LIGHTING DEVICE

MX430975BActive Publication Date: 2026-02-25AIRSTAR SAS +1
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Patent Information

Application Number
MX2023005969
Authority / Receiving Office
MX · MX
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-11-23
Filing Date
2023-05-19
Publication Date
2026-02-25
Estimated Expiration
2041-10-05

AI Technical Summary

Technical Problem

Existing LED lighting devices are not reliable, complex to assemble, and difficult to troubleshoot, and lack advanced control features, particularly in inflatable balloon lighting systems where envelope inflation control is inefficient.

Method used

A modular LED lighting device with an electrically conductive support structure, elementary lighting modules featuring printed circuit boards with LEDs and electronic circuits, and an electronic power supply and control circuit for diagnostic functions, along with an inflatable envelope and a fan control system that monitors rotation speed and emits alerts for cavitation or leaks.

Benefits of technology

The solution provides a reliable, easy-to-assemble, and fault-detectable LED lighting system with improved inflation control, ensuring efficient and safe operation of inflatable balloon lighting devices by reducing power consumption and noise.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present description relates to a lighting device comprising: - an electrically conductive support structure (130); and - a plurality of elementary lighting modules (110) attached to the support structure, each elementary module comprising a printed circuit board and, mounted on the printed circuit board, an LED assembly and an electronic circuit for powering and controlling the LED assembly, wherein, in each elementary module (110), the printed circuit board of the module comprises at least one reference terminal (V-), the reference terminals (V-) of the printed circuit boards of the different elementary modules being electrically connected to each other by means of the support structure (130).
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Description

DESCRIPTION TITLE: Lighting Device This application is based on, and claims priority from, French patent application FR2012025 filed on November 23, 2020, entitled "Lighting Device", which is considered to form an integral part of this description within the limits provided by law. technical field

[0001] This description relates generally to lighting devices, and more specifically to a modular LED lighting device. This description also relates to the field of inflatable lighting balloons, and, more particularly, to the control of balloon inflation in such balloons. Previous technique

[0002] Numerous LED lighting devices have already been proposed. However, it would be desirable to have an LED lighting device that overcomes some or all of the drawbacks of existing devices. In particular, it would be desirable to have an LED lighting device that is more reliable, simpler to assemble, easier to troubleshoot, and / or offers additional features compared to existing devices.

[0003] It would also be desirable to be able to improve the control of the inflation of the envelope in inflatable balloon-type lighting devices. Summary of the invention

[0004] To this end, one embodiment provides for a lighting system comprising: - an electrically conductive support structure; And - a plurality of elementary lighting modules fixed to the support structure, each elementary module comprising a printed circuit board and, mounted on the printed circuit board, an array of LEDs and an electronic circuit for powering and controlling the array of LEDs, wherein, in each elementary module, the printed circuit board of the module includes at least one reference terminal, the reference terminals of the printed circuit boards of the different elementary modules being electrically connected to each other via the support structure.

[0005] According to one embodiment, each elementary module includes a support for fixing the module to the support structure.

[0006] According to one embodiment, in each elementary module the module mounting support includes an electrically conductive part electrically connecting a reference terminal of the module's printed circuit board to the support structure.

[0007] According to one embodiment, the electrically conductive part comprises a conductive rod with conductive legs at its ends, each having an opening through which a conductive rod of the support structure passes.

[0008] According to one embodiment, each elementary module further comprises a transparent or translucent protective cover placed opposite the printed circuit board of the module, the protective cover being fixed on said mounting support of the module.

[0009] According to one embodiment, the elementary modules are arranged in one or more prism-shaped tiers, the modules being arranged on the lateral faces of the prism.

[0010] According to one embodiment, the elementary modules are arranged in a planar arrangement.

[0011] According to one embodiment, the elementary modules are arranged in a plurality of columns, each comprising several elementary modules, each module comprising two power and control connectors, and the elementary modules of the same column are connected in chain via their respective power and control connectors.

[0012] According to one embodiment, the device further includes an electronic power supply and control circuit connected to one end of each column.

[0013] According to one embodiment, the electronic power supply and control circuit is configured to implement a diagnostic process comprising a measurement step of a quantity representative of a current consumed by a column and / or a voltage across the terminals of a column of elementary modules.

[0014] According to one embodiment, the electronic power supply and control circuit is configured to implement a diagnostic process comprising the following steps: a) switching an elementary module of a column to the on state and measuring a representative value of the current flowing in the column; b) switching said elementary module of said column to the off state and measuring a representative value of the current flowing in the column; and c) comparing the difference between the value measured at the step a) and the value measured in step b) to a reference nominal value and, if the difference between said difference and said reference nominal value exceeds a specified margin, deduce that said elementary module is faulty.

[0015] According to one embodiment, the device comprises a diffusing envelope surrounding the support structure and the elementary modules.

[0016] According to one embodiment, the diffusing envelope is an inflatable envelope.

[0017] Another embodiment provides for a lighting system comprising: - an illuminating structure; - an inflatable envelope surrounding the lighting structure; - an inflation fan suitable for inflating the envelope; and - an electronic control circuit configured to, during a phase of inflation of the envelope, monitor the rotation speed of the inflation fan, detect an increase in said rotation speed corresponding to an entry into cavitation of the fan at the end of the inflation phase, and, when said increase is detected, reduce the value of a power setpoint applied to the fan.

[0018] According to one embodiment, the inflation fan includes a rotation speed sensor connected to the electronic control circuit.

[0019] According to one embodiment, the electronic control circuit is configured to, during the inflation phase, command the inflation fan to its maximum power.

[0020] According to one embodiment, the control circuit is further configured to measure the time elapsed since the start of the inflation phase, and, if the elapsed time reaches, before the detection of the fan entering cavitation, a predefined threshold corresponding to a maximum nominal inflation time, emit an alert signal of leakage of the inflatable envelope to the user.

[0021] According to one embodiment, for the emission of the warning signal, the control circuit commands the flashing of at least one light source of the lighting structure according to a predetermined sequence, and / or the sending of a warning message to a remote terminal via a wired or wireless communication channel.

[0022] According to one embodiment, the electronic control circuit is further configured to, during or outside the inflation phase: apply a power setpoint to the inflation fan; - determine the rotation speed of the inflation fan, and compare said rotation speed to a predefined threshold corresponding to a nominal rotation speed for said power setpoint; and - if said rotation speed is above said threshold, issue a warning signal indicating clogging of a fan intake filter.

[0023] In one embodiment, the lighting structure comprises: - a support structure; and - a plurality of elementary lighting modules fixed to the metal support structure, each elementary module comprising a printed circuit board and, mounted on the printed circuit board, an assembly of LEDs and an electronic circuit for powering and controlling the entire assembly LED.

[0024] According to one embodiment, in each elementary module, the printed circuit board of the module includes at least one reference terminal, the reference terminals of the printed circuit boards of the different elementary modules being electrically connected to each other via the support structure.

[0025] According to one embodiment, each elementary module includes a support for fixing the module to the support structure.

[0026] According to one embodiment, in each elementary module the module mounting support includes a conductive part electrically connecting a reference terminal of the module's printed circuit board to the supporting metal structure. Brief description of the drawings

[0027] These features and advantages, as well as others, will be described in detail in the following description of particular embodiments, given by way of non-limiting example, in relation to the attached figures, among which:

[0028] Figure 1 is a partial perspective view of an example of a lighting structure of an LED lighting device according to one embodiment;

[0029] Figure 2 is a perspective view of another example of a lighting structure of an LED lighting device according to one embodiment;

[0030] Figure 3 is a perspective view of another example of an illuminating structure of an LED lighting device according to one embodiment;

[0031] Figure 4 is an exploded perspective view of an example of an elementary lighting module of an LED lighting device according to one embodiment;

[0032] Figure 5 is a partial front view of an example of an LED lighting device according to one embodiment;

[0033] Figure 6 is a schematic front view of an example of an inflatable-envelope lighting balloon according to one embodiment;

[0034] Figure 7 is a simplified electrical diagram of an LED lighting device according to one embodiment;

[0035] Figure 8 is a more detailed electrical diagram of an example of the realization of an elementary lighting module of an LED lighting device according to one embodiment;

[0036] Figure 9 illustrates a variant embodiment of the elementary lighting module of Figure 8;

[0037] Figure 10 illustrates an example of the implementation of a power distribution board for an LED lighting device according to one embodiment;

[0038] Figure 11 schematically illustrates, in block form, steps of an example of a fault detection process in an LED lighting device according to one embodiment;

[0039] Figure 12 illustrates in more detail a step in the process of Figure 11;

[0040] Figure 13 illustrates a variant implementation of one step of the process shown in Figure 11; and

[0041] Figure 14 schematically illustrates, in block form, an example of a method for controlling the inflation of the envelope of an inflatable lighting balloon according to one embodiment. Description of the implementation methods

[0042] The same elements have been designated by the same reference numerals in the different figures. In particular, structural and / or functional elements common to the different embodiments may have the same reference numerals and may have identical structural, dimensional and material properties.

[0043] For the sake of clarity, only the steps and elements necessary for understanding the described implementation methods have been shown and detailed. In particular, the construction of the LEDs and the electronic power supply and control circuits for the described devices has not been detailed, as the construction of these components is within the capabilities of a person skilled in the art, based on the information provided in this description.

[0044] Unless otherwise specified, when referring to two connected elements, this means directly connected without any intermediate elements other than conductors, and when referring to two coupled elements, this means that these two elements can be connected or linked through one or more other elements.

[0045] In the description that follows, when referring to absolute positional qualifiers, such as the terms "front", "back", "top", "bottom", "left", "right", etc., or relative positional qualifiers, such as the terms "above", "below", "superior", "inferior", etc., or to orientational qualifiers, such as the terms "horizontal", "vertical", etc., unless otherwise specified, it refers to the orientation of the figures.

[0046] Unless otherwise specified, the expressions "approximately", "roughly", and "on the order of" mean within 10%, preferably within 5%.

[0047] Figure 1 is a partial perspective view of an example of a lighting structure 100 of an LED lighting device according to one embodiment.

[0048] The lighting structure 100 comprises a plurality of identical or similar elementary lighting modules 110 fixed to the same support structure 130 made of one or more electrically conductive materials, for example metal, carbon, or a carbon-doped polymer material.

[0049] In the example shown in Figure 1, the support structure 130 is designed to receive eighteen elementary modules 110 arranged in three superimposed tiers of six modules each. For clarity, only the six elementary modules 110 of the top tier are shown in Figure 1.

[0050] In this example, each elementary module 110 is roughly rectangular or square in shape. On each level, the six elementary modules 110 of that level are arranged in a hexagonal prism. More specifically, the six elementary modules 110 of that level form the six rectangular faces of the hexagonal prism. The different levels are aligned vertically along the same central axis. More specifically, in this example, on each level of the lighting structure 100, each elementary module 110 of that level is aligned vertically, along its vertical edges, with an elementary module 110 of each other level.

[0051] The support structure 130 in Figure 1 comprises six vertical rods 131, for example identical or similar, regularly spaced in a circular arrangement (top view). The rods define the edges of the hexagonal prismatic structure. The rods 131 are made of an electrically conductive material, for example metal, carbon, or a carbon-doped polymer material.

[0052] Each elementary module 110 includes a support 150 used to fix the module 110 to the support structure 130. In this example, each support 150 has a generally rectangular or square shape and lateral dimensions that substantially correspond to the lateral dimensions of the module 110. Each support 150 includes, on one side of a vertical edge of the module 110, one or more retaining rings 151, designed to fit onto one of the rods 131 of the support structure. In the example shown, each support 150 includes two retaining rings 151 arranged respectively at the two ends of the same vertical edge of the support 150. When an elementary module 110 is mounted on the support structure 130, the retaining ring(s) 151 of the module are passed through the same rod 131 of the support structure.The vertical edge of the support 150 opposite the rings 151 includes, in its lower part of the module, an opening through which a rod 131 passes, adjacent to the support structure 130. More specifically, in this example, viewed from the front outside the lighting structure, in each elementary module 110, the mounting support 150 of the module includes, on its right edge, two mounting rings 151 arranged respectively in the upper and lower parts of the module edge, threaded onto a rod 131 of the support structure 130, and, on its left edge, an opening (not visible in the figure) through which a neighboring rod 131 passes. Thus, in this example, in each stage, each portion of rod 131 defining an edge of the hexagonal prism of the stage: - on the one hand, it passes through the fixing rings 151 of the fixing support 150 of a first elementary module 110 of the stage, located predominantly to the left of said rod 131; and - on the other hand through an opening in the fixing support 150 of a second elementary module 110 of the stage, located primarily to the right of said rod 131.

[0053] This arrangement allows for the robust attachment of the elementary modules 110 of each floor to a number of rods 131 equal to the number of elementary modules 110 on the floor. However, the described embodiments are not limited to this particular arrangement.

[0054] One advantage of the lighting structure described in relation to Figure 1 is that it can easily be adapted into many other shapes and / or sizes using the same basic elementary modules 110, simply by adjusting the arrangement and / or the number of rods 131 in the support structure 130. This allows for a variety of applications while limiting the design and manufacturing costs of the devices for each new application. In particular, the number of elementary modules 110 can be chosen according to the desired total luminous power. For example, each elementary module 110 has a luminous power output ranging from 1 to 10,000 lumens, e.g., from 10 to 5,000 lumens, e.g., from 100 to 1,000 lumens.The total luminous power emitted by the device (sum of the powers emitted by the different elementary modules 110) is for example between 50 and 1000000 lumens, for example between 5000 and 500000 lumens.

[0055] Figures 2 and 3 illustrate further (non-limiting) examples of possible configurations of a lighting structure of the type described in relation to Figure 1.

[0056] In the example in Figure 2, the structure comprises four elementary modules 110 per floor, arranged respectively along the four lateral faces of a square-based prism. The support structure includes four rods 131, defining the four edges of the prism. In the example in Figure 2, only one floor is shown. Depending on the intended application, the lighting structure may include several vertically stacked floors as described in relation to figure 1.

[0057] In the example in Figure 3, the structure comprises two elementary modules 110 per level, aligned linearly in the same plane. The support structure comprises three rods 131 aligned linearly in top view. In the example in Figure 3, only one level of two modules is shown. Depending on the intended application, the lighting structure may comprise several levels stacked vertically as described in relation to Figure 1 and / or a number of elementary modules 110 per level other than two (for example, one module per level or more than two levels per module).

[0058] Figure 4 is an exploded perspective view of an example of an elementary lighting module 110 of a lighting structure of the type described in relation to Figures 1, 2 and 3.

[0059] Module 110 comprises a printed circuit board 112, on which are mounted an array 114 of one or more LEDs (eight LEDs evenly distributed across the surface of the printed circuit board in the example shown) and an electronic circuit 116 for powering and controlling the LED array. Each module 110 has its own printed circuit board 112, separate from those of the other modules 110. Thus, each module 110 constitutes a basic lighting panel independent of the other modules. The dimensions of the printed circuit board 112 correspond approximately to the dimensions of the module 110. For example, the printed circuit board 112 has a generally rectangular or square shape with a length between 50 and 250 mm and a width between 50 and 250 mm.

[0060] In the example shown, module 110 also includes, mounted on the printed circuit board, two connectors 118, for example identical or similar, intended to connect module 110 to an external device, for example another module 110 or an electronic power supply and control circuit for the lighting structure.

[0061] In the example in Figure 4, the connectors 118 are arranged respectively on the upper edge and the lower edge of the module, near the right edge of the module. However, the described embodiments are not limited to this particular arrangement.

[0062] Each elementary module 110 further comprises a protective housing 120 positioned opposite the module's printed circuit board 112, on the side facing the module's illuminated face. The housing 120 may comprise a transparent or translucent plate, for example, made of glass or a polymer material, with dimensions substantially equal to those of the printed circuit board 112, positioned parallel to the printed circuit board 112, on the side of the printed circuit board 112 on which the module's LEDs 114 are mounted. Alternatively, the protective housing 120 may comprise an opaque plate having one or more openings 122 opposite the face of the printed circuit board 112 on which the module's LEDs 114 are mounted, for example, as shown in Figure 4.

[0063] The mounting bracket 150 ensures the positioning and retention of the printed circuit board 112 on the support structure 130 (Figures 1 to 3). In this example, the protective cover 120 is attached directly to the mounting bracket 150, for example, by clipping it in place. This allows any shocks experienced by the protective cover 120 to be transmitted directly to the support structure 130, thus limiting the stresses on the printed circuit board 112.

[0064] In this example, the mounting bracket 150 comprises a frame 153, for example, generally square or rectangular in shape, with lateral dimensions substantially corresponding to the lateral dimensions of the module 110, which is designed to receive the printed circuit board 112 and, above the printed circuit board 112, the protective cover 120. The retaining rings 151 are arranged on the side of a vertical edge of the frame 153. The frame 153 and the retaining rings 151 are, for example, made of an electrically insulating material, such as plastic. As an example, the frame 153 and the retaining rings 151 form a single piece, for example, molded. On its vertical edge opposite the rings 151, the frame 153 may include an opening, not visible in the figures, for a rod 131 to pass through.

[0065] In this example, the mounting bracket 150 also provides an electrical connection function for the reference terminals or connection ranges of the printed circuit board 112 to the support structure 130. The reference terminals are intended to be connected to a reference potential of the device, for example, ground or any other reference potential, such as a positive supply potential. For this purpose, in this example, the bracket 150 includes an electrically conductive part 155, for example, metallic, in contact on one side with a reference connection terminal (not detailed in Figure 4) of the printed circuit board 112 and on the other side with the metal rod 131 passing through the mounting rings 151 of the bracket 150.Thus, the reference terminals of the printed circuit boards 112 of the various elementary modules 110 in the same column are all connected to each other via the metal rod 131 passing through the retaining rings 151 of said modules. The various metal rods 131 of the support structure 130 can be. electrically connected to each other by a connecting piece, not shown, of the support structure 130, made of an electrically conductive material. This ensures equipotentiality of the reference terminals of the different modules 110. As an example, the connecting piece can be an upper plate and / or a lower plate 133 (visible in Figure 5) made of an electrically conductive material. Each plate can include openings through which the conductive rods 131 pass, thus ensuring the lateral spacing of the rods 131 and the electrical connection between the different rods 131.

[0066] In the example shown, the electrically conductive part 155 of the mounting bracket 150 includes a metal rod 155a of a length substantially equal to the height of the frame 153. The rod 155a is provided, at each of its two ends, with a tab 155b, respectively 155c. Each of the tabs 155b and 155c includes a through opening 155d, respectively 155e, intended to be traversed by the conductive rod 131 passing through the mounting rings 151 of the bracket 150. Thus, the conductive rod 131 comes into mechanical and electrical contact with the part 155 at the periphery of the openings 155d, 155e of the tabs 155b, 155c. The rod 155a is further provided, in a central part, with a paste 155f intended to be made in mechanical and electrical contact with a reference terminal of the printed circuit board 112.

[0067] The assembly of the elementary modules 110 and their attachment to the support structure 130 can be carried out as follows.

[0068] The printed circuit boards 112 are prepared prior to the assembly phase. The printed circuit boards 112 and the conductive parts 155 can then be mounted on the support frames 153. In each module 110, A clamping screw (not shown) may be provided to secure the printed circuit board 112 and the conductive part 155 to the frame 153. This screw also ensures good electrical contact between the reference terminal of the printed circuit board 112 and the contact tab 155f of the conductive part 155. The protective cover 120 can then be clipped onto the frame 153, above the printed circuit board 112.

[0069] The elementary modules 110 can then be threaded in a column onto the conducting rods 131 of the support structure 130.

[0070] A clamping device (not detailed in the figure) may be provided at the ends of each rod 131 to ensure the vertical clamping of the elementary modules 110 of each column. For example, the rods 131 are threaded, and the clamping device comprises, for each rod 131, a nut (not detailed in the figures) screwed onto the lower end and / or a nut (not detailed in the figures) screwed onto the upper end of the threaded rod, ensuring the vertical clamping of the column. More generally, any other equivalent clamping system may be provided.

[0071] In the example described above, the protective housing 120 is designed to transmit the light emitted by the LED array 114 without significant alteration. Alternatively, the protective housing 120 can have any other desired optical function, for example, a lens function or a function for directing light in a specific direction (prism).

[0072] Figure 5 is a partial exploded front view of an example of an LED lighting device according to one embodiment.

[0073] The device in Figure 5 includes an illuminating structure 100 identical or similar to the structure described in relation to Figure 1.

[0074] The device in Figure 5 further includes, fixed under the lower plate 133 of the lighting structure, a fan 160, also called a thermal fan, intended to circulate the air located inside the volume delimited by the elementary modules 110, in order to facilitate the evacuation of the heat generated by the LEDs.

[0075] The device in Figure 5 further includes, fixed beneath the lower plate 133 of the lighting structure, a service stage 170 comprising, in particular, electronic circuits for powering and controlling the lighting structure. The service stage 170 may include a support structure of the same type as that of the lighting structure. The electronic power and control circuits may be mounted on one or more printed circuit boards 172 fixed to the support structure, for example, by means of mounting brackets of the same type as the brackets 150 of the lighting structure.

[0076] In this example, the lighting device is a balloon-type lighting device, comprising an inflatable envelope, not shown in Figure 5, enveloping the lighting structure 100 and the service floor 170.

[0077] To enable inflation of the envelope, the service stage includes a fan 174, called an inflation fan, adapted to draw air from the lower part of the device, to inject it into the envelope.

[0078] In the example shown, the device further includes a support mast 180 fixed to a lower plate of the service stage 170.

[0079] Figure 6 is a schematic front view of an inflatable-envelope lighting balloon of the type described above.

[0080] In Figure 6, the lighting structure 100, the service stage 170 and the support mast 180 have been schematically represented by dotted lines.

[0081] In this example, the lighting system comprises an inflatable envelope 190 surrounding the assembly consisting of the lighting structure 100 and the service floor 170. The envelope 190 is a flexible envelope, for example, a textile envelope. The envelope 190 is preferably watertight and airtight and protects all the mechanical and electronic components of the lighting structure and the service floor from external elements. The envelope 190 can also act as an optical diffuser for the light emitted by the lighting structure. In other words, the envelope 190 is designed to transmit, by diffusing it, the light emitted by the lighting structure.

[0082] The inflation of the envelope 190 is ensured by the inflation fan 174 (not visible in figure 6), when the lighting device is put into service.

[0083] It should be noted that the lighting structures described above are not limited to use in inflatable balloon-type lighting devices. As an alternative, the inflatable envelope 190 can be replaced by a flexible, non-inflatable envelope, for example, stretched over supports (not shown) of the support structure, or by a rigid envelope or shell. In this case, the inflation fan 174 and the associated electronic power and control circuits can be omitted.

[0084] Figure 7 is a simplified electrical diagram of an LED lighting device according to one embodiment.

[0085] It should be noted that, in the examples of lighting structures described above, regardless of the structure's shape, the elementary modules 110 define a matrix of M rows by N columns, where M and N are integers greater than or equal to 1. The number M of rows corresponds to the number of levels in the structure. The number N of columns corresponds to the number of elementary modules 110 per level. Each row is defined by the set of N elementary modules 110 in that level. Each column is defined by the set of M elementary modules 110 in the same position across the different levels. Thus, the M*N elementary modules 110 define a matrix screen that can be planar (in the example in Figure 3) or rolled up (in the examples in Figures 1 and 2).

[0086] According to one embodiment, a matrix control system for the lighting structure is implemented, in which each elementary module 110, also called a pixel, can be controlled individually. Figure 7 illustrates in more detail an example of an interconnection diagram of the elementary modules 110 and peripheral power and control circuits for the lighting structure, enabling the implementation of such a matrix control system.

[0087] It should be noted that, depending on the applications considered, some elementary modules 110 of the matrix may be omitted. In other words, the matrix may have gaps. In particular, in certain configurations, different columns may have different numbers of elementary modules 110, and / or different rows may have different numbers of elementary modules 110. A person skilled in the art will be able to adapt the control solutions described below to such configurations.

[0088] In this example, we considered a lighting structure of 9 elementary modules 110 arranged in a matrix with M=3 rows and N=3 columns. The described embodiments can, of course, be adapted to any other matrix dimensions. We will hereafter denote by i, an integer from 1 to M, the rank of the elementary modules in each column, where i=l corresponds to the lowest module 110 and i=M corresponds to the highest module 110 in the column, and by j, an integer from 1 to N, the rank of the elementary modules in each row, where j=l corresponds to the leftmost module 110 and j=N corresponds to the rightmost module 110 in the row. Furthermore, for the sake of simplicity, we will denote by the reference 110i f j is the elementary module 110 of row i of column j of the matrix.

[0089] In each of the N columns of the matrix, the elementary modules 110 of the column are chained together by their respective connectors 118. More specifically, each module 110i f j, with the exception of the upper module 110 Mf j, is connected, via its upper connector 118, to the lower connector 118 of the module of rank 110i+i f j of the same column. The lower connector 118 of the lower module 110i f j of the column is connected to a column-specific connector 201j on a distribution electronic board 210 (DISTRIB). In this example, the upper connector 118 of the upper module 110 Mf j in column j is not connected.

[0090] In this example, each of the connectors 118 and 201j is a three-terminal connector. More specifically, two terminals are dedicated to transmitting a DC power supply voltage to the modules 110, and the third terminal is dedicated to transmitting a control signal to the modules 110, for example, a serialized digital signal.

[0091] In each elementary module 110, the module's printed circuit board 112 comprises three tracks Separate conductors connect the three terminals of the lower connector 118 of the module to the three terminals of the upper connector 118 of the module. For each column, the connection is between connector 201j of the distribution board 210 and the lower connector 118 of module 110i. fj, and the step-by-step connections between neighboring modules of the column can be made by means of conductive wires, for example by means of three-wire conductive ribbons or by means of rigid conductors.

[0092] In each elementary module 110, the module's power and control circuit 116 receives the power and control signals propagated through the connectors 118, and accordingly controls the module's set of LEDs 114.

[0093] In this example, the 110 elementary modules of separate columns are not directly connected to each other.

[0094] The device in Figure 7 further includes an electronic control board 220 (CTRL), connected to the distribution board 210, specifically designed to generate and transmit to the distribution board 210 the control signals for the elementary modules 110 of the lighting structure. The distribution board 210 and the control board 220 are, for example, implemented on two separate printed circuit boards. The distribution board 210 and the control board 220 are, for example, mounted on the service stage 170 (Figures 5 and 6) of the lighting system.

[0095] The 210 distribution board can be connected to a 230 power supply unit (SUP) which is itself connected to one or more power supply sources (not detailed), for example a continuous power supply such as an electric battery and / or an alternative power supply, for example mains voltage.

[0096] The lighting system may also include a user interface device, not shown, connected to the 220 electronic control board via a wired or wireless connection. The user interface may, for example, be an application on a smartphone connected to the 220 electronic control board via wireless communication.

[0097] Figure 8 illustrates in more detail an example of the realization of an elementary lighting module 110 of the LED lighting device of Figure 7.

[0098] Figure 8 details the three connection terminals of each connector 118. The V+ and V- terminals correspond respectively to a positive and a negative terminal for applying the DC supply voltage to the module 110. The potential applied to the V- terminal corresponds, for example, to the reference potential of the module. Thus, in an assembly of the type described in relation to Figures 1 to 4, the reference terminal (not detailed in the figures), electrically connected to the support structure 130 via the metal part 155 of the mounting bracket 150, is a conductive area or trace of the printed circuit board 112 connected to the V- terminals of the module's connectors 118.

[0099] In this example, module 110 is a white LED lighting panel. However, the same principle can be applied to colored, ultraviolet, infrared LEDs, or any other range of light emission wavelengths. The LED array 114 consists of a series connection of white LEDs (not detailed in the figure), for example, identical or similar LEDs, and includes two power supply terminals connected respectively to the anode. from the first LED and to the cathode of the last LED in the series association.

[0100] The power supply and control circuit 116 includes a power supply circuit 301 and a power switch 303. The switch 303 includes two input terminals connected respectively to the V+ and V- power supply terminals of the module 110, and two output terminals connected respectively to two input terminals of the power supply circuit 301. The power supply circuit 301 further includes two output terminals connected respectively to the two power supply terminals of the LED assembly 114.

[0101] When switch 303 is in its first state, called the conducting state, the input terminals of power supply circuit 301 are connected to the V+ and V- supply terminals of the module, respectively, so that the supply voltage of module 110 is applied to the input of power supply circuit 301. Power supply circuit 301 then provides, between its output terminals, a supply current or voltage that causes the LEDs to light up. Preferably, power supply circuit 301 is a constant output current DC-DC converter, which has the advantage of being particularly well-suited for powering LEDs. As an example, the supply voltage of module 110 is between 10 and 100 volts, for example, around 50 volts.

[0102] When switch 303 is in its second state, called the blocked state, the input terminals of power supply circuit 301 are isolated from the V+ and V- supply terminals of the module, so that the module's supply voltage is not applied to the input of power supply circuit 301. The LEDs are then not powered and remain off. In practice, switch 303 can have other functions besides the aforementioned switching function, for example... function for limiting inrush current at startup and / or a function for reshaping the on / off logic, for example to avoid a flash when the product is powered on.

[0103] In this example, the module's power supply and control circuit 116 further includes a control circuit 305, for example, a digital circuit. The control circuit 305 is connected to a control terminal C of the module 110. Thus, the circuit 305 receives the control signal propagated step by step through each column of the module matrix 110. The circuit 305 is adapted to interpret this signal and accordingly control the switch 303 and / or the power supply circuit 301. For example, the circuit 305 is adapted to control the switch 303 to the open or closed state to turn the LEDs of the module 110 on or off. The circuit 305 can also be adapted to control the power supply circuit 301 to vary the electrical power supplied to the LEDs of the assembly 114, and thus vary the light output of the module.

[0104] Figure 9 illustrates an alternative embodiment of the elementary lighting module 110 of Figure 8.

[0105] In this example, the LED set 114 comprises two subsets of LEDs, 114a and 114b. The LEDs in subset 114a and the LEDs in subset 114b have different emission properties. For example, the LEDs in subset 114a are suitable for emitting cool white light, and the LEDs in subset 114b are suitable for emitting warm white light. Each subset, for example, consists of a series connection of a plurality of identical or similar individual LEDs.

[0106] The power and control circuit 116 includes two power supply circuits 301a and 301b, and two power switches 303a and 303b. Each of the Switches 303a and 303b each have two input terminals connected to the V+ and V- supply terminals of module 110, respectively. Switch 303a has two output terminals connected to the two input terminals of power supply circuit 301a, respectively. Switch 303b has two output terminals connected to the two input terminals of power supply circuit 301b, respectively. Power supply circuit 301a has two output terminals connected to the two supply terminals of LED sub-assembly 114a, respectively. Power supply circuit 301b has two output terminals connected to the two supply terminals of LED sub-assembly 114b, respectively.

[0107] When switch 303a is in its first state, called the conducting state, the input terminals of power supply circuit 301a are connected to the V+ and V- supply terminals of the module, respectively. Power supply circuit 301a then supplies a current or voltage between its output terminals, causing the LEDs of subassembly 114a to light up. Similarly, when switch 303b is in its first state, called the conducting state, the input terminals of power supply circuit 301b are connected to the V+ and V- supply terminals of the module, respectively. Power supply circuit 301b then supplies a current or voltage between its output terminals, causing the LEDs of subassembly 114b to light up. Power supply circuits 301a and 301b are, for example, constant output current DC-DC converters.

[0108] When switch 303a is in a second state, called the blocked state, the input terminals of power supply circuit 301a are isolated from the V+ and V- power supply terminals of the module, so the LEDs in subassembly 114a are not powered. Similarly, when the switch 303b is in the blocked state, the LEDs of the subset 114b are not powered.

[0109] In this example, the module's power supply and control circuit 116 further includes a control circuit 305, for example, a digital circuit, connected to the control terminal C of the module 110. The circuit 305 receives the control signal propagated step by step through each column of the module matrix 110 and is adapted to control switches 303a and 303b and / or power supply circuits 301a and 301b accordingly. For example, the circuit 305 is adapted to control each of switches 303a and 303b to the open or closed state to turn the LEDs of the corresponding subassembly 114a or 114b on or off. The circuit 305 can also be adapted to control each of the power supply circuits 301a and 301b to vary the electrical power supplied to the LEDs of the corresponding subassembly 114a or 114b. This allows you to vary the light output and / or the tone (from warm to cool) of the light emitted by the module.More generally, the solution described above allows the intensity of each channel to be varied, each channel providing a light spectrum defining a hue in a bandwidth ranging from the near UV (ultraviolet) to the near IR (infrared) covering the entire visible spectrum.

[0110] The variant in Figure 9 can be adapted to a number of LED subsets of distinct types other than two. For example, the LED set 114 can include a plurality of subsets adapted to emit in distinct wavelength ranges, for example, three LED subsets adapted to emit predominantly blue light, predominantly green light, and predominantly red light, respectively. By modulating the power emitted by the different sub- Together, we can thus control the emission color of the module.

[0111] To individually control the various elementary modules 110 in the same column, the control data for the different modules can be transmitted sequentially on the column's control wire, according to a predetermined sequence. In each lighting module 110, the module's control circuit 305 can identify its intended control code. Implementing a suitable control protocol on a binary bus is within the capabilities of a person skilled in the art, based on the functional specifications in this description, and will therefore not be described in further detail.

[0112] Figure 10 schematically illustrates an example of the implementation of the distribution board 210 of a lighting device of the type described in relation to Figure 7.

[0113] In the example shown in Figure 10, the distribution board 210 is adapted to redistribute power and control signals to and from various components of the lighting system, including the power supply unit 230 (Figure 7), the control board 220 (Figure 7), and the module matrix 110 (Figure 7). In this example, the distribution board is further adapted to distribute power and control signals to and / or from the thermal fan 160 (Figure 5) and the inflation fan 174 (Figure 5).

[0114] In addition to the 201j connectors (PWR CON) intended to be connected respectively to the lower 118 connectors of the 110i elementary modules fj of the different columns, the distribution board 210 of Figure 10 includes a main power connector 401 (PWR SRC CON) intended to be connected to the device's power supply. Connector 401 includes two application terminals, V+ and V-. of a main DC supply voltage, connected respectively, via conductive traces of the board 210, to the V+ and V- supply terminals of the connectors 201j. The distribution board 210 may further include a multiplexer (not detailed in figure 10) adapted to select, where appropriate, from among the different available power sources, the power source used to provide the main DC supply voltage of the distribution board.

[0115] In this example, the distribution board 210 includes a power sensor 403 (PWR SENS) connected to the V+ and V- terminals of connector 401, adapted to measure the electrical power drawn on the main supply terminals V+ and V- of connector 401. As an example, the sensor 403 includes a sensor adapted to measure the voltage between the V+ and V- terminals of connector 401, and a sensor adapted to measure the current flowing between the V+ and V- terminals of connector 401.

[0116] Note that in the example in Figure 10, the main DC supply voltage of the distribution board is applied directly (without level adaptation) between the V+ and V- terminals of each 201j connector.

[0117] In the example shown in Figure 10, the distribution board 210 further includes a connector 405 (CPU CON) intended to be connected to the electronic control board 220 (Figure 7) of the lighting device. Connector 401 includes two terminals. ctr i+ and v ctr i _ adapted to provide a DC supply voltage to the electronic board of 220, for example a voltage lower than the main DC supply voltage of the distribution board, for example a voltage of around 5V. The terminals v ctr i+ and v ctr i _ correspond respectively to a positive terminal and a negative terminal for voltage application continuous power supply to the control board. The potential applied to terminal v ctr i _ corresponds for example to the reference potential (or ground potential) applied to the V- terminals of connectors 401 and 201j.

[0118] To generate the supply voltage for the control board 220, the distribution board 210 further includes a power supply circuit 407 (CPU PSU), for example a DC-DC converter, having two input terminals connected respectively to the V+ and V- terminals of connector 401, and two output terminals connected, for example, respectively to the V- terminals. ctr i+ and v ctr i _ •

[0119] Connector 405 further includes a terminal C intended to be connected to a terminal supplying a control signal to the control board 220. Terminal C of connector 405 is connected to terminals C of connectors 201j

[0120] In the example in Figure 10, the distribution board 210 further includes a connector 409 (Tfan CON) intended to be connected to the thermal fan 160 (Figure 5) of the device, and a connector 411 (Pfan CON) intended to be connected to the inflation fan 174 (Figure 5) of the device.

[0121] Connector 409 includes two terminals v Tfan + and v Tfan - adapted to provide a DC supply voltage for the thermal fan 160, for example a voltage lower than the main DC supply voltage of the distribution board, for example a voltage of around 24V. The terminals v Tfan + and v Tfan - correspond respectively to a positive and a negative terminal for applying the DC supply voltage to the thermal fan. The potential applied to the terminal v T f an - corresponds for example to the reference potential (or ground potential) applied to the V- terminal of connector 401.

[0122] Similarly, connector 411 includes two terminals v Pfan + and v Pfan- adapted to provide a DC supply voltage to the inflation fan 174, for example a voltage lower than the main DC supply voltage of the distribution board, for example a voltage of around 24V. The terminals v Pfan + and v Pfan - correspond respectively to a positive and a negative terminal for applying the DC supply voltage to the thermal fan. The potential applied to the terminal v P f an - corresponds for example to the reference potential (or ground potential) applied to the V- terminal of connector 401.

[0123] In this example, to generate the supply voltages for the thermal fan and the inflation fan, the distribution board 210 includes a power supply circuit 413 (FANS PSU), for example a DC-DC converter, having two input terminals connected respectively to the V+ and V- terminals of connector 401, and two output terminals connected, for example, respectively to the V- terminals. T fan+ and v Tfan -, and two output terminals connected, for example connected, respectively to the V terminals Pfan + and V Pfan - .

[0124] The distribution board 210 in Figure 10 further includes one or more dBUS buses for transmitting control signals, for example, digital signals. In the example shown, a dBus control signal transmission bus connects, in particular, a control port of connector 411 to a data input / output port of connector 405. In this example, a dBus control signal transmission bus also connects a data output port of power sensor 403 to the data input / output port of connector 405. A dBus control signal transmission bus further connects a control port of connector 409 and a power supply circuit control port 413 to the data input / output port of connector 405.

[0125] The implementation of the control board 220 for the device in Figure 7 has not been detailed. The control board 220 may include one or more computing and processing circuits, for example a microprocessor and / or a microcontroller, and / or one or more memory circuits.

[0126] Figure 11 schematically illustrates, in block form, the steps of an example of a fault detection method in an LED lighting device of the type described above. This method can be implemented at startup of the lighting device and / or during operation, for example at periodic intervals, and aims to detect and locate a potentially faulty elementary module 110. The method in Figure 11 can be implemented using the electronic distribution board 210 and control board 220 (Figure 7) of the device.

[0127] The process in Figure 11 consists of testing each column of the matrix of elementary modules 110 one after the other in order to identify any anomaly in the column, and, when an anomaly is detected, testing each of the elementary modules 110 in the column one after the other to identify the faulty module.

[0128] During a 501 step, a column index x is initialized to the value of the first column's rank in the matrix (x=l). At this step, a fault indicator flag, for example binary, is initialized to a value corresponding to the absence of a fault (flag=0).

[0129] During step 503 the current I co The energy i(x) consumed by the column of rank j=x is estimated. To do this, all elementary modules 110 of columns of rank j other than x are deactivated, that is, switched to the off state, and all The elementary modules of the column at rank j=x are activated, that is, switched on. The current flowing between the V+ and V- terminals of connector 401 is then measured using the power sensor 403. This provides an estimate of the current I co i(x) consumed by the column of rank j=x (considering the sum of the currents consumed by the deactivated columns of the matrix, by the electronic control board, and by the fans, as negligible or known).

[0130] During step 503, the current I co i(x) is compared to a nominal reference value I re f coi, for example stored in a memory circuit of the electronic control board 220. The value I re f C oi corresponds to the current normally flowing in a column of the matrix of elementary modules 110 in the absence of a fault in that column.

[0131] If, at step 503, the current I coi(x) measured is equal or substantially equal (within a predetermined tolerance range, for example plus or minus ten percent) to the value I re f C oi (Y) , we can consider that the column is working correctly. In this case, the rank x is incremented at a step 505 (x=x+l) .

[0132] Otherwise (N), we can assume that at least one elementary module 110 in the column is faulty. In this case, the elementary modules 110 in the column are tested one by one during step 507 (Test Col(x)). Examples of implementing step 507 will be described in more detail below in relation to Figures 12 and 13. If, in step 507, a module 110 in the column is considered faulty, the fault indicator flag is set to a value corresponding to the presence of a fault (flag=l). At the end of step 507, step 505, which increments the rank x, is implemented (x=x+l).

[0133] After step 505, a check is performed in step 509 to see if all columns have been tested (x>N). If not (N), steps 503, 507 (if applicable), 505, and 509 are repeated.

[0134] If all columns have been tested (Y), a step 511 determines whether the fault indicator flag is at a value corresponding to the presence of a fault (flag=l). If so (Y), an alert, for example a light alert, can be issued during a step 513 (W). If no fault has been detected (N), the process terminates.

[0135] Figure 12 illustrates an example of the implementation of step 507 of testing a column of rank j=x of the process of Figure 11.

[0136] The process in Figure 12 consists of testing one after the other all the elementary modules 110 of the column of rank j=x in order to identify a possible faulty module.

[0137] During a 601 step, a row index y is initialized to the value of the rank of the first row of the matrix ( y=l ).

[0138] Next, in step 603, all the elementary modules 110 of the matrix are switched on. A current I is then measured using sensor 403. re f represents the total current flowing through the device.

[0139] During step 605, the elementary module 110 yfX is deactivated (controlled to the off state). The other elementary modules 110 of the device remain controlled to the on state, and the total current I flowing through the device is measured by means of the sensor 403.

[0140] In step 607, the current I measured in step 605 is compared to the difference between the current I re f measured in step 603 and a nominal reference value I re f pix, for example stored in a memory circuit of the card 220V electronic control. The value I re f P ix corresponds to the current normally flowing in an elementary module 110 in the absence of a module fault.

[0141] If, at step 607, the current I is equal to or substantially equal to (within a predetermined tolerance margin, for example plus or minus ten percent) the value Iref - Iref pix (Y), the module can be considered to be functioning correctly. In this case, the rank y is incremented at step 609 (y=y+l).

[0142] Otherwise (N), we can assume that the module 110 yfXis faulty. The fault indicator flag is then set to a value corresponding to the presence of a fault (flag=l) during step 611. The coordinates of the faulty module in the matrix can also be stored, for example, to be transmitted to a user via a user interface (not detailed). Following step 611, step 609, which increments the rank y, is implemented (y=y+l).

[0143] After step 609, a check is made in step 613 to see if all the modules in the column of rank x have been tested (y>M). If not (N), steps 603, 605, 607, 611 (if applicable), 609, and 613 are repeated.

[0144] If all modules in the column have been tested (Y), the column testing step ends.

[0145] The method shown in Figure 12 is a subtractive analysis method particularly well-suited to detecting faults that cause a drop in power consumption in the faulty module. It minimizes module shutdowns during the test phase, which is especially advantageous when the test is performed while the device is in operation.

[0146] Figure 13 illustrates another example of implementation of step 507 of testing a column of rank j=x of the process of Figure 11.

[0147] Here again, we test one after the other all the elementary modules 110 of the column of rank j=x in order to identify a possible failing module.

[0148] During a 701 step, a row index y is initialized to the value of the rank of the first row of the matrix ( y=l ).

[0149] Next, in step 703, all the elementary modules 110 of the matrix, except for the elementary modules in column j=x, are switched on. The elementary modules in column j=x are all switched off. A current I is then measured using sensor 403. re f represents the total current flowing through the device.

[0150] During step 705, the elementary module 110 yfX is activated (controlled to the on state). The other elementary modules 110 of the device remain controlled in the same state as in step 703. The total current I flowing through the device is then measured by means of the sensor 403.

[0151] During step 707, the current I measured in step 705 is compared to the sum I re f + Iref pix -

[0152] If, at step 707, the current I is equal to or substantially equal to (within a predetermined tolerance margin, for example plus or minus ten percent) the value Iref+Iref pix (Y), the module can be considered to be functioning correctly. In this case, the rank y is incremented at step 709 (y=y+l).

[0153] Otherwise (N), we can assume that the module 110 yfX is faulty. The fault indicator flag is then set to a value corresponding to the presence of a fault. (flag=l) during step 711. The coordinates of the faulty module in the matrix can also be stored, for example, to be transmitted to a user via an undetailed user interface. Following step 711, step 709, which increments the rank y, is implemented (y=y+l).

[0154] After step 709, step 713 checks whether all modules in column x have been tested (y>M). If not (N), steps 703, 705, 707, 711 (if applicable), 709, and 713 are repeated.

[0155] If all modules in the column have been tested (Y), the column testing step ends.

[0156] The method in Figure 13 is an additive analysis method particularly suited to detecting faults that generate overconsumption in the faulty module.

[0157] Depending on the application requirements, at step 507 of the process in Figure 11, one can choose to apply either of the processes in Figures 12 and 13, or both successively.

[0158] Note that the reference value I reThe f coi used in step 503 (Figure 11) is chosen according to the level of the light power setpoint applied to the elementary modules during the current measurement phase I coi (x) . Similarly, the reference value I re f P ix used in step 607 (Figure 12) or 707 (Figure 13) is chosen according to the level of the light power setpoint applied to the elementary modules during the current measurement phase I re f (step 603 or 703). As an example, the electronic control board 220 can store several reference values ​​I re f coi and several reference values ​​I re f P ix, corresponding respectively to different lighting power setpoint levels of the elementary modules. For a During initial diagnostic testing, the elementary modules are preferably controlled at a relatively low light level, for example, less than 20 percent of their maximum brightness. In particular, in the case of an inflatable lighting balloon, the balloon's envelope may not yet be inflated during the diagnostic phase. Performing the diagnostic test at a low light level then helps to limit thermal stress within the device.

[0159] More generally, other testing strategies than those described in relation to Figures 11, 12 and 13 can be implemented, based on measurements of power consumed and comparison of the measured powers to reference values.

[0160] For example, during in-use diagnostics, a systematic test of all 110 modules using subtractive analysis, module by module, can be preferred. In other words, the procedure shown in Figure 12 is implemented successively in all columns of the matrix, omitting the preliminary step of selecting suspect columns (step 503 in Figure 11). This limits the loss of luminous flux to the equivalent of a single 110 module.

[0161] As an alternative, for after-sales service diagnostics, a systematic test of all modules 110 can be applied by additive analysis, module by module. In other words, the procedure in Figure 13 is implemented successively in all columns of the matrix, omitting the preliminary step of selecting suspect columns (step 503 in Figure 11). Furthermore, during step 703, which measures the reference current, all the elementary modules 110 in the matrix are switched off. This limits power consumption during the test phase.

[0162] When a faulty module is identified, further in-depth tests can be implemented to determine the cause of the failure.

[0163] It should also be noted that the diagnostic methods described above in relation to Figures 11, 12 and 13 can be applied to any lighting device comprising a plurality of elementary modules 110 arranged in a column, including when the support structure of the device is non-conductive and / or does not ensure the equipotentiality function of the reference potentials of the different elementary modules 110.

[0164] Figure 14 schematically illustrates, in block form, an example of a method for controlling the inflation of the envelope of an inflatable lighting balloon according to one embodiment. This method can be implemented during the commissioning of the device, when the envelope is being inflated. The method in Figure 14 can, for example, be implemented using the electronic distribution board 210 and control board 220 (Figure 7) of the device.

[0165] In this example, the inflation fan 174 of the device is a variable-speed fan comprising a control data input / output port, connected to the control electronic board 220 via a data bus, for example, a digital dBus from the distribution board 210. The control input / output port of the fan 174 includes, in particular, one or more input terminals adapted to receive a power setpoint signal from the fan's power supply. The control input / output port of the fan further includes one or more output terminals adapted to provide a feedback signal representing the actual rotational speed of the fan, measured by means of a rotational speed sensor (not detailed in the figures) integrated into the fan.

[0166] Before the inflation phase, the envelope is initially deflated, and the inflation fan is at 1' stop.

[0167] During step 801, the fan is commanded to its inflation power, for example, its maximum power, to achieve rapid inflation of the envelope. Throughout the inflation phase, the fan injects air into the balloon envelope. During this phase, the effective rotational speed the fan maintains a certain inflation pressure G , for example substantially constant, which depends on the power setpoint applied.

[0168] At the end of the inflation phase, that is, when the envelope is filled with air, the air pressure inside the balloon stabilizes at a value slightly higher than the external pressure. The airflow displaced by the fan is then reduced. This leads to an increase in the fan's rotational speed (for a given power setting). The fan is said to enter cavitation.

[0169] According to one aspect of an embodiment, the effective rotational speed of the fan is to be monitored in order to detect cavitation and deduce that the inflation of the balloon is complete.

[0170] During step 803, the effective rotational speed QP of the fan is measured by the electronic control board 220. The board 220 determines if the speed measured corresponds to a cavitation velocity Q C A greater than the inflation speed Q G -

[0171] If cavitation is detected at step 803 (Y), the fan power setpoint is reduced at step 805. The fan rotation speed is thus reduced to a value Q LO w, for example less than the value Q GThis allows a virtually constant pressure to be maintained in the tank during the usage phase, while limiting power consumption and fan noise.

[0172] If cavitation is not detected at step 803 (N), a check is performed during step 807 (TIME OUT) to see if the time elapsed since the start of the inflation phase does not exceed a predefined threshold, corresponding to a maximum nominal inflation time.

[0173] If it is determined in step 807 that the maximum inflation time is not exceeded (N), steps 803 and, where appropriate, 807, may be repeated, for example at regular time intervals.

[0174] If it is determined in step 807 that the maximum inflation time is exceeded (Y), it is inferred that the envelope present may be an air leak and an alert is issued to the user during a step 809 (W).

[0175] The process described in relation to Figure 14 has the advantage of allowing simple detection of the end of the inflation phase, and, if necessary, of any leak in the balloon envelope.

[0176] Other control and / or diagnostic procedures based on analysis of a fan speed feedback signal can be implemented by the 220 electronic control board. For example, detecting an abnormally high rotational speed (for a given power setpoint) can indicate that a fan air intake filter is clogged. An alert message can then be displayed to the user, indicating that the filter needs cleaning. A fan fault can also be detected. A fault is detected if the actual fan speed (QP) is found to be inconsistent with the applied power setting. In this case, an alert can also be issued to the user. If a failure of the inflation fan is detected, a safety shutdown can be activated. For example, the 110 elementary modules can be controlled at a low power level, such as around 10% of their maximum power, to prevent potential damage to the casing due to heat emitted by the LEDs.

[0177] The various alerts sent to the user can be issued via a user interface device (not detailed) of the lighting device, for example via a contactless communication channel, such as a radio wave communication channel (e.g., Bluetooth), for example to a mobile terminal such as a smartphone or to a remote maintenance center. Alternatively, the alerts can be issued in the form of light signals, for example, predefined sequences of successive flashes emitted by means of one or more elementary modules 110 of the device.

[0178] It should be noted that the method shown in Figure 14 is not limited to implementation in a matrix LED lighting device of the type described above. More generally, this inflation-end detection method of Figure 14 can be adapted to any lighting balloon with an inflatable envelope and an inflation fan. In particular, this method can be adapted to balloons incorporating other types of lighting structures than those described above, for example, structures based on incandescent lamps.

[0179] Various embodiments and variations have been described. Those skilled in the art will understand that certain characteristics of these various embodiments and Variants could be combined, and other variants will appear to the person skilled in the art. In particular, embodiments are not limited to the examples of numerical values ​​or the examples of materials mentioned in this description.

[0180] Furthermore, in the assembly examples described in relation to Figures 1 to 5, the mounting bracket 150 can be replaced by any other element suitable for ensuring both the mechanical fixing function of the elementary modules 110 on the support structure 130, and the electrical connection function of the reference terminals of the printed circuit boards 112 to the support structure 130, so as to ensure equipotentiality between the reference terminals of the different modules 110. As an example, the mounting bracket can be replaced by fixing clips each equipped with a conductive part connecting a reference terminal of the printed circuit board 112 to the support structure 130.

Claims

43 CLAIMS Lighting device comprising: an electrically conductive support structure (130); and - a plurality of elementary lighting modules (110) fixed to the support structure, each elementary module comprising a printed circuit board (112) and, mounted on the printed circuit board, an array (114) of LEDs and an electronic circuit (116) for powering and controlling the array of LEDs (114), wherein, in each elementary module (110), the printed circuit board (112) of the module comprises at least one reference terminal (V-), the reference terminals (V-) of the printed circuit boards (112) of the various elementary modules (110) being electrically connected to each other via the support structure (130), wherein the elementary modules (110) are arranged in a plurality of columns, each comprising several elementary modules (110), each module comprising two power and control connectors (118),and the elementary modules (110) of the same column being connected in series via their respective power and control connectors (118). Device according to claim 1, wherein each elementary module (110) comprises a mounting bracket (150) for the module on the support structure (130). Device according to claim 2, wherein, in each elementary module (110), the mounting bracket (150) for the module comprises an electrically conductive part (155) electrically connecting a terminal of, 44. Reference (V-) of the printed circuit board of the module to the support structure (130). Device according to claim 3, wherein said electrically conductive part (155) comprises a conductive rod (155a) having at its ends conductive tabs (155b, 155c), each having an opening (155d, 155e) through which a conductive rod (131) of the support structure (130) passes. Device according to any one of claims 2 to 4, wherein each elementary module (110) further comprises a transparent or translucent protective cover (120) positioned opposite the printed circuit board (112) of the module, the protective cover (120) being fixed to said mounting bracket (150) of the module. Device according to any one of claims 1 to 5, wherein the elementary modules (110) are arranged in one or more prism-shaped stages, the modules being arranged on the lateral faces of the prism.A device according to any one of claims 1 to 5, wherein the elementary modules (110) are arranged in a planar configuration. A device according to any one of claims 1 to 7, further comprising an electronic power supply and control circuit (210, 220) connected to one end of each column. A device according to claim 8, wherein the electronic power supply and control circuit (210, 220) is configured to implement a diagnostic method comprising a step of measuring a quantity representative of a current consumed by a column and / or. 45 of a voltage across a column of elementary modules (110). Device according to claim 8 or 9, wherein the electronic power supply and control circuit (210, 220) is configured to implement a diagnostic method comprising the following steps: a) switching an elementary module (110) of a column to the on state and measuring a representative value of the current flowing in the column; b) switching said elementary module (110) of said column to the off state and measuring a representative value of the current flowing in the column; and c) comparing the difference between the value measured in step a) and the value measured in step b) to a nominal reference value (I ref-pix) and, if the difference between said difference and said nominal reference value exceeds a specified margin, conclude that said elementary module (110) is defective. Device according to any one of claims 1 to 10, comprising a diffusing envelope (190) surrounding the support structure (130) and the elementary modules (110). Device according to claim 11, wherein the diffusing envelope (190) is an inflatable envelope.