Variable speed drive logic board

Abstract

A variable speed drive (VSD) logic board (100) for a VSD (52) of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system (10) includes a printed circuit board (180), a sensor (200) integrated with the printed circuit board (180), where the sensor (200) is configured to detect an organic compound in air within an enclosure (156) of the HVAC&R system (10) and to transmit data indicative of a concentration of the organic compound in the air within the enclosure (156), and a controller (182) integrated with the printed circuit board (180), where the controller (182) is configured to receive the data from the sensor (200), determine an occurrence of a thermal event within the enclosure (156) based on the data, and adjust operation of the VSD (52) in response to determination of the occurrence of the thermal event.

Description

VARIABLE SPEED DRIVE LOGIC BOARDBACKGROUND

[0001] This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the present disclosure, which are described below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present disclosure. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.

[0002] Chiller systems, or vapor compression systems, utilize a working fluid (e.g., a refrigerant) that changes phases between vapor, liquid, and combinations thereof in response to exposure to different temperatures and pressures within components of the chiller system. The chiller system may place the working fluid in a heat exchange relationship with a conditioning fluid (e.g., water) and may deliver the conditioning fluid to conditioning equipment and / or a conditioned environment serviced by the chiller system. In general, the chiller system includes a vapor compression circuit configured to circulate the working fluid through various components, such as one or more heat exchangers. For example, the vapor compression circuit may include a first heat exchanger configured to place the working fluid in a first heat exchange relationship with the conditioning fluid and a second heat exchanger configured to place the working fluid in a second heat exchange relationship with another fluid, such as a cooling fluid. The vapor compression circuit may also include a compressor configured to circulate the working fluid through the vapor compression circuit. In some chiller systems, a variable speed drive (VSD) may supply power to a motor to drive the compressor. Unfortunately, existing variable speed drives are susceptible to various operational interruptions and other inefficiencies. Accordingly, it may be desirable to monitor operational conditions of electrical components, such as the VSD, during operation of the chiller system.SUMMARY

[0003] A summary of certain embodiments disclosed herein is set forth below. It should be understood that these aspects are presented merely to provide the reader with a brief summary of these certain embodiments and that these aspects are not intended to limit the scope of this disclosure. Indeed, this disclosure may encompass a variety of aspects that may not be set forth below.

[0004] In one embodiment, a variable speed drive (VSD) for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes a logic board configured to control operation of the VSD, where the logic board includes a printed circuit board. The logic board also includes a sensing system integrated with the printed circuit board, where the sensing system includes a sensor configured to acquire data indicative of an environmental parameter value within an enclosure of the VSD, and the logic board further includes a controller integrated with the printed circuit board, where the controller is configured to receive the data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to determination of the occurrence of the thermal event.

[0005] In another embodiment, a variable speed drive (VSD) logic board for a VSD of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes a printed circuit board, a sensor integrated with the printed circuit board, where the sensor is configured to detect an organic compound in air within an enclosure of the HVAC&R system and to transmit data indicative of a concentration of the organic compound in the air within the enclosure, and a controller integrated with the printed circuit board, where the controller is configured to receive the data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to determination of the occurrence of the thermal event.

[0006] In a further embodiment, a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes an enclosure and a variable speed drive (VSD)disposed within the enclosure, where the VSD is configured to operate a motor of the HVAC&R system at variable speeds, and the VSD includes a converter, a DC link, and an inverter. The HVAC&R system also includes a VSD logic board disposed within the enclosure. The VSD logic board is configured to control operation of the VSD, and the VSD logic board includes a printed circuit board, a sensor integrated with the printed circuit board, where the sensor is configured to detect carbon monoxide in air within the enclosure and to transmit data indicative of a concentration of the carbon monoxide in the air within the enclosure, and a controller integrated with the printed circuit board, where the controller is configured to receive the data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to determination of the occurrence of the thermal event.

[0007] Various refinements of the features noted above may exist in relation to various aspects of the present disclosure. Further features may also be incorporated in these various aspects as well. These refinements and additional features may exist individually or in any combination. For instance, various features discussed below in relation to one or more of the illustrated embodiments may be incorporated into any of the above-described aspects of the present disclosure alone or in any combination. The brief summary presented above is intended only to familiarize the reader with certain aspects and contexts of embodiments of the present disclosure without limitation to the claimed subject matter.DRAWINGS

[0008] Various aspects of this disclosure may be better understood upon reading the following detailed description and upon reference to the drawings in which:

[0009] FIG. 1 is a perspective view of a building that utilizes an embodiment of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system in a commercial setting, in accordance with an aspect of the present disclosure;

[0010] FIG. 2 is a perspective view of an embodiment of a vapor compression system, in accordance with an aspect of the present disclosure;

[0011] FIG. 3 is a schematic of an embodiment of the vapor compression system of FIG. 2, in accordance with an aspect of the present disclosure;

[0012] FIG. 4 is a schematic of an embodiment of the vapor compression system of FIG. 2, in accordance with an aspect of the present disclosure;

[0013] FIG. 5 is a schematic of an embodiment of a portion of an HVAC&R system, illustrating a variable speed drive (VSD) that may be utilized with a vapor compression system, in accordance with an aspect of the present disclosure; and

[0014] FIG. 6 is a schematic of an embodiment of a logic board that may be utilized with a VSD in a vapor compression system, in accordance with an aspect of the present disclosure.DETAILED DESCRIPTION

[0015] One or more specific embodiments will be described below. In an effort to provide a concise description of these embodiments, not all features of an actual implementation are described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers’ specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.

[0016] When introducing elements of various embodiments of the present disclosure, the articles “a,” “an,” and “the” are intended to mean that there are one or more of theelements. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. Additionally, it should be understood that references to “one embodiment” or “an embodiment” of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features.

[0017] As used herein, the terms “approximately,” “generally,” “substantially,” and so forth, are intended to convey that the property value being described may be within a relatively small range of the property value, as those of ordinary skill would understand. For example, when a property value is described as being “approximately” equal to (or, for example, “substantially similar” to) a given value, this is intended to convey that the property value may be within + / - 5%, within + / - 4%, within + / - 3%, within + / - 2%, within + / - 1%, or even closer, of the given value. Similarly, when a given feature is described as being “substantially parallel” to another feature, “generally perpendicular” to another feature, and so forth, this is intended to convey that the given feature is within + / - 5%, within + / - 4%, within + / - 3%, within + / - 2%, within + / - 1%, or even closer, to having the described nature, such as being parallel to another feature, being perpendicular to another feature, and so forth. Mathematical terms, such as “parallel” and “perpendicular,” should not be rigidly interpreted in a strict mathematical sense, but should instead be interpreted as one of ordinary skill in the art would interpret such terms. For example, one of ordinary skill in the art would understand that two lines that are substantially parallel to each other are parallel to a substantial degree, but may have minor deviation from exactly parallel.

[0018] A heating, ventilation, air conditioning, and refrigeration (HVAC&R) system may be implemented to thermally regulate a space within a building, home, or other suitable structure. For example, the HVAC&R system may include a vapor compression system (e.g., vapor compression circuit) that transfers thermal energy between a working fluid (e.g., a heat transfer fluid, such as a refrigerant) and a fluid to be conditioned, such as water, air, or another suitable fluid. The vapor compression system may include a oneor more heat exchangers, such as a condenser and an evaporator, that are fluidly coupled to one another via a working fluid circuit (e.g., one or more conduits). The vapor compression system may also include a compressor configured to circulate the working fluid through the working fluid circuit and thereby enable the transfer of thermal energy between the condenser and the evaporator and respectively fluids directed through the condenser and the evaporator.

[0019] In many cases, the compressor of the HVAC&R system may be driven by a motor. The motor may be communicatively coupled to a control system, which may include a variable speed drive (VSD). The control system may operate and control the motor to cause the motor to drive the compressor at a desired speed (e.g., a variable speed, a selected speed of a plurality of speeds). In some cases, the control system may further adjust the speed of the motor and the compressor during operation of the HVAC&R system. For example, a power output of the motor may be selected (e.g., by the control system) based on a capacity (e.g., a cooling demand) of the HVAC&R system.

[0020] The control system (e.g., VSD) may include a variety of components configured to enable operation of the compressor at variable speeds and therefore enable operation of the HVAC&R system at different operating capacities. For example, the VSD may include components configured to condition and control flow of electrical current through the VSD and to the motor. The VSD may include a rectifier, a DC link (e.g., DC bus), an inverter, capacitors, diodes, a control board, a control panel, a logic board, insulated-gate bipolar transistors (IGBTs), inductors, transformers, relays, fuses, and so forth. Indeed, components of the VSD may be electrically coupled to one another via wiring to enable flow of electric current therethrough.

[0021] As mentioned above, the VSD may include a logic board (e.g., a printed circuit board [PCB]) configured to monitor and / or control certain operational parameters of the VSD. For example, the logic board may monitor a magnitude of electric current and / or voltage drawn by or supplied to the VSD, a magnitude of electric current and / orvoltage output by the VSD (e.g., to the motor), a magnitude of electric current flow through a direct current (DC) bus of the VSD, and / or any other suitable operational parameter of the VSD. Indeed, the logic board of the VSD may enable, monitor, and / or control numerous operations, functions and / or parameters of the VSD.

[0022] Unfortunately, existing VSDs and / or components thereof may be susceptible to degradation and / or operational interruptions. For example, one or more components of the VSD may degrade at an end of a useful life of the components. In certain instances, one or more components of the VSD may operate improperly due to, for example, supply and / or manufacturing quality irregularities. It therefore may be desirable to monitor an operational state or condition of electrical components of the control system (e.g., the VSD) during operation of the HVAC&R system.

[0023] Accordingly, embodiments of the present disclosure are directed to a sensing system (e.g., a monitoring system) configured to monitor an operational state or condition of one or more electrical components of the HVAC&R system (e.g., chiller system). In particular, present embodiments include a logic board for a VSD and a sensing system integrated with the logic board. The sensing system may include one or more sensors and / or one or more sensing circuits integrated as components of the logic board (e.g., PCB). As will be appreciated, the logic board of the VSD may be installed within an enclosure configured to contain the VSD and associated components. Accordingly, the sensing system is configured to more readily detect and monitor one or more environmental parameters within the enclosure, such as parameters corresponding to a quality and / or composition of the air contained or residing within the enclosure.

[0024] The sensing system may also generate and provide feedback indicative of the environmental parameters. A controller (e.g., processing circuitry) of the logic board may be electrically and / or communicatively coupled to the sensing system and may be configured to receive the feedback from the sensing system. As discussed in detail herein, the controller is configured to determine and monitor an operational state or condition of one or more electrical components (e.g., VSD components) disposed withinthe enclosure based on the feedback received from the sensing system. Further, the controller may adjust operation of the HVAC&R system based on the feedback received from the sensing system (e.g., based on an operational state or condition of the one or more electrical components).

[0025] Turning now to the drawings, FIG. 1 is a perspective view of an embodiment of an environment for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system 10 in a building 12 for a typical commercial setting. The HVAC&R system 10 may include a vapor compression system 14 (e.g., a chiller, a vapor compression circuit) that generates and supplies a chilled liquid, which may be used to cool the building 12. The HVAC&R system 10 may also include a boiler 16 to supply warm liquid to heat the building 12 and an air distribution system which circulates air through the building 12. The air distribution system may include an air return duct 18, an air supply duct 20, and / or an air handler 22. In some embodiments, the air handler 22 may include a heat exchanger that is connected to the boiler 16 and the vapor compression system 14 by conduits 24. The heat exchanger in the air handler 22 may receive either heated liquid from the boiler 16 or chilled liquid from the vapor compression system 14, depending on the mode of operation of the HVAC&R system 10. The HVAC&R system 10 is shown with a separate air handler on each floor of building 12, but in other embodiments, the HVAC&R system 10 may include air handlers 22 and / or other components that may be shared between or among floors.

[0026] FIGS. 2 and 3 illustrate embodiments of the vapor compression system 14 that can be used in the HVAC&R system 10. The vapor compression system 14 may circulate a working fluid through a working fluid circuit starting with a compressor 32. The working fluid circuit may also include a condenser 34, an expansion valve(s) or device(s) 36, and a liquid chiller or an evaporator 38. The vapor compression system 14 may further include a control panel 40 that has an analog to digital (A / D) converter 42, a microprocessor 44, a non-volatile memory 46, and / or an interface board 48.

[0027] Some examples of fluids that may be used as working fluid in the vaporcompression system 14 are hydrofluorocarbon (HFC) based refrigerants, for example, R- 410A, R-407, R-134a, R-1234ze, R1233zd, hydrofluoro olefin (HFO), "natural" refrigerants like ammonia (NH3), R-717, carbon dioxide (CO2), R-744, or hydrocarbon based refrigerants, water vapor, or any other suitable working fluid. In some embodiments, the vapor compression system 14 may be configured to efficiently utilize working fluids having a normal boiling point of about 19 degrees Celsius (66 degrees Fahrenheit) at one atmosphere of pressure, also referred to as low pressure working fluids, versus a medium pressure working fluid, such as R-134a. As used herein, "normal boiling point" may refer to a boiling point temperature measured at one atmosphere of pressure.

[0028] In some embodiments, the vapor compression system 14 may use one or more of a variable speed drive (VSDs) 52, a motor 50, the compressor 32, the condenser 34, the expansion valve or device 36, and / or the evaporator 38. The motor 50 may drive the compressor 32 and may be powered by the variable speed drive (VSD) 52. The VSD 52 receives alternating current (AC) power having a particular fixed line voltage and fixed line frequency from an AC power source, and provides power having a variable voltage and frequency to the motor 50. In other embodiments, the motor 50 may be powered directly from an AC or direct current (DC) power source. The motor 50 may include any type of motor that can be powered by a VSD or directly from an AC or DC power source, such as a switched reluctance motor, an induction motor, an electronically commutated permanent magnet motor, or another suitable motor.

[0029] The compressor 32 compresses a working fluid vapor and delivers the vapor to the condenser 34 through a discharge passage. In some embodiments, the compressor 32 may be a centrifugal compressor. The working fluid vapor delivered by the compressor 32 to the condenser 34 may transfer heat to a cooling fluid (e.g., water or air) in the condenser 34. The working fluid vapor may condense to a working fluid liquid in the condenser 34 as a result of thermal heat transfer with the cooling fluid. The liquid working fluid from the condenser 34 may flow through the expansion device 36 to theevaporator 38. In the illustrated embodiment of FIG. 3, the condenser 34 is water cooled and includes a tube bundle 54 connected to a cooling tower 56, which supplies the cooling fluid to the condenser 34.

[0030] The liquid working fluid delivered to the evaporator 38 may absorb heat from a conditioning fluid, which may or may not be the same cooling fluid used in the condenser 34. The liquid working fluid in the evaporator 38 may undergo a phase change from the liquid working fluid to a working fluid vapor. As shown in the illustrated embodiment of FIG. 3, the evaporator 38 may include a tube bundle 58 having a supply line 60S and a return line 60R connected to a cooling load 62. The conditioning fluid of the evaporator 38 (e.g., water, ethylene glycol, calcium chloride brine, sodium chloride brine, or any other suitable fluid) enters the evaporator 38 via return line 60R and exits the evaporator 38 via supply line 60S. The evaporator 38 may reduce the temperature of the conditioning fluid in the tube bundle 58 via thermal heat transfer with the working fluid. The tube bundle 58 in the evaporator 38 can include a plurality of tubes and / or a plurality of tube bundles. In any case, the vapor working fluid exits the evaporator 38 and returns to the compressor 32 by a suction line to complete the cycle.

[0031] FIG. 4 is a schematic of the vapor compression system 14 with an intermediate circuit 64 incorporated between the condenser 34 and the expansion device 36. The intermediate circuit 64 may have an inlet line 68 that is directly fluidly connected to the condenser 34. In other embodiments, the inlet line 68 may be indirectly fluidly coupled to the condenser 34. As shown in the illustrated embodiment of FIG. 4, the inlet line 68 includes a first expansion device 66 positioned upstream of an intermediate vessel 70, which is incorporated into the vapor compression systems 14 described above to provide efficient operation. In some embodiments, the intermediate vessel 70 may be a flash tank (e g., a flash intercooler, an economizer). In other embodiments, the intermediate vessel 70 may be configured as a heat exchanger or a “surface economizer.” In the illustrated embodiment of FIG. 4, the intermediate vessel 70 is used as a flash tank, and the first expansion device 66 is configured to lower thepressure of (e.g., expand) the liquid working fluid received from the condenser 34. During the expansion process, a portion of the liquid may vaporize, and thus, the intermediate vessel 70 may be used to separate the vapor from the liquid received from the first expansion device 66.

[0032] Additionally, the intermediate vessel 70 may provide for further expansion of the liquid working fluid because of a pressure drop experienced by the liquid working fluid when entering the intermediate vessel 70 (e.g., due to a rapid increase in volume experienced when entering the intermediate vessel 70). The vapor in the intermediate vessel 70 may be drawn by the compressor 32 through a suction line 74 of the compressor 32. For example, the compressor 32 may include a single compressor stage configured to receive and pressurize both the vapor from the evaporator 38 and the vapor from the intermediate vessel 70 to a particular pressure. In other embodiments, the vapor in the intermediate vessel 70 may be drawn to an intermediate stage of the compressor 32 (e.g., not a suction stage). The liquid that collects in the intermediate vessel 70 may be at a lower enthalpy than the liquid working fluid exiting the condenser 34 because of the expansion in the expansion device 66 and / or the intermediate vessel 70. The liquid from intermediate vessel 70 may then flow along line 72 through a second expansion device 36 to the evaporator 38.

[0033] It should be appreciated that any of the features described herein may be incorporated with the vapor compression system 14 or any other suitable HVAC&R systems. For example, the present techniques may be incorporated with any HVAC&R system having an economizer, such as the intermediate vessel 70, and a compressor, such as the compressor 32. The discussion below describes the present techniques incorporated with embodiments of the HVAC&R system having one compressor 32. However, it should be noted that the systems and methods described herein may be incorporated with other embodiments of the HVAC&R system 10.

[0034] The present disclosure is directed to a logic board of a variable speed drive (VSD), such as the VSD 52 discussed above. In particular, the logic board includes anintegrated sensing system configured to sense, detect, and / or otherwise monitor an operational condition or state of one or more components (e.g., electrical components) of the VSD 52 and / or of the HVAC&R system 10 generally. The sensing system integrated with the logic board of the VSD 52 is configured to enable more rapid detection of deterioration, degradation, and / or other operation irregularities in the VSD 52 and / or components thereof. As a result, present embodiments enable mitigation of escalated degradation and / or extended operational interruptions of the HVAC&R system 10.

[0035] With the foregoing in mind, FIG. 5 is a schematic diagram of a portion of an embodiment of the HVAC&R system 10, illustrating an embodiment of the VSD 52 (e.g., VSD system) and a logic board 100 (e.g., VSD logic board) of the VSD 52 that is configured to monitor and / or control operation of the VSD 52. It should be understood that the VSD 52 and the logic board 100 may be configured to control the motor 50 of the vapor compression systems 14 of FIGS. 1-4, for example. An alternating current (AC) power source 102 may supply AC power to the VSD 52, which in turn supplies AC power to the motor 50. The AC power source 102 may provide three-phase, fixed voltage, and fixed frequency AC power to the VSD 52 from an AC power grid or distribution system. For example, the AC power source 102 may provide a first phase of AC power, a second phase of AC power, and a third phase of AC power through a first receiving line 104, a second receiving line 106, and a third receiving line 108, respectively.

[0036] In some applications, the AC power may be supplied directly from an electric utility or from one or more transforming substations between the electric utility and the AC power source 102. In some embodiments, the AC power source 102 may supply a three phase AC voltage, or line voltage, of up to 15 kilovolts (kV) at a line frequency of between 50 Hertz (Hz) and 60 Hz to the VSD 52, depending on the corresponding AC power source 102. However, in other embodiments, the AC power source 102 can provide any suitable fixed line voltage or fixed line frequency to the VSD 52 depending on the configuration of the AC power source 102. In addition, a particular site (e.g.,installed location of the HVAC&R system 10) can have multiple AC power sources that can satisfy different line voltage and line frequency demands.

[0037] The VSD 52 directs AC power from the AC power source 102 to the motor 50 at a desired voltage and a desired frequency. In certain embodiments, the VSD 52 may provide AC power to the motor 50 having higher voltages and frequencies or lower voltages and frequencies than the fixed voltage and fixed frequency AC power received from the AC power source 102. For example, the VSD 52 may include three internal sections (e.g., stages, blocks, modules): a converter 110 (e.g., a rectifier), a direct current (DC) link 112, and an inverter 114. The converter 110 may convert the fixed line frequency and / or the fixed line voltage from the AC power source 102 into DC power. The DC link 112 may filter the DC power from the converter 110 and / or store energy via components such as capacitors 116 and / or inductors. The inverter 114 may convert the DC power from the DC link 112 into variable frequency, variable voltage AC power (e.g., three phase AC power) for supply to the motor 50. For example, the inverter 114 may supply the motor 50 with a first phase of AC power, a second phase of AC power, and a third phase of AC power through a first output line 118, a second output line 120, and a third output line 122, respectively.

[0038] In some embodiments, the converter 110 may be a pulse width modulated (PWM) boost converter or rectifier having insulated gate bipolar transistors (IGBTs) to provide a boosted DC voltage to the DC link 112 and produce a fundamental root mean square (RMS) output voltage from the VSD 52 that is greater than a fixed nominal fundamental RMS input voltage to the VSD 52. Similarly, the inverter 114 may be a PWM-type inverter with IGBTs and / or other suitable transistors (e.g., switches). Additionally or alternatively, the converter 110 may include a diode bridge, such as diode modules and / or silicon controlled rectifier (SCR) modules arranged in a bridge configuration. Furthermore, in some embodiments, the VSD 52 may incorporate components in addition to those shown in FIG. 5 to provide the motor 50 with appropriate output voltages and frequencies, such as circuit breakers, power busses,additional capacitors, filters, resistors, power supplies, fuses, control boards, relays, and so forth.

[0039] In certain embodiments, the motor 50 may be an induction motor that is configured to be driven at variable speeds. The induction motor can have any suitable pole arrangement including two poles, four poles, six poles, or any suitable number of poles. The induction motor is configured to drive a load, such as the compressor 32 of the vapor compression system 14. In other embodiments, the motor 50 may be any suitable motor to drive the compressor 32 and / or another suitable device.

[0040] In some embodiments, the logic board 100 may be communicatively coupled to the VSD 52 via a harness 124 (e.g., wiring harness) or a plurality of harnesses. The harness 124 may include a plurality of wires (e g., copper wires, optical fibers), which enable the transmission of data and / or signals between the VSD 52 and the logic board 100. It should be appreciated that the logic board 100 may be considered a component of the VSD 52 or may be considered a component of a control system 128 (e.g., of the HVAC&R system 10) having the VSD 52. In some embodiments, the logic board 100 may monitor and / or control various operating parameters of the electrical power provided to the VSD 52 by the AC power source 102, such as a frequency and / or voltage of the electrical power supplied to the VSD 52 and / or a magnitude of an electric current drawn by the VSD 52. The logic board 100 may also be communicatively coupled (e.g., via the harness 124) to other components (e.g., of the control system 128, of the HVAC&R system 10), such as the control panel 40 and / or other controllers, control boards, and / or control panels. For example, the logic board 100 may control operation of components of the VSD 52 (e.g., the converter 110, the inverter 114) based on commands received from the control panel 40, such as run commands, speed commands, and so forth.

[0041] The logic board 100 may also be communicatively coupled (e.g., via the harness 124) to input sensing units 130 (e.g., input current transducers), which may be disposed on, about, or adjacent each of the first receiving line 104, the second receiving line 106, and / or the third receiving line 108. Particularly, a first input sensing unit 132disposed on the first receiving line 104 may monitor the first phase of AC power flowing through the first receiving line 104. The first input sensing unit 132 may include a voltage transducer, a current transducer, or another suitable device or sensor configured to measure a parameter of the first phase of AC power, such as a frequency of the first phase of AC power, a voltage value of the first phase of AC power, and / or a current value of the first phase of AC power, for example. The first input sensing unit 132 may output a signal (e.g., an analog signal, an electrical waveform) that is proportional to a value of the parameter of the first phase of AC power being monitored by the first input sensing unit 132. For example, in embodiments where the first input sensing unit 132 is configured to monitor a frequency of the first phase of AC power supplied to the VSD 52, the first input sensing unit 132 may output an electrical waveform having frequencies that corresponds to (e.g., are substantially equal to) the frequency of the first phase of AC power. Similarly, a second input sensing unit 134 disposed on the second receiving line 106 may monitor a parameter (e.g., frequency, voltage, and / or current) of the second phase of AC power flowing through the second receiving line 106, and a third input sensing unit 136 disposed on the third receiving line 108 may monitor a parameter (e.g., frequency, voltage, and / or current) of the third phase of AC power flowing through the third receiving line 108.

[0042] The logic board 100 may additionally or alternatively monitor parameters of the electrical power supplied to the motor 50 by the VSD 52. For example, output sensing units 140 (e.g., output current transducers) may include a first output sensing unit 142, a second output sensing unit 144, and a third output sensing unit 146 disposed on, about, and / or adjacent the first output line 118, the second output line 120, and the third output line 122, respectively. Accordingly, the first, second, and third output sensing units 142, 144, and 146 may monitor the first, second, and third phases of AC power flowing through the first, second, and third output lines 118, 120, and 122, respectively. That is, the first, second, and third output sensing unit 142, 144, and 146 may include voltage transducers, current transducers, and / or other suitable devices or sensors configured to measure respective frequencies, voltage values, and / or current values of thefirst, second, and third phases of AC power. Similar to the input sensing units 130 discussed above, the output sensing units 140 may each be communicatively coupled to the one or more signal sensing circuits 138 of the adaptive logic board 100 via the harness 124.

[0043] As mentioned above, the logic board 100 of the VSD 52 also includes a sensing system 150 (e.g., monitoring system, sensing and monitoring system) that is integrated with the logic board 100, in accordance with present techniques. The sensing system 150 is configured to monitor an operational condition or state of one or more electrical components 152 of the HVAC&R system 10. For example, the one or more components 152 may include the VSD 52 and / or components of the VSD 52. For clarity, as used herein, “electrical components 152” may refer to and / or include digital components (e g., microprocessors, application-specific integrated circuits [ASICs], field- programmable gate arrays [FPGAs]), analog components (e.g., wires, resistors, capacitors, inductors, diodes, transistors), electromechanical components (e.g., solenoids, actuators), power components (e.g., power supplies, inverters, circuit breakers, power busses, etc.) and / or other components of the HVAC&R system 10 that utilize and / or operate with electrical current. Indeed, the electrical components 152 may include any or all of the components of the VSD 52 (e.g., VSD system) discussed herein. Additionally, the electrical components 152 may also include wiring 154 extending between and electrically coupling the VSD 52 to other electrical components 152, electrically coupling components of the VSD 52 to one another, and so forth. The wiring 154 may include receiving lines 104, 108, and 108, as well as output lines 118, 120, and 122. That is, the wiring 154 may be configured to transmit electrical power from one component to another component. In some embodiments, the sensing system 150 may receive a supply of electrical power from the AC power source 102, from another component of the HVAC&R system 10 (e.g., the VSD 52), and / or from a separate power source (e.g., a battery).

[0044] The sensing system 150 integrated with the logic board 100 of the VSD 52 isconfigured to enable improved (e.g., more rapid) detection of one or more environmental parameters associated with the VSD 52, components of the VSD 52, and / or other components (e.g., electrical components 152) of the HVAC&R system 10. To this end, the logic board 100 may be disposed within an enclosure 156 (e.g., housing, electrical enclosure) of the HVAC&R system 10 that is configured to contain the VSD 52, the control system 128, and / or other electrical components 152 of the HVAC&R system 10. For example, in some embodiments, the control panel 40 of the HVAC&R system 10 may be disposed within the enclosure 156. In an installed configuration, the logic board 100 may be mounted to a panel (e.g., wall panel, door panel) of the enclosure 156 and / or may be spaced apart from the converter 110, the DC link 112, the inverter 114, and / or other electrical components 152 within the enclosure 156. The logic board 100 may additionally or alternatively be disposed adjacent or proximate other components of the VSD 52 within the enclosure 156, such as electrical components 152 (e.g., wiring 154) of the VSD 52.

[0045] With the logic board 100 and sensing system 150 integrated therewith installed in the enclosure 156, the sensing system 150 is configured to monitor one or more environmental parameters within an interior 158 of the enclosure 156. As used herein, “environmental parameters” may include, for example, a concentration (e g., in parts per million [ppm]) of compounds (e.g., organic compounds, non-organic compounds, carbon, carbon monoxide) that may be dispersed in the air within the enclosure 156. As a non-limiting example, such compounds may include carbon monoxide. Additionally or alternatively, “environmental parameters” may include a concentration of particulate matter (e.g., carbon particles) that may be suspended in the air within the enclosure 156. By integrating the sensing system 150 with the logic board 100 of the VSD 52, present embodiments enable more rapid detection of environmental parameters within the interior 158 of the enclosure 156, as well as more rapid implementation of remedial actions that may be implemented in response to detections of the sensing system 150 (e.g., detections of environmental parameters indicative of an undesirable operational condition or state within the enclosure 156).

[0046] In some instances, certain of the electrical components 152 may incur performance degradation over time. Indeed, a useful or designed life of some electrical components 152 may expire, and it may be desirable to perform maintenance and / or replacement of such electrical components 152 in order to maintain desirable operation of the HVAC&R system 10 and / or the VSD 52. In some cases, performance degradation of the electrical components 152 and / or other variables (e.g., electrical power quality, environmental factors, such as humidity, supply and / or manufacturing irregularities, etc.) may cause the electrical components 152 to experience a thermal event during operation of the HVAC&R system 10. As another example, improper and / or degraded electrical connections (e.g., loose and / or unsecure connections of the wiring 154) of and / or between electrical components 152 may cause a thermal event. As used herein, a thermal event may be indicative of an operational condition or state of the electrical component 152 in which a temperature of the electrical component 152 exceeds an expected operating temperature range of the electrical component 152 (e.g., overheating of the electrical component 152, such as wiring 154). As such, during a thermal event, the operational state of the electrical component 152 may deviate from an expected operational state of the electrical component 152 (e.g., a temperature of the electrical component 152 may be elevated beyond an expected operating temperature of the electrical component 152).

[0047] In certain embodiments, the presence of certain compounds and / or particulates (e.g., carbon monoxide) in the air within the enclosure 156 may be indicative of a potential occurrence and / or the existence of a thermal event. That is, the environmental parameters within the enclosure 156 may be altered before and / or during a thermal event. Thus, the sensing system 150 integrated with the logic board 100 is configured to detect the presence of one or more compounds and / or particulates within the air that may be indicative of a potential or existing thermal event more readily. As described in further detail below, the sensing system 150 integrated with the logic board 100 may provide feedback indicative of the environmental parameters (e.g., a potential or existing thermal event) to a controller of the logic board 100, and the logic board 100 may utilize thefeedback to evaluate an operational condition or state of the electrical components 152 and / or of the VSD 52. In some instances, the logic board 100 may execute or implement a control action or response to evaluation of the operational condition or state of the electrical components 152 and / or of the VSD 52. Indeed, due to the integration of the sensing system 150 with the logic board 100, remedial, corrective, and / or compensatory control functions (e.g., in response to a potential or existing thermal event) may also be executed (e.g., by the logic board 100) more rapidly, which may reduce and / or mitigate potential and / or further degradation of the electrical components 152.

[0048] FIG. 6 is a schematic of an embodiment of the logic board 100, which may be incorporated with the VSD 52. As discussed above, the logic board 100 includes the sensing system 150 integrated with the logic board 100. For example, the logic board 100 may be a printed circuit board (PCB) 180, and the sensing system 150 (e.g., components of the sensing system 150) may be integrated (e.g., mounted, installed, fused, soldered, attached) with the PCB 180 as a component or system of the logic board 100.

[0049] As shown in the illustrated embodiment, the logic board 100 may include various components configured to enable the functionalities of the logic board 100 described herein. For example, the logic board 100 may include a controller 182 (e.g., an automation controller, a programmable logic controller [PLC]) integrated with (e g., disposed on) the PCB 180. The controller 182 may include processing circuitry 184, and the processing circuitry 184 may include one or more microprocessors, one or more “general-purpose” microprocessors, one or more special-purpose microprocessors, one or more application specific integrated circuits (ASICS), one or more reduced instruction set (RISC) processors, one or more field programmable gate arrays (FPGAs), one or more digital signal controllers (DSCs), one or more digital signal processors (DSPs), or any combination thereof. In some embodiments, the processing circuitry 184 includes an FPGA 186 configured to control operation of the VSD 52 with increased rapidity (e.g., without execution of software or other executable code). For example, the FPGA 186 may be configured to suspend operation of the VSD 52 in response to data and / orfeedback provided by the sensing system 150 (e.g., indicative of a potential or existing thermal event). In some embodiments, the FPGA 186 may actuate (e.g., trip) a circuit breaker of the VSD 52 to interrupt supply of power from the AC power source 102 to the VSD 52 to suspend operation of the VSD 52.

[0050] The logic board 100 (e.g., the controller 182) also include a memory 188 disposed on the PCB 180. The memory 188 may store information, such as instructions, control software, look up tables, configuration data, other data, and so forth. The memory 188 may include a volatile memory, such as random access memory (RAM), and / or a nonvolatile memory, such as read-only memory (ROM). Additionally or alternatively, the memory 188 may include flash memory, a hard drive, or any other suitable optical, magnetic, or solid-state storage medium, or a combination thereof. In some embodiments, the memory 188 is a tangible, non-transitory, machine-readable- medium that may store machine-readable instructions for the processing circuitry 184 to execute. The memory 188 may store a variety of information and may be used for various purposes. For example, the memory 188 may store processor-executable instructions including firmware or software for the processing circuitry 184 to execute, such as instructions for controlling components of the VSD 52. In some embodiments, the memory 188 may store operating parameter values (e.g., threshold values, predetermined values) that the processing circuitry 184 may compare to detected values of corresponding operating parameters of the VSD 52 (e.g., data received by the processing circuitry 184), such as voltage, current, temperature, and so forth. The operating parameter values stored on the memory 188 may be associated with one or more hardware faults of the VSD 52, and the logic board 100 may be configured to suspend operation of the VSD 52 based on comparison of a detected operating parameter value with a threshold operating parameter value stored on the memory 188.

[0051] The logic board 100 also includes other components, which may be coupled to and / or integrated with the PCB 180, such as communication circuitry 190, one or more input / output (VO) ports 192, and one or more indicators 194. The communicationcircuitry 190 is configured to enable communication between the logic board 100 and other components of the HVAC&R system 10, such as components of the VSD 52 and / or the control system 128. In some embodiments, the communications circuitry 190 may be configured to establish and enable communication between the logic board 100 and the control panel 40. Additionally or alternatively, the communications circuitry 190 may be configured to establish and enable communication between the logic board 100 and another control board or control panel of the VSD 52 or the control system 128.

[0052] The one or more I / O ports 192 are also configured to enable coupling (e.g., electrical coupling, communicative coupling) between the logic board 100 and other components or devices. For example, the VO ports 192 may be configured to enable electrical coupling between the logic board 100 and one or more external sensors 196 (e g., off-board sensors) and / or one or more external sensing circuits 198. The external sensors 196 and / or the external sensing circuits 198 may include the input sensing units 130 and / or the output sensing units 140, in some embodiments. As another example, the external sensors 196 and / or the external sensing circuits 198 may include one or more temperature sensors or sensing circuits configured to detect a temperature of a heat sink of the VSD 52, the motor 50, air within the enclosure 156, an ambient temperature external to the enclosure 156, the converter 110, another suitable temperature, or any combination thereof. Indeed, the external sensors 196 and / or the external sensing circuits 198 may be configured to detect any suitable operating parameter associated with operation of the VSD 52 (e.g., power supply operating parameters, current flow direction, etc.). Further, the I / O ports 192 may include ports or interfaces, such as a Universal Serial Bus (USB) port, a Secure Digital (SD) card slot (e g., microSD card slot), an RS- 485 port, an Ethernet port, a control board interface port, an RS-232 interface port, another interface port, or any combination thereof.

[0053] The one or more indicators 194 may be configured to provide feedback, such as visual feedback and / or auditory feedback, to an operator or user of the HVAC&R system 10. For example, the one or more indicators 194 may be configured to providefeedback indicative of a status, operational state, and / or other condition of the VSD 52. In some embodiments, the one or more indicators 194 may include a visual indicator, such as one or more light emitting diodes (LEDs).

[0054] As mentioned above, the logic board 100 also includes the sensing system 150 integrated with the logic board 100 (e.g., integrated with the PCB 180). In accordance with present techniques, the sensing system 150 includes one or more sensors 200 integrated with and / or disposed on the logic board 100 (e.g., PCB 180). Additionally or alternatively, the sensing system 150 may include one or more sensing circuits 202 integrated with and / or disposed on the logic board 100 (e.g., the PCB 180). The sensors 200 and / or sensing circuits 202 are configured to monitor one or more environmental parameters within the interior 158 of the enclosure 156 (e.g., VSD enclosure) and to provide the controller 182 with feedback indicative of the environmental parameters.

[0055] In accordance with present techniques, the sensing system 150 includes a carbon monoxide (CO) sensor cell 204 (e.g., organic compound sensor cell, particulate sensor cell) as one of the sensors 200 and a CO sensing circuit 206 (e.g., sensor supporting circuit, sensing circuit) as one of the sensing circuits 202. The CO sensor cell 204 and the CO sensing circuit 206 may cooperatively define a CO sensor 208 (e.g., sensor, environmental parameter sensor, sensor system) of the sensing system 150. As will be appreciated, carbon monoxide may be present in the interior 158 of the enclosure 156 prior to or during a thermal event. Accordingly, the CO sensor cell 204 is configured to detect a concentration of carbon monoxide within the interior 158. While the present discussion describes the sensing system 150 as including the CO sensor 208 configured to detect carbon monoxide within the enclosure 156 to determine the presence of potential and / or exiting thermal events, it should be appreciated that other embodiments of the sensing system 150 may include a sensor (e.g., sensor cell, sensing circuit, etc.) configured to detect other organic compounds, elements, and / or particles (e.g., environmental parameters) that may be indicative of the potential and / or presence of potential and / or exiting thermal events. Indeed, the CO sensor 208 may be any suitablesensor configured to detect any suitable operating parameter indicative of the presence of potential and / or exiting thermal events.

[0056] The CO sensor cell 204 may be an electrochemical sensor or device configured to detect a concentration of CO in the air within the interior 158 of the enclosure 156 and to generate a current indicative of the CO concentration (e.g., via one or more chemical reactions within the CO sensor cell 204). The current generated by the CO sensor cell 204 is output to the CO sensing circuit 206 (e.g., sensor supporting circuit, transimpedance amplifier circuit), and the CO sensing circuit 206 is configured to convert the current into a voltage (e.g., a digital signal). Thereafter, the CO sensing circuit 206 may transmit the voltage to the processing circuitry 184 (e.g., the controller 182). Indeed, the CO sensor 208 may be directly coupled (e.g., directly electrically coupled) to the processing circuitry 184. In other embodiments, the CO sensor 208 may be another type of sensor, such as a semiconductor sensor (e.g., semiconductor CO sensor). Further, in addition to or instead of a voltage output, the CO sensor 208 (e.g., CO sensing circuit 206) may be configured to output a current and / or a digital signal (e.g., direct digital signal) to the processing circuitry 184.

[0057] The processing circuitry 184 may compare the voltage received from the CO sensor 208 (e.g., the CO sensing circuit 206) with one or more threshold values, which may be stored in the memory 188. The one or more threshold values may correlate with one or more threshold concentrations of CO within air that are indicative of a potential thermal event and / or an existing thermal event. The threshold values may be adjusted, such as by a user (e.g., via a user input). Additionally or alternatively, the processing circuitry 184 may be configured to adjust one or more of the threshold values, such as based on operating conditions and / or parameters of the HVAC&R system 10, based on an elapsed life and / or operating time of equipment of the HVAC&R system 10, and / or based on an elapsed life and / or operating time of the CO sensor 208. In some embodiments, the processing circuitry 184 may determine a potential or an occurrence of the thermal event in response to from the CO sensor 208 indicating that the concentration of CO within theinterior 158 exceeds a threshold value (e.g., by a target amount or tolerance) at a particular instance in time or for a predetermined time interval (e.g., 5 seconds). Additionally or alternatively, the processing circuitry 184 may determine a potential or an occurrence of the thermal event based on a rate of change of a detected CO concentration indicated by feedback received from the CO sensor 208, such as a rate of change that exceeds a threshold rate of change stored in the memory 188.

[0058] In response to a determination that the CO concentration detected by the CO sensor 208 is indicative of a potential thermal event and / or an existing thermal event, the processing circuitry 184 may execute a remedial and / or responsive control action. For example, the processing circuitry 184 may initiate a shutdown (e.g., suspend operation) of the VSD 52 (e.g., the HVAC&R system 10) to suspend flow of electrical current therethrough (e.g., through electrical components 152 of the VSD 52). As mentioned above, the processing circuitry 184 may include the FPGA 186, which may be configured to rapidly initiate a remedial and / or responsive control action (e.g., shutdown of the VSD 52), such as without execution of a software loop. In this way, present embodiments enable an improved, more rapid control response to a potential thermal event and / or an existing thermal event, and further degradation and / or operational interruptions that would otherwise be caused by thermal events may be substantially mitigated and / or avoided.

[0059] In addition to initiating a remedial and / or responsive control action, the controller 182 (e.g., processing circuitry 184) may also output an alert indicative of a detected CO concentration that may be associated with a thermal event. For example, the processing circuitry 184 may cause actuation and / or activation of one of the indicators 194 (e.g., a visual indicator), such as illumination (e.g., constant illumination, intermittent illumination) of an LED. In some embodiments, the controller 182 and / or another component of the logic board 100 (e.g., the communication circuitry 190) may transmit an alert (e.g., signal) to the control panel 40 (e.g., user interface) and / or other component of the HVAC&R system 10 to communicate the alert to a user or operator. Additionallyor alternatively, the control system 128 may transmit the alert to a device (e.g., user device, an electronic device) that is remote from the HVAC&R system 10, such as a mobile device, a building automation system, another suitable system or device, or any combination thereof.

[0060] In some applications, a sensitivity of the CO sensor 208 (e.g., the CO sensor cell 204) , which may be expressed in nanoamperes per parts per million (nA / ppm) may vary. For example, different embodiments of the CO sensor 208 may have different sensitives for CO detected within air. Further, the sensitivity of the CO sensor 208 may vary based on a temperature of the CO sensor 208. In particular, the current output by the CO sensor cell 204 for a particular detected CO concentration may vary as the temperature of the CO sensor cell 204 varies. Accordingly, present embodiments include a temperature sensor 210 of the sensing system 150 that is also integrated with the logic board 100. In some embodiments, the CO sensor cell 204 and the temperature sensor 210 may be posited adjacent (e.g., next to) one another on the PCB 180. The temperature sensor 210 may be configured to detect a temperature of the CO sensor cell 204, a temperature of the PCB 180, and / or an ambient temperature surrounding the logic board 100. The temperature sensor 210 may provide feedback indicative of the detected temperature to the controller 182 (e.g., processing circuitry). In some instances, the processing circuitry 184 may be configured to evaluate a concentration of CO detected by the CO sensor 208 based on the voltage received from the CO sensing circuit 206 as well as based on the temperature detected by the temperature sensors 210. For example, the processing circuitry 184 may reference data stored in the memory 188 that associates respective voltage values and corresponding CO concentrations for various different detected temperature values. In some embodiments, the processing circuitry 184 may be configured to apply an adjustment to the voltage received from the CO sensing circuit 206 based on a temperature value detected by the temperature sensor 210 in order to desirably evaluate the CO concentration within the enclosure 156. To mitigate the effect of temperature on the sensitivity of the CO sensor 208, the CO sensor 208 (e.g., CO sensor cell 204) may be disposed on the PCB 180 remote and / or away from powercircuitry, power supplies, and / or other heat generating components of the logic board 100. For example, in some embodiments, the CO sensor 208 may be disposed on the PCB 180 adjacent one or more of the I / O ports 192.

[0061] Further, in some applications, the CO sensor 208 (e.g., the CO sensor cell 204) may be removed from the logic board 100 and replaced at an end of a useful life of the CO sensor 208. As mentioned above, the replacement of the CO sensor 208 (e.g., CO sensor cell 204) may have a different CO detection sensitivity. Accordingly, the controller 182 (e.g., the processing circuitry 184) may be reprogrammed based on the sensitivity of the new CO sensor 208. For example, in some embodiments, updated threshold values (e.g., threshold voltage values, threshold CO concentration values) associated with a potential thermal event and / or an existing thermal event may be stored in the memory 188 for reference by the processing circuitry 184 during operation of the logic board 100 with the new CO sensor 208 (e.g., replacement CO sensor cell 204).

[0062] As discussed above, embodiments of the present disclosure may provide one or more technical effects useful for detecting occurrence of a thermal event within an enclosure of an HVAC&R system that may contain one or more electrical components. Specifically, present embodiments include a logic board for a VSD that includes an integrated sensing system configured to monitor environmental parameters within an enclosure, such as a VSD enclosure, configured to house the VSD and electrical components. The sensing system integrated with the logic board of the VSD enables more rapid detection of environmental parameters, such as carbon monoxide concentrations within the enclosure, that may be indicated of a potential and / or existing thermal event. Moreover, the sensing system integrated with the logic board of the VSD enables more rapid implementation of remedial and / or responsive control actions based on a determination that potential and / or presence of a thermal event exists. Thus, present embodiments enable improved mitigation and avoidance of degradation of the VSD and electrical components within the enclosure that may otherwise occur due to thermal events within the enclosure. The technical effects and technical problems in thespecification are examples and are not limiting. It should be noted that the embodiments described in the specification may have other technical effects and can solve other technical problems.

[0063] While only certain features and embodiments have been illustrated and described, many modifications and changes may occur to those skilled in the art, such as variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, such as temperatures and pressures, mounting arrangements, use of materials, colors, orientations, and so forth, without materially departing from the novel teachings and advantages of the subject matter recited in the claims. The order or sequence of any process or method steps may be varied or resequenced according to alternative embodiments. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the disclosure.

[0064] Furthermore, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not have been described, such as those unrelated to the presently contemplated best mode, or those unrelated to enablement. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, without undue experimentation.

[0065] The techniques presented and claimed herein are referenced and applied to material objects and concrete examples of a practical nature that demonstrably improve the present technical field and, as such, are not abstract, intangible or purely theoretical. Further, if any claims appended to the end of this specification contain one or more elements designated as “means for [perform]ing [a function], or “step for [perform]ing [a function]...”, it is intended that such elements are to be interpreted under 35 U.S.C.112(f). However, for any claims containing elements designated in any other manner, it is intended that such elements are not to be interpreted under 35 U.S.C. 112(f).

Claims

CLAIMS:

1. A variable speed drive (VSD) for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, comprising: a logic board configured to control operation of the VSD, wherein the logic board comprises a printed circuit board; a sensing system integrated with the printed circuit board, wherein the sensing system comprises a sensor configured to acquire data indicative of an environmental parameter value within an enclosure of the VSD; and a controller integrated with the printed circuit board, wherein the controller is configured to receive the data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to determination of the occurrence of the thermal event.

2. The VSD of claim 1, wherein the data comprises a concentration of carbon monoxide within the enclosure.

3. The VSD of claim 2, wherein the sensor comprises: a carbon monoxide sensor cell configured to detect the concentration of carbon monoxide within the enclosure and to generate a current indicative of the concentration of carbon monoxide; and a sensing circuit configured to receive the current from the carbon monoxide sensor cell and convert the current into a voltage, wherein the sensing circuit is configured to transmit the voltage to the controller.

4. The VSD of claim 1, wherein the controller is configured to suspend operation of the VSD in response to the determination of the occurrence of the thermal event.

5. The VSD of claim 1, wherein the controller is configured to actuate avisual indicator to output a visual indication indicative of the occurrence of the thermal event.

6. The VSD of claim 5, wherein the visual indicator comprises a light emitting diode integrated with the printed circuit board.

7. The VSD of claim 1, wherein the sensor is a first sensor, the sensing system comprises a second sensor, the second sensor is a temperature sensor, and the temperature sensor is disposed adjacent to the first sensor on the printed circuit board.

8. The VSD of claim 1, wherein the controller is configured to determine the occurrence of the thermal event in response to a determination that the data from the sensor is indicative of the environmental parameter value exceeding a threshold value, the logic board comprises a memory integrated with the printed circuit board, and the memory is configured to store the threshold value.

9. The VSD of claim 1, wherein the controller comprises a field- programmable gate array (FPGA), and the FPGA is configured to adjust operation of the VSD in response to the determination of the occurrence of the thermal event.

10. A variable speed drive (VSD) logic board for a VSD of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, wherein the VSD logic board comprises: a printed circuit board; a sensor integrated with the printed circuit board, wherein the sensor is configured to detect an organic compound in air within an enclosure of the HVAC&R system and to transmit data indicative of a concentration of the organic compound in the air within the enclosure; and a controller integrated with the printed circuit board, wherein thecontroller is configured to receive the data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to determination of the occurrence of the thermal event.

11. The VSD logic board of claim 10, wherein the sensor comprises: a sensor cell configured to detect the organic compound in the air within the enclosure and to generate a current indicative of the concentration of the organic compound in the air; and a sensing circuit configured to receive the current from the sensor cell and convert the current into a voltage, wherein the sensing circuit is configured to transmit the voltage to the controller as the data.

12. The VSD logic board of claim 11, wherein the organic compound is carbon monoxide.

13. The VSD logic board of claim 11, wherein the sensing circuit is a transimpedance amplifier circuit.

14. The VSD logic board of claim 10, wherein the controller is configured to: compare the data indicative of the concentration of the organic compound in the air to a threshold value stored in a memory of the VSD logic board; determine that the concentration of the organic compound in the air exceeds the threshold value; determine the occurrence of the thermal event within the enclosure based on the determination that the concentration of the organic compound in the air exceeds the threshold value; and suspend operation of the VSD in response to the determination of the occurrence of the thermal event.

15. The VSD logic board of claim 14, wherein the controller is configured to control operation of a converter of the VSD, control operation of an inverter of the VSD, or both.

16. A heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, comprising: an enclosure; a variable speed drive (VSD) disposed within the enclosure, wherein the VSD is configured to operate a motor of the HVAC&R system at variable speeds, and the VSD comprises a converter, a DC link, and an inverter; and a VSD logic board disposed within the enclosure, wherein the VSD logic board is configured to control operation of the VSD, and the VSD logic board comprises: a printed circuit board; a sensor integrated with the printed circuit board, wherein the sensor is configured to detect carbon monoxide in air within the enclosure and to transmit data indicative of a concentration of the carbon monoxide in the air within the enclosure; and a controller integrated with the printed circuit board, wherein the controller is configured to receive the data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to determination of the occurrence of the thermal event.

17. The HVAC&R system of claim 16, wherein the controller is configured to suspend operation of the VSD in response to the determination of the occurrence of the thermal event.

18. The HVAC&R system of claim 16, wherein the sensor is directly electrically coupled to the controller.

19. The HVAC&R system of claim 16, the sensor comprises: a sensor cell configured to detect the carbon monoxide within the enclosure and to generate a current indicative of the concentration of carbon monoxide; and a sensing circuit configured to receive the current from the sensor cell and convert the current into a voltage, wherein the sensing circuit is configured to transmit the voltage to the controller.

20. The HVAC&R system of claim 19, wherein the VSD logic board comprises a temperature sensor integrated with the printed circuit board, and the temperature sensor is disposed adjacent to the sensor on the printed circuit board.

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