Plating Equipment

Abstract

A technology is provided that can prevent plating solution from scattering outside a plating tank when the plating solution is stirred. The plating apparatus 1000 comprises a plating tank 10, a substrate holder 30, a paddle 70, and a scattering suppression member 60a, the scattering suppression member having a first member 61 and a second member 62, the first member being arranged in a region above the paddle and below the upper end 10ba of the outer peripheral wall 10b of the plating tank, and being arranged in a region between the outer peripheral wall 10b of the plating tank and the substrate holder, and extending in the vertical direction and extending in a curved shape circumferentially around the outer peripheral wall, the second member being arranged above the upper end of the outer peripheral wall, and being arranged above the first member with a space SP1 between it and the first member, and having a lower surface 62a extending horizontally.

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