Polishing pad with window and method for preparing thereof

Abstract

A polishing pad equipped with a window and a method for manufacturing the same are disclosed, wherein a heat fusion method and a vibration fusion method are not applied during the process of inserting and attaching the window to the polishing pad, so that the polishing pad is not deformed and the polishing slurry is not leaked into the gap between the window and the polishing pad. The polishing pad equipped with the window comprises: a polishing layer having a first perforated hole formed in the thickness direction; a window inserted and fixed in the first perforated hole of the polishing layer; a lower support layer located below the polishing layer and the window, wherein a second perforated hole for irradiating an optical beam is formed on the lower side of the window with a width narrower than the first perforated hole or the window; an adhesive layer that mediates the bonding of the polishing layer and the lower support layer, has the same area as the lower support layer, partially overlaps with the edge of the window but does not come into contact with it; and a sealing adhesive member located between the window and the adhesive layer.

Description

Technology Field

[0001] The present invention relates to a polishing pad equipped with a window and a method for manufacturing the same, which is used to chemically or mechanically flatten a semiconductor wafer. More specifically, the invention relates to a polishing pad equipped with a window and a method for manufacturing the same, in which a thermal fusion method and a vibration fusion method are not applied during the process of inserting and attaching the window to the polishing pad, so that the polishing pad is not deformed and the polishing slurry is not leaked into the gap between the window and the polishing pad. Background Technology

[0002] Chemical mechanical planarization / polishing (hereinafter referred to as CMP) is a process introduced for the global planarization of semiconductor devices, and it is emerging as an increasingly important process, particularly due to trends toward larger semiconductor wafer diameters, higher integration, miniaturization of linewidths, and multilayering of wiring structures.

[0003] In such CMP processes, polishing speed and planarization are important, and these are determined by the process conditions of the polishing equipment and the consumable components, namely the polishing slurry and polishing pad. Among these, the polishing slurry performs the function of chemically removing the wafer film through the chemical components within the slurry solution. Additionally, the polishing pad performs the role of uniformly dispersing the polishing slurry onto the wafer while in contact with the wafer surface, and simultaneously physically removing the wafer film through the polishing particles contained in the slurry solution and the protrusions located on the surface of the polishing pad.

[0004] Furthermore, in recent CMP processes, polishing pads are used that are inserted and attached up to a window for the purpose of detecting the polishing endpoint of the wafer. This detection is achieved by transmitting an optical beam, such as a laser beam, through the window within the polishing pad, thereby enabling the analysis of the wafer thickness during the polishing process.

[0005] FIG. 1 is a schematic cross-sectional view of a conventional polishing pad equipped with a window. As shown in FIG. 1, the conventional polishing pad equipped with a window comprises a polishing layer (10) having a perforated hole formed in the thickness direction, a window (20) inserted and fixed in the perforated hole of the polishing layer (10), a lower support layer (30) located below the polishing layer (10) and the window (20), wherein an opening (22) for transmitting an optical beam is formed on the lower side of the window (20) with a width narrower than that of the window (20), and an adhesive layer (40) that bonds the polishing layer (10), the window (20), and the lower support layer (30) respectively.

[0006] In this way, a conventional polishing pad equipped with a window utilizes a portion of an adhesive layer (40) interposed between a portion of the lower surface of the window (20) and a lower support layer (30) to attach the window (20) to the polishing pad. The adhesive layer (40) is formed by applying a hot melt adhesive (e.g., a melting point of 90°C to 130°C) between a portion of the lower surface of the window (20) and the lower support layer (30) and then fusion by heat.

[0007] However, if a heat fusion method is used to attach the window (20) to the polishing pad in this manner, high-temperature thermal energy is transferred to the polishing layer (10) of the polishing pad, causing dimensional deformation problems such as shrinkage or expansion of the polishing pad. Furthermore, since there is no separate sealing means, during the CMP process, the polishing slurry inevitably penetrates sequentially into the 'gap between the polishing layer (10) and the window (20)' and the 'gap between the window (20) and the adhesive layer (40, or lower support layer (30))', causing leakage below the lower support layer (30). In other words, since the CMP process is a harsh process in which physical and chemical external forces are applied in a high-temperature and high-humidity environment, the window (20) may repeatedly shrink and expand during the CMP process, causing the adhesive layer (40) to detach or create gaps, which may result in leakage of the polishing slurry. Therefore, there is a limit to preventing leakage of the polishing slurry using only the adhesive layer (40).

[0008] Therefore, if a window can be attached within the polishing pad while preventing dimensional deformation of the polishing pad and leakage of the polishing slurry under the lower support layer, it is predicted to become a new driving force in polishing semiconductor wafers. The problem to be solved

[0009] Accordingly, the objective of the present invention is to provide a polishing pad equipped with a window and a method for manufacturing the same, in which the polishing pad is not deformed and the polishing slurry is not leaked into the gap between the window and the polishing pad by not applying a heat fusion method or a vibration fusion method during the process of inserting and attaching the window to the polishing pad. means of solving the problem

[0010] To achieve the above objective, the present invention provides a polishing pad equipped with a window, comprising: a polishing layer having a first perforated hole formed in the thickness direction; a window inserted and fixed in the first perforated hole of the polishing layer; a lower support layer located below the polishing layer and the window, wherein a second perforated hole for irradiating an optical beam is formed on the lower side of the window with a width narrower than that of the first perforated hole or the window; an adhesive layer mediating the bonding of the polishing layer and the lower support layer, having the same area as the lower support layer, partially overlapping with the edge of the window but not in contact with it; and a sealing adhesive member located between the window and the adhesive layer.

[0011] In addition, the present invention provides a method for manufacturing a polishing pad equipped with a window, comprising: a) forming a first perforated hole penetrating in the thickness direction at one end of a polishing member; b) attaching a support member to the lower surface of the polishing member through a first adhesive to form a structure in which a lower support layer, an adhesive layer, and a polishing layer are sequentially stacked; c) perforating the portions of the lower support layer and the adhesive layer in the area corresponding to the first perforated hole of the polishing layer with a width narrower than the first perforated hole to form a second perforated hole penetrating each other with the first perforated hole of the polishing layer; d) applying a second adhesive to the upper surface of the adhesive layer exposed to the outside of the first perforated hole and then inserting a window into the first perforated hole; and e) pressing the window inserted into the first perforated hole so that it is fixed through the second adhesive. Effects of the invention

[0012] According to the polishing pad equipped with a window and the method for manufacturing the same according to the present invention, the polishing pad is not deformed and the polishing slurry is not leaked into the gap between the window and the polishing pad because the heat fusion method and the vibration fusion method are not applied during the process of inserting and attaching the window to the polishing pad. Brief explanation of the drawing

[0013] FIG. 1 is a schematic cross-sectional view of a conventional polishing pad equipped with a window. FIG. 2 is a schematic cross-sectional view of a polishing pad equipped with a window according to one embodiment of the present invention. FIG. 3 is an image showing the sequential manufacturing of a polishing pad equipped with a window according to one embodiment of the present invention. Specific details for implementing the invention

[0014] The present invention will be described in detail below with reference to the attached drawings.

[0015] FIG. 2 is a schematic cross-sectional view of a polishing pad equipped with a window according to one embodiment of the present invention. A polishing pad equipped with a window according to the present invention comprises, as shown in FIG. 2, a polishing layer (110) having a first perforated hole (112) formed in the thickness direction, a window (120) inserted and fixed in the first perforated hole (112) of the polishing layer (110), a lower support layer (130) located below the polishing layer (110) and the window (120), wherein a second perforated hole (122) for irradiating an optical beam is formed on the lower side of the window (120) with a width narrower than that of the first perforated hole (112) or the window (120), an adhesive layer (140) that mediates the bonding of the polishing layer (110) and the lower support layer (130) and has the same area as the lower support layer (130) and partially overlaps with the edge portion of the window (120) but does not come into contact with it, and a sealing adhesive member (150) located between the window (120) and the adhesive layer (140).

[0016] In accordance with the trends toward larger semiconductor wafer diameters, higher integration, miniaturization of linewidths, and multilayering of wiring structures, the polishing speed and degree of planarization are critical in the chemical mechanical planarization / polishing (hereinafter CMP) process introduced for the global planarization of semiconductor devices. These factors are determined by the process conditions of the polishing equipment and the consumable components, such as the polishing slurry and polishing pad. In particular, the polishing pad plays a role in uniformly dispersing the polishing slurry onto the wafer while in contact with the wafer surface, and simultaneously physically removing the wafer film through the polishing particles contained in the slurry solution and the protrusions located on the surface of the polishing pad. Recently, it has become possible to detect the end point of the wafer polishing process and analyze the wafer thickness during the polishing process by installing a window on the polishing pad and transmitting an optical beam.

[0017] However, conventional polishing pads equipped with windows undergo dimensional deformation problems, such as shrinkage or expansion, because the windows are heat-fused or vibration-fused when attached. In addition, conventional polishing pads equipped with windows do not have separate sealing means, so a problem occurs where polishing slurry leaks through the gap between the window and the polishing pad facing it during the CMP process. Accordingly, the applicant has invented a polishing pad equipped with a window that prevents the dimensional deformation of the polishing pad and the problem of polishing slurry leakage.

[0018] First, the polishing layer (110) may be a foam having micropores. The foam may include one or more selected from the group consisting of polyurethane resin, polyester resin, polyamide resin, acrylic resin, polycarbonate resin, polyolefin resin, and epoxy resin, and it may be preferable to form the polishing layer (110) with a foam containing the polyurethane resin, i.e., a polyurethane foam. The average diameter of the pores of the polishing layer (110) or the foam may be 5 to 100 μm, and the porosity of the polishing layer (110) or the foam may be 20 to 70 volume%, but is not limited thereto.

[0019] The surface of the polishing layer (110) may have an uneven structure formed with alternating positive and negative patterns to achieve the original purpose of the polishing layer (acting as a flow channel for the polishing slurry), and may have grooves formed at specific locations having a specific shape, pitch, width, depth, etc. Additionally, the thickness of the polishing layer (110) may be, for example, 1.5 to 2.5 mm, but there is no particular limitation on the thickness, such as it may vary depending on the thickness of the object to be polished (semiconductor wafer) or process conditions.

[0020] A first perforation hole (or first perforation area, 112) is formed in the thickness direction of such a polishing layer (110). There are no special restrictions on the shape of the first perforation hole (112), and examples include circular, elliptical, square, and polygonal shapes based on the planar shape (shape viewed from above). In addition, there are no special restrictions on the size (area or volume) of the first perforation hole (112), and it may be formed in any size as long as the optical beam can pass through it. Furthermore, there are no special restrictions on the location of the first perforation hole (112), and any location on the polishing layer (110) is acceptable as long as the thickness of the wafer, etc., can be measured through the optical beam.

[0021] Next, the window (120) is inserted and fixed into the first perforated hole (112) of the polishing layer (110). The upper surface position in the inserted and fixed state may be the same as the upper surface position of the polishing layer (110) or lower than the upper surface position of the polishing layer (110) (i.e., in the latter case, the part where the window is inserted may be in a recessed shape). On the other hand, if the window (120) protrudes beyond the polishing layer (110), it may not only affect the polishing of the wafer but also cause scratches or cracks to occur on the upper surface of the window (120), making it difficult for the optical beam to pass through; therefore, it is not desirable to configure the window (120) to protrude beyond the polishing layer (110).

[0022] The above window (120) may include a conventional material used in the industry as a material for a window for a polishing pad. However, it may be preferable to use a window for a polishing pad disclosed in Korean Patent Application No. 10-2022-0008594 (Title of Invention: Method for manufacturing a window for a polishing pad and a window for a polishing pad manufactured by this method), filed by the applicant on January 20, 2022, in terms of transmittance and reliability of polishing endpoint detection. In addition, to prevent the polishing slurry from leaking to the bottom of the window (120), it may also be preferable to use a non-foamed material without pores as the material for the window (120).

[0023] And, since the window (120) must be inserted into the first perforated hole (112) of the polishing layer (110) described above, it must have an area equal to or slightly smaller than the area of ​​the first perforated hole (112). However, if the area of ​​the window (120) is equal to the area of ​​the first perforated hole (112), insertion into the first perforated hole (112) is not smooth, and there is a risk of damage to the polishing layer (110) or the window (120) itself, so it may be preferable for the area of ​​the window (120) to be slightly smaller than the area of ​​the first perforated hole (112).

[0024] Furthermore, the lower support layer (130) is positioned at the bottom of the polishing layer (110) and also overlaps a portion of the bottom of the window (120), thereby supporting the polishing layer (110) and simultaneously serving to absorb and disperse the impact applied to the polishing layer (110). The lower support layer (130) may include, for example, a non-woven fabric impregnated with polyurethane resin, a polyurethane foam, and a polyurethane resin suede, but is not limited thereto. Additionally, the thickness of the lower support layer (130) may be, for example, 0.4 to 1.5 mm, but there is no particular limitation on the thickness, such as it may vary depending on the thickness of the polishing layer (110) or process conditions.

[0025] In this lower support layer (130), a second perforated hole (or second perforated area, 122) for irradiating an optical beam is formed in the thickness direction. Accordingly, so that the optical beam is irradiated and transmitted toward the window (120), the second perforated hole (122) is formed with a narrower width than the first perforated hole (112) or the area of ​​the window (120). In other words, the second perforated hole (122) is formed below the first perforated hole (112) and is formed with a smaller planar area than the first perforated hole (112), so that the first perforated hole (112) and the second perforated hole (122) are connected to penetrate each other. Meanwhile, if the planar area of ​​the second hole (122) is larger than or equal to the planar area of ​​the first hole (112), a problem occurs in which the window (120) inserted into the first hole (112) is not fixed and moves downward; therefore, the planar area of ​​the second hole (122) must be formed to be smaller than the planar area of ​​the first hole (112) (i.e., the lower support layer also acts as a latch to prevent the window from moving out). In addition, there are no special restrictions on the shape of the second hole (122), and based on the planar shape (shape viewed from above), circular, elliptical, square, and polygonal shapes can be exemplified.

[0026] Next, the adhesive layer (140) serves to bond the polishing layer (110) and the lower support layer (130), and since it is positioned to face the upper surface of the lower support layer (130) in its entirety, it has the same area as the lower support layer (130). Therefore, the adhesive layer (140) also overlaps partially with the edge portion of the window (120) but does not come into contact with it, just like the lower support layer (130).

[0027] Such an adhesive layer (140) may include, for example, one or more selected from the group consisting of polyurethane resin, polyester resin, ethylene-vinyl acetate resin, polyamide resin and polyolefin resin, and it may be preferable to include one or more of polyurethane resin and polyester resin.

[0028] Finally, the sealing adhesive member (150) is a key component of the present invention and is positioned between the window (120) and the adhesive layer (140) to bond them, while also preventing slurry from penetrating and leaking into the interior and bottom of the polishing pad during the polishing process.

[0029] Meanwhile, as previously explained, in order to insert the window (120) into the first perforated hole (112) of the polishing layer (110) without damage, the area of ​​the window (120) must be made slightly smaller than the area of ​​the first perforated hole (112). Accordingly, a small gap is inevitable between the wall of the first perforated hole (112) and the window (120). Therefore, for the purpose of more fundamentally preventing the penetration and leakage of slurry, the sealing adhesive member (150) can also be formed in the gap space formed between the wall of the first perforated hole (112) and the window (120). In this case, the sealing adhesive member (150) can be formed in a right-angle shape by continuously extending from the space formed between the wall of the first perforated hole (112) and the window (120) to the space between the window (120) and the adhesive layer (140), as shown in FIG. 2.

[0030] The sealing adhesive member (150) comprises a cured liquid adhesive, for example, the liquid adhesive may comprise one or more selected from the group consisting of vinyl acetate-based compounds, polychloroprene-based compounds, polyurethane-based compounds, acrylate-based compounds such as cyanoacrylates, and epoxy-based compounds. Furthermore, the sealing adhesive member (150) is characterized by being provided without thermal melting.

[0031] Meanwhile, the polishing pad equipped with a window according to the present invention further includes a tape layer (160) that is attached to the lower surface of the lower support layer (130) as needed. The tape layer (160) is intended to adhesively fix the polishing pad to the platen, and can be used without special limitations as long as it can adhesively fix the polishing pad and the platen to each other, such as double-sided adhesive tape.

[0032] Next, a method for manufacturing a polishing pad equipped with a window according to the present invention will be described. FIG. 3 is an image showing the manufacturing process of a polishing pad equipped with a window according to one embodiment of the present invention in sequence. Referring to FIG. 3, a method for manufacturing a polishing pad equipped with the window comprises: a) forming a first perforated hole (112) penetrating in the thickness direction at one end of a polishing member (110); b) attaching a support member (130) to the lower surface of the polishing member (110) through a first adhesive (140) to form a structure in which a lower support layer (130), an adhesive layer (140), and a polishing layer (110) are sequentially stacked; c) perforating the portions of the lower support layer (130) and the adhesive layer (140) corresponding to the first perforated hole (112) of the polishing layer (110) with a width narrower than the first perforated hole (112) to form a second perforated hole (122) penetrating the first perforated hole (112) of the polishing layer (110); and d) a second on the upper surface of the adhesive layer (140) exposed to the outside of the first perforated hole (112). The method includes the step of applying an adhesive (150) and then inserting a window (120) into the first perforated hole (112), and the step of pressing the window (120) inserted into the first perforated hole (112) so that it is fixed through the second adhesive (150).

[0033] The process of forming a first perforated hole (112) in the polishing member (110) in step a) above and the process of forming a second perforated hole (122) in the lower support layer (130) and the adhesive layer (140) in step c) above may be performed using a press method with a cutting tool, but is not limited thereto. Meanwhile, the polishing member is the same as the polishing layer (110) described above, and it should be noted that the above terms were used considering that the layer is formed beforehand.

[0034] Step b) above is a step of attaching a support member (130) to the bottom surface of the polishing member (110) through the first adhesive (140). At this time, the first adhesive (140) may be separately heated and melted (90°C to 130°C) and then applied to one surface of the support member (130) and attached to the bottom surface of the polishing member (110), or the first adhesive (140) may be applied to one surface of the support member (130) and then heated and melted before being attached to the bottom surface of the polishing member (110). Meanwhile, the support member is identical to the lower support layer (130) described above, and it should be noted that the above terminology was used considering that the layer is formed beforehand.

[0035] The second adhesive is the same as the sealing adhesive member (150) described above, and therefore the second adhesive (150) is a liquid adhesive. In step d), the second adhesive (150) is applied only to the upper surface of the adhesive layer (140) exposed to the outside of the first perforated hole (112), but in order to more fundamentally prevent the penetration and leakage of the slurry, the second adhesive (150) may also be applied to the wall surface of the first perforated hole (112). And, the compression in step e) may be performed under temperature conditions of 10°C to 70°C, preferably 10°C to 40°C. In this way, the present invention completely eliminates the heat fusion method when attaching the window (120) to the polishing pad (i.e., the second adhesive is not heated or melted in steps d) to e), and accordingly, compared to the conventional heat fusion method or vibration fusion method for attaching the window, the problem of dimensional deformation of the polishing pad (specifically, the polishing layer) can be prevented or minimized.

[0036] Meanwhile, the method for manufacturing a polishing pad equipped with a window according to the present invention further includes the step of attaching a tape (160) to the bottom surface of a support member (130) (i.e., the surface where the first adhesive is not applied) as needed. This may be performed at any step of the manufacturing method, but it may be preferable for convenience to attach the tape (160) before step c) (i.e., the step of forming the second perforated hole) is performed.

[0037] The present invention will be explained in more detail below through specific embodiments. The following embodiments are intended to illustrate the present invention, and the present invention is not limited by the following embodiments.

[0038] [Example 1] Manufacturing of a polishing pad equipped with a window

[0039] First, a first perforated hole (planar shape: rectangular, planar area: 20 mm × 60 mm) penetrating in the thickness direction was formed at one end of a polishing member (thickness: 2 mm) made of a polyurethane-based foam, and then a support member (non-woven fabric impregnated with polyurethane resin, thickness: 0.8 mm) was attached to the bottom surface of the polishing member using a first adhesive (polyurethane-based resin) to manufacture a structure in which a lower support layer, an adhesive layer, and a polishing layer were sequentially laminated (at this time, the first adhesive was melted at a temperature of 110 ℃ to attach the polishing member and the support member).

[0040] Next, the lower support layer and adhesive layer portions in the area corresponding to the first perforated hole of the polishing layer were perforated with a width narrower than the first perforated hole to form a second perforated hole (planar shape: rectangular, planar area: 13 mm × 50 mm) that penetrates through the first perforated hole of the polishing layer.

[0041] Next, a second adhesive (cyanoacrylic resin) was applied to the upper surface of the adhesive layer exposed to the outside of the first perforated hole, and a window (non-foamed polyurethane material) was inserted into the first perforated hole. Finally, the window inserted into the first perforated hole was compressed under a temperature condition of 30°C so that it was fixed through the second adhesive, thereby manufacturing a polishing pad equipped with a window.

[0042] [Comparative Example 1] Manufacturing of a polishing pad equipped with a window

[0043] A polishing pad with a window was manufactured by performing the same procedure as in Example 1 above, except that the window was attached with the first adhesive without using the second adhesive, and the first adhesive was melted at a temperature of 110°C to attach the window (additional melting was performed separately from the melting when manufacturing the laminated structure).

[0044] [Experimental Example 1] Evaluation of the degree of dimensional deformation of the grinding pad

[0045] The dimensions of the polishing layer of the polishing pad manufactured in Example 1 above and the dimensions of the polishing layer of the polishing pad manufactured in Comparative Example 1 above were compared and contrasted, and the extent of deformation compared to the dimensions before mounting the window was measured, and the results are shown in Table 1 below.

[0046] Example 1 Comparative Example 1 Before installing the window After installing Windows Before installing the window After installing Windows Grinding layer dimensions (window mounting part) 2.20 mm 2.20 mm 2.20 mm 2.24 mm

[0047] As a result of measurement, as shown in Table 1 above, it was confirmed that the polishing pad (polishing layer) of Example 1, in which a window was attached without heat fusion, had the same dimensions as before the window was attached, indicating that there was no dimensional deformation of the polishing pad. On the other hand, the polishing pad (polishing layer) of Comparative Example 1, in which a window was attached through heat fusion, was elongated compared to the dimensions before the window was attached, confirming that expansion due to heat fusion occurred.

[0048] [Experimental Example 2] Evaluation of leakage in abrasive slurry

[0049] A semiconductor wafer was placed in contact with the surface of the polishing pad prepared in Example 1 and Comparative Example 1, respectively, and a CMP slurry was injected thereon, after which the polishing pad was rotated, and at the same time, whether the slurry leaked to the bottom of the polishing pad was observed.

[0050] As a result of observation, when the polishing pad of Example 1, in which a sealing adhesive member (second adhesive) is located between the adhesive layer and the window, was used, no leakage of slurry to the bottom of the polishing pad occurred at all. On the other hand, when the polishing pad of Comparative Example 1, in which the adhesive layer and the window are attached without a sealing adhesive member (second adhesive), was used, it was confirmed that slurry leaked to the bottom of the polishing pad. Explanation of the symbols

[0051] 10, 110: Abrasive layer 112: 1st Perforation Hole 20, 120: Windows 22, 122: Second piercing hole 30, 130: Lower support layer 40, 140: Adhesive layer 150: Sealing adhesive member 160: Tape layer

Claims

Claim 1 A polishing pad equipped with a window, comprising: a polishing layer having a first perforated hole formed in the thickness direction; a window inserted and fixed in the first perforated hole of the polishing layer; a lower support layer located below the polishing layer and the window, wherein a second perforated hole for irradiating an optical beam is formed on the lower side of the window with a width narrower than that of the first perforated hole or the window; an adhesive layer that mediates the bonding of the polishing layer and the lower support layer, has the same area as the lower support layer, partially overlaps with the edge of the window, but does not come into contact with it; a gap formed between the wall of the first perforated hole and the window, and a sealing adhesive member located between the window and the adhesive layer; wherein the sealing adhesive member is continuously connected from the gap formed between the wall of the first perforated hole and the window to the space between the window and the adhesive layer, forming a right-angle shape. Claim 2 delete Claim 3 delete Claim 4 A polishing pad equipped with a window, wherein, in claim 1, the sealing adhesive member comprises a cured liquid adhesive. Claim 5 A polishing pad equipped with a window according to claim 4, characterized in that the liquid adhesive comprises one or more selected from the group consisting of vinyl acetate-based compounds, polychloroprene-based compounds, polyurethane-based compounds, acrylate-based compounds, and epoxy-based compounds. Claim 6 A polishing pad equipped with a window, wherein, in claim 1, the sealing adhesive member is provided without thermal melting. Claim 7 a) forming a first perforated hole penetrating in the thickness direction at one end of a polishing member; b) attaching a support member to the bottom surface of the polishing member using a first adhesive to form a structure in which a lower support layer, an adhesive layer, and a polishing layer are sequentially laminated; c) perforating the portions of the lower support layer and the adhesive layer in the area corresponding to the first perforated hole of the polishing layer with a width narrower than the first perforated hole to form a second perforated hole penetrating the first perforated hole of the polishing layer; d) applying a second adhesive to the top surface of the adhesive layer exposed to the outside of the first perforated hole and to the wall surface of the first perforated hole, and then inserting a window into the first perforated hole; and e) a step of compressing the window inserted into the first perforated hole so as to be fixed through the second adhesive; wherein the applied second adhesive is continuously extended from the space formed between the wall of the first perforated hole and the window to the space between the window and the adhesive layer to form a right angle shape. Claim 8 delete Claim 9 A method for manufacturing a polishing pad equipped with a window according to claim 7, characterized in that the second adhesive is not heated and melted in steps d) to e). Claim 10 A method for manufacturing a polishing pad equipped with a window according to claim 7, wherein the second adhesive comprises one or more selected from the group consisting of vinyl acetate-based compounds, polychloroprene-based compounds, polyurethane-based compounds, acrylate-based compounds, and epoxy-based compounds.

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