Heat dissipation device

Abstract

A heat dissipation device according to the present invention comprises: a heat conduction panel on one side; a heat conduction panel on the other side, which is bonded to the one side heat conduction panel and forms a refrigerant flow space that is a space where a refrigerant is filled and phase-changed between the one side heat conduction panel and the other side heat conduction panel; and a sintered body column assembly disposed in the refrigerant flow space, wherein the sintered body column comprises: a plurality of condensation unit sintered body columns disposed at a portion corresponding to the condensation end involved in the condensation of the refrigerant through heat exchange with external air, in the refrigerant flow space; and an evaporation unit sintered body base disposed, in the refrigerant flow space, at the evaporation end that is close to heating elements as the portion excluding the condensation end, and connected to at least one of the plurality of condensation unit sintered body columns, thereby maximizing heat dissipation performance and improving bonding force.

Description

heat dissipation device

[0001] The present invention relates to a heat dissipation apparatus, and more particularly, to a heat dissipation apparatus that maximizes heat dissipation performance and improves product productivity.

[0002] In diverse industries such as communications, electronics, and electrical engineering, related technologies are continuously being developed at an advanced level for application in more advanced industries. This advanced technological development requires high-power energy, and devices utilizing this energy inevitably face the problem of high heat generation. Consequently, the development of appropriate cooling systems is essential.

[0003] Heat dissipation systems are used in a variety of industries, including air conditioners, mobile communications, data centers, aerospace mobility, electric vehicles, energy storage devices, and displays. These systems are a major source of power consumption, and power consumption is steadily increasing as industries develop.

[0004] In general, heat dissipation devices are largely divided into Active Cooling Devices and Passive Cooling Devices. Active Cooling Devices mainly utilize Forced Convection by fans, while Passive Cooling Devices can be classified as a technology that utilizes Natural Convection without fans.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving, advanced technologies. Therefore, related industries urgently need innovative technologies to address these issues, and heat dissipation devices are being developed to address this issue.

[0006] Phase change refers to the change in the inherent state of a liquid / gas / solid when it accumulates a large amount of energy or releases stored heat energy.

[0007] A phase change refers to a change in the physical arrangement of molecules rather than a chemical reaction such as chemical bonding or formation. When energy is applied to a substance, the heat that does not undergo a phase change is called sensible heat, and the heat used when the phase changes is called latent heat.

[0008] However, radiators have a problem: since temperature and pressure are proportional, pressure increases as temperature increases. This can lead to the rupture of the radiator itself if the high temperature transmitted from the heating element within the sealed radiator increases pressure. To address this, pressure must be prevented from increasing, and the radiator must have sufficient internal volume to ensure pressure equilibrium during the phase change cycle of the material.

[0009]

[0010] The present invention has been devised to solve the above-mentioned technical problem, and its purpose is to provide a heat dissipation mechanism capable of maximizing heat dissipation performance.

[0011] In addition, another object of the present invention is to provide a heat dissipation mechanism that can improve the work safety of workers (assemblers, etc.) by removing sharp parts of the edge end constituting the condensation end.

[0012] The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0013]

[0014] A heat dissipation mechanism according to one embodiment of the present invention comprises: a heat-conducting panel on one side; a heat-conducting panel on the other side, which is joined to the heat-conducting panel on the one side and forms a refrigerant flow space, which is a space between the heat-conducting panel and the refrigerant filled and phase-changed with the refrigerant; and a sintered column assembly disposed on the refrigerant flow space, wherein the sintered column assembly comprises: a plurality of condensing sintered columns disposed in a portion corresponding to a condensing end that participates in condensation of the refrigerant through heat exchange with external air (outside air) in the refrigerant flow space; and an evaporating sintered base disposed in an evaporating end close to heating elements in a portion of the refrigerant flow space other than the condensing end, and connected to at least one of the plurality of condensing sintered columns.

[0015] Here, the one-side heat-conducting panel and the other-side heat-conducting panel may be made of the same metal material having a thermal conductivity higher than a predetermined level.

[0016] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel may be provided with a metal panel member made of SUS material.

[0017] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel can be processed into sheet metal using a press mold process.

[0018] In addition, the sintered body column assembly further includes a sintered body additional base connected to the evaporation section sintered body base and positioned lower in the direction of gravity among the condensation sections, and the lower ends of each of the plurality of condensation section sintered body columns can be interconnected with the sintered body additional base.

[0019] In addition, when the sintered body additional base is arranged to be inclined in the vertical direction along the condensation section, the lower end of the sintered body additional base can be connected to one side of the upper end, avoiding the upper end of the evaporation section sintered body base.

[0020] Additionally, the upper end of the sintered body base of the evaporator may be positioned at a higher position in the direction of gravity than at least the inclined lower end of the sintered body additional base.

[0021] In addition, the lower part of the condensation sintered body column arranged close to the evaporation sintered body base among the plurality of condensation sintered body columns is interconnected with the evaporation sintered body base.

[0022] Additionally, the lower end of the guide sintered body bar can be arranged to contact one side while avoiding the upper end of the evaporation sintered body bar.

[0023] In addition, the condensation sintered body base is further included, which is arranged slantedly on the condensation end excluding the evaporation end to connect the lower ends of each of the plurality of guide sintered body bars, and the inclined lower end of the condensation sintered body base can be arranged to contact one side of the upper end of the evaporation sintered body bar.

[0024] Additionally, the upper end of the evaporation sintered body bar may be positioned at a higher position in the direction of gravity than at least the inclined lower end of the condensation sintered body base.

[0025] Additionally, the above evaporation sintered body bar can be joined to the evaporation end by brazing welding so as to be in surface heat contact.

[0026] In addition, the above-described evaporation sintered body bar may include a bonding panel formed by bending a copper (Cu) material panel to have a cross-section in the shape of the letter 'ㄷ' with one side open, and a sintered body foam portion formed by sintering copper (Cu) material powder inside the bonding panel.

[0027] In addition, among the sintered body columns, the plurality of guide sintered body bars and the condensation sintered body base can be formed by sintering metal powder of the same material as the metal material forming the one-side heat-conducting panel and the other-side heat-conducting panel.

[0028] In addition, among the sintered body columns, the evaporated sintered body bar can be formed by sintering a metal powder made of copper (Cu).

[0029]

[0030] According to a heat dissipation mechanism according to one embodiment of the present invention, it is possible to achieve the effect of not only significantly improving heat dissipation performance but also improving the bonding strength between one side heat-conducting panel and the other side heat-conducting panel.

[0031] In addition, the present invention can achieve the effect of improving heat dissipation performance by supplying more uniform liquid refrigerant to the evaporation end by forming a liquid refrigerant maintenance end in the condensation end corresponding to the condensation region.

[0032]

[0033] Figure 1 is a perspective view showing an application example of a heat dissipation device according to the present invention.

[0034] Figure 2 is a perspective view showing a heat dissipation mechanism according to the present invention.

[0035] FIG. 3a and FIG. 3b are exploded perspective views of FIG. 2, which are exploded perspective views of a heat dissipation mechanism according to one embodiment (200-1) and another embodiment (200-2) of the present invention.

[0036] FIGS. 4a and 4b are front views showing the layout of the sintered column assembly among the configurations of the heat dissipation mechanism according to one embodiment (200-1) of the present invention and another embodiment (200-2) of the present invention, with one side of the heat-conducting panel removed from the configuration of FIG. 2.

[0037] Figure 5 is a front view of Figure 2,

[0038] FIG. 6 is a cross-sectional view taken along line AA, showing a cross-sectional view of a heat dissipation mechanism according to one embodiment (200-1) and another embodiment (200-2).

[0039] Figure 7 is an enlarged view of parts “B” and “C” of Figure 6,

[0040] Fig. 8 is a cross-sectional view and an enlarged view of a portion thereof showing the joint appearance of one side heat-conducting panel and the other side heat-conducting panel among the configurations of Fig. 2.

[0041] FIG. 9a is a perspective view and a partially enlarged view thereof showing an evaporator sintered body base applied to a heat dissipation mechanism according to one embodiment of the present invention, as part of the configuration of FIG. 4a.

[0042] FIG. 9b is a perspective view and a partially enlarged view thereof showing an evaporator sintered body base applied to a heat dissipation mechanism according to another embodiment of the present invention, as part of the configuration of FIG. 4b.

[0043]

[0044] <Explanation of symbols>

[0045] 200: Heat dissipation device (one example) 200A: One-sided heat-conducting panel

[0046] 200B: Other side heat conduction panel 200A-P: One side thickness forming panel

[0047] 200B-P: Other thickness forming panel 200-1: Other embodiment

[0048] 201: Evaporation section 203: Condensation section

[0049] 204: Liquid refrigerant holding unit 205: Refrigerant flow space

[0050] 230: Strength reinforcement part 235: Column support protrusion

[0051] 250: Sintered column assembly 251: Condensing section sintered column

[0052] 255: Evaporation sintered body base 255-1: Sintered body additional base

[0053] 255B-1: Sintered foam part 255B-2: Bonded panel

[0054] 255A-3,255B-3: Joint avoidance cut-out

[0055]

[0056] Hereinafter, a heat dissipation mechanism according to embodiments of the present invention will be described in detail with reference to the attached drawings.

[0057] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0058] In describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0059]

[0060] Figure 1 is a perspective view showing an application example of a heat dissipation device according to the present invention.

[0061] A heat dissipation device (200) according to one embodiment of the present invention, as referenced in FIG. 1, may be provided to receive heat generated from an electronic device (150, e.g., an LED unit, etc.) in which heat-emitting elements (151, e.g., LED elements in a lighting device) as heat dissipation targets are mounted and dissipate the heat through heat exchange with external air (outside air).

[0062] Here, the electronic device as a heat dissipation target to be dissipated by the heat dissipation mechanism (200) according to one embodiment of the present invention is described as being limited to an LED unit (150) including LED elements (151), but the electronic device is not necessarily limited thereto, and an antenna device corresponding to the main technical field of the applicant of the present invention or an electronic device related to a similar technical scope is not excluded.

[0063] The LED unit (150) transfers and supplies heat generated from the LED elements (151) through the back surface in the drawing of FIG. 1 to the heat dissipation mechanism (200) according to one embodiment of the present invention.

[0064] However, in order to facilitate installation on the back surface of the LED unit (150) and heat transfer to the heat dissipation device (200), a plurality of heat transfer media blocks (160) may be installed between the LED unit (150) and the heat dissipation device (200), and an evaporation end portion (201) of the heat dissipation device (200), which will be described later, may be coupled through an installation groove (165) formed between or in the plurality of heat transfer media blocks (160).

[0065] FIG. 2 is a perspective view showing a heat dissipation mechanism according to the present invention, FIGS. 3a and 3b are exploded perspective views of FIG. 2, which are exploded perspective views of a heat dissipation mechanism according to one embodiment (200-1) and another embodiment (200-2) of the present invention, and FIGS. 4a and 4b are front views showing the arrangement of a sintered column assembly among the configurations of a heat dissipation mechanism according to one embodiment (200-1) and another embodiment (200-2) of the present invention, with one side of the heat-conducting panel removed among the configurations of FIG. 2.

[0066] A heat dissipation device (200) according to the present invention includes a one-side heat-conducting panel (200A) made of a metal panel member, and a other-side heat-conducting panel (200B) made of a metal panel member, as referenced in FIGS. 1 to 4B.

[0067] In particular, a portion corresponding to the space between one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) is formed as a refrigerant flow space (205) having a sealed (shielded) structure with the outside as described later, and the refrigerant is filled and can radiate system heat by undergoing a phase change within the refrigerant flow space (205) by heat supplied from external heating elements (e.g., refer to drawing reference numeral '51' described later). This will be described in more detail later.

[0068] Here, the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) can be made of the same metal material (metal panel material) having a thermal conductivity of a predetermined level or higher.

[0069] Preferably, the refrigerant may be made of stainless steel (SUS), which is one of the materials with lower thermal conductivity than aluminum (Al) among metal materials, so that the phase change of the refrigerant through heat exchange with the outside air (outside air) (particularly, the phase change in which the refrigerant condenses from a gaseous state to a liquid state) can be facilitated.

[0070] In this way, the specific reason for adopting SUS material as the metal material for forming one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) will be explained in more detail later.

[0071] In addition, in the heat dissipation device (200) according to the first embodiment of the present invention, one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) can be formed by sheet metal processing using a press mold process.

[0072] For reference, although the press mold process is not shown, it is sufficient to understand it as a process in which a metal base material panel made of SUS material is processed into sheet metal through a press mold device so that at least each edge end is mutually joined by a joint intermediate frame body (280).

[0073] At this time, through the press mold process, not only the outer shape of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) but also the one-sided thickness-forming panel (200A-P) and the other-sided thickness-forming panel (200B-P) described later can be formed simultaneously together with the plurality of strength reinforcing members (230) described later.

[0074] Here, the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) may be sheet metal processed products of metal panel members made of SUS material. The thickness of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) may be set to be very thin, and may be set to a thickness not exceeding 0.15t.

[0075] In general, aluminum (Al) is well known as the most widely utilized metal material in terms of thermal conductivity and weight. In this case, the heat dissipation device itself, which actually performs the heat dissipation or heat exchange function, is in the form of a heat sink fin. In the case where heat transfer is performed solely through the material itself without using a phase-changeable refrigerant as a heat transfer medium, as in one embodiment of the present invention, aluminum can naturally be selected as the optimal material.

[0076] That is, aluminum material has excellent thermal conductivity of 230 and is one of the most widely used materials as a heat dissipation element because of its low specific gravity.

[0077] However, although the aluminum material has superior thermal conductivity and specific gravity to the SUS material, which is the material of the one-side thermal conductive panel (200A) and the other-side thermal conductive panel (200B) adopted in one embodiment of the present invention (actually, the thermal conductivity of the SUS material is 20), it has the problem that the price is relatively expensive compared to the cost, and when a refrigerant is filled inside, the refrigerant that can be filled is very limited.

[0078] For example, when distilled water (water) is selected as a refrigerant, there is a problem that distilled water must be excluded from the selectable refrigerants because aluminum causes a chemical reaction and makes it impossible to function as a refrigerant.

[0079] In order to solve the problem of aluminum material, in the heat dissipation device (200, 200-1) according to one embodiment of the present invention, the metal material of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) was adopted as SUS material that hardly causes chemical reaction with distilled water.

[0080] The one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) can form a refrigerant flow space (205) in which the refrigerant changes phase and flows inside by being mutually bonded at their edge ends.

[0081] Here, the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) can be mutually joined along their respective edge ends so that the refrigerant flow space (205) described above is formed inside.

[0082] However, when joining the edge ends of two metal panel members having a very thin thickness (0.15T) as described above, the edge ends of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) have a thickness of 0.3T and, without separate processing, have very sharp edges, there is a risk of injury to the worker during work.

[0083] In order to minimize injury to such workers (installers) during work, as shown in FIGS. 1 to 3, one of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) can be joined to be inserted into the other.

[0084] More specifically, as shown in FIGS. 3A and 3B, both the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) are formed such that the edge ends (see drawing symbols '200A-P' and '200B-P') are folded, and each folded edge end is formed as a one-side thickness-forming panel (200A-P) and an other-side thickness-forming panel (200B-P), and a part of the one-side thickness-forming panel (200A-P) of the one-side heat-conducting panel (200A) and the other-side thickness-forming panel (200B-P) of the other-side heat-conducting panel (200B) can be arranged to overlap in the thickness direction of the refrigerant flow space (205).

[0085] Here, the one-sided thickness forming panel (200A-P) is a portion formed by bending along the edge end of the one-sided heat-conducting panel (200A), and can be formed by bending approximately orthogonally toward the other-sided heat-conducting panel (200B), and the other-sided thickness forming panel (200B-P) is a portion formed by bending along the edge end of the other-sided heat-conducting panel (200B), and can be formed by bending approximately orthogonally toward the one-sided heat-conducting panel (200A).

[0086] In this way, the edge end of one side heat-conducting panel (200A) and the edge end of the other side heat-conducting panel (200B) are each bent in a direction forming the thickness of the refrigerant flow space (205), thereby forming the one side thickness-forming panel (200A-P) and the other side thickness-forming panel (200B-P) described above.

[0087] At this time, the other side thickness forming panel (200B-P) of the other side heat-conducting panel (200B) is inserted into the one side thickness forming panel (200A-P) of the one side heat-conducting panel (200A), so that at least the tip of the other side thickness forming panel (200B-P) can be joined to the one side thickness forming panel (200A-P) of the one side heat-conducting panel (200A) in a way that it is hidden from the outside.

[0088] In this way, the one-sided thickness forming panel (200A-P) of the one-sided heat-conducting panel (200A) functions as a thickness forming panel that forms the entire thickness of the refrigerant flow space (205), and thus, by forming the thickness of the edge end to be sufficiently greater than the sum of the thicknesses of the materials of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B), it can perform an additional function of preventing injury to workers (including assemblers) by removing sharp edge ends during their work.

[0089] A refrigerant is filled inside the space between the mutually bonded one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B), and a refrigerant flow space (205) is formed in which the filled refrigerant undergoes a phase change and flows, and can be in surface thermal contact with heating elements (e.g., LED elements (51) mounted on the LED substrate (50) of the lighting device (100) of FIG. 1) that supply heat to the filled refrigerant.

[0090] That is, the heat dissipation device (200, 200-1) according to the present invention is described by taking as a representative example the LED elements (51) mounted on the LED substrate (50) of the lighting device (100) among electronic devices (electronic products) as the heat dissipation target, as shown in FIG. 1.

[0091] However, the electronic device as a heat dissipation target to be dissipated by the heat dissipation device (200, 200-1) according to the present invention is not limited to the lighting device (100), and should be understood as a concept that includes all electronic devices related to the technical scope of an antenna device or a similar technical scope corresponding to the main production and sales product of the applicant of the present invention.

[0092] The LED elements (50) can transfer and supply heat generated through the back surface of the LED substrate (50) to the heat dissipation mechanism (200, 200-1) according to the present invention.

[0093] The refrigerant filled in the refrigerant flow space (205) corresponds to a phase-change material that can be phase-changed by heat supplied from heating elements (51, LED elements) or by heat exchange with external air (outside air). In particular, the refrigerant here is preferably distilled water (water) that does not cause concerns about environmental pollution, etc., when the metal material forming the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) excludes aluminum (Al).

[0094] Hereinafter, the portion of the edge of the heat dissipation device (200) according to one embodiment of the present invention, in which one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) are joined, which receives heat from the heating elements (51, LED elements), is defined as an evaporation end portion (201), and all other portions except the evaporation end portion (201) are defined as a condensation end portion (203).

[0095] More specifically, the refrigerant flow space (205) can be understood as a region (evaporation region) where liquid refrigerant is stored and evaporates into gaseous refrigerant as heat is supplied, as a region relatively lower in the direction of gravity, and as a region relatively upper in the direction of gravity, and as a region (condensation region) where gaseous refrigerant actively flows and condenses into liquid refrigerant through heat exchange with the outside air (outside air).

[0096] Hereinafter, the evaporation region and the condensation region will be understood as being distinguished based on the dotted line referenced by the drawing symbol 200C in FIG. 2, but most of the liquid refrigerant is stored below the dotted line at 200C due to gravity, and the gaseous refrigerant will be understood as flowing and spreading to all parts of the refrigerant flow space (205) including the evaporation region once it undergoes a phase change from the liquid refrigerant, regardless of the dotted line at 200C.

[0097] In addition, the area corresponding to the lower side in the direction of gravity based on drawing symbol 200C is defined as an evaporation region and an evaporation end (201), and the area corresponding to the upper side in the direction of gravity based on drawing symbol 200C is defined as a condensation region and a condensation end (203).

[0098] However, it should be noted that the drawing symbol 200C cannot be a complete physical standard for distinguishing the above-described evaporation area and condensation area, and that condensation may occur within the evaporation area depending on the properties (and specifications) of the refrigerant, and that evaporation may also occur within the condensation area.

[0099] Meanwhile, the heat dissipation device (200) according to one embodiment of the present invention may further include a sintered column assembly (250) disposed on the refrigerant flow space (205), as referenced in FIGS. 1 to 4b.

[0100] Here, the sintered column assembly (250) may include a plurality of condensing sintered columns (251) spaced apart from each other within a condensing region corresponding to the condensing section (203), and an evaporating section sintered base (255) disposed in an evaporating region corresponding to the evaporating section (203) and connected to at least one (251-1) of the plurality of condensing sintered columns (251).

[0101] In addition, the sintered column assembly (250) may further include a sintered additional base (255-1) that is arranged in a condensation section (203) corresponding to a condensation region and connects the lower ends of a plurality of condensation section sintered columns (251).

[0102] However, as shown in FIGS. 3a and 4a and 3b and 4b, the liquid refrigerant (condensed refrigerant) whose flow is guided through a plurality of condenser sintered body columns (251) in the condenser section (203) corresponding to the condensation region may be different in the specific arrangement relationship and configuration of the evaporator sintered body base (255) for the design of the liquid refrigerant holding section (204) described later depending on the presence or absence of the sintered body additional base (255-1) that mediates the transfer to the evaporator sintered body base (255) side of the evaporator section (201) corresponding to the evaporation region, and this may be a criterion for distinguishing one embodiment (FIGS. 3a and 4a) from another embodiment (FIGS. 3b and 4b) of the present invention. This will be described in more detail later.

[0103] When the plurality of condensing sintered body columns (251) are arranged so that the condensed liquid refrigerant in the condensing region corresponding to the condensing section (203) naturally flows downward by gravity, the upper part may be positioned upward based on the direction of gravity, and the lower part may be positioned downward based on the direction of gravity, and may be arranged vertically or inclined.

[0104] In addition, the condensation sintered body base (252) included in the heat dissipation device (200-1) according to one embodiment of the present invention referenced through FIGS. 3A and 4A can serve to easily distribute and collect the liquid refrigerant evenly in the evaporation region corresponding to the evaporation end (201) when the condensed liquid refrigerant flows downward in the direction of gravity through the plurality of guide sintered body bars (251) described above.

[0105] However, in the case of the heat dissipation device (200-2) according to another embodiment of the present invention referred to in FIGS. 3b and 4b, the sintered body additional base (255-1) is not provided, so the liquid refrigerant flowing down through the plurality of condensing body columns (251) is formed to flow along the inclined end corresponding to the condensing end (203) relatively lower in the direction of gravity, and then moves to the evaporation area corresponding to the evaporating end (201) provided with the evaporating body base (255) and is stored.

[0106] Hereinafter, in order to help understand the heat dissipation mechanism (200) according to the present invention, in the case of one embodiment (200) of the present invention, a portion of the condensation area where the sintered body additional base (255-1) is arranged, and in the case of another embodiment (200-1) of the present invention, a portion of the edge end inclined toward the evaporation end (201) as a part of the condensation end (203) is defined as a liquid refrigerant maintenance end (204).

[0107] The liquid refrigerant maintenance section (204) does not correspond to an evaporation region where the liquid refrigerant actually changes into a gaseous refrigerant, but can perform a function of ensuring that the liquid refrigerant, whose flow is guided through the plurality of condensation sintered body columns (251) described above in the condensation section (203) corresponding to the condensation region, is maintained for as long as possible and then flows in a uniform amount toward the evaporation section sintered body base (255) of the evaporation section (201).

[0108] The evaporator sintered body base (255) is installed in the evaporator section (201) closest to the heating elements (51, LED elements) in the evaporation area and directly receives heat from the heating elements (51, LED elements) to evaporate the liquid refrigerant.

[0109] That is, the evaporator sintered body base (255) is configured to be joined by a brazing welding method so as to be in surface heat contact with the evaporator section (201) that receives heat from the heating elements (51, LED elements), and can perform the function of changing the liquid refrigerant stored in the refrigerant flow space (205) into a gaseous refrigerant.

[0110] However, it is preferable that the liquid refrigerant be stored (reserved) throughout the entire evaporation area including the evaporation section (201) (particularly, up to a level exceeding 200°C indicated by a dotted line), but depending on the change in the installation position of the heat dissipation device (200) according to the present invention, the level of the liquid refrigerant may be positioned lower than the upper end of the evaporation section sintered body base (255), and in this case, the liquid refrigerant may not be uniformly evaporated over the entire area of ​​the evaporation section sintered body base (255).

[0111] Therefore, the purpose of providing the above-described liquid refrigerant maintenance unit (204) is to supply a uniform amount of liquid refrigerant to the evaporator sintered body base (255).

[0112] Here, the sintered column assembly (250) can be formed by sintering all SUS material powders, and the sintered base (255) of the evaporation section positioned close to the evaporation section (203) can be formed by sintering a Cu (copper) material in that higher thermal conductivity is required to evaporate the liquid refrigerant in the refrigerant flow space (205) into a gaseous refrigerant.

[0113] More specifically, a plurality of condensation sintered columns (251) or sintered additional bases (255-1) arranged in the condensation section (203) corresponding to the condensation region among the sintered column assemblies (250) can be formed by sintering metal powder (powder) of the same material as the material of the metal panel members of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B).

[0114] Therefore, the material of the plurality of condenser sintered body columns (251) or sintered body additional bases (255-1) can be understood as having the same thermal conductivity by sintering metal powder of SUS material, although the forming or processing method is somewhat different when the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) are understood to be provided with a metal panel member of SUS material, as already described.

[0115] However, the evaporator sintered body base (255) positioned close to the evaporator section (201) can be formed as a sintered body in which metal powder (powder) made of Cu (copper) material having a higher thermal conductivity than SUS material is sintered, as described above, in that a high thermal conductivity is required to allow the liquid refrigerant to change into a gaseous refrigerant by the heat supplied from the heating elements (51, LED elements).

[0116] Here, the effective arrangement relationship of the sintered column assembly (150) to maximize the function of the liquid refrigerant maintenance unit (204) described above is described as follows.

[0117] First, as referenced in FIGS. 3A and 4A, a plurality of condensing sintered columns (251) among the sintered column assemblies (150) can be arranged vertically or inclined so that the condensed liquid refrigerant is uniformly distributed over the entire heat dissipation surface of the condensing section (203) corresponding to the condensing area from approximately the top to the bottom and is induced to flow and transported to the liquid refrigerant holding section (204) located relatively lower based on the direction of gravity.

[0118] Here, in the case of a heat dissipation device (200) according to one embodiment of the present invention in which a sintered body additional base (255-1) connecting the lower ends of each of a plurality of condensing body sintered body columns (251) is arranged to be inclined to one side from a liquid refrigerant holding unit (204), the inclined lower end of the sintered body additional base (255-1) can be arranged to avoid the upper end of the evaporating body sintered body base (255) and to be in contact with one side of the upper end.

[0119] At this time, the upper part of the evaporator sintered body base (255) is positioned at a higher position in the direction of gravity than at least the inclined lower part of the sintered body additional base (255-1), so that it can perform the function of a wall to hold more liquid refrigerant whose flow is guided in the inclined direction along the sintered body additional base (255-1).

[0120] More preferably, the upper end of the evaporation sintered body base (255) may be set higher than the lower end of the condensation sintered body column (251) which is most closely connected to the inclined lower end of the sintered body additional base (255-1).

[0121] Accordingly, except for the condensed refrigerant (liquid refrigerant) that moves directly downward toward the evaporation end (201) on the right side of the drawings of FIGS. 3A and 4A beyond the top of the condensing sintered body column (251) that is closest to the inclined bottom of the sintered body additional base (255-1), almost all of the condensed refrigerant (liquid refrigerant) can be supplied uniformly toward the evaporation end (201) while delaying it for a longer period of time through the multiple condensing sintered body columns (251) or the sintered body additional bases (255-1).

[0122] Next, as shown in FIGS. 3b and 4b, in the case of a heat dissipation mechanism (200-2) according to another embodiment of the present invention, in which the sintered body additional base (255-1) is not provided in the area corresponding to the liquid refrigerant maintenance section (204), the upper end of the evaporation section sintered body base (255) and the lower end of the condensation section sintered body column (251) positioned closest to the evaporation section (201) corresponding to the evaporation area among the plurality of condensation section sintered body columns (251) may be arranged to be interconnected.

[0123] At this time, it is preferable that the lower part of the condensation sintered body column (251) be arranged so as to be in contact (connected) with one side while avoiding the upper part of the evaporation sintered body base (255).

[0124] That is, the lower end of the condensation sintered body column (251) can be connected to one side of the upper end of the evaporation sintered body base (255) while exposing the upper end of the evaporation sintered body base (255) upward based on the direction of gravity.

[0125] In this way, the lower end of the condenser sintered body column (251) is connected to avoid the upper end of the evaporator sintered body base (255), so that the liquid refrigerant held in the liquid refrigerant holding unit (204) can be absorbed through the upper end of the evaporator sintered body base (255).

[0126] Accordingly, except for the condensed refrigerant (liquid refrigerant) that moves directly downward toward the evaporation end (201) on the right side of the drawings of FIGS. 3B and 4B beyond the upper end of the condensed sintered body column (251) directly connected to the upper end of the evaporated sintered body base (255), almost all of the condensed refrigerant (liquid refrigerant) is uniformly collected in the liquid refrigerant holding unit (204) through the plurality of condensed sintered body columns (251) and then supplied to the evaporated sintered body base (255) on the evaporated end (201) side while being delayed for a longer period of time.

[0127] FIG. 5 is a front view of FIG. 2, FIG. 6 is a cross-sectional view taken along the line AA, which is a cross-sectional view of a heat dissipation mechanism according to one embodiment (200-1) and another embodiment (200-2), FIG. 7 is an enlarged view of parts "B" and "C" of FIG. 6, FIG. 8 is a cross-sectional view showing a state of joining one side heat-conducting panel and the other side heat-conducting panel among the configurations of FIG. 2 and an enlarged view thereof, FIG. 9a is a perspective view and an enlarged view thereof showing an evaporator sintered body base applied to a heat dissipation mechanism according to one embodiment of the present invention as a part of the configuration of FIG. 4a, and FIG. 9b is a perspective view and an enlarged view thereof showing an evaporator sintered body base applied to a heat dissipation mechanism according to another embodiment of the present invention as a part of the configuration of FIG. 4b.

[0128] In the heat dissipation device (200) according to the present invention, as referenced in FIGS. 5 to 9, a plurality of strength reinforcing parts (230) processed by sheet metal processing during a press mold process and a column support protrusion (255) supporting the installation of a sintered column assembly (250) may be further formed on one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), respectively, so as to be sunken toward the refrigerant flow space (205).

[0129] The plurality of strength reinforcing members (230) not only perform the function of reinforcing the strength of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) formed with a very thin thickness, but also perform the function of actively responding to changes in internal pressure that occur when the refrigerant phase changes by welding the mutually contacting portions within the refrigerant flow space (205).

[0130] Meanwhile, in the heat dissipation mechanism (200, 200-1) according to embodiments of the present invention, during the process of joining one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), as described later, the refrigerant flow space (205) is joined so that the refrigerant flow space (205) is completely shielded (sealed) from the outside by using the filler material application gap (210) formed to enable welding joining using the filler material (220).

[0131] As referenced in FIGS. 6 and 8, the joining process by the filler material application gap (210) formed by the one-side thickness forming panel (200A-P) of the one-side heat-conducting panel (200A) and the other-side thickness forming panel (200B-P) of the other-side heat-conducting panel (200B), and the filler material (220) applied thereto, will be described in more detail as follows.

[0132] In the heat dissipation device (200) according to the present invention, as referenced in FIGS. 6 and 8, the other side heat-conducting panel (200B) can be joined by a filler material (220) applied to a filler material application gap (210) between the rounded outer surface of the other side thick-formed panel (200B-P) and the tip of the one side thick-formed panel (200A-P) corresponding to the edge end of the one side heat-conducting panel (200A), which is a portion corresponding to the edge end of the one side heat-conducting panel (200A).

[0133] In order to form a gap (210) for applying the solder, the outer surface of the other side heat-conducting panel (200B) and the tip of the one side thickness forming panel (200A-P) of the one side heat-conducting panel (200A) can be formed to match each other.

[0134] More specifically, the other side thickness forming panel (200B-P) of the other side heat-conducting panel (200B) can be formed by being rounded and bent with a predetermined radius with respect to the outer surface of the other side heat-conducting panel (200B) so that the above-described filler material application gap (210) is formed between the tip of the one side thickness forming panel (200A-P) of the one side heat-conducting panel (200A).

[0135] Here, the gap between the filler coating (210) can be defined as a gap between the tip of a one-sided thick-formed panel (200A-P) that is bent perpendicularly to the outer surface of a one-sided heat-conducting panel (200A) and the rounded outer surface of the other-sided heat-conducting panel (200B).

[0136] When the other side heat-conducting panel (200B) is installed to be inserted into the one side heat-conducting panel (200A) in this way, as shown in FIGS. 5 and 6, a filler material application gap (210) in which a filler material (220) can be applied is naturally formed between the rounded outer surface of the other side thickness forming panel (200B-P) of the other side heat-conducting panel (200B) and the tip of the one side thickness forming panel (200A-P) of the one side heat-conducting panel (200A), and after the filler material (220) is applied, the filler material (220) is melted and permeated by a brazing welding method and then hardened, thereby joining the one side heat-conducting panel (200A) and the other side heat-conducting panel (200B).

[0137] Meanwhile, as referenced in FIGS. 6 and 7, the installation process of the evaporation unit sintered body base (255A, 255B) for the evaporation section (201) corresponding to the evaporation area is briefly described as follows.

[0138] That is, in the case of the sintered body base (253) of the evaporation section, as described above, it is formed of a sintered body made of Cu (copper) material and is joined to the evaporation section (201) side by brazing welding so as to be in surface thermal contact. However, when the brazing welding joining method is applied, there is a concern that it may affect the formation of a large number of pores, which are microscopic holes that must be formed in the sintered body itself.

[0139] However, as described above, if a bonding method is applied that does not cause any problems in the process of forming a large number of pores in the sintered body itself, there will not be a major problem. Therefore, as shown in (a) of FIG. 7, it may be possible to provide an evaporation unit sintered body base (255A) that is directly bonded to the evaporation unit (201) side.

[0140] However, as shown in (b) of FIG. 7 and FIG. 9b, if the sintered body bar (255B) of the evaporator is likely to influence the formation of a large number of pores by applying a brazing welding method, the sintered body base (255B) of the evaporator may be provided to include a sintered body foam part (255B-1) made of sintered copper (Cu) material powder, and a bonding panel (255B-2) formed by bending a thin Cu material panel to have a cross-section in the shape of the letter 'ㄷ' with one side open, and may be sintered and formed in a form in which the sintered body foam part (255B-1) is inserted into the inside of the bonding panel (255B-2).

[0141] Here, the bonding panel (255B-2) is a bonding portion substantially on the inside of the evaporator section (201), and prevents a number of pores from being melted and damaged by heat transmitted by the brazing welding method, thereby increasing the bonding strength and preventing damage to a number of pores directly involved in the phase change of the liquid refrigerant.

[0142] Meanwhile, in the evaporation sintered body base (255A, 255B), a bonding avoidance cutout (255A-3, 255B-3) for avoiding bonding with the other side thickness forming panel (200B-P) of the other side heat-conducting panel (200B) described above can be formed.

[0143] In this way, the joint avoidance cut portion (255A-3, 255B-3) is provided with a chamfered cut portion in the area where heat transfer to the evaporation sintered body base (255A, 255B) is expected during application and welding of the filler material (220) through the filler material application gap (210) described above, thereby preventing unnecessary thermal deformation, and also serves to easily accommodate the other side thickness forming panel (200B-P) of the other side heat conduction panel (200B) that is inserted into the one side heat conduction panel (200A).

[0144]

[0145] Hereinafter, heat dissipation mechanisms according to embodiments of the present invention have been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiments, and it will be understood that those skilled in the art to which the present invention pertains can make various modifications and implement equivalent embodiments. Therefore, the true scope of the present invention is defined by the claims set forth below.

[0146]

[0147] The present invention provides a heat dissipation mechanism that can maximize heat dissipation performance and improve bonding strength between panels.

Claims

1. One-sided heat-conducting panel; A heat-conducting panel on the other side that is joined to the heat-conducting panel on the one side and forms a refrigerant flow space, which is a space where a refrigerant is filled and phase-changed between the heat-conducting panel on the other side; and A sintered column assembly disposed on the above refrigerant flow space; The above sintered column assembly, A plurality of condensing unit sintered columns arranged in a portion corresponding to a condensing unit that participates in condensation of the refrigerant through heat exchange with external air (outside air) in the refrigerant flow space; and A heat dissipation device comprising an evaporation unit sintered body base, which is located in an evaporation unit near the heating elements, excluding the condensation unit, among the refrigerant flow spaces, and is connected to at least one of the plurality of condensation unit sintered body columns.

2. In claim 1, A heat dissipation device in which the one-sided heat-conducting panel and the other-sided heat-conducting panel are made of the same metal material having a thermal conductivity higher than a predetermined level.

3. In claim 1, The above one-sided heat-conducting panel and the other-sided heat-conducting panel are heat-dissipating devices equipped with metal panel members made of SUS material.

4. In claim 1, The above one-sided heat-conducting panel and the other-sided heat-conducting panel are heat-dissipating devices processed from sheet metal using a press mold process.

5. In claim 1, The above sintered column assembly further includes a sintered additional base connected to the evaporation section sintered base, and positioned lower in the direction of gravity among the condensation sections; A heat dissipation mechanism, wherein the lower end of each of the plurality of condenser sintered body columns is interconnected with the sintered body additional base.

6. In claim 5, When the above sintered body additional base is arranged to be inclined in the vertical direction along the condensation end, A heat dissipation mechanism in which the lower part of the above sintered body additional base is connected to one side of the upper part while avoiding the upper part of the above evaporation unit sintered body base.

7. In claim 6, A heat dissipation mechanism in which the upper end of the evaporator sintered body base is positioned at a higher position in the direction of gravity than at least the inclined lower end of the sintered body additional base.

8. In claim 1, A heat dissipation mechanism in which the lower part of a condensation sintered body column arranged close to the evaporation sintered body base among the plurality of condensation sintered body columns is interconnected with the evaporation sintered body base.

9. In claim 8, A heat dissipation mechanism in which the lower part of the condensation sintered body column is connected to one side so as to avoid the upper part of the evaporation sintered body base.

10. In claim 9, A heat dissipation mechanism in which the lower end of the condensation sintered body column is connected to one side of the upper end of the evaporation sintered body base while exposing the upper end of the evaporation sintered body base upwards based on the direction of gravity.

11. In claim 1, The above evaporation unit sintered body base is a heat dissipation mechanism that is joined to the above evaporation unit so as to make surface heat contact.

12. In claim 11, A heat dissipation mechanism in which the above evaporation unit sintered body base is joined to the above evaporation unit by brazing welding.

13. In claim 11 or claim 12, A heat dissipation mechanism in which the evaporation end to which the sintered body base of the evaporation end is joined is set to the inner surface of a one-sided thickness forming panel that is bent to one side of the edge end of the one-sided heat-conducting panel to form the thickness of the refrigerant flow space.

14. In claim 13, A heat dissipation device, wherein the evaporator sintered body base is provided with a chamfered joint avoidance cutout for avoiding jointing with the other side thickness forming panel, which is bent to be joined to the inner surface of the one side thickness forming panel.

15. In claim 12, The above evaporator sintered body base is, A joint panel made of copper (Cu) material, bent to have a cross-section in the shape of the letter 'ㄷ' with one side open; and A heat dissipation device comprising a sintered body foam part formed by sintering copper (Cu) material powder inside the above-mentioned bonding panel.

16. In claim 5, A heat dissipation mechanism in which the plurality of condensing sintered columns and the sintered additional base among the sintered column assemblies are formed by sintering metal powder of the same SUS material as the metal material forming the one-side heat-conducting panel and the other-side heat-conducting panel.

17. In claim 5, Among the above sintered column assemblies, the evaporation sintered base is a heat dissipation mechanism formed by sintering a metal powder made of copper (Cu).

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