Input sensing part and display device including the same

Abstract

The display device includes a display panel and an input sensing unit disposed on the display panel, wherein an active area and an inactive area surrounding the active area are defined, and the input sensing unit includes a plurality of sensing electrodes disposed in the active area, a plurality of sensing wires connected to the sensing electrodes and disposed in the inactive area, and a guard wire, a ground wire, and an electromagnetic attenuation wire disposed in the inactive area spaced apart from the sensing wires, and the guard wire, the ground wire, and the electromagnetic attenuation wire may be disposed outside the sensing wires.

Description

Technology Field

[0001] The present invention relates to an input sensing unit and a display device including the same. Background Technology

[0002] Generally, electronic devices that provide video to users, such as smartphones, digital cameras, laptop computers, navigation systems, and smart televisions, include a display device for displaying the video. The display device generates video and provides the generated video to the user through a display screen.

[0003] The display device includes a display panel that generates an image and an input sensing unit disposed on the display panel for sensing external input. The input sensing unit is disposed on the display panel and senses a user's touch as an external input. The input sensing unit includes a plurality of sensing electrodes for sensing external input and sensing wiring connected to the sensing electrodes. The sensing electrodes are disposed in an active area, and the sensing wiring is disposed in an inactive area surrounding the active area.

[0004] A driving signal is applied to the sensing electrodes, and a change in the capacitance of the sensing electrodes is output as a sensing signal. The driving signal is applied to the sensing electrodes through the sensing wiring. When a driving signal having a predetermined frequency is applied to the sensing electrodes, electromagnetic waves corresponding to the driving signal may be radiated as unnecessary electromagnetic signals.

[0005] These electromagnetic signals act as noise for other devices, potentially interfering with their operation. This phenomenon can be defined as electromagnetic interference (EMI). The development of technologies capable of reducing electromagnetic interference is required. The problem to be solved

[0006] The objective of the present invention is to provide an input sensing unit capable of reducing electromagnetic interference and a display device including the same. means of solving the problem

[0007] A display device according to an embodiment of the present invention comprises a display panel and an input sensing unit disposed on the display panel, wherein an active area and an inactive area surrounding the active area are defined. The input sensing unit comprises a plurality of sensing electrodes disposed in the active area, a plurality of sensing wires connected to the sensing electrodes and disposed in the inactive area, and a guard wire, a ground wire, and an electromagnetic attenuation wire disposed in the inactive area spaced apart from the sensing wires. The guard wire, the ground wire, and the electromagnetic attenuation wire may be disposed further outward than the sensing wires.

[0008] An input sensing unit according to an embodiment of the present invention comprises a plurality of sensing electrodes disposed in an active region, a plurality of sensing wires connected to the sensing electrodes and disposed in an inactive region surrounding the active region, and a guard wire, a ground wire, and an electromagnetic attenuation wire disposed in the inactive region spaced apart from the sensing wires, wherein the electromagnetic attenuation wire is disposed between the guard wire and the ground wire, and the guard wire may be adjacent to the sensing wires than the electromagnetic attenuation wire.

[0009] A display device according to an embodiment of the present invention comprises a substrate, an encapsulation substrate disposed on the substrate, a display element layer disposed between the substrate and the encapsulation substrate, and a sealing layer disposed between the substrate and the encapsulation substrate to seal the display element layer, a display panel, and an input sensing unit disposed on the display panel, wherein the input sensing unit comprises a plurality of sensing electrodes, a plurality of sensing wires connected to the sensing electrodes, and a guard wire, a ground wire, and an electromagnetic attenuation wire spaced apart from the sensing wires, and when viewed in a planar view, the guard wire, the ground wire, and the electromagnetic attenuation wire may overlap the sealing layer. Effects of the invention

[0010] According to an embodiment of the present invention, the input sensing unit includes a guard wire, a ground wire, and an electromagnetic attenuation wire arranged to surround an active area, and the electromagnetic attenuation wire may be arranged between the guard wire and the ground wire. An offset signal having a large amplitude and having an opposite phase to the driving signal applied to the sensing electrodes may be applied to the electromagnetic attenuation wire. Accordingly, the electromagnetic signal generated in the input sensing unit may be attenuated by the offset signal. Brief explanation of the drawing

[0011] FIG. 1 is a drawing showing the interior of a vehicle in which a display device according to an embodiment of the present invention is installed. Figure 2 is a plan view of the display device shown in Figure 1. FIG. 3 is a diagram illustrating an exemplary cross-section of the display device shown in FIG. 2. FIG. 4 is a drawing exemplarily illustrating a cross-section of the display panel shown in FIG. 3. FIG. 5 is a drawing exemplarily illustrating a cross-section of a display panel according to another embodiment of the present invention. Figure 6 is a plan view of the display panel shown in Figure 3. FIG. 7 is a diagram illustrating, in an exemplary manner, the cross-sectional configuration of the pixels of the display panel and the input sensing unit shown in FIG. 4. FIG. 8 is a diagram illustrating the cross-sectional configuration of a pixel and an input sensing unit according to another embodiment of the present invention. Figure 9 is a plan view of the input sensing unit illustrated in Figure 3. Figure 10 is an enlarged view of the area (AA1) shown in Figure 9. Figure 11 is a cross-sectional view of the line I-I' shown in Figure 10. FIG. 12 is a diagram illustrating, by way of example, the configuration of the first and second sensing units, connection pattern, and extension pattern of the input sensing unit illustrated in FIG. 5. FIG. 13 is a cross-sectional view of line II-II shown in FIG. 12. Figure 14 is a cross-sectional view of the line A-A' shown in Figure 9. FIGS. 15 and FIGS. 16 are exemplary drawings illustrating a sensing control unit connected to the electromagnetic attenuation wiring shown in FIGS. 9. FIG. 17a is a diagram illustrating, exemplarily, the timing of a driving signal applied to the first sensing electrodes shown in FIG. 9 and a cancellation signal applied to the electromagnetic attenuation wiring shown in FIG. 9. FIGS. 17b to 17f are drawings illustrating the timings of driving signals and cancellation signals according to various embodiments of the present invention. FIGS. 18a and FIGS. 18b are circuit diagrams for exemplarily illustrating the cancellation operation of electromagnetic signals by the cancellation signal shown in FIG. 17a. FIG. 19 is a plan view of an input sensing unit according to another embodiment of the present invention. FIG. 20 is a cross-sectional view of the line A1-A1' shown in FIG. 19. FIGS. 21 to 24 are drawings showing the configurations of input sensing units according to various embodiments of the present invention. Specific details for implementing the invention

[0012] In this specification, where a component (or region, layer, part, etc.) is described as being "on," "connected," or "combined" with another component, it means that it may be directly placed / connected / combined with the other component, or that a third component may be placed between them.

[0013] Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of the components are exaggerated for the effective illustration of the technical content.

[0014] "And / or" includes all one or more combinations that the associated configurations can define.

[0015] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0016] Additionally, terms such as "below," "lower side," "above," and "upper side" are used to describe the relationships between the components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0017] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined herein.

[0018] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0019] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0020] FIG. 1 is a drawing showing the interior of a vehicle in which a display device according to an embodiment of the present invention is arranged. FIG. 2 is a plan view of the display device shown in FIG. 1.

[0021] Referring to FIG. 1, a display device (DD) may be placed inside a vehicle (AM). The display device (DD) may be placed inside the vehicle (AM) and may provide various information to a driver (US) (hereinafter referred to as the user). The display device (DD) may provide information such as speed, weather, or maps to the user (US). The display device (DD) may be defined as a touch display that operates according to the touch input of the user (US).

[0022] Referring to FIGS. 1 and 2, a display device (DD) according to an embodiment of the present invention may have a rectangular shape having short sides extending in a first direction (DR1) and long sides extending in a second direction (DR2) intersecting the first direction (DR1). However, it is not limited thereto, and the display device (DD) may have various shapes such as a circle or a polygon.

[0023] Hereinafter, the direction that intersects substantially perpendicularly with the plane defined by the first direction (DR1) and the second direction (DR2) is defined as the third direction (DR3). Additionally, in this specification, the meaning of "when viewed on a plane" is defined as the state viewed from the third direction (DR3).

[0024] The upper surface of a display device (DD) that provides images to a user (US) can be defined as a display surface (DS) and may have a plane defined by a first direction (DR1) and a second direction (DR2). Images (IM) generated by the display device (DD) can be provided to the user (US) through the display surface (DS). The display device (DD) can sense the touch of the user (US).

[0025] The display surface (DS) may include a display area (DA) and a non-display area (NDA) surrounding the display area (DA). The display area (DA) may display an image, and the non-display area (NDA) may not display an image. The non-display area (NDA) may surround the display area (DA) and define a border of a display device (DD) that is printed in a predetermined color.

[0026] For example, a vehicle display device (DD) is illustrated, but embodiments of the present invention are not limited thereto. For example, a display device (DD) according to an embodiment of the present invention may be used in electronic devices such as smartphones, digital cameras, laptop computers, monitors, and smart televisions that provide images to a user.

[0027] FIG. 3 is a diagram illustrating an exemplary cross-section of the display device shown in FIG. 2.

[0028] For example, FIG. 3 shows a cross-section of a display device (DD) viewed from a first direction (DR1).

[0029] Referring to FIG. 3, the display device (DD) may include a display panel (DP), an input sensing unit (ISP), an anti-reflective layer (RPL), a window (WIN), a panel protection film (PPF), and first to third adhesive layers (AL1 to AL3).

[0030] The display panel (DP) may be a flexible display panel. The display panel (DP) according to one embodiment of the present invention may be a light-emitting display panel, but is not particularly limited. For example, the display panel (DP) may be an organic light-emitting display panel or an inorganic light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of the inorganic light-emitting display panel may include quantum dots and quantum rods, etc. Hereinafter, the display panel (DP) is described as an organic light-emitting display panel.

[0031] The input sensing unit (ISP) may be placed on the display panel (DP). The input sensing unit (ISP) may include a plurality of sensing units for detecting external inputs using a capacitive method. The input sensing unit (ISP) may be manufactured directly on the display panel (DP) during the manufacturing of the display device (DD). However, it is not limited thereto, and the input sensing unit (ISP) may be manufactured as a separate panel from the display panel (DP) and attached to the display panel (DP) by an adhesive layer.

[0032] An anti-reflective layer (RPL) may be placed on an input sensing unit (ISP). The anti-reflective layer (RPL) may be defined as an external light anti-reflective film. The anti-reflective layer (RPL) can reduce the reflectivity of external light incident from above the display device (DD) toward the display panel (DP).

[0033] When external light traveling toward the display panel (DP) is reflected from the display panel (DP) and provided back to an external user, the user may perceive the external light as if through a mirror. To prevent this phenomenon, for example, the anti-reflection layer (RPL) may include a plurality of color filters that display the same color as the pixels of the display panel (DP).

[0034] Color filters can filter external light to the same color as the pixels. In this case, external light may not be visible to the user. However, not limited thereto, the anti-reflective layer (RPL) may include a phase retarder and / or a polarizer to reduce the reflectivity of external light.

[0035] The window (WIN) can be placed on the anti-reflective layer (RPL). The window (WIN) can protect the display panel (DP), the input sensing unit (ISP), and the anti-reflective layer (RPL) from external scratches and impacts.

[0036] A panel protection film (PPF) may be placed under a display panel (DP). The panel protection film (PPF) may protect the lower part of the display panel (DP). The panel protection film (PPF) may include a flexible plastic material such as polyethyleneterephthalate (PET).

[0037] The first adhesive layer (AL1) can be placed between the display panel (DP) and the panel protection film (PPF). The display panel (DP) and the panel protection film (PPF) can be bonded together by the first adhesive layer (AL1).

[0038] The second adhesive layer (AL2) can be placed between the anti-reflection layer (RPL) and the input sensing unit (ISP). The anti-reflection layer (RPL) and the input sensing unit (ISP) can be bonded together by the second adhesive layer (AL2).

[0039] The third adhesive layer (AL3) can be placed between the window (WIN) and the anti-reflective layer (RPL). The window (WIN) and the anti-reflective layer (RPL) can be bonded together by the third adhesive layer (AL3).

[0040] FIG. 4 is a drawing exemplarily illustrating a cross-section of the display panel shown in FIG. 3.

[0041] For example, FIG. 4 shows a cross-section of a display panel (DP) viewed from a first direction (DR1), and an input sensing unit (ISP) is shown together with the display panel (DP).

[0042] Referring to FIG. 4, the display panel (DP) may include a substrate (SUB), a circuit element layer (DP-CL), a display element layer (DP-OLED), an encapsulation substrate (EN-SB), a sealing layer (SAL), and a filler (FL). The circuit element layer (DP-CL) may be disposed on the substrate (SUB). The display element layer (DP-OLED) may be disposed on the circuit element layer (DP-CL).

[0043] Multiple pixels may be disposed in the circuit element layer (DP-CL) and the display element layer (DP-OLED). Each pixel may include a transistor disposed in the circuit element layer (DP-CL) and a light-emitting element disposed in the display element layer (DP-OLED) and connected to the transistor.

[0044] The substrate (SUB) may include a display area (DA) and a non-display area (NDA) around the display area (DA). A display element layer (DP-OLED) may be disposed on the display area (DA). An encapsulation substrate (EN-SB) may be disposed on the display element layer (DP-OLED). The substrate (SUB) and the encapsulation substrate (EN-SB) may be of a rigid type.

[0045] A sealing layer (SAL) may be disposed between the substrate (SUB) and the encapsulation substrate (EN-SB). The sealing layer (SAL) may be disposed on the non-display area (NDA). The sealing layer (SAL) may bond the substrate (SUB) and the encapsulation substrate (EN-SB). The display element layer (DP-OLED) may be sealed between the substrate (SUB) and the encapsulation substrate (EN-SB) by the sealing layer (SAL). The sealing layer (SAL) may include a photocurable material.

[0046] The filler (FL) may be placed between the substrate (SUB) and the encapsulating substrate (EN-SB). The filler (FL) may be placed in the space sealed by the sealing layer (SAL) between the substrate (SUB) and the encapsulating substrate (EN-SB). The filler (FL) may comprise a thermosetting material.

[0047] The input sensing unit (ISP) can be placed directly on the display panel (DP). For example, the input sensing unit (ISP) can be placed directly on the encapsulation substrate (EN-SB).

[0048] FIG. 5 is a drawing exemplarily illustrating a cross-section of a display panel according to another embodiment of the present invention.

[0049] For example, in FIG. 5, an input sensing unit (ISP') is shown together with a display panel (DP').

[0050] Referring to FIG. 5, the display panel (DP') may include a circuit element layer (DP-CL) disposed on a substrate (SUB), a display element layer (DP-OLED) disposed on the circuit element layer (DP-CL), and a thin film encapsulation layer (TFE) disposed on the display element layer (DP-OLED). The arrangement structure of the circuit element layer (DP-CL) and the display element layer (DP-OLED) may be the same as that of the circuit element layer (DP-CL) and the display element layer (DP-OLED) shown in FIG. 4.

[0051] A thin film encapsulation layer (TFE) can be disposed on a circuit element layer (DP-CL) to cover a display element layer (DP-OLED). The thin film encapsulation layer (TFE) may include inorganic layers and an organic layer between the inorganic layers. The inorganic layers can protect the pixels from moisture / oxygen. The organic layer can protect the pixels from foreign substances such as dust particles.

[0052] The input sensing unit (ISP') can be placed directly on the display panel (DP'). For example, the input sensing unit (ISP') can be placed directly on the thin film encapsulation layer (TFE).

[0053] Figure 6 is a plan view of the display panel shown in Figure 3.

[0054] Referring to FIG. 6, the display device (DD) may include a display panel (DP), a scan driver (SDV), a plurality of data drivers (DDV), a plurality of flexible circuit boards (FPCB), an emission driver (EDV), and a printed circuit board (PCB).

[0055] A display panel (DP) may include a display area (DA) and a non-display area (NDA) surrounding the display area (DA). The display area (DA) and the non-display area (NDA) of the display panel (DP) may correspond to the display area (DA) and the non-display area (NDA) shown in FIG. 2, respectively. The display panel (DP) may have a rectangular shape having long sides extending in a second direction (DR2) and short sides extending in a first direction (DR1), but the shape of the display panel (DP) is not limited thereto.

[0056] The display panel (DP) may include a plurality of pixels (PX), a plurality of scan lines (SL1~SLm), a plurality of data lines (DL1~DLn), and a plurality of light-emitting lines (EL1~ELm). m and n are natural numbers.

[0057] Pixels (PX) can be placed in a display area (DA). A scanning driver (SDV) and an emitting driver (EDV) can be placed in a non-display area (NDA) adjacent to the short sides of the display panel (DP), respectively.

[0058] Data drivers (DDVs) may be positioned adjacent to the lower side of the display panel (DP), defined by one of the long sides of the display panel (DP) when viewed in a planar view. A printed circuit board (PCB) may be positioned adjacent to the lower side of the display panel (DP) when viewed in a planar view. Flexible circuit boards (FPCBs) may be connected to the lower side of the display panel (DP) and to the printed circuit board (PCB). Data drivers (DDVs) may be fabricated in the form of integrated circuit chips and mounted on each of the flexible circuit boards (FPCBs).

[0059] Scan lines (SL1~SLm) can be extended in a second direction (DR2) and connected to pixels (PX) and a scanning driver (SDV). Light emission lines (EL1~ELm) can be extended in a second direction (DR2) and connected to pixels (PX) and a light emission driver (EDV).

[0060] Data lines (DL1~DLn) can be extended in a first direction (DR1) and connected to pixels (PX) and data drivers (DDV). For example, two data lines (DL1, DLn) connected to data drivers (DDV) positioned at the far left and far right are shown, but substantially, multiple data lines can be connected to each of the data drivers (DDV).

[0061] Although not illustrated, the display device (DD) may further include a timing controller for controlling the operation of the scanning driver (SDV), data drivers (DDV), and light-emitting driver (EDV). The timing controller may be fabricated in the form of an integrated circuit chip and mounted on a printed circuit board (PCB). The timing controller may be connected to the data drivers (DDV), scanning driver (SDV), and light-emitting driver (EDV) through the printed circuit board (PCB) and a flexible circuit board (FPCB).

[0062] The scanning driver (SDV) generates multiple scanning signals, and the scanning signals can be applied to pixels (PX) through scanning lines (SL1~SLm). The data drivers (DDV) generate multiple data voltages, and the data voltages can be applied to pixels (PX) through data lines (DL1~DLn). The light emission driver (EDV) generates multiple light emission signals, and the light emission signals can be applied to pixels (PX) through light emission lines (EL1~ELm).

[0063] Pixels (PX) can receive data voltages in response to scanning signals. Pixels (PX) can display an image by emitting light of a brightness corresponding to the data voltages in response to light emission signals. The light emission time of the pixels (PX) can be controlled by the light emission signals.

[0064] FIG. 7 is a diagram illustrating, in an exemplary manner, the cross-sectional configuration of the pixels of the display panel and the input sensing unit shown in FIG. 4.

[0065] The pixel (PX) shown in Fig. 7 may be one of the pixels (PX) shown in Fig. 6.

[0066] Referring to FIG. 7, a pixel (PX) may include a transistor (TR) and a light-emitting element (OLED). The light-emitting element (OLED) may include a first electrode (AE) (or anode), a second electrode (CE) (or cathode), a hole control layer (HCL), an electronic control layer (ECL), and a light-emitting layer (EL).

[0067] A transistor (TR) and a light-emitting element (OLED) may be disposed on a substrate (SUB). Although one transistor (TR) is illustrated as an example, substantially, the pixel (PX) may include a plurality of transistors and at least one capacitor for driving the light-emitting element (OLED).

[0068] The display area (DA) may include a light-emitting area (LA) corresponding to each pixel (PX) and a non-light-emitting area (NLA) surrounding the light-emitting area (LA). A light-emitting element (OLED) may be placed in the light-emitting area (LA).

[0069] A buffer layer (BFL) is disposed on a substrate (SUB), and the buffer layer (BFL) may be an inorganic layer. A semiconductor pattern may be disposed on the buffer layer (BFL). The semiconductor pattern may include polysilicon, amorphous silicon, or a metal oxide.

[0070] The semiconductor pattern can be doped with an N-type dopant or a P-type dopant. The semiconductor pattern may include a high-doping region and a low-doping region. The conductivity of the high-doping region is greater than that of the low-doping region and can substantially serve as the source and drain electrodes of the transistor (TR). The low-doping region can substantially correspond to the active (or channel) of the transistor.

[0071] The source (S), active (A), and drain (D) of the transistor (TR) can be formed from a semiconductor pattern. A first insulating layer (INS1) can be disposed on the semiconductor pattern. The gate (G) of the transistor (TR) can be disposed on the first insulating layer (INS1). A second insulating layer (INS2) can be disposed on the gate (G). A third insulating layer (INS3) can be disposed on the second insulating layer (INS2).

[0072] The connecting electrode (CNE) may include a first connecting electrode (CNE1) and a second connecting electrode (CNE2) for connecting a transistor (TR) and a light-emitting element (OLED). The first connecting electrode (CNE1) is disposed on a third insulating layer (INS3) and may be connected to a drain (D) through a first contact hole (CH1) defined in the first to third insulating layers (INS1~INS3).

[0073] A fourth insulating layer (INS4) may be disposed on a first connecting electrode (CNE1). A fifth insulating layer (INS5) may be disposed on the fourth insulating layer (INS4). A second connecting electrode (CNE2) may be disposed on the fifth insulating layer (INS5). The second connecting electrode (CNE2) may be connected to the first connecting electrode (CNE1) through a second contact hole (CH2) defined in the fourth and fifth insulating layers (INS4, INS5).

[0074] A sixth insulating layer (INS6) may be disposed on the second connecting electrode (CNE2). The layers from the buffer layer (BFL) to the sixth insulating layer (INS6) may be defined as circuit element layers (DP-CL). The first insulating layer (INS1) to the sixth insulating layer (INS6) may be inorganic layers or organic layers.

[0075] A first electrode (AE) may be disposed on the sixth insulating layer (INS6). The first electrode (AE) may be connected to a second connecting electrode (CNE2) through a third contact hole (CH3) defined in the sixth insulating layer (INS6). A pixel defining film (PDL) may be disposed on the first electrode (AE) and the sixth insulating layer (INS6), the pixel defining film having an opening (PX_OP) defined to expose a predetermined portion of the first electrode (AE).

[0076] A hole control layer (HCL) may be disposed on a first electrode (AE) and a pixel definition film (PDL). The hole control layer (HCL) may include a hole transport layer and a hole injection layer.

[0077] The emitting layer (EL) may be disposed on the hole control layer (HCL). The emitting layer (EL) may be disposed in the region corresponding to the aperture (PX_OP). The emitting layer (EL) may include organic and / or inorganic materials. The emitting layer (EL) may generate any one of red, green, and blue light.

[0078] An electronic control layer (ECL) may be disposed on an emitting layer (EL) and a hole control layer (HCL). The electronic control layer (ECL) may include an electron transport layer and an electron injection layer. The hole control layer (HCL) and the electronic control layer (ECL) may be disposed in common in the emitting region (LA) and the non-emitting region (NLA).

[0079] The second electrode (CE) may be placed on the electronic control layer (ECL). The second electrode (CE) may be placed in common across the pixels (PX). For example, the second electrode (CE) may be placed as a through electrode across the entire display area (DA). The layer on which the light-emitting element (OLED) is placed may be defined as a display element layer (DP-OLED).

[0080] A first voltage can be applied to a first electrode (AE) through a transistor (TR), and a second voltage can be applied to a second electrode (CE). Holes and electrons injected into the light-emitting layer (EL) combine to form excitons, and as the excitons transition to a ground state, the light-emitting element (OLED) can emit light.

[0081] The filler material (FL) can be placed on the second electrode (CE) to cover the pixel (PX). An encapsulation substrate (EN-SB) can be placed on the filler material (FL). An input sensing unit (ISP) can be placed on the encapsulation substrate (EN-SB).

[0082] An insulating layer (IOL) may be disposed on an encapsulation substrate (EN-SB). The insulating layer (IOL) may include an inorganic insulating layer. At least one insulating layer (IOL) may be provided on the encapsulation substrate (EN-SB). For example, two inorganic insulating layers (IOL) may be sequentially stacked on the encapsulation substrate (EN-SB).

[0083] The input sensing unit (ISP) may include a first conductive layer (CPT1) and a second conductive layer (CPT2). The first and second conductive layers (CPT1, CPT2) may include a transparent conductive material. For example, the first and second conductive layers (CPT1, CPT2) may include a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO).

[0084] A first conductive layer (CPT1) may be disposed on an insulating layer (IOL). A first insulating layer (TC-IL1) may be disposed on the first conductive layer (CPT1). The first insulating layer (TC-IL1) may be disposed on the insulating layer (IOL) to cover the first conductive layer (CPT1). The first insulating layer (TC-IL1) may include an inorganic insulating layer or an organic insulating layer.

[0085] A second conductive layer (CPT2) may be disposed on a first insulating layer (TC-IL1). Sensing electrodes of an input sensing unit (ISP) may be formed by the first and second conductive layers (CPT1, CPT2), and this configuration will be described in detail below. When viewed in a planar view, the first and second conductive layers (CPT1, CPT2) may overlap with the light-emitting region (LA). Light generated from the light-emitting element (OLED) may pass through the transparent first and second conductive layers (CPT1, CPT2) and proceed upward.

[0086] A second insulating layer (TC-IL2) may be disposed on a second conductive layer (CPT2). The second insulating layer (TC-IL2) may be disposed on a first insulating layer (TC-IL1) to cover the second conductive layer (CPT2). The second insulating layer (TC-IL2) may include an organic insulating layer.

[0087] When a pixel (PX) is driven, signals applied to the wiring connected to the transistor (TR) may affect signals applied to the first and second conductive layers (CPT1, CPT2). Noise may be generated in the input sensing unit (ISP) due to such signal interference. However, in an embodiment of the present invention, a second electrode (CE) receiving a common voltage is placed over the entire display area (DA) to block such signal interference. As a result, noise in the input sensing unit (ISP) can be reduced.

[0088] FIG. 8 is a diagram illustrating the cross-sectional configuration of a pixel and an input sensing unit according to another embodiment of the present invention.

[0089] The pixel (PX) shown in FIG. 8 may be a pixel of the display panel (DP') shown in FIG. 5. The configuration of the pixel (PX) shown in FIG. 8 may substantially be the same as the pixel (PX) shown in FIG. 7. Hereinafter, the configuration of the input sensing unit (ISP') shown in FIG. 8 will be described with a focus on the configuration different from the input sensing unit (ISP) shown in FIG. 7.

[0090] Referring to FIG. 8, an insulating layer (IOL) may be disposed on a thin film encapsulation layer (TFE). An input sensing unit (ISP') may include a first conductive layer (CPT1) and a second conductive layer (CPT2). The first conductive layer (CPT1) may be disposed on the insulating layer (IOL). When viewed in a planar view, the first conductive layer (CPT1) may overlap the non-emitting region (NLA) without overlapping the light-emitting region (LA). The first insulating layer (TC-IL1) may be disposed on the insulating layer (IOL) to cover the first conductive layer (CPT1).

[0091] A second conductive layer (CPT2) may be disposed on a first insulating layer (TC-IL1). When viewed in a planar view, the second conductive layer (CPT2) may overlap with a non-emitting region (NLA) without overlapping with a light-emitting region (LA). A portion of the second conductive layer (CPT2) may be connected to the first conductive layer (CPT1) through a contact hole (TC-CH) defined in the first insulating layer (TC-IL1). Sensing electrodes of an input sensing unit (ISP') may be formed by the first and second conductive layers (CPT1, CPT2), and this configuration will be described in detail below. The second insulating layer (TC-IL2) may be disposed on the first insulating layer (TC-IL1) to cover the second conductive layer (CPT2).

[0092] The first and second conductive layers (CPT1, CPT2) may include a metallic material. For example, the first and second conductive layers (CPT1, CPT2) may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. Since the first and second conductive layers (CPT1, CPT2) capable of reflecting light are not placed in the light-emitting region (LA), light generated in the light-emitting element (OLED) can proceed upward through the light-emitting region (LA). The first and second conductive layers (CPT1, CPT2) may have a mesh shape, and this configuration will be described in detail below.

[0093] Figure 9 is a plan view of the input sensing unit illustrated in Figure 3.

[0094] Referring to FIG. 9, the input sensing unit (ISP) may include a plurality of sensing electrodes (SE1, SE2), a plurality of sensing wires (TXL, RXL), a guard wire (GRL), a ground wire (GNL), an electromagnetic attenuation wire (EML), a plurality of first pads (PD1), a plurality of second pads (PD2), and a plurality of third pads (PD3).

[0095] Sensing electrodes (SE1, SE2), sensing wires (TXL, RXL), guard wire (GRL), ground wire (GNL), electromagnetic attenuation wire (EML), and first, second, and third pads (PD1, PD2, PD3) can be placed on an encapsulation substrate (EN-SB).

[0096] When viewed in a planar view, the planar area of ​​the input sensing unit (ISP) may include an active area (AA) and an inactive area (NAA) surrounding the active area (AA). The inactive area (NAA) may surround the active area (AA). When viewed in a planar view, the active area (AA) may overlap with the display area (DA), and the inactive area (NAA) may overlap with the non-display area (NDA).

[0097] Sensing electrodes (SE1, SE2) may be placed in an active region (AA). First, second, and third pads (PD1, PD2, PD3) may be placed in an inactive region (NAA). The first, second, and third pads (PD1, PD2, PD3) may be placed in an inactive region (NAA) adjacent to the lower side of the active region (AA) when viewed in a plane (hereinafter referred to as the lower inactive region). The first, second, and third pads (PD1, PD2, PD3) may be placed on the left and right sides with respect to the center of the lower inactive region (NAA).

[0098] The first pads (PD1) may include a plurality of first-1 pads (PD1-1) and a plurality of first-2 pads (PD1-2). The second pads (PD2) may include a plurality of second-1 pads (PD2-1) and a plurality of second-2 pads (PD2-2). The third pads (PD3) may include a plurality of third-1 pads (PD3-1) and a plurality of third-2 pads (PD3-2).

[0099] The 1-1 pads (PD1-1), 2-1 pads (PD2-1), and 3-1 pads (PD3-1) may be positioned to the left of the center of the lower inactive area (NAA). The 1-2 pads (PD1-2), 2-2 pads (PD2-2), and 3-2 pads (PD3-2) may be positioned to the right of the center of the lower inactive area (NAA).

[0100] Based on the second direction (DR2), within the lower inactive area (NAA), the second-1 pads (PD2-1) may be positioned further outward than the first-1 pads (PD1-1), and the third-1 pads (PD3-1) may be positioned further outward than the second-1 pads (PD2-1). Thus, the second-1 pads (PD2-1) may be positioned between the first-1 pads (PD1-1) and the third-1 pads (PD3-1).

[0101] Based on the second direction (DR2), within the lower inactive area (NAA), the second-2 pads (PD2-2) may be positioned further outward than the first-2 pads (PD1-2), and the third-2 pads (PD3-2) may be positioned further outward than the second-2 pads (PD2-2). Thus, the second-2 pads (PD2-2) may be positioned between the first-2 pads (PD1-2) and the third-2 pads (PD3-2).

[0102] Sensing wires (TXL, RXL) are connected to sensing electrodes (SE1, SE2) and can be extended to an inactive area (NAA) to be connected to first and second pads (PD1, PD2). Although not illustrated, a sensing control unit for controlling an input sensing unit (ISP) can be connected to the first and second pads (PD1, PD2).

[0103] The sensing electrodes (SE1, SE2) may include a plurality of first sensing electrodes (SE1) arranged in a second direction (DR2) extending in a first direction (DR1), and a plurality of second sensing electrodes (SE2) arranged in a first direction (DR1) extending in a second direction (DR2). The second sensing electrodes (SE2) may be extended to intersect with the first sensing electrodes (SE1) while being insulated from each other.

[0104] The sensing wires (TXL, RXL) may include a plurality of first sensing wires (TXL) connected to first sensing electrodes (SE1) and a plurality of second sensing wires (RXL) connected to second sensing electrodes (SE2). The first sensing wires (TXL) may be connected to one end of the first sensing electrodes (SE1). The one end of the first sensing electrodes (SE1) may be adjacent to a lower inactive region (NAA). The second sensing wires (RXL) may be connected to both ends of the second sensing electrodes (SE2). The two ends of the second sensing electrodes (SE2) may be opposite each other in a second direction (DR2).

[0105] The first sensing wires (TXL) can be extended to the inactive area (NAA) and connected to the first pads (PD1). The first sensing wires (TXL) can be extended to the lower inactive area (NAA).

[0106] The second sensing wires (RXL) can be extended into an inactive area (NAA) and connected to the second pads (PD2). The second sensing wires (RXL) can be extended in the second direction (DR2) to the inactive area (NAA) and the lower inactive area (NAA) adjacent to both sides of the active area (AA) that are opposite to each other.

[0107] The first sensing wires (TXL) may include a plurality of first transmission wires (TXL1) and a plurality of second transmission wires (TXL2). The first transmission wires (TXL1) may be connected to some of the first sensing electrodes (SE1) and the first-1 pads (PD1-1). For example, the first transmission wires (TXL1) may be connected to one end of the first sensing electrodes (SE1) positioned to the left of the center of the active area (AA).

[0108] The second transmission wires (TXL2) can be connected to other first sensing electrodes (SE1) and first-second pads (PD1-2). For example, the second transmission wires (TXL2) can be connected to one end of the first sensing electrodes (SE1) positioned to the right of the center of the active area (AA).

[0109] The second sensing wires (RXL) may include a plurality of first receiving wires (RXL1) and a plurality of second receiving wires (RXL2). The first receiving wires (RXL1) may be connected to one end of the second sensing electrodes (SE2) and the second-1 pads (PD2-1). For example, the first receiving wires (RXL1) may be placed in an inactive area (NAA) (hereinafter referred to as the left inactive area) adjacent to the left of the active area (NAA) when viewed in a planar view, and one end of the second sensing electrodes (SE2) may be adjacent to the left inactive area (NAA).

[0110] The second receiving wires (RXL2) can be connected to the other ends of the second sensing electrodes (SE2) and the second-2 pads (PD2-2). For example, the second receiving wires (RXL2) are positioned in an inactive area (NAA) adjacent to the right of the active area (NAA) when viewed in a plane (hereinafter referred to as the right inactive area), and the other ends of the second sensing electrodes (SE2) can be adjacent to the right inactive area (NAA).

[0111] A driving signal can be applied to the first sensing electrodes (SE1) through the first sensing wires (TXL). A change in capacitance formed between the first and second sensing electrodes (SE1, SE2) can be output as a sensing signal through the second sensing wires (RXL).

[0112] Each of the first sensing electrodes (SE1) may include a plurality of first sensing units (SP1) arranged in a first direction (DR1) and a plurality of connection patterns (CP) connecting the first sensing units (SP1).

[0113] Each of the connection patterns (CP) can be positioned between two first sensing units (SP1) adjacent to each other in a first direction (DR1) to connect the two first sensing units (SP1). For example, an insulating layer (not shown) may be positioned between the connection patterns (CP) and the first sensing units (SP1), and the connection patterns (CP) may be connected to the first sensing units (SP1) through contact holes defined in the insulating layer. This configuration will be described in detail below with reference to FIGS. 10 and 11.

[0114] Each of the second sensing electrodes (SE2) may include a plurality of second sensing units (SP2) arranged in a second direction (DR2) and a plurality of extension patterns (EP) extending from the second sensing units (SP2). In each of the second sensing electrodes (SE2), the extension patterns (EP) may be formed integrally with the second sensing units (SP2). Each of the extension patterns (EP) may be positioned between two second sensing units (SP2) adjacent to each other in the second direction (DR2) and extend from the two second sensing units (SP2).

[0115] This configuration will be described in detail below with reference to FIGS. 10 and FIGS. 11. When viewed in a planar view, the extension patterns (EP) can be extended to intersect with the connection patterns (CP).

[0116] The first sensing units (SP1) and the second sensing units (SP2) may be spaced apart from each other without overlapping and may be arranged alternately. Capacitance may be formed by the first sensing units (SP1) and the second sensing units (SP2).

[0117] The first and second sensing units (SP1, SP2) and extension patterns (EP) may be placed on the same layer. The connection patterns (CP) may be placed on a different layer from the first and second sensing units (SP1, SP2) and extension patterns (EP).

[0118] Hereinafter, when viewed in a plane, the inactive region (NAA) adjacent to the upper side of the active region (AA) is referred to as the upper inactive region (NAA).

[0119] Guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be placed in an inactive area (NAA) spaced apart from the sensing wirings (TXL, RXL). Guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be extended to surround three sides of an active area (AA) having a rectangular shape. For example, guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be placed in a left inactive area (NAA), a right inactive area (NAA), and an upper inactive area (NAA).

[0120] The guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) can be connected to third pads (PD3) located in the lower inactive area (NAA) adjacent to the other side of the active area (AA).

[0121] The guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) are connected to the 3-1 pads (PD3-1) and can extend along the perimeter of the input sensing unit (ISP) in the left inactive area (NAA), upper inactive area (NAA), and right inactive area (NAA). The guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) can extend along the perimeter of the input sensing unit (ISP) and be connected to the 3-2 pads (PD3-2).

[0122] One end of the guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) can be connected to the 3-1 pads (PD3-1). The other end of the guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) can be connected to the 3-2 pads (PD3-2).

[0123] Guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be placed outside the sensing wirings (TXL, RXL) in the inactive area (NAA). For example, guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be placed outside the second sensing wirings (RXL) in the left inactive area (NAA) and the right inactive area (NAA).

[0124] The electromagnetic attenuation wiring (EML) may be placed between the guard wiring (GRL) and the ground wiring (GNL). The guard wiring (GRL) may be placed closer to the active area (AA) than the electromagnetic attenuation wiring (EML) and the ground wiring (GNL). The guard wiring (GRL) may be closer to the sensing wirings (TXL, RXL) than the electromagnetic attenuation wiring (EML) and the ground wiring (GNL). The ground wiring (GNL) may be placed further outward than the electromagnetic attenuation wiring (EML).

[0125] A portion of the guard wiring (GRL), a portion of the ground wiring (GNL), and a portion of the electromagnetic attenuation wiring (EML) may be open. For example, in the upper inactive area (NAA), a portion of the guard wiring (GRL), a portion of the ground wiring (GNL), and a portion of the electromagnetic attenuation wiring (EML) may be open.

[0126] The sealing layer (SAL) may overlap the inactive region (NAA). The sealing layer (SAL) may be positioned to surround the active region (AA). The sealing layer (SAL) may be adjacent to the active region (AA) than the first, second, and third pads (PD1, PD2, PD3) in the lower inactive region (NAA).

[0127] Guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be arranged to overlap the sealing layer (SAL). For example, excluding portions of guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) adjacent to the third pads (PD3), guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) surrounding the active area (AA) may be arranged to overlap the sealing layer (SAL).

[0128] In FIG. 9, parts of the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) adjacent to the third pads (PD3) may be parts extending in a first direction (DR1) adjacent to the third pads (PD3).

[0129] A ground voltage may be applied to the ground wiring (GNL). The ground wiring (GNL) may be connected to the ground terminal of the display device (DD) through the 3-1 and 3-2 pads (PD3-1, PD3-2). External static electricity may be applied to the input sensing unit (ISP). In this case, the external static electricity may be discharged to the ground terminal through the ground wiring (GNL). Thus, the input sensing unit (ISP) may be protected from external static electricity by the ground wiring (GNL).

[0130] The guard wiring (GRL) can be connected to the sensing control unit through the 3-1 and 3-2 pads (PD3-1, PD3-2). The sensing control unit can apply a signal having a predetermined level to the guard wiring (GRL).

[0131] Due to the potential difference between the grounding wire (GNL) and the sensing wires (TXL, RXL), coupling may occur between the grounding wire (GNL) and the sensing wires (TXL, RXL). In other words, noise may be generated due to mutual signal interference.

[0132] To reduce this phenomenon, a signal having a predetermined level can be applied to the guard wire (GRL). The guard wire (GRL) can reduce the coupling phenomenon between the ground wire (GNL) and the sensing wires (TXL, RXL).

[0133] The electromagnetic attenuation wiring (EML) can be connected to the sensing control unit through the 3-1 and 3-2 pads (PD3-1, PD3-2). The sensing control unit can apply a cancellation signal having an opposite phase to the driving signal to the electromagnetic attenuation wiring (EML).

[0134] When a driving signal having a predetermined frequency is applied to the first sensing electrodes (SE1), electromagnetic waves corresponding to the driving signal may be radiated as unwanted electromagnetic signals. Such electromagnetic signals may act as noise (electromagnetic interference: EMI) to other devices and interfere with the operation of other devices. For example, the electromagnetic signal of the input sensing unit (ISP) may affect the operation of the display panel (DP).

[0135] By applying a cancellation signal having a phase opposite to the driving signal to the electromagnetic attenuation wiring (EML), the electromagnetic signal generated in the input sensing unit (ISP) can be attenuated by the cancellation signal.

[0136] In an embodiment of the present invention, noise and electromagnetic signals in the input sensing unit (ISP) are reduced by the guard wiring (GRL), electromagnetic attenuation wiring (EML), and ground wiring (GNL), and the input sensing unit (ISP) can be protected from external electrostatic charge. Accordingly, the operational reliability of the input sensing unit (ISP) can be improved.

[0137] Figure 10 is an enlarged view of the area (AA1) shown in Figure 9.

[0138] For example, FIG. 10 illustrates two first sensing units adjacent to each other and two second sensing units adjacent to each other.

[0139] Referring to FIG. 10, the first sensing electrode (SE1) may include a pair of first sensing units (SP1) arranged in a first direction (DR1) and a connection pattern (CP) disposed between the first sensing units (SP1) to connect the first sensing units (SP1). An insulating layer (hereinafter shown in FIG. 11) is disposed between the connection pattern (CP) and the first sensing units (SP1), and the connection pattern (CP) may be connected to the first sensing units (SP1) through contact holes (TC-CH) defined in the insulating layer.

[0140] The second sensing electrode (SE2) may include a pair of second sensing units (SP2) arranged in the second direction (DR2) and an extension pattern (EP) extending from the second sensing units (SP2) and positioned between the second sensing units (SP2). The extension pattern (EP) may be insulated from the connection pattern (CP) and extend to intersect the connection pattern (CP). The extension pattern (EP) may be formed integrally with the second sensing units (SP2).

[0141] The first and second sensing units (SP1, SP2) and the extension pattern (EP) may be placed on the same layer. The connection pattern (CP) may be placed on a different layer from the first and second sensing units (SP1, SP2) and the extension pattern (EP).

[0142] Figure 11 is a cross-sectional view of the line I-I' shown in Figure 10.

[0143] Referring to FIGS. 10 and 11, an insulating layer (IOL) may be disposed on an encapsulation substrate (EN-SB). A connection pattern (CP) may be disposed on the insulating layer (IOL). The connection pattern (CP) may be formed by a first conductive pattern (CPT1) shown in FIG. 7. A first insulating layer (TC-IL1) may be disposed on the connection pattern (CP). The first insulating layer (TC-IL1) may be disposed on the insulating layer (IOL) to cover the connection pattern (CP).

[0144] First sensing parts (SP1) and an extension pattern (EP) may be disposed on the first insulating layer (TC-IL1). Although not shown in FIG. 11, second sensing parts (SP2) disposed on the same layer as the extension pattern (EP) may also be disposed on the first insulating layer (TC-IL1). The first and second sensing parts (SP1, SP2) and the extension pattern (EP) may be formed by the second conductive pattern (CPT2) shown in FIG. 7.

[0145] The first sensing units (SP1) can be connected to the connection pattern (CP) through contact holes (TC-CH) defined in the first insulating layer (TC-IL1). Thus, the first sensing units (SP1) can be connected to each other by the connection pattern (CP).

[0146] A second insulating layer (TC-IL2) may be disposed on the first sensing portions (SP1) and the extension pattern (EP). The second insulating layer (TC-IL2) may be disposed on the first insulating layer (TC-IL1) to cover the first sensing portions (SP1) and the extension pattern (EP). Although not shown in FIG. 11, the second insulating layer (TC-IL2) may be disposed on the first insulating layer (TC-IL1) to cover the second sensing portions (SP2).

[0147] FIG. 12 is a diagram illustrating, by way of example, the configuration of the first and second sensing units, the connection pattern, and the extension pattern of the input sensing unit illustrated in FIG. 5. FIG. 13 is a cross-sectional view along line II-II' illustrated in FIG. 12.

[0148] For example, FIG. 12 is illustrated as a plan view corresponding to FIG. 10.

[0149] Referring to FIG. 12, the input sensing unit (ISP') may include a plurality of configurations shown in FIG. 12. The input sensing unit (ISP') may include first and second sensing electrodes (SE1', SE2'). The first and second sensing electrodes (SE1', SE2') may be disposed on the thin film encapsulation layer (TFE) shown in FIG. 5 and FIG. 8.

[0150] The first sensing electrode (SE1') may include a connection pattern (CP) disposed between the first sensing units (SP1') and the first sensing units (SP1'). The second sensing electrode (SE2') may include an extension pattern (EP') disposed between the second sensing units (SP2') and the second sensing units (SP2').

[0151] The first sensing units (SP1') and the second sensing units (SP2') may have a mesh shape. Each of the first and second sensing units (SP1', SP2') may include a plurality of first branch units (BP1) extended in a first diagonal direction (DDR1) and a plurality of second branch units (BP2) extended in a second diagonal direction (DDR2) to have a mesh shape.

[0152] The first diagonal direction (DDR1) may be defined as a direction that intersects the first and second directions (DR1, DR2) on a plane defined by the first and second directions (DR1, DR2). The second diagonal direction (DDR2) may be defined as a direction that intersects the first diagonal direction (DDR1) on a plane defined by the first and second directions (DR1, DR2). For example, the first direction (DR1) and the second direction (DR2) may intersect perpendicularly to each other, and the first diagonal direction (DDR1) and the second diagonal direction (DDR2) may intersect perpendicularly to each other.

[0153] The first branch portions (BP1) of each of the first and second sensing portions (SP1', SP2') may intersect with the second branch portions (BP2) of each of the first and second sensing portions (SP1, SP2) and may be formed integrally with each other. A rhombus-shaped touch opening (TOP) may be defined by the first branch portions (BP1) and the second branch portions (BP2).

[0154] When viewed in a planar view, light-emitting regions (LA) may be placed within touch openings (TOP). Light-emitting elements (OLEDs) may be placed in the light-emitting regions (LA). Each of the light-emitting regions (LA) may be the light-emitting region (LA) illustrated in FIG. 8. First and second sensing units (SP1', SP2') may be placed in a non-light-emitting region (NLA). Since the first and second sensing units (SP1', SP2') are placed in the non-light-emitting region (NLA), light generated in the light-emitting regions (LA) can be emitted normally without being affected by the first and second sensing units (SP1', SP2').

[0155] Each of the connection patterns (CP') can extend toward two first sensing units (SP1') adjacent to each other in the first direction (DR1) via two second sensing units (SP2') adjacent to each other in the second direction (DR2). The connection pattern (CP') can be extended to connect the first sensing units (SP1') without overlapping with the extension pattern (EP'). The connection pattern (CP) can be connected to the first sensing units (SP1') through a plurality of contact holes (TC-CH). The structure of the contact holes (TC-CH) will be illustrated below in FIG. 13. The connection pattern (CP) can be placed on a different layer from the extension pattern (EP'), the first sensing units (SP1'), and the second sensing units (SP2').

[0156] The extension pattern (EP') may be positioned between the first sensing parts (SP1') and may extend from the second sensing parts (SP2'). The second sensing parts (SP2') and the extension pattern (EP') may be formed integrally. The extension pattern (EP') may have a mesh shape. When viewed in a planar view, the extension patterns (EP') may be positioned between the connection patterns (CP') so as not to overlap with the connection patterns (CP'). The extension pattern (EP'), the first sensing parts (SP1'), and the second sensing parts (SP2') may be positioned on the same layer and formed by simultaneous patterning with the same material.

[0157] The connection pattern (CP') may include a first extension part (EX1) and a second extension part (EX2) having a shape symmetrical to the first extension part (EX1). The extension pattern (EP') may be disposed between the first extension part (EX1) and the second extension part (EX2).

[0158] The first extension part (EX1) extends via an area overlapping with one of the second sensing parts (SP2') and can be connected to the first sensing parts (SP1'). The second extension part (EX2) extends via an area overlapping with another of the second sensing parts (SP2') and can be connected to the first sensing parts (SP1).

[0159] Hereinafter, the first sensing units (SP1') are defined as an upper first sensing unit (SP1') and a lower first sensing unit (SP1') according to their relative placement positions. Additionally, the second sensing units (SP2') are defined as a left second sensing unit (SP2') and a right second sensing unit (SP2) according to their relative placement positions.

[0160] Certain parts of the first and second extension parts (EX1, EX2) adjacent to one side of the first and second extension parts (EX1, EX2) can be connected to the lower first sensing part (SP1') through a plurality of contact holes (TC-CH). Certain parts of the first and second extension parts (EX1, EX2) adjacent to the other side of the first and second extension parts (EX1, EX2) can be connected to the upper first sensing part (SP1') through a plurality of contact holes (TC-CH).

[0161] The first extension part (EX1) may include a first sub-extension part (EX1_1) and a second sub-extension part (EX1_2) extended in the first diagonal direction (DDR1), a third sub-extension part (EX1_3) and a fourth sub-extension part (EX1_4) extended in the second diagonal direction (DDR2), a first sub-conduction pattern (SCP1) extended in the second diagonal direction (DDR2), and a second sub-conduction pattern (SCP2) extended in the first diagonal direction (DDR1).

[0162] Certain parts of the first and second sub-extensions (EX1_1, EX1_2) adjacent to one side of the first and second sub-extensions (EX1_1, EX1_2) can be connected to the lower first sensing part (SP1') through a plurality of contact holes (TC-CH). Certain parts of the third and fourth sub-extensions (EX1_3, EX1_4) adjacent to one side of the third and fourth sub-extensions (EX1_3, EX1_4) can be connected to the upper first sensing part (SP1') through a plurality of contact holes (TC-CH).

[0163] The other side of the first sub-extension section (EX1_1) may extend from the other side of the third sub-extension section (EX1_3), and the other side of the second sub-extension section (EX1_2) may extend from the other side of the fourth sub-extension section (EX1_4). The first sub-conduction pattern (SCP1) may extend from the other side of the fourth sub-extension section (EX1_4) toward the second diagonal direction (DDR2) and may extend to the first sub-extension section (EX1_1). The second sub-conduction pattern (SCP2) may extend from the other side of the second sub-extension section (EX1_2) toward the first diagonal direction (DDR1) and may extend to the third sub-extension section (EX1_3).

[0164] The first sub-extension part (EX1_1), the second sub-extension part (EX1_2), the third sub-extension part (EX1_3), the fourth sub-extension part (EX1_4), the first sub-conducting pattern (SCP1), and the second sub-conducting pattern (SCP2) can be formed integrally.

[0165] The first and second sub-extensions (EX1_1, EX1_2) may be extended to intersect with a predetermined number of second branches (BP2) adjacent to the lower first sensing part (SP1') among the second branches (BP2) of the right second sensing part (SP2'). The first branches (BP1) of the right second sensing part (SP2') may not be placed in some areas overlapping the first and second sub-extensions (EX1_1, EX1_2) and the second sub-conductive pattern (SCP2).

[0166] The third and fourth sub-extensions (EX1_3, EX1_4) may be extended to intersect with a predetermined number of first branches (BP1) adjacent to the upper first sensing part (SP1') among the first branches (BP1) of the right second sensing part (SP2'). The second branches (BP2) of the right second sensing part (SP2') may not be placed in some areas overlapping the third and fourth sub-extensions (EX1_3, EX1_4) and the first sub-conductive pattern (SCP1).

[0167] The second extension section (EX2) may include a fifth sub-extension section (EX2_1) and a sixth sub-extension section (EX2_2) extended in the second diagonal direction (DDR2), a seventh sub-extension section (EX2_3) and an eighth sub-extension section (EX2_4) extended in the first diagonal direction (DDR1), a third sub-conduction pattern (SCP3) extended in the first diagonal direction (DDR1), and a fourth sub-conduction pattern (SCP4) extended in the second diagonal direction (DDR2).

[0168] The left second sensing part (SP2') may have a structure symmetrical to the right second sensing part (SP2'), and the second extension part (EX2) may have a structure symmetrical to the first extension part (EX1). Therefore, the description of the 5th to 8th sub-extension parts (EX2_1~EX2_4) and the 3rd and 4th sub-conducting patterns (SCP3, SCP4) is omitted below.

[0169] Referring to FIG. 13, an insulating layer (IOL) may be disposed on a thin film encapsulation layer (TFE), and a connection pattern (CP') may be disposed on the insulating layer (IOL). A first insulating layer (TC-IL1) may be disposed on the connection pattern (CP') and the insulating layer (IOL). The first insulating layer (TC-IL1) may be disposed on the insulating layer (IOL) to cover the connection pattern (CP'). Connection patterns (CP) may be formed by the first conductive pattern (CPT1) shown in FIG. 8.

[0170] First sensing units (SP1') and second sensing units (SP2') may be disposed on the first insulating layer (TC-IL1). An extension pattern (EP') formed integrally with the second sensing units (SP2') may also be disposed on the first insulating layer (TC-IL1). A connection pattern (CP') may be connected to the first sensing units (SP1') through a plurality of contact holes (TC-CH) defined in the first insulating layer (TC-IL1).

[0171] The first and second sensing parts (SP1', SP2') and extension patterns (EP') can be formed by the second conductive pattern (CPT2) shown in FIG. 8.

[0172] A second insulating layer (TC-IL2) may be disposed on the first and second sensing parts (SP1, SP2) and the first insulating layer (TC-IL1). The second insulating layer (TC-IL2) may be disposed on the first insulating layer (TC-IL1) to cover the first and second sensing parts (SP1, SP2).

[0173] Figure 14 is a cross-sectional view of the line A-A' shown in Figure 9.

[0174] For example, the structure of the right inactive region (NAA) is illustrated in the cross-section of FIG. 14. Although not illustrated, the left inactive region (NAA) may have a structure that is symmetrical to the right inactive region (NAA) and, substantially, may have the same structure as the right inactive region (NAA).

[0175] Referring to FIG. 14, when viewed in a planar view, the active region (AA) may overlap the display region (DA), and the inactive region (NAA) may overlap the non-display region (NDA). The buffer layer (BFL) and the first to fifth insulating layers (INS1 to INS5) disposed on the display region (DA) may extend onto the non-display region (NDA).

[0176] The sixth insulating layer (INS6) and the pixel defining layer (PDL) may be positioned up to the boundary between the display area (DA) and the non-display area (NDA). The boundary between the display area (DA) and the non-display area (NDA) may be defined as the portion adjacent to the light-emitting element (OLED) positioned at the outermost edge.

[0177] The sealing layer (SAL) can be placed on the fifth insulating layer (INS5) between the substrate (SUB) and the encapsulating substrate (EN-SB). When viewed in a planar view, the sealing layer (SAL) can overlap with the inactive region (NAA).

[0178] Second sensing wires (RXL), guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) may be placed on the encapsulation substrate (EN-SB).

[0179] The second sensing wires (RXL), guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) may be placed on an insulating layer (IOL). Each of the second sensing wires (RXL), guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) may include multilayer wires. For example, each of the second sensing wires (RXL), guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) may include wires stacked in two layers by overlapping each other (hereinafter referred to as the first wire and the second wire).

[0180] The first wiring (not shown in the drawing) of each of the second sensing wirings (RXL), guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be placed on an insulating layer (IOL). A first insulating layer (TC-IL1) may be placed on the first wiring of each of the second sensing wirings (RXL), guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML).

[0181] The second wiring (not shown in the drawing) of each of the second sensing wiring (RXL), guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be disposed on the first insulating layer (TC-IL1). A second insulating layer (TC-IL2) may be disposed on the second wiring of each of the second sensing wiring (RXL), guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML).

[0182] Each of the second sensing wires (RXL), guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) comprises multilayer wires, but embodiments of the present invention may not be limited thereto. For example, each of the second sensing wires (RXL), guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) may have a single-layer wiring structure by including only one of the first wiring and the second wiring.

[0183] The second sensing wires (RXL) can be positioned between the sealing layer (SAL) and the active region (AA) when viewed in a planar view. That is, when viewed in a planar view, the second sensing wires (RXL) may not overlap with the sealing layer (SAL).

[0184] When viewed in a planar view, the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) can be arranged to overlap the sealing layer (SAL) while being spaced apart from the second sensing wirings (RXL). Thus, the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) can be placed more stably on the sealing layer (SAL).

[0185] Guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be placed on the sealing layer (SAL) without being placed inside the sealing layer (SAL). The area where the sealing layer (SAL) is formed may be utilized so that guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be placed on the sealing layer (SAL).

[0186] When guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) are placed inside the sealing layer (SAL), an inactive area (NAA) must be provided inside the sealing layer (SAL) for placing the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) together with the sensing wiring (RXL).

[0187] In an embodiment of the present invention, the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be placed on the sealing layer (SAL) rather than being placed inside the sealing layer (SAL). Thus, sufficient space for the inactive area (NAA) for placing the sensing wirings (RXL) can be secured. However, the embodiment of the present invention is not limited thereto, and the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) may be placed inside the sealing layer (SAL), and such an embodiment will be illustrated in FIGS. 19 and 20 below.

[0188] When the guard wiring (GRL) is positioned adjacent to the sensing wiring (RXL), the coupling phenomenon between the sensing wiring (RXL) and the ground wiring (GNL) is effectively reduced, and when the ground wiring (GNL) is positioned at the outermost edge, static electricity entering from the outside can be efficiently discharged. Therefore, it may be desirable to position the electromagnetic attenuation wiring (EML) between the guard wiring (GRL) and the ground wiring (GNL).

[0189] However, the embodiments of the present invention are not limited thereto, and the placement positions of the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) can be varied, and such embodiments will be illustrated in FIGS. 23 and 24 below.

[0190] Although not illustrated in cross-sectional structure, in the embodiment of the display panel (DP') shown in FIG. 5, the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) can be placed on the thin film encapsulation layer (TFE).

[0191] FIGS. 15 and 16 are exemplary drawings illustrating a sensing control unit connected to the electromagnetic attenuation wiring shown in FIG. 9. FIG. 17a is an exemplary drawing illustrating the timing of a driving signal applied to the first sensing electrodes shown in FIG. 9 and a cancellation signal applied to the electromagnetic attenuation wiring shown in FIG. 9.

[0192] Figure 9 will be explained below together with Figures 15 to 17a.

[0193] Referring to FIGS. 15 and 16, the input sensing unit (ISP) may include a sensing control unit (T-IC). The sensing control unit (T-IC) may generate a driving signal (TS) and a cancellation signal (OS). The driving signal (TS) may be applied to an active area (AA), and the cancellation signal (OS) may be applied to an electromagnetic attenuation wiring (EML). The driving signal (TS) may be applied to first sensing electrodes (SE1) placed in the active area (AA).

[0194] The input sensing unit (ISP) can have various shapes. For example, referring to FIG. 15, the input sensing unit (ISP) can have a rectangular shape. The active area (AA) can also have a rectangular shape. Referring to FIG. 16, the input sensing unit (ISP) can have a circular shape. The active area (AA) can also have a circular shape. The shape of the input sensing unit (ISP) can substantially correspond to the shape of the display panel (DP), and the display panel (DP) can also have a rectangular or circular shape.

[0195] Referring to FIG. 9 and FIG. 15 to FIG. 17a, a driving signal (TS) having a predetermined frequency may be applied to first sensing electrodes (SE1), and a cancellation signal (OS) having a predetermined frequency may be applied to electromagnetic attenuation wiring (EML). The cancellation signal (OS) may have an opposite phase to the driving signal (TS). The cancellation signal (OS) may have a second amplitude (AMP2) greater than the first amplitude (AMP1) of the driving signal (TS).

[0196] An electromagnetic signal (EMS) can be generated in the input sensing unit (ISP) by a driving signal (TS) having a predetermined frequency. Since the cancellation signal (OS) has an opposite phase to the driving signal (TS) applied to the active area (AA), the electromagnetic signal (EMS) can be canceled out by the cancellation signal (OS).

[0197] The strength of the electromagnetic signal (EMS) can be proportional to the number and area of ​​the first sensing electrodes (SE1). Therefore, the electromagnetic signal (EMS) can be generated more strongly. In an embodiment of the present invention, the cancellation signal (OS) has a larger amplitude than the driving signal (TS), so it can further cancel out the electromagnetic signal (EMS) that is generated more strongly.

[0198] FIGS. 17b to 17f are drawings illustrating the timings of driving signals and cancellation signals according to various embodiments of the present invention.

[0199] Referring to FIG. 17b, the cancellation signal (OS) may have opposite phase to the driving signal (TS). The amplitude (AMP) of the cancellation signal (OS) may be equal to the amplitude (AMP) of the driving signal (TS).

[0200] Referring to FIG. 17c, the cancellation signal (OS) may have an opposite phase to the driving signal (TS). The cancellation signal (OS) may have a second amplitude (AMP2) that is larger than the first amplitude (AMP1) of the driving signal (TS). The driving signal (OS) may have an active interval (H1). The active interval may be defined as a high-level interval for one cycle. The cancellation signal (OS) may have a deactivated interval (H2). The deactivated interval may be defined as a low-level interval for one cycle. The deactivated interval (H2) of the cancellation signal (OS) may be larger than the active interval (H1) of the driving signal (OS).

[0201] Referring to FIG. 17d, the cancellation signal (OS) may have an opposite phase to the driving signal (TS). The cancellation signal (OS) may have a second amplitude (AMP2) that is larger than the first amplitude (AMP1) of the driving signal (TS). The cancellation signal (OS) may be output shifted to the right of the driving signal (TS). For example, a portion of the low-level portion of the cancellation signal (OS) may overlap with a portion of the high-level portion of the driving signal (TS).

[0202] Referring to FIG. 17e, the cancellation signal (OS) may have opposite phase to the driving signal (TS). The driving signal (TS) may have a second amplitude (AMP2) that is larger than the first amplitude (AMP1) of the cancellation signal (OS).

[0203] Referring to FIG. 17f, the cancellation signal (OS) may have opposite phase to the driving signal (TS). The driving signal (TS) may have a second amplitude (AMP2) that is larger than the first amplitude (AMP1) of the cancellation signal (OS). The cancellation signal (OS) may be output shifted to the right of the driving signal (TS). For example, a portion of the low-level portion of the cancellation signal (OS) may overlap with a portion of the high-level portion of the driving signal (TS).

[0204] FIGS. 18a and FIGS. 18b are circuit diagrams for exemplarily illustrating the cancellation operation of electromagnetic signals by the cancellation signal shown in FIG. 17a.

[0205] Figures 9 and 17a will be described below together with Figures 18a and 18b.

[0206] Referring to FIG. 9, FIG. 18a, and FIG. 18b, the input sensing unit (ISP) may include a capacitor (Cm) formed by first and second sensing electrodes (SE1, SE2). The capacitor (Cm) is shown together with resistors (not shown in the drawings) according to the first and second sensing electrodes (SE1, SE2).

[0207] First parasitic capacitors (Cb1) may be formed in the input sensing unit (ISP). The first parasitic capacitors (Cb1) may be formed by the conductor of the display panel (DP) and the conductor of the input sensing unit (ISP). For example, the conductor of the input sensing unit (ISP) may be the first and second sensing electrodes (SE1, SE2), and the conductor of the display panel (DP) may be the second electrode (E2).

[0208] Second parasitic capacitors (Cb2) may be formed in the display panel (DP). The second parasitic capacitors (Cb2) may be formed by conductors within the display panel (DP). For example, the second parasitic capacitors (Cb2) may be formed by wirings connected to the first electrode (E1) and the second electrode (E2).

[0209] Referring to FIGS. 9, FIGS. 17a, and FIGS. 18a, when a driving signal (TS) is applied to an input sensing unit (ISP), an electromagnetic signal (indicated by a dotted arrow) caused by the driving signal (TS) can be applied to the first electrodes (E1) of the display panel (DP) through the first and second parasitic capacitors (Cb1, Cb2). In this case, the electromagnetic signal caused by the driving signal (TS) acts as noise to the display panel (DP), and the display panel (DP) may not operate normally.

[0210] Referring to FIG. 9 and FIG. 18b, a third parasitic capacitor (Cb3) formed by the electromagnetic attenuation wiring (EML) and the conductor of the display panel (DP) may be further placed in the input sensing unit (ISP).

[0211] Referring to FIG. 9, FIG. 17a, and FIG. 18b, an electromagnetic signal by a driving signal (TS) can be applied to the first electrodes (E1) of a display panel (DP) through first and second parasitic capacitors (Cb1, Cb2). An electromagnetic signal by a cancellation signal (OS) (shown by a solid arrow) can be applied to the first electrodes (E1) of a display panel (DP) through a third parasitic capacitor (Cb3) formed by electromagnetic attenuation wiring (EML) and the second parasitic capacitors (Cb2) of the display panel (DP).

[0212] Accordingly, the electromagnetic signal from the driving signal (TS) can be canceled out by the cancellation signal (OS) having a phase opposite to that of the driving signal (TS). As a result, the electromagnetic signal applied to the display panel (DP) is attenuated so that the display panel (DP) can operate normally.

[0213] FIG. 19 is a plan view of an input sensing unit according to another embodiment of the present invention. FIG. 20 is a cross-sectional view along line A1-A1' shown in FIG. 19.

[0214] FIGS. 19 and FIGS. 20 are illustrated as a plan view and a cross-sectional view corresponding to FIGS. 9 and FIGS. 14, respectively. Hereinafter, the configuration of the input sensing unit (ISP-1) illustrated in FIGS. 19 and FIGS. 20 will be described with a focus on the configuration different from the input sensing unit (ISP) illustrated in FIGS. 9 and FIGS. 14.

[0215] Referring to FIGS. 19 and 20, the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) of the input sensing unit (ISP-1) can be arranged so as not to overlap with the sealing layer (SAL) when viewed in a planar view. For example, except for parts of the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) adjacent to the third pads (PD3), the guard wiring (GRL), ground wiring (GNL), and electromagnetic attenuation wiring (EML) surrounding the active area (AA) may not overlap with the sealing layer (SAL).

[0216] When viewed in a planar view, the guard wire (GRL), ground wire (GNL), and electromagnetic attenuation wire (EML) may be spaced apart from the sealing layer (SAL) and be adjacent to the active area (AA) than the sealing layer (SAL).

[0217] FIGS. 21 to 24 are drawings showing the configurations of input sensing units according to various embodiments of the present invention.

[0218] FIGS. 21 to 24 are cross-sectional views corresponding to FIG. 14. Hereinafter, the configurations of the input sensing units (ISP-2 to ISP-5) shown in FIGS. 21 to 24 will be described, focusing on the configurations different from the input sensing unit (ISP) shown in FIG. 14.

[0219] Referring to FIG. 21, multiple electromagnetic attenuation wires (EML) of the input sensing unit (ISP-2) may be provided to the input sensing unit (ISP-2). Multiple electromagnetic attenuation wires (EML) may be placed between the guard wire (GRL) and the ground wire (GNL). The cancellation signal (OS) shown in FIG. 17a may be applied to the electromagnetic attenuation wires (EML).

[0220] As the number of electromagnetic attenuation wires (EML) increases, the strength of the electromagnetic signal due to the cancellation signal (OS) can increase. Therefore, the electromagnetic signal generated by the input sensing unit (ISP) can be attenuated more by the electromagnetic attenuation wires (EML).

[0221] Referring to FIG. 22, the line width of the electromagnetic attenuation wiring (EML) of the input sensing unit (ISP-3) may be larger than the line width of the guard wiring (GRL) and the ground wiring (GNL), respectively. The line width may represent a value measured in a direction intersecting the extension direction of the wiring.

[0222] As the linewidth of the electromagnetic attenuation wiring (EML) increases, the strength of the electromagnetic signal due to the cancellation signal (OS) can increase. Therefore, the electromagnetic signal generated by the input sensing unit (ISP) can be attenuated more by the electromagnetic attenuation wiring (EML).

[0223] Referring to FIG. 23, the electromagnetic attenuation wiring (EML) of the input sensing unit (ISP-4) may be adjacent to the second sensing wirings (RXL) than the guard wiring (GRL) and the ground wiring (GNL). The ground wiring (GNL) may be placed outside the guard wiring (GRL). The guard wiring (GRL) may be placed between the electromagnetic attenuation wiring (EML) and the ground wiring (GNL).

[0224] Referring to FIG. 24, the electromagnetic attenuation wiring (EML) of the input sensing unit (ISP-5) may be positioned further outward than the guard wiring (GRL) and the ground wiring (GNL). The guard wiring (GRL) may be adjacent to the second sensing wirings (RXL) than the ground wiring (GNL). The ground wiring (GNL) may be positioned between the guard wiring (GRL) and the electromagnetic attenuation wiring (EML).

[0225] Although the invention has been described with reference to the above embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the following claims. Furthermore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the invention, and all technical spirits within the scope of the following claims and equivalents should be interpreted as being included within the scope of the rights of the present invention. Explanation of the symbols

[0226] DD: Display device DP: Display panel ISP: Input sensing unit SE1, SE2: First and second sensing electrodes SP1, SP2: 1st and 2nd sensing units TXL, RXL: 1st and 2nd sensing wiring GRL: Guard wiring GNL: Ground wiring EML: Electromagnetic Attenuation Wiring SAL: Sealing Layer SUB: Substrate EN-SB: Encapsulation substrate

Claims

Claim 1 A display device comprising: a display panel; and an input sensing unit disposed on the display panel, wherein an active area and an inactive area surrounding the active area are defined, the input sensing unit comprises: a plurality of sensing electrodes disposed in the active area; a plurality of sensing wires connected to the sensing electrodes and disposed in the inactive area; and a guard wire, a ground wire, and an electromagnetic attenuation wire disposed in the inactive area spaced apart from the sensing wires, wherein the guard wire, the ground wire, and the electromagnetic attenuation wire are disposed outwardly from the sensing wires, and the line width of the electromagnetic attenuation wire is greater than the line width of each of the guard wire and the ground wire. Claim 2 In claim 1, the electromagnetic attenuation wiring is a display device placed between the guard wiring and the ground wiring. Claim 3 In claim 2, the guard wiring is adjacent to the sensing wiring than the electromagnetic attenuation wiring, and the ground wiring is positioned outside the electromagnetic attenuation wiring. Claim 4 A display device according to claim 1, wherein the cancellation signal applied to the electromagnetic attenuation wiring has a phase opposite to the driving signal applied to the sensing electrodes. Claim 5 In claim 4, the offset signal is a display device having an amplitude greater than the driving signal. Claim 6 A display device according to claim 1, wherein the guard wiring, the electromagnetic attenuation wiring, and the ground wiring extend to surround three sides of the active area having a rectangular shape, and the guard wiring, the electromagnetic attenuation wiring, and the ground wiring are connected to pads placed in an inactive area adjacent to the remaining side. Claim 7 In claim 5, a part of the guard wiring, a part of the electromagnetic attenuation wiring, and a part of the ground wiring are an open display device. Claim 8 In claim 1, the guard wiring, the electromagnetic attenuation wiring, and the grounding wiring comprise multilayer wirings in a display device. Claim 9 A display device according to claim 1, wherein the display panel comprises: a substrate; a display element layer disposed on the substrate; an encapsulation substrate disposed on the display element layer; and a sealing layer disposed between the substrate and the encapsulation substrate to seal the display element layer and, when viewed in a planar view, overlaps the inactive region. Claim 10 In claim 9, when viewed on the above plane, the guard wiring, the electromagnetic attenuation wiring, and the ground wiring are a display device that overlaps the sealing layer. Claim 11 In claim 9, a display device in which, when viewed on the above plane, the guard wiring, the electromagnetic attenuation wiring, and the ground wiring do not overlap the sealing layer. Claim 12 In claim 1, the display device is provided with a plurality of electromagnetic attenuation wires. Claim 13 delete Claim 14 In claim 1, the electromagnetic attenuation wiring is adjacent to the sensing wirings than the guard wiring and the ground wiring, and the ground wiring is positioned outside the guard wiring. Claim 15 In claim 1, the electromagnetic attenuation wiring is positioned outside the guard wiring and the ground wiring, and the guard wiring is adjacent to the sensing wirings than the ground wiring. Claim 16 An input sensing unit comprising: a plurality of sensing electrodes disposed in an active region; a plurality of sensing wires connected to the sensing electrodes and disposed in an inactive region surrounding the active region; and a guard wire, a ground wire, and an electromagnetic attenuation wire disposed in the inactive region spaced apart from the sensing wires, wherein the electromagnetic attenuation wire is disposed between the guard wire and the ground wire, the guard wire is adjacent to the sensing wires than the electromagnetic attenuation wire, and the line width of the electromagnetic attenuation wire is greater than the line width of each of the guard wire and the ground wire. Claim 17 In claim 16, the cancellation signal applied to the electromagnetic attenuation wiring has an opposite phase to the driving signal applied to the sensing electrodes, and the cancellation signal has an amplitude greater than the driving signal, in an input sensing unit. Claim 18 In claim 16, a part of the guard wiring, a part of the electromagnetic attenuation wiring, and a part of the ground wiring are an open input sensing part. Claim 19 In claim 16, the guard wiring, the electromagnetic attenuation wiring, and the ground wiring comprise an input sensing unit including multilayer wiring. Claim 20 A display panel comprising: a substrate, an encapsulation substrate disposed on the substrate, a display element layer disposed between the substrate and the encapsulation substrate, and a sealing layer disposed between the substrate and the encapsulation substrate to seal the display element layer; and an input sensing unit disposed on the display panel, wherein the input sensing unit comprises: a plurality of sensing electrodes; a plurality of sensing wires connected to the sensing electrodes; and a guard wire, a ground wire, and an electromagnetic attenuation wire spaced apart from the sensing wires, wherein, when viewed in a planar view, the guard wire, the ground wire, and the electromagnetic attenuation wire overlap the sealing layer, and the line width of the electromagnetic attenuation wire is greater than the line width of each of the guard wire and the ground wire.

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