Resin molding device and method for producing resin molded article

Abstract

The present invention improves the throughput of resin molding by efficiently transporting a molding object. The present invention comprises: a transport mechanism 2 that transports a pre-molding substrate W into molding dies 7A, 7B and transports a resin molded article P out from the molding dies 7A, 7B; a first transfer stage 3 on which the pre-molding substrate W is transferred; a second transfer stage 4 on which the resin molded article P is transferred; a supply mechanism 5 for supplying the pre-molding substrate W to the first transfer stage 3; and a recovery mechanism 6 for recovering the resin molded article P from the second transfer stage 4. The transport mechanism 2 has a pre-molding transport part 21 for transporting the pre-molding substrate W from the first transfer stage 3 into the molding dies 7A, 7B, and a post-molding transport part 22 for transporting the resin molded article P out from the molding dies 7A, 7B to the second transfer stage 4. The first transfer stage 3 and the second transfer stage 4 are arranged side by side. The pre-molding transport part 21 and the post-molding transport part 22 are arranged side by side in correspondence with the first transfer stage 3 and the second transfer stage 4.

Description

Resin molding device and method for manufacturing resin molded product

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

[0002] A resin molding apparatus for compression molding a plurality of workpieces has been proposed, as disclosed in Patent Document 1. This resin molding apparatus has a structure in which a workpiece transport mechanism moves back and forth between a workpiece supply and storage section and a press section. Specifically, the workpiece transport mechanism removes molded workpieces and supplies unmolded workpieces as it moves toward and away from an open compression molding die.

[0003] Japanese Patent Application Laid-Open No. 2019-136943

[0004] The above-mentioned resin molding device performs a series of operations in which the work transport mechanism receives the work from the work supply storage section, then moves to the press section, removes the molded work from the press section, supplies the work before molding, and stores the received molded work in the work supply storage section.

[0005] Incidentally, in order to improve the throughput of resin molding, it is possible to increase the movement speed of the work transport mechanism to speed up the transport of work before and after molding between the work supply and storage section and the press section.

[0006] However, there is a limit to how fast the work transport mechanism can move, and the more workpieces the work transport mechanism transports at one time, the longer it takes to supply the workpieces from the work supply and storage unit to the work transport mechanism, which hinders improvements in throughput.

[0007] SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and its main object is to improve the throughput of resin molding by efficiently transporting molding objects.

[0008] In other words, the resin molding apparatus of the present invention is a resin molding apparatus that performs resin molding on a molding object, and is equipped with a molding mold, a transport mechanism that transports the molding object before molding into the molding mold and transports the molding object after molding out of the molding mold, a first transfer and loading stage onto which the molding object before molding that is handed over to the transport mechanism is transferred, a second transfer and loading stage onto which the molding object after molding transported by the transport mechanism is transferred, a supply mechanism that supplies the molding object before molding to the first transfer and loading stage, and a recovery mechanism that recovers the molding object after molding from the second transfer and loading stage, and the transport mechanism has a pre-molding transport section that transports the molding object before molding from the first transfer and loading stage to the molding mold, and a post-molding transport section that transports the molding object after molding from the molding mold to the second transfer and loading stage, and the first transfer and loading stage and the second transfer and loading stage are arranged side by side, and the pre-molding transport section and the post-molding transport section are arranged side by side corresponding to the first transfer and loading stage and the second transfer and loading stage.

[0009] According to the present invention configured as described above, the throughput of resin molding can be improved by efficiently transporting molding objects.

[0010] FIG. 1 is a schematic diagram showing the configuration of a resin molding apparatus according to an embodiment of the present invention; (a) a front view and (b) a side view showing the configuration of a resin molding module according to the embodiment; (a) a schematic diagram showing a lever mechanism and (b) a rack-and-pinion mechanism, which are modified examples of an interlocking mechanism; (b) a cross-sectional view showing the configuration of a molding die according to the embodiment; (c) a schematic diagram showing the configuration of a first transfer stage, a second transfer stage, and a transport mechanism according to the embodiment; (d) a schematic diagram showing the configuration of a substrate supply unit and a molded product storage unit according to the embodiment, and a diagram showing the supply operation of a pre-molded substrate and the recovery operation of a resin molded product between them and each transfer stage; (e) a schematic diagram showing the specific operational states of a supply mechanism, a recovery mechanism, and a transport mechanism according to the embodiment; (f) a schematic diagram showing the specific operational states of a supply mechanism, a recovery mechanism, and a transport mechanism according to the embodiment;

[0011] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0012] A resin molding apparatus according to Technology 1 of the present invention is a resin molding apparatus for resin molding an object to be molded, and comprises a mold, a transport mechanism for transporting the object to be molded before molding into the mold and for transporting the object to be molded after molding out of the mold, a first transfer stage onto which the object to be molded before being handed over to the transport mechanism is transferred, a second transfer stage onto which the object to be molded after molding transported by the transport mechanism is transferred, a supply mechanism for supplying the object to be molded before molding to the first transfer stage, and a recovery mechanism for recovering the object to be molded after molding from the second transfer stage, wherein the transport mechanism has a pre-molding transport section that transports the object to be molded from the first transfer stage into the mold, and a post-molding transport section that transports the object to be molded after molding from the mold to the second transfer stage, and the first transfer stage and the second transfer stage are arranged side by side, and the pre-molding transport section and the post-molding transport section are arranged side by side corresponding to the first transfer stage and the second transfer stage.

[0013] This resin molding apparatus can perform a loading / unloading operation, which includes loading the molding object from the first transfer stage to the mold and unloading it from the mold to the second transfer stage, and a supply / recovery operation, which includes supplying the molding object to the first transfer stage and recovering the molded molding object from the second transfer stage, separately. This allows for efficient transport of the molding object by performing the supply and recovery operations while the loading / unloading operations are being performed. As a result, the throughput of resin molding can be improved. In addition, if the first transfer stage and the second transfer stage are not provided, the molding object is supplied to a transport mechanism, which then transports the molding object to the molding mold. Furthermore, the transport mechanism unloads the molded molding object from the molding mold and recovers the unloaded molding object. With this configuration, the molding object cannot be supplied or recovered while the transport mechanism is performing loading or unloading. Furthermore, with the resin molding apparatus of Technology 1, the pre-molding conveying section can be configured to appropriately hold the molding object before molding, and the post-molding conveying section can be configured to appropriately hold the molding object after molding, allowing them to be stably conveyed. Furthermore, with the resin molding apparatus of Technology 1, the pre-molding conveying section and the post-molding conveying section are arranged side by side corresponding to the first transfer stage and the second transfer stage, so that with the conveying mechanism stopped at a predetermined position, the operation of supplying the molding object before molding from the first transfer stage to the pre-molding conveying section and the operation of transferring the molding object after molding from the post-molding conveying section to the second transfer stage can be performed simultaneously, allowing efficient conveyance of the molding object.

[0014] In addition to the configuration of the above-described technology 1, the resin molding apparatus of technology 2 according to the present invention preferably has the transport mechanism that performs loading by the pre-molding transport unit and unloading by the post-molding transport unit during one round trip between a transfer module including the first transfer stage and the second transfer stage and a molding module including the molding die. With this configuration, molding objects can be transported efficiently, and the throughput of resin molding can be improved.

[0015] As a specific arrangement of the first transfer stage and the second transfer stage, in the resin molding device of Technology 3 according to the present invention, in addition to the configuration of Technology 1 or 2 described above, it is desirable that the first transfer stage and the second transfer stage are arranged side by side along the transport direction of the transport mechanism.

[0016] As a specific embodiment for improving the throughput of resin molding, the resin molding device of Technology 4 according to the present invention, in addition to the configuration of any one of Technologies 1 to 3 described above, desirably, while the conveying mechanism is away from the first transfer stage and the second transfer stage, the supply mechanism supplies the molding object before molding to the first transfer stage, and the recovery mechanism recovers the molding object after molding from the second transfer stage.

[0017] A resin molding apparatus according to a fifth aspect of the present invention, in addition to the configuration of the third or fourth aspect, includes a plurality of molding molds arranged in a vertical direction, the transport mechanism having a plurality of pre-molding transport sections and a plurality of post-molding transport sections arranged in a vertical direction corresponding to the plurality of molding molds, the first transfer stage being provided in a plurality of positions corresponding to the plurality of pre-molding transport sections, and the second transfer stage being provided in a plurality of positions corresponding to the plurality of post-molding transport sections. This configuration allows a plurality of pre-molded objects to be simultaneously loaded into the plurality of molding molds arranged in a vertical direction, and a plurality of post-molded objects to be simultaneously unloaded from the plurality of molding molds. Furthermore, the effects of providing the first and second transfer stages can be further enhanced.

[0018] In addition to the configuration of any one of the above-described techniques 1 to 5, the resin molding apparatus of technique 6 according to the present invention preferably has at least one of the first transfer stage and the second transfer stage configured to be movable in the vertical direction. With this configuration, if the first transfer stage is movable in the vertical direction, it is possible to reliably supply pre-molded objects to the transport mechanism. Furthermore, even if the transport mechanism (the pre-molding transport section) is located on the first transfer stage, it is possible to increase the vertical distance between the first transfer stage and the transport mechanism, thereby enabling the supply of pre-molded objects to the first transfer stage. On the other hand, if the second transfer stage is movable in the vertical direction, it is possible to reliably receive post-molded objects from the transport mechanism. Furthermore, even if the transport mechanism (the post-molding transport section) is located on the second transfer stage, it is possible to increase the vertical distance between the second transfer stage and the transport mechanism, thereby enabling the recovery of post-molded objects from the second transfer stage.

[0019] As a specific embodiment of the supply mechanism, in addition to the configuration of any one of the above-mentioned techniques 1 to 6, the resin molding device of technique 7 according to the present invention preferably has a molding object supply section that supplies the molding object before molding, and a molding object transfer section that transfers the molding object before molding from the molding object supply section to the first transfer stage.

[0020] As a specific embodiment of the recovery mechanism, in addition to the configuration of any one of the above-mentioned techniques 1 to 7, the resin molding device of technique 8 according to the present invention preferably has a molding object storage section that stores the molding object after molding, and a molding object recovery section that recovers the molding object after molding from the second transfer stage to the molding object storage section.

[0021] In a resin molding apparatus according to Technology 9 of the present invention, in addition to the configuration of Technology 8, which is based on Technology 7, it is desirable that the molding workpiece transfer section and the molding workpiece recovery section have a common transport robot that includes a holding unit that holds the molding workpiece and an articulated arm that moves the holding unit. With this configuration, the molding workpiece transfer section and the molding workpiece recovery section are configured from a common transport robot, which simplifies the configuration of the resin molding apparatus and reduces the installation space required for the resin molding apparatus.

[0022] A resin molding apparatus according to a tenth aspect of the present invention, in addition to the configuration of the seventh or ninth aspect, preferably includes: the molding object having an electronic component fixed to one surface; the molding object supply unit supplies the molding object before molding in a first state in which the electronic component is located on the upper side; the first transfer stage transfers the molding object before molding in a second state in which the electronic component is located on the lower side; and the molding object transfer unit holds the molding object supplied in the first state and transfers it to the first transfer stage in the second state. This configuration allows the molding object before molding to be stored in the first state, preventing dust from adhering to the back surface (the surface held by the mold) of the molding object before molding. As a result, poor appearance of the resin molded product can be prevented. Furthermore, since the molding object is in the second state on the first transfer stage, it can be transported to the mold by a transport mechanism in the second state, allowing the molding object before molding in the second state to be supplied to the upper mold of the mold.

[0023] The manufacturing method of a resin molded product according to Technology 11 of the present invention is a manufacturing method of a resin molded product using the resin molding apparatus of any one of Technologies 1 to 10 above, and is characterized by comprising a loading step of loading the pre-molded object into the molding die by the conveying mechanism, a molding step of clamping the molding die and performing resin molding on the pre-molded object, and an unloading step of unloading the molded object from the molding die by the conveying mechanism.

[0024] In addition to the configuration of the above-described Technology 11, the manufacturing method of a resin molded product according to Technology 12 of the present invention is preferably such that the loading step and the unloading step are performed by the conveying mechanism during one round trip between the first transfer stage and the second transfer stage and the molding die.

[0025] In addition to the configuration of Technique 11 or 12 described above, the manufacturing method for a resin molded product according to Technique 13 of the present invention is preferably such that, while the conveying mechanism is away from the first transfer stage and the second transfer stage, the supply mechanism supplies the molded object before molding to the first transfer stage, and the recovery mechanism recovers the molded object after molding from the second transfer stage.

[0026] <One embodiment of the present invention> Hereinafter, one embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. Note that in all of the drawings shown below, parts are appropriately omitted or exaggerated for clarity. Identical components are given the same reference numerals, and descriptions thereof will be omitted as appropriate.

[0027] <Overall Configuration of Resin Molding Apparatus> The resin molding apparatus 100 of the first embodiment resin-seals a substrate W, which is a molding object having electronic components Wx fixed to one surface, by resin molding using a resin material J to manufacture a resin molded product P. Note that, hereinafter, the molding object (substrate W) before resin molding will be referred to as a "pre-molding substrate W," and the molding object (substrate W) after resin molding will be referred to as a "molded substrate W" or a "resin molded product P."

[0028] Here, the substrate W is, for example, rectangular in plan view, and examples thereof include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc. Alternatively, the substrate W may be a carrier without wiring. The substrate W may also have other shapes, such as a circular shape, in plan view.

[0029] Examples of the resin material J include powdered or granular resin (including granular resin), liquid resin, etc. Examples of the electronic component Wx include electronic elements such as semiconductor chips, resistor elements, and capacitor elements, or electronic components in which at least one of these electronic elements is sealed with resin.

[0030] 1, the resin molding apparatus 100 includes, as its components, a substrate supply and storage module A, two resin molding modules B, and a resin material supply module C. Each component (each of modules A to C) is detachable and replaceable with respect to the other components.

[0031] 1, the substrate supply and storage module A includes a transport mechanism 2 that loads pre-molded substrates W into the molding dies 7A and 7B of the resin molding module B and loads molded substrates W (resin molded products P) out of the molding dies 7A and 7B, a first transfer stage 3 onto which the pre-molded substrates W handed over to the transport mechanism 2 are transferred, a second transfer stage 4 onto which the resin molded products P loaded by the transport mechanism 2 are transferred, a supply mechanism 5 that supplies pre-molded substrates W to the first transfer stage 3, and a recovery mechanism 6 that recovers the resin molded products P from the second transfer stage 4. The specific configuration of each part of the substrate supply and storage module A will be described later. The substrate supply and storage module A corresponds to a transfer module that includes the first transfer stage 3 and the second transfer stage 4.

[0032] As shown in Fig. 2, each resin molding module B has a plurality of molding dies 7A, 7B (two in Fig. 2) arranged in the vertical direction, a mold clamping mechanism 8 that clamps the plurality of molding dies 7A, 7B, and an interlocking mechanism 9 that interlocks the clamping and opening of the plurality of molding dies 7A, 7B. Here, the upper molding die is also referred to as the first molding die 7A, and the lower molding die is also referred to as the second molding die 7B.

[0033] Resin molding module B has a stationary platen 10, a movable platen 11 that can be raised and lowered by a mold clamping mechanism 8, and an intermediate plate 12 that is disposed between the stationary platen 10 and the movable platen 11. A first molding die 7A is disposed between the stationary platen 10 and the intermediate plate 12, and a second molding die 7B is disposed between the intermediate plate 12 and the movable platen 11. The intermediate plate 12 is supported so as to be slidable in the vertical direction by a pair of sidewall members 131, 132 to whose upper ends the stationary platen 10 is fixed. The pair of sidewall members 131, 132 are also provided on a base 14 and fix the stationary platen 10 at a predetermined height relative to the base 14.

[0034] The first mold 7A has a pair of upper and lower molds 71 ​​and 72. The second mold 7B also has a pair of upper and lower molds 71 ​​and 72. The upper mold 71 of the first mold 7A is provided on the lower surface of the stationary platen 10, either directly or via another member. The lower mold 72 of the first mold 7A is provided on the upper surface of the intermediate plate 12, either directly or via another member. The upper mold 71 of the second mold 7B is provided on the lower surface of the intermediate plate 12, either directly or via another member. The lower mold 72 of the second mold 7B is provided on the upper surface of the movable platen 11, either directly or via another member. The movable platen 11 is moved up and down by a mold clamping mechanism 8 provided below the movable platen 11.

[0035] The first molding die 7A and the second molding die 7B will now be described with reference to Fig. 4. The upper die 71 of each molding die 7A, 7B sucks and holds the back surface of the substrate W (the surface on which the electronic components Wx are not fixed). A suction port (not shown) is formed in the lower surface of the upper die 71, and a suction flow path (not shown) connected to the suction port is formed inside the upper die 71. This suction flow path is connected to an external suction device (not shown).

[0036] The lower mold 72 of each molding die 7A, 7B has a cavity 72C that accommodates the electronic component Wx fixed to the substrate W and the resin material J. Specifically, the lower mold 72 has a bottom member 721 that forms the bottom surface of the cavity 72C and a frame-shaped side member 722 that surrounds the bottom member 721. The cavity 72C is formed by the upper surface of the bottom member 721 and the inner peripheral surface of the side member 722. The side member 722 is arranged to be movable up and down relative to the bottom member 721. Specifically, the side member 722 is supported by a base plate 723 of the lower mold 72 via a plurality of elastic members 724, such as coil springs. The lower mold 72 is covered with a release film F to improve the releasability of the resin molded product P. An air vent (not shown) may be provided on the upper surface of the side member 722 to discharge air or gas. In addition, around the upper mold 71 and the lower mold 72 in each molding die, a sealing structure 15 is provided, which consists of side walls and sealing members such as O-rings for drawing a vacuum around the upper mold 71 and the lower mold 72 during resin molding.

[0037] The mold clamping mechanism 8 of this embodiment is of a linear motion type that raises and lowers the movable platen using a ball screw mechanism that converts the rotation of a servo motor or the like into linear movement. Note that the mold clamping mechanism 8 may also be of a link type that transmits a power source such as a servo motor to the movable platen using a link mechanism such as a toggle link.

[0038] The interlocking mechanism 9 synchronizes the clamping and opening of the first molding die 7A and the second molding die 7B by interlocking the lifting and lowering of the intermediate plate 12 with the lifting and lowering of the movable platen 11. In other words, the interlocking mechanism 9 makes it possible to clamp the first molding die 7A and the second molding die 7B at the same clamping speed, while simultaneously clamping them.

[0039] The interlocking mechanism 9 shown in FIG. 2 is configured using a pantograph mechanism 91 that extends and retracts as the movable platen 11 rises and falls. The pantograph mechanism 91 includes one cross link portion 911, an upper end link portion 912, and a lower end link portion 913. The upper end link portion 912 is fixed to the upper ends of a pair of side wall members 131, 132, and the lower end link portion 913 is fixed to the movable platen 11 or a fixing member 110 that moves together with the movable platen 11. A rotation shaft 911a of the cross link portion 911 is fixed to the intermediate plate 12 or a fixing member 120 that moves together with the intermediate plate 12. When the movable platen 11 is driven by the mold clamping mechanism 8, the pantograph mechanism 91 extends and retracts accordingly, and the intermediate plate 12, connected to the cross link portion 911, moves up and down together with the movable platen 11.

[0040] As a modified example of the interlocking mechanism 9, as shown in FIG. 3(a), it may be one using a lever mechanism or one using a rack and pinion mechanism.

[0041] 3A, the interlocking mechanism 9 using a lever mechanism has an arm 92 that rotates around a fulcrum 92a at one end, and the movable platen 11 and the intermediate plate 12 are connected to the arm 92 via connecting members 93a and 93b at different positions on the arm 92. When the movable platen 11 is driven by the mold clamping mechanism 8, the arm 92 rotates around the fulcrum 92a accordingly, and the intermediate plate 12 connected to the arm 92 moves up and down in conjunction with the movable platen 11.

[0042] 3B, the interlocking mechanism 9 using a rack and pinion mechanism has a pair of rack gears 94a, 94b and a pinion gear 94c that meshes with the rack gears 94a, 94b, with one rack gear 94a provided on the side wall members 131, 132 and the other rack gear 94b provided on the movable platen 11 side. The pinion gear 94c that meshes with the pair of rack gears 94a, 94b is provided on the intermediate plate 12 side. By rotating the pinion gear 94c forward or backward by a motor (not shown), the movable platen 11 and the intermediate plate 12 move up and down in an interlocking manner.

[0043] 1, the resin material supply module C has a moving table 16, a resin material accommodation unit 17 placed on the moving table 16, a resin material supply mechanism 18 that measures and supplies resin material J to the resin material accommodation unit 17, and a resin material transport mechanism 19 that transports the resin material accommodation unit 17 and supplies resin material J to the cavity 72C of the lower mold 72. Here, the resin material accommodation unit 17 is configured using a holding frame that holds a release film F, and the resin material J is supplied by the resin material supply mechanism 18 onto the release film F held by the holding frame.

[0044] The moving table 16 moves within the resin material supply module C between a resin supply position by a resin material supply mechanism 18 and a transport position for transferring the resin material accommodation unit 17 to a resin material transport mechanism 19 .

[0045] Furthermore, the resin material transport mechanism 19 transports the resin material accommodation section 17 containing the resin material J from the resin material supply module C to the resin molding module B, and supplies the release film F and the resin material J to the lower mold 72 of the molding dies 7A and 7B in the resin molding module B. Thereafter, the resin material transport mechanism 19 transports the resin material accommodation section 17 after the resin material J has been supplied from the resin molding module B to the resin material supply module C.

[0046] The resin material transport mechanism 19 of this embodiment has a resin material transport section 191 that transports the resin material accommodation section 17 that accommodates the resin material J, and a film recovery section 192 that recovers used release film F from the cavity 72C of the lower mold 72. Furthermore, the resin material transport mechanism 19 has a plurality of resin material transport sections 191 and a plurality of film recovery sections 192 in the vertical direction corresponding to the plurality of molding dies 7A, 7B.

[0047] <Specific configuration of each part of the substrate supply / storage module A> As shown in Figures 1, 5 and 6, the substrate supply / storage module A comprises a transport mechanism 2, a first transfer stage 3, a second transfer stage 4, a supply mechanism 5 and a recovery mechanism 6.

[0048] 1 , the transport mechanism 2 moves back and forth between the substrate supply / storage module A and the resin molding module B, and moves along rails (not shown) provided between the substrate supply / storage module A and the resin molding module B. This transport mechanism 2 receives the pre-molding substrate W temporarily placed (transferred) on the first transfer stage 3, and transports (carries in) it to the upper mold 71 of the resin molding module B. After the pre-molding substrate W has been resin molded, the transport mechanism 2 receives the resin molded product P from the upper mold 71 of the resin molding module B, and transports (carries out) it to the second transfer stage 4.

[0049] Specifically, as shown in Figures 1, 5, and 6, the transport mechanism 2 has a substrate transport section 21, which is a pre-molding transport section that transports the pre-molding substrate W, and a molded product transport section 22, which is a post-molding transport section that transports the resin molded product P. The substrate transport section 21 may be provided with positioning pins (not shown) that are inserted into positioning holes formed in the pre-molding substrate W. The transport mechanism 2 is configured so that the substrate transport section 21 and the molded product transport section 22 move simultaneously. In this embodiment, the substrate transport section 21 and the molded product transport section 22 are arranged side by side along the transport direction (here, the left-right direction). Here, the transport direction is also the movement direction of the transport mechanism 2.

[0050] 5 and 6, the transport mechanism 2 has a plurality of substrate transport sections 21 and a plurality of molded product transport sections 22 corresponding to the plurality of molding dies 7A, 7B arranged in the vertical direction. The plurality of substrate transport sections 21 are arranged in the vertical direction so that they can supply pre-molded substrates W to each upper die 71 of the plurality of molding dies 7A, 7B when the molds are opened. The plurality of molded product transport sections 22 are also arranged in the vertical direction so that they can receive resin molded products P from each upper die 71 of the plurality of molding dies 7A, 7B when the molds are opened. The height positions of the substrate transport sections 21 and molded product transport sections 22 corresponding to each upper die 71 are the same.

[0051] 1, 5, and 6, the first transfer stage 3 is a stage on which the pre-forming substrate W supplied by the supply mechanism 5 is temporarily placed (transferred) and which hands over the pre-forming substrate W to the transport mechanism 2. Here, the pre-forming substrate W is transferred to the first transfer stage 3 in a second state (so-called chip-down state) in which the electronic components Wx are on the bottom. The first transfer stage 3 has holding claws (not shown) that hook and hold the edges of the pre-forming substrate W in the second state, and holds the pre-forming substrate W in the second state by opening and closing the holding claws. The first transfer stage 3 may be provided with positioning pins (not shown) that are inserted into positioning holes formed in the pre-forming substrate W.

[0052] 5 and 6, a plurality of first transfer stages 3 are provided in the vertical direction corresponding to the plurality of substrate transfer units 21 in the transfer mechanism 2. Furthermore, the plurality of first transfer stages 3 are configured to be movable in the vertical direction. Here, the plurality of first transfer stages 3 are configured to be movable in the vertical direction in synchronization with one another.

[0053] 5 and 6 , the substrate supply / storage module A has a first support member 31 that supports a plurality of first transfer stages 3 so that they can move in the vertical direction, and a first guide mechanism 32 that guides the plurality of first transfer stages 3 in the vertical direction relative to the first support member 31. The first guide mechanism 32 has, for example, a first guide rail 321 provided on the first support member 31, and a first slide body 322 that supports the plurality of first transfer stages 3, for example, at equal intervals in the vertical direction, and moves along the first guide rail 321. The first slide body 322 moves on the first guide rail 321 by an actuator (not shown) that uses, for example, a ball screw mechanism, an air cylinder, or the like.

[0054] 1, 5, and 6, the second transfer stage 4 is a stage on which a resin-molded resin product P is temporarily placed (transferred) and receives the resin-molded product P from the transport mechanism 2. Here, the resin-sealed electronic component Wx is transferred to the second transfer stage 4 in a second state (so-called tip-up state) on the lower side. The second transfer stage 4 has holding claws (not shown) that hook and hold the edges of the resin-molded product P in the second state, and holds the resin-molded product P in the second state by opening and closing the holding claws.

[0055] 5 and 6, a plurality of second transfer stages 4 are provided in the vertical direction corresponding to the plurality of molded product transport sections 22 in the transport mechanism 2. Furthermore, the plurality of second transfer stages 4 are configured to be movable in the vertical direction. Here, the plurality of second transfer stages 4 are configured to be movable in the vertical direction in synchronization with one another.

[0056] 5 and 6 , the substrate supply / storage module A has a second support member 41 that supports a plurality of second transfer stages 4 so that they can move in the vertical direction, and a second guide mechanism 42 that guides the plurality of second transfer stages 4 in the vertical direction relative to the second support member 41. The second guide mechanism 42 has second guide rails 421 provided on the second support member 41 and second slide bodies 422 that support the plurality of second transfer stages 4, for example, at equal intervals in the vertical direction and move along the second guide rails 421. The second slide bodies 422 move on the second guide rails 421 by an actuator (not shown) that uses, for example, a ball screw mechanism, an air cylinder, or the like.

[0057] 1, 5, and 6, the first transfer stages 3 and the second transfer stages 4 are arranged side by side in the left-right direction and are at the same height. In other words, the first transfer stages 3 and the second transfer stages 4 are provided in accordance with the positional relationship of the substrate transport units 21 and the molded product transport units 22 of the transport mechanism 2. In this embodiment, since the substrate transport units 21 and the molded product transport units 22 are arranged side by side in the left-right direction, the first transfer stages 3 and the second transfer stages 4 are also arranged side by side in the left-right direction.

[0058] With this configuration, while the transport mechanism 2 makes one round trip between the substrate supply / storage module A and the resin molding module B, it can perform a loading operation to transport multiple pre-molded substrates W from the first transfer stage 3 to the upper mold 71, and a loading operation to transport multiple resin molded products P from the upper mold 71 to the second transfer stage 4.

[0059] As shown in Figures 1 and 6, the supply mechanism 5 has a substrate supply section 51, which is a molding object supply section that supplies pre-molding substrates W, and a molding object transfer section 52 that transfers the pre-molding substrates W from the substrate supply section 51 to the first transfer stage 3.

[0060] The substrate supply unit 51 includes a storage box 511 in which pre-molding substrates W are stored, and a take-out mechanism 512 that takes out the pre-molding substrates W from the storage box 511. The storage box 511 stores a plurality of pre-molding substrates W in multiple vertical tiers. The storage box 511 also stores the pre-molding substrates W in a first state (so-called tip-up state) in which the electronic components Wx are on the upper side. The storage box 511 is configured to be able to be taken out from the resin molding apparatus 100. The take-out mechanism 512 takes out one pre-molding substrate W from the storage box 511, for example, by clamping it, and positions the pre-molding substrate W in the first state on a pre-molding substrate stage 513 of the substrate supply unit 51. A guide rail 514 is provided between the storage box 511 and the pre-molding substrate stage 513.

[0061] The pre-forming substrate stage 513 may be configured to slide on the guide rails 514. In this case, with the pre-forming substrate stage 513 positioned near the storage box 511, the take-out mechanism 512 takes out the pre-forming substrate W from the storage box 511 and places the taken-out pre-forming substrate W on the pre-forming substrate stage 513. The pre-forming substrate stage 513, for example, holds the pre-forming substrate W by suction. Thereafter, the pre-forming substrate stage 513 moves along the guide rails 514 in a direction away from the storage box 511. In addition, the substrate supply unit 51 is provided with, for example, a confirmation mechanism (not shown) that confirms whether the electronic components Wx are properly arranged on the pre-forming substrate W. In this configuration, for example, while the pre-forming substrate stage 513 is moving on the guide rails 514, the confirmation mechanism confirms from above whether the electronic components Wx are properly arranged on the pre-forming substrate W. The confirmation mechanism is a laser displacement meter, a camera, or the like.

[0062] As shown in Figures 1 and 6, the recovery mechanism 6 has a molded product storage section 61, which is a molded product storage section that stores the resin molded product P, and a molded product recovery section 62 that recovers the resin molded product P from the second transfer stage 4 to the molded product storage section 61.

[0063] The molded product storage section 61 includes a storage box 611 for storing the resin molded products P and a storage mechanism 612 for storing the resin molded products P in the storage box 611. The storage box 611 stores multiple resin molded products P in multiple vertical layers. The storage box 611 stores the resin molded products P in a first state (so-called tip-up state) in which the resin-sealed electronic components Wx are on the upper side. The storage box 611 is configured to be removable from the resin molding apparatus 100. The storage mechanism 612 stores the resin molded product P in the first state in the storage box 611 by pushing it from the resin molded product stage 613 of the molded product storage section 61. A guide rail 614 is provided between the storage box 611 and the resin molded product stage 613.

[0064] The storage mechanism 612 may also sandwich the resin molded product P and move it to the vicinity of the storage box 611. In this case, after the resin molded product P has moved to the vicinity of the storage box 611, the resin molded product P is pushed by the storage mechanism 612 or the like to store it in the storage box 611.

[0065] 1, the substrate supply unit 51 and the molded product storage unit 61 are shown arranged side by side in the front-to-rear direction for the sake of convenience, but in order to reduce the installation space required for the resin molding apparatus 100 (substrate supply / storage module A), the substrate supply unit 51 and the molded product storage unit 61 in this embodiment are arranged one above the other, as shown in FIG. 6. Note that either the substrate supply unit 51 or the molded product storage unit 61 may be arranged on top. Furthermore, the substrate supply unit 51 and the molded product storage unit 61 may be arranged side by side.

[0066] 1, the molding object transfer section 52 and the molding object recovery section 62 of this embodiment are configured from a common transport robot 20. This common transport robot 20 delivers pre-molding substrates W between the substrate supply section 51 and the first transfer stage 3, and delivers resin molded products P between the second transfer stage 4 and the molded product storage section 61. In a plan view, this transport robot 20 is provided between the substrate supply section 51 and the molded product storage section 61 and each of the transfer stages 3 and 4.

[0067] Specifically, the transport robot 20 has a holding unit 20a that holds the pre-molding substrate W and the resin molded product P, respectively, and an articulated arm 20b that moves the holding unit 20a.

[0068] The holding unit 20a has holding claws (not shown) that hook onto and hold the edges of the pre-molded substrate W and the resin molded product P, and by opening and closing the holding claws, the pre-molded substrate W and the resin molded product P are held, respectively.

[0069] The articulated arm unit 20b is, for example, a vertical articulated robot (for example, an articulated robot having six joints). The articulated arm unit 20b can control the position and posture of the holding unit 20a. Specifically, the articulated arm unit 20b can turn the holding unit 20a, which holds the pre-molding substrate W or the resin molded product P, upside down. The articulated arm unit 20b also moves the holding unit 20a between the substrate supply unit 51 and the first transfer stage 3, and between the molded product storage unit 61 and the second transfer stage 4.

[0070] The transport robot 20 then holds the pre-molding substrate W supplied to the pre-molding substrate stage 513 in the first state, changes it to the second state, and delivers it to the first transfer stage 3. The transport robot 20 also holds the resin molded product P transferred to the second transfer stage 4 in the second state, changes it to the first state, and delivers it to the resin molded product stage 613 of the molded product storage unit 61.

[0071] <Example of Operation of Resin Molding Apparatus 100> Next, an example of operation of the resin molding apparatus 100 will be described with reference to Figures 1, 2, and 4. The operation described below is performed by a control unit COM provided in, for example, the substrate supply / storage module A, controlling each unit of the resin molding apparatus 100. The control unit COM is a dedicated or general-purpose computer having a CPU, internal memory, an input / output interface, an AD converter, etc.

[0072] <Overall Operation> First, with the mold clamping mechanism 8 opening the molds 7A and 7B, the transport mechanism 2 transports and holds the pre-molded substrate W into the upper mold 71 of each mold 7A and 7B (see FIGS. 1 and 2). The resin material transport mechanism 19 then places the release film F and resin material J into the cavity 72C of the lower mold 72 of each mold 7A and 7B (see FIG. 1). In this way, the pre-molded substrate W, release film F, and resin material J are supplied to each mold 7A and 7B (see FIG. 4). The resin material J is thermosetting. While contained in the cavity 72C, the resin material J is heated by a heating mechanism (not shown). This temporarily reduces the viscosity of the resin material J.

[0073] Next, the movable platen 11 is raised by the mold clamping mechanism 8. As the movable platen 11 rises, the pantograph mechanism 91 contracts, and the intermediate plate 12 connected to the rotation shaft 911a of the cross link portion 911 of the pantograph mechanism 91 rises. As the movable platen 11 rises, the periphery of the upper mold 71 and the lower mold 72 is sealed by the sealing structure 15 shown in FIG. 4, and a vacuum is drawn around the periphery of the upper mold 71 and the lower mold 72 by a vacuum pump (not shown).

[0074] Thereafter, the mold clamping mechanism 8 further raises the movable platen 11, thereby completing the clamping of the first molding die 7A and the second molding die 7B, and by maintaining this state for a preset time, the temperature of the resin material J rises and the resin material J hardens. After the set time has elapsed, the resin molding is completed.

[0075] After this resin molding, the mold clamping mechanism 8 lowers the movable platen 11, thereby opening the molding dies 7A and 7B. Then, the substrate supply and storage module A stores the resin molded product P in the molded product storage section 61 (see FIG. 1). Note that a thermoplastic material may be used as the resin material J. In this case, the resin material J is hardened by cooling.

[0076] <Specific Operations of Supply Mechanism 5, Recovery Mechanism 6, and Transport Mechanism 2> Next, the transport operations of the supply mechanism 5, recovery mechanism 6, and transport mechanism 2 will be described with reference to FIGS.

[0077] First, the pre-forming substrate W is placed on the pre-forming substrate stage 513 from the storage box 511 of the substrate supply unit 51 by the take-out mechanism 512 (see FIG. 6 ). Here, on the pre-forming substrate stage 513, the pre-forming substrate W is in a first state (a so-called tip-up state).

[0078] The articulated arm section 20b of the transport robot 20 moves the holding unit 20a to the pre-shaping substrate stage 513. Then, the holding unit 20a holds the pre-shaping substrate W on the pre-shaping substrate stage 23. Thereafter, the articulated arm section 20b moves the holding unit 20a to the first transfer stage 3 while turning it over. Then, the holding unit 20a delivers the pre-shaping substrate W in the second state to the first transfer stage 3 (see FIG. 6).

[0079] The supply mechanism 5 performs the supply operation for each of the plurality of first transfer stages 3 , whereby the pre-forming substrates W are supplied to each of the plurality of first transfer stages 3 .

[0080] Next, the transport mechanism 2 moves the plurality of substrate transport units 21 to the plurality of first transfer stages 3 (see FIG. 7(a)). At this time, the plurality of first transfer stages 3 are in a raised position by the first guide mechanism 32 (see FIG. 7(b)). The plurality of first transfer stages 3 are then lowered by the first guide mechanism 32 to a predetermined substrate transfer position (see FIG. 8(a)). Thereafter, the plurality of substrate transport units 21 simultaneously receive the plurality of pre-molding substrates W in the second state from the plurality of first transfer stages 3 (see FIG. 8(b)).

[0081] Here, as the multiple substrate transport units 21 move to the multiple first transfer stages 3, the multiple molded product transport units 22 move to the multiple second transfer stages 4 (see FIG. 7(a)). At this time, the multiple second transfer stages 4 are in a raised position by the second guide mechanism 42 (see FIG. 7(b)). Then, the multiple second transfer stages 4 are lowered to a predetermined molded product receiving position by the second guide mechanism 42 (see FIG. 8(a)). Thereafter, if the multiple molded product transport units 22 are holding multiple resin molded products P, the multiple molded product transport units 22 deliver the multiple resin molded products P in the second state to the multiple second transfer stages 4 all at once (see FIG. 8(b)).

[0082] Then, when the operation of supplying the pre-molding substrate W to the transport mechanism 2 is completed, the first transfer stages 3 are raised by the first guide mechanism 32 (see FIG. 9(a)). Furthermore, when the operation of transferring the resin molded product P to the second transfer stages 4 is completed, the second transfer stages 4 are raised by the second guide mechanism 42 (see FIG. 9(a)).

[0083] Then, the transport mechanism 2 moves the multiple substrate transport units 21, while each unit is holding a plurality of pre-molded substrates W, to the multiple opened molding dies 7A, 7B (see Figure 9 (b)), and delivers the pre-molded substrates W to each of the multiple upper dies 71.

[0084] Here, before transferring the pre-molded substrates W from the plurality of substrate transfer units 21 to the plurality of upper dies 71, if the plurality of upper dies 71 are holding a plurality of resin molded products P, the transfer mechanism 2 receives the plurality of resin molded products P from the plurality of molded product transfer units 22. Then, after the plurality of molded product transfer units 22 have received the plurality of resin molded products P, the transfer mechanism 2 transfers the pre-molded substrates W from the plurality of substrate transfer units 21 to the plurality of upper dies 71. Note that, separately from the delivery of the pre-molded substrates W, a release film F and a resin material J are supplied to the plurality of lower dies 72 by the resin material transfer mechanism 19. Thereafter, the molding dies 7A, 7B are clamped, thereby performing resin molding on the pre-molded substrates W.

[0085] When multiple resin molded products P have been transferred to multiple second transfer stages 4, the articulated arm 20b of the transport robot 20 moves the holding unit 20a to the second transfer stage 4. The holding unit 20a then holds the resin molded product P on the second transfer stage 4. The articulated arm 20b then moves the holding unit 20a to the resin molded product stage 613 of the molded product storage unit 61 while turning it over, and the holding unit 20a delivers the resin molded product P in the first state to the resin molded product stage 613 (see FIG. 6 ). After the resin molded product P in the first state has been placed on the resin molded product stage 613, the storage mechanism 612 of the molded product storage unit 61 pushes the resin molded product P on the resin molded product stage 613 to store it in the storage box 611. Note that the storage mechanism 612 may also grasp an end of the resin molded product P and slide the resin molded product P along the guide rails 614 until it approaches the storage box 611. In this case, the storage mechanism 612 pushes the slid resin molded product P to store it in the storage box 611 .

[0086] The recovery mechanism 6 performs the recovery operation for each of the second transfer stages 4 , whereby the resin molded products P are recovered from each of the second transfer stages 4 .

[0087] When the transport mechanism 2 moves from the molding dies 7A, 7B to the first transfer stage 3 after delivering the pre-molding substrate W to the upper die 71, the molded product transport unit 22 holds the resin molded product P. Then, the molded product transport unit 22 of the transport mechanism 2 moves to the second transfer stage 4, whereby the resin molded product P is transported out.

[0088] In this way, on the outward path in which the transport mechanism 2 moves from the first transfer stage 3 and the second transfer stage 4 to the molding dies 7A, 7B, it transports the pre-molding substrate W from the first transfer stage 3 into the molding dies 7A, 7B. Also, on the return path in which the transport mechanism 2 moves from the molding dies 7A, 7B to the first transfer stage 3 and the second transfer stage 4, it transports the resin molded product P from the molding dies 7A, 7B to the second transfer stage 4.

[0089] In this embodiment, while the transport mechanism 2 is away from the first transfer stage 3 and the second transfer stage 4, the supply mechanism 5 supplies pre-molded substrates W to the multiple first transfer stages 3, and the recovery mechanism 6 recovers the resin molded products P from the multiple second transfer stages 4.

[0090] Here, the period when the transport mechanism 2 is away from the first transfer stage 3 and the second transfer stage 4 means (a) the period when the transport mechanism 2 is moving from each transfer stage 3, 4 towards the molding molds 7A, 7B, (b) the period when the transport mechanism 2 is receiving the resin molded product P from the molding molds 7A, 7B after moving to the molding molds 7A, 7B, (c) the period when the transport mechanism 2 is supplying the pre-molded substrate W to the molding molds 7A, 7B after moving to the molding molds 7A, 7B, or (d) the period when the transport mechanism 2 is moving from the molding molds 7A, 7B towards the first transfer stage 3 and the second transfer stage 4.

[0091] Furthermore, while the transport mechanism 2 is away from the first transfer stage 3 and the second transfer stage 4, either the supply operation of the pre-molding substrate W by the supply mechanism 5 (transport robot 20) or the recovery operation of the resin molded product P by the recovery mechanism 6 (transport robot 20) can be performed first.

[0092] Furthermore, the operation of supplying the pre-molded substrate W and the operation of recovering the resin molded product P may be performed alternately. For example, the transport robot 20 may repeat an operation of transporting a resin molded product P from one second transfer stage 4 to the resin molded product stage 613, and subsequently transporting a pre-molded substrate W from the pre-molded substrate stage 513 to one first transfer stage 3. Also, the transport robot 20 may repeat an operation of transporting a pre-molded substrate W from the pre-molded substrate stage 513 to one first transfer stage 3, and subsequently transporting a resin molded product P from one second transfer stage 4 to the resin molded product stage 613.

[0093] Additionally, in this embodiment, the first transfer stage 3 and the second transfer stage 4 are configured to be movable in the vertical direction, so when the transport mechanism 2 is located at the first transfer stage 3 and the second transfer stage 4, it is possible to increase the vertical distance between the first transfer stage 3 and the second transfer stage 4 and the transport mechanism 2. Then, with this vertical distance increased, the supply mechanism 5 can supply the pre-molding substrate W, and the recovery mechanism 6 can recover the resin molded product P.

[0094] Effect of the Present Embodiment According to the resin molding apparatus 100 of the present embodiment, the operation of carrying in the pre-molded substrate W from the first transfer stage 3 to the molding dies 7A and 7B and the operation of carrying out the resin molded product P from the molding dies 7A and 7B to the second transfer stage 4 can be performed separately from the operation of supplying the pre-molded substrate W to the first transfer stage 3 and the operation of collecting the resin molded product P from the second transfer stage 4. This allows the pre-molded substrate W and the resin molded product P to be transported efficiently by performing the supply and collection operations while the above-mentioned carrying-in and carrying-out operations are being performed. As a result, the throughput of resin molding can be improved. When the first transfer stage 3 and the second transfer stage 4 are not present, the pre-molded substrate W is supplied to the transport mechanism 2, and the transport mechanism 2 transports the pre-molded substrate W into the molding dies 7A and 7B. Furthermore, the transport mechanism 2 transports the resin molded product P from the molding dies 7A and 7B and collects the resin molded product P transported by the transport mechanism 2. In this configuration, while the transport mechanism 2 is carrying in or out, it is not possible to supply the pre-molding substrate W or collect the resin molded product P.

[0095] Furthermore, in this embodiment, the conveying mechanism 2 has a substrate conveying section 21 and a molded product conveying section 22, so that the substrate conveying section 21 can be configured to properly hold the pre-molded substrate W, and the molded product conveying section 22 can be configured to properly hold the resin molded product P, allowing them to be transported stably.

[0096] Furthermore, in this embodiment, the substrate transport section 21 and the molded product transport section 22 are arranged side by side in correspondence with the first transfer stage 3 and the second transfer stage 4 which are arranged side by side, so that with the transport mechanism 2 stopped at a predetermined position, the supply operation of the pre-molded substrate W from the first transfer stage 3 to the substrate transport section 21 and the transfer operation of the resin molded product P from the molded product transport section 22 to the second transfer stage 4 can be performed simultaneously, allowing the transport of the pre-molded substrate W and the resin molded product P to be performed efficiently.

[0097] Other Modified Embodiments The present invention is not limited to the above-described embodiments.

[0098] For example, the substrate supply unit 51 is configured to store pre-forming substrates W in a first state (a so-called tip-up state), but may be configured to store pre-forming substrates W in a second state (a so-called tip-down state). In this case, the shaping target transfer unit 52 is configured not to turn the pre-forming substrate W upside down when transporting the pre-forming substrate W from the first transfer stage 3 to the pre-forming substrate stage 513.

[0099] Furthermore, although the molded product storage section 61 is configured to store resin molded products P in the first state (so-called tip-up state), it may be configured to store resin molded products P in the second state (so-called tip-down state). In this case, the molding target object recovery section 62 is configured not to turn the resin molded products P upside down when transporting the resin molded products P from the second transfer stage 4 to the resin molded product stage 613.

[0100] Furthermore, in the above embodiment, the supply mechanism 5 and the recovery mechanism 6 are configured using a common transport robot 20, but the supply mechanism 5 and the recovery mechanism 6 may be configured using separate transport robots. The transport mechanism 2 is also a common mechanism that transports both the pre-molding substrate W and the resin molded product P, but it may be configured to include separate transport mechanisms for transporting the pre-molding substrate W and the resin molded product P.

[0101] Furthermore, the resin molding module B may have one molding die or three or more molding dies in addition to the two molding dies 7A and 7B. In these cases, the pre-molding conveying section and post-molding conveying section of the conveying mechanism 2 are provided according to the number of molding dies, and the transfer stages 3 and 4 are provided according to the number of molding dies.

[0102] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention.

[0103] According to the present invention, the throughput of resin molding can be improved by efficiently transporting molding objects.

[0104] DESCRIPTION OF SYMBOLS 100: Resin molding apparatus W: Pre-molding substrate (molding object) Wx: Electronic component P: Resin molded product (molding object) 2: Transport mechanism 21: Substrate transport section (pre-molding transport section) 22: Molded product transport section (post-molding transport section) 3: First transfer stage 4: Second transfer stage 5: Supply mechanism 51: Substrate supply section (molding object supply section) 52: Molding object transfer section 6: Recovery mechanism 61: Molded product storage section (molding object storage section) 62: Molding object recovery section 7A, 7B: Molding mold 20: Transport robot 20a: Holding unit 20b: Articulated arm section

Claims

1. A resin molding device for resin molding an object to be molded, comprising: a molding die; a transport mechanism for transporting the object to be molded before molding into the molding die and transporting the object to be molded after molding out of the molding die; a first transfer stage onto which the object to be molded before molding handed over to the transport mechanism is transferred; a second transfer stage onto which the object to be molded after molding transported by the transport mechanism is transferred; a supply mechanism for supplying the object to be molded before molding to the first transfer stage; and a recovery mechanism for recovering the object to be molded after molding from the second transfer stage, wherein the transport mechanism has a pre-molding transport section for transporting the object to be molded before molding from the first transfer stage into the molding die, and a post-molding transport section for transporting the object to be molded after molding from the molding die to the second transfer stage, wherein the first transfer stage and the second transfer stage are arranged side by side, The pre-molding transport section and the post-molding transport section are arranged side by side corresponding to the first transfer stage and the second transfer stage.

2. The resin molding apparatus described in claim 1, wherein the transport mechanism performs loading by the pre-molding transport section and unloading by the post-molding transport section during one round trip between a transfer module including the first transfer stage and the second transfer stage and a molding module including the molding mold.

3. A resin molding apparatus as described in claim 1 or 2, wherein the first transfer stage and the second transfer stage are arranged side by side along the transfer direction of the transfer mechanism.

4. A resin molding apparatus as described in any one of claims 1 to 3, wherein while the transport mechanism is away from the first transfer stage and the second transfer stage, the supply mechanism supplies the molding object before molding to the first transfer stage, and the recovery mechanism recovers the molding object after molding from the second transfer stage.

5. A resin molding apparatus as described in any one of claims 1 to 4, comprising a plurality of molding dies arranged along a vertical direction, the transport mechanism having a plurality of the pre-molding transport sections and a plurality of the post-molding transport sections in the vertical direction corresponding to the plurality of molding dies, the first transfer stage being provided in a plurality of positions in the vertical direction corresponding to the plurality of pre-molding transport sections, and the second transfer stage being provided in a plurality of positions in the vertical direction corresponding to the plurality of post-molding transport sections.

6. A resin molding apparatus according to any one of claims 1 to 5, wherein at least one of the first transfer stage and the second transfer stage is configured to be movable in the vertical direction.

7. A resin molding apparatus as described in any one of claims 1 to 6, wherein the supply mechanism has: a molding object supply section which supplies the molding object before molding; and a molding object transfer section which transfers the molding object before molding from the molding object supply section to the first transfer stage.

8. A resin molding apparatus as described in any one of claims 1 to 7, wherein the recovery mechanism has a molding object storage section that stores the molding object after molding, and a molding object recovery section that recovers the molding object after molding from the second transfer stage to the molding object storage section.

9. A resin molding apparatus as described in claim 8, which quotes claim 7, wherein the molding object transfer section and the molding object recovery section have a common transport robot equipped with a holding unit that holds the molding object and a multi-joint arm section that moves the holding unit.

10. A resin molding apparatus as described in claim 7 or 9, wherein the object to be molded has an electronic component fixed to one surface, the object to be molded supplying section supplies the object to be molded before molding in a first state in which the electronic component is on the upper side, the first transfer stage is a stage onto which the object to be molded before molding is transferred in a second state in which the electronic component is on the lower side, and the object to be molded transfer section holds the object to be molded supplied in the first state and passes it to the first transfer stage in the second state.

11. A method for manufacturing a resin molded product using a resin molding apparatus according to any one of claims 1 to 10, comprising: a loading step of loading the object to be molded before molding into the mold by the conveying mechanism; a molding step of clamping the mold and performing resin molding on the object to be molded before molding; and an unloading step of unloading the object to be molded from the mold by the conveying mechanism.

12. The method for manufacturing a resin molded product described in claim 11, wherein the loading step and the unloading step are performed by the conveying mechanism during one round trip between the first transfer stage and the second transfer stage and the molding die.

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