Substrate connection structure and antenna device and communication device equipped with same

Abstract

A facing surface (131a) of a first substrate (131) faces a side surface (132c) of a second substrate (132). The first substrate has a first signal line (141), a first signal electrode (E1), and a first ground electrode (GND1). The first ground electrode has an opening (150) that is open so as to surround the first signal electrode. The second substrate has a second signal electrode (E2), a second signal line (142), and a second ground electrode (GND2). When viewed from the x-axis direction, the second ground electrode has a first portion (161) that overlaps with the second signal electrode and a second portion (162) that does not overlap with the second signal electrode. The distance (X2) between the second signal electrode and the first portion in the x-axis direction is greater than the distance (X3) between the second signal line and the second portion in the x-axis direction.

Description

Substrate connection structure, and antenna device and communication device equipped with the same

[0001] The present disclosure relates to a substrate connection structure, and an antenna device and a communication device that incorporate the same.

[0002] International Publication No. 2020 / 170722 (Patent Document 1) discloses an antenna device having a flat patch antenna (radiating element). In this antenna device, the patch antenna is disposed in a substrate connection structure formed by connecting a first substrate and a second substrate having different normal directions. The first substrate and the second substrate are connected via a bent portion, and a ground electrode and a signal line for the patch antenna are disposed across the first substrate, the bent portion, and the second substrate.

[0003] International Publication No. 2020 / 170722

[0004] In the antenna device disclosed in International Publication No. 2020 / 170722 (Patent Document 1), a first substrate and a second substrate, which have different normal directions, are connected via a bent portion, which creates dead space and raises concerns about the increased size of the substrate connection structure. To reduce the area required for arranging the substrate connection structure, it is conceivable to eliminate the bent portion and connect the side of the second substrate to the main surface of the first substrate, and arrange a ground electrode and a signal line across the first and second substrates. However, simply arranging the ground electrode and the signal line across the first and second substrates poses a problem in that impedance matching is not easy.

[0005] The present disclosure has been made to solve the above-mentioned problems, and its purpose is to provide a substrate connection structure having a first substrate and a second substrate with different normal directions, which is miniaturized while being configured to facilitate impedance matching.

[0006] A substrate connection structure according to the present disclosure includes a first substrate and a second substrate having a main surface and a side surface that intersect with each other. The first substrate has an opposing surface facing the side surface of the second substrate, a first signal line arranged opposite the opposing surface, a plate-shaped first ground electrode arranged on the opposing surface or arranged opposite the opposing surface at a position between the opposing surface and the first signal line, and a first signal electrode connected to the first signal line and exposed on the opposing surface. The second substrate has a second signal line arranged opposite the main surface, a plate-shaped second ground electrode arranged opposite the main surface at a position between the main surface and the second signal line, and a second signal electrode connected to the second signal line and exposed on the side surface and connected to the first signal electrode. The first ground electrode is configured to sandwich the first substrate from at least two directions when viewed from a first direction that is normal to the opposing surface. The second ground electrode includes a first portion connected to the first ground electrode and a second portion connected to the first portion. When viewed from a second direction that is a normal direction to the main surface, at least a part of the first portion overlaps with the second signal electrode, and the second portion does not overlap with the second signal electrode, and the distance in the second direction between the second signal electrode and the first portion is greater than the distance in the second direction between the second signal line and the second portion.

[0007] An antenna device according to the present disclosure includes the above-described substrate connection structure.A communication device according to the present disclosure includes the above-described substrate connection structure.

[0008] According to the present disclosure, a substrate connection structure having a first substrate and a second substrate with different normal directions can be made compact and configured to facilitate impedance matching.

[0009] FIG. 1 is an example of a block diagram of a communication device to which an antenna device including a substrate connection structure is applied. FIG. 1 is a diagram (part 1) showing a connection structure between a first substrate and a second substrate. FIG. 1 is a diagram (part 1) showing a simulation result of return loss. FIG. 2 is a diagram (part 2) showing a connection structure between a first substrate and a second substrate. FIG. 3 is a diagram (part 3) showing a simulation result of return loss. FIG. 4 is a diagram (part 5) showing a connection structure between a first substrate and a second substrate. FIG. 6 is a diagram (part 1) showing a perspective view of a first substrate. FIG. 2 is a diagram (part 3) showing a perspective view of a first substrate.

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated.

[0011] 1 is an example of a block diagram of a communication device 10 to which an antenna device 120 including a substrate connection structure according to this embodiment is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, smartphone, or tablet, or a personal computer with communication functions. An example of the frequency band of radio waves used in the antenna device 120 according to this embodiment is millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz, and 60 GHz, but radio waves in other frequency bands are also applicable.

[0012] 1 , a communication device 10 includes an antenna module 100 and a BBIC 200 that constitutes a baseband signal processing circuit. The antenna module 100 includes an RFIC 110, which is an example of a power supply device, and an antenna device 120. The communication device 10 upconverts an intermediate frequency signal transmitted from the BBIC 200 to the antenna module 100 into a high frequency signal and radiates the high frequency signal from the antenna device 120, and also downconverts a high frequency signal received by the antenna device 120 into an intermediate frequency signal and processes the signal in the BBIC 200.

[0013] The antenna device 120 includes a dielectric substrate 130 on which a plurality of radiating elements 121 are arranged. The radiating element 121 is a flat-plate-shaped patch antenna. The dielectric substrate 130 is a substrate connection structure having a first substrate 131 and a second substrate 132 connected to each other with their normal directions different from each other. Both the first substrate 131 and the second substrate 132 have a flat-plate shape. The plurality of radiating elements 121 are arranged on a first main surface 132a of the second substrate 132.

[0014] 1 shows an example of an array configuration in which four radiating elements 121 are arranged in a line, but the number and arrangement of the radiating elements 121 are not limited to this. A single radiating element 121 may be arranged on the first main surface 132a of the second substrate 132, or five or more radiating elements 121 may be arranged. Also, an array configuration in which the radiating elements 121 are arranged two-dimensionally may be used.

[0015] The first substrate 131 and the second substrate 132 may be, for example, a low-temperature co-fired ceramics (LTCC) multilayer substrate, a multilayer resin substrate formed by stacking multiple resin layers made of resins such as epoxy and polyimide, a multilayer resin substrate formed by stacking multiple resin layers made of liquid crystal polymer (LCP) with a lower dielectric constant, a multilayer resin substrate formed by stacking multiple resin layers made of fluorine-based resin, a multilayer resin substrate formed by stacking multiple resin layers made of PET (Polyethylene Terephthalate), or a ceramic multilayer substrate other than LTCC. The first substrate 131 and the second substrate 132 do not necessarily have a multilayer structure and may be a single-layer substrate. Furthermore, the first substrate 131 and the second substrate 132 may be formed of the same dielectric or different dielectrics.

[0016] In the antenna module 100 according to this embodiment, a high frequency signal is supplied to each radiating element 121 from the corresponding power supply wiring 140. The antenna module 100 is a so-called single-band single-polarized type antenna module.

[0017] The RFIC 110 includes switches 111A to 111D, 113A to 113D, and 117, power amplifiers 112AT to 112DT, low-noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, a signal combiner / divider 116, a mixer 118, and an amplifier circuit 119.

[0018] When transmitting a high frequency signal, the switches 111A to 111D and 113A to 113D are switched to the side of the power amplifiers 112AT to 112DT, and the switch 117 is connected to the transmitting amplifier of the amplifier circuit 119. When receiving a high frequency signal, the switches 111A to 111D and 113A to 113D are switched to the side of the low noise amplifiers 112AR to 112DR, and the switch 117 is connected to the receiving amplifier of the amplifier circuit 119.

[0019] The intermediate frequency signal transmitted from the BBIC 200 is amplified by the amplifier circuit 119 and up-converted by the mixer 118. The up-converted high frequency signal, that is the transmission signal, is split into four by the signal combiner / divider 116, passes through the corresponding signal paths, and is fed to each different radiating element 121. By individually adjusting the phase shift of the phase shifters 115A to 115D arranged on each signal path, it is possible to adjust the directivity of the radio waves output from the radiating element 121. Furthermore, the attenuators 114A to 114D adjust the strength of the transmission signal.

[0020] The received signals, which are high-frequency signals received by each radiating element 121, are transmitted to the RFIC 110 and combined in the signal combiner / divider 116 via four different signal paths. The combined received signals are down-converted to intermediate frequency signals in the mixer 118, further amplified in the amplifier circuit 119, and transmitted to the BBIC 200.

[0021] The RFIC 110 may be formed, for example, as a one-chip integrated circuit component. Alternatively, a device (switch, power amplifier, low-noise amplifier, attenuator, phase shifter) corresponding to each radiating element may be formed as a one-chip integrated circuit component for each corresponding radiating element. The RFIC 110 may also be mounted on the first substrate 131 of the antenna device 120.

[0022] (Configuration of Dielectric Substrate 130) Next, a description will be given of the configuration of the dielectric substrate 130. As described above, the dielectric substrate 130 is a substrate connection structure having a first substrate 131 and a second substrate 132 that are connected to each other with their normal directions different from each other.

[0023] Fig. 2 is a diagram partially showing the connection structure between first substrate 131 and second substrate 132 in dielectric substrate 130. The upper left side (A) of Fig. 2 shows a perspective view of first substrate 131, the lower left side (B) of Fig. 2 shows a cross-sectional view of the connection portion between first substrate 131 and second substrate 132, and the lower right side (C) of Fig. 2 shows a perspective view of the connection portion between first substrate 131 and second substrate 132.

[0024] The first substrate 131 has an opposing surface 131a that faces the second substrate 132, and a main surface 131b on the opposite side to the opposing surface 131a.

[0025] The second substrate 132 has a first main surface 132 a, a second main surface 132 b opposite to the first main surface 132 a, and a side surface 132 c substantially perpendicular to the first main surface 132 a and the second main surface 132 b. The side surface 132 c of the second substrate 132 faces the opposing surface 131 a of the first substrate 131.

[0026] The normal direction of the opposing surface 131 a of the first substrate 131 and the normal direction of the first main surface 132 a of the second substrate 132 are approximately perpendicular to each other. The dielectric substrate 130, which is a substrate connection structure having the first substrate 131 and the second substrate 132, has an L-shape.

[0027] In the following description, the normal direction to the opposing surface 131 a of the first substrate 131 is defined as the Z-axis direction, the normal direction to the first main surface 132 a of the second substrate 132 is defined as the X-axis direction, and the direction perpendicular to the Z-axis and X-axis directions is defined as the Y-axis direction. In addition, the positive direction of the Z-axis in each drawing may be referred to as the upper side, and the negative direction may be referred to as the lower side.

[0028] The first substrate 131 has a first ground electrode GND1, a first signal line 141, and a first signal electrode E1.

[0029] The first ground electrode GND1 is disposed on the opposing surface 131a and extends in a plate shape along the opposing surface 131a. The first ground electrode GND1 may be disposed at a position (layer) between the opposing surface 131a and the first signal line 141. As shown in Fig. 2A, the first ground electrode GND1 has an opening 150 that opens to surround the first signal electrode E1 when viewed from the Z-axis direction.

[0030] The first signal line 141 is disposed opposite the opposing surface 131a and extends linearly in the X-axis direction.

[0031] The first signal electrode E1 is a conductor having a substantially rectangular parallelepiped shape for connecting the first signal line 141 to the outside of the first substrate 131. As shown in Fig. 2A, the first signal electrode E1 is disposed in a position (i.e., an area inside the opening 150) that does not overlap with the first ground electrode GND1 when viewed from the Z-axis direction. As shown in Fig. 2B, the upper surface of the first signal electrode E1 is connected to the tip portion of the first signal line 141. The lower surface of the first signal electrode E1 is exposed on the opposing surface 131a and is connected to the upper surface of the second signal electrode E2 via a solder bump C2.

[0032] The second substrate 132 has a second signal line 142, a second signal electrode E2, and a second ground electrode GND2.

[0033] The second signal line 142 is disposed opposite the first main surface 132a and extends linearly in the Z-axis direction.

[0034] The second signal electrode E2 is a conductor having a substantially rectangular parallelepiped shape for connecting the second signal line 142 to the outside of the second substrate 132. The lower surface of the second signal electrode E2 is connected to the tip portion of the second signal line 142. The size S of the second signal electrode E2 in the X-axis direction is ２ is the size S of the second signal line 142 in the X-axis direction. ３ The size S of the first signal electrode E1 in the X-axis direction is larger than １ is the size S of the second signal electrode E2 in the X-axis direction ２ It is roughly the same as:

[0035] The upper surface of the second signal electrode E2 is exposed on the side surface 132c and is connected to the lower surface of the first signal electrode E1 via a solder bump C2.

[0036] The combination of the first signal line 141, the first signal electrode E1, the second signal electrode E2, and the second signal line 142 functions as a single power supply wiring 140 (see Figure 1) that is arranged across the first substrate 131 and the second substrate 132.

[0037] The second ground electrode GND2 is disposed at a position (layer) between the first main surface 132a and the second signal line 142. The second ground electrode GND2 includes a first portion 161, a second portion 162, and a connecting conductor 170 such as a via.

[0038] The first portion 161 extends in a plate shape parallel to the first main surface 132 a. The upper end of the first portion 161 is exposed on the side surface 132 c and connected to the first ground electrode GND1 via the solder bump C2. Therefore, the combination of the first ground electrode GND1 and the second ground electrode GND2 functions as a ground electrode for the power supply wiring 140 that is disposed across the first substrate 131 and the second substrate 132.

[0039] The second portion 162 is disposed at a position (layer) between the first portion 161 and the second signal line 142 and extends in a plate shape parallel to the first portion 161. The upper end of the second portion 162 is connected to the first portion 161 via the connecting conductor 170. The upper end of the second portion 162 is disposed at a position lower than the lower end of the second signal electrode E2 in the Z-axis direction. That is, as shown in FIG. 2C , when the second ground electrode GND2 is viewed from the X-axis direction, the first portion 161 has a portion overlapping with the second signal electrode E2, but the second portion 162 does not have a portion overlapping with the second signal electrode E2.

[0040] The distance X2 in the X-axis direction between the second signal electrode E2 and the first portion 161 is greater than the distance X3 in the X-axis direction between the second signal line 142 and the second portion 162.

[0041] The distance X2 in the X-axis direction between the second signal electrode E2 and the first portion 161 and the shortest distance X between the first signal electrode E1 and the inner wall of the opening 150 in the X-axis direction are １ and the distance Y between the first signal electrode E1 and the inner wall of the opening 150 in the Y-axis direction. １ satisfies the following formula (1).

[0042] 0.5X2<Y １ <2X2 and X １ <Y １ ...(1) That is, distance Y １ is half the distance X2, and the distance X １ and is smaller than twice the distance X2.

[0043] In the dielectric substrate 130 having the above configuration, when connecting the first substrate 131 and the second substrate 132, the opposing surface 131a of the first substrate 131 and the side surface 132c of the second substrate 132 are connected via solder bumps C1 and C2. Therefore, compared to when the first substrate 131 and the second substrate 132 are connected via a bent portion, no space is required for arranging the bent portion, and the dielectric substrate 130 can be made smaller accordingly.

[0044] Furthermore, in the dielectric substrate 130, when transmitting a signal to the power supply wiring 140 (a combination of the first signal line 141, the first signal electrode E1, the second signal electrode E2, and the second signal line 142) arranged across the first substrate 131 and the second substrate 132, impedance matching can be achieved in each of the following (1) to (5).

[0045] (1) A first microstrip line formed by coupling between the first signal line 141 and the first ground electrode GND1.

[0046] (2) A first coplanar line formed by coupling between the first signal line 141 and the inner wall of the opening 150 in the Y-axis direction in the opening 150 of the first ground electrode GND1 (the distance YZ between the first signal line 141 and the inner wall of the opening 150 in the Y-axis direction).

[0047] (3) In the opening 150 of the first ground electrode GND1, a second coplanar line (distance Y １ ).

[0048] (4) A second microstrip line (distance X2) formed by coupling between the second signal electrode E2 and the first portion 161 of the second ground electrode GND2.

[0049] (5) A third microstrip line (distance X3) formed by coupling between the second signal line 142 and the second portion 162 of the second ground electrode GND2.

[0050] For example, when transmitting a signal from the first signal line 141 to the second signal line 142, the signal transmission line is converted sequentially from the first microstrip line to the first coplanar line and second coplanar line, the second microstrip line, and the third microstrip line, in that order.

[0051] Therefore, not only the transmission characteristics of the first microstrip line, but also the transmission characteristics of the first coplanar line (distance YZ) and the transmission characteristics of the second coplanar line (distance Y １), the transmission characteristics of the second microstrip line (distance X2), and the transmission characteristics of the third microstrip line (distance X3) can be adjusted to achieve impedance matching. As a result, impedance matching can be easily achieved.

[0052] In particular, in this embodiment, the distance Y between the first signal electrode E1 and the inner wall of the opening 150 in the Y-axis direction is １ is greater than half (=0.5X2) of the distance X2 between the second signal electrode E2 and the first portion 161 in the X-axis direction, and is greater than the shortest distance X between the first signal electrode E1 and the inner wall of the opening 150 in the X-axis direction. １ The distance X2 is set to a range greater than the distance X2 and smaller than twice the distance X2. By setting the distance X2 in this way, impedance matching can be achieved more easily.

[0053] Furthermore, the size S of the second signal electrode E2 in the X-axis direction ２ is the size S of the second signal line 142 in the X-axis direction. ３ Therefore, even if a slight misalignment occurs in the X-axis direction when mounting the second substrate 132 on the first substrate 131, the second signal electrode E2 can be properly connected to the first signal electrode E1.

[0054] Furthermore, the size S of the second signal electrode E2 in the X-axis direction ２ The size S of the second signal line 142 in the X-axis direction is ３ By making it larger than , reflection loss can be reduced.

[0055] 3 is a diagram showing an example of a simulation result of reflection loss when transmitting a signal using the power supply wiring 140 of the dielectric substrate 130 according to this embodiment. In FIG. 3, the horizontal axis represents frequency (GHz), and the vertical axis represents reflection loss. The reflection loss is expressed in decibels (dB) as the ratio of reflected power to input power. Therefore, the reflection loss is 0 dB when the reflectivity is 100% (total reflection), a negative value when the reflectivity is less than 100% (partial reflection), and the smaller the reflection, the smaller the value (the larger the negative absolute value).

[0056] 3, the results when using the dielectric substrate 130 according to this embodiment are shown by a solid line, and the results when using the configuration of the comparative example are shown by a dashed line. The configuration of the comparative example is a configuration in which the dielectric substrate 130 according to this embodiment is modified so that the distances X2 and X3 are the same value.

[0057] As can be seen from Figure 3, when the dielectric substrate 130 according to this embodiment is used, the return loss can be suppressed to a value lower than the reference value (-10 dB) in the entire simulated frequency range (20 to 50 GHz), which is a favorable result.

[0058] Furthermore, the result showed that the return loss when using the dielectric substrate 130 according to this embodiment was lower than the return loss when using the configuration of the comparative example across the entire simulated frequency range (20 to 50 GHz). This result is thought to be due to the fact that, while the distances X2 and X3 are the same value in the configuration of the comparative example, in the dielectric substrate 130 according to this embodiment, the distance X2 is greater than the distance X3.

[0059] The "first substrate 131" and the "second substrate 132" according to the present embodiment may correspond to the "first substrate" and the "second substrate" of the present disclosure, respectively.

[0060] The "first signal line 141" and the "first signal electrode E1" according to the present embodiment may correspond to the "first signal line" and the "first signal electrode" of the present disclosure, respectively.

[0061] The "first ground electrode GND1" and the "opening 150" according to this embodiment may correspond to the "first ground electrode" and the "opening" of the present disclosure, respectively.

[0062] The "second signal electrode E2" and the "second signal line 142" according to the present embodiment may correspond to the "second signal electrode" and the "second signal line" of the present disclosure, respectively.

[0063] The "second ground electrode GND2," "first portion 161," "second portion 162," and "connecting conductor 170" according to this embodiment may correspond to the "second ground electrode," "first portion," "second portion," and "connecting conductor" of the present disclosure, respectively.

[0064] The "Z-axis direction" and "X-axis direction" according to this embodiment may correspond to the "first direction" and "second direction" of the present disclosure.

[0065] According to this embodiment, the distance X １ ”, “distance ２ " and "Distance Y １ " may correspond to the "first distance," "second distance," and "third distance" of the present disclosure.

[0066] 4 is a diagram partially illustrating a connection structure between a first substrate 131 and a second substrate 132 in a dielectric substrate 130A according to Modification 1. In the dielectric substrate 130A according to Modification 1, the second ground electrode GND2 of the above-described dielectric substrate 130 is changed to a second ground electrode GND2A.

[0067] The second ground electrode GND2A is obtained by adding a third portion 163 to the above-described second ground electrode GND2. That is, the second ground electrode GND2A includes the third portion 163 in addition to the first portion 161, the second portion 162, and the connecting conductor 170.

[0068] The third portion 163 extends in a plate shape from the upper end of the second portion 162 (the connection portion between the second portion 162 and the connection conductor 170) in the positive direction of the Z axis (toward the side surface 132c).

[0069] The distance Z between the connecting conductor 170 and the second signal electrode E2 in the Z-axis direction １ is the size Z of the connecting conductor 170 in the Z-axis direction ２ is greater than.

[0070] By configuring in this manner, impedance matching can be easily achieved even when the connection conductor 170 is formed by a via. Specifically, when the connection conductor 170 is formed by a via, a certain area is required for the connection portion between the second portion 162 and the via. In the second ground electrode GND2A according to the first modification, the distance Z in the Z-axis direction between the connection conductor 170 and the second signal electrode E2 is 1 / 2 mm. １ is the size Z of the connecting conductor 170 in the Z-axis direction. ２ , it is possible to ensure an area required for connecting the second portion 162 and the via.

[0071] Furthermore, in the second ground electrode GND2A according to the present modified example 1, the provision of the third portion 163 makes it possible to adjust impedance disturbances caused by gaps between the distance X2 in the X-axis direction between the second signal electrode E2 and the first portion 161 and the distance X3 in the X-axis direction between the second signal line 142 and the second portion 162, thereby facilitating impedance matching.

[0072] 5 is a diagram showing an example of the simulation results of the reflection loss when a signal is transmitted using the feed wiring 140 of the dielectric substrate 130A according to the present modification 1. In Fig. 5, the results when the dielectric substrate 130A according to the present modification 1 is used are shown by a solid line, and the results when the configuration of the comparative example is used are shown by a dashed dotted line. The configuration of the comparative example is a configuration in which the third portion 163 is removed from the dielectric substrate 130A according to the present modification 1.

[0073] As can be seen from FIG. 5, the reflection loss when the dielectric substrate 130A according to the first modification is used is reduced compared to the reflection loss when the configuration of the comparative example is used.

[0074] The "second ground electrode GND2A" according to the present modification example 1 can correspond to the "second ground electrode" of the present disclosure.

[0075] 6 is a diagram partially showing the connection structure between the first substrate 131 and the second substrate 132 in a dielectric substrate 130B according to Modification 2. In the dielectric substrate 130B according to Modification 2, the first signal electrode E1 and the second signal electrode E2 of the above-described dielectric substrate 130 are changed to a first signal electrode E1B and a second signal electrode E2B, respectively.

[0076] The size S of the second signal electrode E2B in the X-axis direction ２ is the size S of the second signal line 142 in the X-axis direction. ３ The size S of the first signal electrode E1B in the X-axis direction is approximately the same as １ is the size S of the second signal electrode E2 in the X-axis direction ２ It is roughly the same as:

[0077] 7 is a diagram showing an example of the simulation results of the return loss when a signal is transmitted using the feed wiring 140 of the dielectric substrate 130B according to the present modification 2. In Fig. 7, the results when the dielectric substrate 130B according to the present modification 2 is used are shown by a solid line, and the results when the configuration of the comparative example is used are shown by a dashed dotted line. The configuration of the comparative example is a configuration in which the dielectric substrate 130B according to the present modification 2 is modified so that the distance X2 and the distance X3 have the same value.

[0078] As can be seen from FIG. 7, the reflection loss when the dielectric substrate 130B according to the second modification is used is reduced compared to the reflection loss when the configuration of the comparative example is used.

[0079] The "first signal electrode E1B" and the "second signal electrode E2B" according to the present modification example 2 may correspond to the "first signal electrode" and the "second signal electrode" of the present disclosure, respectively.

[0080] 8 is a diagram partially showing the connection structure between the first substrate 131 and the second substrate 132 in a dielectric substrate 130C according to Modification 3. In the dielectric substrate 130C according to Modification 3, the second signal electrode E2 of the dielectric substrate 130A according to Modification 1 described above is changed to a second signal electrode E2B.

[0081] The second signal electrode E2B is a conductor having a semi-cylindrical shape when viewed from the X-axis direction. In this way, the shape of the second signal electrode E2B is not limited to a rectangular parallelepiped shape, and may be a semi-cylindrical shape.

[0082] The "second signal electrode E2B" according to the present modification example 3 can correspond to the "second signal electrode" of the present disclosure.

[0083] 9 is a diagram partially illustrating a connection structure between the first substrate 131 and the second substrate 132 in a dielectric substrate 130D according to Modification 4. In the dielectric substrate 130D according to Modification 4, the first signal electrode E1 of the dielectric substrate 130A according to Modification 1 described above is changed to a first signal electrode E1D.

[0084] The first signal electrode E1D has a first pad 181 , a second pad 182 , and a connecting conductor 183 .

[0085] The first pad 181 is connected to the tip portion of the first signal line 141. The second pad 182 is exposed on the opposing surface 131a and is connected to the upper surface of the second signal electrode E2 via a solder bump C2. The first pad 181 and the second pad 182 are connected by a connection conductor 183 such as a via.

[0086] In this way, the shape of the second signal electrode E2B is not limited to a rectangular parallelepiped shape, but may be a shape in which two upper and lower pads are connected by a via or the like.

[0087] The "first signal electrode E1D" according to the present modification 4 can correspond to the "first signal electrode" of the present disclosure.

[0088] 10 is a diagram partially illustrating a connection structure between the first substrate 131 and the second substrate 132 in a dielectric substrate 130E according to Modification 5. The dielectric substrate 130E according to Modification 5 is obtained by adding a specific portion 200 to the first substrate 131 according to the above-described embodiment, and by changing the second signal electrode E2 and the second ground electrode GND2 according to the above-described embodiment to a second signal electrode E2E and a second ground electrode GND2E, respectively.

[0089] The specific portion 200 is a flat ground electrode that extends from the inner wall of the opening 150 in the positive direction of the Z axis (toward the virtual line 201) at a position where, when a virtual line 201 (dotted line) is drawn from the tip of the first signal line 141 in the extension direction of the first signal line 141, the virtual line 201 overlaps with the inner wall of the opening 150 of the first ground electrode GND1 as viewed from the Z axis direction.

[0090] The distance X between the first signal electrode E1 and the specific portion 200 in the X-axis direction ４ is approximately equal to the distance X2 between the second signal electrode E2 and the first portion 161 in the X-axis direction.

[0091] The second signal electrode E2E has a smaller size in the Z-axis direction than the second signal electrode E2 described above, and accordingly, the position of the connection conductor 170 of the second ground electrode GND2E is shifted upward (in the positive direction of the Z-axis) relative to the position of the connection conductor 170 of the second ground electrode GND2 described above.

[0092] In the dielectric substrate 130E according to the fifth modified example, in addition to the features (1) to (5) described in the above-described embodiment, (1-1) a fourth microstrip line (distance X ４ That is, in the dielectric substrate 130E according to the fifth modification, impedance matching can be achieved in each of the following (1), (1E), (2), (3), (4), and (5).

[0093] (1) The first microstrip line. (1-1) The fourth microstrip line (distance X) formed by coupling between the first signal electrode E1 and the specific portion 200. ４ In the fifth modification, the fourth microstrip line (distance X ４ ) impedance matching is added to the above embodiment.

[0094] (2) First coplanar line (distance YZ). (3) Second coplanar line (distance Y １ ).

[0095] (4) Second microstrip line (distance X2). (5) Third microstrip line (distance X3).

[0096] For example, when transmitting a signal from the first signal line 141 to the second signal line 142, the signal transmission line is converted sequentially in the following order: from the first microstrip line, to the fourth microstrip line, to the first coplanar line and the second coplanar line, to the second microstrip line, and to the third microstrip line.

[0097] Therefore, not only the transmission characteristics of the first microstrip line but also the transmission characteristics of the fourth microstrip line (distance X ４ ), transmission characteristics of the first coplanar line (distance YZ), transmission characteristics of the second coplanar line (distance Y １ By adjusting the transmission characteristics of the first microstrip line (distance X2) and the third microstrip line (distance X3), impedance matching can be achieved. As a result, impedance matching can be achieved more easily.

[0098] Furthermore, in the fifth modified example, the distance X between the first signal electrode E1 and the specific portion 200 in the X-axis direction is ４ is approximately equal to the distance X2 in the X-axis direction between the second signal electrode E2 and the first portion 161. Therefore, part of the impedance matching that was handled by the second microstrip line (distance X2) formed on the second substrate 132 is now handled by the fourth microstrip line (distance X ４ ) In this way, in the present modification 5, the size of the second signal electrode E2E in the Z-axis direction can be made smaller than the size of the second signal electrode E2 described above in the Z-axis direction, and accordingly, the position of the connecting conductor 170 in the Z-axis direction can be shifted upward. As a result, the size of the second substrate 132 in the Z-axis direction can be reduced.

[0099] The "specific portion 200," "second signal electrode E2E," and "second ground electrode GND2E" according to this modification example 5 may correspond to the "specific portion," "second signal electrode," and "second ground electrode" of the present disclosure, respectively.

[0100] 11 is a perspective view of a first substrate 131 according to Modification 6. In the first substrate 131 according to Modification 6, a plurality of combinations of a first signal line 141, a first signal electrode E1, and an opening 150 are arranged side by side in the Y-axis direction.

[0101] That is, in the present modification 6, a single power supply wiring 140 (first signal line 141 and first signal electrode E1) passes through one opening 150. Therefore, the size Y of each opening 150 in the Y-axis direction is ２ is the distance Y between two adjacent first signal lines 141 in the Y-axis direction. ３ is less than half of the

[0102] In this way, it is possible to arrange a plurality of power supply lines 140 while maintaining isolation characteristics between the power supply lines 140. As a result, it is possible to accommodate an array configuration in which a plurality of radiating elements 121 are arranged on the second substrate 132. It is also possible to accommodate a configuration in which a dual-band or dual-polarized radiating element is arranged on the second substrate 132.

[0103] [Variation 7] In the above-described embodiment, when the first signal electrode E1 is viewed from the Z-axis direction, the first signal electrode E1 is completely surrounded by the first ground electrode GND1. That is, the first signal electrode E1 is surrounded by the first ground electrode GND1 from four directions (the positive X-axis direction, the negative X-axis direction, the positive Y-axis direction, and the negative Y-axis direction).

[0104] However, when viewed from the Z-axis direction, the first signal electrode E1 does not necessarily need to be surrounded by the first ground electrode GND1 from four directions, but only needs to be sandwiched between the first ground electrodes GND1 from at least two directions.

[0105] FIG. 12 is a perspective view of a first substrate 131A according to an example of Modification 7. In the first substrate 131A, the first ground electrode GND1 of the first substrate 131 described above is replaced with a first ground electrode GND1A. As shown in FIG. 12 , the first ground electrode GND1A is divided into a portion disposed in the negative X-axis direction relative to the first signal electrode E1 and a portion disposed in the positive X-axis direction relative to the first signal electrode E1, and is configured so that the first signal electrode E1 is sandwiched between the two divided portions. Even with this first ground electrode GND1A, the same effects as those of the above-described embodiment can be achieved.

[0106] FIG. 13 is a perspective view of a first substrate 131B according to another example of the seventh modified example. In the first substrate 131B, the first ground electrode GND1 of the first substrate 131 described above is replaced with a first ground electrode GND1B. As shown in FIG. 13 , the first ground electrode GND1B has an opening 150B that opens to surround the periphery of the first signal electrode E1, but a portion surrounding the periphery from the positive X-axis direction is cut out. In other words, the opening 150B opens to surround the periphery of the first signal electrode E1 from at least three directions (the negative X-axis direction, the positive Y-axis direction, and the negative Y-axis direction). Even with this first ground electrode GND1B, the same effects as those of the above-described embodiment can be achieved.

[0107] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and is intended to include all modifications within the meaning and scope of the claims.

[0108] It will be understood by those skilled in the art that the above-described embodiments and their modifications are specific examples of the following aspects.

[0109] (Item 1) A substrate connection structure according to the present disclosure includes a first substrate and a second substrate having a main surface and a side surface that intersect with each other. The first substrate has an opposing surface facing the side surface of the second substrate, a first signal line arranged opposite the opposing surface, a plate-shaped first ground electrode arranged on the opposing surface or arranged opposite the opposing surface at a position between the opposing surface and the first signal line, and a first signal electrode connected to the first signal line and exposed on the opposing surface. The second substrate has a second signal line arranged opposite the main surface, a plate-shaped second ground electrode arranged opposite the main surface at a position between the main surface and the second signal line, and a second signal electrode connected to the second signal line and exposed on the side surface and connected to the first signal electrode. The first ground electrode is configured to sandwich the first signal electrode from at least two directions when viewed from a first direction that is normal to the opposing surface. The second ground electrode includes a first portion connected to the first ground electrode and a second portion connected to the first portion. When viewed from a second direction that is a normal direction to the main surface, at least a part of the first portion overlaps with the second signal electrode, and the second portion does not overlap with the second signal electrode, and the distance in the second direction between the second signal electrode and the first portion is greater than the distance in the second direction between the second signal line and the second portion.

[0110] (Item 2) In the substrate connection structure described in item 1, the size of the second signal electrode in the second direction is larger than the size of the second signal line in the second direction.

[0111] (Item 3) In the substrate connection structure described in Items 1 or 2, the second ground electrode further includes a connection conductor extending in the second direction to connect the first portion and the second portion, and a third portion extending in the first direction from the connection portion between the connection conductor and the second portion. The distance in the first direction between the connection conductor and the second signal electrode is greater than the size of the connection conductor in the first direction.

[0112] (Item 4) In the substrate connection structure described in item 1 or 2, the second signal electrode has a rectangular parallelepiped shape or a semi-cylindrical shape.

[0113] (Item 5) In the substrate connection structure described in Items 1 or 2, the first ground electrode has an opening that surrounds the first signal electrode when viewed from a first direction. When the shortest distance between the first signal electrode and an inner wall of the opening in the extension direction of the first signal line is defined as a first distance, the distance in the second direction between the second signal electrode and the first portion is defined as a second distance, and the distance between the first signal electrode and the inner wall of the opening in a direction perpendicular to the first direction and the extension direction of the first signal line is defined as a third distance, the third distance is greater than half the second distance, greater than the first distance, and less than twice the second distance.

[0114] (Item 6) In the substrate connection structure described in Items 1 or 2, the first ground electrode has an opening that surrounds the first signal electrode when viewed from the first direction. The first ground electrode further includes a specific portion that extends in the first direction from an inner wall of the opening toward the imaginary line at a position where, when an imaginary line is drawn from the first signal line in the extension direction of the first signal line, the imaginary line overlaps with the inner wall of the opening when viewed from the first direction. The distance in the second direction between the first signal electrode and the specific portion is approximately equal to the distance in the second direction between the second signal electrode and the first portion.

[0115] (Item 7) In the substrate connection structure described in Items 1 or 2, the first ground electrode has an opening that opens so as to surround the first signal electrode when viewed from the first direction. A plurality of combinations of the first signal line, the first signal electrode, and the opening are arranged in a line along the opposing surface of the first substrate.

[0116] (Item 8) An antenna device according to the present disclosure includes the substrate connection structure according to any one of items 1 to 7.

[0117] (Claim 9) A communication device according to the present disclosure includes a substrate connection structure or an antenna device according to any one of claims 1 to 8.

[0118] 10 Communication device, 100 Antenna module, 111A to 113D, 117 Switch, 112AR to 112DR Low noise amplifier, 112AT to 112DT Power amplifier, 114A to 114D Attenuator, 115A to 115D Phase shifter, 116 Distributor, 118 Mixer, 119 Amplification circuit, 120 Antenna device, 121 Radiating element, 130, 130A, 130B, 130C, 130D, 130E Dielectric substrate (connection structure), 131, 131A, 131B First substrate, 131a Opposing surface, 131b Main surface, 132 Second substrate, 132a First main surface, 132b Second main surface, 132c Side, 140 Power supply wiring, 141 First signal line, 142 Second signal line, 150, 150B Opening, 161 First portion, 162 Second portion, 163 Third portion, 170, 183 Connecting conductor, 181 First pad, 182 Second pad, 200 Specific portion, 201 Virtual line, C1, C2 Solder bump, E1, E1B, E1D First signal electrode, E2, E2E, E2B Second signal electrode, GND1, GND1A, GND1B First ground electrode, GND2, GND2E, GND2A Second ground electrode.

Claims

1. A semiconductor device comprising a first substrate and a second substrate having a main surface and a side surface intersecting each other, wherein the first substrate has: an opposing surface opposing the side surface of the second substrate; a first signal line arranged opposite the opposing surface; a plate-shaped first ground electrode arranged on the opposing surface or arranged opposite the opposing surface at a position between the opposing surface and the first signal line; and a first signal electrode connected to the first signal line and exposed on the opposing surface; wherein the second substrate has: a second signal line arranged opposite the main surface; a plate-shaped second ground electrode arranged opposite the main surface at a position between the main surface and the second signal line; and a second signal electrode connected to the second signal line, exposed on the side surface and connected to the first signal electrode; wherein the first ground electrode is configured to sandwich the first signal electrode from at least two directions when viewed from a first direction which is a normal direction to the opposing surface; and wherein the second ground electrode has: a first portion connected to the first ground electrode; a second portion connected to the first portion, when viewed from a second direction that is a normal direction of the main surface, at least a portion of the first portion overlaps with the second signal electrode and the second portion does not overlap with the second signal electrode, and a distance in the second direction between the second signal electrode and the first portion is greater than a distance in the second direction between the second signal line and the second portion.

2. The substrate connection structure according to claim 1, wherein the size of the second signal electrode in the second direction is larger than the size of the second signal line in the second direction.

3. A substrate connection structure as described in claim 1 or 2, wherein the second ground electrode further includes a connecting conductor extending in the second direction to connect the first portion and the second portion, and a third portion extending in the first direction from the connection portion between the connecting conductor and the second portion, and the distance in the first direction between the connecting conductor and the second signal electrode is greater than the size of the connecting conductor in the first direction.

4. The substrate connection structure according to claim 1 or 2, wherein the second signal electrode has a rectangular parallelepiped shape or a semi-cylindrical shape.

5. The substrate connection structure according to claim 1 or 2, wherein the first ground electrode has an opening that opens to surround the first signal electrode when viewed from the first direction, and when the shortest distance between the first signal electrode and an inner wall of the opening in the extension direction of the first signal line is defined as a first distance, the distance in the second direction between the second signal electrode and the first portion is defined as a second distance, and the distance between the first signal electrode and the inner wall of the opening in a direction perpendicular to the first direction and the extension direction of the first signal line is defined as a third distance, the third distance is greater than half of the second distance, greater than the first distance, and smaller than twice the second distance.

6. A substrate connection structure as described in claim 1 or 2, wherein the first ground electrode has an opening that opens to surround the first signal electrode when viewed from the first direction, and further comprises a specific portion that extends in the first direction from an inner wall of the opening toward an imaginary line at a position where, when an imaginary line is drawn from the first signal line in the extension direction of the first signal line, the imaginary line overlaps with the inner wall of the opening when viewed from the first direction, and the distance in the second direction between the first signal electrode and the specific portion is approximately equal to the distance in the second direction between the second signal electrode and the first portion.

7. A substrate connection structure as described in claim 1 or 2, wherein the first ground electrode has an opening that opens to surround the first signal electrode when viewed from the first direction, and multiple combinations of the first signal line, the first signal electrode, and the opening are arranged in a line along the opposing surface of the first substrate.

8. An antenna device comprising a substrate connection structure according to any one of claims 1 to 7.

9. A communication device comprising a substrate connection structure or an antenna device according to any one of claims 1 to 8.

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