RESIN COMPOSITION FOR SEALER, LAMINATOR, PACKAGING MATERIAL, AND CONTAINER.

Abstract

A resin composition for a sealant has excellent heat-sealing power with respect to a substrate and a reduced amount of elution thereof in ordinary heptane; a resin composition for a sealant includes: a resin (A) which is an ester of ethylene-(meth)acrylic acid in which a content of one unit of the (meth)acrylic acid ester is from 10% to 25% by mass; and an adhesive agent (B), in which a content of resin (A) is greater than 45% by mass with respect to a total amount of the resin components in the resin composition for a sealant, and a content of adhesive resin (B) is from 0.1% to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.

Description

RESIN COMPOSITION FOR SEALER, LAMINATOR, PACKAGING MATERIAL, AND CONTAINER TECHNICAL FIELD The present invention relates to a resin composition for a sealant, a laminate, a packaging material, and a container. RELATED ART Conventionally, several studies have been conducted on a resin composition for a sealant. A resin composition for a sealant is also called a resin composition for a sealing material. For example, Japanese Patent Application No. 2008-95044 discloses a resin composition for a sealing material containing 30 to 80 parts by mass of an ethylene vinyl ester copolymer resin (A), 1 to 45 parts by mass of an ethylene-(meth)acrylic acid ester copolymer resin (B), and 3 to 30 parts by mass of an adhesive resin (C) (where a total amount of resins (A), (B), and (C) is 100 parts by mass), wherein the resin composition for a sealing material is at least a heat-sealable material that is suitable as a heat-sealable material used for a plastic container, and particularly for a high-impact polystyrene container, has a spalling resistance within an appropriate range with respect to a structural member of the main body of the container compared to conventional compositions.It maintains the physical properties required as a heat-sealable material for a protective sealing property of a container's contents, such as food, which are almost identical to those of the conventional composition, and exhibits greater heat resistance and a smooth and convenient peeling property despite heat sealing treatment at a low temperature when compared to the conventional composition. BRIEF DESCRIPTION OF THE INVENTION It may be required that the resin composition for a sealing material described in patent JP-A No. 2008-95044 (i.e., the resin composition for a sealant) have a significantly higher heat-sealing power to a substrate. Furthermore, from a hygiene point of view, it may be required that the resin composition for a sealant have a reduced amount of normal heptane elution. The invention has been prepared taking into consideration the above circumstances znzann / Lznz / E / Yii. An objective of a first aspect of the invention is to provide a resin composition for a sealant that has excellent heat-sealing power with respect to a substrate and a reduced amount of elution in normal heptane. A second aspect of the invention aims to provide a laminate comprising a substrate layer and a sealant layer, having excellent heat-sealing power with respect to a substrate, and wherein the sealant layer has a reduced amount of elution in normal heptane. A third aspect of the invention aims to provide a packaging material including the laminate, having excellent heat-sealing power with respect to a substrate, and wherein the sealant layer has a reduced amount of normal heptane elution. A fourth aspect of the invention aims to provide a package comprising a substrate, a laminate comprising a substrate layer and a sealant layer, and a packaged object, having excellent heat-sealing power between the substrate and the laminate, and wherein the sealant layer has a reduced amount of normal heptane elution. The invention includes the following aspects. < 1> A resin composition for a sealant, containing: a resin (A) that is an ethylene-(meth)acrylic acid ester copolymer in which a content of one unit of the (meth)acrylic acid ester is from 10% by mass to 25% by mass; and an adhesive agent (B), wherein a content of the resin (A) is greater than 45% by mass with respect to a total amount of the resin components in the resin composition for a sealant, and a content of the adhesive resin (B) is from 0.1% by mass to 10% by mass with respect to a total amount of the resin components in the resin composition for a sealant. < 2> The composition of the resin for a sealant according to point <1> , which also comprises a resin (C) that is a copolymer of ethylene vinyl ester. < 3> The composition of the resin for a sealant according to point <1> either <2> , further comprising a resin (D) that is at least one selected from the group of an ethylene-o-olefin copolymer elastomer, a styrene-based elastomer and polyethylene. < 4> The composition of the resin for a sealant according to point <3> , where a resin content (D) is from 5% by mass to 40% by mass with respect to a total amount of the resin components in the resin composition. < 5> The composition of the resin for a sealant according to any of the points <1> to <4> , used as a sealant for packaging material. < 6> The composition of the resin for a sealant according to point <5> , where the packaging material is for the packaging of a skin pack. znzann / i ¡wp / yl < 7> A laminate, which includes: a substrate layer; and a sealant layer containing the resin composition for a sealant according to any of the points <1> to <6> . < 8> Laminating according to point <7> , where the substrate layer contains at least one selected from the group consisting of an ionomer of an ethylene-unsaturated carboxylic acid copolymer and an ethylene-unsaturated ester copolymer. < 9> Laminating according to point <7> or <8> , where the thickness of the laminate is from 40 pm to 300 pm. < 10> A packaging material, including lamination in accordance with any of the points <7> to <9> . The packaging material according to point <10> which also includes a substrate. < 12> The packaging material in accordance with point <11> where the substrate contains polypropylene. < 13> One package, which includes: a substrate; the laminate according to any of the points <7> to <9> ; and a packaged object, packaged by the substrate and the laminate. According to a first aspect of the invention, a resin composition is provided for a sealant having excellent heat-sealing power with respect to a substrate and a reduced amount of elution in normal heptane. According to a second aspect of the invention, a laminate is provided comprising a substrate layer and a sealant layer, having excellent heat-sealing power with respect to a substrate, and wherein the sealant layer has a reduced amount of normal heptane elution. According to a third aspect of the invention, a packaging material including the laminate is provided, having excellent heat-sealing power with respect to a substrate, and wherein the sealant layer has a reduced amount of normal heptane elution. According to a fourth aspect of the invention, a package is provided comprising a substrate, a laminate comprising a substrate layer and a sealant layer, and a packaged object, having excellent heat-sealing power between the substrate and the laminate, and wherein the sealant layer has a reduced amount of normal heptane elution. DETAILED DESCRIPTION OF THE INVENTION ζηζαηη / ίζηζ / Ε / γι In the invention, a range of numerical values ​​indicated by a / up to represents a range that includes the numerical values ​​described before and after a / up to as the minimum value and the maximum value, respectively. znzann / Lznz / Em In the invention, in a case where a plurality of substances corresponding to the components are present in the composition, the amount of each component in the composition means the total amount of the plurality of substances present in the composition, unless otherwise stated. In the range of numerical values ​​described in a step-by-step manner in the invention, an upper limit value or a lower limit value described in a certain range of numerical values ​​may be replaced with an upper limit value or a lower limit value from the range of numerical values ​​of another step-by-step description or may be replaced with the values ​​shown in the examples. In the invention, (meth)acrylic acid is a concept that encompasses both acrylic acid and methacrylic acid, and (meth)acrylic acid ester is a concept that encompasses both an ester of acrylic acid and an ester of methacrylic acid. [Resin composition for sealant] A resin composition for a sealant of the invention comprises: a resin (A) that is an ethylene-(meth)acrylic acid ester in which a content of one unit of the (meth)acrylic acid ester is from 10% by mass to 25% by mass; and an adhesive agent (B), in which a content of the resin (A) is greater than 45% by mass with respect to a total amount of the resin components in the resin composition for a sealant, and a content of the adhesive resin (B) is from 0.1% by mass to 10% by mass with respect to a total amount of the resin components in the resin composition for a sealant. The resin composition for a disclosure sealant has heat sealing power with respect to a substrate. The resin composition for a sealant of the invention has a reduced elution amount in normal heptane, where the elution amount is one of the hygienic indices. The reason for exhibiting the effects is assumed to be as follows. The following is considered to contribute to the effect of excellent heat sealing power with respect to a substrate: the content of the (meth)acrylic acid ester unit in the resin (A) (i.e., ethylene-(meth)acrylic acid ester copolymer) is 10% by mass or more; the content of resin (A) with respect to the total amount of resin components in the resin composition for a sealant (hereafter simply referred to as the resin (A) content) is greater than 45% by mass; and the content of adhesive resin (B) is 0.1% by mass or more. The following are considered to be contributors to the effect of reducing the amount of elution in normal heptane to some extent: the content of the adhesive resin (B) with respect to the total amount of resin components in the resin composition for a sealant (hereafter simply referred to as the content of the adhesive resin (B)) is 10% by mass or less; and the content of the (meth)acrylic acid ester unit in the resin (A) (i.e., ethylene-(meth)acrylic acid ester copolymer) is 25% by mass or less. In particular, the resin composition for a sealant of the invention has excellent adhesion to a substrate containing a resin [for example, polyethylene (PE), polypropylene (PP), polystyrene (PS), high impact polystyrene (HIPS), polyethylene terephthalate (PET), a mixture of polyethylene (PE) and polybutene (PB), or a mixture of polyethylene (PE) and polypropylene (PP)]. The substrate containing a resin may also contain a filler and the like. In a case where a film containing PE, PP, PS, HIPS or PET is used as a substrate, the film can be a stretched film or an unstretched film. Examples of a substrate containing a mixture of PE and PB or a mixture of PE and PP include a cohesive failure film. Among the substrates containing the resin described above, for example, polypropylene (PP) substrates are relatively difficult to bond effectively to other objects with heat. The resin composition for the sealant described above provides excellent heat sealing even to polypropylene (PP) substrates (see Examples below). <Resina (A)> The resin composition for a sealant of the invention contains a resin (A). Resin (A) is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit (i.e., a structural unit derived from the (meth)acrylic acid ester) is from 10% to 25% by mass. Here, the content of the (meth)acrylic acid ester unit is a content with respect to a total amount of the ethylene-(meth)acrylic acid ester copolymer (i.e., resin (A)) (when two or more types of (meth)acrylic acid ester units are included in resin (A), the content means a total content of the same). The resin (A) contained in the resin composition for a sealant of the invention can be used alone, or in combination with two or more of these. The (meth)acrylic acid ester unit contained in resin (A) can be used alone, or in combination with two or more of the same. In the resin composition for a sealant of the invention, the content of the (meth)acrylic acid ester unit in the resin (A) is 10% by mass or more, such that the heat-sealing power of the sealant resin composition to the substrate is increased. For the purpose of further increasing the heat-sealing power to a substrate, the content of the (meth)acrylic acid ester unit in the resin (A) is preferably 15% by mass or more, and more preferably 18% by mass or more. ζηζαηη / ίζηζ / Ε / γι In the resin composition for a sealant of the invention, the content of the (meth)acrylic acid ester unit in the resin (A) is 25% by mass or less, such that the resin composition for a sealant has a reduced amount of elution in normal heptane. From the point of view of reducing the amount of elution of the resin composition for a sealant in normal heptane, the content of the (meth)acrylic acid ester unit in the resin (A) is preferably 24% by mass or less and more preferably 22% by mass or less. An ethylene unit content (i.e., a structural unit derived from ethylene) in the resin (A) is preferably from 75% to 90% by mass. Here, the ethylene unit content is a content with respect to the total amount of the ethylene-ester copolymer of (meth)acrylic acid (i.e., resin (A)). In the resin composition for a sealant of the invention, the ethylene unit content in the resin (A) is 90% by mass or less, such that the heat-sealing power with respect to the substrate of the sealant resin composition is increased. From the standpoint of further increasing the heat-sealing power with respect to the substrate of the sealant resin composition, the ethylene unit content in the resin (A) is preferably 85% by mass or less, and more preferably 82% by mass or less. In the resin composition for a sealant of the invention, the content of the ethylene unit in the resin (A) is 75% by mass or more, such that the resin composition for a sealant has a reduced amount of elution in normal heptane. From the point of view of reducing the amount of elution of the resin composition for a normal heptane sealant, the content of the ethylene unit in the resin (A) is preferably 76% by mass or more and more preferably 78% by mass or more. The ethylene-(meth)acrylic acid ester copolymer (i.e., resin (A)) may or need to contain other structural units besides the ethylene unit and the (meth)acrylic acid ester unit. The total content of the ethylene unit and the (meth)acrylic acid ester unit in the resin (A) is preferably 80% by mass or more and more preferably 90% by mass or more with respect to the total amount of resin (A). As a monomer to form the ester unit of (meth)acrylic acid, an alkyl ester of (meth)acrylic acid is preferred, and an alkyl ester of (meth)acrylic acid having 1 to 10 carbon atoms in an alkyl ester fraction (i.e., an alkoxy group) is most preferable. In the monomer to form the ester unit of (meth)acrylic acid, the number of carbon atoms of the alkyl ester moiety (i.e., the alkoxy group) is most preferably from 1 to 8, even more preferably from 1 to 6, even more preferably from 1 to znzann / Lznz / Em 4, and even more preferably 1 or 2. Examples of the monomer to form the ester unit of (meth)acrylic acid include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, n-hexyl (meth)acrylate, isohexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. A melt flow rate (MFR, measured in accordance with JIS K7210-1999 under a condition of 190°C and 2,160 g of charge) of the resin (A) is preferably from 0.1 g / 10 min to 100 g / 10 min, more preferably from 1 g / 10 min to 50 g / 10 min, and even more preferably from 1 g / 10 min to 30 g / 10 min, from the point of view of a characteristic and the processability of a resin composition for the sealant. A method of synthesis of the resin (A) is not particularly limited and a known synthesis method may be applied. For the resin synthesis method (A), for example, reference may be made to the descriptions in paragraphs 0020 to 0023 of JP-A patent No. 2008-95044, as appropriate. Specifically, in disclosure, such as the ethylene-(meth)acrylic acid ester copolymer (resin (A)), it is particularly preferable to use a copolymer resin produced by a high-pressure tubular polymerization method. The copolymer resin obtained by this method has a higher melting point compared to an ethylene-(meth)acrylic acid ester copolymer produced by another method, such as the conventional radical polymerization method, even if the copolymer composition and average molecular weight are the same. Furthermore, thermal properties such as viscoelastic behavior in a softened-to-melt state, and other attributes of the copolymer resin obtained by this method differ from those produced by other methods, such that a composition obtained by combining the copolymer resin obtained by this method exhibits improved characteristics compared to the composition described above in the invention. A high-pressure tubular polymerization method is a radical polymerization method that uses a free-radical catalyst at high pressure with the use of a tubular reactor, and examples thereof include a method described in Japanese Open Patent Application (JP-A) No. S62-273214. Specifically, the high-pressure tubular polymerization method is carried out (a) using a tubular reactor, (b) adjusting the reactor inlet pressure from 2300 kg / cm2 to 3000 kg / cm2, and preferably from 2400 kg / cm2 to 2800 kg / cm2, (c) adjusting the average reaction temperature (T) in the reactor to 190°C < T AV < 230°C, and (d) introducing ethylene from the reactor inlet, or from the inlet and at least a side portion, and the total amount of ethyl acrylate, i.e., a comonomer, is introduced from the inlet, whereby it is radically polymerized in the presence of a free-radical catalyst and a chain-transfer agent, and an auxiliary agent, if required. In the copolymer obtained by the polymerization method, a relationship between the ester content of (meth) acrylic acid E (% by weight) and a melting point of the copolymer T (°C) is expressed by the following formula (I). - 0.8 x E + 115 > T > - 0.8 x E + 109 (I) It is characterized in that the copolymer obtained by the polymerization method has a higher melting point than that of a copolymer having an equivalent composition obtained by another polymerization method and is excellent in heat resistance. The copolymer obtained by the above polymerization method has less random sequence of ethylene units or (meth)acrylic acid ester unit, which has a high sequence non-uniformity, and has a polymer structure and physical property similar to those of block copolymers, when compared to copolymers with good randomness produced by conventional radical polymerization methods. Therefore, the melting point and the ester unit content are considered to have the above relationship. The resin content (A) relative to the total amount of resin components in the resin composition for a sealant of the invention (hereinafter simply referred to as the resin content (A)) is greater than 45% by mass. Therefore, the heat-sealing power of the resin composition for a sealant on the substrate is increased. From the point of view of the additional increase in heat sealing power with respect to the substrate of the resin composition for a sealant, the resin content (A) is preferably 46% by mass or more, more preferably 47% by mass or more, and even more preferably 50% by mass or more. An upper limit for a resin content (A) depends on a content of other components such as adhesive resin (B). The upper limit for resin content (A) is 99.9% by mass in principle. Examples of an upper limit for resin content (A) include 98.9% by mass, 98% by mass, 97.9% by mass, 90% by mass, 80% by mass, 70% by mass, and 65% by mass. In the invention, the resin component includes at least the resin (A) and an adhesive resin (B) described below. In a case where the resin composition for a sealant of the invention contains a resin (C) described below, the resin component also includes the resin (C). In a case where the resin composition for a sealant of the invention contains a resin (D) described below, the resin component also includes the resin (D). ζηζαηη / lzoz / e / yij In the resin composition for a sealant of the invention, the total content of the resin components is preferably 80% by mass or more and more preferably 90% by mass or more with respect to the total amount of the resin composition for a sealant. <Resina adhesiva (B)> The resin composition for a sealant of the invention contains an adhesive resin (B). The adhesive resin (B) contained in the resin composition for a sealant can be used alone, or in combination with two or more of these. Examples of adhesive resin (B) include an aliphatic hydrocarbon resin, an alicyclic hydrocarbon resin, an aromatic hydrocarbon resin, a styrene resin, a terpene resin, and resins. Examples of aliphatic hydrocarbon resin include a polymer of a monomeric feedstock that is primarily composed of C4-C5 monoolefin or diolefin, such as 1-butene, isobutene, butadiene, 1,3-pentadiene, isoprene, and piperylene. Examples of alicyclic hydrocarbon resin include a resin obtained by polymerizing the diene components into a C4-C5 fraction after cyclization and dimerization, a resin obtained by polymerizing a cyclic monomer such as cyclopentadiene, and a resin obtained by intranuclear hydrogenation of an aromatic hydrocarbon resin. Examples of aromatic hydrocarbon resin include a polymer of a monomeric feedstock that is primarily composed of C9-C10 vinyl aromatic hydrocarbon, such as vinyl toluene, indene, and α-methyl styrene. Examples of styrene resin include a polymer of a monomeric raw material that is primarily made up of styrene, vinyl toluene, α-methyl styrene, or isopropenyl toluene. Examples of terpene resin include an α-pinene polymer, a β-pinene polymer, a dipentene polymer, a terpene-phenol copolymer, an α-pinene-phenol copolymer, and a hydrogenated terpene resin. Examples of rosins include a rosin, a polymerized rosin, a hydrogenated rosin, a rosin ester, a phenolic rosin resin, and an ester of a phenolic rosin resin. As the adhesive agent, an alicyclic hydrocarbon resin, an aliphatic hydrocarbon resin, or a hydrogenated terpene resin are preferred, with an alicyclic hydrocarbon resin being the most preferred. A softening point with the ring and ball method of the adhesive resin is preferably from 70°C to 150°, and more preferably from 100°C to 130°. The smoothing point of the ring and ball method means a value measured in accordance with JIS K6863 (1994). The content of the adhesive resin (B) with respect to the total amount of resin components in the resin composition for a sealant of the invention (hereinafter simply referred to as the adhesive resin content (B)) is from 0.1% by mass to 10% by mass. In the resin composition for a sealant of the invention, the adhesive resin content (B) is 0.1% by mass or more, such that the heat-sealing power with respect to the substrate of the sealant resin composition is increased. From the standpoint of further increasing the heat-sealing power with respect to the substrate of the sealant resin composition, the adhesive resin content (B) is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 1.5% by mass or more. The ethylene unit content in the adhesive resin (B) is 10% by mass or less, such that the resin composition for a sealant has a reduced elution rate in normal heptane. To reduce the elution rate of the resin composition for a sealant in normal heptane, the content of the adhesive resin (B) is preferably 5% by mass or less, more preferably 3% by mass or less, even more preferably less than 3% by mass, and particularly preferably 2.5% by mass. <Resina (C)> It is preferred that the resin composition for a sealant of the invention contains, in addition, a resin (C) that is an ethylene vinyl ester copolymer. In this case, the resin (C) contained can be used individually, or in combination with two or more of these. In the case where the resin composition for a sealant of the invention also contains resin (C), when a film-shaped laminate is produced, such as a laminate described below, it is advantageous in that the adhesive applied when the laminate is produced is reduced, and the adhesion between the films is reduced. The resin (C) (i.e., the vinyl ester-ethylene copolymer) contains an ethylene unit (i.e., a structural unit derived from ethylene) and a vinyl ester unit (i.e., a structural unit derived from a vinyl ester). As a vinyl aster to form a vinyl aster unit, vinyl acetate or vinyl propionate is preferred, and vinyl acetate is more preferred. A vinyl ester unit content with respect to a total amount of resin (C) (i.e., ethylene-vinyl ester copolymer) (hereafter simply referred to as the vinyl ester unit content) is preferably from 2% by mass to 30% by mass, more preferably from 5% by mass to 25% by mass, even more preferably from 6% by mass to 19% by mass, and even more preferably from 7% by mass to 13% by mass. In the case where the vinyl ester content is 2% by mass or more, the heat sealing power with respect to the substrate of the resin composition of a sealant is further increased. In the case where the vinyl ester content is 30% by mass or less, the heat sealing power with respect to the substrate of the resin composition of a sealant is further increased, and the resin composition for a sealant has a further reduced elution amount in normal heptane. An ethylene unit content with respect to the total amount of resin (C) (i.e., the ethylene-vinyl ester copolymer) (hereafter simply referred to as the ethylene unit content) is preferably from 70% by mass to 98% by mass, more preferably from 75% by mass to 95% by mass, even more preferably from 81% by mass to 94% by mass, and even more preferably from 87% by mass to 93% by mass. In the case where the ethylene unit content is 98% by mass or less, the heat sealing power with respect to the substrate of the resin composition of a sealant is further increased. In the case where the ethylene unit content is 70% by mass or more, the heat sealing power with respect to the substrate of the resin composition of a sealant is further increased, and the resin composition for a sealant has a further reduced elution amount in normal heptane. The resin (C) (i.e., the ethylene-vinyl ester copolymer) may not have, or need not have, any structural units other than the ethylene unit and the vinyl ester unit. The total content of the ethylene unit and the vinyl ester unit in the resin (C) is preferably 80% by mass or more and more preferably 90% by mass or more with respect to the total amount of resin (C). A melt flow rate (MFR, measured in accordance with JIS K7210-1999 under a condition of 190°C and 2,160 g of charge) of the resin (C) is preferably from 0.1 g / 10 min to 100 g / 10 min, more preferably from 1 g / 10 min to 50 g / 10 min, and even more preferably from 1 g / 10 min to 30 g / 10 min, from the point of view of a characteristic and the processability of a resin composition for the sealant. In the case where the resin composition for the sealant of the invention contains the resin (C), the content of the resin (C) with respect to the total amount of the resin components in the resin composition for a sealant (hereinafter simply referred to as the resin (C) content) is preferably from 1% by mass to 50% by mass, more preferably from 5% by mass to 45% by mass, and even more preferably from 15% by mass to 45% by mass. In the case where the resin content (C) is 50% by mass or less, the heat sealing power with respect to the substrate of the resin composition of a zezan / lzoz / e / yij sealant is further increased. In the case where the resin content (C) is 1% by mass or more, when producing a film-shaped laminate such as the laminate described below, it is advantageous in that the roller adhesive used when producing the laminate is reduced and the adhesion between the films is reduced. <Resina (D)> It is preferred that the resin composition for a sealant of the invention contains, in addition, a resin (D) that is at least one selected from the group of an ethylene-α-olefin copolymer elastomer, a styrene-based elastomer, and a polyethylene-based elastomer. In the case where the resin composition for a sealant of the invention also contains resin (D), the heat sealing power with respect to the substrate of the resin composition of a sealant is further increased. From the point of view of obtaining greater effectiveness, it is preferred4 that the resin (D) also contain at least one selected from the group consisting of an ethylene-o-olefin copolymer elastomer and a styrene-based elastomer. The ethylene-o-olefin copolymer elastomer is an elastomer containing one ethylene unit and one o-olefin unit (i.e., a structural unit derived from the o-olefin). The number of carbon atoms of the o-olefin to form the aolefin unit is preferably 3 to 10 and more preferably 3 to 8. Examples of α-olefins forming the α-olefin unit include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, and 4-methyl-l-pentene. The ethylene-o-olefin copolymer elastomer is preferably an ethylene-l-butene copolymer elastomer, an ethylene-propylene copolymer elastomer, or an ethylene-l-octene copolymer elastomer. The ethylene-α-olefin copolymer elastomer is produced, for example, by carrying out random copolymerization in ethylene and α-olefin in the presence of a combination of catalysts of a transition metal compound (e.g., a vanadium compound or a zirconium compound) and an organic aluminum compound. A degree of crystallization of the ethylene-α-olefin copolymer elastomer measured by X-rays is preferably from 1% to 20% (more preferably from 3% to 15%). There are slight differences depending on the type of catalyst or aolefin used, and examples of a method for obtaining the ethylene-aolefin copolymer elastomer having the degree of crystallization include a method for copolymerizing ethylene and aolefin such that the copolymerization ratio of α-olefin is from 7 mol% to 20 mol% (preferably from 8 mol% to 16 mol%). A molten flow rate (MFR, measured according to znzonn / Lznz / Em) JIS K7210-1999 under a condition at 190°C and 2,160 g load) of ethylene-α-olefin copolymer elastomer is preferably from 0.1 g / 10 min to 100 g / 10 min, more preferably from 1 g / 10 min to 50 g / 10 min, and even more preferably from 1 g / 10 min to 30 g / 10 min. A density of the ethylene-α-olefin copolymer elastomer is preferably 850 kg / m3 to less than 900 kg / m3, more preferably 860 kg / m3 to 890 kg / m3, and even more preferably 860 kg / m3 to 880 kg / m3. Examples of styrene-based elastomers include the ABA-type block copolymer (where A represents a styrene copolymer block and B represents an alkylene copolymer block). Here, the styrene copolymer block refers to a portion of polystyrene, and the alkylene copolymer block refers to a portion of an alkylene copolymer obtained by copolymerizing two or more alkenes. Examples of alkylene copolymer blocks include the ethylene-butene copolymer block and an ethylene-propylene copolymer block. This block copolymer is obtained by hydrogenating a styrene-butadiene-styrene block copolymer, or an isoprene copolymer unit from a styrene-isoprene-styrene block copolymer. Examples of ABA-type block copolymers include polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer (SEBS) and polystyrene-poly(ethylene-propylene)-polystyrene triblock copolymer (SEPS). Specific examples of ABA-type block copolymers include Craton G1657 produced by Craton Corporation, and Tuftec H1221 produced by Asahi Kasei Corporation. A melt flow rate (MFR, measured in accordance with JIS K7210-1999 under a condition at 230°C and 5,000 g load) of styrene-based copolymer elastomer (preferably block copolymer type ABA) is preferably from 0.1 g / 10 min to 100 g / 10 min, more preferably from 1 g / 10 min to 50 g / 10 min, and even more preferably from 1 g / 10 min to 30 g / 10 min. Examples of polyethylene include high-density polyethylene (HDPE), low-density polyethylene (LDPE), medium-density polyethylene (MDPE), and linear low-density polyethylene (LLDPE). The density of polyethylene depends on the type of polyethylene, and is preferably 900 kg / m³ or higher, and more preferably 910 kg / m³ or higher. There is no particular upper limit for the density of polyethylene, and the upper limit is, for example, 960 kg / m³. The density of HDPE is preferably 942 kg / m3 or more and more preferably from 942 kg / m3 to 960 kg / m3. The density of MDPE is preferably from 930 kg / m3 to less than 942 kg / m3. The density of LDPE is preferably from 910 kg / m3 to less than 930 kg / m3. The density of LLDPE is preferably from 900 kg / m3 to less than 930 kg / m3. A molten flow rate (MFR, measured in accordance with JIS K7210-1999 under a condition at 190°C and 2,160 g of charge) of polyethylene is preferably from 0.1 g / 10 min to 100 g / 10 min, more preferably from 1 g / 10 min to 50 g / 10 min, and even more preferably from 1 g / 10 min to 30 g / 10 min. In the case where the resin composition for the sealant of the invention contains the resin (D), the content of the resin (D) with respect to the total amount of the resin components in the resin composition for a sealant (hereinafter simply referred to as the resin content (D)) is preferably from 1% by mass to 50% by mass, more preferably from 5% by mass to 40% by mass, and even more preferably from 10% by mass to 30% by mass. In the case where the resin content (D) is 1% by mass or more, the heat sealing power with respect to the substrate of the resin composition of a sealant is further increased. In the case where the resin content (D) is 50% by mass or less, excessive heat sealing power with respect to the substrate of the resin composition of a sealant is further suppressed. < Other components > The resin composition for a sealant of the invention may contain other components, in addition to the components described above. An example of the other components includes an additive such as a slip agent or a roller release agent. Examples of the additive include: various amides such as palmitic acid amide, stearic acid amide, behenic acid amide, oleic acid amide, erucic acid amide, oleol palmitamide, stearyl palmitamide, methylene bis stearylamide, methylene bis oleylamide, and ethylene bis erucic acid amide; polyalkylene glycol such as polyethylene glycol and polypropylene glycol; hydrogenated castor oil; and an inorganic additive such as silica, talc, and zeolite. An additive content is preferably from 0.01% by mass to 3% by mass with respect to a total amount of the resin components. In the resin composition for a sealant of the invention, the total content of the resin components is preferably 80% by mass or more and more preferably 90% by mass or more with respect to the total amount of the resin composition for a sealant. In the invention, the resin component includes at least the resin (A) and the adhesive resin (B). In the case where the resin composition for a sealant of the invention contains resin (C), the resin component also includes resin (C). A preferred embodiment according to the resin composition for a sealant of the invention is that the composition contains resin (A), adhesive resin (B), and resin (C) as the resin components, wherein the content of resin (A) is more than 45% by mass, the content of adhesive resin (B) is from 0.1% to 10% by mass, and the content of resin (C) is from 1% to 50% by mass, with respect to the total amount of the resin composition for a sealant. In the case where the resin composition for a sealant of the invention contains resin (D), the resin component also includes resin (D). A preferred embodiment according to the resin composition for a sealant of the invention is that the composition contains resin (A), adhesive resin (B), resin (C), and resin (D) as the resin components, wherein the content of resin (A) is more than 45% by mass, the content of adhesive resin (B) is from 0.1% to 10% by mass, the content of resin (C) is from 1% to 50% by mass, and the content of resin (D) is from 1% to 50% by mass, with respect to the total amount of the resin composition for a sealant. <Aplicación preferida > The resin composition for a sealant of the invention can be applied to various applications that require increasing the heat sealing power with respect to the substrate and reducing the amount of elution in normal heptane. The applications of the resin composition for a sealant of the invention are not particularly limited, and the resin composition for a sealant is preferably used as a sealant for a packaging material. An example of packaging material includes packaging material for packaging a food, a toy, stationery, a household product, a cosmetic, a medicine, a quasi-medicine, and medical instruments. The packaging material is preferably a food packaging material. Examples of food include meat, a meat product, a dish with meat, seafood, a dish with seafood, processed seafood, an everyday dish, cooked pasta, and a processed product with milk. The food may refer to Notification No. 370 from the Ministry of Health and Welfare (Guidelines for Food and Additives). Furthermore, the packaging material is preferably a packaging material for a leather container. The packaging of a leather container means the vacuum packaging in a state in which at least part of the packaging material is closely adhered to a packaged object while following the shape of the packaged object. In the packaging of a leather container, a sealer is used to perform the vacuum packaging from the previous state. Since the packaging material for leather packaging often includes a substrate (e.g., a container and a tray), the sealant for such packaging material is frequently required to have a high heat sealing capacity relative to the substrate. Since hygiene requirements for maintaining the quality of the packaged item (e.g., reduced elution in normal heptane) are often necessary for the packaging material of leather packaging, a sealant for such packaging material is frequently required to have reduced elution in normal heptane. For these reasons, as a packaging material to which the resin composition for a sealant of the invention is applied, a leather packaging material is preferable. [Laminate] The laminate of the invention includes a substrate layer and a sealant layer containing the resin composition for a sealant of the invention described above. Since the laminate of the invention includes a sealant layer containing the resin composition for a sealant of the invention, the laminate has excellent heat sealing strength with respect to the substrate and a reduced amount of sealant layer elution in ordinary heptane. <Capa de sustrato> A substrate layer is a layer to ensure strength as a packaging material, in which the sealant layer containing the resin composition for a sealant of the invention described above is laminated onto the substrate layer directly or through another layer. The substrate layer material is not particularly limited. Examples of substrate layer material include stretched and unstretched films, for example, polyester such as polyethylene terephthalate; polyamide; polyolefin such as polypropylene and polyethylene; an unsaturated ethylene ester copolymer such as an ethylene-vinyl acetate copolymer and an unsaturated ethylene-carboxylic acid ester copolymer; an unsaturated ethylene-carboxylic acid copolymer or an ionomer of the foregoing; an ethylene-vinyl alcohol copolymer; paper; aluminum foil; vapor-deposited film with aluminum, silica, alumina, or magnesium; and a film coated with a barrier material such as polyvinylidene chloride and polyvinyl alcohol. A substrate layer structure can be a single structure and can be a laminated structure that includes two or more layers. The substrate layer preferably contains a resin. Thermoplastic resin is preferably used as the resin. The thermoplastic resin is not limited in particular; examples include polyester such as polyethylene terephthalate; polyamide; polyolefin such as polypropylene and polyethylene; an unsaturated ethylene-ester copolymer such as an ethylene-vinyl acetate copolymer and an unsaturated ethylene-carboxylic acid copolymer; an unsaturated ethylene-carboxylic acid copolymer or an ionomer of the foregoing; and an ethylene-vinyl alcohol copolymer. It is preferred that the substrate layer contain at least one selected from the group consisting of an ionomer of an unsaturated carboxylic acid copolymer with ethylene and an unsaturated ester copolymer with ethylene. In particular, if the substrate layer contains at least one material selected from the group mentioned above, the extensibility is improved. Extensibility is a characteristic that may be required, for example, when the laminate is used as a packaging material. In particular, in the case where the laminate that has excellent extensibility is used as packaging material for the packaging of a leather container, the ability to follow to obtain a shape of the packaged object and the ability to adhere to the packaged object are further improved. (Ethylene-unsaturated carboxylic acid copolymer ionomer) The substrate layer may contain at least one ionomer of an unsaturated ethylene-carboxylic acid copolymer. In the case where the substrate layer contains the ionomer of the unsaturated ethylene-carboxylic acid copolymer, the laminate's puncture resistance is increased, as well as its extensibility. Puncture resistance is also a property that may be required in the case where the laminate is used as packaging material (in particular, packaging material for the packaging of a leather container). In the invention, the ionomer of the unsaturated ethylene-carboxylic acid copolymer means a compound in which at least a portion of an acid group (i.e., the carboxyl group) in the unsaturated ethylene-carboxylic acid copolymer as a base polymer is neutralized with a metal ion. The ethylene-unsaturated carboxylic acid copolymer as a base polymer is a copolymer obtained by copolymerization of at least ethylene and unsaturated carboxylic acid, and includes an ethylene unit (i.e., a structural unit derived from ethylene) and an unsaturated carboxylic acid unit (i.e., a structural unit derived from unsaturated carboxylic acid). The ethylene-unsaturated carboxylic acid copolymer can be any of a block copolymer, a random copolymer, and a graft copolymer. From the point of view of industrial availability, the unsaturated ethylene carboxylic acid copolymer is preferably a random copolymer. Examples of the unsaturated carboxylic acid unit include a (meth)acrylic acid unit, a fumaric acid unit, and a maleic acid unit. Among them, the unsaturated carboxylic acid unit is preferably a (meth)acrylic acid unit, and more preferably a methacrylic acid unit. The content of the unsaturated carboxylic acid unit in the ethylene-unsaturated carboxylic acid copolymer as a base polymer is preferably from 1% by mass to 25% by mass, more preferably from 3% by mass to 20% by mass, and even more preferably from 5% by mass to 15% by mass, with respect to a total amount of the copolymer. The content of the ethylene unit in the ethylene-unsaturated carboxylic acid copolymer as a base polymer is preferably from 75% by mass to 99% by mass, more preferably from 80% by mass to 97% by mass, and even more preferably from 85% by mass to 95% by mass, with respect to the total amount of the copolymer. The ethylene-unsaturated carboxylic acid copolymer as a base polymer may not have or need not contain other structural units besides the ethylene unit and the unsaturated carboxylic acid unit. An example of other structural units includes an unsaturated carboxylic acid ester unit. A first aspect of the unsaturated carboxylic acid ester unit is similar to the preferred aspect of the (meth)acrylic acid ester unit in the resin (A) described above. A total content of the ethylene unit and the unsaturated carboxylic acid unit in the ethylene-unsaturated carboxylic acid copolymer is preferably 80% by mass or more and more preferably 90% by mass or more with respect to a total amount of ethylene-unsaturated carboxylic acid copolymer. In the ionomer of the ethylene-unsaturated carboxylic acid copolymer, the type of metal ion to neutralize the acid group in the ethylene-unsaturated carboxylic acid copolymer (i.e., a base polymer) is not particularly limited. Examples of metal ions include: an alkali metal ion such as a lithium ion, a sodium ion, a potassium ion, a rubidium ion, and a cesium ion; an alkaline earth metal ion such as a magnesium ion and a calcium ion; a transition metal ion such as a zinc ion; and various metal ions such as an aluminum ion. The metal ion is preferably at least one selected from the group consisting of a zinc ion (Zn), a magnesium ion (Mg), and a sodium ion (Na), and more preferably at least a zinc ion or a sodium ion, and even more preferably a sodium ion. The metal ion to neutralize the acid group in the base polymer can be used alone, or in combination with two or more of the same. A degree of neutralization of the ethylene-unsaturated carboxylic acid copolymer ionomer is preferably 90% or less, more preferably 5% to 80%, and even more preferably 10% to 70%. When the degree of neutralization is 90% or less, an ionic aggregate can be appropriately suppressed, flow degradation can be further suppressed, and molding processability can also be appropriately maintained. When the degree of neutralization is 5% or more, an efficient yield of the ionomer can also be exhibited. Here, the degree of neutralization (%) refers to a proportion (mole percent) of a carboxyl group obtained by neutralizing with the metal ion all the carboxylic groups included in the ethylene-unsaturated carboxylic acid copolymer (base polymer). A melt flow rate (MFR, measured in accordance with JIS K7210-1999 under a condition at 190°C and 2,160 g of charge) of the ionomer in the ethylene-unsaturated carboxylic acid copolymer is preferably 0.1 g / 10 min to 100 g / 10 min, more preferably 0.3 g / 10 min to 50 g / 10 min, and even more preferably 0.5 g / 10 min to 20 g / 10 min, from the point of view of processability. Unsaturated ethylene-ester copolymer The substrate layer may contain at least one unsaturated ethylene-ester copolymer. The unsaturated ethylene-ester copolymer includes one ethylene unit and one unsaturated ester unit (i.e., a structural unit derived from an unsaturated ester). The unsaturated ethylene-ester copolymer can be any of a block copolymer, a random copolymer, and a graft copolymer. Examples of unsaturated esters forming the unsaturated ester unit include: vinyl esters such as vinyl acetate and vinyl propionate; and (meth)acrylic acid esters such as methyl (meth)acrylate, ethyl (meth)acrylate, isobutyl (meth)acrylate, n-butyl (meth)acrylate, and isooctyl (meth)acrylate. Among them, the unsaturated ester is preferably at least a vinyl acetate or an ester of (meth)acrylic acid. As an unsaturated ethylene-ester copolymer, an ethylene-vinyl acetate copolymer or an ethylene-(meth)acrylic acid ester copolymer is preferable, and an ethylene-vinyl acetate copolymer is most preferable. The content of the unsaturated ester unit is preferably from 1% by mass to 40% by mass, more preferably from 2% by mass to 30% by mass, and even more preferably from 5% by mass to 25% by mass, with respect to a total amount of the unsaturated ethylene-ester copolymer. The ethylene unit content is preferably from 60% by mass to 99% by mass, more preferably from 70% by mass to 98% by mass, and even more preferably from 75% by mass to 95% by mass, with respect to the total amount of the unsaturated ethylene-ester copolymer. The unsaturated ethylene-ester copolymer may not contain, or does not need to contain, any structural units other than the ethylene unit and the unsaturated ester unit. A total content of the ethylene unit and the unsaturated ester unit in the unsaturated ethylene-ester copolymer is preferably 80% by mass or more and more preferably 90% by mass or more with respect to a total amount of ZnZn / LznZn / Bm unsaturated ethylene-ester copolymer. In cases where the substrate layer contains an unsaturated ethylene ester copolymer, it is preferable that the unsaturated ethylene ester copolymer in the substrate layer have a cross-linked structure. This further increases the puncture resistance of both the substrate layer and the laminate. Examples of methods for forming a cross-linked structure include heat cross-linking, electron beam cross-linking, and radiation cross-linking. Among these, electron beam cross-linking is preferable in terms of cross-linking efficiency and hygiene. A melt flow rate (MFR, measured in accordance with JIS K7210-1999 under a condition at 190°C and 2,160 g of charge) of the unsaturated ethylene-ester copolymer is preferably 0.1 g / 10 min to 100 g / 10 min, more preferably 1 g / 10 min to 50 g / 10 min, and even more preferably 1 g / 10 min to 30 g / 10 min, from the point of view of processability. From the point of view of improving the extensibility and puncture resistance of the laminate, it is preferable that the substrate layer contains at least one selected from the group consisting of ionomer of the unsaturated ethylene-carboxylic acid copolymer and the unsaturated ethylene-ester copolymer that has a crosslinked structure. (Other components) The substrate layer may contain other components such as an additive. A total amount of the ethylene-unsaturated carboxylic acid copolymer ionomer and the unsaturated ethylene-ester copolymer is preferably 80% by mass or more and more preferably 90% by mass or more with respect to the total amount of the substrate layer. <Capa de sellador> The sealant layer is a layer containing the resin composition for a sealant of the invention described above. A sealant layer structure can be a single structure and can be a laminated structure that includes two or more layers. The sealant layer is produced, for example, by fusion extrusion using the resin composition for a sealant of the invention (and other components such as an additive, if necessary). In the sealant layer, the content of the resin composition for a sealant of the invention is preferably 80% by mass or more and more preferably 90% by mass or more with respect to a total amount of the sealant layer. One form of the laminate of the invention is not particularly restricted and is, appropriately, a sheet form (i.e., film form). A thickness of the laminate is not particularly limited, and is preferably from Znzonn / Lznz / Em μηη to 300 pm, more preferably from 50 pm to 300 pm, and even more preferably from 50 pm to 200 μm. The thickness of the laminate sealant layer is not particularly limited, and is preferably from 1 pm to 500 pm, more preferably from 2 pm to 30 pm, and even more preferably from 3 pm to 20 pm. A substrate layer thickness of the laminate (a total thickness in a case of a laminate structure that includes two or more layers) is not particularly limited, and is preferably from 40 pm to 300 pm, more preferably from 50 pm to 300 pm, and even more preferably from 50 pm to 200 pm. <Método preferido para producir el laminado The laminate of the invention can be produced using a known method. Examples of a method for producing a laminate include an extrusion lamination method, a coextrusion inflation method, and a T-type coextrusion method. Among them, the T-type coextrusion method is preferable from the point of view of controlling the thickness of the laminate. <Aplicación preferida del laminado> An application of the laminate of the invention is not limited in particular. A preferred application of the laminate of the invention is similar to the preferred application of the resin composition for a sealant of the invention described above. [Packaging material] The packaging material of the invention includes the laminate of the invention described above. Therefore, the packaging material has excellent heat sealing power with respect to a substrate, and in which the sealant layer has a reduced amount of elution in normal heptane. It is preferable that the packaging material of the invention also includes a substrate. Examples of such packaging material include a packaging material that is an assembly comprising a substrate and a laminate, and an integrated packaging material in which a portion of a substrate and a portion of a sealant layer of a laminate are bonded together. As a substrate, a substrate containing a resin is preferred. An example of the resin is as described in the section on resin composition for a sealant. Examples include polyethylene (PE), polypropylene (PP), polystyrene (PS), high-impact polystyrene (HIPS), polyethylene terephthalate (PET), a mixture of polyethylene (PE) and polybutene (PB), or a mixture of polyethylene (PE) and polypropylene (PP), with polypropylene (PP) being preferable. znzann / i zípe / yl The substrate may contain other components such as a filler and an additive. A resin content in the substrate is preferably 80% by mass or more and more preferably 90% by mass or more with respect to a total amount of substrate. One form of the substrate is not particularly restricted. Examples of substrate shapes include a sheet shape (i.e., film shape) and a container shape such as a tray shape. When a film containing PE, PP, PS, HIPS, or PET is used as the substrate, the film may be either stretched or unstretched. Examples of a substrate containing a mixture of PE and PB or a mixture of PE and PP include a cohesive failure film. A substrate structure can be an individual structure and can be a laminated structure that includes two or more layers. A substrate thickness (a total thickness in the case of a laminated structure that includes two or more layers) is not particularly limited, and is preferably 0.05 mm or more, more preferably 0.1 mm or more, and even more preferably 0.2 mm or more, from the point of view of ensuring performance in a case where the substrate is used as a container. An upper limit for substrate thickness is, for example, 5 mm or less, 3 mm or less, and 2 mm or less. From the point of view of ensuring performance in the case where the substrate is used as a container, it is preferred that the thickness of the substrate be greater than the thickness of the laminate. A ratio of substrate thickness to laminate thickness (i.e., a ratio of [substrate thickness / laminate thickness]) is preferably 1.5 or more, more preferably 2.0 or more, and even more preferably 3.0 or more. An upper limit for the ratio [substrate thickness / laminate thickness] is, for example, 30 or less, 20 or less, and 15 or less. An application of the packaging material of the invention is not limited in particular. A preferred application of the packaging material of the invention is similar to the preferred application of the resin composition for a sealant of the invention described above. [Container] The packaging of the invention includes the substrate, the laminate of the invention, and the packaged object, packaged by the substrate and the laminate. Since the packaging material of the invention includes the laminate, the packaging material of the invention has a reduced amount of sealant layer elution in normal heptane and excellent heat sealing strength between the substrate and the laminate. The preferred aspects of the substrate, laminate, and packaged item are as described above. In particular, it is preferred that the packaging of the invention be a package-type packaging (i.e., a package obtained by packaging in a zípe / yl leather packaging) EXAMPLES From here on, examples of the invention will be described, and the invention is not limited to the following examples. From this point forward, a melt flow index (MFR) was measured in accordance with patent JISK7210-1999. From here on, an ethylene unit content, a methacrylate unit content, and a vinyl acetate unit content mean a content of a structural unit derived from ethylene, a content of a structural unit derived from methyl acrylate, and a content of a structural unit derived from vinyl acetate, respectively. [Examples 1 to 10 and Comparative Examples 1 to 5]<Producción de la composición de resina para el sellador> The following components were mixed at a mixing ratio shown in Tables 1 and 2 such that the amount charged is 10 kg. The resulting mixture was placed in an extruder (65 mmφ, L / D = 28, Dulmage front-tip flying screw) and heat-woven at a processing temperature of 160°C, thereby obtaining the resin compositions for a sealant of the Examples and Comparative Examples. Each blank in Tables 1 and 2 means that the corresponding component was not included. Resin (A) EMA1 (comparative resin): ethylene-methyl acrylate copolymer [91% by mass of ethylene unit content, 9% by mass of methyl acrylate unit content (written as MA9% in Tables 1 and 2), and MFR (190°C, a 2,160 g load) of 6 g / 10 min, produced by high-pressure radical polymerization according to the tubular method] EMA2: ethylene-methyl acrylate copolymer [80% by mass of ethylene unit content, 20% by mass of methyl acrylate unit content (written as MA20% in Tables 1 and 2), and MFR (190°C, a 2,160 g load) of 8 g / 10 min, produced by high-pressure radical polymerization according to the tubular method] EMA3: ethylene-methyl acrylate copolymer [76% by mass of ethylene unit content, 24% by mass of methyl acrylate unit content (written as MA24% in Tables 1 and 2), and MFR (190°C, a 2,160 g load) of 20 g / 10 min, produced by high-pressure radical polymerization according to the tubular method] Adhesive resin (B) ARKON AM-1 (an alicyclic hydrocarbon resin having a ring and ball softening point of 115°C) produced by Arakawa Chemical Industries, Ltd. znzann / Lznz / E / YiAi Resin (C) EVA1: ethylene-vinyl acetate copolymer [94% by mass of ethylene unit content, 6% by mass of vinyl acetate unit content (written as VA6% in Tables 1 and 2), and MFR (190°C, a load of 2,160 g) of 7 g / 10 min] EVA2: ethylene-vinyl acetate copolymer [90% by mass of ethylene unit content, 10% by mass of vinyl acetate unit content (written as VA10% in Tables 1 and 2), and MFR (190°C, a load of 2,160 g) of 9 g / 10 min] EVA3: ethylene-vinyl acetate copolymer [81% by mass of ethylene unit content, 19% by mass of vinyl acetate unit content (written as VA19% in Tables 1 and 2), and MFR (190°C, a load of 2,160 g) of 15 g / 10 min] Resin (D) PO-1: ethylene-l-butene copolymer [density of 885 kg / m3, and MFR (190°C, a loading of 2160 g) of 3.7 g / 10 min (Tafmer A4085S produced by Mitsui Chemicals, Inc.)] PO-2: ethylene-propylene copolymer [density of 875 kg / m3, and MFR (190°C, a load of 2,160 g) of 2 g / 10 min (Tafmer P0275 produced by Mitsui Chemicals, Inc.)] PO-3: ethylene-l-octene copolymer [density of 870 kg / m3, and MFR (190°C, a loading of 2160 g) of 5 g / 10 min (Tafmer H5030S produced by Mitsui Chemicals, Inc.)] Styrene-based elastomer 1: polystyrene-poly(ethylene-butylene)-polystyrene (SEBS) triblock copolymer [density of 900 kg / m3, and MFR (230°C, a load of 5,000 g) of 22 g / 10 min (Craton G1657 produced by Craton Corporation)] (Main part of the slip agent) Mixture of erucic acid amide as a slip agent (2 parts by mass), silica (20 parts by mass), and an ethylene-vinyl acetate copolymer (78 parts by mass) (M445 produced by Du Pont-Mitsui Polychemicals Co., Ltd.) <Producción del laminado (Producción del laminado que tiene la estructura de la capa A: Ejemplos 1 a 8, y 10, y Ejemplos comparativos 1 a 5) Molding was carried out under a processing speed of 25 m / min using the resin composition for a sealant, the following HDPE, and the following ionomer as raw material with a three-layer, three-type molding machine of 40 mmφ, thereby obtaining a film-shaped laminate having the following layer structure A and a thickness of 100 pm. HDPE: HI-ZEX 3300F produced by Prime Polymer Co., Ltd. (high-density polyethylene, density of 950 kg / m3, and MFR (190°C, a load of 2,160 g) of 1.1 g / 10 min) Ionomer: Product neutralized with Na (Na neutralization degree of 50% and MFR (190°C, a load of 2,160 g) of 1.3 g / 10 min) of ethylene-methacrylic acid copolymer (90% by mass of the ethylene unit content and 10% by mass of the methacrylic acid unit content) znzann / i zípe / yl Layered structure A: HDPE layer / ionomer layer / sealant layer (layer ratio of [HDPE layer / ionomer layer / sealant layer] = 10 / 80 / 10 or 10 / 85 / 5, Tables 1 and 2 show the details) In the layered structure A, the sealant layer is a layer derived from the resin composition for a sealant, the HDPE layer is a layer derived from HDPE, and the ionomer layer is a layer derived from ionomer. In the layered structure A, a portion of the HDPE layer / ionomer layer is a substrate layer. (Production of the laminate having the structure of layer B: Example 9) Molding was performed at a processing speed of 25 m / min using the resin composition for a sealant, EVA2 and EVA3, and the following ionomer as raw material, with a three-layer, three-type molding machine of 40 mmcp, thus obtaining a film-shaped molded body with a three-layer structure. In the resulting molded body, the EVA2-derived layer and the EVA3-derived layer were subjected to electron beam crosslinking, thus obtaining a film-shaped laminate with the following layered structure B and a thickness of 100 pm. Layered structure B: EVA2 layer / EVA3 layer / sealant layer (layer ratio of [EVA2 layer / EVA3 layer / sealant layer] = 30 / 60 / 10) In the layered structure B, the sealant layer is a layer derived from the resin composition for a sealant, the EVA2 layer is a layer derived from EVA2 (in detail, a layer obtained by performing electron beam crosslinking after molding), and the EVA3 layer is a layer derived from EVA3 (in detail, a layer obtained by performing electron beam crosslinking after molding). In the layered structure B, a portion of the EVA2 layer / EVA3 layer is a substrate layer. [Assessment] The following evaluation was performed using the resin composition for a sealant and laminate. The results are shown in Tables 1 and 2. <Potencia de sellado con calor con respecto al sustrato (Producción de la muestra para análisis 1) The laminate was superimposed on a sheet of polypropylene (PP) (F317DV produced by Prime Polymer Co., Ltd.) which is a substrate and has a thickness of 0.4 mm in one direction in which the sealant layer and the laminate substrate are in contact with each other. Heat sealing was performed under conditions of a pressure force of 0.2 MPa, a heating temperature of 120°C, and a heating time of 1.0 second. The superimposed laminate was then left for 24 hours at room temperature, thus obtaining an experimental sample 1 which has a layered structure of substrate layer / sealant layer / substrate. (Measurement of resistance to detachment) A piece was cut for analysis that has a width of 15 mm from the experimental sample 1 obtained. One side of the substrate and one side of the substrate layer of the cut piece for analysis were pulled in opposite directions (i.e., T-type detachment direction) and a detachment resistance (N / 15 mm) was obtained. The peel strength (N / 15 mm) represents a heat sealing power with respect to the substrate of the resin composition for a sealant. From the point of view of the heat sealing power with respect to the substrate of the resin composition for a sealant, the peel strength (N / 15 mm) is preferably 3 N / 15 mm or more. <Cantidad de elución en heptano normal> (Sample production for analysis 2) Molding was carried out under a processing speed of 25 m / min using the resin composition for a sealant, and the following LDPE as raw material with a three-layer three-type molding machine of 40 mmφ, thus obtaining an experimental sample 2 in the form of a film having the following layer structure C and a thickness of 100 pm. LDPE: low density polyethylene of 917 kg / m3, and MFR (190°C, a load of 2,160 g) of 3.7 g / 10 min (MIRASON 16P produced by Du Pont-Mitsul Polychemicals Co., Ltd.) Layered structure C: LDPE layer / LDPE layer / sealant layer (layer ratio of [LDPE layer / LDPE layer / sealant layer] = 10 / 80 / 10 or 10 / 85 / 5, Tables 1 and 2 show the details) In the C-layered structure, the sealant layer is a layer derived from the resin composition for a sealant, and the LDPE layer is a layer derived from LDPE. In the C-layered structure, a portion of the LDPE layer / LDPE layer is a substrate layer. In evaluating the amount of elution in normal heptane, the reason the laminate layer structure was the C-layer structure (i.e., the reason the substrate layer was the LDPE layer / LDPE layer) is to properly evaluate the amount of sealant layer elution in normal heptane by the extreme reduction of the substrate layer elution in normal heptane. (Amount of elution in normal heptane) According to Notification No. 370 of the Ministry of Health and Welfare, normal heptane was brought into contact with the sealant layer of experimental sample 2 at room temperature for 2 hours, and then normal heptane was recovered. The recovered normal heptane was evaporated using an evaporator, the residue was weighed, and then the amount of elution (pg / ml) of the sealant layer (i.e., the resin composition for a sealant) per 1 ml of normal heptane was calculated based on the weighted value. From a hygiene point of view, the elution amount (pg / ml) is preferably 30 pg / ml or less. znzonn / Lznz / Bm Example 10 50 rxj 00 i—l 30 in < 10 / 85 / 5 Example 9 09 ΓM 38 m co 10 / 80 / 10 Example 8 00 σ» OJ m < 10 / 80 / 10 Example 7 50 ΓM 00 i—l 30 m < 10 / 85 / 5 Example 6 50 rxj 33 LO i—l in < 10 / 85 / 5 Example 5 60 rxj 28 O 1—, LO < 10 / 80 / 10 Example 4 09 rxj 38 LO < 10 / 80 / 10 Example 3 09 rxj 38 LO < 10 / 80 / 10 Example 2 09 rxj 38 LO < 10 / 80 / 10 Example 1 09 rxj 38 LO < 10 / 80 / 10 EMA 1 (MA9%) EMA 2 (MA20%) EMA 3 (MA24%) AM-l EVA 1 (VA6%) EVA 2 (VA10%) EVA 3 (VA19%) Styrene-based elastomer 1 PO-1 PO-2 PO-3 Main batch of slip agent Layered structure Resin ratio (A) Adhesive agent (B) Resin (C) Resin (D) Laminate Resin composition for sealant Heat sealing power at znzonn / Lznz / E / γΐΛΐ Ln 9.3 u 47 / 48 / 5 LO i_n rxj o iH 3.0 CJ 45 / 45 / 10 O id lO i—l O iH 4.7 O 45 / 45 / 10 O i—I cD fxj Ln (N CJ 47 / 48 / 5 Ln 00 i—l Ln 9.7 o 47 / 48 / 5 m VO fN o iH 7.4 u 45 / 45 / 10 oi—l LD rxj o iH in CJ 45 / 45 / 10 o id 28 o iH 3.9 o 45 / 45 / 10 oi—l i_n r\jo iH 6.3 CJ 45 / 45 / 10 O i—l ΓΝ ΓΝ O iH 3.4 o 45 / 45 / 10 O i—lo rxj caps Thickness of the sealing cap (pm) Resistance to sagging (N / 15 mm) Construction of caps Proportion of caps Thickness of the sealing cap (μm) Elución content (μg / ml) Laminated substrate Elución cantidad in heptano normal znzonn / Lznz / Ε / γΐΛΐ [Table 2] Comparative Example 5 20 40 40 LO < 10 / 80 / 10 10 Comparative Example 4 18 r\i 50 30 LO < 10 / 85 / 5 LO Comparative Example 3 20 ΓM 78 LO < 10 / 80 / 10 O Comparative Example 2 09 rxi 38 LH < 10 / 80 / 10 10 Comparative Example 1 09 40 LO < 10 / 80 / 10 10 EMA 1 (MA9%) EMA 2 (MA20%) EMA 3 (MA24%) AM-l EVA 1 (VA6%) EVA 2 (VA10%) EVA 3 (VA19%) Styrene-based elastomer 1 PO-1 PO-2 PO-3 Main batch of slip agent Layered structure Layer ratio Sealant layer thickness (μm) Resin (A) Adhesive agent (B) Resin (C) Resin (D) Laminate Resin composition for sealant Heat sealing strength to substrate zn^onn / Lznz / E / γΐΛΐ >10 u 45 / 45 / 10 O i—I >200 2.9 o 47 / 48 / 5 m UD O'Z o 45 / 45 / 10 o O rq 0.4 u 45 / 45 / 10 O i—I co rq 0.3 o 45 / 45 / 10 O i—I oi—( Peel resistance (N / 15 mm) Layered structure Layer ratio Sealant layer thickness (pm) Elution quantity (gg / ml) Laminate Elution quantity in normal heptane zn^onn / Lznz / E / γΐΛΐ As shown in Tables 1 and 2, each of the resin compositions for a sealant in Examples 1 to 10 had the reduced elution amount in normal heptane and excellent heat-sealing power with respect to the substrate. The resin composition contains: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of one unit of the (meth)acrylic acid ester is from 10% by mass to 25% by mass; and an adhesive resin (B), where a content of resin (A) is greater than 45% by mass, and a content of adhesive resin (B) is from 0.1% by mass to 10% by mass. The resin composition for a sealant in Comparative Example 1 that did not contain adhesive resin (B) had insufficient heat-sealing power with respect to the substrate, when compared to the respective resin compositions for a sealant in the Examples. The resin composition for a sealant in Comparative Example 2, in which the content of the (meth)acrylic acid ester unit in the ethylene-(meth)acrylic acid ester copolymer was less than 10% by mass, also had insufficient heat-sealing power with respect to the substrate. Each of the resin compositions for a sealant in Comparative Examples 3 and 4 in which the resin content (A) was less than 45% by mass also had insufficient heat sealing power with respect to the substrate. The resin composition for a sealant in Comparative Example 5, in which the adhesive resin content (B) was greater than 10% by mass, had excessive elution in normal heptane. <Adecuabilidad del envasado de envase de piel> The suitability of the leather packaging for each of the laminates having layered structure A in Examples 1 to 8 and 10, and the laminate having layered structure B in Example 9 was confirmed as follows. A piece of wood that has a height of 2 cm and an area of ​​50 cm2 (10 cm wide x 5 cm long) as a packaged object was placed on a polypropylene tray, and a laminate was placed on top of it, by which the packaged object and the tray were completely covered. In this state, the packaged object was packaged in a skin pack using laminate as packaging material and the tray with a T200 tray sealer produced by MULTIVAC under the conditions of a fixed temperature of 130°C, a heating time of 1 and a vacuum degree of 10 mbar. As a result, even when using any laminate, it was possible to create a leather-like package in which the laminate follows the shape of the packaged object and adheres closely to the packaged object, without creating a hole or wrinkle in the laminate. Based on the above, it was confirmed that each of the laminates having the layered structure A in Examples 1 to 8 and 10, and the laminate having the layered structure znzonn / Lznz / Bm B in Example 9 had packaging suitability of the leather packaging. The disclosure of Japanese Patent Application No. 2018-225788 filed on November 30, 2018, incorporated by reference in this document in its entirety. All documents, patent applications and technical standards described in this descriptive report are incorporated herein by reference to the same extent as if each individual document, patent application or technical standard were specifically and individually described as incorporated by reference. ζηζαηη / ίζηζ / Β / γι

Claims

1. A resin composition for a sealant, characterized in that it comprises: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% to 25% by mass; and an adhesive agent (B), wherein a content of the resin (A) is greater than 45% by mass with respect to a total amount of the resin components in the resin composition for a sealant, and a content of the adhesive resin (B) is from 0.1% to 10% by mass with respect to a total amount of the resin components in the resin composition for a sealant. 2 - The resin composition for a sealant according to claim 1, characterized in that it further comprises a resin (C) that is a copolymer of ethylene vinyl ester. 3 - The resin composition for a sealant according to claim 1 or 2, characterized in that it further comprises a resin (D) that is at least one selected from the group of an ethylene-α-olefin copolymer elastomer, a styrene-based elastomer, and a polyethylene-based elastomer. 4 - The resin composition for a sealant according to claim 3, characterized in that a resin content (D) is from 5% by mass to 40% by mass with respect to a total amount of the resin components in the resin composition.

5. The resin composition for a sealant according to claim 1 or 2, characterized in that it is used as a sealant for a packaging material.

6. The resin composition for a sealant according to claim 5, characterized in that the packaging material is for packaging a leather container. 7 - A laminate, characterized in that it comprises: a substrate layer; and a sealant layer containing the resin composition for a sealant according to claim 1 or 2. 8 - The laminate according to claim 7, characterized in that the substrate layer contains at least one selected from the group consisting of an ionomer of an ethylene-unsaturated carboxylic acid copolymer and an ethylene-unsaturated ester copolymer.

9. The laminate according to claim 7, characterized in that the laminate thickness is from 40 pm to 300 pm.

10. A packaging material, characterized in that it comprises the lamination according to claim 7. 11.- The packaging material according to claim 10, characterized in that it further comprises a substrate. 12,- The packaging material according to claim 11, characterized in that the substrate comprises polypropylene.

13. A container, characterized in that it comprises: a substrate; the laminate according to claim 7; and a packaged object, packaged by the substrate and the laminate.