b, 3a, 3b, 3c Input terminal, 1c, 1d, 1e, 3d, 3e, 3f Output terminal, 2, 2a, 2b Control circuit, 10 Heat receiving block, 11, 12, 13, 14, 15, 16, 51, 52, 53, 54, 55, 56, 57, 58, 59, 71, 72, 73, 74, 75, 76 Semiconductor module, 11a, 12a, 13a, 14a, 15a, 16a, 51a, 52a, 53a, 54a, 55a, 56a, 57a, 58a, 59a, 71a, 72a, 73a, 74a, 75a, 76a Casing: 11b, 12b, 13b, 14b, 15b, 16b, 51b, 52b, 53b, 54b, 55b, 56b, 57b, 58b, 59b Control terminals: 11c, 12c, 13c, 14c, 15c, 16c, 51c, 52c, 53c, 54c, 55c, 56c, 57e, 58e, 59e, 71c, 72c, 73c, 74c, 75c, 76c Collector main terminals: 11d, 12d, 13d, 14d, 15d, 16d, 51e, 52e, 53e, 54d, 55d, 56d, 57d, 58d, 59d Emitter main terminals, 21, 22, 23, 24, 24a, 24b, 25, 25a, 25b, 26, 26a, 26b, 27, 28, 29; control wiring, 31, 32, 33, 34, 35, 36; wiring attachment members, 51d, 52d, 53d, 54e, 55e, 56e, 57c, 58, 59c; intermediate terminals, 61, 62, 63, 64, 65, 66, 67, 66, 68, 69; circuit boards, 61a, 62a, 63a, 64a, 64b, 65a, 65b, 66a, 66b, 67, 68, 69, 71f, 72f, 73f, 74f, 75f, 76f; connectors, 101, 102, 103 Electronic device, C1, C2, C3, C4 collector terminals, D1, D2, D3, D4 freewheeling diodes, D5, D6 clamp diodes, E1, E2, E3, E4 emitter terminals, G1, G2, G3, G4 gate terminals, SW1, SW2, SW3, SW4 switching elements.

Claims

1. A plurality of semiconductor modules attached to a heat receiving block, arranged in one dimension in a first arrangement direction, or arranged in two dimensions in a second arrangement direction perpendicular to the first arrangement direction, Each of the semiconductor modules comprises at least one control circuit for controlling at least one switching element, A plurality of control wires, each associated with a different semiconductor module, connect the associated semiconductor module to the control circuit that controls the switching elements of the semiconductor module, The device comprises at least one wiring mounting member for attaching at least two control wirings associated with at least two semiconductor modules, including two semiconductor modules arranged adjacent to each other in the first arrangement direction, to the heat receiving block, while they are all arranged adjacent to each other. Of the at least two control wires attached to the heat receiving block by the same wiring mounting member, two control wires associated with two semiconductor modules arranged adjacent to each other in the first arrangement direction extend from the control circuit toward the wiring mounting member while arranged adjacent to each other, and then separate at the center of the gap between the two associated semiconductor modules in the first arrangement direction, or at a position offset in the second arrangement direction from the center or the contact point of the two associated semiconductor modules, and extend in different directions from each other and connect to the associated semiconductor modules. The ratio of the length of one control wire to the length of the other corresponding to the same phase is 0.9 or more and 1.1 or less. electronic equipment.

2. The semiconductor module has a casing attached to the heat receiving block and housing the switching element, and control terminals electrically connected to the switching element and exposed to the outside of the casing. The control wiring connects the control terminal of the associated semiconductor module to the control circuit. The electronic device according to claim 1.

3. The semiconductor module is attached to the heat receiving block and has a casing that houses the switching element. The present invention further comprises a plurality of substrates, each attached to the casing of at least one of the semiconductor modules, and electrically connected to the switching elements of the semiconductor module having the attached casing. The control wiring connects the substrate, which is electrically connected to the switching element of the associated semiconductor module, to the control circuit. The electronic device according to claim 1.

4. The circuit board has a connector to which the control wiring is connected. The connectors of the two substrates, which are arranged adjacent to each other in the first arrangement direction and are electrically connected to the switching elements of the two semiconductor modules to which the two control wires, which are attached to the heat receiving block by the same wiring mounting member, are arranged facing each other in the first direction. The electronic device according to claim 3.

5. Two semiconductor modules, which are arranged adjacent to each other in the first direction and whose control wiring is associated with the same wiring mounting member attached to the heat receiving block, are electrically connected in series with each other. The electronic device according to any one of claims 1 to 4.

6. The plurality of semiconductor modules are arranged in two dimensions in the first and second array directions, The plurality of semiconductor modules arranged adjacent to each other in the second array direction are electrically connected in parallel to each other. The electronic device according to any one of claims 1 to 4.

7. The wiring mounting member is associated with the two control wires attached to the heat receiving block by the wiring mounting member, and is positioned between the two semiconductor modules, which are arranged adjacent to each other in the first direction, in the first direction. The electronic device according to any one of claims 1 to 4.

8. The control circuit is provided in the vicinity of the plurality of semiconductor modules, The electronic device according to any one of claims 1 to 4.

9. The control circuit is provided at a position offset in the second alignment direction from the gap between two semiconductor modules, which are arranged adjacent to each other in the first direction, or from the gap or the contact point between the two semiconductor modules, and to which two control wires attached to the heat receiving block by the same wiring mounting member are associated. The electronic device according to any one of claims 1 to 4.