Imaging device, electronic apparatus, and method for manufacturing imaging device

Abstract

An imaging device according to an embodiment of the present invention comprises: a pixel region having a plurality of pixels; an outer peripheral region that is a region around the pixel region; and a reinforcing member provided in the outer peripheral region.

Description

Imaging device, electronic device, and method of manufacturing imaging device

[0001] The present disclosure relates to an imaging device, an electronic device, and a method for manufacturing an imaging device.

[0002] Conventionally, in imaging devices (also referred to as solid-state imaging devices or solid-state imaging elements), a cavityless structure in which no gap is provided between the semiconductor substrate and the glass substrate has been adopted as a structure in which a glass substrate is joined to a semiconductor substrate in order to seal a pixel region in which a plurality of pixels are arranged.

[0003] In imaging devices with a cavityless structure, higher-order light of diffracted light that reflects off the surface of the semiconductor substrate and enters the glass substrate may undergo total reflection on the surface of the glass substrate and then return to the pixel area. In other words, in a cavityless structure, a resin with a refractive index similar to that of the glass substrate (1.51) is embedded between the semiconductor substrate and the glass substrate, and light reflected from the semiconductor surface exits from a high-refractive medium into air (a low-refractive medium), resulting in total reflection if the angle of incidence exceeds the critical angle. This light may return to the pixel area, causing the higher-order light of the diffracted light to produce a ring-shaped flare, adversely affecting image quality.

[0004] To address this issue, image pickup devices with a glass-free chip-size package, or glass-free structure, have been developed that suppresses the occurrence of ring-shaped flare by connecting terminals from the back surface of the image pickup device without bonding a glass substrate to the front surface, and improves connectivity with the mounting board through back surface terminal connections. This glass-free structure image pickup device has the same structure as the image pickup device with a glass structure, with the terminals connected from the back surface, but does not have a glass substrate on the light-receiving surface.

[0005] Japanese Patent Application Laid-Open No. 2022-44653

[0006] However, in an imaging device without a glass substrate, the strength of the device (chip strength) is reduced compared to an imaging device with a glass substrate, and the device (chip) may be damaged by external impact, especially at the edge of the imaging device.

[0007] Therefore, the present disclosure proposes an imaging device, an electronic device, and a method for manufacturing an imaging device that can improve the strength of the device.

[0008] An imaging device according to an embodiment includes a pixel region having a plurality of pixels, a peripheral region that is a region surrounding the pixel region, and a reinforcing member provided in the peripheral region.

[0009] An electronic device according to an embodiment includes an imaging device, the imaging device having a pixel region having a plurality of pixels, a peripheral region that is a region surrounding the pixel region, and a reinforcing member provided in the peripheral region.

[0010] The method for manufacturing an imaging device according to the embodiment includes providing a reinforcing member in a peripheral region that is a region surrounding a pixel region having a plurality of pixels.

[0011] 1 is a diagram illustrating an example of the configuration of an imaging device according to the first embodiment; FIG. 2 is a cross-sectional view illustrating an example of the configuration of an imaging device of Example 1 according to the first embodiment; FIG. 3 is a plan view illustrating an example of an arrangement of a reinforcing member of the imaging device of Example 1 according to the first embodiment; FIG. 4 is an explanatory view for explaining an example of a method for forming a reinforcing member of the imaging device of Example 1 according to the first embodiment; FIG. 5 is a plan view illustrating another example of an arrangement of a reinforcing member of the imaging device of Example 1 according to the first embodiment; FIG. 6 is a cross-sectional view illustrating an example of the configuration of an imaging device of Example 2 according to the first embodiment; FIG. 7 is a cross-sectional view illustrating an example of the configuration of an imaging device of Example 3 according to the first embodiment; FIG. 8 is a cross-sectional view illustrating an example of the configuration of an imaging device of Example 4 according to the first embodiment; FIG. 9 is a cross-sectional view illustrating an example of the configuration of an imaging device of Example 5 according to the first embodiment; FIG. 10 is a cross-sectional view illustrating an example of the configuration of an imaging device of Example 6 according to the first embodiment; FIG. 11 is a cross-sectional view illustrating an example of the configuration of an imaging device of Example 7 according to the first embodiment; FIG. 12 is a cross-sectional view illustrating an example of the configuration of an imaging device and a lens unit of Example 7 according to the first embodiment; FIG. 13 is a cross-sectional view illustrating an example of the configuration of an imaging device of Example 8 according to the first embodiment; FIG. 14 is a cross-sectional view illustrating an example of the configuration of an imaging device of Example 9 according to the first embodiment; FIG. 15 is a cross-sectional view illustrating an example of the configuration of an imaging device of Example 10 according to the first embodiment. 10 is a plan view showing an example of the shape of a reinforcing member of an imaging device of Example 11 according to the first embodiment. FIG. 11 is a cross-sectional view showing an example of the configuration of an imaging device of Example 12 according to the first embodiment. FIG. 12 is a cross-sectional view showing an example of the arrangement of a reinforcing member of an imaging device of Example 12 according to the first embodiment. FIG. 13 is a cross-sectional view showing an example of the configuration of an imaging device of Example 11 according to the first embodiment. FIG. 14 is a cross-sectional view showing an example of the configuration of an imaging device of Example 14 according to the second embodiment. FIG. 15 is a cross-sectional view showing an example of the configuration of an imaging device of Example 16 according to the second embodiment. FIG. 16 is a cross-sectional view showing an example of the configuration of an imaging device of Example 17 according to the second embodiment. FIG. 17 is a cross-sectional view showing an example of the configuration of an imaging device of Example 18 according to the second embodiment. FIG. 18 is a cross-sectional view showing an example of the configuration of an imaging device of Example 19 according to the second embodiment.10 is a cross-sectional view showing an example of the configuration of an imaging device of Example 10 according to the second embodiment. FIG. 11 is a cross-sectional view showing an example of the configuration of an imaging device of Example 12 according to the second embodiment. FIG. 12 is a cross-sectional view showing an example of the configuration of an imaging device of Example 13 according to the second embodiment. FIG. 13 is a cross-sectional view showing an example of the configuration of an imaging device of Example 14 according to the second embodiment. FIG. 14 is a cross-sectional view showing an example of the manufacturing process of an imaging device of Example 1 according to the second embodiment. FIG. 15 is a cross-sectional view showing an example of the configuration of an imaging device of Example 16 according to the second embodiment. FIG. 16 is a cross-sectional view showing an example of the configuration of an imaging device of Example 17 according to the second embodiment. FIG. 17 is a cross-sectional view showing an example of the configuration of an imaging device of Example 18 according to the second embodiment. FIG. 18 is a cross-sectional view showing an example of the configuration of an imaging device of Example 19 according to the second embodiment. FIG. 19 is a cross-sectional view showing an example of the manufacturing process of an imaging member according to the second embodiment. 10 is a diagram showing an example of a manufacturing process for an imaging device of Example 15 according to the second embodiment. FIG. 11 is a diagram showing an example of a manufacturing process for an imaging device of Example 16 according to the second embodiment. FIG. 12 is a diagram showing an example of a manufacturing process for an imaging device of Example 17 according to the second embodiment. FIG. 13 is a diagram showing an example of a manufacturing process for an imaging device of Example 18 according to the second embodiment. FIG. 14 is a diagram showing an example of a manufacturing process for an imaging device of Example 19 according to the second embodiment. FIG. 15 is a cross-sectional view showing an example of the configuration of an imaging device of Example 20 according to the second embodiment. FIG. 16 is a cross-sectional view showing an example of the configuration of an imaging device of Example 21 according to the second embodiment. FIG. 17 is a cross-sectional view showing an example of the configuration of an imaging device of Example 22 according to the second embodiment. FIG. 18 is a cross-sectional view showing an example of the configuration of an imaging device of Example 23 according to the second embodiment. FIG. 19 is a cross-sectional view showing an example of the configuration of an imaging device of Example 24 according to the second embodiment. FIG. 19 is a cross-sectional view showing an example of the configuration of an imaging device of Example 25 according to the second embodiment. FIG. 19 is a cross-sectional view showing an example of the configuration of an imaging device of Example 26 according to the second embodiment.10 is a cross-sectional view showing another example of a manufacturing process of an imaging device of Example 26 according to the second embodiment; FIG. 11 is a cross-sectional view showing an example of the configuration of an imaging device of Example 1 according to the third embodiment; FIG. 12 is a cross-sectional view showing an example of the configuration of an imaging device of Example 2 according to the third embodiment; FIG. 13 is a cross-sectional view showing an example of the configuration of an imaging device of Example 3 according to the third embodiment; FIG. 14 is a cross-sectional view showing an example of the configuration of an imaging device of Example 4 according to the third embodiment; FIG. 15 is a cross-sectional view showing an example of the configuration of an imaging device of Example 5 according to the third embodiment; FIG. 16 is a cross-sectional view showing an example of the shape of a reinforcing member according to the third embodiment; FIG. 17 is a cross-sectional view showing another example of the shape of a reinforcing member according to the third embodiment; FIG. 18 is a plan view showing an example of the arrangement of a reinforcing member according to the third embodiment; FIG. 19 is a plan view showing another example of the arrangement of a reinforcing member according to the third embodiment; FIG. 19 is a cross-sectional view showing an example of the manufacturing process of an imaging device of Example 1 according to the third embodiment; FIG. 19 is a cross-sectional view showing an example of the configuration of an imaging device of Example 1 according to the fourth embodiment; FIG. 19 is a cross-sectional view showing an example of the configuration of an imaging device of Example 2 according to the fourth embodiment; FIG. 19 is a cross-sectional view showing an example of the configuration of an imaging device of Example 3 according to the fourth embodiment; FIG. 19 is a cross-sectional view showing an example of the configuration of an imaging device of Example 4 according to the fourth embodiment; 10A and 10B are cross-sectional views showing an example of the configuration of an imaging device of Example 6 according to the fourth embodiment; FIG. 11A and 11B are cross-sectional views showing an example of the configuration of an imaging device of Example 6 according to the fourth embodiment; FIG. 12A and 12B are cross-sectional views showing an example of the configuration of an imaging device of Example 7 according to the fourth embodiment; FIG. 13A and 13B are cross-sectional views showing an example of the configuration of an imaging device of Example 8 according to the fourth embodiment; FIG. 14A and 14B are cross-sectional views showing an example of the configuration of an imaging device of Example 9 according to the fourth embodiment; FIG. 15A and 15B are cross-sectional views showing an example of the configuration of an imaging device of Example 10 according to the fourth embodiment; FIG. 16A and 16B are cross-sectional views showing an example of the configuration of an imaging device of Example 11 according to the fourth embodiment; FIG. 17A and 17B are plan views showing an example of the arrangement of reinforcing members according to the fourth embodiment; FIG. 18A and 18B are plan views showing another example of the arrangement of reinforcing members according to the fourth embodiment; FIG. 19A and 19B are plan views showing another example of the arrangement of reinforcing members according to the fourth embodiment;10A and 10B are cross-sectional views showing an example of a manufacturing process for an imaging device of Example 1 according to the fourth embodiment. FIG. 11A is a cross-sectional view showing an example of a manufacturing process for an imaging device of Example 4 according to the fourth embodiment. FIG. 12A is a cross-sectional view showing an example of a manufacturing process for an imaging device of Example 10 according to the fourth embodiment. FIG. 13B is a cross-sectional view showing an example of a configuration of an imaging device of Example 1 according to the fifth embodiment. FIG. 14B is a cross-sectional view showing an example of a manufacturing process for an imaging device of Example 1 according to the fifth embodiment. FIG. 15A is a plan view showing a cut line according to the fifth embodiment. FIG. 16A is a cross-sectional view showing an example of a manufacturing process for an imaging device of a comparative example according to the fifth embodiment. FIG. 17A is a cross-sectional view showing an example of a configuration of an imaging device of Example 2 according to the fifth embodiment. FIG. 18A is a cross-sectional view showing an example of a configuration of an imaging device of Example 3 according to the fifth embodiment. FIG. 19A is a cross-sectional view showing an example of a configuration of an imaging device of Example 4 according to the fifth embodiment. FIG. 19B is a diagram showing an application example using an imaging device. FIG. 19C is a diagram showing an example of a configuration of an imaging device according to an application example. FIG. 19D is a diagram showing an example of a configuration of a distance measuring device according to an application example.

[0012] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments include examples and modified examples. Note that the embodiments do not limit the devices, equipment, methods, etc. according to the present disclosure. Furthermore, in the following embodiments, essentially identical components are designated by the same reference numerals, and redundant explanations will be omitted.

[0013] One or more of the following embodiments can be implemented independently. However, at least a portion of the following embodiments may be implemented in appropriate combination with at least a portion of another embodiment. These embodiments may include novel features that are different from one another. Therefore, each embodiment may contribute to solving different objectives or problems and may achieve different effects. The effects of each embodiment are merely examples and are not intended to be limiting, and other effects may also be achieved.

[0014] The present disclosure will be described in the following order of items. 1. First Embodiment 1-1. Configuration Example of Imaging Device 1-2. Example 1 of Imaging Device 1-2-1. Detailed Configuration Example of Imaging Device 1-2-2. Example of Method of Forming Reinforcing Member 1-2-3. Other Arrangement Examples of Reinforcing Member 1-3. Example 2 of Imaging Device 1-4. Example 3 of Imaging Device 1-5. Example 4 of Imaging Device 1-6. Example 5 of Imaging Device 1-7. Example 6 of Imaging Device 1-8. Example 7 of Imaging Device 1-9. Example 8 of Imaging Device 1-10. Example 9 of Imaging Device 1-11. Example 10 of Imaging Device 1-12. Example 11 of Imaging Device 1-13. Example 12 of Imaging Device 2. Second Embodiment 2-1. Example 1 of Imaging Device 2-2. Example 2 of Imaging Device 2-3. Example 3 of Imaging Device 2-4. Example 4 of Imaging Device 2-5. 2-1. Example 5 of Imaging Device 2-6. Example 6 of Imaging Device 2-7. Example 7 of Imaging Device 2-8. Example 8 of Imaging Device 2-9. Example 9 of Imaging Device 2-10. Example 10 of Imaging Device 2-11. Example 11 of Imaging Device 2-12. Example 12 of Imaging Device 2-13. Example 13 of Imaging Device 2-14. Example 14 of Imaging Device 2-15. Example of Manufacturing Process of Imaging Device 2-16. Example 15 of Imaging Device 2-17. Example 16 of Imaging Device 2-18. Example 17 of Imaging Device 2-19. Example 18 of Imaging Device 2-20. Example 19 of Imaging Device 2-21. Example of Manufacturing Process of Imaging Device 2-22. Example 20 of Imaging Device 2-23. Example 21 of Imaging Device 2-24. Example 22 of Imaging Device 2-25. Example 23 of Imaging Device 2-26. 1. Example of Imaging Device 24 2-27. Example of Imaging Device 25 2-28. Example of Imaging Device 26 2-29. Example of Manufacturing Process of Imaging Device 3. Third Embodiment 3-1. Example of Imaging Device 1 3-2. Example of Imaging Device 2 3-3. Example of Imaging Device 3 3-4. Example of Imaging Device 4 3-5. Example of Imaging Device 5 3-6. Example of Shape of Reinforcing Member 3-7. Example of Arrangement of Reinforcing Member 3-8. Example of Manufacturing Process of Imaging Device 4. Fourth Embodiment 4-1. Example of Imaging Device 1 4-2. Example of Imaging Device 2 4-3. Example of Imaging Device 3 4-4. Example of Imaging Device 4 4-5. Example of Imaging Device 54-6. Example 6 of imaging device 4-7. Example 7 of imaging device 4-8. Example 8 of imaging device 4-9. Example 9 of imaging device 4-10. Example 10 of imaging device 4-11. Example 11 of imaging device 4-12. Example of arrangement of reinforcing member 4-13. Example of manufacturing process of imaging device 5. Fifth embodiment 5-1. Example 1 of imaging device 5-2. Example 2 of imaging device 5-3. Example 3 of imaging device 5-4. Example 4 of imaging device 6. Functions and effects according to embodiment 7. Other embodiments 8. Application examples 8-1. Imaging device 8-2. Distance measuring device 9. Supplementary notes

[0015] <1. First embodiment> <1-1. Configuration example of imaging device> An example of the configuration of an imaging device 10 according to a first embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing an example of the configuration of the imaging device 10 according to the first embodiment. The imaging device 10 is an example of a semiconductor device.

[0016] 1, the imaging device 10 includes a pixel array unit 11, a vertical drive unit 12, a column signal processing unit 13, and a control unit 14. The imaging device 10 is, for example, a solid-state imaging device that generates image data of a subject.

[0017] The pixel array unit 11 is configured by arranging a plurality of pixels 100. In the example of FIG. 1, the pixels 100 are arranged in a two-dimensional matrix. Each pixel 100 includes a photoelectric conversion unit 101 that performs photoelectric conversion of incident light, and generates an image signal of a subject based on the incident light. For example, a photodiode can be used as the photoelectric conversion unit 101.

[0018] A signal line 15 and a signal line 16 are connected to each pixel 100. The pixel 100 generates an image signal under control of a control signal transmitted through the signal line 15, and outputs the generated image signal to the column signal processing unit 13 via the signal line 16. The signal line 15 is arranged for each row of the two-dimensional matrix, and is commonly connected to multiple pixels 100 arranged in one row. The signal line 16 is arranged for each column of the two-dimensional matrix, and is commonly connected to multiple pixels 100 arranged in one column.

[0019] The vertical drive unit 12 generates control signals for the pixels 100. The vertical drive unit 12 generates a control signal for each row of the two-dimensional matrix of the pixel array unit 11, and outputs the generated control signals to each pixel 100 via each signal line 15.

[0020] The column signal processing unit 13 processes image signals generated by the pixels 100. The column signal processing unit 13 simultaneously processes image signals transmitted via signal lines 16 from each of the pixels 100 arranged in one row of the pixel array unit 11. Examples of this processing include analog-to-digital conversion, which converts analog image signals generated by the pixels 100 into digital image signals, and correlated double sampling (CDS), which removes offset errors in the image signals. The processed image signals are output to an external circuit or the like of the imaging device 10.

[0021] The control unit 14 controls the vertical drive unit 12 and the column signal processing unit 13. The control unit 14 generates control signals for controlling the vertical drive unit 12 and the column signal processing unit 13 based on data instructing a clock, an operation mode, etc., input from an external circuit, etc. The control unit 14 outputs control signals to the vertical drive unit 12 via a signal line 17 and to the column signal processing unit 13 via a signal line 18, thereby controlling the vertical drive unit 12 and the column signal processing unit 13.

[0022] The imaging device 10 having the above-described configuration basically receives light incident from a subject, performs photoelectric conversion, and outputs an electrical signal corresponding to the amount of light. The imaging device 10 may be, for example, a wafer-level chip size package (WLCSP) formed by forming terminals and wiring before dicing a wafer (silicon wafer). The type of imaging device 10 is not particularly limited, and it may be a front-illuminated or back-illuminated type. The imaging device 10 may be a complementary metal oxide semiconductor (CMOS), a charge-coupled device (CCD), or any other type. The imaging device 10 may be manufactured using methods such as chemical vapor deposition, physical vapor deposition, and coating methods such as spin coating, lithography, and bonding techniques for supporting substrates and peripheral circuit boards.

[0023] Note that the imaging device 10 having the above-described configuration will be described below with reference to Examples 1 to 12 according to the first embodiment. In each of Examples 1 to 12 according to the first embodiment, the imaging device 10 is, for example, a back-illuminated image sensor. Note that in each of Examples 1 to 12 according to the first embodiment, a color filter is not provided in the imaging device 10, but a color filter may be provided in the imaging device 10.

[0024] <1-2. Example 1 of Imaging Device> <1-2-1. Detailed Configuration Example of Imaging Device> A configuration example of the imaging device 10 of Example 1 according to the first embodiment will be described with reference to Fig. 2 and Fig. 3. Fig. 2 is a cross-sectional view showing the configuration example of the imaging device 10 of Example 1 according to the first embodiment. Fig. 3 is a plan view showing an example of the arrangement of the reinforcing member 60 of the imaging device 10 of Example 1 according to the first embodiment.

[0025] As shown in Figure 2, the imaging device 10 of Example 1 according to the first embodiment has a semiconductor substrate 20, an adhesive layer 30, a lens layer 40, a bonding layer 50, a reinforcing member 60, a wiring interlayer film 70, a wiring layer 80, and a protective layer 90.

[0026] As shown in FIGS. 2 and 3 , the semiconductor substrate 20 has a pixel region R11 and a peripheral region R12. In the pixel region R11, as shown in FIG. 2 , a plurality of pixels 100, i.e., a plurality of photoelectric conversion units 101, are arranged along a first main surface M1 (e.g., a back surface) of the semiconductor substrate 20. The first main surface M1 is the upper surface (top surface) of the semiconductor substrate 20 in FIG. 2 . The pixel region R11 corresponds to, for example, the region of the pixel array unit 11 described above. As shown in FIG. 3 , the peripheral region R12 is a region surrounding the pixel region R11. For example, the pixel region R11 is a rectangular region in a plan view, and the peripheral region R12 is a region having a rectangular frame shape in a plan view.

[0027] The semiconductor substrate 20 may be, for example, a substrate such as a silicon wafer. Pixel transistors (not shown), for example, are provided inside the semiconductor substrate 20. Examples of pixel transistors include a transfer transistor, a reset transistor, an amplification transistor, and a selection transistor. A pixel transistor is basically provided for each pixel 100. The shape of the pixel region R11 may be rectangular in plan view, or may be other quadrilateral shapes such as a square, or may be circular or elliptical.

[0028] 2 , the adhesive layer 30 is laminated on the first main surface M1 of the semiconductor substrate 20. This adhesive layer 30 is a layer for adhering the lens layer 40, i.e., each on-chip lens 41, to the semiconductor substrate 20. The adhesive layer 30 can be made of, for example, a resin.

[0029] The lens layer 40 is stacked on the adhesive layer 30. That is, the lens layer 40 is provided on the first main surface M1 of the semiconductor substrate 20 via the adhesive layer 30. The lens layer 40 includes a plurality of on-chip lenses 41. Each of these on-chip lenses 41 faces the photoelectric conversion unit 101. For example, a microlens can be used as each on-chip lens 41. Furthermore, each on-chip lens 41 may be formed of an inorganic film with a high refractive index, such as a silicon nitride film (SiN film), a silicon oxynitride film (SiON film), or a silicon oxide film (SiO film). For example, each on-chip lens 41 is formed by an etch-back method. Each on-chip lens 41 functions as a lens group (lens unit). The on-chip lens 41 is an example of a lens.

[0030] The bonding layer 50 is laminated on the lens layer 40 in the outer peripheral region R12. The bonding layer 50 is a layer for bonding the reinforcing member 60 to the semiconductor substrate 20. The bonding layer 50 may be made of, for example, a resin.

[0031] The reinforcing member 60 is laminated on the bonding layer 50. That is, the reinforcing member 60 is provided on the first main surface M1 of the semiconductor substrate 20 via the adhesive layer 30, the lens layer 40, and the bonding layer 50. The reinforcing member 60 is a member for reinforcing the imaging device 10. The reinforcing member 60 is formed, for example, in a rectangular frame shape (ring shape) in a planar view (see FIG. 3). The reinforcing member 60 can be made of, for example, a light-transmitting substrate such as glass.

[0032] The thickness of the reinforcing member 60 (the length in the vertical direction in FIG. 2 ) is preferably 100 μm or more for reinforcement, and more preferably 300 μm or more. Furthermore, the thickness of the reinforcing member 60 is preferably 700 μm or less, and more preferably 500 μm or less, to suppress optical noise. That is, the thickness of the reinforcing member 60 is preferably 100 to 700 μm, and more preferably 300 to 500 μm. For example, the thickness of the on-chip lens 41 is approximately several μm, such as 1 to 3 μm. Note that, during the process of introducing light into the imaging device 10, i.e., the photoelectric conversion unit 101, light incident on the inner circumferential surface of the reinforcing member 60 may be reflected and enter the photoelectric conversion unit 101, resulting in optical noise. To suppress this optical noise, the thickness of the reinforcing member 60 described above is preferably 700 μm or less, and more preferably 500 μm or less.

[0033] The height position of the lower end of the reinforcing member 60 (height position in the vertical direction in FIG. 2 ) is preferably the same as the height position of the upper end of each on-chip lens 41 or higher than the height position of the upper end of each on-chip lens 41. The height position of the lower end of the reinforcing member 60 is the height position of the lower end face of the reinforcing member 60 in FIG. 2 , and the height position of the upper end of the on-chip lens 41 is the height position of the upper vertex of the on-chip lens 41 in FIG. 2 . The height position of the lower end of the reinforcing member 60 is determined taking into consideration various conditions, such as the above-mentioned reinforcement and optical noise.

[0034] The wiring interlayer film 70 is laminated on a second main surface M2 (e.g., the front surface) of the semiconductor substrate 20. The second main surface M2 is the lower surface (bottom surface) of the semiconductor substrate 20 in FIG. 2. The wiring interlayer film 70 is provided with, for example, a plurality of internal electrodes 71. Note that the wiring interlayer film 70 may also be provided with wiring and the like in addition to the internal electrodes 71.

[0035] The wiring layer 80 is laminated on the wiring interlayer film 70. A plurality of rewirings 81 are provided in this wiring layer 80. A solder bump 82, for example, is provided at the lower end of each of the rewirings 81. Note that in addition to the rewirings 81, other wirings, elements, etc. may also be formed in the wiring layer 80.

[0036] The protective layer 90 is laminated on the wiring layer 80. The protective layer 90 is a layer that protects layers such as the wiring layer 80. As the protective layer 90, for example, a resist such as a solder resist can be used.

[0037] In the imaging device 10 configured as described above, a glass substrate is not provided in the pixel region R11. Therefore, in the pixel region R11, light reflected by the surface of the on-chip lens 41 or the like is directly emitted outside the device and does not re-enter the device, thereby preventing flare caused by light reflected from the device. Furthermore, a reinforcing member 60 is provided in the peripheral region R12 located on the periphery of the pixel region R11 to increase device strength (chip strength). Therefore, the reinforcing member 60 located at the chip end of the imaging device 10 increases device strength while preventing flare. For example, the adverse effects of high-order light among the reflected and diffracted light from the device on image quality can be suppressed.

[0038] <1-2-2. Example of Method for Forming Reinforcing Member> An example of a method for forming the reinforcing member 60 of the image pickup device 10 of Example 1 according to the first embodiment will be described with reference to Fig. 4. Fig. 4 is an explanatory diagram for describing an example of a method for forming the reinforcing member 60 of the image pickup device 10 of Example 1 according to the first embodiment. In the example of Fig. 4, a portion of the light-transmitting substrate 110 is shown enlarged.

[0039] 4, for example, a light-transmitting substrate 110 (e.g., glass) is prepared. This light-transmitting substrate 110 is a member for forming a plurality of reinforcing members 60. The light-transmitting substrate 110 has a plurality of openings 111. Each opening 111 is an opening corresponding to one of the pixel regions R11. Each opening 111 is formed by hollowing out a rectangular shape in each portion of the light-transmitting substrate 110.

[0040] The light-transmitting substrate 110 having these openings 111 is bonded to an image sensor substrate (e.g., a semiconductor substrate before singulation) via a bonding layer 50. At this time, the pixel region R11 is exposed from the openings 111. As a result, the light-transmitting substrate 110 is not formed in the pixel region R11, and the light-transmitting substrate 110, i.e., the reinforcing member 60, is formed only in the peripheral region R12 located on the periphery of the pixel region R11. After the light-transmitting substrate 110 is bonded to the image sensor substrate, the imaging devices 10 (chips) are cut out one by one. In this way, the imaging devices 10 having the reinforcing member 60 are completed.

[0041] In the above explanation, a manufacturing process for manufacturing the imaging device 10 by bonding the light-transmitting substrate 110 to the image sensor substrate has been described, but other manufacturing processes may also be used. For example, a frame-shaped light-transmitting substrate 110, i.e., a frame-shaped reinforcing member 60, may be joined to an individualized imaging device 10 (chip).

[0042] Furthermore, methods, devices, and conditions used in the manufacture of general semiconductor devices can be used as a manufacturing method for the imaging device 10. In other words, the imaging device 10 according to this embodiment can be manufactured using an existing manufacturing method for a semiconductor device.

[0043] <1-2-3. Other Arrangement Examples of Reinforcing Member> Other arrangement examples of the reinforcing member 60 of the image pickup device 10 of Example 1 according to the first embodiment will be described with reference to Fig. 5 and Fig. 6. Each of Fig. 5 and Fig. 6 is a plan view showing another arrangement example of the reinforcing member 60 of the image pickup device 10 of Example 1 according to the first embodiment.

[0044] As shown in Fig. 5, two reinforcing members 60 are arranged in the outer peripheral region R12 on either side of the pixel region R11 at both ends of the imaging device 10. In the example of Fig. 5, the ends of the imaging device 10 are the left and right ends of the imaging device 10. The reinforcing member 60 is formed in a rectangular shape along one side of the pixel region R11, which is rectangular in plan view.

[0045] According to the arrangement example of the reinforcing members 60 shown in Fig. 5, the reinforcing members 60 are arranged at the left and right ends in Fig. 5, but the reinforcing members 60 are not arranged at the top and bottom ends in Fig. 5. This makes it possible to arrange test pads in, for example, the top and bottom peripheral regions R12 (regions other than the pixel region R11) of the imaging device 10, and therefore makes it possible to perform an electrical quality test on the imaging device 10 after the reinforcing members 60 are installed.

[0046] In the example of Fig. 5, the reinforcing members 60 are arranged only on the left and right ends in Fig. 5, but for example, the reinforcing members 60 may be arranged only on the top and bottom ends in Fig. 5, or the reinforcing members 60 may be arranged only on one of the left and right or top and bottom ends. In addition, the planar shape of the reinforcing members 60 is not limited to a rectangular shape.

[0047] As shown in Fig. 6, four reinforcing members 60 are arranged in the outer peripheral region R12 at the four corners of the imaging device 10. For example, in view of the stress acting on the imaging device 10, the four corners are the areas that require strength. Therefore, by arranging the reinforcing members 60 at these four corners, the necessary device strength can be ensured. In the example of Fig. 6, the reinforcing members 60 are formed in a square shape in a plan view.

[0048] According to the example of arrangement of the reinforcing member 60 shown in Figure 6, it is possible to reduce the amount of material used for the reinforcing member 60, and similar to the example of arrangement of the reinforcing member 60 shown in Figure 5, it is possible to provide inspection pads in areas where the reinforcing member 60 is not placed, so that electrical quality inspection of the imaging device 10 can be performed after the reinforcing member 60 is installed.

[0049] 6, the reinforcing members 60 are arranged at the four corners, but the reinforcing members 60 may be arranged at only one, two, or three corners. The planar shape of the reinforcing members 60 is not limited to a square.

[0050] <1-3. Example 2 of Imaging Device> An example of the configuration of the imaging device 10 of Example 2 according to the first embodiment will be described with reference to Fig. 7. Fig. 7 is a cross-sectional view showing an example of the configuration of the imaging device 10 of Example 2 according to the first embodiment. Note that in Example 2 according to the first embodiment, differences from the example according to the first embodiment (see Fig. 2) will be described.

[0051] 7 , in Example 2 according to the first embodiment, the remaining lens material portion 42 is formed in the outer peripheral region R12. The reinforcing member 60 is provided on the remaining lens material portion 42 via the bonding layer 50 so as to cover the remaining lens material portion 42.

[0052] The remaining lens material portion 42 is a film formed from the same material as each on-chip lens 41. This remaining lens material portion 42 is a portion formed by the lens material remaining when each on-chip lens 41 is formed. In other words, the remaining lens material portion 42 is formed by extending the same material to the outer circumferential region R12 when the on-chip lenses 41 in the pixel region R11 are formed. This makes it possible to suppress shape changes at the pattern end portion of the on-chip lens 41 and obtain uniform light-collection performance all the way to the edge of the pixel region R11.

[0053] The thickness of the remaining lens material portion 42 (the length in the vertical direction in FIG. 7 ) is, for example, the same as or approximately the same as the thickness of the on-chip lens 41 (the length in the vertical direction in FIG. 7 ). The remaining lens material portion 42 and each on-chip lens 41 are formed of, for example, an organic material.

[0054] Here, for example, if an organic material is used as the lens material, there is a concern that the remaining lens material portion 42 formed in the peripheral region R12 outside the pixel region R11 will absorb moisture from the atmosphere and expand in volume, resulting in film peeling or film floating, etc. However, by covering the upper part of the remaining lens material portion 42 with the reinforcing member 60, it is possible to prevent moisture absorption and suppress the occurrence of film peeling and the like.

[0055] <1-4. Example 3 of Imaging Device> A configuration example of the imaging device 10 of Example 3 according to the first embodiment will be described with reference to Fig. 8. Fig. 8 is a cross-sectional view showing the configuration example of the imaging device 10 of Example 3 according to the first embodiment. Note that in Example 3 according to the first embodiment, differences from Example 1 according to the first embodiment (see Fig. 2) will be described.

[0056] 8 , in Example 3 according to the first embodiment, a plurality of high-refractive-index lenses 41A and a low-refractive-index layer 55 are provided. Each high-refractive-index lens 41A is provided in place of each on-chip lens 41 described above.

[0057] Each high-refractive-index lens 41A is formed in the pixel region R11, similar to each on-chip lens 41 described above. The refractive index of each high-refractive-index lens 41A is higher than the refractive index of the low-refractive-index layer 55. For example, a silicon nitride film, a silicon oxynitride film, or a laminate film thereof can be used as the high-refractive-index lens 41A. The refractive index of a silicon nitride film or a silicon oxynitride film is, for example, approximately 1.8 to 2.0. Each high-refractive-index lens 41A is formed from, for example, an inorganic material.

[0058] The low-refractive-index layer 55 is provided on the lens layer 40 including each high-refractive-index lens 41A. The low-refractive-index layer 55 is a layer that covers the upper part of each high-refractive-index lens 41A. The refractive index of the low-refractive-index layer 55 is lower than the refractive index of each high-refractive-index lens 41A. For example, an epoxy resin with a low refractive index can be used as the low-refractive-index layer 55. The refractive index of the epoxy resin is, for example, approximately 1.5 to 1.6. A reinforcing member 60 is provided on the low-refractive-index layer 55 in the outer peripheral region R12 via a bonding layer 50.

[0059] By providing a low-refractive-index layer 55 on each high-refractive-index lens 41A, the light-receiving surface can be flattened. Furthermore, if a silicon nitride film or the like is used as the high-refractive-index lens 41A, the lens itself functions as a water-resistant cover film (passivation film). This prevents the color filter from being altered by moisture penetration, especially when a color filter is formed below the high-refractive-index lens 41A. This suppresses deterioration of the device's characteristics over time, particularly sensitivity fluctuations, due to variations in light transmittance.

[0060] <1-5. Example 4 of Imaging Device> An example configuration of the imaging device 10 of Example 4 according to the first embodiment will be described with reference to Fig. 9. Fig. 9 is a cross-sectional view showing an example configuration of the imaging device 10 of Example 4 according to the first embodiment. Note that in Example 4 according to the first embodiment, differences from Example 1 according to the first embodiment (see Fig. 2) will be described.

[0061] As shown in FIG. 9 , in Example 4 according to the first embodiment, the reinforcing member 60 is composed of a first layer 61 and a second layer 62. For example, the first layer 61 is made of glass, and the second layer 62 is made of sapphire glass. Sapphire glass is harder than regular glass. This increases the strength of the device. Furthermore, by replacing a portion of the glass with sapphire glass, the thickness of the reinforcing member 60 can be reduced compared to when the reinforcing member 60 is made of only glass, thereby reducing the overall thickness of the device.

[0062] 9, the reinforcing member 60 is configured with two layers, but it may be configured with three or more layers, and the number of layers configuring the reinforcing member 60 is not particularly limited. Furthermore, the types of materials forming the layers may be the same or different for each layer. Furthermore, a plurality of different types of forming materials may be repeatedly laminated for each layer.

[0063] <1-6. Example 5 of Imaging Device> A configuration example of the imaging device 10 of Example 5 according to the first embodiment will be described with reference to Fig. 10. Fig. 10 is a cross-sectional view showing the configuration example of the imaging device 10 of Example 5 according to the first embodiment. Note that in Example 5 according to the first embodiment, differences from Example 1 according to the first embodiment (see Fig. 2) will be described.

[0064] 10 , in Example 5 according to the first embodiment, the reinforcing member 60 is formed of sapphire glass. This allows for increased device strength, similar to Example 4 according to the first embodiment. Furthermore, by replacing glass with sapphire glass, the thickness of the reinforcing member 60 can be reduced compared to when the reinforcing member 60 is made of glass, thereby reducing the overall thickness of the device.

[0065] <1-7. Example 6 of Imaging Device> A configuration example of the imaging device 10 of Example 6 according to the first embodiment will be described with reference to Fig. 11. Fig. 11 is a cross-sectional view showing the configuration example of the imaging device 10 of Example 6 according to the first embodiment. Note that in Example 6 according to the first embodiment, differences from Example 1 according to the first embodiment (see Fig. 2) will be described.

[0066] 11 , in Example 6 according to the first embodiment, a light-transmitting substrate 56 is provided on the lens layer 40 via a bonding layer 50. The bonding layer 50 is, for example, a layer for bonding the light-transmitting substrate 56 and the lens layer 40 together. For example, glass can be used as the light-transmitting substrate 56. A reinforcing member 60 is provided on the light-transmitting substrate 56 in the outer peripheral region R12. For example, sapphire glass can be used as the reinforcing member 60.

[0067] The hardness of the reinforcing member 60 (e.g., sapphire glass) is higher than that of the light-transmitting substrate 56 (e.g., ordinary glass). Therefore, by overlapping the reinforcing member 60 on the outer peripheral region R12 of the light-transmitting substrate 56, cracking of the light-transmitting substrate 56 can be prevented and the light-transmitting substrate 56 can be formed thin. This allows, for example, light reflected on the surface of the on-chip lens 41 to be incident near the light source when it is re-reflected on the back side of the glass surface and returns to the device. Therefore, by burying the flare output due to the reflected light in the light source output, it can be made visually inconspicuous.

[0068] 1-8. Example 7 of Image Capturing Device An example configuration of an image capturing device 10 of Example 7 according to the first embodiment will be described with reference to FIGS. 12 and 13. FIG. 12 is a cross-sectional view showing an example configuration of the image capturing device 10 of Example 7 according to the first embodiment. FIG. 13 is a cross-sectional view showing an example configuration of the image capturing device 10 and a lens unit (lens module) 95 of Example 7 according to the first embodiment. Note that, in Example 7 according to the first embodiment, differences from Example 1 according to the first embodiment (see FIG. 2) will be described.

[0069] As shown in Fig. 12 , in Example 7 related to the first embodiment, the reinforcing member 60 has a step portion A1. As shown in Fig. 13 , a lens unit 95 may be mounted on the upper part of the reinforcing member 60. The lens unit 95 has a plurality of lenses 96. The step portion A1 is formed on the upper surface of the reinforcing member 60 to position the lens unit 95. The step portion A1 is formed, for example, in the same shape as the shape of the lower end portion of the lens unit 95 in a plan view.

[0070] In addition to the lens unit 95, a component such as a bandpass filter that transmits only light of a specific wavelength may be mounted on the upper portion of the reinforcing member 60. Even in this case, the step portion A1 of the reinforcing member 60 can be used to position the component such as the bandpass filter.

[0071] <1-9. Example 8 of Imaging Device> An example configuration of an imaging device 10 of Example 8 according to the first embodiment will be described with reference to Fig. 14. Fig. 14 is a cross-sectional view showing an example configuration of the imaging device 10 of Example 8 according to the first embodiment. Note that in Example 8 according to the first embodiment, differences from Example 1 according to the first embodiment (see Fig. 2) will be described.

[0072] 14 , in Example 8 according to the first embodiment, an anti-reflection layer 65 is provided on the inner circumferential surface of the reinforcing member 60 (the end surface of the reinforcing member 60 on the pixel region R11 side). The anti-reflection layer 65 prevents reflection of light. The anti-reflection layer 65 is formed, for example, in a frame shape in a plan view.

[0073] The anti-reflection layer 65 is formed of, for example, a material having a refractive index lower than that of the reinforcing member 60. As this material, for example, a material having a refractive index lower than that of glass, such as MgF2 (n=1.38), can be used. Alternatively, the anti-reflection layer 65 can be formed by alternately stacking two or more layers of low-refractive-index films (e.g., MgF2 or SiO2) and high-refractive-index films (e.g., Ta2O5, TiO, ZrO2), thereby suppressing the reflectance by utilizing optical interference.

[0074] For example, in the process of introducing light into the imaging device 10, i.e., the photoelectric conversion unit 101, light that is incident on the inner circumferential surface of the reinforcing member 60 may be reflected and enter the photoelectric conversion unit 101, resulting in optical noise. Even in such cases, forming an anti-reflection layer 65 on the inner circumferential surface of the reinforcing member 60 makes it possible to suppress reflection, thereby preventing degradation of image quality.

[0075] <1-10. Example 9 of Imaging Device> An example configuration of the imaging device 10 of Example 9 according to the first embodiment will be described with reference to Fig. 15. Fig. 15 is a cross-sectional view showing an example configuration of the imaging device 10 of Example 9 according to the first embodiment. Note that in Example 9 according to the first embodiment, differences from Example 1 according to the first embodiment (see Fig. 2) will be described.

[0076] 15 , in Example 9 according to the first embodiment, the inner circumferential surface of the reinforcing member 60 (the end surface of the reinforcing member 60 on the pixel region R11 side) is an inclined surface A2. The inclined surface A2 is, for example, a surface that slopes gradually downward from the outside to the inside of the imaging device 10. The inclined surface A2 is, for example, formed in a frame shape in a plan view. By forming the inner circumferential surface of the reinforcing member 60 as the inclined surface A2, the direction of reflected light from the inner circumferential surface of the reinforcing member 60 can be controlled, and reflection of light incident on the inner circumferential surface of the reinforcing member 60 onto the pixel region R11 can be suppressed, i.e., the amount of light incident on the pixel region R11 can be reduced.

[0077] <1-11. Example 10 of Imaging Device> A configuration example of the imaging device 10 of Example 10 according to the first embodiment will be described with reference to Fig. 16. Fig. 16 is a cross-sectional view showing the configuration example of the imaging device 10 of Example 10 according to the first embodiment. Note that in Example 10 according to the first embodiment, differences from Example 1 according to the first embodiment (see Fig. 2) will be described.

[0078] 16 , in Example 10 according to the first embodiment, the inner circumferential surface of the reinforcing member 60 (the end surface of the reinforcing member 60 on the pixel region R11 side) is a curved surface A3. The curved surface A3 is, for example, formed in an arc shape, and is a surface that curves so as to gradually descend from the outside to the inside of the imaging device 10. The curved surface A3 is, for example, formed in a frame shape in a plan view. By forming the inner circumferential surface of the reinforcing member 60 as the curved surface A3, the direction of reflected light from the inner circumferential surface of the reinforcing member 60 can be controlled, and reflection of light incident on the inner circumferential surface of the reinforcing member 60 onto the pixel region R11 can be suppressed, i.e., the amount of light incident on the pixel region R11 can be reduced.

[0079] <1-12. Example 11 of Imaging Device> An example configuration of the imaging device 10 of Example 11 according to the first embodiment will be described with reference to Fig. 17. Fig. 17 is a plan view showing an example shape of the reinforcing member 60 of the imaging device 10 of Example 11 according to the first embodiment. Note that in Example 11 according to the first embodiment, differences from Example 1 according to the first embodiment (see Fig. 2) will be described.

[0080] 17 , the inner circumferential surface of the reinforcing member 60 (the end surface of the reinforcing member 60 on the pixel region R11 side) has a sawtooth surface A4 in plan view. In other words, the inner circumferential surface of the reinforcing member 60 is formed so as to have a sawtooth shape in plan view. This makes it possible to scatter light that is incident on the inner circumferential surface of the reinforcing member 60, thereby reducing the amount of light incident on the pixel region R11.

[0081] 17, the end of the reinforcing member 60 on the pixel region R11 side is sawtoothed around the entire periphery, but only a part of the end may be sawtoothed. Also, the planar shape of the end of the reinforcing member 60 shown in Fig. 17 may be applied to any or all of the reinforcing members 60 shown in Fig. 5 or 6.

[0082] <1-13. Example 12 of Imaging Device> A configuration example of the imaging device 10 of Example 12 according to the first embodiment will be described with reference to Figs. 18 and 19. Fig. 18 is a cross-sectional view showing the configuration example of the imaging device 10 of Example 12 according to the first embodiment. Fig. 19 is a plan view showing an example of the arrangement of the reinforcing member 60 of the imaging device 10 of Example 12 according to the first embodiment. Note that in Example 12 according to the first embodiment, differences from Example 1 according to the first embodiment (see Fig. 2) will be described.

[0083] 18 , in Example 12 according to the first embodiment, two reinforcing members 60 are formed by a semiconductor chip A5 having a circuit A5a such as elements and wiring. The circuit A5a in the semiconductor chip A5 is electrically connected to, for example, the interior of the imaging device 10 (for example, electrodes and wiring). The circuit A5a can have functions such as a memory that stores an output signal from the imaging device 10, a signal processor that receives the output signal from the imaging device 10, and a signal processing chip that processes the signal.

[0084] 19 , two reinforcing members 60 are arranged in the outer peripheral region R12 on either side of the pixel region R11 at both ends of the imaging device 10. In the example of Fig. 19 , the ends of the imaging device 10 are the left and right ends of the imaging device 10. The reinforcing member 60 is formed in a rectangular shape along one side of the pixel region R11, which is rectangular in plan view.

[0085] In the example of Figure 19, the reinforcing members 60 are arranged only on the left and right ends in Figure 19, but for example, the reinforcing members 60 may be arranged only on the top and bottom ends in Figure 19, or may be arranged only on one of the left and right or top and bottom ends. Furthermore, the reinforcing members 60 (semiconductor chips A5) may be arranged in the arrangement shapes shown in Figures 3, 5, and 6. For example, if the reinforcing member 60 is divided into multiple members, only some of these members may be semiconductor chips A5. Furthermore, the planar shape of the reinforcing member 60 is not limited to a rectangular shape.

[0086] <2. Second Embodiment> <2-1. Example 1 of Imaging Device> A configuration example of an imaging device 10 of Example 1 according to the second embodiment will be described with reference to Fig. 20. Fig. 20 is a cross-sectional view showing the configuration example of the imaging device 10 of Example 1 according to the second embodiment. Note that in Example 1 according to the second embodiment, differences from Example 2 according to the first embodiment (see Fig. 7) will be described.

[0087] As shown in FIG. 20 , in Example 1 according to the second embodiment, the reinforcing member 60 is provided directly on the remaining lens material portion 42 of the lens layer 40, and the bonding layer 50 is not present. The reinforcing member 60 is made of, for example, a light-absorbing material. Examples of the light-absorbing material include a black material. Examples of the black material include black solder resist (e.g., a Co or C-containing material), a black color filter, and black Ti. With this configuration, the reinforcing member 60 is made of a light-absorbing material, which can suppress flare and the like while achieving appropriate reinforcement.

[0088] The reinforcing member 60 may be formed of a resin such as a UV (ultraviolet) curable resin, a thermoplastic resin, or a thermosetting resin. This resin may be a non-transparent resin or a transparent resin. However, to suppress flare, it is desirable to use a non-transparent resin. Using a resin as the reinforcing member 60 can achieve weight reduction and cost reduction. Although the bonding layer 50 is not present, the bonding layer 50 may be present, for example, when the reinforcing member 60 is a resin substrate.

[0089] <2-2. Example 2 of Imaging Device> An example configuration of an imaging device 10 of Example 2 according to the second embodiment will be described with reference to Fig. 21. Fig. 21 is a cross-sectional view showing an example configuration of an imaging device 10 of Example 2 according to the second embodiment. Note that in Example 2 according to the second embodiment, differences from Example 2 according to the first embodiment (see Fig. 7) will be described.

[0090] 21 , in Example 2 according to the second embodiment, a reinforcing member 60 is composed of a first layer 61 and a second layer 62. The second layer 62 is thinner than the first layer 61. For example, the first layer 61 is formed of a light-transmitting substrate, and the second layer 62 is formed of a light-absorbing material. With this configuration, a portion of the reinforcing member 60 is formed of a light-absorbing material, which makes it possible to suppress flare and the like while achieving appropriate reinforcement.

[0091] Examples of the light-transmitting substrate include glass and transparent resin. Examples of the light-absorbing material include black materials. As described above, examples of the black materials include black solder resist (e.g., Co or C-containing materials), black color filter materials, and black Ti. In addition to black materials, examples of the light-absorbing material include anti-reflective materials. Examples of the anti-reflective material include SiO-based, SiON-based, and TiO-based single films or laminated films.

[0092] The second layer 62 may be formed of a resin such as a UV-curable resin, a thermoplastic resin, or a thermosetting resin. This resin may be either a non-transparent resin or a transparent resin. However, in order to suppress flare, it is preferable to use a non-transparent resin. Using a resin for the second layer 62 can achieve weight reduction and cost reduction.

[0093] 21, the reinforcing member 60 is configured with two layers, but it may be configured with three or more layers, and the number of layers configuring the reinforcing member 60 is not particularly limited. Furthermore, the type of material for each layer may be the same for each layer or may be different for each layer. Furthermore, a plurality of different types of materials may be repeatedly stacked.

[0094] <2-3. Example 3 of Imaging Device> A configuration example of an imaging device 10 of Example 3 according to the second embodiment will be described with reference to Fig. 22. Fig. 22 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 3 according to the second embodiment. Note that in Example 3 according to the second embodiment, differences from Example 2 according to the second embodiment (see Fig. 21) will be described.

[0095] 22 , in Example 3 according to the second embodiment, the second layer 62 is thicker than the first layer 61. The second layer 62 is made of a light-absorbing material (e.g., a black material, an anti-reflective material, etc.). With this configuration, a portion of the reinforcing member 60 is made of a light-absorbing material, so that flare and the like can be suppressed while providing appropriate reinforcement. Furthermore, because the thickness of the light-absorbing material of the second layer 62 is thicker than the first layer 61, flare suppression can be more reliably achieved.

[0096] <2-4. Example 4 of Imaging Device> A configuration example of an imaging device 10 of Example 4 according to the second embodiment will be described with reference to Fig. 23. Fig. 23 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 4 according to the second embodiment. Note that in Example 4 according to the second embodiment, differences from Example 2 according to the second embodiment (see Fig. 21) will be described.

[0097] 23 , in Example 4 according to the second embodiment, a second layer 62 is provided to cover the first layer 61. The first layer 61 is made of a light-transmitting substrate, and the second layer 62 is made of a light-absorbing material (e.g., a black material, an anti-reflective material, etc.). The second layer 62 covers the upper surface of the first layer 61, the inner circumferential surfaces of the first layer 61 and the bonding layer 50, and the outer circumferential surfaces of the first layer 61 and the bonding layer 50. The second layer 62 also covers a portion of each of the inner circumferential surface and the outer circumferential surface of the lens material remaining portion 42.

[0098] This configuration makes it possible to suppress light incidence from the periphery of the device, for example, from the side of the device, thereby suppressing flare and oblique incidence of light, thereby improving optical characteristics.

[0099] 24 , the second layer 62 covers the entire upper surface of the first layer 61, the entire inner circumferential surfaces of the first layer 61 and the bonding layer 50, and the entire outer circumferential surfaces of the first layer 61 and the bonding layer 50, but is not limited to this. For example, the second layer 62 may cover only a portion of the upper surface of the first layer 61, only a portion of the inner circumferential surfaces of the first layer 61 and the bonding layer 50, and only a portion of the outer circumferential surfaces of the first layer 61 and the bonding layer 50.

[0100] <2-5. Example 5 of Imaging Device> A configuration example of an imaging device 10 of Example 5 according to the second embodiment will be described with reference to Fig. 24. Fig. 24 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 5 according to the second embodiment. Note that in Example 5 according to the second embodiment, differences from Example 4 according to the second embodiment (see Fig. 23) will be described.

[0101] 24, in Example 5 according to the second embodiment, the second layer 62 covers only the upper surface of the first layer 61. Even with this configuration, it is possible to obtain the same effect as in Example 4 according to the second embodiment.

[0102] 24, the second layer 62 covers the entire upper surface of the first layer 61, but this is not limiting. For example, the second layer 62 may cover only a portion of the upper surface of the first layer 61.

[0103] <2-6. Example 6 of Imaging Device> A configuration example of an imaging device 10 of Example 6 according to the second embodiment will be described with reference to Fig. 25. Fig. 25 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 6 according to the second embodiment. Note that in Example 6 according to the second embodiment, differences from Example 4 according to the second embodiment (see Fig. 23) will be described.

[0104] 25 , in Example 6 according to the second embodiment, the second layer 62 covers only the inner circumferential surfaces of the first layer 61 and the bonding layer 50. Even with this configuration, it is possible to obtain the same effect as in Example 4 according to the second embodiment.

[0105] 25 , the second layer 62 covers the entire inner circumferential surfaces of the first layer 61 and the bonding layer 50, but this is not limiting. For example, the second layer 62 may cover only a portion of the inner circumferential surfaces of the first layer 61 and the bonding layer 50.

[0106] <2-7. Example 7 of Imaging Device> A configuration example of an imaging device 10 of Example 7 according to the second embodiment will be described with reference to Fig. 26. Fig. 26 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 7 according to the second embodiment. Note that in Example 7 according to the second embodiment, differences from Example 4 according to the second embodiment (see Fig. 23) will be described.

[0107] 26 , in Example 7 according to the second embodiment, the second layer 62 covers only the outer peripheral surfaces of the first layer 61 and the bonding layer 50. Even with this configuration, it is possible to obtain the same effect as in Example 4 according to the second embodiment.

[0108] 26 , the second layer 62 covers the entire outer circumferential surfaces of the first layer 61 and the bonding layer 50, but this is not limiting. For example, the second layer 62 may cover only a portion of the outer circumferential surfaces of the first layer 61 and the bonding layer 50.

[0109] <2-8. Example 8 of Imaging Device> A configuration example of an imaging device 10 of Example 8 according to the second embodiment will be described with reference to Fig. 27. Fig. 27 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 8 according to the second embodiment. Note that in Example 8 according to the second embodiment, differences from Example 4 according to the second embodiment (see Fig. 23) will be described.

[0110] 27 , in Example 8 according to the second embodiment, the second layer 62 covers only the upper surface of the first layer 61 and the outer peripheral surfaces of the first layer 61 and the bonding layer 50. Even with this configuration, it is possible to obtain the same effect as in Example 4 according to the second embodiment.

[0111] 27 , the second layer 62 covers the entire upper surface of the first layer 61 and the entire outer peripheral surfaces of the first layer 61 and the bonding layer 50, but is not limited to this. For example, the second layer 62 may cover only a portion of the upper surface of the first layer 61 and a portion of the outer peripheral surfaces of the first layer 61 and the bonding layer 50.

[0112] <2-9. Example 9 of Imaging Device> A configuration example of an imaging device 10 of Example 9 according to the second embodiment will be described with reference to Fig. 28. Fig. 28 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 9 according to the second embodiment. Note that in Example 9 according to the second embodiment, differences from Example 4 according to the second embodiment (see Fig. 23) will be described.

[0113] 28 , in Example 9 according to the second embodiment, the second layer 62 covers only the upper surface of the first layer 61 and the inner circumferential surfaces of the first layer 61 and the bonding layer 50. Even with this configuration, it is possible to obtain the same effect as in Example 4 according to the second embodiment.

[0114] 28 , the second layer 62 covers the entire upper surface of the first layer 61 and the entire inner circumferential surfaces of the first layer 61 and the bonding layer 50, but is not limited to this. For example, the second layer 62 may cover only a portion of the upper surface of the first layer 61 and a portion of the inner circumferential surfaces of the first layer 61 and the bonding layer 50.

[0115] <2-10. Example 10 of Imaging Device> A configuration example of an imaging device 10 of Example 10 according to the second embodiment will be described with reference to Fig. 29. Fig. 29 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 10 according to the second embodiment. Note that in Example 10 according to the second embodiment, differences from Example 2 according to the first embodiment (see Fig. 7) will be described.

[0116] As shown in FIG. 29 , in Example 10 according to the second embodiment, the reinforcing member 60 has an uneven portion 60b. The uneven portion 60b is formed only on the upper surface of the reinforcing member 60. In other words, the upper surface of the reinforcing member 60 is formed in an uneven shape. The uneven portion 60b has repeated concave and convex portions. The tips of the convex portions may be curved or pointed. The uneven portion 60b may have, for example, a moth-eye structure. The uneven portion 60b functions as an anti-reflection portion (anti-reflection structure).

[0117] The uneven portion 60b can be formed, for example, by roughening the surface of the reinforcing member 60, forming an oxide film on the reinforcing member 60 and roughening the surface of the oxide film, attaching a moth-eye film (e.g., a tape-like film) to the reinforcing member 60, or transferring the shape of a mold to the resin. For example, UV and thermal imprinting techniques may be used to transfer the shape of the mold.

[0118] This configuration makes it possible to suppress light incidence from the periphery of the device, for example, from the side of the device, thereby suppressing flare and oblique incidence of light, thereby improving optical characteristics.

[0119] 29, the uneven portion 60b is formed on the entire top surface of the reinforcing member 60, but this is not limiting. For example, the uneven portion 60b may be formed on only a part of the top surface of the reinforcing member 60.

[0120] <2-11. Example 11 of Imaging Device> A configuration example of an imaging device 10 of Example 11 according to the second embodiment will be described with reference to Fig. 30. Fig. 30 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 11 according to the second embodiment. Note that in Example 11 according to the second embodiment, differences from Example 10 according to the second embodiment (see Fig. 29) will be described.

[0121] 30 , in Example 11 according to the second embodiment, the uneven portion 60b is formed only on the inner circumferential surfaces of the reinforcing member 60 and the bonding layer 50. In other words, the inner circumferential surfaces of the reinforcing member 60 and the bonding layer 50 are formed with an uneven shape. Even with this configuration, the same effect as in Example 10 according to the second embodiment can be obtained.

[0122] 30, the uneven portion 60b is formed on the entire inner circumferential surface of each of the reinforcing member 60 and the bonding layer 50, but this is not limiting. For example, the uneven portion 60b may be formed on only a part of the inner circumferential surface of each of the reinforcing member 60 and the bonding layer 50.

[0123] <2-12. Example 12 of Imaging Device> A configuration example of an imaging device 10 of Example 12 according to the second embodiment will be described with reference to Fig. 31. Fig. 31 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 12 according to the second embodiment. Note that in Example 12 according to the second embodiment, differences from Example 10 according to the second embodiment (see Fig. 29) will be described.

[0124] 31 , in Example 12 according to the second embodiment, the uneven portion 60b is formed only on the upper surface of the reinforcing member 60 and the inner circumferential surfaces of the reinforcing member 60 and the bonding layer 50. In other words, the upper surface of the reinforcing member 60 and the inner circumferential surfaces of the reinforcing member 60 and the bonding layer 50 are formed with uneven shapes. Even with this configuration, the same effect as in Example 10 according to the second embodiment can be obtained.

[0125] 31 , the uneven portion 60b is formed on the entire upper surface of the reinforcing member 60 and the entire inner circumferential surfaces of the reinforcing member 60 and the bonding layer 50, but is not limited to this. For example, the uneven portion 60b may be formed on only a portion of the entire upper surface of the reinforcing member 60 and only a portion of the entire inner circumferential surfaces of the reinforcing member 60 and the bonding layer 50.

[0126] <2-13. Example 13 of Imaging Device> A configuration example of an imaging device 10 of Example 13 according to the second embodiment will be described with reference to Fig. 32. Fig. 32 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 13 according to the second embodiment. Note that in Example 13 according to the second embodiment, differences from Example 10 according to the second embodiment (see Fig. 29) will be described.

[0127] 32 , in Example 13 according to the second embodiment, the uneven portion 60b is formed only on the upper surface of the reinforcing member 60 and the outer peripheral surfaces of the reinforcing member 60 and the bonding layer 50. In other words, the upper surface of the reinforcing member 60 and the outer peripheral surfaces of the reinforcing member 60 and the bonding layer 50 are formed with uneven shapes. Even with this configuration, the same effect as in Example 10 according to the second embodiment can be obtained.

[0128] 32, the uneven portion 60b is formed on the entire upper surface of the reinforcing member 60 and the entire outer circumferential surfaces of the reinforcing member 60 and the bonding layer 50. However, the present invention is not limited to this. For example, the uneven portion 60b may be formed on only a portion of the upper surface of the reinforcing member 60 and only a portion of the outer circumferential surfaces of the reinforcing member 60 and the bonding layer 50.

[0129] <2-14. Example 14 of Imaging Device> A configuration example of an imaging device 10 of Example 14 according to the second embodiment will be described with reference to Fig. 33. Fig. 33 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 14 according to the second embodiment. Note that in Example 14 according to the second embodiment, differences from Example 10 according to the second embodiment (see Fig. 29) will be described.

[0130] 33 , in Example 14 according to the second embodiment, the uneven portion 60c is formed only on the inner circumferential surface of the reinforcing member 60. In other words, the inner circumferential surface of the reinforcing member 60 is formed in an uneven shape. Even with this configuration, the same effect as in Example 10 according to the second embodiment can be obtained.

[0131] The uneven portion 60c is formed, for example, by roughening the surface of the reinforcing member 60 or by transferring the shape of a mold to the resin. For example, UV and thermal imprinting techniques may be used to transfer the shape of the mold.

[0132] 33, the uneven portion 60c is formed on the entire inner circumferential surface of the reinforcing member 60, but this is not limiting. For example, the uneven portion 60c may be formed on only a part of the inner circumferential surface of the reinforcing member 60.

[0133] 2-15. Example of Manufacturing Process of Imaging Device An example of a manufacturing process of the imaging device 10 according to the second embodiment will be described with reference to FIGS.

[0134] (Example of manufacturing process of imaging device of Example 1) Fig. 34 is a cross-sectional view showing an example of manufacturing process of the imaging device 10 (see Fig. 20) of Example 1 according to the second embodiment. Fig. 35 is a cross-sectional view showing another example of manufacturing process of the imaging device 10 of Example 1 according to the second embodiment.

[0135] (Manufacturing Process Example) As shown in FIG. 34 , a light absorbing material 201 is laminated on a laminate 200. The light absorbing material 201 is, for example, a photosensitive black color filter or a black solder resist. The laminate 200 includes a semiconductor substrate 20, an adhesive layer 30, a lens layer 40, a wiring interlayer film 70, a wiring layer 80, and a protective layer 90. Thereafter, a frame-shaped reinforcing member 60 is formed on the laminate 200 by exposing or patterning the light absorbing material 201 on the laminate 200. This completes the imaging device 10 of Example 1 according to the second embodiment.

[0136] (Another Manufacturing Process Example) As shown in Fig. 35 , a light absorbing material 201 is laminated on a laminated body 200. The light absorbing material 201 is, for example, black Ti. Thereafter, a resist layer 202 is laminated on the light absorbing material 201 on the laminated body 200, and a frame-shaped reinforcing member 60 is formed on the laminated body 200 by patterning the light absorbing material 201 on the laminated body 200, and the resist layer 202 is removed. In this way, the imaging device 10 of Example 1 according to the second embodiment is completed.

[0137] (Example of Manufacturing Process of Imaging Device of Example 5) FIG. 36 is a cross-sectional view showing an example of manufacturing process of the imaging device 10 (see FIG. 24) of Example 5 according to the second embodiment.

[0138] As shown in FIG. 36 , a second layer 211 is laminated on a first layer 210. At this time, the first layer 210 is a light-transmitting substrate, and the second layer 211 is a light-absorbing material (e.g., an anti-reflection material). The second layer 211 is formed, for example, by plasma CVD (chemical vapor deposition). Thereafter, a resist layer 212 is laminated on the second layer 211 on the first layer 210. A frame-shaped reinforcing member 60 is formed by patterning the second layer 211 on the first layer 210, and the resist layer 212 is removed. The frame-shaped reinforcing member 60 is laminated on the laminate 200 via a bonding layer 50. This completes the imaging device 10 of Example 5 according to the second embodiment.

[0139] Note that the uneven portion 60b may be formed on the first layer 210 as the second layer 211. In this case, an imaging device 10 according to Example 10 (see FIG. 29 ) of the second embodiment is completed. In forming the uneven portion 60b, for example, the surface of the first layer 210 may be roughened by ashing or plasma treatment. Alternatively, an oxide film may be formed on the first layer 210 as the second layer 211, and the surface of the oxide film may be roughened by ashing or plasma treatment. Also, a moth-eye film (e.g., a tape-like film) may be attached to the first layer 210 as the second layer 211. Also, a resin may be laminated on the first layer 210 as the second layer 211, and the shape of the mold may be transferred to the resin.

[0140] (Example of Manufacturing Process of Imaging Device of Example 9) FIG. 37 is a cross-sectional view showing an example of manufacturing process of the imaging device 10 of Example 9 (see FIG. 28) according to the second embodiment.

[0141] As shown in Fig. 37 , a frame-shaped first layer 61 is laminated on the laminated body 200. At this time, if the first layer 61 is made of glass, the frame-shaped first layer 61 is formed by mechanical polishing, glass molding (molding using a metal mold), or the like. If the first layer 61 is made of resin, the frame-shaped first layer 61 is formed by molding using injection molding, a 3D printer, heat curing, UV curing, or the like. Thereafter, a second layer 62 is laminated on the first layer 61 on the laminated body 200, and the reinforcing member 60 is formed on the laminated body 200. The second layer 62 is formed by, for example, inkjet printing or application using a dispenser 220. This completes the imaging device 10 of Example 9 according to the second embodiment.

[0142] (Example of Manufacturing Process of Imaging Device of Example 12) FIG. 38 is a cross-sectional view showing an example of a manufacturing process of the imaging device 10 of Example 12 (see FIG. 31) according to the second embodiment.

[0143] As shown in FIG. 38 , a frame-shaped reinforcing member 60 is laminated on a laminate 200 via a bonding layer 50. A plasma treatment is performed on the reinforcing member 60 on the laminate 200. As a result, uneven portions 60b are formed on the upper surface of the reinforcing member 60 and on the inner circumferential surfaces of the reinforcing member 60 and the bonding layer 50. The plasma treatment is performed, for example, by a vacuum process. Gases used include, for example, O ２ , N ２ , H ２ , N.H. ３ Alternatively, a mixture of these gases may be used.

[0144] Incidentally, uneven portions 60b are formed on the upper surface of the reinforcing member 60 and on the inner circumferential surfaces of the reinforcing member 60 and the bonding layer 50. This suppresses reflection at the reinforcing member 60, thereby suppressing deterioration of optical characteristics such as halation. Furthermore, by increasing the surface area of ​​the upper surface of the reinforcing member 60, it is possible to improve adhesion between the reinforcing member 60 and an upper layer when an upper layer is provided on the reinforcing member 60. Furthermore, the upper surface of each on-chip lens 41 is also roughened to have an uneven shape, which makes it possible to form an anti-reflection layer on that surface, thereby realizing improved sensitivity, cost reduction due to process simplification, improved manufacturing TAT (Turn Around Time), and the like.

[0145] The various manufacturing methods described above can be applied to various imaging devices 10 other than those of Examples 1, 5, 9, and 12 according to the second embodiment. It is also possible to combine the various manufacturing methods described above.

[0146] <2-16. Example 15 of Imaging Device> A configuration example of an imaging device 10 of Example 15 according to the second embodiment will be described with reference to Fig. 39. Fig. 39 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 15 according to the second embodiment. Note that in Example 15 according to the second embodiment, differences from Example 2 according to the first embodiment (see Fig. 7) will be described.

[0147] 39 , in Example 15 according to the second embodiment, the reinforcing member 60 is provided not only on the top surface of the laminate 200 but also on the side surface (outer peripheral surface) of the laminate 200 via a bonding layer 50. The side surface of the laminate 200 is formed, for example, in a tapered shape. In the example of FIG. 39 , the side surface of the laminate 200 is inclined so as to gradually descend from the inside to the outside of the imaging device 10.

[0148] According to this configuration, the side surface of the laminate 200 is reinforced by the reinforcing member 60, thereby improving the strength of the device. Furthermore, the area of ​​the side surface of the laminate 200 increases, and the contact area of ​​the bonding layer 50 also increases, thereby improving the adhesive strength between the reinforcing member 60 and the laminate 200.

[0149] <2-17. Example 16 of Imaging Device> A configuration example of the imaging device 10 of Example 16 according to the second embodiment will be described with reference to Fig. 40. Fig. 40 is a cross-sectional view showing the configuration example of the imaging device 10 of Example 16 according to the second embodiment. Note that in Example 16 according to the second embodiment, differences from Example 15 according to the second embodiment (see Fig. 39) will be described.

[0150] As shown in Fig. 40 , in Example 16 according to the second embodiment, a reinforcing member 60 is provided on a side surface of a laminate 200 via a bonding layer 50. The side surface of the laminate 200 is formed, for example, in an inverted tapered shape. In the example of Fig. 40 , the side surface of the laminate 200 is inclined so as to gradually rise from the inside toward the outside of the imaging device 10. With this configuration, it is possible to obtain the same effect as Example 15 according to the second embodiment.

[0151] <2-18. Example 17 of Imaging Device> A configuration example of an imaging device 10 of Example 17 according to the second embodiment will be described with reference to Fig. 41. Fig. 41 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 17 according to the second embodiment. Note that in Example 17 according to the second embodiment, differences from Example 15 according to the second embodiment (see Fig. 39) will be described.

[0152] As shown in FIG. 41 , in Example 17 according to the second embodiment, a reinforcing member 60 is provided on a side surface of a laminate 200 via a bonding layer 50. The side surface of the laminate 200 is formed, for example, in a tapered shape. In the example of FIG. 41 , the side surface of the laminate 200 is inclined so as to gradually descend from the inside to the outside of the imaging device 10, and the cross-sectional shape of the reinforcing member 60 is triangular. With this configuration, it is possible to obtain the same effects as in Example 15 according to the second embodiment. It is also possible to achieve a more compact device.

[0153] <2-19. Example 18 of Imaging Device> An example configuration of an imaging device 10 of Example 18 according to the second embodiment will be described with reference to Fig. 42. Fig. 42 is a cross-sectional view showing an example configuration of an imaging device 10 of Example 18 according to the second embodiment. Note that in Example 18 according to the second embodiment, differences from Example 15 according to the second embodiment (see Fig. 39) will be described.

[0154] As shown in FIG. 42 , in Example 18 according to the second embodiment, a reinforcing member 60 is provided on a side surface of a laminate 200 via a bonding layer 50. The side surface of the laminate 200 is formed, for example, in an inverted tapered shape. In the example of FIG. 42 , the side surface of the laminate 200 is inclined so as to gradually rise from the inside toward the outside of the imaging device 10, and the cross-sectional shape of the reinforcing member 60 is triangular. With this configuration, it is possible to obtain the same effects as in Example 15 according to the second embodiment. It is also possible to achieve a more compact device.

[0155] <2-20. Example 19 of Imaging Device> A configuration example of an imaging device 10 of Example 19 according to the second embodiment will be described with reference to Fig. 43. Fig. 43 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 19 according to the second embodiment. Note that in Example 19 according to the second embodiment, differences from Example 15 according to the second embodiment (see Fig. 39) will be described.

[0156] As shown in Fig. 43 , in Example 19 according to the second embodiment, a reinforcing member 60 is provided on a side surface of a laminate 200 via a bonding layer 50. The side surface of the laminate 200 is formed into a shape that includes, for example, a tapered shape and an inverted tapered shape. In the example of Fig. 43 , the side surface of the laminate 200 is formed into a V-shape that protrudes outward. With this configuration, it is possible to obtain the same effect as Example 15 according to the second embodiment.

[0157] 2-21. Example of Manufacturing Process of Imaging Device An example of a manufacturing process of the imaging device 10 according to the second embodiment will be described with reference to FIGS.

[0158] (Example of a manufacturing process for a reinforcing member) Figure 44 is a diagram showing an example of a manufacturing process for a reinforcing member 60 according to the second embodiment. In the example of Figure 44, a cross-sectional view and a plan view are shown.

[0159] 44 , the light-transmitting substrate 230 is processed into a frame shape by a drill 231 or laser light 232. As a result, the frame-shaped reinforcing member 60 is formed. In this way, the reinforcing member 60 is formed by, for example, drilling or laser processing. Note that in a later process, the frame-shaped reinforcing member 60 is provided on the laminate 200.

[0160] (Example of Manufacturing Process of Imaging Device of Example 15) Fig. 45 is a diagram showing an example of manufacturing process of the imaging device 10 (see Fig. 39) of Example 15 according to the second embodiment. In the example of Fig. 45, a cross-sectional view, a plan view, and a perspective view are shown.

[0161] As shown in FIG. 45 , the light-transmitting substrate 230 is machined into a frame shape using a drill 231 (for example, by countersinking). This forms a frame-shaped reinforcing member 60. The laminate 200 is also machined using an oblique trim 240. For example, the laminate 200 is machined so that the side surface 200a of the laminate 200 has a tapered shape. Thereafter, the frame-shaped reinforcing member 60 and the processed laminate 200 are combined. At this time, the frame-shaped reinforcing member 60 is turned upside down, and the frame-shaped reinforcing member 60 and the processed laminate 200 are bonded together using a bonding layer 50. This completes the imaging device 10 of Example 15 according to the second embodiment.

[0162] (Example of Manufacturing Process of Imaging Device of Example 16) Fig. 46 is a diagram showing an example of manufacturing process of the imaging device 10 (see Fig. 40) of Example 16 according to the second embodiment. In the example of Fig. 46, a cross-sectional view, a plan view, and a perspective view are shown.

[0163] As shown in FIG. 46 , the light-transmitting substrate 230 is processed into a frame shape using a drill 231 (for example, by countersinking). This forms a frame-shaped reinforcing member 60. The laminate 200 is also processed using an oblique trim 240. For example, the laminate 200 is processed so that the side surface 200a of the laminate 200 has an inverse tapered shape. Thereafter, the frame-shaped reinforcing member 60 and the processed laminate 200 are combined. At this time, the processed laminate 200 is turned upside down, and the frame-shaped reinforcing member 60 and the processed laminate 200 are bonded together using a bonding layer 50. This completes the imaging device 10 of Example 16 according to the second embodiment.

[0164] (Example of Manufacturing Process of Imaging Device of Example 17) Fig. 47 is a diagram showing an example of manufacturing process of the imaging device 10 (see Fig. 41) of Example 17 according to the second embodiment. In the example of Fig. 47, a cross-sectional view, a plan view, and a perspective view are shown.

[0165] As shown in Fig. 47 , a light-transmitting substrate 230 is processed into a frame shape using a drill 231. As a result, a frame-shaped reinforcing member 60 is formed. A laminate 200 is formed in the same manner as in Fig. 45 described above. Thereafter, the frame-shaped reinforcing member 60 and the processed laminate 200 are combined together. At this time, the frame-shaped reinforcing member 60 is turned upside down, and the frame-shaped reinforcing member 60 and the processed laminate 200 are bonded together by a bonding layer 50. As a result, an imaging device 10 of Example 17 according to the second embodiment is completed.

[0166] (Example of Manufacturing Process of Imaging Device of Example 18) Fig. 48 is a diagram showing an example of manufacturing process of the imaging device 10 (see Fig. 42) of Example 18 according to the second embodiment. In the example of Fig. 48, a cross-sectional view, a plan view, and a perspective view are shown.

[0167] As shown in Fig. 48, a light-transmitting substrate 230 is processed into a frame shape using a drill 231. As a result, a frame-shaped reinforcing member 60 is formed. A laminate 200 is formed in the same manner as in Fig. 46 described above. Thereafter, the frame-shaped reinforcing member 60 and the processed laminate 200 are combined together. At this time, the frame-shaped reinforcing member 60 and the processed laminate 200 are bonded together by a bonding layer 50. As a result, an imaging device 10 of Example 18 according to the second embodiment is completed.

[0168] (Example of Manufacturing Process of Imaging Device of Example 19) Fig. 49 is a diagram showing an example of manufacturing process of the imaging device 10 (see Fig. 43) of Example 19 according to the second embodiment. In the example of Fig. 49, a cross-sectional view and a perspective view are shown.

[0169] As shown in Figure 49, the imaging device 10, i.e., the laminated body 200 having the reinforcing member 60, is formed in the same manner as in Figure 47 described above. The laminated body 200 having the reinforcing member 60 is turned upside down, and the laminated body 200 having the reinforcing member 60 is processed by a diagonal trim 240. Another frame-shaped reinforcing member 60 is formed in the same manner as in Figure 48 described above. Thereafter, the frame-shaped reinforcing member 60 and the processed laminated body 200 are combined. At this time, the processed laminated body 200 is turned upside down, and the frame-shaped reinforcing member 60 and the processed laminated body 200 are bonded by a bonding layer 50. In this way, the imaging device 10 of Example 19 according to the second embodiment is completed.

[0170] <2-22. Example 20 of Imaging Device> A configuration example of an imaging device 10 of Example 20 according to the second embodiment will be described with reference to Fig. 50. Fig. 50 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 20 according to the second embodiment. Note that in Example 20 according to the second embodiment, differences from Example 2 according to the first embodiment (see Fig. 7) will be described.

[0171] 50 , in Example 20 according to the second embodiment, the inner circumferential surface of the reinforcing member 60 (the end surface of the reinforcing member 60 on the pixel region R11 side) is an inclined surface B1. The inclined surface B1 is, for example, inclined so as to gradually descend from the inside to the outside of the imaging device 10. The inclined surface B1 is, for example, formed in a frame shape in a plan view. With this configuration, the inner circumferential surface of the reinforcing member 60 is formed as the inclined surface B1, which controls the direction of reflected light from the inner circumferential surface of the reinforcing member 60 and suppresses reflection of light incident on the inner circumferential surface of the reinforcing member 60 onto the pixel region R11, i.e., reduces the amount of light incident on the pixel region R11.

[0172] It is desirable that the reinforcing member 60 is formed in the outer peripheral region R12, and that the tip of the reinforcing member 60 on the inclined surface B1 side (the tip of the inner peripheral surface) is not present in the pixel region R11, i.e., above each on-chip lens 41 or each pixel 100. This also applies to the following Examples 21 and 22.

[0173] <2-23. Example 21 of Imaging Device> A configuration example of an imaging device 10 of Example 21 according to the second embodiment will be described with reference to Fig. 51. Fig. 51 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 21 according to the second embodiment. Note that in Example 21 according to the second embodiment, differences from Example 20 according to the second embodiment (see Fig. 50) will be described.

[0174] 51 , in Example 21 according to the second embodiment, the inner circumferential surface of the reinforcing member 60 is a stepped surface B2. The stepped surface B2, for example, descends in a stepped manner from the inside to the outside of the imaging device 10. The stepped surface B2 is, for example, formed in a frame shape in a plan view. With this configuration, the inner circumferential surface of the reinforcing member 60 is formed as the stepped surface B2, thereby achieving the same effect as Example 20 according to the second embodiment.

[0175] <2-24. Example 22 of Imaging Device> A configuration example of an imaging device 10 of Example 22 according to the second embodiment will be described with reference to Fig. 52. Fig. 52 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 22 according to the second embodiment. Note that in Example 22 according to the second embodiment, differences from Example 20 according to the second embodiment (see Fig. 50) will be described.

[0176] 52 , in Example 22 according to the second embodiment, the inner circumferential surface of the reinforcing member 60 is a curved surface B3. The curved surface B3 gradually slopes downward from the inside to the outside of the imaging device 10, for example. The curved surface B3 is formed, for example, in a frame shape in a plan view. With this configuration, the inner circumferential surface of the reinforcing member 60 is formed as the curved surface B3, thereby achieving the same effect as Example 20 according to the second embodiment.

[0177] <2-25. Example 23 of Imaging Device> A configuration example of an imaging device 10 of Example 23 according to the second embodiment will be described with reference to Fig. 53. Fig. 53 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 23 according to the second embodiment. Note that in Example 23 according to the second embodiment, differences from Example 2 according to the first embodiment (see Fig. 7) will be described.

[0178] 53 , in Example 23 according to the second embodiment, the reinforcing member 60 has a step portion 60d. The step portion 60d is formed in a single-step shape on the lens layer 40 side of the inner circumferential surface of the reinforcing member 60. The step portion 60d is formed in, for example, a frame shape in plan view.

[0179] With this configuration, if the step portion 60d does not exist, the bonding layer 50 (e.g., resin) may protrude onto the on-chip lens 41 side (pixel region R11 side), but this protrusion of the bonding layer 50 can be suppressed. This makes it possible to suppress reflection at the protruding portion of the bonding layer 50, thereby suppressing deterioration of optical characteristics such as halation. Furthermore, suppressing the protrusion of the bonding layer 50 by the structure eliminates the need for a high-precision resin application process, making it possible to manufacture the device using inexpensive equipment and shortening the manufacturing TAT.

[0180] <2-26. Example 24 of Imaging Device> A configuration example of an imaging device 10 of Example 24 according to the second embodiment will be described with reference to Fig. 54. Fig. 54 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 24 according to the second embodiment. Note that in Example 24 according to the second embodiment, differences from Example 23 according to the second embodiment (see Fig. 53) will be described.

[0181] 54, in Example 24 according to the second embodiment, a step portion 60d is formed in a two-step step shape on the lens layer 40 side of the inner peripheral surface of the reinforcing member 60. With this configuration, it is possible to obtain the same effect as in Example 23 according to the second embodiment.

[0182] <2-27. Example 25 of Imaging Device> A configuration example of an imaging device 10 according to Example 25 of the second embodiment will be described with reference to Fig. 55. Fig. 55 is a cross-sectional view showing a configuration example of an imaging device 10 according to Example 25 of the second embodiment. Note that in Example 25 of the second embodiment, differences from Example 24 of the second embodiment (see Fig. 53) will be described.

[0183] 55 , in Example 25 according to the second embodiment, the step portion 60d is formed in a tapered shape (inclined shape) on the lens layer 40 side of the inner circumferential surface of the reinforcing member 60. With this configuration, it is possible to obtain the same effect as in Example 23 according to the second embodiment.

[0184] <2-28. Example 26 of Imaging Device> A configuration example of an imaging device 10 according to Example 26 of the second embodiment will be described with reference to Fig. 56. Fig. 56 is a cross-sectional view showing a configuration example of an imaging device 10 according to Example 26 of the second embodiment. Note that in Example 26 of the second embodiment, differences from Example 24 of the second embodiment (see Fig. 53) will be described.

[0185] 56 , in Example 26 according to the second embodiment, a step 60d is formed on both the inner circumferential surface of the reinforcing member 60 facing the lens layer 40 and the outer circumferential surface facing the lens layer 40. In other words, there are two step portions 60d. With this configuration, it is possible to obtain the same effect as in Example 23 according to the second embodiment.

[0186] 2-29. Example of Manufacturing Process of Imaging Device An example of a manufacturing process of the imaging device 10 according to the second embodiment will be described with reference to FIGS.

[0187] (Example of manufacturing process of imaging device of Example 23) Fig. 57 is a cross-sectional view showing an example of manufacturing process of the imaging device 10 of Example 26 according to the second embodiment (see Fig. 56). Fig. 58 is a cross-sectional view showing another example of manufacturing process of the imaging device 10 of Example 26 according to the second embodiment.

[0188] 57 , a UV curable resin 251 is laminated on a glass substrate 250, and a mold 252 is provided for the UV curable resin 251 on the glass substrate 250. This mold 252 is a mold for forming a frame-shaped reinforcing member 60. UV is irradiated onto the UV curable resin 251 on the glass substrate 250 through the mold 252. This hardens the UV curable resin 251, and the frame-shaped reinforcing member 60 is formed on the glass substrate 250. Thereafter, the mold 252 is removed from the glass substrate 250.

[0189] On the other hand, a stacked body 200 is prepared, and a bonding layer 50 is laminated on the upper surface of the stacked body 200. As with the other examples, the stacked body 200 includes a semiconductor substrate 20, an adhesive layer 30, a lens layer 40, a wiring interlayer film 70, a wiring layer 80, and a protective layer 90. Thereafter, a glass substrate 250 having a frame-shaped reinforcing member 60 is turned upside down, and the glass substrate 250 having the frame-shaped reinforcing member 60 is provided on the stacked body 200 via the bonding layer 50. After the frame-shaped reinforcing member 60 is bonded to the stacked body 200, only the glass substrate 250 is removed from the frame-shaped reinforcing member 60. In this way, an imaging device 10 of Example 26 according to the second embodiment is completed.

[0190] (Another Example of a Manufacturing Process) As shown in FIG. 58 , a thermoplastic resin 253 is laminated on a glass substrate 250, a UV curable resin 251 is laminated on the thermoplastic resin 253, and a mold 252 is provided on the UV curable resin 251. This mold 252 is a model for forming a frame-shaped reinforcing member 60. The thermoplastic resin 253 is, for example, a thermoplastic resin with a low Tg (glass transition point). UV is irradiated onto the UV curable resin 251 on the glass substrate 250 through the mold 252. This hardens the UV curable resin 251, and the frame-shaped reinforcing member 60 is formed on the thermoplastic resin 253. Thereafter, the mold 252 is removed from the thermoplastic resin 253.

[0191] On the other hand, the laminate 200 is prepared, and a bonding layer 50 is laminated on the upper surface of the laminate 200. Thereafter, a glass substrate 250 having a thermoplastic resin 253 and a frame-shaped reinforcing member 60 is inverted upside down, and the glass substrate 250 having the thermoplastic resin 253 and the frame-shaped reinforcing member 60 is provided on the laminate 200 via the bonding layer 50. After the reinforcing member 60 is bonded to the laminate 200, the laminate 200 and the like are heated, and the thermoplastic resin 253 and the glass substrate 250 are removed from the frame-shaped reinforcing member 60. In this way, the imaging device 10 of Example 26 according to the second embodiment is completed.

[0192] The various manufacturing methods described above can be applied to various imaging devices 10 other than those of Example 23 according to the second embodiment. Furthermore, the various manufacturing methods described above can also be combined. The various manufacturing methods are performed, for example, at the wafer level.

[0193] <3. Third Embodiment> <3-1. Example 1 of Imaging Device> A configuration example of an imaging device 10 of Example 1 according to the third embodiment will be described with reference to Fig. 59. Fig. 59 is a cross-sectional view showing a configuration example of the imaging device 10 of Example 1 according to the third embodiment. Note that in Example 1 according to the third embodiment, differences from Example 2 according to the first embodiment (see Fig. 7) will be described.

[0194] 59 , in Example 1 according to the third embodiment, the reinforcing member 60 is composed of a first reinforcing member 63 and a second reinforcing member 64. The first reinforcing member 63 is laminated on the remaining lens material portion 42 of the lens layer 40. The second reinforcing member 64 is provided on the side surface (outer peripheral surface) of the remaining lens material portion 42, i.e., the side surface (outer peripheral surface) of the imaging device 10. The first reinforcing member 63 functions as a laminated member, and the second reinforcing member 64 functions as a side wall member.

[0195] Each of the first reinforcing member 63 and the second reinforcing member 64 is formed, for example, in a square or rectangular frame shape (ring shape) in a plan view. The first reinforcing member 63 and the second reinforcing member 64 are in contact with each other. For example, the ends of the first reinforcing member 63 and the second reinforcing member 64 are in contact with the upper surface of the lens layer 40 (the remaining lens material portion 42).

[0196] The first reinforcing member 63 is formed on the upper surface of the remaining lens material portion 42 by applying the material of the first reinforcing member 63 to the upper surface of the remaining lens material portion 42 of the lens layer 40 using a local application technique. The upper surface of the remaining lens material portion 42 is, for example, an adsorption area during transfer or an area that serves as a foothold for the lens module. The upper surface of the remaining lens material portion 42 is reinforced by the first reinforcing member 63. As the material of the first reinforcing member 63, for example, a material that is suitable for reinforcing the upper surface of the remaining lens material portion 42 is used.

[0197] For example, the first reinforcing member 63 is made of an inorganic Si-containing material such as photosensitive SOG (Spin On Glass) or SOC (Spin On Carbon), or an epoxy or acrylic resin, etc. Examples of acrylic resin include thermosetting, anaerobic, and photosensitive acrylic resins.

[0198] The second reinforcing member 64 is formed on the side of the imaging device 10 by applying the material of the second reinforcing member 64 to the corners (corners between the top and side surfaces) and side surfaces of the imaging device 10 using a local application technique. As the material of the second reinforcing member 64, for example, a material having a moisture-proof function and a suppressing function for suppressing film peeling due to moisture absorption is used.

[0199] For example, the second reinforcing member 64 may be made of a hybrid resin of epoxy and acrylic, or a BMI (bismalimide) resin, such as a thermosetting, anaerobic, or photosensitive BMI resin containing a curing agent.

[0200] According to this configuration, the first reinforcing member 63 is laminated on the remaining lens material portion 42 of the lens layer 40, and the second reinforcing member 64 is provided on the side surface of the remaining lens material portion 42, i.e., on the side surface (device side surface) of the imaging device 10. This makes it possible to reinforce the top surface of the remaining lens material portion 42 and also to prevent film peeling due to moisture absorption.

[0201] Here, for example, if a transparent substrate (e.g., a glass or sapphire substrate) is bonded to the pixel periphery to improve strength, flare may occur due to reflection from the side surface of the transparent substrate. Furthermore, bonding the transparent substrate to the pixel periphery requires many processes, such as forming marks on the transparent substrate and cutting out the transparent substrate. On the other hand, by providing a reinforcing member 60 (first reinforcing member 63 and second reinforcing member 64) in the pixel periphery using a material such as resin, the occurrence of flare can be suppressed and the manufacturing process can be simplified.

[0202] Regarding the moisture absorption of the second reinforcing member 64, the moisture-proofing effect differs depending on the resin. Furthermore, although the sealing ability varies depending on the film thickness, it is desirable to apply the resin so that the resin is at least 10 μm thick. For example, if the resin film thickness is 10 μm or less, the moisture-proofing may be insufficient. Furthermore, the application area of ​​the second reinforcing member 64 is desirably 10 μm or more from the top surface of the lens layer 40 (remaining lens material portion 42) along the side surface of the device, and desirably includes at least the side surface area facing the photoelectric conversion unit 101.

[0203] In addition, in order to improve strength, it is desirable that the corners (corners between the top and side surfaces) of the imaging device 10 are covered with a single type of material. In the example of Fig. 59, the corners of the imaging device 10 are covered with second reinforcing members 64.

[0204] <3-2. Example 2 of Imaging Device> A configuration example of an imaging device 10 of Example 2 according to the third embodiment will be described with reference to Fig. 60. Fig. 60 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 2 according to the third embodiment. Note that in Example 2 according to the third embodiment, differences from Example 1 according to the third embodiment (see Fig. 59) will be described.

[0205] 60 , in Example 2 according to the third embodiment, the second reinforcing member 64 is formed to cover the respective side surfaces of the lens layer 40, adhesive layer 30, semiconductor substrate 20, wiring interlayer film 70, and wiring layer 80. In other words, the application area of ​​the second reinforcing member 64 is an area extending from the upper surface of the lens layer 40 (remaining lens material portion 42) along the side surface of the device and including the respective side surfaces of the lens layer 40, adhesive layer 30, semiconductor substrate 20, wiring interlayer film 70, and wiring layer 80. With this configuration, it is possible to improve moisture-proof performance and also improve the ability to suppress film peeling due to moisture absorption.

[0206] <3-3. Example 3 of Imaging Device> A configuration example of an imaging device 10 of Example 3 according to the third embodiment will be described with reference to Fig. 61. Fig. 61 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 3 according to the third embodiment. Note that in Example 3 according to the third embodiment, differences from Example 1 according to the third embodiment (see Fig. 59) will be described.

[0207] 61 , in Example 3 according to the third embodiment, a groove (recess) 43 is formed in the lens layer 40. The groove 43 is formed, for example, on the upper surface of the remaining lens material portion 42 of the lens layer 40. The groove 43 is formed, for example, in a frame shape in plan view. With this configuration, when the material of the first reinforcing member 63 is applied to the upper surface of the remaining lens material portion 42, the presence of the groove 43 can prevent the applied material from flowing into the pixel region R11.

[0208] <3-4. Example 4 of Imaging Device> A configuration example of the imaging device 10 of Example 4 according to the third embodiment will be described with reference to Fig. 62. Fig. 62 is a cross-sectional view showing a configuration example of the imaging device 10 of Example 4 according to the third embodiment. Note that in Example 4 according to the third embodiment, differences from Example 1 according to the third embodiment (see Fig. 59) will be described.

[0209] 62 , in Example 4 related to the third embodiment, a bank portion (convex portion) 44 is formed on the lens layer 40. The bank portion 44 is formed, for example, on the upper surface of the remaining lens material portion 42 of the lens layer 40. The bank portion 44 is formed, for example, in a frame shape in plan view. With this configuration, when the material of the first reinforcing member 63 is applied to the upper surface of the remaining lens material portion 42, the presence of the bank portion 44 can prevent the applied material from flowing into the pixel region R11.

[0210] <3-5. Example 5 of Imaging Device> A configuration example of the imaging device 10 of Example 5 according to the third embodiment will be described with reference to Fig. 63. Fig. 63 is a cross-sectional view showing a configuration example of the imaging device 10 of Example 5 according to the third embodiment. Note that in Example 5 according to the third embodiment, differences from Example 1 according to the third embodiment (see Fig. 59) will be described.

[0211] As shown in FIG. 63 , in Example 5 according to the third embodiment, the inner circumferential surface of the first reinforcing member 63 (the end surface of the first reinforcing member 63 on the pixel region R11 side) is an inclined surface A2. The inclined surface A2 is, for example, a surface that slopes gradually downward from the outside to the inside of the imaging device 10. The inclined surface A2 is, for example, formed in a frame shape in a plan view. With this configuration, by forming the inner circumferential surface of the first reinforcing member 63 into the inclined surface A2, the direction of reflected light from the inner circumferential surface of the first reinforcing member 63 can be controlled, and reflection of light incident on the inner circumferential surface of the first reinforcing member 63 onto the pixel region R11 can be suppressed, i.e., the amount of light incident on the pixel region R11 can be reduced.

[0212] The inclined surface A2 of the first reinforcing member 63 may be, for example, a curved surface. Furthermore, since the first reinforcing member 63 needs to have a certain height and inclination, it may be made of a multi-layer film. For example, a resin with high moisture resistance and a resin with high reflowability may be alternately laminated.

[0213] 3-6. Shape Examples of Reinforcing Member Shape examples of the reinforcing member 60 (first reinforcing member 63) according to the third embodiment will be described with reference to Fig. 64 and Fig. 65. Fig. 64 is a cross-sectional view showing a shape example of the reinforcing member 60 (first reinforcing member 63) according to the third embodiment. Fig. 65 is a cross-sectional view showing another shape example of the reinforcing member 60 (first reinforcing member 63) according to the third embodiment.

[0214] 64 , the cross-sectional shape of the first reinforcing member 63 is semicircular. The first reinforcing member 63 is formed, for example, by applying the material of the first reinforcing member 63 to the upper surface of the remaining lens material portion 42 of the lens layer 40. This formation method is merely one example, and other formation methods may also be used.

[0215] 65 , the cross-sectional shape of the first reinforcing member 63 is trapezoidal. The first reinforcing member 63 is formed, for example, by applying the material of the first reinforcing member 63 to the upper surface of the remaining lens material portion 42 of the lens layer 40, and then melting the material by reflow once it has hardened. This formation method is merely one example, and other formation methods may also be used.

[0216] 3-7. Arrangement Examples of Reinforcing Members Arrangement examples of reinforcing members 60 according to the third embodiment will be described with reference to Fig. 66 to Fig. 68. Fig. 66 is a plan view showing an arrangement example of reinforcing members 60 according to the third embodiment. Fig. 67 and Fig. 68 are each plan views showing other arrangement examples of reinforcing members 60 according to the third embodiment.

[0217] 66 , the second reinforcing member 64 constituting the reinforcing member 60 is formed in a rectangular frame shape in a plan view, and is provided on a side surface (device side surface) of the imaging device 10. As a result, a portion of the side surface of the imaging device 10 is covered by the second reinforcing member 64. The first reinforcing member 63 constituting the reinforcing member 60 is formed, for example, in a rectangular frame shape in a plan view. The first reinforcing member 63 and the second reinforcing member 64 are connected at all four sides.

[0218] Note that, like the first embodiment described above, the first reinforcing member 63 is formed in a rectangular frame shape in plan view (see FIG. 3), but is not limited to the shape in FIG. 3 (the shape of the reinforcing member 60), and may be formed in shapes (the shapes of the reinforcing member 60) such as those in FIG. 5, FIG. 6, and FIG. 17. This also applies to the following FIG. 67 and FIG. 68, and the shapes in the respective figures can be combined as appropriate.

[0219] As shown in Fig. 67 , two second reinforcing members 64 are provided on both side surfaces of the imaging device 10 to sandwich the pixel region R11. As a result, part of the side surface of the imaging device 10 is covered by the second reinforcing members 64. With this configuration, it is possible to reduce the amount of material used for the second reinforcing members 64 compared to the frame-shaped second reinforcing members 64 described above. In the example of Fig. 67 , the both side surfaces of the imaging device 10 are the top and bottom side surfaces of the imaging device 10. The second reinforcing members 64 are formed linearly along one side of the outer peripheral region R12, which is rectangular in plan view.

[0220] In the example of Figure 67, the second reinforcing members 64 are arranged only on the top and bottom sides in Figure 67, but for example, the second reinforcing members 64 may be arranged only on the left and right sides in Figure 67, or the second reinforcing members 64 may be arranged only on one of the top and bottom or left and right side surfaces.

[0221] As shown in Fig. 68 , the multiple second reinforcing members 64 are positioned in a rectangular frame shape in a plan view and are provided on the side surfaces of the imaging device 10. As a result, part of the side surface of the imaging device 10 is covered by the second reinforcing members 64. With this configuration, it is possible to reduce the amount of material used for the second reinforcing members 64 compared to the frame-shaped second reinforcing members 64 described above. In the example of Fig. 68 , the number of second reinforcing members 64 is 22.

[0222] In the example of Figure 68, multiple second reinforcing members 64 are arranged along the entire circumference in Figure 68, but for example, multiple second reinforcing members 64 may be arranged only on the left and right side surfaces in Figure 68, or multiple second reinforcing members 64 may be arranged only on one of the top and bottom or left and right side surfaces.

[0223] 3-8. Example of Manufacturing Process of Imaging Device An example of a manufacturing process of the imaging device 10 according to the third embodiment will be described with reference to FIG.

[0224] (Example of Manufacturing Process of Imaging Device of Example 1) FIG. 69 is a cross-sectional view showing an example of manufacturing process of the imaging device 10 (see FIG. 59) of Example 1 according to the third embodiment.

[0225] 69 , in step S11, dicing is performed on the workpiece 500 placed on the dicing tape 501, and the dicing tape 501 is pulled in the horizontal direction, creating gaps at each of the multiple dicing positions. This forms multiple chips 502. Each of the chips 502 is a component that will become the imaging device 10.

[0226] In step S12, the dispenser 510 applies moisture-proof material to the side surface (edge) of the chip 502. For example, the moisture-proof material is applied around the entire side surface of the chip 502. As a result, the second reinforcing member 64 is formed in the desired region of the side surface of the chip 502.

[0227] In step S13, the dispenser 520 applies the reinforcing material to the upper surface of the chip 502. For example, the reinforcing material is applied around the entire upper surface of the chip 502. As a result, the first reinforcing member 63 is formed in the desired region on the upper surface of the chip 502.

[0228] In step S14, the chip 502 is picked up by the pickup unit 530. Thereafter, the chip 502 is transported to the next process, etc. A first reinforcing member 63 is formed on the top surface of the chip 502, and a second reinforcing member 64 is formed on the side surface of the chip 502.

[0229] In the above-mentioned steps S12 and S13, application is performed by each of the dispensers 510 and 520, so that the material can be applied to the side surfaces and corners of the chip 502 with a high coverage rate.

[0230] The order of steps S12 and S13 may be reversed, but in order to improve the coverage of the moisture-proof material on the side surfaces of the chip 502, it is desirable to perform step S12 before step S13.

[0231] <4. Fourth Embodiment> <4-1. Example 1 of Imaging Device> A configuration example of an imaging device 10 of Example 1 according to the fourth embodiment will be described with reference to Fig. 70. Fig. 70 is a cross-sectional view showing a configuration example of the imaging device 10 of Example 1 according to the fourth embodiment. Note that in Example 1 according to the fourth embodiment, differences from Example 2 according to the first embodiment (see Fig. 7) will be described.

[0232] 70 , in Example 1 according to the fourth embodiment, the lens layer 40 has an uneven surface 40a, and the reinforcing member 60 has an uneven surface 60a. The uneven surface 40a of the lens layer 40 is formed on the upper surface of the lens layer 40 (the surface of the lens layer 40 facing the reinforcing member 60). The uneven surface 60a of the reinforcing member 60 is formed on the lower surface of the reinforcing member 60 (the surface of the reinforcing member 60 facing the lens layer 40). The lens layer 40 and the reinforcing member 60 are bonded together via a bonding layer 50, with the uneven surfaces 40a and 60a facing each other.

[0233] The uneven surface 40a of the lens layer 40 is the upper surface of the lens layer 40. Specifically, the uneven surface 40a of the lens layer 40 is the upper surface of the lens material remaining portion 42 (see FIG. 7 ) of the lens layer 40. The uneven surface 40a of the lens layer 40 faces the reinforcing member 60. The upper surface of the lens layer 40 is formed in an uneven shape, thereby forming the uneven surface 40a on the lens layer 40. In the example of FIG. 70 , the uneven surface 40a of the lens layer 40 is formed in a sawtooth shape (triangular wave shape).

[0234] The uneven surface 60a of the reinforcing member 60 is the lower surface of the reinforcing member 60. The uneven surface 60a of the reinforcing member 60 faces the lens layer 40. The reinforcing member 60 is, for example, a light-transmitting substrate. The lower surface of the reinforcing member 60 is formed in an uneven shape, and the uneven surface 60a is formed on the reinforcing member 60. In the example of Fig. 70, the uneven surface 60a of the reinforcing member 60 is formed in a sawtooth shape (triangular wave shape).

[0235] The aforementioned uneven shape is a shape in which recesses and protrusions are repeated, so the uneven portion has a plurality of recesses and a plurality of protrusions. Each of the protrusions may have the same shape or may have different shapes. Furthermore, each of the protrusions may have the same size or may have different sizes.

[0236] With this configuration, by making the upper surface of the lens layer 40 an uneven surface 40a and the lower surface of the reinforcing member 60 an uneven surface 60a, the adhesion force of the bonding layer 50 is improved due to the anchor effect, thereby improving the strength of the peripheral portion (periphery of the chip) of the imaging device 10, i.e., improving the strength of the device.

[0237] 70, the uneven surface 40a of the lens layer 40 and the uneven surface 60a of the reinforcing member 60 are formed in a sawtooth shape (triangular wave shape), but this is not limiting. Also, although the uneven surface 40a of the lens layer 40 and the uneven surface 60a of the reinforcing member 60 are formed in the same shape, they may be formed in different shapes.

[0238] <4-2. Example 2 of Imaging Device> A configuration example of an imaging device 10 of Example 2 according to the fourth embodiment will be described with reference to Fig. 71. Fig. 71 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 2 according to the fourth embodiment. Note that in Example 2 according to the fourth embodiment, differences from Example 1 according to the fourth embodiment (see Fig. 70) will be described.

[0239] 71 , in Example 2 according to the fourth embodiment, only the reinforcing member 60 has an uneven surface 60 a on the side of the lens layer 40. The lens layer 40 and the reinforcing member 60 are bonded together via the bonding layer 50, with the uneven surface 60 a of the reinforcing member 60 facing the upper surface of the lens layer 40.

[0240] With this configuration, by making the lower surface of the reinforcing member 60 an uneven surface 60a, the adhesion force of the bonding layer 50 is improved due to the anchor effect, thereby improving the strength of the peripheral parts of the imaging device 10, i.e., improving the strength of the device.

[0241] <4-3. Example 3 of Imaging Device> A configuration example of an imaging device 10 of Example 3 according to the fourth embodiment will be described with reference to Fig. 72. Fig. 72 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 3 according to the fourth embodiment. Note that in Example 3 according to the fourth embodiment, differences from Example 1 according to the fourth embodiment (see Fig. 70) will be described.

[0242] 72 , in Example 3 according to the fourth embodiment, only the lens layer 40 has an uneven surface 40 a on the side of the reinforcing member 60. The lens layer 40 and the reinforcing member 60 are bonded together via a bonding layer 50, with the uneven surface 40 a of the lens layer 40 facing the lower surface of the reinforcing member 60.

[0243] With this configuration, by making the upper surface of the lens layer 40 an uneven surface 40a, the adhesion force of the bonding layer 50 is improved due to the anchor effect, thereby improving the strength of the peripheral parts of the imaging device 10, i.e., improving the strength of the device.

[0244] <4-4. Example 4 of Imaging Device> A configuration example of an imaging device 10 of Example 4 according to the fourth embodiment will be described with reference to Fig. 73. Fig. 73 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 4 according to the fourth embodiment. Note that in Example 4 according to the fourth embodiment, differences from Example 1 according to the fourth embodiment (see Fig. 70) will be described.

[0245] As shown in Fig. 73 , in Example 4 according to the fourth embodiment, the uneven surface 40a of the lens layer 40 and the uneven surface 60a of the reinforcing member 60 are each formed in a comb-tooth shape. In the example of Fig. 73 , the shapes of the concave and convex portions in the uneven surface 40a of the lens layer 40 and the uneven surface 60a of the reinforcing member 60 are each rectangular in cross section. With this configuration, it is possible to obtain the same effects as in Examples 1 to 3 according to the fourth embodiment.

[0246] From the viewpoint of the filling property of the bonding material (e.g., adhesive) and the strength of the concave-convex structure, the width of the convex portions (or concave portions) is preferably 20 μm or more, and the aspect ratio of the convex portions (or concave portions) is preferably 3 or less.

[0247] <4-5. Example 5 of Imaging Device> A configuration example of an imaging device 10 of Example 5 according to the fourth embodiment will be described with reference to Fig. 74. Fig. 74 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 5 according to the fourth embodiment. Note that in Example 5 according to the fourth embodiment, differences from Example 4 according to the fourth embodiment (see Fig. 73) will be described.

[0248] 74 , in Example 5 according to the fourth embodiment, only the reinforcing member 60 has a comb-tooth-shaped uneven surface 60a on the lens layer 40 side. The lens layer 40 and the reinforcing member 60 are bonded via a bonding layer 50, with the uneven surface 60a of the reinforcing member 60 facing the upper surface of the lens layer 40. With this configuration, it is possible to obtain the same effects as in Examples 1 to 4 according to the fourth embodiment.

[0249] 4-6. Example 6 of Imaging Device An example configuration of an imaging device 10 of Example 6 according to the fourth embodiment will be described with reference to Fig. 75. Fig. 75 is a cross-sectional view showing an example configuration of an imaging device 10 of Example 6 according to the fourth embodiment. Note that in Example 6 according to the fourth embodiment, differences from Example 4 according to the fourth embodiment (see Fig. 73) will be described.

[0250] 75 , in Example 6 according to the fourth embodiment, only the lens layer 40 has a comb-tooth shaped uneven surface 40a on the side of the reinforcing member 60. The lens layer 40 and the reinforcing member 60 are bonded together via a bonding layer 50, with the uneven surface 40a of the lens layer 40 facing the lower surface of the reinforcing member 60. With this configuration, it is possible to obtain the same effects as in Examples 1 to 5 according to the fourth embodiment.

[0251] 4-7. Example 7 of Imaging Device An example of the configuration of an imaging device 10 of Example 7 according to the fourth embodiment will be described with reference to Fig. 76. Fig. 76 is a cross-sectional view showing an example of the configuration of an imaging device 10 of Example 7 according to the fourth embodiment. Note that in Example 7 according to the fourth embodiment, differences from Example 4 according to the fourth embodiment (see Fig. 73) will be described.

[0252] 76 , in Example 7 according to the fourth embodiment, the uneven surface 40a of the lens layer 40 and the uneven surface 60a of the reinforcing member 60 have different uneven sizes and uneven pitches. For example, the uneven surface 40a of the lens layer 40 has different sizes and pitches for the plurality of convex portions and the plurality of concave portions. Furthermore, the uneven surface 60a of the reinforcing member 60 has different sizes and pitches for the plurality of convex portions and the plurality of concave portions.

[0253] According to this configuration, similar to Examples 1 to 6 according to the fourth embodiment, it is possible to improve the strength of the peripheral portion of the imaging device 10, i.e., to improve the strength of the device. Furthermore, by adjusting the size of the irregularities, it is possible to more reliably improve the strength of the device.

[0254] <4-8. Example 8 of Imaging Device> A configuration example of an imaging device 10 of Example 8 according to the fourth embodiment will be described with reference to Fig. 77. Fig. 77 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 8 according to the fourth embodiment. Note that in Example 8 according to the fourth embodiment, differences from Example 4 according to the fourth embodiment (see Fig. 73) will be described.

[0255] 77, in Example 8 according to the fourth embodiment, the bottom of each recess is formed in a trapezoidal shape in cross section on the uneven surface 40a of the lens layer 40 and the uneven surface 60a of the reinforcing member 60. With this configuration, it is possible to obtain the same effects as Examples 1 to 7 according to the fourth embodiment.

[0256] 4-9. Example 9 of Imaging Device An example of the configuration of an imaging device 10 of Example 9 according to the fourth embodiment will be described with reference to Fig. 78. Fig. 78 is a cross-sectional view showing an example of the configuration of the imaging device 10 of Example 9 according to the fourth embodiment. Note that in Example 9 according to the fourth embodiment, differences from Example 4 according to the fourth embodiment (see Fig. 73) will be described.

[0257] 78, in Example 9 according to the fourth embodiment, the bottom of each recess is formed in a semicircular shape in cross section on the uneven surface 40a of the lens layer 40 and the uneven surface 60a of the reinforcing member 60. With this configuration, it is possible to obtain the same effects as Examples 1 to 8 according to the fourth embodiment.

[0258] <4-10. Example 10 of Imaging Device> A configuration example of the imaging device 10 of Example 10 according to the fourth embodiment will be described with reference to Fig. 79. Fig. 79 is a cross-sectional view showing the configuration example of the imaging device 10 of Example 10 according to the fourth embodiment. Note that in Example 10 according to the fourth embodiment, differences from Example 2 according to the first embodiment (see Fig. 7) will be described.

[0259] As shown in Fig. 79 , in Example 10 according to the fourth embodiment, a plurality of reinforcing members 60 are stacked via bonding layers 50. The bonding layers 50 and the reinforcing members 60 are alternately stacked. In the example of Fig. 79 , the number of bonding layers 50 is three, and the number of reinforcing members 60 is also three, the same number as the number of bonding layers 50. These numbers of layers are not limited. The reinforcing members 60 are, for example, light-transmitting substrates. The bonding layers 50 are, for example, resin.

[0260] With this configuration, by using a multilayer structure with multiple reinforcing members 60, it is possible to realize a structure that easily distributes stress, thereby realizing the alleviation of stress deformation in the peripheral portion of the imaging device 10 (periphery of the chip).

[0261] <4-11. Example 11 of Imaging Device> A configuration example of an imaging device 10 of Example 11 according to the fourth embodiment will be described with reference to Fig. 80. Fig. 80 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 11 according to the fourth embodiment. Note that in Example 11 according to the fourth embodiment, differences from Example 10 according to the fourth embodiment (see Fig. 79) will be described.

[0262] 80 , in Example 11 according to the fourth embodiment, in addition to the plurality of bonding layers 50 and the plurality of reinforcing members 60, a plurality of warp alleviation layers 57 are provided. The warp alleviation layers 57 are provided between the bonding layers 50 and the reinforcing members 60. The warp alleviation layers 57 function as, for example, residual stress alleviation layers. The warp alleviation layers 57 are made of, for example, SiN, SiO, SiO, or the like.

[0263] According to this configuration, similarly to Example 10 according to the fourth embodiment, it is possible to alleviate stress deformation in the peripheral portion (chip peripheral portion) of the imaging device 10. It is also possible to alleviate deformation due to warpage.

[0264] 4-12. Arrangement Examples of Reinforcing Members Arrangement examples of the reinforcing members 60 according to the fourth embodiment will be described with reference to Fig. 81 to Fig. 88. Fig. 81 is a plan view showing an arrangement example of the reinforcing members 60 according to the fourth embodiment. Fig. 82 to Fig. 88 are plan views showing other arrangement examples of the reinforcing members 60 according to the fourth embodiment.

[0265] As shown in Fig. 81, the reinforcing member 60 is disposed in the outer peripheral region R12 so as to surround the pixel region R11. In the example of Fig. 81, the reinforcing member 60 is formed in a square frame shape (ring shape) in a plan view.

[0266] As shown in Fig. 82 , two reinforcing members 60 are arranged in the outer peripheral region R12 on either side of the pixel region R11 at both ends of the imaging device 10. In the example of Fig. 82 , the ends of the imaging device 10 are the top and bottom ends of the imaging device 10. The reinforcing member 60 is formed in a rectangular shape along one side of the pixel region R11, which is square in plan view.

[0267] As shown in Fig. 83 , two reinforcing members 60 are arranged in the outer peripheral region R12 on either side of the pixel region R11 at both ends of the imaging device 10. In the example of Fig. 83 , the ends of the imaging device 10 are the left and right ends of the imaging device 10. The reinforcing member 60 is formed in a rectangular shape along one side of the pixel region R11, which is square in plan view.

[0268] As shown in Fig. 84, the reinforcing member 60 is disposed in the outer peripheral region R12 so as to surround the pixel region R11 on three sides. In the example of Fig. 84, the reinforcing member 60 is formed in a U-shape in plan view.

[0269] 85 , a plurality of reinforcing members 60 are arranged in the outer peripheral region R12 so as to surround the pixel region R11. For example, the reinforcing members 60 are arranged around the pixel region R11 at desired intervals. In the example of FIG. 85 , each of the reinforcing members 60 is formed in a square shape in a plan view.

[0270] As shown in Fig. 86 , multiple reinforcing members 60 are arranged in the outer peripheral region R12 so as to surround the pixel region R11, similar to Fig. 85 . For example, the reinforcing members 60 are arranged around the pixel region R11 at desired intervals. In the example of Fig. 86 , each of the reinforcing members 60 is formed in a circular shape in a plan view.

[0271] 85 and 86 , multiple reinforcing members 60 are arranged in the outer peripheral region R12 so as to surround the pixel region R11. For example, the reinforcing members 60 are arranged side by side around the pixel region R11 so as to be in contact with each other. In the example of Fig. 87 , each of the reinforcing members 60 is formed in a diamond shape in a plan view.

[0272] 85 to 87, multiple reinforcing members 60 are arranged in the outer peripheral region R12 so as to surround the pixel region R11. For example, the reinforcing members 60 are arranged in a honeycomb pattern around the pixel region R11 so as not to contact each other. In the example of Fig. 88, each of the reinforcing members 60 is formed in a polygonal shape (e.g., a hexagonal shape) in plan view.

[0273] 4-13. Example of Manufacturing Process of Imaging Device An example of a manufacturing process of the imaging device 10 according to the fourth embodiment will be described with reference to FIGS.

[0274] (Example of Manufacturing Process of Imaging Device of Example 1) FIG. 89 is a cross-sectional view showing an example of manufacturing process of the imaging device 10 (see FIG. 70) of Example 1 according to the fourth embodiment.

[0275] 89 , one surface (lower surface) of the frame-shaped reinforcing member 60 is processed by sandblasting. As a result, one surface of the reinforcing member 60 becomes an uneven surface 60a. The uneven surface 60a is formed, for example, in a sawtooth shape. The reinforcing member 60 is, for example, a light-transmitting substrate.

[0276] One surface (top surface) of the lens layer 40 is processed by sandblasting. Specifically, the outer frame (lens outer frame) of the lens layer 40 other than the on-chip lenses 41 is processed by sandblasting. As a result, one surface (top surface of the lens outer frame) of the lens layer 40 becomes an uneven surface 40a. The uneven surface 40a is formed, for example, in a sawtooth shape.

[0277] The concave-convex surface 60a of the reinforcing member 60 faces the concave-convex surface 40a of the lens layer 40. The reinforcing member 60 is then bonded to the concave-convex surface 40a of the lens layer 40 via the bonding layer 50. In this way, the imaging device 10 of Example 1 according to the fourth embodiment is completed.

[0278] (Example of Manufacturing Process of Imaging Device of Example 4) FIG. 90 is a cross-sectional view showing an example of manufacturing process of the imaging device 10 (see FIG. 73) of Example 4 according to the fourth embodiment.

[0279] 90 , one surface (lower surface) of the frame-shaped reinforcing member 60 is processed by dry etching. As a result, one surface of the reinforcing member 60 becomes an uneven surface 60a. The uneven surface 60a is formed in a comb-teeth shape. The reinforcing member 60 is, for example, a light-transmitting substrate.

[0280] One surface (top surface) of the lens layer 40 is processed by dry etching. Specifically, the outer frame (lens outer frame) of the lens layer 40 other than the on-chip lenses 41 is processed by dry etching. As a result, one surface (top surface of the lens outer frame) of the lens layer 40 becomes an uneven surface 40a. The uneven surface 40a is formed, for example, in a comb-tooth shape.

[0281] The concave-convex surface 60a of the reinforcing member 60 faces the concave-convex surface 40a of the lens layer 40. The reinforcing member 60 is then bonded to the concave-convex surface 40a of the lens layer 40 via the bonding layer 50. This completes the imaging device 10 of Example 4 according to the fourth embodiment.

[0282] (Example of Manufacturing Process of Imaging Device of Example 10) FIG. 91 is a cross-sectional view showing an example of manufacturing process of the imaging device 10 (see FIG. 79) of Example 10 according to the fourth embodiment.

[0283] 91 , two frame-shaped reinforcing members 60 are bonded together by a bonding layer 50 (first layer of the bonding layer 50). The reinforcing members 60 are, for example, a light-transmitting substrate. The bonding layer 50 is, for example, an adhesive. Furthermore, a frame-shaped reinforcing member 60 is bonded to the two bonded frame-shaped reinforcing members 60 by the bonding layer 50 (second layer of the bonding layer 50).

[0284] Finally, the three bonded frame-shaped reinforcing members 60 are bonded to the upper surface of the lens layer 40 by the bonding layer 50 (the third layer of the bonding layer 50). In this way, the imaging device 10 of Example 10 according to the fourth embodiment is completed.

[0285] <5. Fifth Embodiment> <5-1. Example 1 of Imaging Device> A configuration example of an imaging device 10 of Example 1 according to the fifth embodiment will be described with reference to Fig. 92. Fig. 92 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 1 according to the fifth embodiment. Note that in Example 1 according to the fifth embodiment, differences from Example 1 according to the first embodiment (see Fig. 2) will be described.

[0286] 92 , in Example 1 according to the fifth embodiment, the reinforcing member 60 is provided so as to avoid the outermost region R12a included in the outer periphery region R12. As in the other embodiments, the outer periphery region R12 is formed, for example, in a frame shape (ring shape) in plan view. The outermost region R12a within this outer periphery region R12 is located outside the outer periphery region R12 (outside the device) and is formed, for example, in a frame shape in plan view. The reinforcing member 60 is, for example, a light-transmitting substrate. The reinforcing member 60 is bonded to the first semiconductor substrate 20 by a bonding layer 50. The bonding layer 50 is, for example, a resin.

[0287] Here, the imaging device 10 is configured by laminating a first semiconductor substrate 20, a wiring layer 70A, and a second semiconductor substrate 80A, and laminating a bonding layer 50 and a reinforcing member 60 on the laminate. For example, a protective layer may be laminated, or an intermediate layer (e.g., a color filter or an inorganic film) may be laminated. The intermediate layer may include, for example, the adhesive layer 30 according to another embodiment, or may be provided in place of the adhesive layer 30.

[0288] The side surface (outer peripheral surface) 60e of the reinforcing member 60 is located more inward (inside the device) than the side surface (outer peripheral surface) 20a of the first semiconductor substrate 20. In other words, the reinforcing member 60 is formed so that its side surface 60e is located more inward than the side surface 20a of the first semiconductor substrate 20. The side surface 20a of the first semiconductor substrate 20, the side surface 70a of the wiring layer 70A, and the side surface 80a of the second semiconductor substrate 80A are located on the same plane. This is due to cutting using a blade or the like, and these side surfaces are normally located on the same plane. Note that in the example of FIG. 92, intermediate layers (e.g., color filters, inorganic films, etc.) are not shown. This also applies to the subsequent figures.

[0289] Here, a slit portion 46 is provided in the outermost peripheral region R12a of the first semiconductor substrate 20. The slit portion 46 functions as a slit region present in the outermost peripheral region R12a. When this slit portion 46 is present, the side surface 60e of the reinforcing member 60 is located more inward than the slit portion 46.

[0290] (Manufacturing Process Example) Fig. 93 is a cross-sectional view showing a manufacturing process example of the imaging device 10 (see Fig. 92) of Example 1 according to the fifth embodiment. Fig. 94 is a plan view showing a cut line 620 according to the fifth embodiment.

[0291] As shown in FIG. 93 , a workpiece 600 such as a wafer is singulated by a blade 610. The workpiece 600 is configured by stacking a first semiconductor substrate 20, a wiring layer 70A, and a second semiconductor substrate 80A, and then stacking a bonding layer 50 and a reinforcing member 60 on the stack for each imaging device 10 to be manufactured. In the example of FIG. 93 , the blade 610 cuts the first semiconductor substrate 20, the wiring layer 70A, the second semiconductor substrate 80A, etc., without cutting the reinforcing member 60 and the bonding layer 50. As a result, multiple imaging devices 10 are formed from the workpiece 600. At this time, as shown in FIG. 94 , for example, the workpiece 600 is cut along cut lines 620 to singulate the workpiece 600.

[0292] Comparative Example FIG. 95 is a cross-sectional view showing an example of a manufacturing process for an imaging device 10A of a comparative example according to the fifth embodiment.

[0293] As shown in Fig. 95 , a workpiece 650 is divided into individual pieces by a blade 610. The workpiece 650 is configured by laminating a first semiconductor substrate 20, a wiring layer 70A, and a second semiconductor substrate 80A, and then laminating a bonding layer 50 and a reinforcing member 60 on the laminate. In the example of Fig. 95 , the blade 610 cuts the reinforcing member 60, the bonding layer 50, the first semiconductor substrate 20, the wiring layer 70A, the second semiconductor substrate 80A, etc. As a result, a plurality of imaging devices 10A are formed from the workpiece 650.

[0294] In the workpiece 650 of the comparative example, cracks K2 that occur when the workpiece 650 is singulated are suppressed by the reinforcing member 60. As a result, cracks, delamination, or chipping are more likely to occur below the reinforcing member 60 and extend toward the inside of the chip (inside the device). In addition, the slit portion 46 is filled with the material of the bonding layer 50. As a result, if cracks K2 occur during singulation, the cracks K2 do not head toward the slit portion 46 but instead extend toward the inside of the chip.

[0295] On the other hand, in the workpiece 600, the reinforcing member 60 is provided so as to avoid the outermost peripheral region R12a (see FIG. 92). As a result, cracks K1 (see FIG. 93) that occur when the workpiece 600 is singulated are not suppressed by the reinforcing member 60. As a result, cracks, delamination, or chipping are more likely to occur outside the reinforcing member 60, i.e., in the outermost peripheral region R12a, and the cracks, delamination, or chipping can be prevented from spreading toward the inside of the chip.

[0296] Furthermore, if a slit portion 46 is present, the slit portion 46 will not be filled with the material of the bonding layer 50 or the like and will instead be groove-shaped. This causes the crack K1 to run toward the slit portion 46, thereby preventing it from extending toward the inside of the chip. Furthermore, since there is no transparent material or resin in the area cut by the blade 610, the processing load is reduced, and the blade life can be extended.

[0297] <5-2. Example 2 of Imaging Device> A configuration example of an imaging device 10 of Example 2 according to the fifth embodiment will be described with reference to Fig. 96. Fig. 96 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 2 according to the fifth embodiment. Note that in Example 2 according to the fifth embodiment, differences from Example 1 according to the fifth embodiment (see Figs. 92 and 93) will be described.

[0298] As shown in FIG. 96 , in Example 2 according to the fifth embodiment, the side surface 60e of the reinforcing member 60 is located outside (outside the device) compared to Example 1 according to the fifth embodiment. In the example of FIG. 96 , the side surface 60e of the reinforcing member 60 is located outside the slit portion 46. In this configuration, the slit portion 46 is filled with the material of the bonding layer 50, but as described above, cracks K1 that occur when the workpiece 600 is singulated are not suppressed by the reinforcing member 60. Therefore, cracks, delamination, or chipping are more likely to occur outside the reinforcing member 60, i.e., in the outermost peripheral region R12a, and the cracks, delamination, or chipping can be prevented from extending toward the inside of the chip.

[0299] <5-3. Example 3 of Imaging Device> A configuration example of an imaging device 10 of Example 3 according to the fifth embodiment will be described with reference to Fig. 97. Fig. 97 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 3 according to the fifth embodiment. Note that in Example 3 according to the fifth embodiment, differences from Example 1 according to the fifth embodiment (see Figs. 92 and 93) will be described.

[0300] 97, in Example 3 according to the fifth embodiment, the side surface 60e of the reinforcing member 60 is located more inward (inside the device) than in Example 1 according to the fifth embodiment. With this configuration, it is possible to obtain the same effects as in Example 1 according to the fifth embodiment.

[0301] <5-4. Example 4 of Imaging Device> A configuration example of an imaging device 10 of Example 4 according to the fifth embodiment will be described with reference to Fig. 98. Fig. 98 is a cross-sectional view showing a configuration example of an imaging device 10 of Example 4 according to the fifth embodiment. Note that in Example 4 according to the fifth embodiment, differences from Example 1 according to the fifth embodiment (see Figs. 92 and 93) will be described.

[0302] 98 , in Example 4 according to the fifth embodiment, the reinforcing member 60 is made of, for example, resin, and is provided directly on the upper surface of the first semiconductor substrate 20 without the bonding layer 50. Therefore, the bonding layer 50 is not required. With this configuration, it is possible to obtain the same effects as in Example 1 according to the fifth embodiment.

[0303] 6. Actions and Effects of the Embodiment As described above, the imaging device 10 according to the embodiment includes a pixel region R11 having a plurality of pixels 100, a peripheral region R12 that is a region surrounding the pixel region R11, and a reinforcing member 60 provided in the peripheral region R12 (see, for example, FIGS. 2 and 3 ). As a result, the imaging device 10 is reinforced by the reinforcing member 60, and the strength of the imaging device 10 can be improved. For example, damage to the imaging device 10 due to an external impact can be reduced.

[0304] The imaging device 10 may also include a plurality of on-chip lenses 41 provided in the pixel region R11 corresponding to a plurality of pixels 100, and a remaining lens material portion 42 provided in the peripheral region R12 and made of the same material as the plurality of on-chip lenses 41, and the reinforcing member 60 may be laminated on the remaining lens material portion 42 (see FIG. 7 ). Even in this case, the strength of the device can be improved. Furthermore, the presence of the remaining lens material portion 42 makes it possible to suppress deformation of the end portion of each on-chip lens 41, thereby achieving uniform light-collection performance within the pixel region R11.

[0305] The remaining lens material portion 42 and the plurality of on-chip lenses 41 may each be made of an organic material (see FIG. 7 ). Even in this case, the strength of the device can be improved. Furthermore, since the remaining lens material portion 42, which is made of an organic material, is covered with the reinforcing member 60, moisture absorption by the remaining lens material portion 42 can be suppressed.

[0306] The reinforcing member 60 may be made of glass (see FIGS. 2 and 3), sapphire glass (see FIG. 10), or a laminated film of glass and sapphire glass (see FIG. 9), thereby ensuring an improvement in the strength of the device.

[0307] The imaging device 10 may further include a plurality of on-chip lenses 41 provided in the pixel region R11 corresponding to the plurality of pixels 100, and a low-refractive index layer 55 provided in the pixel region R11 and the peripheral region R12 so as to cover the plurality of on-chip lenses 41 and formed of a material having a refractive index lower than that of each of the plurality of on-chip lenses 41. The reinforcing member 60 may be laminated on the low-refractive index layer 55 in the peripheral region R12 (see FIG. 8 ). Even in this case, the strength of the device can be improved. Furthermore, by providing the low-refractive index layer 55 on each on-chip lens 41, the light-receiving surface can be flattened.

[0308] The on-chip lenses 41 may be made of an inorganic material (see FIG. 8). Even in this case, the strength of the device can be improved. Furthermore, each on-chip lens 41 itself can function as a water-resistant cover film.

[0309] The reinforcing member 60 may also have a step portion A1 (see FIGS. 12 and 13). This allows the step portion A1 to be used for positioning a member such as a lens unit 95 when the member is provided on the upper portion of the imaging device 10.

[0310] The imaging device 10 may further include an anti-reflection layer 65 that is provided on the inner circumferential surface of the reinforcing member 60 and that prevents reflection of light (see FIG. 14 ). This makes it possible to suppress reflection of light that has entered the inner circumferential surface of the reinforcing member 60 onto the pixel region R11, thereby reducing the amount of light that enters the pixel region R11.

[0311] The inner peripheral surface of the reinforcing member 60 may be an inclined surface A2 or an inclined surface B1 (see FIGS. 15 and 50 ). This makes it possible to suppress reflection of light incident on the inner peripheral surface of the reinforcing member 60 onto the pixel region R11, thereby reducing the amount of light incident on the pixel region R11.

[0312] The inner peripheral surface of the reinforcing member 60 may be a curved surface A3, a stepped surface B2, or a curved surface B3 (see FIGS. 16, 51, and 52). This makes it possible to suppress reflection of light incident on the inner peripheral surface of the reinforcing member 60 onto the pixel region R11, thereby reducing the amount of light incident on the pixel region R11.

[0313] The inner peripheral surface of the reinforcing member 60 may have a sawtooth surface A4 in plan view (see FIG. 17 ), which makes it possible to scatter light incident on the inner peripheral surface of the reinforcing member 60, thereby reducing the amount of light incident on the pixel region R11.

[0314] The reinforcing member 60 may also be a semiconductor chip A5 (see FIGS. 18 and 19). This allows the semiconductor chip A5 to be used to provide the imaging device 10 with various functions such as a memory, a processor, and a signal processing chip.

[0315] The reinforcing member 60 may be formed so as to surround the pixel region R11 in plan view (see FIG. 3), thereby ensuring an improvement in the strength of the device.

[0316] Furthermore, the reinforcing member 60 may be formed along only two sides of the pixel region R11, which has a quadrangular shape (e.g., a rectangular or square shape) in a plan view (see FIGS. 5 and 19 ), thereby ensuring an improvement in the strength of the device.

[0317] The reinforcing members 60 may also be provided at the corners of the outer peripheral region R12 (for example, at any or all of the four corners) (see FIG. 6 ), thereby ensuring an improvement in the strength of the device.

[0318] The imaging device 10 further includes a plurality of on-chip lenses 41 provided in the pixel region R11 corresponding to the plurality of pixels 100, and a light-transmitting substrate 56 provided in the pixel region R11 and the peripheral region R12 so as to cover the plurality of on-chip lenses 41. The reinforcing member 60 is laminated on the light-transmitting substrate 56 in the peripheral region R12, and the hardness of the reinforcing member 60 may be higher than the hardness of the light-transmitting substrate 56 (see FIG. 11 ). This improves the strength of the device. Furthermore, the presence of the reinforcing member 60 allows the light-transmitting substrate 56 to be made thinner.

[0319] The thickness of the reinforcing member 60 may be 100 μm or more and 700 μm or less (see FIG. 2, etc.). This makes it possible to improve the strength of the device and also to suppress optical noise.

[0320] The imaging device 10 may further include a plurality of on-chip lenses 41 provided in the pixel region R11 corresponding to the plurality of pixels 100, and the height position of the lower end of the reinforcing member 60 may be higher than the height position of the upper ends of the plurality of on-chip lenses 41 (see FIG. 2, etc.). This reliably improves the strength of the device.

[0321] Furthermore, the reinforcing member 60 may be formed of a light absorbing material (see FIG. 20, etc.). This makes it possible to improve the strength of the device while suppressing flare and other issues, thereby improving the optical characteristics.

[0322] The reinforcing member 60 is composed of a first layer 61 and a second layer 62, and the second layer 62 may be made of a light-absorbing material (see, for example, FIGS. 21 to 28 ). This makes it possible to improve the strength of the device while suppressing flare and other issues, thereby improving the optical characteristics.

[0323] Furthermore, the reinforcing member 60 may have an uneven portion 60b or an uneven portion 60c (see, for example, FIGS. 29 to 33). This makes it possible to improve the strength of the device while suppressing flare and other issues, thereby improving the optical characteristics.

[0324] Furthermore, the reinforcing member 60 is formed so as to cover the side surface (the outer peripheral surface of the device) connected to the outer peripheral region R12 (see FIGS. 39 to 43, etc.), thereby making it possible to reliably improve the strength of the device.

[0325] The imaging device 10 further includes a lens layer 40 including a plurality of on-chip lenses 41 provided in the pixel region R11, and the reinforcing member 60 is bonded to the lens layer 40 by a bonding layer 50, and the reinforcing member 60 may have a step portion 60d on the lens layer 40 side (see, for example, FIGS. 53 to 56 ). This makes it possible to suppress protrusion of the bonding layer 50, thereby suppressing reflection at the protruding portion of the bonding layer 50 and suppressing deterioration of optical characteristics such as halation.

[0326] The reinforcing member 60 may also include a first reinforcing member 63 provided in the outer peripheral region R12 and a second reinforcing member 64 provided on the side surface connected to the outer peripheral region R12 (see, for example, FIGS. 59 to 63 ). This can reliably improve the strength of the device.

[0327] Furthermore, the first reinforcing member 63 and the second reinforcing member 64 may be in contact with each other (see FIGS. 59 to 63, etc.), which can reliably improve the strength of the device.

[0328] Furthermore, the first reinforcing member 63 and the second reinforcing member 64 may be made of different resin materials, which allows for an appropriate selection of the resin material, thereby ensuring an improvement in the strength of the device.

[0329] The imaging device 10 further includes a lens layer 40 including a plurality of on-chip lenses 41 provided in the pixel region R11, and the first reinforcing member 63 is laminated on the lens layer 40, which may have grooves 43 or banks 44 (see FIGS. 61 and 62 ). This makes it possible to prevent the material of the first reinforcing member 63 from flowing into the pixel region R11 when the material is applied to the lens layer 40.

[0330] The imaging device 10 further includes a lens layer 40 including a plurality of on-chip lenses 41 provided in the pixel region R11, and the reinforcing member 60 is bonded to the lens layer 40 by a bonding layer 50, and the surface of the reinforcing member 60 facing the lens layer 40 may be an uneven surface 60a (see, for example, FIGS. 70, 71, 73, 74, 76 to 78). This improves the adhesion force of the bonding layer 50 due to the anchor effect, thereby reliably improving the strength of the device.

[0331] The imaging device 10 further includes a lens layer 40 including a plurality of on-chip lenses 41 provided in the pixel region R11, and the reinforcing member 60 is bonded to the lens layer 40 by a bonding layer 50, and the surface of the lens layer 40 facing the reinforcing member 60 may be an uneven surface 40a (see, for example, FIGS. 70, 72, 73, 75 to 78). This improves the adhesion force of the bonding layer 50 due to the anchor effect, thereby reliably improving the strength of the device.

[0332] Furthermore, a plurality of reinforcing members 60 may be present, and the plurality of reinforcing members 60 may be stacked via bonding layers 50 (see, for example, FIGS. 79 and 80). This makes it possible to realize a structure in which stress is easily dispersed, thereby reliably improving the strength of the device.

[0333] The imaging device 10 may further include a warpage alleviation layer 57 provided between the reinforcing member 60 and the bonding layer 50 (see FIG. 80 ). This makes it possible to realize a structure that easily disperses stress, thereby reliably improving the strength of the device.

[0334] Furthermore, the reinforcing member 60 may be provided so as to avoid the outermost peripheral region R12a included in the peripheral region R12 (see, for example, FIGS. 92 to 94 and 96 to 98), which makes it possible to prevent cracks, delamination, or chipping from spreading toward the inside of the device.

[0335] The imaging device 10 may further include a semiconductor substrate 20 provided in the pixel region R11 and the peripheral region R12, and the side surface 60e of the reinforcing member 60 may be located more inward (inside the device) than the side surface 20a of the semiconductor substrate 20. This makes it possible to prevent cracks, delamination, or chipping from spreading inside the device.

[0336] Furthermore, the outermost peripheral region R12a may include a slit region (for example, the slit portion 46), which can reliably prevent cracks, delamination, or chipping from spreading toward the inside of the device.

[0337] 7. Other Embodiments The configurations and processes according to the above-described embodiments (including examples and modified examples) may be implemented in various different forms other than the above-described embodiments. For example, the configurations and processes are not limited to the above-described examples and may be implemented in various forms. Furthermore, for example, the configurations, processing procedures, specific names, or information including various data and parameters shown in the above documents and drawings may be changed arbitrarily unless otherwise specified.

[0338] Furthermore, the components and processes according to the above-described embodiments (including examples and modifications) do not necessarily have to be physically configured as shown in the drawings. In other words, the specific form of distribution and integration of the components and processes is not limited to that shown in the drawings, and all or part of them may be functionally or physically distributed or integrated in any unit depending on various loads, usage conditions, etc.

[0339] Furthermore, the configurations and processes of the above-described embodiments (including examples and modified examples) may be combined as appropriate. For example, at least a part of an embodiment may be combined as appropriate with at least a part of another embodiment. Furthermore, the effects of the embodiments are merely examples and are not intended to be limiting, and other effects may also be obtained.

[0340] 8. Application Examples An application example of the imaging device 10 according to the above-described embodiment (including examples and modifications) will be described with reference to Fig. 99. Fig. 99 is a diagram showing an application example in which the imaging device 10 is used.

[0341] The imaging device 10 can be used in various cases for sensing light such as visible light, infrared light, ultraviolet light, and X-rays, for example, as follows. For example, as shown in FIG. 99 , the imaging device 10 is used in the following applications: "devices for capturing images for viewing, such as digital cameras and portable devices with camera functions," "devices for traffic use, such as in-vehicle sensors for capturing images of the front, rear, surroundings, and interior of a vehicle for safe driving such as automatic stopping and for recognizing the driver's state, surveillance cameras for monitoring moving vehicles and roads, and distance measuring sensors for measuring distances between vehicles," "devices for home appliances such as TVs, refrigerators, and air conditioners for capturing images of user gestures and operating the device in accordance with the gestures," "devices for medical and healthcare use, such as endoscopes and devices for capturing blood vessel images by receiving infrared light," "devices for security use, such as surveillance cameras for crime prevention and cameras for person authentication," "devices for beauty use, such as skin measuring devices for capturing images of the skin and microscopes for capturing images of the scalp," "devices for sports use, such as action cameras and wearable cameras for sports use," and "devices for agriculture, such as cameras for monitoring the condition of fields and crops."

[0342] The technology according to the present disclosure can be applied to various products. For example, the technology according to the present disclosure may be realized as an electronic device mounted on any type of moving body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility device, an airplane, a drone, a ship, a robot, a construction machine, or an agricultural machine (tractor). Furthermore, for example, the technology according to the present disclosure may be realized as an electronic device mounted on an endoscopic surgery system, a microsurgery system, or the like.

[0343] <8-1. Imaging Device> An imaging device 300 according to an application example will be described with reference to Fig. 100. Fig. 100 is a diagram showing an example of the configuration of the imaging device 300 according to an application example. The imaging device 300 is an example of an electronic device to which the imaging device 10 according to the above-described embodiment is applied. Examples of the imaging device 300 include electronic devices such as digital still cameras, video cameras, smartphones and mobile phones with imaging functions.

[0344] 100, the imaging device 300 includes an optical system 301, a shutter device 302, an imaging element (solid-state imaging device) 303, a control circuit (drive circuit) 304, a signal processing circuit 305, a monitor 306, and a memory 307. The imaging device 300 is capable of capturing still images and moving images.

[0345] The optical system 301 includes one or more lenses. The optical system 301 guides light from a subject (incident light) to the image sensor 303, and forms an image on the light receiving surface of the image sensor 303.

[0346] The shutter device 302 is disposed between the optical system 301 and the image sensor 303. The shutter device 302 controls the light irradiation period and the light blocking period for the image sensor 303 under the control of the control circuit 304.

[0347] The image sensor 303 accumulates signal charges for a certain period of time in response to light that is focused on the light receiving surface via the optical system 301 and the shutter device 302. The signal charges accumulated in the image sensor 303 are transferred in accordance with a drive signal (timing signal) supplied from the control circuit 304. As the image sensor 303, for example, the image sensor 10 according to the above-described embodiment is used.

[0348] The control circuit 304 outputs a drive signal that controls the transfer operation of the image sensor 303 and the shutter operation of the shutter device 302 , thereby driving the image sensor 303 and the shutter device 302 .

[0349] The signal processing circuit 305 performs various signal processing on the signal charges output from the image sensor 303. The image (image data) obtained by the signal processing performed by the signal processing circuit 305 is supplied to a monitor 306 and also to a memory 307.

[0350] The monitor 306 displays moving or still images captured by the image sensor 303 based on the image data supplied from the signal processing circuit 305. As the monitor 306, for example, a panel-type display device such as a liquid crystal panel or an organic EL (Electro Luminescence) panel is used.

[0351] The memory 307 stores the image data supplied from the signal processing circuit 305 , that is, the image data of a moving image or a still image captured by the image sensor 303 .

[0352] Even in the imaging device 300 configured in this way, by applying the imaging device 10 according to the above-described embodiment to the imaging element 303, it is possible to improve the strength of the device.

[0353] <8-2. Distance Measuring Device> A distance measuring device 400 according to an application example will be described with reference to Fig. 101. Fig. 101 is a diagram showing an example of the configuration of the distance measuring device 400 according to an application example. This distance measuring device 400 is an example of an electronic device to which the imaging device 10 according to the above-described embodiment is applied.

[0354] 101, distance measuring device (distance image sensor) 400 includes a light source unit 401, an optical system 402, an image sensor (solid-state image sensor) 403, a control circuit (drive circuit) 404, a signal processing circuit 405, a monitor 406, and a memory 407. Distance measuring device 400 projects light from light source unit 401 toward an object and receives light (modulated light or pulsed light) reflected from the surface of the object, thereby obtaining a distance image according to the distance to the object.

[0355] The light source unit 401 projects light toward the subject. For example, a vertical cavity surface emitting laser (VCSEL) array that emits laser light as a surface light source, or a laser diode array in which laser diodes are arranged in a line, is used as the light source unit 401. The laser diode array is supported by a predetermined drive unit (not shown) and scanned in a direction perpendicular to the direction in which the laser diodes are arranged.

[0356] The optical system 402 includes one or more lenses. The optical system 402 guides light from a subject (incident light) to the image sensor 403, and forms an image on the light receiving surface (sensor portion) of the image sensor 403.

[0357] The image sensor 403 accumulates signal charges in response to light that is imaged on the light receiving surface via the optical system 402. A distance signal indicating a distance determined from a light receiving signal (APD OUT) output from the image sensor 403 is supplied to a signal processing circuit 405. As the image sensor 403, for example, the image sensor 10 according to the above-described embodiment is used.

[0358] The control circuit 404 outputs a drive signal (control signal) that controls the operation of the light source unit 401, the image sensor 403, and the like, thereby driving the light source unit 401, the image sensor 403, and the like.

[0359] The signal processing circuit 405 performs various signal processing on the distance signal supplied from the image sensor 403. For example, the signal processing circuit 405 performs image processing (e.g., histogram processing, peak detection processing, etc.) to construct a distance image based on the distance signal. The image (image data) obtained by the signal processing performed by the signal processing circuit 405 is supplied to a monitor 406 and also to a memory 407.

[0360] The monitor 406 displays the distance image captured by the image sensor 403 based on the image data supplied from the signal processing circuit 405. The monitor 406 may be, for example, a panel display device such as a liquid crystal panel or an organic EL panel.

[0361] The memory 407 stores the image data supplied from the signal processing circuit 405 , that is, the image data of the distance image captured by the image sensor 403 .

[0362] In the distance measuring device 400 configured as above, by applying the imaging device 10 according to the above-described embodiment to the imaging element 403, it is possible to improve the strength of the device.

[0363] As described above, the imaging device 10 according to the above-described embodiment can be implemented in various electronic devices. For example, the imaging device 10 may be installed in various electronic devices such as an HDD (hard disk drive), a notebook PC (personal computer), a mobile device (e.g., a smartphone or tablet PC), a PDA (personal digital assistant), a wearable device, a game device, or a music device, in addition to the imaging device 300 or the distance measuring device 400.

[0364] <9. Supplementary Notes> The present technology may also have the following configurations. (1) An imaging device comprising: a pixel region having a plurality of pixels; a peripheral region that is a region surrounding the pixel region; and a reinforcing member provided in the peripheral region. (2) The imaging device according to (1), comprising: a plurality of lenses provided in the pixel region; and a lens material remaining portion provided in the peripheral region and formed of the same material as the plurality of lenses, wherein the reinforcing member is laminated on the lens material remaining portion. (3) The imaging device according to (2), wherein the lens material remaining portion and the plurality of lenses are formed of an organic material. (4) The imaging device according to any one of (1) to (3), wherein the reinforcing member is formed of glass, sapphire glass, or a laminated film of glass and sapphire glass. (5) The imaging device according to (1), further comprising: a plurality of lenses provided in the pixel region; and a low-refractive index layer provided in the pixel region and the outer circumferential region so as to cover the plurality of lenses, the low-refractive index layer being formed of a material having a refractive index lower than that of each of the plurality of lenses, wherein the reinforcing member is laminated on the low-refractive index layer in the outer circumferential region. (6) The imaging device according to (5), wherein the plurality of lenses are formed of an inorganic material. (7) The imaging device according to any one of (1) to (6), wherein the reinforcing member has a stepped portion. (8) The imaging device according to any one of (1) to (7), further comprising an anti-reflection layer provided on an inner circumferential surface of the reinforcing member and preventing reflection of light. (9) The imaging device according to any one of (1) to (8), wherein the inner circumferential surface of the reinforcing member is an inclined surface. (10) The imaging device according to any one of (1) to (8), wherein the inner circumferential surface of the reinforcing member is a curved surface or a stepped surface. (11) The imaging device according to any one of (1) to (8), wherein an inner circumferential surface of the reinforcing member is a sawtooth-shaped surface in a plan view. (12) The imaging device according to any one of (1) to (11), wherein the reinforcing member is a semiconductor chip.(13) The imaging device according to any one of (1) to (12), wherein the reinforcing member is formed so as to surround the pixel region in a planar view. (14) The imaging device according to any one of (1) to (12), wherein the reinforcing member is formed so as to follow only two sides of the pixel region, which is rectangular in a planar view. (15) The imaging device according to any one of (1) to (12), wherein the reinforcing member is provided at a corner of the outer periphery region. (16) The imaging device according to (1), further comprising: a plurality of lenses provided in the pixel region; and a light-transmitting substrate provided in the pixel region and the outer periphery region so as to cover the plurality of lenses, wherein the reinforcing member is laminated on the light-transmitting substrate in the outer periphery region, and wherein the hardness of the reinforcing member is higher than the hardness of the light-transmitting substrate. (17) The imaging device according to any one of (1) to (16), wherein the thickness of the reinforcing member is 100 μm or more and 700 μm or less. (18) The imaging device according to (1), further comprising a plurality of lenses provided in the pixel region, wherein a height position of a lower end of the reinforcing member is higher than a height position of an upper end of each of the plurality of lenses. (19) An electronic device comprising an imaging device, the imaging device having: a pixel region having a plurality of pixels; a peripheral region that is a region around the pixel region; and a reinforcing member provided in the peripheral region. (20) A method for manufacturing an imaging device, including providing a reinforcing member in the peripheral region that is a region around the pixel region having a plurality of pixels. (21) The imaging device according to (1), wherein the reinforcing member is formed of a light-absorbing material. (22) The imaging device according to (1), wherein the reinforcing member is composed of a first layer and a second layer, and the second layer is formed of a light-absorbing material. (23) The imaging device according to (1), wherein the reinforcing member has an uneven portion. (24) The imaging device according to (1), wherein the reinforcing member is formed to cover a side surface connected to the peripheral region.(25) The imaging device according to (1), further comprising a lens layer including a plurality of lenses provided in the pixel region, wherein the reinforcing member is bonded to the lens layer by a bonding layer, and wherein the reinforcing member has a step portion on the lens layer side. (26) The imaging device according to (1), wherein the reinforcing member has: a first reinforcing member provided in the outer circumferential region; and a second reinforcing member provided on a side surface connected to the outer circumferential region. (27) The imaging device according to (26), wherein the first reinforcing member and the second reinforcing member are in contact with each other. (28) The imaging device according to (26) or (27), wherein the first reinforcing member and the second reinforcing member are made of different resin materials. (29) The imaging device according to any one of (26) to (28), further comprising a lens layer including a plurality of lenses provided in the pixel region, wherein the first reinforcing member is laminated on the lens layer, and the lens layer has a groove portion or a bank portion. (30) The imaging device according to (1), further comprising: a lens layer including a plurality of lenses provided in the pixel region; the reinforcing member being bonded to the lens layer by a bonding layer; and a surface of the reinforcing member facing the lens layer being an uneven surface. (31) The imaging device according to (1), further comprising: a lens layer including a plurality of lenses provided in the pixel region; the reinforcing member being bonded to the lens layer by a bonding layer; and a surface of the lens layer facing the reinforcing member being an uneven surface. (32) The imaging device according to (1), further comprising: a plurality of the reinforcing members; and the plurality of reinforcing members being stacked via a bonding layer. (33) The imaging device according to (32), further comprising: a warpage reduction layer provided between the reinforcing member and the bonding layer. (34) The imaging device according to (1), further comprising: a reinforcing member being provided so as to avoid an outermost peripheral region included in the peripheral region. (35) The imaging device according to (34), further comprising a semiconductor substrate provided in the pixel region and the outer periphery region, wherein a side surface of the reinforcing member is located more inward than a side surface of the semiconductor substrate. (36) The imaging device according to (35), wherein the outermost periphery region includes a slit region.(37) An electronic device comprising the imaging device according to any one of (1) to (18) and (21) to (36). (38) A method for manufacturing an imaging device, which manufactures the imaging device according to any one of (1) to (18) and (21) to (36).

[0365] REFERENCE SIGNS LIST 10 Imaging device 11 Pixel array section 12 Vertical drive section 13 Column signal processing section 14 Control section 15 Signal line 16 Signal line 17 Signal line 18 Signal line 20 Semiconductor substrate 20a Side surface 30 Adhesive layer 40 Lens layer 40a Textured surface 41 On-chip lens 41A High refractive index lens 42 Lens material remaining portion 43 Groove portion 44 Bank portion 46 Slit portion 50 Bonding layer 55 Low refractive index layer 56 Light-transmitting substrate 57 Warpage reduction layer 60 Reinforcing member 60a Textured surface 60b Textured portion 60c Textured portion 60d Step portion 60e Side surface (outer peripheral surface) 61 First layer 62 Second layer 63 First reinforcing member 64 Second reinforcing member 65 Anti-reflection layer 70 Inter-wiring layer film 70A Wiring layer 70a Side surface 71 Internal electrode 80 Wiring layer 80A Semiconductor substrate 80a Side surface 81 Rewiring 82 Solder bump 90 Protective layer 95 Lens unit 96 Lens 100 Pixel 101 Photoelectric conversion section 110 Light-transmitting substrate 111 Opening 200 Laminated body 300 Imaging device 400 Distance measuring device A1 Stepped portion A2 Inclined surface A3 Curved surface A4 Sawtooth-shaped surface A5 Semiconductor chip A5a Circuit B1 Inclined surface B2 Step surface B3 Curved surface K1 Crack K2 Crack M1 First main surface M2 Second main surface R11 Pixel region R12 Peripheral region R12a Outermost region

Claims

1. An imaging device comprising: a pixel region having a plurality of pixels; a peripheral region that is a region surrounding the pixel region; and a reinforcing member provided in the peripheral region.

2. The imaging device according to claim 1, comprising: a plurality of lenses provided in the pixel region; and a remaining portion of lens material provided in the peripheral region and made of the same material as the plurality of lenses, wherein the reinforcing member is laminated onto the remaining portion of lens material.

3. The imaging device according to claim 2, wherein the remaining portion of the lens material and the plurality of lenses are made of an organic material.

4. The imaging device according to claim 1, wherein the reinforcing member is formed of glass, sapphire glass, or a laminated film of glass and sapphire glass.

5. The imaging device of claim 1, further comprising: a plurality of lenses provided in the pixel region; and a low refractive index layer provided in the pixel region and the peripheral region so as to cover the plurality of lenses, the low refractive index layer being made of a material having a refractive index lower than the refractive index of each of the plurality of lenses, wherein the reinforcing member is laminated on the low refractive index layer in the peripheral region.

6. The imaging device according to claim 5, wherein the plurality of lenses are made of an inorganic material.

7. The imaging device according to claim 1, wherein the reinforcing member has a stepped portion.

8. The imaging device according to claim 1, further comprising an anti-reflection layer provided on an inner peripheral surface of the reinforcing member to prevent reflection of light.

9. The imaging device according to claim 1, wherein the inner peripheral surface of the reinforcing member is an inclined surface, a curved surface, a stepped surface, or a surface that has a sawtooth shape in a plan view.

10. The imaging device according to claim 1, wherein the reinforcing member is a semiconductor chip.

11. The imaging device according to claim 1, wherein the reinforcing member is formed so as to surround the pixel region in a planar view, or so as to run along only two sides of the pixel region which is rectangular in a planar view, or at a corner of the outer circumferential region.

12. The imaging device of claim 1, further comprising: a plurality of lenses provided in the pixel region; and a light-transmitting substrate provided in the pixel region and the peripheral region so as to cover the plurality of lenses; the reinforcing member is laminated on the light-transmitting substrate in the peripheral region; and the hardness of the reinforcing member is greater than the hardness of the light-transmitting substrate.

13. The imaging device according to claim 1, wherein the reinforcing member has a thickness of 100 μm or more and 700 μm or less.

14. The imaging device according to claim 1, further comprising a plurality of lenses provided in the pixel region, wherein a height position of a lower end of the reinforcing member is higher than a height position of an upper end of each of the plurality of lenses.

15. The imaging device according to claim 1, wherein the reinforcing member is formed from a light absorbing material.

16. The imaging device of claim 1, wherein the reinforcing member comprises: a first reinforcing member provided in the outer circumferential region; and a second reinforcing member provided on a side surface connected to the outer circumferential region.

17. The imaging device according to claim 1, further comprising a lens layer including a plurality of lenses provided in the pixel region, the reinforcing member being bonded to the lens layer by a bonding layer, and the surface of the reinforcing member facing the lens layer being an uneven surface.

18. The imaging device according to claim 1, wherein the reinforcing member is provided so as to avoid the outermost peripheral region included in the outer peripheral region.

19. An electronic device comprising an imaging device, the imaging device having: a pixel region having a plurality of pixels; a peripheral region that is a region surrounding the pixel region; and a reinforcing member provided in the peripheral region.

20. A method for manufacturing an imaging device, comprising providing a reinforcing member in a peripheral region that is a region surrounding a pixel region having a plurality of pixels.

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