Camera module having tilting-type OIS function

Abstract

The present invention relates to a camera module having a tilting-type OIS function. The camera module comprises: an OIS carrier tiltably accommodated inside the housing; an AF carrier elevatably accommodated in the OIS carrier and having a lens module in the center thereof; an image sensor fixed to the lower part of the OIS carrier and sensing light having passed through the lens module; a support substrate for supporting the image sensor; a lower elastic connection means provided between a base substrate and the support substrate to electrically connect the base substrate and the support substrate and tiltably supporting the support substrate; an OIS tilting driving unit for tilting the OIS carrier by operating when the sensor unit senses shaking; and an AF driving unit for moving the lens module in the optical axis direction by driving the AF carrier. According to the present invention configured as above, the camera module having a tilting-type OIS function employs an FPCB as a spring for combined use to reduce the number of components, thereby having a compact structure, enabling an accurate tilting motion, and reducing costs.

Description

Camera module with tilting OIS function

[0001] The present invention relates to a camera module mounted on a camera of a portable electronic device, and more specifically, to a camera module having a tilting OIS function that enables precise tilting motion and has a simple structure by reducing the number of parts by using an FPCB as a spring.

[0002] Cameras in recently released smartphones and other portable electronic devices incorporate a variety of cutting-edge technologies. These include features like autofocusing, which automatically focuses the camera more quickly, and image stabilization.

[0003] Image stabilization is a feature that helps capture images of a relatively high quality even when the camera shakes during photography. There are two types of image stabilization: electronic and optical.

[0004] Electronic correction technology is a process that improves the captured image through software, etc., and optical image stabilization (OIS) is a technology that physically corrects the position of the lens module or image element to prevent the subject from appearing shaky on the image sensor due to camera shake, etc.

[0005] While optical image stabilization technology can be easily applied to digital cameras with relatively ample internal space, its application is limited in devices with limited internal space, such as smartphones. This necessitates the development of smaller image stabilization devices.

[0006] Meanwhile, optical image correction includes lens shifting and tilting methods. The lens shifting method has a structure in which the lens module moves in the XY direction, orthogonal to the optical axis, in front of the image sensor. However, the lens shifting method's shake correction has limitations. This is because, during video shooting, the hand shakes not only in the XY direction. In contrast, the tilting method tilts the lens module and the image sensor together, and can obtain better images than the lens shifting method.

[0007] As a background technology for an invention related to tilting type OIS, Korean Patent Publication No. 10-2022-0009386 (4-axis Tilt OIS anti-shake structure based on OIS motor and ball) has been disclosed.

[0008] The disclosed prevention structure is a ball-based 4-axis Tilt OIS anti-shake structure, comprising a case and a lens clamping device installed in an internal chamber of the case, wherein a plurality of magnets are arranged on the inner wall of the case, a plurality of coils corresponding to the magnets are wired on the side walls of the lens clamping device, the coils located on the same side wall of the lens clamping device have the same winding direction, and the coils located on two side walls opposite to the lens clamping device have the opposite winding directions, and a moving mechanism is installed between the case and the lens clamping device so as to be convenient for moving the lens clamping device; The moving mechanism includes a first support installed on an inner wall of the case, a second support installed on a side wall of the lens clamping device, an intermediate support installed between the first support and the second support, at least two first balls installed between the first support and the intermediate support so that the intermediate support can conveniently move in parallel or be reversible, and at least two second balls installed between the second support and the intermediate support, and the arrangement direction of the first balls has a structure in which the arrangement direction of the second balls is perpendicular to the arrangement direction of the second balls.

[0009] The present invention was created to solve the above problems, and the purpose of the present invention is to provide a camera module having a tilting type OIS function, which has a compact structure with a reduced number of parts, enables precise tilting motion, and is inexpensive.

[0010] As a solution to the problem for achieving the above object, the present invention provides a camera module having a tilting OIS function, comprising: a base substrate; a housing having a shape of a rectangular frame open vertically and fixed to an upper portion of the base substrate and connected to a circuit of the base substrate; a sensor unit installed in the housing and detecting shaking of the housing; an OIS carrier accommodated in the housing so as to be tilted; an AF carrier accommodated in the OIS carrier so as to be raised and lowered and having a lens module at a center thereof; an image sensor fixed to a lower portion of the OIS carrier and detecting light passing through the lens module; a support substrate supporting and connecting the image sensor; a lower elastic connecting means provided between the base substrate and the support substrate, electrically connecting the base substrate and the support substrate, and tiltably supporting the support substrate; an OIS tilting driving unit that operates when the sensor unit detects shaking to tilt the OIS carrier; It includes an AF driving unit that drives the AF carrier to move the lens module in the optical axis direction.

[0011] In addition, the lower elastic connection means comprises a plurality of lower FPCB springs having a first terminal portion connected to the base substrate, a second terminal portion connected to the support substrate, and an elasticity providing portion that connects the first terminal portion and the second terminal portion and elastically supports the second terminal portion upward, and the lower FPCB springs are symmetrical about the optical axis.

[0012] In addition, the elastic member has a certain thickness and takes the shape of a bent band.

[0013] In addition, the lower FPCB spring has an elastic band that connects the base substrate and the support substrate and is elastically deformable and made of synthetic resin, and a circuit member that is accommodated inside the elastic band and electrically connects the base substrate and the support substrate.

[0014] And, the OIS carrier takes the shape of a square frame, and a permanent magnet unit composed of an upper magnet and a lower magnet spaced parallel to each other is installed on each side, and the OIS tilting driving unit is installed on each of the four sides of the housing and corresponds one-to-one to the permanent magnet unit, and includes an X driving coil located on one side and the opposite side, a Y driving coil installed on each of the remaining two sides, and a coil driving substrate that surrounds the housing and applies an electric signal transmitted from the base substrate to the X driving coil and the Y driving coil.

[0015] In addition, the AF carrier has a carrier body that accommodates a lens module and has a plurality of support protrusions provided on the upper surface, an AF coil that is wound on the outer surface of the carrier body and corresponds to a permanent magnet unit, and a coil connection terminal that is exposed to the upper part of the carrier body in a state of being connected to an end of the AF coil and is located on the opposite side centered on the lens module is provided on the upper part of the carrier body.

[0016] In addition, two upper exposed electrode parts are built into the inside of the housing, which are connected to the circuit of the base substrate and a portion of which is exposed to the upper part of the housing, and the AF driving part includes two upper FPCB springs that connect the upper exposed electrode parts and the coil connection terminal to transmit the electric signal of the base substrate to the AF coil and elastically support the AF carrier.

[0017] And, the upper FPCB spring is made of a synthetic resin film having a certain thickness, and has an elastic band having a first support end supported by a corner support part on one side of the housing, a connection end positioned close to a coil connection terminal on one side of the AF carrier, a first extension part connecting the first support end and the connection end, a second support end supported by the corner support part on the other side, a fixed end coupled to a support protrusion of the AF carrier, and a second extension part connecting the second support end and the fixed end, and a circuit member accommodated in the elastic band, one end of which is connected to the upper exposed electrode part, and the other end of which is connected to the coil connection terminal.

[0018] In addition, a bending portion that outputs elastic force is further formed in the upper FPCB spring.

[0019] And, the above bending portion takes the shape of a U, V, W, or ring.

[0020] The camera module of the present invention having a tilting OIS function as described above uses an FPCB as a spring, so the number of parts is reduced, and it has a compact structure, enables accurate tilting motion, and is inexpensive.

[0021] FIG. 1 and FIG. 2 are exploded perspective views of a camera module having a tilting OIS function according to one embodiment of the present invention.

[0022] Figure 3 is a bottom exploded perspective view of the camera module shown in Figure 2.

[0023] Figures 4 and 5 are drawings for explaining the tilting principle of the lens module of Figure 2.

[0024] Fig. 6 is a plan view showing the mounting structure of the upper FPCB spring illustrated in Fig. 1.

[0025] Fig. 7 is a cutaway perspective view for explaining the detailed configuration of the upper FPCB spring of Fig. 6.

[0026] Figures 8a to 8c are drawings showing examples of deformation of the bending portion in the upper FPCB spring shown in Figure 2.

[0027] Hereinafter, one embodiment according to the present invention will be described in more detail with reference to the attached drawings.

[0028] FIG. 1 and FIG. 2 are exploded perspective views of a camera module (10) having a tilting OIS function according to one embodiment of the present invention. FIG. 3 is an exploded perspective view of the bottom of the camera module illustrated in FIG. 2. In addition, FIG. 4 and FIG. 5 are drawings for explaining the tilting principle of the lens module of FIG. 2. FIG. 6 is a plan view showing the mounting structure of the upper FPCB spring illustrated in FIG. 1. And, FIG. 7 is a cutaway perspective view for explaining the detailed configuration of the upper FPCB spring of FIG. 6.

[0029] As shown, the camera module (10) having a tilting OIS function according to the present embodiment comprises a base substrate (15), a housing (25), a sensor unit, an OIS carrier (41), an AF carrier (45), an image sensor (21), a filter plate (23), a support substrate (19), a lower elastic connecting means, an OIS tilting driving unit, an AF driving unit, and a shield can (11).

[0030] The base board (15) is a PCB installed at the lowest part of the camera module (10) and is connected to an external controller. The base board (15) is provided with a connection portion (15a). The connection portion (15a) is a portion formed on the edge of the lower FPCB spring (17) and is connected to the first terminal portion (17a).

[0031] The housing (25) takes the form of a rectangular frame that is open from top to bottom, and is connected to the circuit of the base substrate (15) while being fixed to the upper part of the base substrate. The lower part of the housing (25) is fixed to the upper surface of the connection part (15a) and does not move.

[0032] And two electrode members (25b) are built into the inside of the housing (25). The electrode members (25b) are embedded in the housing (25) through an insert injection method. The two electrode members (25b) are connected to the first terminal portion (17a) of the lower FPCB spring (17) on one side. A positive current is applied to one of the two electrode members (25b), and a negative current is applied to the other.

[0033] In addition, the other end of the electrode member (25b) on both sides is exposed to the upper part of the housing (25). The part exposed to the upper part of the housing is the upper exposed electrode part (25c). The upper exposed electrode part (25c) is located on the upper surface of the corners on both sides in the diagonal direction among the four corners of the housing (25).

[0034] In addition, corner support portions (25a) are formed on the upper surface of the four corners of the housing (25). The corner support portions (25a) are projections that protrude upward and support the projection insert portions (51b, 53b) of the upper FPCB spring (50). The upper FPCB spring (50) maintains its mounting state by the action of the corner support portions (25a). In other words, it does not dislodge upward.

[0035] And on each of the four walls of the housing (25), two X-drive coils (27a) and two Y-drive coils (29a) are installed. The X-drive coils (27a) and the Y-drive coils (29a) are part of the OIS tilting drive unit. The two X-drive coils (27a) are located on opposite sides centered on the OIS carrier (41). In addition, the two Y-drive coils (29a) are installed on each of the remaining two sides. That is, they are mounted on the two side walls excluding the side wall on which the X-drive coil (27a) is installed. The X-drive coils (27a) and the Y-drive coils (29a) correspond one-to-one to the permanent magnet unit (41c) described later.

[0036] Additionally, a first sensor (27b) is installed on the inside of one side X drive coil (27a), and a second sensor (29b) is installed on one side Y drive coil (29a).

[0037] The first sensor (27b) and the second sensor (29b) send a signal to an external controller the moment tilting of the housing (25) due to hand tremor is detected, and the controller compensates for the tilting of the housing by applying an electric signal to the coil driving board (31). That is, by tilting the OIS carrier (41) in the opposite direction to the direction in which the housing (25) is tilted due to hand tremor, the lens module (13) is prevented from being tilted (in the tilting direction of the housing). The first sensor (27b) can detect tilting with the X-axis of the OIS carrier (41) as the rotation axis, and the second sensor (29b) can detect tilting with the Y-axis of the OIS carrier (41) as the rotation axis.

[0038] The coil drive board (31) is also included in the OIS tilting drive unit. The coil drive board (31) is a band-shaped FPCB circuit board having a certain width, and is connected to the X drive coil (27a), the Y drive coil (29a), and the first and second sensors (27b, 29b) while being fixed to the outer surface of the housing (25). In addition, a connection portion (31a) is provided at the lower end of the coil drive board (31), and the connection portion (31a) is electrically connected to the first terminal portion (17a). Consequently, the coil drive board (31) surrounds the housing and applies an electric signal transmitted from the base board to the X drive coil and the Y drive coil.

[0039] The OIS carrier (41) is a member that is tiltably accommodated within the housing (25). That is, it is tiltable within an allowable range while supported by the lower FPCB spring (17). The OIS carrier (41) includes a square-shaped carrier body (41a) and a plurality of permanent magnet units (41c).

[0040] The four corners of the carrier body (41a) are provided with upwardly open bending portion receiving grooves (41b). The bending portion receiving grooves (41b) are grooves in which the bending portions (51c, 53c) of the upper FPCB spring (50) are received. The bending portion receiving grooves (41b) are formed to apply the bending portions (51c, 53c) to the upper FPCB spring (50).

[0041] The permanent magnet unit (41c) is composed of an upper magnet (41d) and a lower magnet (41e). The upper magnet (41d) and the lower magnet (41e) are arranged parallel to each other and spaced apart from each other vertically. The permanent magnet unit (41c) corresponds to the X, Y drive coils (27a, 29a) on the outside and to the AF coil (45f) on the inside.

[0042] When current is applied to the X drive coil (27a) or the Y drive coil (29a), the OIS carrier (41) tilts around the X-axis or Y-axis through interaction with the permanent magnet unit (41c). In addition, when current is applied to the AF coil (45e), the AF carrier (45) moves linearly in the optical axis direction.

[0043] The AF carrier (45) is movably accommodated within the OIS carrier (41) and accommodates a lens module (13) in the center. The AF carrier (45) has a carrier body (45a) and an AF coil (45e). The carrier body (45a) has a roughly ring shape and accommodates and fixes the lens module (13). The carrier body (45a) and the lens module (13) form a single body.

[0044] And two support protrusions (45d) are formed on the upper surface of the carrier body (45a). The support protrusions (45d) are located on opposite sides with the lens module (13) in between and are fitted into the protrusion holes (53f) of the upper FPCB spring (50).

[0045] In addition, the AF coil (45e) is a coil wound on the outer surface of the carrier body (45a). Both ends of the AF coil (45e) are exposed to the upper portion of the carrier body (45a) through the coil connection terminal (45c). The method of exposing the AF coil (45e) can be implemented in various ways. The reason for exposing the end of the AF coil (45e) to the upper portion is to connect the upper FPCB spring (50) to the AF coil (45e).

[0046] The coil connection terminal (45c) is connected to the circuit member (58) of the upper FPCB spring, as shown in FIGS. 6 and 7. The AF coil (45e) receives an electric signal from the outside through the upper FPCB spring (50). The coil connection terminal (45c) is connected to the end of the AF coil and is located on the opposite side from the lens module (13).

[0047] Meanwhile, a support substrate (19) is fixed to the lower portion of the carrier body (41a), and an image sensor (21) and a filter plate (23) are sequentially arranged on the upper portion of the support substrate (19). The support substrate (19) is a circuit board that affects the resolution of the captured image, and its edge is fixed to the lower portion of the carrier body (41a). It forms one body with the OIS carrier (41). In addition, the circuit formed on the support substrate (19) is connected to the image sensor (21) and the second terminal portion (17b) of the lower FPCB spring (17).

[0048] As illustrated in Fig. 3, a connection portion (19a) is formed on the bottom edge of the support substrate (19). The connection portion (19a) is the portion to which the second terminal portion (17b) is connected.

[0049] The image sensor (21) is fixed to the upper part of the support substrate (19) and detects light passing through the lens module (13). The image sensor (21) itself is a general one. The image sensor (21) is connected to the circuit of the support substrate (19). The filter plate (23) is a plate-shaped member that filters light incident on the image sensor (21).

[0050] A lower elastic connecting means is provided between the above-mentioned support substrate (19) and the base substrate (15). The lower elastic connecting means electrically connects the base substrate (15) and the support substrate (19) and tiltably supports the support substrate (19), and is provided with four lower FPCB springs (17). Four lower FPCB springs (17) are arranged symmetrically with respect to the center of the base substrate (15). In other words, they are symmetrical with respect to the point where the extension of the central axis (optical axis) of the lens module (13) and the base substrate (15) meet.

[0051] The lower FPCB spring (17) is an elastically deformable signal transmission member. That is, it is a connecting means that connects the circuit of the base substrate (15) and the circuit of the support substrate (19).

[0052] The lower FPCB spring is composed of an elastic band (17d) made of synthetic resin and a circuit member (17e) accommodated therein. Accordingly, the lower FPCB spring performs the function of connecting the circuit and simultaneously performing the OIS tilting function.

[0053] The elastic band (17d) is formed by laminating and bonding polyimide sheets having a certain thickness. The elastic band (17d) has elastic recovery properties. For example, when the elastic band (17d) is bent and then released, it returns to its original state. The circuit member (17e) is a metal member that transmits an electric signal and is accommodated inside the elastic band (17d). Copper foil may be used as the circuit member. The circuit member (17e) electrically connects the base substrate (15) and the support substrate (19).

[0054] This lower FPCB spring (17) has a first terminal portion (17a), a second terminal portion (17b), and an elastic portion (17c).

[0055] The first terminal portion (17a) is a portion that is closely fixed to the connection portion (15a) of the base substrate (15), and the second terminal portion (17b) is a portion that is closely fixed to the connection portion of the bottom surface of the support substrate (19). As mentioned above, the circuit member (17e) inside the first terminal portion (17a) and the second terminal portion (17b) is connected to the circuits of the base substrate and the support substrate. The connection portion (15a) of the base substrate (15) can be arranged on the upper surface of the base substrate.

[0056] The elastic member (17c) connects the first terminal (17a) and the second terminal (17b) and serves as a 'plate spring' that elastically supports the second terminal upward. The elastic member (17c) has a certain thickness and takes the shape of a band so that the left and right sides bent toward the center of the base substrate each form a '⊃⊂' shape.

[0057] The mounting state of the lower FPCB spring (17) is illustrated in FIGS. 4 and 5. As illustrated in FIGS. 4 and 5, when the OIS carrier (41) is tilted in the direction of arrow r, the lower FPCB spring (17) located on the right side of the drawing is pressed downward, and the lower FPCB spring (17) on the left side is opened. In this state, when the force applied to the OIS carrier (41) is removed, the OIS carrier (41) returns to the state of FIG. 4 by the action of the elastic providing portion (17c).

[0058] According to the present invention, the lower FPCB spring (17) is interposed between the base substrate (15) and the support substrate (19), and has a structure in which it is bent in a “⊃⊂” shape horizontally and vertically, so that its width does not protrude outside the base substrate (15) and the support substrate (19). Accordingly, the size of the camera module becomes compact, and there is no need to separately provide a circuit connection member and an OIS tilting function member.

[0059] Meanwhile, a pair of upper FPCB springs (50) are installed between the housing (25) and the AF carrier (45). The upper FPCB springs (50) have two roles. One is to electrically connect the upper exposed electrode portion (25c) and the coil connection terminal (45c), and the other is to elastically support the AF carrier.

[0060] As shown in Fig. 7, this upper FPCB spring (50) is composed of an elastic band (57) made of a synthetic resin film and a circuit member (58) therein.

[0061] The elastic band (57) is manufactured by laminating polyimide films, and has a first support end (51a), a connection end (51e), a first extension end (51d), a second support end (53a), a fixed end (53e), a second extension end (53d), and a reinforcing part (55). The elastic band (57) has the shape of a flat band with a certain thickness. The elastic band (57) is bent while extending in the longitudinal direction, and is elastically deformable, so it functions as a spring.

[0062] In addition, the circuit member (58) is a metal member that is accommodated within the elastic band (57), and one end is connected to the upper exposed electrode portion (25c) and the other end is connected to the coil connection terminal (45c). The circuit member (58) may be copper foil.

[0063] The first support end (51a) is supported by one corner support end (25a) of the housing, and the connection end (51e) is positioned close to one coil connection terminal (45c) of the AF carrier. The first extension end (51d) connects the first support end and the connection end. The second support end (53a) is supported by the other corner support end (25a), and the fixed end is coupled to the support protrusion (45d) of the AF carrier. In addition, the second extension end (53d) connects the second support end and the fixed end.

[0064] To elaborate, it is as follows:

[0065] The first support end (51a) is in close contact with the upper surface of the part where the upper exposed electrode part (25c) (where the electric signal comes in) is located among the four corner parts of the housing and is supported by the corner support part (25a). In addition, the first extension part (51d) is a part that is integrally formed with the first support end (51a) and extends toward the coil connection terminal (45c) of the AF carrier (45). A downwardly bent bending part (51c) is located in the first extension part (51d). The bending part (51c) is accommodated in the bending part accommodation groove (41b). In addition, the connection end (51e) has a shape of an approximately square plate and is located above the coil connection terminal (45c). The connection end (51e) is fusion-bonded to the AF carrier (45).

[0066] And the second support end (53a) is installed at the side corner of the corner where the first support end (51a) is installed and is supported by the corner support end (25a). The second extension end (53d) is a belt-shaped portion that is integral with the second support end (53a) and extends toward the support protrusion (45d) of the AF carrier. A bending portion (53c) is also formed in the second extension end (53d). The bending portion (53c) is accommodated in the bending portion receiving groove (41b) of the OIS carrier. The fixed end (53e) is a portion integral with the end of the second extension end (53d) and has a protrusion hole (53f). The support protrusion (45d) of the AF carrier is fitted into the protrusion hole (53f).

[0067] The reinforcing member (55) connects the first extension member (51d) and the second extension member (53d) to maintain the gap between the first and second extension members (51d, 53d).

[0068] In addition, the circuit member (58) is built into the first support end (51a), the first extension end (51d), and the connection end (51e), and one end is connected to the upper exposed electrode part (25c), and the other end is connected to the coil connection terminal (45c). The connection method may be a fusion or soldering method.

[0069] The upper FPCB springs (50) are a pair of two and are symmetrical with respect to the lens module (13). The upper FPCB springs (50) elastically restrain the AF carrier (45) and the OIS carrier (41), so that the central axis of the lens module (13) is parallel to the optical axis and coincides with the center of the optical path.

[0070] In this case, the upper FPCB spring (50) can elastically support the AF carrier by having a structure that can have elasticity while having a synthetic resin film material. In addition, since the upper FPCB spring is made of a synthetic resin film material, it has superior flexibility compared to metal materials such as existing plate springs. In addition, the upper FPCB spring can have a pattern shape of a circuit element inside the polyimide film. Accordingly, the wire shape of the circuit element can be designed more freely than in the existing plate spring, and thus the degree of structural design freedom is dramatically expanded compared to the shape of the existing plate spring.

[0071] Meanwhile, the above-described bending portions (51c, 53c) are elastically deformed according to the movement of the OIS carrier (41) and the AF carrier (45). For example, they are elastically deformed when the OIS carrier (41) is tilted or the AF carrier (45) moves in the optical axis direction. The elastic restoring force of the bending portions (51c, 53c) keeps the OIS carrier (41) and the AF carrier (45) in place.

[0072] Meanwhile, the OIS tilting drive unit operates when the sensor unit, i.e., the first sensor (27b) and the second sensor (29b), detects shaking and tilts the OIS carrier. That is, as mentioned above, when tilting of the housing (25) due to hand shaking is detected by the first sensor (27b) and the second sensor (29b), the OIS carrier (41) is tilted, thereby preventing the lens module (25) from being tilted (in the tilting direction of the housing).

[0073] The OIS tilting driving unit includes components related to OIS tilting, namely, a base substrate (15), a lower FPCB spring (17), a support substrate (19), X, Y driving coils (27a, 29a), and a permanent magnet unit (41c).

[0074] The AF driving unit drives the AF carrier to move the lens module in the direction of the optical axis. The AF driving unit includes components involved in moving the AF carrier (45), namely, a base substrate (15), an electrode member (25b), an upper FPCB spring (50), and an AF coil (45e).

[0075] The shield can (11) is a cover that is detachably connected to the housing (25) and has a passage (11a) through which a lens module (13) passes in the center. The shield can (11) serves to protect the components housed in the housing (25).

[0076] Figures 8a to 8c are drawings showing examples of deformation of the bending portion in the upper FPCB spring shown in Figure 2.

[0077] The bending portions (51c, 53c) illustrated in Fig. 8a have a V-shape, and the bending portions (51c, 53c) illustrated in Fig. 8b have an approximate W-shape. Furthermore, the bending portions (51c, 53c) illustrated in Fig. 8c have a ring-shaped shape. These shapes are merely examples, and the shapes of the bending portions (51c, 53c) may vary as long as the elastic support force of the upper FPCB spring can be output.

[0078] Above, the present invention has been described in detail through specific examples, but the present invention is not limited to the above examples, and various modifications are possible by a person of ordinary skill within the scope of the technical idea of ​​the present invention.

[0079] The present invention can be applied to electronic devices equipped with a camera.

Claims

1. Base board and; A housing having the form of a square frame that is open from top to bottom and is connected to the circuit of the base board while being fixed to the upper part of the base board; A sensor unit installed in the housing and detecting shaking of the housing; An OIS carrier that can be tilted and accommodated inside the housing; An AF carrier that is movably accommodated within an OIS carrier and has a lens module at the center; An image sensor fixed to the lower portion of the OIS carrier and detecting light passing through the lens module; A support substrate that supports and connects to the image sensor; A lower elastic connecting means provided between a base substrate and a support substrate, electrically connecting the base substrate and the support substrate, and tiltably supporting the support substrate; An OIS tilting driving unit that operates when the above sensor unit detects shaking and tilts the OIS carrier; Including an AF driving unit that drives the AF carrier to move the lens module in the optical axis direction. Camera module with tilting OIS function.

2. In paragraph 1, The above lower elastic connecting means; It has a plurality of lower FPCB springs having a first terminal portion connected to a base substrate, a second terminal portion connected to a support substrate, and an elastic portion connecting the first terminal portion and the second terminal portion and elastically supporting the second terminal portion upward. The lower FPCB spring is symmetrical around the optical axis. Camera module with tilting OIS function.

3. In paragraph 2, The above elastic member has a certain thickness and takes the shape of a bent band. Camera module with tilting OIS function.

4. In paragraph 3, The above lower FPCB spring; An elastic band that connects the base substrate and the support substrate and is made of synthetic resin and is elastically deformable, A circuit member that is accommodated inside the elastic band and electrically connects the base substrate and the support substrate, Camera module with tilting OIS function.

5. In paragraph 1, The above OIS carrier has a square frame shape, and a permanent magnet unit consisting of an upper magnet and a lower magnet spaced parallel to each other is installed on each side. The OIS tilting drive unit is installed on each of the four sides of the housing and corresponds one-to-one to the permanent magnet unit. X-drive coils located on one side and the opposite side, Y drive coils installed on each of the remaining two sides, A coil drive substrate that surrounds the housing and applies an electric signal transmitted from the base substrate to the X drive coil and the Y drive coil, Camera module with tilting OIS function.

6. In paragraph 5, The above AF carrier; It has a carrier body that accommodates a lens module and has a number of support protrusions on the upper surface, and an AF coil that is wound on the outer surface of the carrier body and corresponds to a permanent magnet unit. The upper part of the carrier body is provided with a coil connection terminal that is exposed to the upper part of the carrier body while connected to the end of the AF coil and is located on the opposite side from the lens module. Camera module with tilting OIS function.

7. In paragraph 6, Inside the above housing, two upper exposed electrode parts are built in, which are connected to the circuit of the base board and a part of which is exposed to the upper part of the housing. The AF drive unit is It includes two upper FPCB springs that connect the upper exposed electrode part and the coil connection terminal to transmit the electric signal of the base board to the AF coil and elastically support the AF carrier. Camera module with tilting OIS function.

8. In paragraph 7, The upper FPCB spring is; An elastic band made of a synthetic resin film having a certain thickness, the elastic band having a first support end supported by a corner support end on one side of the housing, a connection end positioned close to a coil connection terminal on one side of the AF carrier, a first extension part connecting the first support end and the connection end, a second support end supported by a corner support end on the other side, a fixed end coupled to a support projection of the AF carrier, and a second extension part connecting the second support end and the fixed end, A circuit member having a circuit element that is accommodated within an elastic band, one end of which is connected to the upper exposed electrode portion, and the other end of which is connected to the coil connection terminal. Camera module with tilting OIS function.

9. In paragraph 7, In the above upper FPCB spring, A bending section that outputs elasticity is further formed, Camera module with tilting OIS function.

10. In paragraph 9, The above bending portion has a U-shape, a V-shape, a W-shape, or a ring shape. Camera module with tilting OIS function.

11. A housing having the shape of a square frame that is open from top to bottom, and to which a base substrate is fixed at the bottom; A sensor unit installed in the housing and detecting shaking of the housing; An AF carrier having a lens module installed in the center and arranged so as to be tiltable inside the housing, and an OIS carrier having an image sensor and a support substrate that supports and connects the image sensor at the bottom; A lower elastic connecting means provided between the base substrate and the support substrate, electrically connecting the base substrate and the support substrate, and tiltably supporting the support substrate; Includes an OIS tilting actuator that tilts the OIS carrier, The above lower elastic connecting means; It has a plurality of lower FPCB springs having a first terminal portion connected to a base substrate, a second terminal portion connected to a support substrate, and an elastic portion connecting the first terminal portion and the second terminal portion and elastically supporting the second terminal portion upward. The lower FPCB spring is symmetrical around the optical axis. Camera module with tilting OIS function.

12. In paragraph 11, The above elastic member has a certain thickness and takes the shape of a bent band. Camera module with tilting OIS function.

13. In paragraph 12, The above lower FPCB spring; An elastic band that connects the base substrate and the support substrate and is made of synthetic resin and is elastically deformable, A circuit member that is accommodated inside the elastic band and electrically connects the base substrate and the support substrate, Camera module with tilting OIS function.

14. In paragraph 13, The above lower FPCB spring is arranged to be interposed between the base substrate and the support substrate, The first terminal portion is connected to a connection portion formed on the upper surface of the base substrate, the second terminal portion is connected to a connection portion formed on the lower surface of the support substrate, and the elasticity providing portion is bent in a concave “⊃” shape toward the center of the base substrate, A camera module having a tilting OIS function in which the lower FPCB spring is connected to the base substrate and the support substrate, and the entirety of the lower FPCB spring does not protrude outside the base substrate and the support substrate.

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