Light emitting module including light emitting element and display device using same

Abstract

A light emitting module according to an embodiment includes: a base plate; a light emitting element array substrate arranged on the base plate and including a plurality of light emitting elements; a molding part covering the light emitting elements; a circuit board having one end electrically connected to the light emitting element array substrate; a connector electrically connected to the other end of the circuit board; and a reinforcing plate arranged under the connector.

Description

A light-emitting module including a light-emitting element and a display device using the same

[0001] The present disclosure relates to a light-emitting module including a light-emitting element and a display device using the same.

[0002] Light-emitting diodes (LEDs), semiconductor devices that utilize inorganic light sources, are widely used in various fields, including display devices, vehicle lamps, and general lighting. Light-emitting diodes (LEDs) are rapidly replacing existing light sources due to their long lifespan, low power consumption, and fast response times.

[0003] Traditionally, light-emitting elements have been primarily used as backlight sources in display devices. However, display devices that directly display images using light-emitting elements are being developed. Display devices that utilize light-emitting diodes (micro LEDs) measuring 100㎛ or less in both width and height are sometimes referred to as micro LED displays. Because light-emitting elements directly display images, they can dramatically reduce the thickness of display devices.

[0004] Embodiments of the present disclosure provide a light-emitting module suitable for a micro LED display and a display device having the same.

[0005] Embodiments of the present disclosure provide a light-emitting module and a display device including a light-emitting element with improved light efficiency.

[0006] Embodiments of the present disclosure provide a light emitting module and a display device having improved heat dissipation characteristics.

[0007] A light-emitting module according to one embodiment of the present disclosure comprises: a base plate; a light-emitting element array substrate disposed on the base plate and including a plurality of light-emitting elements; a molding part covering the light-emitting elements; a circuit board having one end electrically connected to the light-emitting element array substrate; a connector electrically connected to the other end of the circuit board; and a reinforcing plate disposed below the connector.

[0008] The above base plate may have a larger area than the above light emitting element array substrate.

[0009] The upper surface of the base plate may be exposed near at least three sides of the light emitting element array substrate.

[0010] The transverse width of the base plate and the transverse width of the reinforcing plate may be greater than the transverse width of the circuit board positioned between the base plate and the reinforcing plate. In addition, the longitudinal width of the base plate and the longitudinal width of the reinforcing plate may be greater than the longitudinal width of the circuit board positioned between the base plate and the reinforcing plate.

[0011] The above light emitting element array substrate and the above connector can be arranged on the same side of the circuit board.

[0012] The above light emitting element array substrate and the above connector can be respectively placed on different surfaces of the circuit board.

[0013] The above light emitting module may include a window surrounded by the molding portion.

[0014] The above light emitting element array substrate can be mounted on the circuit board.

[0015] The above connector can be formed on the circuit board.

[0016] The above light emitting module is arranged opposite the connector and may further include a cover covering the passive element or the active element.

[0017] A display device according to one embodiment may include a light emitting module; a lens assembly; and a light guide, wherein the light emitting module may include: a base plate; a light emitting element array substrate disposed on the base plate and including a plurality of light emitting elements; a molding part covering the light emitting elements; a circuit board having one end electrically connected to the light emitting element array substrate; a connector electrically connected to the other end of the circuit board; and a reinforcing plate disposed below the connector.

[0018] The display device may include a plurality of light-emitting modules, each of which may emit light of a single color.

[0019] The above light emitting module can be directly coupled to the lens assembly.

[0020] The display device may further include an optical coupler, and light-emitting modules emitting light of different colors may be arranged on at least two sides of the optical coupler.

[0021] Light-emitting modules emitting green light, red light, and blue light may be arranged on each of the three sides of the optical coupler, and the light-emitting module emitting green light may be arranged facing the lens assembly.

[0022] The above base plate may have a larger area than the above light emitting element array substrate.

[0023] The above circuit board may be a flexible printed circuit board.

[0024] The above light guide may include an automobile window or glass.

[0025] The display device can form an image within the light guide.

[0026] The above lens assembly can diffuse light.

[0027] FIG. 1 is a schematic exploded perspective view illustrating a light-emitting module according to a first embodiment of the present disclosure.

[0028] FIG. 2A is a schematic cross-sectional view illustrating a light-emitting module according to a first embodiment of the present disclosure.

[0029] FIG. 2B is a schematic cross-sectional view enlarged to illustrate a portion of a light-emitting module according to the first embodiment of the present disclosure.

[0030] Figure 2C is a schematic plan view of Figure 2B.

[0031] FIG. 3 is a schematic cross-sectional view illustrating a light-emitting module according to a second embodiment of the present disclosure.

[0032] FIG. 4 is a schematic cross-sectional view illustrating a light-emitting module according to a third embodiment of the present disclosure.

[0033] FIG. 5 is a schematic cross-sectional view illustrating a light-emitting module according to a fourth embodiment of the present disclosure.

[0034] FIG. 6 is a schematic plan view illustrating a light-emitting module according to the fifth embodiment of the present disclosure.

[0035] FIG. 7 is a schematic rear view illustrating a light-emitting module according to the fifth embodiment of the present disclosure.

[0036] FIG. 8 is a schematic exploded plan view illustrating a display device having a light-emitting module according to a fifth embodiment of the present disclosure.

[0037] FIG. 9 is a schematic plan view illustrating a light-emitting module according to the sixth embodiment of the present disclosure.

[0038] FIG. 10 is a schematic side view illustrating a display device having a light-emitting module according to a sixth embodiment of the present disclosure.

[0039] Fig. 11 is a schematic plan view for explaining the display device of Fig. 10.

[0040] In the following description, for purposes of explanation, numerous specific details are set forth to provide a thorough understanding of various embodiments or implementations of the present disclosure. As used herein, the terms "embodiment" and "implementation" are interchangeable to refer to non-limiting examples of devices or methods that utilize one or more of the inventive concepts disclosed herein. However, it will be apparent that various embodiments may be practiced without utilizing these specific details or using one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, while the various embodiments may vary from one another, they are not necessarily exclusive. For example, specific features, configurations, and characteristics of an embodiment may be utilized or implemented in other embodiments without departing from the scope of the inventive concepts.

[0041] Unless otherwise specified, the illustrated embodiments should be understood to provide exemplary features of varying details of some ways in which the concepts of the present invention may be practically implemented. Therefore, unless otherwise specified, the features, components, modules, layers, membranes, panels, regions, and / or aspects (hereinafter, individually or collectively referred to as "elements") of the various embodiments may be differently combined, separated, interchanged, and / or rearranged without departing from the scope of the concepts of the present invention.

[0042] The use of cross-hatching and / or shading in the accompanying drawings is generally provided to clarify boundaries between adjacent elements. As such, the presence or absence of cross-hatching or shading, unless expressly stated, does not imply or indicate any preference or requirement for any particular material, material properties, dimensions, proportions, commonality between the illustrated elements, and / or any other features, properties, or characteristics of the elements. Furthermore, in the accompanying drawings, the dimensions and relative sizes of elements may be exaggerated for clarity and / or illustrative purposes. When embodiments are implemented differently, certain process sequences may be performed differently from the illustrated sequence. For example, two consecutively illustrated processes may be performed substantially simultaneously or in a reverse order from the illustrated sequence. Furthermore, like reference numerals designate like elements.

[0043] When an element, such as a layer, is referred to as being "on," "connected to," or "joined to" another element or layer, the element may be directly on, connected to, or joined to the other element or layer, or there may be intervening elements or layers present. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly joined to" another element or layer, there are no intervening elements or layers present. For this purpose, the term "connected" may refer to physical, electrical, and / or fluidic connections, with or without intervening elements. Furthermore, the DR1-axis, DR2-axis, and DR3-axis are not limited to the three axes of a Cartesian coordinate system, such as the x, y, and z-axes, and may be interpreted in a broader sense. For example, the DR1-axis, DR2-axis, and DR3-axis may be perpendicular to one another, or may represent different directions that are not perpendicular to one another. For purposes of this disclosure, “one or more of X, Y or Z” and “one or more selected from the group consisting of X, Y or Z” may be interpreted as only X, only Y, only Z or any combination of two or more of X, Y and Z, such as, for example, XYZ, XYY, YZ and ZZ. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items.

[0044] Although the terms "first," "second," and the like may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be referred to as the second element without departing from the teachings of the present disclosure.

[0045] Spatially relative terms such as "beneath," "beneath," "directly beneath," "lower," "above," "upper," "above," "higher than," "side" (as in, for example, a "side wall"), and the like may be used for descriptive purposes and thereby to describe the relationship of one element to other element(s) as depicted in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the drawings. For example, if the device in the drawings were turned over, an element described as "beneath" or "beneath" another element or feature would then be oriented "above" the other element or feature. Therefore, the exemplary term "beneath" can encompass both orientations above and below. Furthermore, the device can be oriented differently (e.g., rotated 90° or oriented in other orientations), and thus the spatially relative descriptors used herein can also be interpreted accordingly.

[0046] The terminology used herein is for the purpose of describing particular embodiments and is not limiting. The singular forms "a," "an," and "the" as used herein also include the plural forms unless the context clearly dictates otherwise. Furthermore, the terms "comprises," "comprising," "includes," and / or "comprising" as used herein specify the presence of stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Furthermore, the terms "substantially," "about," and other similar terms as used herein are used as terms of approximation rather than degrees, and as such, are used to describe inherent deviations from measured, calculated, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0047] Various embodiments are described below with reference to cross-sectional and / or exploded illustrations, which are schematic illustrations of idealized embodiments and / or intermediate structures. As such, variations from the shapes of the illustrated drawings may be expected, for example, as a result of manufacturing techniques and / or tolerances. Therefore, the embodiments disclosed herein should not necessarily be construed as limited to the shapes of specific illustrated regions, but should be construed to include, for example, deviations in shape resulting from manufacturing. In this way, the regions depicted in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of regions of the device, and as such, are not necessarily intended to have a limiting meaning.

[0048] As is conventional in the art, some embodiments may be illustrated and described in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will appreciate that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, wiring circuits, memory elements, and wiring connections formed using semiconductor-based or other manufacturing techniques. When the blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and optionally may be driven by firmware and / or software. Furthermore, each block, unit, and / or module may be implemented by dedicated hardware, or by a combination of dedicated hardware for performing some functions and processors (e.g., one or more programmed processors and associated circuitry) for performing other functions. Additionally, the blocks, units, and / or modules of some embodiments may be physically separated into two or more interacting and individual blocks, units, and / or modules without departing from the scope of the present invention. Additionally, the blocks, units, and / or modules of some embodiments may be physically combined into more complex blocks, units, and / or modules without departing from the scope of the present invention.

[0049] Unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms defined in commonly used dictionaries, such as terms defined in commonly used dictionaries, should be interpreted to have a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealistic or overly formal sense unless explicitly defined herein.

[0050] The light-emitting modules of the embodiments of the present disclosure can be applied to display devices. Furthermore, the light-emitting elements included in the light-emitting modules may be micro LEDs. A detailed description of the light-emitting modules will be provided below with reference to the drawings.

[0051] FIG. 1 is a schematic exploded perspective view for explaining a light-emitting module (1001) according to a first embodiment of the present disclosure, FIG. 2A is a schematic cross-sectional view for explaining a light-emitting module (1001) according to a first embodiment of the present disclosure, FIG. 2B is a schematic cross-sectional view enlarged to illustrate a part of a light-emitting module (1001) according to the first embodiment of the present disclosure, and FIG. 2C is a schematic plan view of FIG. 2B.

[0052] Referring to FIGS. 1, 2A, 2B, and 2C, a light-emitting module (1001) according to a first embodiment may include a circuit board (110), a plurality of light-emitting elements (120), a first molding layer (130), and a second molding layer (150). A circuit board (110) having an array of a plurality of light-emitting elements (120) is referred to as a light-emitting element array substrate (100). The light-emitting elements (120) may include a first semiconductor layer (11), an active layer (12), and a second semiconductor layer (13). The light-emitting module (1001) may also include an insulating layer (15) and an electrode (17).

[0053] The circuit board (110) may include a circuit pattern, which is a wiring for supplying electricity to the light-emitting elements (120). When the light-emitting elements (120) are mounted on the circuit board (110), they may be electrically connected to the circuit pattern. The electrodes of the light-emitting elements (120) may be electrically connected by directly contacting the circuit pattern. Alternatively, the electrodes of the light-emitting elements (120) may be electrically connected to the circuit pattern through a conductive adhesive material. For example, the circuit board (110) may be various types of printed circuit boards (110). However, the circuit board (110) is not limited to the printed circuit board (110), and may be any type as long as it has wiring for supplying electricity to the light-emitting elements (120).

[0054] A plurality of light-emitting elements (120) may be electrically connected to each other on a circuit board (110) by a circuit pattern so that they can be driven in series, in parallel, or individually. According to the present embodiment, the circuit pattern may be formed so that the plurality of light-emitting elements (120) can each operate independently. The light-emitting element (120) may be a light source of the light-emitting module (1001) and may be disposed on the circuit board (110). In addition, the light-emitting elements (120) may be driven individually. According to the present embodiment, the light-emitting element (120) may be a light-emitting diode in which an n-type semiconductor layer is disposed in the direction of a light-emitting surface. Therefore, when a plurality of light-emitting elements (120) are included, the n-type electrodes may all be positioned in the same direction. For example, the light-emitting element (120) may include light-emitting elements (120) that emit light having at least three different peak wavelengths, such as red light, green light, and blue light.

[0055] The light-emitting element (120) may have a light-emitting structure (10) including a structure in which a first semiconductor layer (11), an active layer (12), and a second semiconductor layer (13) are sequentially stacked. In addition, the first semiconductor layer (11), the active layer (12), and the second semiconductor layer (13) may be nitride semiconductor layers sequentially grown on a growth substrate. The type of light generated from the light-emitting element (120) may vary depending on the composition of the first semiconductor layer (11), the second semiconductor layer (13), and the active layer (12). In the present embodiment, the first semiconductor layer (11) is a p-type semiconductor layer, and the second semiconductor layer (13) is an n-type semiconductor layer, but conversely, the first semiconductor layer (11) may be an n-type semiconductor layer, and the second semiconductor layer (13) may be a p-type semiconductor layer.

[0056] The active layer (12) can be formed between the first semiconductor layer (11) and the second semiconductor layer (13). The active layer (12) is a layer where electrons injected through the first semiconductor layer (11) and holes injected through the second semiconductor layer (13) recombine, and light can be generated through the recombination of electrons and holes. Alternatively, the active layer (12) can generate light through the recombination of holes injected through the first semiconductor layer (11) and electrons injected through the second semiconductor layer (13).

[0057] The active layer (12) may be formed in any one of a single well structure, a multi-well structure, a single quantum well structure, a multi-quantum well (MQW) structure, a quantum dot structure, and a quantum wire structure. In addition, the active layer (12) may include one material among InGaN, AlGaN, and GaN. However, the composition of the active layer (12) is not limited thereto.

[0058] In one embodiment, the first semiconductor layer (11) may be formed of a compound semiconductor such as a group III-V semiconductor, a group II-VI semiconductor, etc. The first semiconductor layer (11) may be an n-type semiconductor layer doped with an n-type dopant. The second semiconductor layer (13) may be formed of a group III-V semiconductor, a group II-VI semiconductor, etc. The second semiconductor layer (13) may be a p-type semiconductor layer doped with a p-type dopant. For example, the second semiconductor layer (13) may be formed of AlGaN or GaN doped with a p-type dopant.

[0059] A conductive first electrode (140) may be formed between the light emitting element (120) and the circuit board (110) and may be electrically connected to an electrode (pad, 115) formed on the board (110). A conductive second electrode (160) may be formed on the upper portion of the light emitting element (120). The second electrode (160) may be formed to cover at least a portion of the upper surface of the second semiconductor layer (13). The second electrode (160) may be electrically connected to the second semiconductor layer (13) of the light emitting structure (10). The second electrode (160) may be formed of a light reflective material or a light transmissive material. The position of the upper surface of the first electrode (140) disposed in at least one of the light emitting elements (120) may be different from the positions of the upper surfaces of the first electrodes (140) disposed in other light emitting elements (120) disposed adjacently.

[0060] The light-emitting element (120) in which the second electrode (160) is formed of a light-transmitting material can be applied to a light-emitting module mounted on a transparent display device. At this time, the circuit board (110) of the light-emitting module (1001) can also be formed of a light-transmitting material. In this case, when the light-emitting module or the display device is turned off, the display device can function as transparent glass. The thickness of the second electrode (160) can be different from the thickness of the first electrode (140). By making the thickness of the second electrode (160) different from the thickness of the first electrode (140), the transmittance of light transmitted upward and downward can be controlled. The width of the second electrode (160) can be different from the width of the first electrode (140).

[0061] An insulating layer (15) may be formed on the upper portion of the second electrode (160). The insulating layer (15) may be formed to cover at least a portion of the first electrode (160) and the upper and side surfaces of the light-emitting element (120). The insulating layer (15) may be formed of SiO2. The insulating layer (15) may include an opening (16) disposed on the upper portion of the light-emitting structure (10). The opening (16) of the insulating layer (15) may be located on the upper portion of the second electrode (160). The opening (16) of the insulating layer (15) may be located on or near a central vertical line based on the width of the light-emitting element (120). For example, the difference between the distance (d1) to one side of the boundary of the opening (16) and the distance (d2) to the other side based on the central axis of the opening (16) of the insulating layer (15) may be about 20% or less. Furthermore, d1 and d2 may be the same. When viewed in cross section, the virtual line (A) passing through the center of the opening (16) may be spaced apart from the virtual line (B) passing through the center of the second electrode (160). When viewed in cross section, the virtual line (A) passing through the center of the opening (16) may be spaced apart from the virtual line (C) passing through the center of the second conductive semiconductor layer (13). Therefore, when a plurality of materials are stacked on the light-emitting element (120), the stress applied to the light-emitting element (120) can be dispersed.

[0062] A conductive electrode (170) made of a conductive material may be formed on the upper portion of the insulating layer (15). The conductive electrode (170) may be formed to cover at least a portion of the upper surface of the insulating layer (15) and may be formed to contact the second electrode (160) through the opening (16) of the insulating layer (15). Therefore, the conductive electrode (170) may be electrically connected to the second semiconductor layer (13) of the light-emitting element (120) through the second electrode (160). The conductive electrode (17) may be formed along the surface of the insulating layer (15) and may have a concave structure in the region where the opening (16) of the insulating layer (15) is formed. The thickness of the insulating layer (15) may be thinner than the thickness of the light-emitting element (120). Therefore, loss of light emitted from the light-emitting element (120) may be reduced.

[0063] Although the second electrode (160) is described as being positioned between the light-emitting element (120) and the conductive electrode (170), the second electrode (160) may be omitted. Accordingly, a portion of the light-emitting element (120) may be covered by the insulating layer (15), and the conductive electrode (170) may be formed so that the conductive electrode (170) may come into contact with the light-emitting element (120).

[0064] The light emitting element (120) may be a micro LED. That is, the light emitting element (120) may have a cross-sectional area of ​​100 μm or less in both width and height. Furthermore, the cross-sectional area of ​​the light emitting element (120) may be 30 μm x 30 μm or less. Furthermore, the cross-sectional area of ​​the light emitting element (120) may be 10 μm x 10 μm or less.

[0065] A first molding layer (130) may be disposed on the upper portion of the substrate (110) on which the light-emitting element (120) is mounted. The first molding layer (130) covers the side surface of the light-emitting element (120), and when a plurality of light-emitting elements (120) are mounted, the first molding layer (130) may be disposed between the plurality of light-emitting elements (120), and further, may be formed to surround the plurality of light-emitting elements (120). The first molding layer (130) may cover the side surface of the first electrode (140) disposed between the light-emitting element (120) and the substrate (110). Since the first molding layer (130) covers the boundary between the insulating layer (15) and the first electrode (140), the light-emitting element (120) may be prevented from being peeled off from the first electrode (140). The width of the first molding layer (130) disposed between the light emitting element (120) and the adjacent light emitting element (120) may be greater than the thickness of the insulating layer (15) disposed on the side of the light emitting element (120).

[0066] A second molding layer (150) may be arranged on the first molding layer (130). The second molding layer (150) may be formed of a different material or a material having different properties from the first molding layer (130), and an interface may be formed between the second molding layer (150) and the first molding layer (130). However, the present invention is not limited thereto, and may have a single molding layer form, and the second molding layer (150) may be formed of the same material as the first molding layer (130), or may be formed without an interface between the second molding layer (150) and the first molding layer (130). The second molding layer (150) and the first molding layer (130) may be formed simultaneously in a single process, or the first molding layer (130) may be formed first and then the second molding layer (150). The second molding layer (150) includes a first surface that contacts the first molding layer (150) and a second surface that is positioned to face the first surface, and the second surface may include an anti-glare surface.

[0067] Furthermore, the second molding layer (150) may be formed of a material having a higher light absorbency than the first molding layer (130). Accordingly, when light generated from the light emitting element (120) and emitted to the outside of the light emitting module (1001) is re-incident into the light emitting module (1001), the formation of an image such as a ghost can be prevented by absorbing the light in the second molding layer (150). Meanwhile, a window may be formed in the second molding layer (150) to prevent light generated from the light emitting element (120) from being absorbed in the second molding layer (150). The window may be formed by partially removing the second molding layer (150) or by using a material having a higher light transmittance than the second molding layer (150).

[0068] The first semiconductor layer (11) of the light-emitting element (120) may have a flat surface or may have a surface including unevenness. The width of the unevenness is formed within 5 um to enable stable connection with the electrode.

[0069] The light emitting element (120) may have a structure in which at least a portion thereof has a width that changes as it goes upward. For example, the width of the light emitting element (120) may be such that the width of the first semiconductor layer (11) is greater than the width of the second semiconductor layer (13). The light emitting element (120) may have an obtuse angle formed by an inclined plane between an upper surface or a lower surface and a side surface connected thereto. Accordingly, the phenomenon of current concentration at the corners can be alleviated compared to when the angle formed by the upper surface or the lower surface of the light emitting element (120) and the side surface connected thereto is a right angle.

[0070] According to one embodiment, a plurality of light emitting elements (120) may be arranged in a light emitting module (1001), and light generated from the plurality of light emitting elements (120) is emitted by passing through a second semiconductor layer (13). The thickness of the second semiconductor layer (13) may be smaller than the thickness of the first semiconductor layer (11), and light extraction efficiency may be improved by reducing absorption within the semiconductor layer on the path along which light generated from the active layer (12) is extracted to the outside. Preferably, the active layer (12) may be arranged above the center of the maximum thickness of the light emitting element (120). Since the distance from the active layer (12) where light is generated to the upper surface of the first molding layer (130) or the interface between the first molding layer (130) and the second molding layer (150) can be shortened, light extraction can be increased, thereby improving image clarity.

[0071] The light-emitting element (120) has a structure in which at least a portion thereof has a width that changes as it goes upward or in the light-emitting direction. Preferably, the width of the semiconductor layer positioned closer to the substrate (110) may be greater than the width of the semiconductor layer positioned closer to the light-emitting direction. The side surface of the light-emitting element (120) may include an inclined side surface.

[0072] When viewed in cross-section, the width of the conductive electrode (170) may be less than or equal to about 80% of the width of the light-emitting element (120). Therefore, light generated from the light-emitting element (120) can be emitted to the outside without being obstructed by the conductive electrode (170).

[0073] In another embodiment, the first electrode (140) electrically connected to the plurality of light-emitting elements (120) may function as a common electrode. Alternatively, the first electrode (140) may be connected to a common electrode formed on the circuit board (110). Accordingly, an electrical signal may be simultaneously supplied to the first semiconductor layers (11) of the plurality of light-emitting elements (120) through the first electrode (140). At this time, the second electrode (160) or the conductive electrode (170) is disposed on each of the light-emitting elements (120), and they may be spaced apart from each other and electrically spaced apart from each other. The common electrode is disposed between the substrate (110) and the light-emitting elements (120), and the second electrode (160) or the conductive electrode (170), which is an individual electrode, is disposed between the light-emitting elements (120) and the first molding layer (130).

[0074] In another embodiment, the second electrode (160) or conductive electrode (170) electrically connected to the plurality of light-emitting elements (120) may function as a common electrode. Accordingly, an electrical signal may be simultaneously supplied to the second semiconductor layers (13) of the light-emitting elements (120) through the second electrode (160) or conductive electrode (170). Accordingly, light generated from each light-emitting element (120) may be emitted in the direction in which the common electrode is formed. When the second electrode (160) or conductive electrode (170) serving as a common electrode includes a light-transmitting material, the second electrode (160) or conductive electrode (170) may have light-transmitting properties for a plurality of wavelengths so that light of a plurality of wavelengths may be emitted through the light-transmitting common electrode. The first electrode (140) is disposed on each of the light-emitting elements (120), and these may be disposed to be spaced apart from each other and may also be electrically spaced apart.

[0075] FIG. 3 is a schematic cross-sectional view illustrating a light-emitting module (1001a) according to a second embodiment of the present disclosure.

[0076] Referring to FIG. 3, the light emitting module (1001a) according to the present embodiment is generally similar to the light emitting module (1001) described with reference to FIGS. 1, 2A, 2B, and 2C, but differs in that light generated from a plurality of light emitting elements (120) is emitted by passing through the first semiconductor layer (11). The thickness of the first semiconductor layer (11) may be greater than the thickness of the second semiconductor layer (13), and the active layer (12) may be arranged below the center of the maximum thickness of the light emitting element (120).

[0077] The light emitting element (120) has a structure in which at least a portion thereof has a width that changes as it goes upward or in the light emission direction. Preferably, the width of the semiconductor layer disposed closer to the substrate (110) may be narrower than the width of the semiconductor layer disposed closer to the light emission surface. Accordingly, the width of the light emitting element (120) in the light emission direction increases, thereby enabling it to emit a large amount of light. The light emitting element (120) may include inclined side surfaces. When viewed in cross section, the width of the conductive electrode (170) may be about 80% or less of the width of the light emitting element (120). Accordingly, light generated from the light emitting element (120) may be emitted to the outside without being obstructed by the conductive electrode (170).

[0078] When viewed in cross-section, the width of the first electrode (140) may be approximately 80% or less of the width of the light-emitting element (120). Therefore, light generated from the light-emitting element (120) can be emitted to the outside without being obstructed by the first electrode (140).

[0079] In another embodiment, the first electrode (140) electrically connected to the plurality of light-emitting elements (120) may function as a common electrode. Accordingly, an electrical signal may be simultaneously supplied to the first semiconductor layers (11) of the plurality of light-emitting elements (120) through the first electrode (140). Accordingly, light generated from each light-emitting element (120) may be emitted in the direction in which the common electrode is formed. At this time, the second electrode (160) or the conductive electrode (170) may be disposed on each of the light-emitting elements (120), may be disposed spaced apart from each other, and may also be electrically spaced apart. Accordingly, the individual electrodes are disposed between the substrate (110) and the light-emitting elements (120), and the first electrode (140), which is a common electrode, is disposed between the light-emitting elements (120) and the first molding layer (130).

[0080] In another embodiment, the second electrode (160) or conductive electrode (170) electrically connected to the plurality of light-emitting elements (120) may function as a common electrode. Accordingly, an electrical signal may be simultaneously supplied to the second conductive layers (13) of the light-emitting elements (120) through the second electrode (160) or conductive electrode (170). The second electrode (160) or conductive electrode (170) may have light transparency for a plurality of peak wavelengths, or may have reflectivity for a plurality of peak wavelengths. The first electrode (140) may be disposed on each of the plurality of light-emitting elements (120), may be disposed spaced apart from each other, and may also be electrically spaced apart.

[0081] FIG. 4 is a schematic cross-sectional view illustrating a light-emitting module (1001b) according to a third embodiment of the present disclosure.

[0082] Referring to FIG. 4, the light emitting module (1001b) according to the present embodiment is generally similar to the light emitting module (1001b) described with reference to FIG. 3, but differs in that the light emitting surface of the light emitting element (120) has unevenness formed thereon. The unevenness may be formed within the area of ​​the first semiconductor layer (11) so as not to exceed the width of the first semiconductor layer (11). The outermost surface of the unevenness may include an inclined surface, and the angle formed by the inclined surface of the unevenness and the side inclined surface of the semiconductor layer may be 90° or more or an obtuse angle.

[0083] The first electrode (140) may be formed along the uneven surface, and the first molding layer (130) may fill the concave portions of the uneven surface. However, this is not necessarily limited to the first electrode (140) and may fill the concave portions of the uneven surface to make the slope of the uneven surface gentle, thereby making the shape of the uneven surface gentle at the boundary where the first molding layer (130) covers the light-emitting element (120).

[0084] FIG. 5 is a schematic cross-sectional view illustrating a light-emitting module (1001c) according to the fourth embodiment of the present disclosure.

[0085] Referring to FIG. 5, the light-emitting module (100c) according to the present embodiment is generally similar to the light-emitting modules (1001, 1001a, 1001b) described above, but differs in that the light-emitting element (120) has a flip-chip structure. That is, both the first electrode (170a) and the second electrode (170b) are positioned between the light-emitting element (120) and the circuit board (110), and are flip-bonded to the electrodes (115a, 115b) of the circuit board (110). Instead of or in addition to the second electrode (170b), a conductive electrode may be formed.

[0086] Light emitted from the light emitting element (120) can be emitted through the first semiconductor layer (11), and light efficiency can be improved because there is no electrode on the light emitting surface.

[0087] FIG. 6 is a schematic plan view for explaining a light-emitting module (2001) according to a fifth embodiment of the present disclosure, FIG. 7 is a schematic rear view for explaining a light-emitting module (2001) according to a fifth embodiment of the present disclosure, and FIG. 8 is a schematic exploded plan view for explaining a display device having a light-emitting module (2001) according to a fifth embodiment of the present disclosure.

[0088] First, referring to FIGS. 6 and 7, a light-emitting module (2001) according to the present embodiment may include a light-emitting element array substrate (200), a base plate (210), a molding portion (230), a window (230W), an extension portion (240), a circuit board (250), a reinforcement plate (260), a connector (270), and a cover (280).

[0089] The light emitting element array substrate (200) includes a circuit board and a light emitting element array arranged on the circuit board as described with reference to FIG. 1. In the present embodiment, the light emitting elements arranged in the light emitting element array substrate (200) may be light emitting elements that emit light of different wavelengths, or may be light emitting elements that emit light of the same color. In one embodiment, the light emitting elements arranged in the light emitting element array substrate (200) may be light emitting elements that emit red light, green light, and blue light and may be regularly arranged. In another embodiment, the light emitting elements arranged in the light emitting element array substrate (200) may be light emitting elements that emit red light, green light, or blue light. In yet another embodiment, the light emitting elements arranged in the light emitting element array substrate (200) may be light emitting elements that emit green light and blue light.

[0090] The light emitting element array substrate (200) is disposed on a base plate (210). The base plate (210) may be formed of a material that is more rigid than the circuit board (250), for example, may be formed of metal. The base plate (210) may also be a thermally conductive material and may help dissipate heat generated in the light emitting element array substrate (200). The base plate (210) may have a larger area than the light emitting element array substrate (200) mounted thereon. For example, the light emitting element array substrate (200) may have a transverse width (W1) and a longitudinal width (W5), and the base plate (210) may have a transverse width (W2) and a longitudinal width (W6). The transverse width (W2) and the longitudinal width (W6) of the base plate (210) may be larger than the transverse width (W1) and the longitudinal width (W5) of the light emitting element array substrate (200), respectively. Furthermore, as illustrated in FIG. 6, the upper surface of the base plate (210) can be exposed near at least three sides of the light emitting element array substrate (200). Therefore, the array substrate (200) can be prevented from being preferentially affected by external factors, and can be effective in heat dissipation.

[0091] The light emitting element array substrate (200) may be covered with a molding part (230). The molding part (230) is formed of a material having a relatively high light absorbency and absorbs light incident from the outside. Meanwhile, a window (230W) is surrounded by the molding part (230). The window (230W) is a region where light generated in the light emitting element array substrate (200) is emitted. The window (230W) may be formed of a material having a higher light transmittance than the molding part (230) or may be formed by at least partially removing the molding part (230). Meanwhile, another molding part having a higher light transmittance than the molding part (230) may be added between the molding part (230) and the light emitting element array substrate (200).

[0092] The circuit board (250) may be a flexible printed circuit board. The circuit board (250) has a circuit pattern. The circuit board (250) may be electrically connected to the light emitting element array substrate (200) disposed on the extension portion (240). For example, the circuit pattern in the light emitting element array substrate (200) and the circuit pattern in the circuit board (250) may be connected via bonding wires, and the extension portion (240) may be packaged for electrical safety. The extension portion (240) and the circuit board (250) may be physically connected or electrically connected. In another embodiment, the circuit pattern in the light emitting element array substrate (200) and the circuit pattern in the circuit board (250) may be connected via a connecting socket. In yet another embodiment, the light emitting element array substrate (200) may be mounted on the circuit board (250).

[0093] One end of the circuit board (250) is connected to the light emitting element array substrate (200), and the other end is connected to the connector (270). The connector (270) can be electrically connected to the light emitting element array substrate (200) and can supply an electrical signal to the light emitting element array substrate (200). The connector (270) can be disposed on a reinforcing plate (260). The reinforcing plate (260) increases the strength of the area where the connector (270) is disposed, thereby helping to connect the connector with external components. The reinforcing plate (260) may also include a thermally conductive material. A marking capable of exposing information of the light emitting module (2001) may be provided on one surface of the circuit board (250). The left-right width of the circuit board (250) may be smaller than the up-down length. That is, the circuit board (250) is formed to have a longitudinal direction, and the light emitting element array substrate (200) and the connector (270) may be disposed along the longitudinal direction. Therefore, the center of gravity of the light emitting module (2001) can be maintained. The connector (270) may include a power supply unit or a driver IC.

[0094] The neck portion of the circuit board (250) positioned between the extension portion (240) and the reinforcing plate (260) has a transverse width (W3) and a longitudinal width (W7). The transverse width (W3) of the circuit board (250) is smaller than the transverse width (W2) of the base plate (210) and the transverse width (W4) of the reinforcing plate (260). In addition, the longitudinal width (W7) of the circuit board (250) is smaller than the longitudinal width (W6) of the base plate (210) and the longitudinal width (W8) of the reinforcing plate (260). Accordingly, the overall external size of the light emitting module (2001) can be reduced while maintaining flexibility. The extension portion (240) and the reinforcing plate (260) can be symmetrical with respect to the circuit board (250).

[0095] The extension (240), circuit board (250) and reinforcement plate (260) may be formed as an integral body.

[0096] The cover layer (280) may be placed on the other side of the reinforcing plate (260) facing the connector (270). The cover layer (280) protects various active or passive components, such as resistors. The area of ​​the cover layer (280) may be smaller than the area of ​​the base plate (210). Therefore, when the light-emitting module (2001) is installed in a device such as a projector, the weight is biased toward the area where the cover layer (280) is placed, thereby preventing the light-emitting module (2001) from being detached.

[0097] In this embodiment, the light emitting element array substrate (200) and the connector (270) are arranged on the upper surface side of the circuit board (250), and the base plate (210) and the cover layer (280) are arranged on the lower surface side of the circuit board (250), but the present disclosure is not limited thereto. For example, the light emitting element array substrate (200) and the cover layer (280) may be arranged on the upper surface side of the circuit board (250), and the base plate (210) and the connector (270) may be arranged on the lower surface side of the circuit board (250).

[0098] Referring to FIG. 8, a display device according to the present embodiment may include a plurality of light-emitting modules (2001a, 2001b, 2001c), an optical coupler (2100), a lens assembly (2200), and a light guide (2007).

[0099] The plurality of light-emitting modules (2001a, 2001b, 2001c) are similar to the light-emitting module (2001) described with reference to FIGS. 6 and 7, respectively, and can emit light of a single color. For example, the light-emitting module (2001a) can emit green light, the light-emitting module (2001b) can emit red light, and the light-emitting module (2001c) can emit blue light.

[0100] The optical coupler (2100) couples the light emitted from the light emitting modules (2001a, 2001b, 2001c). The optical coupler (2100) may have, for example, a hexahedral shape, and the light emitting modules (2001a, 2001b, 2001c) may be arranged on each of the three sides of the optical coupler (2100).

[0101] The light emitted from the light emitting module (2001a) enters the optical coupler (2100) and then travels in the incident direction and passes through the light emitting surface of the optical coupler (2100). Meanwhile, the light entering the optical coupler (2100) from the light emitting module (2001b) and the light emitting module (2001c) is reflected internally and then passes through the light emitting surface of the optical coupler (2100). Accordingly, the light emitted from the light emitting modules (2001a, 2001b, 2001c) is combined within the optical coupler (2100). Meanwhile, by arranging the light emitting module (2001a) emitting green light to face the lens assembly (2200), the green light can pass through the optical coupler (2100) without reflection within the optical coupler (2100). Accordingly, the loss of green light can be minimized, making it more effective in reproducing color images.

[0102] The lens assembly (2200) may include a barrel (2003) and lenses (2005). The barrel (2003) fixes the positions of the lenses (2003) and protects the lenses (2005). Meanwhile, the lenses (2005) diffuse or converge light passing through the optical coupler (2100). Various combinations of lenses may be used.

[0103] The optical coupler (2100) can be placed within the housing, and the lens assembly (220) can be coupled to the housing. In addition, insertion holders are provided on three sides of the housing, and light emitting modules (2001a, 2001b, 2001c) can be coupled to the insertion holders. Furthermore, a cover that covers the light emitting modules (2001a, 2001b, 2001c) can be coupled to the housing to protect the light emitting modules.

[0104] The light guide (2007) guides light incident through the lens assembly (2200) to form an image. The light guide (2007) may be, for example, a car window, augmented reality glasses, etc. Accordingly, light emitted from the light-emitting modules can form an image on the car window or glasses.

[0105] In this embodiment, a color image is implemented using three types of light-emitting modules (2001a, 2001b, 2001c), but the present disclosure is not limited thereto. For example, one light-emitting module may emit light of two colors, and the other light-emitting modules may each emit light of one color. For example, the light-emitting module (2001a) may emit green light and blue light, and the light-emitting modules (2001b, 2001c) may emit red light. Accordingly, the intensity of the red light can be relatively greatly enhanced. One of the light-emitting modules (2001b, 2001c) may be omitted.

[0106] In another embodiment, at least two connectors (270) among the connectors (270) disposed in each module (2001a, 2001b, 2001c) may be disposed to face each other. The connectors (270) disposed in each module (2001a, 2001b, 2001c) may be disposed to face the center of the optical coupler (2100). Therefore, the distance between the connectors (270) and the optical coupler (2100) can be further reduced.

[0107] In another embodiment, the light emitting module (2001a) may emit green light and blue light, and the light emitting modules (2001b, 2001c) may emit red light and green light, respectively. Accordingly, the intensity of the green light can be relatively greatly enhanced.

[0108] In another embodiment, the light-emitting module (2001a) may emit blue light and red light, and the light-emitting modules (2001b, 2001c) may each emit green light. Accordingly, the intensity of the green light can be significantly enhanced. Furthermore, the positions of the light-emitting modules (2001a) emitting two colors of light can also be varied.

[0109] In this embodiment, a micro lens array may be placed between the light emitting modules (2001a, 2001b, 2001c) and the optical coupler (2100). The micro lens array may be formed within each light emitting module.

[0110] FIG. 9 is a schematic plan view for explaining a light-emitting module (3001) according to the sixth embodiment of the present disclosure, FIG. 10 is a schematic side view for explaining a display device having a light-emitting module (3001) according to the sixth embodiment of the present disclosure, and FIG. 11 is a schematic plan view for explaining the display device of FIG. 10.

[0111] First, referring to FIG. 9, a light emitting module (3001) according to the present embodiment may include a light emitting element array substrate (300), a base plate (310), a molding part (330), a window (330W), a circuit board (350), a reinforcing plate, and a connector (370).

[0112] The light emitting element array substrate (300), the molding portion (330), and the window (330W) are similar to the light emitting element array substrate (200), the molding portion (230), and the window (230W) described with reference to FIG. 6, so detailed descriptions are omitted to avoid duplication.

[0113] The light emitting element array substrate (300) may be mounted on a circuit board (350), and a base plate (310) may be coupled to the circuit board (350) facing the light emitting element array substrate (300). The circuit board (350) may be a flexible printed circuit board, and the base plate (310) reinforces the flexibility of the circuit board (350). The base plate (310) may also be a heat sink.

[0114] One end of the circuit board (350) can be connected to the light emitting element array board (300), and the other end can be connected to a connector (370). The connector (370) is similar to the connector (270) described with reference to FIG. 6, except that the connector (370) is formed on the circuit board (350). A reinforcing plate (360) is arranged opposite the connector (370), and the reinforcing plate (360) reinforces the strength of the circuit board (350).

[0115] In this embodiment, the base plate (310) and the reinforcing plate (360) are arranged on the lower surface side of the circuit board (350), and the light emitting element array substrate (300) and the connector (370) are arranged on the upper surface side of the circuit board (350). However, the present disclosure is not necessarily limited thereto.

[0116] Meanwhile, in the present embodiment, the transverse width of the base plate (310) or the transverse width of the reinforcing plate (360) may be greater than the transverse width of the circuit board (350), but is not necessarily limited thereto, and may be the same. Furthermore, the transverse width of the light emitting element array substrate (330) may be smaller than the transverse width of the base plate (310), but is not limited thereto, and may be the same.

[0117] Referring to FIG. 10, the display device may include a light emitting module (3001), a lens assembly (3200), and a light guide (3007).

[0118] The light emitting module (3001) is coupled to the lens assembly (3200) without using an optical coupler. That is, the light emitting module (3001) can be directly coupled to the lens assembly (2200). The lens assembly (3200) includes a barrel (3003) and lenses (3005), similar to the lens assembly (2200) described with reference to FIG. 8.

[0119] The light guide (3007) guides light incident through the lens assembly (2200) to form an image. The light guide (3007) may be, for example, a car window, augmented reality glasses, etc. Accordingly, light emitted from the light-emitting modules can form an image on the car window or glasses.

[0120] Referring to FIG. 11, light emitting modules (3001a, 3001b, 3001c) can be coupled to a light guide (3007). The light emitting modules (3001a, 3001b, 3001c) can emit red light, green light, and blue light, respectively. The three light emitting modules (3001a, 3001b, 3001c) are coupled to the light guide, and a color image can be formed in a specific area (3009) of the light guide by the light emitted from these light emitting modules.

[0121] In this embodiment, an image is implemented using three light-emitting modules (3001a, 3001b, 3001c), but the present disclosure is not limited thereto. A display device may be provided in which a single light-emitting module emitting light of a single color or light of two or more colors is coupled to a light guide. In another example, a light-emitting module emitting light of two colors and a light-emitting module emitting light of a single color, for example, a light-emitting module emitting green light and blue light and a light-emitting module emitting red light, may be coupled to a light guide. Furthermore, a plurality of light-emitting modules emitting light of the same color may be coupled to a light guide to enhance the intensity of light of a specific color. For example, a light-emitting module emitting green light or a light-emitting module emitting red light may be added to the three light-emitting modules described above.

[0122] While various embodiments of the present invention have been described above, the present invention is not limited to these embodiments. Furthermore, matters or components described for one embodiment may be applied to other embodiments without departing from the technical spirit of the present invention.

Claims

1. In the light-emitting module, base plate; A light emitting element array substrate disposed on the base plate and including a plurality of light emitting elements; A molding part covering the above light-emitting elements; First, a circuit board electrically connected to the light emitting element array substrate; a connector electrically connected to the other end of the circuit board; and A light emitting module including a reinforcing plate disposed at the bottom of the above connector.

2. In claim 1, A light emitting module in which the base plate has a larger area than the light emitting element array substrate.

3. In claim 2, A light emitting module in which the upper surface of the base plate is exposed near at least three sides of the light emitting element array substrate.

4. In claim 2, The transverse width of the base plate and the transverse width of the reinforcement plate are larger than the transverse width of the circuit board located between the base plate and the reinforcement plate, A light emitting module in which the longitudinal width of the base plate and the longitudinal width of the reinforcing plate are greater than the longitudinal width of the circuit board located between the base plate and the reinforcing plate.

5. In claim 1, A light emitting module in which the light emitting element array substrate and the connector are arranged on the same side of the circuit board.

6. In claim 1, A light emitting module in which the light emitting element array substrate and the connector are respectively arranged on different surfaces of the circuit board.

7. In claim 1, A light emitting module comprising a window surrounded by the above molding portion.

8. In claim 1, The above light emitting element array substrate is a light emitting module mounted on the circuit board.

9. In claim 1, The above connector is a light emitting module formed on the circuit board.

10. In claim 1, A light emitting module further comprising a cover disposed opposite the above connector and covering a passive element or an active element.

11. In the display device, luminescent module; lens assembly; and Including a light guide, The above light emitting module base plate; A light emitting element array substrate disposed on the base plate and including a plurality of light emitting elements; A molding part covering the above light-emitting elements; First, a circuit board electrically connected to the light emitting element array substrate; a connector electrically connected to the other end of the circuit board; and A display device comprising a reinforcing plate disposed at the lower portion of the connector.

12. In claim 11, A display device comprising a plurality of light-emitting modules, each of which emits light of a single color.

13. In claim 11, The above light emitting module is a display device directly coupled to the lens assembly.

14. In claim 11, Further including an optical coupler, A display device in which light-emitting modules emitting light of different colors are arranged on at least two sides of the optical coupler.

15. In claim 14, A display device in which light emitting modules emitting green light, red light, and blue light are arranged on each of the three sides of the optical coupler, and the light emitting module emitting green light is arranged facing the lens assembly.

16. In claim 11, A display device wherein the base plate has a larger area than the light emitting element array substrate.

17. In claim 11, The above circuit board is a display device whose left-right width is smaller than its top-bottom length.

18. In claim 11, The above light emitting module further includes a cover layer disposed on the reinforcing plate, and the area of ​​the cover layer is smaller than the area of ​​the base plate.

19. In claim 18, A display device that forms an image within the above light guide.

20. In claim 11, The above lens assembly is a display device that diffuses light.

Images