Ultrasonic probe

Abstract

An ultrasonic probe having a sono-stair structure is disclosed. An ultrasonic probe according to an embodiment comprises: an active element having a thickness corresponding to a 1 / 4 wavelength to a 2 / 3 wavelength based on the center frequency of the ultrasonic probe; a matching layer formed on the active element; a grinding relief layer formed beneath the active element to separate a channel during a grinding process of the active element; and a sono-stair layer formed beneath the grinding relief layer and comprising a copper sheet; and a support formed beneath the sono-stair layer.

Description

ultrasound probe

[0001] The present invention relates to an ultrasonic probe that obtains image information of the inside of a test subject using ultrasonic waves.

[0002] An ultrasound diagnostic device transmits ultrasound signals to a subject and uses the reflected ultrasound signals to image the subject's internal tissues. The device transmits ultrasound signals to the target area of ​​the subject and then receives the reflected ultrasound signals from the boundaries of tissues within the subject, each with different acoustic impedances. This process allows the device to acquire image information about the target area.

[0003] Ultrasonic diagnostic devices include an ultrasonic probe that transmits ultrasonic signals to a subject and receives the reflected ultrasonic signals. A typical ultrasonic probe largely consists of an active element, a matching layer, and a backing layer.

[0004] According to one embodiment, an ultrasonic probe having a sono-stair structure is proposed that improves the channel separation process and enhances uniformity through the generation of periodic and uniform back reflection waves.

[0005] An ultrasonic probe according to one embodiment includes an active element having a thickness of 1 / 4 wavelength to 2 / 3 wavelength based on a center frequency of the ultrasonic probe, a matching layer formed on an upper portion of the active element, a grinding relief layer formed on a lower portion of the active element for channel separation during a grinding process of the active element, a sono-stair layer including a copper sheet formed on a lower portion of the grinding relief layer, and a support formed on a lower portion of the sono-stair layer.

[0006] The active element may have a thickness of half a wavelength relative to the center frequency of the ultrasonic probe.

[0007] The grinding relief layer may have a thickness of 1 / 5 wavelength to 1 / 4 wavelength based on the center frequency of the ultrasonic probe. The grinding relief layer may have a thickness of 1 / 4 wavelength based on the center frequency of the ultrasonic probe.

[0008] The grinding relief layer may be made of epoxy material.

[0009] The copper sheet can have a thickness greater than 1 / 20 wavelength based on the center frequency of the ultrasonic probe.

[0010] The sono-stair layer may further include a flexible printed circuit board formed between the active component and the grinding relief layer for electrical connection to the multiple separate channels of the active component.

[0011] The flexible printed circuit board may include a first flexible printed circuit board formed between an active element and a second flexible printed circuit board, and a second flexible printed circuit board formed between the first flexible printed circuit board and a grinding relief layer.

[0012] The first flexible printed circuit board may include copper (Cu), and the second flexible printed circuit board may include polyimide (PI).

[0013] The ultrasonic probe may further include a ground sheet formed between the active element and the matching layer.

[0014] The ultrasonic probe may further include a first cuff formed to extend from an upper surface of the matching layer to a first position within the active element and the grinding relief layer.

[0015] The ultrasonic probe further includes a second cuff formed only on the active element, wherein the second cuff can be formed along a direction intersecting the first cuff.

[0016] The matching layer can be configured with multiple layers, each having a different acoustic impedance size, using N materials (N≥2 is an integer) to match the acoustic impedance between the active element and the test object.

[0017] According to one embodiment, an ultrasonic probe has an active element having a thickness of 1 / 4 to 2 / 3 wavelengths (1 / 4 to 2 / 3λ) relative to the center frequency of the ultrasonic probe. Accordingly, the ultrasonic probe can be applied to high frequencies. In addition, the ultrasonic probe has a wide operating voltage tolerance range, and the production of a grinding relief layer is easy and inexpensive.

[0018] Furthermore, conventional ultrasonic probes have limitations in grinding operations because they require cutting the backing layer during the grinding of the active element. However, an ultrasonic probe according to one embodiment can grind the active element by cutting the grinding relief layer located on the back of the active element. Therefore, channel separation of the active element is facilitated, and the fabrication of multi-dimensional probes is possible.

[0019] Additionally, according to one embodiment, the ultrasonic probe comprises a sono-stair structure in which the grinding relief layer and the copper sheet each have a uniform thickness. Accordingly, the ultrasonic probe can generate periodic and uniform back-reflected waves. Furthermore, the ultrasonic probe can be free from limitations such as the thickness, material, and shape of the support formed beneath the copper sheet.

[0020] Furthermore, according to one embodiment, the ultrasonic probe forms a copper sheet under the grinding relief layer. Accordingly, the ultrasonic probe can prevent overheating of the ultrasonic probe because the copper sheet has high thermal conductivity and dissipates heat.

[0021] FIG. 1 is a diagram schematically showing the main configuration of an ultrasonic probe according to one embodiment of the present invention;

[0022] Figures 2 and 3 are drawings showing the detailed structure of an ultrasonic probe according to one embodiment of the present invention.

[0023] FIG. 4 is a diagram illustrating the configuration of an ultrasonic diagnostic device according to an embodiment of the present invention.

[0024] FIG. 5 is a drawing showing the difference in configuration and performance between an ultrasonic probe having a conventional structure according to an embodiment of the present invention and an ultrasonic probe having a sono-stair structure according to an embodiment of the present invention.

[0025] FIG. 6 is a drawing showing that an ultrasonic probe having a sono-stair structure according to one embodiment of the present invention can be applied to probes of various frequencies and shapes.

[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. In describing the present invention, detailed descriptions of known functions or configurations will be omitted if they are deemed to unnecessarily obscure the gist of the present invention. Furthermore, the terms described below are defined based on their functions in the present invention and may vary depending on the intentions or practices of the user or operator. Therefore, their definitions should be based on the overall content of this specification.

[0027] When it is said in this specification that a first material layer is formed on a second material layer, it should be interpreted to include not only cases where the first material layer is formed directly on the second material layer, but also cases where another third material layer is interposed between the first material layer and the second material layer (upper), unless there is a description explicitly excluding this.

[0028] FIG. 1 is a diagram schematically showing the main configuration of an ultrasonic probe according to one embodiment of the present invention.

[0029] Hereinafter, the term "schematic" is intended to indicate that the depicted drawing represents the relative positional relationship or stacking relationship between components included in the ultrasonic probe. Therefore, the specific shape or thickness of each component included in the ultrasonic probe may not necessarily match that depicted in the drawing.

[0030] Referring to FIG. 1, the ultrasonic probe (1) includes a support (11), a sono-stair layer (12), and an active layer (16).

[0031] The active element (16) generates an ultrasonic signal, transmits the ultrasonic signal to the subject, and receives an ultrasonic signal reflected from the subject. The active element (16) includes at least one piezoelectric element.

[0032] According to one embodiment, the active element (16) has a thickness of 1 / 4 wavelength to 2 / 3 wavelength (1 / 4 to 2 / 3λ) based on the center frequency of the ultrasonic probe (1). Preferably, the active element (16) may have a thickness of 1 / 2 wavelength based on the center frequency of the ultrasonic probe (1).

[0033] When using active elements with a thickness less than 1 / 4 wavelength relative to the center frequency of the ultrasonic probe, using the ultrasonic probe as a high-frequency probe limits the processing of the active element. Furthermore, when using piezoelectric single crystals, the low coercive electric field reduces the allowable driving voltage by half.

[0034] In contrast, the active element (16) according to one embodiment has a thickness of 1 / 4 wavelength to 2 / 3 wavelength (1 / 4 to 2 / 3λ) based on the center frequency of the ultrasonic probe (1). Accordingly, the ultrasonic probe (1) can be applied to high frequencies. In addition, the ultrasonic probe (1) has a wide allowable driving voltage range, and the grinding relief layer (14) is easy to manufacture and inexpensive.

[0035] Depending on the number of piezoelectric elements in the active element (16), if there is a single piezoelectric element, the ultrasonic probe (1) is a single-element probe. In contrast, if there are multiple piezoelectric elements, the ultrasonic probe (1) may be an array probe. Types of array probes include linear arrays, convex arrays, phased arrays, etc.

[0036] An ultrasonic probe (1) according to one embodiment is applicable to a single element probe and an array probe of all types. In particular, the ultrasonic probe (1) may include a copper sheet (13), a dicing buffer layer (14), and a flexible printed circuit board (FPCB, hereinafter referred to as 'FPCB') (15) arranged in a sono-stair structure between an active element (16) and a support (11). Hereinafter, the copper sheet (13), the dicing buffer layer (14), and the FPCB (15) will be referred to as a sono-stair layer (12).

[0037] The copper sheet (13), the grinding relief layer (14), and the FPCB (15) are formed of materials having different impedances, so that the ultrasonic probe (1) of the present invention can generate a periodic and uniform back reflection wave for an ultrasonic signal generated from the active element (16) and transmitted toward the support (11).

[0038] Below, the structure of the copper sheet (13), the grinding relief layer (14), and the FPCB (15) will be described in detail.

[0039] First, a grinding relief layer (14) is formed on the lower part of the active element (16) to facilitate channel separation during the dicing process of the active element (16).

[0040] Typically, an ultrasonic probe has a backing layer at the bottom, with the active element positioned above it. In this case, grinding the active element requires cutting the backing layer. However, the powder contained within the backing layer makes grinding the active element difficult. Consequently, channel separation of the active element is difficult.

[0041] However, according to one embodiment, a grinding relief layer (14) is formed between the active element (16) and the support (11) having a backing layer function. In this case, when grinding the active element (16), the grinding relief layer (14) is cut instead of the backing layer, making it easy to separate the channels of the active element (16). Accordingly, the manufacturing of a multidimensional probe is easy.

[0042] As the grinding relief layer (14) is formed between the copper sheet (13) and the FPCB (15), the grinding relief layer (14) can prevent the copper sheet (13) and the FPCB (15) from directly contacting each other. To this end, the grinding relief layer (14) can be made of a non-conductive material. For example, the grinding relief layer (14) can be formed using an epoxy material. Since the epoxy material can provide an adhesive function, the copper sheet (13) and the FPCB (15) can be adhered to each other by the grinding relief layer (14) implemented with the epoxy material.

[0043] In the above-described embodiment, an example in which a grinding relief layer (14) is formed between a copper sheet (13) and an FPCB (15) is described, but the arrangement positions of the copper sheet (13) and the FPCB (15) and the grinding relief layer (14) constituting the sono-stair layer (12) are not limited to the above-described example, and may be arranged at various positions.

[0044] Additionally, it is possible for at least one circuit layer to be formed between the copper sheet (13) and the FPCB (15) in addition to the grinding relief layer (14).

[0045] The FPCB (15) formed between the active element (16) and the grinding relief layer (14) enables electrical connection to a plurality of channels separated through the grinding operation of the active element (16).

[0046] A copper sheet (13) is formed on the lower part of the grinding relief layer (14). The copper sheet (13) has high thermal conductivity and can disperse heat to prevent overheating of the ultrasonic probe (1). The copper sheet (13) can have a thickness of 1 / 20 wavelength or more based on the center frequency of the ultrasonic probe (1).

[0047] Due to the uniform thickness of each of the grinding relief layer (14) and the copper sheet (13), the ultrasonic probe (1) can generate periodic and uniform rear reflection waves. Accordingly, the support (11) formed under the copper sheet (13) can be free from restrictions on thickness, material, shape, etc. An embodiment in which the ultrasonic probe (1) generates periodic and uniform rear reflection waves due to the uniform thickness of each of the grinding relief layer (14) and the copper sheet (13) will be described below with reference to FIG. 5.

[0048] The support (11) minimizes the ultrasonic signal generated from the active element (16) from propagating in an undesired direction, that is, toward the support (11), and returning its reflected wave. As described above, due to the uniform thickness of each of the grinding relief layer (14) and the copper sheet (13), the support (11) has no limitations in thickness, material, shape, etc. Therefore, the ultrasonic probe (1) can easily change the material, material, shape, etc. of the support (11). For example, the ultrasonic probe (1) can increase the powder content in the support (11) to improve thermal conductivity, and aluminum can also be used as the material. In addition, the ultrasonic probe (1) can include a metal material in the support (11) for heat dissipation.

[0049] FIG. 2 and FIG. 3 are drawings showing the detailed structure of an ultrasonic probe according to one embodiment of the present invention.

[0050] Referring to FIGS. 2 and 3, the ultrasonic probe (1) includes a support (11), a sono-stair layer (12), an active element (16), a ground sheet (17), a matching layer (18), an acoustic lens (19), a first cuff (Kerf) (20), and a second cuff (22).

[0051] Since the support (11), sono-stair layer (12), and active element (16) have been described above with reference to Fig. 1, the components not described with reference to Fig. 1 will be described below.

[0052] An active element (16) according to one embodiment generates an ultrasonic signal when energy is applied, such as by applying voltage to the FPCB (15) and ground sheet (17) located at both ends. The ultrasonic signal generated by the active element (16) according to one embodiment may have various frequencies. In particular, it may be a high frequency.

[0053] The FPCB (15) of the sono-stair layer (12) is formed between the active element (16) and the grinding relief layer (14) for electrical connection to a plurality of separated channels of the active element (16).

[0054] The FPCB (15) may include a first FPCB (15a) and a second FPCB (15b). The first FPCB (15a) is formed between the active element (16) and the second FPCB (15b), and the second FPCB (15b) is formed between the first FPCB (15a) and the grinding relief layer (14). The first FPCB (15a) may include a metal, for example, copper (Cu), and the second FPCB (15b) may include polyimide (PI).

[0055] The matching layer (18) is located on the front side of the active element (16). The matching layer (18) matches the acoustic impedance between the active element (16) and the subject to be examined, thereby transmitting the ultrasonic signal generated from the active element (16) to the subject to be examined or reducing the loss of the ultrasonic reflection signal reflected and returned by the subject to be examined. The matching layer (18) can also serve as a buffer to reduce problems such as image distortion caused by a sudden change in the acoustic impedance between the active element (16) and the subject to be examined.

[0056] The matching layer (18) can be configured with multiple layers, each having a different acoustic impedance, using N materials (N≥2, an integer) to match the acoustic impedance between the active element (16) and the test object. In this case, the acoustic impedance variation range of the matching layer (18) is reduced, thereby improving the bandwidth and sensitivity of the ultrasonic probe (1).

[0057] According to one embodiment, a ground sheet (17) may be formed between the matching layer (18) and the active element (16). Although not illustrated, the matching layer (18) may also be disposed between the ground sheet (17) and the active element (16). In this case, the matching layer (18) is formed by including an electrically conductive material, so that the ground sheet (17) and the active element (16) can exchange electrical signals with each other through the matching layer (18). As described above, when the active element (16), the matching layer (18), and the ground sheet (17) are sequentially laminated, a two-dimensional array probe (2-D array probe) with easy electrical connection can be implemented.

[0058] The acoustic lens (19) is located at the outermost part of the ultrasonic probe (1). The ultrasonic signal passing through the matching layer (18) can be connected to the test object through the acoustic lens (19). The acoustic lens (19) according to one embodiment is implemented to allow the ultrasonic signal to be transmitted without loss or with minimal loss, and to minimize loss due to reflection / re-reflection at the boundary surface. In addition, it can perform the function of protecting the matching layer (18) from wear. For this purpose, the acoustic impedance (Z) of the acoustic lens (19) lens ) may be identical to or similar to the acoustic impedance of human soft tissue. For example, the acoustic lens (19) may include a material such as urethane or RTV silicone.

[0059] The ultrasonic probe (1) may include first and second cuffs (20, 22) that divide the active element (16) into a plurality of piezoelectric elements. There may be at least one first and second cuff (20, 22). FIG. 2 illustrates a plurality of first cuffs (20a, 20b, 20c: 20) that divide the active element (16) along a first direction (azimuth direction), and FIG. 3 illustrates a plurality of second cuffs (22a, 22b: 22) that divide the active element (16) along a second direction (elevation direction). The first and second kerfs (20, 22) refer to spaces formed by a grinding process in which the active element (16) is divided into a plurality of piezoelectric elements, and the first and second kerfs (20, 22) can be formed along directions intersecting each other.

[0060] The first and second cuffs (20, 22) described above can be formed between a plurality of piezoelectric elements along the depth direction of the ultrasonic probe (1). The first and second cuffs (20, 22) can be structures filled with a material constituting the acoustic lens (19), but are not limited thereto.

[0061] At this time, first and second cuffs (20, 22) are formed between a plurality of piezoelectric elements along the first direction (azimuth direction) and the second direction (elevation direction) of the ultrasonic probe (1), so that the ultrasonic probe (1) may have a multi-D array structure that forms one or more foci in the second direction (elevation direction). In addition, although not illustrated, the ultrasonic probe (1) of the embodiment of the present invention may have a 2-D array structure in which a cuff is formed only in the first direction (azimuth direction).

[0062] The first cuff (20) may be formed to extend from the upper surface of the matching layer (18) to the first position inside the ground sheet (17), the active element (16), the FPCB (15), and the grinding relief layer (14). In addition, the second cuff (22) may not be formed on the matching layer (18) and the ground sheet (17), but may be formed only on the active element (16). FIG. 3 illustrates that the second cuff (22) is formed on the active element (16) and the first FPCB (15a).

[0063] The first FPCB (15a) and the second FPCB (15b) can be extended to cover not only the area between the active element (16) and the grinding relief layer (14), but also the side surfaces of the grinding relief layer (14), the copper sheet (13), and the support (11).

[0064] The ground sheet (17) may also extend not only between the active element (16) and the matching layer (18), but also to the side surfaces of the active element (16), the first FPCB (15a), the second FPCB (15b), the grinding relief layer (14), the copper sheet (13), and the support (11).

[0065] FIG. 4 is a diagram illustrating the configuration of an ultrasonic diagnostic device according to an embodiment of the present invention.

[0066] Referring to Fig. 4, the ultrasonic diagnostic device (5) includes an ultrasonic probe (1), a beamforming unit (2), an image processing unit (3), and an output unit (4).

[0067] The ultrasonic probe (1) may be composed of a plurality of piezoelectric elements (10-1, 10-2,…, 10-n).

[0068] The beamforming unit (2) drives the ultrasonic probe (1) to transmit an ultrasonic signal to the subject to be examined and processes the reflected signal returned from the subject to generate a beam signal.

[0069] The image processing unit (3) receives a beam signal from the beamforming unit (2) and generates an ultrasonic image.

[0070] The output unit (4) displays the ultrasonic image generated through the image processing unit (3) to the outside.

[0071] FIG. 5 is a drawing illustrating the differences in configuration and performance between an ultrasonic probe having a conventional structure according to an embodiment of the present invention and an ultrasonic probe having a sono-stair structure according to an embodiment of the present invention.

[0072] More specifically, (a) is a drawing showing the configuration of an ultrasonic probe having a sono-stair structure according to an embodiment of the present invention and the shape of a back-reflected wave, and (b) is a drawing showing the configuration of an ultrasonic probe having a general structure and the shape of a back-reflected wave. (c) is a drawing comparing the voltage magnitude with respect to time in (a) and (b), and (d) is a drawing comparing the normalized voltage magnitude with respect to time in (a) and (b).

[0073] When interpreting (c) and (d), it should be noted that the support (11) was tested under the same conditions as the rear layer of a general structure ultrasonic probe, i.e., conditions including coagulated powder.

[0074] Referring to (a) of Fig. 5, an ultrasonic probe (1) of a sono-stair structure includes a support (11), a copper sheet (13), a grinding relief layer (14), a second FPCB (15b), a first FPCB (15a), an active element (16), a ground sheet (17), a matching layer (18), and an acoustic lens (19).

[0075] In comparison, an ultrasonic probe (6) having a general structure as shown in (b) of Fig. 5 includes a backing layer (51), a second FPCB (15b), a first FPCB (15a), an active element (16), a ground sheet (17), a matching layer (18), and an acoustic lens (19).

[0076] The ultrasonic probe (1) of the sono-stair structure has a structure in which, compared to the ultrasonic probe (6) of the general structure, a grinding relief layer (14) and a copper sheet (13) are arranged between the active element (16) and the support (11). The ultrasonic probe (1) of the sono-stair structure has a structure in which the support (11) is formed instead of the backing layer (51) disclosed in (b) of Fig. 5. Furthermore, the ultrasonic probe (1) of the sono-stair structure has a grinding relief layer (14) and a copper sheet (13) of uniform thickness. For example, the grinding relief layer (14) has a thickness of 1 / 5 wavelength to 1 / 4 wavelength based on the center frequency of the ultrasonic probe (1), and the copper sheet (13) has a thickness of 1 / 20 wavelength or more based on the center frequency of the ultrasonic probe (1).

[0077] Accordingly, the ultrasonic probe (1) of the sono-stair structure can generate periodic and uniform rear reflection waves. Furthermore, it can be free from limitations such as the thickness, material, and shape of the support (11) formed under the copper sheet (13).

[0078] As shown in (c), it can be confirmed that the ultrasonic probe (1) of the sono-stair structure has a smaller voltage change in the same time period compared to the ultrasonic probe (6) of the general structure.

[0079] As shown in (b), the ultrasonic probe (6) of a general structure reflects sound waves (P) from the powder included in the backing layer (51). powder) Therefore, errors may appear in the ultrasonic image through signal processing in the image system. On the other hand, the ultrasonic probe (1) of the sono-stair structure can block uneven reflected waves generated from the rear, so the voltage change is small, as in (c).

[0080] In addition, as shown in (d), it can be confirmed that the ultrasonic probe (1) of the sono-stair structure has a greater voltage in the same time period than the ultrasonic probe (6) of the general structure. In the case of organs or lesions that are small in size or have a small difference in acoustic impedance, it is not easy to detect the reflected signal after applying ultrasound to the lesion.

[0081] However, since the sono-stair structured ultrasonic probe (1) has a high voltage, its transmission and reception sensitivity increases, enabling it to detect even minute signals. Therefore, the sono-stair structured ultrasonic probe (1) can accurately represent organs or lesions that are small in size or have a small difference in acoustic impedance in an ultrasound image.

[0082] The sound waves generated from the active element (16) are described in detail as follows.

[0083] As shown in (a) and (b), when a driving voltage is applied to the active element (16), a sound wave is generated on the upper and lower surfaces of the active element (16), and then the main sound wave (P) propagates toward the matching layer (18). a , P c , P b ) is formed.

[0084] In a probe (6) of a general structure as shown in (b), sound waves directed toward the backing layer (51) are all canceled out by the attenuation of the back layer.

[0085] However, in the probe (1) of the sono-stair structure as shown in (a), the sound wave (P) generated from the active element (16) and directed toward the copper sheet (13) d , P e) is reflected from the copper sheet (13) and the main sound wave (P a , P c , P b ) and the composite wave (P) is amplified by constructive interference. a , P c , P b, P d , P e ) can be created.

[0086] Also, as shown in (b), the probe (6) of the general structure has an acoustic wave (P) due to unintended impurities in the backing layer (51). Powder ) are generated irregularly, but in the probe (1) of the sono-stair structure of (a), sound waves (P d , P e ) is mostly reflected from the copper sheet (13) and is not affected by the support (11). Accordingly, the ultrasonic probe (1) of the embodiment of the present invention has freedom in the thickness, material, shape, etc. of the support (11), and the support (11) can be formed to include a metal material to improve heat dissipation characteristics.

[0087] FIG. 6 is a drawing showing that an ultrasonic probe having a sono-stair structure according to one embodiment of the present invention can be applied to probes of various frequencies and shapes.

[0088] In more detail, Fig. 6 is a diagram showing the change in voltage magnitude with respect to time and the normalized magnitude change with respect to time in an environment with probes (a, b, c, d) having various frequencies and shapes.

[0089] Referring to FIGS. 1, 5, and 6, the ultrasonic probe (1) having a sono-stair structure according to one embodiment is applicable to probes of various frequencies and shapes. For example, it can be confirmed that the ultrasonic probe (1) having a sono-stair structure has a larger normalized voltage magnitude than the ultrasonic probe (6) having a general structure. Accordingly, the ultrasonic probe (1) having a sono-stair structure has a wider bandwidth and improved sensitivity.

[0090] Figures 6(a), 6(b), and 6(c) show the results of finite element analysis, and are graphs when a sono-stair structure is applied to a curved array probe, a phase modulation array probe, and a straight array probe with different center frequencies, and it can be confirmed that the output voltage increases and the bandwidth is widened.

[0091] The center frequency of the curved array probe shown in Fig. 6(a) is 3 MHz, the center frequency of the phase modulation array probe shown in Fig. 6(b) is 6 MHz, and the center frequency of the straight array probe shown in Fig. 6(c) is 9 MHz.

[0092] Frequency and wavelength are inversely proportional, and the thickness of the active element (16), the grinding relief layer (14), and the copper sheet (13) of Fig. 5(a) is changed based on the wavelength that changes depending on the frequency. As a result, the back reflected wave (P d , P e ) is set to a certain frequency (P) for a certain period of time a , P c , P b ) can be combined to generate a reinforced synthetic wave. As shown in the time domain waveform of Fig. 6, the output voltage of the sono-stair structure ultrasonic probe (1) is greater than that of the general structure ultrasonic probe (6). In addition, as seen in the frequency spectrum of Fig. 6, various frequency components are reinforced, thereby widening the bandwidth.

[0093] Fig. 6(d) shows the measurement results obtained by applying a sono-stair structure to a therapeutic 2-D array probe in which multiple channels are formed in a narrow area, and it can be confirmed that the sound pressure increases. This demonstrates that the sono-stair structure is effective in improving the performance of the ultrasonic probe (1), regardless of the frequency and shape of the ultrasonic probe (1).

[0094] In addition, the ultrasonic probe (1) of the sono-stair structure has no restrictions on the thickness, material, shape, etc. of the support (11) due to the uniform thickness of each of the grinding relief layer (14) and the copper sheet (13). Therefore, it is easy to change the material, material, shape, etc. of the support (11). For example, the ultrasonic probe (1) of the sono-stair structure can increase the powder content in the support (11) to improve thermal conductivity, and can also use aluminum as the material. The support (11) can include a metal material for heat dissipation.

[0095] Furthermore, in the sono-stair structured ultrasonic probe (1), a copper sheet (13) having high thermal conductivity is laminated under the grinding relief layer (14). Accordingly, heat dissipation is effectively achieved, thereby preventing overheating of the ultrasonic probe (1).

[0096] The present invention has been described above, focusing on specific embodiments thereof. Those skilled in the art will appreciate that the present invention can be implemented in modified forms without departing from its essential characteristics. Therefore, the disclosed embodiments should be considered illustrative rather than limiting. The scope of the present invention is set forth in the claims, not the foregoing description, and all differences within the scope equivalent thereto should be construed as being encompassed by the present invention.

Claims

1. An active element having a thickness of 1 / 4 wavelength to 2 / 3 wavelength based on the center frequency of the ultrasonic probe; A matching layer formed on top of the above active element; A sono-stair layer including a grinding relief layer formed on the lower portion of the active element for channel separation during the grinding process of the active element; and a copper sheet formed on the lower portion of the grinding relief layer; and A support formed at the bottom of the sono-stair layer; An ultrasonic probe characterized by including a .

2. In the first paragraph, the active element An ultrasonic probe characterized by having a thickness of 1 / 2 wavelength based on the center frequency of the ultrasonic probe.

3. In the first paragraph, the grinding relief layer An ultrasonic probe characterized by having a thickness of 1 / 5 wavelength to 1 / 4 wavelength based on the center frequency of the ultrasonic probe.

4. In the third paragraph, the grinding relief layer An ultrasonic probe characterized by having a thickness of 1 / 4 wavelength based on the center frequency of the ultrasonic probe.

5. In the first paragraph, the grinding relief layer An ultrasonic probe characterized by being made of epoxy material.

6. In the first paragraph, the copper sheet An ultrasonic probe characterized by having a thickness of at least 1 / 20 wavelength based on the center frequency of the ultrasonic probe.

7. In the first paragraph, the sono-stair layer A flexible printed circuit board formed between the active element and the grinding relief layer for electrical connection to a plurality of separated channels of the active element; An ultrasonic probe characterized by further comprising:

8. In paragraph 7, the flexible printed circuit board A first flexible printed circuit board formed between the active element and the second flexible printed circuit board; and A second flexible printed circuit board formed between the first flexible printed circuit board and the grinding relief layer; An ultrasonic probe characterized by including:

9. In paragraph 8, The first flexible printed circuit board contains copper (Cu), An ultrasonic probe characterized in that the second flexible printed circuit board comprises polyimide (PI).

10. In the first paragraph, the ultrasonic probe A ground sheet formed between the active element and the matching layer; An ultrasonic probe characterized by further comprising:

11. In the first paragraph, the ultrasonic probe A first kerf formed by extending from the upper surface of the matching layer to a first position inside the active element and the grinding relief layer; An ultrasonic probe characterized by further comprising:

12. In the 11th paragraph, the ultrasonic probe Further comprising a second cuff formed only on the above active element; An ultrasonic probe characterized in that the second cuff is formed along a direction intersecting the first cuff.

13. In the first paragraph, the matching layer An ultrasonic probe characterized in that it comprises a plurality of layers, each having a different acoustic impedance size, using N materials (N≥2, an integer) to match the acoustic impedance between the active element and the test object.

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