Cooking apparatus

Abstract

The present invention relates to a cooking apparatus configured such that high-frequency power is supplied to a terminal pattern through a connector capable of maintaining the minimum protruding height from the upper end surface of a coil circuit board module, thereby enabling the minimum gap between the coil circuit board module and a top plate to be maintained, and thus heating efficiency can be effectively improved.

Description

Cooking appliances

[0001] The present invention relates to a cooking appliance, and more particularly, to a cooking appliance in which high-frequency power is supplied to a terminal pattern through a connector whose protrusion height from the top surface of a coil circuit board module can be kept to a minimum, so that the gap between the coil circuit board module and the top plate can be kept to a minimum, thereby effectively improving heat generation efficiency.

[0002]

[0003] Cooking appliances are a type of home appliance used for cooking food. They are installed in kitchens and cook food according to the user's preferences. These cooking appliances can be categorized in various ways based on the heat source, form, or type of fuel used.

[0004] Cooking appliances can be categorized by their cooking method. They can be categorized into open and closed types, based on the space in which the food is placed. Closed types include ovens and microwave ovens, while open types include cooktops and hobs.

[0005] Among open cooking appliances, a cooktop may be provided with at least one burner to heat a food item contained in a cooking vessel.

[0006] These cooktops may be provided with an electric burner or with a gas burner.

[0007] Additionally, the cooktop may be implemented as a standalone unit or as an oven range that includes an oven beneath the cooktop.

[0008] An example of a cooktop with an electric burner is an induction cooker.

[0009] An induction cooking appliance is a cooking device that performs cooking functions using induction heating. In an induction cooking appliance, when high-frequency power is applied to a working coil, a magnetic field can be formed around the working coil.

[0010] Eddy currents are generated in the magnetic cooking container due to the generated magnetic field, and food can be cooked by the cooking container that is heated by acting as resistance to these eddy currents.

[0011] These induction cookers do not require gas combustion and therefore do not produce exhaust gases. Furthermore, by generating heat immediately within the container itself, induction cookers minimize heat transfer through radiation or conduction, allowing for rapid heating of food.

[0012] A conventional induction heating cooktop is configured to form individual burners by twisting a plurality of Litz wires to form a working coil and winding the working coil in a spiral shape in multiple layers.

[0013] At this time, each crater must be equipped with a coil frame to maintain and support the winding shape of the working coil.

[0014] Therefore, the vertical size of each burner, which is the sum of the vertical size of the working coil wound in a multi-layer structure and the vertical size of the coil frame, cannot help but occupy a considerably large proportion of the vertical size of the entire cooktop.

[0015] Due to the limitations in the size of the individual burners that make up a cooktop like this, conventional cooktops inevitably had limitations in increasing the output of each burner.

[0016] In addition, when constructing a cooktop with multiple burners, conventional cooktops have spatial limitations in that there is very little space for installing other components or parts, and therefore the total number of burners that can be installed on the cooktop is inevitably very limited.

[0017] As an alternative to the Litz wire-type working coil, a technology for a cooktop has been developed that forms a burner by forming the working coil in a spiral multilayer pattern on a printed circuit board. (Prior Document 001, Design and Optimization of Small Inductors on Extra-Thin PCB for Flexible Cooking Surfaces / IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, VOL. 53, NO. 1, JANUARY / FEBRUARY 2017)

[0018] The cooktop disclosed in prior art document 001 can be configured to form a burner by forming a single or multiple layer working coil pattern wound in a spiral shape on a single printed circuit board.

[0019] In this way, the cooktop disclosed in prior art document 001 has the advantage that the vertical size of the cooktop can be significantly reduced compared to a conventional cooktop since the working coil patterns forming the burner are integrally formed on a single printed circuit board, thereby improving vertical space utilization, and the number of burners can be significantly increased compared to a conventional cooktop, thereby improving horizontal space utilization.

[0020]

[0021] The cooktop disclosed in the aforementioned prior art document 001 has a working coil pattern constituting an individual burner arranged as close to the top plate as possible so that the heat generation efficiency can be maintained at its maximum.

[0022] At this time, a terminal pattern that supplies high-frequency power to the working coil pattern can be formed integrally on the printed circuit board.

[0023] Accordingly, the cooktop disclosed in prior art document 001 may have a phenomenon in which there is insufficient vertical free space for directly connecting the power cable connecting the inverter circuit board module and the terminal pattern to the terminal pattern.

[0024] In addition, since the cooktop disclosed in prior art document 001 applies high-frequency power of 20 A or more to the terminal pattern, it is impossible to apply a conventional simple insertion type board connector to the terminal pattern, and a method of directly soldering the terminal of the power cable to the terminal pattern or connecting it using a mechanical connection means such as a screw bolt must be applied.

[0025] Accordingly, the cooktop disclosed in prior art document 001 has the problem that, when the terminal of the power cable is connected to the terminal pattern by soldering, there is a high possibility that the solder portion will be damaged as it comes into contact with the lower surface of the top plate, and there is a high possibility that the contact portion will be defective as the solder portion melts due to storage of the contact portion, and when the terminal of the power cable is mechanically connected to the terminal pattern by using a screw bolt or the like, there is a very high possibility that the coil circuit board module will be damaged due to the fastening force of the screw bolt.

[0026] The present invention has been devised to solve the problems of the prior art, and the first object of the present invention is to provide a cooking appliance in which high-frequency power is supplied to a terminal pattern through a connector whose protrusion height from the top surface of the coil circuit board module can be kept to a minimum, so that the gap between the coil circuit board module and the top plate can be kept to a minimum, thereby effectively improving heat generation efficiency.

[0027] In addition, the present invention provides a cooking appliance in which a connector for supplying high-frequency power to a coil circuit board module is configured to be fixed to the coil circuit board module while at least partially penetrating the coil circuit board module, thereby ensuring a high fastening force between the coil circuit board module and the connector, and effectively preventing the contact between the connector and the terminal pattern from being separated or damaged by torque applied when the terminal of the power cable is fastened to the connector using a screw bolt, so as to provide a second object.

[0028] The objectives of the present invention are not limited to those mentioned above. Other objectives and advantages of the present invention not mentioned above can be understood through the following description and will be more clearly understood through the embodiments of the present invention. Furthermore, it will be readily apparent that the objectives and advantages of the present invention can be realized by the means and combinations thereof set forth in the claims.

[0029]

[0030] A cooking appliance according to the present invention comprises: a top plate on which a container is placed; a coil circuit board module disposed below the top plate and having a working coil portion that heats the container; and an inverter circuit board module disposed below the coil circuit board module and generating power to be supplied to the working coil portion; wherein the coil circuit board module has a terminal portion electrically connected to the working coil portion, and the working coil portion is characterized in that it receives the high-frequency power from the inverter circuit board module through the terminal portion.

[0031] In addition, the invention further includes a connector having a first connection portion electrically connected to the terminal portion and a second connection portion electrically connected to the inverter circuit board module side; wherein the connector can be fixed to the coil circuit board module.

[0032] In addition, the first connecting portion may partially protrude upward from the upper surface of the coil circuit board module, and the vertical protrusion height of the first connecting portion from the upper surface of the coil circuit board module may be lower than the vertical gap between the lower surface of the top plate and the upper surface of the coil circuit board module.

[0033] Additionally, the vertical protrusion height may be less than half of the vertical spacing.

[0034] Additionally, the terminal portion may be formed on the upper or lower surface of the coil circuit board module.

[0035] In addition, the connector further includes a substrate supporter disposed between the coil circuit board and the inverter circuit board module, and having the coil circuit board module mounted on an upper surface thereof; and the second connection portion of the connector can extend through the upper surface of the substrate supporter toward the inverter circuit board module.

[0036] Additionally, a through hole through which the second connection portion of the connector passes may be formed in the substrate supporter.

[0037] In addition, the terminal portion is arranged in a pair on the upper surface of the coil circuit board module, and the first connection portion is provided in a pair so as to be connected to each of the pair of terminal portions arranged in a pair, and the lower surface of the pair of first connection portions can be connected to each of the pair of terminal portions.

[0038] In addition, the connector further includes a pair of bridge portions, each end of which is connected to one of the pair of first connection portions and each other end of which is connected to the second connection portion; and the pair of bridge portions can extend through the coil circuit board module in the vertical direction.

[0039] Additionally, when the connector is fixed to the coil circuit board module, a restoring force that presses the pair of first connecting portions away from each other can be applied to the coil circuit board module through the pair of bridge portions.

[0040] In addition, at least one of the pair of first connecting portions may have an insertion projection formed to protrude downward toward the coil circuit board module, and the coil circuit board module may have a joining hole into which the insertion projection is inserted and joined.

[0041] In addition, the terminal portion is arranged in a pair on the lower surface of the coil circuit board module, and the first connection portion is provided in a pair so as to be connected to each of the pair of terminal portions arranged in a pair, and the upper surface of the pair of first connection portions can be connected to the pair of terminal portions.

[0042] In addition, at least one of the pair of first connecting portions may have an insertion projection formed to protrude upward toward the coil circuit board module, and the coil circuit board module may have a joining hole into which the insertion projection is inserted and joined.

[0043] In addition, the terminal portion may be arranged in a pair on the upper or lower surface of the coil circuit board module, and the first connection portion may be provided in a pair so as to be connected to each of the pair of terminal portions arranged in a separate manner, and the pair of first connection portions may each have an upper connection portion that contacts the upper surface of the coil circuit board module and a lower connection portion that contacts the lower surface of the coil circuit board module.

[0044] Additionally, the vertical gap between the upper connecting portion and the lower connecting portion may be smaller than or equal to the vertical thickness of the coil circuit board module.

[0045] In addition, the terminal portion is arranged in a pair on the upper or lower surface of the coil circuit board module, and the first connection portion is provided in a pair so as to be connected to each of the pair of terminal portions arranged in a separate manner, and the pair of first connection portions is formed to protrude upward toward the coil circuit board module and can be connected to the pair of terminal portions while being inserted from the lower surface toward the upper surface of the coil circuit board module.

[0046] Additionally, the coil circuit board module may have a coupling hole into which the pair of first connecting portions are each inserted and coupled.

[0047] Additionally, the above-mentioned joining hole may be a via hole electrically connected to each of the pair of terminal portions.

[0048] In addition, when inserted into the above-mentioned coupling hole, the upper portion of the pair of first connecting portions protrudes upward from the upper surface of the coil circuit board module, and a catch for preventing downward movement of the connector may be provided at each of the upper portions of the pair of first connecting portions.

[0049] Additionally, the coil circuit board module can be formed into a printed circuit pattern.

[0050]

[0051] The present invention has the effect of effectively improving heat generation efficiency by configuring a high-frequency power to be supplied to a terminal portion through a connector whose protrusion height from the top surface of a coil circuit board module can be kept to a minimum, thereby allowing the gap between the coil circuit board module and the top plate to be kept to a minimum.

[0052] In addition, the present invention has the effect of ensuring a high fastening force between the coil circuit board module and the connector by configuring the connector to supply high-frequency power to the coil circuit board module so that it is fixed to the coil circuit board module while at least partially penetrating the coil circuit board module.

[0053] In addition, the present invention has an effect of effectively preventing the contact between the connector and the terminal from being separated or damaged by torque applied when the terminal of the power cable is fastened to the connector using a screw bolt.

[0054] In addition to the effects described above, specific effects of the present invention are described below while explaining specific details for carrying out the invention.

[0055]

[0056] Figure 1 is a front perspective view of a cooking appliance according to one embodiment of the present invention.

[0057] Fig. 2 is a plan view of the cooking appliance illustrated in Fig. 1, showing a state in which the indicator line is lit.

[0058] Figure 3 is a perspective view of the cooking appliance illustrated in Figure 1.

[0059] Figure 4 is an exploded perspective view of the cooktop of the cooking appliance illustrated in Figure 1.

[0060] Figure 5 is a plan view of the cooktop illustrated in Figure 4, and is a view that sees through the bottom of the top plate.

[0061] FIG. 6 is a schematic cross-sectional view for explaining the layered structure of the first coil circuit board module illustrated in FIG. 4.

[0062] FIG. 7 is a plan view of the first layer constituting the layered structure of the first coil circuit board module illustrated in FIG. 4, and FIG. 8 is a partial enlarged view of FIG. 7.

[0063] FIG. 9 is a plan view of the second layer constituting the layered structure of the first coil circuit board module illustrated in FIG. 4.

[0064] Figure 10 is a partial enlarged view of Figure 7, showing patterns formed in the first to twelfth layers.

[0065] FIG. 11 is a plan view of the third to seventh layers constituting the layered structure of the first coil circuit board module illustrated in FIG. 4.

[0066] FIG. 12 is a plan view of the 8th to 12th layers constituting the layered structure of the first coil circuit board module illustrated in FIG. 4.

[0067] Fig. 13(a) is a plan view illustrating a part of the first type pattern illustrated in Fig. 11, and Fig. 13(b) is a plan view illustrating a part of the second type pattern illustrated in Fig. 12.

[0068] Figure 14(a) is a partial enlarged view of Figure 13(a), and Figure 14(b) is a partial enlarged view of Figure 13(b).

[0069] FIG. 15 is a schematic cross-sectional view for explaining a structure in which the first type pattern constituting the third to seventh layers shown in FIG. 4 and the second type pattern constituting the eighth to twelfth layers are collectively connected through working coil via holes.

[0070] Fig. 16(a) is a partial enlarged view of Fig. 13(a), and Fig. 16(b) is a partial enlarged view of Fig. 13(b), which are partial enlarged views for explaining the common terminal of the first type pattern and the common terminal of the second type pattern, respectively.

[0071] Fig. 17a is a plan view from above showing a coil circuit board module mounted on a substrate supporter, and Figs. 17b and 17c are schematic cross-sectional views for explaining the support structure of the coil circuit board module and the electrical components according to another embodiment.

[0072] Fig. 18 is a partially enlarged view of the plan view of the substrate supporter illustrated in Fig. 17a viewed from below.

[0073] Fig. 19 is a vertical cross-sectional view of the cooktop, and Fig. 20 is a partial enlarged view of Fig. 19.

[0074] Fig. 21 is a plan view showing a state in which a first coil circuit board module is placed on a substrate supporter, and Fig. 22 is a perspective view showing a state in which a high-power connector is coupled to the first coil circuit board module.

[0075] FIG. 23 is a perspective view of a high-power connector according to a first embodiment of the present invention, and FIG. 24 is a perspective view showing a state in which a high-power connector according to the first embodiment is installed on a first coil circuit board module.

[0076] FIG. 25 is a perspective view of a high-power connector according to a second embodiment of the present invention, and FIG. 26 is a perspective view showing a state in which a high-power connector according to the second embodiment is installed on a first coil circuit board module.

[0077] FIG. 27 is a perspective view of a high-power connector according to a third embodiment of the present invention, and FIG. 28 is a perspective view showing a state in which a high-power connector according to the third embodiment is installed on a first coil circuit board module.

[0078] FIG. 29 is a perspective view of a high-power connector according to a fourth embodiment of the present invention, and FIG. 30 is a perspective view showing a state in which a high-power connector according to the fourth embodiment is installed on a first coil circuit board module.

[0079] FIG. 31 is a perspective view and a partially enlarged view of a high-power connector according to a fifth embodiment of the present invention, and FIG. 32 is a perspective view showing a state in which a high-power connector according to the fifth embodiment is installed on a first coil circuit board module.

[0080]

[0081] The above-described objects, features, and advantages will be described in detail below with reference to the accompanying drawings, so that those skilled in the art can easily practice the technical idea of ​​the present invention. In describing the present invention, if it is determined that a detailed description of known technologies related to the present invention may unnecessarily obscure the gist of the present invention, a detailed description thereof will be omitted. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

[0082] Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless otherwise specified, a "first" component may also be a "second" component.

[0083] Throughout the specification, unless otherwise specifically stated, each element may be singular or plural.

[0084] Hereinafter, the phrase "any configuration is placed on (or below)" a component or "on (or below)" a component may mean that any configuration is placed in contact with the upper surface (or lower surface) of said component, and that other configurations may be interposed between said component and any configuration placed on (or below) said component.

[0085] Additionally, when it is described that a component is "connected," "coupled," or "connected" to another component, it should be understood that the components may be directly connected or connected to one another, but that other components may also be "interposed" between the components, or that each component may be "connected," "coupled," or "connected" through another component.

[0086] As used herein, singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "consisting of" or "comprising" should not necessarily be construed to include all of the components or steps described in the specification, and should be construed to mean that some of the components or steps may not be included, or that additional components or steps may be included.

[0087] Additionally, the singular expressions used herein include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "consist of" or "comprises" should not be construed to necessarily include all of the various components or various steps described in the specification, and should be construed to mean that some of the components or some of the steps may not be included, or that additional components or steps may be included.

[0088] Throughout the specification, when we refer to "A and / or B", this means A, B, or A and B, unless otherwise stated, and when we refer to "C through D", this means C or more and D or less, unless otherwise stated.

[0089] [Overall structure of the cooking appliance]

[0090] FIG. 1 is a perspective view showing a cooking appliance (1) according to one embodiment of the present invention, and FIG. 2 is a plan view of a cooktop (20) constituting the cooking appliance (1) shown in FIG. 1 as viewed from above.

[0091] Referring to FIGS. 1 and 2, a cooking appliance (1) according to one embodiment of the present invention may be configured to include a cooktop (20) and an oven section (10) disposed below the cooktop (20).

[0092] In this way, the cooking appliance (1) according to the embodiment of the present invention may be an oven range type in which a cooktop (20) is arranged on the upper side and an oven section (10) is arranged on the lower side. However, the present invention is not limited thereto, and may be configured as a cooking appliance (1) in which a cooktop (20) is provided alone. Hereinafter, a cooking appliance (1) configured as an oven range type as illustrated will be described as an example.

[0093] The cooking appliance (1) of the embodiment of the present invention can provide both the function of an oven, which is a closed cooking means, and the function of a cooktop, which is an open means, by being provided in the form of an oven range.

[0094] A cooking chamber may be formed inside an oven section (10) that serves as a sealed cooking device. In the oven section (10), food may be cooked as the interior of the cooking chamber is heated.

[0095] For this purpose, although not shown, the oven section (10) may be equipped with a heating unit that heats the interior of the cooking chamber. The heating unit may be a heating device that uses gas fuel or electricity.

[0096] The oven section (10) of the cooking appliance (1) may be provided with a rotatably-mounted door (11) that selectively opens and closes the cooking chamber.

[0097] For example, the door (11) may be provided in the oven section (10) in a form that opens and closes the cooking chamber in a pull-down manner in which the upper part rotates in the up-and-down direction with the lower part as the center.

[0098] A control panel (30) for operating the oven section (10) and cooktop (20) may be provided on the upper front surface of the cooking appliance (1).

[0099] As it is placed on the front surface of the cooking appliance (1), the control panel (30) can form a part of the front surface appearance of the cooking appliance (1).

[0100] Such a control panel (30) may be provided with multiple switches for controlling the operation of the cooking appliance (1) and a display (31) for displaying the operating status of the cooking appliance (1).

[0101] In addition, as illustrated, a plurality of knobs (32) may be further provided on the control panel (30) of the cooking appliance (1). That is, the control panel (30) provided on the upper front surface of the cooking appliance (1) may be provided with a plurality of knobs (32) for controlling the operation of the cooking appliance (1) together with a display (31).

[0102] Each knob (32) may be provided in a form that can be rotated. These knobs (32) may be provided so that either one of the oven section (10) and the cooktop (20) can be operated, or they may be provided so that both the oven section (10) and the cooktop (20) can be operated.

[0103] By operating the knob provided as described above, one of a number of preset cooking modes can be selected, or a heating temperature or heating stage can be selected.

[0104] In addition, the control panel (30) of the cooking appliance (1) according to the present embodiment may further include a knob ring (33). The knob ring (33) may be positioned radially outside the knob (32). For example, the knob ring (33) may be provided in a ring shape that surrounds the knob (32) radially outside.

[0105] The knob ring (33) can play a role in supporting the knob (32) and in finishing the outer appearance of the knob (32) to improve the outer appearance quality of the cooking appliance (1).

[0106] In addition, the knob ring (33) of this embodiment can simultaneously serve as a timer operation switch and a function of indicating the timer time and the intensity of the fire.

[0107] The knob ring (33) is installed so as to be independently rotatable relative to the knob (32), and the timer time can be set through the rotation operation of the knob ring (33) installed in this manner.

[0108] Meanwhile, as described above, a cooktop (20) may be placed on the upper side of the oven section (10).

[0109] The cooktop (20) is installed on the upper surface of the cooktop (20) and can perform the function of heating food or a container containing food.

[0110] For this purpose, the cooktop (20) may include a top plate (21) that forms the upper surface of the cooktop (20) and on which a container containing food is placed.

[0111] Additionally, a heating unit for heating a container containing food may be provided inside the cooktop (20) below the top plate (21).

[0112] The heating unit may be configured to include at least one burner. For example, the burner constituting the heating unit may be provided in the form of a working coil that converts supplied electric power into magnetic power or a heating coil that converts supplied electric power into thermal energy.

[0113] The cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may be equipped with an induction heating method.

[0114] To this end, the burner of the cooktop (20) may be configured to include a working coil. The burner including the working coil in this way can generate a strong magnetic field by being operated by a high-frequency current generated and supplied by an inverter.

[0115] In this way, the magnetic field generated from the burner including the working coil generates an eddy current in a container containing a metal component, and as the eddy current flows in the container, heat is generated, which can heat the container, and as the container is heated, food contained in the container can be heated.

[0116] However, the working coil applied to conventional induction heating cooktops was generally formed by twisting a number of electrically conductive wires to form a cable and winding the cable in a spiral shape.

[0117] However, as described later, the working coil constituting the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may be configured as a plurality of patterns formed by being spirally stacked on a printed circuit board.

[0118] As such, the working coil of the cooking device (1) according to the present invention may be referred to as a working coil pattern since it has a structure formed by laminating on a printed circuit board.

[0119] The detailed configuration of the heating unit having a working coil pattern is described below with reference to Fig. 2 and below.

[0120] [Overall composition of the cooktop]

[0121] The configuration of a cooktop (20) constituting a cooking appliance (1) according to one embodiment of the present invention will be described with reference to FIGS. 2 to 4 below.

[0122] FIG. 2 is a plan view of the cooktop (20) viewed from the upper side with the indicator line (L) lit, FIG. 3 is a perspective view of the cooktop (20) according to the present invention, FIG. 4 is an exploded perspective view of the cooktop (20) illustrated in FIG. 3, and FIG. 6 is a plan view of the inside of the cooktop (20) illustrated in FIG. 3.

[0123] First, referring to FIGS. 2 to 5, similar to the oven section (10) described above, the cooktop (20) according to the present embodiment may be equipped with a control panel (22).

[0124] As shown, the control panel (22) of the cooktop (20) is placed on the top plate (21), but may be placed in a position tilted toward the front for the convenience of the user.

[0125] This control panel (22) may be equipped with various switches for controlling the operation of the cooktop (20) and a display panel (221) for displaying the operating status of the cooktop (20).

[0126] As described below, when it is detected that a container is placed on the upper surface (21a) of the top plate (21) through the sensing coil pattern (2514), an icon corresponding to the container may be displayed on the display panel (221) of the control panel (22) provided on the cooktop (20). For example, the icon may be provided in a form corresponding to the size and shape of the container, and may be positioned on the display panel (221) corresponding to the position of the cooking appliance (1).

[0127] The user can select a container that is the target of the icon by pressing the displayed icon, and perform an operation to control the operation of the cooking appliance (1) with respect to the selected container.

[0128] For example, a user can select a container to be manipulated by pressing an icon, and then select a desired heating temperature for that container.

[0129] When heating of the container is started through the operation of the control panel (22) in this way, as shown in Fig. 2, the start of heating of the container can be indicated on the top plate (21) through the indication line (L).

[0130] As shown in Fig. 2, a plurality of display lines (L) may be provided on the top plate (21) of the cooktop (20).

[0131] The display line (L) can visually convey information related to the location of the container, the heating status of the container, temperature, etc. to the user by displaying the information in the form of a light-emitting area on the top plate (21).

[0132] FIG. 2 illustrates an embodiment in which a total of seven display lines (L) are provided. These display lines (L) may be conveniently referred to as first to seventh display lines (L1, L2, L3, L4, L5, L6, L7) from the left side based on the top plate (21). The present invention is not limited thereto, but for convenience, the following description will be based on an embodiment in which a total of seven display lines (L) are provided as illustrated.

[0133] These indicator lines (L) can be a light-emitting area formed such that the width in the left-right direction is much smaller than the width in the front-back direction, as shown.

[0134] In order for each display line (L) to be formed in the form of a light-emitting area, the display line (L) can be implemented by a light source module (23) placed on a substrate supporter (26) described below, below the top plate (21).

[0135] The light source module (23) can be configured to include a plurality of light source elements (231) that generate visible light and a light source circuit board (232) on which the plurality of light source elements (231) are mounted.

[0136] A plurality of light source elements (231) can be arranged to irradiate visible light toward the lower surface of the top plate (21), and the incident visible light can be irradiated to the lower surface of the top plate (21) by passing through a light transmitting hole formed through the substrate supporter (26), a light transmitting slit hole (H_sl) formed in each coil circuit board module constituting the heating unit (25), and a gap formed between adjacent coil circuit board modules, as described later.

[0137] The light source module (23) may be configured to include a plurality of light source elements (231) that receive power and generate visible light, and a light source circuit board (232) on which the plurality of light source elements (231) are mounted.

[0138] The light source element (231) may be applied without limitation to any means capable of receiving power and generating a predetermined amount of visible light, and may be, for example, an LED element. The present invention is not limited thereto, but the following description will be based on an embodiment in which an LED element is applied as the light source element (231).

[0139] As shown, in correspondence with each linearly extending display line (L), each light source circuit board (232) can be linearly extended along the front-back direction, and on each light source circuit board (232), a plurality of light source elements (231) can be linearly arranged and placed so as to have equal or unequal intervals along the front-back direction.

[0140] In addition, as described above, a plurality of light source modules (23) may be provided so that visible light can be independently irradiated to the first to seventh display lines (L1, L2, L3, L4, L5, L6, L7), and these plurality of light source modules (23) may be conveniently referred to as the first to seventh light source modules (23a, 23b, 23c, 23d, 23e, 23f, 23g) from the left with respect to the top plate (21).

[0141] Corresponding to the first to seventh display lines (L1, L2, L3, L4, L5, L6, L7), the first to seventh light source modules (23a, 23b, 23c, 23d, 23e, 23f, 23g) can be spaced apart from each other in the left-right direction at a predetermined interval.

[0142] As described below, the spacing between adjacent display lines (L) and the spacing between adjacent light source modules (23) can be formed to have a width equal to or slightly larger than the left-right width of the working coil pattern (2512) constituting the heating unit (25).

[0143] Meanwhile, as illustrated, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may include a bottom case (24) that forms the front side, the rear side, the front side, both sides, and the lower side of the exterior of the cooktop (20).

[0144] The bottom case (24) can be formed with the upper surface entirely open, and the top plate (21) described above can be combined to the open upper surface.

[0145] As shown in Fig. 4, a fastening bracket (211) for coupling to a bottom case (24) may be provided on the lower surface of the top plate (21) at a position corresponding to the upper end of the bottom case (24).

[0146] As the top plate (21) is connected to the upper side of the bottom case (24) in this way, the internal space surrounded by the top plate (21) and the bottom case (24) can accommodate a number of internal components that constitute the cooktop (20).

[0147] Additionally, the bottom case (24) may be provided with a plurality of mount brackets (241) integrally or separately.

[0148] The mount bracket (241) is placed in the internal space of the cooktop (20) and can be formed to protrude upward from the lower surface of the mount bracket (241) toward the electrical components.

[0149] These mount brackets (241) can support various electrical components (28) constituting the cooktop (20) from the lower side, thereby limiting the occurrence of sagging of components such as the main circuit board module (281), SMPS circuit board module (282), inverter circuit board module (283), resonant circuit board module (284), EMI filter module (285), etc., and supporting them.

[0150] In addition, as illustrated in FIG. 4, an intake hole (242) and an exhaust hole (243) can be formed in the vertical direction through which air can flow in and out for cooling various electrical components constituting the cooktop (20) on the lower surface (24a) of the bottom case (24).

[0151] Meanwhile, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may further include a heating unit (25) having a working coil unit that heats a container by induction heating, and as described above, the working coil unit may be formed by a plurality of working coil patterns (2512) that are formed by being spirally stacked on a printed circuit board.

[0152] Considering that a plurality of working coil patterns (2512) are laminated in a plurality of layered structures to form a crater, a printed circuit board formed by laminating working coil patterns (2512) can be referred to as a coil circuit board module.

[0153] In addition, as described below, a plurality of working coil patterns (2512), a plurality of sensing coil patterns (2514), a plurality of lead patterns (2513), a plurality of dummy patterns, etc., which constitute the coil circuit board module, can be formed in a manner similar to a method of manufacturing a pattern of a general printed circuit board. Therefore, taking this into consideration, the components referred to as patterns below can be referred to by various terms such as a conductive portion, a copper portion, a thin film portion, a printed portion, etc.

[0154] In addition, similar to a general printed circuit board having a multi-layer structure, the coil circuit board module of the present invention may be provided with a working coil via hole (H_v1), a sensing coil via hole (H_v2), and a temperature sensor via hole (H_v3) for electrically connecting patterns arranged on different layers to each other, and a plurality of dummy via holes that are not electrically connected to other patterns. Similar to the prior art, the via holes may be formed in a through-hole formed in the coil circuit board module through a physical or chemical deposition method or a coating method, and thus may be referred to by various terms such as a conductive coating portion or a conductive deposition portion.

[0155] Meanwhile, the coil circuit board module constituting the heating unit (25) may be provided in multiple units in consideration of manufacturing convenience and efficiency.

[0156] FIGS. 4 and 5 illustrate an embodiment of a cooktop (20) having a heating element (25) including a total of three coil circuit board modules. The present invention is not limited thereto, but will be described below based on an embodiment in which three coil circuit board modules are provided as illustrated.

[0157] The three coil circuit board modules (251, 252, 253) are referred to in order from the left as the first coil circuit board module (251), the second coil circuit board module (252), and the third coil circuit board module (253).

[0158] Each coil circuit board module (251, 252, 253) may be formed with a plurality of burners (2511) for heating the container.

[0159] FIG. 5 illustrates an embodiment in which the first coil circuit board module (251) and the third coil circuit board module (253) may each be provided with eight burners (2511), and the second coil circuit board module (252) may be provided with six burners (2511). As described below, the number of burners (2511) and the size of the burners (2511) may be set differently depending on the size and output of the cooktop (20). Hereinafter, an embodiment in which eight first coil circuit board modules (251) and the third coil circuit board module (253) are each provided with eight burners (2511), and the second coil circuit board module (252) is provided with six burners will be described as an example.

[0160] In addition, although the shape and size of each burner (2511) are shown as being the same in FIG. 5, this is merely exemplary, and similarly, the shape and size of the burner (2511) may be set differently depending on the size and output of the cooktop (20).

[0161] In each coil circuit board module (251, 252, 253), a working coil pattern (2512) forming a plurality of craters (2511) can be formed by stacking multiple layers.

[0162] Additionally, a sensing coil pattern (2514) may be laminated and formed on each coil circuit board module (251, 252, 253) as a means for detecting whether a container is seated at a specific location on the upper surface (21a) of the top plate (21).

[0163] Additionally, each coil circuit board module (251, 252, 253) may be equipped with a temperature sensor (2515) for detecting the temperature of each top plate (21).

[0164] At this time, as described later, the working coil pattern (2512), the sensing coil pattern (2514), and the temperature sensor (2515) can be provided in a form that is integrated into each coil circuit board module (251, 252, 253). Therefore, the heating unit (25) of the cooktop (20) according to the present invention can reduce the vertical size of the cooktop (20) as the vertical width of the heating unit (25) is significantly reduced compared to the conventional one, so that the space utilization can be significantly improved, and the manufacturing process of the cooktop (20) can be significantly simplified.

[0165] The working coil pattern (2512) and the sensing coil pattern (2514) may be provided in a form that extends in a spiral shape and is stacked in the vertical direction.

[0166] At this time, as described later, the first to third coil circuit board modules (251, 252, 253) may be formed in a form in which the working coil pattern (2512) is stacked in 10 to 12 layers and the sensing coil pattern (2514) is stacked in 2 layers in the vertical direction, respectively. Accordingly, each coil circuit board module (251, 252, 253) may have a layered structure having 12 to 14 layers.

[0167] In addition, since the thickness of each layer in the vertical direction is formed thinly due to the characteristics of the lamination process of the printed circuit board, each coil circuit board module (251, 252, 253) may be laminated in a number of layers exceeding 14. That is, there is no limitation on the number of layers for each coil circuit board module (251, 252, 253), although it will be determined according to specific design conditions.

[0168] When viewed in a vertical cross-section along the direction of current flow, a spiral-shaped working coil pattern (2512) must be formed by extending the copper pattern in the up-down and left-right directions. Therefore, the working coil pattern (2512) can be applied in a number of layers of four or more. That is, each coil circuit board module (251, 252, 253) can be distinguished by a number of copper pattern layers of at least four or more.

[0169] Meanwhile, each sensing coil pattern may be placed inside an area occupied by a working coil pattern (2512) forming an individual crater (2511), or may be placed in an area between an adjacent pair of working coil patterns (2512).

[0170] In this embodiment, considering the efficiency and accuracy of container detection, a pair of sensing coil patterns (2514) may be placed inside the area occupied by each working coil pattern (2512), and a pair of sensing coil patterns (2514) may be placed in the area between adjacent pairs of working coil patterns (2512), as described below.

[0171] Meanwhile, a temperature sensor (2515) for detecting the temperature of the top plate (21) can be placed at the center of each sensing coil pattern (2514).

[0172] Details regarding the working coil pattern (2512), sensing coil pattern (2514), and temperature sensor (2515) constituting the first to third coil circuit board modules (251, 252, 253) are described below with reference to FIG. 6 and below.

[0173] Meanwhile, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may further include a substrate supporter (26).

[0174] The substrate supporter (26) is installed inside the cooktop (20) and serves to support the internal components.

[0175] More specifically, as illustrated in FIG. 4, the first to third coil circuit board modules (251, 252, 253) and the ferrite core module (27) can be mounted on the upper side of the substrate supporter (26). Accordingly, the substrate supporter (26) functions as a coil base on which a conventional working coil and a ferrite core are mounted.

[0176] Additionally, as shown in FIG. 4, several electrical components (28) constituting the cooktop (20) can be installed on the lower side of the substrate supporter (26).

[0177] These electrical components (28) may include a main circuit board module (281), an SMPS circuit board (switching mode power supply, 282), an inverter circuit board module (283), a resonant circuit board module (284), an EMI filter module (285), a blower fan module (286), a light source module (23), etc.

[0178] These electric components (28) can be placed in the space formed between the lower surface (24a) of the bottom case (24) and the substrate supporter (26) as the lower side of the substrate supporter (26).

[0179] For example, to effectively accommodate these components (28), the substrate supporter (26) may have an inverted box shape configured so that the lower surface facing the bottom case (24) is entirely open.

[0180] Accordingly, the main circuit board module (281), SMPS circuit board (switching mode power supply, 282), inverter circuit board module (283), resonant circuit board module (284), EMI filter module (285), blower fan module (286), and light source module (23) can be assembled to the board supporter (26) in a manner of being stacked in a receiving space formed inside the board supporter (26).

[0181] In this way, as the first to third coil circuit board modules (251, 252, 253) are mounted on the upper surface (21a) of the board supporter (26) and the electrical component (28) is mounted on the lower surface of the board supporter (26) as the interior of the board supporter (26), the wiring structure between the electrical component (28) and the wiring structure between the electrical component (28) and the first to third coil circuit board modules (251, 252, 253) can be significantly simplified and streamlined.

[0182] In particular, in the case of the conventional cooktop (20), it had a structure that required disassembly of almost all components in the reverse order of the assembly process in order to repair the inverter circuit board, which is the main cause of failure and malfunction.

[0183] In contrast, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention is configured so that the electrical components (28) such as the inverter circuit board module (283) can be easily accessed by disassembling only the bottom case (24) while the bottom case (24) is turned over so that it faces upward, thereby having the effect of allowing easy repair or replacement of a faulty electrical component (28).

[0184] In this regard, the assembly process of the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention will be briefly described.

[0185] First, a plurality of ferrite core modules (27) can be assembled on the upper surface (261) of the substrate supporter (26).

[0186] The ferrite core module (27) according to an embodiment of the present invention may be configured by combining multiple ferrite cores into a modular structure. This is in consideration of the possibility of cracking or magnetic field loss when a ferrite core is applied that is formed as a single body and has a relatively large volume.

[0187] By modularizing multiple ferrite cores in this way to form a ferrite core module (27) and installing it on a substrate supporter (26), the number of parts can be reduced and the assembly process can be simplified.

[0188] For example, the ferrite core module (27) can be manufactured by insert injection molding. By manufacturing the ferrite core module (27) by insert injection molding, a separate jig for fixing the ferrite core unit during assembly of the cooktop (20) as in the past can be omitted.

[0189] In addition, by modularizing the ferrite core in this way to form a plurality of ferrite core modules (27), it has the advantage of being able to be repaired by simply replacing some of the ferrite cores even if they are damaged.

[0190] Meanwhile, when the arrangement of a plurality of ferrite core modules (27) on the upper surface (261) of the substrate supporter (26) is completed, the first to third coil circuit board modules (251, 252, 253) can be installed on the upper side of the ferrite core module (27).

[0191] Next, with the first to third coil circuit board modules (251, 252, 253) installed, the board supporter (26) can be flipped upside down and assembly of the electric components (28) can proceed.

[0192] As described above, several electrical components (28) can be installed and assembled on the lower surface of the substrate supporter (26). At this time, these electrical components (28) can be installed and assembled on the substrate supporter (26) in an upside-down state.

[0193] Meanwhile, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may further include an insulating material (291) disposed on the upper side of the first to third coil circuit board modules (251, 252, 253) between the first to third coil circuit board modules (251, 252, 253) and the top plate (21).

[0194] The insulation (291) is placed on the upper surface (21a) of the top plate (21) and serves to minimize the heat generated from the container heated by the working coil pattern (2512) from being transferred to the working coil pattern (2512).

[0195] To perform this insulation function, the insulation material (291) can be arranged in the form of a pad that entirely covers the first to third coil circuit board modules (251, 252, 253).

[0196] Meanwhile, in this embodiment, the insulation material (291) may be provided divided into a plurality of pads.

[0197] More specifically, each insulation material (291) can be divided into a plurality of pads so as to have a left-right width corresponding to the left-right width of the crater (2511) formed on the first to third coil circuit board modules (251, 252, 253).

[0198] In this way, by dividing the insulation material (291) into multiple pieces and arranging them, a predetermined gap can be formed between adjacent insulation materials (291), and visible light generated from the aforementioned light source module (23) passing through the predetermined gap can be irradiated to the lower surface of the top plate (21), so that the aforementioned display line (L) can be displayed on the top plate (21).

[0199] Meanwhile, the insulation material (291) can additionally perform the role of electrically insulating between the working coil pattern (2512) or sensing coil pattern (2514) formed on the first to third coil circuit board modules (251, 252, 253) and the top plate (21).

[0200] In this case, the insulation material (291) can be made of a material having both insulation performance and insulating performance.

[0201] Meanwhile, although not shown, in order to further improve the insulation performance of the insulation material (291), an insulation material may be added between the insulation material (291) and the top plate (21) on the upper side of the insulation material (291). For example, the insulation material may be a mica sheet having a thickness thinner than the vertical thickness of the insulation material (291).

[0202] [Detailed configuration of the coil circuit board module]

[0203] Hereinafter, with reference to FIGS. 6 to 15, the detailed configuration of the coil circuit board module (251, 252, 253) of the cooktop (20) constituting the cooking appliance (1) according to one embodiment of the present invention will be described.

[0204] As described above, embodiments of the present invention may be configured to include first to third coil circuit board modules (251, 252, 253).

[0205] At this time, the first to third coil circuit board modules (251, 252, 253) can be configured substantially the same except for the number of working coil patterns (2512) and the number of sensing coil patterns (2514) constituting the crater (2511).

[0206] Therefore, the following description will be based on the first coil circuit board module (251), and unless otherwise stated, the contents described below can be applied almost identically to the second coil circuit board module (252) and the third coil circuit board module (253).

[0207] First, as described above, the first coil circuit board module (251) can be formed by stacking multiple working coil patterns (2512) forming a plurality of craters (2511) in multiple layers.

[0208] As illustrated in FIG. 6, the first coil circuit board module (251) may be configured to include working coil patterns (2512) arranged in a ten-layered structure, sensing coil patterns (2514) arranged in a two-layered structure, and an insulating material disposed between each working coil pattern (2512) and each sensing coil pattern (2514) and insulating them. The insulating material may be formed by curing a prepreg composed of a thermosetting resin and glass fiber, which are generally used to form a printed circuit board. An epoxy resin series is preferable as an applicable thermosetting resin, and specifically, FR-4 can be applied.

[0209] In this way, the insulating material formed through the prepreg can be placed between each of the working coil patterns (2512) arranged in a layered structure to insulate them, and can be placed between each of the sensing coil patterns (2514) to insulate them. In addition, the insulating material can be configured to fill in areas where patterns are not formed, such as the working coil pattern (2512), the sensing coil pattern (2514), and the lead coil pattern (2513), and can serve to form a layered structure of individual layers.

[0210] Therefore, based on the working coil pattern (2512) and the sensing coil pattern (2514), the first coil circuit board module (251) can have a layered structure having a total of 12 layers from the first layer (251a) forming the uppermost side in the vertical direction to the 12th layer (251l) forming the lowermost layer.

[0211] At this time, a first sensing coil pattern (2514a) constituting a sensing coil pattern (2514) may be arranged on the first layer (251a) of the first coil circuit board module (251) having a 12-layer structure.

[0212] In addition, a lead pattern (2513) may be arranged on the first layer (251a) to electrically connect the first sensing coil pattern (2514a) to a signal processing unit (2518) described later, or to electrically connect the working coil pattern (2512) arranged on the third to twelfth layers (251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k, 251l) to a high-power terminal pattern (2516) to which high-frequency power is supplied.

[0213] Here, the lead pattern (2513) can be divided into a first lead pattern (2513a) that electrically connects the working coil pattern (2512) arranged in the third to twelfth layers (251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k, 251l) to the high-power terminal pattern (2516), and a second lead pattern (2513b) that electrically connects the first sensing coil pattern (2514a) to the signal processing unit (2518).

[0214] In addition, although not shown in FIG. 6, the first layer (251a) may further include a temperature sensor (2515) for detecting the temperature of the top plate (21), a high-power terminal pattern (2516) to which high-frequency power is supplied from an inverter circuit board module (283), a signal processing unit (2518) for processing the output signal of the sensing coil pattern (2514) and the output signal of the temperature sensor (2515), and a third lead pattern (2513c) for electrically connecting the temperature sensor (2515) and the signal processing unit (2518).

[0215] Meanwhile, a second sensing coil pattern (2514b) constituting a sensing coil pattern (2514) and a second lead pattern (2513b) electrically connecting the second sensing coil pattern (2514b) to a signal processing unit (2518) may be arranged on the second layer (251b) of the first coil circuit board module (251).

[0216] That is, in order to increase the efficiency and effectiveness of detection for the container, the sensing coil pattern (2514) may be divided and arranged into a first sensing coil pattern (2514a) arranged in the first layer (251a) and a second sensing coil pattern (2514b) arranged in the second layer (251b).

[0217] At this time, as described later, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) are configured to be connected in series through a sensing coil via hole (H_v2) extending through the first layer (251a) and the second layer (251b), so that they can function as one sensing coil pattern (2514).

[0218] Meanwhile, a second sensing coil pattern (2514b) constituting the sensing coil pattern (2514) may be arranged on the second layer (251b) of the first coil circuit board module (251).

[0219] As described below, the working coil pattern (2512) provided on the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may include a first type pattern (2512a) and a second type pattern (2512b) in which the traveling direction or winding direction of individual pattern strands (2512a-1, 2512b-1) are formed in opposite directions so that a magnetic field can be applied evenly to the container.

[0220] As illustrated in FIG. 6, a working coil pattern (2512) may be formed in the third to seventh layers (251c, 251d, 251e, 251f, 251g), for example, and a first type pattern (2512a) configured such that the progress direction or winding direction of the individual pattern strands (2512a-1) becomes the first direction may be arranged.

[0221] In addition, for example, the 8th to 12th layers (251h, 251i, 251j, 251k, 251l) may be configured to have a working coil pattern (2512) formed, and a second type pattern (2512b) configured such that the progress direction or winding direction of the individual pattern strands (2512b-1) is in the second direction.

[0222] At this time, as illustrated, the first lead pattern (2513a) formed on the first layer (251a), the first type pattern (2512a) arranged on the third to seventh layers (251c, 251d, 251e, 251f, 251g), and the second type pattern (2512b) arranged on the eighth to twelfth layers (251h, 251i, 251j, 251k, 251l) can be configured to be connected in batches through a working coil via hole (H_v1) continuously formed to penetrate from the first layer (251a) to the twelfth layer (251l).

[0223] Accordingly, among the plurality of craters described below, a plurality of first type patterns (2512a) and a plurality of second type patterns (2512b) forming a specific crater can be connected in series through a working coil via hole (H_v1).

[0224] Meanwhile, although not shown, an insulating material may be additionally formed on the upper side of the first layer (251a) and on the lower side of the 12th layer (251l).

[0225] Meanwhile, the layered structure of the first coil circuit board module (251) illustrated in FIG. 6 is merely exemplary.

[0226] That is, the layered structure may be modified so that the second sensing coil pattern (2514b) is placed on a layer other than the second layer (251b), such as the sixth layer (251f) or seventh layer (251g) which is an intermediate layer, or on the twelfth layer (251l) which is the lowest layer.

[0227] In addition, although FIG. 6 illustrates that the first type pattern (2512a) is arranged continuously from the third layer (251c) to the seventh layer (251g), and the second type pattern (2512b) is arranged continuously from the eighth layer (251h) to the twelfth layer (251l), the first type pattern (2512a) and the second type pattern (2512b) may be modified so that they are arranged alternately and repeatedly.

[0228] Such variations are considered to fall within the scope of the present invention. However, the present invention is not limited thereto, and the following description will be made based on the layered structure of the first coil circuit board module (251) as illustrated in FIG. 6.

[0229] The first coil circuit board module (251) having such a multi-layered structure can be formed by printing the shape of the working coil pattern (2512), which becomes the second type pattern (2512b), by masking it on a copper film, removing unnecessary parts through etching to form a pattern, and coating an insulating material on the formed pattern to form the 12th layer (251l), which becomes the lowest layer.

[0230] The thickness of the copper foil applied in this embodiment may be in the range of 0.13 mm to 0.15 mm, and preferably 0.14 mm.

[0231] Therefore, if no additional surface treatment is performed during the lamination process, the vertical thickness of the individual pattern formed through the copper film can be 0.13 mm to 0.15 mm.

[0232] Additionally, the thickness of the insulating material applied in this embodiment may be in the range of 0.09 mm to 0.11 mm, and preferably 0.1 mm.

[0233] After the 12th layer (251l), which is the lowest layer, is formed in this way, a multi-layered structure as shown in FIG. 6 can be formed by repeating the same process as the method of forming the 12th layer (251l) on top of it.

[0234] Therefore, when the formation of the first coil circuit board module (251) is completed with a total of 12 layers, the vertical thickness of the first coil circuit board module (251) can be in the range of 2.7 mm to 3.3 mm, and preferably 3 mm.

[0235] In this embodiment, a layered structure having a total of 12 layers is exemplified, but as mentioned above, more layers can be laminated. In this case, the thickness of the first coil circuit board module (251) can be less than 10 mm. If the thickness exceeds 10 mm, the gap between the first coil circuit board module (251) and the top plate (21) may become too narrow, and difficulties may arise in the arrangement of terminal patterns and connectors. Reflecting this, the vertical thickness of the first coil circuit board module (251) can be in the range of 2 mm to 10 mm.

[0236] A method for manufacturing a multilayer printed circuit board for forming a first coil circuit board module (251) having such a shape and structure can be applied using means already known in the art, and therefore, a description of the specific manufacturing method will be omitted below.

[0237] Figures 7 and 8 illustrate the planar structures of the first layer (251a) and the second layer (251b) of the first coil circuit board module (251) having a multilayer structure, respectively.

[0238] In this embodiment, the first coil circuit board module (251) may be configured to have a rectangular shape in which the width in the front-back direction is greater than the width in the left-right direction based on the state in which it is placed on the cooktop (20).

[0239] In response to this, the first layer (251a), which is the uppermost layer, and the second layer (251b), which is the next upper layer, can be configured to have a rectangular shape in which the width in the front-back direction is greater than the width in the left-right direction.

[0240] As described above, in the first layer (251a), a first sensing coil pattern (2514a) forming the first layer among the sensing coil patterns (2514) arranged in two layers may be arranged, and in the second layer (251b), a second sensing coil pattern (2514b) forming the second layer among the sensing coil patterns (2514) arranged in two layers may be arranged.

[0241] At this time, as shown, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be wound in a different shape from the working coil pattern (2512).

[0242] That is, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be wound in a circular spiral shape. For example, the number of turns of the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be set to be 18, and the outer diameter can have a range of 32 mm to 34 mm, preferably a range of 33 mm. In addition, the width of the individual pattern strands constituting the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be a range of 0.27 mm to 0.33 mm, preferably 0.3 mm.

[0243] As described below, the working coil pattern (2512) is wound in a square spiral shape.

[0244] Additionally, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) are arranged so that a region partially overlaps with the working coil pattern (2512) in the vertical direction.

[0245] Therefore, due to such overlapping areas, there is a possibility that malfunction or detection error of the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may occur.

[0246] In this way, by winding the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) in a circular spiral shape, interference with the working coil pattern (2512) wound in a square spiral shape can be minimized, and the possibility of malfunction and detection errors of the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be minimized.

[0247] Meanwhile, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may be wound so that a starting point is not formed at the center of the circular spiral. That is, a first central internal region may be formed at the center of the circular spiral shape, where the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) are not formed.

[0248] A temperature sensor (2515) may be mounted in the central inner region of the first sensing coil pattern (2514a), as described later. In order to distinguish it from the central inner region formed on the inner side of the working coil pattern (2512) described later, the central inner region of the first sensing coil pattern (2514a) is hereinafter referred to as a first central inner region.

[0249] The specific configuration regarding placement of the temperature sensor (2515) is described later with reference to FIG. 9.

[0250] In this embodiment, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may be provided in multiple numbers.

[0251] More specifically, the plurality of first sensing coil patterns (2514a) and the plurality of second sensing coil patterns (2514b) may include patterns that are arranged entirely within a specific crater and patterns that are arranged across a pair of adjacent craters (2511).

[0252] For example, in an embodiment as illustrated in FIG. 7, when the first coil circuit board module (251) has a total of eight craters (2511), a total of 28 first sensing coil patterns (2514a) and a total of 28 second sensing coil patterns (2514b) may be provided.

[0253] However, this is merely an example, and the number of first sensing coil patterns (2514a) may be adjusted and provided differently depending on the size of the individual crater (2511) and the size of the first coil circuit board module (251). The present invention is not limited thereto, but the following description will be made based on an embodiment in which 28 first sensing coil patterns (2514a) and second sensing coil patterns (2514b) are provided on the first coil circuit board module (251).

[0254] The first sensing coil patterns (2514a) arranged at different locations can be configured to have substantially the same number of turns, and similarly, the second sensing coil patterns (2514b) arranged at different locations can be configured to have the same number of turns.

[0255] A sensing coil via hole (H_v2) may be formed at a starting point or an ending point of a first sensing coil pattern (2514a), and the sensing coil via hole (H_v2) may be connected to an ending point or a starting point of a second sensing coil pattern (2514b). Through this, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may be connected in series to form one sensing coil pattern (2514).

[0256] A starting point or an ending point that is not connected to a sensing coil via hole (H_v2) can be electrically connected to a signal processing unit (2518) provided in the first layer (251a) through a second lead pattern (2513b) formed in the first layer (251a) or the second layer (251b), as illustrated in FIGS. 7 and 8.

[0257] Meanwhile, a temperature sensor (2515) to be described later may be electrically connected to the signal processing unit (2518) via a third lead pattern (2513c). As illustrated in Fig. 8, the third lead pattern (2513c) may be formed on the second layer (251b).

[0258] In the case where a total of 28 sensing coil patterns (2514) are provided as in the embodiment illustrated in FIG. 7, a total of four signal processing units (2518) may be provided, and a pair of signal processing units (2518) may be formed adjacent to each other at the center of the rear edge of the first layer (251a), and another pair of signal processing units (2518) may be arranged adjacent to each other at the center of the front edge of the first layer (251a).

[0259] For example, based on the embodiment illustrated in FIG. 7, among a pair of signal processing units (2518) arranged at the leading edge of the first layer (251a), a left signal processing unit (2518) may be assigned a group of six sensing coil patterns (2514) arranged on the left side among a plurality of sensing coil patterns (2514) that are divided left and right and arranged toward the rear from the leading edge of the first layer (251a), and a temperature sensor (2515) arranged on each of them, and a right signal processing unit (2518) may be assigned a group of six sensing coil patterns (2514) arranged on the right side among a plurality of sensing coil patterns (2514) that are arranged toward the rear from the leading edge of the first layer (251a), and a temperature sensor (2515) arranged on each of them.

[0260] In the same manner, a group of sensing coil patterns (2514) and a temperature sensor (2515) can be assigned to a pair of signal processing units (2518) positioned at the rear edge of the first layer (251a).

[0261] In this way, by arranging the two pairs of signal processing units (2518) at positions that are maximally spaced apart along the front-back direction, the structure of the second lead pattern (2513b) that connects the individual sensing coil pattern (2514) to the signal processing unit (2518) and the third lead pattern (2513c) that connects the individual temperature sensor (2515) to the signal processing unit (2518) can be simplified, and their lengths can be minimized.

[0262] In addition, adjacent to each signal processing unit (2518), a low-power terminal (not shown) for signal transmission and reception for transmitting an electrical signal output to the signal processing unit (2518) to the aforementioned main circuit board module (281) and a low-power connector (2518g) mounted on the low-power terminal may be mounted together at the front edge and the rear edge of the first layer (251a).

[0263] Meanwhile, a first lead pattern (2513a) for transmitting high-frequency power to each of the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) may be formed in the first layer (251a), as described later.

[0264] As illustrated, each first lead pattern (2513a) can be configured to be divided into multiple pattern strands.

[0265] Accordingly, the first lead pattern (2513a) is formed by dividing into multiple pattern strands, so that power loss that may occur due to the skin effect when high-frequency power is applied can be minimized.

[0266] Meanwhile, considering the efficiency of power supply, a plurality of pattern strands may be concentrated at one end and the other end of the first lead pattern (2513a) to form a common lead terminal (2513a1).

[0267] A common lead terminal (2513a1) formed at one end of the first lead pattern (2513a) can be connected to a high-power terminal pattern (2516) formed at the front edge and the rear edge of the first layer (251a), respectively.

[0268] Meanwhile, the first lead pattern (2513a) may be arranged inside the first layer (251a) from one end and may extend toward a common lead terminal (2513a1) formed at the other end.

[0269] Meanwhile, in this embodiment, a pair of working coil patterns (2512) arranged adjacent to each other can be configured to supply high-frequency power through three high-power terminal patterns (2516) and three first lead patterns (2513a).

[0270] That is, if high-frequency power is supplied to each working coil pattern (2512) through a pair of high-power terminal patterns (2516) and a pair of first lead patterns (2513a), two pairs of high-power terminal patterns (2516) and two pairs of first lead patterns (2513a) must be allocated to one pair of working coil patterns (2512).

[0271] The present invention is configured so that high-frequency power is supplied to a pair of working coil patterns (2512) through three high-power terminal patterns (2516) and three first lead patterns (2513a) arranged adjacent to each other, so that the number of high-power terminal patterns (2516) and the number of first lead patterns (2513a) are minimized, and thus the circuit configuration can be simplified.

[0272] This will be explained in more detail with reference to Figure 8.

[0273] FIG. 8 is a partial enlarged view of FIG. 7, showing the detailed configuration of a high-power terminal pattern (2516) and a first lead pattern (2513a) for supplying power to a pair of working coil patterns (2512) arranged adjacent to the left rear side based on the state illustrated in FIG. 7.

[0274] Based on the illustrated state, the leftmost high-power terminal pattern (2516) is referred to as the first high-power terminal pattern (2516a), the middle high-power terminal pattern (2516) is referred to as the second high-power terminal pattern (2516b), and the rightmost high-power terminal pattern (2516) is referred to as the third high-power terminal pattern (2516c).

[0275] In addition, the first lead pattern (2513a) connected to the first high-power terminal pattern (2516a) is referred to as the 1-1 lead pattern (2513a-1), the first lead pattern (2513a) connected to the second high-power terminal pattern (2516b) is referred to as the 1-2 lead pattern (2513a-2), and the first lead pattern (2513a) connected to the third high-power terminal pattern (2516c) is referred to as the 1-3 lead pattern (2513a-3).

[0276] As illustrated, the first high-power terminal pattern (2516a) can be electrically connected to the external common terminal of the working coil pattern (2512) positioned further rearward among the pair of working coil patterns (2512) through the first-1 lead pattern (2513a-1).

[0277] Hereinafter, the external common terminal of the working coil pattern (2512) is referred to as the second common terminal (2512a-3, 2512b-3), and the internal common terminal of the working coil pattern (2512) is referred to as the first common terminal (2512a-2, 2512b-2).

[0278] As described below, the first common terminals (2512a-2, 2512b-2) include a first common terminal (2512a-2) of a first type pattern (2512a) and a first common terminal (2512b-2) of a second type pattern (2512b), and the first common terminal (2512a-2) of the first type pattern (2512a) and the first common terminal (2512b-2) of the second type pattern (2512b) may be connected in series through a working coil via hole (H_v1). As described below, the first common terminal (2512a-2) of the first type pattern (2512a) and the first common terminal (2512b-2) of the second type pattern (2512b) may be formed at positions where they vertically overlap each other.

[0279] Likewise, the second common terminals (2512a-3, 2512b-3) include the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b), and the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b) can be connected in series through the working coil via hole (H_v1). As described below, the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b) can be formed at positions where they vertically overlap each other.

[0280] At this time, the common lead terminal (2513a1) formed at the other end of the 1-1 lead pattern (2513a-1) can be formed at a position that vertically overlaps with the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) arranged at the rear, and can be connected in series with the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) through the working coil via hole (H_v1).

[0281] Meanwhile, as illustrated, the second high-power terminal pattern (2516b) can be electrically connected to the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) positioned further forward among a pair of working coil patterns (2512) through the first-second lead pattern (2513a-2).

[0282] At this time, the common lead terminal (2513a1) formed at the other end of the first-second lead pattern (2513a-2) can be formed at a position that vertically overlaps the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) arranged in the front, and can be connected in series with the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) through the working coil via hole (H_v1).

[0283] Additionally, the third high-power terminal pattern (2516c) can be electrically connected to the first common terminals (2512a-2, 2512b-2) of a pair of working coil patterns (2512) simultaneously through the first-third lead pattern (2513a-3).

[0284] That is, as illustrated, the 1-3 lead pattern (2513a-3) has a common lead terminal (2513a1) formed at the other end, and a common lead terminal (2513a1) may be additionally provided at an intermediate position between one end and the other end.

[0285] A common lead terminal (2513a1) formed at the other end of the 1-3 lead pattern (2513a-3) can be electrically connected to the first common terminal (2512a-2, 2512b-2) of the working coil pattern (2512) positioned at the front among a pair of working coil patterns (2512) through a working coil via hole (H_v1).

[0286] In addition, the common lead terminal (2513a1) formed at the middle position of the 1-3 lead pattern (2513a-3) can be electrically connected to the first common terminal (2512a-2, 2512b-2) of the working coil pattern (2512) positioned at the rear among a pair of working coil patterns (2512) through a working coil via hole (H_v1).

[0287] That is, the 1-3 lead pattern (2513a-3) can be configured to act as a common lead pattern capable of simultaneously supplying power to a pair of working coil patterns (2512).

[0288] Accordingly, when only the rear working coil pattern (2512) is driven, power is supplied to the first high-power terminal pattern (2516a) and the third high-power terminal pattern (2516c) and power to the second high-power terminal pattern (2516b) is blocked, and when only the front working coil pattern (2512) is driven, power is supplied to the second high-power terminal pattern (2516b) and the third high-power terminal pattern (2516c) and power to the first high-power terminal pattern (2516a) is blocked, and when a pair of working coil patterns (2512) are driven simultaneously, power is supplied to all of the first to third high-power terminal patterns (2516c). The driving of a pair of working coil patterns (2512) can be controlled.

[0289] Meanwhile, based on the state illustrated in FIGS. 7 and 8, a plurality of edge notches (2517) may be formed at the front edge and rear edge of the first layer (251a).

[0290] The edge notch (2517) serves to provide a mating space into which a high-power connector (254) that supplies high-frequency power to the high-power terminal pattern (2516) can be fitted.

[0291] As illustrated, the individual high-power terminal patterns (2516) can be arranged in a split form with the edge notches (2517) interposed therebetween so that the connector can be connected to the high-power terminal patterns (2516) while being fitted into the edge notches (2517).

[0292] In this way, the edge notch (2517) serves to provide a space into which a connector, which will be described later, can be coupled. Therefore, the edge notch (2517) may be referred to as a connector connection portion, edge portion, cut portion, opening portion, etc., considering its function and shape.

[0293] To reduce manufacturing costs through component commonality, connectors having the same shape and structure can be coupled to each edge notch (2517). To this end, each edge notch (2517) can be formed to have the same shape and size.

[0294] Meanwhile, as illustrated in FIG. 9, the edge notch (2517) may be formed entirely from the first layer (251a) of the first coil circuit board module (251) through the second layer (251b) to the twelfth layer (251l). Detailed configurations regarding the connector and the edge notch (2517) will be described later with reference to FIG. 17a and below.

[0295] Additionally, a screw hole (H_sc) may be formed through the first coil circuit board module (251). The screw hole (H_sc) may be formed through the first layer (251a) to the twelfth layer (251l) in the same manner as the edge notch (2517).

[0296] A fastening means such as a screw bolt not shown can be connected to the aforementioned substrate supporter (26) through the screw hole (H_sc), and through this, the first coil circuit board module (251) can be firmly connected to the aforementioned substrate supporter (26).

[0297] For example, the screw holes (H_sc) can be placed on the four corner sides so as not to cause interference with the patterns constituting the first coil circuit board module (251).

[0298] Additionally, a ground terminal for grounding the first coil circuit board module (251) can be formed in the first layer (251a) around the screw hole (H_sc).

[0299] Meanwhile, the first coil circuit board module (251) may be provided with a light-transmitting slit hole (H_sl) formed penetrating from the first layer (251a) to the twelfth layer (251l).

[0300] The aforementioned light source module (23) can be placed below the light projection slit hole (H_sl), and visible light generated from the light source module (23) can pass through the light projection slit hole (H_sl) and be irradiated to the lower surface of the top plate (21). Through this, a linearly extending display line (L) can be formed on the top plate (21).

[0301] In order to implement a linearly extended display line (L), the light-transmitting slit hole (H_sl) can be linearly extended corresponding to the shape of the display line (L).

[0302] However, as shown in Fig. 7, in order to prevent the rigidity of the first coil circuit board module (251) from rapidly decreasing, the light transmitting slit hole (H_sl) may be formed by being divided into multiple pieces, and the divided light transmitting slit holes (H_sl) may be arranged linearly.

[0303] Additionally, a connecting portion may be provided between the divided light-transmitting slit holes (H_sl) to connect them.

[0304] The light-transmitting slit hole (H_sl) can be formed through a process of punching the relevant part after the lamination process of the circuit board module is completed.

[0305] Alternatively, for the projection of visible light generated from the light source module (23), the two coil circuit board modules may be spaced apart so that a predetermined gap is formed between the two completely separated coil circuit board modules. Through this, a separate punching fixing or slit hole process for the first coil circuit board module (251) can be omitted.

[0306] Hereinafter, with reference to FIG. 10, the relative arrangement position of the sensing coil pattern (2514) and the arrangement and arrangement structure of the temperature sensor (2515) will be described.

[0307] Fig. 10 is a partially enlarged view of a plan view of the first coil circuit board module (251) as viewed from above, in which the sensing coil pattern (2514) and the working coil pattern (2512) are illustrated together for the purpose of explaining and understanding their relative positions. However, in the present embodiment, the sensing coil pattern (2514) and the working coil pattern (2512) are actually arranged on different layers, so the sensing coil pattern (2514) and the working coil pattern (2512) cannot be observed together.

[0308] As described above, the individual sensing coil patterns (2514) wound in a circular spiral shape can be arranged so that a region partially overlaps with the working coil patterns (2512) wound in a square spiral shape in the vertical direction.

[0309] At this time, some of the plurality of sensing coil patterns (2514) may be entirely arranged within a single crater (2511) formed through the working coil pattern (2512), and other some of the plurality of sensing coil patterns (2514) may be arranged across an adjacent pair of craters (2511).

[0310] FIG. 10(a) illustrates a state in which a sensing coil pattern (2514) is arranged entirely within a working coil pattern (2512), and FIG. 10(b) illustrates a state in which a sensing coil pattern (2514) is arranged between a pair of adjacent working coil patterns (2512).

[0311] First, as described later, a working coil pattern (2512) formed by stacking a plurality of first type patterns (2512a) and a plurality of second type patterns (2512b) can be wound multiple times to have a square spiral shape.

[0312] For example, the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) can be wound a total of 9 times. That is, they can be wound to have a total of 9 turns. Here, each turn of the first type pattern (2512a) and the second type pattern (2512b) can be defined as meaning a state in which they are wound helically by 1 turn. That is, the number of turns can mean a state in which the first type pattern (2512a) and the second type pattern (2512b) are wound helically by 9 turns and the number of turns.

[0313] Additionally, for example, six to five pattern strands (2512a-1, 2512b-1) can be tied together to form one turn.

[0314] At this time, as shown, the interval between each turn forming the first type pattern (2512a) and the second type pattern (2512b) is maintained approximately constant, but the horizontal interval between the third turn and the fourth turn can be formed to be much larger.

[0315] Internal clearance (D1) can be formed through the horizontal gap formed relatively larger in this way.

[0316] In addition, as shown in Fig. 10(b), an external clearance (D2) that is a front-back distance similar to the internal clearance (D1) can be formed between a pair of working coil patterns (2512) that are arranged adjacently along the front-back direction based on the state in which the first coil circuit board module (251) is arranged.

[0317] The internal clearance (D1) and the external clearance (D2) can be formed to have the same size, and for example, the internal clearance (D1) and the external clearance (D2) can have a range of 3.8 mm to 4.2 mm, and preferably, 4 mm.

[0318] As illustrated, the sensing coil pattern (2514) can be arranged so that the center point is located at the inner clearance (D1) and the outer clearance (D2).

[0319] Preferably, when the center point of the sensing coil pattern (2514) is located at the internal clearance (D1) as in Fig. 10(a), the center point of the sensing coil pattern (2514) may roughly coincide with the middle position between the third turn and the fourth turn.

[0320] In addition, preferably, when the center point of the sensing coil pattern (2514) is located at the external clearance (D2) as in FIG. 10(b), the center point of the sensing coil pattern (2514) may roughly coincide with the middle position between a pair of adjacently arranged working coil patterns (2512).

[0321] In addition, as described above, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) each have an area in which no pattern is formed inside, through which a first central inner area (2514c) can be formed on the inner side of the sensing coil pattern (2514).

[0322] As illustrated, the first central inner region (2514c) of the sensing coil pattern (2514) may have a disk shape, and the diameter of the inner region of the disk shape may be formed to be equal to or slightly smaller than the size of the inner clearance (D1) and the outer clearance (D2).

[0323] In this way, the internal clearance (D1) and external clearance (D2) of the working coil pattern (2512) and the first central internal region (2514c) of the sensing coil pattern (2514) can provide a space in which a temperature sensor (2515) can be mounted.

[0324] As illustrated, a temperature sensor (2515) for detecting the temperature of the top plate (21) may be mounted on the first layer (251a) as the first central inner region (2514c) of each sensing coil pattern (2514). At this time, the size of the internal clearance (D1) and the external clearance (D2) and the diameter of the sensing coil pattern (2514) may be formed to be larger than the size of the temperature sensor (2515), i.e., the longitudinal width.

[0325] Through this, when viewed from the top plate (21), individual temperature sensors (2515) can be placed in the first layer (251a) so as to belong to the first central inner region (2514c) as a position surrounded by each sensing coil pattern (2514).

[0326] Additionally, in order to prevent interference with the sensing coil pattern (2514), the temperature sensor (2515) may be positioned at a location where vertical overlap with the sensing coil pattern (2514) does not occur, as shown inside the first central inner region (2514c).

[0327] Meanwhile, as an example, a temperature sensor (2515) may be a SMD (Surface Mounted Devices) type sensor in the form of a chip that is relatively small, easy to mount on the first layer (251a), and has excellent detection capability.

[0328] The SMD type temperature sensor (2515) may be configured, for example, with a sensor body, a thermistor disposed on the sensor body, and a pair of electrodes exposed on the upper surface of the first coil circuit board module (251).

[0329] This temperature sensor (2515) can be mounted on the top surface of the first coil circuit board module (251). That is, the temperature sensor (2515) can be attached and fixed to the top surface of the first coil circuit board module (251).

[0330] More specifically, the first coil circuit board module (251) may be provided with a pair of conductive sensor pads (not shown) for attachment of a temperature sensor (2515), and a pair of electrodes of the temperature sensor (2515) may be attached to each of the pair of sensor pads.

[0331] At this time, a pair of electrodes of the temperature sensor (2515) can be electrically connected and attached to a corresponding pair of pads, respectively, through various physical and chemical methods such as welding, soldering, and adhesive.

[0332] However, in the case where the SMD type temperature sensor (2515) is attached and mounted on the upper surface of the first coil circuit board module (251), there is a very high possibility that it will be affected by heat generated from the working coil pattern (2512).

[0333] In order to minimize the influence of heat generation from such a working coil pattern (2512), it is necessary to place it as far away as possible from the working coil pattern (2512) in the horizontal direction.

[0334] As locations where the influence of such heat generation can be minimized, an area where the first central inner region (2514c) of the sensing coil pattern (2514) and the internal clearance (D1) overlap, and an area where the first central inner region (2514c) of the sensing coil pattern (2514) and the external clearance (D2) overlap can be selected.

[0335] Although FIG. 10 illustrates that the temperature sensor (2515) is positioned at a position where the center point of the temperature sensor (2515) and the center point of the first central inner region (2514c) of the sensing coil pattern (2514) roughly coincide, this is merely exemplary, and the influence of heat generation of the working coil pattern (2512) can be minimized simply by positioning the temperature sensor (2515) at any position in the region where the first central inner region (2514c) of the sensing coil pattern (2514) and the internal clearance (D1) overlap, and in the region where the first central inner region (2514c) of the sensing coil pattern (2514) and the external clearance (D2) overlap.

[0336] In addition, by configuring the temperature sensor (2515) to be placed in an area where the first central inner region (2514c) of the sensing coil pattern (2514) overlaps with the internal clearance (D1), and an area where the first central inner region (2514c) of the sensing coil pattern (2514) overlaps with the external clearance (D2), a space for installing a third lead pattern (2513c) that electrically connects the temperature sensor (2515) and the signal processing unit (2518), and a temperature sensor via hole (H_v3) through which the temperature sensor (2515) and the third lead pattern (2513c) are connected can be effectively secured.

[0337] At this time, as described above, the SMD type temperature sensor (2515) may be formed with a first electrode and a second electrode, each of which constitutes a pair of electrodes at both ends in the longitudinal direction, and the first layer (251a) may be provided with a pair of sensor pads that are soldered to each of the first electrode and the second electrode.

[0338] As illustrated, in the present embodiment, the direction in which the first electrode and the second electrode provided at both ends of the temperature sensor (2515) are arranged to be spaced apart from each other may be arranged in a direction parallel to the direction in which the working coil pattern (2512) is arranged adjacent to the temperature sensor (2515) or may be arranged in a direction intersecting the direction in which the working coil pattern (2512) is arranged.

[0339] That is, when the temperature sensor (2515) is arranged in the region of the first gap (D1) as illustrated in FIG. 10(a), the individual pattern strands (2512a-1, 2512b-1) of the working coil pattern (2512) arranged adjacent to both sides of the temperature sensor (2515) proceed along the forward-backward direction. Accordingly, the direction in which the first electrode and the second electrode of the temperature sensor (2515) arranged in the region of the first gap (D1) are arranged to be spaced apart from each other may be the forward-backward direction or the left-right direction intersecting the forward-backward direction.

[0340] In addition, when the temperature sensor (2515) is arranged in the region of the second clearance (D2) as illustrated in FIG. 10(b), the individual pattern strands (2512a-1, 2512b-1) of the working coil pattern (2512) arranged adjacent to both sides of the temperature sensor (2515) proceed along the left-right direction. Accordingly, the direction in which the first electrode and the second electrode of the temperature sensor (2515) arranged in the region of the second clearance (D2) are arranged to be spaced apart from each other may be the left-right direction or the front-back direction intersecting the left-right direction.

[0341] At this time, a pair of sensor pads corresponding to the first electrode and the second electrode of the temperature sensor (2515) arranged in the area of ​​the first gap (D1), and the first electrode and the second electrode of the temperature sensor (2515) arranged in the area of ​​the second gap (D2) can be arranged with the same direction as these.

[0342] Through this, the third lead pattern (2513c) for transmitting an electrical signal generated from the temperature sensor (2515) to the signal processing unit (2518) can be extended toward the signal processing unit (2518) without interference with the working coil pattern (2512) or with interference with the working coil pattern (2512) being minimized.

[0343] More specifically, the portion where the third lead pattern (2513c) overlaps with the sensing coil pattern (2514) and extends across the sensing coil pattern (2514) may be provided in any one of the third to seventh layers (251c, 251d, 251e, 251f, 251g) on ​​which the first type pattern (2512a) is formed, or may be provided in any one of the eighth to twelfth layers (251h, 251i, 251j, 251k, 251l) on which the second type pattern (2512b) is formed.

[0344] By way of example, in the present embodiment, as illustrated in FIG. 13, a third lead pattern (2513c) may be provided in any one of the 8th to 12th layers (251h, 251i, 251j, 251k, 251l) on which a second type pattern (2512b) is formed, and the third lead pattern (2513c) formed in any one of the 8th to 12th layers (251h, 251i, 251j, 251k, 251l) may extend parallel to the pattern strand (2512b-1) of the second type pattern (2512b) within the first gap (D1) and the second gap (D2).

[0345] Through this, the third lead pattern (2513c) can be extended while effectively avoiding the working coil pattern (2512).

[0346] The remaining portion of the third lead pattern (2513c) can be formed on the first layer (251a) or the second layer (251b) that does not cause interference with the working coil pattern (2512), as shown in FIGS. 9 and 10.

[0347] Hereinafter, the detailed configuration of the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) will be described with reference to FIGS. 11 to 16.

[0348] Figure 11 illustrates the planar structure of the third layer (251c) of the first coil circuit board module (251) having a multi-layer structure.

[0349] The configuration of the third layer (251c) of the first coil circuit board module (251) described below can be applied equally to the fourth to seventh layers (251d, 251e, 251f, 251g) unless otherwise described.

[0350] Referring to FIG. 11, a first type pattern (2512a) of a working coil pattern (2512) consisting of a total of eight pieces can be arranged on a third layer (251c) of a first coil circuit board module (251) so as to form a total of eight craters (2511).

[0351] As illustrated, one first type pattern (2512a) can be assigned to one crater (2511), and the size of each first type pattern (2512a) can be formed to be the same so that the size of each crater (2511) can be formed to be the same.

[0352] At this time, for example, eight craters (2511) can be arranged in a grid shape, and accordingly, the first type pattern (2512a) can be arranged in a grid shape.

[0353] Accordingly, as the first type pattern (2512a) is arranged in a grid shape like this, a heating area can be evenly formed inside the third layer (251c) by being configured to be wound in a square spiral shape.

[0354] Meanwhile, in a case where a plurality of first type patterns (2512a) are arranged in a grid shape, the second type patterns (2512b) can be arranged symmetrically.

[0355] That is, a plurality of first type patterns (2512a) can be arranged in a left-right symmetrical shape centered on the light-transmitting slit hole (H_sl), which becomes the left-right center line of the third layer (251c).

[0356] In addition, a plurality of first type patterns (2512a) may be arranged to have a front-back symmetry shape centered on the front-back center line of the third layer (251c). In the illustrated embodiment, the front-back center line of the third layer (251c) may be defined as an imaginary horizontal line that divides a total of eight craters (2511) into four craters (2511) in the front and four craters (2511) in the rear along the front-back direction.

[0357] By arranging a plurality of first type patterns (2512a) in a symmetrical manner, the length of the first lead pattern (2513a) for supplying high-frequency power to the individual third layer (251c) can be minimized, and the structure of the first lead pattern (2513a) can be simplified.

[0358] Figure 12 illustrates the planar structure of the eighth layer (251h) of the first coil circuit board module (251) having a multi-layer structure.

[0359] The configuration of the 8th layer (251h) of the first coil circuit board module (251) described below can be equally applied to the 9th to 12th layers (251i, 251j, 251k, 251l) unless otherwise described.

[0360] As illustrated in FIG. 12, a second type pattern (2512b) of a working coil pattern (2512) consisting of a total of eight pieces can be arranged on the eighth layer (251h) of the first coil circuit board module (251) so as to form a total of eight craters (2511).

[0361] As illustrated, one second type pattern (2512b) can be assigned to one crater (2511), and the size of each second type pattern (2512b) can be formed to be the same so that the size of each crater (2511) can be formed to be the same.

[0362] At this time, the second type pattern (2512b) can be arranged in a grid shape, similar to the first type pattern (2512a).

[0363] In addition, similarly to the first type pattern (2512a) described above, a plurality of second type patterns (2512b) may be arranged to have a left-right symmetrical shape centered on the light-transmitting slit hole (H_sl), and a plurality of second type patterns (2512b) may be arranged to have a front-back symmetrical shape centered on the front-back center line of the third layer (251c).

[0364] Figure 13 illustrates a first type pattern (2512a) and a second type pattern forming one identical crater (2511).

[0365] The first type pattern (2512a) and the second type pattern (2512b) illustrated in FIG. 13 can be arranged in a layered structure along the vertical direction as described above so as to form the same crater (2511).

[0366] As illustrated in FIG. 13, the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) can be wound to have a square spiral shape from the first common terminal (2512a-2, 2512b-2) formed on the inside to the second common terminal (2512a-3, 2512b-3) formed on the outside as described above.

[0367] For example, it can be wound with a total of 9 turns from the first common terminal (2512a-2, 2512b-2) to the second common terminal (2512a-3, 2512b-3). That is, it can be wound with a total of 9 turns.

[0368] As illustrated, the first common terminals (2512a-2, 2512b-2) may be formed at positions eccentric outward from the center of the crater (2511). That is, an area in which the first type pattern (2512a) and the second type pattern (2512b) are not formed may be formed in the center of the crater (2511). This is to prevent overheating that may occur due to heat generated by individual pattern strands (2512a-1, 2512b-1) being concentrated in the center of the crater (2511). Although not illustrated, a means for preventing overheating on the center side of the crater (2511) may be additionally provided in the form of a via hole on the center side of the crater (2511).

[0369] Additionally, as described above, the spacing between each turn forming the first type pattern (2512a) and the second type pattern (2512b) is maintained approximately constant, but an internal clearance (D1) for placement of a temperature sensor (2515) may be formed between the third turn and the fourth turn.

[0370] Meanwhile, for example, the first type pattern (2512a) may be formed by binding six pattern strands (2512a-1) to form one turn, and the second type pattern (2512b) may be formed by binding five pattern strands (2512b-1) to form one turn.

[0371] The widths of the individual pattern strands (2512a-1, 2512b-1) constituting the first type pattern (2512a) and the second type pattern (2512b) can be formed identically in a range of 0.27 mm to 0.33 mm, preferably 0.3 mm.

[0372] However, although the first type pattern (2512a) has six individual pattern strands (2512a-1) that constitute one turn, the ninth turn from the first turn does not proceed with only six individual pattern strands (2512a-1).

[0373] Likewise, the second type pattern (2512b) has five individual pattern strands (2512b-1) that constitute one turn, but the ninth turn does not proceed from the first turn with only five individual pattern strands (2512b-1).

[0374] That is, the first type pattern (2512a) can be arranged by dividing a plurality of pattern strands (2512a-1) in such a way that when one turn is completed while progressing from the first turn to the ninth turn, one of the six individual pattern strands (2512a-1) is stopped and a new individual pattern strand (2512a-1) is newly progressed.

[0375] Similarly, the second type pattern (2512b) can be arranged by dividing multiple pattern strands (2512b-1) in such a way that when one turn is completed while progressing from the first turn to the ninth turn, one of the five individual pattern strands (2512b-1) is stopped and a new individual pattern strand (2512b-1) is newly progressed.

[0376] By configuring the first type pattern (2512a) and the second type pattern (2512b) to be formed through a plurality of divided individual pattern strands (2512a-1, 2512b-1) in this way, it is possible to achieve the effect of a bundle of wires being bundled similar to the Litz wire applied to conventional cooktops.

[0377] At this time, the starting point and the ending point of the individual pattern strand (2512a-1) of the first type pattern (2512a) arranged to form a new turn as illustrated in FIG. 14, and the starting point and the ending point of the individual pattern strand (2512b-1) of the second type pattern (2512b) arranged to form a new tube in the same manner can be connected in series through the working coil via hole (H_v1).

[0378] At this time, the working coil via hole (H_v1) connecting the starting point and the ending point of the individual pattern strand (2512a-1) of the first type pattern (2512a) to the starting point and the ending point of the individual pattern strand (2512b-1) of the second type pattern (2512b) can be configured to collectively connect the individual pattern strands (2512a-1, 2512b-1) arranged in each layer by penetrating the entirety from the third layer (251c) to the twelfth layer (251l), as illustrated in FIG. 15.

[0379] However, as illustrated in FIG. 14, the individual pattern strands (2512a-1) constituting the first type pattern (2512a) and the individual pattern strands (2512b-1) constituting the second type pattern (2512b) may be configured to extend in opposite directions.

[0380] For example, individual pattern strands (2512a-1) constituting a first type pattern (2512a) may extend along a first direction (W1), and individual pattern strands (2512b-1) constituting a second type pattern (2512b) may extend along a second direction (W2) opposite to the first direction (W1).

[0381] As illustrated by way of example, the first direction (W1) can be clockwise, and the second direction (W2) can be counterclockwise.

[0382] Therefore, when high-frequency power is supplied through the same working coil via hole (H_v1), currents having opposite directions may flow in the individual pattern strands (2512a-1) of the first type pattern (2512a) and the individual pattern strands (2512b-1) of the second type pattern (2512b), which are electrically connected simultaneously to the same working coil via hole (H_v1), and magnetic fields having opposite directions may be formed.

[0383] As magnetic fields in opposite directions are formed in the first type pattern (2512a) and the second type pattern (2512b) in this way, a magnetic field dispersion effect similar to a conventional twisted Litz wire can be created.

[0384] Accordingly, the magnetic field generated from the first type pattern (2512a) and the second type pattern (2512b) is evenly transmitted to the container without being concentrated on a specific part of the container, thereby improving the heating efficiency and heating effect for the container.

[0385] Meanwhile, as illustrated in FIG. 16, a plurality of working coil via holes (H_v1) may be formed in the first common terminal (2512a-2) of the first type pattern (2512a) and the first common terminal (2512b-2) of the second type pattern (2512b) to minimize loss due to resistance.

[0386] These multiple working coil via holes (H_v1) can be formed to penetrate the entire layer from the first layer (251a) to the twelfth layer (251l) so as to be electrically connected to the first lead pattern (2513a) formed on the first layer (251a).

[0387] As a common working coil via hole (H_v1) is formed through the entire layer in this way, heat generated by individual working coil patterns (2512) can be effectively released from the first coil circuit board module (251) through the working coil via hole (H_v1). That is, the working coil via hole (H_v1) can function as a ventilation hole that prevents overheating of the first coil circuit board module (251).

[0388] Although not shown in FIG. 16, a plurality of working coil via holes (H_v1) may be formed to penetrate the entire area from the first layer (251a) to the twelfth layer (251l) in the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b), similarly to the first common terminals (2512a-2, 2512b-2).

[0389] [Detailed structure of the support structure and connector of the first coil circuit board module]

[0390] Referring to FIGS. 17a to 32 below, the support structure of the first coil circuit board module (251) of the cooking appliance (1) according to the present invention and the detailed configuration of the high-power connector (254) for supplying high-frequency power to the first coil circuit board module (251) will be described.

[0391] First, FIGS. 17a to 21 illustrate the support structure of the first coil circuit board module (251) of the cooking appliance (1) according to the present invention.

[0392] As described above, the first coil circuit board module (251) is placed below the top plate (21) on which the container is mounted.

[0393] In addition, as illustrated in FIG. 17a, a substrate supporter (26) is arranged below the first coil circuit board module (251), and the first coil circuit board module (251) can be supported by the substrate supporter (26) by being mounted on the upper surface (261) of the substrate supporter (26). At this time, as illustrated in FIG. 17a, a main circuit board module (281) constituting an electric component (28), an SMPS circuit board (switching mode power supply, 282), an inverter circuit board module (283), a resonant circuit board module (284), an EMI filter module (285), a blower module (286), and a light source module (23) can be fixed to the lower surface (262) as the inside of the substrate supporter (26).

[0394] Meanwhile, in contrast, the inverter circuit board module (283) may be configured to be fixed and supported on another separate object rather than being fixed to the board supporter (26). More specifically, as illustrated in FIG. 17b, an additional supporter (26a) may be further provided below the board supporter (26) to fix and support the inverter circuit board module (283).

[0395] As illustrated, the additional supporter (26a) can be fixed to the upper surface of the bottom case (24), and the inverter circuit board module (283) can be fixed to the upper surface of the additional supporter (26a). By configuring in this manner, the high-power connector (254) that supplies power to the first coil circuit board module (251) can be more easily electrically connected to the inverter circuit board module (283) by passing through the through-hole (263) of the board supporter (26). At this time, the board supporter (26) can be supported and fixed to the bottom case (24) via the support leg (264) while being separated from the inverter circuit board module (283).

[0396] Alternatively, as illustrated in FIG. 17c, the inverter circuit board module (283) may be supported by an additional supporter (26a), but the high-power connector (254) may be configured to be electrically connected to the inverter circuit board module (283) through another gap or groove formed on the periphery of the board supporter (26) rather than through the through-hole (263) of the board supporter (26).

[0397] In FIGS. 17b and 17c, the high-power connector (254) is illustrated as having a single bar shape that electrically connects the first coil circuit board module (251) and the inverter circuit board module (283). However, specifically, as described below, the first coil circuit board module (251) and the inverter circuit board module (283) may be electrically connected to each other by a combination of the high-power connector (254) and the high-power cable (256). This is because it is difficult to maintain a constant alignment when the first coil circuit board module (251) and the inverter circuit board module (283) are combined, and considering the convenience of maintenance, it may be advantageous to configure the configuration so that the high-power cable (256) is included.

[0398] Meanwhile, as described above, the working coil pattern (2512) constituting the crater (2511) should be positioned as close to the top plate (21) as possible so that the heat generation efficiency for the container can be maintained at its maximum.

[0399] This is explained as follows based on the examples shown in Figs. 19 and 20.

[0400] Based on the illustrated embodiment, the top plate (21) can have a vertical thickness of approximately 4 mm.

[0401] In addition, as described above, when the working coil pattern (2512) is arranged in a 10-layer structure in the vertical direction and the first coil circuit board module (251) has a total of 12-layer structures, the first coil circuit board module (251) can have a vertical thickness of approximately 3 mm.

[0402] At this time, in order to achieve maximum heat generation efficiency of the working coil pattern (2512), the vertical gap (GH1) formed between the upper surface (251t) of the first coil circuit board module (251) and the lower surface (21b) of the top plate (21) may be in the range of 2.7 mm or more and 3.3 mm or less, as shown in FIG. 20, and may preferably be set to be 3 mm.

[0403] Meanwhile, as described above, a plurality of high-power terminal patterns (2516) as terminals for supplying high-frequency power to the working coil pattern (2512) can be integrally formed on the first coil circuit board module (251) together with the working coil pattern (2512).

[0404] As illustrated in FIG. 20, these multiple high-power terminal patterns (2516) may be formed, for example, close to the leading edge and trailing edge of the first coil circuit board module (251), and may be arranged along the leading edge and trailing edge, respectively.

[0405] In the embodiment, the high-power terminal pattern (2516) is shown as being formed on the upper surface (251t) of the first coil circuit board module (251), but alternatively, it may be formed on the lower surface (251v) of the first coil circuit board module (251), or the high-power terminal pattern (2516) may be formed on the upper surface (251t) and the lower surface (251v) of the first coil circuit board module (251), respectively, depending on the embodiment. In addition, depending on the embodiment, the high-power terminal pattern (2516) may be configured to be formed on the front edge surface or the rear edge surface of the first coil circuit board module (251).

[0406] Meanwhile, the high-power terminal pattern (2516) is configured to be applied with high-frequency power having an effective value of approximately 20 A or more. Therefore, it is virtually impossible to apply a connector having a simple insertion method, such as a conventional board connector, to the high-power terminal pattern (2516). The high-frequency power applied to the high-power terminal pattern (2516) can be generated and supplied from an inverter circuit board module (283) disposed on the lower surface (262) of the board supporter (26) as an interior of the board supporter (26), as illustrated in FIG. 18.

[0407] As the operation of a conventional board connector becomes virtually impossible, the first coil circuit board module (251) according to the present invention must be applied by directly soldering the cable terminal of a power cable that supplies high-frequency power to a high-power terminal pattern (2516) or connecting it through a mechanical connecting means such as a screw bolt.

[0408] However, in the case where the cable terminal of the power cable is directly connected to the high-power terminal pattern (2516) through soldering, as described above, since the vertical gap (GH1) formed between the upper surface (251t) of the first coil circuit board module (251) and the lower surface (21b) of the top plate (21) is formed quite small, there is a high possibility that the solder portion of the high-power terminal pattern (2516) will be damaged as it comes into contact with the lower surface (21b) of the top plate (21), and there is a high possibility that the solder portion of the contact portion will melt, causing a contact failure.

[0409] In addition, when the cable terminal of the power cable is mechanically connected to the high-power terminal pattern (2516) using a screw bolt or the like, there is a very high possibility that the first coil circuit board module (251) will be damaged due to the fastening force of the screw bolt.

[0410] As a means for solving a problem that occurs due to the direct connection of a high-power terminal pattern (2516) and a cable terminal of a power cable, the present invention may include a high-power connector (254) having one side connected to the high-power terminal pattern (2516) of a first coil circuit board module (251) and the other side electrically connected to an inverter (2831) of an inverter circuit board module (283) via a power cable (256).

[0411] At this time, the first connection part forming one side of the high-power connector (254) is connected by soldering to the high-power terminal pattern (2516) of the first coil circuit board module (251) and fixed to the first coil circuit board module (251), and the second connection part forming the other side of the high-power connector (254) can be connected to the cable terminal (255) of the power cable (256) by a mechanical connection means such as a connection bolt (B).

[0412] Meanwhile, as shown in FIGS. 19 and 20, when a high-power terminal pattern (2516) is formed on the upper surface (251t) of the first coil circuit board module (251), the first connection portion of the high-power connector (254) is formed so that it can be soldered to the high-power terminal pattern (2516), and a portion protrudes upward from the upper surface (251t) of the first coil circuit board module (251).

[0413] At this time, the vertical protrusion height of the portion protruding upward from the upper surface (251t) of the first coil circuit board module (251) can be set to be lower than the vertical gap (GH1) formed between the upper surface (251t) of the first coil circuit board module (251) and the lower surface (21b) of the top plate (21).

[0414] More specifically, the vertical protrusion height of the portion protruding upward from the upper surface (251t) of the first coil circuit board module (251) may be limited to less than half of the vertical gap (GH1) formed between the upper surface (251t) of the first coil circuit board module (251) and the lower surface (21b) of the top plate (21).

[0415] For example, as described above, when the vertical gap (GH1) is set to a range of 2.7 mm or more and 3.3 mm or less, the vertical protrusion height of the portion protruding upward from the upper surface (251t) of the first coil circuit board module (251) may have a range of 0.8 mm or more and 1.2 mm or less.

[0416] By limiting the vertical protrusion height of the portion protruding upward from the upper surface (251t) of the first coil circuit board module (251) to a predetermined relative range, the soldering portion of the high-power terminal pattern (2516) can be configured not to contact the lower surface (21b) of the top plate (21), and accordingly, the possibility of the contact portion between the high-power terminal pattern (2516) and the high-power connector (254) being damaged and the possibility of the contact portion being defective due to melting can be fundamentally blocked.

[0417] Meanwhile, the second connection part electrically connected to the inverter (2831) via a power cable (256) can extend through the upper surface (261) of the substrate supporter (26) toward the inside of the substrate supporter (26), as illustrated in FIG. 18.

[0418] More specifically, as illustrated in FIG. 18, cable terminals (255) may be provided at both ends of the power cable (256). A fastening hole may be formed in the cable terminal (255) through which the fastening bolt (B) may pass so that the cable terminal can be fixed by the fastening bolt (B). The cable terminal (255) provided at one end of the power cable (256) may be mechanically coupled to a plurality of supply terminals (2841) arranged along the edge of the resonant circuit board module (284) by the fastening bolt (B). In addition, the cable terminal (255) provided at the other end of the power cable (256) may be mechanically coupled to a second connection portion of a high-power connector (254) disposed inside the board supporter (26) by passing through a through hole (263) formed in the board supporter (26), as described below, by the fastening bolt (B).

[0419] Through this, the high-frequency power generated in the inverter circuit board module (283) can be supplied to the first coil circuit board module (251) through the resonant circuit board module (284) and the power cable (256) and the high-power connector (254). In FIG. 18, the power cable (256) is illustrated as extending across the EMI filter module (285), but in order to avoid interference with the components arranged in the EMI filter module (285) and the components arranged in the resonant circuit board module (284) as much as possible, the power cable (256) may be configured to extend along a space that does not overlap with these components in the vertical direction. In this way, by configuring the second connection portion to pass through the board supporter (26) and be positioned inside the board supporter (26) in which the electric component (28) including the inverter (2831), the inverter circuit board module (283) and the EMI filter module are accommodated, the power cable (256) can connect the inverter (2831) and the second connection portion of the high-power connector (254) with the shortest length without having to detour to the outside of the board supporter (26).

[0420] Through this, the length of the power cable (256) connecting the second connection part of the inverter (2831) and the high-power connector (254) can be minimized, and the connection structure between the inverter (2831) and the high-power connector (254) via the power cable (256) can be expected to be simplified.

[0421] As illustrated in FIG. 17a and FIG. 21, a plurality of through holes (263) may be formed in the substrate supporter (26) penetrating the upper surface (261) and the lower surface (262). Some of the plurality of through holes (263) may be configured to allow the second connection portion of the high-power connector (254) illustrated in FIG. 22 to pass through, and the remaining portions may be configured to allow the lower end of the low-power connector (2518g) illustrated in FIG. 21 to pass through directly or a flat communication cable (not illustrated) that is a counterpart of the low-power connector (2518g) to pass through.

[0422] In addition, in a case where the high-power terminal pattern (2516) is configured to be divided and arranged around the edge notch (2517) as in the embodiment, the position of the through hole (263) can be set so that the edge notch (2517) overlaps the through hole (263) entirely along the vertical direction.

[0423] The detailed configuration of the high-power connector (254) for each embodiment is described below with reference to FIG. 23 and below.

[0424] [Detailed configuration of high-power connector according to the first embodiment]

[0425] First, FIGS. 23 and 24 illustrate detailed configurations of a high-power connector (254a) according to the first embodiment of the present invention.

[0426] Referring to FIG. 23, a high-power connector (254a) according to the first embodiment of the present invention may be configured to include a first connection portion (254a-1) electrically connected to a high-power terminal pattern (2516) of a first coil circuit board module (251), a second connection portion (254a-2) electrically connected to the inverter circuit board module (283), and a bridge portion (254a-3) connecting the first connection portion (254a-1) and the second connection portion (254a-2).

[0427] As described above, a high-frequency power having an effective value of approximately 20 A or more is applied to the high-power connector (254a), and as described later, the cable terminal (255) of the power cable (256) is connected through a mechanical fastening means such as a fastening bolt, so that a certain electrical stability and a certain mechanical strength are required.

[0428] Therefore, to meet these electrical stability and mechanical strength requirements, a high-power connector (254a) can be manufactured by pressing a plate-shaped metal material having a predetermined thickness.

[0429] The metal material may be, for example, a copper-based alloy material or a stainless steel-based alloy material having electrical stability and mechanical strength.

[0430] Additionally, the thickness of the metal material on the plate may be approximately 1 mm.

[0431] As illustrated, a high-power connector (254a) can be formed by bending a plate-shaped metal material having a uniform thickness of approximately 1 mm to have an overall U-shape, and bending the upper portion of the U-shape so that it extends horizontally.

[0432] Accordingly, in this embodiment, the first connecting portion (254a-1) may be the upper portion of a U-shape that is bent to extend in the horizontal direction, the second connecting portion (254a-2) may be the lower portion of the U-shape, and the bridge portion (254a-3) may be a portion of the U-shape that extends in the vertical direction.

[0433] As illustrated in FIG. 24, the high-power terminal pattern (2516) can be arranged in pairs on the upper surface (251t) of the first coil circuit board module (251) around the edge notch (2517).

[0434] In response to this, the first connection portion (254a-1) connected to the high-power terminal pattern (2516) may be formed integrally at the upper portion of the U-shape, i.e., the upper portion of a pair of bridge portions (254a-3), and may be provided as a pair.

[0435] As illustrated, the first connecting portion (254a-1) may have a connecting surface having a predetermined front-rear width (Wa) and a predetermined left-right width. Accordingly, the lower surfaces of a pair of first connecting portions (254a-1) may be connected in a state of surface contact with a pair of high-power terminal patterns (2516) and fixed through soldering.

[0436] The first connecting portion (254a-1) forms the uppermost portion of the high-power connector (254a) according to the first embodiment in the vertical direction as shown, and is configured to protrude from the upper surface of the first coil circuit board module (251) as a whole.

[0437] As described above, since the high-power connector (254a), including the first connecting portion (254a-1), is manufactured using a plate-like member having a thickness of about 1 mm, the height at which the high-power connector (254a) protrudes from the upper surface (251t) of the first coil circuit board module (251) can be maintained at about 1 mm.

[0438] Accordingly, the vertical height of the portion including the thickness of the solder portion and the first connection portion (254a-1) generated during soldering can be maintained smaller than the vertical gap (GH1) between the top plate (21) and the upper surface of the first coil circuit board module (251).

[0439] The second connection portion (254a-2) forms the lowermost end of the high-power connector (254a) according to the first embodiment in the vertical direction as illustrated, and is configured to be connected to the cable terminal (255) of the power cable (256).

[0440] In more detail, the cable terminal (255) of the power cable (256) can be connected in a surface contact state to the lower surface of the second connection portion (254a-2).

[0441] A plate-shaped contact portion (254a-21) having a square or circular shape can be formed on the lower surface of the second connecting portion (254a-2) so that a minimum contact surface can be secured.

[0442] In addition, as illustrated, a bolt hole (254a-22) through which a fastening bolt (B) can pass may be formed on the central side of the contact portion (254a-21), and a burring portion (254a-23) concentric with the bolt hole (254a-22) and having screw threads formed on the inner surface may be formed on the upper surface of the second connection portion (254a-2).

[0443] Meanwhile, the second connecting portion (254a-2) may further be provided with a guide portion (254a-24) to guide the position of the cable terminal (255) of the power cable (256).

[0444] The guide portion (254a-24) serves to guide the position where the cable terminal (255) of the power cable (256) is placed on the contact portion (254a-21) of the second connection portion (254a-2) when connecting the cable terminal (255).

[0445] As shown, the guide portion (254a-24) may be provided in the form of a protrusion formed by cutting a portion of the bridge portion (254a-3) and bending it downward.

[0446] Meanwhile, the bridge portion (254a-3) serves to connect the first connection portion (254a-1) and the second connection portion (254a-2) constituting the high-power connector (254a), as illustrated.

[0447] The bridge portion (254a-3) can extend approximately in the vertical direction so as to connect between the first connecting portion (254a-1) forming the uppermost portion and the second connecting portion (254a-2) forming the lowermost portion.

[0448] Additionally, the bridge portions (254a-3) may be provided as a pair so as to connect the first connecting portions (254a-1) provided as a pair to the second connecting portions (254a-2), respectively. As illustrated, the pair of bridge portions (254a-3) may be arranged to face each other.

[0449] At this time, the horizontal gap between the pair of bridge portions (254a-3) can be configured to gradually increase in the upward direction from the second connecting portion (254a-2) toward the first connecting portion (254a-1).

[0450] That is, based on the state before the high-power terminal pattern (2516) is assembled to the first coil circuit board module (251), the left-right gap between the inner surfaces of a pair of bridge portions (254a-3) facing each other or the left-right gap (Wb) between the outer surfaces of a pair of bridge portions (254a-3) can be configured to gradually increase as it progresses in the upward direction.

[0451] At this time, the left-right distance (Wb) between the outer surfaces at the bottom of a pair of bridge portions (254a-3) may be smaller than the left-right width of the edge notch (2517), but the left-right distance (Wb) between the outer surfaces at the top of a pair of bridge portions (254a-3) may be formed to be larger than the left-right width of the edge notch (2517).

[0452] Accordingly, as illustrated in FIG. 24, when a pair of bridge portions (254a-3) penetrate the edge notch (2517) of the first coil circuit board module (251) in the vertical direction and are inserted into the edge notch (2517), the left-right gap (Wb) between the outer surfaces at the top of the pair of bridge portions (254a-3) narrows, causing elastic deformation to occur in the pair of bridge portions (254a-3).

[0453] Through this, a restoring force acting in a direction that moves a pair of first connecting portions (254a-1) away from each other is applied to the edge notch (2517) of the first coil circuit board module (251) through a pair of bridge portions (254a-3).

[0454] By this restoring force, the movement of the cable terminal (255) can be minimized during the soldering process between the first connection portion (254a-1) and the high-power terminal pattern (2516) and during the fastening process between the second connection portion (254a-2) and the cable terminal (255), and these assembly processes can be stably performed without adding separate equipment for temporarily fixing the high-power connector (254a).

[0455] [Detailed configuration of the high-power connector according to the second embodiment]

[0456] Figures 25 and 26 illustrate detailed configurations of a high-power connector (254b) according to a second embodiment of the present invention.

[0457] Referring to FIG. 25, a high-power connector (254b) according to a second embodiment of the present invention, unlike the first embodiment, may be configured such that at least one of a pair of first connecting portions (254b-1) is provided with an insertion protrusion (254b-11) that protrudes downward toward the first coil circuit board module (251).

[0458] In this way, other configurations except for the insertion protrusion (254b-11) can be applied almost identically to the first embodiment.

[0459] That is, the detailed configuration of a pair of first connecting portions (254b-1), the detailed configuration of a second connecting portion (254b-2) including a contact portion (254b-21), a bolt hole (254b-22), a burring portion (254b-23) and a guide portion (254b-24), and the detailed configuration of a pair of bridge portions (254b-3) can be identically applied to the contents described in the first embodiment unless otherwise described. Hereinafter, descriptions of overlapping parts with respect to the first embodiment will be omitted.

[0460] As in the first embodiment, the first connection portion (254b-1) of the high-power connector (254b) according to the second embodiment is configured to protrude upward from the upper surface (251t) of the first coil circuit board module (251), and may be formed to extend parallel to the upper surface (251t) of the first coil circuit board module (251) and the high-power terminal pattern (2516).

[0461] As described above, in the case of the first embodiment, the restoring force of a pair of bridge portions acts to minimize the movement of the high-power connector during the process of fastening the second connection portion (254b-2) and the cable terminal (255) using the fastening bolt (B). However, if a significantly high torque is applied to the fastening bolt (B) momentarily, the high-power connector is subjected to a high rotational force, and there is a very high possibility that the bridge portion will detach from the edge notch (2517). In this case, if the bridge portion of the high-power connector detaches from the edge notch (2517), there is a concern that a serious problem may additionally occur in which the soldering portion between the first connection portion and the high-power terminal pattern (2516) is damaged.

[0462] As a means for preventing rotation of the high-power connector (254b) due to torque applied to the fastening bolt (B), the high-power connector (254b) according to the second embodiment may further include an insertion protrusion (254b-11).

[0463] The insertion projection (254b-11) may be formed integrally with at least one of a pair of first connecting portions (254b-1) forming the uppermost portion of the high-power terminal pattern (2516).

[0464] FIGS. 25 and 26 illustrate a configuration in which a pair of insertion protrusions (254b-11) are provided on each of a pair of first connecting portions (254b-1), as an example. The present invention is not limited thereto, but the following description will be based on a configuration in which a pair of insertion protrusions (254b-11) are provided integrally on each of the first connecting portions (254b-1), as in the illustrated embodiment.

[0465] As illustrated, the insertion projection (254b-11) can be formed by, for example, partially cutting the outer end of the first connecting portion (254b-1) to form a T-shaped notch and then bending the notched portion downward.

[0466] The insertion protrusion (254b-11) can be fixed by being inserted downward into the coupling hole (251h_b) formed in the first coil circuit board module (251) as illustrated in FIG. 26.

[0467] Therefore, in order to secure a minimum insertion depth, the height at which the insertion projection (254b-11) protrudes from the lower surface of the first connecting portion (254b-1) may be formed to be greater than half the vertical thickness of the first coil circuit board module (251).

[0468] In response to the height at which the insertion protrusion (254b-11) protrudes from the lower surface of the first connecting portion (254b-1), the vertical depth of the coupling hole (251h_b) formed in the first coil circuit board module (251) may be formed to be the same as or deeper than the protrusion height of the insertion protrusion (254b-11).

[0469] Accordingly, the coupling hole (251h_b) may be formed to have a depth that is at least half the vertical thickness of the first coil circuit board module (251). However, regardless of the depth of the coupling hole (251h_b), the upper end of the coupling hole (251h_b) may be completely open so that the insertion protrusion (254b-11) can be inserted while moving downward along the direction illustrated in FIG. 26.

[0470] Meanwhile, the coupling hole (251h_b) may be arranged inside the area where the high-power terminal pattern (2516) is formed, or may be arranged outside the area where the high-power terminal pattern (2516) is formed.

[0471] FIG. 26 illustrates a configuration in which a coupling hole (251h_b) is arranged inside a high-power terminal pattern (2516).

[0472] In this case, when the coupling hole (251h_b) is arranged inside the high-power terminal pattern (2516), the coupling hole (251h_b) may be configured as a via hole whose inner surface is coated with a conductor.

[0473] At this time, the coupling hole (251h_b) that becomes the via hole can be electrically connected to the high-power terminal pattern (2516).

[0474] As the coupling hole (251h_b) is formed as a via hole, the insertion protrusion (254b-11) can be indirectly electrically connected to the high-power terminal pattern (2516).

[0475] Through this, it is expected that the electrical contact area between the high-power terminal pattern (2516) and the high-power connector (254b) will be additionally expanded.

[0476] [Detailed configuration of high-power connector according to the third embodiment]

[0477] Figures 27 and 28 illustrate detailed configurations of a high-power connector (254c) according to a third embodiment of the present invention.

[0478] Referring to FIG. 27, a high-power connector (254c) according to a third embodiment of the present invention can be configured so that, unlike the first embodiment, the first connection portion (254c-1) is connected and fixed to the lower surface (251v) of the first coil circuit board module (251).

[0479] In addition, unlike the first embodiment, the high-power connector (254c) according to the third embodiment may be configured such that at least one of the pair of first connecting portions (254c-1) is provided with an insertion protrusion (254c-11) that protrudes upward toward the first coil circuit board module (251).

[0480] In this way, other configurations except for the first connecting portion (254c-1) and the insertion protrusion (254c-11) can be applied almost identically to the first embodiment.

[0481] That is, the detailed configuration of the second connecting portion (254c-2) including the contact portion (254c-21), the bolt hole (254c-22), the burring portion (254c-23), and the guide portion (254c-24), and the detailed configuration of the pair of bridge portions (254c-3) can be applied identically to the description in the first embodiment unless otherwise described. Hereinafter, the description of the overlapping portions with respect to the first embodiment will be omitted.

[0482] Similar to the first embodiment, the first connecting portion (254c-1) constituting the high-power connector (254c) of the third embodiment may be formed integrally at the upper portion of the U-shape, i.e., at the upper portion of a pair of bridge portions (254c-3), and provided as a pair.

[0483] However, the first connection portion (254c-1) of the high-power connector (254c) according to the third embodiment can be fixed to the first coil circuit board module (251) in a state of being connected to the lower surface (251v) of the first coil circuit board module (251).

[0484] Accordingly, the upper surface of the first connection portion (254c-1) of the high-power connector (254c) according to the third embodiment functions as a connection surface that is connected and soldered to the high-power terminal pattern (2516).

[0485] Therefore, the third embodiment is suitable for a configuration in which a high-power terminal pattern (2516) connected to the first connection portion (254c-1) is divided and arranged on the lower surface (251v) of the first coil circuit board module (251).

[0486] In addition, since the first connecting portion (254c-1) is fixed to the lower surface (251v) of the first coil circuit board module (251), the pair of bridge portions (254c-3) are configured not to extend through the first coil circuit board module (251). Therefore, the edge notch (2517) illustrated in FIG. 28 can be omitted.

[0487] Meanwhile, similar to the second embodiment, the insertion projection (254c-11) provided in the third embodiment corresponds to a means for preventing rotation of the high-power connector (254c) due to torque applied to the fastening bolt (B).

[0488] However, unlike the second embodiment, the insertion projection (254c-11) of the third embodiment can be fixed by being inserted upward into the coupling hole (251h_b) formed in the first coil circuit board module (251) as illustrated in FIG. 28.

[0489] Therefore, the insertion projection (254c-11) and the coupling hole (251h_b) of the third embodiment can be configured similarly to those of the second embodiment, except that the insertion direction is configured differently.

[0490] That is, in order to secure a minimum insertion depth, the height at which the insertion protrusion (254c-11) protrudes from the upper surface of the first connection portion (254c-1) may be formed to be greater than half the vertical thickness of the first coil circuit board module (251), and the vertical depth of the coupling hole (251h_b) formed in the first coil circuit board module (251) may be formed to be equal to or deeper than the protrusion height of the insertion protrusion (254c-11).

[0491] However, the lower end of the coupling hole (251h_b) can be maintained in a completely open state regardless of the depth of the coupling hole (251h_b) so that the insertion protrusion (254c-11) can be inserted while moving upward along the direction shown in Fig. 28.

[0492] Additionally, similar to the second embodiment, the coupling hole (251h_b) of the third embodiment may be positioned inside the area where the high-power terminal pattern (2516) is formed, or may be positioned outside the area where the high-power terminal pattern (2516) is formed.

[0493] As illustrated in Fig. 28, when the coupling hole (251h_b) is positioned inside the high-power terminal pattern (2516), the coupling hole (251h_b) can be configured as a via hole whose inner surface is coated with a conductor.

[0494] The coupling hole (251h_b) that becomes the via hole can be electrically connected to the high-power terminal pattern (2516), and the insertion protrusion (254c-11) can be indirectly electrically connected to the high-power terminal pattern (2516).

[0495] Meanwhile, similar to the first embodiment, when the insertion projection (254c-11) moves upward and is inserted into the coupling hole (251h_b), a pair of bridge portions (254c-3) are elastically deformed, and the restoring force of the bridge portions (254c-3) generated by the elastic deformation can be configured to act on the coupling hole (251h_b) through the insertion projection (254c-11).

[0496] [Detailed configuration of the high-power connector according to the fourth embodiment]

[0497] Figures 29 and 30 illustrate detailed configurations of a high-power connector (254d) according to the fourth embodiment of the present invention.

[0498] Referring to FIG. 29, a high-power connector (254d) according to a fourth embodiment of the present invention can be configured so that, unlike the first embodiment, the first connection portion (254d-1) is connected and fixed to the upper surface (251t) and the lower surface (251v) of the first coil circuit board module (251), respectively.

[0499] In this way, other configurations except for the first connecting portion (254d-1) can be applied almost identically to the first embodiment.

[0500] That is, the detailed configuration of the second connecting portion (254d-2) including the contact portion (254d-21), the bolt hole (254d-22), the burring portion (254d-23), and the guide portion (254d-24), and the detailed configuration of the pair of bridge portions (254d-3) can be applied identically to the description in the first embodiment unless otherwise described. Hereinafter, the description of the overlapping portions with respect to the first embodiment will be omitted.

[0501] Similar to the first embodiment, the first connecting portion (254d-1) constituting the high-power connector (254d) of the fourth embodiment may be formed integrally at the upper portion of the U-shape, i.e., at the upper portion of a pair of bridge portions (254d-3), and provided as a pair.

[0502] However, the first connection portion (254d-1) of the high-power connector (254d) according to the fourth embodiment can be fixed to the first coil circuit board module (251) in a state of being connected to the upper surface (251t) and the lower surface (251v) of the first coil circuit board module (251).

[0503] To this end, as illustrated, the first connection portion (254d-1) of the high-power connector (254d) according to the fourth embodiment may be configured to include an upper connection portion (254d-11) connected to the upper surface (251t) of the first coil circuit board module (251) and a lower connection portion (254d-12) connected to the lower surface (251v) of the first coil circuit board module (251).

[0504] Accordingly, the lower surface of the upper connection portion (254d-11) and the upper surface of the lower connection portion (254d-12) of the high-power connector (254d) according to the fourth embodiment are connected to the high-power terminal pattern (2516) and function as soldered connection surfaces, respectively.

[0505] The fourth embodiment may correspond to an embodiment suitable for a configuration in which a high-power terminal pattern (2516) connected to the first connection portion (254d-1) is divided and arranged on both the upper and lower surfaces of the first coil circuit board module (251).

[0506] The upper connection portion (254d-11) and the lower connection portion (254d-12) of the high-power connector (254d) according to the fourth embodiment can be formed by cutting the upper portion of the first connection portion and the bridge portion of the first embodiment described above along two dividing lines and bending some of the three-part divided bodies.

[0507] FIG. 29 illustrates a configuration in which a centrally divided body among three divided bodies is bent to form a lower connection portion (254d-12), and the remaining unbent divided bodies form an upper connection portion (254d-11). However, this is merely exemplary, and a configuration in which the centrally divided body is formed as an upper connection portion (254d-11) and the remaining divided bodies are formed as lower connection portions (254d-12) may also be applied, and this naturally falls within the scope of the present invention. The present invention is not limited thereto, but will be described below based on an exemplary embodiment illustrated.

[0508] The upper connecting portion (254d-11) and the lower connecting portion (254d-12) can be formed parallel to each other, and a predetermined vertical gap can be formed between the upper connecting portion (254d-11) and the lower connecting portion (254d-12).

[0509] The vertical gap formed between the lower connection portion (254d-12) and the upper connection portion (254d-11) can be formed to be almost the same as the vertical thickness of the first coil circuit board module (251).

[0510] Accordingly, as illustrated in FIG. 30, the high-power connector (254d) can be coupled to the first coil circuit board module (251) by moving parallel along the horizontal direction so that the high-power connector (254d) can be coupled in a state where the first coil circuit board module (251) is inserted between the lower connection portion (254d-12) and the upper connection portion (254d-11).

[0511] In this way, when the parallel movement along the horizontal direction of the high-power connector (254d) is completed, the upper connection portion (254d-11) and the lower connection portion (254d-12) are soldered to the upper surface (251t) and the lower surface (251v) of the first coil circuit board module (251), respectively, and the high-power connector (254d) can be fixed to the first coil circuit board module (251).

[0512] As soldering is performed on the upper connection portion (254d-11) and the lower connection portion (254d-12) in this way, the bonding strength to the first coil circuit board module (251) can be further improved, and the high-power connector (254d) can be firmly fixed to the first coil circuit board module (251).

[0513] In addition, as soldering is performed on the upper connection portion (254d-11) and the lower connection portion (254d-12), the electrical contact area between the high-power terminal pattern (2516) and the high-power connector (254d) may be additionally expanded.

[0514] [Detailed configuration of high-power connector according to the fifth embodiment]

[0515] Figures 31 and 32 illustrate detailed configurations of a high-power connector (2516) according to a fifth embodiment of the present invention.

[0516] Referring to FIG. 31, unlike the first embodiment, the high-power connector (2516) according to the fourth embodiment of the present invention can be configured to be connected and fixed to the first coil circuit board module (251) only by an insertion protrusion (254e-11) formed to protrude upward from the top of the bridge portion (254e-3).

[0517] That is, the high-power connector (2516) according to the fifth embodiment can be configured so that a pair of insertion protrusions (254e-11) provided at the upper end of the bridge portion (254e-3) function as the first connection portion (254e-1).

[0518] Except that the first connecting portion is replaced with a pair of insertion projections (254e-11) as shown, other configurations can be applied almost identically to the first embodiment.

[0519] That is, the detailed configuration of the second connecting portion (254e-2) including the contact portion (254e-21), the bolt hole (254e-22), the burring portion (254e-23), and the guide portion (254e-24), and the detailed configuration of the pair of bridge portions (254e-3) can be applied identically to the description in the first embodiment unless otherwise described. Hereinafter, the description of the overlapping portions with respect to the first embodiment will be omitted.

[0520] Similar to the third embodiment described above, the insertion projection (254e-11) provided in the fifth embodiment corresponds to a means for preventing rotation of the high-power connector (2516) due to torque applied to the fastening bolt (B).

[0521] Accordingly, the insertion projection (254e-11) of the fifth embodiment can be fixed by being inserted upward into the coupling hole (251h_b) formed in the first coil circuit board module (251) as illustrated in FIG. 32.

[0522] Furthermore, the insertion protrusion (254e-11) of the fifth embodiment may also serve to prevent the high-power connector (2516) from being detached downward from the first coil circuit board module (251).

[0523] To this end, the height at which the insertion protrusion (254e-11) protrudes from the top of the bridge portion (254e-3) may be formed to be greater than the vertical thickness of the first coil circuit board module (251).

[0524] That is, the insertion protrusion (254e-11) may be configured to penetrate the entire first coil circuit board module (251) and have its upper end protrude from the upper surface (251t) of the first coil circuit board module (251).

[0525] In response to this, the coupling hole (251h_b) formed in the first coil circuit board module (251) may be a through hole that penetrates the entire area from the lower surface (251v) to the upper surface (251t) of the first coil circuit board module (251).

[0526] However, the protrusion height of the insertion protrusion (254e-11) protruding from the upper surface (251t) of the first coil circuit board module (251) may be limited to 1 mm or less, similar to the embodiments described above.

[0527] The portion of the insertion protrusion (254e-11) protruding from the upper surface (251t) of the first coil circuit board module (251) can be connected and fixed to the first coil circuit board module (251) through soldering.

[0528] Additionally, similar to the third embodiment, the coupling hole (251h_b) of the fifth embodiment can be arranged inside the area where the high-power terminal pattern (2516) is formed.

[0529] As illustrated in FIG. 32, when the coupling hole (251h_b) is positioned inside the high-power terminal pattern (2516), the coupling hole (251h_b) can be configured as a via hole whose inner surface is coated with a conductor.

[0530] The coupling hole (251h_b) that becomes the via hole can be electrically connected to the high-power terminal pattern (2516). Accordingly, a portion protruding from the upper surface (251t) of the first coil circuit board module (251) can be directly electrically connected to the high-power terminal pattern (2516), and a portion inserted into the coupling hole (251h_b) can be indirectly electrically connected to the high-power terminal pattern (2516) through the via hole.

[0531] Meanwhile, the high-power connector (2516) according to the fifth embodiment may further include a means for preventing separation from the first coil circuit board module (251).

[0532] A means for preventing separation from the first coil circuit board module (251) may be a catch (254e-12) provided on a portion protruding from the upper surface (251t) of the first coil circuit board module (251).

[0533] As illustrated in Fig. 31, the catch (254e-12) can be formed through a curved portion formed by bending a portion protruding from the upper surface (251t) of the first coil circuit board module (251).

[0534] The illustrated embodiment shows a configuration in which a curved portion is formed by convexly bending from the inside toward the outside of the high-power connector (2516), but alternatively, the curved portion may be formed by convexly bending from the outside toward the inside of the high-power connector (2516).

[0535] As the curved portion is formed by convexly curving outward or convexly curving inward in this way, the horizontal width between the curved portions arranged opposite each other can be varied as they progress in the up-down direction.

[0536] That is, as one proceeds from the top to the bottom of the insertion protrusion (254e-11), the horizontal width between the curved portions that are arranged opposite each other gradually increases and then gradually decreases again.

[0537] At this time, when the insertion of the insertion protrusion (254e-11) into the coupling hole (251h_b) is completed, the curved portion is in a state where it protrudes upward from the upper surface (251t) of the first coil circuit board module (251).

[0538] Accordingly, when the insertion of the insertion protrusion (254e-11) into the coupling hole (251h_b) is completed, the lower end of the curved portion is formed in a state of being caught in the coupling hole (251h_b), so that the lower end of the curved portion functions as a catch (254e-12) that prevents the insertion protrusion (254e-11) from being detached downward, and thereby the high-power connector (2516) can be effectively prevented from being detached from the first coil circuit board module (251) without providing an additional detachment prevention means.

[0539] Although the present invention has been described with reference to the drawings exemplified above, it is to be understood that the present invention is not limited to the embodiments and drawings disclosed herein, and that various modifications may be made by those skilled in the art within the scope of the technical idea of ​​the present invention. Furthermore, even if the operational effects according to the configuration of the present invention have not been explicitly described while describing the embodiments of the present invention, it is natural that the effects predictable by the corresponding configuration should also be acknowledged.

Claims

1. Top plate on which the container is mounted; A coil circuit board module disposed below the top plate and having a working coil section that heats the container; and An inverter circuit board module disposed below the coil circuit board module and generating power to be supplied to the working coil section; Including, The above coil circuit board module has a terminal portion electrically connected to the working coil portion, A cooking appliance in which the above-mentioned working coil section receives power from the inverter circuit board module through the terminal section.

2. In paragraph 1, A connector having a first connection part electrically connected to the terminal part and a second connection part electrically connected to the inverter circuit board module side; Including more, A cooking appliance wherein the connector is fixed to the coil circuit board module.

3. In paragraph 2, The above first connecting portion partially protrudes upward from the upper surface of the coil circuit board module, A cooking appliance in which the vertical protrusion height of the first connection portion from the upper surface of the coil circuit board module is lower than the vertical gap between the lower surface of the top plate and the upper surface of the coil circuit board module.

4. In paragraph 3, A cooking appliance in which the vertical protrusion height is less than half of the vertical gap.

5. In paragraph 2, A cooking appliance in which the terminal portion is formed on the upper or lower surface of the coil circuit board module.

6. In paragraph 2 A substrate supporter disposed between the coil circuit board and the inverter circuit board module, and having the coil circuit board module mounted on the upper surface; Including more, A cooking appliance in which the second connection portion of the connector extends through the upper surface of the substrate supporter toward the inverter circuit board module.

7. In paragraph 6, A cooking appliance in which a hole is formed in the above substrate supporter through which the second connection part of the connector passes.

8. In paragraph 2, The above terminal portion is divided into a pair and arranged on the upper surface of the coil circuit board module, The above first connecting portion is provided as a pair so as to be connected to each of the pair of terminal portions that are arranged separately, A cooking appliance in which the lower surfaces of the first pair of connecting portions are each connected to the pair of terminal portions.

9. In paragraph 8, The above connector, A pair of bridge portions, each end of which is connected to one of the first connecting portions of the pair, and each other end of which is connected to the second connecting portion; Including more, A cooking appliance in which the above pair of bridge sections extends vertically through the coil circuit board module.

10. In paragraph 9, When the above connector is fixed to the above coil circuit board module, A cooking appliance in which a restoring force that presses the pair of first connecting portions away from each other is applied to the coil circuit board module through the pair of bridge portions.

11. In paragraph 8, At least one of the pair of first connecting portions has an insertion projection formed to protrude downward toward the coil circuit board module, A cooking appliance in which the above coil circuit board module has a joining hole into which the insertion protrusion is inserted and joined.

12. In paragraph 2, The above terminal portion is divided into a pair and arranged on the lower surface of the coil circuit board module, The above first connecting portion is provided as a pair so as to be connected to each of the pair of terminal portions that are arranged separately, A cooking appliance in which the upper surface of the first pair of connecting portions is connected to the pair of terminal portions.

13. In paragraph 12, At least one of the pair of first connecting portions has an insertion projection formed to protrude upward toward the coil circuit board module, A cooking appliance in which the above coil circuit board module has a joining hole into which the insertion protrusion is inserted and joined.

14. In paragraph 2, The above terminal portion is divided into a pair and arranged on the upper or lower surface of the coil circuit board module, The above first connecting portion is provided as a pair so as to be connected to each of the pair of terminal portions that are arranged separately, A cooking appliance, wherein the pair of first connecting portions each have an upper connecting portion that contacts the upper surface of the coil circuit board module and a lower connecting portion that contacts the lower surface of the coil circuit board module.

15. In paragraph 14, A cooking appliance in which the vertical gap between the upper connecting portion and the lower connecting portion is smaller than or equal to the vertical thickness of the coil circuit board module.

16. In paragraph 2, The above terminal portion is divided into a pair and arranged on the upper or lower surface of the coil circuit board module, The above first connecting portion is provided as a pair so as to be connected to each of the pair of terminal portions that are arranged separately, A cooking appliance in which the pair of first connecting portions protrude upwardly toward the coil circuit board module and are inserted from the lower surface toward the upper surface of the coil circuit board module and connected to the pair of terminal portions.

17. In paragraph 16, The above coil circuit board module is a cooking appliance having a coupling hole into which the pair of first connecting parts are each inserted and coupled.

18. In paragraph 17, A cooking appliance in which the above-mentioned connecting hole is a via hole electrically connected to each of the pair of terminal parts.

19. In paragraph 16, When inserted into the above-mentioned joining hole, the upper end of the pair of first connecting portions protrudes upward from the upper surface of the coil circuit board module, A cooking appliance in which each of the upper portions of the first pair of connecting portions is provided with a catch that prevents downward movement of the connector.

20. In paragraph 1, The above coil circuit board module is a cooking appliance formed with a printed circuit pattern.

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