Support and chip assembly

Abstract

The present application relates to the field of chip assemblies, and specifically provides a support and a chip assembly. The present invention aims to solve the problem in the existing technology that completely symmetrical legs cannot meet layout requirements of a chip. Therefore, the support provided in the present application is symmetrically arranged along an x-axis and a y-axis, the x-axis and the y-axis being perpendicular to one another. The support comprises a main body and a plurality of legs. The plurality of legs are arranged on the main body and extend out of the main body along the main body. An included angle between any leg and the x-axis is not equal to an included angle between the leg and the y-axis. On the basis of the described structural arrangement, the support provided in the present application, by means of arrangement such that the included angles between the legs and the x-axis are not equal to the included angles between the legs and the y-axis, enables the design of the legs to not be completely symmetrical and to have significant adjustability, thereby satisfying the requirements of the layout around the chip.

Description

Bracket and chip components Technical Field

[0001] This application claims priority to Chinese patent application CN202323368898.1, filed on December 8, 2023, with the invention name “Standard and Chip Assembly”. The entire contents of the above Chinese patent application are incorporated into this application by reference.

[0002] The present application relates to the field of chip components, and specifically provides a bracket and a chip component. Background Art

[0003] With the development of science and technology, electronic products are becoming increasingly intelligent and complex, the size of electronic components is becoming smaller, and the density of components per unit area is getting higher and higher. For vehicle controllers, since the vehicle requires the support of multiple chips during operation, these chips will generate a lot of heat during operation, and they must be cooled during use to ensure the normal operation of the chips. The device that is provided in conjunction with the chip also includes a circuit board, a heat dissipation structure and a bracket. Among them, the bracket is used to connect to the heat dissipation structure in the chip assembly, and abut against the circuit board provided between the bracket and the heat dissipation structure, so that the chip provided between the circuit board and the heat dissipation structure and the heat dissipation structure can fit tightly, thereby reducing the contact thermal resistance between the chip and the heat dissipation structure and increasing the heat dissipation effect of the chip.

[0004] In the prior art, in order to ensure the aesthetics of the bracket, the legs in the bracket are usually arranged completely symmetrically. However, due to the complex layout around the chip, completely symmetrical legs cannot meet the layout requirements of the chip.

[0005] Therefore, the art needs a bracket and chip assembly to solve the above technical problems. Summary of the Invention

[0006] The present application aims to solve the above technical problem, namely, the problem in the prior art that completely symmetrical legs cannot meet the layout requirements of the chip.

[0007] In a first aspect, the present application provides a bracket, wherein the bracket is arranged symmetrically along the x-axis and the y-axis, and the x-axis and the y-axis are perpendicular to each other.

[0008] The bracket includes a body and a plurality of legs, wherein the plurality of legs are arranged on the body and extend out of the body along the body.

[0009] The angle between any of the supporting legs and the x-axis is not equal to the angle between the supporting leg and the y-axis.

[0010] In a specific embodiment of the above-mentioned bracket, a hole is opened on the main body, and the circumferential edge of the hole is recessed to form the convex bump.

[0011] In a specific embodiment of the above-mentioned bracket, there are multiple convex hulls, and the multiple convex hulls are distributed at intervals along the circumferential edge of the hole.

[0012] In a specific embodiment of the above bracket, the support leg includes a first connecting leg and a second connecting leg.

[0013] The first connecting leg extends along the bracket body in a direction away from the convex bump.

[0014] The second connecting leg extends along the first connecting leg in a direction away from the bracket body.

[0015] In a specific embodiment of the above bracket, a first connecting structure is provided on the edge of the second connecting leg.

[0016] In a specific embodiment of the above bracket, the first connection structure is a mounting hole.

[0017] In a specific embodiment of the above bracket, the mounting hole extends to the edge of the support leg to form a notch, and the opening of the notch is arranged away from the bracket body.

[0018] In a specific embodiment of the above-mentioned bracket, a first angle is formed between the plane where the first connecting leg is located and the plane where the bracket body is located, and the first angle is greater than 90° and less than 180°.

[0019] In a specific embodiment of the above-mentioned bracket, a second angle is formed between the plane where the first connecting leg is located and the plane where the second connecting leg is located, and the second angle is greater than or equal to the first angle.

[0020] When the above technical solution is adopted, the bracket provided by the present application is arranged symmetrically along both the x-axis and the y-axis, and the x-axis and the y-axis are perpendicular to each other. The bracket includes a main body and a plurality of legs, and the plurality of legs are arranged on the main body and extend out of the main body along the main body. The angle between any leg and the x-axis is not equal to the angle between the leg and the y-axis. Based on the above structural arrangement, the bracket provided by the present application makes the angle between the leg and the x-axis unequal to the angle between the leg and the y-axis, so that the leg design is not completely symmetrical, has greater adjustability, and can thus meet the requirements of the chip peripheral layout.

[0021] Furthermore, the bracket provided in the present application defines a circumferential edge of the hole that is recessed to form a convex bulge, so that after the bracket is connected to the heat dissipation structure in the chip assembly, the convex bulge can abut against the circuit board arranged between the bracket and the heat dissipation structure, so that the chip and the heat dissipation structure arranged between the circuit board and the heat dissipation structure can fit tightly, thereby reducing the contact thermal resistance between the chip and the heat dissipation structure and increasing the heat dissipation effect of the chip.

[0022] Furthermore, the bracket provided in the present application limits the plurality of convex bumps to be spaced apart along the circumferential edge of the hole, which can make the force exerted by the convex bumps on the circuit board more uniform, and thus make the force between the chip and the heat dissipation structure more uniform, thereby improving the heat dissipation effect of the chip.

[0023] Furthermore, the bracket provided in the present application defines a first connecting leg and a second connecting leg, wherein the first connecting leg is mainly used to realize pressure control, and the angle can be adjusted according to the force requirements, which is also convenient for mass production. The force difference caused by the difference in material parameters can be compensated by the angle; the second connecting leg is mainly to ensure that the corners of the fastener and the bracket can be in surface contact and the force is evenly distributed.

[0024] Furthermore, the bracket provided in the present application defines a first connection structure, so that the fastener can be in surface contact with the first connection structure, thereby facilitating increasing the connection strength of the second connection member.

[0025] Furthermore, the bracket provided in the present application defines the first connection structure as a mounting hole to facilitate screwing and installation of the fastener.

[0026] Furthermore, the present application can reduce the strength of the support leg by providing a notch structure, thereby making it easier for the fastener to contact the first connecting structure surface.

[0027] Furthermore, the bracket provided in the present application is conducive to adjusting the magnitude of the force exerted by the convex bump on the circuit board by limiting the first angle, and then can adjust the fitting force between the chip and the heat dissipation structure, thereby helping to reduce the thermal resistance between the chip and the heat dissipation structure and improve the heat dissipation effect of the chip.

[0028] Furthermore, the bracket provided in the present application limits the second angle so that the fastener can contact the first connection structure surface, thereby facilitating increasing the uniformity of the force exerted by the bump on the circuit board.

[0029] In a second aspect, the present application further provides a chip assembly, which includes a circuit board, a heat dissipation structure, a chip, and a bracket as described in the above embodiment.

[0030] The bracket and the chip are arranged on different sides of the circuit board, and the heat dissipation structure is arranged on a side of the chip away from the bracket.

[0031] Based on the above structural setting, the chip assembly provided in this application is connected to the heat dissipation structure through a bracket, so that the convex bump can abut against the circuit board in the chip assembly, so that the chip and the heat dissipation structure can fit tightly, thereby reducing the contact thermal resistance between the chip and the heat dissipation structure, increasing the heat dissipation effect of the chip, and solving the current problem of poor chip heat dissipation effect due to large thermal resistance between the chip and the heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The preferred embodiments of the present application are described below with reference to the accompanying drawings, in which:

[0033] FIG1 is a structural diagram of a bracket provided by the present application according to one or more embodiments;

[0034] FIG2 is a structural diagram of a chip assembly provided by the present application according to one or more embodiments;

[0035] FIG3 is a cross-sectional view of a chip assembly provided by the present application according to one or more embodiments.

[0036] 1. Bracket; 11. Main body; 111. Hole; 112. Bump; 12. Support leg; 121. First connecting leg; 122. Second connecting leg; 123. First connecting structure; 124. Notch; 2. Circuit board; 3. Heat dissipation structure; 4. Chip. DETAILED DESCRIPTION

[0037] The preferred embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application. Those skilled in the art can make adjustments to them as needed to adapt to specific application scenarios. For example, although this specific embodiment is described in conjunction with the situation where the bracket is applied to a chip assembly, the bracket of the present application can obviously also be used in other scenarios. Such changes in the application scenario do not deviate from the basic principles of the present application and fall within the scope of protection of the present application.

[0038] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to having a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0039] It should be noted that, in the description of this preferred embodiment, unless otherwise expressly specified or limited, the terms "connected" and "connected" should be understood in a broad sense. For example, they can refer to direct connection, indirect connection through an intermediate medium, or internal connection between two components. These are not to be construed as limitations on this application. In addition, the terms "first" and "second" are used for descriptive purposes only. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0040] First, refer to Figure 1, which is a schematic structural diagram of the bracket provided by the present application. As shown in Figure 1, the present application provides a bracket 1, which is arranged axially symmetrically along the x-axis and the y-axis, and the x-axis and the y-axis are perpendicular to each other, wherein the bracket 1 includes a main body 11 and a plurality of legs 12, and the plurality of legs 12 are all arranged on the main body and extend out of the main body 11 along the main body 11, and the angle between any leg 12 and the x-axis is not equal to the angle between the leg 12 and the y-axis. Based on the above structural setting, the bracket 1 provided by the present application sets the angle between the leg 12 and the x-axis to be unequal to the angle between the leg 12 and the y-axis, so that the design of the leg 12 is not completely symmetrical, has greater adjustability, and can meet the requirements of the peripheral layout of the chip.

[0041] In this preferred embodiment, the main body 11 is a sheet metal stamping part, and its material is high carbon steel with a carbon content of 0.6. The main body 11 of this material has a high yield strength. The shape of the main body 11 is rectangular, and a hole 111 is opened in the middle part thereof, and the hole 111 is a rounded rectangular hole. The edges of the rounded rectangular hole are recessed to form a convex 112, and the convex surfaces of the four convex hulls 112 are all flat, and the flat surface is a rounded rectangle, and the planes of the four convex hulls 112 are all on the same plane, so that the four convex hulls 112 can abut against the circuit board 2. The convex hulls 112 on both sides of the length direction of the main body 11 (the left and right sides as shown in Figure 1) are symmetrically arranged, and the convex hulls 112 on both sides of the width direction (the upper and lower sides as shown in Figure 1) are symmetrically arranged.

[0042] Of course, the material and shape of the body 11 are not fixed in this application, and those skilled in the art can adjust them according to specific application scenarios. For example, the material of the body 11 can also be high-carbon steel with other carbon contents, such as high-carbon steel with a carbon content of 0.7, 0.8, or other values. And / or, the shape of the body 11 can also be circular, triangular, pentagonal, or other shapes.

[0043] In addition, the shape of the hole 111 is not fixed in this application, and those skilled in the art can adjust it as needed. For example, the shape of the hole 111 can also be circular, triangular, pentagonal, or other shapes. It should be noted that the shape of the hole 111 can be the same as the shape of the body 11, such as the shape of the hole 111 and the shape of the body 11 can both be rectangular. Alternatively, the shape of the hole 111 can also be different from the shape of the bracket 1, such as the shape of the hole 111 can be circular and the shape of the body 11 can be rectangular.

[0044] In addition, the number and shape of the convex hulls 112 are not fixed in this application, and those skilled in the art can adjust them as needed. For example, the number of convex hulls 112 can also be 1, 8, 12, or other numbers. And / or, the plane of the convex hull 112 can be circular, arc-shaped, or other shapes. When the number of convex hulls 112 is 1, the convex hull 112 is arranged circumferentially along the circumferential edge of the hole 111. In this case, the convex hull 112 is an circumferential convex hull 112. When the number of convex hulls 112 is 8, two convex hulls 112 can be arranged on both sides of the hole 111 along its length direction and on both sides of its width direction.

[0045] It should also be noted that in other preferred embodiments, the presence of holes 111 is not required and can be selected by those skilled in the art as needed. When the body 11 does not have holes 111, the number of bumps 112 can be one or more. When there is only one bump 112, it is located in the middle of the body 11, and the planar surface area of ​​the bump 112 is relatively large. When there are multiple bumps 112, the bumps 112 can be evenly spaced along the periphery of the body 11.

[0046] In this preferred embodiment, the support leg 12 includes a first connecting leg 121 and a second connecting leg 122. The first connecting leg 121 is arranged obliquely upward along the main body 11, and the second connecting leg 122 is arranged obliquely upward along the first connecting leg 121 toward the end away from the main body 11. Among them, the first connecting leg 121 is mainly used to control the pressure, and the angle can be adjusted according to the force requirements. It is also convenient for mass production to cause the force difference caused by the difference in material parameters, which can be compensated by the angle; the second connecting leg 122 is mainly used to ensure that the corners of the fastener and the bracket 1 can be in surface contact and the force is evenly distributed.

[0047] In this preferred embodiment, legs 12 are provided at each of the four corners of the body 11. Each of the four legs 12 extends away from the body 11, and the body 11 is connected to the legs 12 with a circular chamfer. A first connecting structure 123 is provided on the edge of the second connecting leg 122 of the legs 12. The provision of the first connecting structure 123 enables the fastener to come into surface contact with the first connecting structure 123, thereby increasing the connection strength of the second connecting leg 122.

[0048] Preferably, the first connection structure 123 is a mounting hole to facilitate screwing and installation of a fastener, and the mounting hole extends to the edge of the support leg 12 to form a U-shaped notch 124, with the opening of the U-shaped notch 124 being located away from the body 11. The aperture of one set of diagonally arranged mounting holes is smaller than the aperture of the other set of diagonally arranged mounting holes. The set of mounting holes with the smaller aperture can be used for positioning. That is, after the mounting holes with the smaller aperture are preferentially installed with screws to the heat dissipation structure, the connection between the bracket 1 and the heat dissipation structure is stable, which facilitates the connection of the mounting holes with other apertures to the heat dissipation structure with screws.

[0049] It should be noted that, in addition to arc chamfers, the support legs 12 and the body 11 can also be connected by straight chamfers, or the support legs 12 can be directly connected to the body 11. In addition, the shape of the notch 124 is not fixed in this application, and those skilled in the art can adjust it according to specific application scenarios.

[0050] In this preferred embodiment, a first angle is defined between the first connecting leg 121 and the body of the leg 12, wherein the first angle is greater than 90° and less than 180°. A second angle is defined between the first connecting leg 121 and the second connecting leg 122, which is greater than the angle between the first connecting leg 121 and the body 11. This ensures that when the bracket 1 is screwed to the heat dissipation structure, the screw nut can make surface contact with the second connecting leg 122, resulting in a more uniform force applied to the circuit board 2 when the bracket 1 is connected to the heat dissipation structure.

[0051] Of course, the second angle is not fixed in this application, and those skilled in the art can adjust it according to specific application scenarios. For example, the second angle can be equal to the first angle.

[0052] In this preferred embodiment, the first connecting leg 121 and the second connecting leg 122 are integrally formed to form the support leg 12, and the support leg 12 is integrally formed with the body 11. The support leg 12 and the body 11 are made of the same material, which is high carbon steel with a carbon content of 0.6.

[0053] Of course, the connection method between the first connecting leg 121 and the second connecting leg 122 and the first connecting leg 121 and the main body 11 is not fixed in this application, and those skilled in the art can adjust it according to the specific application scenario. For example, the first connecting leg 121 and the second connecting leg 122 can be connected by welding. And / or, the first connecting leg 121 and the main body 11 can be connected by welding. In addition, the material of the support leg 12 and the main body 11 can be different. For example, the material of the support leg 12 is iron or other metal. And / or, the main body 11 can be high carbon steel with a carbon content of 0.6 or other values.

[0054] In addition, in conjunction with Figures 2 and 3, the present application also provides a chip assembly, which includes a circuit board 2, a heat dissipation structure 3, a chip 4, and a bracket 1 as described in the above embodiment, wherein the bracket 1 and the chip 4 are arranged on different sides of the circuit board 2, and the heat dissipation structure 3 is arranged on the side of the chip 4 away from the bracket 1. Based on the above structural arrangement, the chip assembly provided by the present application is connected to the heat dissipation structure 3 through the bracket 1, so that the convex bump 112 can abut against the circuit board 2 in the chip assembly, so that the chip 4 and the heat dissipation structure 3 can fit tightly, thereby reducing the contact thermal resistance between the chip 4 and the heat dissipation structure 3, increasing the heat dissipation effect of the chip 4, and solving the current problem of poor heat dissipation effect of the chip 4 due to the large thermal resistance between the chip 4 and the heat dissipation structure 3.

[0055] Next, in combination with Figures 1 to 3, a 4 mm thick Mylar film (not marked in the figure) is arranged between the convex bump 112 and the circuit board 2. On the one hand, the Mylar film can play an insulating role to prevent a short circuit between the convex bump 112 and the circuit board 2. On the other hand, it can also make the force applied by the bracket 1 on the circuit board 2 more uniform.

[0056] Of course, the specific form of the insulating film is not fixed in this application, and those skilled in the art can adjust it according to the specific application scenario. For example, the insulating film can also be a rubber gasket. In addition, the thickness of the insulating film is not fixed in this application, and those skilled in the art can adjust it according to the specific application scenario. For example, the thickness of the insulating film can also be 3mm, 5mm, or other thickness values.

[0057] It should be noted that the above-mentioned implementation mode is only used to illustrate the principles of the present application and is not intended to limit the scope of protection of the present application. Without departing from the principles of the present application, those skilled in the art can adjust the above-mentioned structure so that the present application can be applied to more specific application scenarios.

[0058] Thus far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present application.

Claims

1. A bracket, characterized in that: The bracket is arranged symmetrically along the x-axis and the y-axis, and the x-axis and the y-axis are perpendicular to each other. The bracket includes a body and a plurality of legs, wherein the plurality of legs are arranged on the body and extend out of the body along the body. The angle between any of the legs and the x-axis is not equal to the angle between the legs and the y-axis.

2. The bracket according to claim 1, characterized in that: The main body is provided with a hole, and the peripheral edge of the hole is recessed to form a convex bump.

3. The bracket according to claim 2, characterized in that: There are multiple convex hulls, and the multiple convex hulls are distributed at intervals along the circumferential edge of the hole.

4. The bracket according to claim 2, characterized in that: The support leg comprises a first connecting leg and a second connecting leg, The first connecting leg extends along the bracket body in a direction away from the convex bump. The second connecting leg extends along the first connecting leg in a direction away from the bracket body.

5. The bracket according to claim 4, characterized in that: A first connecting structure is arranged on the edge of the second connecting pin.

6. The bracket according to claim 5, characterized in that: The first connection structure is a mounting hole.

7. The bracket according to claim 6, characterized in that: The mounting hole extends to the edge of the supporting leg to form a notch, and the opening of the notch is arranged away from the bracket body.

8. The bracket according to claim 4, characterized in that: A first angle is formed between a plane where the first connecting leg is located and a plane where the bracket body is located, and the first angle is greater than 90° and less than 180°.

9. The bracket according to claim 8, characterized in that: A second angle is formed between a plane where the first connecting leg is located and a plane where the second connecting leg is located, and the second angle is greater than or equal to the first angle.

10. A chip assembly, characterized in that: The chip assembly comprises a circuit board, a heat dissipation structure, a chip and a bracket according to any one of claims 1 to 9, The bracket and the chip are arranged on different sides of the circuit board, and the heat dissipation structure is arranged on a side of the chip away from the bracket.

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