Coil assembly

Abstract

According to the present invention, disclosed is a coil assembly provided in an induction heating cooking device. The coil assembly comprises: a plurality of heating coil layers having formed therein a plurality of heating coils; and a wiring layer stacked on top of the plurality of heating coil layers and having formed therein heating coil wirings. The plurality of heating coil layers and the wiring layer are formed on the same substrate. According to the present invention, a container may be detected through the heating coils, without using a detection coil, by detecting a change in impedance of the heating coils.

Description

coil assembly

[0001] The present invention relates to a cooking appliance, and more particularly, to a coil assembly provided in an induction heating cooktop.

[0002]

[0003] Induction ranges, which utilize induction heating technology, are gaining attention as next-generation cooking appliances that can replace gas ranges due to their advantages such as high heating efficiency, fast heating speed, stability, and convenience.

[0004] Induction heating cooktops feature heating coils made of Ritz wire. These cooktops heat induction-specific containers by placing them on a designated burner. This method requires containers to be placed in a specific location, and any slight misalignment reduces heating efficiency.

[0005] Accordingly, research and development are underway for "All Free" induction heating technology. This technology enables heating of induction containers in various locations without requiring a fixed area on the induction heating plate. It also offers the advantage of being able to heat containers of various sizes and multiple containers with three or more zones.

[0006]

[0007] The present invention provides a coil assembly comprising a heating coil layer in which a heating coil is formed and a wiring layer in which a temperature sensor and wiring are formed as an integrated PCB pattern assembly.

[0008] The present invention provides a coil assembly that detects a container using a heating coil.

[0009] The present invention provides a coil assembly capable of reducing the thickness of an integrated PCB pattern assembly.

[0010] The present invention provides a coil assembly that optimally arranges wires of a plurality of heating coils.

[0011] The present invention provides a coil assembly that secures space for a plurality of temperature sensors.

[0012] The present invention provides a coil assembly that contributes to process simplification by forming a heating coil as an integrated PCB pattern assembly.

[0013] The problems to be solved according to one embodiment of this specification are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0014]

[0015] A coil assembly according to one embodiment of the present invention comprises a plurality of heating coil layers in which a plurality of heating coils are formed, and a wiring layer laminated on top of the plurality of heating coil layers and in which a plurality of heating coil wirings are formed, on the same substrate.

[0016] Specifically, a plurality of heating coils used for container detection and container heating are formed in a plurality of heating coil layers and are stacked in a vertical direction, and a plurality of temperature sensors are arranged in a wiring layer, and wires of a plurality of temperature sensors and wires of a plurality of heating coils are arranged.

[0017] A coil assembly according to one embodiment of the present invention detects a container using a heating coil. Specifically, the coil assembly detects the container by a change in the impedance of the heating coil, and detects a change in an oscillation signal according to a change in the equivalent resistance of the heating coil, thereby detecting at least one of the position, size, and material of the container.

[0018] A coil assembly according to one embodiment of the present invention includes a plurality of heating coil layers and a wiring layer, wherein at least one via is formed in a vertical direction, and the heating coil and the wiring of the heating coil are connected in a vertical direction through the via.

[0019] According to one embodiment of the present invention, a coil assembly comprises a plurality of heating coil wires that are optimally arranged. Specifically, wires that cross the heating coils are arranged in a wiring layer, and these wires connect the heating coils, the heating coil terminals, and the temperature sensor and connector.

[0020] A coil assembly according to one embodiment of the present invention secures space for a plurality of temperature sensors. Specifically, at least one temperature sensor is positioned on the wiring layer at positions corresponding to both sides of the center of the heating coil and at positions between the heating coils arranged adjacently in the front-rear direction.

[0021] A coil assembly according to one embodiment of the present invention contributes to process simplification by forming multiple heating coil layers and wiring layers on the same substrate. Specifically, multiple heating coils having a layered structure are formed on multiple heating coil layers, heating coil wiring connecting the multiple heating coils is formed on the wiring layer, and multiple heating coil layers and wiring layers are formed on the same substrate.

[0022]

[0023] As described above, the present invention can be formed on the same substrate by laminating a wiring layer in which wirings of a plurality of heating coils are formed on top of a plurality of heating coil layers in which a plurality of heating coils are formed.

[0024] The present invention can detect a container through a heating coil without a detection coil by detecting a change in impedance of the heating coil.

[0025] The present invention can detect at least one of the position, size, and material of a container by detecting a change in an oscillation signal according to a change in the equivalent resistance of a heating coil.

[0026] The present invention can reduce the thickness of a coil assembly by connecting the heating coil and the wiring of the heating coil in the vertical direction through a via.

[0027] The present invention can optimally arrange the wires of a plurality of heating coils by arranging wires crossing the heating coils in a wiring layer, connecting the heating coils through these wires, and connecting the heating coils and heating coil terminals, temperature sensors, and connectors.

[0028] The present invention can secure a space for arranging a plurality of temperature sensors by forming an area on both sides of a central area of ​​a plurality of heating coils in which an area between turns among a plurality of turns of the heating coils is wider than other turns, and arranging temperature sensors in a wiring layer on another layer in an area in which the area between turns is wider than other turns.

[0029] The present invention can contribute to the simplification of processes such as masking, printing, and etching by forming a plurality of heating coils having a layered structure in a heating coil layer, forming heating coil wires connecting the heating coils in a wiring layer, and forming the heating coil layer and the wiring layer as an integrated coil assembly.

[0030] The present invention can implement an optimal wiring route by arranging heating coil wiring that interconnects heating coils or connects heating coils to terminals in a wiring layer so as to cross the heating coils.

[0031] In addition to the effects described above, specific effects of the present invention are described below while explaining specific details for carrying out the invention.

[0032]

[0033] FIG. 1 is an exploded perspective view showing a disassembled state of a cooktop in a cooking appliance according to one embodiment of the present invention.

[0034] Figure 2 is a drawing showing a plan view of the cooktop illustrated in Figure 1 and the configuration of the PCB pattern coil assembly.

[0035] FIG. 3 is a drawing showing a connection structure between heating coils connected in series in a coil assembly according to one embodiment of the present invention.

[0036] FIG. 4 is a drawing showing a connection structure between series-parallel connected heating coils in a coil assembly according to one embodiment of the present invention.

[0037] FIG. 5 is a circuit diagram showing the connection relationship between an inverter circuit and series-parallel connected heating coils in a cooking appliance according to one embodiment of the present invention.

[0038] Fig. 6a is a schematic cross-sectional view for explaining the structure of a coil assembly according to the first embodiment.

[0039] Figure 6b is a plan view of the wiring layer illustrated in Figure 6a.

[0040] Fig. 7a is a schematic cross-sectional view for explaining the structure of a coil assembly according to the second embodiment.

[0041] Fig. 7b is a plan view of the sensing coil layer illustrated in Fig. 7a.

[0042] Fig. 8a is a schematic cross-sectional view for explaining the structure of a coil assembly according to the third embodiment.

[0043] Figure 8b is a plan view of the wiring layer illustrated in Figure 8a.

[0044] Figure 8c is a plan view of the sensing coil layer illustrated in Figure 8a.

[0045] Figure 9 is a plan view of the first to tenth heating coil layers illustrated in Figure 8.

[0046] Fig. 10 is a circuit diagram of a container detection sensor in a cooking appliance according to one embodiment of the present invention.

[0047] Figure 11 is a drawing for explaining the operation of the container detection sensor illustrated in Figure 10.

[0048] FIG. 12 is a diagram showing the equivalent resistance variation ratio by container material according to the oscillation frequency of the container detection sensor in a cooking appliance according to one embodiment of the present invention.

[0049] FIG. 13 is a drawing showing the connection relationship between a container detection sensor and a controller in a cooking appliance according to one embodiment of the present invention.

[0050]

[0051] The above-described objects, features, and advantages will be described in detail below with reference to the accompanying drawings, so that those skilled in the art can easily practice the technical idea of ​​the present invention. In describing the present invention, if it is determined that a detailed description of known technologies related to the present invention may unnecessarily obscure the gist of the present invention, a detailed description thereof will be omitted. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

[0052] Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless otherwise specified, a "first" component may also be a "second" component.

[0053] The present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and with various modifications. However, these embodiments are provided to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Therefore, the present invention is not limited to the embodiments disclosed below, but should be understood to include all modifications, equivalents, and substitutes included within the technical spirit and scope of the present invention, as well as substitutions or additions of the components of one embodiment with those of another embodiment.

[0054] The attached drawings are only intended to facilitate understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, or substitutes included in the spirit and technical scope of the present invention. In the drawings, the components may be expressed in an exaggerated size or thickness for convenience of understanding, etc., but the scope of protection of the present invention should not be construed as being limited thereby.

[0055] The terminology used in this specification is only used to describe specific implementations or examples and is not intended to limit the present invention. In addition, the singular expression includes the plural expression unless the context clearly indicates otherwise. In the specification, terms such as "comprises" and "consists of" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification. In other words, it should be understood that terms such as "comprises" and "consists of" in the specification do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0056] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0057] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0058] When a component is referred to as being "above" or "below" another component, it should be understood that it is not only positioned directly above that other component, but that there may also be other components intervening there.

[0059] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0060] Hereinafter, the present invention discloses a coil assembly and a cooking appliance including the same.

[0061] In this specification, when the cooking appliance is placed on the floor, the direction facing forward and backward relative to the center of the cooking appliance may be defined as the forward-backward direction. The direction perpendicular to the forward-backward direction of the cooking appliance may be defined as the left-right direction.

[0062]

[0063] [Overall structure of an induction heating cooktop]

[0064] FIG. 1 is an exploded perspective view showing an exploded state of an induction heating cooktop (100) in a cooking appliance according to one embodiment of the present invention.

[0065] A cooking appliance according to one embodiment of the present invention may be an oven range type in which a cooktop (100) is positioned on the upper side and an oven section is positioned on the lower side. The present invention is not limited thereto, and may be configured as a cooking appliance in which a cooktop (100) is provided alone.

[0066] Referring to FIG. 1, a cooking appliance according to an embodiment of the present invention includes an induction heating cooktop (100). The induction heating cooktop (100) may include a case (110) and a top plate (120).

[0067] According to the present embodiment, the exterior of the cooktop (100) can be formed by a case (110) and a top plate (120). The case (110) is placed below the top plate (120) and can form the front, back, side, and bottom surfaces of the cooktop (100). The top plate (120) is placed on the top of the cooktop (100) and can form the upper exterior surface of the cooktop (100). The top plate (120) can be formed of ceramic glass for holding a cooking vessel.

[0068] A receiving space may be formed inside the case (110). The receiving space formed inside the case (110) may be opened upward. As an example, the case (110) may be formed in a hexahedral shape with an open upper side. Various internal components constituting the cooktop (100) may be accommodated in the receiving space surrounded by the top plate (120) and the case (110).

[0069] In addition, the cooktop (100) may have an integrated PCB pattern coil assembly (140) disposed on the lower side of the top plate (120). The PCB pattern coil assembly (140) may have a plurality of heating coil layers in which at least one heating coil for heating a cooking vessel is disposed in a layered structure and a wiring layer in which wiring for connecting the heating coils is disposed, formed integrally.

[0070] For example, the PCB pattern coil assembly (140) may be configured in multiple pieces depending on the size of the top plate (120) of the cooktop (100). For example, if the top plate (120) is divided into three left areas, a center area, and a right area, three PCB pattern coil assemblies (140) may be placed on the lower side of the corresponding areas. Each of the PCB pattern coil assemblies (140) may be formed in a different size appropriate for the sizes of the left area, the center area, and the right area. Each of the PCB pattern coil assemblies (140) corresponding to each area may be driven independently.

[0071] The PCB pattern coil assembly (140) may be formed as an integrated unit, including a heating coil for induction heating, a temperature sensor for temperature detection, and wiring and terminals for connection with other components. The PCB pattern coil assembly (140) may be divided into a plurality of unit blocks. For example, one heating coil may be arranged in one unit block. For example, at least two temperature sensors may be arranged in one unit block. For example, two temperature sensors may be arranged between one unit block and another unit block.

[0072] In addition, a supporter (150) may be placed on the lower side of the PCB pattern coil assembly (140) of the cooktop (100). The supporter (150) may form a framework inside the cooktop (100) to support various internal components constituting the cooktop (100). As an example, the supporter (150) may be formed in a hexahedral shape with an open lower side. For example, the supporter (150) may be formed in a shape that is roughly an upside-down version of the case (110), and may be formed to have a size slightly smaller than the case (110).

[0073] According to the present embodiment, the accommodation space can be formed inside the supporter (150), and can be formed as a space surrounded by the bottom of the case (110) and the supporter (150). Various internal components constituting the cooktop (100) can be accommodated inside the supporter (150).

[0074] For example, the inside of the supporter (190) may accommodate a resonance PCB assembly (160) in which capacitors used for resonance or oscillation are mounted, an inverter PCB assembly (170) in which switching elements for applying current to a heating coil for induction heating are mounted, a fan (180) for cooling the heat of internal components, an EMI filter (190) for filtering and blocking various noises mixed in the power supply, and a control PCB assembly in which a controller for controlling the overall operation of the cooktop (100) and circuits for container detection are mounted.

[0075] According to the present embodiment, the supporter (150) can also provide a base function of the PCB pattern coil assembly (140). More specifically, a ferrite core can be installed on the upper side of the supporter (150), the PCB pattern coil assembly (140) can be installed on the upper side of the ferrite core, and a top plate (120) can be installed on the upper side of the PCB pattern coil assembly (140).

[0076] In addition, the cooktop (100) may be equipped with a control panel (130). The control panel (130) may be placed on an area of ​​the upper surface of the top plate (120). The control panel (130) may be equipped with a user interface (UI) including a control icon for controlling the operation of the cooktop (100) by touch and a display for indicating the operating status of the cooktop (100).

[0077]

[0078] [PCB pattern coil assembly]

[0079] FIG. 2 is a drawing showing a plan view of the cooktop (100) illustrated in FIG. 1 and the configuration of the PCB pattern coil assembly (140).

[0080] Referring to FIG. 2, a coil assembly according to one embodiment of the present invention includes a substrate and a plurality of heating elements disposed on the substrate. The coil assembly may be referred to as a PCB pattern coil assembly (140), and the heating elements may be referred to as heating coils (142).

[0081] A plurality of heating coils (142) are formed in a pattern of a rotating shape and are electrically connected through at least two layers, and the pattern of the plurality of heating coils (142) forms a plurality of turns on one layer, an inter-turn area is formed between the plurality of turns, and a temperature sensor (144) is arranged on another layer of the inter-turn area.

[0082] A central region without a pattern is formed in the center of the plurality of heating coils (142). On both sides of the central region of the plurality of heating coils (142), regions are formed in which the width of the inter-turn region among the plurality of turns is wider than that of other turns. A temperature sensor (144) is placed on another layer in the region in which the width of the inter-turn region is wider than that of other turns.

[0083] The temperature sensors (144) are arranged at a certain distance from each other. For example, the heating coil (142) and the temperature sensor (144) may be formed on the same substrate. In another example, the heating coil (142) and the temperature sensor (144) may be formed on different substrates. The substrate on which the heating coil (142) is formed and the substrate on which the temperature sensor (144) is formed may be electrically connected through a terminal portion.

[0084] A non-patterned region may be formed within the heating region of one of the plurality of heating coils (142), and a non-patterned region may be formed in the boundary region between the plurality of heating regions.

[0085] A temperature sensor (144) may be placed in a non-patterned area within the heating coil (142) area. A temperature sensor (144) may not be placed in a left-right boundary area among the boundary areas between heating coils. A temperature sensor (144) may be placed in a front-back boundary area among the boundary areas between heating sections.

[0086] At least four, and at most six, temperature sensors (144) may be placed in a non-pattern area of ​​two heating coils (142) arranged side by side in the left-right or front-back direction among a plurality of heating coils (142). Here, a temperature sensor (144) may not be placed in a boundary area between the heating coils (142) arranged side by side in the left-right direction.

[0087] When 4 heating elements are arranged in series or parallel, at least 12, and at most 14, temperature sensors (144) may be arranged in the non-pattern area of ​​the heating coil (142) region. Here, temperature sensors (144) may not be arranged in the boundary area between the heating coils that are parallel in the left and right directions.

[0088] The heating coil (142) may include a first heating coil (WC1) and a second heating coil (WC2) that are arranged adjacent to each other in the front-back direction, and a third heating coil (WC3) and a fourth heating coil (WC4) that are arranged adjacent to each other in the front-back direction and arranged adjacent to the first heating coil (WC1) and the second heating coil (WC) in the left-right direction.

[0089] Two sensing coils may be positioned within the first heating coil (WC1) and second heating coil (WC2) regions. Two sensing coils may be positioned in the boundary region between the first heating coil (WC1) and second heating coil (WC2).

[0090] Two sensing coils may be arranged within the third heating coil (WC3) and fourth heating coil (WC4) regions. Two sensing coils may be arranged in the boundary region between the third heating coil (WC3) and fourth heating coil (WC4). No sensing coils may be arranged in the boundary region between the first heating coil (WC1) and the second heating coil (WC2), and the third heating coil (WC3) and the fourth heating coil (WC4).

[0091] A cooktop (100) may include a case (110), a supporter (150), and a PCB pattern coil assembly (140). The PCB pattern coil assembly (140) may include a heating coil (142) for heating a container of the cooktop (100), wires (147) for connecting the heating coils and the combustible coil to a terminal (145), a temperature sensor (144), and wires for connecting the temperature sensor (144) to a connector (146). The PCB pattern coil assembly (140) may be placed in a receiving space inside the cooktop (100).

[0092] A supporter (150) may be placed on the upper part of the case (110), a PCB pattern coil assembly (140) may be placed on the upper part of the supporter (150), and a top plate (120) may be placed on the upper part of the PCB pattern coil assembly (140).

[0093] The PCB pattern coil assembly (140) may include a plurality of units depending on the size and shape of the cooktop (100). In the present embodiment, the cooktop (100) may be divided into a left region, a center region, and a right region, and a PCB pattern coil assembly (140) may be placed in each of the left region, the center region, and the right region.

[0094] Each PCB pattern coil assembly (140) can be divided into a plurality of unit blocks (141). The plurality of unit blocks (141) can be arranged in a matrix form. For example, at least one heating coil (142) can be arranged in one unit block (141). For example, at least two temperature sensors (144) can be arranged in one unit block (141). In addition, at least two temperature sensors (144) can be arranged between one unit block (141) and another unit block (141).

[0095] Each heating coil (142) formed on the PCB pattern coil assembly (140) may be arranged in a pattern shape. For example, the heating coil (142) may be formed in a polygonal, for example, square, rectangular, or hexagonal pattern. Alternatively, the heating coil (142) may be formed in a circular pattern.

[0096] Additionally, the PCB pattern coil assembly (140) may be formed with at least one heating coil terminal (145), at least one connector (146), at least one heating coil wire (147), at least one sensing wire (148), and at least one via. The heating coil terminal (145) is electrically connected to the heating coil (142) through the heating coil wire (147) and is electrically connected to the resonant PCB assembly (160) and the inverter PCB assembly (170). The connector (146) is electrically connected to the temperature sensor (144) through the sensing wire (148) and is electrically connected to the control PCB assembly.

[0097] The PCB pattern coil assembly (140) may include a plurality of heating coil layers in which heating coils (142) are formed in a pattern and a wiring layer in which wiring is formed in a pattern. For example, the plurality of heating coil layers may be formed in 10 to 12 layers, and the heating coils (142) between the layers may be electrically connected through vias. For example, the wiring layer may be formed in one layer and may be laminated on top of the plurality of heating coil layers, and the heating coils (142) and the heating coil wiring may be electrically connected through the vias.

[0098] Additionally, the heating coil layer may be provided in a form in which the heating coil is patterned on both sides of the substrate. In the present embodiment, the heating coil (142) may be patterned on each side of the heating coil layer, the temperature sensor (144) may be arranged on the upper surface of the wiring layer, and the heating coil wiring and the temperature sensor wiring may be patterned on at least one of the two sides of the wiring layer.

[0099] In this embodiment, it is exemplified that two temperature sensors (144) are respectively placed inside each heating coil (142) formation area, and two temperature sensors (144) are respectively placed between two heating coils (142) adjacent in the front-back direction.

[0100] As an example, a PCB pattern coil assembly (140) may be provided in a form in which a heating coil (142), heating coil wiring (147), temperature sensor (144), and detection wiring (148) are integrally formed.

[0101] For example, an integrated PCB pattern coil assembly (140) may include a heating coil layer including heating coil patterns arranged in a ten-layer structure, a wiring layer including a wiring pattern and a temperature sensor arranged in a single layer structure, and an insulating material disposed between the heating coil layer and the wiring layer to insulate them. The insulating material may be formed by curing a prepreg composed of a thermosetting resin and glass fiber, which are generally used to form a printed circuit board. As an example, an applicable thermosetting resin is preferably an epoxy resin series, and specifically, FR-4 can be applied.

[0102] Insulating material formed through prepreg in this manner can be positioned between each heating coil layer arranged in a layered structure to insulate them. Furthermore, the insulating material can be configured to fill in areas where patterns are not formed, such as heating coil patterns and wiring patterns, thereby forming a layered structure for each individual layer.

[0103] In this way, the present invention can contribute to the simplification of processes such as masking, printing, and etching by forming a heating coil, heating coil wiring, temperature sensor, and detection wiring into an integrated PCB pattern coil assembly.

[0104]

[0105] [Connection structure between heating coils of PCB pattern coil assembly]

[0106] FIG. 3 is a drawing showing a connection structure between series-connected heating coils in a coil assembly according to one embodiment of the present invention. As an example, the connection relationship between a first heating coil (WC1) and a second heating coil (WC2) is illustrated.

[0107] Referring to FIG. 3, the PCB pattern coil assembly (140) includes a first heating coil (WC1), a second heating coil (WC2), a first heating coil terminal (145a), a second heating coil terminal (145b), a third heating coil terminal (145c), a temperature sensor (144), and a connector (146).

[0108] The first heating coil (WC1) is formed in a pattern that rotates clockwise from the outer terminal (WC1a) toward the inner terminal (WC1b). The outer terminal (WC1a) of the first heating coil (WC1) is connected to the first heating coil terminal (145a) through a wire. Current is applied to the first heating coil terminal (145a). The current applied to the first heating coil terminal (145a) rotates clockwise along the pattern of the shape of the first heating coil (WC1).

[0109] The second heating coil (WC2) is formed in a pattern that rotates counterclockwise from the inner terminal (WC2a) toward the outer terminal (WC2b). The outer terminal (WC2b) of the second heating coil (WC2) is connected to the second heating coil terminal (145b) through a wire. A ground voltage is applied to the second heating coil terminal (145b). The second heating coil (WC2) is connected in series with the first heating coil (WC1). The current of the second heating coil (WC2) rotates counterclockwise along the pattern of the second heating coil (WC2).

[0110] The first heating coil (WC1) and the second heating coil (WC2) are connected in series. For example, the first heating coil (WC1) and the second heating coil (WC2) are connected in series through a wire that crosses the center of the first heating coil (WC1) and the second heating coil (WC2). The inner terminal (WC1b) of the first heating coil (WC1) and the inner terminal (WC2a) of the second heating coil (WC2) are connected to the third heating coil terminal (145c) through the wire that crosses the center of the first heating coil (WC1) and the second heating coil (WC2).

[0111] Among the intervals between the patterns of the first heating coil (WC1), the interval in the area where the temperature sensor (144) is placed may be spaced apart at a wider distance than the intervals in other areas where the temperature sensor (144) is not placed. In addition, the interval between the first heating coil (WC1) and the second heating coil (WC2) may be spaced apart at a certain distance or more so that the temperature sensor (144) can be placed. The interval in the area where the temperature sensor (144) is placed among the intervals between the patterns of the first heating coil (WC1) or the second heating coil (WC2) and the interval between the first heating coil (WC1) and the second heating coil (WC2) may be set to have the same value.

[0112] The first heating coil terminal (145a), the second heating coil terminal (145b), and the third heating coil terminal (145c) are arranged on one side of the PCB pattern coil assembly (140). For example, the third heating coil terminal (145c) is arranged on one side in the front-rear direction of the PCB pattern coil assembly (140), and the first heating coil terminal (145a) and the second heating coil terminal (145b) are arranged on the right side with respect to the third heating coil terminal (145c).

[0113] And, the connector (146) is arranged on one side of the PCB pattern coil assembly (140) in the front-back direction, such as the first heating coil terminal (145a), the second heating coil terminal (145b), and the third heating coil terminal (145c). The connector (146) is arranged on the left side with respect to the third heating coil terminal (145c). Or, conversely, the first heating coil terminal (145a) and the second heating coil terminal (145b) may be arranged on the left side with respect to the third heating coil terminal (145c), and the connector (146) may be arranged on the right side with respect to the third heating coil terminal (145c).

[0114] The first heating coil terminal (145a) is connected to the output terminal of the inverter circuit provided in the inverter PCB assembly (170). A first resonant capacitor may be further connected between the first heating coil terminal (145a) and the output terminal of the inverter circuit. The current applied from the inverter circuit resonates with a resonant frequency determined by the first heating coil (WC1) and the first resonant capacitor, and is supplied to the first heating coil (WC1) through the first heating coil terminal (145a).

[0115] The current of the first heating coil (WC1) rotates clockwise along the pattern of the first heating coil (WC1) rotating clockwise from the outside toward the center of the inside.

[0116] The second heating coil terminal (145b) is connected to the ground voltage terminal. A second resonant capacitor may be further connected between the second heating coil terminal (145b) and the ground voltage terminal.

[0117] The first heating coil terminal (145a), the first heating coil (WC1), the second heating coil (WC1), and the second heating coil terminal (145b) form a current path. The resonant current output from the inverter circuit flows through the first heating coil terminal (145a), the first heating coil (WC1), the second heating coil (WC1), and the second heating coil terminal (145b). At this time, the current of the first heating coil (WC1) rotates clockwise, and the current of the second heating coil (WC2) rotates counterclockwise.

[0118] The first heating coil (WC1) and the second heating coil (WC2) can generate a magnetic field whose magnetic field directions cancel each other out by forming a pattern so that the current flows in opposite directions. The first heating coil (WC1) and the second heating coil (WC2) can generate a magnetic field whose magnetic field directions cancel each other out by being connected in series so that the polarities are opposite. The first heating coil (WC1) and the second heating coil (WC2) generate a magnetic field in a direction in which the magnetic field directions cancel each other out, thereby generating a magnetic field in the container by electromagnetic induction. The magnetic field generated by electromagnetic induction superimposes eddy currents in the container, and the eddy currents superimposed in the container increase the heating performance and efficiency of the cooking appliance.

[0119] The third heating coil terminal (145c) is connected to the first heating coil (WC1) and the second heating coil (WC2) through a wire that crosses the centers of the first heating coil (WC1) and the second heating coil (WC2). The third heating coil terminal (145c) is arranged on one side of the PCB pattern coil assembly (140) so as to be connected to the centers of the first heating coil (WC1) and the second heating coil (WC2).

[0120] The first heating coil terminal (145a) and the second heating coil terminal (145b) may be arranged on the right side with respect to the third heating coil terminal (145c). Or, conversely, the first heating coil terminal (145a) and the second heating coil terminal (145b) may be arranged on the left side with respect to the third heating coil terminal (145c).

[0121] The connector (146) may be positioned on the left side with respect to the third heating coil terminal (145c). Alternatively, the connector (146) may be positioned on the right side with respect to the third heating coil terminal (145c). The connector (146) may have multiple connection ports. Multiple temperature sensors (144) may be connected to corresponding connection ports of the connector (146) through respective detection wires (148).

[0122] The outer terminal (WC1a) of the first heating coil (WC1) is connected to the first heating coil terminal (145a), and the inner terminal (WC1b) of the first heating coil (WC1) is connected to the third heating coil terminal (145c) through a heating coil wiring (147) that crosses the center of the first heating coil (WC1). Through this connection structure, the heating coil wiring connected to the first heating coil terminal (145a) and the outer terminal (WC1a) of the first heating coil (WC1) and the heating coil wiring connected to the second heating coil terminal (145b) and the outer terminal (WC2b) of the second heating coil (WC2) have an optimal arrangement structure.

[0123] The third heating coil terminal (145c) is connected to the inner terminal of the first heating coil (WC1) and the inner terminal of the second heating coil (WC2) through a heating coil wiring (147) that crosses the centers of the first heating coil (WC1) and the second heating coil (WC2), and is arranged on one side of the PCB pattern assembly (140). This connection and arrangement structure implements an optimal wiring route.

[0124] The first heating coil terminal (145a) and the second heating coil terminal (145b) are arranged on the left or right side with respect to the third heating coil terminal (145c). This arrangement structure can secure space for the wires of a plurality of heating coils (142) and the wires of a plurality of temperature sensors (144).

[0125] In addition, by arranging the first heating coil terminal (145a) and the second heating coil terminal (145b) connected to the first heating coil (WC1) and the second heating coil (WC2) connected in series, respectively, on the same side of the PCB pattern assembly (140), it is possible to secure a space for arranging the wiring of a plurality of detection coils (143) and a plurality of temperature sensors (144).

[0126]

[0127] [Connection relationship between inverter circuit and heating coil]

[0128] FIG. 4 is a diagram showing a connection structure between heating coils connected in series and parallel in a cooking appliance according to one embodiment of the present invention. As an example, FIG. 4 illustrates a connection relationship between a first heating coil (WC1), a second heating coil (WC2), a third heating coil (WC3), and a fourth heating coil (WC4). FIG. 5 is a circuit diagram showing a connection relationship between an inverter circuit and heating coils connected in series and parallel in a cooking appliance according to one embodiment of the present invention.

[0129] Referring to FIGS. 4 and 5, the PCB pattern coil assembly (140) includes a first heating coil (WC1), a second heating coil (WC2), a third heating coil (WC3), and a fourth heating coil (WC4).

[0130] The first heating coil (WC1) is connected to the first heating coil terminal (145a) and is formed in a pattern that rotates clockwise from the outside toward the center of the inside. The second heating coil (WC2) is connected to the second heating coil terminal (145b) and is formed in a pattern that rotates counterclockwise from the center of the inside toward the outside.

[0131] The third heating coil (WC3) is connected to the fourth heating coil terminal (145d) and is formed in a pattern that rotates counterclockwise from the inner center toward the outer side. The fourth heating coil (WC4) is connected to the fifth heating coil terminal (145e) and is formed in a pattern that rotates clockwise from the outer side toward the inner center.

[0132] The first heating coil (WC1) and the second heating coil (WC2) are connected in series, and the third heating coil (WC3) and the fourth heating coil (WC4) are connected in series. In addition, the first heating coil (WC1) and the second heating coil (WC2) connected in series, and the third heating coil (WC3) and the fourth heating coil (WC4) connected in series are connected in parallel to each other.

[0133] For example, the inner terminal (WC1b) of the first heating coil (WC1) and the inner terminal (WC2a) of the second heating coil (WC2) are connected in series through heating coil wiring that crosses the centers of the first heating coil (WC1) and the second heating coil (WC2).

[0134] The inner terminal (WC3b) of the third heating coil (WC3) and the inner terminal (WC4a) of the fourth heating coil (WC4) are connected in series through heating coil wiring that crosses the centers of the third heating coil (WC3) and the fourth heating coil (WC4).

[0135] The first heating coil (WC1) and the third heating coil (WC3) are connected to the output terminal of the inverter circuit through the first heating coil terminal (145a) and the fourth heating coil terminal (145d), and the second heating coil (WC2) and the fourth heating coil (WC4) are connected to the ground voltage terminal through the second heating coil terminal (145b) and the fifth heating coil terminal (145e).

[0136] The first heating coil (WC1) receives current supplied from the inverter circuit through the first heating coil terminal (145a). At this time, the current of the first heating coil (WC1) flows clockwise along the heating coil pattern that rotates clockwise from the outside toward the center of the inside.

[0137] The second heating coil (WC2) receives current supplied from the first heating coil (WC1) through its inner terminal. At this time, the current of the second heating coil (WC2) flows in a counterclockwise direction along a heating coil pattern that rotates counterclockwise from the center of the inner side toward the outer side.

[0138] The third heating coil (WC3) receives current supplied from the inverter circuit (320) through the fourth heating coil terminal (145d). At this time, the current of the third heating coil (WC3) flows in a counterclockwise direction along the heating coil pattern that rotates counterclockwise from the outside toward the center of the inside.

[0139] The fourth heating coil (WC4) receives current supplied from the third heating coil (WC3) through its inner terminal. At this time, the current of the fourth heating coil (WC4) flows in a clockwise direction along the heating coil pattern that rotates clockwise from the center of the inner side toward the outer side.

[0140] In this way, the current of the first heating coil (WC1) flows in the opposite direction to the adjacent second heating coil (WC2) in the forward-backward reverberation direction and the adjacent third heating coil (WC3) in the left-right direction. In addition, the current of the fourth heating coil (WC1) flows in the opposite direction to the adjacent third heating coil (WC3) in the forward-backward reverberation direction and the adjacent second heating coil (WC2) in the left-right direction.

[0141] Additionally, the first heating coil (WC1) and the second heating coil (WC2) are connected with opposite polarities. The third heating coil (WC3) and the fourth heating coil (WC4) are connected with opposite polarities.

[0142] Additionally, the PCB pattern coil assembly (140) includes a first heating coil terminal (145a), a second heating coil terminal (145b), a third heating coil terminal (145c), a fourth heating coil terminal (145d), a fifth heating coil terminal (145e), and a sixth heating coil terminal (145f). Additionally, the PCB pattern coil assembly (140) further includes a heating coil wire (147), a sensing wire (148), a plurality of temperature sensors (144), and a connector (146).

[0143] The first heating coil terminal (145a), the second heating coil terminal (145b), the third heating coil terminal (145c), the fourth heating coil terminal (145d), the fifth heating coil terminal (145e), the sixth heating coil terminal (145f) and the connector (146) are arranged on one side of the PCB pattern coil assembly (140).

[0144] For example, the first heating coil terminal (145a) and the second heating coil terminal (145b) are arranged on the right side with respect to the third heating coil terminal (145c), and the connector (146) is arranged on the left side with respect to the third heating coil terminal (145c). The fourth heating coil terminal (145d) and the fifth heating coil terminal (145e) are arranged on the left side with respect to the sixth heating coil terminal (145f), and the connector (146) is arranged on the right side with respect to the sixth heating coil terminal (145f).

[0145] Additionally, the cooking appliance includes a rectifier circuit (not shown), an inverter circuit (320), a plurality of resonant capacitors (CS1, CS2, CS3, CS4), a plurality of heating coils (WC1, WC2, WC3, WC4), and a plurality of relays (RL1, RL2, RL3, RL4).

[0146] The rectifier circuit converts an alternating voltage whose magnitude and polarity (positive voltage or negative voltage) change over time into a direct current voltage whose magnitude and polarity are constant, and converts an alternating current whose magnitude and direction (positive current or negative current) change over time into a direct current whose magnitude and polarity are constant, and provides the converted current to the inverter circuit (320).

[0147] The inverter circuit (320) receives an input voltage from a rectifier circuit, and switches and drives the first switching element (DS1) and the second switching element (DS2) according to the control of the controller to supply current to the resonant capacitor and the heating coil. At this time, the current output from the inverter circuit (320) resonates at a resonant frequency determined according to the capacitance value of the resonant capacitor and the inductance value of the heating coil.

[0148] The inverter circuit (320) may include a first inverter circuit and a second inverter circuit. The first inverter circuit may supply current to the first to fourth heating coils (WC1, WC2, WC3, WC4), and the second inverter circuit may supply current to the fifth to eighth heating coils. At least one of the first to fourth heating coils (WC1, WC2, WC3, WC4) and the fifth to eighth heating coils may be selectively connected in series or in parallel through at least one of the first to fourth relays (RL1, RL2, RL3, RL4).

[0149] This inverter circuit (320) includes a plurality of switching elements, for example, a first switching element (DS1) and a second switching element (DS2). The first switching element (DS1) and the second switching element (DS2) are connected in series with each other between a high-potential voltage terminal and a low-potential voltage terminal. This inverter circuit (320) outputs current according to the switching operation of the first switching element (DS1) and the second switching element (DS2).

[0150] The inverter circuit (320) supplies resonant current to the first heating coil (WC1) and the second heating coil (WC2) or the third heating coil (WC3) and the fourth heating coil (WC4) according to the switching operation of the first switching element (DS1) and the second switching element (DS2). The resonant frequency of the resonant current is determined by the inductance value of the heating coil and the capacitance value of the resonant capacitor.

[0151] The first switching element (DS1) and the second switching element (DS2) can be alternately turned on and off under the control of the controller. The alternate turning on and off of the first switching element (DS1) and the second switching element (DS2) can be referred to as switching driving of the first switching element (DS1) and the second switching element (DS2).

[0152] A resonant current is generated by the switching operation of the first switching element (DS1) and the second switching element (DS2), and when the resonant current is supplied to the heating coil, a magnetic field is formed, and an eddy current flows in a container provided on the upper part of the heating coil through electromagnetic induction, thereby heating the container.

[0153] The inverter circuit (320) further includes a first snubber capacitor (SC1) and a second snubber capacitor (SC2). The first snubber capacitor (SC1) is connected in parallel with the first switching element (DS1), and the second snubber capacitor (SC2) is connected in parallel with the second switching element (SW2). The first snubber capacitor (SC1) and the second snubber capacitor (SC2) are connected in series with each other.

[0154] The first snubber capacitor (SC1) and the second snubber capacitor (SC2) serve to reduce power loss due to hard switching that occurs when the first switching element (DS1) and the second switching element (DS2) are turned off.

[0155] This inverter circuit (320) supplies current to the load circuit according to the switching operation of the first switching element (DS1) and the second switching element (DS2). The load circuit includes a plurality of heating coils (WC1, WC2, WC3, WC4), a plurality of resonant capacitors (CS1, CS2, CS3, CS4), and a plurality of relays (RL1, RL2, RL3, RL4).

[0156] A first resonant capacitor (CS1) may be further connected between the output terminal of the inverter circuit (320) and the first heating coil (WC1). In addition, a second resonant capacitor (CS2) and a first relay (RL1) may be further connected between the second heating coil (WC2) and the ground voltage terminal.

[0157] Additionally, a third resonance capacitor (CS3) may be further connected between the output terminal of the inverter circuit (320) and the third heating coil (WC3). Additionally, a fourth resonance capacitor (CS4) and a second relay (RL2) may be further connected between the fourth heating coil (WC4) and the ground voltage terminal.

[0158] Additionally, a third relay (RL3) may be further connected between the third heating coil terminal (145c) and other heating coils of the PCB pattern coil assembly (140). Additionally, a fourth relay (RL4) may be further connected between the sixth heating coil terminal (145f) and other heating coils of the PCB pattern coil assembly (140).

[0159] The resonant capacitors (CS1, CS2, CS3, CS4) can be used to filter the DC component in the output current of the inverter circuit (320). The heating coils (WC1, WC2, WC3, WC4) can be used to heat the cooking vessel using electromagnetic induction. In addition, the heating coils (WC1, WC2, WC3, WC4) can be used to detect the vessel being seated on the top plate. For example, the vessel can be detected by detecting the impedance change of the heating coils (WC1, WC2, WC3, WC4).

[0160] Relays (RL1, RL2, RL3, RL4) can be used to selectively connect other heating coils driven by other inverter circuits (WC1, WC2, WC3, WC4) in series or parallel. In addition, the resonant frequency of the output current of the inverter circuit (320) can be determined according to the inductance values ​​of the heating coils (WC1, WC2, WC3, WC4) that are selectively connected in series or in parallel and the capacitance values ​​of the resonant capacitors (CS1, CS2, CS3, CS4).

[0161] The load circuit may include a first resonant capacitor (CS1) that transmits a resonant current supplied from an inverter circuit (320), a first heating coil (WC1) connected in series to the first resonant capacitor (CS1), a second heating coil (WC2) connected in series to the first heating coil (WC1), a second resonant capacitor (CS2) connected in series to the second heating coil (WC2), and a first relay (RL1) that switches the second resonant capacitor (CS2) and a ground voltage terminal.

[0162] In addition, the load circuit may further include a third resonant capacitor (CS3) that transmits a resonant current supplied from an inverter circuit (320), a third heating coil (WC3) connected in series to the third resonant capacitor (CS3), a fourth heating coil (WC4) connected in series to the third heating coil (WC3), a fourth resonant capacitor (CS4) connected in series to the fourth heating coil (WC4), and a second relay (RL2) that switches the fourth resonant capacitor (CS4) and a ground voltage terminal.

[0163] Additionally, the load circuit may further include a third relay (RL3) that switches the connection between the node between the first heating coil (WC1) and the second heating coil (WC2) and other heating coils driven by other inverter circuits. Additionally, the load circuit may further include a fourth relay (RL4) that switches the connection between the node between the third heating coil (WC3) and the fourth heating coil (WC4) and other heating coils driven by other inverter circuits.

[0164] The first to fourth relays (RL1, RL2, RL3, RL4) can be selectively turned on depending on the size of the container. For example, when the first relay (RL1) and the third relay (RL3) are turned on, current can flow through the first heating coil (WC1), the second heating coil (WC3), and the other heating coils. At this time, the currents of the first heating coil (WC1) and the second heating coil (WC2) rotate in opposite directions, and the currents of the second heating coil (WC2) and the other heating coils rotate in opposite directions.

[0165] Additionally, for example, when the second relay (RL2) and the fourth relay (RL4) are turned on, current may flow through the third heating coil (WC3), the fourth heating coil (WC4), and other heating coils. At this time, the currents of the third heating coil (WC3) and the fourth heating coil (WC4) rotate in opposite directions, and the currents of the fourth heating coil (WC2) and the seventh heating coil (WC7) rotate in opposite directions.

[0166] At least one of the first relay (RL1), the second relay (RL2), the third relay (RL3), and the fourth relay (RL4) can be turned on to form a current path depending on the size of the container. For example, when the first relay (RL1) is turned on, currents rotating in opposite directions flow through the first heating coil (WC1) and the second heating coil (WC2), forming a magnetic field, and a magnetic field is formed in the container by electromagnetic induction. At this time, the first heating coil (WC1) and the second heating coil (WC2) generate magnetic fields in a direction in which the magnetic field directions cancel each other, thereby superimposing the eddy current of the container, which increases the heating performance and efficiency of the cooking appliance.

[0167] When the first relay (RL1) and the second relay (RL2) are turned on, currents rotating in opposite directions flow through the first heating coil (WC1) and the second heating coil (WC2), thereby forming a magnetic field, and currents rotating in opposite directions flow through the third heating coil (WC3) and the fourth heating coil (WC4), thereby forming a magnetic field. At this time, the first heating coil (WC1) and the second heating coil (WC2), and the third heating coil (WC3) and the fourth heating coil (WC4) generate magnetic fields in directions in which the magnetic field directions cancel each other out, thereby superimposing the eddy currents of the container, which increases the heating performance and efficiency of the cooking appliance.

[0168] In this way, the present invention connects the heating coils in series, between adjacent heating coils in the front-back direction, and between adjacent heating coils in the left-right direction so that the current flows in opposite directions, thereby allowing the magnetic fields to cancel each other out. This superimposes the eddy currents of the container, thereby increasing the heating performance and efficiency of the cooking appliance.

[0169]

[0170] [Laminated structure and connection structure of PCB pattern assembly]

[0171] Fig. 6a is a schematic cross-sectional view illustrating the structure of an integrated PCB pattern assembly in a cooking appliance according to the first embodiment. Fig. 6b is a plan view of the wiring layer illustrated in Fig. 6a. Fig. 9 is a plan view of the first to tenth heating coil layers illustrated in Fig. 6a.

[0172] Referring to FIGS. 6a, 6b and 9, in a cooking appliance according to the first embodiment, an integrated PCB pattern assembly (140) includes a plurality of heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and a wiring layer (147L). The cooking appliance according to the first embodiment detects a container by utilizing a change in impedance of the heating coil.

[0173] A heating coil (142) used for container detection and container heating is formed in each of a plurality of heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j), and the plurality of heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) are stacked in the vertical direction.

[0174] A wiring layer (147L) is laminated on top of a plurality of heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j), and a temperature sensor (144) is arranged on the wiring layer (147L), and a detection wire (148) and a heating coil wire (147) are formed. The detection wire (148) connects each of the plurality of temperature sensors (144) arranged on the wiring layer (147L) to a connector (146). The heating coil wiring (147) connects a plurality of heating coils arranged in a plurality of heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) to the heating coil terminal (145).

[0175] For example, the PCB pattern assembly (140) may include first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and a wiring layer (147L).

[0176] The first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) are stacked in the vertical direction, and a plurality of heating coils are formed in each of them.

[0177] The wiring layer (147L) is stacked on top of the first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j), and a plurality of temperature sensors (144) are arranged. The plurality of temperature sensors (144) can be connected to a connector (146) through a detection wire (148) arranged on the upper surface or the lower surface of the wiring layer (147L).

[0178] The wiring layer (147L) is provided with heating coil wiring (147) that interconnects the heating coils or connects the heating coils to the heating coil terminals (145). The first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and the wiring layer (147L) may include at least one via formed in a vertical direction. Through this via, the heating coils and the wiring of the heating coils may be electrically connected in the vertical direction.

[0179] At least one temperature sensor (144) can be placed on the wiring layer (147) at a position corresponding to both sides of the center of the heating coil and at a position between the heating coils that are adjacent to each other in the front-back direction.

[0180] The first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) may include the first to eighth heating coils having a layered structure.

[0181] The first heating coil (WC1) is formed in a pattern that rotates clockwise from the outside toward the inside. The second heating coil (WC2) is connected in series with the first heating coil (WC1) and is formed in a pattern that rotates counterclockwise from the inside toward the outside.

[0182] The third heating coil (WC3) is arranged vertically adjacent to the first heating coil (WC1) and is formed in a pattern that rotates counterclockwise from the outside toward the inside. The fourth heating coil (WC4) is connected in series with the third heating coil (WC3) and is formed in a pattern that rotates clockwise from the inside toward the outside. The fifth to eighth heating coils may be formed in a pattern that is symmetrical with respect to the first to fourth heating coils.

[0183] The first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and the wiring layer (147L) include a first outer terminal (WC1a) connected to the outer side of the first heating coil (WC1), a first inner terminal (WC1b) connected in the vertical direction and connected to the inner side of the first heating coil (WC1), a second outer terminal (WC2b) connected in the vertical direction and connected to the outer side of the second heating coil (WC2), and a second inner terminal (WC2a) connected in the vertical direction and connected to the inner side of the second heating coil. The first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and the wiring layer (147L) are electrically connected through the first outer terminal (WC1a), the first inner terminal (WC1b), the second outer terminal (WC2b), and the second inner terminal (WC2a) and the heating coil wiring (147).

[0184] Each of the first outer terminal (WC1a), the first inner terminal (WC1b), the second inner terminal (WC2a), and the second outer terminal (WC2b) is vertically connected to the first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and the wiring layer (147L) through at least one via.

[0185] In the wiring layer (147L), a first heating coil terminal (145a), a second heating coil terminal (145b), a third heating coil terminal (145c) and a connector (146) are arranged on one side in the front-rear direction.

[0186] The first heating coil terminal (145a) is connected to the output terminal of the inverter circuit, and the second heating coil terminal (145b) is connected to the ground voltage terminal. The third heating coil terminal (145c) is connected between other heating coils. The connector (146) is connected to the container detection circuit. The container detection circuit detects changes in the equivalent resistance and equivalent inductance of the heating coil, and detects at least one of the presence or absence of the container and the material thereof based on the value of the change.

[0187] The first heating coil terminal (145a) and the first outer terminal (WC1a) are connected through a first heating coil wiring arranged on one side of the wiring layer (147L), and the second heating coil terminal (145b) and the second outer terminal (WC2b) are connected through a second heating coil wiring crossing one side of the wiring layer (147L). The first inner terminal (WC1b) and the second inner terminal (WC2a) are interconnected through a third heating coil wiring crossing the center of the wiring layer (147L) and are connected to a third heating coil terminal (145c).

[0188] A temperature sensor (144) is further arranged in the wiring layer (147L). A sensing wire (148) that connects the temperature sensor (144) to the connector (146) is further arranged in the wiring layer (147L).

[0189] The first heating coil terminal (145a) and the second heating coil terminal (145b) may be arranged on the right or left side with respect to the third heating coil terminal (145c) in the wiring layer (147L). The connector (146) may be arranged on the left or right side with respect to the third heating coil terminal (145c) in the wiring layer (147L).

[0190] In addition, for example, the first to fifth heating coil layers (142a, 142b, 142c, 142d, 142e) may be configured to have a heating coil pattern formed thereon, but a first type pattern configured such that the direction of travel or winding of individual pattern strands becomes the first direction. In addition, for example, the sixth to tenth heating coil layers (142f, 142g, 142h, 142i, 142j) may be configured to have a heating coil pattern formed thereon, but a second type pattern configured such that the direction of travel or winding of individual pattern strands becomes the second direction.

[0191] At this time, the first to third heating coil wirings formed in the wiring layer (147L), the first type patterns arranged in the first to fifth heating coil layers (142a, 142b, 142c, 142d, 142e), and the second type patterns arranged in the sixth to tenth heating coil layers (142f, 142g, 142h, 142i, 142j) can be connected in batches through vias that are continuously formed to penetrate from the wiring layer (147L) to the tenth heating coil layer (142j).

[0192] Additionally, in the first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and the wiring layer (147L), an insulating layer may be further formed between each layer.

[0193] Additionally, the PCB pattern assembly (140) may be provided with a light-transmitting slit hole (H_sl) formed penetrating from the wiring layer (147L) to the first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j).

[0194] A light source module can be placed below the light projection slit hole (H_sl), and visible light generated from the light source module can pass through the light projection slit hole and be irradiated to the lower surface of the top plate. Through this, a linearly extending display line can be formed on the top plate.

[0195] In order to implement a linearly extended display line, the light transmitting slit hole (H_sl) may be linearly extended corresponding to the shape of the display line. However, as illustrated, in order to prevent the rigidity of the PCB pattern assembly (140) from rapidly deteriorating, the light transmitting slit hole (H_sl) may be formed by being divided into a plurality of pieces, and the divided light transmitting slit holes (H_sl) may be arranged linearly.

[0196] In this way, the cooking appliance according to the embodiment of the present invention can be configured as an integrated PCB pattern assembly by laminating a wiring layer in which wirings are formed on top of a heating coil layer in which a heating coil is formed.

[0197] The present invention can reduce the thickness of an integrated PCB pattern assembly by connecting a heating coil and a wiring of the heating coil in a vertical direction through a via.

[0198] The present invention can optimally arrange the wires of a plurality of heating coils by arranging wires crossing the heating coils in a wiring layer, connecting the heating coils through these wires, and connecting the heating coils and heating coil terminals, temperature sensors, and connectors.

[0199] The present invention can secure a space for arranging multiple temperature sensors by arranging at least one temperature sensor in a wiring layer at positions corresponding to both sides of the center of the heating coil and at positions between the heating coils arranged adjacently in the front-back direction.

[0200] The present invention can contribute to the simplification of processes such as masking, printing, and etching by forming a plurality of heating coils having a layered structure in a heating coil layer, forming heating coil wires connecting the heating coils in a wiring layer, and forming the heating coil layer and the wiring layer into an integrated PCB pattern assembly.

[0201] The present invention can implement an optimal wiring route by arranging heating coil wiring that interconnects heating coils or connects heating coils to terminals in a wiring layer so as to cross the heating coils.

[0202] Fig. 7a is a schematic cross-sectional view illustrating the structure of an integrated PCB pattern assembly in a cooking appliance according to a second embodiment. Fig. 7b is a plan view of the sensing coil layer illustrated in Fig. 7a.

[0203] Referring to FIGS. 7a and 7b, a cooking appliance according to the second embodiment includes a plurality of heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j), a wiring layer (147L), and a detection coil layer (143b'). The plurality of heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and the wiring layer (147L) are formed as an integrated PCB pattern assembly (140), and the detection coil layer (143b') is disposed on the wiring layer (147L). The cooking appliance according to the second embodiment detects a container using a plurality of detection coils formed in the detection coil layer (143b').

[0204] The description of the multiple heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and the wiring layer (147L) is replaced with the description of FIGS. 6a and 6b.

[0205] A plurality of sensing coils (143) and sensing wires (148) are arranged in the sensing coil layer (143b'). The plurality of sensing coils (143) are connected to a connector (146) through the sensing wires (148). Fig. 7a illustrates one sensing coil layer (143b'), but is not limited thereto. The sensing coil layer may be formed of at least two layers.

[0206] In the detection coil layer (143b'), two detection coils (143) may be arranged in a position overlapping one heating coil. Additionally, two detection coils (143) may be arranged in an overlapping position between one heating coil and another heating coil.

[0207] Fig. 8a is a schematic cross-sectional view illustrating the structure of an integrated PCB pattern assembly in a cooking appliance according to a third embodiment. Fig. 8b is a plan view of the wiring layer illustrated in Fig. 8a. Fig. 8c is a plan view of the sensing coil layer illustrated in Fig. 8a.

[0208] Referring to FIGS. 8a to 8c, the cooking appliance according to the third embodiment includes a plurality of heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j), a wiring layer (147L'), and a detection coil layer (143a').

[0209] A plurality of heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and a wiring layer (147L') are formed as an integrated PCB pattern assembly (140), and a detection coil layer (143a') is disposed on the wiring layer (147L'). The cooking appliance according to the second embodiment detects a container using a plurality of detection coils formed on the detection coil layer (143a'). The difference of the third embodiment compared to the first and second embodiments is that the temperature sensor (144) is disposed on the detection coil layer (143a').

[0210] The description of the multiple heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) is replaced by the description of FIGS. 6a and 6b.

[0211] The wiring layer (147L') is provided with heating coil wiring (147) that interconnects heating coils or connects heating coils to heating coil terminals (145). The first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and the wiring layer (147L') may include at least one via formed in a vertical direction. Through this via, the heating coil having a layered structure and the heating coil wiring may be vertically connected.

[0212] In the first to tenth heating coil layers (142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142i, 142j) and the wiring layer (147L), each of the first outer terminal (WC1a), the first inner terminal (WC1b), the second inner terminal (WC2a), and the second outer terminal (WC2b) is connected in the vertical direction through at least one via. In the wiring layer (147L), the first heating coil terminal (145a), the second heating coil terminal (145b), and the third heating coil terminal (145c) are arranged on one side in the front-rear direction.

[0213] A plurality of sensing coils (143) and sensing wires (148) are arranged in the sensing coil layer (143a'). The plurality of sensing coils (143) are connected to a connector (146) through the sensing wires (148). Fig. 8c illustrates one sensing coil layer (143a'), but is not limited thereto. The sensing coil layer may be formed of at least two layers, the sensing coils may be formed on the upper surface or the lower surface, and the sensing coils (143) may be electrically connected through vias (149).

[0214] In the detection coil layer (143a'), two detection coils (143) may be arranged in a position overlapping one heating coil. Additionally, two detection coils (143) may be arranged in an overlapping position between one heating coil and another heating coil.

[0215] Additionally, in the detection coil layer (143a'), a temperature sensor (144) may be placed at the center of each detection coil (143). The detection coil (143) and the temperature sensor (144) may be connected to a connector (146) placed on one side of the detection coil layer (143a') through a detection wire (148).

[0216]

[0217] [Container Detection Sensor and Overall Operation of Container Detection]

[0218] Fig. 10 is a circuit diagram of a container detection sensor in a cooking appliance according to an embodiment of the present invention. Fig. 11 is a diagram for explaining the operation of the container detection sensor illustrated in Fig. 10. Fig. 12 is a diagram showing the equivalent resistance variation ratio by container material according to the oscillation frequency of the container detection sensor in a cooking appliance according to an embodiment of the present invention. Fig. 13 is a diagram showing the connection relationship between a container detection sensor and a controller in a cooking appliance according to an embodiment of the present invention.

[0219] FIGS. 10 to 13 illustrate, in a cooking appliance according to the first embodiment, a container detection sensor (200) detects a cooking container using a plurality of heating coils (142) arranged in a heating coil layer, but is not limited thereto. In a cooking appliance according to the second and third embodiments, a container detection sensor (200) can detect a cooking container using a plurality of detection coils (143) arranged in a detection coil layer.

[0220] Referring to FIGS. 10 to 13, a cooking appliance according to an embodiment of the present invention includes a container detection sensor (200) and a controller (500). The container detection sensor (200) detects a cooking container placed on a top plate (120) of a cooktop (100) and provides a container detection signal based on the detection to the controller (500). The controller (500) controls the operation of the container detection sensor (200) and determines container information including at least one of a position, material, shape, and size of the container based on the container detection signal received from the container detection sensor (200).

[0221] The container detection sensor (200) includes a container detection circuit (200a) and a detection output circuit (200b). The container detection circuit (200a) stores oscillation energy in a heating coil (142) or outputs an oscillation signal that freely resonates according to a driving signal (DS) of a controller (500). The detection output circuit (200b) filters the DC component from the oscillation signal received from the container detection circuit (200a), compares the filtered oscillation signal with a reference signal, and outputs a container detection signal according to the comparison result to the controller (500).

[0222] In this embodiment, the container detection circuit (200a) includes a heating coil (142), an oscillation circuit (220), and an oscillation driving circuit (210).

[0223] When a container is placed on the top plate (120) of the cooktop (100), the heating coil (142) is electromagnetically coupled with the container to form an equivalent resistance (Req) and an equivalent inductance (Leq). As described above, the heating coil (142) is formed in a multi-layered pattern and is arranged in multiple pieces.

[0224] The oscillation circuit (220) is electrically connected to the heating coil (142) and generates an oscillation signal that resonates with an oscillation frequency determined by the inductance of the heating coil (142) and the capacitance of the oscillation capacitor. The oscillation circuit (220) may be connected in parallel with the heating coil (142). The oscillation circuit (220) may include at least one oscillation capacitor. In the present embodiment, the oscillation circuit (220) is exemplified as including two oscillation capacitors (Ca, Cb).

[0225] The oscillation circuit (220) may include a first oscillation capacitor (Ca), a second oscillation capacitor (Cb), and a control switch (SW2). The first oscillation capacitor (Ca) is connected in parallel with the heating coil (142), the second oscillation capacitor (Cb) is connected in parallel with the first oscillation capacitor (Ca), and the control switch (SW2) is connected in parallel with the first oscillation capacitor (Ca) and in series with the second oscillation capacitor (Cb). The control switch (SW2) is used to control the oscillation frequency.

[0226] The adjustment switch (SW2) can be turned on or off under the control of the controller (500). When the adjustment switch (SW2) is turned off, the oscillation frequency is determined by the inductance of the detection coil (143) and the capacitance of the first oscillation capacitor (Ca). The oscillation frequency at which the adjustment switch (SW2) is turned on is determined by the inductance of the heating coil (142) and the capacitances of the first oscillation capacitor (Ca) and the second oscillation capacitor (Cb).

[0227] This oscillation circuit (220) adjusts the oscillation frequency of the oscillation signal by adjusting the capacitance value according to the switching of the adjustment switch (SW2). This oscillation frequency adjustment can improve the performance of the container material discrimination by increasing the variation ratio of the equivalent resistance (Req) according to the container material when the container detection sensor (200) discriminates the container material, for example, between a magnetic container and a non-magnetic container, or between a ferromagnetic container and a weakly magnetic container.

[0228] The oscillation driving circuit (210) includes a driving switch (SW1), and drives the heating coil (142) and the oscillation circuit (220) so that the heating coil (142) stores oscillation energy or the oscillation circuit (220) outputs an oscillation signal to the detection output circuit (200b) according to the driving of the driving switch (SW1). When the driving switch (SW1) is turned on, the oscillation energy by the power voltage (Vdd) is stored in the heating coil (142). When the driving switch (SW1) is turned off, the oscillation energy stored in the heating coil (142) freely resonates through the oscillation circuit (220) and is output as an oscillation signal that freely resonates with an oscillation frequency.

[0229] In this embodiment, the oscillation driving circuit (210) is exemplified as including a first resistor (R1), a first diode (D1), a driving switch (SW1), a second resistor (R2), a third resistor (R3), and a first capacitor (C1).

[0230] The first resistor (R1) has one end connected to the power supply voltage (Vdd) terminal and the other end connected to the detection coil (143) and the oscillator circuit (220). The first resistor (R1) acts as a current limiting resistor and lowers the power supply voltage (Vdd). The first diode (D1) has an anode electrode connected to the detection coil (143) and the oscillator circuit (220), and a cathode electrode connected to the driving switch (SW1). The first diode (D1) transmits power from the detection coil (143) and the oscillator circuit (220) to the driving switch (SW1), and blocks noise, such as surge power, that may be introduced from the driving switch (SW1).

[0231] The driving switch (SW1) has a first electrode connected to the cathode electrode of the first diode (D1), a second electrode connected to a ground voltage, and a gate electrode connected to a terminal that receives a driving signal (DS). The driving switch (SW1) is turned on or off according to the driving signal (DS) received from the controller (500).

[0232] The second resistor (R2) is connected between the terminal receiving the driving signal (DS) and the gate electrode of the driving switch (SW1), and the third resistor (R3) and the first capacitor (C1) are connected in parallel between the gate electrode of the driving switch (SW1) and the ground voltage terminal. The second resistor (R2), the third resistor (R3), and the first capacitor (C1) maintain the potential level of the driving signal (DS) at the turn-on level of the driving switch (SW1) when the driving signal (DS) is received from the controller (500).

[0233] The oscillation driving circuit (210) may include an output node that outputs a freely resonant oscillation signal when the driving switch (SW1) is turned off. The output node may be formed between one side of the heating coil (142) and the oscillation circuit (220) and the anode electrode of the first diode (D1).

[0234] In this embodiment, the detection output circuit (200b) includes a DC blocking circuit (230) and a comparison circuit (240). The DC blocking circuit (230) blocks the DC signal included in the oscillation signal and outputs only the resonant oscillation signal. The comparison circuit (240) compares the oscillation signal with a reference signal and outputs a container detection signal based on the comparison result to the controller (500).

[0235] The controller (500) determines at least one of the container position and the container material based on the number of pulses of the container detection signal output from the detection output circuit (200b). For example, the oscillation signal has a difference in the degree of attenuation due to the equivalent resistance (Req) that varies depending on the degree of electromagnetic coupling between the container and the heating coil (142) and the material of the container. The controller (500) determines the container position and the container material based on the change in the container detection signal according to the variable oscillation signal.

[0236] In this embodiment, the controller (500) turns off the adjustment switch (SW2) of the oscillation circuit (220) of the container detection sensor (200), and determines the container of the first material based on the number of pulses of the container detection signal according to the variation of the oscillation signal resonating at the first oscillation frequency determined by the inductance of the heating coil (142) and the capacitance of the first oscillation capacitor (Ca) through the turning off of the adjustment switch (SW2). As an example, the container of the first material may be exemplified as a ferromagnetic or magnetic cooking container.

[0237] In addition, in the present embodiment, the controller (500) turns on the adjustment switch (SW2) of the oscillation circuit (220) of the container detection sensor (200), and determines the container of the second material based on the number of pulses of the container detection signal according to the variation of the oscillation signal that resonates at the second oscillation frequency determined by the capacitance of the first oscillation capacitor (Ca) and the second oscillation capacitor (Cb) connected in parallel with the inductance of the heating coil (142) through the turning on of the adjustment switch (SW2). For example, the second oscillation frequency has a lower frequency value than the first oscillation frequency. The container of the second material may be exemplified as a weakly magnetic or non-magnetic cooking container.

[0238] In this embodiment, the container detection sensor (200) can use an oscillation signal that resonates at a first oscillation frequency to detect a ferromagnetic container, and can use an oscillation signal that resonates at a second oscillation frequency lower than the first oscillation frequency to detect a weakly magnetic container. The container detection sensor (200) can periodically perform a process of detecting a container position and a container material by using an oscillation signal that resonates at the first oscillation frequency or the second oscillation frequency.

[0239] The operation of the container detection sensor (200) of the present invention is described over time as follows. First, the container detection sensor (200) turns on the drive switch (SW1) connected to the heating coil (142). Then, a certain amount of energy from the power voltage (Vdd) is stored in the detection coil (143).

[0240] After a certain period of time, the container detection sensor (200) turns off the drive switch (SW1). Then, an oscillation signal resonating at a first oscillation frequency determined by the first oscillation capacitor (Ca) of the oscillation circuit (220) connected in parallel with the heating coil (142) is output. At this time, the oscillation signal generates a difference in the degree of attenuation due to the degree of electromagnetic coupling between the container and the heating coil (142) and the equivalent resistance (Req) that varies depending on the container material.

[0241] Here, the first oscillation frequency is given by the mathematical formula is calculated by. Here, C represents the capacitance value of the first oscillation capacitor (Ca), and Leq represents the equivalent inductance of the heating coil (142). The difference in the degree of attenuation by the equivalent resistance (Req) of the heating coil (142) is expressed by the mathematical formula is calculated by. For example, an oscillating signal resonating at the first oscillation frequency is used to detect a ferromagnetic container.

[0242] Next, the container detection sensor (200) filters the DC signal from the oscillation signal resonating at the first oscillation frequency, compares the filtered oscillation signal with a reference signal, and outputs a container detection signal based on the comparison result to the controller (500).

[0243] In this embodiment, the controller (500) determines the container location and the degree of ferromagnetism based on a container detection signal corresponding to a change in an oscillation signal resonating at a first oscillation frequency. Thereafter, the controller (500) can drive the heating coil at the corresponding location with an appropriate power for the ferromagnetic container.

[0244] Next, the container detection sensor (200) turns on the adjustment switch (SW2) of the oscillation circuit (220) to connect the first oscillation capacitor (Ca) and the second oscillation capacitor (Cb) in parallel, thereby forming an equivalent capacitance.

[0245] Next, the container detection sensor (200) turns on the drive switch (SW1) connected to the heating coil (142). Then, a certain amount of energy from the power voltage (Vdd) is stored in the detection coil (143).

[0246] After a certain period of time, the container detection sensor (200) turns off the drive switch (SW1). Then, an oscillation signal resonating at a second oscillation frequency determined by the first oscillation capacitor (Ca) and the second oscillation capacitor (Cb) connected in parallel with the heating coil (142) is output. At this time, the oscillation signal generates a difference in the degree of attenuation due to the degree of electromagnetic coupling between the container and the heating coil (142) and the equivalent resistance (Req) that varies depending on the container material.

[0247] Here, the second oscillation frequency is given by the mathematical formula is calculated by. Here, C represents the capacitance value of the first oscillation capacitor (Ca) and the second oscillation capacitor (Cb) connected in parallel, and Leq represents the equivalent inductance of the heating coil (142). The difference in the degree of attenuation by the equivalent resistance (Req) of the heating coil (142) is expressed by the mathematical formula is calculated by. For example, an oscillating signal resonating at the second oscillation frequency is used to detect a weakly magnetic container.

[0248] The container detection sensor (200) filters a DC signal from an oscillation signal resonating at a second oscillation frequency, compares the filtered oscillation signal with a reference signal, and outputs a container detection signal based on the comparison result to the controller (500).

[0249] The controller (500) determines the container location and the degree of weak magnetic material based on a container detection signal corresponding to a change in an oscillation signal resonating at a second oscillation frequency. Thereafter, the controller (500) can drive the heating coil at the corresponding location with an appropriate power for the weak magnetic material container.

[0250] These container detection operations may be performed periodically when the cooktop is powered on, before induction heating, and during induction heating operations.

[0251] In the present embodiment, while at least one of the plurality of container detection sensors (200) detects a container using a freely resonating oscillation signal, the remaining container detection sensors discharge the energy charged in the heating coil (142). The first period (T1) represents a period for charging the oscillation energy in the heating coil (142). The second period (T2) represents a period for detecting and determining at least one of the position, size, and material of the container using the freely resonating oscillation signal. The third period (T3) represents a discharge period for discharging the voltage induced in the heating coil (142).

[0252] All multiple container detection sensors (200) store the oscillation energy in the heating coil (142) by turning on the driving switch (SW1) during the first period (T1).

[0253] After a certain period of time, during a second period (T2), the target sensor among the plurality of container detection sensors (200) generates an oscillation signal that freely resonates by turning off the drive switch (SW1). At this time, the oscillation signal has a difference in the degree of attenuation due to the degree of electromagnetic coupling between the container and the heating coil (142) and the equivalent resistance that varies depending on the material of the container. Then, the controller (500) determines at least one of the position, size, and material of the container based on the container detection signal according to the oscillation signal that varies depending on the presence or absence of the container and the material.

[0254] After a certain period of time, during the third period (T3), the remaining sensors keep the driving switch (SW1) turned on, so that the energy according to the voltage induced in the heating coil (142) is discharged to the ground through the driving switch (SW1).

[0255] In this way, the container detection sensor (200) detects the container by changing the oscillation frequency of the oscillation signal, and the controller (500) determines container information including at least one of the location, material, shape, and size of the container by using the container detection signal according to the change in the equivalent resistance (Req) of each container material according to the oscillation frequency.

[0256] The size of the equivalent resistance (Req) variation ratio for each container material may vary depending on the oscillation frequency. By utilizing this, the larger the value of the equivalent resistance (Req) variation ratio, the higher the performance in determining the container. Therefore, the container detection sensor (200) can detect the container by adjusting the oscillation frequency during the container detection period.

[0257] For example, the container detection sensor (200) can use an oscillation signal that resonates at a first oscillation frequency to detect a ferromagnetic container, and can use an oscillation signal that resonates at a second oscillation frequency lower than the first oscillation frequency to detect a weakly magnetic container. Specifically, the container detection sensor (200) can detect a ferromagnetic container such as iron, cobalt, nickel, silicon steel, cast iron, or clad using a frequency of 300 kHz, and can detect a weakly magnetic container such as aluminum, platinum, silver, or copper using a frequency lower than 100 kHz.

[0258] The criteria for classifying magnetic materials are determined by the formation of relative magnetic permeability. Relative magnetic permeability is the ratio of the magnetic permeability in a medium to the magnetic permeability in a vacuum, and represents the multiple of the vacuum magnetic permeability. In this specification, a ferromagnetic material is defined as a material with a relative magnetic permeability greater than 1. Ferromagnetic materials possess strong magnetism, and their magnetism can change depending on temperature and an external magnetic field, and they retain this magnetism even when the external magnetic field is removed. Iron, cobalt, and nickel are representative ferromagnetic materials. A weakly magnetic material is defined as a material with a relative magnetic permeability equal to or slightly greater than 1. A weakly magnetic material is weakly magnetic and its magnetism easily changes depending on an external magnetic field or temperature. Aluminum, platinum, and platinum are representative examples of weakly magnetic materials. A nonmagnetic material is defined as a material with a relative magnetic permeability less than or equal to 1. Nonmagnetic materials weakly repel magnetic fields and have very weak magnetism. Copper, silver, gold, and quartz are representative examples of nonmagnetic materials.

[0259] The controller (500) determines at least one of the container position and the container material based on the number of pulses of the container detection signal output from the detection output circuit (200b). For example, the oscillation signal has a difference in the degree of attenuation due to the equivalent resistance (Req) that varies depending on the degree of electromagnetic coupling between the container and the heating coil (142) and the material of the container, and the controller (500) determines the container position and the container material based on the change in the container detection signal according to the fluctuating oscillation signal.

[0260] Data on the variation ratio of equivalent resistance (Req) by container material according to the oscillation frequency can be stored in memory. The controller (500) can determine the container material by comparing the data determined based on the container detection signal with the data on the variation ratio of equivalent resistance by container material stored in the memory.

[0261] In this way, the present invention can detect a container through a heating coil without a detection coil by detecting a change in the impedance of the heating coil. Furthermore, the present invention can detect at least one of the position, size, and material of the container by detecting a change in an oscillation signal according to a change in the equivalent resistance of the heating coil.

[0262] A coil assembly according to one embodiment of the present invention may include a plurality of heating coil layers in which a plurality of heating coils used for container detection and container heating are formed, are stacked in a vertical direction and electrically connected; and a wiring layer stacked on top of the plurality of heating coil layers, in which a plurality of temperature sensors are arranged, and in which wires of the plurality of temperature sensors and wires of the plurality of heating coils are formed.

[0263] In one embodiment, the plurality of heating coils are formed in a rotating pattern and can be electrically connected through at least two layers.

[0264] According to one embodiment, the pattern of the plurality of heating coils forms a plurality of turns on one layer, an inter-turn region is formed between the plurality of turns, and a temperature sensor can be placed on another layer of the inter-turn region.

[0265] In one embodiment, a central region without a pattern can be formed in the center of the plurality of heating coils.

[0266] According to one embodiment, on both sides of a central region of a plurality of heating elements, a region may be formed in which the width of the region between turns among the plurality of turns is wider than that of other turns.

[0267] In one embodiment, the temperature sensors may be placed on different layers of the turn-to-turn area, with a wider width than the other turns.

[0268] According to one embodiment, a plurality of temperature sensors may be arranged at a predetermined distance from each other.

[0269] According to one embodiment, multiple heating coil layers and wiring layers can be formed on the same substrate.

[0270] According to one embodiment, a plurality of heating coil layers and wiring layers include at least one via formed in a vertical direction, through which the heating coils and wiring of the heating coils can be connected in a vertical direction.

[0271] According to one embodiment, a non-patterned region may be formed within a plurality of heating coil regions, and a non-patterned region may be formed in a boundary region between the plurality of heating coils.

[0272] According to one embodiment, at least four, and at most six, temperature sensors may be arranged in a non-patterned area of ​​two heating coil areas that are arranged side by side in the left-right or front-back direction among a plurality of heating coils, and no temperature sensors may be arranged in a boundary area between the heating coils that are arranged side by side in the left-right direction.

[0273] According to one embodiment, when four heating coils are arranged in series or parallel, at least 12, and at most 14, temperature sensors may be arranged in a non-pattern area of ​​the heating coil area, and no temperature sensors may be arranged in a boundary area between the heating coils that are aligned in the left and right directions.

[0274] A coil assembly according to another embodiment of the present invention may include a plurality of heating coil layers in which a plurality of heating coils are formed and stacked in a vertical direction and electrically connected, a wiring layer stacked on top of the plurality of heating coil layers, in which a plurality of temperature sensors are arranged and in which wires of the plurality of temperature sensors and wires of the plurality of heating coils are formed, and a sensing coil layer disposed on top of the wiring layer and in which a plurality of sensing coils are formed.

[0275] According to one embodiment, a plurality of heating coil layers and the wiring layer may be formed on the same substrate. The plurality of heating coil layers and the wiring layer may include at least one via formed in a vertical direction, and the heating coils and the wiring of the heating coils may be vertically connected through the via.

[0276] In one embodiment, the sensing coil layer may be formed on a different substrate from the plurality of heating coil layers and wiring layers.

[0277] According to one embodiment, the sensing coil layer, the plurality of heating coil layers, and the wiring layer can be electrically connected through terminal portions.

[0278] According to another embodiment of the present invention, a coil assembly may include a plurality of heating coil layers in which a plurality of heating coils are formed and stacked in a vertical direction and electrically connected, a wiring layer stacked on top of the plurality of heating coil layers and in which wires of the plurality of heating coils are formed, and a sensing coil layer disposed on top of the wiring layer and in which a plurality of sensing coils are formed, a plurality of temperature sensors are respectively disposed in central regions of the plurality of sensing coils, and in which wires of the plurality of temperature sensors are formed.

[0279] According to one embodiment, the plurality of heating coil layers and wiring layers can be formed on the same substrate, and the sensing coil layer can be formed on a different substrate from the plurality of heating coil layers and wiring layers.

[0280] According to one embodiment, a plurality of heating coil layers and wiring layers include at least one via formed in a vertical direction, through which the heating coils and wiring of the heating coils can be connected in a vertical direction.

[0281] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent embodiments are possible. Accordingly, the true technical protection scope of the present invention should be defined by the following claims.

Claims

1. A plurality of heating coil layers are formed, stacked in the vertical direction and electrically connected, and a plurality of heating coils are used for container detection and container heating; and A coil assembly comprising a wiring layer that is stacked on top of the plurality of heating coil layers, on which a plurality of temperature sensors are arranged, and on which wires of the plurality of temperature sensors and wires of the plurality of heating coils are formed.

2. In paragraph 1, A coil assembly in which the above plurality of heating coils are formed in a rotating pattern and are electrically connected through at least two layers.

3. In paragraph 2, The above pattern of the plurality of heating coils forms a plurality of turns on one layer, An inter-turn area is formed between the above multiple turns, A coil assembly wherein the temperature sensor is disposed on another layer of the above turn area.

4. In paragraph 1, A coil assembly in which a central region without a pattern is formed in the center of the plurality of heating coils.

5. In paragraph 4, A coil assembly in which, on both sides of the central region of the plurality of heating sections, an area is formed in which the width of the area between the turns among the plurality of turns is wider than that of other turns.

6. In paragraph 3, A coil assembly wherein the temperature sensor is arranged on a different layer of an area having a wider width than other turns.

7. In paragraph 1, A coil assembly in which the above plurality of temperature sensors are arranged at a certain interval from each other.

8. In paragraph 1, A coil assembly wherein the above plurality of heating coil layers and the above wiring layer are formed on the same substrate.

9. In paragraph 8, A coil assembly comprising at least one via formed in a vertical direction in the plurality of heating coil layers and the wiring layer, wherein the heating coil and the wiring of the heating coil are connected in a vertical direction through the via.

10. In paragraph 1, A coil assembly in which a non-pattern region is formed within the plurality of heating coil regions, and a non-pattern region is formed in a boundary region between the plurality of heating coils.

11. In paragraph 10, A coil assembly in which at least four, and at most six, temperature sensors are arranged in a non-pattern area of ​​two heating coil areas arranged side by side in the left-right or front-back direction among the plurality of heating coils, and no temperature sensors are arranged in a boundary area between the heating coils arranged side by side in the left-right direction.

12. In paragraph 8, A coil assembly in which, when the plurality of heating coils are arranged in series or in parallel in numbers of four, at least 12, and at most 14, temperature sensors are arranged in a non-pattern area of ​​the heating coil area, and no temperature sensors are arranged in a boundary area between the heating coils that are aligned in the left and right directions.

13. A plurality of heating coil layers formed by stacking a plurality of heating coils in a vertical direction and electrically connecting them; A wiring layer laminated on top of the plurality of heating coil layers, in which a plurality of temperature sensors are arranged and in which wires of the plurality of temperature sensors and wires of the plurality of heating coils are formed; and A coil assembly comprising a sensing coil layer disposed on the upper portion of the wiring layer and having a plurality of sensing coils formed therein.

14. In paragraph 13, A coil assembly wherein the above plurality of heating coil layers and the above wiring layer are formed on the same substrate.

15. In paragraph 14, A coil assembly comprising at least one via formed in a vertical direction in the plurality of heating coil layers and the wiring layer, wherein the heating coil and the wiring of the heating coil are connected in a vertical direction through the via.

16. In paragraph 14, A coil assembly wherein the above sensing coil layer is formed on a different substrate from the plurality of heating coil layers and the wiring layer.

17. In paragraph 16, A coil assembly in which the above sensing coil layer, the plurality of heating coil layers, and the wiring layer are electrically connected through a terminal portion.

18. A plurality of heating coil layers formed by stacking a plurality of heating coils in a vertical direction and electrically connecting them; A wiring layer laminated on top of the plurality of heating coil layers, in which the wirings of the plurality of heating coils are formed; and A coil assembly comprising a sensing coil layer disposed on the upper portion of the wiring layer, in which a plurality of sensing coils are formed, a plurality of temperature sensors are respectively disposed in the central region of the plurality of sensing coils, and in which wirings of the plurality of temperature sensors are formed.

19. In paragraph 18, The above plurality of heating coil layers and the above wiring layer are formed on the same substrate, The above sensing coil layer is formed on a different substrate from the plurality of heating coil layers and the wiring layer, the coil assembly 20. In paragraph 19, A coil assembly comprising at least one via formed in a vertical direction in the plurality of heating coil layers and the wiring layer, wherein the heating coil and the wiring of the heating coil are connected in a vertical direction through the via.

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