Additive manufacturing quality inspection method and related device

Abstract

Disclosed in the embodiments of the present application are an additive manufacturing quality inspection method and a related device. The method comprises: an industrial control computer acquires electric signals corresponding to optical signals in a first stage during a laser additive manufacturing process; on the basis of at least two electric signals corresponding to the at least two optical signals, the industrial control computer respectively creates at least two trajectory amplitude graphs; the industrial control computer separately divides the at least two trajectory amplitude graphs to obtain a plurality of image block sets; and, on the basis of an electric signal amplitude of an image block in each image block set, the industrial control computer determines whether there is a defect in an area corresponding to the image block in each image block set in a target slice layer. The present application helps to detect abnormal areas of part slice layers in additive machining processes.

Description

Additive manufacturing quality inspection method and related device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on December 19, 2023, with application number 202311764353.4 and invention name “Additive manufacturing quality detection method and related device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of additive manufacturing technology, and in particular to an additive manufacturing quality detection method and related devices. Background Art

[0003] Additive manufacturing, also known as 3D printing, primarily involves melting raw metal with focused laser heat and then shaping dust and other materials layer by layer into the desired workpiece. Laser additive manufacturing is a metal additive manufacturing process that offers greater efficiency and flexibility than traditional methods such as part assembly and metal cutting. It can be used for rapid prototyping, manufacturing functionally graded materials, and repairing high-value-added components. Currently, this technology is increasingly being used in the aerospace, defense, automotive, and biomedical industries. During laser additive manufacturing, varying laser processing parameters, the environment, and equipment can lead to poor surface finish in the workpiece. Defect generation and dimensional accuracy, among other factors, have hindered the technology's further adoption and application. Therefore, research into online monitoring technology for the additive manufacturing process is essential for overall process control and quality assurance.

[0004] Existing online detection methods for laser additive manufacturing generally include the following two types of detection: offline and online:

[0005] Offline inspection methods, such as microscopes and scanning electron microscopes, primarily focus on surface inspection, making it difficult to detect internal defects. Industrial metallographic cutting and other cutting methods perform destructive measurements, destroying the component's original morphology and resulting in low efficiency. Industrial CT scanning and ultrasonic testing can obtain internal information about workpieces and detect defects, but these methods can only be performed after the part is manufactured. These offline inspections are not feasible for online testing, making it difficult to integrate manufacturing and testing, impacting production efficiency.

[0006] In online detection methods, such as the existing Chinese patent (CN115861187A) for laser additive manufacturing, the schematic diagram of the laser deposition additive manufacturing online monitoring system of this application uses methods such as photography, scanning, and infrared sensing to melt and deposit powdered or filamentary materials in combination with a digital model, and uses three types of data matching: melt pool image data, melt pool temperature data, and 3D point cloud data. Specifically, high-speed cameras, infrared cameras, and laser 3D scanners are used to obtain online detection information. For example, a high-speed camera is used to collect melt pool image data; an infrared camera is used to collect melt pool temperature data; and a laser 3D scanner is used to collect 3D point cloud data of the workpiece shape.

[0007] The offline detection method not only destroys the workpiece structure, but also easily causes the workpiece to deform due to destructive detection, affecting the final measurement results; inspection based on online detection methods is costly. Summary of the Invention

[0008] This application proposes an additive manufacturing quality detection method and related devices, which are conducive to detecting abnormal areas in the part slice layer during the additive manufacturing process.

[0009] This application is implemented using the following technical solutions.

[0010] In a first aspect, an embodiment of the present application provides an additive manufacturing quality detection method, comprising: an industrial control computer obtains an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, the first time period being a time period for processing a target slice layer of a target part during the laser additive processing process, the optical signal in the first time period including an output light signal of a laser in the first time period, and at least two optical signals among a laser reflection signal, a visible light signal and an infrared light signal generated by the target slice layer in the first time period; the industrial control computer constructs at least two trajectory amplitude graphs based on at least two electrical signals corresponding to the at least two optical signals; the contour of each trajectory amplitude graph in the at least two trajectory amplitude graphs is the same as the contour of the target slice layer, and the trajectory amplitude graph includes multiple trajectory amplitude lines, and the multiple trajectory amplitude lines are the same as the contour of the target slice layer during processing. The processing trajectory of the target slice layer corresponds to the processing trajectory of the target slice layer, and the amplitude represented by the trajectory amplitude line is the amplitude of the corresponding electrical signal during the processing of the target slice layer; the industrial control computer divides the at least two trajectory amplitude maps respectively to obtain multiple first image blocks; each first image block in the multiple first image blocks is divided respectively to obtain multiple image block sets; the multiple image block sets correspond to the areas of the target slice layer; each image block set in the multiple image block sets includes at least two second image blocks, the at least two second image blocks respectively belong to at least two trajectory amplitude maps, and the at least two second image blocks correspond to the same area of ​​the target slice layer; the industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the electrical signal amplitude of the second image block in each image block set.

[0011] During the process of machining the target slice layer of the target part, at least two of the electrical signals corresponding to the output light signal, the electrical signals corresponding to the laser reflection signal, the electrical signals corresponding to the visible light signal, and the electrical signals corresponding to the infrared light signal are obtained; at least two trajectory amplitude maps are constructed based on the electrical signals corresponding to the output light signal, the electrical signals corresponding to the laser reflection signal, the electrical signals corresponding to the visible light signal, and the electrical signals corresponding to the infrared light signal. By dividing the constructed trajectory amplitude maps into blocks, the area with defects, that is, the abnormal area, in the target slice layer is determined based on the electrical signal amplitudes of the image blocks obtained by the block division. This method can detect abnormal areas in the part slice layer during additive machining without damaging the part and is low-cost compared to existing technologies. Since the area with defects in the target slice layer can be determined, it is convenient to subsequently reprocess the defective area to eliminate the defective area.

[0012] In conjunction with the first aspect, in one possible implementation, the industrial control computer determines whether there is a defect in an area corresponding to the second image block in each image block set in the target slice layer based on the electrical signal amplitude of the second image block in each image block set, including:

[0013] The industrial control computer determines the detection result corresponding to each second image block based on the electrical signal amplitude of each second image block in each image block set and the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs; and the industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set.

[0014] By judging whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the electrical signal amplitudes of at least two image blocks respectively belonging to at least two trajectory amplitude maps, the accuracy of the judgment result can be improved.

[0015] In combination with the first aspect, in one possible implementation, when the electrical signal amplitude of each second image block exceeds the threshold range of the electrical signal corresponding to the first image block to which the image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to the image block in the target slice layer; when the electrical signal amplitude of each second image block does not exceed the threshold range of the electrical signal corresponding to the second image block to which the image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to the second image block in the target slice layer.

[0016] In conjunction with the first aspect, in one possible implementation, the industrial control computer determines a detection result corresponding to each second image block based on the electrical signal amplitude of each second image block in each image block set, including:

[0017] The industrial control computer determines the ratio of each second image block, where the ratio of each second image block is the ratio of the electrical signal amplitude of the second image block to the electrical signal amplitude of the first image block to which the second image block belongs; when the ratio of each second image block exceeds the ratio range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to each second image block in the target slice layer; when the ratio of each image block does not exceed the ratio range of the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is that there is no defect in the area corresponding to each second image block in the target slice layer.

[0018] In conjunction with the first aspect, in one possible implementation, the industrial control computer determines whether a region corresponding to the second image block in each image block set in the target slice layer has a defect based on a detection result corresponding to the second image block in each image block set, including:

[0019] When the detection results corresponding to all the second image blocks in the target image block set are that there is a defect in the area corresponding to the second image block in the target slice layer, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of multiple image block sets.

[0020] Only when the detection results corresponding to all the second image blocks in the target image block set show that there is a defect in the area corresponding to the image block in the target slice layer, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer, which can improve the accuracy of judging whether there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer.

[0021] In conjunction with the first aspect, in one possible implementation, the industrial control computer determines whether a region corresponding to the second image block in each image block set in the target slice layer has a defect based on a detection result corresponding to the second image block in each image block set, including:

[0022] When the detection result in the target image block set is that there are multiple image blocks corresponding to the defective area in the target slice layer, if the multiple second image blocks include a second image block with a priority higher than the preset priority, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of the multiple image block sets; if the multiple second image blocks do not include a second image block with a priority higher than the preset priority, when the number of the multiple second image blocks is greater than the preset number, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer.

[0023] By adopting the above-mentioned method, the accuracy of judging whether there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer can be improved.

[0024] In combination with the first aspect, in one possible implementation, the priority of the second image block A is higher than the priority of the second image block B, the priority of the second image block B is higher than the priority of the second image block C, and the priority of the second image block C is higher than the priority of the second image block D; wherein, the second image block A belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the laser output signal; the second image block B belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the infrared light signal; the second image block C belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the visible light signal; and the second image block D belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the laser reflection signal.

[0025] In combination with the first aspect, in a possible implementation, the method of this embodiment further includes: the industrial control computer obtains one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group, wherein the target group is a group in which the number of position information is greater than a preset number; the target group is obtained by grouping the position information of all abnormal areas from the first layer to the target slice layer, and the position information in the same group indicates the same position, and the industrial control computer obtains the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, and the position information corresponding to the target group. One or more of the ratio of the area of ​​the normal area to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group is transmitted to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, and the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, so that the laser processing system adjusts the parameters of the laser processing system based on the position information corresponding to the target group.

[0026] In conjunction with the first aspect, in one possible implementation, the method of this embodiment further includes:

[0027] The industrial control computer obtains a ratio of an area of ​​the abnormal region of the target slice layer to an area of ​​the target slice layer. When the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer is greater than a first preset ratio, the industrial control computer transmits position information of the abnormal region of the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer.

[0028] or,

[0029] The industrial control computer obtains the position information of all abnormal areas from the first layer to the target slice layer, groups the position information of all abnormal areas, and the position information in the same group indicates the same position; the industrial control computer transmits the position information corresponding to the target group to the laser processing system, so that the laser processing system adjusts the parameters of the laser processing system based on the target position information; the target group is a group with more position information than a preset number;

[0030] or,

[0031] The industrial control computer obtains the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer. If the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer is greater than the second preset ratio, and the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer is not greater than the first preset ratio, the industrial control computer transmits the position information of all abnormal areas in the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer.

[0032] In combination with the first aspect, in a possible implementation, the electrical signal amplitude of the second image block is an average electrical signal amplitude of the second image block, or is obtained by weighting the electrical signal amplitudes of all points in the second image block.

[0033] In conjunction with the first aspect, in one possible implementation, the industrial control computer constructs at least two trajectory amplitude maps based on the at least two electrical signals corresponding to the at least two optical signals, including:

[0034] The industrial control computer obtains the starting and ending coordinates, laser processing speed and sampling rate of each trajectory line in the target trajectory amplitude map; the target trajectory amplitude map is one of the at least two trajectory amplitude maps; the industrial control computer calculates the number of first additive processing points of each trajectory line based on the starting and ending coordinates, laser printing speed and sampling rate of each trajectory line; the industrial control computer obtains the number of second additive processing points of each trajectory line based on the target electrical signal; the target electrical signal is the electrical signal corresponding to the target trajectory amplitude map; for the target trajectory line in the target trajectory amplitude map, if the absolute value of the difference between the number of the second additive processing points of the target trajectory line and the number of the first additive processing points of the target trajectory line is less than a preset ratio, then the target trajectory line is retained; if it exceeds, then the target trajectory line is deleted.

[0035] By using the above method, abnormal trajectory lines in the trajectory amplitude map are removed, and subsequently, whether there is a defect in the target slice layer area is judged based on the processed trajectory amplitude map, which can improve the accuracy of the judgment result.

[0036] Furthermore, if the ratio of the absolute value of the difference between the number of the second additively processed points on the target trajectory and the number of the first additively processed points on the target trajectory to the number of the first additively processed points on the target trajectory exceeds a preset ratio, the industrial control computer deletes the target trajectory, including:

[0037] If the ratio of the absolute value of the difference between the number of the second additively processed points of the target trajectory line and the number of the first additively processed points of the target trajectory line to the number of the first additively processed points of the target trajectory line exceeds a preset ratio, and the ratio of the absolute value of the difference between the number of the second additively processed points of a next trajectory adjacent to the target trajectory in the processing order and the number of the first additively processed points of the next trajectory to the number of the first additively processed points of the next trajectory does not exceed the preset ratio, the industrial control computer deletes the target trajectory.

[0038] The above method can improve the accuracy of determining abnormal trajectory lines.

[0039] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: the industrial control computer displays at least two trajectory amplitude maps and displays the result of whether there is a defect in the target slice layer; when the industrial control computer determines that there is a defect in the target slice layer, the industrial control computer displays the abnormal area of ​​the target slice layer on at least two trajectory amplitude maps.

[0040] By displaying the trajectory amplitude graph and the defect detection result, the processing personnel can easily know whether the target slice layer has defects. If defects are present, the processing personnel can also know which area of ​​the target slice layer has defects, so as to facilitate subsequent reprocessing.

[0041] In a second aspect, an embodiment of the present application provides an industrial control computer, comprising an acquisition unit, a construction unit, a display unit, a division unit, a determination unit, and a sending unit. The acquisition unit, the construction unit, the display unit, the division unit, the determination unit, and the sending unit are configured to implement any of the methods provided in the first aspect.

[0042] In a third aspect, an embodiment of the present application provides an industrial control computer, comprising: a processor, the processor being connected to a memory, the memory being used to store a computer program, the processor being used to execute the computer program stored in the memory, so that the industrial control computer executes a method as provided in any one of the first aspects.

[0043] In a fourth aspect, an embodiment of the present application provides a laser processing control system, comprising a laser welding system, a sensor module, a signal processing module and an industrial control computer, wherein the industrial control computer is used to execute the method provided in any one of the first aspects.

[0044] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program enables a computer to execute a method as provided in any one of the first aspects.

[0045] In a sixth aspect, an embodiment of the present application provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer is operable to enable the computer to execute the method described in the first aspect or the second aspect.

[0046] It is understandable that the industrial control computers described in the second and third aspects, the laser processing control system described in the fourth aspect, the computer storage medium described in the fifth aspect, or the computer program product described in the sixth aspect are all used to implement the method provided in any one of the first aspects. Therefore, the beneficial effects that can be achieved can be referenced to the beneficial effects of the corresponding methods and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0048] FIG1 is a schematic structural diagram of a laser additive manufacturing online detection system provided in an embodiment of the present application.

[0049] FIG2 is a flow chart of an additive manufacturing quality inspection method provided in an embodiment of the present application.

[0050] FIG3 is a schematic diagram of the relationship between a processing trajectory and an electrical signal provided in an embodiment of the present application.

[0051] FIG4 is a schematic diagram of a target slice layer and a trajectory amplitude diagram provided in an embodiment of the present application.

[0052] FIG5a is a schematic diagram of a correspondence between an image block and an area in a target slice layer provided by an embodiment of the present application.

[0053] FIG5 b is a schematic diagram of another correspondence relationship between an image block and an area in a reference slice layer provided in an embodiment of the present application.

[0054] FIG5c is a schematic diagram of a detection result provided in an embodiment of the present application.

[0055] FIG6 is a schematic structural diagram of an industrial control computer provided in an embodiment of the present application.

[0056] FIG7 is a schematic structural diagram of another industrial control computer provided in an embodiment of the present application. DETAILED DESCRIPTION

[0057] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this invention.

[0058] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms of "a", "said" and "the" used in the embodiments of the present application, the accompanying drawings and the claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should be understood that the term "and / or" used herein is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the related objects before and after are in an "or" relationship. It should be understood that although the terms "first", "second" and similar words may be used in the embodiments of the present application, they do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "an" do not indicate a quantity limitation, but rather indicate the presence of at least one. The "multiple" involved in the embodiments of the present application refers to greater than or equal to two.

[0059] See Figure 1, which is a schematic diagram of the structure of a laser additive manufacturing online detection system provided in an embodiment of the present application. As shown in Figure 1, the system includes a laser 1, a field lens 2, a scanning galvanometer 3, a beam splitter 4, a sensor module 5, a signal processor 6, and an industrial control computer 7. The sensor module 5 is coaxially mounted in the scanning galvanometer system of the laser additive manufacturing equipment. The sensor module 5 is connected to the signal processor 6 via a signal line, and the signal processor 6 is connected to the industrial control computer 7 via a signal line. The signal processor 6 is also connected to the control system 8 of the laser additive manufacturing equipment via a signal line.

[0060] In this embodiment, the laser light generated by the laser 1 is first transmitted to the sensor module of the laser light signal of the sensor module 5 through the beam splitter 4. At the same time, the laser light generated by the laser 1 is also incident into the molding cavity 9 by the scanning galvanometer 3 and the field lens 2. The light radiation generated during the laser additive manufacturing process is transmitted to the sensor module 5 through the field lens 2, the scanning galvanometer 3 and the beam splitter 4. The sensor module 5 can realize photoelectric conversion and can convert light radiation signals of multiple wavelengths into electrical signals, including visible light (400-700nm), laser reflection (1060-1070nm), laser light (1060-1070nm). ) and infrared light (>1200nm); the electrical signal is transmitted to the signal processor 6 via the signal line, and the signal processor 6 performs relevant processing on the electrical signal, including signal amplification and filtering. After the signal processing, it is transmitted to the industrial control computer 7 via the signal line, and the industrial control computer 7 extracts and processes the corresponding characteristic values ​​of the signal, and compares it with the preset upper and lower thresholds and upper and lower ratio thresholds, so as to judge the processing quality of each slice layer in the additive manufacturing process. The industrial control computer 7 transmits the corresponding processing information to the control system 8 of the laser additive manufacturing equipment through the signal line and the signal processor 6, so as to adjust and optimize the process parameters of the additive manufacturing.

[0061] Optionally, the sensor module 5 includes at least one of a laser output signal sensor, a laser reflection signal sensor, a visible light signal sensor, and an infrared light signal sensor.

[0062] The laser wavelength generated by the laser 1 is 1070-1070nm, and the sensor module 5 can realize photoelectric conversion, specifically through a silicon photoelectric sensor; the sensor module 5 can perform photoelectric conversion on light of multiple wavelengths, including visible light (400-700nm), laser reflection (1070-1070nm), and infrared light (>1200nm); the signal processor 6 processes the electrical signal, including signal amplification and filtering, to increase the signal amplitude and reduce the signal noise; the industrial control computer 7 can further filter the signal, and then determine whether there is an abnormal area in the slice layer of the part based on the collected electrical signal. If there is an abnormal area, the position information of the abnormal area is obtained; the position information or other information of the abnormal area is transmitted to the control system 8 of the laser additive manufacturing equipment through the signal line and the signal processor 6, so that the control system controls the laser 1 or laser processing head or other components that control laser welding in the laser welding system to reprocess the abnormal area.

[0063] In laser processing applications, the infrared radiation signal corresponds to infrared radiation signals with wavelengths between 1250nm and 1700nm. The visible light radiation signal corresponds to visible light radiation signals with wavelengths between 400nm and 700nm. The laser processing reflection signal corresponds to the reflection signal of the processing laser during actual laser processing. For example, processing laser wavelengths include 915nm, 1064nm, and 1070nm. The wavelength of the processing laser is related to the actual wavelength of the laser used. In some environments, the suitable range of the infrared radiation signal can be extended beyond the 1250nm to 1700nm range. In some environments, the visible light radiation signal can be extended beyond the 400nm to 700nm range.

[0064] The solution of this application is described in detail below.

[0065] Referring to FIG2 , FIG2 is a flow chart of an additive manufacturing quality inspection method provided in an embodiment of the present application. As shown in FIG2 , the method includes:

[0066] S201. An industrial control computer obtains an electrical signal corresponding to an optical signal in a first period of time during a laser additive manufacturing process.

[0067] Among them, the first time period is the time period for processing the target slice layer of the target part during the laser additive processing process, and the optical signal of the first time period includes the light output signal of the laser in the first time period, and at least two optical signals of the laser reflection signal, visible light signal and infrared light signal generated by the target slice layer in the first time period.

[0068] During the laser additive manufacturing process, the keyhole metal vapor generated radiates visible light, the molten pool radiates infrared light, and the laser reflected light not absorbed by the powder and the laser output signal are collected by the sensor module 5 and photoelectrically converted into electrical signals, including: obtaining the corresponding voltage value V0 through the laser output signal sensor, obtaining the corresponding voltage value V1 through the visible light signal sensor, obtaining the corresponding voltage value V2 through the laser reflection signal sensor, and obtaining the corresponding voltage value V3 through the infrared light signal sensor, and performing gain adjustment on the voltage values ​​V0, V1, V2, and V3 respectively to obtain an adjusted output electrical signal. During the process of machining the target slice layer of the target part, at least two electrical signals can be obtained from the electrical signal corresponding to the output signal, the electrical signal corresponding to the laser reflection signal, the electrical signal corresponding to the visible light signal, and the electrical signal corresponding to the infrared light signal in the above manner.

[0069] S202 : The industrial control computer constructs at least two trajectory amplitude graphs based on the at least two electrical signals corresponding to the at least two optical signals.

[0070] Among them, the outline of each trajectory amplitude map in at least two trajectory amplitude maps is the same as the outline of the target slice layer, the trajectory amplitude map includes multiple trajectory amplitude lines, and the multiple trajectory amplitude lines correspond to the processing trajectories when processing the target slice layer. The amplitude represented by the trajectory amplitude line is the amplitude of the corresponding electrical signal during the processing of the target slice layer.

[0071] During the laser additive manufacturing process, the model of the target part is preprocessed, that is, the three-dimensional model of the target part is sliced ​​and layered in the Z-axis direction according to the pre-set slice layer thickness, so as to obtain the contour data of each cross-section in the XY direction. Part (a) in Figure 3 shows the contour information of a slice layer of the target part model, where line segments ①-⑧ are the laser trajectories during the laser processing of the slice layer, and the arrows are the positions where the laser ends the light emission in each laser trajectory; Part (b) in Figure 3 shows the laser light emission signal and the generated light radiation signal (including laser reflection signal, visible light signal and infrared light signal) during the laser additive manufacturing process. After being collected by the sensor module 5 and converted into electrical signals through photoelectric conversion, the electrical signal change diagram corresponding to each laser trajectory of the slice layer is obtained after the signal processor 6 performs corresponding signal processing.

[0072] As shown in part (b) of Figure 3, the electrical signal amplitude interval L1-L2 corresponds to laser trajectory ①, the electrical signal amplitude interval L3-L4 corresponds to laser trajectory ②, the electrical signal amplitude interval L5-L6 corresponds to laser trajectory ③, the electrical signal amplitude interval L7-L8 corresponds to laser trajectory ④, the electrical signal amplitude interval L9-L10 corresponds to laser trajectory ⑤, the electrical signal amplitude interval L11-L12 corresponds to laser trajectory ⑥, the electrical signal amplitude interval L13-L14 corresponds to laser trajectory ⑦, and the electrical signal amplitude interval L15-L16 corresponds to laser trajectory ⑧.

[0073] For example, the shape of the target slice layer is circular, the processing trajectory is shown in the left figure of Figure 4, and the corresponding trajectory amplitude is shown in the right figure of Figure 4. The trajectory amplitude diagram shown in the right figure of Figure 4 includes multiple trajectory amplitude lines, and the trajectory amplitude lines correspond to the processing trajectory of the target slice layer. Each trajectory amplitude line includes multiple pixel points, and the pixel value of the pixel point is used to represent the amplitude of the target electrical signal at the corresponding moment in the process of processing the target slice layer. Among them, the target electrical signal is the electrical signal corresponding to the light output signal, the electrical signal corresponding to the laser reflection signal, the electrical signal corresponding to the visible light signal, or the electrical signal corresponding to the infrared light signal.

[0074] Optionally, the industrial computer displays a trajectory amplitude map corresponding to the target slice layer. The inspection personnel can know the amplitude of the target electrical signal at the corresponding moment through the pixel value of the pixel point in the trajectory amplitude map.

[0075] In one possible implementation, the industrial control computer constructs at least two trajectory amplitude maps based on the at least two electrical signals corresponding to the at least two optical signals, including:

[0076] The industrial control computer obtains the starting and ending coordinates, laser processing speed and sampling rate of each trajectory line in the target trajectory amplitude map; the target trajectory amplitude map is one of at least two trajectory amplitude maps; the industrial control computer calculates the number of first additive processing points of each trajectory line based on the starting and ending coordinates, laser printing speed and sampling rate of each trajectory line; the industrial control computer obtains the number of second additive processing points of each trajectory line based on the target electrical signal; the target electrical signal is the electrical signal corresponding to the target trajectory amplitude map; for the target trajectory line in the target trajectory amplitude map, if the difference between the number of the first additive processing points of the target trajectory line and the number of the second additive processing points of the target trajectory line does not exceed the difference threshold, the target trajectory line is retained; if it exceeds the difference threshold, the target trajectory line is deleted.

[0077] Specifically, in the process of constructing a corresponding trajectory amplitude diagram based on the electrical signal corresponding to the optical signal, the industrial control computer first obtains the starting and ending coordinates, laser printing speed and sampling frequency of each trajectory line in the trajectory amplitude diagram, wherein the length of each trajectory line can be obtained based on the starting and ending coordinates of each trajectory line; based on the length of each trajectory line, the laser printing speed and sampling frequency, the number of the first additive processing points of each trajectory line is calculated.

[0078] The length of each trajectory line, laser printing speed, sampling frequency, and the first additive processing point satisfy the following formula:

[0079] Where points is the number of the first additive manufacturing points on the trajectory, distance is the length of the trajectory, speed is the laser printing speed, and frequency is the sampling frequency, which is the sampling frequency of the photoelectric sensor, for example, 20kHz. Round is the rounding function.

[0080] The number of the first additively processed points on a trajectory is calculated based on the above formula and can be called the theoretical number. Since the optical signal is acquired by the photoelectric sensor, the industrial control computer determines the number of the second additively processed points on the trajectory based on the electrical signal corresponding to the optical signal. This second number of additively processed points can be called the actual number of additively processed points. For a target trajectory, the number of the first additively processed points is compared with the number of the second additively processed points to determine whether the target trajectory is an abnormal trajectory.

[0081] The specific judgment method is: determine the difference between the number of the second additive processing points of the target trajectory line and the number of the first additive processing points of the target trajectory line, and then determine the ratio of the absolute value of the difference to the number of the first additive processing points of the target trajectory line. If the ratio does not exceed the preset ratio, the industrial control computer retains the target trajectory line; if it exceeds, the industrial control computer deletes the target trajectory line.

[0082] It should be pointed out that an abnormal track line refers to a track line that is printed when the laser does not emit light.

[0083] Furthermore, the industrial control computer determines whether the next trajectory adjacent to the target trajectory in the processing sequence is an abnormal trajectory line according to the above method. If the next trajectory adjacent to the target trajectory in the processing sequence is determined not to be an abnormal trajectory line, the industrial control computer determines that the laser did not emit light when processing the target trajectory line. In this case, the target trajectory line is determined to be an abnormal trajectory line and the industrial control computer deletes the target trajectory line. Using this method, the target trajectory line can be prevented from being accidentally deleted, which helps to improve the accuracy of abnormal trajectory line identification.

[0084] Each trajectory line is processed in the above manner, and the retained trajectory lines can form a trajectory amplitude map.

[0085] The above processing is performed on each of the at least two electrical signals, and the industrial control computer can obtain at least two trajectory amplitude graphs.

[0086] S203 , the industrial control computer divides the at least two trajectory amplitude images respectively to obtain a plurality of first image blocks; the industrial control computer divides each of the plurality of first image blocks respectively to obtain a plurality of image block sets.

[0087] Among them, multiple first image blocks correspond to the first area of ​​the target slice layer, and multiple image block sets correspond to the second area of ​​the target slice layer; each image block set in the multiple image block sets includes at least two second image blocks, and the at least two second image blocks respectively belong to at least two trajectory amplitude maps, and at least two second image blocks correspond to the same second area of ​​the target slice layer.

[0088] Specifically, the industrial control computer divides each of the at least two trajectory amplitude maps according to a preset method. For each trajectory amplitude map, the industrial control computer obtains a corresponding plurality of first image blocks; the first image blocks correspond to the first region in the target slice layer. The plurality of first image blocks are then divided into blocks to obtain a plurality of second image blocks; the second image blocks correspond to the second region in the target slice layer. The industrial control computer then forms an image block set with the second image blocks corresponding to the same second region in the target slice layer and belonging to the at least two trajectory amplitude maps. Finally, the industrial control computer obtains a plurality of image block sets. In other words, the second image blocks belonging to the same image block set correspond to the same second region in the target slice layer and belong to the at least two trajectory amplitude maps.

[0089] As shown in Figure 5a, Figure a in Figure 5a illustrates the result of dividing the target slice layer into regions according to a preset method; Figures b and c in Figure 5a illustrate the result of dividing the trajectory amplitude maps corresponding to the two electrical signals according to a preset method. It can be seen that the image blocks in the trajectory amplitude maps corresponding to the two electrical signals correspond to regions in the target slice layer. For example, the first image block 1 in Figure b in Figure 5a and the first image block 2 in Figure c correspond to the first target region in the target slice layer, and the second image block 1 in Figure b in Figure 5a and the second image block 2 in Figure c correspond to the second target region in the target slice layer.

[0090] S204 : The industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the electrical signal amplitude of the second image block in each image block set.

[0091] In one possible implementation, the electrical signal amplitude of an image block is the average electrical signal amplitude of the image block, or is obtained by weighting the electrical signal amplitudes of all points in the image block. The following description uses the example where the electrical signal amplitude corresponding to an image block is the average electrical signal amplitude corresponding to the image block.

[0092] In one possible implementation, the industrial control computer determines the detection result corresponding to the second image block based on the average electrical signal amplitude of each second image block in each image block set and the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs; when the average electrical signal amplitude of each second image block in each image block set exceeds the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to the second image block is that there is a defect in the area corresponding to the second image block in the target slice layer; when the average electrical signal amplitude of each second image block in each image block set does not exceed the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to the second image block is that there is a defect in the area corresponding to the second image block in the target slice layer. According to the above method, the industrial control computer determines whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set.

[0093] For example, assume that Figure b in Figure 5a is a trajectory amplitude map obtained based on the electrical signal corresponding to the output light signal, and the target image set includes the second image block 1 in Figure b in Figure 5a and the second image block 2 in Figure c. For the second image block 1, the industrial control computer obtains the average electrical signal amplitude of the second image block 1 and the threshold range of the output light signal corresponding to the first image block 1. The industrial control computer determines whether the average electrical signal amplitude of the second image block 1 exceeds the threshold range of the output light signal corresponding to the second image block 1; if it does, the industrial control computer determines that the detection result corresponding to the second image block 1 is that there is a defect in the second target area in the target slice layer; if it does not, the industrial control computer determines that the detection result corresponding to the second image block 1 is that there is no defect in the second target area in the target slice layer.

[0094] In the same way, the industrial control computer can obtain the detection result corresponding to the second image block 2. The industrial control device determines whether there is a defect in the second target area of ​​the target slice layer based on the detection result corresponding to the second image block 1 and the detection result corresponding to the second image block 2.

[0095] In another possible implementation, the industrial control computer determines the ratio of each second image block in each image block set, where the ratio of each second image block is the ratio of the average electrical signal amplitude of the second image block to the average electrical signal amplitude of the first image block to which the second image block belongs; when the ratio of each second image block exceeds the ratio range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to each second image block in the target slice layer; when the ratio of each image block does not exceed the ratio range of the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is that there is no defect in the area corresponding to each second image block in the target slice layer.

[0096] For example, assume that Figure b in Figure 5a is a trajectory amplitude map obtained based on the electrical signal corresponding to the output optical signal, and the target image set includes the second image block 1 in Figure b in Figure 5a and the second image block 2 in Figure c. For second image block 1, the industrial control computer obtains the ratio of the average electrical signal amplitude of second image block 1 to the average electrical signal amplitude of first image block 1, and obtains the ratio range of the output optical signal corresponding to second image block 1. The industrial control computer determines whether the ratio of the average electrical signal amplitude of second image block 1 to the average electrical signal amplitude of second image block 1 exceeds the ratio range of the output optical signal corresponding to second image block 1; if so, the industrial control computer determines that the detection result corresponding to second image block 1 is that the second target area in the target slice layer has a defect; if not, the industrial control computer determines that the detection result corresponding to second image block 1 is that the second target area in the target slice layer does not have a defect.

[0097] In the same way, the industrial control computer can obtain the detection result corresponding to the second image block 2. The industrial control device determines whether there is a defect in the second target area of ​​the target slice layer based on the detection result corresponding to the second image block 1 and the detection result corresponding to the second image block 2.

[0098] Due to the large printing area or errors in printer installation, when printing a slice layer, the amplitude intensity corresponding to some areas in the trajectory amplitude map will always be higher than the amplitude intensity corresponding to other areas. If the global average electrical signal amplitude is compared with the threshold, the result of judging whether the slice layer has defects will be inaccurate. However, in this embodiment, by dividing the trajectory amplitude map into blocks and then judging in units of blocks, it is beneficial to improve the accuracy of the result of judging whether the slice layer has defects and can determine the location of the defect in the slice layer.

[0099] In one possible implementation, the industrial control computer determines whether a region corresponding to the second image block in each image block set in the target slice layer has a defect based on a detection result corresponding to the second image block in each image block set, including:

[0100] When the detection results corresponding to all image blocks in the target image block set are that there is a defect in the area corresponding to the image block in the target slice layer, the industrial control computer determines that there is a defect in the area corresponding to the image block in the target image block set in the target slice layer; wherein the target image block set is one of multiple image block sets.

[0101] For example, assuming that the target image block set includes a second image block 1 and a second image block 2, as shown in Figure 5a, if the detection result corresponding to the second image block 1 is that there is a defect in the second target area in the target slice layer, and the detection result corresponding to the second image block 2 is that there is a defect in the second target area in the target slice layer, then the industrial control computer determines that there is a defect in the second target area in the target slice layer; if the detection result corresponding to the second image block 1 is that there is no defect in the second target area in the target slice layer, or the detection result corresponding to the second image block 2 is that there is no defect in the second target area in the target slice layer, then the industrial control computer determines that there is no defect in the second target area in the target slice layer.

[0102] Only when the detection results corresponding to all second image blocks in the image block set indicate that there is a defect in the corresponding area of ​​the image block set in the target slice layer, is it determined that there is a defect in the corresponding area of ​​the image block set in the target slice layer, thereby improving the accuracy of the detection result.

[0103] In one possible implementation, the industrial control computer determines whether a region corresponding to the second image block in each image block set in the target slice layer has a defect based on a detection result corresponding to the second image block in each image block set, including:

[0104] When the corresponding detection result in the target image block set is that there are multiple second image blocks corresponding to the defective area in the target slice layer, if the multiple second image blocks include a second image block with a priority higher than a preset priority, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of the multiple image block sets; if the multiple second image blocks do not include an image block with a priority higher than the preset priority, then when the number of the multiple second image blocks is greater than the preset number, the industrial control computer determines that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer.

[0105] In one possible implementation, the priority of the second image block A is higher than the priority of the second image block B, the priority of the second image block B is higher than the priority of the second image block C, and the priority of the second image block C is higher than the priority of the second image block D; wherein the second image block A belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the laser output signal; the second image block B belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the infrared light signal; the second image block C belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the visible light signal; and the second image block D belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the laser reflection signal. For example, the priority of the first image block is the first priority, the priority of the second image block is the second priority, the priority of the third image block is the third priority, and the priority of the fourth image block is the fourth priority.

[0106] For example, assuming that the preset priority is the second priority and the preset number is 2, the target image block set includes the second image block 1 and the second image block 2 as shown in Figure 5a, and the second image block 3 and the second image block 4 not shown in Figure 5a, wherein the second image block 1 and the second image block 2 belong to the trajectory amplitude map obtained based on the electrical signal corresponding to the outgoing light signal and the trajectory amplitude map obtained based on the electrical signal corresponding to the laser reflection signal, respectively, and the second image block 3 and the second image block 4 belong to the trajectory amplitude map obtained based on the electrical signal corresponding to the visible light signal and the trajectory amplitude map obtained based on the electrical signal corresponding to the infrared light signal, respectively. In other words, the priority of the second image block 1 is the first priority, the priority of the second image block 2 is the fourth priority, and the priority of the second image block 3 and the priority of the second image block 4 are the second priority and the third priority, respectively.

[0107] It should be understood that the second image block 3 and the second image block 4 correspond to the second target region in the target slice layer.

[0108] If the detection result of the second image block 1 is that there is a defect in the second target area in the target slice layer, since the priority of the second image block 1 is higher than the second priority (i.e., the preset priority), the industrial control computer directly determines that there is a defect in the second target area in the target slice layer, and there is no need to determine the detection results of the second image block 2, the second image block 3, and the second image block 4; if the detection result of the second image block 1 is that there is no defect in the second target area in the target slice layer, the industrial control computer continues to determine the detection results of the second image block 2, the second image block 3, and the second image block 4; if the detection results of the second image block 2, the second image block 3, and the second image block 4 are all If there is a defect in the target area, that is, the number of second image blocks corresponding to the second target area with defects in the target slice layer whose corresponding detection results in the target image block set are greater than the preset number, the industrial control computer determines that there is a defect in the second target area in the target slice layer; if the detection results of some of the second image blocks in the second image block 2, the second image block 3 and the second image block 4 are all that there is a defect in the second target area in the target slice layer, that is, the number of second image blocks corresponding to the second target area with defects in the target slice layer whose corresponding detection results in the target image block set are not greater than the preset number, the industrial control computer determines that there is no defect in the second target area in the target slice layer.

[0109] In one possible implementation, an industrial control computer constructs multiple trajectory amplitude maps corresponding to target electrical signals based on target electrical signals corresponding to multiple reference slice layers. The multiple trajectory amplitude maps correspond to the multiple reference slice layers. The multiple reference slice layers are slice layers determined to be defect-free according to the solution of the present application. The contours of the reference slice layers are identical or similar to the contours of the target slice layers. The multiple reference slice layers are slice layers used for laser processing of parts made of the same material as the target part. Each of the multiple trajectory amplitude maps is divided according to the same preset method to obtain multiple first image blocks. The reference slice layers can be divided according to the same method to obtain multiple first regions. The multiple first image blocks of the same slice layer correspond to the multiple first regions. Based on the first image blocks obtained by dividing the multiple trajectory amplitude maps, multiple image block sets are obtained. Each image block set includes multiple first image blocks, and the multiple first image blocks belong to the multiple trajectory amplitude maps and correspond to regions with the same position in the multiple reference slice layers. The first image blocks in the same image block set are divided according to the same division method to obtain multiple second image blocks; the maximum value and the minimum value of the average electrical signal amplitudes of the multiple second image blocks are respectively used as the maximum value and the minimum value of the threshold range of the corresponding electrical signal of the image block set.

[0110] It should be understood that the first image block in the above-mentioned image block set corresponds to the same first area in the reference slice layer. When determining whether the target slice layer has defects, the trajectory amplitude map corresponding to the target slice layer is divided in the same way, and the first image block obtained by division corresponds to the same area in the target slice layer; therefore, the threshold range of the corresponding electrical signal of the above-mentioned image block set can be regarded as the threshold range of the electrical signal corresponding to the first image block.

[0111] As shown in Figure 5b, Figures A, B, and C in Figure 5b each illustrate a reference slice layer, and the outlines of these three slice layers are the same. The position of the first region A1 in the reference slice layer shown in Figure A, the position of the first region B1 in the reference slice layer shown in Figure B, and the position of the first region C1 in the reference slice layer shown in Figure C are the same. Figures D, E, and F in Figure 5b illustrate the trajectory amplitude maps corresponding to the target electrical signals of the reference slice layers illustrated in Figures A, B, and C, respectively. The first image block D1 corresponds to the first region A1, the first image block E1 corresponds to the first region B1, and the first image block F1 corresponds to the first region C1.

[0112] Similarly, the position of the first region A2 in the reference slice layer shown in FIGA, the position of the first region B2 in the reference slice layer shown in FIGB, and the position of the first region C2 in the reference slice layer shown in FIGC are the same. The first image block D2 corresponds to the first region A2, the first image block E2 corresponds to the first region B2, and the first image block F2 corresponds to the first region C2.

[0113] For the first image block D1, the first image block E1, and the first image block F1, block division is performed in the same manner to obtain 12 second image blocks; the maximum value and the minimum value of the average electrical signal amplitudes of the target electrical signals corresponding to the 12 second image blocks are determined as the upper limit and the lower limit of the threshold range corresponding to the target electrical signals of the first image block D1, the first image block E1, and the first image block F1.

[0114] Similarly, for the first image block D2, the first image block E2 and the first image block F2, block division is performed in the same manner to obtain 12 second image blocks; the maximum value and the minimum value of the average electrical signal amplitudes of the target electrical signals corresponding to the 12 second image blocks are determined as the upper limit and the lower limit of the threshold range corresponding to the target electrical signals of the first image block D2, the first image block E2 and the first image block F2.

[0115] According to the above method, the threshold range of the target electrical signal corresponding to each first image block can be obtained.

[0116] In one possible implementation, an industrial control computer constructs multiple trajectory amplitude maps corresponding to target electrical signals based on target electrical signals corresponding to multiple reference slice layers. The multiple trajectory amplitude maps correspond to the multiple reference slice layers. The multiple reference slice layers are slice layers determined to be defect-free according to the solution of the present application. The contours of the reference slice layers are identical or similar to those of the target slice layers. The multiple reference slice layers are slice layers used for laser processing of parts made of the same material as the target part. Each of the multiple trajectory amplitude maps is divided according to the same preset method to obtain multiple first image blocks. The reference slice layers can be divided according to the same method to obtain multiple first regions, and the multiple first image blocks of the same slice layer correspond to the multiple first regions. Based on the first image blocks obtained by dividing the multiple trajectory amplitude maps, multiple image block sets are obtained. Each image block set includes multiple first image blocks, and the multiple first image blocks belong to the multiple trajectory amplitude maps and correspond to regions located in the same position in the multiple reference slice layers. The first image blocks in the same image block set are divided according to the same method to obtain multiple second image blocks.

[0117] Optionally, the multiple second image blocks are preprocessed based on their average electrical signal amplitudes. For example, after the average electrical signal amplitudes of the multiple second image blocks are sorted in ascending order, the k second image blocks with the highest average electrical signal amplitudes and the k second image blocks with the lowest average electrical signal amplitudes among the multiple second image blocks are eliminated.

[0118] The industrial control computer obtains the ratio of the average electrical signal amplitude of each second image block to the average electrical signal amplitude of the second image block to which the second image block belongs; among the ratios corresponding to the second image blocks obtained in the above manner, the maximum ratio and the minimum ratio are determined as the upper limit and lower limit of the ratio range of the corresponding image block set.

[0119] It should be understood that the first image block in the above-mentioned image block set corresponds to the same first area in the reference slice layer. When determining whether the target slice layer has a defect, the trajectory amplitude map corresponding to the target slice layer is divided in the same way, and the first image block obtained by division corresponds to the same area in the target slice layer; therefore, the ratio range of the corresponding electrical signals of the above-mentioned image block set can be regarded as the ratio range of the electrical signals corresponding to the first image block.

[0120] As shown in Figure 5b, Figures A, B, and C in Figure 5b each illustrate a reference slice layer, and the outlines of these three slice layers are the same. The position of the first region A1 in the reference slice layer shown in Figure A, the position of the first region B1 in the reference slice layer shown in Figure B, and the position of the first region C1 in the reference slice layer shown in Figure C are the same. Figures D, E, and F in Figure 5b illustrate the trajectory amplitude maps corresponding to the target electrical signals of the reference slice layers illustrated in Figures A, B, and C, respectively. The first image block D1 corresponds to the first region A1, the first image block E1 corresponds to the first region B1, and the first image block F1 corresponds to the first region C1.

[0121] Similarly, the position of the first region A2 in the reference slice layer shown in FIGA, the position of the first region B2 in the reference slice layer shown in FIGB, and the position of the first region C2 in the reference slice layer shown in FIGC are the same. The first image block D2 corresponds to the first region A2, the first image block E2 corresponds to the first region B2, and the first image block F2 corresponds to the first region C2.

[0122] For the first image block D1, the first image block E1, and the first image block F1, block division is performed in the same manner to obtain 12 second image blocks; the ratio of the average electrical signal amplitude of each second image block in the 12 second image blocks to the average electrical signal amplitude of the first image block to which the second image block belongs is determined, and the maximum and minimum values ​​corresponding to the ratios of the 12 second image blocks are determined as the upper limit and lower limit of the ratio range corresponding to the target electrical signals of the first image block D1, the first image block E1, and the first image block F1.

[0123] Similarly, for the first image block D2, the first image block E2 and the first image block F2, block division is performed in the same manner to obtain 12 second image blocks; the ratio of the average electrical signal amplitude of each second image block in the 12 second image blocks to the average electrical signal amplitude of the first image block to which the second image block belongs is determined respectively, and the maximum value and the minimum value of the ratios corresponding to the 12 second image blocks are determined as the upper limit and the lower limit of the ratio range corresponding to the target electrical signals of the first image block D2, the first image block E2 and the first image block F2.

[0124] According to the above method, the threshold range of the target electrical signal corresponding to each first image block can be obtained.

[0125] The target electrical signal is the electrical signal corresponding to the outgoing optical signal, the electrical signal corresponding to the laser reflected signal, the electrical signal corresponding to the visible light signal, or the electrical signal corresponding to the infrared light signal. In other words, the threshold ranges corresponding to the outgoing optical signal, the threshold ranges corresponding to the laser reflected signal, the threshold ranges corresponding to the visible light signal, and the threshold ranges corresponding to the infrared light signal can all be obtained using the above method.

[0126] It should be understood that the preset manner used to divide the trajectory amplitude map when determining the threshold range is the same as the preset manner used to divide the trajectory amplitude map when determining whether a target slice layer has a defect.

[0127] In one possible implementation, upon determining the presence of an abnormal region in the target slice layer, the industrial control computer obtains the location information of the abnormal region in the target slice layer and transmits this location information to the laser processing system. This allows the laser processing system to reprocess the abnormal region in the target slice layer based on the location information, thereby eliminating the defect in the target slice layer. It should be understood that the laser processing system herein specifically refers to the control system of the additive manufacturing equipment.

[0128] It should be understood that since the image blocks of the target slice layer are obtained by dividing the trajectory amplitude map of the target slice layer according to a preset method, the image blocks correspond to the areas in the target slice layer. Therefore, after determining the abnormal area of ​​the target slice layer, the industrial control computer determines the position information of the abnormal area in the target slice layer based on the preset method.

[0129] In one feasible implementation, upon determining that an abnormal area exists in a target slice layer, the industrial control computer obtains the average electrical signal amplitude of the output light signal, the average electrical signal amplitude of the laser reflection signal, the average electrical signal amplitude of the visible light signal, and the average electrical signal amplitude of the infrared light signal corresponding to the abnormal area of ​​the target slice layer. The industrial control computer compares the average electrical signal amplitude of the output light signal, the average electrical signal amplitude of the laser reflection signal, the average electrical signal amplitude of the visible light signal, and the average electrical signal amplitude of the infrared light signal corresponding to the abnormal area with corresponding preset thresholds. Based on the comparison results, the industrial control computer sends an instruction to the additive manufacturing equipment control system to instruct the additive manufacturing equipment control system to adjust the output power of the laser. If the comparison result is that the number of electrical signals higher than the corresponding preset threshold is greater than the number of electrical signals lower than the corresponding preset threshold, it indicates that the reason for the existence of an abnormal area in the target slice layer may be that the laser output power is too high, and the indication information is used to instruct the additive manufacturing equipment control system to reduce the laser output power; if the comparison result is that the number of electrical signals higher than the corresponding preset threshold is not greater than the number of electrical signals lower than the corresponding preset threshold, it indicates that the reason for the existence of an abnormal area in the target slice layer may be that the laser output power is too low, and the indication information is used to instruct the additive manufacturing equipment control system to increase the laser output power.

[0130] After completing these adjustments, the industrial computer transmits the location information of the abnormal area to the additive manufacturing equipment's control system. Based on the abnormal area's location information and the indication information, the control system controls the reprocessing of the abnormal area to eliminate the defects in the target slice layer. Furthermore, subsequent slice layers are processed based on the adjusted optical power, preventing defects from occurring in subsequent slice layers.

[0131] In conjunction with the first aspect, in one possible implementation, the method of this embodiment further includes:

[0132] Method 1: The industrial control computer obtains the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer. When the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer is greater than a first preset ratio, that is, the area of ​​the abnormal region of the target slice layer is larger, the industrial control computer determines that the abnormal region of the target slice layer needs to be reprocessed. The industrial control computer transmits the position information of the abnormal region of the target slice layer to the laser processing system, so that the laser processing system reprocesses the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer.

[0133] or,

[0134] Method 2: The industrial control computer obtains the position information of all abnormal areas from the first layer to the target slice layer, groups the position information of all abnormal areas, and the position information in the same group indicates the same position; based on the grouping result, the target group is determined, and the target group is a group with more position information than the preset number, that is, the position corresponding to the target group is the position where the abnormal area occurs more frequently, which may be caused by incorrect setting of the processing parameters of the laser processing system. Therefore, the industrial control computer transmits the position information corresponding to the target group to the laser processing system, so that the laser processing system adjusts the parameters of the laser processing system based on the target position information; thereby, the occurrence of abnormalities in the same area in subsequent slice layers can be avoided;

[0135] or,

[0136] Method 3: The industrial control computer obtains the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer. When the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer is greater than the second preset ratio, and the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer is not greater than the first preset ratio, that is, the area of ​​the abnormal area of ​​the target slice layer is small, but the accumulated area of ​​the abnormal area from the first layer to the target slice layer is large, the industrial control computer needs to suppress the increase in the area of ​​the abnormal area. At this time, the industrial control computer The position information of all abnormal areas in the target slice layer is transmitted to the laser processing system, so that the laser processing system re-processes the abnormal areas of the target slice layer based on the position information of the abnormal areas of the target slice layer; optionally, the industrial control computer also transmits the position information of the abnormal areas of the slice layer of a preset value adjacent to the target slice layer to the laser processing system, so that when the laser processing system re-processes the abnormal areas of the target slice layer based on the position information of the abnormal areas of the target slice layer, it re-processes the abnormal areas of the slice layer of a preset value adjacent to the target slice layer, thereby further suppressing the increase in the area of ​​the abnormal area.

[0137] It should be noted that the first and second methods can be performed separately or simultaneously, and are not limited here.

[0138] In a possible implementation, the industrial control computer obtains one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group, where the target group is a group in which the number of position information is greater than a preset number; the target group is obtained by grouping the position information of all abnormal areas from the first layer to the target slice layer, and the position information in the same group indicates the same position, and the industrial control computer compares the position information of the abnormal area of ​​the target slice layer, the area of ​​the abnormal area of ​​the target slice layer and the ratio of the total area of ​​the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer One or more of the ratio of the areas of the slice layers, the ratio of the total areas of all abnormal areas from the first layer to the target slice layer to the total areas of all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group is transmitted to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, and the ratio of the total areas of all abnormal areas from the first layer to the target slice layer to the total areas of all slice layers from the first layer to the target slice layer, so that the laser processing system adjusts the parameters of the laser processing system based on the position information corresponding to the target group.

[0139] It should be pointed out here that the specific process of the laser processing system re-processing the abnormal area of ​​the target slice layer based on one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, and the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the specific process of the laser processing system adjusting the parameters of the laser processing system based on the position information corresponding to the target group can be found in the relevant description of the above-mentioned industrial control computer execution operation, which will not be described here.

[0140] Optionally, before transmitting one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group to the laser processing system, the industrial control computer sends a reprocessing request or a processing parameter adjustment request to the terminal device of the processing personnel. If a response message indicating that the processing personnel agrees to reprocess or adjust the processing parameters is received, the industrial control computer transmits one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group to the laser processing system.

[0141] It should be understood that the laser processing system here specifically refers to the control system of additive manufacturing equipment.

[0142] This method allows processing personnel to determine whether the abnormal area needs to be reprocessed or the processing parameters need to be adjusted, or allows processing personnel to further determine whether the abnormal area is a true abnormal area, and then determine whether the abnormal area needs to be reprocessed, thereby improving processing flexibility.

[0143] By acquiring and displaying the above information, the processing personnel can know the information of the abnormal area of ​​each slice layer from the first layer to the current layer during the processing, as well as the overall information of the abnormal area from the first layer to the current layer.

[0144] In one possible implementation, the method of this embodiment further includes: an industrial control computer displaying at least two trajectory amplitude maps and indicating whether the target slice layer has a defect; when the industrial control computer determines that the target slice layer has a defect, the industrial control computer displays or marks an abnormal area of ​​the target slice layer on the at least two trajectory amplitude maps, so that the inspector knows the location of the abnormal area in the target slice layer. As shown in Figure 5c, the abnormal area of ​​the target slice layer is marked by circumscribing a box.

[0145] As can be seen, in the solution of the present application, during the processing of the target slice layer of the target part, at least two of the electrical signals corresponding to the outgoing light signal, the electrical signals corresponding to the laser reflection signal, the electrical signals corresponding to the visible light signal, and the electrical signals corresponding to the infrared light signal are acquired. Based on the acquired electrical signals corresponding to the outgoing light signal, the electrical signals corresponding to the laser reflection signal, the electrical signals corresponding to the visible light signal, and the electrical signals corresponding to the infrared light signal, at least two trajectory amplitude maps are constructed. By dividing the constructed trajectory amplitude maps into blocks, the area containing defects, i.e., abnormal areas, in the target slice layer is determined based on the average electrical signal amplitudes of the image blocks obtained by the block division. This method can detect abnormal areas in the slice layer of the part during additive processing while preventing damage to the part and being cost-effective compared to existing technologies. The accuracy of the determination result can be improved by determining whether the area corresponding to each image block in the target slice layer is defective based on the average electrical signal amplitudes of at least two image blocks belonging to the at least two trajectory amplitude maps. By displaying the at least two trajectory amplitude maps and the defect determination result, it is easy for the processing personnel to know whether the target slice layer is defective. And when there is a defect, it can help the processing personnel know which specific area of ​​the target slice layer has the defect, so as to facilitate subsequent reprocessing.

[0146] Referring to FIG6 , an embodiment of the present application provides a schematic diagram of the structure of an industrial control computer. As shown in FIG6 , the industrial control computer 600 includes:

[0147] an acquisition unit 601 configured to acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive manufacturing process, and the optical signal includes an output light signal of a laser in the first time period, and at least two optical signals selected from a laser reflection signal, a visible light signal, and an infrared light signal generated in the target slice layer in the first time period;

[0148] A construction unit 602 is configured to construct at least two trajectory amplitude maps based on the at least two electrical signals corresponding to the at least two optical signals, wherein the contour of each of the at least two trajectory amplitude maps is the same as the contour of the target slice layer, and the trajectory amplitude map includes a plurality of trajectory amplitude lines, the plurality of trajectory amplitude lines corresponding to processing trajectories when processing the target slice layer, and the amplitudes represented by the trajectory amplitude lines are the amplitudes of the corresponding electrical signals during the processing of the target slice layer;

[0149] A display unit 603 is used to display at least two trajectory amplitude graphs;

[0150] A dividing unit 604 is configured to divide the at least two trajectory amplitude maps respectively to obtain a plurality of first image blocks; divide each of the plurality of first image blocks respectively to obtain a plurality of image block sets; the plurality of image block sets correspond to regions of the target slice layer; each of the plurality of image block sets includes at least two second image blocks, the at least two second image blocks respectively belonging to the at least two trajectory amplitude maps, and the at least two second image blocks correspond to the same region of the target slice layer;

[0151] A determining unit 605 is configured to determine whether a region corresponding to the second image block in each image block set in the target slice layer has a defect based on the electrical signal amplitude of the second image block in each image block set;

[0152] The display unit 603 is further configured to display an abnormal region of the target slice layer on the at least two trajectory amplitude images when it is determined that a defect exists in the target slice layer.

[0153] In one possible implementation, in determining whether a region corresponding to the second image block in each image block set in the target slice layer has a defect based on the electrical signal amplitude of the second image block in each image block set, the determining unit 605 is specifically configured to:

[0154] The detection result corresponding to each second image block is determined based on the electrical signal amplitude of each second image block in each image block set and the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs; and whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer is determined based on the detection result corresponding to the second image block in each image block set.

[0155] In one possible implementation, when the electrical signal amplitude of each second image block exceeds the threshold range of the electrical signal corresponding to the first image block to which the image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to the image block in the target slice layer; when the electrical signal amplitude of each second image block does not exceed the threshold range of the electrical signal corresponding to the second image block to which the image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to the second image block in the target slice layer.

[0156] In one possible implementation, in determining the detection result corresponding to each second image block based on the electrical signal amplitude of each second image block in each image block set, the determining unit 605 is specifically configured to:

[0157] The industrial control computer determines the ratio of each second image block, where the ratio of each second image block is the ratio of the electrical signal amplitude of the second image block to the electrical signal amplitude of the first image block to which the second image block belongs; when the ratio of each second image block exceeds the ratio range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to each second image block in the target slice layer; when the ratio of each image block does not exceed the ratio range of the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is that there is no defect in the area corresponding to each second image block in the target slice layer.

[0158] In one possible implementation, in determining whether a region corresponding to the second image block in each image block set in the target slice layer has a defect based on the detection result corresponding to the second image block in each image block set, the determining unit 605 is specifically configured to:

[0159] When the detection results corresponding to all the second image blocks in the target image block set are that there is a defect in the area corresponding to the second image block in the target slice layer, it is determined that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of multiple image block sets.

[0160] In one possible implementation, in determining whether a region corresponding to the second image block in each image block set in the target slice layer has a defect based on the detection result corresponding to the second image block in each image block set, the determining unit 605 is specifically configured to:

[0161] When a detection result in the target image block set is that there are multiple second image blocks corresponding to the defective area in the target slice layer, if the multiple second image blocks include a second image block with a priority higher than a preset priority, it is determined that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of the multiple image block sets; if the multiple second image blocks do not include the second image block with a priority higher than the preset priority, when the number of the multiple second image blocks is greater than the preset number, it is determined that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer.

[0162] In one possible implementation, the priority of the second image block A is higher than the priority of the second image block B, the priority of the second image block B is higher than the priority of the second image block C, and the priority of the second image block C is higher than the priority of the second image block D; wherein, the second image block A belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the laser output signal; the second image block B belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the infrared light signal; the second image block C belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the visible light signal; and the second image block D belongs to a trajectory amplitude map constructed based on the electrical signal corresponding to the laser reflection signal.

[0163] In one possible implementation, the acquisition unit 601 is further configured to acquire one or more of the following: position information of an abnormal region of a target slice layer, a ratio of an area of ​​the abnormal region of the target slice layer to an area of ​​the target slice layer, a ratio of a total area of ​​all abnormal regions from the first layer to the target slice layer to a total area of ​​all slice layers from the first layer to the target slice layer, and position information corresponding to a target group, where the target group is a group in which the number of position information is greater than a preset number; the target group is obtained by grouping the position information of all abnormal regions from the first layer to the target slice layer, and the position information in the same group indicates the same position.

[0164] The industrial control computer also includes: a sending unit 606, which is used to transmit one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group, so that the laser processing system adjusts the parameters of the laser processing system based on the position information corresponding to the target group.

[0165] In one possible implementation, the acquiring unit 601 is further configured to acquire a ratio of an area of ​​the abnormal region of the target slice layer to an area of ​​the target slice layer, and the sending unit 606 is further configured to, when the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer is greater than a first preset ratio, transmit, by the industrial control computer, position information of the abnormal region of the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer.

[0166] or,

[0167] The acquisition unit 601 is further configured to acquire the position information of all abnormal regions from the first layer to the target slice layer, group the position information of all abnormal regions, and the position information in the same group indicates the same position; the sending unit 606 is further configured to transmit the position information corresponding to the target group to the laser processing system, so that the laser processing system adjusts the parameters of the laser processing system based on the target position information; the target group is a group whose number of position information is greater than a preset number;

[0168] or,

[0169] The acquisition unit 601 is further used to obtain the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer. The sending unit 606 is further used to transmit the position information of all abnormal areas in the target slice layer to the laser processing system if the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer is greater than the second preset ratio, and the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer is not greater than the first preset ratio, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer.

[0170] In a possible implementation, the electrical signal amplitude of the second image block is an average electrical signal amplitude of the second image block, or is obtained by weighting the electrical signal amplitudes of all points in the second image block.

[0171] In one possible implementation, the construction unit 602 is specifically configured to:

[0172] Obtain the starting and ending coordinates, laser processing speed and sampling rate of each trajectory line in the target trajectory amplitude map; the target trajectory amplitude map is one of at least two trajectory amplitude maps; calculate the number of first additive processing points of each trajectory line based on the starting and ending coordinates, laser printing speed and sampling rate of each trajectory line; obtain the number of second additive processing points of each trajectory line based on the target electrical signal; the target electrical signal is the electrical signal corresponding to the target trajectory amplitude map; for the target trajectory line in the target trajectory amplitude map, if the absolute value of the difference between the number of the second additive processing points of the target trajectory line and the number of the first additive processing points of the target trajectory line is less than a preset ratio, then retain the target trajectory line; if it exceeds, delete the target trajectory line.

[0173] Furthermore, in the aspect of deleting the target trajectory if the ratio of the absolute value of the difference between the number of the second additively processed points on the target trajectory and the number of the first additively processed points on the target trajectory to the number of the first additively processed points on the target trajectory exceeds a preset ratio, the constructing unit 602 is specifically configured to:

[0174] If the ratio of the absolute value of the difference between the number of the second additive processing points of the target trajectory line and the number of the first additive processing points of the target trajectory line to the number of the first additive processing points of the target trajectory line exceeds a preset ratio, and the ratio of the absolute value of the difference between the number of the second additive processing points of the next trajectory adjacent to the target trajectory in the processing order and the number of the first additive processing points of the next trajectory to the number of the first additive processing points of the next trajectory does not exceed the preset ratio, then the target trajectory is deleted.

[0175] In a possible implementation, the display unit 603 is further configured to display the result of whether the target slice layer has defects; when the industrial control computer determines that the target slice layer has defects, the industrial control computer displays the abnormal area of ​​the target slice layer on at least two trajectory amplitude maps.

[0176] It should be noted that the above-mentioned units (acquisition unit 601, construction unit 602, display unit 603, division unit 604, determination unit 605 and sending unit 606) are used to perform the relevant steps of the above-mentioned method. For example, acquisition unit 601 is used to perform the relevant content of S201, construction unit 602 is used to perform the relevant content of S202, division unit 604 is used to perform the relevant content of S203, and display unit 603, determination unit 605 and sending unit 606 are used to perform the relevant content of S204. Each unit or module in the industrial control computer 600 can be individually or completely combined into one or more other units or modules to form a structure, or one (or some) of the units or modules can be further divided into multiple functionally smaller units or modules to form a structure, which can achieve the same operation without affecting the realization of the technical effects of the embodiments of the present invention. The above-mentioned units or modules are divided based on logical functions. In actual applications, the functions of one unit (or module) can also be implemented by multiple units (or modules), or the functions of multiple units (or modules) can be implemented by one unit (or module).

[0177] Based on the description of the above method and apparatus embodiments, please refer to FIG7 , which shows a schematic diagram of the structure of another industrial computer 700 provided in an embodiment of the present invention. The industrial computer 700 shown in FIG7 (which may specifically be a computer device) includes a memory 701, a processor 702, a communication interface 703, and a bus 704. The memory 701, processor 702, and communication interface 703 are interconnected via bus 704.

[0178] The memory 701 may be a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM).

[0179] The memory 701 can store programs. When the program stored in the memory 701 is executed by the processor 702, the processor 702 and the communication interface 703 are used to perform the various steps of the additive manufacturing quality inspection method of the embodiment of the present application.

[0180] The processor 702 can be a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), a graphics processing unit (GPU) or one or more integrated circuits to execute relevant programs to implement the functions required to be performed by the units in the industrial control computer 600 of the embodiment of the present application, or to execute the additive manufacturing quality detection method of the method embodiment of the present application.

[0181] The processor 702 may also be an integrated circuit chip with signal processing capabilities. During implementation, the various steps of the additive manufacturing quality inspection method of the present application may be completed by hardware integrated logic circuits or software instructions in the processor 702. The aforementioned processor 702 may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The various methods, steps, and logic block diagrams disclosed in the embodiments of the present application may be implemented or executed. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the method disclosed in conjunction with the embodiments of the present application may be directly implemented and executed by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. The software module may be located in a storage medium mature in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or the like. The storage medium is located in the memory 701, and the processor 702 reads the information in the memory 701 and combines its hardware to complete the functions required to be performed by the units included in the industrial control computer 700 of the embodiment of the present application, or executes the additive manufacturing quality detection method of the method embodiment of the present application.

[0182] The communication interface 703 uses a transceiver device such as, but not limited to, a transceiver to implement communication between the industrial computer 700 and other devices or a communication network. For example, data can be obtained through the communication interface 703.

[0183] The bus 704 may include a path for transmitting information between various components of the industrial computer 700 (eg, the memory 701 , the processor 702 , and the communication interface 703 ).

[0184] It should be noted that although the industrial computer 700 shown in FIG7 only shows a memory, a processor, and a communication interface, during specific implementation, those skilled in the art will understand that the industrial computer 700 also includes other components necessary for normal operation. Furthermore, those skilled in the art will understand that, depending on specific needs, the industrial computer 700 may also include hardware components that implement other additional functions. Furthermore, those skilled in the art will understand that the industrial computer 700 may only include the components necessary to implement the embodiments of the present application, and does not necessarily need to include all of the components shown in FIG7 .

[0185] An embodiment of the present application further provides a chip, which includes a processor and a data interface. The processor reads instructions stored in a memory through the data interface to implement the additive manufacturing quality detection method.

[0186] Optionally, as an implementation method, the chip may further include a memory, in which instructions are stored, and the processor is used to execute the instructions stored in the memory. When the instructions are executed, the processor is used to execute the additive manufacturing quality detection method.

[0187] An embodiment of the present application also provides a computer-readable storage medium, which stores instructions. When the computer-readable storage medium is executed on a computer or a processor, the computer or processor executes one or more steps in any of the above methods.

[0188] The present application also provides a computer program product comprising instructions, which, when executed on a computer or processor, causes the computer or processor to execute one or more steps in any of the above methods.

[0189] Those skilled in the art will appreciate that the functions described in conjunction with the various illustrative logic blocks, modules, and algorithm steps disclosed herein can be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions described in the various illustrative logic blocks, modules, and steps can be stored or transmitted as one or more instructions or codes on a computer-readable medium and executed by a hardware-based processing unit. Computer-readable media can include computer-readable storage media, which corresponds to tangible media, such as data storage media, or communication media including any media that facilitates the transfer of computer programs from one place to another (e.g., based on a communication protocol). In this manner, computer-readable media can generally correspond to (1) non-transitory tangible computer-readable storage media, or (2) communication media, such as signals or carrier waves. Data storage media can be any available media that can be accessed by one or more computers or one or more processors to retrieve instructions, codes, and / or data structures for implementing the techniques described in this application. A computer program product can include computer-readable media.

[0190] By way of example, and not limitation, such computer-readable storage media may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage, flash memory, or any other medium that can be used to store desired program code in the form of instructions or data structures and that can be accessed by a computer. Furthermore, any connection is properly referred to as a computer-readable medium. For example, if instructions are transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of medium. However, it should be understood that computer-readable storage media and data storage media do not include connections, carrier waves, signals, or other transient media, but are actually directed to non-transitory tangible storage media. As used herein, disk and disc include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), and Blu-ray disc, where disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0191] Instructions may be executed by one or more processors, such as one or more digital signal processors (DSPs), general-purpose microprocessors, application-specific integrated circuits (ASICs), field-programmable logic arrays (FPGAs), or other equivalent integrated or discrete logic circuits. Thus, the term "processor," as used herein, may refer to any of the aforementioned structures or any other structure suitable for implementing the techniques described herein. Additionally, in some aspects, the functionality described by the various illustrative logical blocks, modules, and steps described herein may be provided within dedicated hardware and / or software modules configured for encoding and decoding, or incorporated into a combined codec. Furthermore, the techniques may be fully implemented in one or more circuits or logic elements.

[0192] The techniques of this application can be implemented in a variety of devices or apparatuses, including wireless handsets, integrated circuits (ICs), or a set of ICs (e.g., a chipset). Various components, modules, or units are described herein to emphasize functional aspects of devices for performing the disclosed techniques, but they do not necessarily require implementation by different hardware units. In fact, as described above, the various units can be combined in coded hardware units in conjunction with appropriate software and / or firmware, or provided by interoperating hardware units (including one or more processors as described above).

[0193] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described systems, devices and units can refer to the specific descriptions of the corresponding steps in the aforementioned method embodiments and will not be repeated here.

[0194] It should be understood that in the description of this application, unless otherwise specified, " / " indicates that the objects associated with each other are in an "or" relationship. For example, A / B can mean A or B; where A and B can be singular or plural. Also, in the description of this application, unless otherwise specified, "multiple" means two or more than two. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or plural. In addition, to facilitate the clear description of the technical solutions of the embodiments of this application, in the embodiments of this application, words such as "first" and "second" are used to distinguish between identical or similar items with substantially the same functions and effects. Those skilled in the art will understand that words such as "first" and "second" do not limit the quantity or execution order, and words such as "first" and "second" do not necessarily mean different. At the same time, in the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner to facilitate understanding.

[0195] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. The mutual coupling, direct coupling, or communication connection shown or discussed can be through some interface, indirect coupling or communication connection of devices or units, and can be electrical, mechanical or other forms.

[0196] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0197] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware, or any combination thereof. When implemented using software, all or part of the embodiments may be implemented in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions according to the embodiments of the present application are generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted via the computer-readable storage medium. The computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via a wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) method. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or data center that includes one or more available media integrated therein. The available medium may be a read-only memory (ROM), a random access memory (RAM), a magnetic medium such as a floppy disk, a hard disk, a tape, a magnetic disk, or an optical medium such as a digital versatile disc (DVD), or a semiconductor medium such as a solid state disk (SSD).

[0198] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

[0199] The device embodiments described above are merely illustrative, wherein the units and modules described as separate components may or may not be physically separate. Furthermore, some or all of the units and modules may be selected based on actual needs to achieve the objectives of the present embodiment. Those skilled in the art can understand and implement the present invention without inventive effort.

[0200] The above is only a specific implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A method for detecting quality of additive manufacturing, characterized in that: The method comprises: Acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive manufacturing process, and the optical signal includes an output light signal of a laser in the first time period, and at least two optical signals of a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; At least two trajectory amplitude maps are constructed based on the at least two electrical signals corresponding to the at least two optical signals; the contour of each trajectory amplitude map in the at least two trajectory amplitude maps is the same as the contour of the target slice layer, the trajectory amplitude map includes a plurality of trajectory amplitude lines, the plurality of trajectory amplitude lines correspond to the processing trajectories when processing the target slice layer, and the amplitudes represented by the trajectory amplitude lines are the amplitudes of the corresponding electrical signals during the processing of the target slice layer; Dividing the at least two trajectory amplitude images respectively to obtain a plurality of first image blocks; The plurality of first image blocks are respectively divided into blocks to obtain a plurality of image block sets; the plurality of image block sets correspond to regions of the target slice layer; each of the plurality of image block sets includes at least two second image blocks, the at least two second image blocks respectively belong to at least two trajectory amplitude maps, and the at least two second image blocks correspond to the same region of the target slice layer; Based on the electrical signal amplitude of the second image block in each image block set, it is determined whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer.

2. The method according to claim 1, characterized in that: The determining, based on the electrical signal amplitude of the second image block in each image block set, whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer includes: Determine the detection result corresponding to each second image block based on the electrical signal amplitude of each second image block in each image block set; Based on the detection result corresponding to the second image block in each image block set, it is determined whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer.

3. The method according to claim 2, characterized in that When the amplitude of the electrical signal of each second image block exceeds the threshold range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to each second image block is that there is a defect in the area corresponding to each second image block in the target slice layer; When the electrical signal amplitude of each image block does not exceed the threshold range of the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is that there is no defect in the area corresponding to each second image block in the target slice layer.

4. The method according to claim 2, characterized in that: The determining the detection result corresponding to each second image block based on the electrical signal amplitude of each second image block in each image block set includes: Determine a ratio of each second image block, wherein the ratio of each second image block is a ratio of an electrical signal amplitude of the second image block to an electrical signal amplitude of the first image block to which the second image block belongs; When the ratio of each second image block exceeds the ratio range of the electrical signal corresponding to the first image block to which the second image block belongs, the detection result corresponding to each second image block is that a defect exists in the area corresponding to each second image block in the target slice layer; When the ratio of each image block does not exceed the ratio range of the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is that there is no defect in the area corresponding to each second image block in the target slice layer.

5. The method according to any one of claims 2 to 4, characterized in that: The determining whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set includes: When the detection results corresponding to all the second image blocks in the target image block set indicate that the area corresponding to the second image block in the target slice layer has a defect, it is determined that the area corresponding to the second image block in the target image block set in the target slice layer has a defect; The target image block set is one of the multiple image block sets.

6. The method according to claim 3 or 4, characterized in that: The determining whether there is a defect in the area corresponding to the second image block in each image block set in the target slice layer based on the detection result corresponding to the second image block in each image block set includes: When the detection result in the target image block set is that there are multiple second image blocks corresponding to the defective area in the target slice layer, if the multiple second image blocks include a second image block with a priority higher than a preset priority, it is determined that there is a defect in the area corresponding to the second image block in the target image block set in the target slice layer; wherein the target image block set is one of the multiple image block sets; If the plurality of second image blocks do not include an image block with a priority higher than a preset priority, when the number of the plurality of second image blocks is greater than a preset number, it is determined that a region corresponding to a second image block in the target image block set in the target slice layer has a defect.

7. The method according to claim 6, characterized in that The priority of the second image block A is higher than the priority of the second image block B, the priority of the second image block B is higher than the priority of the second image block C, and the priority of the second image block C is higher than the priority of the second image block D; Among them, the second image block A belongs to the trajectory amplitude map constructed based on the electrical signal corresponding to the optical signal of the laser; the second image block B belongs to the trajectory amplitude map constructed based on the electrical signal corresponding to the infrared light signal; the second image block C belongs to the trajectory amplitude map constructed based on the electrical signal corresponding to the visible light signal; the second image block D belongs to the trajectory amplitude map constructed based on the electrical signal corresponding to the laser reflection signal.

8. The method according to any one of claims 1 to 7, characterized in that: The method further comprises: Obtain one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group, wherein the target group is a group whose number of position information is greater than a preset number; the target group is obtained by grouping the position information of all abnormal areas from the first layer to the target slice layer, and the position information in the same group indicates the same position; One or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, and the position information corresponding to the target group are transmitted to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on one or more of the position information of the abnormal area of ​​the target slice layer, the ratio of the area of ​​the abnormal area of ​​the target slice layer to the area of ​​the target slice layer, and the ratio of the total area of ​​all abnormal areas from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer, so that the laser processing system adjusts the parameters of the laser processing system based on the position information corresponding to the target group.

9. The method according to any one of claims 1 to 7, characterized in that: The method further comprises: acquiring a ratio of an area of ​​the abnormal region of the target slice layer to an area of ​​the target slice layer, and when the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer is greater than a first preset ratio, transmitting position information of the abnormal region of the target slice layer to a laser processing system, so that the laser processing system re-processes the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer; or, Acquire the position information of all abnormal areas from the first layer to the target slice layer, group the position information of all abnormal areas, and the position information in the same group indicates the same position; transmit the position information corresponding to the target group to the laser processing system, so that the laser processing system adjusts the parameters of the laser processing system based on the position information corresponding to the target group; the target group is a group with a number of position information greater than a preset number; or, Obtain the ratio of the total area of ​​all abnormal regions from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer. If the ratio of the total area of ​​all abnormal regions from the first layer to the target slice layer to the total area of ​​all slice layers from the first layer to the target slice layer is greater than a second preset ratio, and the ratio of the area of ​​the abnormal region of the target slice layer to the area of ​​the target slice layer is not greater than the first preset ratio, transmit the position information of all abnormal regions in the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer.

10. The method according to any one of claims 1 to 9, characterized in that: The electrical signal amplitude of the second image block is an average electrical signal amplitude of the second image block, or is obtained by weighting the electrical signal amplitudes of all points in the second image block.

11. The method according to any one of claims 1 to 10, characterized in that: The step of constructing at least two trajectory amplitude graphs based on the at least two electrical signals corresponding to the at least two optical signals comprises: Obtaining the first and last coordinates, laser processing speed and sampling rate of each trajectory line in the target trajectory amplitude map; the target trajectory amplitude map is one of the at least two trajectory amplitude maps; Calculating the number of first additive processing points of each trajectory line based on the first and last coordinates of each trajectory line, the laser printing speed and the sampling rate; Acquire the number of second additive processing points of each trajectory line based on a target electrical signal; the target electrical signal is an electrical signal corresponding to the target trajectory amplitude map; For a target trajectory line in the target trajectory amplitude map, if the ratio of the absolute value of the difference between the number of the second additive processing points of the target trajectory line and the number of the first additive processing points of the target trajectory line to the number of the first additive processing points does not exceed a preset ratio, the target trajectory line is retained in the target trajectory amplitude map; if it exceeds, the target trajectory line is deleted.

12. The method according to claim 11, characterized in that If the target track is exceeded, the target track is deleted, including: If it exceeds, and the ratio of the absolute value of the difference between the number of second additive processing points of a next trajectory adjacent to the target trajectory in the processing order and the number of first additive processing points of the next trajectory to the number of first additive processing points of the next trajectory line does not exceed the preset ratio, the target trajectory is deleted.

13. The method according to any one of claims 1 to 12, characterized in that: The method further comprises: The at least two trajectory amplitude maps are displayed, and the result of whether the target slice layer has defects is displayed; when it is determined that the target slice layer has defects, an abnormal area of ​​the target slice layer is displayed on the at least two trajectory amplitude maps.

14. An industrial computer, characterized in that: include: an acquisition unit, configured to acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive manufacturing process, and the optical signal includes an output light signal of a laser in the first time period, and at least two optical signals of a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; A construction unit, configured to respectively construct at least two trajectory amplitude maps based on at least two electrical signals corresponding to the at least two optical signals; the contour of each trajectory amplitude map of the at least two trajectory amplitude maps is the same as the contour of the target slice layer, the trajectory amplitude map comprises a plurality of trajectory amplitude lines, the plurality of trajectory amplitude lines correspond to processing trajectories when processing the target slice layer, and the amplitudes represented by the trajectory amplitude lines are the amplitudes of the corresponding electrical signals during the processing of the target slice layer; A display unit, used for displaying the at least two trajectory amplitude graphs; a dividing unit, configured to divide the at least two trajectory amplitude maps respectively to obtain a plurality of first image blocks; and to divide the plurality of first image blocks respectively to obtain a plurality of image block sets; and the plurality of image block sets correspond to regions of the target slice layer; Each of the plurality of image block sets includes at least two second image blocks, the at least two second image blocks respectively belong to at least two trajectory amplitude images, and the at least two second image blocks correspond to the same area of ​​the target slice layer; a determining unit, configured to determine whether a region corresponding to the second image block in each image block set in the target slice layer has a defect based on an electrical signal amplitude of the second image block in each image block set; The display unit is further configured to display an abnormal region of the target slice layer on the at least two trajectory amplitude images when it is determined that the target slice layer has a defect.

15. An industrial computer, characterized in that: It includes a processor, the processor is connected to a memory, the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the industrial computer executes the method as described in any one of claims 1-13.

16. A laser processing control system, comprising: A laser welding system, a sensor module, a signal processing module and an industrial computer, wherein the industrial computer is used to execute the method as described in any one of claims 1-13.

17. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement the method according to any one of claims 1 to 13.

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