Radio-frequency apparatus, radio-frequency transmission system, radio-frequency system, radio-frequency module, and radar

Abstract

Provided are a radio-frequency apparatus, a radio-frequency transmission system, a radio-frequency system, a radio-frequency module, and a radar. The radio-frequency apparatus comprises a packaging body (11) in which an IC bare die is packaged, and a PCB (21), wherein on the surface of the packaging body (11), at least one radiation sheet (119) and a plurality of solder balls (12), which are respectively arranged around each radiation sheet into a circle and form a waveguide channel, are provided, and an inner ring enclosed by the plurality of solder balls (12) comprises at least one ridge portion (121), which protrudes towards the inside of the ring; and the PCB (21) is provided with a first waveguide hole (211), which has the same shape as the inner ring enclosed by the solder balls (12). The radio-frequency transmission system further comprises a waveguide structure (22), which is arranged on the side of the PCB (21) that is away from the packaging body (11), wherein the waveguide structure (22) is provided with a ridge-shaped or rectangular second waveguide hole (221). The radio-frequency apparatus reduces the area occupied by a packaging transition structure, the radio-frequency transmission system realizes the diversification of a radio-frequency signal transmission channel, and the radio-frequency module reduces the loss.

Description

RF devices, RF transmission systems, RF systems, RF modules and radars

[0001] This application claims priority to the Chinese patent application with application number 202322672173.5 filed on September 28, 2023, with invention name “A radio frequency device and radar device”, the Chinese patent application with application number 202323391601.3 filed on December 12, 2023, with invention name “Radio frequency transmission system and radio frequency system”, and the Chinese patent application with application number 202410566287.8 filed on May 8, 2024, with invention name “Radio frequency module, radar and electronic device”, the contents of which should be understood as incorporated into this application by reference. Technical Field

[0002] The present application relates to but is not limited to semiconductor radio frequency technology, and in particular to a radio frequency device, a radio frequency transmission system, a radio frequency system, a radio frequency module and a radar. Background Art

[0003] In the semiconductor industry, the conversion from chip packaging to waveguide is a complex technology, commonly used for high-frequency, high-speed signal transmission or high-frequency RF applications. The conversion from chip packaging to waveguide involves transferring the signal on the chip to a waveguide or microstrip line through a special packaging or connection structure to achieve higher signal transmission performance and frequency response. The radio frequency (RF) signal from the bare chip first enters the chip package and then is converted to an external waveguide / microstrip line / coaxial line or other transmission structure through the connection structure. A waveguide is a structure used to transmit electromagnetic waves, commonly used for high-frequency, high-speed signal transmission or high-frequency RF applications. A waveguide can be a hollow metal tube or dielectric tube used to guide the propagation of electromagnetic waves such as microwaves, millimeter waves or light waves.

[0004] When converting the RF signal in the chip package to the packaging transition structure of the external waveguide, it is urgent to solve the problem of how to reduce the area occupied by the packaging transition structure while ensuring low loss and wide impedance bandwidth characteristics.

[0005] SUMMARY OF THE INVENTION

[0006] To solve the above technical problems, an embodiment of the present application provides a radio frequency device, comprising a package body encapsulating an IC bare chip; at least one radiating portion is provided on a surface of the package body, and the radiating portion is connected to the IC bare chip for signal transmission;

[0007] The surface of the package body is also provided with a plurality of solder balls arranged in a circle around each of the radiating parts, and the plurality of solder balls constitute a waveguide channel for the radiating parts to transmit signals; the inner circle surrounded by the plurality of solder balls includes a ridge protruding into the circle.

[0008] In an exemplary embodiment, the device further includes a PCB board;

[0009] Waveguide holes are respectively provided on the PCB board corresponding to each of the radiation parts. The package body is mounted on the PCB board, and a plurality of solder balls are arranged in a circle around the boundaries of the waveguide holes.

[0010] In an exemplary embodiment, a cross-sectional shape of the waveguide hole is the same as a shape of an inner circle surrounded by the plurality of solder balls around the radiation portion.

[0011] In an exemplary embodiment, the inner ring is a rectangular ring with the ridge provided therein, or a circular ring with the ridge provided therein, or an elliptical ring with the ridge provided therein.

[0012] In an exemplary embodiment, the inner ring is a rectangular ring with the ridge provided therein;

[0013] The ridge comprises one; the ridge is located in the middle or a corner of one side of the rectangular inner circle;

[0014] Alternatively, the ridges include two ridges, which are respectively located at the middle of two opposite sides or at two opposite corners of the rectangular inner circle.

[0015] The present invention provides a radio frequency transmission system, including:

[0016] A PCB board, wherein the PCB board has a second surface and a third surface opposite to each other, and at least one first waveguide hole is provided on the PCB board, wherein the first waveguide hole is a ridge-type waveguide hole;

[0017] A waveguide structure having a fourth surface and a fifth surface relative to each other, wherein a second waveguide hole is provided on the fourth surface corresponding to each of the first waveguide holes, and the first waveguide holes are connected to the second waveguide holes to form a channel for transmitting radio frequency signals.

[0018] In an exemplary embodiment, the second waveguide hole is a ridge waveguide hole or a rectangular waveguide hole.

[0019] In an exemplary embodiment, the ridge waveguide hole is a single-ridge waveguide hole or a double-ridge waveguide hole.

[0020] In an exemplary embodiment, the fourth surface is connected to the PCB board, and an isolation structure is provided on the fourth surface.

[0021] In an exemplary embodiment, the isolation structure includes a plurality of periodically arranged protrusion structures.

[0022] In an exemplary embodiment, the height of the protruding structure is 1 / 4 of the wavelength of the radio frequency signal, and the distance between two adjacent protruding structures is 1 / 2 to 1 / 6 of the wavelength of the radio frequency signal.

[0023] In an exemplary embodiment, the isolation structure includes a first protruding structure located at a region with the strongest signal field at an edge of each of the second waveguide holes;

[0024] The isolation structure further includes at least one second protruding structure disposed around the first protruding structure, wherein a cross-sectional diameter of the first protruding structure is greater than or equal to a cross-sectional diameter of the second protruding structure.

[0025] In an exemplary embodiment, the height of the second protruding structure is 1 / 4 of the wavelength of the radio frequency signal, and the diameter of the second protruding structure is 1 / 3 to 1 / 10 of the wavelength of the radio frequency signal.

[0026] In an exemplary embodiment, a gap between the upper surfaces of the first and second protruding structures and the third surface is no greater than 400 μm.

[0027] In an exemplary embodiment, a distance between the first protruding structure and an adjacent second protruding structure is [1 / 2λ, 1 / 6λ], where λ is an operating wavelength of the radio frequency signal.

[0028] In an exemplary embodiment, the first protruding structure and the second protruding structure are at least one of a rectangular parallelepiped, a cylindrical, and a truncated cone shape.

[0029] In an exemplary embodiment, at least one antenna unit is provided on the fifth surface, and the second waveguide hole is connected to the antenna unit from one end of the wide side surface of the antenna unit or a middle position of the wide side surface.

[0030] In an exemplary embodiment, the second waveguide hole includes two cavity segments with rectangular cross sections, and a stepped transition structure is provided at the connection between adjacent cavity segments.

[0031] In an exemplary embodiment, the second waveguide holes are arranged in an array, and the long sides of two adjacent second waveguide holes are perpendicular to each other.

[0032] In an exemplary embodiment, the antenna unit includes a plurality of radiation slots for transmitting and / or receiving the radio frequency signal.

[0033] An embodiment of the present application provides a radio frequency system, comprising: a package, and the radio frequency transmission system as described in any one of the above items;

[0034] At least one radiation portion is provided on the first surface of the package body, and a plurality of solder balls are provided on the first surface. The plurality of solder balls are arranged around the radiation portion to form a first waveguide channel;

[0035] The first surface of the package body is mounted on the second surface of the PCB board, and each of the radiation portions is arranged in a one-to-one correspondence with the first waveguide holes.

[0036] In one exemplary embodiment, the package includes a substrate and an IC die;

[0037] The side of the substrate facing away from the IC bare chip is the first surface. A radio frequency (RF) trace is provided inside the substrate, and the radio frequency signal is transmitted to the radiation portion through the RF trace.

[0038] In an exemplary embodiment, the substrate includes a metal layer, a feeder layer, and a patch layer;

[0039] The RF trace is arranged on the feeder layer, and the radiating portion is arranged on the patch layer; the radio frequency signal is coupled to the radiating portion through the RF trace.

[0040] An embodiment of the present application provides a radar, comprising the radio frequency device as described in any one of the above items, or the radio frequency transmission system as described in any one of the above items, or the radio frequency system as described in any one of the above items.

[0041] An embodiment of the present application provides an electronic device, including the radar described above.

[0042] Other features and advantages of the present application will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present application. The purposes and other advantages of the present application can be achieved and obtained through the structures particularly pointed out in the description, claims and drawings.

[0043] Summary of the Figures

[0044] The accompanying drawings are used to provide a further understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0045] FIG1 is a front perspective view of a radio frequency device according to an embodiment of the present application;

[0046] FIG2 is a top perspective view of a radio frequency device according to an embodiment of the present application;

[0047] FIG3 is a schematic top view of a first arrangement of multiple solder balls in an embodiment of the present application;

[0048] FIG3 a is a schematic top view of an arrangement of multiple solder balls in the prior art;

[0049] FIG4 is a schematic top view of a second arrangement of multiple solder balls in an embodiment of the present application;

[0050] FIG5 is a schematic top view of a third arrangement of multiple solder balls in an embodiment of the present application;

[0051] FIG6 is a schematic top view of a fourth arrangement of multiple solder balls in an embodiment of the present application;

[0052] FIG7 is a schematic top view of the first metal layer in an embodiment of the present application;

[0053] FIG8 is a schematic top view of the second metal layer in an embodiment of the present application;

[0054] FIG9 is a schematic top view of the third metal layer in an embodiment of the present application;

[0055] FIG10 is a schematic top view of a plurality of shielding metallized through holes in an embodiment of the present application;

[0056] FIG11 is a schematic top view of a PCB board in an embodiment of the present application;

[0057] FIG12 is a schematic diagram of a form of the second metal layer RF routing in an embodiment of the present application;

[0058] FIG13 is a schematic diagram of another form of the second metal layer RF routing in an embodiment of the present application;

[0059] FIG14 is a schematic diagram of another form of the second metal layer RF routing in an embodiment of the present application;

[0060] FIG15 is a schematic diagram of RF performance from substrate to PCB in an embodiment of the present application.

[0061] FIG16 is a schematic diagram of a radio frequency transmission system according to an embodiment of the present application;

[0062] FIG17 is a plan view of the interface between the PCB board and the waveguide structure in an embodiment of the present application;

[0063] FIG18 is a schematic diagram of a radio frequency transmission system with an isolation structure according to an embodiment of the present application;

[0064] FIG19 is a plan view of the isolation structure in FIG18 at the interface between the PCB board and the waveguide structure;

[0065] FIG20 is a plan view of an isolation structure at the interface between a PCB board and a waveguide structure according to an embodiment of the present application;

[0066] FIG21 is a schematic diagram of another radio frequency transmission system with an isolation structure according to an embodiment of the present application;

[0067] FIG22 is a schematic diagram of another radio frequency transmission system with an isolation structure according to an embodiment of the present application;

[0068] FIG23 is a schematic diagram of another radio frequency transmission system with an isolation structure according to an embodiment of the present application;

[0069] FIG24 is a schematic diagram of another radio frequency transmission system with an isolation structure according to an embodiment of the present application;

[0070] FIG25 is a plan view of the isolation structure in FIG24 at the interface between the PCB board and the waveguide structure;

[0071] FIG26 is a plan view of another isolation structure at the interface between the PCB board and the waveguide structure according to an embodiment of the present application;

[0072] FIG27 is a plan view of another isolation structure at the interface between the PCB board and the waveguide structure according to an embodiment of the present application;

[0073] FIG28 is a plan view of another isolation structure at the interface between the PCB board and the waveguide structure according to an embodiment of the present application;

[0074] FIG29 is a plan view of another isolation structure at the interface between the PCB board and the waveguide structure according to an embodiment of the present application;

[0075] FIG30 is a plan view of a second waveguide hole at the interface between the PCB board and the waveguide structure in an embodiment of the present application;

[0076] FIG31 is a plan view of an isolation structure at the interface between a PCB board and a waveguide structure according to an embodiment of the present application;

[0077] FIG32 is a schematic diagram of RF transmission performance parameters corresponding to the RF transmission system according to an embodiment of the present application;

[0078] FIG33 is a cross-sectional view of a radio frequency module in the related art;

[0079] FIG34 is a cross-sectional view of a radio frequency module according to an embodiment of the present application;

[0080] FIG35 is a cross-sectional view of the connection between the substrate and the PCB board in an embodiment of the present application;

[0081] FIG36 is a top view of the connection between the substrate and the solder balls in an embodiment of the present application;

[0082] FIG37 is a top view of the connection between the substrate, solder balls, and PCB board according to an embodiment of the present application;

[0083] FIG38 is a top view of a PCB board in an embodiment of the present application;

[0084] FIG39 is a top view of a waveguide antenna according to an embodiment of the present application;

[0085] FIG40 is a schematic diagram of a connection method between a feeder and an antenna unit according to an embodiment of the present application;

[0086] FIG41 is a schematic diagram of the layout of the feeder and antenna units in an embodiment of the present application;

[0087] FIG42 is a schematic diagram of a double-layer structure of a waveguide antenna according to an embodiment of the present application;

[0088] Figure 43 is a schematic diagram of the stepped transition structure in an embodiment of the present application. DETAILED DESCRIPTION

[0089] To make the purpose, technical solutions and advantages of this application more clear, the embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be noted that, unless there is a conflict, the embodiments and features in the embodiments of this application can be combined with each other in any way.

[0090] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0091] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0092] It is understood that the terms "first" and "second" used in this application are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0093] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if there is transmission of electrical signals or data between the connected circuits, modules, units, etc.

[0094] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Furthermore, the term "and / or" as used in this specification includes any and all combinations of the relevant listed items.

[0095] As shown in FIG1 and FIG2 , FIG1 and FIG2 show the structure of a radio frequency device in this embodiment. The radio frequency device includes a package body 11 .

[0096] Package 11 encapsulates an integrated circuit (IC) die (not shown). Package 11 is provided with at least one radiating plate 119 on its surface, each electrically connected to the IC die. Package 11 is also provided with multiple solder balls 12. These solder balls 12 and the radiating plates 119 are located on the same side of package 11. Each radiating plate 119 is surrounded by a ring of solder balls 2.

[0097] In an exemplary embodiment, the solder balls 12 are made of metal material and can be configured in a drum shape or a spherical shape. In an embodiment, the solder balls 12 can be ball grid array (BGA) solder balls.

[0098] In an exemplary embodiment, as shown in Figures 2 and 3, a plurality of solder balls 12 are arranged around a circle of the radiation plate 119, and adjacent solder balls 12 may be spaced apart. The solder balls 12 are spaced apart from the radiation plate 119. The inner circle formed by the plurality of solder balls 12 includes at least one ridge 121 protruding into the circle, so that the plurality of solder balls 12 are arranged in a ridge-like pattern. Each ridge 121 is composed of one or more solder balls 12. In this embodiment, the ridge 121 is composed of one solder ball 12. The plurality of solder balls 12 arranged around the radiation plate 119 together constitute a waveguide channel for the radiation plate 119 to transmit signals.

[0099] In one embodiment, the signal emitted by the IC bare chip is transmitted to each radiation plate 119, and the radiation plate 119 then radiates the signal into the waveguide channel surrounded by multiple solder balls 12. The signal can be a radio frequency signal. The waveguide channel formed by the multiple solder balls 12 then transmits the signal to the waveguide structure of other components (for example, the waveguide structure can be the waveguide hole 131 of the printed circuit board (PCB board) 13 shown in Figure 1).

[0100] In one embodiment, the signal can also be transmitted from the waveguide structure of the above-mentioned components (for example, the waveguide hole 131 of the PCB board 13) to the waveguide channel formed by multiple solder balls 12, and the waveguide channel then transmits the signal to the radiation plate 119, and the radiation plate 119 then transmits the signal to the IC bare chip.

[0101] In the embodiment of the present application, the inner circle formed by the multiple solder balls 12 is provided with a ridge 121 protruding toward the inner circle, and the cavity enclosed by the multiple solder balls forms a ridge waveguide cavity. A ridge waveguide cavity can be understood as a process in which the original rectangular waveguide cavity is bent inward. After the bending, the length of the longest side of the cavity remains unchanged, and thus the transmission performance remains unchanged. However, after the cavity is bent, the area occupied by the cavity can be reduced, and the number of solder balls surrounding the cavity can also be reduced, ensuring that the performance of the radiation plate is not reduced when multiple solder balls are used to transmit signals.

[0102] For example, FIG3 a shows an arrangement of solder balls 12 a in a related art. The plurality of solder balls 12 a are arranged in a rectangular shape, wherein a horizontal side 122 a is formed by four solder balls 12 a and a vertical side 123 a is formed by six solder balls 12 a.

[0103] In one exemplary embodiment, as shown in FIG3 , a solder ball arrangement 12 in an embodiment of the present application is configured such that multiple solder balls 12 are arranged in a rectangular inner circle. Due to the presence of a ridge 121 within the rectangular inner circle, the longitudinal side 123 of the rectangular inner circle is reduced to five solder balls, while the lateral side 122 of the rectangular inner circle remains composed of four solder balls 12. Compared to solder ball arrangements in related art, the solder ball arrangement with ridge 121 in the embodiment of the present application occupies less area. However, the solder ball arrangement with ridge 121 utilizes ridge waveguide cavity technology, ensuring that the performance of the radiation plate 119 transmitting signals from the multiple solder balls 12 is not degraded.

[0104] In an exemplary embodiment, as shown in FIG3 , the inner circle enclosed by the plurality of solder balls 12 is a rectangular inner circle having a ridge 121 therein. The rectangular inner circle includes two lateral sides 122, two longitudinal sides 123, and the ridge 121. The lateral sides 122 and the longitudinal sides 123 are each formed by a plurality of solder balls 12 arranged along a straight line. The lateral sides 122 are perpendicular to the longitudinal sides 123. The two ends of one lateral side 122 are respectively connected to one end of the two longitudinal sides 123, and the two ends of the other lateral side 122 are respectively connected to the other end of the two longitudinal sides 123. The ridge 121 is disposed between the two lateral sides 122 and between the two longitudinal sides 123. The ridge 121 is disposed on the inner side of the lateral sides 122 and / or the longitudinal sides 123. In this way, the ridge 121 protrudes inward from the rectangular circle enclosed by the lateral side 122 and the longitudinal side 123. The embodiment of the present application utilizes the technology of the ridge waveguide to reduce the size of the lateral side 122 and / or the longitudinal side 123 while ensuring that the transmission performance remains unchanged, thereby reducing the area occupied by the multiple solder balls 12 as a whole.

[0105] In one exemplary embodiment, as shown in FIG3 , a single ridge 121 is provided. This ridge 121 can be located in the middle of one longitudinal side 123 of the rectangular inner circle and away from the middle of the other longitudinal side 123 of the rectangular inner circle. In another exemplary embodiment, a single ridge 121 is provided. This ridge 121 can be located in the middle of one lateral side 122 of the rectangular inner circle and away from the other lateral side 122 of the rectangular inner circle. In some embodiments, positioning the ridge 121 in the middle of one side of the rectangular inner circle can utilize ridge waveguide technology to further reduce the overall area occupied by the plurality of solder balls 12 by reducing the size of the lateral side 122 and / or the longitudinal side 123 while maintaining unchanged transmission performance.

[0106] In one exemplary embodiment, as shown in FIG4 , two ridges 121 are provided, spaced apart from each other. One ridge 121 may be located in the middle of one longitudinal side 123 of the rectangular inner circle, and the other ridge 121 may be located in the middle of another longitudinal side 123 of the rectangular inner circle. In another exemplary embodiment, two ridges 121 are provided, spaced apart from each other. One ridge 121 may be located in the middle of one lateral side 122 of the rectangular inner circle, and the other ridge 121 may be located in the middle of another lateral side 122 of the rectangular inner circle. In some embodiments, by providing two ridges 121, each located in the middle of two opposing sides of the rectangular inner circle, ridge waveguide technology can be utilized to reduce the overall area occupied by the plurality of solder balls 12 by reducing the size of the lateral sides 122 and / or the longitudinal sides 123 while maintaining transmission performance.

[0107] In one exemplary embodiment, as shown in FIG5 , a single ridge 121 is provided, located at a corner formed by the intersection of a lateral side 122 and a longitudinal side 123 of the inner rectangular circle. In some embodiments, locating the ridge 121 at a corner of the inner rectangular circle allows ridge waveguide technology to be utilized to reduce the overall area occupied by the plurality of solder balls 12 by reducing the size of the lateral side 122 and / or the longitudinal side 123 while maintaining transmission performance.

[0108] In one exemplary embodiment, as shown in FIG6 , two ridges 121 are provided, one of which is located at a corner formed by the intersection of a horizontal side 122 and a vertical side 123 of the rectangular inner circle, and the other of which is located at a corner formed by the intersection of another horizontal side 122 and another vertical side 123 of the rectangular inner circle. The two ridges 121 are located at two opposing corners of the rectangular inner circle. In some embodiments, by providing two ridges 121 at two opposing corners of the rectangular inner circle, ridge waveguide technology can be utilized to reduce the overall area occupied by the plurality of solder balls 12 by reducing the size of the horizontal side 122 and / or the vertical side 123 while maintaining unchanged transmission performance.

[0109] In an exemplary embodiment, the inner circle formed by the plurality of solder balls 12 is a circular circle or an elliptical circle with a ridge 121 therein.

[0110] In an exemplary embodiment, as shown in Figures 9 and 11, the radio frequency device also includes a PCB board 13, and waveguide holes 131 are respectively provided on the PCB board 13 corresponding to each radiation plate 119. The package body is mounted on the PCB board 13, and multiple solder balls around the radiation plate 119 corresponding to each waveguide hole 131 are also arranged in a circle around the boundary of the waveguide hole.

[0111] The IC die transmits signals to and from waveguide holes 131 of the PCB 13 via a waveguide channel formed by the radiating plate 119 and multiple solder balls 12. An antenna structure is also provided on the side of the PCB 13 facing away from the package, and signals connect to the antenna structure via waveguide holes 131. Signals from the antenna structure can also be transmitted to the IC die via waveguide holes 131, the waveguide channel, and the radiating plate 119.

[0112] In an exemplary embodiment, the cross-sectional shape of the waveguide hole 131 is the same as the inner circle shape of the plurality of solder balls 12 surrounding the radiation plate, thereby further reducing signal transmission loss and improving signal transmission efficiency.

[0113] In one exemplary embodiment, a ridge 132 is provided on the inner wall of the waveguide hole 131. The ridge 132 extends from one end of the waveguide hole 131 to the other end, giving the waveguide hole 131 a ridge-shaped cross-section. The number of ridges 132 is the same as the number of ridges 121. The ridges 132 are arranged in a one-to-one correspondence with the ridges 121, and each ridge 121 is connected to the end of its corresponding ridge 132 closest to the package body 11.

[0114] In the embodiment of the present application, by setting the cross-section of the waveguide hole 131 on the PCB board 13 to be ridge-shaped, the loss of the signal transmitted between the waveguide channel formed by the multiple solder balls 12 and the waveguide hole 131 is effectively reduced, thereby improving the signal transmission efficiency.

[0115] In an exemplary embodiment, as shown in FIG1 , the package body 11 may further include: a first metal layer 111 , a first insulating layer 112 , a second metal layer 113 , a second insulating layer 114 , a third metal layer 115 , a plurality of shielding metallization vias 116 and a conversion metallization via 117 .

[0116] The first metal layer 111, the first insulating layer 112, the second metal layer 113, the second insulating layer 114, and the third metal layer 115 are stacked in sequence. The first insulating layer 112 and the second insulating layer 114 are both made of insulating materials. The first insulating layer 112 supports the first metal layer 111 and the second metal layer 113, and the second insulating layer 114 supports the second metal layer 113 and the third metal layer 115.

[0117] As shown in FIG7 , the first metal layer 111 serves as a metal ground layer. In one embodiment, in the RF region, the first metal layer 111 may be entirely metal and serve as a reference ground for the third metal layer 115 .

[0118] As shown in FIG. 8 , the second metal layer 113 is provided with an RF trace 118 , and each radiation plate 119 is connected to the IC bare chip via the RF trace 118 .

[0119] In one embodiment, the radiation plate 119 is disposed on the third metal layer 115, and one end of the RF trace 118 is connected to the IC bare die, and the other end extends above the radiation plate 119, so that the projection of the RF trace 118 on the third metal layer 115 at least partially overlaps with the radiation plate 119, so that the capacitance formed between the radiation plate 119 and the RF trace 118 introduces capacitance characteristics.

[0120] As shown in Figures 1 and 2 , the other end of RF trace 118 is connected to a radiating plate 119 below it via a transition metallization via 117. RF trace 118 is connected to radiating plate 119 via transition metallization via 117 to introduce inductance. The direction in which transition metallization via 117 extends is perpendicular to the third metal layer 115.

[0121] As shown in Figures 1, 2, and 10, multiple shielding vias 116 are grounding vias arranged around radiating plate 119 and RF trace 118 to guide RF signal propagation and prevent leakage. Shielding vias 116 extend from first metal layer 111 to third metal layer 115, extending perpendicularly to third metal layer 115.

[0122] An RF device provided in one embodiment of the present application, on the one hand, forms a capacitance characteristic structure of a capacitor between the RF trace 118 arranged on the second metal layer 113 and the radiation plate 119 arranged on the third metal layer 115; on the other hand, introduces the inductance characteristic of the conversion structure through the conversion metallized through-hole 117 arranged between the second metal layer 113 and the third metal layer 115. The equivalent circuit of the two constitutes a broadband resonant structure. The RF device has the characteristics of simple structure, low loss, wide impedance bandwidth, good processability and good RF performance.

[0123] In an exemplary embodiment, as shown in FIG8 , a first hollow region 1142 and a hollow strip 1143 are provided on the second metal layer 113. The hollow strip 1143 extends outward from the first hollow region 1142. An RF trace 118 is also arranged in the first hollow region 1142 and the hollow strip 1143 of the second metal layer 113. The RF trace 118 extends along the hollow strip 1143 into the first hollow region 1142. One end of the RF trace 118 facing away from the first hollow region 1142 is electrically connected to the IC die. A plurality of shielding metallized vias 116 are distributed around the second hollow region 1152 and the hollow strip 1143. In one embodiment, an RF reference ground is provided around the periphery of the first hollow region 1142 and the hollow strip 1143.

[0124] In one exemplary embodiment, as shown in FIG9 , the third metal layer 115 is provided with a second hollow region 1152. The second hollow region 1152 is aligned with the first hollow region 1142 on the second metal layer 113 in a direction perpendicular to the third metal layer 115. The radiation plate 119 is provided in the second hollow region 1152.

[0125] In an exemplary embodiment, the plurality of solder balls 12 are connected to the surface of the third metal layer 115 facing away from the second metal layer 113 . The plurality of solder balls 12 surround the second hollow region 1152 of the third metal layer 115 and surround the radiating plate 119 .

[0126] As shown in Figures 8 and 9, the shapes of the first hollow area 1142 of the second metal layer 113 and the second hollow area 1152 of the third metal layer 115 are the same as the inner circle shape formed by the plurality of solder balls 12. The first hollow area 1142 and the second hollow area 1152 are aligned with each other in a direction perpendicular to the third metal layer 115.

[0127] The edge of the first hollow region 1142 protrudes inward to form a first raised portion 1141. The edge of the second hollow region 1152 protrudes inward to form a second raised portion 1151. The number of first raised portions 1141 and second raised portions 1151 is the same as the number of ridges 121. The first raised portions 1141 and the second raised portions 1151 are arranged in a one-to-one correspondence, and each first raised portion 1141 is aligned with its corresponding second raised portion 1151 in a direction perpendicular to the third metal layer 115.

[0128] The second protrusions 1151 are arranged in a one-to-one correspondence with the ridges 121 , and each ridge 121 is connected to the corresponding second protrusion 1151 .

[0129] In the embodiment of the present application, the inner circle formed by the first hollow area 1142, the second hollow area 1152 and the multiple solder balls 12 are all constructed as a ridge structure, and are aligned in a direction perpendicular to the third metal layer 115, which is beneficial to improving signal transmission efficiency, reducing loss and increasing bandwidth.

[0130] In an exemplary embodiment, the RF trace 118 may include, but is not limited to, traces such as substrate integrated waveguide (SIW), microstrip, or stripline.

[0131] In one embodiment, the RF trace 118 is a Y-shaped trace as shown in FIG12 . The RF trace 118 forks in the second hollow region 1152. The RF trace 118 includes two branches located in the second hollow region 1152. A conversion metallization via 117 is provided at one end of each branch near the radiation plate 119.

[0132] In one embodiment, as shown in FIG8 and FIG13 , the RF trace 118 is an exemplary half-Y-shaped single-branch trace, and a conversion metallization through-hole 117 is provided at one end of the branch close to the radiation plate 119 .

[0133] In some embodiments, the single-branch RF trace 118 may be a straight trace, or a trace with other forms of bends.

[0134] In one embodiment, as shown in FIG14 , the RF trace 118 is an exemplary symmetrical trident, including three branches located in the second hollow region 1152. A conversion metallized through-hole 117 is provided at one end of each branch near the radiating plate 119. The multi-branch symmetrical RF trace 118 has better transmission efficiency than a single-branch RF trace 118.

[0135] In one exemplary embodiment, the spatial overlap length L between the RF trace 118 and the radiating plate 119 is sufficiently long so that the resonant circuit formed by the capacitance formed between the RF trace 118 and the radiating plate 119 and the inductance introduced by the conversion metallized via 15 can form a broadband resonant structure. In one embodiment, the overlap length L between the projection of the RF trace 118 on the third metal layer 115 and the radiating plate 119 is greater than or equal to one-third the length of the radiating plate 119.

[0136] Figure 15 is a schematic diagram of the RF performance waveforms of the RF device according to an embodiment of the present application. As shown in Figure 15 , the horizontal axis represents frequency (in GHz), the left vertical axis represents return loss (in dB), and the right vertical axis represents insertion loss (in dB). Figure 15 shows the return loss and insertion loss in decibels (dB) across the frequency range of 70 to 85 GHz. The solid line curve represents the return loss curve, and the dashed line curve represents the insertion loss curve. The waveforms shown in Figure 15 demonstrate the RF performance of the IC die package to waveguide conversion structure in the automotive millimeter-wave radar frequency band. High transmission efficiency, low loss, and wide bandwidth are achieved across the entire frequency range, ensuring RF performance.

[0137] The present application also provides a radar device comprising at least: the radio frequency device described in any one of the embodiments of the present application; and an antenna radiating structure electrically connected to the radio frequency device for signal transmission. In one embodiment, the antenna radiating structure may be electrically connected to the PCB board 13.

[0138] Radiation on Package (RoP) technology adds a radiating metal patch to the package for signal transmission and reception. The radiating patch is surrounded by a ring of solder balls and connects to the windowed PCB, forming a transitional metal cavity. This structure transmits the RF signal within the package to an external waveguide antenna.

[0139] In the related art, a rectangular window is provided on the PCB to serve as a waveguide channel to transmit radio frequency signals, and the package size of the PCB occupied is relatively large.

[0140] One embodiment of the present application relates to a radio frequency transmission system, as shown in Figures 16 and 17, the radio frequency transmission system includes: a PCB board 21, on which at least one first waveguide hole 211 is provided, and the first waveguide hole 211 is a ridge-type waveguide hole; a waveguide structure 22, on the end face of which the first waveguide hole 211 is connected, and a second waveguide hole 221 is provided at a position corresponding to each first waveguide hole 211, and the second waveguide hole 221 is a ridge-type waveguide hole or a rectangular waveguide hole (rectangular waveguide holes are shown as an example in Figure 16), and the first waveguide hole 211 is connected to the second waveguide hole 221 to form a channel for radio frequency signal transmission.

[0141] In an exemplary embodiment, a chip package can be mounted on the PCB board 21, and at least one signal transceiver can be provided on a side of the chip package facing the PCB board 21, and each signal transceiver can be provided opposite a first waveguide hole 211. The first waveguide hole 211 runs through two opposite sides of the PCB board 21, and can be used to transmit the radio frequency signal emitted by the signal transceiver on the chip package or the received radio frequency signal through the first waveguide hole 211 opposite to the signal transceiver, thereby realizing signal transmission and reception. In an embodiment of the present application, setting the first waveguide hole 211 as a ridge-type waveguide hole effectively reduces the package size occupied by the first waveguide hole 211 on the PCB board 21. In an embodiment, wiring can be laid and devices can be provided in other areas of the PCB board 21 in addition to the first waveguide hole 211 to realize other functions, which is not limited in this embodiment.

[0142] On the end face of the waveguide structure 22 that interfaces with each first waveguide hole 211, a second waveguide hole 221 is provided corresponding to each first waveguide hole 211. The first waveguide holes 211 and the second waveguide holes 221 interface to form a channel for RF signal transmission. RF signals transmitted or received by the signal transceiver can be transmitted through this transmission channel. Arranging the second waveguide holes 221 as ridge waveguide holes or rectangular waveguide holes (a rectangular waveguide hole is shown as an example in FIG16 ) increases the diversity of channels for RF signal transmission.

[0143] In some embodiments, the first waveguide hole 211 may be a single-ridge waveguide hole, as shown in FIG. 16 .

[0144] In other embodiments, the second waveguide hole 221 may be a rectangular waveguide hole.

[0145] As shown in Figure 16, a single-ridged first waveguide hole 211 and a rectangular second waveguide hole 221 are illustrated. Designing the first waveguide hole 211 as a single-ridged waveguide hole reduces the area occupied by the first waveguide hole 211 on the PCB 21 and reduces the manufacturing complexity compared to a double-ridged waveguide hole. Since there are generally no specific dimensional requirements for the external waveguide structure 22, a conventional rectangular waveguide hole can be used as the second waveguide hole 221 to connect the rectangular waveguide to the waveguide channel of the PCB 21, further reducing the manufacturing complexity.

[0146] In the radio frequency transmission system provided in the embodiment of the present application, since a ridge-type waveguide hole is provided on the PCB board as the first waveguide hole, the area occupied by the waveguide structure on the PCB board is better reduced than that of the traditional rectangular waveguide hole. At the same time, the ridge-type waveguide hole or the rectangular waveguide hole on the waveguide structure is connected with the ridge-type waveguide hole on the waveguide structure to form a transmission channel for the radio frequency signal, thereby realizing the diversification of the transmission channels for the radio frequency signal.

[0147] The following describes in detail the implementation details of the radio frequency transmission system of this embodiment. The following content is only provided for ease of understanding and is not essential for implementing this solution.

[0148] Compared to rectangular windowing, this embodiment employs ridged waveguide holes (including single-ridge and double-ridge holes) on PCB board 21, effectively reducing package size and increasing isolation between channels. However, when the waveguide structure 22 is assembled on PCB board 21, a gap inevitably exists between the first waveguide hole 211 and the second waveguide hole 221 due to loose surface connection. When RF signals leak through this gap, the transmission efficiency of the RF signal within the channel is reduced. Furthermore, the signal can couple to other channels through the gap, reducing isolation and seriously affecting the performance of the antenna module.

[0149] In order to effectively reduce the leakage of radio frequency signals in the transmission channel from the gap, or the free signals in the gap from entering the transmission channel, that is, to improve the isolation between the transmission channel and external signals, this embodiment proposes an isolation structure.

[0150] That is, in some embodiments, an isolation structure is provided on the end surface where the waveguide structure 22 and the PCB board 21 are connected to prevent signals from being transmitted laterally along the end surface.

[0151] In this embodiment, the isolation structure may be composed of multiple raised structures disposed on the end surface of the waveguide structure 22, with the surface of the isolation structure being made of metal. The shape, number, and arrangement of these raised structures are not limited in this embodiment. The isolation structure can provide a certain degree of isolation from radiated signals that are trapped in the gap between the waveguide structure 22 and the PCB board 21. The specific configuration of the isolation structure will be described below through various embodiments.

[0152] In some embodiments, as shown in Figures 18, 19, and 20, the isolation structure adopts an electromagnetic band gap structure, which includes a plurality of periodically arranged protrusion structures, which are metal structures or structures with metal-plated surfaces; the plurality of periodically arranged protrusion structures can prevent the propagation of surface waves, thereby preventing the radio frequency signal from leaking from the transmission channel to the outside, and can also prevent the free radio frequency signal in the gap of the cross-section where the PCB board 21 and the waveguide structure 22 are connected from entering the adjacent transmission channel, thereby realizing signal isolation within each transmission channel.

[0153] In some embodiments, these protrusions can be cylindrical protrusions 222 as shown in Figures 18 and 19, or rectangular protrusions 223 as shown in Figure 20. The cross-sectional shape of the protrusions is not limited and can be adjusted according to specific needs. In one embodiment, the shapes of the protrusions can be the same or different, without limitation.

[0154] In some embodiments, in the above-mentioned periodically arranged raised structures, the height of the raised structures may be about 1 / 4 wavelength of the radio frequency signal, preferably 1 / 4 wavelength; the distance between two adjacent raised structures is 1 / 2 wavelength to 1 / 6 wavelength of the radio frequency signal, where the distance between the two raised structures refers to the distance between the centers of the two raised structures.

[0155] Specifically, as shown in Figure 18, a plurality of cylinders are provided on the end face where the waveguide structure 22 is connected to the PCB board 21. Taking two specific cylinders 2221 and cylinder 2222 as examples, the height a of the cylinder is approximately λ / 4, and the distance between two adjacent cylinders 2221 and 2222 is approximately λ / 4, where λ is the wavelength of the radio frequency signal.

[0156] In other embodiments, in order to simplify the isolation structure, the protruding structure may be arranged only at the position where the field intensity at the edge of the second waveguide hole 221 is the strongest.

[0157] In one exemplary embodiment, as shown in FIG21 , the isolation structure may include a first protruding structure 224 located at the strongest signal field region at the edge of the second waveguide hole 221. In one embodiment, the second waveguide hole 221 is rectangular, and the strongest signal field region is located between the two long sides of the rectangular waveguide hole. A first protruding structure 224 is provided at each of these two locations.

[0158] In one exemplary embodiment, as shown in FIG22 , the isolation structure includes at least: a first protruding structure 224 located at the strongest signal field region at the edge of each second waveguide hole 221, and at least one second protruding structure 225 surrounding the first protruding structure. In one embodiment, when the second waveguide hole 221 is a rectangular waveguide hole, the middle position of the two long sides of the rectangular waveguide hole is the strongest signal field region, and a first protruding structure 224 is disposed at each of the two locations, and a second protruding structure 225 may be disposed around the first protruding structure 224. In one embodiment, as shown in FIG23 , when the second waveguide hole 221 is a rectangular waveguide hole, the middle position of the two long sides of the rectangular waveguide hole is the strongest signal field region, and a first protruding structure 224 is disposed at each of the two locations, and two second protruding structures 225 may be disposed around the first protruding structure 224.

[0159] In one embodiment, the height of the first protruding structure 224 is about 1 / 4λ, where λ is the wavelength of the radio frequency signal, preferably 1 / 4λ.

[0160] In one embodiment, the cross-sectional diameter of the first protrusion structure 224 is about 1 / 4λ, where λ is the wavelength of the radio frequency signal, preferably 1 / 4λ.

[0161] In one embodiment, the lateral distance between the first protruding structure 224 and the adjacent second protruding structure 225 is 1 / 2 to 1 / 6λ, where λ is the wavelength of the radio frequency signal.

[0162] In the embodiment of the present application, the area between the first protrusion structure 224 and the second protrusion structure 225 forms a strong field confinement region, preventing electromagnetic waves from escaping from this region. When the protrusion structures in the embodiment of the present application are positioned on both sides of the edge of the waveguide channel where the field strength is strongest, they prevent leakage of the primary energy within the channel. The diameter of the first protrusion structure 224 is approximately λ / 4. The interface between the PCB board 21 and the waveguide structure 22 is made of metal. When a gap exists between this metal layer and the top of the first protrusion structure 224, capacitive reactance is introduced, which interacts with the inductive reactance introduced by the first protrusion structure 224 itself, forming a resonance. This ensures impedance matching between the first waveguide hole 211 and the second waveguide hole 221, while preventing signal leakage through the gap.

[0163] In some embodiments, to achieve better radio frequency transmission performance, the cross-sectional diameter of the first protrusion structure 224 may be set to be greater than or equal to the cross-sectional diameter of the second protrusion structure 225 .

[0164] In some embodiments, the projection of the first protrusion structure 224 on the PCB board 21 is located outside the first waveguide hole 221, so that the top of the first protrusion structure 224 is opposite to the area of ​​the PCB board 21 other than the first waveguide hole, thereby forming a gap.

[0165] In some embodiments, the projection of the second protrusion structure 225 on the PCB board 21 is located outside the first waveguide hole 221, so that the top of the second protrusion structure 225 is opposite to the area of ​​the PCB board 21 other than the first waveguide hole, thereby forming a gap.

[0166] In some embodiments, the height of the second protruding structure 225 is 1 / 4 of the wavelength of the RF signal, and / or the diameter of the top of the second protruding structure 225 is 1 / 4 of the wavelength of the RF signal, and / or the distance between two adjacent second protruding structures 225 is 1 / 2 to 1 / 6 of the wavelength of the RF signal. These dimensions can be set to form a structure such as the above-mentioned cylinder 2221 and cylinder 2222 between two adjacent second protruding structures 225, thereby isolating the free signal in the gap. The specific principle is referred to above and is not repeated here.

[0167] In some embodiments, a plurality of second protrusion structures 225 are disposed around each first protrusion structure 224 , and all the second protrusion structures 225 and the first protrusion structures 224 are arranged in an array on the end surface to further enhance the isolation effect.

[0168] For example, in Figures 24 to 28, all first protrusions 224 and all second protrusions 225 are still arranged in a substantially array. The only difference between Figures 24 to 28 is the different graphical structures of the first and second protrusions 224 and 225: cylindrical in Figures 24 to 27 and rectangular in Figure 28; and the different structures of the second waveguide holes 221: rectangular in Figures 24, 25, and 28, single-ridged in Figure 26, and double-ridged in Figure 27.

[0169] In some embodiments, the first protrusion structure 224 and the second protrusion structure 225 are at least one of a rectangular parallelepiped, a cylindrical, and a truncated cone shape.

[0170] In some practical application scenarios, as shown in FIG29 , when setting the relative positional relationship between the second waveguide holes 221 and the isolation structure, a cross-arrangement as shown in FIG29 can also be adopted, that is, each second waveguide hole 221 can be arranged after being rotated at different angles according to a certain rule. Accordingly, the first protrusion structure 224 can still be located in the area with the strongest signal field strength around the second waveguide hole 221, and the second protrusion structure 225 is arranged around the first protrusion structure 224. In some cases, due to space limitations, some special-shaped second protrusion structures 225 can also be provided, such as the second protrusion structure 2252 in FIG29 .

[0171] FIG30 is a schematic diagram showing a cross arrangement of multiple single-ridge waveguide holes when the second waveguide hole 221 is a single-ridge waveguide hole.

[0172] As shown in FIG31 , the isolation structure formed by improving the first protrusion structure 224 and the second protrusion structure 225 in this embodiment is shown. Specifically, the first protrusion structures 224 at the same distance from the second waveguide hole 221 are connected to form an annular boss 2240. Similarly, the second protrusion structures 225 at the same distance from the second waveguide hole 221 are connected to form an annular boss 2250. This can reduce the complexity of the casting.

[0173] As shown in FIG32 , which is a transmission performance diagram of the radio frequency transmission system of this embodiment, it can be seen that when the gap between the PCB board 21 and the waveguide structure 22 is 0 μm, 200 μm and 400 μm respectively, the corresponding transmission coefficient and reflection coefficient are both in a good range.

[0174] The radio frequency transmission system provided in an embodiment of the present application includes a PCB board 21 and a waveguide structure 22. At least one first waveguide hole 211 is provided on the PCB board 21. The first waveguide hole 211 is a ridge-type waveguide hole. On the end surface of the waveguide structure 22 that interfaces with the first waveguide hole 211, a second waveguide hole 221 is provided corresponding to each first waveguide hole 211. The second waveguide hole 221 is a ridge-type waveguide hole or a rectangular waveguide hole. Radio frequency signals are transmitted in a channel formed by the first waveguide hole 211 and the second waveguide hole 221. The provision of the ridge-type waveguide hole as the first waveguide hole 211 on the PCB board 21 significantly reduces the package size occupied by the waveguide structure on the PCB board 21 compared to conventional rectangular waveguide holes. Furthermore, the ridge-type waveguide hole or rectangular waveguide hole on the waveguide structure 22 interfaces with the ridge-type waveguide hole on the waveguide structure to form a transmission channel for the radio frequency signal, thereby achieving diversification of the transmission channels for the radio frequency signal.

[0175] Another embodiment of the present application relates to a radio frequency system, comprising: a chip packaging structure, and the radio frequency transmission system described in any one of the embodiments of the present application; wherein:

[0176] At least one signal transceiver is provided on the surface of the chip packaging structure; the side of the chip packaging structure provided with the signal transceiver is mounted on a PCB board of a radio frequency transmission system, and each signal transceiver is provided in a one-to-one correspondence with the first waveguide hole on the PCB board.

[0177] In one embodiment, the signal transceiver is connected to an IC die within a chip package structure.

[0178] In one embodiment, a plurality of solder balls are provided around the signal transceiver to form a waveguide channel for signal transmission. The side of the chip packaging structure provided with the signal transceiver is mounted to the PCB board of the radio frequency transmission system through the solder balls, and each signal transceiver is provided in a one-to-one correspondence with the first waveguide hole on the PCB board, and the plurality of solder balls are also provided in a circle around the first waveguide hole.

[0179] The radio frequency system further includes an antenna structure, which is arranged at an end of the second waveguide hole away from the PCB board.

[0180] In one embodiment, the waveguide channel surrounded by the multiple solder balls, the first waveguide hole, and the second waveguide hole together constitute a radio frequency signal transmission channel between the signal transceiver and the antenna structure.

[0181] In traditional packaging technology, RF signals are generated by the IC and connected to external circuits through the package. After fanning out, the RF signal connects to a planar waveguide in the PCB via solder balls, completing the signal path. The RF signal then connects to the antenna via a planar waveguide feeder on the PCB. Planar waveguides exhibit significant dielectric and radiation losses, which are proportional to the length of the feeder. RF modules that use planar waveguides to feed antennas suffer from high losses. Furthermore, since the antenna is designed on the PCB, once the chip is soldered to the PCB, the antenna cannot be replaced.

[0182] As shown in Figure 33, the RF signal is generated by the IC in chip 301 and connected to the external circuit through the package. After the RF signal is fanned out through the package substrate, it passes through the solder ball 302 and the planar waveguide in the PCB board 303 to realize the signal path. It is then connected to the antenna 304 on the PCB board 303 via the planar waveguide feeder. In other words, the transmission process of the RF signal from the IC to the antenna 304 is completed through the planar waveguide mode, and the antenna 304 is also fixedly mounted on the side of the PCB board 303 facing the chip 301. Because the planar waveguide has large dielectric loss and radiation loss, these losses are proportional to the length of the feeder. Therefore, the RF module that uses a planar waveguide to feed the antenna has a large system loss. In addition, the antenna is designed on the PCB board. Once the chip is soldered to the PCB board, the antenna will not be replaced.

[0183] An embodiment of the present application relates to a radio frequency module, as shown in FIG34 , comprising: a chip package 311 , a PCB board 321 and a waveguide antenna 331 ; wherein,

[0184] At least one radiation portion 312 is disposed on the first surface S1 of the chip package 311 . A plurality of solder balls 313 are disposed on the first surface S1 . The plurality of solder balls 313 are disposed around the radiation portion 312 to form a first waveguide channel 314 .

[0185] In an exemplary embodiment, the first surface S1 is a side of the chip package 311 facing the PCB board 321, and a radiating portion 312 is provided on the first surface S1, and the radiating portion 312 is used to transmit and receive radio frequency signals to the outside. In one embodiment, the radiating portion 312 may be a radiating patch. In one embodiment, the radiating portion 312 is not limited to a radiating patch, and it may also be other forms of radiating structures. In one embodiment, the shape of the radiating patch may be at least one of a rectangle, a diamond, and a butterfly, or may be any other pattern shape. In one embodiment, the radiating patch may be provided in a metal layer in an integrated circuit in a patterned form.

[0186] In one exemplary embodiment, multiple radiating portions 312 may be provided, each surrounded by multiple solder balls 313. It should be noted that the solder balls 313 may also be replaced with conductive adhesive or other methods. In one embodiment, the solder balls 313 may be spherical, cylindrical, or block-shaped. In one embodiment, the solder balls 313 may be metal solder balls made of gold, copper, copper-nickel-gold, tin, or the like.

[0187] In FIG. 34 and FIG. 35 , the space surrounded by the plurality of solder balls 313 serves as a waveguide channel for transmitting radio frequency signals, and is referred to as a first waveguide channel 314 .

[0188] In Figures 34 and 36, the RF signal inside the chip package 311 can be radiated to the solder balls 313 arranged around the radiating portion 312 in the first waveguide channel 314 through the radiating portion 312. One end of the solder balls 313 is connected to the chip package 311, and the other end is connected to the PCB board 321. The closed rectangular circle thus formed can confine the electromagnetic waves in a single signal transmission channel, effectively preventing signal leakage between channels, reducing crosstalk between channels, and improving isolation.

[0189] In FIG34 , the PCB board 321 has a second surface S2 and a third surface S3 opposite to each other. The second surface S2 is connected to the first surface S1 of the chip package 311 . A second waveguide channel 322 is provided at a position of the PCB board 321 corresponding to the first waveguide channel 314 .

[0190] In one exemplary embodiment, the second surface S2 and the third surface S3 are two surfaces parallel to the metal layers of the PCB 321. The second surface S2 directly contacts the solder balls 313 to achieve docking between the PCB 321 and the chip package 311. Through the soldering action of the solder balls 313, the second surface S2 and the first surface S1 are connected via the solder balls, achieving a stable docking. After docking, a second waveguide channel 322 is provided on the second surface S2 corresponding to each first waveguide channel 314, extending through the second surface S2 and the third surface S3. In one embodiment, the cross-section of the second waveguide channel 322 can have a single-ridge shape, or can have other structures such as a rectangle or a double-ridge shape.

[0191] The cross-section of the second waveguide channel 322 is configured as a single-ridge type. Compared to a conventional rectangular waveguide, the area occupied by the second waveguide channel 322 on the PCB board 321 can be effectively reduced. Since the channel port dimensions of the first waveguide channel 314 surrounded by the solder balls 313 are consistent with those of the second waveguide channel 322, the configuration of the single-ridge waveguide channel can reduce the size of the chip package by reducing the size of the first waveguide channel 314.

[0192] In Figure 34, the waveguide antenna 331 has a fourth surface S4 and a fifth surface S5 relative to each other. The fourth surface S4 is connected to the third surface S3, and at least one antenna unit 332 is set on the fifth surface S5. A third waveguide channel 333 is set in the waveguide antenna 331.

[0193] In one exemplary embodiment, the fourth surface S4 is the side of the waveguide antenna 331 that interfaces with the third surface S3 of the PCB board 321, and the fifth surface S5 is the side of the waveguide antenna 331 that faces away from the PCB board 321 when the waveguide antenna 331 interfaces with the PCB board 321. An antenna unit 332 is disposed on the fifth surface S5. The antenna unit 332 is configured to transmit and receive radio frequency signals. Each antenna unit 332 may include multiple radiating slots (e.g., a waveguide slot antenna) for transmitting and / or receiving radio frequency signals. The waveguide antenna 331 includes multiple third waveguide channels 333. Each third waveguide channel 333 is connected at one end to a second waveguide channel 322 and at the other end to an antenna unit 332.

[0194] In Figure 34, the radio frequency signal generated in the chip package 311 is coupled to the radiating portion 312 and radiated outward, and is transmitted to the antenna unit 332 through the radio frequency signal transmission channel composed of the first waveguide channel 314, the second waveguide channel 322 and the third waveguide channel 333 connected in sequence, and then radiated outward by the antenna unit 332 as a radio signal; conversely, after the antenna unit 332 receives the wireless signal, it is transmitted to the radiating portion 312 through the radio frequency signal transmission channel composed of the third waveguide channel 333, the second waveguide channel 322 and the first waveguide channel 314, and the radiating portion 312 then couples the received signal to the inside of the chip package 311 for processing.

[0195] In an exemplary embodiment, the RF signal transmission channel can realize the connection between the chip package 311, the PCB board 321 and the waveguide antenna 331 and the matching of the RF signal. The waveguide antenna 331 can be directly connected to the chip package 311 without other conversion structures, thereby reducing the load of the design. Compared with the planar waveguide, the use of the waveguide antenna 331 effectively reduces the feeder loss and improves the output performance of the RF module.

[0196] In an exemplary embodiment, the PCB board 321 is located between the chip package 311 and the waveguide antenna 331. In addition to being used to connect the chip package 311 and the waveguide antenna 331, it can also carry other peripheral circuits, and these peripheral circuits can be isolated from the second waveguide channel 322 by setting a gap in the non-metallic area.

[0197] 34 , a chip package 311 includes at least a substrate 315 and an IC die 316 . A surface of the substrate 315 facing away from the IC die 316 is a first surface S1 . RF traces 317 are disposed within the substrate, through which radio frequency signals are transmitted to the radiating portion 312 .

[0198] In one exemplary embodiment, substrate 315 serves as both a carrier for IC die 316 and a medium for transmitting RF signals generated by IC die 316 to radiators 312. By disposing RF traces 317 within the substrate, the RF signals generated by IC die 316 can be fanned out to multiple radiators 312 that are distributed relatively widely.

[0199] In some embodiments, as shown in Figures 35 to 37, the substrate 315 includes at least a metal ground layer 3151, a feed layer 3152, and a patch layer 3153; the RF trace 317 is arranged on the feed layer 3151, and the radiating portion 312 is arranged on the patch layer 3153, wherein the radio frequency signal is coupled to the radiating portion 312 through the RF trace 317.

[0200] Figure 35 is a top view of the feeder layer 3152 and the patch layer 3153, viewed from inside the chip package 311 toward the outside. In Figures 34 and 35, the RF signal generated by the IC die 316 is transmitted to the feeder layer 3152 via vias 318 and coupled to the radiating portion 312 of the patch layer 3153 at the end of the RF trace 317. The feeder layer 3152 and the patch layer 3153 have opposing rectangular windows 319. The two rectangular windows 319 can be of the same or different sizes. The RF trace 317 and the radiating portion 312 are located within the windows 319 of their respective metal layers, with the outside of the windows 319 being the ground ground. The gap created by the rectangular windows 319 isolates the RF trace 317 and the radiating portion 312 from the external ground ground. Vias 318 arranged at equal intervals near the inside of the rectangular windows 319 can also be provided to the ground ground. These vias 318 connect the GND of the feeder layer 3152 to the GND of the patch layer 3153. Below the patch layer 3153, a circle of grounded solder balls 313 are soldered below the GND of the outer circle of rectangular windows 319, and the bottom surface of the solder balls is soldered to the PCB board 321.

[0201] In Figures 36 and 37, when radiating element 312 radiates the millimeter-wave signal coupled from RF trace 317, the enclosed first waveguide channel 314, enclosed by solder balls 313 surrounding radiating element 312, confines the electromagnetic wave within a single signal transmission channel, thereby reducing crosstalk between channels and improving isolation. The cavity formed by the GND of patch layer 3153 within substrate 315, solder balls 313, and the metal on the top surface of PCB board 321 provides mode and impedance matching between radiating element 312 and the single-ridged window (second waveguide channel 322), effectively converting the electromagnetic wave from the planar microstrip transmission mode to the waveguide transmission mode.

[0202] Figure 37 shows a top view of the connection between the feeder layer 3152, the patch layer 3153, and the PCB 321, viewed from inside the chip package 311 toward the exterior. In Figures 35 and 37, a single-ridged window is defined in the PCB 321, serving as the second waveguide channel 322. This window is positioned directly opposite the radiating portion 312 in the chip package. The sidewalls and upper and lower surfaces of the single-ridged window are plated with a conductive metal layer. The metal coating on the upper and lower surfaces extends from the edge of the single-ridged window outward to cover the solder ball 313 soldering area.

[0203] In actual process design, no other metal layer may be provided on the other side of the metal ground layer 3151 in the substrate 315. The IC die 316 may be provided directly above the metal ground layer 3151. The metal ground layer 3151 serves to isolate the IC die 316 from the feeder layer 3152. Other metal layers may also be provided on the other side of the metal ground layer 3151 in the substrate 315. The IC die 316 may be provided directly above the other metal ground layer. The metal ground layer 3151 serves to isolate the other metal layers from the feeder layer 3152. In the metal ground layer 3151, the feeder layer 3152, and the patch layer 3153, a dielectric layer is provided between each adjacent two layers, and connections can be achieved by providing vias 18 between the metal layers.

[0204] In some embodiments, the second waveguide channels 333 are arranged in an array, and the long sides of two adjacent second waveguide channels 333 are perpendicular to each other.

[0205] As shown in Figure 38, the port layout of the second waveguide channel 333 in a 4T4R (4 groups of transmission and 4 groups of reception) radio frequency module is shown. The perspective of this figure is from the third surface S3 of the PCB board 321 to the second surface S2. The cross-section of the second waveguide channel 333 in Figure 38 is a single-ridge type (for example, it can be a single-ridge waveguide), and the direction of the electric field when the electromagnetic wave propagates therein is mainly perpendicular to the long side where the ridge is located. Through the port arrangement shown in this example, it is ensured that the polarizations between adjacent ports are perpendicular to each other, thereby reducing the signal crosstalk problem at the port. At the same time, each second waveguide channel 333 can appear smoothly.

[0206] In some embodiments, as shown in FIG. 34 , an isolation structure 334 is further provided on the fourth surface S4 , and the isolation structure 334 includes a plurality of periodically arranged protrusion structures.

[0207] When assembling the waveguide antenna 331 onto the PCB board 321, due to processing and assembly errors, the surfaces of the two are not tightly connected, resulting in inevitable gaps. When the RF signal leaks from the gap, the transmission efficiency of the RF signal in the channel will be reduced. At the same time, the signal will also be coupled to other channels through the gap to form channel crosstalk, resulting in reduced isolation and seriously affecting the performance of the RF module.

[0208] Therefore, the embodiment of the present application proposes to set an isolation structure 334 on the fourth surface S4 to prevent the signal from being transmitted laterally along the gap surface. In one embodiment, the isolation structure 334 can be composed of a plurality of raised structures set on the fourth surface S4. The shape, number, and arrangement of these raised structures are not limited in this embodiment. The raised structure can be a cylinder, a rectangular parallelepiped, a hexagonal prism, etc. In one embodiment, the raised structure is a metal structure or a structure with a metal-plated surface. In this embodiment, the propagation of surface waves is prevented by a plurality of periodically arranged raised structures, thereby preventing the radio frequency signal from leaking from the transmission channel to the outside, and also preventing the free radio frequency signal in the gap between the end face where the PCB board 321 and the waveguide antenna 331 are connected to the adjacent transmission channel, thereby achieving signal isolation within each transmission channel. In some embodiments, the waveguide antenna 331 can be connected to the PCB board 321 by fasteners such as screws and bolts.

[0209] In some embodiments, as shown in Figure 39, the protrusion structure included in the RF module of the present application includes multiple first protrusion structures 335 and multiple second protrusion structures 336, and the cross-sectional area of ​​the first protrusion structure 335 is greater than or equal to the cross-sectional area of ​​the second protrusion structure 336.

[0210] Figure 39 is a top view of the third waveguide channel 333 on the fourth surface S4 of the waveguide antenna 331. This view is viewed from the fourth surface S4, looking into the interior of the waveguide antenna 331. This example uses a rectangular waveguide antenna, which requires less computer numerical control (CNC) or plastic injection molding and electroplating processes. The port on the fourth surface S4 is rectangular in shape. Non-uniform raised structures can be provided around the port to provide a surrounding surface.

[0211] When the end of the third waveguide channel 333 that interfaces with the second waveguide channel 322 is rectangular (i.e., a rectangular waveguide aperture), the center of the two long sides of the rectangular waveguide aperture represents the strongest signal field region. The signal field strength gradually decreases as it extends outward from this center. Protrusions with different cross-sectional areas can be provided in signal field regions of varying strength to achieve differentiated isolation. In this embodiment, two types of protrusions are provided on the fourth surface S4: a first protrusion 335 and a second protrusion 336. The cross-sectional area of ​​the first protrusion 335 is greater than or equal to the cross-sectional area of ​​the second protrusion 336.

[0212] In some embodiments, the plurality of first protrusion structures 335 are located at the center line of the long side of the third waveguide channel 333 .

[0213] In some embodiments, a plurality of second protrusion structures 336 are disposed around the first protrusion structure 335 .

[0214] In some embodiments, the gap between the upper surfaces of the first and second protrusion structures 335 and 336 and the third surface S3 is no greater than 400 micrometers (μm).

[0215] In Figure 39, a thick cylindrical structure serving as the first raised structure 335 (in this example, operating in the 77 GHz automotive millimeter-wave frequency band, with a diameter and height of approximately 1 mm) is symmetrically placed at the center of the long side of the rectangular waveguide aperture of the third waveguide channel 333. When electromagnetic waves are transmitted from the second waveguide channel 322 of the PCB board 321 to the third waveguide channel 333, the thick cylindrical structure maintains normal transmission of the electromagnetic waves and ensures good matching. This embodiment allows for a certain gap between the waveguide antenna 331 and the PCB board 321. This gap is the distance between the upper surface of the raised structure and the third surface. For the automotive millimeter-wave frequency band, this gap is approximately 0 to 400 μm. Thin cylindrical structures serving as the second raised structures 336 are distributed around the thick cylindrical structure to block subtle energy that escapes through the gap. The dimensions of these thin cylindrical structures are not strictly required; for example, their height can be consistent with that of the thick cylindrical structure, while their diameter and the gap with the surrounding cylinders can be within half a wavelength. In one embodiment, the distance between the thick cylinder and the center of the long side of the rectangular waveguide hole is maintained within ±100 μm to improve the consistency between channels.

[0216] In some embodiments, the height of the first protrusion structure 335 and the second protrusion structure 336 is Where λ is the operating wavelength of the RF signal.

[0217] In some embodiments, the diameter of the second protrusion structure 336 is Where λ is the operating wavelength of the RF signal.

[0218] In some embodiments, the distance between the first protrusion structure 335 and the adjacent second protrusion structure 336 is Where λ is the operating wavelength of the RF signal.

[0219] In some embodiments, as shown in FIG8 , the third waveguide channel 33 is connected to the antenna unit 33 from one end of the broad side surface of the antenna unit 32 or a middle position of the broad side surface.

[0220] As shown in FIG42 , the cross-section of the waveguide cavity of the antenna unit 332 is rectangular, wherein the side where the long side of the rectangle is located is called the long side side, and the side where the wide side of the rectangle is located is called the wide side side. In FIG40 , a slot for radiating RF signals outward is provided on the long side side. FIG40 shows two feeding methods of the waveguide antenna: the left figure shows that the RF signal in the third waveguide channel 333 is fed from one end of the wide side side of the antenna unit 332 into the interior of the antenna unit 332, which is called side feeding; the right figure shows that the RF signal in the third waveguide channel 333 is fed from the middle position of the wide side side of the antenna unit 332 into the interior of the antenna unit 332, which is called center feeding.

[0221] As shown in FIG41 , it is a layout diagram of an array composed of a feeding line formed by a third waveguide channel 333 and antenna units 332 in a waveguide antenna 331 .

[0222] In some embodiments, as shown in FIG42 , the waveguide antenna 331 includes two parts (an upper half and a lower half divided along a dividing line) that are spliced ​​together, a splicing surface of the two parts is parallel to the surface current direction of the RF signal, and the path of the surface current is located on the splicing surface.

[0223] In some embodiments, as shown in Figure 42, the waveguide antenna 31 is designed as a double-layer structure, divided into upper and lower parts along the dividing line in the figure. For the rectangular waveguide shown in the figure, the path of the surface current parallel to the waveguide extension direction coincides with the dividing line. When the connection between the upper and lower structures is not tight, the segmentation method shown in Figure 42 can effectively reduce energy leakage.

[0224] In some embodiments, as shown in FIG. 43 , the third waveguide channel 333 includes at least two cavity segments 337 with rectangular cross sections, and a stepped transition structure 338 is provided at the connection between adjacent cavity segments 337 .

[0225] For example, in Figure 43, (a) and (d) include two cavity segments 337 from bottom to top, wherein the upper cavity segment 337 is rotated out from the long side of the lower cavity segment 337, also known as long side rotation; (b), (c), and (e) include two cavity segments 337 from bottom to top, wherein the upper cavity segment 337 is rotated out from the wide side of the lower cavity segment 337, also known as wide side rotation.

[0226] In one embodiment, a stepped transition structure 338 may be further designed at the connection between adjacent cavity segments 337, i.e., at the exit position. By properly designing the recessed and protruding steps to form the stepped transition structure 338, better impedance matching can be achieved and electromagnetic wave reflection at the turning discontinuity can be reduced.

[0227] In one embodiment, the stepped transition structure 338 can be a single-step structure as shown in (a), (b), (d), and (e) in 43, or a multi-step structure as shown in (c) in Figure 43. In this embodiment, there is no limit on the number of layers of the stepped structure.

[0228] The RF module in this embodiment has the following advantages over traditional RF modules:

[0229] When designing the chip package 311, the RF trace 317 is fanned out inside the substrate 315 and a radiating portion 312 is provided outside the chip package 311. The radiating portion 312 can couple the RF signal from the chip package to the external waveguide antenna, thereby increasing the flexibility of the chip and antenna design and facilitating miniaturization.

[0230] To prevent leakage between channels, the radiation portion 312 is surrounded by solder balls 313 to form a first waveguide channel 314. One end of the solder ball 313 is connected to the chip package 311, and the other end is soldered to the PCB board 321, thereby achieving channel docking.

[0231] A single ridge-shaped window is dug out in the area of ​​the PCB board 321 corresponding to the area surrounded by the solder balls as the second waveguide channel 322 for achieving the connection between the chip package 311, the PCB board 321 and the waveguide antenna 331 and the matching of the radio frequency signal.

[0232] The waveguide antenna 331 utilizes a two-layer structure for ease of fabrication. The upper layer contains the antenna unit 332 and a portion of the RF trace 317, while the lower layer includes the interface between the portion of the RF trace 317 and the RF trace 317 that interfaces with the first waveguide channel 314. The dividing line between the two layers aligns with the direction of the surface current within the rectangular waveguide, effectively reducing energy leakage at the dividing line.

[0233] The use of the waveguide antenna 331 can reduce feeder loss and increase the output power of the radar.

[0234] In summary, the RF module provided in the above embodiments of the present application reduces the size of the chip package and has low cost, high power, good isolation and robustness.

[0235] Another embodiment of the present application further provides a radar, including: a radio frequency module as in any of the above embodiments.

[0236] In an exemplary embodiment, the radar is used to transmit an electromagnetic wave signal based on a reference frequency via a transmitting antenna, and to receive an echo formed by reflection from a target object using a receiving antenna, and to perform down-conversion processing based on the transmitted radio frequency signal to generate and output an intermediate frequency signal; the radar is also used to convert the intermediate frequency signal into a digital signal and then perform signal processing.

[0237] In some embodiments, the electromagnetic wave signal is a frequency modulated continuous wave signal, which is a millimeter wave signal, so that the electronic device equipped with the radar can be used in fields such as autonomous driving, industrial automation, smart home appliances, and security inspection.

[0238] In some embodiments, the radar may be an AiP millimeter-wave radar chip with an integrated antenna.

[0239] In one embodiment, a radar can generate a chirp signal using a preset continuous frequency modulation scheme. A radio frequency (RF) transmit signal is generated through frequency multiplication and fed to a transmitting antenna to emit a corresponding detection signal wave. When the detection signal wave is reflected by an object, an echo signal wave is generated. The echo signal wave is converted into a RF receive signal by a receiving antenna. The radar uses the RF transmit signal to down-convert and filter the RF receive signal, and then performs analog-to-digital conversion to output a baseband digital signal representing the difference frequency between the detection signal wave and the echo signal wave. Signal processing then extracts measurement information from the baseband digital signal and outputs measurement data. The signal processing includes performing phase, frequency, and time domain digital signal processing on at least one signal to be processed provided by at least one receiving antenna. The measurement data includes at least one of the following: distance data indicating the relative distance of at least one detected obstacle; velocity data indicating the relative velocity of at least one detected obstacle; and angle data indicating the relative angle of at least one detected obstacle.

[0240] In some embodiments, the present disclosure also provides an electronic device including the aforementioned radar.

[0241] In some embodiments, the electronic device includes: a device body; and an electronic device, such as a radar, disposed on the device body. In one embodiment, the device body is a structure that supports and is signal-connected to a radio device. In one embodiment, the radio device transmits and / or receives radio signals that have been phase-shifted by a phase shifter to perform functions such as target detection and / or communication within a beam scanning range, thereby providing the device body with detection target information and / or communication information, thereby assisting or even controlling the operation of the device body.

[0242] In some embodiments, the electronic device comprising the device body and the aforementioned at least one radio device may be a component or product used in fields such as smart housing, transportation, smart home, consumer electronics, monitoring, industrial automation, in-cabin detection, and health care. For example, the device body may be intelligent transportation equipment (such as cars, bicycles, motorcycles, ships, subways, trains, etc.), security equipment (such as cameras), liquid level / flow rate detection equipment, smart wearable devices (such as bracelets, glasses, etc.), smart home devices (such as sweeping robots, door locks, televisions, air conditioners, smart lights, etc.), various communication devices (such as mobile phones, tablets, etc.), as well as gates, smart traffic lights, smart signs, traffic cameras, and various industrial robotic arms (or robots). It may also be various instruments for detecting vital signs and various devices equipped with the instruments, such as in-cabin detection in automobiles, indoor personnel monitoring, smart medical equipment, consumer electronic devices, etc.

Claims

1. A radio frequency device, comprising a package body encapsulating an IC bare chip; at least one radiating portion is disposed on a surface of the package body, and the radiating portion is connected to the IC bare chip for signal transmission; The surface of the package body is also provided with a plurality of solder balls respectively arranged around each of the radiation parts, and the plurality of solder balls constitute a waveguide channel for the radiation part to transmit signals; the inner circle surrounded by the plurality of solder balls includes a ridge protruding into the circle.

2. The radio frequency device according to claim 1, wherein: Also includes PCB board; Waveguide holes are respectively arranged on the PCB board at locations corresponding to the radiation parts, the package body is mounted on the PCB board, and a plurality of solder balls are arranged around the boundaries of the waveguide holes.

3. The radio frequency device according to claim 2, wherein: The cross-sectional shape of the waveguide hole is the same as the inner circle shape surrounded by the plurality of solder balls around the radiation portion.

4. The radio frequency device according to claim 1, 2 or 3, wherein: The inner ring is a rectangular ring with the ridge inside, or a circular ring with the ridge, or an elliptical ring with the ridge.

5. The radio frequency device according to claim 1 or 2, wherein: The inner ring is a rectangular ring with the ridge portion disposed therein; The ridge portion includes one; the ridge portion is located in the middle or a corner of one side of the rectangular inner circle; Alternatively, the ridges include two ridges, which are respectively located at the middle of two opposite sides or at two opposite corners of the rectangular inner circle.

6. A radio frequency transmission system, comprising: A PCB board, wherein the PCB board has a second surface and a third surface opposite to each other, and at least one first waveguide hole is provided on the PCB board, wherein the first waveguide hole is a ridge-type waveguide hole; A waveguide structure, wherein the waveguide structure has a fourth surface and a fifth surface relative to each other, and a second waveguide hole is arranged on the fourth surface corresponding to each of the first waveguide holes, and the first waveguide holes are connected with the second waveguide holes to form a channel for transmitting radio frequency signals.

7. The radio frequency transmission system according to claim 6, wherein: The second waveguide hole is a ridge waveguide hole or a rectangular waveguide hole.

8. The radio frequency transmission system according to claim 6, wherein: The ridge waveguide hole is a single-ridge waveguide hole or a double-ridge waveguide hole.

9. The radio frequency transmission system according to claim 6, wherein: The fourth surface is connected to the PCB board, and an isolation structure is arranged on the fourth surface.

10. The radio frequency transmission system according to claim 9, wherein: The isolation structure includes a plurality of periodically arranged protrusion structures.

11. The radio frequency transmission system according to claim 10, wherein: The height of the protruding structure is 1 / 4 of the wavelength of the radio frequency signal, and the distance between two adjacent protruding structures is 1 / 2 to 1 / 6 of the wavelength of the radio frequency signal.

12. The radio frequency transmission system according to claim 9 or 10, wherein: The isolation structure comprises a first protruding structure located at the strongest signal field region at the edge of each of the second waveguide holes; The isolation structure further includes at least one second protruding structure disposed around the first protruding structure, and a cross-sectional diameter of the first protruding structure is greater than or equal to a cross-sectional diameter of the second protruding structure.

13. The radio frequency transmission system according to claim 12, wherein: The height of the second protruding structure is 1 / 4 of the wavelength of the radio frequency signal, and the diameter of the second protruding structure is 1 / 3 to 1 / 10 of the wavelength of the radio frequency signal.

14. The radio frequency transmission system according to claim 12, wherein: A gap between the upper surface of the first convex structure and the second convex structure and the third surface is no more than 400 μm.

15. The radio frequency transmission system according to claim 12, wherein: The distance between the first protruding structure and the adjacent second protruding structure is [1 / 2λ, 1 / 6λ], where λ is the operating wavelength of the radio frequency signal.

16. The radio frequency transmission system according to claim 12, wherein: The first protrusion structure and the second protrusion structure are at least one of a rectangular parallelepiped, a cylindrical, and a truncated cone shape.

17. The radio frequency transmission system according to claim 6, wherein: At least one antenna unit is disposed on the fifth surface, and the second waveguide hole is connected to the antenna unit from one end of the wide side surface of the antenna unit or a middle position of the wide side surface.

18. The radio frequency transmission system according to claim 17, wherein: The second waveguide hole includes two cavity segments with rectangular cross sections, and a stepped transition structure is provided at the connection between adjacent cavity segments.

19. The radio frequency transmission system according to any one of claims 6 to 18, wherein: The second waveguide holes are arranged in an array, and the long sides of two adjacent second waveguide holes are perpendicular to each other.

20. The radio frequency transmission system according to any one of claims 6 to 18, wherein: The antenna unit includes a plurality of radiation slots for transmitting and / or receiving the radio frequency signal.

21. A radio frequency system comprising: A package, and a radio frequency transmission system as claimed in any one of claims 6 to 20; At least one radiation portion is disposed on the first surface of the package body, a plurality of solder balls are disposed on the first surface, and the plurality of solder balls are disposed around the radiation portion to form a first waveguide channel; The first surface of the package body is mounted on the second surface of the PCB board, and each of the radiation parts is arranged in a one-to-one correspondence with the first waveguide hole.

22. The radio frequency system according to claim 21, wherein the package comprises a substrate and an IC die; The side of the substrate facing away from the IC bare chip is the first surface. A radio frequency (RF) wiring is arranged inside the substrate, and the radio frequency signal is transmitted to the radiation part through the RF wiring.

23. The radio frequency system according to claim 22, wherein: The substrate comprises a metal layer, a feeder layer and a patch layer; The RF wiring is arranged on the feeder layer, and the radiating part is arranged on the patch layer; the radio frequency signal is coupled to the radiating part through the RF wiring.

24. A radar, comprising the radio frequency device according to any one of claims 1 to 5, or the radio frequency transmission system according to any one of claims 6 to 20, or the radio frequency system according to any one of claims 21 to 23.

25. An electronic device comprising the radar according to claim 24.

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