Cover tape for packaging electronic components, and package

Abstract

The present disclosure provides a cover tape for packaging electronic components which comprises a substrate layer, an interlayer, and a heat seal layer in this order. The surface of the cover tape on the heat seal layer side has an arithmetic average height Sa of 0.4-4.0 μm and the surface of the cover tape on the heat seal layer side has a root-mean-square height Sq of 0.5-5.0 μm. The cover tape for packaging electronic components has a haze of 15% or less.

Description

Cover tape for packaging electronic components and packaging body

[0001] The present disclosure relates to a cover tape for packaging electronic components and a package using the same.

[0002] In recent years, electronic components such as ICs, resistors, transistors, diodes, capacitors, and piezoelectric resistors have been packaged in tape for surface mounting. In tape packaging, electronic components are housed in a carrier tape with multiple compartments for housing the electronic components, and then the carrier tape is heat-sealed with a cover tape to obtain a package for storing and transporting the electronic components. When mounting the electronic components, the cover tape is peeled off the carrier tape, and the electronic components are automatically removed and surface-mounted on a substrate. The cover tape is also called a top tape.

[0003] In a tape package, if the stored electronic components adhere to the surface of the heat seal layer side of the cover tape, the electronic components cannot be stably removed. Therefore, there is a demand for a cover tape that suppresses adhesion of electronic components, i.e., a cover tape that has excellent adhesion resistance for electronic components.

[0004] Furthermore, in a tape package, electronic components contained therein are inspected visually or mechanically through the cover tape when the package is unopened, and therefore, the cover tape must have excellent transparency from the viewpoint of visibility of the electronic components.

[0005] Patent No. 6777216

[0006] In order to improve the adhesion resistance of electronic components to the cover tape, i.e., to make it difficult for electronic components to adhere to the surface of the heat seal layer, it is necessary to increase the surface roughness of the heat seal layer. However, increasing the surface roughness of the heat seal layer increases haze and impairs transparency. Thus, there is a trade-off between adhesion resistance and transparency of electronic components.

[0007] For example, Patent Document 1 discloses a cover tape having a substrate layer, an intermediate layer, and a sealant layer in this order for the purpose of improving transparency, in which the arithmetic mean height Sa of the surface on the sealant layer side is 0.05 μm to 0.35 μm, and the root mean square height Sq of the surface on the sealant layer side is 0.05 μm to 0.35 μm. This cover tape is said to reduce surface irregularities and provide good visibility. However, as mentioned above, reduced surface irregularities make it easier for electronic components to adhere.

[0008] The present disclosure has been made in view of the above circumstances, and has an object to provide a cover tape for packaging electronic components that can suppress adhesion of electronic components and has excellent transparency.

[0009] One embodiment of the present disclosure provides a cover tape for packaging electronic components having a base layer, an intermediate layer, and a heat seal layer in this order, wherein the arithmetic mean height Sa of the surface of the cover tape on the heat seal layer side is 0.4 μm or more and 4.0 μm or less, the root mean square height Sq of the surface of the cover tape on the heat seal layer side is 0.5 μm or more and 5.0 μm or less, and the haze of the cover tape for packaging electronic components is 15% or less.

[0010] Another embodiment of the present disclosure provides a package comprising a carrier tape having a plurality of storage sections for storing electronic components, the electronic components stored in the storage sections, and the above-mentioned cover tape for packaging electronic components arranged to cover the storage sections.

[0011] The cover tape for packaging electronic components according to the present disclosure has the effect of being able to suppress adhesion of electronic components and having excellent transparency.

[0012] 1 is a schematic cross-sectional view illustrating a cover tape for packaging electronic components according to the present disclosure; FIG. 2 is a schematic plan view and a cross-sectional view illustrating a package according to the present disclosure; FIG. 3 is a schematic plan view and a cross-sectional view illustrating a package sample used in Examples;

[0013] Embodiments of the present disclosure will be described below with reference to the drawings and the like. However, the present disclosure can be implemented in many different forms and should not be construed as being limited to the description of the embodiments exemplified below. Furthermore, to clarify the explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual form, but these are merely examples and do not limit the interpretation of the present disclosure. Furthermore, in this specification and each drawing, elements similar to those described above with reference to the previous drawings may be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0014] In this specification, when describing an aspect in which another component is placed on a certain component, the term "above" or "below" refers to both a case in which another component is placed directly above or below the component so as to be in contact with the component, and a case in which another component is placed above or below the component with another component interposed therebetween, unless otherwise specified. Also, in this specification, when describing an aspect in which another component is placed on the surface of a certain component, the term "on the surface side" or "on the surface" refers to both a case in which another component is placed directly above or below the component so as to be in contact with the component, and a case in which another component is placed above or below the component with another component interposed therebetween, unless otherwise specified.

[0015] The cover tape for packaging electronic components and the package according to the present disclosure will be described in detail below. Note that in this specification, the "cover tape for packaging electronic components" may be simply referred to as the "cover tape."

[0016] A. Cover Tape for Packaging Electronic Components The cover tape according to the present disclosure has a base layer, an intermediate layer, and a heat seal layer in this order, wherein the surface of the cover tape facing the heat seal layer has an arithmetic mean height Sa of 0.4 μm or more and 4.0 μm or less, the root mean square height Sq of the surface of the cover tape facing the heat seal layer has an arithmetic mean height Sq of 0.5 μm or more and 5.0 μm or less, and the haze of the cover tape is 15% or less.

[0017] The cover tape according to the present disclosure will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of a cover tape according to the present disclosure. As shown in FIG. 1, the cover tape 1 includes a base layer 2, an intermediate layer 3, and a heat seal layer 4, in this order. In the cover tape 1, the arithmetic mean height Sa of the surface 1A on the heat seal layer 4 side is within a predetermined range, and the root mean square height Sq of the surface 1A on the heat seal layer 4 side is within a predetermined range. In addition, the haze of the cover tape is within a predetermined range.

[0018] 2(a) and 2(b) are schematic plan and cross-sectional views illustrating an example of a package using a cover tape according to the present disclosure, and FIG. 2(b) is a cross-sectional view taken along line A-A in FIG. 2(a). As shown in FIGS. 2(a) and 2(b), the package 10 includes a carrier tape 11 having multiple storage compartments 12 for storing electronic components 13, the electronic components 13 stored in the storage compartments 12, and a cover tape 1 arranged to cover the storage compartments 12. The cover tape 1 is heat-sealed to the carrier tape 11, and a heat-sealed portion 4H is provided in a linear shape with a predetermined width on both ends of the heat-sealed layer 4 of the cover tape 1. Furthermore, in the package 10, the carrier tape 11 may have feed holes 14.

[0019] As described above, cover tapes are required to have adhesion resistance and transparency for electronic components. Generally, the greater the surface roughness of the heat seal layer, the better the adhesion resistance of electronic components tends to be. Furthermore, haze is generally used as an indicator of transparency. It is believed that the surface roughness of the heat seal layer, which is the interface with air, has a significant impact on the diffusion of light that penetrates the cover tape and increases the haze. Therefore, if the surface roughness of the heat seal layer is increased to improve the adhesion resistance of electronic components, the haze will decrease and transparency will deteriorate. Thus, it has been difficult to achieve both adhesion resistance and transparency for electronic components in the past.

[0020] In the present disclosure, the arithmetic mean height Sa of the surface of the heat seal layer side of the cover tape is within a predetermined range, and the root mean square height Sq of the surface of the heat seal layer side of the cover tape is within a predetermined range, so that adhesion of electronic components to the cover tape can be suppressed. In the present disclosure, it was found that the haze of the cover tape can be reduced even when the surface roughness of the heat seal layer is relatively high, and the present invention was completed based on this finding.

[0021] Hereinafter, each configuration of the cover tape according to the present disclosure will be described.

[0022] 1. Physical Properties of the Cover Tape (1) Arithmetic Mean Height Sa of the Surface on the Heat Seal Layer Side of the Cover Tape In the present disclosure, the arithmetic mean height Sa of the surface on the heat seal layer side of the cover tape is 0.4 μm or more, may be 1.0 μm or more, or may be 1.5 μm or more. On the other hand, Sa may be 4.0 μm or less, may be 3.90 μm or less, or may be 3.85 μm or less. That is, Sa may be 0.4 μm or more and 4.0 μm or less, may be 1.0 μm or more and 3.90 μm or less, or may be 1.5 μm or more and 3.85 μm or less. By keeping Sa within the above range, adhesion of electronic components to the cover tape can be suppressed. On the other hand, if Sa is too large, the transparency of the cover tape may be impaired.

[0023] Sa is measured in accordance with ISO 25178 using a Keyence digital microscope "VHX-6000" under the following conditions: <Measurement conditions> Magnification: 20x Measurement mode: Transparent object Measurement range: 1878 μm x 1689 μm Measurement quality: High accuracy Measurement size: Standard (1024 x 768) Analysis: Multi-file analysis application Image processing: Reference plane setting Area setting: All areas

[0024] Methods for adjusting the surface Sa of the heat seal layer side of the cover tape in the present disclosure include, for example, a method of incorporating irregularly shaped particles into the heat seal layer, a method of adjusting the surface roughness of the heat seal layer side of the intermediate layer, and a method of placing an uneven layer between the heat seal layer and the intermediate layer.

[0025] (2) Root-mean-square height Sq of the surface of the heat seal layer side of the cover tape In the present disclosure, the root-mean-square height Sq of the surface of the heat seal layer side of the cover tape is 0.5 μm or more, may be 1.0 μm or more, or may be 2.0 μm or more. On the other hand, Sq may be 5.0 μm or less, may be 4.8 μm or less, or may be 4.6 μm or less. That is, Sq may be 0.5 μm or more and 5.0 μm or less, may be 1.0 μm or more and 4.8 μm or less, or may be 2.0 μm or more and 4.6 μm or less. By having Sq within the above range, adhesion of electronic components to the cover tape can be suppressed and blocking of the cover tape can be suppressed. On the other hand, if Sq is too large, the transparency of the cover tape may be impaired.

[0026] Sq is measured in accordance with ISO 25178 using a digital microscope "VHX-6000" manufactured by Keyence Corporation under the same conditions as those for Sa above.

[0027] Methods for adjusting the Sq of the surface on the heat seal layer side of the cover tape in the present disclosure include, for example, a method of incorporating irregularly shaped particles into the heat seal layer, a method of adjusting the surface roughness of the heat seal layer side of the intermediate layer, and a method of placing an uneven layer between the heat seal layer and the intermediate layer.

[0028] (3) Haze The haze of the cover tape according to the present disclosure is 15% or less, or may be 13% or less, or may be 10% or less. A haze within this range results in a cover tape with good visibility.

[0029] The haze is measured in accordance with JIS K7136:2000 using a haze meter "NDH 7000" manufactured by Nippon Denshoku Industries Co., Ltd.

[0030] Methods for adjusting the haze of the cover tape in the present disclosure include, for example, adjusting the refractive index of the substrate layer and intermediate layer. For example, as described below, when the intermediate layer has a first layer and a second layer in order from the substrate layer side, if the refractive index of the substrate layer, the first layer, and the second layer increases in this order, i.e., substrate layer > first layer > second layer, interlayer reflection can be suppressed and internal haze can be reduced. If the surface roughness of the heat seal layer is high and the refractive index difference between adjacent layers is large, light reflected and diffused inside the cover tape is further reflected and diffused between the layers, resulting in increased haze. In contrast, even if the surface roughness of the heat seal layer is relatively high, if the refractive index difference between adjacent layers is small, interlayer reflection and diffusion can be suppressed, thereby reducing internal haze. Therefore, the haze of the cover tape can be reduced.

[0031] (4) Total Light Transmittance The total light transmittance of the cover tape in the present disclosure is, for example, preferably 80% or more, and more preferably 85% or more. A cover tape having such optical properties will have good visibility. The total light transmittance is measured using a haze meter "NDH 7000" manufactured by Nippon Denshoku Industries Co., Ltd. in accordance with JIS K7361-1:1997.

[0032] 2. Heat Seal Layer The heat seal layer in the present disclosure adheres the cover tape and carrier tape by heat sealing the cover tape to the carrier tape when a package is produced using the cover tape of the present disclosure.

[0033] The heat seal layer contains a thermoplastic resin. Examples of the thermoplastic resin include (meth)acrylic resins, polyester resins, polyurethane resins, vinyl chloride-vinyl acetate copolymers, ethylene-vinyl acetate copolymers, polyethylene resins, and resins containing these as main components. Among these, (meth)acrylic resins are preferred.

[0034] The (meth)acrylic resin refers to a homopolymer composed of a (meth)acrylic monomer unit and a copolymer containing a (meth)acrylic monomer unit. The (meth)acrylic monomer unit is referred to as a structural unit derived from a (meth)acrylic monomer. Examples of the (meth)acrylic monomer include (meth)acrylic acid and (meth)acrylic acid esters. The (meth)acrylic monomer unit is preferably a (meth)acrylic acid ester such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, or isobutyl (meth)acrylate.

[0035] Examples of homopolymers composed of (meth)acrylic monomer units include polymethyl(meth)acrylate, polyethyl(meth)acrylate, polybutyl(meth)acrylate, and methyl(meth)acrylate-butyl(meth)acrylate copolymers.

[0036] Examples of monomers copolymerizable with (meth)acrylic monomers include styrene-based monomers such as styrene, chlorostyrene, chloromethylstyrene, t-butylstyrene, and vinyltoluene. Examples of copolymers containing (meth)acrylic monomer units include styrene-methyl(meth)acrylate copolymers and styrene-ethyl(meth)acrylate copolymers. The copolymers may be random copolymers, block copolymers, or graft copolymers. Among these, styrene-methyl(meth)acrylate copolymers are preferred from the viewpoint of sealability to carrier tapes.

[0037] The heat seal layer preferably contains irregularly shaped particles. In this specification, "irregularly shaped particles" refers to non-spherical particles. Irregularly shaped particles can be any particle of various shapes, such as acicular, plate-like, scale-like, fibrous, or dendritic. Among these, acicular particles are preferred. Since the surface roughness of the heat seal layer increases when acicular particles are oriented vertically or overlap with each other, the Sa and Sq of the surface of the heat seal layer side of the cover tape can be easily adjusted to fall within a specified range. Furthermore, when the acicular particles are conductive, they function as an antistatic agent. In this case, the antistatic performance is enhanced. Therefore, high antistatic performance can be achieved with a small amount of antistatic agent. This allows the heat seal layer to be thinner and more transparent.

[0038] The acicular particles refer to particles having an aspect ratio of the major axis to the minor axis, that is, a ratio of the major axis to the minor axis, of 10 or more.

[0039] The average major axis of the acicular particles is, for example, 100 nm or more and 2000 nm or less, and may be, for example, 200 nm or more and 2000 nm or less. The average minor axis of the acicular particles is, for example, 100 nm or less and may be, for example, 50 nm or less. The ratio of the average major axis to the average minor axis of the acicular particles, i.e., the average aspect ratio, is, for example, preferably 10 or more, and more preferably 20 or more and 30 or less. The median diameter D50 of the acicular particles is, for example, 70 nm or more and 250 nm or less, and may be, for example, 100 nm or more and 220 nm or less.

[0040] The major axis and minor axis of the acicular particles are measured by observation with a scanning electron microscope (SEM). The average major axis and average minor axis of the acicular particles are average values ​​obtained by measuring 30 particles randomly observed with a scanning electron microscope (SEM). The median diameter D50 of the acicular particles is a value obtained by measuring 30 particles randomly observed with a scanning electron microscope (SEM).

[0041] The acicular particles are preferably conductive particles, since they function as an antistatic agent. Examples of such acicular particles include antimony-doped tin oxide particles, aluminum-doped zinc oxide particles, barium sulfate particles coated with antimony-doped tin oxide, and silicon dioxide particles coated with antimony-doped tin oxide. Among these, antimony-doped tin oxide acicular particles are preferred from the viewpoint of transparency.

[0042] The content of irregular-shaped particles in the heat seal layer is not particularly limited as long as the Sa and Sq of the surface of the cover tape facing the heat seal layer are within the specified range. The content of irregular-shaped particles in the heat seal layer is, for example, 30% by mass or more, or may be 35% by mass or more, or 40% by mass or more. On the other hand, the content of irregular-shaped particles in the heat seal layer is, for example, 70% by mass or less, or may be 65% by mass or less, or may be 60% by mass or less. That is, the content of irregular-shaped particles in the heat seal layer is, for example, 30% by mass or more to 70% by mass or less, or 35% by mass or more to 65% by mass or less, or may be 40% by mass or more to 60% by mass or less. If the content of irregular-shaped particles is too low, the Sa and Sq of the surface of the cover tape facing the heat seal layer may not fall within the specified range. Furthermore, if the content of irregular-shaped particles is too high, transparency may be impaired.

[0043] The heat seal layer may contain additives such as an antistatic agent, an antiblocking agent, a dispersant, a filler, a plasticizer, a colorant, a tackifier, etc., as needed. Among these, the heat seal layer preferably contains an antistatic agent, and more preferably contains the irregular-shaped particles as the antistatic agent.

[0044] The thickness of the heat seal layer is not particularly limited. The thickness of the heat seal layer is, for example, 1 μm or more. On the other hand, the thickness of the heat seal layer is, for example, 30 μm or less, and may be 5 μm or less. That is, the thickness of the heat seal layer is, for example, 1 μm or more and 30 μm or less, and may be 1 μm or more and 5 μm or less. If the thickness of the heat seal layer is too thin, the heat sealability may be poor or a uniform film may not be obtained. On the other hand, if the thickness of the heat seal layer is too thick, the transparency of the cover tape may be reduced.

[0045] In this specification, the thickness of each layer is a value measured by observing the cross section of the cover tape with an optical microscope.

[0046] The method for forming the heat seal layer is not particularly limited, and known methods can be used. For example, a method (extrusion lamination) can be used in which a heat-molten film raw material is extruded onto a substrate layer or an intermediate layer using a T-die or the like, and then pressure-bonded to the substrate layer or intermediate layer using a laminator (cooling roll). Another example is a method in which a pre-manufactured film is bonded to the substrate layer or intermediate layer with an adhesive. Examples of adhesives that can be used include polyester adhesives, polyurethane adhesives, and acrylic adhesives.

[0047] Another method for forming the heat seal layer includes, for example, using a composition for a heat seal layer in which a thermoplastic resin, additives, etc. are dispersed or dissolved in a solvent, applying the composition for a heat seal layer to a base layer, and drying the composition. Examples of methods for applying the composition for a heat seal layer include known application methods such as roll coating, reverse roll coating, gravure coating, gravure reverse coating, comma coating, bar coating, wire bar coating, rod coating, kiss coating, knife coating, die coating, flow coating, dip coating, and spray coating.

[0048] 3. Intermediate Layer The intermediate layer in the present disclosure is disposed between the substrate layer and the heat seal layer. By disposing the intermediate layer between the substrate layer and the heat seal layer, the adhesion between the substrate layer and the heat seal layer can be improved. Furthermore, when the cover tape in the present disclosure is heat-sealed to the carrier tape, the intermediate layer improves cushioning. Therefore, heat can be applied more uniformly to the heat seal layer.

[0049] The refractive index of the intermediate layer is preferably lower than that of the base layer. Furthermore, as described below, when the intermediate layer has a first layer and a second layer in order from the base layer side, the refractive index of the base layer is preferably higher than that of the first layer, and then that of the second layer, i.e., the order is base layer > first layer > second layer. This reduces the difference in refractive index between adjacent layers, thereby reducing the haze of the cover tape.

[0050] The refractive index of the intermediate layer may be equal to or greater than the refractive index of the heat seal layer, or may be equal to or less than the refractive index of the heat seal layer. Since the thickness of the heat seal layer is relatively thin, it is thought that this will not significantly affect visibility.

[0051] The refractive index of the intermediate layer is, for example, 1.51 or more and 1.58 or less. As will be described later, when the intermediate layer has a first layer and a second layer in this order from the base layer side, the refractive index of the first layer is, for example, 1.55 or more and 1.58 or less. The refractive index of the second layer is, for example, 1.51 or more and 1.54 or less. The refractive index is measured using an Abbe refractometer "DR-A1" manufactured by Atago Co., Ltd.

[0052] The intermediate layer contains a resin. The resin used in the intermediate layer is appropriately selected depending on the materials of the base layer and the heat seal layer so that the refractive index of each layer satisfies the above relationship. In particular, the intermediate layer preferably contains an ethylene-(meth)acrylic resin. In this case, the refractive index of each layer satisfies the above relationship.

[0053] The ethylene-(meth)acrylic resin refers to a copolymer containing at least an ethylene monomer unit and a (meth)acrylic monomer unit. The ethylene monomer unit refers to a structural unit derived from an ethylene monomer. The (meth)acrylic monomer unit refers to a structural unit derived from a (meth)acrylic monomer. Examples of (meth)acrylic monomers include (meth)acrylic acid and (meth)acrylic acid esters. Of these, (meth)acrylic acid is preferred. The presence of a polar structural unit such as (meth)acrylic acid or (meth)acrylic acid ester is thought to improve the adhesion between the intermediate layer and the heat seal layer.

[0054] Examples of (meth)acrylic acid and (meth)acrylic acid esters include (meth)acrylic acid, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, octyl (meth)acrylate, dodecyl (meth)acrylate, stearyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and dimethylaminoethyl (meth)acrylate.

[0055] In this specification, (meth)acrylic acid refers to at least one of acrylic acid and methacrylic acid.

[0056] The ratio of the (meth)acrylic monomer unit in the ethylene-(meth)acrylic resin is preferably 1.3% by mass or more, and may be 2.0% by mass or more. When the ratio of the (meth)acrylic monomer unit is within the above range, the adhesion between the intermediate layer and the heat-seal layer is improved. When the adhesion between the intermediate layer and the heat-seal layer is improved, light diffusion at the interface between the intermediate layer and the heat-seal layer is suppressed, thereby improving transparency. On the other hand, the ratio of the (meth)acrylic monomer unit in the ethylene-(meth)acrylic resin is preferably 8.0% by mass or less, and may be 5.0% by mass or less. When the intermediate layer has a first layer and a second layer as described below, when the ratio of the (meth)acrylic monomer unit is within the above range, the adhesion between the first layer and the second layer is improved. When the adhesion between the first layer and the second layer is improved, diffusion at the interface between the first layer and the second layer is suppressed, thereby improving transparency. The ratio of the (meth)acrylic monomer unit in the ethylene-(meth)acrylic resin is preferably 1.3% by mass or more and 8.0% by mass or less, and may be 2.0% by mass or more and 5.0% by mass or less.

[0057] The ratio of the (meth)acrylic monomer unit in the ethylene-(meth)acrylic resin is a value obtained by measuring the acid content by FT-IR.

[0058] The ratio of ethylene monomer units in the ethylene-(meth)acrylic resin is preferably 98.7% by mass or less, and may be 98.0% by mass or less. On the other hand, the ratio of ethylene monomer units in the ethylene-(meth)acrylic resin is preferably 92.0% by mass or more, and may be 95.0% by mass or more. The ratio of ethylene monomer units in the ethylene-(meth)acrylic resin is preferably 92.0% by mass or more and 98.7% by mass or less, and may be 95.0% by mass or more and 98.0% by mass or less.

[0059] The content of the ethylene-(meth)acrylic resin in the intermediate layer is not particularly limited as long as the refractive index of each layer satisfies the above relationship, and may be, for example, 10% by mass or more, 35% by mass or more, 60% by mass or more, or 100% by mass.

[0060] The intermediate layer may contain a resin other than an ethylene-(meth)acrylic resin. Examples of resins other than an ethylene-(meth)acrylic resin include polyolefin resins and ethylene-vinyl acetate copolymers. Examples of polyolefin resins include polyethylene resins and polypropylene resins. Among these, polyethylene resins are preferred. Preferred polyethylene resins are low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE). The density of low-density polyethylene is 0.900 g / cm ３ Super 0.925g / cm ３ The density of the linear low density polyethylene is preferably 0.900 g / cm ３ Super 0.925g / cm ３ The following is preferred: The density of polyethylene is measured in accordance with JIS K7112:1999.

[0061] The intermediate layer may be a single layer or a laminate of multiple layers of the same or different types.

[0062] When the intermediate layer is a laminate having a first layer and a second layer in this order from the base layer side, it is preferable that the first layer located on the base layer side contains an ethylene-(meth)acrylic resin. This reduces the difference in refractive index between the base layer and the first layer, thereby reducing the haze of the cover tape. The first layer may contain a resin other than an ethylene-(meth)acrylic resin. The resin other than the ethylene-(meth)acrylic resin is as described above. The content of the ethylene-(meth)acrylic resin in the first layer is not particularly limited as long as the refractive index of each layer satisfies the above relationship, and may be, for example, 30% by mass or more, 50% by mass or more, 80% by mass or more, or even 100% by mass.

[0063] On the other hand, the second layer located on the heat seal layer side may or may not contain an ethylene-(meth)acrylic resin. The second layer preferably contains a polyethylene resin. In particular, from the viewpoint of heat sealability, the second layer preferably contains low-density polyethylene.

[0064] The surface of the intermediate layer facing the heat seal layer may have irregularities, which allows adjustment of the Sa and Sq of the surface of the cover tape facing the heat seal layer. The surface roughness of the intermediate layer facing the heat seal layer is not particularly limited as long as the Sa and Sq of the surface of the cover tape facing the heat seal layer are within the specified ranges.

[0065] The method for adjusting the surface roughness of the heat seal layer side of the intermediate layer can be extrusion lamination using a lami roll (cooling roll) with a predetermined plate shape.The surface treatment method of the mold for making the lami roll with a predetermined plate shape can be wet blasting, dry blasting, etc., sandblasting treatment, surface treatment with sandpaper, belt sander, wire brush, etc., embossing treatment, laser treatment, polishing treatment, etching treatment, etc.The surface roughness of the lami roll used for forming the intermediate layer is not particularly limited, as long as it can form an intermediate layer that can make the Sa and Sq of the surface of the heat seal layer side of the cover tape within a predetermined range.

[0066] Furthermore, methods for adjusting the surface roughness of the intermediate layer include selecting the resin used for the intermediate layer. Examples include adjusting the molecular weight of the resin and adjusting the melt mass flow rate (MFR) of the resin. Resins with low molecular weights have high fluidity when melted, and therefore easily penetrate the irregularities of the laminar roll. Furthermore, resins with MFRs within a predetermined range tend to flow easily into the irregularities of the laminar roll when melted, and therefore easily reflect the irregularities of the laminar roll. Therefore, the surface roughness of the intermediate layer can be adjusted by easily reflecting the irregularities of the laminar roll.

[0067] The surface roughness of the intermediate layer can be adjusted by roughening the surface of the intermediate layer on the heat seal layer side by surface treatment such as plasma treatment, corona discharge treatment, UV ozone treatment or the like.

[0068] The thickness of the intermediate layer is, for example, 20 μm or more, and may be 30 μm or more. On the other hand, the thickness of the intermediate layer is, for example, 200 μm or less, and may be 150 μm or less. That is, the thickness of the intermediate layer may be, for example, 20 μm or more and 200 μm or less, and 30 μm or more and 150 μm or less.

[0069] When the intermediate layer has a first layer and a second layer in order from the base layer side, the thickness of the first layer is, for example, 30 μm or less, and may be 20 μm or less. If the thickness of the first layer is within the above range, heat transfer to the second layer and the heat seal layer during sealing is good, and low-temperature sealing properties are excellent. On the other hand, the thickness of the first layer is, for example, 5 μm or more, and may be 10 μm or more. If the thickness of the first layer is within the above range, cushioning properties are excellent. Specifically, the thickness of the first layer may be 5 μm or more and 30 μm or less, and may be 10 μm or more and 20 μm or less.

[0070] The ratio (T1 / T0) of the thickness T1 of the first layer to the thickness T0 of the intermediate layer is, for example, 0 or more, and may be 0.5 or more, 0.6 or more, or 0.7 or more. On the other hand, T1 / T0 is, for example, less than 1.0, and may be 0.9 or less, or 0.8 or less. That is, T1 / T0 is, for example, 0 or more and 0.9 or less, 0.5 or more and 0.9 or less, 0.6 or more and 0.8 or less, or 0.7 or more and 0.8 or less.

[0071] The thickness of the second layer is, for example, 20 μm or less, or may be 15 μm or less, or may be 10 μm or less. If the thickness of the second layer is within the above range, the peel strength will not be too strong, and the seal curve (a graph curve plotting peel strength against heat sealing temperature) will be smooth. On the other hand, the thickness of the second layer may be, for example, 3 μm or more, or may be 5 μm or more. If the thickness of the second layer is within the above range, the adhesion to the heat seal layer will be improved. That is, the thickness of the second layer is, for example, 3 μm or more and 20 μm or less, or may be 3 μm or more and 15 μm or less, or 5 μm or more and 10 μm or less.

[0072] The ratio (T2 / T0) of the thickness T2 of the second layer to the thickness T0 of the intermediate layer is, for example, 0.1 or more, or may be 0.2 or more, or 0.3 or more. On the other hand, T2 / T0 is, for example, 1.0 or less, or may be 0.6 or less, or may be 0.5 or less. That is, T2 / T0 is, for example, 0.1 or more and 1.0 or less, or 0.2 or more and 0.6 or less, or 0.3 or more and 0.5 or less.

[0073] A film can be used as the intermediate layer. In this case, the lamination method for the substrate layer and intermediate layer is not particularly limited, and known methods can be used. For example, a method (extrusion lamination) can be used in which a heat-molten film raw material is extruded onto the substrate layer using a T-die or the like, rapidly solidified with a cooling roll, and then pressure-bonded to the substrate layer. This results in an intermediate layer being formed on one side of the substrate layer. It is preferable that an anchor coat layer is formed in advance on the surface of the substrate layer on which the intermediate layer will be disposed. Another method can be used in which a pre-manufactured film is bonded to the substrate layer with an adhesive. When the intermediate layer is a laminate, examples of methods for forming the intermediate layer film include selecting a resin material for the first layer and a resin material for the second layer and forming an intermediate layer film having the first and second layers using a conventional film-forming method such as an inflation method or a T-die method.

[0074] 4. Substrate Layer The substrate layer in the present disclosure is a layer that supports the intermediate layer and the heat seal layer.

[0075] As described above, the refractive index of the substrate layer is preferably higher than the refractive index of the intermediate layer, and is, for example, 1.60 or more and 1.66 or less.

[0076] Various materials can be used for the base layer as long as they have the mechanical strength to withstand external forces during storage and transportation, and the heat resistance to withstand manufacturing and taping packaging. Examples include polyester, polyamide, polyolefin, etc. Examples of polyester include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer, etc. Examples of polyamide include nylon 6, nylon 66, nylon 610, etc. Examples of polyolefin include polyethylene, polypropylene, polymethylpentene, etc. Among these, polyester is preferred, with polyethylene terephthalate and polyethylene naphthalate being more preferred. These materials are low cost and have good mechanical strength. In particular, polyethylene terephthalate is preferred from the viewpoint of the relationship between the refractive indexes of the individual layers.

[0077] The base layer may contain additives as needed, such as fillers, plasticizers, colorants, and antistatic agents.

[0078] The substrate layer may be a single layer or a laminate of multiple layers of the same or different types. The substrate layer may be a stretched film or an unstretched film. In particular, the substrate layer may be a film that has been stretched uniaxially or biaxially to improve its strength.

[0079] The thickness of the substrate layer is, for example, 2.5 μm or more, or may be 6 μm or more, or 12 μm or more. The thickness of the substrate layer is, for example, 300 μm or less, or may be 100 μm or less, or may be 50 μm or less. That is, the thickness of the substrate layer is, for example, 2.5 μm or more and 300 μm or less, or may be 6 μm or more and 100 μm or less, or may be 12 μm or more and 50 μm or less. If the thickness of the substrate layer is too thick, the rigidity during tape packaging increases, which is disadvantageous in terms of handling and cost. If the thickness of the substrate layer is too thin, the water vapor barrier property may decrease and the mechanical strength may be insufficient.

[0080] 5. Other Configurations (1) Antistatic Layer In the present disclosure, an antistatic layer is preferably disposed on the surface of the substrate layer opposite the intermediate layer. The antistatic layer is a layer for preventing the cover tape from becoming electrically charged. The presence of the antistatic layer can suppress the generation of static electricity due to contact with other surfaces and can suppress the adhesion of dirt, dust, etc. to the surface of the cover tape due to static electricity.

[0081] The antistatic layer can be formed by coating the substrate layer with an antistatic agent. Examples of antistatic agents include conductive polymers, such as polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylene vinylene, and polyvinyl carbazole. Among these, the conductive polymer is preferably one or more selected from the group consisting of polythiophene, polyaniline, and polypyrrole. This is because sufficient antistatic properties and transparency independent of humidity can be obtained. Examples of polythiophenes that are preferably used include PEDOT / PSS (poly(3,4-ethylenedioxythiophene) / polystyrene sulfonic acid). Examples of polyanilines that are preferably used include sulfonated polyaniline. Antistatic layers containing the above-mentioned conductive polymers are preferred because they can achieve low surface resistivity even at thin thicknesses. A thin antistatic layer can improve the light transmittance of the cover tape. Furthermore, a thin antistatic layer can reduce the light absorption rate of the cover tape. This can improve the transparency of the cover tape.

[0082] The antistatic layer of the present disclosure may also contain an antistatic agent other than a conductive polymer. Examples of antistatic agents other than a conductive polymer include polymer surfactants and low-molecular-weight surfactants. These surfactants are available in nonionic, cationic, and anionic types. Among these, cationic polymer surfactants are preferred from the viewpoints of antistatic performance and coatability. As the cationic polymer surfactant, polymer quaternary ammonium salts are preferred. The counter anion of the quaternary ammonium salt is not particularly limited, and examples thereof include halogen ions and sulfide ions. Aryl groups and alkyl groups are substituted for the first to third positions of the ammonium, and although not particularly limited, a group having six or fewer carbon atoms is preferred from the viewpoints of solubility. As the main chain of the polymer quaternary ammonium salt, an acrylic main chain is preferred from the viewpoints of transparency and substrate adhesion. The antistatic layer may also contain a resin.

[0083] The antistatic layer may be formed, for example, by using a composition for an antistatic layer, in which an antistatic agent or the like is dispersed or dissolved in a solvent, applying the composition for an antistatic layer to the other surface of the substrate layer, and then drying the composition. Examples of the method for applying the composition for an antistatic layer include known coating methods such as air doctor coating, blade coating, knife coating, rod coating, bar coating, direct roll coating, reverse roll coating, gravure coating, and slide coating.

[0084] The thickness of the antistatic layer is, for example, 0.02 μm to 3 μm, and by making the antistatic layer have such a thickness, it is possible to impart antistatic properties to the cover tape.

[0085] (2) Adhesive Layer The cover tape of the present disclosure may have an adhesive layer between the base layer and the intermediate layer, or between the intermediate layer and the heat-sealing layer. The adhesive layer can improve adhesion between the base layer and the intermediate layer, or between the intermediate layer and the heat-sealing layer.

[0086] The adhesive layer may be appropriately selected depending on the materials used for the base layer, intermediate layer, and heat seal layer, and is not particularly limited. For example, an olefin-based adhesive, an acrylic-based adhesive, an isocyanate-based adhesive, a urethane-based adhesive, or an ester-based adhesive may be used for the adhesive layer.

[0087] The adhesive layer can be formed by coating an adhesive composition, which is not particularly limited and can be gravure coating, roll coating, or the like.

[0088] The thickness of the adhesive layer is not particularly limited as long as it can improve the adhesion between the base layer and the intermediate layer or between the intermediate layer and the heat seal layer, and may be adjusted as appropriate.

[0089] (3) Concave-convex layer The cover tape of the present disclosure may have a concave-convex layer between the intermediate layer and the heat seal layer. By disposing the concave-convex layer, Sa and Sq of the surface of the cover tape on the heat seal layer side can be adjusted.

[0090] The surface roughness of the uneven layer on the heat seal layer side is not particularly limited as long as Sa and Sq of the surface on the heat seal layer side of the cover tape are within the predetermined ranges.

[0091] The method for adjusting the surface roughness of the heat-seal layer side of the concave-convex layer is the same as the method for adjusting the surface roughness of the heat-seal layer side of the intermediate layer. Another method for adjusting the surface roughness of the heat-seal layer side of the concave-convex layer is to press an embossing plate against the surface of the heat-seal layer side of the concave-convex layer to form a shape.

[0092] The material of the concave-convex layer is the same as the material of the intermediate layer.

[0093] The thickness of the uneven layer is, for example, 1 μm or more, and may be 2 μm or more. On the other hand, the thickness of the uneven layer is, for example, 5 μm or less, and may be 4 μm or less. That is, the thickness of the uneven layer may be, for example, 1 μm or more and 5 μm or less, and may be 2 μm or more and 4 μm or less.

[0094] The method for forming the irregularity layer is not particularly limited as long as it is a method that can form an irregularity layer having a desired surface roughness.

[0095] B. Package The package according to the present disclosure includes a carrier tape having a plurality of storage sections for storing electronic components, the electronic components stored in the storage sections, and the above-described cover tape arranged to cover the storage sections.

[0096] 2(a) and 2(b) are a schematic plan view and a cross-sectional view showing an example of a package according to the present disclosure. Since Fig. 2(a) and Fig. 2(b) were described above in the section "A. Cover tape for packaging electronic components," their description will be omitted here.

[0097] Each configuration of the packaging body of the present disclosure will be described below.

[0098] 1. Cover Tape The cover tape in the present disclosure has been described above in the section "A. Cover tape for packaging electronic components," so a description thereof will be omitted here.

[0099] In the package of the present disclosure, the heat seal layer of the cover tape and the carrier tape are bonded together by a heat seal portion. The heat seal portion can be located, for example, in a portion where the heat seal layer of the cover tape contacts the carrier tape. That is, the heat seal layer may have a heat seal portion and a non-heat seal portion. This improves the peelability of the cover tape from the carrier tape.

[0100] 2. Carrier Tape The carrier tape in the present disclosure is a member having a plurality of storage sections for storing electronic components.

[0101] The carrier tape may be any tape having a plurality of storage compartments, and may be, for example, an embossed carrier tape (also called an embossed tape), a punched carrier tape (also called a punched tape), or a pressed carrier tape (also called a pressed tape). Of these, an embossed carrier tape is preferably used from the viewpoints of cost, formability, dimensional accuracy, etc.

[0102] Examples of materials for the carrier tape include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin, as well as paper. In this specification, paper refers to a material containing cellulose as its main component and may further contain a resin component.

[0103] The thickness of the carrier tape is appropriately selected depending on the material of the carrier tape, the thickness of the electronic components, etc. The thickness of the carrier tape is, for example, 30 μm or more and 1500 μm or less. If the thickness of the carrier tape is too thick, the formability may be poor. On the other hand, if the thickness of the carrier tape is too thin, the strength may be insufficient.

[0104] The carrier tape has a plurality of storage sections. The storage sections are usually arranged at predetermined intervals along the longitudinal direction of the carrier tape. The size, depth, pitch, etc. of the storage sections are appropriately adjusted depending on the size, thickness, etc. of the electronic components.

[0105] A general carrier tape molding method can be applied as a method for forming a carrier tape having a storage portion, and the method can be appropriately selected depending on the type and material of the carrier tape, etc. Examples include press molding, vacuum molding, pressure molding, punching, and compression processing.

[0106] 3. Electronic Components Electronic components used in the packaging of the present disclosure are not particularly limited and include, for example, ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light-emitting diodes), liquid crystals, piezoelectric element resistors, filters, quartz oscillators, quartz vibrators, connectors, switches, volumes, relays, etc. The type of IC is also not particularly limited.

[0107] 4. Other The packaging body in the present disclosure is used for storing and transporting electronic components. The electronic components are stored and transported in the packaging body and are then mounted. During mounting, the cover tape is peeled off, the electronic components stored in the carrier tape storage compartment are removed, and the components are mounted on a substrate or the like.

[0108] The present disclosure is not limited to the above-described embodiments. The above-described embodiments are merely examples, and any configuration that is substantially identical to the technical idea described in the claims of the present disclosure and that provides similar effects is included within the technical scope of the present disclosure.

[0109] The present disclosure will be described in more detail below with reference to examples and comparative examples.

[0110] [Example 1] A 12 μm thick biaxially stretched polyethylene terephthalate film ("E7415" manufactured by Toyobo Co., Ltd., hereinafter referred to as PET film) was prepared as a substrate layer, with one side subjected to a corona treatment. An ethylene-methacrylic acid copolymer (EMAA1, "Nucrel AN4223C" manufactured by Mitsui-Dow Polychemicals, density 0.930 g / cm) was applied to the corona-treated surface of the PET film as a resin constituting the first layer of the intermediate layer. ３ The resin constituting the second intermediate layer was linear low-density polyethylene (LLDPE, manufactured by Prime Polymer Co., Ltd., "Evolue SP1071C", density 0.910 g / cm ３ ) was used to form a 35 μm thick intermediate layer, consisting of a 5 μm thick first layer and a 30 μm thick second layer, by a two-layer co-extrusion film formation method. Subsequently, the surface of the intermediate layer opposite the substrate layer side was subjected to corona treatment. Next, the heat seal layer composition 1 described below was applied to the surface of the intermediate layer opposite the substrate layer side and dried to form a 2 μm thick heat seal layer. This produced a cover tape having, in order, the substrate layer, the first intermediate layer, the second intermediate layer, and the heat seal layer.

[0111] <Heat seal layer composition 1> - 25 parts by mass of styrene-methyl methacrylate copolymer - 75 parts by mass (solids content) of acicular particles ("FSS-10M," an acicular transparent conductive material manufactured by Ishihara Sangyo Kaisha, Ltd., a 30% solids dispersion of acicular particles of antimony-doped tin oxide)

[0112] [Example 2] The same PET film as in Example 1 was prepared. A urethane anchor coating agent was applied to the corona-treated surface of the PET film to form an adhesive layer with a dry thickness of 2 μm. Next, an ethylene-methacrylic acid copolymer (EMAA1, "Nucrel AN4223C" manufactured by Mitsui-Dow Polychemicals, density 0.930 g / cm) was applied. ３ , acid content 1.3 wt%), and linear low-density polyethylene (LLDPE, Prime Polymer Co., Ltd. "Evolue SP1071C", density 0.910 g / cm ３ ) were mixed in a 1:1 weight ratio, and an intermediate layer having a thickness of 35 μm was formed by extrusion film formation. Subsequently, the surface of the intermediate layer opposite to the surface on the substrate layer side was subjected to corona treatment. Next, the heat seal layer composition 2 described below was applied to the surface of the intermediate layer opposite to the surface on the substrate layer side, and dried to form a heat seal layer having a thickness of 2 μm. In this way, a cover tape having a substrate layer, an intermediate layer, and a heat seal layer in this order was produced.

[0113] <Heat seal layer composition 2> - 40 parts by mass of styrene-methyl methacrylate copolymer - 60 parts by mass (solids content) of acicular particles ("FSS-10M," an acicular transparent conductive material manufactured by Ishihara Sangyo Kaisha, Ltd., a 30% solids dispersion of acicular particles of antimony-doped tin oxide)

[0114] [Comparative Example 1] A linear low-density polyethylene (LLDPE, "Evolue SP2520" manufactured by Prime Polymer Co., Ltd., density 0.925 g / cm) was used as the resin constituting the first layer of the intermediate layer. ３ ) was used, and the resin constituting the second intermediate layer was a mixed resin (density 0.960 g / cm) of 55% by mass of linear low-density polyethylene (LLDPE, manufactured by Prime Polymer Co., Ltd. under the trade name "Ultzex ​​2021L") and 45% by mass of styrene-butadiene block copolymer (manufactured by Asahi Kasei Chemicals Corporation under the trade name "Asaflex 810"). ３ ) was used to prepare a 35 μm thick intermediate layer film consisting of a 25 μm thick first layer and a 10 μm thick second layer by a two-layer co-extrusion film formation method.

[0115] A 12 μm-thick biaxially oriented polyethylene terephthalate film ("E7415" manufactured by Toyobo Co., Ltd., hereinafter referred to as PET film) was prepared as the base layer, with one side subjected to corona treatment. A urethane-based anchor coating agent was applied to the corona-treated surface of the PET film, forming an adhesive layer with a dry thickness of 2 μm. The intermediate layer film was attached to the adhesive layer surface of the PET film, thereby laminating the intermediate layer on the base layer. Next, corona treatment was applied to the surface of the intermediate layer opposite the substrate layer side. Next, the heat seal layer composition 3 described below was applied to the surface of the intermediate layer opposite the substrate layer side and dried to form a 2 μm-thick heat seal layer. This produced a cover tape having, in order, a base layer, a first intermediate layer, a second intermediate layer, and a heat seal layer.

[0116] <Heat seal layer composition 3> Styrene-methyl methacrylate copolymer: 40 parts by mass Spherical particles (transparent conductive material "SNS-10M" manufactured by Ishihara Sangyo Kaisha, Ltd.): 60 parts by mass (solid content)

[0117] [Evaluation] (1) Sa and Sq of the surface on the heat seal layer side of the cover tape Sa and Sq of the surface on the heat seal layer side of the cover tape were measured using the method described above in the section "A. Cover tape for packaging electronic components 1. Physical properties of the cover tape."

[0118] (2) Haze The haze of the cover tape was measured by the method described above in the section "A. Cover tape for packaging electronic components 1. Physical properties of the cover tape."

[0119] (3) Surface Resistivity The surface resistivity of the heat seal layer side of the cover tape was measured using a resistivity meter "Hiresta UP MCP-HT450" manufactured by Nitto Seiko Analytech Co., Ltd. under the following test conditions. <Test conditions> Probe: UA probe Applied voltage: 10 １０ Ω / □ Less than 10V 10 １０ Ω / □ or more 10 １２ Ω / □ Less than 500V 10 １３Ω / □ or more 1000V ・Sample size: 5.5mm x 100mm ・Measurement point: Center of sample ・Measurement value: Measure at 5 points so that the measurement points do not overlap, and use the average value ・Time for one measurement: Use the display after 10 seconds ・Sample storage before measurement: Store in an environment of 25°C, 40% RH for 24 hours or more ・Measurement environment: 25±2°C, 40±5% RH environment

[0120] (4) Visibility The following carrier tape and electronic components were used. <Carrier tape> Material: Polystyrene (no product number specified) Carrier tape width: 16 mm Pocket width: 6.9 mm x 2.9 mm Pocket depth: 1.3 m <Electronic component> Product name: Resistor CR2010-JW-750ELF manufactured by Bourns Chip size: 5.0 mm x 2.5 mm x 0.6 mm

[0121] As shown in Figures 3(a) and 3(b), electronic components 13 were placed in the storage compartment of carrier tape 11, and a cover tape 1 stretched without wrinkles or irregularities was attached to carrier tape 11 using adhesive tape 15 to prepare a package sample. Figure 3(b) is a cross-sectional view taken along line A-A in Figure 3(a). The visibility of the electronic components in the package sample was evaluated using the following method. <Evaluation Method> Five inspectors visually inspected the electronic components in the package sample through the cover tape and determined whether the electronic components were recognizable. A total of 10 chips were inspected, and the pass rate was calculated. The evaluation criteria are shown below. A: All five inspectors judged that the 10 electronic components were easy to see. B: Two or more of the five inspectors judged that at least one of the 10 electronic components was difficult to see.

[0122] (5) Chip Adhesion Test Twenty 0402 size chips were lined up on a flat glass plate. A 5 mm wide cover tape was placed on top of the chips so that the heat seal layer side of the cover tape was in contact with the 0402 size chips. Next, a 20 gf weight was placed so that the load was evenly distributed on each of the 20 chips. After 15 minutes, the weight was removed, the cover tape was lifted, and the number of 0402 size chips that moved on the glass plate was counted. The test was carried out five times, and the average number was calculated. The evaluation criteria are shown below. A: Less than 3 B: 3 to 5 C: 6 or more

[0123]

[0124] From Table 1, it was confirmed that when Sa and Sq of the surface on the heat seal layer side of the cover tape are within the predetermined ranges, adhesion of electronic components is suppressed and the visibility of the electronic components is excellent.

[0125] The present disclosure provides, for example, the following inventions. [1] A cover tape for packaging electronic components having, in this order, a base layer, an intermediate layer, and a heat seal layer, wherein the arithmetic mean height Sa of the surface of the cover tape facing the heat seal layer is 0.4 μm or more and 4.0 μm or less, the root mean square height Sq of the surface of the cover tape facing the heat seal layer is 0.5 μm or more and 5.0 μm or less, and the haze of the cover tape for packaging electronic components is 15% or less. [2] The cover tape for packaging electronic components according to [1], wherein the heat seal layer contains irregular-shaped particles. [3] The cover tape for packaging electronic components according to [1] or [2], wherein the heat seal layer contains acicular particles. [4] The cover tape for packaging electronic components according to any of [1] to [3], wherein the intermediate layer contains an ethylene-(meth)acrylic resin. [5] A package comprising: a carrier tape having a plurality of storage sections for storing electronic components; the electronic components stored in the storage sections; and the cover tape for packaging electronic components according to any one of [1] to [4], arranged to cover the storage sections.

[0126] REFERENCE SIGNS LIST 1: cover tape 2: base material layer 3: intermediate layer 4: heat seal layer 10: package 11: carrier tape 12: storage section 13: electronic component

Claims

1. A cover tape for packaging electronic components having a base layer, an intermediate layer, and a heat seal layer in this order, wherein the arithmetic mean height Sa of the surface of the cover tape on the heat seal layer side is 0.4 μm or more and 4.0 μm or less, the root mean square height Sq of the surface of the cover tape on the heat seal layer side is 0.5 μm or more and 5.0 μm or less, and the haze of the cover tape for packaging electronic components is 15% or less.

2. The cover tape for packaging electronic components according to claim 1, wherein the heat seal layer contains irregularly shaped particles.

3. The cover tape for packaging electronic components according to claim 2, wherein the heat seal layer contains acicular particles.

4. The cover tape for packaging electronic components according to claim 1, wherein the intermediate layer contains an ethylene-(meth)acrylic resin.

5. A packaging body comprising: a carrier tape having a plurality of storage sections for storing electronic components; electronic components stored in the storage sections; and a cover tape for packaging electronic components according to any one of claims 1 to 4, arranged to cover the storage sections.

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