Polyphenylene sulfide resin composition and molded article

Abstract

The present invention provides a polyphenylene sulfide resin composition containing a polyphenylene sulfide resin, which has a tracking resistance of 300 V or more and a thermal shock resistance of 15 or more cycles when used in a metal insert molded article. The present invention also provides a PPS resin composition and molded articles thereof that have excellent tracking resistance and thermal shock resistance.

Description

[Technical Field]

[0001] The present invention relates to a polyphenylene sulfide resin composition having excellent tracking resistance and thermal shock resistance, and a molded article thereof. [Background technology]

[0002] Polyphenylene sulfide (hereinafter sometimes abbreviated as PPS) resin is an engineering plastic that has excellent heat resistance, flame retardancy, chemical resistance, electrical insulation, moist heat resistance, mechanical strength, and dimensional stability. PPS resin can be molded into various molded products, fibers, films, etc. using various molding methods such as injection molding and extrusion molding, so it is used in a wide range of fields, including electrical and electronic components, machine parts, and automotive parts.

[0003] In recent years, as the power output of electric vehicles has increased, the amount of heat generated has tended to increase, and therefore there is an increasing need for resin compositions with excellent heat resistance, such as PPS resin.

[0004] In addition, electric vehicles are equipped with many resin molded parts that are made with metal insert molding, such as bus bars, current sensors, and power modules, and there is a demand for resin compositions with excellent resistance to cold and thermal shock that will prevent cracking of the metal insert molded parts even when the temperature in the operating environment changes.

[0005] On the other hand, PPS resin is inferior to other engineering plastics such as polyamide resin and polyester resin in terms of tracking breakdown that occurs when a high voltage is applied to the surface of an insulator.

[0006] Therefore, despite PPS resin's excellent heat resistance, flame retardancy, chemical resistance, electrical insulation, moist heat resistance, mechanical strength, and dimensional stability, its use is limited in environments where it is exposed to relatively high voltages. In recent years, rated voltages have tended to rise in response to the increasing power output and rapid charging of electric vehicles. Furthermore, in order to reduce the size and weight of components, there is an increasing need to ensure that creepage distances of components are greater than the required creepage distance specified in IEC 60664. These factors have created a demand for PPS resin with excellent tracking resistance.

[0007] Attempts have been made to improve the tracking resistance of PPS resins. For example, Patent Document 1 describes improving tracking resistance by adding magnesium hydroxide and an ethylene-vinyl alcohol copolymer to PPS resin. Patent Document 2 describes stabilizing the productivity of PPS resins with excellent tracking resistance by adding magnesium hydroxide, which has a high apparent specific gravity, to PPS resin. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-145006 [Patent Document 2] International Publication No. 2015 / 137228 Summary of the Invention [Problem to be solved by the invention]

[0009] However, although the resin composition described in Patent Document 1 has improved tracking resistance by incorporating a large amount of magnesium hydroxide and an ethylene-vinyl alcohol copolymer, there is no specific description of thermal shock resistance. Furthermore, the composition specifically shown in the examples incorporates a large amount of magnesium hydroxide, which has a small particle size and a small standard deviation of the particle size distribution, and therefore is thought to have insufficient thermal shock resistance.

[0010] The resin composition described in Patent Document 2 has improved tracking resistance due to the incorporation of a large amount of magnesium hydroxide, but there is no specific description of thermal shock resistance. Furthermore, the resin composition specifically shown in the examples is considered to have insufficient thermal shock resistance because it does not incorporate modified cross-section glass or an elastomer.

[0011] In view of the above, an object of the present invention is to provide a PPS resin composition that provides a molded article with high safety when used in a member to which high voltage is applied and that does not cause cracking even when used in a location where the ambient temperature changes from high to low. The present invention also provides a molded article made of the PPS resin composition. [Means for solving the problem]

[0012] In order to solve the above problems, the present invention has the following configuration: (1) A polyphenylene sulfide resin composition containing a polyphenylene sulfide resin, the polyphenylene sulfide resin composition having a tracking resistance of 300 V or more and a thermal shock resistance of 15 times or more when used in a metal insert molding. (2) The polyphenylene sulfide resin composition according to (1), which is obtained by blending 20 parts by weight or more and 170 parts by weight or less of a non-fibrous inorganic filler (B) with 100 parts by weight of a polyphenylene sulfide resin (A), wherein the standard deviation of the particle size distribution of the non-fibrous inorganic filler (B) is 0.22 or more and 10.00 or less. (3) The polyphenylene sulfide resin composition according to (1) or (2), wherein the non-fibrous inorganic filler (B) is a decomposition endothermic filler. (4) The polyphenylene sulfide resin composition according to any one of (1) to (3), wherein (E) a silicone compound is blended in an amount of 0.1 to 20 parts by weight per 100 parts by weight of the polyphenylene sulfide resin (A). (5) A polyphenylene sulfide resin composition obtained by blending 20 to 170 parts by weight of a non-fibrous inorganic filler (B) with 100 parts by weight of a polyphenylene sulfide resin (A), wherein the standard deviation of the particle size distribution of the non-fibrous inorganic filler (B) is 0.22 to 10.00, and the non-fibrous inorganic filler (B) is a decomposition endothermic filler; and wherein the polyphenylene sulfide resin composition is obtained by blending 0.1 to 20 parts by weight of a silicone compound (E) with 100 parts by weight of the polyphenylene sulfide resin (A). (6) The polyphenylene sulfide resin composition according to any one of (2) to (5), wherein the average particle size of the non-fibrous inorganic filler (B) is 1.0 μm or more and 50.0 μm or less. (7) The polyphenylene sulfide resin composition according to any one of (1) to (6), wherein the 10% D of the non-fibrous inorganic filler (B) is 0.1 μm or more and 1.2 μm or less. (8) The polyphenylene sulfide resin composition according to any one of (1) to (7), wherein (C) a fibrous inorganic filler is blended in an amount of 40 parts by weight or more and 190 parts by weight or less per 100 parts by weight of (A) the polyphenylene sulfide resin. (9) The polyphenylene sulfide resin composition according to any one of (1) to (8), wherein the (C) fibrous inorganic filler is a modified cross section glass fiber. (10) The polyphenylene sulfide resin composition according to any one of (1) to (9), wherein (D) elastomer is blended in an amount of 1 part by weight or more and 40 parts by weight or less per 100 parts by weight of (A) polyphenylene sulfide resin. (11) A molded article made of the polyphenylene sulfide resin composition according to any one of (1) to (10). (12) A metal insert molding comprising the molding according to (11). (13) An in-vehicle electrical component comprising the molded product according to (11). (14) An eAxle comprising the molded article described in (11). (15) An xEV comprising the molded article described in (11). [Effects of the Invention]

[0013] The PPS resin composition of the present invention improves the safety of molded articles when used in components to which high voltage is applied. Furthermore, it is possible to ensure that the creepage distance of the molded article is greater than the required creepage distance specified in IEC 60664. Therefore, molded articles made from the PPS resin composition of the present invention have greater design freedom, making it easier to achieve smaller and lighter molded articles. Furthermore, metal insert molded articles made from the PPS resin composition of the present invention do not crack even when used in locations where the environmental temperature fluctuates, making them suitable for use in metal insert molded articles with a variety of complex shapes.

[0014] The molded article of the present invention can be suitably used for in-vehicle electrical components such as current sensors and bus bars, and electric and electronic components such as power semiconductor housings. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic diagram of a molded product used in evaluating thermal shock resistance. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described in detail.

[0017] (A)PPS resin The PPS resin used in the embodiment of the present invention is a polymer having a repeating unit represented by the following structural formula.

[0018] [ka]

[0019] From the viewpoint of heat resistance, the PPS resin is preferably a polymer containing 70 mol % or more, and more preferably 90 mol % or more, of the repeating units represented by the above structural formula. Furthermore, the PPS resin may be composed of repeating units having a structure selected from the following structures, with less than 30 mol % of the repeating units being approximately equal to or less than 30 mol %.

[0020] [ka]

[0021] A PPS copolymer partially containing such a structure has a low melting point, and therefore such a PPS copolymer is advantageous in terms of moldability.

[0022] When the entire PPS resin composition is taken as 100% by weight, the content of (A) PPS resin is preferably 10% by weight or more and 50% by weight or less. The lower limit of the content is more preferably 20% by weight or more, and even more preferably 25% by weight or more. The upper limit of the content is more preferably 40% by weight or less, and even more preferably 35% by weight or less. By making the content of (A) PPS resin 10% by weight or more, the proportion of the main resin component that provides strength in the PPS resin composition increases, making it possible to achieve a weld tensile strength of 30 MPa or more in the PPS resin composition. By making the content of (A) PPS resin 50% by weight or less, the concentration of the easily carbonized PPS resin is diluted in the entire PPS resin composition, making it possible to achieve a tracking resistance of 300 V or more in the PPS resin composition.

[0023] A method for producing the PPS resin used in the embodiment of the present invention will be described below, but the method is not limited to the following method as long as the PPS resin having the above structure can be obtained.

[0024] First, the polyhalogenated aromatic compound, sulfidizing agent, polymerization solvent, molecular weight regulator, polymerization aid and polymerization stabilizer used in the production method will be described.

[0025] [Polyhalogenated aromatic compounds] A polyhalogenated aromatic compound refers to a compound having two or more halogen atoms per molecule. Specific examples include p-dichlorobenzene, m-dichlorobenzene, o-dichlorobenzene, 1,3,5-trichlorobenzene, 1,2,4-trichlorobenzene, 1,2,4,5-tetrachlorobenzene, hexachlorobenzene, 2,5-dichlorotoluene, 2,5-dichloro-p-xylene, 1,4-dibromobenzene, 1,4-diiodobenzene, and 1-methoxy-2,5-dichlorobenzene. Preferably, p-dichlorobenzene is used. While it is possible to combine two or more different polyhalogenated aromatic compounds to form a copolymer, it is preferable to use a p-dihalogenated aromatic compound as the main component.

[0026] The amount of the polyhalogenated aromatic compound used in the production process is preferably 0.9 mol or more, more preferably 0.95 mol or more, and even more preferably 1.005 mol or more per mol of the sulfidizing agent, from the viewpoint of obtaining a PPS resin with a viscosity suitable for processing. The upper limit is preferably 2.0 mol or less, more preferably 1.5 mol or less, and even more preferably 1.2 mol or less per mol of the sulfidizing agent.

[0027] [Sulfidizing agent] The sulfidizing agent includes alkali metal sulfides, alkali metal hydrosulfides, and hydrogen sulfide.

[0028] Specific examples of alkali metal sulfides include lithium sulfide, sodium sulfide, potassium sulfide, rubidium sulfide, cesium sulfide, and mixtures of two or more of these, with sodium sulfide being preferred. These alkali metal sulfides can be used as hydrates, aqueous mixtures, or anhydrous forms.

[0029] Specific examples of alkali metal hydrosulfides include sodium hydrosulfide, potassium hydrosulfide, lithium hydrosulfide, rubidium hydrosulfide, cesium hydrosulfide, and mixtures of two or more of these, with sodium hydrosulfide being preferred. These alkali metal hydrosulfides can be used as hydrates, aqueous mixtures, or anhydrous forms.

[0030] Alternatively, an alkali metal sulfide prepared in situ in the reaction system from an alkali metal hydrosulfide and an alkali metal hydroxide can be used.Also, an alkali metal sulfide can be prepared from an alkali metal hydrosulfide and an alkali metal hydroxide and then transferred to a polymerization vessel for use.

[0031] Alternatively, an alkali metal sulfide prepared in situ in the reaction system from an alkali metal hydroxide such as lithium hydroxide or sodium hydroxide and hydrogen sulfide can be used.Also, an alkali metal sulfide can be prepared from an alkali metal hydroxide such as lithium hydroxide or sodium hydroxide and hydrogen sulfide, and then transferred to a polymerization vessel for use.

[0032] In this specification, the amount of the sulfidizing agent "charged" means the remaining amount obtained by subtracting a partial loss of the sulfidizing agent from the actual charged amount of the sulfidizing agent when the loss occurs before the start of the polymerization reaction due to a dehydration operation or the like.

[0033] It is also possible to use an alkali metal hydroxide and / or an alkaline earth metal hydroxide together with the sulfidizing agent. Specific examples of alkali metal hydroxides include sodium hydroxide, potassium hydroxide, lithium hydroxide, rubidium hydroxide, cesium hydroxide, and mixtures of two or more of these. Specific examples of alkaline earth metal hydroxides include calcium hydroxide, strontium hydroxide, barium hydroxide, etc. Among these, sodium hydroxide is preferably used.

[0034] When an alkali metal hydrosulfide is used as the sulfidizing agent, it is particularly preferable to use an alkali metal hydroxide simultaneously. The lower limit of the amount of alkali metal hydroxide used is preferably 0.95 mol or more per mol of alkali metal hydrosulfide, more preferably 1.00 mol or more, and even more preferably 1.005 mol or more. The upper limit is preferably 1.2 mol or less per mol of alkali metal hydrosulfide, more preferably 1.15 mol or less, and even more preferably 1.100 mol or less.

[0035] [Polymerization solvent] As the polymerization solvent, an organic polar solvent is preferably used. Specific examples include N-alkylpyrrolidones such as N-methyl-2-pyrrolidone and N-ethyl-2-pyrrolidone; caprolactams such as N-methyl-ε-caprolactam; aprotic organic solvents such as 1,3-dimethyl-2-imidazolidinone, N,N-dimethylacetamide, N,N-dimethylformamide, hexamethylphosphoric triamide, dimethyl sulfone, and tetramethylene sulfoxide; and mixtures thereof. These polymerization solvents are preferably used because of their high reaction stability. Among these, N-methyl-2-pyrrolidone (hereinafter sometimes abbreviated as "NMP") is particularly preferred.

[0036] The amount of the organic polar solvent used in the production step is preferably 2.0 mol or more, more preferably 2.25 mol or more, and even more preferably 2.5 mol or more, relative to 1 mol of the sulfidizing agent, as a lower limit, and is preferably 10 mol or less, more preferably 6.0 mol or less, and even more preferably 5.5 mol or less, relative to 1 mol of the sulfidizing agent, as an upper limit.

[0037] [Molecular weight regulator] A monohalogen compound (which does not necessarily have to be an aromatic compound) can be used in combination with the polyhalogenated aromatic compound for purposes such as forming terminals in the resulting PPS resin or adjusting the polymerization reaction or molecular weight.

[0038] [Polymerization aid] To obtain a PPS resin with a relatively high degree of polymerization in a shorter time, the use of a polymerization aid is also a preferred embodiment. Here, "polymerization aid" refers to a substance that has the effect of increasing the viscosity of the resulting PPS resin. Specific examples of such polymerization aids include organic carboxylates, water, alkali metal chlorides, organic sulfonates, alkali metal sulfates, alkaline earth metal oxides, alkali metal phosphates, and alkaline earth metal phosphates. These can be used alone or in combination of two or more. Among these, compounds selected from organic carboxylates, water, and alkali metal chlorides are preferred. Alkali metal carboxylates are preferred as organic carboxylates, and lithium chloride is preferred as alkali metal chlorides.

[0039] The alkali metal carboxylate is represented by the general formula R(COOM) n (wherein R is an alkyl group, cycloalkyl group, aryl group, alkylaryl group, or arylalkyl group having 1 to 20 carbon atoms; M is an alkali metal selected from lithium, sodium, potassium, rubidium, and cesium; and n is an integer of 1 to 3.) The alkali metal carboxylate can also be used as a hydrate, anhydrous form, or aqueous solution. Specific examples of the alkali metal carboxylate include lithium acetate, sodium acetate, potassium acetate, sodium propionate, lithium valerate, sodium benzoate, sodium phenylacetate, potassium p-toluate, and mixtures thereof.

[0040] Alkali metal carboxylates may be formed by adding and reacting an organic acid with one or more compounds selected from the group consisting of alkali metal hydroxides, alkali metal carbonates, and alkali metal bicarbonates in approximately equal chemical equivalents. Among the alkali metal carboxylates, lithium salts are highly soluble in the reaction system and have a significant auxiliary effect, but are expensive. On the other hand, potassium salts, rubidium salts, and cesium salts appear to have insufficient solubility in the reaction system. For this reason, sodium acetate, which is inexpensive and has adequate solubility in the polymerization system, is most preferably used.

[0041] When these alkali metal carboxylates are used as polymerization aids, the lower limit of the amount used is preferably 0.01 mol or more relative to 1 mol of the alkali metal sulfide charged, more preferably 0.1 mol or more and even more preferably 0.2 mol or more in order to obtain a higher degree of polymerization, and the upper limit of the amount used is preferably 2 mol or less relative to 1 mol of the alkali metal sulfide charged, more preferably 0.6 mol or less and even more preferably 0.5 mol or less in order to obtain a higher degree of polymerization.

[0042] When water is used as a polymerization aid, the lower limit of the amount added is preferably 0.3 mol or more relative to 1 mol of the alkali metal sulfide charged, more preferably 0.6 mol or more in order to obtain a higher degree of polymerization, and even more preferably 1 mol or more. The upper limit of the amount added is preferably 15 mol or less relative to 1 mol of the alkali metal sulfide charged, and more preferably 10 mol or less in order to obtain a higher degree of polymerization, and even more preferably 5 mol or less.

[0043] It is of course possible to use two or more of these polymerization aids in combination. For example, when an alkali metal carboxylate and water are used in combination, it is possible to increase the molecular weight of the PPS resin with smaller amounts of the alkali metal carboxylate and water.

[0044] The timing of addition of these polymerization aids is not particularly specified, and they may be added at any time during the pre-step, at the start of polymerization, or during the polymerization, as described below, or may be added in multiple batches. When an alkali metal carboxylate is used as the polymerization aid, it is more preferable to add it simultaneously with other additives at the start of the pre-step or at the start of polymerization, from the viewpoint of ease of addition. Furthermore, when water is used as the polymerization aid, it is effective to add it during the polymerization reaction after charging the polyhalogenated aromatic compound.

[0045] [Polymerization stabilizer] Polymerization stabilizers can be used to stabilize the polymerization reaction system and prevent side reactions. Polymerization stabilizers contribute to stabilizing the polymerization reaction system and suppress undesirable side reactions. One indicator of side reactions is the formation of thiophenol. The addition of a polymerization stabilizer can suppress the formation of thiophenol. Specific examples of polymerization stabilizers include compounds such as alkali metal hydroxides, alkali metal carbonates, alkaline earth metal hydroxides, and alkaline earth metal carbonates. Among these, alkali metal hydroxides such as sodium hydroxide, potassium hydroxide, and lithium hydroxide are preferred. The aforementioned alkali metal carboxylates also function as polymerization stabilizers and are therefore classified as polymerization stabilizers. Furthermore, when using an alkali metal hydrosulfide as a sulfidizing agent, it is particularly preferable to use an alkali metal hydroxide simultaneously. However, an excess amount of alkali metal hydroxide relative to the sulfidizing agent can also function as a polymerization stabilizer.

[0046] These polymerization stabilizers can be used alone or in combination of two or more. The lower limit of the polymerization stabilizer is preferably 0.02 mol or more, more preferably 0.03 mol or more, and even more preferably 0.04 mol or more, per mol of the charged alkali metal sulfide. The upper limit is preferably 0.2 mol or less, more preferably 0.1 mol or less, and even more preferably 0.09 mol or less, per mol of the charged alkali metal sulfide. If this ratio is too low, the stabilizing effect will be insufficient, and conversely, if it is too high, it will be economically disadvantageous and the polymer yield will tend to decrease.

[0047] The timing of adding the polymerization stabilizer is not particularly specified, and it may be added at any time during the pre-step described below, at the start of polymerization, or during polymerization, or may be added in multiple divided portions, but it is more preferable to add it simultaneously at the start of the pre-step or at the start of polymerization from the viewpoint of ease.

[0048] Next, a preferred method for producing the PPS resin used in the embodiment of the present invention will be specifically described in order, including a pre-process, a polymerization reaction process, a recovery process, and a post-treatment process, but the present invention is not limited to this method.

[0049] [Pre-process] In the production process for PPS resin, the sulfidizing agent is usually used in the form of a hydrate, but it is preferable to heat the mixture containing the organic polar solvent and the sulfidizing agent and remove excess water from the system before adding the polyhalogenated aromatic compound. This step is called the pre-step.

[0050] As mentioned above, sulfidizing agents prepared in situ in the reaction system or in a separate vessel from the polymerization vessel can also be used. While there are no particular limitations on this method, a preferred method involves adding an alkali metal hydrosulfide and an alkali metal hydroxide to an organic polar solvent in an inert gas atmosphere at room temperature to 150°C, preferably room temperature to 100°C, and then heating the mixture to at least 150°C or higher, preferably 180 to 260°C, under atmospheric or reduced pressure, to distill off water. A polymerization aid may also be added at this stage. To promote the distillation of water, the reaction may be carried out with the addition of toluene or the like.

[0051] In the polymerization reaction, the amount of water in the polymerization system is preferably 0.3 to 10.0 mol per 1 mol of the charged sulfidizing agent. Here, the "amount of water in the polymerization system" refers to the amount of water charged to the polymerization system minus the amount of water removed from the polymerization system. The charged water may be in any form, such as water, an aqueous solution, or water of crystallization.

[0052] [Polymerization reaction process] PPS resin is produced by reacting a sulfidizing agent with a polyhalogenated aromatic compound in an organic polar solvent at a temperature range of 200°C to less than 290°C. This process is called the polymerization reaction process.

[0053] When starting the polymerization reaction process, the organic polar solvent, sulfidizing agent, and polyhalogenated aromatic compound are mixed, preferably in an inert gas atmosphere, at a temperature not lower than room temperature, preferably not lower than 100°C, and not higher than 240°C, preferably not higher than 230°C. A polymerization aid may be added at this stage. These raw materials may be charged in any order, or simultaneously.

[0054] The mixture is typically heated to a temperature in the range of 200°C to 290°C. There are no particular limitations on the rate of temperature increase, but the lower limit is preferably 0.01°C / min or more, and more preferably 0.1°C / min or more. The upper limit of the rate of temperature increase is preferably 5°C / min or less, and more preferably 3°C / min or less.

[0055] Generally, the temperature is finally raised to 250 to 290°C, and the reaction is carried out at that temperature for a time period of 0.25 hours or more, preferably 0.5 hours or more, and 50 hours or less, preferably 20 hours or less.

[0056] Before reaching the final temperature, a method of reacting for a certain period of time at, for example, 200 to 260°C and then raising the temperature to 270 to 290°C is effective in obtaining a higher degree of polymerization. In this case, the reaction time at 200 to 260°C is usually preferably in the range of 0.25 to 20 hours, more preferably 0.25 to 10 hours.

[0057] In order to obtain a polymer with a higher degree of polymerization, it may be effective to carry out the polymerization in multiple stages. When carrying out the polymerization in multiple stages, it is effective when the conversion of the polyhalogenated aromatic compound in the system at 245°C reaches preferably 40 mol% or more, more preferably 60 mol%.

[0058] The conversion rate of polyhalogenated aromatic compounds (abbreviated as "PHA" herein) is a value calculated by the following formula: The amount of remaining PHA can usually be determined by gas chromatography.

[0059] (A) When polyhalogenated aromatic compounds are added in excess of alkali metal sulfides in terms of molar ratio Conversion rate = [PHA charge amount (mol) - PHA remaining amount (mol)] / [PHA charge amount (mol) - PHA excess amount (mol)] (B) Cases other than (A) above Conversion rate = [amount of PHA charged (mol) - amount of remaining PHA (mol)] / [amount of PHA charged (mol)].

[0060] [Recovery process] In the method for producing a PPS resin, after polymerization is completed, solid matter is recovered from the polymerization reaction product containing the polymer, solvent, etc. This step is called the recovery step. Any known recovery method may be used.

[0061] For example, after the polymerization reaction is completed, the polymer may be slowly cooled and recovered in particulate form. The cooling rate is not particularly limited, but is preferably about 0.1°C / min to 3°C / min. It is not necessary to cool at the same rate throughout the entire cooling process; for example, a method may be used in which the polymer particles are cooled at a rate of 0.1 to 1°C / min until they crystallize and precipitate, and then slowly cooled at a rate of 1°C / min or more.

[0062] Another preferred method is to carry out the above recovery under rapid cooling conditions. Among these recovery methods, a flash method is a preferred method. The "flash method" is a method in which the polymerization reaction product is subjected to high temperature and high pressure (usually 250°C or higher, 8 kg / cm 2This method involves flashing the polymer from the above-mentioned state into an atmosphere under normal pressure or reduced pressure, recovering the solvent and simultaneously recovering the polymer in powder form. Here, "flashing" means ejecting the polymerization reaction product from a nozzle. Specific examples of the flashing atmosphere include nitrogen or water vapor at normal pressure, and the temperature is preferably in the range of 150°C to 250°C.

[0063] [Post-processing process] After being produced through the above-mentioned polymerization and recovery steps, the PPS resin may be subjected to acid treatment, hot water treatment, or washing with an organic solvent. This step is called a post-treatment step.

[0064] The acid treatment is carried out as follows: The acid used in the acid treatment of the PPS resin is not particularly limited as long as it does not have the effect of decomposing the PPS resin, and examples thereof include acetic acid, hydrochloric acid, sulfuric acid, phosphoric acid, silicic acid, carbonic acid, and propylic acid. Of these, an acid selected from acetic acid and hydrochloric acid is more preferably used.

[0065] The acid treatment can be carried out, for example, by immersing the PPS resin in an acid or an aqueous solution of an acid, with stirring or heating as necessary. For example, when acetic acid is used, a sufficient effect can be obtained by immersing the PPS resin powder in an aqueous solution of acetic acid at pH 4 heated to 80 to 200°C and stirring for 30 minutes.

[0066] Hot water treatment is carried out as follows: When treating the PPS resin with hot water, the temperature of the hot water is preferably 100° C. or higher, more preferably 120° C. or higher, even more preferably 150° C. or higher, and particularly preferably 170° C. or higher. Temperatures below 100° C. are not preferred because the desired chemical modification effect of the PPS resin is small.

[0067] In addition, to avoid undesirable decomposition of the terminal groups, it is desirable to carry out the treatment in an inert atmosphere. Furthermore, to remove any remaining components, it is preferable to wash the PPS resin after this hot water treatment operation with warm water several times.

[0068] Washing with an organic solvent is as follows: There are no particular restrictions on the organic solvent used to wash the PPS resin, as long as it does not have the effect of decomposing the PPS resin. Examples of organic solvents that can be used to wash PPS resin include nitrogen-containing polar solvents such as N-methyl-2-pyrrolidone, dimethylformamide, dimethylacetamide, 1,3-dimethylimidazolidinone, hexamethylphosphoramide, and piperazinones; sulfoxide and sulfone solvents such as dimethyl sulfoxide, dimethyl sulfone, and sulfolane; ketone solvents such as acetone, methyl ethyl ketone, diethyl ketone, and acetophenone; ether solvents such as dimethyl ether, dipropyl ether, dioxane, and tetrahydrofuran; halogenated solvents such as chloroform, methylene chloride, trichloroethylene, ethylene dichloride, perchloroethylene, monochloroethane, dichloroethane, tetrachloroethane, perchloroethane, and chlorobenzene; alcoholic or phenolic solvents such as methanol, ethanol, propanol, butanol, pentanol, ethylene glycol, propylene glycol, phenol, cresol, polyethylene glycol, and polypropylene glycol; and aromatic hydrocarbon solvents such as benzene, toluene, and xylene. Among these organic solvents, it is particularly preferable to use N-methyl-2-pyrrolidone, acetone, dimethylformamide, chloroform, etc. These organic solvents may be used alone or in combination of two or more.

[0069] One method for washing with an organic solvent is to immerse the PPS resin in the organic solvent, and if necessary, stirring or heating can be performed. There are no particular restrictions on the washing temperature when washing the PPS resin with an organic solvent, and any temperature between room temperature and about 300°C can be selected. The higher the washing temperature, the more effective the washing tends to be, but a washing temperature between room temperature and 150°C is usually sufficient. Washing can also be performed under pressure in a pressure vessel at a temperature above the boiling point of the organic solvent.

[0070] As the post-treatment step, any one of acid treatment, hot water treatment, and washing with an organic solvent is preferably carried out, and it is preferable to use two or more of these treatments in combination from the viewpoint of removing impurities.

[0071] In an embodiment of the present invention, a PPS resin into which an alkali metal or an alkaline earth metal such as Ca has been introduced may be used. Methods for introducing the alkali metal and / or alkaline earth metal include adding an alkali metal salt and / or alkaline earth metal salt before, during, or after the pre-processing step, adding an alkali metal salt and / or alkaline earth metal salt to the polymerization vessel before, during, or after the polymerization step, and adding an alkali metal salt and / or alkaline earth metal salt at the beginning, middle, or end of the washing step.

[0072] After polymerization, the PPS resin can be used after being made into a high molecular weight resin by a thermal oxidation crosslinking treatment, such as heating in an oxygen atmosphere or heating with the addition of a crosslinking agent such as peroxide.

[0073] When dry heat treatment is performed for the purpose of increasing the molecular weight by thermal oxidation crosslinking, the lower limit of the temperature is preferably 160°C or higher, and more preferably 170°C or higher. The upper limit of the temperature is preferably 260°C or lower, and more preferably 250°C or lower. The oxygen concentration is preferably 5% by volume or higher, and more preferably 8% by volume or higher. There is no particular limit to the upper limit of the oxygen concentration, but the limit is approximately 50% by volume. The lower limit of the treatment time is preferably 0.5 hours or higher, more preferably 1 hour or higher, and even more preferably 2 hours or higher. The upper limit of the treatment time is preferably 100 hours or lower, more preferably 50 hours or lower, and even more preferably 25 hours or lower.

[0074] Dry heat treatment can also be performed to suppress thermal oxidative crosslinking and remove volatiles. The temperature is preferably in the range of 130 to 250°C, more preferably 160 to 250°C. In this case, the oxygen concentration is preferably less than 5% by volume, and more preferably less than 3% by volume. The lower limit of the treatment time is preferably 0.5 hours or more, more preferably 1 hour or more. The upper limit of the treatment time is preferably 50 hours or less, more preferably 20 hours or less, and even more preferably 10 hours or less.

[0075] The heating device may be a conventional hot air dryer or a rotary or stirring blade-equipped heating device, although it is more preferable to use a rotary or stirring blade-equipped heating device for efficient and more uniform treatment.

[0076] From the viewpoint of improving fluidity and toughness during molding, the PPS resin preferably has a melt flow rate (MFR) of 80 g / 10 min or more and 6100 g / 10 min or less, as measured at a temperature of 315.5°C under a load of 5000 g according to a method conforming to ASTM-D1238-70. Multiple types of PPS resins with different MFRs may also be used in combination.

[0077] (B) Non-fibrous inorganic filler The PPS resin composition of the present invention preferably contains (B) a non-fibrous inorganic filler.

[0078] The non-fibrous inorganic filler (B) incorporated into the PPS resin composition of the present invention preferably has a standard deviation of particle size distribution of 0.22 to 10.00, more preferably 0.23 to 9.50, and even more preferably 0.24 to 9.00. The "standard deviation of particle size distribution" here refers to the standard deviation defined on a logarithmic scale based on the results of particle size distribution measurement using a laser diffraction / scattering method. When the standard deviation of the particle size distribution of the non-fibrous inorganic filler is 0.22 or greater, the tracking resistance of the PPS resin composition can be 300 V or greater, even if the average particle size of the non-fibrous inorganic filler is large. Furthermore, when the average particle size of the non-fibrous inorganic filler is small, the PPS resin composition can be used to achieve thermal shock resistance of 15 or greater using a metal insert molded product. While the reason why a PPS resin composition exhibits favorable properties when the standard deviation of the particle size distribution of the non-fibrous inorganic filler is within the above range is unclear, the following is speculated. Non-fibrous inorganic fillers with small particle sizes have a large specific surface area, which significantly improves tracking resistance. On the other hand, non-fibrous inorganic fillers with large particle sizes are thought to be more effective in utilizing the toughness of the resin itself, since the distance between non-fibrous inorganic fillers in the resin composition increases. It is speculated that when the standard deviation of the particle size distribution is within the above range, the effects exhibited when the particle size of the non-fibrous inorganic filler is small and the effects exhibited when the particle size of the non-fibrous inorganic filler is large are synergistically exhibited. It is preferable that the standard deviation of the particle size distribution of the non-fibrous inorganic filler is 10.00 or less, since this prevents problems caused by cracking or chipping of coarse non-fibrous inorganic fillers. Tracking resistance and thermal shock resistance will be discussed later.

[0079] The average particle diameter of the (B) non-fibrous inorganic filler is preferably 1.0 μm or more and 50.0 μm or less. The lower limit of the average particle diameter is more preferably 1.1 μm or more, and even more preferably 1.2 μm or more. The upper limit of the average particle diameter is more preferably 45.0 μm or less, and even more preferably 40.0 μm or less. When the average particle diameter of the non-fibrous inorganic filler is 1.0 μm or more, the thermal shock resistance of a metal insert molded product of the PPS resin composition can be increased to 15 or more cycles. While the reason for the high thermal shock resistance achieved within this range is unclear, it is believed that this range is due to the increased distance between non-fibrous inorganic fillers in the resin composition, which effectively utilizes the toughness of the resin itself. When the average particle diameter of the non-fibrous inorganic filler is 50.0 μm or less, the tracking resistance of the PPS resin composition can be increased to 300 V or more. Note that the average particle diameter referred to here is the volume-average particle diameter obtained from particle size distribution measurement using a laser diffraction / scattering method.

[0080] The 10% D of the (B) non-fibrous inorganic filler is preferably 0.1 μm or more and 1.2 μm or less. The lower limit of 10% D is more preferably 0.2 μm or more, and even more preferably 0.3 μm or more. The upper limit of 10% D is more preferably 1.1 μm or less, and even more preferably 1.0 μm or less. Note that 10% D here indicates that, in particle size distribution measurement by laser diffraction / scattering, 10 volume % of the particle size distribution population has a particle diameter smaller than this value. When the 10% D of the non-fibrous inorganic filler is 0.1 μm or more, the thermal shock resistance of a metal insert molded product of the PPS resin composition can be increased to 15 or more cycles. When the 10% D of the non-fibrous inorganic filler is 1.2 μm or less, the tracking resistance of the PPS resin composition can be increased to 300 V or more. The reason why high thermal shock resistance is exhibited in the PPS resin composition when 10%D of the (B) non-fibrous inorganic filler is in the above range is not clear, but it is presumed that this range results in the presence of a certain amount of non-fibrous inorganic filler, which has a small particle size and a large surface area and is therefore highly effective in improving tracking resistance, and therefore the tracking resistance-improving effect is significant.

[0081] Although one type of (B) non-fibrous inorganic filler may be used, it is preferable to use two or more types in combination, as this makes it easier to adjust the standard deviation of the particle size distribution, the average particle diameter, and 10% D within appropriate ranges. When two types of non-fibrous inorganic fillers are mixed, a non-fibrous inorganic filler having an average particle diameter of less than 2 μm and a non-fibrous inorganic filler having an average particle diameter of 2 μm or more are preferably mixed in a weight ratio of 1:10 to 10:1, more preferably 1:9 to 9:1.

[0082] The PPS resin composition of the present invention preferably contains 20 to 170 parts by weight of (B) non-fibrous inorganic filler per 100 parts by weight of (A) PPS resin. The content of (B) non-fibrous inorganic filler is more preferably 40 parts by weight or more, more preferably 50 parts by weight or more, more preferably 60 parts by weight or more, and even more preferably 70 parts by weight or more. When the amount of non-fibrous inorganic filler is 20 parts by weight or more, the tracking resistance of the PPS resin composition can be 300 V or more. When the amount of non-fibrous inorganic filler is 170 parts by weight or less, the thermal shock resistance of a metal insert molded product of the PPS resin composition can be 15 cycles or more.

[0083] Specific examples of (B) non-fibrous inorganic fillers include fullerenes; silicates such as talc, wollastonite, zeolite, sericite, mica, kaolin, clay, pyrophyllite, bentonite, asbestos, and alumina silicate; metal oxides such as silicon oxide, magnesium oxide, alumina, zirconium oxide, titanium oxide, and iron oxide; metal hydroxides such as magnesium hydroxide, aluminum hydroxide, and calcium hydroxide; carbonates such as calcium carbonate, magnesium carbonate, and dolomite; sulfates such as calcium sulfate and barium sulfate; glass beads, glass flakes, glass powder, ceramic beads, boron nitride, silicon carbide, carbon black, silica, and graphite. From the viewpoint of the tracking resistance of the PPS resin composition, endothermic fillers that undergo an endothermic reaction upon decomposition, such as magnesium hydroxide, magnesium carbonate, aluminum hydroxide, and calcium borate, and highly thermally conductive fillers are particularly preferred, as they can suppress heat generation in the PPS resin composition and make it less susceptible to tracking.

[0084] It is also preferable to use a non-fibrous inorganic filler after surface treatment. Examples of compounds used for the surface treatment include vinylsilane compounds such as vinyltriethoxysilane and vinyltrichlorosilane; epoxysilane compounds such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; aminosilane compounds such as γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane; γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropyltrimethoxysilane, and γ-isocyanatopropylmethyldimethoxysilane; Examples of suitable alkoxysilane compounds include isocyanato groups, such as methoxysilane, γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropylethyldimethoxysilane, γ-isocyanatopropylethyldiethoxysilane, and γ-isocyanatopropyltrichlorosilane; methacryloxysilane compounds, such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, and 3-methacryloxypropyltriethoxysilane; and long-chain fatty acids or long-chain aliphatic alcohols, such as stearic acid, oleic acid, montanic acid, and stearyl alcohol. In particular, the use of a non-fibrous inorganic filler that has been surface-treated with a compound selected from vinylsilane compounds, epoxysilane compounds, aminosilane compounds, isocyanatosilane compounds, and methacryloxysilane compounds is advantageous in terms of suppressing aggregation in the composition or molded product, in terms of tracking resistance since the non-fibrous inorganic filler is well dispersed and its surface area is increased, and in terms of mechanical strength since the interfacial strength between the non-fibrous inorganic filler and the resin is increased.

[0085] (C) Fibrous inorganic filler The PPS resin composition of the present invention preferably contains (C) a fibrous inorganic filler.

[0086] The PPS resin composition of the present invention preferably contains 40 to 190 parts by weight, more preferably 60 to 190 parts by weight, of (C) fibrous inorganic filler per 100 parts by weight of (A) PPS resin. When the amount of fibrous inorganic filler is 40 parts by weight or more, the effect of improving the mechanical properties of the resin is particularly large, and the thermal shock resistance of a metal insert molded product of the PPS resin composition can be increased to 15 or more cycles. When the amount of fibrous inorganic filler is 190 parts by weight or less, the fluidity of the PPS resin composition when melted can be maintained.

[0087] Specific examples of (C) fibrous inorganic fillers include glass fibers, carbon fibers, carbon nanotubes, carbon nanohorns, potassium titanate whiskers, zinc oxide whiskers, calcium carbonate whiskers, wollastonite whiskers, aluminum borate whiskers, aramid fibers, alumina fibers, silicon carbide fibers, ceramic fibers, asbestos fibers, gypsum fibers, metal fibers, etc. The surface of the fibrous inorganic filler may be pretreated with a coupling agent such as an isocyanate compound, an organosilane compound, an organotitanate compound, an organoborane compound, or an epoxy compound before use.

[0088] Among these, (C) the fibrous inorganic filler is preferably one selected from glass fiber and carbon fiber in order to obtain the effect of improving the rigidity of the material, and glass fiber is more preferred from the viewpoint of material cost. Furthermore, irregular cross-section glass fiber is preferred from the viewpoint of thermal shock resistance when using metal insert molded articles of PPS resin compositions. While the reason for this is unclear, it is presumed that irregular cross-section glass fiber has the effect of reducing the dimensional change and anisotropy of the resin composition, thereby suppressing dimensional change during thermal cycles and impacts due to anisotropy. Furthermore, molded articles made from resin compositions containing irregular cross-section glass have improved surface smoothness compared to molded articles made from resin compositions containing round cross-section glass, which has little anisotropy, and are therefore preferred from the viewpoint of tracking resistance. An irregular cross-section glass fiber is a glass fiber with a flat cross-section. It is more preferable that the ratio of the major axis (the longest linear distance in the cross section) to the minor axis (the longest linear distance perpendicular to the major axis) (hereinafter sometimes abbreviated as "flatness") in the cross section when the glass fiber is cut perpendicular to the length direction is 1.3 to 10.0.

[0089] (D) Elastomer The PPS resin composition of the present invention preferably contains (D) an elastomer. Elastomer refers to a material with rubber elasticity. Examples of elastomers include thermoplastic elastomers such as olefin (co)polymers and styrene (co)polymers, and thermosetting elastomers such as silicone elastomers and fluoroelastomers.

[0090] The PPS resin composition of the present invention preferably contains 1 to 40 parts by weight, more preferably 2 to 35 parts by weight, of the elastomer (D) per 100 parts by weight of the PPS resin (A). When the elastomer is present in an amount of 1 part by weight or more, the resin composition is more likely to exhibit stress relaxation and toughness-improving effects, enabling a metal insert-molded product of the PPS resin composition to have a thermal shock resistance of 15 or more cycles. Furthermore, because the elastomer (D) is less likely to carbonize, the tracking resistance of the PPS resin composition can be increased to 300 V or more. When the elastomer is present in an amount of 40 parts by weight or less, the flame retardancy of the PPS resin composition can be maintained.

[0091] The (D) elastomer is preferably an olefin copolymer having an epoxy group (D-1), and the content of the olefin copolymer having an epoxy group (D-1) is preferably 1 part by weight or more and 40 parts by weight or less, more preferably 2 parts by weight or more and 35 parts by weight or less, per 100 parts by weight of the (A) PPS resin.

[0092] (D-1) Olefin copolymers having epoxy groups include (co)polymers obtained by polymerizing α-olefins such as ethylene, propylene, 1-butene, 1-pentene, 1-octene, 4-methyl-1-pentene, and isobutylene, either alone or in combination; or copolymers of α-olefins and α,β-unsaturated acids and alkyl esters thereof, such as acrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, methacrylic acid, methyl methacrylate, ethyl methacrylate, and butyl methacrylate; and copolymers obtained by introducing a monomer component having epoxy groups (functional group-containing component) into, for example, ethylene / propylene copolymer (where " / " indicates copolymerization, the same applies hereinafter), ethylene / 1-butene copolymer, ethylene / 1-hexene copolymer, ethylene / 1-octene copolymer, ethylene / methyl acrylate copolymer, ethylene / ethyl acrylate copolymer, ethylene / butyl acrylate copolymer, ethylene / methyl methacrylate copolymer, ethylene / ethyl methacrylate copolymer, and ethylene / butyl methacrylate copolymer. Examples of functional group-containing components include epoxy group-containing monomers such as glycidyl acrylate, glycidyl methacrylate, glycidyl ethacrylate, glycidyl itaconate, and glycidyl citraconate. The method for introducing these functional group-containing components is not particularly limited, and methods such as copolymerizing the functional group-containing component when copolymerizing the monomers that constitute the olefin (co)polymer, or grafting the functional group-containing component onto the olefin (co)polymer using a radical initiator can be used. Particularly useful examples of olefin copolymers having epoxy groups obtained by introducing a functional group-containing component into an olefin (co)polymer include ethylene / propylene-g-glycidyl methacrylate copolymer ("g" represents graft, the same applies below), ethylene / 1-butene-g-glycidyl methacrylate copolymer, ethylene / glycidyl acrylate copolymer, ethylene / glycidyl methacrylate copolymer, ethylene / methyl acrylate / glycidyl methacrylate copolymer, and ethylene / methyl methacrylate / glycidyl methacrylate copolymer.Alternatively, epoxy group-containing olefin copolymers containing other monomers as copolymerization components in addition to an α-olefin such as ethylene or propylene and a glycidyl ester of an α,β-unsaturated acid can also be suitably used.

[0093] Among these, from the viewpoints of thermal shock resistance and tracking resistance, an olefin copolymer containing a structure derived from a glycidyl ester of an α,β-unsaturated acid is preferred as the (D) elastomer, since it allows for a small dispersion diameter of the (D) elastomer in the PPS resin composition, and an ethylene / methyl acrylate / glycidyl methacrylate copolymer is even more preferred. From the viewpoint of thermal shock resistance, the lower limit of the content of the structural units derived from the glycidyl ester of an α,β-unsaturated acid is preferably 0.01 parts by weight or more, and even more preferably 0.03 parts by weight or more, per 100 parts by weight of the total resin composition. From the viewpoint of fluidity during melting, the upper limit of the content of the structural units derived from the glycidyl ester of an α,β-unsaturated acid is preferably less than 0.15 parts by weight, and even more preferably 0.10 parts by weight or less, per 100 parts by weight of the total resin composition.

[0094] In the present invention, it is also preferable that the (D) elastomer contains (D-2) an elastomer having no epoxy groups. The (D-2) elastomer having no epoxy groups is preferably contained in an amount of 1 part by weight to 40 parts by weight, more preferably 2 parts by weight to 35 parts by weight, per 100 parts by weight of the (A) PPS resin.

[0095] The use of a combination of an olefin copolymer (D-1) having an epoxy group and an elastomer (D-2) having no epoxy group as the elastomer (D) is preferred from the viewpoints of thermal shock resistance and tracking resistance, since it reduces the dispersion diameter of the elastomer (D) in the PPS resin composition.

[0096] Specific examples of the (D-2) epoxy group-free elastomer include elastomers having at least one functional group selected from the group consisting of carboxyl groups, acid anhydride groups, hydroxyl groups, amino groups, epoxy groups, and isocyanate groups, and particularly elastomers having no polar functional groups. Furthermore, as long as the elastomer does not have an epoxy group, it may be a thermoplastic elastomer such as an olefin (co)polymer or a styrene (co)polymer. It may also be a thermosetting elastomer such as a silicone elastomer or a fluoroelastomer.

[0097] (D-2) The epoxy group-free elastomer preferably has a glass transition temperature of −20°C or lower, more preferably −30°C or lower, so that it can maintain toughness and a low elastic modulus even at low temperatures, from the viewpoint of thermal shock resistance when using a metal insert molding product.

[0098] (E) Silicone Compound From the viewpoints of tracking resistance and thermal shock resistance when used in metal insert molded products, it is preferable to add a (E) silicone compound to the PPS resin composition, which enhances the water repellency of the PPS resin composition and has a stress relaxation effect. Silicone compounds are organosilicon compounds with a siloxane bond as the backbone, in which organic groups are directly bonded to the silicon. Known organic groups directly bonded to silicon include methyl, ethyl, phenyl, vinyl, trifluoropropyl, and combinations thereof. These known silicone compounds can be used without particular restrictions. Silicone compounds in which some of the organic groups are substituted with substituents such as epoxy groups, amino groups, polyether groups, carboxyl groups, mercapto groups, ester groups, chloroalkyl groups, alkyl groups with 3 or more carbon atoms, and hydroxyl groups can also be used. Silicone compounds are classified into silicone oils, silicone elastomers, and silicone resins based on the degree of crosslinking. Although silicone elastomers also fall under the category of (D) elastomers, they are treated as (E) silicone compounds in this invention. Although any of these silicone compounds can be used, silicone elastomers with a high degree of crosslinking and resistance to decomposition are particularly preferred from the viewpoints of workability, tracking resistance, thermal shock resistance, and weld tensile strength. Micronized silicone compounds with an average particle size of 0.1 to 80 μm are also effective because of their good dispersibility and excellent workability.

[0099] The amount of the (E) silicone compound is preferably 0.1 to 20 parts by weight, more preferably 0.1 to 15 parts by weight, and even more preferably 0.5 to 15 parts by weight, per 100 parts by weight of the (A) PPS resin. An amount of 0.1 part by weight or more is preferred from the viewpoint of improving tracking resistance and thermal shock resistance when used in metal insert molded products. An amount of 20 parts by weight or less is preferred from the viewpoint of maintaining the mechanical strength of the resin composition and reducing the amount of gas generated.

[0100] (F) Organosilane compounds To the PPS resin composition used in the present invention, a silane compound having at least one functional group selected from epoxy, amino, isocyanate, hydroxyl, mercapto, and ureido groups may be added, as long as the effects of the present invention are not impaired, for the purpose of improving mechanical strength, toughness, etc. Specific examples of such compounds include epoxy group-containing alkoxysilane compounds such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; mercapto group-containing alkoxysilane compounds such as γ-mercaptopropyltrimethoxysilane and γ-mercaptopropyltriethoxysilane; ureido group-containing alkoxysilane compounds such as γ-ureidopropyltriethoxysilane, γ-ureidopropyltrimethoxysilane, and γ-(2-ureidoethyl)aminopropyltrimethoxysilane; γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropyltrimethoxysilane, and γ-isocyanatopropyltriethoxysilane. Examples of the alkoxysilane compound include isocyanate group-containing alkoxysilane compounds such as γ-isocyanatepropylmethyldimethoxysilane, γ-isocyanatepropylmethyldiethoxysilane, γ-isocyanatepropylethyldimethoxysilane, γ-isocyanatepropylethyldiethoxysilane, and γ-isocyanatepropyltrichlorosilane; amino group-containing alkoxysilane compounds such as γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, and γ-aminopropyltriethoxysilane; and hydroxyl group-containing alkoxysilane compounds such as γ-hydroxypropyltrimethoxysilane and γ-hydroxypropyltriethoxysilane. Among these, alkoxysilane compounds having at least one functional group selected from epoxy groups, amino groups, isocyanate groups, and hydroxyl groups are particularly suitable for obtaining excellent tracking resistance, resistance to cold and heat shock, and weld tensile strength, because they can improve the dispersibility of (B) non-fibrous inorganic filler and (D) elastomer in the PPS resin composition and also increase the interfacial strength between (B) non-fibrous inorganic filler and (C) fibrous inorganic filler and the PPS resin.The preferred amount of such a silane compound to be added is in the range of 0.05 to 5 parts by weight per 100 parts by weight of the PPS resin.

[0101] The PPS resin composition used in the present invention may be blended with other resins as long as the effects of the present invention are not impaired. While there are no particular limitations on the resins that can be blended, specific examples include polyamides; polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polycyclohexyldimethylene terephthalate, and polynaphthalene terephthalate; polyethylene, polypropylene, polytetrafluoroethylene, polyamideimide, polyacetal, polyimide, polyetherimide, polyethersulfone, polysulfone resins, polyarylsulfone resins, polyketone resins, polyarylate resins, liquid crystal polymers, polyetherketone resins, polythioetherketone resins, polyetheretherketone resins, and polyamideimide resins.

[0102] The PPS resin composition of the present invention may contain other components, such as antioxidants and heat stabilizers (hindered phenols, hydroquinones, phosphorus, phosphites, amines, sulfur-based compounds, and their substituted derivatives), weathering agents (resorcinols, salicylates, benzotriazoles, benzophenones, hindered amines, and the like), release agents and lubricants (montanic acid and its metal salts, its esters, its half esters, stearyl alcohol, stearamide, stearates, bisurea, polyethylene wax, and the like), pigments (cadmium sulfide, phthalocyanine, coloring carbon black, and the like), dyes (nigrosine, and the like), plasticizers (octyl p-oxybenzoate, N-butylbenzenesulfonamide, and the like), antistatic agents (alkyl sulfate-type anionic antistatic agents, Common additives that can be added include quaternary ammonium salt-type cationic antistatic agents, nonionic antistatic agents such as polyoxyethylene sorbitan monostearate, and betaine-type amphoteric antistatic agents; flame retardants (e.g., red phosphorus, phosphate esters, melamine cyanurate, ammonium polyphosphate, brominated polystyrene, brominated polyphenylene ether, brominated polycarbonate, brominated epoxy resins, or combinations of these brominated flame retardants with antimony trioxide); heat stabilizers; lubricants such as calcium stearate, aluminum stearate, and lithium stearate; strength improvers such as bisphenol epoxy resins (e.g., bisphenol A), novolac phenolic epoxy resins, and cresol novolac epoxy resins; UV inhibitors, colorants, flame retardants, and foaming agents. Antioxidants and heat stabilizers (hindered phenols, hydroquinones, phosphorus compounds, phosphites, amines, sulfur compounds, and their substituted derivatives) are preferred. More preferably, a phosphorus-based antioxidant and a hindered phenol-based antioxidant are used. The amount of each of the above compounds is preferably 20 parts by weight or less, and more preferably 10 parts by weight or less, because if the amount exceeds 20 parts by weight of the total resin composition, the inherent properties of the PPS resin may be impaired.

[0103] The method for preparing the PPS resin composition of the present invention is not particularly limited. Representative examples include feeding the raw materials into a commonly known melt mixer, such as a single-screw or twin-screw extruder, a Banbury mixer, a kneader, or a mixing roll, and kneading them at a temperature of 280 to 380°C. The order in which the raw materials are mixed is also not particularly limited. Any of the following methods may be used: blending all the raw materials and then melt-kneading them using the method described above; blending some of the raw materials and then melt-kneading them using the method described above, followed by blending and melt-kneading the remaining raw materials; or blending some of the raw materials and then melt-kneading them using a side feeder while melt-kneading them in a single-screw or twin-screw extruder. Minor additive components can also be added to the mixture before molding after the other components have been kneaded and pelletized using the method described above.

[0104] The PPS resin composition of the present invention thus obtained can be subjected to various molding processes such as injection molding, extrusion molding, blow molding and transfer molding, but is particularly suitable for injection molding.

[0105] The PPS resin composition of the present invention preferably has a tensile elongation of 1.0% or more. This allows it to be suitably used in parts that are assumed to deform during use, such as snap-fit ​​shapes. Furthermore, a tensile elongation of 1.0% or more makes it possible to achieve a thermal shock resistance of 15 or more cycles when using a metal insert molded product. The tensile elongation in the present invention is a value measured in accordance with ISO 527-1, -2 (2012).

[0106] The PPS resin composition of the present invention preferably has a weld tensile strength of 30 MPa or more, preferably 34 MPa or more, and more preferably 38 MPa or more. This improves the strength of the welds, which are the weakest parts of a molded article, making the molded article less likely to break and improving its reliability. The measurement method will be described later.

[0107] The tracking resistance of the PPS resin composition of the present invention is evaluated by the value of the comparative tracking index measured in accordance with IEC 60112 (2003). A higher comparative tracking index means higher tracking resistance.

[0108] The PPS resin composition of the present invention must have a tracking resistance of 300 V or more, preferably 400 V or more, measured in accordance with IEC 60112 (2003). This reduces the likelihood of tracking failure when the PPS resin composition of the present invention is used in components to which high voltages (400 V or more) are applied, improving the safety of the molded article. Furthermore, it becomes possible to ensure a creepage distance of the molded article that is greater than the required creepage distance specified in IEC 60664. Therefore, molded articles made from the PPS resin composition of the present invention have greater design freedom, making it easier to achieve smaller and lighter molded articles. If the tracking resistance of a PPS resin composition is less than 300 V, tracking failure may be more likely to occur on the surface of a molded article made from the PPS resin composition, making it unsafe for use in components to which high voltages are applied.

[0109] The PPS resin composition of the present invention must have a thermal shock resistance of 15 or more cycles, preferably 20 or more cycles, when measured using a metal insert molded article by the method described below. By doing so, when the PPS resin composition of the present invention is used in a metal insert molded article, the molded article is less likely to crack, making it suitable for use. If the thermal shock resistance of the PPS resin composition is less than 15 cycles, resin cracking may be more likely to occur when a metal insert molded article made of the PPS resin composition is used in a location where the environmental temperature fluctuates (approximately -40°C to 130°C).

[0110] In the present invention, thermal shock resistance is evaluated by the number of thermal shock treatments required to generate cracks in the weld when a metal insert test piece is used, in which a weld is intentionally generated by drilling a hole in the center as shown in Figure 1. The number of treatments required to generate cracks indicates the crack resistance of the weld, and the higher the number of treatments, the higher the thermal shock resistance.

[0111] Although welds are prone to cracking due to their weak mechanical strength caused by the orientation of the fibrous inorganic filler, the PPS resin composition of the present invention exhibits high resistance to cold and thermal shock at the welds, making it suitable for use in molded products of various shapes, particularly metal insert molded products. The metal insert molded product of the present invention is a product obtained by integrally molding a metal part with the PPS resin composition. Metal insert molded products can be suitably used for, for example, automotive electrical components such as current sensors and bus bars, and electrical and electronic components such as power semiconductor housings. These components can be suitably installed in eAxles and xEVs. An eAxle is a drive system for electric vehicles, etc., that integrates a motor, inverter, and reducer. xEV is a general term for electric vehicles, including battery electric vehicles (BEVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), and fuel cell electric vehicles (FCEVs).

[0112] Examples of applications to which the PPS resin composition of the present invention can be applied include electric and electronic components such as power semiconductor housings such as power modules, sensors, consumer connectors, relay cases, coil bobbins, capacitors, various terminal boards, insulating plates, and small motors; automobile and vehicle-related parts such as distributors, starter switches, starter relays, transmission wire harnesses, coils for fuel-related electromagnetic valves, fuse connectors, insulating plates for electrical components, terminal blocks, step motor rotors, solenoid bobbins, engine oil filters, ignition device cases, vehicle speed sensors, current sensors, bus bars, capacitor cases, and cable liners; and in-vehicle electrical components. [Example]

[0113] The present invention will be explained in more detail below by showing examples, but the present invention is not limited to the descriptions of these examples. Note that Example 5 is currently a reference example, and Examples 1-4 and 6-13 are examples of the present invention.

[0114] [Evaluation method for PPS resin produced in the reference example] (1) Melt flow rate (MFR) The measurement was performed at a temperature of 315.5°C under a load of 5000g in accordance with the method of ASTM-D1238-70.

[0115] However, for polyphenylene sulfide resins with low viscosity, the MFR was calculated as follows: The ER (Extrusion Rate) of the polyphenylene sulfide resin was measured at a measurement temperature of 315.5°C under a load of 345 g in accordance with a method in accordance with ASTM-D1238-70, and the MFR value was calculated using the following formula (1). Formula (1) MFR = 15.8 x 4.4 x ER [Reference example 1] A 70-liter autoclave equipped with a stirrer and bottom stop valve was charged with 8.27 kg (70.00 mol) of 47.5% sodium hydrosulfide, 2.91 kg (69.80 mol) of 96% sodium hydroxide, 11.45 kg (115.50 mol) of N-methyl-2-pyrrolidone (NMP), and 10.5 kg of ion-exchanged water. The mixture was gradually heated to 245°C over approximately 3 hours under atmospheric pressure while passing nitrogen through. After distilling off 14.78 kg of water and 0.28 kg of NMP, the reactor was cooled to 200°C. The amount of water remaining in the system per mole of charged alkali metal sulfide, including the water consumed in the hydrolysis of NMP, was 1.06 mol. The amount of hydrogen sulfide released was 0.02 mol per mole of charged alkali metal sulfide.

[0116] Then, 10.48 kg (71.27 mol) of p-dichlorobenzene and 9.37 kg (94.50 mol) of NMP were added, and the reaction vessel was sealed under nitrogen gas and heated from 200°C to 270°C at a rate of 0.6°C / min while stirring at 240 rpm. After reacting at 270°C for 100 minutes, the bottom stopper valve of the autoclave was opened, and the contents were flushed into a vessel equipped with a stirrer over 15 minutes while pressurizing with nitrogen, followed by stirring for a while at 250°C to remove most of the NMP and obtain a solid.

[0117] The obtained solid and 76 liters of ion-exchanged water were placed in an autoclave equipped with a stirrer, stirred and washed at 70°C for 30 minutes, and then suction filtered through a glass filter. Next, 76 liters of ion-exchanged water heated to 70°C was poured into the glass filter and suction filtered to obtain a cake.

[0118] The obtained cake and 90 liters of ion-exchanged water were placed in an autoclave equipped with a stirrer, and acetic acid was added to adjust the pH to 7. After the inside of the autoclave was purged with nitrogen, the temperature was raised to 192°C and maintained at that temperature for 30 minutes. The autoclave was then cooled, and the contents were removed.

[0119] The contents were filtered under suction using a glass filter, and then 76 liters of ion-exchanged water at 70°C was poured into the filter and filtered under suction to obtain a cake, which was then dried at 120°C under a nitrogen stream to obtain a dried PPS.

[0120] The obtained PPS resin was subjected to thermal oxidation treatment by heating at 220°C for 12 hours at an oxygen concentration of 2%. The obtained PPS had an ER of 67g / 10min, which was converted to an MFR of 4658g / 10min.

[0121] [Reference example 2] A 70-liter autoclave equipped with a stirrer and bottom stop valve was charged with 8.27 kg (70.00 mol) of 47.5% sodium hydrosulfide, 2.94 kg (70.63 mol) of 96% sodium hydroxide, 11.45 kg (115.50 mol) of N-methyl-2-pyrrolidone (NMP), 0.513 kg (6.25 mol) of sodium acetate, and 3.82 kg of ion-exchanged water. The mixture was gradually heated to 245°C over approximately 3 hours under atmospheric pressure while passing nitrogen through. After distilling off 8.09 kg of water and 0.28 kg of NMP, the reactor was cooled to 200°C. The amount of water remaining in the system per mole of charged alkali metal sulfide, including the water consumed in the hydrolysis of NMP, was 1.06 mol. The amount of hydrogen sulfide released was 0.02 mol per mole of charged alkali metal sulfide.

[0122] Subsequently, 10.34 kg (70.32 mol) of p-dichlorobenzene and 9.37 kg (94.50 mol) of NMP were added, the reaction vessel was sealed under nitrogen gas, and the temperature was raised from 200°C to 270°C at a rate of 0.6°C / min while stirring at 240 rpm, and the reaction was carried out at 270°C for 140 minutes. Subsequently, 2.67 kg (148.4 mol) of water was injected while cooling from 270°C to 250°C over 15 minutes. The mixture was then gradually cooled from 250°C to 220°C over 75 minutes, after which it was rapidly cooled to near room temperature and the contents were removed.

[0123] The contents were diluted with approximately 35 L of NMP, stirred at 85°C for 30 minutes, and filtered through an 80-mesh wire mesh (0.175 mm mesh size) to obtain a solid. The resulting solid was similarly washed with approximately 35 L of NMP and filtered. The resulting solid was diluted with 70 L of ion-exchanged water, stirred at 70°C for 30 minutes, and then filtered through an 80-mesh wire mesh to recover the solid. This procedure was repeated three times. The resulting solid and 32 g of acetic acid were diluted with 70 L of ion-exchanged water, stirred at 70°C for 30 minutes, and then filtered through an 80-mesh wire mesh. The resulting solid was further diluted with 70 L of ion-exchanged water, stirred at 70°C for 30 minutes, and then filtered through an 80-mesh wire mesh to recover the solid. The resulting solid was dried at 120°C under a nitrogen stream to obtain dried PPS. The resulting PPS had an MFR of 600 g / 10 min.

[0124] The raw materials used in the examples and comparative examples are shown below.

[0125] (A)PPS resin PPS-1: PPS resin polymerized by the method described in Reference Example 1 PPS-2: PPS resin polymerized by the method described in Reference Example 2.

[0126] (B) Non-fibrous inorganic filler B-1: Surface-treated magnesium hydroxide (Kisuma 5P, manufactured by Kyowa Chemical Industry Co., Ltd., treated with a silane coupling agent) B-2: Surface-treated magnesium hydroxide (EP1 vinylsilane-treated product manufactured by Konoshima Chemical Co., Ltd.) B-3: Surface-treated magnesium hydroxide (EP3 vinylsilane-treated product manufactured by Konoshima Chemical Co., Ltd., standard deviation of particle size distribution: 0.29, average particle size: 4.0 μm, 10% D: 1.38 μm) B-4: Surface-treated magnesium hydroxide (S-4 manufactured by Konoshima Chemical Co., Ltd., fatty acid + vinylsilane treatment). B-5: Surface-treated magnesium hydroxide (Kisuma 5L, manufactured by Kyowa Chemical Industry Co., Ltd., treated with silane coupling agent) B-6: Surface-treated magnesium hydroxide (Magnifin® H-5A, vinyl silane treated, manufactured by Huber Engineered Materials).

[0127] (C) Fibrous inorganic filler C-1: Chopped strand glass fiber (Nitto Boshoku Co., Ltd. CSG 3PA 830 S, 3 mm length, minor axis 7 μm, major axis 28 μm, aspect ratio 4) C-2: Chopped strand glass fiber (T-760H manufactured by Nippon Electric Glass Co., Ltd., 3 mm length, average fiber diameter 10.5 μm, aspect ratio 1) C-3: Chopped strand glass fiber (CSG 3PA 9886 manufactured by Nitto Boshoku Co., Ltd., 3 mm length, minor axis 7 μm, major axis 28 μm, aspect ratio 4).

[0128] (D) Elastomer D-1: Ethylene-glycidyl methacrylate-methyl acrylate copolymer (Bondfast (registered trademark) 7M, manufactured by Sumitomo Chemical Co., Ltd., 67% by mass of ethylene, 6% by mass of glycidyl methacrylate, 27% by mass of methyl acrylate) D-2: Ethylene-1-octene copolymer (Engage® 8842, manufactured by The Dow Chemical Company, glass transition temperature: −61° C.).

[0129] (E) Silicone Compound E-1: Dimethyl silicone oil-supported silica powder (Dowsil Trefil (registered trademark) F-202, manufactured by Dow-Toray Industries, Inc.). E-2: Silicone elastomer powder (Dowsil EP-2601, epoxy modified, manufactured by Dow-Toray Industries, Inc.).

[0130] (F) Organosilane compounds F-1: β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (KBM-303, manufactured by Shin-Etsu Chemical Co., Ltd.).

[0131] (G) Other resins G-1: Nylon 610 (CM2021 manufactured by Toray Industries, Inc.).

[0132] The evaluation and measurement methods used in the examples and comparative examples are shown below.

[0133] [Standard deviation of particle size distribution of non-fibrous inorganic filler, average particle size, 10%D] 20 mg of non-fibrous inorganic filler was placed in 5 mL of 0.2 w / v% aqueous sodium hexametaphosphate solution and dispersed for 3 minutes in an ultrasonic cleaner. The particle size distribution of the resulting dispersion was measured using a particle size distribution analyzer (SALD-2100) manufactured by Shimadzu Corporation, and the standard deviation, volume average particle diameter, and 10% D were calculated. The standard deviation is expressed as a standard deviation on a logarithmic scale. When multiple non-fibrous inorganic fillers were blended in the examples and comparative examples, measurements were performed using a mixture blended at the blending ratio (weight ratio).

[0134] [Tracking resistance] Using an injection molding machine (SE50DUZ-C160) manufactured by Sumitomo Heavy Industries, Ltd., a square plate (80 mm x 80 mm x 3.0 mm thick) was injection molded at a cylinder temperature of 320°C and a mold temperature of 130°C to serve as the measurement sample. The maximum voltage at which tracking breakdown did not occur was determined in accordance with IEC 60112, 4th Edition. A 0.1% aqueous solution of ammonium chloride was used as the electrolyte.

[0135] [Cold and thermal shock resistance] A cassette-shaped insert metal 1 (material: SUS430) measuring 50 mm x 35 mm x 5 mm and having two central holes was placed in the mold of a Sumitomo Heavy Industries, Ltd. injection molding machine (SE30D). The insert metal was injection molded from gate 2 under the following conditions: an injection speed of 70 mm / s, an injection pressure resulting in a 0.5-second fill time, a 5-second hold at 0.6 times the injection pressure, a cylinder temperature of 320°C, and a mold temperature of 130°C. This resulted in the production of the metal insert molded product 3 shown in Figure 1. The metal insert molded product 3 was subjected to thermal shock treatment, consisting of one cycle consisting of one hour at 130°C and one hour at -40°C. The presence or absence of cracks was visually inspected every 10 cycles, and the number of cycles required for crack generation was calculated as an average of N = 3. This test specimen had a hole in the center to intentionally create a weld, and the weld's thermal shock resistance was estimated.

[0136] [Tensile strength, tensile elongation] Measurement samples were prepared using a Sumitomo Heavy Industries injection molding machine (SE75DUZ-C250) at a resin temperature of 310°C and a mold temperature of 140°C to prepare Type A1 test pieces as specified in ISO20753 (2008). The tensile strength and tensile elongation (break point) were measured in accordance with ISO527-1, 2 at a support distance of 114 mm and a tensile speed of 5 mm / min.

[0137] [Weld tensile strength] The measurement samples were Type IV test pieces specified in ASTM-D638, injection molded using a Sumitomo Heavy Industries injection molding machine (SE75DUZ-C250) at a resin temperature of 320°C and a mold temperature of 150°C. Tensile strength and tensile elongation (break point) were measured in accordance with ISO527-1, 2, with a support distance of 65 mm and a tensile speed of 5 mm / min. This test piece was intentionally welded in the center by injecting resin into both ends of the test piece, and was designed to measure the strength of the weld.

[0138] [Examples 1 to 13, Comparative Examples 1 to 8] Using a Japan Steel Works, Ltd. TEX30α twin-screw extruder set at a cylinder temperature of 300°C and a screw rotation speed of 200 rpm, (A) PPS resin, (B) non-fibrous inorganic filler, (C) fibrous inorganic filler, (D) elastomer, (E) silicone compound, (F) organosilane compound, and (G) other resins were melt-kneaded according to the weight ratios listed in Tables 1 and 2. (A) PPS resin, (B) non-fibrous inorganic filler, (D) elastomer, (E) silicone compound, (F) organosilane compound, and (G) other resins were fed into the raw material feed port and melted, while (C) fibrous inorganic filler was fed into the twin-screw extruder's side feeder. The resin discharged from the extruder was pelletized in a grinder and dried overnight with hot air at 120°C before being subjected to various molding and evaluation processes.

[0139] In Examples 1 to 13, it was found that by setting the standard deviation, average particle diameter, and 10% D of the particle size distribution of (B) the non-fibrous inorganic filler within predetermined ranges and optimizing the blending of raw materials, both tracking resistance and thermal shock resistance of metal insert molded articles were excellent. The PPS resin compositions of these examples can be safely used in molded articles and metal insert molded articles that are subjected to high voltage, such as automotive parts and electrical and electronic parts.

[0140] It was found that the PPS resin composition of Comparative Example 1 was inferior in thermal shock resistance because the standard deviation of the particle size distribution of the non-fibrous inorganic filler (B) was small.

[0141] It was found that the PPS resin composition of Comparative Example 2 had poor thermal shock resistance because the standard deviation of the particle size distribution of the non-fibrous inorganic filler (B) was small and the average particle diameter was small.

[0142] The PPS resin composition of Comparative Example 3 was found to have poor tracking resistance because it did not contain either (B) the non-fibrous inorganic filler or (E) the silicone compound.

[0143] The PPS resin composition of Comparative Example 4 was found to be inferior in both tracking resistance and thermal shock resistance because the standard deviation of the particle size distribution of the (B) non-fibrous inorganic filler was small, the blended amount was small, and the composition did not contain the (E) silicone compound.

[0144] It was found that the PPS resin composition of Comparative Example 5 was inferior in cold and thermal shock resistance because the fibrous inorganic filler (C) was not a modified cross section glass.

[0145] The PPS resin composition of Comparative Example 6 was found to have poor thermal shock resistance because the standard deviation of the particle size distribution of the (B) non-fibrous inorganic filler was small, and the composition did not contain the (D) elastomer or the (E) silicone compound.

[0146] It was found that the PPS resin composition of Comparative Example 7 was inferior in cold and heat shock resistance because the standard deviation of the particle size distribution of the non-fibrous inorganic filler (B) was small.

[0147] It was found that the PPS resin composition of Comparative Example 8, which did not contain the silicone compound (E), was inferior in cold and thermal shock resistance. [Explanation of symbols]

[0148] 1. Insert metal 2. Gate 3. Metal insert molding

[0149] [Table 1]

[0150] [Table 2]

Claims

1. A polyphenylene sulfide resin composition comprising a polyphenylene sulfide resin, wherein (A) 100 parts by weight of polyphenylene sulfide resin is blended with (E) 0.1 parts by weight or more and 20 parts by weight or less of a silicone compound, the comparative tracking index value measured in accordance with IEC 60112 (2003) is 300V or more, and when a thermal shock treatment is performed using a metal insert test piece in which a weld portion is intentionally generated by providing a hole in the center, with one cycle consisting of treatment at 130°C for 1 hour followed by treatment at -40°C for 1 hour, the polyphenylene sulfide resin composition is characterized by having 15 or more treatment cycles in which cracks occur in the weld portion.

2. A polyphenylene sulfide resin composition comprising (A) 100 parts by weight of polyphenylene sulfide resin and (B) 20 parts by weight or more and 170 parts by weight or less of a non-fibrous inorganic filler, wherein the standard deviation of the particle size distribution of (B) non-fibrous inorganic filler is 0.22 or more and 10.00 or less, according to claim 1.

3. The polyphenylene sulfide resin composition according to claim 2, wherein the (B) non-fibrous inorganic filler is a decomposition endothermic filler.

4. A polyphenylene sulfide resin composition comprising (A) 100 parts by weight of polyphenylene sulfide resin and (B) 20 to 170 parts by weight of a non-fibrous inorganic filler, wherein the standard deviation of the particle size distribution of (B) non-fibrous inorganic filler is 0.22 or more and 10.00 or less, (B) non-fibrous inorganic filler is a decomposition endothermic filler, and a polyphenylene sulfide resin composition comprising (A) 100 parts by weight of polyphenylene sulfide resin and (E) 0.1 to 20 parts by weight of a silicone compound.

5. The polyphenylene sulfide resin composition according to claim 2 or 4, wherein the average particle size of the non-fibrous inorganic filler (B) is 1.0 μm or more and 50.0 μm or less.

6. The polyphenylene sulfide resin composition according to claim 2 or 4, wherein the 10% D of the non-fibrous inorganic filler (B) is 0.1 μm or more and 1.2 μm or less.

7. A polyphenylene sulfide resin composition according to claim 1 or 4, comprising (A) 100 parts by weight of polyphenylene sulfide resin and (C) 40 parts by weight or more and 190 parts by weight or less of fibrous inorganic filler.

8. The polyphenylene sulfide resin composition according to claim 7, wherein the (C) fibrous inorganic filler is a glass fiber with an irregular cross-section.

9. A polyphenylene sulfide resin composition according to claim 1 or 4, comprising (A) 100 parts by weight of polyphenylene sulfide resin and (D) 1 to 40 parts by weight of elastomer.

10. A molded article comprising the polyphenylene sulfide resin composition according to claim 1 or 4.

11. A metal insert molded article comprising the molded article described in claim 10.

12. An automotive electrical component comprising the molded product described in claim 10.

13. An eAxle comprising the molded article described in claim 10.

14. xEV comprising the molded article described in claim 10.

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