Optical assembly and electronic device comprising same

Abstract

According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may comprise: a case; a lens group disposed on a portion of the case and comprising at least one lens aligned along an optical axis; an image sensor disposed in the case and configured to detect light which has passed through the lens group; and an optical member disposed between the lens group and the image sensor in the case and configured to change the path of light which has passed through the lens group toward the image sensor. The optical member may include a first sidewall inclined with respect to the optical axis of the lens group and a second sidewall disposed opposite to the first sidewall of the optical member. The electronic device may comprise a first support member configured to contact a portion of the case and to support the first sidewall, and a second support member configured to contact a portion of the case and to support the second sidewall.

Description

Optical assembly and electronic device including the same

[0001] Examples disclosed in this document relate to optical assemblies and electronic devices including the same.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a case, a lens group disposed in a portion of the case and including at least one lens aligned along an optical axis, an image sensor disposed within the case and configured to detect light passing through the lens group, and an optical member disposed within the case between the lens group and the image sensor and configured to change a path of light passing through the lens group toward the image sensor. The optical member may include a first side wall inclined with respect to the optical axis of the lens group and a second side wall disposed opposite the first side wall of the optical member. The electronic device may include a first support member configured to contact a portion of the case and support the first side wall, and a second support member configured to contact a portion of the case and support the second side wall.

[0005] According to one embodiment of the present disclosure, an optical assembly may be provided. The optical assembly may include a case, a lens group disposed within a portion of the case and including at least one lens aligned with an optical axis, an image sensor disposed within the case and configured to detect light passing through the lens group, a reflective member disposed within the case between the lens group and the image sensor and configured to change a path of light passing through the lens group toward the image sensor, and a first support member and a second support member disposed on opposite sides of the optical member, respectively. The case may include a first assembly reference portion surrounding at least a portion of the first support member and a second assembly reference portion surrounding at least a portion of the second support member.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0008] FIG. 2 is a front perspective view of an electronic device according to one embodiment disclosed in this document.

[0009] FIG. 3 is a rear perspective view of an electronic device according to one embodiment disclosed in this document.

[0010] FIG. 4 is a rear view showing a portion of the rear surface of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is a cross-sectional side view of an optical assembly according to one embodiment of the present disclosure, taken along line A-A' of FIG. 4.

[0012] FIG. 6 is a cross-sectional side view of an optical assembly according to one embodiment of the present disclosure, taken along line A-A' of FIG. 4.

[0013] FIG. 7 is a perspective view showing optical members and support members of an optical assembly according to one embodiment of the present disclosure.

[0014] FIG. 8A is a perspective view showing a first case, optical member, and support members of an optical assembly according to one embodiment of the present disclosure.

[0015] FIG. 8b is a cross-sectional side view taken along line B-B' of FIG. 8a, according to one embodiment of the present disclosure.

[0016] FIG. 8C is a cross-sectional side view taken along line C-C' of FIG. 8A, according to one embodiment of the present disclosure.

[0017] FIG. 9A is a perspective view of an optical assembly according to one embodiment of the present disclosure.

[0018] FIG. 9b is a plan view of an optical assembly according to one embodiment of the present disclosure.

[0019] FIG. 9c is a cross-sectional side view of an optical assembly according to one embodiment of the present disclosure.

[0020] FIGS. 10A, 10B, and 10C are drawings for explaining the assembly structure of an optical assembly according to one embodiment.

[0021] FIGS. 11a, 11b, and 11c are drawings for explaining the assembly structure of an optical assembly according to one embodiment.

[0022] FIG. 12a is a schematic diagram illustrating a configuration of an optical assembly according to one embodiment.

[0023] FIG. 12b is a schematic diagram illustrating a configuration of an optical assembly according to one embodiment.

[0024] FIG. 13a is a schematic diagram illustrating a configuration of an optical assembly according to one embodiment.

[0025] FIG. 13b is a schematic diagram illustrating a configuration of an optical assembly according to one embodiment.

[0026] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0027] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0028] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.

[0029] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0030] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0031] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall-area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the one embodiment disclosed in this document. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0054] FIG. 2 is a front perspective view of an electronic device according to an embodiment of the present disclosure. FIG. 3 is a rear perspective view of the electronic device illustrated in FIG. 2 according to an embodiment of the present disclosure. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0055] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0056] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat, in which case it may not include a curved extending region. When it includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.

[0057] According to one embodiment, the electronic device (101) may include one or more of a display (201), an audio module (not shown) including at least one sound hole (203, 207, 214) (e.g., audio module (170) of FIG. 1), a sensor module (204) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213, 214) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), or a connector hole (208, 209) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., key input device (217) or light emitting element (206)) or may additionally include other components.

[0058] In one embodiment, the display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (201) is visually exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially the same.

[0059] In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (201), and at least one of an acoustic hole (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an acoustic hole (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be positioned on the side (210C).

[0060] According to one embodiment, the audio module (not shown) may include a microphone hole (203) and sound holes (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. According to one embodiment, the sound holes (207, 214) may include an external sound hole (207) and a receiver hole (214) for calls. In one embodiment, the sound holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included in the audio module without the sound holes (207, 214) (e.g., a piezo speaker).

[0061] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210). According to an embodiment, an additional sensor module may be disposed on a second surface (210B) of the housing (210). The fingerprint sensor (not shown) may be disposed on not only the first surface (210A) (e.g., the display (201)) of the housing (210) but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0062] According to one embodiment, the camera modules (205, 212, 213, 214) may include a first camera module (205) facing the first side (210A) of the electronic device (101), a second camera module (212) facing the second side (210B), a flash (213), and / or a sensor module (214) (e.g., a distance sensor). According to one embodiment, the electronic device (101) may further include a cover window (215) covering the camera modules (205, 212, 213, 214). For example, the first camera module (205) and / or the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, some of the camera modules (205, 212) and / or some of the sensor modules (e.g., sensor module (204)) may be arranged to be exposed to the outside through at least a portion of the display (201). In one embodiment, the first camera module (205) may include a punch hole camera arranged inside a hole or recess formed in the back surface of the display (201). For example, the first camera module (205) may receive at least a portion of light incident from inside the electronic device (101) through the display (210) toward the first side (210A) (or front side) of the electronic device (101).

[0063] In one embodiment, the second camera module (212) may be disposed within the housing (210) such that the lens is exposed to the second side (210B) (or rear) of the electronic device (101). For example, the camera module (212) may be electrically connected to a printed circuit board. For example, the flash (213) may include a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (e.g., a wide-angle lens and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) and / or the sensor module (214) may emit infrared light. For example, infrared rays emitted from the flash (213) and / or the sensor module (214) and reflected by the subject can be received through a sensor module (e.g., the sensor module (214) of FIGS. 3 and 4) disposed on the second side (210B) of the housing (210). The electronic device (101) or the processor (e.g., the processor (180) of FIG. 1) can detect depth information of the subject based on the point in time when the infrared rays are received by the sensor module.

[0064] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0065] In one embodiment, the light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to a process of, for example, the camera module (205). The light emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0066] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0067] FIG. 4 is a rear view illustrating a portion of the rear surface of an electronic device according to one embodiment of the present disclosure. FIG. 4 may illustrate a portion of the second side (210B) (or rear surface) of the electronic device (101) on which the camera modules (212, 213, 214) of FIG. 3 are arranged.

[0068] Referring to FIG. 4, according to one embodiment, the electronic device (101) may include a cover window (215) disposed on the second surface (210B). In one embodiment, the cover window (215) may be connected to the rear plate (211) or may be a part of the rear plate (211). According to one embodiment, the camera modules (212, 213, 214) may receive light incident toward the second surface (210B) of the electronic device (101) or the cover window (215). According to one embodiment, the cover window (215) may include a plurality of transparent regions (215a). The camera modules (212, 213, 214) may receive light from outside the electronic device (101) or radiate light to the outside through the transparent regions (215a) of the cover window (215). According to one embodiment, the camera modules (212, 213, 214) may include a second-first camera device (212a), a second-second camera device (212b), and a second-third camera device (212c) that are disposed inside the electronic device (101) and receive light through transparent areas (215a). For example, the second-first camera device (212a) and / or the second-second camera device (212b) may be a wide-angle (or ultra-wide-angle) camera, and the third camera device (212c) may be a telephoto camera. According to one embodiment, the camera modules (212, 213, 214) may include a flash (213) and a sensor module (214) (e.g., a distance sensor). For example, the third camera device (212c) may be disposed between the flash (213) and the sensor module (214).

[0069] According to an exemplary embodiment, a third camera device (212c) (e.g., a telephoto camera or a folded camera) may include a lens group (230), an image sensor (240), a reflective member (250) disposed between the lens group (230) and the image sensor (240), and a case (215) accommodating the lens group (230), the image sensor (240), and the reflective member (250). The lens group (230) may include a plurality of lenses, and may receive and receive light incident toward the rear surface (210B) of the electronic device (101) through transparent regions (215a) and transmit the light to the reflective member (250). The reflective member (250) may be configured to receive light passing through the lens group (230) and refract and / or reflect the light at least once internally. The image sensor (240) may be configured to receive and detect light passing through the reflective member (250). For example, the case (215) may include a first case (215a) for supporting a lens group (230) and a reflective member (250), and a second case (215b) for supporting a reflective member (250) and an image sensor (240).

[0070] According to one embodiment, a corner or edge of the image sensor (240) may be arranged parallel to a length direction (e.g., Y-axis direction), a width direction (e.g., X-axis direction), or a thickness direction (e.g., Z-axis direction) of the electronic device (101). According to one embodiment, a short side (e.g., X-axis direction edge) of the image sensor (240) may be parallel to or parallel to a short side (e.g., X-axis direction edge) of the electronic device (101) or the display (201). A long side (e.g., Y-axis direction edge) of the image sensor (240) may be parallel to or parallel to a long side (e.g., Y-axis direction edge) of the electronic device (101) or the display (201).

[0071] According to one embodiment, a corner or edge of the reflective member (250) may be arranged parallel to a longitudinal direction (e.g., Y-axis direction), a width direction (e.g., X-axis direction), or a thickness direction (e.g., Z-axis direction) of the electronic device (101). According to one embodiment, a long side (e.g., X-axis direction edge) of the reflective member (250) may be parallel to or parallel to a short side (e.g., X-axis direction edge) of the electronic device (101) or the display (201). A short side (e.g., Y-axis direction edge) of the reflective member (250) may be parallel to or parallel to a long side (e.g., Y-axis direction edge) of the electronic device (101) or the display (201).

[0072] FIG. 5 is a cross-sectional side view of an optical assembly according to an embodiment of the present disclosure taken along line A-A' of FIG. 4. FIG. 6 is a cross-sectional side view of an optical assembly according to an embodiment of the present disclosure taken along line A-A' of FIG. 4. FIG. 7 is a perspective view illustrating an optical member and support members of an optical assembly according to an embodiment of the present disclosure.

[0073] Referring to FIGS. 5 to 7, according to one embodiment, an optical assembly (301) (e.g., a telephoto camera or a folded camera) (e.g., a third camera device (212c)) may include a case (302), a lens group (330) (or a lens assembly or a lens array) (e.g., the lens group (230) of FIG. 4) disposed in a part of the case (302), an image sensor (340) (e.g., the image sensor (240) of FIG. 4) disposed within the case (302), and an optical member (350) (e.g., a reflective and / or refractive member) for transmitting light passing through the lens group (330) to the image sensor (340). According to one embodiment, the optical assembly (301) may include a case (302) for supporting the lens group (330), the image sensor (340), and the optical member (350).

[0074] Referring to FIGS. 5 and 6, according to one embodiment, the case (302) may include a first case (310) and a second case (320). According to one embodiment, the first case (310) may be formed to support the lens group (330) and the optical member (350) in a form that at least partially surrounds the lens group (330) and the optical member (350). According to one embodiment, the second case (320) may support the image sensor (340) and the optical member (350) in a form that at least partially surrounds the image sensor (340) and the optical member (350). According to one embodiment, the second case (320) may support the first support member (360) in a form that surrounds at least a portion of the first support member (360).

[0075] Referring to FIGS. 5 and 6, according to one embodiment, the lens group (330) may include a single lens or a plurality of lenses aligned along an optical axis (O). The lens group (330) may focus or guide light incident from outside the electronic device (101) toward the optical member (350). In the present disclosure, for example, the optical axis (O) may be parallel or parallel to the thickness direction (e.g., Z-axis direction) of the electronic device (101).

[0076] According to one embodiment, the image sensor (340) may be configured to convert light emitted or reflected from a subject and transmitted through the lens group (330) and the reflective member (350) into an electrical signal. According to one embodiment, the image sensor (340) may be configured to detect light that travels along a direction parallel to the optical axis (O) (e.g., the Z-axis direction) after being reflected and / or refracted at least once (four times in the embodiment of FIGS. 5 and 6) inside the optical member (350). The electronic device (101) may acquire a subject image based on signals and / or information detected through the image sensor (340). The image sensor (340) may include, for example, one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (340) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0077] In one embodiment, the image sensor (340) may include an imaging plane, which is a plane that receives at least a portion of light and on which an image is formed. In one embodiment, the imaging plane of the image sensor (340) may be arranged substantially parallel to the XY plane.

[0078] According to one embodiment, the electronic device (e.g., the electronic device (101) of FIGS. 1 to 3) or the electronic device (101) may be configured to move the image sensor (340) in a direction parallel to the direction in which light is incident on the imaging surface of the image sensor (340) (e.g., the optical axis (O) direction or the Z-axis direction) and / or in a direction crossing the direction (e.g., the X-axis direction and / or the Y-axis direction). According to one embodiment, the processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) may be configured to perform a shake correction operation by moving the image sensor (340) in a plane (e.g., the XY plane) perpendicular to the direction in which light is incident on the imaging surface of the image sensor (340) (e.g., the Z-axis direction). According to one embodiment, the processor (120) may be configured to perform a focus adjustment operation by moving the image sensor (340) forward and backward along a direction in which light is incident on the image surface of the image sensor (e.g., the Z-axis direction). For example, an actuator for moving the image sensor (340) may be electrically connected to the processor (120) and may be provided inside or outside the first case (310) and / or the second case (320).

[0079] Referring to FIGS. 5 and 6, according to one embodiment, an optical member (350) (e.g., a reflective and / or refractive member) may include a first surface (350a), a second surface (350b) opposite to the first surface (350a), and side walls (351, 352) (or side walls) connecting the first surface (350a) and the second surface (350b). For example, the side walls (351, 352) may be formed to be inclined with respect to the first surface (350a) or the second surface (350b). According to one embodiment, the first surface (350a) of the optical member (350) may face a direction in which the lens group (330) is arranged (e.g., a rearward or -Z direction), and the second surface (350b) may face a direction opposite to the first surface (350a). In one embodiment, a portion of the second surface (350b) may face the image sensor (340).

[0080] For example, the reflective member (250) may be configured to receive light passing through the lens group (230) and refract and / or reflect it at least once internally.

[0081] According to one embodiment, the side walls (351, 352) (or side surfaces) of the optical member (350) may include a first side wall (351) inclined with respect to the optical axis (O) of the lens group (330) and a second side wall (352) disposed opposite to or opposite the first side wall (351) and inclined with respect to the optical axis (O). For example, the first side wall (351) may include a reflective surface (or refractive surface) that reflects and / or refracts incident light toward the second side wall (352). For example, an inner surface of the second side wall (352) may include a reflective surface (or refractive surface) that reflects and / or refracts incident light toward the image sensor (340). In one embodiment, the first side wall (351) can at least partially contact the first support member (360) disposed on the outside. In one embodiment, the second side wall (352) can at least partially contact the second support member (370) disposed on the outside. For example, the side walls (351, 352) and their reflective surfaces can be formed to be inclined with respect to the first surface (350a) or the second surface (350b), for example, can form an angle of about 45 degrees or greater than 0 and less than about 45 degrees with respect to the first surface (350a) or the second surface (350b). In one embodiment, the reflective member (350) can be configured to reflect light incident from the lens group (330) at least once (four times in the embodiment of FIGS. 5 and 6). In the present disclosure, the number of reflections and the path of light within the reflective member (350) are only examples and may be changed.

[0082] According to one embodiment, the optical member (350) may have a cross-section parallel to the YZ plane in the shape of a parallelogram, in which case the first side wall (351) and the second side wall (352) may be parallel or parallel to each other. When the first side wall (351) and the second side wall (352) are parallel or parallel to each other, the lens group (330) and the image sensor (340) may be arranged on different sides (e.g., opposite sides) of the optical member (350). However, the shape of the optical member (350) and the positions of the lens group (330) and the image sensor (340) with respect to the optical member (350) may be changed. According to one embodiment (e.g., see FIG. 13), the optical member (350) may have a trapezoidal cross-section along the YZ plane, in which case the first side wall (351) and the second side wall (352) may form a non-zero angle with respect to each other, and the lens group (330) and the image sensor (340) may be arranged on the same side (e.g., the -Z direction side) of the optical member (350). However, the shape of the optical member (350) is not limited, and may be, for example, a square column, a polygonal column, or a cylinder extending in a direction intersecting or perpendicular to the optical axis (O), and various other shapes are possible.

[0083] Referring to FIGS. 5 to 7, according to one embodiment, the first support member (360) may be configured to support the first side wall (351) of the optical member (350), and the second support member (370) may be configured to support the second side wall (352) of the optical member (350). According to one embodiment, the first support member (360) and the second support member (370) may maintain the optical member (350) in its original position or assembled position within the case (302). For example, the first support member (360) and the second support member (370) may prevent the reflective member (350) from being displaced or detached from its original position or assembled position due to an external impact, such as a drop of the electronic device (101).

[0084] In one embodiment, for example, the first support member (360) and the second support member (370) may at least partially contact the first side wall (351) and the second side wall (352), respectively. In one embodiment, the first support member (360) may include a first-first surface (360a), a first-second surface (360b), first-third surfaces (360c), and a first inclined surface (361). In one embodiment, the direction in which the first-first surface (360a) faces may be parallel to or parallel to the direction in which the first surface (350a) of the optical member (350) faces (e.g., the -Z direction). For example, the 1-2nd surface (360b) may be connected to the 1-1st surface (360a), and the direction in which the 1-1st surface (360a) faces (e.g., -X direction) may intersect with or be perpendicular to the direction in which the 1-1st surface (360a) faces. For example, the 1-3rd surfaces (360c) may be connected to the 1-1st surface (360a) and the 1-2nd surface (360b), and the direction in which the 1-3rd surfaces (360c) face (e.g., +Y direction or -Y direction) may intersect with or be perpendicular to the directions in which the 1-1st surface (360a) and the 1-2nd surface (360b) face. The first inclined surface (361) may be connected to the 1-1st surface (360a), the 1-2nd surface (360b), and the 1-3rd surfaces (360c). The first inclined surface (361) can be inclined with respect to the optical axis (O) and can be parallel or parallel to the first side wall (351) of the optical member (350). The first inclined surface (361) can support the first side wall (351) of the optical member (350) and, for example, can at least partially contact the first side wall (351).

[0085] According to one embodiment, the second support member (370) may include a 2-1 face (370a), a 2-2 face (370b), 2-3 faces (370c), and a first inclined face (371). According to one embodiment, the direction in which the 2-1 face (370a) faces may be parallel or parallel to the direction in which the second face (350b) of the optical member (350) faces (e.g., +Z direction). For example, the 2-2 face (370b) may be connected to the 2-1 face (370a), and the direction in which the 2-1 face (370a) faces (e.g., +X direction) may intersect or be perpendicular to the direction in which the 2-1 face (370a) faces. For example, the 2-3 faces (370c) may be connected to the 2-1 face (370a) and the 2-2 face (370b), and the direction in which the 2-3 faces (370c) face (e.g., +Y direction or -Y direction) may intersect or be perpendicular to the direction in which the 2-1 face (370a) and the 2-2 face (370b) face. The first inclined face (371) may be connected to the 2-1 face (370a), the 2-2 face (370b), and the 2-3 faces (370c). The first inclined face (371) may be inclined with respect to the optical axis (O), and may be parallel or parallel to the second side wall (352) of the optical member (350). The above first inclined surface (371) can support the second side wall (352) of the optical member (350) and, for example, can at least partially contact the second side wall (352).

[0086] According to one embodiment, the height (e.g., the height in the Z-axis direction) of the first support member (360) and / or the height (e.g., the height in the Z-axis direction) of the second support member (370) may be greater than or equal to the height (e.g., the height in the Z-axis direction) of the optical member (250). Referring to FIG. 6, according to one embodiment, the height (l1) of the first support member (360) and / or the height (l2) of the second support member (370) (e.g., the height in the Z-axis direction) may be greater than the height (d1) of the optical member (350) and in this case, the optical member (350) may be supported more stably compared to a case where the heights of the support members (360, 370) are less than or equal to the height of the optical member (350). According to one embodiment, the first support member (360) and the second support member (370) are supported by the assembly reference parts (311, 321) of the case (302) described below, thereby maintaining the arrangement or alignment between the lens group (330), the optical member (350), and the image sensor (340).

[0087] According to one embodiment, the case (302) may include a first assembly reference portion (311) surrounding at least a portion of the first support member (360) and a second assembly reference portion (321) surrounding at least a portion of the second support member (370). According to one embodiment, the first assembly reference portion (311) may be included in the first case (310). For example, the first assembly reference portion (311) may correspond to a portion of the first case (310) as illustrated in FIGS. 5 and 6, but this is not limiting, and for example, the first assembly reference portion (311) may be connected to the first case (310) as a separate member. According to one embodiment, the second assembly reference portion (321) may be included in the second case (320). For example, the second assembly reference part (321) may correspond to a part of the second case (320) as illustrated in FIGS. 5 and 6, but this is not limited thereto, and for example, the second assembly reference part (321) may be connected to the second case (320) as a separate member.

[0088] According to one embodiment, the first assembly reference portion (311) and the second assembly reference portion (321) can assist in vertical and horizontal alignment of the first support member (360) and the second support member (370) by providing a reference for the original position or assembly position of the first support member (360) and the second support member (370). In the present disclosure, “the first support member (360) and / or the second support member (370) are vertically and horizontally aligned” may mean that the edges of the first support member (360) and the second support member (370) that do not come into contact with the optical member (350) are arranged or aligned parallel or perpendicular to a vertical direction (e.g., a thickness direction or a Z-axis direction of the electronic device (101)) or a horizontal direction (e.g., a length direction of the electronic device (101) (e.g., a Y-axis direction) and / or a width direction of the electronic device (101) (e.g., an X-axis direction). According to one embodiment, when the first support member (360) and the second support member (370) are vertically and horizontally aligned, the optical member (350) can be arranged at a pre-designed assembly position.

[0089] According to one embodiment, the first assembly reference portion (311) can be in contact with the first support member (360) on two or more sides. For example, the number of sides of the first assembly reference portion (311) and the sides of the first support member (360) that are in contact with each other may be three or more sides (e.g., four sides). According to one embodiment, the first assembly reference portion (311) can support and / or be in contact with the first-first side (360a), the first-second side (360b), and / or the first-third sides (360c) of the first support member (360) shown in FIG. 7. For example, the first assembly reference portion (311) and the first support member (360) can be supported by frictional force without a separate bonding member (e.g., adhesive) interposed therebetween, and according to one embodiment, a separate bonding member (e.g., adhesive) may be disposed therebetween.

[0090] According to one embodiment, the second assembly reference portion (321) can be in contact with the second support member (370) on two or more surfaces. For example, the number of surfaces of the second assembly reference portion (321) and the first support member (370) that are in contact with each other may be three or more (e.g., four surfaces). According to one embodiment, the second assembly reference portion (321) can support and / or be in contact with the second-first surface (370a), the second-second surface (370b), and the second-third surfaces (370c) of the second support member (370) shown in FIG. 7. For example, the second assembly reference portion (321) and the second support member (370) may be supported by frictional force without a separate bonding member (e.g., adhesive) interposed therebetween, and according to one embodiment, a separate bonding member (e.g., adhesive) may be disposed therebetween.

[0091] FIG. 8A is a perspective view illustrating a first case, an optical member, and support members of an optical assembly according to an embodiment of the present disclosure. FIG. 8B is a side cross-sectional view taken along line B-B' of FIG. 8A according to an embodiment of the present disclosure. FIG. 8C is a side cross-sectional view taken along line C-C' of FIG. 8A according to an embodiment of the present disclosure. FIG. 9A is a perspective view of an optical assembly according to an embodiment of the present disclosure. FIG. 9B is a plan view of an optical assembly according to an embodiment of the present disclosure. FIG. 9C is a side cross-sectional view of an optical assembly according to an embodiment of the present disclosure.

[0092] All or part of the configuration of the optical assembly (301) according to the embodiments of FIGS. 8A to 9C may be identical or similar to the configuration of the optical assembly (301) according to the embodiments of FIGS. 5 to 7. The first case (310) and the second case (320), the lens group (330), the optical member (350), and the image sensor (340) of the case (302) according to the embodiments of FIGS. 8A to 9C may be referred to as the first case (310) and the second case (320), the lens group (330), the optical member (350), and the image sensor (340) of the case (302) according to the embodiments of FIGS. 5 to 7.

[0093] Referring to FIGS. 8A to 8C, according to one embodiment, the first case (310) of the case (302) can support the lens group (330) and the optical member (350) by at least partially surrounding the lens group (330) and the optical member (350). According to one embodiment, the second case (320) can support the image sensor (340) and the optical member (350) by at least partially surrounding the image sensor (340) and the optical member (350). According to one embodiment, the first case (310) can include a first portion (310a) surrounding a first surface (350) of the optical member (350) and a second portion (310b) extending outward from the first portion (310a). The first part (310a) of the first case (310) may include a lens support member (3111) that supports the lens group (330) in a lateral direction (e.g., in the X-axis and / or Y-axis direction). According to one embodiment of FIGS. 8b and 8c , a step may exist between the first part (310a) and the second part (310b). For example, the second part (310b) may include a step structure (312) that surrounds at least a portion of the second support member (370). However, the shape of the first case (310) is only an example and is not limiting, and as an example, the first case (310) may be configured to surround at least a portion of the first support member (360).

[0094] Referring to FIGS. 9A to 9C , according to one embodiment, the second case (320) of the case (302) can support at least a portion of the first support member (360) by surrounding it. A portion of the second case (320) can be spaced apart from the outside of the second support member (370). According to one embodiment, the second case (320) can include a region that engages with the first case (310) and is assembled with the first case (310) to form the case (310), thereby protecting and supporting other components of the optical assembly (301) (e.g., lens group (330), optical member (350), and support members (360, 370)) and maintaining alignment of the components. However, the shape of the second case (320) is only an example and is not limiting, and as an example, the second case (320) may be configured to surround at least a portion of the second support member (370).

[0095] FIGS. 10A to 10C are drawings for explaining the assembly structure of an optical assembly according to one embodiment. FIGS. 11A to 11C are drawings for explaining the assembly structure of an optical assembly according to one embodiment.

[0096] The optical assembly (301) according to the embodiments of FIGS. 10a to 11c may be referred to as the optical assembly (301) according to the embodiments of FIGS. 5 to 9c.

[0097] Referring to FIGS. 10A and 10B, the second case (320) can be coupled or assembled while the first case (310), the optical member (350), the first support member (360), and the second support member (370) of the optical assembly (301) are coupled or assembled. For example, the step structure (e.g., the step structure (312) of FIGS. 8B and 8C) of the first case (310) can guide the assembly positions of the optical member (350), the first support member (360), and the second support member (370) with respect to the first case (310). For example, the step structure (e.g., the step structure (312) of FIGS. 8B and 8C) of the first case (310) can strengthen the bonding force between the optical member (350), the first support member (360), and the second support member (370). Referring to FIG. 10c, when the first case (310), the second case (320), the optical member (350), the first support member (360), and the second support member (370) are combined or assembled, the lens group (330) can be combined or assembled to the lens support member (3111) of the first case (310).

[0098] Referring to FIGS. 11A and 11B, the first case (310) can be coupled or assembled while the second case (320), the optical member (350), the first support member (360), and the second support member (370) of the optical assembly (301) are coupled or assembled. For example, the inner hole of the second case (320) can be configured to guide the assembly positions of the optical member (350), the first support member (360), and the second support member (370) with respect to the first case (310). Referring to FIG. 11C, the lens group (330) can be coupled or assembled to the lens support part (3111) of the first case (310) while the first case (310), the second case (320), the optical member (350), the first support member (360), and the second support member (370) are coupled or assembled.

[0099] FIG. 12A is a schematic diagram illustrating a portion of an optical assembly according to one embodiment. FIG. 12B is a schematic diagram illustrating a portion of an optical assembly according to one embodiment. FIG. 13A is a schematic diagram illustrating a portion of an optical assembly according to one embodiment. FIG. 13B is a schematic diagram illustrating a portion of an optical assembly according to one embodiment.

[0100] The lens group (330), optical member (350; 450) and image sensor (340) of FIGS. 12A to 13B may be included in the optical assembly (301) of the embodiment of FIGS. 5 to 11C. The lens group (330), optical member (350) and image sensor (340) of the embodiment of FIGS. 12A and 12B may be referred to as the lens group (330), optical member (350) and image sensor (340) of FIGS. 5 to 11C. The lens group (330) and image sensor (340) of the embodiment of FIGS. 13A and 13B may be referred to as the lens group (330) and image sensor (340) of FIGS. 5 to 11C. The optical member (450) of FIGS. 13a and 13b may have features identical or similar to those of the optical member (350) of FIGS. 5 to 12b, except for the shape.

[0101] Referring to FIGS. 12A and 12B , according to one embodiment, the optical member (350) may have a cross-section parallel to the YZ plane in the shape of a parallelogram, in which case the first side wall (351) and the second side wall (352) of the optical member (350) may be parallel or parallel to each other. When the first side wall (351) and the second side wall (352) are parallel or parallel to each other, the lens group (330) and the image sensor (340) may be arranged on different sides (e.g., opposite sides) of the optical member (350).

[0102] According to one embodiment, the reflective member (350) may be configured to reflect light incident from the lens group (330) at least once. For example, when the angle (acute angle) that the side walls (351, 352) form with respect to a plane (e.g., XY plane) perpendicular to the optical axis (O) decreases, the reflection angle of light on the inner reflective surfaces of the side walls (351, 352) may decrease, and the number of times that light is reflected within the reflective member (350) may increase. Here, the reflection angle may mean the angle that the direction in which light is reflected from the reflective surfaces of the side walls (351, 352) forms with a normal line perpendicular to the inner reflective surfaces of the side walls (351, 352). The angle (e.g., 45 degrees) formed by the first side wall (351) and the second side wall (352) of the embodiment of FIG. 12a with respect to a plane (e.g., XY plane) perpendicular to the optical axis (O) may be greater than the angle (e.g., about 20 degrees to about 35 degrees) formed by the first side wall (351) and the second side wall (352) of the embodiment of FIG. 12b with respect to a plane (e.g., XY plane) perpendicular to the optical axis (O). Accordingly, the number of times (e.g., 2 times) that light is reflected within the reflective member (350) of the embodiment of FIG. 12a may be less than the number of times (e.g., 4 times) that light is reflected within the reflective member (350) of the embodiment of FIG. 12b. In the present disclosure, the inclination of the side walls (351, 352) of the reflective member (350), the number of times that light is reflected within the reflective member (350), and the path of light traveling within the reflective member (350) are merely examples and may be changed.

[0103] Referring to FIGS. 13A and 13B , according to one embodiment, the optical member (350) may have a trapezoidal cross-section parallel to the YZ plane, in which case the first side wall (351) and the second side wall (352) may form a non-zero angle with respect to each other, and the lens group (330) and the image sensor (340) may be arranged on the same side (e.g., the -Z direction side) of the optical member (350). In the present disclosure, the shape of the optical member (350) is not limited, and may be, for example, a square pillar, a polygonal pillar, or a cylinder extending in a direction intersecting or perpendicular to the optical axis (O), and various other shapes are possible.

[0104] According to one embodiment, the reflective member (450) may be configured to reflect light incident from the lens group (430) at least once. For example, when the angle (acute angle) that the side walls (451, 452) form with respect to a plane (e.g., XY plane) perpendicular to the optical axis (O) decreases, the reflection angle of light on the reflective surfaces on the inner sides of the side walls (451, 452) may decrease, and the number of times that light is reflected within the reflective member (450) may increase. Here, the reflection angle may mean the angle that the direction in which light is reflected from the reflective surfaces of the side walls (451, 452) forms with a normal line perpendicular to the reflective surfaces on the inner sides of the side walls (451, 452). The angle (e.g., 45 degrees) formed by the first side wall (451) and the second side wall (452) of the embodiment of FIG. 13a with respect to a plane (e.g., XY plane) perpendicular to the optical axis (O) may be greater than the angle (e.g., about 20 degrees to about 35 degrees) formed by the first side wall (451) and the second side wall (452) of the embodiment of FIG. 13b with respect to a plane (e.g., XY plane) perpendicular to the optical axis (O). Accordingly, the number of times (e.g., 2 times) that light is reflected within the reflective member (450) of the embodiment of FIG. 13a may be less than the number of times (e.g., 4 times) that light is reflected within the reflective member (450) of the embodiment of FIG. 13b. In the present disclosure, the inclination of the side walls (451, 452) of the reflective member (450), the number of times that light is reflected within the reflective member (450), and the path of light traveling within the reflective member (450) are merely examples and may be changed.

[0105] The challenges addressed by this disclosure are not limited to the aforementioned challenges, and may be further defined without departing from the spirit and scope of this disclosure. The benefits achieved by this disclosure are not limited to the aforementioned benefits, and various benefits may be directly or indirectly realized through this document.

[0106] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a case (302), a lens group (320) disposed in a portion of the case and including at least one lens aligned with an optical axis (O), an image sensor (340) disposed within the case and configured to detect light passing through the lens group, and a reflective member (350; 450) disposed within the case between the lens group and the image sensor and configured to change a path of light passing through the lens group toward the image sensor. The reflective member may include a first side wall (351; 451) inclined with respect to the optical axis of the lens group and a second side wall (351; 451) disposed opposite the first side wall of the reflective member. The electronic device may include a first support member (360) configured to contact a portion of the case and support the first side wall, and a second support member (370) configured to contact a portion of the case and support the second side wall.

[0107] According to one embodiment, the case may include a first assembly reference portion (311) surrounding at least a portion of the first support member.

[0108] In one embodiment, the inner surface of the first assembly reference portion can be in contact with two or more surfaces of the first support member.

[0109] According to one embodiment, the case may further include a first case (310) that supports the lens group.

[0110] The above first assembly reference part may be connected to the first case or may form a part of the first case.

[0111] According to one embodiment, the case may include a second assembly reference portion (321) surrounding at least a portion of the second support member.

[0112] In one embodiment, the surfaces of the second assembly reference portion may be in contact with two or more surfaces of the second support member.

[0113] According to one embodiment, the case may further include a second case (320).

[0114] The second case may be configured to move the image sensor in a direction parallel to the optical axis of the lens group or in a direction intersecting the optical axis.

[0115] In one embodiment, the second assembly reference portion may be connected to the second case or may form a part of the second case.

[0116] In one embodiment, the second sidewall may be parallel to the first sidewall or inclined with respect to the first sidewall.

[0117] According to one embodiment, the first support member may include a first inclined surface (361) that contacts an outer surface of the first side wall and is inclined with respect to the optical axis.

[0118] According to one embodiment, the second support member may include a second inclined surface (371) that contacts the outer surface of the second side wall and is inclined with respect to the optical axis.

[0119] According to one embodiment, the first side wall of the optical member may include a first reflective surface (351) configured to reflect light passing through the lens group toward the interior of the optical member.

[0120] According to one embodiment, the second side wall of the optical member may include a second reflective surface (352) configured to reflect light passing through the interior of the optical member toward the image sensor.

[0121] In one embodiment, the second sidewall may be closer to the image sensor than to the first sidewall.

[0122] In one embodiment, the image sensor may be positioned to face at least a portion of the lens group with the optical member therebetween.

[0123] According to one embodiment of the present disclosure, an optical assembly (301) may be provided. The optical assembly may include a case (302), a lens group (320) disposed in a portion of the case and including at least one lens aligned with an optical axis (O), an image sensor (340) disposed within the case and configured to detect light passing through the lens group, a reflective member (350; 450) disposed within the case between the lens group and the image sensor and configured to change a path of light passing through the lens group toward the image sensor, and a first support member (360) and a second support member (370) disposed on opposite sides of the optical member, respectively. The case may include a first assembly reference member (311) surrounding at least a portion of the first support member and a second assembly reference member (321) surrounding at least a portion of the second support member.

[0124] According to one embodiment, the optical member may include a first side wall (351; 451) inclined with respect to the optical axis (O) of the lens group and a second side wall (351; 451) disposed opposite the first side wall of the optical member. The first support member may support the first side wall, and the second support member may support the second side wall.

[0125] In one embodiment, the surfaces of the first assembly reference portion may be in contact with two or more surfaces of the first support member. The inner surface of the second assembly reference portion may be in contact with two or more surfaces of the second support member.

[0126] In one embodiment, the case may further include a first case (310) supporting the lens group. The first assembly reference part may be connected to the first case or may form a part of the first case.

[0127] In one embodiment, the case may further include a second case (320) configured to move the image sensor in a direction parallel to the optical axis of the lens group or in a direction intersecting the optical axis. The second assembly reference part may be connected to the second case or may form a part of the second case.

[0128] The optical assembly of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0129] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0130] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0131] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0132] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0133] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0134] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0135] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), Case (302); A lens group (330) comprising at least one lens arranged in a part of the above case and aligned along an optical axis (O); An image sensor (340) arranged within the case and configured to detect light passing through the lens group; An optical member (350; 450) arranged between the lens group and the image sensor within the case and configured to change the path of light passing through the lens group toward the image sensor, the optical member including a first side wall (351; 451) inclined with respect to the optical axis (O) and a second side wall (351; 451) arranged on the opposite side of the first side wall of the optical member; A first support member (360) configured to contact a portion of the case and support the first side wall; and An electronic device comprising a second support member (370) configured to contact a portion of the case and support the second side wall.

2. In paragraph 1, An electronic device, wherein the case comprises a first assembly reference member (311) surrounding at least a portion of the first support member.

3. In paragraph 2, An electronic device, wherein the surfaces of the first assembly reference portion are in contact with two or more surfaces of the first support member.

4. In paragraph 2 or 3, The above case further includes a first case (310) supporting the above lens group, An electronic device, wherein the first assembly reference portion is connected to the first case or forms a part of the first case.

5. In any one of paragraphs 1 to 4, An electronic device, wherein the case includes a second assembly reference member (321) surrounding at least a portion of the second support member.

6. In paragraph 5, An electronic device, wherein the surfaces of the second assembly reference portion are in contact with two or more surfaces of the second support member.

7. In clause 5 or 6, The above case further includes a second case (320), The second case is an electronic device configured to move the image sensor in a direction parallel to the optical axis of the lens group or in a direction intersecting the optical axis.

8. In paragraph 7, An electronic device, wherein the second assembly reference portion is connected to the second case or forms a part of the second case.

9. In any one of paragraphs 1 to 8, An electronic device wherein the second side wall is parallel to the first side wall or is inclined with respect to the first side wall.

10. In any one of paragraphs 1 to 9, An electronic device, wherein the first support member includes a first inclined surface (361) that contacts an outer surface of the first side wall and is inclined with respect to the optical axis.

11. In any one of paragraphs 1 to 10, An electronic device, wherein the second support member includes a second inclined surface (371) that is in contact with an outer surface of the second side wall and is inclined with respect to the optical axis.

12. In any one of paragraphs 1 to 11, The first side wall of the optical member includes a first reflective surface (351) configured to reflect light passing through the lens group toward the interior of the optical member, An electronic device, wherein the second side wall of the optical member includes a second reflective surface (352) configured to reflect light passing through the interior of the optical member toward the image sensor.

13. In any one of paragraphs 1 to 12, An electronic device wherein the second sidewall is closer to the image sensor than to the first sidewall.

14. In any one of paragraphs 1 to 12, An electronic device wherein the image sensor is positioned to face at least a portion of the lens group with the optical member therebetween.

15. In the optical assembly (301), Case (302); A lens group (330) comprising at least one lens arranged in a part of the above case and aligned along an optical axis (O); An image sensor (340) arranged within the case and configured to detect light passing through the lens group; An optical member (350; 450) arranged between the lens group and the image sensor within the case and configured to change the path of light passing through the lens group toward the image sensor; and It includes a first support member (360) and a second support member (370) respectively arranged on opposite sides of the optical member, An optical assembly, wherein the case comprises a first assembly reference member (311) surrounding at least a portion of the first support member and a second assembly reference member (321) surrounding at least a portion of the second support member.

Images