Heat insulation pedestal of a semiconductor manufacturing apparatus

USD1110288SActive Publication Date: 2026-01-27KOKUSAI DENKI KK
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Patent Information

Application Number
US29/933535
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Filing Date
2024-03-20
Publication Date
2026-01-27
Estimated Expiration
2041-01-27

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Description

[0001] FIG. 1 is a rear, top and right side perspective view of a heat insulation pedestal of a semiconductor manufacturing apparatus, showing my new design;

[0002] FIG. 2 is a front elevational view thereof;

[0003] FIG. 3 is a rear elevational view thereof;

[0004] FIG. 4 is a right side elevational view thereof;

[0005] FIG. 5 is a left side elevational view thereof;

[0006] FIG. 6 is a top plan view thereof;

[0007] FIG. 7 is a bottom plan view thereof; and,

[0008] FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2.

Claims

The ornamental design for heat insulation pedestal of a semiconductor manufacturing apparatus, as shown and described.

Citation Information

Patent Citations

  • Thermal insulation unit cover for semiconductor manufacturing equipment

    JP1565116S

  • Retaining ring for use on a carrier of a polishing apparatus

    US20040077167A1

  • Retaining ring assembly for use in chemical mechanical polishing

    US20050277375A1

  • Deposition ring and cover ring to extend process components life and performance for process chambers

    US20090050272A1

  • Chemical vapour deposition device

    US20160002788A1

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