Implantable electroceutical system including cortical electrode and wireless charging device

The implantable electronic drug system with a flexible brain cortex electrode and wireless charging addresses the rigidity and bulkiness issues of current devices, enabling minimal skull opening and reducing patient discomfort, while providing convenient wireless charging.

WO2025110742A1PCT designated stage expired Publication Date: 2025-05-30GBRAIN INC
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Patent Information

Application Number
PCT/KR2024/018482
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-21
Filing Date
2024-11-21
Publication Date
2025-05-30

AI Technical Summary

Technical Problem

Current commercialized brain implantable medical devices are rigid and bulky, requiring wide skull opening and causing issues like changes in intracranial pressure, deep brain damage, and infection, along with inconvenience due to external connection wires.

Method used

An implantable electronic drug system with a brain cortex electrode and wireless charging device, featuring a flexible interpolation element with a laminated structure integrated circuit, minimizing skull opening and reducing device volume, and utilizing inductive coupling technology for wireless charging.

Benefits of technology

The system allows for minimal skull opening during surgery, increasing surgical stability and reducing patient discomfort, while the wireless charging feature eliminates the need for external wires, enhancing convenience and safety.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention comprises: an interpolation element including a contact unit for measuring a signal generated in the brain or transmitting stimulation to the brain, a transmission / reception unit configured to transmit a signal received from the contact unit to the outside or transmit a signal indicating the stimulation to the contact unit, and a connection unit for connecting the contact unit and the transmission / reception unit; and an integrated circuit connected to the transmission / reception unit to transmit and receive a signal, wherein the integrated circuit has a stacked structure.
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Description

An implantable electronic drug system that includes a brain cortex electrode and a wireless charging device.

[0001] The present invention relates to an implantable electronic drug system comprising a brain cortex electrode and a wireless charging device. The present invention was researched with the support of the following research projects.

[0002] 1. Alchemist Project ([Project Unique Number] 20012355 / [Project Number] 20012355 / [Ministry Name] Ministry of Trade, Industry and Energy / [Project Management (Specialized) Agency Name] Korea Institute of Industrial Technology Evaluation and Planning / [Research Project Name] Industrial Technology Alchemist Project / [Research Project Name] Development of a Fully Implantable Closed-Circuit Brain to X for Voice Communication / [Contribution Rate] 100% / [Project Implementing Agency Name] G-Brain Co., Ltd. / [Research Period] September 1, 2020 ~ December 31, 2026 (Total Research Period))

[0003] 2. Materials and Components Technology Development Project ([Project Unique Number] RS-2024-00418941 / [Project Number] RS-2024-00418941 / [Ministry Name] Ministry of Trade, Industry and Energy / [Project Management (Specialized) Agency Name] Korea Institute of Industrial Technology Planning and Evaluation / [Research Project Name] Materials and Components Technology Development (R&D) / [Research Project Name] Wireless Closed-Loop Cranial Nerve Stimulator for Parkinson's Disease Diagnosis / Treatment / [Contribution Rate] 100% / [Project Implementing Agency Name] G-Brain Co., Ltd. / [Research Period] July 1, 2024 - December 31, 2026)

[0004] Brain implantable medical devices are devices containing multiple microelectrodes that acquire neural signals or transmit electrical stimulation, acting as neural interfaces that connect neurons to electronic circuits. Electrical stimulation offers the advantages of fewer side effects, reversibility, and ease of adjustment compared to drug therapy or surgical resection.

[0005] Currently commercially available brain implantable medical devices are rigid and bulky, requiring extensive cranial opening and the use of penetrating electrodes to stimulate deep brain regions. This has led to potential side effects, including changes in intracranial pressure due to skull opening, serious damage to deep brain regions, and infections.

[0006] In addition, brain implantable medical devices cause inconvenience to patients when inserted into the brain due to the connection wire to the outside, and there are inconveniences such as the need to perform a separate connection procedure to the outside.

[0007] Accordingly, the industry is continuously and actively conducting research and development to address the problems of brain implantable medical devices.

[0008] The present invention was created to solve the problems of the prior art as described above and to expand the scope of application, and the purpose of the present invention is to provide a medical device for measuring brain signals and transmitting stimulation that can minimize opening of the skull by having a minimum volume using a high-performance element with excellent adhesion to living tissue and a laminated structure design.

[0009] The present invention comprises an interpolation element including a contact portion for measuring a signal generated in the brain or transmitting a stimulus to the brain, a transceiver portion configured to transmit a signal received from the contact portion to the outside or to transmit a signal indicating the stimulus to the contact portion, a connection portion connecting between the contact portion and the transceiver portion; and an integrated circuit connected to the transceiver portion for transmitting and receiving a signal, wherein the integrated circuit is characterized by having a layered structure.

[0010] Specifically, the integrated circuit includes a housing; and a laminated portion having the laminated structure, wherein the housing includes an upper case protecting an upper direction of the laminated portion; a side case having a height higher than the height of the laminated portion and having a through portion on at least a portion of one side; and a lower case formed on a lower side of the laminated portion; wherein the side case may be formed larger than the laminated portion so that at least a portion of space is formed between the side case and the laminated portion.

[0011] Specifically, the transceiver may be formed so that at least a portion thereof penetrates the penetration portion.

[0012] Specifically, the upper case may be formed of a synthetic resin material, and the side case and the lower case may be formed of a metal material.

[0013] Specifically, the laminated portion may include a receiver coil, a battery, an IC, a PCB, and at least a portion of the transceiver.

[0014] Specifically, the transceiver of the laminated portion is formed on the lowest layer, and can be laminated in the order of the transceiver, PCB, IC, battery, and receiver coil.

[0015] Specifically, the battery may be formed in a circular shape, and the housing may be provided in a square shape.

[0016] Specifically, each component of the laminated portion can be electrically connected.

[0017] In the brain signal measurement and stimulation structure including the interpolation element and integrated circuit of the present invention, the interpolation element has excellent flexibility and mechanical properties, and thus can be installed in the brain, thereby enabling surgery by opening only a very narrow area of ​​the skull region, thereby increasing surgical stability, and minimizing the volume of the structure including the integrated circuit installed in the skull, thereby minimizing patient discomfort.

[0018] FIG. 1 is a drawing showing the configuration of an interpolation element according to an embodiment of the present invention.

[0019] FIG. 2 is a drawing showing a form in which an integrated circuit according to an embodiment of the present invention is attached to a skull surface.

[0020] FIG. 3 is a diagram schematically showing the internal configuration of an integrated circuit according to an embodiment of the present invention.

[0021] FIG. 4 is a schematic diagram of a system including a brain cortex electrode and an inductive coupling technology-based wireless device according to another embodiment of the present invention.

[0022] FIG. 5 is a schematic diagram illustrating an example of an interpolation element according to another embodiment of the present invention.

[0023] FIG. 6 is a schematic diagram illustrating another example of an interpolation element according to another embodiment of the present invention.

[0024] FIG. 7 is a schematic diagram illustrating another example of an interpolation element according to another embodiment of the present invention.

[0025] FIG. 8 is a schematic drawing showing an example of a left end according to another embodiment of the present invention.

[0026] FIG. 9 is a schematic drawing showing an example of a connecting portion according to another embodiment of the present invention.

[0027] FIG. 10 is a schematic drawing showing another example of a connecting portion according to another embodiment of the present invention.

[0028] FIG. 11 is a schematic drawing showing another example of a connecting portion according to another embodiment of the present invention.

[0029] FIG. 12 is a schematic drawing of an example of a system including a guide portion according to another embodiment of the present invention.

[0030] FIG. 13 is a schematic drawing of a guide part including a fixing member according to another embodiment of the present invention.

[0031] FIG. 14 is a schematic diagram illustrating another example of a system according to another embodiment of the present invention.

[0032] FIG. 15 is a schematic diagram illustrating another example of a system according to another embodiment of the present invention.

[0033] FIG. 16 is a schematic diagram of a system including a brain cortex electrode and an inductive coupling technology-based wireless device according to another embodiment of the present invention.

[0034] The objects, specific advantages, and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments, taken in conjunction with the accompanying drawings. In this specification, when reference numerals are assigned to components in each drawing, it should be noted that, where possible, identical components are given the same reference numerals even if they appear in different drawings. Furthermore, in describing the present invention, if a detailed description of a related known technology is deemed to unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

[0035] Hereinafter, a detailed description will be provided along with the drawings shown below.

[0036] FIG. 1 is a drawing showing the configuration of an interpolation element according to an embodiment of the present invention, and FIG. 2 is a drawing showing a form in which an integrated circuit according to an embodiment of the present invention is attached to a skull surface.

[0037] A system (10) including a brain cortex electrode and an inductive coupling technology-based wireless device according to an embodiment of the present invention includes an interpolation element (100) and an integrated circuit (200). In addition, the system (10) including a brain cortex electrode and an inductive coupling technology-based wireless device may be a structure for measuring and stimulating brain signals, and may be a system including the same.

[0038] The interpolation element (100) of the embodiment of the present invention with reference to FIG. 1 may include a contact portion (110), a connection portion (120), and a transceiver portion (130). Specifically, the interpolation element may include a contact portion (110) that contacts the surface of the cerebral cortex, a transceiver portion (130) that is installed in the space between the skull and the skin, and a connection portion (120) that connects the contact portion (110) and the transceiver portion (130) at both ends and is arranged across the inside and outside of the skull by passing through the skull. Here, the interpolation element (100) is a flexible cerebral cortex electrode that can be transformed into various shapes, and embodiments of each shape will be described later.

[0039] The system (10) including the brain cortex electrode and wireless device of the present invention may include components for a flexible electrode, a wireless link, and wireless power supply, recording, and stimulation.

[0040] Among the implanted elements (100) injected into the brain, the contact portion (110) contacts the cerebral cortex, and the connecting portion (120) penetrates the skull to connect the contact portion (110) and the transceiver portion (130). The contact portion (110) may include electrode pads, and contacts the cerebral cortex through the electrode pads.

[0041] The transceiver (130) is coupled to the integrated circuit (200) and is positioned between the skull and the skin or on the skull or inserted into the skull.

[0042] FIG. 3 is a diagram briefly showing the internal configuration of an integrated circuit (200) according to an embodiment of the present invention.

[0043] The integrated circuit (200) of the embodiment of the present invention may be a wireless chip, and functions to wirelessly transmit and receive radio waves or wirelessly receive power. The integrated circuit (200) may include a wireless power device, a recording device, a stimulation device, and a wireless communication device, and may be a package that includes the above-described components to enhance biocompatibility.

[0044] The integrated circuit (200) is installed in the space between the skull and the skin. Specifically, the wireless power device is for supplying power to the integrated circuit (200), the recording device is for recording measured brain waves, the stimulation device is for processing signals for providing stimulation to the brain, and the wireless communication device is a component for wirelessly transmitting the measured brain waves to the outside and receiving external commands.

[0045] Referring to FIG. 3, the integrated circuit (200) records radio wave measurements received from the brain to acquire biometric information and detect abnormal signals. When an abnormality is detected, the integrated circuit (200) applies energy such as current, voltage, magnetic field, or electric field stimulation to perform neuromodulation to treat diseases or regulate brain activity.

[0046] The integrated circuit (200) may include a wireless chip power supply (210) which is a wireless power device, a recorder (220) which is a recording device, a stimulator (230) which is a stimulation device, a chip controller (240) and a communication device (250).

[0047] The wireless chip power supply (210) includes a power regulator (211) and a battery (212).

[0048] The battery (212) can wirelessly supply energy (energy harvesting) using an RF coil, an on-chip coil, etc., and can store energy supplied wirelessly.

[0049] The battery (212) can be charged wirelessly using WPT (Wireless Power Transfer) technology.

[0050] The power regulator (211) is a current converter that converts AC of the battery (212) into DC and transmits it directly to the chip controller (240) or transmits it to a power management circuit (Power Management System; 294; Fig. 15) and then transmits it to the chip controller (240).

[0051] A Neural Micro Electrode is an electrode (111) attached to the brain that can measure brain waves and perform electrical stimulation. For example, it may be an electrode (111) formed on a contact portion (110) of an interpolation element (100).

[0052] In brain wave measurement, analog data measured by a Neural Micro Electrode is converted into digital data by a converter (ADC; 291 Fig. 15) and transmitted to a chip controller (240). At this time, the digital data can be recorded by a recorder (220), and the recorded digital data is wirelessly transmitted to an external device through a wireless communication device (250) via the chip controller (240). Here, the converter (ADC; 291) varies depending on the number of brain wave measurement panels, i.e., the number of electrodes (111), and can be configured to be included in the recorder (220).

[0053] The recorder (220) can input and convert multi-channel brainwave measurement data into digital signals through a converter (ADC; 291).

[0054] The chip controller (240) can control the measurement signal and stimulus signal.

[0055] The wireless communication device (250) is wirelessly connected to an external communication network so that it can be monitored from outside the body. The wireless communication device (250) can wirelessly transmit a digital signal converted by the converter (ADC; 291) of the recorder (220) through an electrode or antenna.

[0056] The integrated circuit (200) must ensure biocompatibility by ensuring that the packaging material of the integrated circuit is compatible with the body, taking into account issues such as packaging heat generation, and the chip must not be affected during encapsulation formation.

[0057] The integrated circuit (200) can be used as a package material without limitation as long as it is a material commonly used in vivo in the relevant field, but PDMS (Polydimethylsiloxane), Parylene C, Polyimide, and biocompatible UV resin are suitable.

[0058] Specifically, if brain waves are measured through an electrode (111) exposed to the outside at a contact portion (110) of an interpolation element (100), for example, a graphene electrode layer, and transmitted to an integrated circuit (200), the brain waves can be wirelessly transmitted to the outside through the integrated circuit (200).

[0059] When an abnormality is detected in the brain wave signal measured by the chip controller (240), it is transmitted to the outside via a wireless communication device (250) and a command is transmitted to the stimulator (230) to apply an electrical stimulation signal to the Neural Micro Electrode, i.e., the electrode (111). The stimulator (230) varies depending on the number of electrical stimulation channels. The stimulator (230) can generate or transmit a therapeutic stimulus commanded by the chip controller (240).

[0060] Brain waves measured through the contact portion (110) of the interpolation element (100) can be converted into a digital signal through a recorder (220) and transmitted to an integrated circuit (200), which can then be wirelessly transmitted to a smart device such as a smartphone, a smart pad, or a computer. One or more recorders (220) can be included.

[0061] Conversely, radio waves received from the outside through the integrated circuit (200) can be transmitted to the brain through the interpolation element (100).

[0062] Through this process, if an abnormality is detected in the brain waves measured by the contact portion (110), this is transmitted to the outside, and the integrated circuit (200) can be controlled to provide an electric signal or the like to the contact portion (110). For example, the integrated circuit (200) can transmit a command to a stimulator (230) to stimulate the cerebral cortex. One or more stimulators (230) can be included.

[0063] Meanwhile, the integrated circuit (200) may play a role in transmitting external radio waves received by a separate wireless communication device to the integrated circuit through an electrode or antenna, thereby transmitting the external radio waves to the brain without receiving them as they are.

[0064] The present invention may include additional components to enhance the adhesion of the contact portion (110) to wet biological tissue. For example, the surface of the insulating layer formed on the contact portion (the layer that blocks the electrode formed on the inside) may be hydrophilic surface-treated and include hydrophilic functional groups bonded thereto. The present invention may additionally include hydrophobic microstructures formed on a portion of the surface of the lower support substrate, which is opposite to the surface.

[0065] The contact portion (110) of the present invention may have a hydrophilic treatment on the side that directly contacts the cerebral cortex, and a hydrophobic treatment on the opposite side. In addition, the contacting side may be prevented from turning over.

[0066] The present invention can provide a method for measuring brain signals and a method for stimulating the brain using a system (10) including a brain cortex electrode and a wireless device.

[0067] The contact portion (110) can contact the cerebral cortex and receive electrical signals generated in the brain. Specifically, the graphene electrode layer among the contact portions (110) of the interpolation element (100) measures the electrical signals. These are transmitted to the integrated circuit (200) connected to the transceiver (130) through the wiring layer, and brain signals received through the terminal can be visually provided, as will be described later.

[0068] Meanwhile, the transceiver (130) is located in the space between the skull and the skin and can receive external stimuli and transmit them to the cerebral cortex. Specifically, the transceiver (130) can receive external stimuli and transmit them to the cerebral cortex.

[0069] As an example, the transceiver (130) can be connected to an integrated circuit (200), and the integrated circuit (200) can be in contact with the surface of the skull or inserted into the skull.

[0070] Meanwhile, the system (10) including the brain cortex electrode and wireless device of the present invention may additionally include an amplifier. This amplifier can amplify the electrical signal measured from the electrode of the interpolation device (100) of the present invention.

[0071] Meanwhile, the system (10) including the brain cortex electrode and wireless device of the present invention is described as being injected into the brain, but the location where the interpolation element (100) is injected can be inserted or implanted into the spinal cord, peripheral nerves, etc., within the range applicable to a person skilled in the art.

[0072] The system (10) including the brain cortex electrode and wireless device of the present invention can be used in vitro, ex vivo, and in vivo. The living organism is an animal, and may include a human, but may also be an animal other than a human.

[0073] The system (10) including the brain cortex electrode and wireless device of the present invention provides a medical device. The medical device of the present invention may include an integrated circuit (200) connected to a transceiver (130) of an interpolation element (100). Specifically, the interpolation element (100) has a diameter of several mm. 2 ~ several cm 2 The interpolation element (100) can be injected only through the skull region, and the contact portion (110) of the interpolation element (100) is in contact with the cerebral cortex, and the integrated circuit (200) is connected to the transceiver portion (130) of the interpolation element (100) and is installed between the skull and the skin, preferably in contact with the skull surface, or can be inserted into the skull. In this case, a part of the lower portion of the integrated circuit (200) may be exposed to the lower side of the skull. The contact portion (110) of the interpolation element (100), which is in contact with the brain through this exposed lower portion, may be connected to the integrated circuit (200) through the connection portion (120).

[0074] In addition, the present invention can provide a brain cortex electrode and stimulation module that additionally includes a wireless communication device that directly transmits external radio waves to a circuit (200). For example, as described above, transmission and reception are possible only with a wireless module such as Bluetooth or a wireless communication network (Wi-Fi) within the interpolation element (100) and the integrated circuit (200), but a wireless communication device can be additionally used for safer signal transmission and reception through BCC (Body Channel Communication).

[0075] Specifically, external radio waves received via a wireless communication device are transmitted to the integrated circuit via the BCC antenna. This allows the BCC antenna to transmit external radio waves to the brain, rather than simply accepting them.

[0076] Wireless communication devices are not limited to those capable of receiving external stimuli and transmitting them to an integrated circuit. They can be devices that adhere to the skin. For example, they can be smart devices worn on the wrist, waist, or other areas.

[0077] The wireless communication device can communicate with external terminals such as computers and smartphones via Bluetooth, Wi-Fi, etc., and provide various information to the user through measured brain wave signals, and can transmit stimuli transmitted from the terminal to the integrated circuit (200). Additionally, the device can also be equipped with a function to transmit information to a medical institution when an emergency signal occurs.

[0078] The present invention can also provide a method for stimulating the brain of an animal by implanting a cortical electrode into the animal's brain. The animal may be any human. As described above, when a stimulation command is transmitted from an external source, it is transmitted to the integrated circuit (200) via the electrode or antenna, and the stimulation can be delivered to the cerebral cortex via the interpolation device (100) of the present invention.

[0079] For example, brain stimulation can be achieved through the following process. If an abnormality such as a seizure is detected in the brain waves measured through the interpolation element (100), the integrated circuit (200) can receive it and provide it to the outside. If it is determined through the provided information that stimulation needs to be applied from the outside, the information can be transmitted to the integrated circuit (200) and then the stimulation can be transmitted to the electrodes of the interpolation element (100) through a stimulator (Strimulator; 230) within the integrated circuit (200) to transmit electrical stimulation to the cerebral cortex. Through this process, abnormal brain wave signals can be removed.

[0080] The present invention aims to provide stimulation to the cerebral cortex through an interpolation element (100). The stimulation is not limited thereto, but may be one or more selected from current stimulation, voltage stimulation, electric field stimulation, and magnetic field stimulation.

[0081] According to another embodiment of the present invention, a system (10) including a brain cortex electrode and an inductive coupling technology-based wireless device includes an integrated circuit (200) composed of an interpolation element (100), a housing (300), and a laminated portion (260); wherein the integrated circuit (200) is connected to the transceiver (130) to transmit and receive signals, and may have a laminated structure.

[0082] Here, the integrated circuit (200) may transmit and receive information obtained through the interpolation element (100). For example, it may utilize electronic communication.

[0083] At this time, the integrated circuit (200) may include a power supply and may be capable of wireless communication.

[0084] Additionally, the integrated circuit (200) may have a stacked structure. Specifically, each device, including a power supply, a PCB, an IC, etc., may have a stacked structure to minimize volume. A detailed description will be provided later.

[0085] FIG. 4 is a schematic diagram of a system including a brain cortex electrode and an inductive coupling technology-based wireless device according to an embodiment of the present invention.

[0086]

[0087] According to another embodiment of the present invention with reference to FIG. 4, the housing (300) may have a structure with a width (X) of 25 mm, a length (Y) of 25 mm, and a height (Z) of 10 mm, and may include an upper case (310) that protects the upper direction of the laminated portion (260); a side case (320) that has a height higher than the height of the laminated portion (260) and has a through portion (321) on at least a portion of one side; and a lower case (330) formed on the lower side of the laminated portion (260).

[0088] Here, the housing (300) may serve to protect devices included in the integrated circuit (200). Specifically, it may have a laminated portion (260) and a portion of the interpolated element (100) built into it, and may protect the embedded devices from the outside of the wireless device so that they can operate electrically.

[0089] The upper case (310) may be formed on the upper side of the laminated portion (260) to protect the laminated portion (260).

[0090] The side case (320) may be formed on the side of the laminated portion (260) to protect the laminated portion (260). At this time, the side case (320) protecting the laminated portion (260) may have a length greater than the height of the laminated portion (260).

[0091] The lower case (330) may be formed on the lower side of the laminated portion (260) to protect the laminated portion (260).

[0092] Each component of the housing (300) formed as described above may be combined, and the upper case (310) and the lower case (330) may have the same size. In addition, the upper case (310) and the lower case (330) may have a width greater than the width of the laminated portion (260). In addition, the side case (320) may have a height greater than the height of the laminated portion (260). Accordingly, the laminated portion (260) formed inside by the upper case (310), the side case (320), and the lower case (330) can be protected.

[0093] Here, the housing (300) may be configured to surround the laminated portion (260) and form at least a portion of space. For example, when the laminated portion (260) is configured in a circular shape, the housing (300) may be configured in a square shape so that at least a portion of space is formed between the laminated portion (260) and the housing (300), specifically, between the side surface of the laminated portion (260) and the side case (320). This allows a signal to be well transmitted to the outside through the antenna constructed in the PCB (214) or a signal received from the outside by the antenna to be well transmitted.

[0094] The integrated circuit (200) integrated by the housing (300) may protect the electrical components inside the housing (300) from substances present in the body when the interpolation element (100) acquires and transmits a signal generated from the cerebral cortex and receives and processes it.

[0095] Additionally, the integrated circuit (200) may be connected, at least in part, to a transceiver (130).

[0096] At this time, a penetrating portion (321) having a shape in which a part of the side case (320) is removed may be provided so that the transceiver (130) extending from the contact portion (110) can be inserted into the housing (300). The penetrating portion (321) may have a shape that matches the transceiver (130) and may have a larger size than the transceiver (130).

[0097] According to another embodiment of the present invention, the transceiver (130) may be formed so that at least a portion thereof penetrates the through portion (321).

[0098] Here, the penetration portion (321) may be a shape in which a portion of the side case (320) is removed. Specifically, it may be a shape in which a portion is removed so as to form a gap through which the transmitting and receiving unit (130) formed to extend to the contact portion (110) can remain in a penetrated state.

[0099] In addition, the transceiver (130) may have an extended shape from the contact portion (110) and the connection portion (120), and accordingly, at least a portion of the transceiver (130), the connection portion (120), or the contact portion (110) may be formed in the through portion (321). Accordingly, at least a portion may be formed to pass through the through portion (321) of a shape in which it is detached.

[0100] The side case (320) of the present invention may be provided with an intrusion prevention member to prevent external substances from entering through the empty space formed between the through-hole (321) and the transceiver (130) after the transceiver (130) is inserted into the through-hole (321). For example, it may have a waterproof structure made of a material such as rubber or plastic.

[0101] According to another embodiment of the present invention, the upper case (310) may be formed of a synthetic resin material (preferably plastic), and the side case (320) and the lower case (330) may be formed of a metal material (preferably titanium).

[0102] Here, the upper case (310) may be formed of synthetic resin to ensure smooth communication of signals generated from the laminated portion (260) formed inside the housing (300).

[0103] Additionally, the side case (320) and the lower case (330) may be formed of titanium.

[0104] If the side case (320) and the lower case (330) are formed of titanium, there may be no effect from future MRI examinations or high-frequency procedures.

[0105] Conversely, if the upper case (310) is formed of titanium, it may be preferable for the upper case (310) to be formed of plastic, as it can serve as a shield to block communication occurring in the laminated portion (260).

[0106] According to another embodiment of the present invention, the laminated portion (260) may include a receiver coil (213), a battery (212), a PCB (214) having an IC chip inserted therein, and at least a portion of the transceiver portion (130).

[0107] Here, the receiver coil (213) may be a receiver coil and may receive power from the outside, and the battery (212) may be a flat cylindrical battery.

[0108] An IC (Integrated Circuit) can refer to a complex, ultra-small device or system in which many electronic circuit elements are inseparably connected on a single substrate or to the substrate itself. It can be a single electronic circuit formed by precisely manufacturing complex electronic components such as transistors, diodes, resistors, and capacitors and embedding them within a small semiconductor. For example, instead of using individual semiconductors separately, it can be a case in which thousands or tens of thousands of them are gathered and stacked on a silicon plane. Such an IC can be installed on a PCB (214) described below.

[0109] A PCB (printed circuit board; 214) may be a printed circuit board that forms an electronic circuit by fixing an IC (integrated circuit) to the surface of a printed wiring board and connecting the components with copper wires. Here, the PCB (214) may include components that enable wireless communication, such as an antenna.

[0110] Through the above configuration, information obtained from the interpolation element (100) can be transmitted to the outside and information from the outside can be received.

[0111] In particular, it can be made possible wirelessly so that it can be used without making additional incisions on the scalp after the procedure.

[0112] According to another embodiment of the present invention, the transceiver (130) of the laminated portion (260) is formed on the lowest layer and can be laminated in the following order: transceiver (130), PCB, IC (since the IC is fixed on the PCB), battery (212), and receiver coil.

[0113] Each configuration may be identical to that described above.

[0114] Here, the transceiver (130) is connected to the connecting portion (120) formed as an extension from the contact portion (110), and may be formed at the lowest end of the stacked portion (260) so as to minimize the stress on the interpolation element (100). For example, if the transceiver (130) of the interpolation element (100) is located at the highest end of the stacked portion (260), it must be connected to the contact portion (110) of the interpolation element (100) that contacts the cerebral cortex present at the lower side of the skull, and thus may be excessively bent, which may cause stress to be concentrated on the interpolation element (100) itself and cause damage. To resolve this, the transceiver (130) may be formed at the lowest end of the stacked portion (260). That is, in the present embodiment, the transceiver (130) is arranged on the lower side of the PCB in the stacked portion (260) and connected to the PCB. At this time, the PCB may be configured so that the upper side faces the battery (212) and the lower side is connected to the transmitter / receiver (130).

[0115] Meanwhile, unlike the embodiment mentioned above, the transceiver (130) may be connected to the upper side of the PCB in the laminated portion (260). In this case, the PCB may be configured so that the upper side is connected to the transceiver (130) and the lower side faces the battery (212).

[0116] In another embodiment, the transceiver (130) may be connected to the side of the PCB in the laminate (260). In this case, the PCB may be configured so that its upper side faces the battery (212), but its lower side may be the lowest side of the laminate (260).

[0117] In another embodiment, the transceiver (130) may be connected to the upper side of the PCB in the laminate (260). In this case, the PCB may be the lowermost side of the laminate (260) and may be configured so that its upper side is connected to the transceiver (130). In this case, the transceiver (130) may be placed between the PCB and the battery (212).

[0118] In addition, by placing the receiver coil (213) at the top, power can be received quickly and accurately from the outside. However, in the case of data here, an antenna built on the PCB (214) is installed, and this PCB (214) is located at the lower side of the laminated part (260), so that wireless communication may not be smooth due to interference by the battery (212) or the receiver coil (213) installed at the upper side. To solve this, in the present invention, the housing (300) may be configured to form at least a portion of space while surrounding the laminated part (260). For example, when the laminated part (260) is configured in a circular shape, the housing (300) may be configured in a square shape so that at least a portion of space is formed between the laminated part (260) and the housing (300), specifically, between the side surface of the laminated part (260) and the side case (320).

[0119] Meanwhile, as illustrated in FIG. 16, it may have a laminated structure. At this time, the PCB (214) may be arranged as in the above-mentioned embodiment, but may additionally be configured so that the PCB (214) is arranged on the inside of the side case (320). At this time, since some necessary components of the PCB (214) are arranged on the inside of the side case (320), the area required for the PCB (214) can be reduced, thereby having the effect of reducing the overall volume of the laminated portion (260). At this time, the housing (300) illustrated in FIG. 16 has a circular shape, and the PCB (214) arranged on the inside of the side case (320) may be an FPCB (Flexible PCB).

[0120] According to another embodiment of the present invention, the battery (212) may be formed in a circular shape, and the housing (300) may be provided in a square shape.

[0121] Here, the battery (212) may act as an interference factor when generating a signal for information transmission. To minimize this, it may be formed in a circular shape.

[0122] Additionally, the housing (300) may be provided in a square shape to optimize signal generation.

[0123] According to another embodiment of the present invention, each component of the laminated portion (260) can be electrically connected.

[0124] Here, the stacking unit (260) may be a device for reading and transmitting brain signals through the interpolation element (100) and receiving and controlling external signals.

[0125] At this time, the components of the stacking unit (260) may be electrically connected for transmitting and receiving information. Specifically, the transmitting and receiving unit (130), the PCB (214), the battery (212), and the receiver coil (213) are electrically connected to each other, so that the power received from the receiver coil (213) is stored in the battery (212), and the electrical energy stored in the battery (212) can be appropriately transmitted to the PCB (214) and the transmitting and receiving unit (130).

[0126] FIG. 5 is a schematic drawing showing an example of an interpolation element (100) according to another embodiment of the present invention, FIG. 6 is a schematic drawing showing another example of an interpolation element (100) according to another embodiment of the present invention, and FIG. 7 is a schematic drawing showing another example of an interpolation element (100) according to another embodiment of the present invention.

[0127] According to another embodiment of the present invention with reference to FIG. 5, the contact portion (110) may be formed such that the substrate is elongated in the longitudinal direction. In this case, the contact portion (110) may have, for example, a longitudinal direction of 60.0 mm and a width direction of 15.0 mm. (Here, the longitudinal direction is the horizontal direction of FIG. 5, and the width direction is the vertical direction of FIG. 5.)

[0128] Specifically, the contact portion (110) may contact the motor cortex when it comes into contact with the cerebral cortex, and may have a length that can cover the outer surface of the motor cortex.

[0129] At this time, the contact portion (110) may have a rectangular shape, and at least one electrode (111) may be formed.

[0130] The electrode (111) can receive signals generated from the brain and transmit signals to the brain using electrical stimulation.

[0131] Here, the electrode (111) may be formed only on the front surface of the contact portion (110), or may be formed only on the back surface. Additionally, it may be formed on both sides by penetrating the contact portion (110).

[0132] According to another embodiment of the present invention with reference to FIG. 6, the contact portion (110) may be formed in multiple numbers on both sides based on the transceiver portion (130).

[0133] Here, the contact portion (110) is connected to the transceiver (130) by the connection portion (120). For example, when the contact portions (110) are formed on both sides of the transceiver (130), connection portions (120) may be formed on both sides, and each connection portion (120) may be connected to the contact portion (110).

[0134] In this form, it is possible to form a contact portion (110) in independent brain areas formed on both the left and right brain sides through one transmitter / receiver portion (130).

[0135] According to another embodiment of the present invention with reference to FIG. 7, the contact portion (110) may include a left end portion (140), a middle portion (150), and a right end portion (160).

[0136] As shown in Fig. 7, when the transceiver (130) is formed on the right side and the contact portion (110) is formed on the left side, the contact portion (110) side can be defined as the left side and the transceiver (130) side can be defined as the right side.

[0137] The left end (140) may be an area formed on the left side of the contact portion (110) and may be an area where the most electrodes (111) are formed.

[0138] The right end (160) may be the area closest to the integrated circuit (200) and may have the fewest number of electrodes (111).

[0139] The intermediate portion (150) may be an area connecting the left end (140) and the right end (160), and the number of electrodes may be intermediate between the left end (140) and the right end (160).

[0140] It may be possible to make the electrodes heavier by pushing them into the left end (140) compared to the middle end (150) and right end (160) so that they are well-placed on the brain surface.

[0141] In addition, when the contact part (110) is attached to the brain, the lower part of the motor cortex where the left end (140) is seated has many nerves distributed (more nerves are distributed to the eyes, nose, mouth, etc. than to the feet, knees, etc.), and accordingly, many electrodes are required for stimulation or brain wave detection, so that the efficiency of stimulation and data reception may be improved.

[0142] According to another embodiment of the present invention, the interpolation element (100) in contact with the cerebral cortex may be formed in the order of the left end (140), the middle end (150), and the right end (160), with the left end (140) formed at the far left.

[0143] Specifically, it may be in the order of the right end (160), the middle end (150), and the left end (140) from the integrated circuit (200).

[0144] By having this configuration, the heaviest left end (140) is formed to bend toward the cerebral cortex, thereby making it easy to settle on the cerebral cortex.

[0145] According to another embodiment of the present invention, the density of the electrodes may increase as they move from the right end (160) to the left end (140).

[0146] Electrode density can refer to the number of electrodes present per unit area. For example, a high density means that there are many electrodes per unit area.

[0147] Electrodes can have a certain weight, and the weight can increase as the electrode density increases.

[0148] Accordingly, when attached to the brain due to the increased weight, the left end (140) can be completely settled without being lifted off from the brain cortex.

[0149] In addition, when the interpolation element (100) is attached to the brain, the location of the left end (140) may be a place where many brain signals are formed, and signals may be acquired accurately and quickly using a number of electrodes.

[0150] In addition, when a large number of electrodes are formed on the interpolation element (100), there is an effect of being able to form a wide range of lesion locations that can be covered when attached.

[0151] According to another embodiment of the present invention, the interpolation element (100) may be formed of an elastic material.

[0152] Specifically, the interpolation element (100) may be formed to be bent downwards toward the integrated circuit (200), the right end (160), the middle end (150), and the left end (140) so as to be in close contact with the brain. For example, the interpolation element (100) may be formed to be bent in a shape from the upper side to the lower side of the brain so as to be in close contact with the brain.

[0153] These interpolation elements (100) are formed to have elasticity, so that when they are placed on the meninges, they can be additionally bent at a certain angle.

[0154] According to another embodiment of the present invention, the connecting portion (120) connecting the contact portion (110) and the transceiver portion (130) may have a width thinner than that of the contact portion (110) or the transceiver portion (130).

[0155] For example, a connecting portion (120) having a thinner width than the contact portion (110) may be connected to the transceiver (130) at the right end of the rectangular-shaped contact portion (110). Here, the connecting portion (120) may serve to physically connect the contact portion (110) and the transceiver (130) while allowing electrical movement.

[0156] This type of connection (120) can minimize material waste and improve flexibility.

[0157] Figure 8 is a schematic drawing showing an example of a left end (140) according to another embodiment of the present invention.

[0158] According to another embodiment of the present invention with reference to (a) of FIG. 8, the end of the left end (140) may include a step (141).

[0159] Here, the step portion (141) may be formed to have a certain weight so that when the interpolation element (100) comes into contact with the meninges, all of the ends are settled in the brain. For example, when the step portion (141) has a certain weight, when the interpolation element (100) is settled in the meninges by the weight of the step portion (141), it can be easily moved in the direction of gravity or the direction in which the user shakes it, and the elasticity of the interpolation element (100) due to the movement can be utilized to the maximum extent.

[0160] According to another embodiment of the present invention, the step portion (141) may be provided in a rectangular shape.

[0161] For example, a step (141) with the thickness of the interpolation element (100) may be additionally formed at the end of the left end (140) to allow contact with the meninges.

[0162] According to another embodiment of the present invention with reference to FIG. 8 (b), the step portion (141) may have a gradient structure in which the thickness becomes thicker toward the end of the left end portion (140).

[0163] The gradient structure may be a structure that minimizes the space between the meninges and the interpolation element (100) when the interpolation element (100) is settled on the meninges.

[0164] For example, when the weight of the step portion (141) causes the membrane to be settled, the gradient structure may allow the membrane to flexibly fit when a portion of the membrane is aligned with the shape of the step portion (141).

[0165] According to another embodiment of the present invention, the thickness of the end of the right end (160) may be 16 ㎛, and the thickness of the end of the left end (140) may be 18 to 20 ㎛.

[0166] Here, the end of the right end (160) may be the end on the transceiver side (130).

[0167] Additionally, the end of the left end (140) may be the opposite end of the transceiver (130).

[0168] The end of the left end (140) is formed thicker than the end of the right end (160), so that when the interpolation element (100) is installed in the brain, it can be installed well in an irregular brain shape.

[0169] FIG. 9 is a drawing schematically showing an example of a connecting part (120) according to another embodiment of the present invention, FIG. 10 is a drawing schematically showing another example of a connecting part (120) according to another embodiment of the present invention, and FIG. 11 is a drawing schematically showing another example of a connecting part (120) according to another embodiment of the present invention.

[0170] According to another embodiment of the present invention with reference to FIG. 9, the connecting portion (120) may be provided with a plurality of substrates (1201) having a wire shape. In an embodiment of the present invention, the contact portion (110) may be formed as a large-area multi-channel surface electrode. As the contact portion (110) is formed with multiple channels, when the connecting portion (120) connected to the transceiver (130) is manufactured in a lateral shape in the form of a film, there is a disadvantage in that the width of the lateral shape increases, requiring a wide incision of the scalp during surgery. Therefore, in the present invention, the connecting portion (120) is provided with a bundle of wire-shaped substrates (1201), so that the contact portion (110), which is a large-area flexible electrode, has the advantage of not requiring a wide scalp incision when connected to an external measurement terminal after being inserted into the cerebral cortex.

[0171] Here, the plurality of wire-shaped substrates may be formed by dividing a plate-shaped substrate into a plurality of wire-shaped substrates. In this case, wiring may be formed on each of the plurality of wire-shaped substrates and separated into individual wires.

[0172] Additionally, the multiple wire-shaped substrates may be provided in different colors. This may be to easily distinguish the multiple wires by wiring.

[0173] The connecting portion (120) having a plurality of wire-shaped substrates may be formed into a bundle using a shrink tube (121) described later. This can increase rigidity.

[0174] The connecting portion (120) having a plurality of wire-shaped substrates may be compressed using a shrink tube (121).

[0175] A connecting portion (120) formed in the shape of a thin wire can be connected by passing through the incised skin. However, a weak connecting portion (120) may cause breakage. To prevent this, multiple wire-shaped substrates may be bundled together.

[0176] The shrink tube (121) may be formed to have a certain rigidity and may be used to bundle multiple wire-shaped substrates into a single string shape. The bundled multiple wire-shaped substrates can minimize volume while maintaining rigidity when passing through the skull.

[0177] According to another embodiment of the present invention, the shrink tube (121) may be a flexible material that coats a plurality of bundled wire-shaped substrates.

[0178] For example, it may be a case of coating multiple bundled wire-shaped substrates with silicone from the outside.

[0179] This shape gives it the strength to pass through the skin and allows for easy connection.

[0180] Additionally, the connecting portion (120) may be formed to have a serpentine structure to absorb strain applied to the portion connected to the transceiver (130), and this portion may be coated with soft rubber or, for example, silicone.

[0181] According to another embodiment of the present invention with reference to FIG. 10, the connecting portion (120) may have at least a portion having a serpentine structure.

[0182] Here, the winding structure may be a substrate (1201) having a wire shape having a certain shape.

[0183] For example, it may have a curved shape that becomes wider as it gets closer to the contact portion (110).

[0184] This is because the material used to manufacture the interpolation element (100) does not have high elasticity because it contains less than 6-7% of parylene and less than 1% of gold, and furthermore, the structure of the electrode adversely affects the elasticity. Therefore, when a process of wrapping the wire-shaped substrate (1201) by bundling it together with silicone or a shrink tube (121) is performed, the pressure (strain) generated is concentrated in a specific area. In this case, if the pressure (strain) is concentrated in a part with weak durability, there is a risk of breakage or damage. Therefore, in order to concentrate the pressure (strain) concentrated in this specific area into a part with good durability, the connecting portion (120) may be formed by wire-shaped substrates (1201), and at least some of the wire-shaped substrates (1201) may have a serpentine structure. The winding structure of this connection (120) allows the pressure (strain) concentrated in a specific area to be concentrated in the connection (120) because the effective stiffness of the winding structure is significantly smaller than that of other materials.

[0185] In particular, when the wire-shaped substrates (1201) are joined together at the portion where the wire-shaped substrates are connected to the contact portion (110), a strain may be generated on the outermost wire-shaped substrate (1201) that is pulled inward. Accordingly, the wire-shaped substrate (1201) formed at the outermost can have the most curved shape.

[0186] The connecting portion (120) formed as described above may minimize strain by increasing the length as the winding area spreads out when the wire-shaped substrate (1201) is joined together.

[0187] According to another embodiment of the present invention, the substrate (1201) having a wire shape of the connecting portion (120) may have a curved shape only in a portion close to the contact portion (110).

[0188] When the wire-shaped connecting portion (120) is bundled together, the pressure (strain) generated occurs in a portion close to the contact portion (110), and among these, it may be strongly generated in the wire-shaped substrate (1201) located outside. Accordingly, the wire-shaped substrate (1201) may be provided with a curved shape only in a portion close to the contact portion (110) of the connecting portion (120).

[0189] According to another embodiment of the present invention, the area of ​​the contact portion (110) connected to the connecting portion (120) may be provided in a 'v' shape.

[0190] When the wire-shaped substrates (1201) having a winding structure of the connecting portion (120) are connected to the contact portion (110), the length may be secured to the maximum extent and the pressure (strain) generated may be minimized. For example, the inner wire-shaped substrates (1201) may be formed so that the length of the wire-shaped substrates (1201) increases as they go outward.

[0191] According to another embodiment of the present invention with reference to FIG. 11, the wire-type substrate (1201) of the connection portion (120) may have 64 channels of wiring. Specifically, the wire-type substrate (1201) has wiring (1202) formed on the substrate, and 20 wire-type substrates (1201) including three wirings (1202) are formed, and one wire-type substrate (1201) including two wirings (1202) is formed on each of the two sides of the 20 wire-type substrates (1201), so that a total of 64 wirings (1202), i.e., 64 channels of wiring (1202), can be formed. At this time, the width (W1) of the wiring (1202) is formed to be 10 to 30 um (preferably 15 um), and the width (W2) of one wire-shaped substrate (1201) is formed to be 50 to 200 um (preferably 85 um), so that preferably, the total width (W3) of the wire-shaped substrate (1201) can be formed to be 2.24 mm. At this time, the thickness (D) of the wire-shaped substrate (1201) can be manufactured to be 15 um or more. The number of wirings (1202) that can be formed on one wire-shaped substrate (1201) can be changed according to the design. At this time, a substrate (1203) that connects the wire-shaped substrates (!201) to each other can be formed, and this connection substrate (1203) can connect the wire-shaped substrates (1201) at an angle of 45 degrees. If the connecting board (1203) is connected at a 90-degree angle, the stiffness in the x-axis direction increases, which can prevent the wire-type boards (1201) from clumping together, so that the connecting board (1203) can connect the wire-type boards (1201) at a 45-degree angle. This 45-degree angle can prevent the wire-type boards (1201) from being torn due to the high stiffness in the x-axis direction when the connecting portion (120) is forcibly clumped together when wrapping it with a shrink tube (121) or silicone, etc.That is, when the connecting board (1203) is connected at an angle of 90 degrees, tearing of the wire-shaped board (1201) may be induced due to high X-axis direction stiffness, but this can be prevented when the connecting board (1203) is connected at an angle of 45 degrees.

[0192] In addition, the y-axis (A2) length of the wire-shaped substrate (1201) of the connecting portion (120) may be formed to be 10 times or more longer than the x-axis (A1) length. When the y-axis (A2) length of the wire-shaped substrate (1201) is formed to be long, the wire-shaped substrates (1201) may be induced to easily assemble with each other by making the elastic energy accumulated in the y-axis (A2) direction 0 while allowing them to be well clumped together in the x-axis (A1) direction. This may also allow the pressure (strain) to be concentrated on the connecting portion (120).

[0193] A thinly formed wire-shaped substrate (1201) may have flexibility when bundled in the x-axis (A1) direction, but may cause problems such as tearing or breaking.

[0194] Accordingly, according to another embodiment of the present invention, the area of ​​the contact portion (110) connected to the wire-shaped substrate (1201) may be provided in an 'A' shape (110a).

[0195] Here, the 'A' shape (110a) may be a cone shape with a pointed center, and a wire-shaped connecting part (120) may be connected to the inside of the 'A' shape (110a).

[0196] The contact portion (110) having a lower end in an 'A' shape (110a) can reduce stress so as to prevent tearing due to pulling of the wire-shaped substrate (1201) of the connection portion (120) when the wire-shaped substrate (1201) of the connection portion (120) is bunched in the x-axis direction. The wire-shaped connection portion (120) formed as described above has the effect of minimizing the area of ​​the scalp to be cut when connecting to an external measurement unit after inserting a large-area interpolation element (100).

[0197] FIG. 12 is a schematic drawing showing an example of a system including a guide part (410) according to another embodiment of the present invention, and FIG. 13 is a schematic drawing showing a guide part (410) including a fixing member (470) according to another embodiment of the present invention.

[0198] According to another embodiment of the present invention with reference to FIG. 12, a system (10) including a brain cortex electrode and an inductive coupling technology-based wireless device is a system for inserting a brain cortex electrode into a surface of the cerebral cortex, including a pocket portion (400) provided in a pocket shape and having a predetermined space formed inside; and a guide portion (410) which is a guide structure that can be inserted into the inside of the pocket portion (400) and has at least a portion in the shape of a hard rod so that the brain cortex electrode can be pushed in; and may include an interpolation element (100) that contacts the surface of the cerebral cortex to measure a signal generated in the brain or transmit an external stimulus to the brain.

[0199] Here, the cerebral cortex electrode may refer to an interpolation element (100). For example, it may be one that directly contacts the cerebral cortex to receive brain signals or transmit information received from the outside to the brain.

[0200] In addition, the interpolation element (100) may be a substrate (electrode) made of a flexible material as the interpolation element (100) described above, but is not limited thereto.

[0201] In addition, the interpolation device (100) may be inserted by cutting open the skull to make contact with the cerebral cortex. At this time, in order to minimize the area of ​​the skull to be cut open, the interpolation device (100) may be formed in the shape of the interpolation device (100) described above, and the interpolation device (100) may be inserted by cutting open the skull to a width that allows the interpolation device (100) to be inserted, and using the pocket portion (400) and the guide portion (410). A detailed description will be provided later.

[0202] The pocket part (400) may be a predetermined space into which the guide part (410) is inserted. For example, the pocket part (400) may be formed at the longitudinal end of the interpolation element (100), and may be formed anywhere on one side, the other side, or the middle side in the width direction, but preferably may be formed on the middle side. The pocket part (400) may be formed with an open front side so that the lens of the camera (420) formed in the guide part (410) can look forward when inserted. At this time, the pocket part (400) does not have a front side that is entirely open, but rather has a form in which at least a portion, preferably only the central portion, is open, thereby preventing the guide part (410) inserted into the pocket part (400) from passing through the pocket part (400) and at the same time securing a front view. That is, the pocket part (400) may include a shooting hole (440) that is open on at least a portion. In addition, the material of the interpolation element (100) may be formed of a flexible material, and only the portion where the pocket portion (400) is formed may be formed of a material with high rigidity. When the interpolation element (100) is pushed in, damage to the cerebral cortex can be minimized, while the interpolation element (100), which has lower rigidity than the guide portion (410), can be prevented from being folded or torn.

[0203] That is, according to another embodiment of the present invention, the interpolation element (100) may include a reinforcing plate (430) to prevent the end of the interpolation element (100) from being torn.

[0204] Here, the reinforcing plate (430) may be formed by adding a high-rigidity material to the portion where the pocket portion (400) of the interpolation element (100) is formed. This may prevent the end of the interpolation element (100) that is pushed in through the guide portion (410) from being folded or torn, while allowing the entire interpolation element (100) to be seated in the cerebral cortex.

[0205] The guide portion (410) is formed so as to be inserted into the pocket portion (400), and may be inserted into the skull along the cerebral cortex by pushing after insertion. At this time, the guide portion (410) may push the pocket portion (400) while being inserted into the pocket portion (400), thereby pushing the entire interposer portion (100). In addition, the guide portion (410) may be formed of a material that is stiffer than the interposer portion (100) to guide the interposer portion (100).

[0206] Additionally, the guide portion (410) may include a camera (420) at the end that comes into contact with the pocket portion (400). Here, the camera (420) may be an endoscope camera (420). It may be a means for confirming the inside of the opened brain.

[0207] Additionally, a wire connected to the camera (420) may be formed inside the guide portion (410).

[0208] The camera (420) formed in the guide section (410) may be configured to photograph the front side of the pocket section (400) that is pushed in. At this time, lighting for photographing may be provided, or conversely, it may be an infrared camera (420) that does not require light.

[0209] According to another embodiment of the present invention, the pocket part (400) may be formed with a shooting hole (440) that is open at least in part to enable shooting by the camera (420) while being pushed in by the guide part (410).

[0210] Here, the shooting hole (440) may have a size that allows the camera (420) to take pictures, and may be formed in the center of the front side of the pocket part (400). In addition, the portion of the guide part (410) other than the camera (420) part may be structured to be blocked so that the guide part (410) cannot pass through.

[0211] Accordingly, the guide unit (410) can push the element (100) into the cerebral cortex while filming.

[0212] According to another embodiment of the present invention with reference to FIG. 13, the interpolation element (100) may include a catch groove (450) at both ends of the lower side, and the guide portion (410) may include at least one catch portion (460) having a protruding shape so as to be caught by the catch groove (450). Here, the guide portion (410) may include a first guide structure (411) and a second guide structure (412).

[0213] Here, the catch groove (450) may be formed at the lower end of the insertion element (100). Specifically, the catch groove (450) may be in the form of a concave groove or through hole formed in the downward direction on both sides of the lower end of the insertion element (100).

[0214] In addition, the catch portion (460) may be formed smaller than the catch groove (450). For example, if the catch portion (460) is formed larger than the catch groove (450), the catch portion (460) may not be caught in the catch groove (450), and this may be to prevent this.

[0215] In addition, the guide part (410) may be formed by forming a single catch (460), but is not limited thereto, and may be formed in multiple ways. This is to prevent the single catch (460) from falling out when the insertion element (100) is pushed in by being caught in the catch groove (450), and through the configuration of the catch grooves (450) and catch portions (460) formed in multiple ways on both sides of the insertion element (100), it is possible to prevent the insertion element (100) from falling out due to movement by being inserted from both sides.

[0216] According to another embodiment of the present invention with reference to FIG. 13, the guide part (410) may include a fixing member (470) on the middle side for fixing a plurality of the guide parts (410) so as to be spaced apart at a certain distance in the width direction.

[0217] Here, the fixed member (470) can prevent the first and second guide structures (411, 412) from widening or narrowing in the width direction and keep them spaced apart at a certain interval.

[0218] At this time, the first and second guide structures (411, 412) that are connected may be formed to have the same length from the connected portion to the bottom, and the fixing member (470) may be formed to have the same width as the width of the insertion element (100). This guide portion (410) may be configured to allow both sides to be pushed equally when the insertion element (100) is pushed in after being caught in the catch groove (450). In addition, it is possible to prevent the catch portion (460) from being separated from the catch groove (450) due to force being concentrated on one side, and to allow the insertion element (100) to be inserted well without wrinkling during the insertion process.

[0219] These hooking portions (460) are formed to protrude in the width direction from each of the first and second guide structures (411, 412), and may be formed in the shape of a 'ㄱ' shaped hook. At this time, the fixing portion (470) is formed to be rotatable when connected to each guide portion (410), so that the hooking portion (460) can be implemented to be hooked to and released from the hooking groove (450) by rotation.

[0220] According to another embodiment of the present invention, the catch groove (450) may be formed to have a size smaller than or equal to the size of the catch portion (460).

[0221] The catch (460) formed in the guide (410) catches the catch groove (450) and performs the function of pushing the insertion element (100).

[0222] At this time, in order to prevent the catch (460) from being easily detached from the catch groove (450), the catch (460) may be formed smaller than the catch groove (450) or may have a specific shape.

[0223] Specifically, the catch groove (450) is provided in a circular or square shape, and the catch portion (460) may have a hook shape of the letter 'ㄱ' or a shape of the letter 'ㄷ', but may be configured such that the opening of the 'ㄷ' shape faces downward, or a protruding member facing forward may be additionally configured at the lower end of the hook of the letter 'ㄱ' to provide a stronger fixing force when pushed forward.

[0224] According to another embodiment of the present invention, at least one of the first and second guide structures (411, 412) may form a camera (420) at each lower end.

[0225] The camera (420) can capture images of the cerebral cortex inside the skull, and the first and second guide structures (411, 412) made of hard materials on both sides can guide the operator to position the interpolation element (100) at an accurate location without causing damage to the brain as it is pushed in.

[0226] FIG. 14 is a schematic diagram illustrating another example of a system according to another embodiment of the present invention, and FIG. 15 is a schematic diagram illustrating another example of a system according to another embodiment of the present invention. In FIG. 15, (a) is a block diagram schematically illustrating a system according to another embodiment of the present invention, (b) is a cross-sectional diagram of a system according to one embodiment of the present invention, and (c) is a cross-sectional diagram of a system according to another embodiment of the present invention.

[0227] According to another embodiment of the present invention with reference to FIG. 14 or FIG. 15, the contact portion (110) of the interpolation element (100) of the system can be integrated with the brain wave collection device (200a) that collects brain wave information of the integrated circuit (200), i.e., the converter (ADC; 291), the chip controller (240), and the recorder (220).

[0228] For example, the brain wave collection device (200a) can store the signal when the interpolation element (100) is installed in the cerebral cortex and receives the signal from the brain, and can convert analog information into digital information.

[0229] Specifically, an EEG collection device (200a) may be provided at a contact portion (110) of an interpolation element (100). The contact portion (110) may include an electrode array (111) disposed on a substrate (112) at a portion (distal portion) far from a connection portion (120), and an EEG collection device (200a), i.e., an amplifier (amp; 290), a converter (ADC; 291), a chip controller (249), and a recorder (220), at a portion (proximal portion) close to the connection portion (120).

[0230] This brainwave collection device (200a) may be damaged by moisture if directly exposed to the outside.

[0231] To prevent this, the contact portion (110) of the interpolation element (100) may be subjected to waterproof packaging. For example, the brainwave collection device (200a) formed on one side of the interpolation element (100) may be formed to be surrounded by a waterproof material (plastic, rubber, silicone, etc.). In addition, the entire interpolation element (100) may be coated.

[0232] According to another embodiment of the present invention, there is provided an interpolation device (100) including a contact portion (110) that includes an electrode (111) that contacts the surface of a cerebral cortex to measure a signal generated in the brain or transmit an external stimulus to the brain, an electroencephalographic collection device (200a) that is connected to the electrode (111) so as to enable information exchange, that is, an amplifier (amp; 290), a converter (291), a chip controller (240), and a recorder (220); and an integrated circuit (200) that exchanges information transmitted from the interpolation device (100) with the outside and receives power; and the interpolation device (100) may include a connection portion (120) that connects the contact portion (110) and the integrated circuit (200).

[0233] As described above, the contact portion (110) of the interpolation element (100) may include an amplifier (amp; 290), a converter (291), a chip controller (chip controller; 240), and a recorder (220). Meanwhile, the chip controller (240) may not only be placed at the contact portion (110) of the interpolation element (100), but may also be placed outside the skull while being excluded from the contact portion (110). In addition, the contact portion (110) may include an electrode (111) to receive an analog signal of the brain while in contact with the cerebral cortex. At this time, the contact portion (110) may include at least one electrode (111).

[0234] Analog information received through the electrode (111) of the contact portion (110) may be converted into digital information using a brainwave collection device (200a) and stored. The digital information stored as described above may be transmitted to the integrated circuit (200) through the wires of the connection portion (120), and the transmitted information may be transmitted to the outside of the body through wireless communication. In addition, conversely, information received from the outside of the body may be converted into analog information and transmitted to a stimulator, and the stimulator may transmit a signal to the electrode (111) of the contact portion (110) to stimulate the brain.

[0235] These contact portions (110) and the integrated circuit (200) may be connected by a connection portion (120). The connection portion (120) includes at least one wire, and may supply power or transmit or receive information from the integrated circuit (200) to the contact portion (110) through the wire.

[0236] According to another embodiment of the present invention, the connection portion (120) of the interpolation element (100) may be connected to the integrated circuit (200) by only two wires. These two wires may be a power line (295) and a data line (296), and the power line (295) may be separated into a VDD wire and a ground wire.

[0237] The power line (295) may be a wiring for applying power.

[0238] Additionally, the data line (296) may be a wire for transmitting and receiving information. Here, the data line (296) may include a signal ground wire and may also be composed of a plurality of data lines.

[0239] As described above, the present invention integrates the contact portion (110) of the interpolation element (100) with the brainwave collection device (200a) that collects brainwave information, so that the connection portion (120) connected to the integrated circuit (200) has only two wires, that is, a power line (295) and a data line (296), thereby minimizing the thickness of the connection portion (120).

[0240] At this time, the two wires (295, 296) may further be provided with a housing that surrounds the outside.

[0241] According to another embodiment of the present invention, the integrated circuit (200) may include a wireless device (200b) based on inductive coupling technology.

[0242] The wireless device (200b) may include an on-chip coil (292), a current converter (293), a power management circuit (294), and a wireless chip, i.e., a wireless chip (250). Here, the current converter (293) may convert an alternating current received from the outside through the on-chip coil (292) into a direct current and then transmit the converted current to the power management circuit (294). The power management circuit (294) may be connected to a chip controller (240) of a contact portion (110) of an interpolation element (100) through a power line (295), and the wireless chip (250) may be connected to a recorder (220) of a contact portion (110) of an interpolation element (100) through a data line (296). Of course, the chip controller (240) is connected to the recorder (220).

[0243] Accordingly, the interpolation element (100) can store brain signals on its own and transmit the stored information to an integrated circuit (200) attached to the skull. The integrated circuit (200) may transmit the stored information using a wireless communication device (250), i.e., a wireless chip, or may wirelessly receive power from an external source. Conversely, when the wireless chip is connected to a recorder (220), an encoder may be provided in the middle.

[0244] According to another embodiment of the present invention, the contact portion (110) includes at least one electrode (111), and the chip controller (240) can form a number of channels equal to the number of electrodes.

[0245] Here, the electrode (111) may be configured to contact the cerebral cortex to measure brain waves or transmit signals to the brain. At this time, a plurality of electrodes may be used, and may be configured to read various signals in order to read all signals generated in the brain.

[0246] Additionally, it may form as many channels as the number of brain waves generated in the brain. In this case, the electrodes reading the brain waves may form as many channels as the number of brain waves.

[0247] Since these channels form a bundle of multiple wires, the shorter the channels, the more likely they are to minimize information errors and reduce waste of materials. For example, if information acquired from the contact (110) is transmitted over 64 channels, and the chip controller (240) and recorder (220) are formed outside the interpolation element (100), 64 channels of wires must be connected to the interpolation element (100) and the external chip controller (240) and recorder (220), which may result in reduced durability and waste of materials. (See (b) of FIG. 15)

[0248] According to another embodiment of the present invention, the interpolation element (100) and the integrated circuit (200) may be connected by two lines (295, 296). (See (c) of FIG. 15)

[0249] When the line is formed with two lines, that is, two channels, the line can have a voltage (Vdd) line, a ground line, and a data line, and compared to when forming a large number of lines, the line has fewer lines, thereby minimizing the volume and minimizing the area to be opened when connecting the integrated circuit (200) on the upper side of the skull and the interpolation element (100) in contact with the cerebral cortex.

[0250] According to another embodiment of the present invention, the interpolation element (100) can convert analog information collected from the contact portion (110) into digital information using the chip controller (240) and transmit the digital information to the integrated circuit (200) using the connection portion (120).

[0251] Here, the analog information may be shortwave information received from the brain, which may be converted into a digital signal by the chip controller (240), and the converted digital signal may be stored by the recorder (220). The stored digital information may be transmitted to the integrated circuit (200), and the integrated circuit (200) and an external transceiver may be capable of transmitting a digital signal.

[0252] According to another embodiment of the present invention, the system can waterproof-coat the chip controller (240) and the recorder (220) together when waterproof-coating the contact portion (110).

[0253] Here, the coating may be applied to the interpolation element (100) that comes into contact with the cerebral cortex, which may become wetted by liquid on the surface of the brain. At this time, the coating may be applied to prevent electrical connections from being discharged or leaked due to moisture. The coating may be made of rubber, silicone, or the like, but is preferably a silicone coating.

[0254] At this time, the interpolation element (100) may be positioned together with the chip controller (240) and the recorder (220), and both may be coated.

[0255] According to another embodiment of the present invention, the interpolation element (100) including a plurality of channels is formed inside the skull, and the interpolation element (100) can be connected to the integrated circuit (200) formed outside the skull through the connection portion (120).

[0256] An interpolation element (100) including a chip controller (240) and a recorder (220) may be formed to contact the cerebral cortex inside the skull. This interpolation element (100) may receive signals generated from the brain, convert them into digital signals, and store them. In order to transmit information converted into digital signals to the outside, the digital information may be transmitted to an integrated circuit (200). This digital information requires only minimal wiring, and thus, the connection portion (120) connecting the interpolation element (100) and the integrated circuit (200) may have a very thin shape. Accordingly, the open portion of the skull can be formed very narrowly.

[0257] Additionally, the contact portion (110) that receives an analog signal acquires information using a plurality of electrodes, and at this time, a plurality of channels are used. Each of these channels must have separate wiring formed, and thus, a very large number of wirings are formed.

[0258] These wires must form the same wires until they are converted into digital signals. That is, the analog signal obtained from the contact portion (110) may have multiple wires until it passes through the chip controller (240). Multiple wires take up a large volume, and the volume of the skull that is opened when the interpolation element (100) is inserted or used may increase, and damage to the body may occur. Therefore, in order to minimize the size of the connection portion (120), the connection portion (120) has only two wires. To this end, the electrode (111) is not placed only on the contact portion (110) of the interpolation element (100), but the chip controller (240) and the recorder (220) are placed together in the contact portion (110) and integrated rather than being placed on the integrated circuit (200), and accordingly, the volume of the connection portion (120) can be minimized.

[0259] The present invention may have the following first embodiment.

[0260] The present invention comprises an interpolation device including a contact portion for measuring a signal generated in the brain or transmitting a stimulus to the brain; a transceiver portion configured to transmit a signal received from the contact portion to the outside or to transmit a signal indicating the stimulus to the contact portion; and a connecting portion connecting between the contact portion and the transceiver portion, wherein the contact portion is formed to have a length in the longitudinal direction and includes at least one electrode, and the contact portion is characterized in that the greatest number of electrodes is formed in a portion farthest from the connecting portion.

[0261] Specifically, the contact portion may be formed in multiple numbers on both sides of the transceiver portion.

[0262] Specifically, the contact portion includes a right end portion where at least one electrode is formed; a left end portion formed at an end of the contact portion; and a middle portion connecting the left end and the right end; and the density of the electrodes may increase in the order of the right end portion, the middle portion, and the left end.

[0263] Specifically, the contact portion may be formed of a material having elasticity, and the left end portion may form a stepped portion formed such that at least a portion of the left end portion has a different thickness.

[0264] Specifically, the step portion may be a rectangular structure configured to form a preset thickness by a preset distance from the end of the left end toward the right end.

[0265] Specifically, the step portion may be a gradient structure formed so that the thickness becomes thinner by a preset distance from the end of the left end toward the right end.

[0266] Specifically, the connecting portion may be formed such that at least one or more wire-shaped substrates have a bundle shape.

[0267] Specifically, the connecting portion may include a shrink tube that secures at least one wire-shaped substrate.

[0268] Specifically, the connecting portion may have at least a portion of at least one wire-shaped substrate having a meandering structure.

[0269] The present invention may have a second embodiment as follows.

[0270] The present invention relates to a brain cortex electrode system including an interpolation element that measures a signal generated in the brain by contacting the surface of the cerebral cortex or transmits an external stimulus to the brain, the system including a pocket portion provided in a pocket shape on one side of the interpolation element and forming a predetermined space on the inside, and the pocket portion is characterized in that a rod-shaped guide portion is formed to be inserted on the inside so as to insert the interpolation element into the surface of the cerebral cortex.

[0271] Specifically, the interpolation element may include a reinforcing plate formed to extend to one side of the pocket portion to prevent tearing from the insertion of the guide portion.

[0272] Specifically, the guide part may be an endoscope, and the pocket part may include a photographing hole that is at least partially open so that the guide part can be inserted and photographed.

[0273] Specifically, the interpolation element may include a plurality of pocket portions and a plurality of guide portions each inserted into the plurality of pocket portions.

[0274] The present invention relates to a brain cortex electrode system including an interpolation element that measures a signal generated in the brain by contacting the surface of the cerebral cortex or transmits an external stimulus to the brain, wherein the interpolation element is characterized in that it has a hook groove on each side of one end, and a hook portion having a protruding shape that can be hooked to each of the hook grooves, and includes first and second guide structures in the shape of rods that allow the interpolation element to be inserted into the surface of the cerebral cortex.

[0275] Specifically, the first and second guide structures may include a fixing member fixed on the middle side so that the first and second guide structures are spaced apart by a preset distance.

[0276] Specifically, the above-mentioned catch portion may be formed to protrude from the first or second guide structure in an ‘ㄱ’ shape so as to be inserted into the catch groove.

[0277] Specifically, at least one of the first or second guide structures may be an endoscope.

[0278] The present invention may have a third embodiment as follows.

[0279] The present invention comprises an interpolation element including a contact portion that measures a signal generated in the brain or transmits a stimulus to the brain, a transceiver portion configured to transmit a signal received from the contact portion to the outside or to transmit a signal instructing the stimulus to the contact portion, and a connection portion that connects between the contact portion and the transceiver portion; and an integrated circuit that exchanges information transmitted from the interpolation element with the outside and receives power from the outside, wherein the interpolation element includes a brainwave collection device that collects brainwave information.

[0280] Specifically, the contact portion may form at least one electrode, and the brainwave collection device may include a converter (ADC) that converts analog information collected from the contact portion into digital information; a chip controller that controls the converter; and a recorder that records information converted by the converter.

[0281] Specifically, the connection may include only two lines: a power line and a data line.

[0282] Specifically, the connection unit may connect the power line to the chip controller and the integrated circuit, and the data line may connect the recorder and the integrated circuit.

[0283] Specifically, the system can waterproof-coat the converter, the chip controller and the recorder together when waterproof-coating the contact portion.

[0284] Specifically, the interpolation element is formed inside the skull, and the interpolation element can be connected to the integrated circuit formed to be inserted outside the skull or into the skull through the connection portion.

[0285] Specifically, the integrated circuit includes a wireless power device and a wireless communication device, wherein the wireless power device is connected to the chip controller via the power line, and the wireless communication device is connected to the recorder via the data line.

[0286] Specifically, the wireless power device may include an on-chip coil in the form of a coil that wirelessly receives power from an external source; a current converter that converts an alternating current transmitted from the on-chip coil into a direct current; and a power management circuit that controls power to be received from the current converter and transmitted to the chip controller, and the wireless communication device may include a wireless chip that wirelessly transmits and receives data.

[0287] Although the present invention has been described in detail through specific embodiments, this is intended to specifically explain the present invention, and the present invention is not limited thereto, and it will be apparent that modifications and improvements can be made by those skilled in the art within the technical spirit of the present invention.

[0288] All simple modifications or changes of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be made clear by the appended claims.

Claims

1. An interpolation element including a contact portion for measuring a signal generated in the brain or transmitting a stimulus to the brain, a transceiver portion configured to transmit a signal received from the contact portion to the outside or a signal indicating the stimulus to the contact portion, and a connecting portion connecting between the contact portion and the transceiver portion; and It includes an integrated circuit connected to the above transceiver for transmitting and receiving signals, The above integrated circuit, A system comprising a brain cortex electrode and an inductive coupling technology-based wireless device, characterized by having a laminated structure.

2. In the first paragraph, the integrated circuit, Housing; and A laminated portion having the above laminated structure is included, The above housing, An upper case protecting the upper direction of the above laminated portion; A side case having a height higher than the height of the laminated portion and having a through-hole on at least one part of one side; and A lower case formed on the lower side of the above laminated portion; The above side case is, It is formed larger than the laminated portion and configured so that at least some space is formed between the side case and the laminated portion. A system including a brain cortex electrode and a wireless device based on inductive coupling technology.

3. In paragraph 2, The above transmitter and receiver, At least a portion of which is formed to penetrate the above penetration portion, A system including a brain cortex electrode and a wireless device based on inductive coupling technology.

4. In paragraph 2, The upper case above, It is formed from synthetic resin material, The above side case and lower case, Formed of metal material, A system including a brain cortex electrode and a wireless device based on inductive coupling technology.

5. In paragraph 1, The above laminated portion, Comprising a receiver coil, a battery, an IC, a PCB and at least a portion of the transceiver, A system including a brain cortex electrode and a wireless device based on inductive coupling technology.

6. In paragraph 5, The above transceiver section of the above laminated section is, It is formed at the lowest level Transmitter and receiver, PCB, IC, battery, and receiver coil are stacked in that order. A system including a brain cortex electrode and a wireless device based on inductive coupling technology.

7. In paragraph 2, The above battery, It is formed in a circular shape, The above housing, Equipped in a square shape, A system including a brain cortex electrode and a wireless device based on inductive coupling technology.

8. In paragraph 6, Each component of the above laminated portion is: electrically connected, A system including a brain cortex electrode and a wireless device based on inductive coupling technology.

Citation Information

Patent Citations

  • Implantable wireless neural device

    KR1020140092238A

  • Apparatus for measuring power grid frequency and method thereof

    KR1020210120965A

  • Cortical Implant System for Brain Stimulation and Recording

    US20150157862A1

  • Implantable medical device structures including recharge and / or telemetry coil

    US20190290911A1

  • Systems, Devices, Components and Methods for the Delivery of Electrical Stimulation to Cranial Nerves to Treat Mood or Mood Affective Disorders

    US20230158302A1