Imaging device and electronic device including same

Abstract

An imaging device, according to one embodiment of the present disclosure, includes: a lens assembly comprising at least four lenses sequentially arranged in the optical axis direction, the at least four lenses including a first lens disposed first in the incident direction of light and having positive refractive power, a second lens disposed second in the incident direction of light and having positive refractive power, a third lens disposed third in the incident direction of light, and a fourth lens disposed fourth in the incident direction of light; and an optical member configured to reflect, at least once, the light focused or guided by the lens assembly, so as to guide the light in a direction crossing the optical axis, and satisfies the conditions presented in the disclosed embodiment(s). Other various embodiments may also be possible.

Description

Imaging device and electronic device including the same

[0001] Embodiments of the present disclosure relate to electronic devices, for example, to imaging devices and electronic devices including the same.

[0002] An electronic device can refer to any device that performs a specified function according to a built-in program, such as a home appliance, an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an audio / video device, a desktop / laptop computer, and / or an in-vehicle navigation system. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single electronic device, such as a mobile communication terminal, can recently be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and / or functions such as schedule management or electronic wallets are being integrated into a single electronic device.

[0003] As digital camera manufacturing technology developed, electronic devices equipped with compact, lightweight camera modules became commercially available. By incorporating camera modules, such as imaging devices, into electronic devices we typically carry with us (e.g., mobile terminals), users can conveniently utilize a variety of functions, including not only taking photos and videos, but also video calling and / or augmented reality.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] According to one embodiment of the present disclosure, an imaging device includes a lens assembly including at least four lenses sequentially aligned along an optical axis direction, wherein the at least four lenses include a first lens arranged first in a light incidence direction and having a positive refractive power, a second lens arranged second in a light incidence direction and having a positive refractive power, a third lens arranged third in a light incidence direction, and a fourth lens arranged fourth in a light incidence direction, and an optical member configured to guide light focused or guided by the lens assembly in a direction intersecting the optical axis by reflecting the light at least once. In one embodiment, the lens assembly satisfies the following [Conditional Expression 1].

[0006] [Condition 1]

[0007] -0.9 < ((f12 / (V1+V2)+f34 / (V3+V4)) / Vp) x 100 < -0.5

[0008] Here, 'f12' is the composite focal length of the first lens and the second lens, 'f34' is the composite focal length of the third lens and the fourth lens, 'V1' is the Abbe number of the first lens, 'V2' is the Abbe number of the second lens, 'V3' is the Abbe number of the third lens, 'V4' is the Abbe number of the fourth lens, and 'Vp' is the Abbe number of the optical member.

[0009] According to one embodiment of the present disclosure, an electronic device includes a lens assembly including at least four lenses sequentially aligned along an optical axis direction, an imaging device including an optical member configured to guide light focused or guided by the lens assembly in a direction crossing the optical axis by reflecting the light at least once, and a processor configured to acquire an image of a subject using the imaging device. In one embodiment, the at least four lenses include a first lens arranged first in a light incidence direction and having a positive refractive power, a second lens arranged second in a light incidence direction and having a positive refractive power, a third lens arranged third in a light incidence direction and having a negative refractive power, and a fourth lens arranged fourth in a light incidence direction. In one embodiment, the lens assembly satisfies the following [Conditional Expression 1].

[0010] [Condition 1]

[0011] -0.9 < ((f12 / (V1+V2)+f34 / (V3+V4)) / Vp) x 100 < -0.5

[0012] Here, 'f12' is the composite focal length of the first lens and the second lens, 'f34' is the composite focal length of the third lens and the fourth lens, 'V1' is the Abbe number of the first lens, 'V2' is the Abbe number of the second lens, 'V3' is the Abbe number of the third lens, 'V4' is the Abbe number of the fourth lens, and 'Vp' is the Abbe number of the optical member.

[0013] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0014] FIG. 1 is a block diagram illustrating an electronic device within a network environment according to one embodiment of the present disclosure.

[0015] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0017] FIG. 4 is an exploded perspective view showing the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0018] FIG. 5 is a plan view illustrating the rear surface of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 6 is a cross-sectional view showing a portion of an electronic device according to one embodiment of the present disclosure taken along line A-A' of FIG. 5.

[0020] FIG. 7 is a schematic diagram illustrating an optical path of a camera module in an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 8 is a drawing showing an imaging device according to one embodiment of the present disclosure.

[0022] FIG. 9 is a graph showing spherical aberration of the imaging device of FIG. 8 according to one embodiment of the present disclosure.

[0023] FIG. 10 is a graph showing astigmatism of the imaging device of FIG. 8 according to one embodiment of the present disclosure.

[0024] FIG. 11 is a graph showing the distortion rate of the imaging device of FIG. 8 according to one embodiment of the present disclosure.

[0025] FIG. 12 is a drawing showing an imaging device according to one embodiment of the present disclosure.

[0026] FIG. 13 is a graph showing spherical aberration of the imaging device of FIG. 12 according to one embodiment of the present disclosure.

[0027] FIG. 14 is a graph showing astigmatism of the imaging device of FIG. 12 according to one embodiment of the present disclosure.

[0028] FIG. 15 is a graph showing the distortion rate of the imaging device of FIG. 12 according to one embodiment of the present disclosure.

[0029] FIG. 16 is a drawing showing an imaging device according to one embodiment of the present disclosure.

[0030] FIG. 17 is a graph showing spherical aberration of the imaging device of FIG. 16 according to one embodiment of the present disclosure.

[0031] FIG. 18 is a graph showing astigmatism of the imaging device of FIG. 16 according to one embodiment of the present disclosure.

[0032] FIG. 19 is a graph showing the distortion rate of the imaging device of FIG. 16 according to one embodiment of the present disclosure.

[0033] FIG. 20 is a drawing showing an imaging device according to one embodiment of the present disclosure.

[0034] FIG. 21 is a graph showing spherical aberration of the imaging device of FIG. 20 according to one embodiment of the present disclosure.

[0035] FIG. 22 is a graph showing astigmatism of the imaging device of FIG. 20 according to one embodiment of the present disclosure.

[0036] FIG. 23 is a graph showing the distortion rate of the imaging device of FIG. 20 according to one embodiment of the present disclosure.

[0037] FIG. 24 is a drawing showing an imaging device according to one embodiment of the present disclosure.

[0038] FIG. 25 is a graph showing spherical aberration of the imaging device of FIG. 24 according to one embodiment of the present disclosure.

[0039] FIG. 26 is a graph showing astigmatism of the imaging device of FIG. 24 according to one embodiment of the present disclosure.

[0040] FIG. 27 is a graph showing the distortion rate of the imaging device of FIG. 24 according to one embodiment of the present disclosure.

[0041] FIG. 28 is a drawing showing an imaging device according to one embodiment of the present disclosure.

[0042] FIG. 29 is a graph showing spherical aberration of the imaging device of FIG. 28 according to one embodiment of the present disclosure.

[0043] FIG. 30 is a graph showing astigmatism of the imaging device of FIG. 28 according to one embodiment of the present disclosure.

[0044] FIG. 31 is a graph showing the distortion rate of the imaging device of FIG. 28 according to one embodiment of the present disclosure.

[0045] FIG. 32 is a drawing showing an imaging device according to one embodiment of the present disclosure.

[0046] FIG. 33 is a graph showing spherical aberration of the imaging device of FIG. 32 according to one embodiment of the present disclosure.

[0047] FIG. 34 is a graph showing astigmatism of the imaging device of FIG. 32 according to one embodiment of the present disclosure.

[0048] FIG. 35 is a graph showing the distortion rate of the imaging device of FIG. 32 according to one embodiment of the present disclosure.

[0049] FIG. 36 is a drawing showing an imaging device according to one embodiment of the present disclosure.

[0050] FIG. 37 is a graph showing spherical aberration of the imaging device of FIG. 36 according to one embodiment of the present disclosure.

[0051] FIG. 38 is a graph showing astigmatism of the imaging device of FIG. 36 according to one embodiment of the present disclosure.

[0052] FIG. 39 is a graph showing the distortion rate of the imaging device of FIG. 36 according to one embodiment of the present disclosure.

[0053] FIG. 40 is a drawing showing an imaging device according to one embodiment of the present disclosure.

[0054] FIG. 41 is a drawing showing an imaging device according to one embodiment of the present disclosure.

[0055] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0056] As electronic devices become smaller and lighter, they can become more portable. In an environment where displays are becoming larger to enable larger screens on portable electronic devices, reducing thickness can also lead to smaller and lighter electronic devices. However, miniaturizing electronic devices can present challenges in integrating imaging devices with superior optical performance. For example, while a larger number or size of lenses can facilitate the optical performance of an imaging device, miniaturizing electronic devices can reduce the design freedom for arranging the lenses or image sensors. When optical elements such as mirrors or prisms are placed, arranging the lenses or image sensors can be facilitated. However, the addition of additional optical elements can increase chromatic aberration, and selecting the refractive power or material (e.g., Abbe number) to improve chromatic aberration can be challenging.

[0057] One embodiment of the present disclosure is intended to at least resolve the above-described problems and / or disadvantages and at least provide the advantages described below, thereby providing an imaging device and / or an electronic device including the same with improved design freedom.

[0058] One embodiment of the present disclosure can provide an imaging device that is easy to improve chromatic aberration while having a degree of design freedom suitable for miniaturized electronic devices.

[0059] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0060] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0061] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0062] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0063] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment of the present disclosure. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0064] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0065] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0066] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0067] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0068] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0069] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0070] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0071] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0072] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0073] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0074] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0075] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0076] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0077] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0078] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0079] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0080] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0081] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0082] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0083] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0084] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0085] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0086] The embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it is understood that the component can be connected to the other component directly (e.g., wired), wirelessly, or via a third component.

[0087] The term "module" used in the embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0088] Embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0089] According to one embodiment, a method according to the embodiment(s) of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0090] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0091] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawings. For example, the front of the electronic device and / or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device and / or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. In one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the rectangular coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the embodiment(s) of the present disclosure. For example, depending on the design specifications of the electronic device or the user's usage habits, the orthogonal coordinate system may be defined differently from the disclosed embodiment(s).

[0092] FIG. 2 is a perspective view showing the front side of an electronic device (200) according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear side of the electronic device (200) illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0093] Referring to FIGS. 2 and 3, an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 2. According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate including various coating layers, and / or a polymer plate). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated and / or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), and / or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0094] In the illustrated embodiment, the front plate (202) may include two first regions (210D) that extend seamlessly from the first surface (210A) toward the rear plate (211), at both ends of a long edge of the front plate (202). In the illustrated embodiment (see FIG. 3), the rear plate (211) may include two second regions (210E) that extend seamlessly from the second surface (210B) toward the front plate (202), at both ends of a long edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the first regions (210D) (or the second regions (210E)). In one embodiment, some of the first regions (210D) and / or some of the second regions (210E) may not be included. In the above embodiments, when viewed from the side of the electronic device (200), the side structure (218) may have a first thickness (or width) on the side that does not include the first regions (210D) and / or the second regions (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first regions (210D) and / or the second regions (210E).

[0095] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204, 216, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) and / or the light emitting element (206)) or may additionally include other components.

[0096] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202), which forms the first surface (210A) and the first areas (210D) of the side surfaces (210C). In one embodiment, the corners of the display (201) may be formed to be substantially identical to the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (201) is visually exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially identical.

[0097] In one embodiment (not shown), a recess and / or an opening may be formed in a portion of a screen display area of ​​the display (201), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess and / or the opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (216), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be disposed in the first areas (210D) and / or the second areas (210E).

[0098] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0099] The sensor modules (204, 216, 219) can generate electrical signals or data values ​​corresponding to the internal operating state and / or the external environmental state of the electronic device (200). The sensor modules (204, 216, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) and / or a fourth sensor module (216) (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) (e.g., the display (201)) of the housing (210) as well as the second surface (210B). The electronic device (200) may further include at least one of the sensor modules (176) of FIG. 1, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor.

[0100] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode and / or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0101] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device may include a sensor module (216) disposed on a second surface (210B) of the housing (210).

[0102] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0103] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0104] FIG. 4 is an exploded perspective view showing the electronic device (200) illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0105] Referring to FIG. 4, the electronic device (300) (e.g., the electronic device (200) of FIG. 2 or FIG. 3) may include a side structure (310) (e.g., the side structure (218) of FIG. 2), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 2), a display (330) (e.g., the display (201) of FIG. 2), a printed circuit board (340) (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB) and / or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., the rear plate (211) of FIG. 3). In one embodiment, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) and / or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2 or FIG. 3, and any overlapping descriptions will be omitted below.

[0106] The first support member (311) may be disposed inside the electronic device (300) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, and / or a communication processor.

[0107] The memory may include, for example, volatile memory and / or non-volatile memory.

[0108] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically and / or physically connect the electronic device (300) to an external electronic device, and may include, for example, a USB connector, an SD card / MMC connector, and / or an audio connector.

[0109] The battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (340). The battery (350) may be disposed integrally within the electronic device (300), or may be disposed detachably from the electronic device (300).

[0110] Antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a portion or a combination of the side structure (310) and / or the first support member (311).

[0111] In the detailed description below, reference may be made to the electronic devices (101, 102, 104, 200, 300) of the preceding embodiments, and it is noted that the same reference numbers in the drawings may be given or omitted for configurations that can be easily understood through the preceding embodiments, and the detailed description thereof may also be omitted.

[0112] FIG. 5 is a plan view illustrating a rear surface of an electronic device (400) (e.g., the electronic devices (101, 102, 104, 200, 300) of FIGS. 1 to 4 ) according to one embodiment of the present disclosure. FIG. 6 is a cross-sectional view illustrating a portion of the electronic device (400) according to one embodiment of the present disclosure taken along line A-A' of FIG. 5 . FIG. 7 is a configuration diagram illustrating an optical path of an imaging device (500) in an electronic device (400) according to one embodiment of the present disclosure.

[0113] Referring to FIGS. 5 and 6, an electronic device (400) according to an embodiment of the present disclosure may include a camera window (385) disposed on one surface (e.g., the second surface (210B) of FIG. 3). In one embodiment, the camera window (385) may be a part of a rear plate (380). In one embodiment, the camera window (385) may be coupled to the rear plate (380) through a decorative member (389), and when viewed from the outside, the decorative member (389) may be exposed in a form that surrounds the periphery of the camera window (385). According to one embodiment, the camera window (385) may include a plurality of transparent regions (387), and the electronic device (400) may receive external light or radiate light to the outside through at least one of the transparent regions (387). For example, the electronic device (400) may include at least one imaging device (500) (e.g., camera modules (180, 205, 212, 213) of FIGS. 1 to 3) arranged to correspond to at least some of the transparent areas (387), and at least one light source (e.g., an infrared light source) arranged to correspond to another part of the transparent areas (387). In one embodiment, the imaging device (500) and / or the light source may receive external light or radiate light to the outside of the electronic device (400) through any one of the transparent areas (387). In one embodiment, the electronic device (400) and / or the imaging device (500) may further include a camera support member (381). The camera support member (381) may be positioned or secured to the rear plate (380) and / or the camera window (385) at least one of the imaging device (500) and / or another imaging device adjacent thereto (e.g., a wide-angle camera, an ultra-wide-angle camera, and / or a macro camera). In one embodiment, the camera support member (381) may be substantially a part of the first support member (311) and / or the second support member (360) of FIG. 4.

[0114] According to one embodiment, the electronic device (400) may include at least one of a wide-angle camera, an ultra-wide-angle camera, a close-up camera, a telephoto camera, or an infrared photodiode as an imaging device (500) and / or a light-receiving element, and may include a flash (e.g., the flash (213) of FIG. 3) or an infrared laser diode as a light source and / or a light-emitting element. In one embodiment, the electronic device (400) may detect a distance and / or depth to a subject by emitting an infrared laser toward the subject and receiving an infrared laser reflected by the subject using the infrared laser diode and the infrared photodiode. In one embodiment, the electronic device (400) may capture a subject by using one or a combination of two or more of the cameras, and may provide illumination toward the subject by using a flash as needed.

[0115] According to one embodiment, among the cameras, a wide-angle camera, an ultra-wide-angle camera, and / or a macro camera may have a shorter length in the optical axis direction of the lens(es) compared to a telephoto camera (e.g., the imaging device (500)). For example, a telephoto camera (e.g., the imaging device (500)) having a relatively small angle of view and a relatively large focal length may have a larger lens length than other cameras (e.g., the wide-angle camera, the ultra-wide-angle camera, and / or the macro camera). The term “lens length” may be the distance from the object-side surface of the first lens on the object side to the imaging surface of the image sensor (411). In the case where other optical members (e.g., a mirror and / or prism) are arranged between the lens(es) and the image sensor, as in the embodiment described below (e.g., the imaging device (600) of FIG. 8), the “lens length” may be the distance from the object-side surface of the first lens on the object side to the sensor-side surface of the first lens on the image sensor side. In one embodiment, the wide-angle camera, the ultra-wide-angle camera, and / or the macro camera may have a substantially small effect on the thickness of the electronic device (400) even if the lens(es) are arranged along the thickness direction of the electronic device (400) (e.g., the thickness measured in the Z-axis direction of FIG. 4 or FIG. 6). For example, the wide-angle camera, the ultra-wide-angle camera, and / or the macro camera may be arranged in the electronic device (400) such that the direction in which light is incident on the electronic device (400) from the outside and the optical axis direction of the lens(es) are substantially the same. In one embodiment, compared to the wide-angle camera, the ultra-wide-angle camera, and / or the macro camera, the imaging device (500) (e.g., a telephoto camera) may have a smaller angle of view but may be useful for capturing subjects at a longer distance. In one embodiment of the present disclosure, the imaging device (500) may include at least one optical member (R) that reflects and / or refracts the incident light (IL) in a different direction. By including at least one optical member (R), the imaging device (500) can easily implement a telephoto function while suppressing an increase in the thickness of the electronic device (400).

[0116] Referring to FIGS. 6 and 7, a folded camera (e.g., an imaging device (500)) may include a lens assembly (421) (e.g., lenses (421a, 421b)), at least one optical member (R) (e.g., a refractive member or a reflective member), and / or an image sensor (411). In one embodiment, the at least one optical member (R) may guide light (e.g., incident light (IL)) focused or guided by the lens assembly (421) to the image sensor (411) by reflecting or refracting the light at least once. In one embodiment, the optical member (R) may include, for example, a prism and / or a mirror. For example, the optical member (R) may be formed as a prism including at least one mirror. In one embodiment, the optical member (R) may reflect and / or refract light (IL) incident in a first direction (D1) in a second direction (D2) intersecting the first direction (D1). The first direction (D1) may refer to a direction in which external light (IL) is incident on the electronic device (400) and / or the imaging device (500) through any one of the transparent areas (387) of FIG. 5, for example, when photographing a subject. In one embodiment, the first direction (D1) may refer to a photographing direction, a subject direction, an orientation direction of the imaging device (500), and / or a direction parallel thereto. In one embodiment, the first direction (D1) may be parallel to a thickness direction and / or a Z-axis direction of the electronic device (400).

[0117] According to one embodiment, light (RL1) reflected or refracted inside the optical member (R) and propagating in the second direction (D2) may be reflected and / or refracted by another region inside the optical member (R) and propagate in a third direction (D3) intersecting the second direction (D2). In one embodiment, the third direction (D3) may be substantially perpendicular to the second direction (D2). For example, the third direction (D3) may mean a direction parallel to the Z-axis direction. However, one embodiment of the present disclosure is not limited thereto, and the third direction (D3) may be a direction inclined with respect to the second direction (D2) and / or the XY plane depending on the arrangement and specifications of the imaging device (500) and / or the optical member (R) within the electronic device (400). In one embodiment, the third direction (D3) may be substantially parallel to the first direction (D1).

[0118] According to one embodiment, the image sensor (411) may be configured to detect light (RL2) that travels along the third direction (D3) after being reflected and / or refracted at least once inside the optical member (R). For example, light (IL) incident from the outside may be detected by the image sensor (411) after being reflected or refracted at least once (e.g., twice in the illustrated embodiment) inside the optical member (R), and the electronic device (400) and / or the imaging device (500) may acquire an image of a subject based on a signal and / or information detected through the image sensor (411). In one embodiment, the image sensor (411) may be arranged substantially parallel to the XY plane. For example, when the imaging device (500) has a shake correction function having a structure that shifts the image sensor (411), the image sensor (411) can move horizontally in a plane substantially perpendicular to the first direction (D1) and / or the third direction (D3).

[0119] According to one embodiment, when performing a shake correction operation, the image sensor (411) may be shifted in the longitudinal direction (e.g., Y-axis direction) and / or the width direction (e.g., X-axis direction) of the electronic device (400). For example, the image sensor (411) may be arranged on a plane substantially perpendicular to the first direction (D1) and / or the third direction (D3), so that in an electronic device having a small thickness (e.g., a thickness of approximately 10 mm or less), it may be easy to expand the size of the image sensor (411) and / or it may be easy to secure a space for a shake correction operation. In one embodiment, when the imaging device (500) is utilized as a telephoto camera, the quality of the captured image may be further improved by incorporating a shake correction function. In one embodiment, when the image sensor (411) is enlarged, the performance of the imaging device (500) may be further improved.

[0120] According to one embodiment, the lens assembly (421) can guide and / or focus light (IL) incident from a first direction (D1) onto the optical member (R). In one embodiment, the lens assembly (421) and / or the first lens (e.g., the first lens (421a)) arranged on the object side of the imaging device (500) can have a positive refractive power. For example, since the first lens (421a) is configured to focus and / or align light (IL) incident from the outside onto the optical member (R), the optical system from the first lens (421a) to the image sensor (411) can be miniaturized. In one embodiment, the lens assembly (421) can further include an additional lens (e.g., the second lens (421b)(s)) for focusing and / or aligning light incident from the outside.

[0121] According to one embodiment, at least one of the first lens (421a) and / or the second lens (421b)(s) can move forward and backward in the direction in which light is incident (e.g., the first direction (D1) of FIG. 6). For example, the electronic device (400) and / or the imaging device (500) can perform focal length adjustment and / or focus adjustment by moving forward and backward at least one of the first lens (421a) and / or the second lens (421b)(s). In one embodiment, the image sensor (411) can perform focal length adjustment and / or focus adjustment by moving forward and backward along the third direction (D3) of FIG. 6.

[0122] According to one embodiment, the electronic device (400) and / or the imaging device (500) may further include an infrared cut filter (419). In one embodiment, the infrared cut filter (419) may suppress or substantially block light in the infrared and / or near-infrared wavelength band from being incident on the image sensor (411) and may be positioned at any position in the optical path between the first lens (421a) and the image sensor (411). In one embodiment, the infrared cut filter (419) may be positioned close to the image sensor (411) (e.g., between the image sensor (411) and the optical member (R)), thereby suppressing and / or preventing the infrared cut filter (419) from being visually exposed to the outside. In one embodiment, the optical member (R) may include an infrared cut coating layer, in which case the infrared cut filter (419) may be omitted. Hereby, the image sensor (411) can detect light that has substantially passed through the infrared cut filter (419) (or infrared cut coating layer). The optical member (R) according to the embodiment(s) of the present disclosure can be selectively designed according to the structure of the imaging device (500). For example, in one embodiment, the optical member (R) can have a triangular prism shape. In one embodiment, the optical member (R) can have a trapezoidal prism shape. The shape of the optical member (R) is not limited to the structure illustrated in the present disclosure. For example, if the optical member (R) reflects, refracts, or transmits light, the optical member (R) can have a structure other than a triangular prism or a trapezoidal prism. In one embodiment, the type of the optical member (R) can be arranged in various ways. For example, the optical member (R) can be arranged as a prism. For example, the optical member (R) can be arranged as at least one mirror. For example, the optical member (R) can include a substantially transparent material. For example, the optical member (R) can be manufactured using glass.

[0123] FIG. 8 is a diagram showing an imaging device (600) according to one embodiment of the present disclosure (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3 or the imaging device (500) of FIG. 6). FIG. 9 is a graph showing spherical aberration of the imaging device (600) of FIG. 8 according to one embodiment of the present disclosure. FIG. 10 is a graph showing astigmatism of the imaging device (600) of FIG. 8 according to one embodiment of the present disclosure. FIG. 11 is a graph showing a distortion rate of the imaging device (600) of FIG. 8 according to one embodiment of the present disclosure.

[0124] FIG. 9 is a graph showing spherical aberration of an imaging device (600) according to one embodiment of the present disclosure, in which the horizontal axis represents a coefficient of longitudinal spherical aberration, and the vertical axis represents a normalized representation of the distance from the optical axis, and shows a change in longitudinal spherical aberration according to the wavelength of light. The longitudinal spherical aberration is shown for light having wavelengths of, for example, 656.3000 (NM, nanometer), 587.6000 (NM), 546.1000 (NM), 486.1000 (NM), and 435.8000 (NM), respectively. FIG. 10 is a graph showing astigmatic field curves of an imaging device (600) according to one embodiment of the present disclosure, for light having a wavelength of 546.1000 (NM), where 's' exemplifies a sagittal plane and 't' exemplifies a tangential plane (meridional plane). FIG. 11 is a graph showing a distortion ratio of an imaging device (600) according to one embodiment of the present disclosure, for light having a wavelength of 546.1000 (NM). In the following description, the imaging device (600)(s) is a structure including an optical member (R)(s) disposed between the lens (L1, L2, L3, L4)(s) and the image sensor (I), and it is noted that in a graph regarding spherical aberration, astigmatism and / or distortion rate, negative / positive may be reversed depending on the number of times light is reflected and / or refracted by the optical member (R)(s). In describing the embodiment(s) of the present disclosure, optical data such as 'lens total length' or 'focal length' may be an example of a value in a state in which the optical member (R)(s) is not included.For example, the optical member (R)(s) may change the path of light by performing reflection and / or refraction, and may not substantially affect the optical performance (e.g., focal length, F-number, and / or angle of view) of the imaging device (600).

[0125] According to one embodiment, the imaging device (600) may further include an additional optical member (not shown) arranged in front of the lens assembly (LA). In one embodiment, the imaging device (600) may further include an additional optical member (not shown) arranged between two adjacent lenses among the lenses (L1, L2, L3, L4). For example, the optical member (R) shown may be omitted or an optical member (R) not shown may be additionally arranged depending on the specifications of the imaging device (600) or the electronic device (400) to be manufactured. In the above-described embodiment, the optical member (R) is generally exemplified as a triangular prism, but it should be noted that the embodiment(s) of the present disclosure are not limited thereto. For example, the optical member (R) may be implemented in the shape of a polygonal column, such as a quadrilateral (e.g., a parallelogram or a trapezoid) or a pentagonal shape.

[0126] Referring to FIG. 8, the imaging device (600) (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3 and / or the imaging device (500) of FIG. 6) may include a lens assembly (LA) including at least four lenses (L1, L2, L3, L4), an image sensor (I), and an optical member (R) disposed between the image sensor (I) and the at least four lenses (hereinafter, referred to as “lenses L1, L2, L3, L4”). In one embodiment, the lens assembly (LA) may be understood to include the optical member (R). In one embodiment, the imaging device (600) may include a photosensitive member replacing the image sensor (I). In one embodiment, when the imaging device (600) includes the image sensor (I), duplication, movement, and / or post-processing of an acquired image may be facilitated.

[0127] As mentioned above, the imaging device (600) may include an additional optical member positioned in front of the first lens (L1) among the lenses (L1, L2, L3, L4) or an additional optical member positioned between two adjacent lenses among the lenses (L1, L2, L3, L4). For example, in one embodiment, additional optical member(s) not shown may be positioned, which may vary depending on the specifications of the imaging device (600) and the space secured within the electronic device (400). The lenses (L1, L2, L3, L4) are positioned sequentially along the optical axis (A) or along the direction in which light is incident, and may be distinguished by indicating an ordinal number corresponding to the order in which they are positioned along the direction in which light is incident, 'first', 'second', 'third', and / or 'fourth'. For example, the lens positioned first in the direction in which light is incident may be referred to as a 'first lens (L1)'.

[0128] In Fig. 8, 'S2' may be the object-side surface of the first lens (L1) among the lenses (L1, L2, L3, L4), and 'S3' may be the sensor-side surface of the first lens (L1). The imaging device (600) and / or the lens assembly (LA) may include an aperture (STOP) arranged in front of the first lens (L1). In one embodiment, the aperture (STOP) may be understood to be arranged behind the vertex (e.g., the point intersecting the optical axis (A)) of the object-side surface (S2) of the first lens (L1). In one embodiment, 'S4' may be the object-side surface of the second lens (L2) among the lenses (L1, L2, L3, L4) that is arranged second in the direction in which light is incident, and 'S5' may be the sensor-side surface of the second lens (L2). In one embodiment, 'S6' may be an object-side surface of a third lens (L3) among the lenses (L1, L2, L3, L4), and 'S7' may be a sensor-side surface of the third lens (L3). In one embodiment, 'S8' may be an object-side surface of a fourth lens (L4) among the lenses (L1, L2, L3, L4), and 'S9' may be a sensor-side surface of the fourth lens (L4). In one embodiment, 'S10' may be an object-side surface of the optical member (R), which may be a surface onto which light focused or guided by the lenses (L1, L2, L3, L4) is incident, and 'S11' may be a sensor-side surface of the optical member (R), which may be a surface facing the image sensor (I) or a surface aligned with the optical axis of the image sensor (I). In one embodiment, a filter member (e.g., an infrared cut filter (F)) may be placed between the optical member (R) and the image sensor (I), and 'S13' indicates the sensor-side surface of the infrared cut filter (F), and the object-side surface of the infrared cut filter (F) may be referred to as 'S12'. In the embodiments described below, reference numbers assigned to each lens surface may be different from the embodiment of FIG. 8.

[0129] In one embodiment, the first lens (L1) may have positive refractive power, the second lens (L2) may have positive refractive power, and / or the third lens (L3) may have negative refractive power. In one embodiment, the fourth lens (L4) may have positive or negative refractive power. As will be described with reference to the embodiments of FIGS. 20 and / or 36, the lens assembly (LA) and / or the imaging device (600) may further include a fifth lens (L5), which may have positive or negative refractive power.

[0130] Although the illustrated embodiment illustrates that the lenses (L1, L2, L3, L4), the optical member (R) and / or the image sensor (I) are aligned along one optical axis (A), it should be noted that the embodiment(s) of the present disclosure are not limited thereto. For example, the optical member (R) may receive light focused or guided by the lenses (L1, L2, L3, L4) and reflect the light at least once within the optical member. For example, the object-side surface (S10) of the optical member (R) may be aligned with the lenses (L1, L2, L3, L4) along the optical axis (A), and the image sensor (I) may be aligned with the sensor-side surface (S11) of the optical member in a direction intersecting the optical axis (A). For example, in Fig. 8, the optical axis (A) is simplified and illustrated, and the light focused or guided by the lenses (L1, L2, L3, L4) is reflected at least once inside the optical member (R), and thus can proceed along the same path as in the embodiment of Fig. 6 or Fig. 7 and be incident on the image sensor (I) (e.g., imaging surface (img)). As will be described below with reference to [Tables] regarding lens data, it should be noted that reference numbers for lens surfaces not described in the drawings may be provided.

[0131] According to one embodiment, the optical member (R) can reflect, refract, and / or guide light incident in the direction of the optical axis (A) at least once in another direction (e.g., a direction intersecting the optical axis (A)). For example, light transmitted through the optical member (R) can be incident on the image sensor (I) substantially along a direction intersecting the optical axis (A). According to one embodiment, the imaging device (600) may further include an infrared cut filter (F). For example, the infrared cut filter (F) may be disposed between the sensor-side surface (S11) of the optical member (R) and the image sensor (I). The infrared cut filter (F) may block light (e.g., infrared) that is not recognized by the naked eye of a user but is detected by a photosensitive material or the image sensor (I). In one embodiment, depending on the purpose or function of the imaging device (600), the infrared cut filter (F) may be replaced with a bandpass filter that transmits light of a specified wavelength band.

[0132] According to one embodiment, at least four lenses (L1, L2, L3, L4) can be sequentially arranged along the optical axis (A) from the object (obj) side toward the optical member (R) or the image sensor (I). In one embodiment, the optical axis (A) can be arranged substantially parallel to the front (e.g., the first surface (210A) of FIG. 2) and / or the back (e.g., the second surface (210B) of FIG. 3) of the electronic device (e.g., the electronic device (101, 200, 300, 400) of FIGS. 1 to 6). According to one embodiment, the electronic device (400) (e.g., the processor (120) of FIG. 1) and / or the imaging device (600) can move at least one of the lenses (L1, L2, L3, L4) forward and backward along the optical axis (A). For example, a focal length adjustment and / or focus adjustment operation can be performed by moving at least one of the lenses (L1, L2, L3, L4) along the direction of the optical axis (A). In one embodiment, the electronic device (400) (e.g., the processor (120) of FIG. 1) and / or the imaging device (600) can perform an image stabilization operation by moving at least one of the lenses (L1, L2, L3, L4) in a plane substantially perpendicular to the optical axis (A). "Movement in a plane substantially perpendicular to the optical axis (A)" can be understood as, for example, moving the lens(es) (L1, L2, L3, L4) along at least two directions substantially perpendicular to the optical axis (A). The "at least two directions" can be, for example, directions that are substantially perpendicular to each other.

[0133] According to one embodiment, the image sensor (I) may be configured to allow the imaging device (600) and / or the electronic device (400) including the same to acquire an image of a subject by receiving light guided and / or focused through the lenses (L1, L2, L3, L4) and / or the optical member (R). In one embodiment, the image sensor (I) may be arranged to be inclined or intersecting with respect to the front (e.g., the first surface (210A) of FIG. 2) and / or the back (e.g., the second surface (210B) of FIG. 3) of the electronic device (e.g., the electronic devices (101, 200, 300, 400) of FIGS. 1 to 6). For example, the imaging plane (img) of the image sensor (I) may form an acute angle and / or an obtuse angle with the optical axis (A). In one embodiment, in a structure in which the optical axis (A) (e.g., the array of lenses (L1, L2, L3, L4)) is arranged perpendicular to the front or back of the electronic device (400) and light incident on the optical member (R) is reflected in a 90-degree direction inside the optical member (R), the imaging plane (img) of the image sensor (I) may be arranged perpendicular to the front or back of the electronic device (400). Depending on the direction or angle in which the optical member (R) reflects light, the imaging plane (img) may be arranged to be inclined with respect to the optical axis (A), the X-axis, the Y-axis, and / or the Z-axis of FIGS. 2 to 6. In one embodiment, since the image sensor (I) may be arranged in various directions with respect to the alignment direction of the lenses (L1, L2, L3, L4), the degree of design freedom may be increased in manufacturing the imaging device (600) and / or the electronic device (400) including the same.

[0134] According to one embodiment, the optical member (R) can change the direction of propagation of light by reflecting and / or refracting the incident light at least once. For example, by arranging the optical member (R) between the lenses (L1, L2, L3, L4) and the image sensor (I), the degree of design freedom in the arrangement (or orientation) of the image sensor (I) with respect to the lenses (L1, L2, L3, L4) can be increased. The optical member (R) is arranged between the lenses (L1, L2, L3, L4) and the image sensor (I), and can receive light through the lenses (L1, L2, L3, L4) in the direction of the optical axis (A). In one embodiment, the optical member (R) can reflect and / or refract light incident through the lenses (L1, L2, L3, L4) in the direction of the optical axis (A) at least once, thereby emitting the light in a direction intersecting the optical axis (A). Such optical members (R) may include, for example, mirrors and / or prisms.

[0135] According to one embodiment, the electronic device (400) (e.g., the processor (120) of FIG. 1) and / or the imaging device (600) may perform image stabilization by rotating or tilting the optical member (R) about the optical axis (A). The “tilt operation” may include, for example, an operation in which the optical member (R) rotates around an arbitrary axis intersecting the optical axis (A). The center axis of the tilt operation may be set in various ways depending on the structure of the imaging device (600) and / or the electronic device (400) to be actually manufactured. In one embodiment, a subject tracking function may be performed through the rotational or tilting operation of the optical member (R). For example, the processor (120) may perform an image stabilization operation or a subject tracking function by rotating or tilting the optical member (R). In one embodiment, the processor (120) may perform a focus adjustment operation by moving the image sensor (I) forward and backward along the direction in which light is incident on the imaging plane (img), and / or may perform an image stabilization operation by moving the image sensor (I) in a plane substantially perpendicular to the direction in which light is incident. When including an additional optical member not shown, the imaging device (600) or the electronic device (400) may perform an image stabilization operation or a subject tracking function using the additional optical member.

[0136] According to one embodiment, the imaging device described above and / or described below (e.g., the imaging device (600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500) of FIG. 8, FIG. 12, FIG. 16, FIG. 20, FIG. 24, FIG. 28, FIG. 32, FIG. 36, FIG. 40 and / or FIG. 41) or the lens assembly (LA) of the imaging device can satisfy the condition of the following [Mathematical Formula 1].

[0137]

[0138] Here, 'f12' is the composite focal length of the first lens (L1) and the second lens (L2), 'f34' is the composite focal length of the third lens (L3) and the fourth lens (L4), 'V1' is the Abbe number of the first lens (L1), 'V2' is the Abbe number of the second lens (L2), 'V3' is the Abbe number of the third lens (L3), 'V4' is the Abbe number of the fourth lens (L4), and 'Vp' may be the Abbe number of the optical member (R). The value calculated by [Mathematical Formula 1] may be a value in the unit of 'mm'. [Mathematical expression 1], for example, presents conditions regarding the refractive power and material (e.g., Abbe number) of lenses (L1, L2, L3, L4) in an imaging device (600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500). When the calculated value of [Mathematical expression 1] is less than -0.9 or greater than -0.5, chromatic aberration due to the optical member (R) may increase, or spherical aberration or field curvature may increase. For example, when the condition of [Mathematical expression 1] is satisfied, the lens assembly (LA) and / or the imaging device (600) may easily improve chromatic aberration while including an optical member (R) such as a prism. When the condition of [Mathematical Formula 1] is satisfied, the combination of the refractive power and the material (e.g., Abbe number) of the lenses (L1, L2, L3, L4) in the lens assembly (LA) and / or the imaging device (600) can be easily performed, thereby suppressing spherical aberration or field curvature. For example, the sensitivity can be lowered in the manufacturing or assembly of the lenses (L1, L2, L3, L4), thereby realizing good optical performance. In one embodiment, the lens assembly (LA) and / or the imaging device (600) satisfying the condition of [Mathematical Formula 1] can provide a field of view (FOV) of about 15 degrees to about 35 degrees. For example, the lens assembly (LA) and / or the imaging device (600) satisfying the condition of [Mathematical Formula 1] can include an optical member (R) such as a mirror or a prism, and can be easily manufactured and improve chromatic aberration, while providing good telephoto performance.

[0139] In one embodiment, at least one of the first lens (L1) and the second lens (L2) may have an Abbe number of about 50 or greater. In one embodiment, both the first lens (L1) and the second lens (L2) may have an Abbe number of about 50 or greater. When the conditions of the first lens (L1) and the second lens (L2) with respect to the Abbe number are satisfied, the lens assembly (LA) and / or the imaging device (600) may be easily improved in chromatic aberration and may have low sensitivity in manufacturing or assembling the lenses (L1, L2, L3, L4). In one embodiment, when the conditions of the first lens (L1) and the second lens (L2) with respect to the Abbe number are satisfied, field curvature in the lens assembly (LA) and / or the imaging device (600) may be suppressed to provide an image of a subject with improved quality.

[0140] In one embodiment, at least one of the third lens (L3) and the fourth lens (L4) may have an Abbe number of about 40 or less. In one embodiment, both the third lens (L3) and the fourth lens (L4) may have an Abbe number of about 40 or less. When the conditions of the third lens (L3) and the fourth lens (L4) with respect to the Abbe number are satisfied, the lens assembly (LA) and / or the imaging device (600) may be easily improved in chromatic aberration and may have low sensitivity in manufacturing or assembling the lenses (L1, L2, L3, L4). In one embodiment, when the conditions of the third lens (L3) and the fourth lens (L4) with respect to the Abbe number are satisfied, field curvature in the lens assembly (LA) and / or the imaging device (600) may be suppressed to provide an image of a subject with improved quality.

[0141] The manufacturing specifications of FIG. 8, FIG. 12, FIG. 16, FIG. 20, FIG. 24, FIG. 28, FIG. 32, FIG. 36, FIG. 40, and / or FIG. 41 (600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500), the manufacturing specifications of the lenses (L1, L2, L3, L4, L5) and / or the calculated values ​​of each embodiment according to [Mathematical Formula 1] are exemplified in [Table 1] and [Table 2]. In [Table 1] and [Table 2], the image height (IMG HT) can be understood as the maximum distance from the point where the optical axis (A) intersects the image sensor (I) to the edge of the imaging plane (img), for example, half of the diagonal length of the imaging plane (img).

[0142] The imaging device (600) of Fig. 8, the imaging device (700) of Fig. 12, the imaging device (800) of Fig. 16, and the imaging device (900) of Fig. 20, the total focal length (mm) 16.93 16.92 16.92 19.55, the angle of view (FOV) (degree) 23232324, and the height (IMG) HT)(mm)3.53.53.54.2F number(Fno)2.83.02.83.0Effective focal length(EFL)(mm)f114.1214.7514.1311.93f226.5426.5426.9628.42f3-19.06-14.34-17.93-24.70f4-44.49134.24-62.08-71.00f5N / AN / AN / A-16.92f129.239.469.358.50f34-13.51-16.99-14.11-18.00Refractive index(nd)L11.5931.5441 .5931.544L21.5441.5441.5441.544L31.6151.681.6151.62L41.6801.641.6801.680L5N / AN / AN / A1.567Prism1.5501.521.5901.544Abbe number(Abv)L155.955.955.955.9L255.955.955.955.9L318.118.118.125.8L419.223.5119.219.0L5N / AN / AN / A37.4Prism40.164.135.164.0[Mathematical formula 1] Output value -0.697-0.505-0.839-0.509

[0143] Fig. 24 imaging device (1000) Fig. 28 imaging device (1100) Fig. 32 imaging device (1200) Fig. 36 imaging device (1300) Total focal length (mm) 16.94 16.95 16.95 19.55 Angle of view (FOV) (degree) 23 23 23 24 Height (IMG) HT)(mm)3.53.53.54.2F number(Fno)2.83.02.83.0Effective focal length(EFL)(mm)f114.2512.4611.4014.04f231.6050.0050.0030.00f3-21.08-164.80-19.54-70.00f4-57.70-13.20-14.43-13.99f5N / AN / AN / A-101.11f129.889.869.149.50f34-15.70-13.20-11.63-11.97Refractive index(nd)L11.5931.4971. 4971.497L21.5441.5441.6161.616L31.6151.6151.6151.620L41.6801.6801.6801.567L5N / AN / AN / A1.567Prism1.5501.5501.5501.550Abbe number(Abv)L167.181.581.581.5L255.937.425.825.8L318.118.118.118.1L419.219.219.219.0L5N / AN / AN / A37.4Prism40.037.435.035.0[Mathematical formula 1] Output value -0.852-0.774-0.647-0.667

[0144] More specific data regarding the shape and arrangement of the imaging device (600) and / or the lens assembly (LA) of FIG. 8 are exemplified in [Table 3], [Table 4] and / or [Table 5]. The data in [Table 3] may additionally exemplify the radius of curvature of the lens surface at the point where the optical axis (A) intersects, or the thickness and arrangement interval of the lenses (L1, L2, L3, L4), and [Table 4] and / or [Table 5] describe the aspherical coefficients of the lenses (L1, L2, L3, L4), and the definition of aspherical can be calculated through the following [Mathematical Formula 2].

[0145]

[0146] In [Mathematical Formula 2], "z" is the distance in the direction of the optical axis (A) from the point where the optical axis (A) passes on the lens surface, "y" is the distance from the optical axis (A) in the vertical direction from the optical axis (A), 'c'' is the reciprocal of the radius of curvature at the vertex of the lens, 'k' is the Conic constant, and 'A', 'B', 'C', 'D', 'E', 'F', 'G', 'H', 'J', 'K', 'L', 'M', 'N', and 'O' may each represent an aspherical coefficient. The 'reciprocal of the radius of curvature' may represent a value (e.g., curvature) indicating the degree of curvature at each point of a curved surface or curve.

[0147] Lens surface radius of curvature thickness (air gap) gap)) Refractive index (nd) Abbe number (Vd) objinfinityinfinitySTOPinfinity-0.500S29.2291.7171.593 55.9S3-88.6440.100S45.0910.8071.54455.9S57.4060.100S62.8680.5001.61518.1S 72.1561.257S8-7.5290.4301.68019.2S9-10.2140.589S10infinity10.8701.55040.1S11infinity0.100S12infinity0.2101.52064.1S13infinity2.961imginfinity-0.005

[0148] 렌즈면(surface)2_ASP3_ASP4_ASP5_ASP곡률반경(radius)9.229E+00-8.864E+015.091E+007.406E+00k(Conic)0.000E+000.000E+002.496E-01-2.702E+00A(4th)3.093E-048.365E-041.238E-036.268E-03B(6th)-1.656E-05-5.374E-051.698E-031.903E-03C(8th)-1.503E-06-4.380E-06-8.692E-04-1.218E-03D(10th)1.985E-075.460E-072.894E-044.707E-04E(12th)0.000E+000.000E+00-5.146E-05-9.536E-05F(14th)0.000E+000.000E+004.736E-061.006E-05G(16th)0.000E+000.000E+00-1.791E-07-4.504E-07H(18th)0.000E+000.000E+000.000E+000.000E+00J(20th)0.000E+000.000E+000.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0149] Lens surface6_ASP7_ASP8_ASP9_ASPcurvatureradius2.868E+002.156E+00-7.529E+00-1.021E+01k(Conic)-2 .654E-01-9.750E-01-3.322E-014.129E+00A(4th)-9.507E-03-1.049E-021.647E-021.587E-02B(6th)4.579 E-041.739E-033.835E-044.031E-04C(8th)-2.778E-04-5.047E-042.012E-041.198E-04D(10th)9.361E-066 .700E-054.374E-064.631E-05E(12th)1.462E-06-3.524E-07-1.688E-05-3.063E-05F(14th)1.729E-07-7.87 9E-073.279E-066.264E-06G(16th)-2.426E-087.908E-08-2.339E-07-4.986E-07H(18th)0.000E+000.000E+ 000.000E+000.000E+00J(20th)0.000E+000.000E+000.000E+000.000E+00K(22th)0.000E+000.000E+000.000 E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000. 000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0150] In the embodiments described below, reference numerals for optical axes, lenses, and / or lens surfaces may be omitted from the drawings for simplicity. Reference numerals omitted from the drawings will be readily understood by those skilled in the art by further referring to FIG. 8 or by reading the lens data and drawings presented in each embodiment.

[0151] FIG. 12 is a diagram showing an imaging device (700) according to one embodiment of the present disclosure (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3 or the imaging device (500) of FIG. 6). FIG. 13 is a graph showing spherical aberration of the imaging device (700) of FIG. 12 according to one embodiment of the present disclosure. FIG. 14 is a graph showing astigmatism of the imaging device (700) of FIG. 12 according to one embodiment of the present disclosure. FIG. 15 is a graph showing a distortion rate of the imaging device (700) of FIG. 12 according to one embodiment of the present disclosure.

[0152] Referring to FIGS. 12 to 15, the imaging device (700) can be manufactured in accordance with the specifications of [Table 1] and [Table 2] described above, as well as the data of [Table 6] regarding the radius of curvature of the lens surface or the thickness and spacing between the lenses (L1, L2, L3, L4), and can have the aspherical coefficients of [Table 7] and / or [Table 8]. In one embodiment, the imaging device (700) can satisfy at least some of the conditions described above, such as [Mathematical Formula 1].

[0153] Lens surface radius of curvature thickness (air gap) gap)) Refractive index (nd) Abbe number (Vd) objinfinityinfinitySTOPinfinity-0.500S210.0581.6341.54 455.9S3-38.1300.100S45.0910.8071.54455.9S57.4060.100S62.9350.4591.68018.1 S72.1211.257S8-6.0310.7011.64023.5S9-5.8950.589S10infinity10.8701.52064.1S11infinity0.100S12infinity0.2101.52064.1S13infinity3.707imginfinity-0.005

[0154] 렌즈면(surface)2_ASP3_ASP4_ASP5_ASP곡률반경(radius)1.006E+01-3.813E+015.091E+007.406E+00k(Conic)0.000E+000.000E+002.496E-01-2.702E+00A(4th)7.702E-041.439E-03-9.167E-056.582E-03B(6th)3.671E-05-1.098E-051.573E-031.727E-03C(8th)-2.775E-064.372E-07-8.776E-04-1.248E-03D(10th)6.521E-071.039E-062.855E-044.693E-04E(12th)0.000E+000.000E+00-5.154E-05-9.583E-05F(14th)0.000E+000.000E+004.761E-069.979E-06G(16th)0.000E+000.000E+00-1.840E-07-4.445E-07H(18th)0.000E+000.000E+000.000E+000.000E+00J(20th)0.000E+000.000E+000.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0155] 렌즈면(surface)6_ASP7_ASP8_ASP9_ASP곡률반경(radius)2.935E+002.121E+00-6.031E+00-5.895E+00k(Conic)-2.654E-01-9.750E-01-3.322E-014.129E+00A(4th)-9.507E-03-1.049E-021.124E-021.051E-02B(6th)4.579E-041.739E-037.505E-045.981E-04C(8th)-2.778E-04-5.047E-042.601E-041.425E-04D(10th)9.361E-066.700E-053.901E-066.113E-05E(12th)1.462E-06-3.524E-07-1.681E-05-3.157E-05F(14th)1.729E-07-7.879E-073.512E-065.716E-06G(16th)-2.426E-087.908E-08-2.312E-07-2.704E-07H(18th)0.000E+000.000E+000.000E+000.000E+00J(20th)0.000E+000.000E+000.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0156] FIG. 16 is a diagram showing an imaging device (800) according to one embodiment of the present disclosure (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3 and / or the imaging device (500) of FIG. 6). FIG. 17 is a graph showing spherical aberration of the imaging device (800) of FIG. 16 according to one embodiment of the present disclosure. FIG. 18 is a graph showing astigmatism of the imaging device (800) of FIG. 16 according to one embodiment of the present disclosure. FIG. 19 is a graph showing a distortion rate of the imaging device (800) of FIG. 16 according to one embodiment of the present disclosure.

[0157] Referring to FIGS. 16 to 19, the imaging device (800) can be manufactured in accordance with the specifications of [Table 1] and [Table 2] described above, as well as the data of [Table 9] regarding the radius of curvature of the lens surface or the thickness and arrangement interval of the lenses (L1, L2, L3, L4), and can have the aspherical coefficients of [Table 10] and / or [Table 11]. In one embodiment, the imaging device (800) can satisfy at least some of the conditions described above, such as [Mathematical Formula 1].

[0158] Lens surface radius of curvature thickness (air gap) gap)) Refractive index (nd) Abbe number (Vd) objinfinityinfinitySTOPinfinity-0.450S29.2292.0131.593 55.9S3-88.6440.100S45.0910.6931.54455.9S57.4060.100S62.7350.4951.62018.1S 72.0451.205S8-6.6880.3501.68019.2S9-8.0980.589S10infinity10.8701.59035.1S11infinity0.100S12infinity0.2101.52062.1S13infinity3.337imginfinity-0.005

[0159] 렌즈면(surface)2_ASP3_ASP4_ASP5_ASP곡률반경(radius)9.229E+00-8.864E+015.091E+007.406E+00k(Conic)0.000E+000.000E+002.496E-01-2.702E+00A(4th)1.568E-041.075E-032.085E-037.167E-03B(6th)-1.453E-05-4.220E-051.793E-031.905E-03C(8th)-2.067E-07-4.010E-06-8.650E-04-1.228E-03D(10th)1.750E-077.010E-072.894E-044.700E-04E(12th)0.000E+000.000E+00-5.146E-05-9.521E-05F(14th)0.000E+000.000E+004.745E-061.010E-05G(16th)0.000E+000.000E+00-1.754E-07-4.465E-07H(18th)0.000E+000.000E+000.000E+000.000E+00J(20th)0.000E+000.000E+000.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0160] 렌즈면(surface)6_ASP7_ASP8_ASP9_ASP곡률반경(radius)2.735E+002.045E+00-6.688E+00-8.098E+00k(Conic)-2.654E-01-9.750E-01-3.322E-014.129E+00A(4th)-9.507E-03-1.049E-021.447E-021.470E-02B(6th)4.579E-041.739E-031.798E-043.212E-04C(8th)-2.778E-04-5.047E-041.714E-049.594E-05D(10th)9.361E-066.700E-05-1.679E-074.046E-05E(12th)1.462E-06-3.524E-07-1.712E-05-3.207E-05F(14th)1.729E-07-7.879E-073.254E-066.064E-06G(16th)-2.426E-087.908E-08-2.845E-07-4.730E-07H(18th)0.000E+000.000E+000.000E+000.000E+00J(20th)0.000E+000.000E+000.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0161] FIG. 20 is a diagram showing an imaging device (900) according to one embodiment of the present disclosure (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3 or the imaging device (500) of FIG. 6). FIG. 21 is a graph showing spherical aberration of the imaging device (900) of FIG. 20 according to one embodiment of the present disclosure. FIG. 22 is a graph showing astigmatism of the imaging device (900) of FIG. 20 according to one embodiment of the present disclosure. FIG. 23 is a graph showing a distortion rate of the imaging device (900) of FIG. 20 according to one embodiment of the present disclosure.

[0162] Referring to FIGS. 20 to 23, the imaging device (900) can be manufactured in accordance with the specifications of [Table 1] and [Table 2] described above, as well as the data of [Table 12] regarding the radius of curvature of the lens surface or the thickness and arrangement interval of the lenses (L1, L2, L3, L4, L5), and can have the aspherical coefficients of [Table 13] and / or [Table 14]. In one embodiment, the imaging device (900) can satisfy at least some of the conditions described above, such as [Mathematical Formula 1].

[0163] Lens surface (surface) curvature (radius) thickness (air gap) refractive index (nd) Abbe number (Vd) objinfinityinfinityS17.1051957991.0961.54455.9STOP (S2)-76.3490.100S39.8360.8031.54455.9S425.9870.100S556.8532.1481 .62025.8S611.9780.115S733.2431.3481.68019.0S819.4480.256S9-19.01 40.3801.56737.4S1019.7660.300S11infinity13.0001.54464.1S12infinity0.100S13infinity0.2101.52064.1S14infinity1.743imginfinity0.007

[0164] 렌즈면(surface)1_ASP2_ASP3_ASP4_ASP5_ASP곡률반경(radius)7.105E+00-7.635E+019.836E+002.599E+015.685E+01k(Conic)-5.097E-01-1.000E+000.000E+000.000E+000.000E+00A(4th)-4.562E-04-7.997E-055.776E-05-7.370E-042.635E-04B(6th)6.199E-05-6.570E-04-8.871E-04-3.028E-047.011E-06C(8th)-7.902E-054.624E-045.959E-041.675E-04-1.033E-06D(10th)3.483E-05-1.122E-04-1.322E-04-2.821E-05-1.648E-07E(12th)-7.239E-061.644E-051.517E-051.939E-06-1.337E-08F(14th)9.078E-07-1.745E-06-1.014E-06-2.223E-082.051E-10G(16th)-7.391E-081.277E-073.998E-08-4.009E-09-1.469E-11H(18th)3.864E-09-3.665E-09-8.627E-102.020E-106.058E-12J(20th)-1.176E-10-3.043E-107.870E-12-2.962E-121.299E-13K(22th)1.569E-123.174E-110.000E+000.000E+000.000E+00L(24th)0.000E+00-8.618E-130.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+000.000E+00

[0165] 렌즈면(surface)6_ASP7_ASP8_ASP9_ASP10_ASP곡률반경(radius)1.198E+011.945E+011.945E+01-1.901E+011.977E+01k(Conic)0.000E+000.000E+000.000E+00-1.000E+00-9.900E+01A(4th)-3.366E-041.300E-031.300E-033.757E-037.733E-03B(6th)-5.029E-052.364E-042.364E-04-6.693E-04-9.853E-04C(8th)-1.686E-064.260E-054.260E-05-6.113E-04-3.848E-04D(10th)4.789E-076.775E-066.775E-066.236E-044.352E-04E(12th)1.177E-071.027E-061.027E-06-3.164E-04-2.276E-04F(14th)1.527E-098.826E-088.826E-089.745E-057.050E-05G(16th)-2.519E-09-2.703E-08-2.703E-08-1.842E-05-1.362E-05H(18th)-6.334E-102.736E-182.736E-182.060E-061.615E-06J(20th)-3.467E-114.255E-204.255E-20-1.244E-07-1.087E-07K(22th)0.000E+000.000E+000.000E+003.120E-093.228E-09L(24th)0.000E+000.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+000.000E+00

[0166] FIG. 24 is a diagram showing an imaging device (1000) according to one embodiment of the present disclosure (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3 or the imaging device (500) of FIG. 6). FIG. 25 is a graph showing spherical aberration of the imaging device (1000) of FIG. 24 according to one embodiment of the present disclosure. FIG. 26 is a graph showing astigmatism of the imaging device (1000) of FIG. 24 according to one embodiment of the present disclosure. FIG. 27 is a graph showing a distortion rate of the imaging device (1000) of FIG. 24 according to one embodiment of the present disclosure.

[0167] Referring to FIGS. 24 to 27, the imaging device (1000) can be manufactured in accordance with the specifications of [Table 1] and [Table 2] described above, as well as the data of [Table 15] regarding the radius of curvature of the lens surface or the thickness and arrangement interval of the lenses (L1, L2, L3, L4), and can have the aspherical coefficients of [Table 16] and / or [Table 17]. In one embodiment, the imaging device (1000) can satisfy at least some of the conditions described above, such as [Mathematical Formula 1].

[0168] Lens surface (surface) curvature (radius) thickness (air gap) refractive index (nd) Abbe number (Vd) objinfinityinfinitySTOP (S1)8.8351.9251.59367.1S2-197.1060.266S34.8900.6781.54455.9S46. 4880.100S52.7340.4851.61618.1S62.1091.161S7-6.7530.3721.68019.2S 8-8.3180.589S9infinity10.8701.55040.1S10infinity0.100S11infinity0.2101.52064.1S12infinity0.000S13infinity3.100Imginfinity-0.005

[0169] 렌즈면(surface)1_ASP2_ASP3_ASP4_ASP곡률반경(radius)8.835E+00-1.971E+024.890E+006.488E+00k(Conic)0.000E+000.000E+002.496E-01-2.702E+00A(4th)4.188E-049.480E-041.433E-037.121E-03B(6th)-1.425E-05-3.260E-051.708E-031.859E-03C(8th)-5.539E-07-2.151E-06-8.685E-04-1.228E-03D(10th)2.455E-077.297E-072.889E-044.709E-04E(12th)0.000E+000.000E+00-5.145E-05-9.529E-05F(14th)0.000E+000.000E+004.747E-061.007E-05G(16th)0.000E+000.000E+00-1.777E-07-4.449E-07H(18th)0.000E+000.000E+000.000E+000.000E+00J(20th)0.000E+000.000E+000.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0170] 렌즈면(surface)5_ASP6_ASP7_ASP8_ASP곡률반경(radius)2.734E+002.109E+00-6.753E+00-8.318E+00k(Conic)-2.654E-01-9.750E-01-3.322E-014.129E+00A(4th)-9.507E-03-1.049E-021.574E-021.598E-02B(6th)4.579E-041.739E-033.473E-044.207E-04C(8th)-2.778E-04-5.047E-041.926E-041.153E-04D(10th)9.361E-066.700E-052.890E-064.582E-05E(12th)1.462E-06-3.524E-07-1.684E-05-3.128E-05F(14th)1.729E-07-7.879E-073.279E-066.078E-06G(16th)-2.426E-087.908E-08-2.704E-07-4.998E-07H(18th)0.000E+000.000E+000.000E+000.000E+00J(20th)0.000E+000.000E+000.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0171] FIG. 28 is a diagram showing an imaging device (1100) according to one embodiment of the present disclosure (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3 or the imaging device (500) of FIG. 6). FIG. 29 is a graph showing spherical aberration of the imaging device (1100) of FIG. 28 according to one embodiment of the present disclosure. FIG. 30 is a graph showing astigmatism of the imaging device (1100) of FIG. 28 according to one embodiment of the present disclosure. FIG. 31 is a graph showing a distortion rate of the imaging device (1100) of FIG. 28 according to one embodiment of the present disclosure.

[0172] Referring to FIGS. 28 to 31, the imaging device (1100) can be manufactured in accordance with the specifications of [Table 1] and [Table 2] described above, as well as the data of [Table 18] regarding the radius of curvature of the lens surface or the thickness and arrangement interval of the lenses (L1, L2, L3, L4), and can have the aspherical coefficients of [Table 19] and / or [Table 20]. In one embodiment, the imaging device (1100) can satisfy at least some of the conditions described above, such as [Mathematical Formula 1].

[0173] Lens surface (surface) curvature (radius) thickness (air gap) refractive index (nd) Abbe number (Vd) objinfinityinfinitySTOP (S1)5.1901.2441.49781.5S229.0030.367S35.0250.6291.61637.4S45.7 100.686S53.1150.5101.61618.1S62.8330.300S723.5710.3601.68019.2S 86.6270.450S9infinity12.0001.55035.1S10infinity0.100S11infinity0.2101.52064.1S12infinity0.000S13infinity1.949Imginfinity-0.005

[0174] 렌즈면(surface)1_ASP2_ASP3_ASP4_ASP곡률반경(radius)5.190E+002.900E+015.025E+005.710E+00k(Conic)0.000E+000.000E+002.496E-01-2.702E+00A(4th)3.433E-04-1.415E-053.079E-038.225E-03B(6th)-6.386E-06-2.145E-051.609E-032.282E-03C(8th)7.130E-07-4.697E-06-8.447E-04-1.225E-03D(10th)-8.155E-081.502E-072.858E-044.835E-04E(12th)-1.734E-081.763E-09-5.134E-05-9.505E-05F(14th)-2.726E-101.508E-094.810E-069.854E-06G(16th)2.182E-113.154E-10-1.855E-07-4.362E-07H(18th)9.040E-122.817E-110.000E+000.000E+00J(20th)3.217E-12-1.604E-120.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0175] 렌즈면(surface)5_ASP6_ASP7_ASP8_ASP곡률반경(radius)3.115E+002.833E+002.357E+016.627E+00k(Conic)-2.654E-01-9.750E-01-3.322E-014.129E+00A(4th)-7.640E-03-1.228E-021.125E-021.602E-02B(6th)4.684E-041.695E-032.434E-05-5.003E-04C(8th)-2.813E-04-4.566E-041.312E-047.046E-06D(10th)1.108E-057.510E-052.550E-063.443E-05E(12th)1.954E-061.031E-06-1.457E-05-3.536E-05F(14th)2.395E-07-3.506E-073.706E-065.334E-06G(16th)-1.610E-081.759E-07-2.429E-07-3.145E-07H(18th)0.000E+000.000E+000.000E+000.000E+00J(20th)0.000E+000.000E+000.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0176] FIG. 32 is a diagram showing an imaging device (1200) according to one embodiment of the present disclosure (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3 or the imaging device (500) of FIG. 6). FIG. 33 is a graph showing spherical aberration of the imaging device (1200) of FIG. 32 according to one embodiment of the present disclosure. FIG. 34 is a graph showing astigmatism of the imaging device (1200) of FIG. 32 according to one embodiment of the present disclosure. FIG. 35 is a graph showing a distortion rate of the imaging device (1200) of FIG. 32 according to one embodiment of the present disclosure.

[0177] Referring to FIGS. 32 to 35, the imaging device (1200) can be manufactured in accordance with the specifications of [Table 1] and [Table 2] described above, as well as the data of [Table 21] regarding the radius of curvature of the lens surface or the thickness and spacing between the lenses (L1, L2, L3, L4), and can have the aspherical coefficients of [Table 22] and / or [Table 23]. In one embodiment, the imaging device (1200) can satisfy at least some of the conditions described above, such as [Mathematical Formula 1].

[0178] Lens surface (surface) curvature (radius) thickness (air gap) refractive index (nd) Abbe number (Vd) objinfinityinfinitySTOP (S1)5.3041.2351.49781.5S273.0800.329S35.3020.6901.61625.8S46.0 740.397S53.0510.5031.61618.1S62.6010.361S731.3050.3601.68019.2S 87.5090.589S9infinity12.0001.55035.1S10infinity0.100S11infinity0.2101.52064.1S12infinity0.000S13infinity2.032Imginfinity-0.005

[0179] 렌즈면(surface)1_ASP2_ASP3_ASP4_ASP곡률반경(radius)5.304E+007.308E+015.302E+006.074E+00k(Conic)0.000E+000.000E+002.496E-01-2.702E+00A(4th)3.492E-044.688E-042.727E-037.798E-03B(6th)-2.414E-05-3.639E-051.662E-032.147E-03C(8th)7.760E-08-5.624E-06-8.568E-04-1.205E-03D(10th)1.900E-084.212E-072.875E-044.809E-04E(12th)-1.705E-08-5.131E-09-5.129E-05-9.496E-05F(14th)-8.175E-101.131E-094.794E-069.941E-06G(16th)-1.250E-122.642E-10-1.812E-07-4.474E-07H(18th)1.335E-112.550E-110.000E+000.000E+00J(20th)3.912E-12-3.698E-130.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0180] 렌즈면(surface)5_ASP6_ASP7_ASP8_ASP곡률반경(radius)3.051E+002.601E+003.131E+017.509E+00k(Conic)-2.654E-01-9.750E-01-3.322E-014.129E+00A(4th)-8.195E-03-1.228E-021.257E-021.654E-02B(6th)4.062E-041.831E-031.035E-04-2.641E-04C(8th)-2.860E-04-4.582E-041.618E-04-1.604E-05D(10th)8.864E-067.380E-053.574E-063.261E-05E(12th)1.696E-064.245E-07-1.518E-05-3.329E-05F(14th)2.283E-07-5.799E-073.604E-065.804E-06G(16th)-1.893E-081.453E-07-2.851E-07-5.036E-07H(18th)1.409E-101.340E-080.000E+000.000E+00J(20th)1.010E-101.596E-100.000E+000.000E+00K(22th)0.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+00

[0181] FIG. 36 is a diagram showing an imaging device (1300) according to one embodiment of the present disclosure (e.g., the camera modules (180, 205, 212, 213) of FIGS. 1 to 3 or the imaging device (500) of FIG. 6). FIG. 37 is a graph showing spherical aberration of the imaging device (1300) of FIG. 36 according to one embodiment of the present disclosure. FIG. 38 is a graph showing astigmatism of the imaging device (1300) of FIG. 36 according to one embodiment of the present disclosure. FIG. 39 is a graph showing a distortion rate of the imaging device (1300) of FIG. 36 according to one embodiment of the present disclosure.

[0182] Referring to FIGS. 36 to 39, the imaging device (1300) can be manufactured in accordance with the specifications of [Table 1] and [Table 2] described above, as well as the data of [Table 24] regarding the radius of curvature of the lens surface or the thickness and arrangement interval of the lenses (L1, L2, L3, L4, L5), and can have the aspherical coefficients of [Table 25] and / or [Table 26]. In one embodiment, the imaging device (1300) can satisfy at least some of the conditions described above, such as [Mathematical Formula 1].

[0183] Lens surface (surface) curvature (radius) thickness (air gap) refractive index (nd) Abbe number (Vd) objinfinityinfinityS17.1601.5101.49781.0STOP (S2)-290.0110.100S35.5610.8951.61525.0S47.4360.419S512.7611.255 1.69018.0S69.7120.157S716.0350.5381.67919.0S85.9290.411S915.345 0.3601.56737.4S1012.0180.300S11infinity13.0001.55035.1S12infinity0.100S13infinity0.2101.52064.1S14infinity2.350Imginfinity0.006

[0184] 렌즈면(surface)1_ASP2_ASP3_ASP4_ASP5_ASP곡률반경(radius)7.160E+00-2.900E+025.561E+007.436E+001.276E+01k(Conic)-7.920E-01-1.000E+000.000E+000.000E+000.000E+00A(4th)-4.700E-05-3.462E-045.924E-044.569E-044.450E-05B(6th)-4.456E-053.904E-051.900E-041.858E-04-5.026E-06C(8th)1.574E-050.000E+00-8.319E-05-1.802E-04-1.241E-06D(10th)-2.064E-060.000E+001.830E-055.227E-05-7.850E-08E(12th)-3.180E-080.000E+00-2.027E-06-8.274E-068.751E-09F(14th)4.721E-080.000E+001.149E-077.534E-073.075E-09G(16th)-6.377E-090.000E+00-3.207E-09-3.885E-083.819E-10H(18th)4.112E-100.000E+003.440E-111.053E-092.591E-11J(20th)-1.337E-110.000E+002.506E-14-1.164E-11-9.320E-12K(22th)1.748E-130.000E+000.000E+000.000E+000.000E+00L(24th)0.000E+000.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+000.000E+00

[0185] 렌즈면(surface)6_ASP7_ASP8_ASP9_ASP10_ASP곡률반경(radius)9.712E+001.603E+015.929E+001.534E+011.202E+01k(Conic)0.000E+000.000E+000.000E+00-1.000E+00-9.900E+01A(4th)1.132E-04-2.036E-061.471E-032.696E-031.055E-02B(6th)-2.510E-067.197E-053.059E-04-2.536E-04-3.070E-03C(8th)-1.539E-071.375E-055.946E-05-2.727E-041.103E-03D(10th)-1.045E-062.964E-069.023E-061.116E-04-5.909E-04E(12th)2.262E-07-1.286E-071.041E-06-1.059E-052.528E-04F(14th)1.775E-08-6.080E-087.434E-08-1.910E-06-6.889E-05G(16th)-2.563E-09-1.250E-08-5.205E-085.297E-071.070E-05H(18th)-1.526E-09-1.663E-092.750E-18-4.940E-08-8.428E-07J(20th)-3.818E-10-1.076E-104.419E-202.123E-092.278E-08K(22th)0.000E+000.000E+000.000E+00-3.538E-113.535E-10L(24th)0.000E+000.000E+000.000E+000.000E+000.000E+00M(26th)0.000E+000.000E+000.000E+000.000E+000.000E+00N(28th)0.000E+000.000E+000.000E+000.000E+000.000E+00O(30th)0.000E+000.000E+000.000E+000.000E+000.000E+00

[0186] FIG. 40 is a drawing showing an imaging device (1400) according to one embodiment of the present disclosure. FIG. 41 is a drawing showing an imaging device (1500) according to one embodiment of the present disclosure.

[0187] Referring to FIGS. 40 and 41, the optical member (R) disposed between the lens assembly (LA) and the image sensor (I) to convert the path of light may have a polygonal shape, for example, a parallelogram column shape as in FIG. 40 or a trapezoidal column shape as in FIG. 41. For example, depending on the position and shape of the optical member (R), the position or direction of the image sensor (I) with respect to the lens assembly (LA) may be implemented in various ways. Depending on the shape of the optical member (R), light incident on the optical member (R) through the lens assembly (LA) may be reflected at least once inside the optical member (R) and then emitted to the outside of the optical member (R) through a surface directed toward the image sensor (I).

[0188] An imaging device according to one embodiment of the present disclosure (e.g., a camera module (180, 205, 212, 213) of FIGS. 1 to 3, or an imaging device (500, 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500) of FIGS. 7, 8, 12, 16, 20, 24, 28, 32, 36, 40, and 41) includes an optical member (e.g., an optical member (R) of FIG. 8) that reflects and / or refracts incident light, thereby allowing free design of a path of light reaching an image sensor (e.g., an image sensor (I) of FIG. 8). For example, the arrangement direction of the image forming surface (e.g., the image forming surface (img) of FIG. 8) of the image sensor (I) can be designed in various ways with respect to the arrangement of lenses (e.g., the lenses (L1, L2, L3, L4) of FIG. 8). Accordingly, it can be easy to mount an imaging device having high optical performance (e.g., telephoto performance) in a miniaturized and lightweight electronic device such as a smart phone (e.g., the electronic devices (101, 102, 104, 200, 300, 400) of FIGS. 1 to 6). In one embodiment, the imaging device and / or the electronic device including the same can suppress chromatic aberration due to an optical member through a combination of refractive power and material of the lenses, thereby providing good telephoto performance and / or suppressing deterioration of the quality of the acquired image.

[0189] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description of the above-described embodiment(s).

[0190] According to one embodiment of the present disclosure, an imaging device (e.g., a camera module (180, 205, 212, 213) of FIGS. 1 to 3, or an imaging device (500, 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500) of FIGS. 7, 8, 12, 16, 20, 24, 28, 32, 36, 40, and 41) comprises at least four lenses (e.g., lenses (L1, L2) of FIGS. 8, 12, 16, and / or 20) sequentially aligned along an optical axis (e.g., an optical axis (A) of FIGS. 8, 12, 16, and / or 20). A lens assembly (e.g., the lens assembly (LA) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20) comprising at least four lenses, wherein the at least four lenses include a first lens (e.g., the first lens (L1) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20) which is arranged first in the direction of incidence of light and has positive refractive power, a second lens (e.g., the second lens (L2) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20) which is arranged second in the direction of incidence of light and has positive refractive power, a third lens (e.g., the third lens (L3) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20) which is arranged third in the direction of incidence of light, and a fourth lens (e.g., the fourth lens (L3) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20) which is arranged fourth in the direction of incidence of light. The lens assembly includes a lens (L4), and an optical member (e.g., the optical member (R) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20) configured to guide light focused or guided by the lens assembly in a direction crossing the optical axis by reflecting the light at least once. In one embodiment, the lens assembly satisfies the following [Conditional Expression 1].

[0191] [Condition 1]

[0192] -0.9 < ((f12 / (V1+V2)+f34 / (V3+V4)) / Vp) x 100 < -0.5

[0193] Here, 'f12' is the composite focal length of the first lens and the second lens, 'f34' is the composite focal length of the third lens and the fourth lens, 'V1' is the Abbe number of the first lens, 'V2' is the Abbe number of the second lens, 'V3' is the Abbe number of the third lens, 'V4' is the Abbe number of the fourth lens, and 'Vp' is the Abbe number of the optical member.

[0194] In one embodiment, the third lens may have negative refractive power.

[0195] According to one embodiment, at least one of the first lens, the second lens and the third lens may include at least one of a synthetic resin or glass.

[0196] In one embodiment, at least one of the first lens and the second lens may have an Abbe number of 50 or greater. In one embodiment, the sum of the Abbe number of the first lens and the Abbe number of the second lens may be 100 or greater.

[0197] In one embodiment, at least one of the third lens and the fourth lens may have an Abbe number of 40 or less.

[0198] According to one embodiment, the imaging device as described above may further include an image sensor (e.g., the image sensor (I) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20) configured to receive light guided through the optical member.

[0199] According to one embodiment, the imaging device as described above may further include an infrared cutoff filter (e.g., an infrared cutoff filter (F) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20) disposed between the optical member and the image sensor.

[0200] According to one embodiment, the image sensor may be configured to perform a focus adjustment operation by moving forward and backward along a direction in which light is incident on the imaging surface of the image sensor, or to perform a shake correction operation by moving in a plane perpendicular to the direction in which light is incident on the imaging surface.

[0201] According to one embodiment, the imaging device as described above can satisfy the following [Conditional Expression 2].

[0202] [Condition 2]

[0203] 15 < FOV < 35

[0204] Here, 'FOV' is the angle of view of the lens assembly, and the unit may be 'degree'.

[0205] According to one embodiment, the imaging device as described above may be configured to perform a shake correction operation or a subject tracking operation by rotating or tilting the optical member.

[0206] According to one embodiment, the imaging device as described above may further include a second optical member arranged in front of the first lens and configured to receive light from a direction intersecting the optical axis and guide the light to the first lens along the optical axis.

[0207] According to one embodiment, the second optical member may be configured to reflect the incident light at least once internally.

[0208] According to one embodiment, the second optical member may be configured to perform a shake correction operation or a subject tracking operation by rotating or tilting the second optical member.

[0209] According to one embodiment of the present disclosure, an electronic device (e.g., an electronic device (101, 102, 104, 200, 300, 400) of FIGS. 1 to 6) comprises a lens assembly (e.g., a lens assembly (LA) of FIGS. 8, 12, 16, and / or 20) including at least four lenses (e.g., lenses (L1, L2, L3, L4, L5) of FIGS. 8, 12, 16, and / or 20) sequentially aligned along an optical axis (e.g., an optical axis (A) of FIGS. 8, 12, 16, and / or 20)) and an optical member (e.g., an optical member (R) of FIGS. 8, 12, 16, and / or 20) configured to guide light focused or guided by the lens assembly in a direction crossing the optical axis by reflecting the light at least once. An imaging device (e.g., camera modules (180, 205, 212, 213) of FIGS. 1 to 3, or imaging devices (500, 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500) of FIGS. 7, 8, 12, 16, 20, 24, 28, 32, 36, 40, and 41), and a processor (e.g., processor (120) of FIG. 1) configured to acquire an image of a subject using the imaging device. In one embodiment, the at least four lenses include a first lens arranged first in the direction of incidence of light and having positive refractive power (e.g., the first lens (L1) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20), a second lens arranged second in the direction of incidence of light and having positive refractive power (e.g., the second lens (L2) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20), a third lens arranged third in the direction of incidence of light and having negative refractive power (e.g., the third lens (L3) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20), and a fourth lens arranged fourth in the direction of incidence of light (e.g., the fourth lens (L4) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20).In one embodiment, the lens assembly satisfies the following [Conditional Expression 1].

[0210] [Condition 1]

[0211] -0.9 < ((f12 / (V1+V2)+f34 / (V3+V4)) / Vp) x 100 < -0.5

[0212] Here, 'f12' is the composite focal length of the first lens and the second lens, 'f34' is the composite focal length of the third lens and the fourth lens, 'V1' is the Abbe number of the first lens, 'V2' is the Abbe number of the second lens, 'V3' is the Abbe number of the third lens, 'V4' is the Abbe number of the fourth lens, and 'Vp' is the Abbe number of the optical member.

[0213] According to one embodiment, at least one of the first lens, the second lens, and the third lens may include at least one of a synthetic resin material or glass.

[0214] In one embodiment, the first lens and the second lens may have an Abbe number of 50 or greater.

[0215] In one embodiment, the third lens and the fourth lens may have an Abbe number of 40 or less.

[0216] In one embodiment, the imaging device may further include an image sensor (e.g., the image sensor (I) of FIGS. 8, 12, 16, and / or 20) configured to receive light guided through the optical member. In one embodiment, the processor may be configured to acquire an image of a subject based on the light received through the image sensor.

[0217] According to one embodiment, the imaging device may further include an infrared cutoff filter (e.g., the infrared cutoff filter (F) of FIG. 8, FIG. 12, FIG. 16, and / or FIG. 20) disposed between the optical member and the image sensor.

[0218] According to one embodiment, the processor may be configured to perform a focus adjustment operation by moving the image sensor forward and backward along a direction in which light is incident on the imaging plane of the image sensor, or to perform a shake correction operation by moving the image sensor in a plane perpendicular to a direction in which light is incident on the imaging plane.

[0219] According to one embodiment, the lens assembly can satisfy the following [Conditional Expression 2].

[0220] [Condition 2]

[0221] 15 < FOV < 35

[0222] Here, 'FOV' is the angle of view of the lens assembly, and the unit is 'degree'.

[0223] In one embodiment, the processor may be configured to perform a shake correction operation or a subject tracking operation by rotating or tilting the optical member.

[0224] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In the imaging device (180; 205; 212; 213; 500; 600; 700; 800; 900; 1000; 1100; 1200; 1300; 1400; 1500), A lens assembly (LA) comprising at least four lenses (L1, L2, L3, L4, L5) sequentially aligned along the optical axis (A), wherein the at least four lenses, A first lens (L1) is placed first in the direction of incidence of light and has a defined refractive power, A second lens (L2) positioned second from the direction of incidence of light and having a defined refractive power, The third lens (L3) is placed third from the direction of incidence of light, The lens assembly including a fourth lens (L4) arranged fourth from the direction of incidence of light; and An optical member (R) configured to guide light focused or guided by the lens assembly in a direction intersecting the optical axis by reflecting the light at least once, The above lens assembly is an imaging device that satisfies the following [Conditional Expression 1]. [Condition 1] -0.9 < ((f12 / (V1+V2)+f34 / (V3+V4)) / Vp) x 100 < -0.5 Here, 'f12' is a composite focal length of the first lens and the second lens, 'f34' is a composite focal length of the third lens and the fourth lens, 'V1' is an Abbe number of the first lens, 'V2' is an Abbe number of the second lens, 'V3' is an Abbe number of the third lens, 'V4' is an Abbe number of the fourth lens, and 'Vp' is an Abbe number of the optical member.

2. In the first paragraph, the third lens is an imaging device having negative refractive power.

3. An imaging device according to any one of claims 1 to 2, wherein at least one of the first lens, the second lens and the third lens comprises at least one of synthetic resin or glass.

4. In any one of claims 1 to 3, at least one of the first lens and the second lens has an Abbe number of 50 or greater, An imaging device wherein the sum of the Abbe number of the first lens and the Abbe number of the second lens is 100 or greater.

5. An imaging device according to any one of claims 1 to 4, wherein at least one of the third lens and the fourth lens has an Abbe number of 40 or less.

6. In any one of paragraphs 1 to 5, An imaging device further comprising an image sensor (I) set to receive light guided through the optical member.

7. In paragraph 6, An imaging device further comprising an infrared blocking filter (F) disposed between the optical member and the image sensor.

8. In any one of clauses 6 to 7, the image sensor, The focus adjustment operation is performed by moving forward and backward along the direction in which light is incident on the imaging surface of the image sensor, or An imaging device configured to perform a shake correction operation by moving in a plane perpendicular to the direction in which light is incident on the imaging surface.

9. An imaging device satisfying the following [conditional expression 2] in any one of clauses 1 to 8. [Condition 2] 15 < FOV < 35 Here, 'FOV' is the angle of view of the lens assembly, and the unit is 'degree'.

10. An imaging device according to any one of claims 1 to 9, wherein the imaging device is configured to perform a shake correction operation or a subject tracking operation by rotating or tilting the optical member.

11. In any one of paragraphs 1 to 10, An imaging device further comprising a second optical member arranged in front of the first lens and configured to receive light from a direction intersecting the optical axis and guide the light to the first lens along the optical axis.

12. An imaging device in accordance with claim 11, wherein the second optical member is configured to reflect the incident light at least once internally.

13. In electronic devices (101; 102; 104; 200; 300; 400), An imaging device (180; 205; 212; 213; 500; 600; 700; 800; 900; 1000; 1100; 1200; 1300; 1400; 1500) according to any one of claims 1 to 12; and An electronic device including a processor (120) set to acquire an image of a subject using the above imaging device.

14. In the 13th paragraph, the electronic device is set to acquire an image of a subject based on light received through an image sensor of the imaging device.

15. An imaging device according to any one of claims 13 to 14, wherein the processor is configured to perform a focus adjustment operation or a shake correction operation by moving an image sensor of the imaging device.

Images