Additive manufacturing quality inspection method and related apparatus

Abstract

Disclosed in the present application are an additive manufacturing quality inspection method and a related apparatus. The method comprises: an industrial control computer acquiring a first electrical signal corresponding to a light emission signal, a second electrical signal corresponding to a laser reflection signal, a third electrical signal corresponding to a visible light signal and a fourth electrical signal corresponding to an infrared light signal within a first period of time during laser additive manufacturing; on the basis of at least one of the first electrical signal, the second electrical signal, the third electrical signal and the fourth electrical signal within the first period of time, the industrial control computer determining layer-based electrical signal amplitudes respectively corresponding to at least one of the light emission signal, the laser reflection signal, the visible light signal and the infrared light signal; and on the basis of at least one of the layer-based electrical signal amplitude corresponding to the light emission signal, the layer-based electrical signal amplitude corresponding to the laser reflection signal, the layer-based electrical signal amplitude corresponding to the visible light signal and the layer-based electrical signal amplitude corresponding to the infrared light signal, determining whether a target slice layer has a defect. The present application facilitates the detection for an abnormal region in a slice layer of a part during additive manufacturing.

Description

Additive manufacturing quality inspection method and related device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on December 19, 2023, with application number 202311761269.7 and invention name “Additive manufacturing quality detection method and related device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of additive manufacturing technology, and in particular to an additive manufacturing quality detection method and related devices. Background Art

[0003] Additive manufacturing, also known as 3D printing, primarily involves melting raw metal with focused laser heat and then shaping dust and other materials layer by layer into the desired workpiece. Laser additive manufacturing is a metal additive manufacturing process that offers greater efficiency and flexibility than traditional methods such as part assembly and metal cutting. It can be used for rapid prototyping, manufacturing functionally graded materials, and repairing high-value-added components. Currently, this technology is increasingly being used in the aerospace, defense, automotive, and biomedical industries. During laser additive manufacturing, varying laser processing parameters, the environment, and equipment can lead to poor surface finish in the workpiece. Defect generation and dimensional accuracy, among other factors, have hindered the technology's further adoption and application. Therefore, research into online monitoring technology for the additive manufacturing process is essential for overall process control and quality assurance.

[0004] Existing online detection methods for laser additive manufacturing generally include the following two types of detection: offline and online:

[0005] Offline inspection methods, such as microscopes and scanning electron microscopes, primarily focus on surface inspection, making it difficult to detect internal defects. Industrial metallographic cutting and other cutting methods perform destructive measurements, destroying the component's original morphology and resulting in low efficiency. Industrial CT scanning and ultrasonic testing can obtain internal information about workpieces and detect defects, but these methods can only be performed after the part is manufactured. These offline inspections are not feasible for online testing, making it difficult to integrate manufacturing and testing, impacting production efficiency.

[0006] In online detection methods, such as the existing Chinese patent (CN115861187A) for laser additive manufacturing, the schematic diagram of the laser deposition additive manufacturing online monitoring system of this application uses methods such as photography, scanning, and infrared sensing to melt and deposit powdered or filamentary materials in combination with a digital model, and uses three types of data matching: melt pool image data, melt pool temperature data, and 3D point cloud data. Specifically, high-speed cameras, infrared cameras, and laser 3D scanners are used to obtain online detection information. For example, a high-speed camera is used to collect melt pool image data; an infrared camera is used to collect melt pool temperature data; and a laser 3D scanner is used to collect 3D point cloud data of the workpiece shape.

[0007] The offline detection method not only destroys the workpiece structure, but also easily causes the workpiece to deform due to destructive detection, affecting the final measurement results; inspection based on online detection methods is costly. Summary of the Invention

[0008] This application proposes an additive manufacturing quality detection method and related devices, which are conducive to detecting abnormal areas in the part slice layer during the additive manufacturing process.

[0009] This application is implemented using the following technical solutions.

[0010] In a first aspect, an embodiment of the present application provides an additive manufacturing quality detection method, comprising: an industrial control computer acquiring an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, where the first time period is a time period during which a target slice layer of a target part is processed during the laser additive processing process, the optical signal comprising an output light signal of a laser in the first time period, and a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; the electrical signal corresponding to the optical signal comprising one or more of a first electrical signal corresponding to the output light signal, a second electrical signal corresponding to the laser reflection signal, a third electrical signal corresponding to the visible light signal, and a fourth electrical signal corresponding to the infrared light signal; and the industrial control computer determining that a defect exists in the target slice layer when one or more of the following conditions are met; the following conditions comprising:

[0011] The amplitude of the layer electrical signal corresponding to the outgoing light signal exceeds the first threshold range, the amplitude of the layer electrical signal corresponding to the laser reflection signal exceeds the second threshold range, the amplitude of the layer electrical signal corresponding to the visible light signal exceeds the third threshold range, and the amplitude of the layer electrical signal corresponding to the infrared light signal exceeds the fourth threshold range;

[0012] Among them, the layer electrical signal amplitude corresponding to the outgoing light signal is determined based on the first electrical signal in the first time period, and the layer electrical signal amplitude corresponding to the laser reflection signal is determined based on the second electrical signal in the first time period; the layer electrical signal amplitude corresponding to the visible light signal is determined based on the third electrical signal in the first time period; and the layer electrical signal amplitude corresponding to the infrared light signal is determined based on the fourth electrical signal in the first time period.

[0013] During the process of machining a target slice layer of a target part, electrical signals corresponding to the emitted light signal, the laser reflected signal, the visible light signal, and the infrared light signal are acquired. Based on the acquired electrical signals corresponding to the emitted light signal, the laser reflected signal, the visible light signal, and the infrared light signal, it is determined whether the target slice layer has defects. While being able to detect abnormal areas in the slice layer of a part during additive machining, the method does not damage the part and is less costly than existing technologies.

[0014] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: the industrial control computer obtains the layer electrical signal amplitudes corresponding to multiple light output signals corresponding to multiple reference slicing layers respectively; the reference slicing layer is a defect-free slicing layer, and the processing parameters are the same as the processing parameters of the target slicing layer; the industrial control computer determines a first threshold range based on the layer electrical signal amplitudes corresponding to the multiple light output signals, and the upper limit and lower limit of the first threshold range are respectively the maximum value and the minimum value of the layer electrical signal amplitudes corresponding to the multiple light output signals.

[0015] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: the industrial control computer obtains the layer electrical signal amplitudes corresponding to multiple laser reflection signals corresponding to multiple reference slicing layers respectively; the reference slicing layer is a defect-free slicing layer, and the processing parameters are the same as the processing parameters of the target slicing layer; the industrial control computer determines a second threshold range based on the layer electrical signal amplitudes corresponding to the multiple laser reflection signals, and the upper limit and lower limit of the second threshold range are respectively the maximum value and the minimum value of the layer electrical signal amplitudes corresponding to the multiple laser reflection signals.

[0016] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: the industrial control computer obtains the layer electrical signal amplitudes corresponding to multiple visible light signals corresponding to multiple reference slicing layers; the reference slicing layer is a defect-free slicing layer, and the processing parameters are the same as the processing parameters of the target slicing layer; the industrial control computer determines a third threshold range based on the layer electrical signal amplitudes corresponding to the multiple visible light signals, and the upper limit and lower limit of the third threshold range are respectively the maximum value and the minimum value of the layer electrical signal amplitudes corresponding to the multiple visible light signals.

[0017] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: the industrial control computer obtains the layer electrical signal amplitudes corresponding to multiple infrared light signals corresponding to multiple reference slicing layers; the reference slicing layer is a defect-free slicing layer, and the processing parameters are the same as the processing parameters of the target slicing layer; the industrial control computer determines a fourth threshold range based on the layer electrical signal amplitudes corresponding to the multiple infrared light signals, and the upper limit and lower limit of the fourth threshold range are respectively the maximum value and the minimum value of the layer electrical signal amplitudes corresponding to the multiple infrared light signals.

[0018] In conjunction with the first aspect, in one possible implementation, the method of this embodiment further includes:

[0019] When the industrial control computer determines that there is a defect in the target slice layer, it constructs a trajectory amplitude map corresponding to the target slice layer based on the target electrical signal in the first time period. The outline of the trajectory amplitude map is the same as the outline of the target slice layer. The trajectory amplitude map includes multiple trajectory amplitude lines. The multiple trajectory amplitude lines correspond to the processing trajectory when processing the target slice layer. The amplitude represented by the trajectory amplitude line is the amplitude of the target electrical signal during the processing of the target slice layer; the industrial control computer divides the trajectory amplitude map into multiple image blocks; the industrial control computer determines the average electrical signal amplitude corresponding to each image block in the multiple image blocks; the industrial control computer obtains a first ratio for each image block based on the electrical signal amplitude corresponding to each image block and the layer electrical signal amplitude corresponding to the target electrical signal. The first ratio of each image block is the ratio of the average electrical signal amplitude corresponding to each image block to the layer electrical signal amplitude corresponding to the target electrical signal; the industrial control computer determines the abnormal area of ​​the target slice layer according to the first ratio of each image block.

[0020] The abnormal region of the target slice layer is a region corresponding to an image block in the plurality of image blocks whose first ratio exceeds a ratio threshold range corresponding to a target electrical signal. The target electrical signal is any one of a first electrical signal in a first time period, a second electrical signal in a first time period, a third electrical signal in a first time period, and a fourth electrical signal in a first time period.

[0021] By dividing the constructed trajectory amplitude map into blocks, the average electrical signal amplitude of the resulting image blocks is used to determine the defective areas in the target slice layer, that is, the abnormal areas. This method further determines the defective areas in the target slice layer, facilitating subsequent reprocessing to eliminate the defective areas.

[0022] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: the industrial control computer obtains the position information of the abnormal area of ​​the target slice layer, and the industrial control computer transmits the position information of the abnormal area of ​​the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer.

[0023] In conjunction with the first aspect, in one possible implementation, the above-mentioned layer electrical signal amplitude is a layer average electrical signal amplitude, and the electrical signal amplitude corresponding to each image block is an average electrical signal amplitude of each image block;

[0024] or,

[0025] The above-mentioned layer electrical signal amplitude is determined by weighted summing the electrical signal amplitudes of all points in the layer, and the electrical signal amplitude corresponding to each image block is determined by weighted summing the electrical signal amplitudes of all points in each image block.

[0026] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: the industrial control computer displays at least one of the curves of the first electrical signal, the curve of the second electrical signal, the curve of the third electrical signal, and the curve of the fourth electrical signal in the first time period; and displays the result of whether there is a defect in the target slice layer.

[0027] By displaying the above curves and the results of whether there are defects, processing personnel can easily know whether there are defects in the target slice layer and the changes in each electrical signal curve.

[0028] In conjunction with the first aspect, in one possible implementation, the method of this embodiment further includes: displaying a trajectory amplitude map corresponding to the target slice layer; and displaying the abnormal region of the target slice layer on the trajectory amplitude map corresponding to the target slice layer. This allows processing personnel to identify the specific region of the target slice layer that has a defect, facilitating subsequent reprocessing.

[0029] In a second aspect, an embodiment of the present application provides an industrial computer, comprising an acquisition unit, a display unit, a determination unit, a construction unit, a division unit, and a sending unit. The acquisition unit, display unit, determination unit, construction unit, division unit, and sending unit are configured to implement any of the methods provided in the first aspect.

[0030] In a third aspect, an embodiment of the present application provides an industrial control computer, comprising: a processor, the processor being connected to a memory, the memory being used to store a computer program, the processor being used to execute the computer program stored in the memory, so that the industrial control computer executes a method as provided in any one of the first aspects.

[0031] In a fourth aspect, an embodiment of the present application provides a laser processing control system, comprising a laser welding system, a sensor module, a signal processor and an industrial control computer, wherein the industrial control computer is used to execute the method provided in any one of the first aspects.

[0032] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program enables a computer to execute a method as provided in any one of the first aspects.

[0033] In a sixth aspect, an embodiment of the present application provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer is operable to enable the computer to execute the method described in the first aspect or the second aspect.

[0034] It is understandable that the industrial control computers described in the second and third aspects, the laser processing control system described in the fourth aspect, the computer storage medium described in the fifth aspect, or the computer program product described in the sixth aspect are all used to implement the method provided in any one of the first aspects. Therefore, the beneficial effects that can be achieved can be referenced to the beneficial effects of the corresponding methods and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] FIG1 is a schematic structural diagram of a laser additive manufacturing online detection system provided in an embodiment of the present application.

[0037] FIG2 is a schematic diagram of a process for additive manufacturing quality inspection provided in an embodiment of the present application.

[0038] FIG3 is a schematic diagram of the relationship between a processing trajectory and an electrical signal provided in an embodiment of the present application.

[0039] FIG4 is a trajectory amplitude diagram provided in an embodiment of the present application.

[0040] FIG5 is a schematic diagram of an electrical signal provided in an embodiment of the present application.

[0041] FIG6 is a schematic structural diagram of an industrial control computer provided in an embodiment of the present application.

[0042] FIG7 is a schematic structural diagram of another industrial control computer provided in an embodiment of the present application. DETAILED DESCRIPTION

[0043] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this invention.

[0044] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms of "a", "said" and "the" used in the embodiments of the present application, the accompanying drawings and the claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should be understood that the term "and / or" used herein is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the related objects before and after are in an "or" relationship. It should be understood that although the terms "first", "second" and similar words may be used in the embodiments of the present application, they do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "an" do not indicate a quantity limitation, but rather indicate the presence of at least one. The "multiple" involved in the embodiments of the present application refers to greater than or equal to two.

[0045] See Figure 1, which is a schematic diagram of the structure of a laser additive manufacturing online detection system provided in an embodiment of the present application. As shown in Figure 1, the system includes a laser 1, a field lens 2, a scanning galvanometer 3, a beam splitter 4, a sensor module 5, a signal processor 6, and an industrial control computer 7. The sensor module 5 is coaxially mounted in the scanning galvanometer system of the laser additive manufacturing equipment. The sensor module 5 is connected to the signal processor 6 via a signal line, and the signal processor 6 is connected to the industrial control computer 7 via a signal line. The signal processor 6 is also connected to the control system 8 of the laser additive manufacturing equipment via a signal line.

[0046] In this embodiment, the laser light generated by the laser 1 is first transmitted to the sensor module of the laser light signal of the sensor module 5 through the beam splitter 4. At the same time, the laser light generated by the laser 1 is also incident into the molding cavity 9 by the scanning galvanometer 3 and the field lens 2. The light radiation generated during the laser additive manufacturing process is transmitted to the sensor module 5 through the field lens 2, the scanning galvanometer 3 and the beam splitter 4. The sensor module 5 can realize photoelectric conversion and can convert light radiation signals of multiple wavelengths into electrical signals, including visible light (400-700nm), laser reflection (1060-1070nm), laser light (1060-1070nm). ) and infrared light (>1200nm); the electrical signal is transmitted to the signal processor 6 via the signal line, and the signal processor 6 performs relevant processing on the electrical signal, including signal amplification and filtering. After the signal processing, it is transmitted to the industrial control computer 7 via the signal line, and the industrial control computer 7 extracts and processes the corresponding characteristic values ​​of the signal, and compares it with the preset upper and lower thresholds and upper and lower ratio thresholds, so as to judge the processing quality of each slice layer in the additive manufacturing process. The industrial control computer 7 transmits the corresponding processing information to the control system 8 of the laser additive manufacturing equipment through the signal line and the signal processor 6, so as to adjust and optimize the process parameters of the additive manufacturing.

[0047] Optionally, the sensor module 5 includes at least one of a laser output signal sensor, a laser reflection signal sensor, a visible light signal sensor, and an infrared light signal sensor.

[0048] The laser wavelength generated by the laser 1 is 1070-1070nm, and the sensor module 5 can realize photoelectric conversion, specifically through a silicon photoelectric sensor; the sensor module 5 can perform photoelectric conversion on light of multiple wavelengths, including visible light (400-700nm), laser reflection (1070-1070nm), and infrared light (>1200nm); the signal processor 6 processes the electrical signal, including signal amplification and filtering, to increase the signal amplitude and reduce the signal noise; the industrial control computer 7 can further filter the signal, and then determine whether there is an abnormal area in the slice layer of the part based on the collected electrical signal. If there is an abnormal area, the position information of the abnormal area is obtained; the position information or other information of the abnormal area is transmitted to the control system 8 of the laser additive manufacturing equipment through the signal line and the signal processor 6, so that the control system controls the laser 1 or laser processing head or other components that control laser welding in the laser welding system to reprocess the abnormal area.

[0049] In laser processing applications, the infrared radiation signal corresponds to infrared radiation signals with wavelengths between 1250nm and 1700nm. The visible light radiation signal corresponds to visible light radiation signals with wavelengths between 400nm and 700nm. The laser processing reflection signal corresponds to the reflection signal of the processing laser during actual laser processing. For example, processing laser wavelengths include 915nm, 1064nm, and 1070nm. The wavelength of the processing laser is related to the actual wavelength of the laser used. In some environments, the suitable range of the infrared radiation signal can be extended beyond the 1250nm to 1700nm range. In some environments, the visible light radiation signal can be extended beyond the 400nm to 700nm range.

[0050] The solution of this application is described in detail below.

[0051] Referring to FIG2 , FIG2 is a flow chart of an additive manufacturing quality inspection method provided in an embodiment of the present application. As shown in FIG2 , the method includes:

[0052] S201. An industrial control computer obtains an electrical signal corresponding to an optical signal in a first period of time during a laser additive manufacturing process.

[0053] Among them, the first time period is the time period for processing the target slice layer of the target part during the laser additive processing process, and the optical signal includes the light output signal of the laser in the first time period, and the laser reflection signal, visible light signal and infrared light signal generated by the target slice layer in the first time period; the electrical signal corresponding to the optical signal includes one or more of the first electrical signal corresponding to the light output signal, the second electrical signal corresponding to the laser reflection signal, the third electrical signal corresponding to the visible light signal and the fourth electrical signal corresponding to the infrared light signal.

[0054] During the laser additive manufacturing process, the keyhole metal vapor generated radiates visible light, the molten pool radiates infrared light, and the laser reflected light not absorbed by the powder and the laser output signal are collected by the sensor module 5 and photoelectrically converted into electrical signals, including: obtaining the corresponding voltage value V0 through the laser output signal sensor, obtaining the corresponding voltage value V1 through the visible light signal sensor, obtaining the corresponding voltage value V2 through the laser reflection signal sensor, and obtaining the corresponding voltage value V3 through the infrared light signal sensor, and performing gain adjustment on the voltage values ​​V0, V1, V2, and V3 respectively to obtain the adjusted output electrical signals. During the process of machining the target slice layer of the target part, the first electrical signal corresponding to the output signal, the second electrical signal corresponding to the laser reflection signal, the third electrical signal corresponding to the visible light signal, and the fourth electrical signal corresponding to the infrared light signal can be obtained in the above manner.

[0055] S202. The industrial control computer determines the layer electrical signal amplitude corresponding to the optical signal based on the first electrical signal in the first time period; determines the layer electrical signal amplitude corresponding to the laser reflection signal based on the second electrical signal in the first time period; determines the layer electrical signal amplitude corresponding to the visible light signal based on the third electrical signal in the first time period; determines the layer electrical signal amplitude corresponding to the infrared light signal based on the fourth electrical signal in the first time period.

[0056] It should be understood that the layer electrical signal amplitude corresponding to the output light signal, the layer electrical signal amplitude corresponding to the laser reflection signal, the layer electrical signal amplitude corresponding to the visible light signal and the layer electrical signal amplitude corresponding to the infrared light signal can only be obtained in the above manner when needed.

[0057] It should be noted that the layer electrical signal amplitude referred to in this application is the layer average electrical signal amplitude or the weighted sum of the electrical signal amplitudes at all points in the layer. It should be understood that during the additive manufacturing process of a layer, the photoelectric sensor collects the electrical signal amplitude corresponding to the optical signal at the additive manufacturing points at a certain frequency, and for each layer, the electrical signal amplitude corresponding to multiple additive manufacturing points is collected. The following explanation uses the layer electrical signal amplitude as an example, where the layer average electrical signal amplitude is used.

[0058] It should be understood that the laser output signal sensor collects laser output signals at a certain frequency. During the first period of processing the target slice layer, the laser output signal sensor collects multiple first electrical signals, and the average of the multiple first electrical signals is the layer average electrical signal amplitude corresponding to the output signal. Optionally, after collecting the multiple first electrical signals, the multiple first electrical signals are gain-adjusted to obtain multiple adjusted first electrical signals. The average of the multiple adjusted first electrical signals is the layer average electrical signal amplitude corresponding to the output signal.

[0059] The laser reflection signal sensor collects laser reflection signals at a certain frequency. During the first period of processing the target slice layer, the laser reflection signal sensor collects multiple second electrical signals, the average of which is the layer average electrical signal amplitude corresponding to the laser reflection signal. Optionally, after collecting the multiple second electrical signals, the gain of the multiple second electrical signals is adjusted to obtain multiple adjusted second electrical signals. The average of the adjusted multiple second electrical signals is the layer average electrical signal amplitude corresponding to the laser emission signal.

[0060] The visible light signal sensor collects visible light signals at a certain frequency. During the first period of processing the target slice layer, the visible light signal sensor collects multiple third electrical signals, the average of which is the layer-average electrical signal amplitude corresponding to the visible light signal. Optionally, after collecting the multiple third electrical signals, the gain of the multiple third electrical signals is adjusted to obtain multiple adjusted third electrical signals. The average of the adjusted multiple third electrical signals is the layer-average electrical signal amplitude corresponding to the visible light signal.

[0061] The infrared light signal sensor collects infrared light signals at a certain frequency. During the first period of processing the target slice layer, the infrared light signal sensor collects multiple fourth electrical signals, the average of which is the layer-average electrical signal amplitude corresponding to the infrared light signal. Optionally, after collecting the multiple fourth electrical signals, the gain of the multiple fourth electrical signals is adjusted to obtain multiple adjusted fourth electrical signals. The average of the adjusted multiple fourth electrical signals is the layer-average electrical signal amplitude corresponding to the infrared light signal.

[0062] S203. When one or more of the following conditions are met: the amplitude of the layer electrical signal corresponding to the output light signal exceeds the first threshold range; the amplitude of the layer electrical signal corresponding to the laser reflection signal exceeds the second threshold range; the amplitude of the layer electrical signal corresponding to the visible light signal exceeds the third threshold range; and the amplitude of the layer electrical signal corresponding to the infrared light signal exceeds the fourth threshold range, the industrial control computer determines that there is a defect in the target slice layer.

[0063] Among them, the upper limit and lower limit of the first threshold range are respectively the maximum value and minimum value of the layer-average electrical signal amplitude corresponding to the light output signal in the process of processing a defect-free slicing layer under the same processing parameters. The upper limit and lower limit of the second threshold range are respectively the maximum value and minimum value of the layer-average electrical signal amplitude corresponding to the laser emission signal in the process of processing a defect-free slicing layer under the same processing parameters. The upper limit and lower limit of the third threshold range are respectively the maximum value and minimum value of the layer-average electrical signal amplitude corresponding to the visible light signal in the process of processing a defect-free slicing layer under the same processing parameters. The upper limit and lower limit of the fourth threshold range are respectively the maximum value and minimum value of the layer-average electrical signal amplitude corresponding to the infrared light signal in the process of processing a defect-free slicing layer under the same processing parameters.

[0064] In one example, the above-mentioned defects refer to the presence of pores, unfused holes, cracks or warping in the slice layer.

[0065] Specifically, the industrial control computer obtains layer-average electrical signal amplitudes corresponding to multiple optical output signals corresponding to multiple reference slice layers, where the reference slice layers are defect-free slice layers and the processing parameters used when processing the reference slice layers are the same as the processing parameters of the target slice layers. The industrial control computer determines a first threshold range based on the layer-average electrical signal amplitudes corresponding to the multiple optical output signals, where the upper and lower limits of the first threshold range are the maximum and minimum values, respectively, of the layer-average electrical signal amplitudes corresponding to the multiple optical output signals.

[0066] The industrial control computer obtains slice average electrical signal amplitudes corresponding to multiple laser reflection signals corresponding to the multiple reference slice layers. The industrial control computer determines a second threshold range based on the slice average electrical signal amplitudes corresponding to the multiple laser reflection signals, where the upper limit and lower limit of the second threshold range are the maximum value and the minimum value, respectively, of the slice average electrical signal amplitudes corresponding to the multiple laser reflection signals.

[0067] The industrial control computer obtains layer-average electrical signal amplitudes corresponding to multiple visible light signals corresponding to the multiple reference slice layers. The industrial control computer determines a third threshold range based on the layer-average electrical signal amplitudes corresponding to the multiple visible light signals, where the upper limit and lower limit of the third threshold range are the maximum value and the minimum value, respectively, of the layer-average electrical signal amplitudes corresponding to the multiple visible light signals.

[0068] The industrial control computer obtains slice-average electrical signal amplitudes corresponding to a plurality of infrared light signals corresponding to the plurality of reference slice layers. The industrial control computer determines a fourth threshold range based on the slice-average electrical signal amplitudes corresponding to the plurality of infrared light signals, where the upper limit and lower limit of the fourth threshold range are the maximum value and the minimum value, respectively, of the slice-average electrical signal amplitudes corresponding to the plurality of infrared light signals.

[0069] When the layer-average electrical signal amplitude corresponding to the outgoing light signal exceeds the first threshold range, the layer-average electrical signal amplitude corresponding to the laser reflection signal exceeds the second threshold range, the layer-average electrical signal amplitude corresponding to the visible light signal exceeds the third threshold range, and the layer-average electrical signal amplitude corresponding to the infrared light signal exceeds the fourth threshold range, the industrial control computer determines that there is a defect in the target slice layer.

[0070] In one possible implementation, when the layer-average electrical signal amplitude corresponding to the output light signal exceeds the first threshold range, the layer-average electrical signal amplitude corresponding to the laser reflection signal exceeds the second threshold range, the layer-average electrical signal amplitude corresponding to the visible light signal exceeds the third threshold range, and the layer-average electrical signal amplitude corresponding to the infrared light signal exceeds the fourth threshold range, the industrial control computer determines that there is a defect in the target slice layer.

[0071] When it is determined that the target slice layer has a defect, the industrial control computer determines the location information of the abnormal area of ​​the target slice layer in the following manner:

[0072] The industrial control computer constructs a trajectory amplitude graph corresponding to the target slice layer based on the target electrical signal of the first time period, where the target electrical signal is any one of the first electrical signal of the first time period, the second electrical signal of the first time period, the third electrical signal of the first time period, and the fourth electrical signal of the first time period. The contour of the trajectory amplitude graph corresponding to the target slice layer is the same as the contour of the target slice layer. The trajectory amplitude graph corresponding to the target slice layer includes multiple trajectory amplitude lines, and the multiple trajectory amplitude lines correspond to the processing trajectories in processing the target slice layer. The amplitude represented by the trajectory amplitude line is the amplitude of the target electrical signal in the process of processing the target slice layer.

[0073] During the laser additive manufacturing process, the model of the target part is preprocessed, that is, the three-dimensional model of the target part is sliced ​​and layered in the Z-axis direction according to the pre-set slice layer thickness, so as to obtain the contour data of each cross-section in the XY direction. Part (a) in Figure 3 shows the contour information of a slice layer of the target part model, where line segments ①-⑧ are the laser trajectories during the laser processing of the slice layer, and the arrows are the positions where the laser ends the light emission in each laser trajectory; Part (b) in Figure 3 shows the laser light emission signal and the generated light radiation signal (including laser reflection signal, visible light signal and infrared light signal) during the laser additive manufacturing process. After being collected by the sensor module 5 and converted into electrical signals through photoelectric conversion, the electrical signal change diagram corresponding to each laser trajectory of the slice layer is obtained after the signal processor 6 performs corresponding signal processing.

[0074] As shown in part (b) of Figure 3, the electrical signal amplitude interval L1-L2 corresponds to laser trajectory ①, the electrical signal amplitude interval L3-L4 corresponds to laser trajectory ②, the electrical signal amplitude interval L5-L6 corresponds to laser trajectory ③, the electrical signal amplitude interval L7-L8 corresponds to laser trajectory ④, the electrical signal amplitude interval L9-L10 corresponds to laser trajectory ⑤, the electrical signal amplitude interval L11-L12 corresponds to laser trajectory ⑥, the electrical signal amplitude interval L13-L14 corresponds to laser trajectory ⑦, and the electrical signal amplitude interval L15-L16 corresponds to laser trajectory ⑧.

[0075] FIG4 illustrates a trajectory amplitude diagram. The trajectory amplitude diagram illustrated in FIG4 includes multiple trajectory amplitude lines, each corresponding to the processing trajectory of the target slice layer. The trajectory amplitude line includes multiple pixel points, and the pixel values ​​of the pixel points are used to represent the amplitude of the target electrical signal at the corresponding moment during the processing of the target slice layer. Optionally, the industrial control computer displays the trajectory amplitude diagram corresponding to the target slice layer. The inspection personnel can know the amplitude of the target electrical signal at the corresponding moment through the pixel values ​​of the pixel points in the trajectory amplitude diagram.

[0076] The industrial control computer divides the trajectory amplitude map corresponding to the target slice layer into multiple image blocks. Optionally, the industrial control computer divides the trajectory amplitude map into multiple image blocks according to a preset method. Of course, the industrial control computer can also divide the trajectory amplitude map based on other rules.

[0077] It should be noted that for each image block, the electrical signal amplitude is determined by the average electrical signal amplitude of the image block or by taking the weighted sum of the electrical signal amplitudes of all points in the image block. The following explanation uses the example where the electrical signal amplitude corresponding to each image block is the average electrical signal amplitude corresponding to the image block.

[0078] Because the pixel values ​​of the pixels in the image block are used to represent the amplitude of the target electrical signal at the corresponding moment in the process of processing the target slice layer, the industrial control computer can determine the average electrical signal amplitude corresponding to each image block in the multiple image blocks; based on the average electrical signal amplitude corresponding to each image block and the average electrical signal amplitude of the layer corresponding to the target electrical signal, a first ratio of each image block is obtained, and the first ratio of each image block is the ratio of the average electrical signal amplitude corresponding to each image block to the average electrical signal amplitude of the layer corresponding to the target electrical signal; the industrial control computer determines the abnormal area of ​​the target slice layer based on the first ratio of each image block; wherein the abnormal area of ​​the target slice layer is the area corresponding to the image block in the multiple image blocks whose first ratio exceeds the ratio threshold range corresponding to the target electrical signal. In other words, the image block corresponding to the abnormal area of ​​the target slice layer meets the following preset condition: the first ratio of the image block exceeds the ratio threshold range corresponding to the target electrical signal.

[0079] Among them, when the target electrical signal is the first electrical signal, the threshold range corresponding to the target electrical signal is the above-mentioned first threshold range; when the target electrical signal is the second electrical signal, the threshold range corresponding to the target electrical signal is the above-mentioned second threshold range; when the target electrical signal is the third electrical signal, the threshold range corresponding to the target electrical signal is the above-mentioned third threshold range; when the target electrical signal is the fourth electrical signal, the threshold range corresponding to the target electrical signal is the above-mentioned fourth threshold range.

[0080] It should be understood that the image block corresponds to the area of ​​the target slice layer. Therefore, when determining the image block that meets the above preset conditions, the abnormal area of ​​the target slice layer, that is, the defective area, can be determined based on the image block that meets the above preset conditions.

[0081] It should be noted that the above process only determines one trajectory amplitude map based on one of the first electrical signal, the second electrical signal, the third electrical signal, and the fourth electrical signal in the first time period. The solution of the present application can also determine multiple corresponding trajectory amplitude maps based on multiple electrical signals of the first electrical signal, the second electrical signal, the third electrical signal, and the fourth electrical signal in the first time period. The industrial control computer processes each of the multiple trajectory amplitude maps in the above manner to obtain the average electrical signal amplitude corresponding to each image block in each trajectory amplitude map. Optionally, for multiple image blocks corresponding to the same area of ​​the target slice layer in the multiple trajectory amplitude maps, if at least one image block in the multiple image blocks meets the above preset conditions, the industrial control computer determines that the area corresponding to the multiple image blocks in the target slice layer is an abnormal area. Furthermore, if all of the multiple image blocks meet the above preset conditions, the industrial control computer determines that the area corresponding to the multiple image blocks in the target slice layer is an abnormal area.

[0082] It should be understood that since the image blocks of the target slice layer are obtained by dividing the trajectory amplitude map of the target slice layer according to a preset method, the image blocks correspond to the areas in the target slice layer. Therefore, after determining the abnormal area of ​​the target slice layer, the industrial control computer determines the position information of the abnormal area in the target slice layer based on the preset method.

[0083] In one possible implementation, the industrial control computer constructs multiple trajectory amplitude maps corresponding to the target electrical signals based on the target electrical signals corresponding to the multiple reference slice layers. The multiple trajectory amplitude maps correspond to the multiple reference slice layers. Each of the multiple trajectory amplitude maps is processed as follows:

[0084] Each trajectory amplitude map is divided according to a preset method to obtain multiple image blocks; the industrial control computer obtains the average electrical signal amplitude corresponding to the target electrical signal of each image block in the multiple image blocks, and determines the second ratio of each image block based on the average electrical signal amplitude corresponding to the target electrical signal of each image block and the corresponding layer average electrical signal amplitude. The second ratio of each image block is the ratio of the average electrical signal amplitude corresponding to the target electrical signal of each image block to the corresponding layer average electrical signal amplitude.

[0085] For multiple trajectory amplitude maps, the industrial computer can obtain second ratios of multiple image blocks (the multiple image blocks herein include image blocks obtained by dividing the multiple trajectory amplitude maps) in the above manner. The upper and lower limits of the ratio threshold range corresponding to the target electrical signal are the maximum and minimum values ​​of the second ratios of the multiple image blocks, respectively.

[0086] It should be understood that the preset manner used to divide the trajectory amplitude map when determining the ratio threshold range is the same as the preset manner used to divide the trajectory amplitude map when determining whether a target slice layer has a defect.

[0087] In one possible implementation, when the industrial control computer determines that there is an abnormal area in the target slice layer, it obtains the position information of the abnormal area in the target slice layer and transmits the position information of the abnormal area to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer, thereby eliminating the defects in the target slice layer.

[0088] In one feasible implementation, upon determining that an abnormal area exists in a target slice layer, the industrial control computer obtains the average electrical signal amplitude of the output light signal, the average electrical signal amplitude of the laser reflection signal, the average electrical signal amplitude of the visible light signal, and the average electrical signal amplitude of the infrared light signal corresponding to the abnormal area of ​​the target slice layer. The industrial control computer compares the average electrical signal amplitude of the output light signal, the average electrical signal amplitude of the laser reflection signal, the average electrical signal amplitude of the visible light signal, and the average electrical signal amplitude of the infrared light signal corresponding to the abnormal area with corresponding preset thresholds. Based on the comparison results, the industrial control computer sends an instruction to the additive manufacturing equipment control system to instruct the additive manufacturing equipment control system to adjust the output power of the laser. If the comparison result is that the number of electrical signals higher than the corresponding preset threshold is greater than the number of electrical signals lower than the corresponding preset threshold, it indicates that the reason for the existence of abnormal areas in the target slice layer may be that the output power of the laser is too high, and the indication information instructs the additive manufacturing equipment control system to reduce the output power of the laser; if the comparison result is that the number of electrical signals higher than the corresponding preset threshold is not greater than the number of electrical signals lower than the corresponding preset threshold, it indicates that the reason for the existence of abnormal areas in the target slice layer may be that the output power of the laser is too low, and the indication information instructs the additive manufacturing equipment control system to increase the output power of the laser.

[0089] After completing these adjustments, the industrial computer transmits the location information of the abnormal area to the additive manufacturing equipment control system. Based on the abnormal area's location information and the indication information, the control system controls the reprocessing of the abnormal area to eliminate the defects in the target slice layer. The subsequent slice layers are processed based on the adjusted optical power, thus preventing defects in subsequent slice layers.

[0090] In one possible implementation, the industrial computer displays at least one of the curves of the first electrical signal, the second electrical signal, the third electrical signal, and the fourth electrical signal during the first time period, along with the corresponding maximum and minimum values ​​of the layer-averaged electrical signal amplitude, as shown in FIG5 , where V+ and V- are the maximum and minimum values ​​of the layer-averaged electrical signal amplitude, respectively; and displays whether the target slice layer has defects.

[0091] Figure 5 illustrates the relationship between the number of layers and the electrical signal. Specifically, a single diagram illustrates the electrical signal corresponding to the target optical signal when processing multiple slice layers. Displaying the electrical signal, along with the maximum and minimum values ​​of the average electrical signal amplitude for each layer, allows the operator to determine if any abnormal areas exist within the processed slice layer.

[0092] In one possible implementation, the industrial control computer displays the trajectory amplitude map corresponding to the target slice layer, and when it is determined that there is a defect in the target slice layer, the industrial control computer displays the abnormal area of ​​the target slice layer on the trajectory amplitude map corresponding to the target slice layer, so that the inspection personnel know the location information of the abnormal area in the target slice layer.

[0093] It can be seen that in the solution of the present application, in the process of processing the target slice layer of the target part, the electrical signal corresponding to the light-emitting signal, the electrical signal corresponding to the laser reflection signal, the electrical signal corresponding to the visible light signal and the electrical signal corresponding to the infrared light signal are obtained; based on the acquired electrical signal corresponding to the light-emitting signal, the electrical signal corresponding to the laser reflection signal, the electrical signal corresponding to the visible light signal and the electrical signal corresponding to the infrared light signal, it is determined whether the target slice layer has defects. While being able to detect abnormal areas of the part slice layer during additive processing, compared with the existing technology, it will not damage the parts and the cost is low. When determining whether the target slice layer has defects, the constructed trajectory amplitude map is divided into blocks, and the area with defects in the target slice layer, that is, the abnormal area, is determined based on the average electrical signal amplitude of the image block obtained by the block division. In this way, the area with defects in the target slice layer is further determined, which facilitates the subsequent reprocessing of the defective area to eliminate the defective area.

[0094] Referring to FIG6 , an embodiment of the present application provides a schematic diagram of the structure of an industrial computer. As shown in FIG6 , the industrial computer 600 includes:

[0095] An acquisition unit 601 is configured to acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, where the first time period is a time period during which a target slice layer of a target part is processed during the laser additive manufacturing process. The optical signal includes an output light signal of a laser in the first time period, and a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period. The electrical signal corresponding to the optical signal includes one or more of a first electrical signal corresponding to the output light signal, a second electrical signal corresponding to the laser reflection signal, a third electrical signal corresponding to the visible light signal, and a fourth electrical signal corresponding to the infrared light signal.

[0096] A display unit 602 is configured to display at least one of a curve of the first electrical signal, a curve of the second electrical signal, a curve of the third electrical signal, and a curve of the fourth electrical signal in the first time period;

[0097] The determination unit 603 is used to determine that the target slice layer has a defect when the industrial control computer satisfies one or more of the following conditions: the layer average electrical signal amplitude corresponding to the outgoing light signal exceeds the first threshold range, the layer average electrical signal amplitude corresponding to the laser reflection signal exceeds the second threshold range, the layer average electrical signal amplitude corresponding to the visible light signal exceeds the third threshold range, and the layer average electrical signal amplitude corresponding to the infrared light signal exceeds the fourth threshold range; wherein the layer electrical signal amplitude corresponding to the outgoing light signal is determined based on the first electrical signal of the first time period, the layer electrical signal amplitude corresponding to the laser reflection signal is determined based on the second electrical signal of the first time period; the layer electrical signal amplitude corresponding to the visible light signal is determined based on the third electrical signal of the first time period; and the layer electrical signal amplitude corresponding to the infrared light signal is determined based on the fourth electrical signal of the first time period.

[0098] In one possible implementation, the acquisition unit 601 is further configured to acquire layer average electrical signal amplitudes corresponding to a plurality of optical output signals corresponding to a plurality of reference slice layers, respectively; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as those of the target slice layer;

[0099] The determination unit 603 is further configured to determine a first threshold range based on the layer average electrical signal amplitudes corresponding to the multiple output optical signals, wherein the upper limit and lower limit of the first threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to the multiple output optical signals.

[0100] In one possible implementation, the acquisition unit 601 is further configured to acquire layer average electrical signal amplitudes corresponding to a plurality of laser reflection signals corresponding to a plurality of reference slice layers, respectively; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as those of the target slice layer;

[0101] The determination unit 603 is further used to determine a second threshold range based on the layer average electrical signal amplitudes corresponding to multiple laser reflection signals, and the upper limit and lower limit of the second threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to multiple laser reflection signals.

[0102] In one possible implementation, the acquisition unit 601 is further configured to acquire layer average electrical signal amplitudes corresponding to a plurality of visible light signals corresponding to a plurality of reference slice layers, respectively; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as those of the target slice layer;

[0103] The determination unit 603 is further configured to determine a third threshold range based on the layer average electrical signal amplitudes corresponding to the multiple visible light signals, wherein the upper limit and lower limit of the third threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to the multiple visible light signals.

[0104] In one possible implementation, the acquisition unit 601 is further configured to acquire layer average electrical signal amplitudes corresponding to a plurality of infrared light signals corresponding to a plurality of reference slice layers, respectively; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as those of the target slice layer;

[0105] The determination unit 603 is also used to determine a fourth threshold range based on the layer average electrical signal amplitudes corresponding to multiple infrared light signals, and the upper and lower limits of the fourth threshold range are respectively the maximum and minimum values ​​of the layer average electrical signal amplitudes corresponding to multiple infrared light signals.

[0106] In conjunction with the first aspect, in one possible implementation, the industrial control computer 600 further includes:

[0107] a constructing unit 604 configured to construct, when the determining unit 603 determines that the target slice layer has a defect, a trajectory amplitude map corresponding to the target slice layer based on the target electrical signal in the first time period, wherein the contour of the trajectory amplitude map is the same as the contour of the target slice layer, the trajectory amplitude map includes a plurality of trajectory amplitude lines, the plurality of trajectory amplitude lines corresponding to processing trajectories when processing the target slice layer, and the amplitudes represented by the trajectory amplitude lines are the amplitudes of the target electrical signal during the processing of the target slice layer;

[0108] A division unit 605 is used to divide the trajectory amplitude map into multiple image blocks;

[0109] The determination unit 603 is also used for the industrial control computer to determine the average electrical signal amplitude corresponding to each image block in the multiple image blocks; the industrial control computer obtains a first ratio of each image block based on the electrical signal amplitude corresponding to each image block and the layer electrical signal amplitude corresponding to the target electrical signal, and the first ratio of each image block is the ratio of the electrical signal amplitude corresponding to each image block to the layer average electrical signal amplitude corresponding to the target electrical signal; and the abnormal area of ​​the target slice layer is determined according to the first ratio of each image block.

[0110] The abnormal region of the target slice layer is a region corresponding to an image block in the plurality of image blocks whose first ratio exceeds a ratio threshold range corresponding to a target electrical signal. The target electrical signal is any one of a first electrical signal in a first time period, a second electrical signal in a first time period, a third electrical signal in a first time period, and a fourth electrical signal in a first time period.

[0111] In a possible implementation, the acquiring unit 601 is further configured to acquire location information of an abnormal region of a target slice layer.

[0112] The Industrial Computer 600 also includes:

[0113] The sending unit 606 is configured to transmit the position information of the abnormal region of the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal region of the target slice layer based on the position information of the abnormal region of the target slice layer.

[0114] In a possible implementation, the above-mentioned layer electrical signal amplitude is the layer electrical signal amplitude, and the electrical signal amplitude corresponding to each image block is the electrical signal amplitude corresponding to the image block;

[0115] or,

[0116] The above-mentioned layer electrical signal amplitude is determined by weighted summing of the electrical signal amplitudes of all points in the layer, and the electrical signal amplitude corresponding to each image block is determined by weighted summing of the electrical signal amplitudes of all points in the image block.

[0117] In a possible implementation, the display unit 602 is further configured to display a result of whether the target slice layer has defects.

[0118] In a possible implementation, the display unit 602 is further configured to display a trajectory amplitude map corresponding to the target slice layer; and display an abnormal region of the target slice layer on the trajectory amplitude map corresponding to the target slice layer.

[0119] It should be noted that the above-mentioned units (acquisition unit 601, display unit 602, determination unit 603, construction unit 604, division unit 605 and sending unit 606) are used to perform the relevant steps of the above-mentioned method. For example, acquisition unit 601 is used to perform the relevant content of S201, determination unit 603 is used to perform the relevant content of S202, display unit 602, determination unit 603, construction unit 604, division unit 605 and sending unit 606 are used to perform the relevant content of S203. Each unit or module in the industrial control computer 600 can be individually or completely combined into one or more other units or modules to form a structure, or one (or some) of the units or modules can be further divided into multiple functionally smaller units or modules to form a structure, which can achieve the same operation without affecting the realization of the technical effects of the embodiments of the present invention. The above-mentioned units or modules are divided based on logical functions. In actual applications, the functions of one unit (or module) can also be implemented by multiple units (or modules), or the functions of multiple units (or modules) can be implemented by one unit (or module).

[0120] Based on the description of the above method and apparatus embodiments, please refer to FIG7 , which shows a schematic diagram of the structure of another industrial computer 700 provided in an embodiment of the present invention. The industrial computer 700 shown in FIG7 (which may specifically be a computer device) includes a memory 701, a processor 702, a communication interface 703, and a bus 704. The memory 701, processor 702, and communication interface 703 are interconnected via bus 704.

[0121] The memory 701 may be a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM).

[0122] The memory 701 can store programs. When the program stored in the memory 701 is executed by the processor 702, the processor 702 and the communication interface 703 are used to perform the various steps of the additive manufacturing quality inspection method of the embodiment of the present application.

[0123] The processor 702 can be a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), a graphics processing unit (GPU) or one or more integrated circuits to execute relevant programs to implement the functions required to be performed by the units in the industrial control computer 600 of the embodiment of the present application, or to execute the additive manufacturing quality detection method of the method embodiment of the present application.

[0124] The processor 702 may also be an integrated circuit chip with signal processing capabilities. During implementation, the various steps of the additive manufacturing quality inspection method of the present application may be completed by hardware integrated logic circuits or software instructions in the processor 702. The aforementioned processor 702 may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The various methods, steps, and logic block diagrams disclosed in the embodiments of the present application may be implemented or executed. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the method disclosed in conjunction with the embodiments of the present application may be directly implemented and executed by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. The software module may be located in a storage medium mature in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or the like. The storage medium is located in the memory 701, and the processor 702 reads the information in the memory 701 and combines its hardware to complete the functions required to be performed by the units included in the industrial control computer 700 of the embodiment of the present application, or executes the additive manufacturing quality detection method of the method embodiment of the present application.

[0125] The communication interface 703 uses a transceiver device such as, but not limited to, a transceiver to implement communication between the industrial computer 700 and other devices or a communication network. For example, data can be obtained through the communication interface 703.

[0126] The bus 704 may include a path for transmitting information between various components of the industrial computer 700 (eg, the memory 701 , the processor 702 , and the communication interface 703 ).

[0127] It should be noted that although the industrial computer 700 shown in FIG7 only shows a memory, a processor, and a communication interface, during specific implementation, those skilled in the art will understand that the industrial computer 700 also includes other components necessary for normal operation. Furthermore, those skilled in the art will understand that, depending on specific needs, the industrial computer 700 may also include hardware components that implement other additional functions. Furthermore, those skilled in the art will understand that the industrial computer 700 may only include the components necessary to implement the embodiments of the present application, and does not necessarily need to include all of the components shown in FIG7 .

[0128] An embodiment of the present application further provides a chip, which includes a processor and a data interface. The processor reads instructions stored in a memory through the data interface to implement the additive manufacturing quality detection method.

[0129] Optionally, as an implementation method, the chip may further include a memory, in which instructions are stored, and the processor is used to execute the instructions stored in the memory. When the instructions are executed, the processor is used to execute the additive manufacturing quality detection method.

[0130] An embodiment of the present application also provides a computer-readable storage medium, which stores instructions. When the computer-readable storage medium is executed on a computer or a processor, the computer or processor executes one or more steps in any of the above methods.

[0131] The present application also provides a computer program product comprising instructions, which, when executed on a computer or processor, causes the computer or processor to execute one or more steps in any of the above methods.

[0132] Those skilled in the art will appreciate that the functions described in conjunction with the various illustrative logic blocks, modules, and algorithm steps disclosed herein can be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions described in the various illustrative logic blocks, modules, and steps can be stored or transmitted as one or more instructions or codes on a computer-readable medium and executed by a hardware-based processing unit. Computer-readable media can include computer-readable storage media, which corresponds to tangible media, such as data storage media, or communication media including any media that facilitates the transfer of computer programs from one place to another (e.g., based on a communication protocol). In this manner, computer-readable media can generally correspond to (1) non-transitory tangible computer-readable storage media, or (2) communication media, such as signals or carrier waves. Data storage media can be any available media that can be accessed by one or more computers or one or more processors to retrieve instructions, codes, and / or data structures for implementing the techniques described in this application. A computer program product can include computer-readable media.

[0133] By way of example, and not limitation, such computer-readable storage media may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage, flash memory, or any other medium that can be used to store desired program code in the form of instructions or data structures and that can be accessed by a computer. Furthermore, any connection is properly referred to as a computer-readable medium. For example, if instructions are transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of medium. However, it should be understood that computer-readable storage media and data storage media do not include connections, carrier waves, signals, or other transient media, but are actually directed to non-transitory tangible storage media. As used herein, disk and disc include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), and Blu-ray disc, where disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0134] Instructions may be executed by one or more processors, such as one or more digital signal processors (DSPs), general-purpose microprocessors, application-specific integrated circuits (ASICs), field-programmable logic arrays (FPGAs), or other equivalent integrated or discrete logic circuits. Thus, the term "processor," as used herein, may refer to any of the aforementioned structures or any other structure suitable for implementing the techniques described herein. Additionally, in some aspects, the functionality described by the various illustrative logical blocks, modules, and steps described herein may be provided within dedicated hardware and / or software modules configured for encoding and decoding, or incorporated into a combined codec. Furthermore, the techniques may be fully implemented in one or more circuits or logic elements.

[0135] The techniques of this application can be implemented in a variety of devices or apparatuses, including wireless handsets, integrated circuits (ICs), or a set of ICs (e.g., a chipset). Various components, modules, or units are described herein to emphasize functional aspects of devices for performing the disclosed techniques, but they do not necessarily require implementation by different hardware units. In fact, as described above, the various units can be combined in coded hardware units in conjunction with appropriate software and / or firmware, or provided by interoperating hardware units (including one or more processors as described above).

[0136] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described systems, devices and units can refer to the specific descriptions of the corresponding steps in the aforementioned method embodiments and will not be repeated here.

[0137] It should be understood that in the description of this application, unless otherwise specified, " / " indicates that the objects associated with each other are in an "or" relationship. For example, A / B can mean A or B; where A and B can be singular or plural. Also, in the description of this application, unless otherwise specified, "multiple" means two or more than two. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or plural. In addition, to facilitate the clear description of the technical solutions of the embodiments of this application, in the embodiments of this application, words such as "first" and "second" are used to distinguish between identical or similar items with substantially the same functions and effects. Those skilled in the art will understand that words such as "first" and "second" do not limit the quantity or execution order, and words such as "first" and "second" do not necessarily mean different. At the same time, in the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner to facilitate understanding.

[0138] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. The mutual coupling, direct coupling, or communication connection shown or discussed can be through some interface, indirect coupling or communication connection of devices or units, and can be electrical, mechanical or other forms.

[0139] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0140] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware, or any combination thereof. When implemented using software, all or part of the embodiments may be implemented in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions according to the embodiments of the present application are generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted via the computer-readable storage medium. The computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via a wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) method. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or data center that includes one or more available media integrated therein. The available medium may be a read-only memory (ROM), a random access memory (RAM), a magnetic medium such as a floppy disk, a hard disk, a tape, a magnetic disk, or an optical medium such as a digital versatile disc (DVD), or a semiconductor medium such as a solid state disk (SSD).

[0141] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

[0142] The device embodiments described above are merely illustrative, wherein the units and modules described as separate components may or may not be physically separate. Furthermore, some or all of the units and modules may be selected based on actual needs to achieve the objectives of the present embodiment. Those skilled in the art can understand and implement the present invention without inventive effort.

[0143] The above is only a specific implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A method for detecting quality of additive manufacturing, characterized in that: The method comprises: Acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive processing process, wherein the optical signal includes an output light signal of a laser in the first time period, and a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; the electrical signal corresponding to the optical signal includes one or more of a first electrical signal corresponding to the output light signal, a second electrical signal corresponding to the laser reflection signal, a third electrical signal corresponding to the visible light signal, and a fourth electrical signal corresponding to the infrared light signal; When one or more of the following conditions are met, it is determined that the target slice layer has a defect; the following conditions include: The amplitude of the layer electrical signal corresponding to the output optical signal exceeds a first threshold range; The layer electrical signal amplitude corresponding to the laser reflection signal exceeds a second threshold range; The amplitude of the layer electrical signal corresponding to the visible light signal exceeds a third threshold range, and The amplitude of the layer electrical signal corresponding to the infrared light signal exceeds a fourth threshold range; Among them, the layer electrical signal amplitude corresponding to the light output signal is determined based on the first electrical signal in the first time period, and the layer electrical signal amplitude corresponding to the laser reflection signal is determined based on the second electrical signal in the first time period; the layer electrical signal amplitude corresponding to the visible light signal is determined based on the third electrical signal in the first time period; and the layer electrical signal amplitude corresponding to the infrared light signal is determined based on the fourth electrical signal in the first time period.

2. The method according to claim 1, characterized in that: The method further comprises: Acquire layer electrical signal amplitudes corresponding to a plurality of light output signals respectively corresponding to a plurality of reference slice layers; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer; The first threshold range is determined based on the amplitudes of the layer electrical signals corresponding to the multiple output light signals, and the upper limit and the lower limit of the first threshold range are respectively the maximum value and the minimum value of the amplitudes of the layer electrical signals corresponding to the multiple output light signals.

3. The method according to claim 1, characterized in that The method further comprises: Acquiring layer electrical signal amplitudes corresponding to a plurality of laser reflection signals respectively corresponding to a plurality of reference slice layers; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer; The second threshold range is determined based on the layer electrical signal amplitudes corresponding to the multiple laser reflection signals, and the upper limit and lower limit of the second threshold range are respectively the maximum value and the minimum value of the layer electrical signal amplitudes corresponding to the multiple laser reflection signals.

4. The method according to claim 1, characterized in that The method further comprises: Acquiring layer electrical signal amplitudes corresponding to a plurality of visible light signals respectively corresponding to a plurality of reference slice layers; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer; The third threshold range is determined based on the slice electrical signal amplitudes corresponding to the multiple visible light signals, and the upper limit and the lower limit of the third threshold range are respectively the maximum value and the minimum value of the slice electrical signal amplitudes corresponding to the multiple visible light signals.

5. The method according to claim 1, characterized in that The method further comprises: Acquiring layer electrical signal amplitudes corresponding to a plurality of infrared signals respectively corresponding to a plurality of reference slice layers; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer; The fourth threshold range is determined based on the amplitudes of the layer electrical signals corresponding to the multiple infrared signals, and the upper limit and the lower limit of the fourth threshold range are respectively the maximum value and the minimum value of the amplitudes of the layer electrical signals corresponding to the multiple infrared signals.

6. The method according to any one of claims 1 to 5, characterized in that: When it is determined that the target slice layer has defects, the method further includes: constructing a trajectory amplitude map corresponding to a target slice layer based on a target electrical signal in the first period, wherein the target electrical signal is any one of a first electrical signal in the first period, a second electrical signal in the first period, a third electrical signal in the first period, and a fourth electrical signal in the first period, wherein an outline of the trajectory amplitude map is the same as an outline of the target slice layer, and wherein the trajectory amplitude map comprises a plurality of trajectory amplitude lines, wherein the plurality of trajectory amplitude lines correspond to processing trajectories when processing the target slice layer, and an amplitude represented by the trajectory amplitude line is an amplitude of the target electrical signal in the process of processing the target slice layer; Dividing the trajectory amplitude map into a plurality of image blocks; determining the electrical signal amplitude corresponding to each image block in the plurality of image blocks; obtaining a first ratio of each image block based on the electrical signal amplitude corresponding to each image block and the layer electrical signal amplitude corresponding to the target electrical signal, wherein the first ratio of each image block is a ratio of the electrical signal amplitude corresponding to each image block to the layer electrical signal amplitude corresponding to the target electrical signal; Determine an abnormal area of ​​the target slice layer according to the first ratio of each image block; The abnormal area of ​​the target slice layer is an area corresponding to an image block whose first ratio among the multiple image blocks exceeds a ratio threshold range corresponding to the target electrical signal.

7. The method according to claim 6, characterized in that The method further comprises: Obtaining the position information of the abnormal area of ​​the target slice layer, The position information of the abnormal area of ​​the target slice layer is transmitted to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer.

8. The method according to any one of claims 1 to 7, characterized in that: The layer electrical signal amplitude is the layer average electrical signal amplitude, and the electrical signal amplitude corresponding to each image block is the average electrical signal amplitude corresponding to each image block; or, The layer electrical signal amplitude is determined by weighted summing the electrical signal amplitudes of all points in the layer, and the electrical signal amplitude corresponding to each image block is determined by weighted summing the electrical signal amplitudes of all points in each image block.

9. The method according to any one of claims 1 to 5, characterized in that: The method further comprises: At least one of the curves of the first electrical signal, the second electrical signal, the third electrical signal and the fourth electrical signal in the first time period is displayed; and the result of whether the target slice layer has defects is displayed.

10. The method according to claim 6, characterized in that The method further comprises: The trajectory amplitude map corresponding to the target slice layer is displayed; and the abnormal area of ​​the target slice layer is displayed on the trajectory amplitude map corresponding to the target slice layer.

11. An industrial computer, characterized in that: include: an acquisition unit, configured to acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive processing process, wherein the optical signal includes an output light signal of a laser in the first time period, and a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; and the electrical signal corresponding to the optical signal includes one or more of a first electrical signal corresponding to the output light signal, a second electrical signal corresponding to the laser reflection signal, a third electrical signal corresponding to the visible light signal, and a fourth electrical signal corresponding to the infrared light signal; A display unit, configured to display at least one of a curve of the first electrical signal, a curve of the second electrical signal, a curve of the third electrical signal, and a curve of the fourth electrical signal in the first time period; A determining unit, configured to determine that the target slice layer has a defect when one or more of the following conditions are met; The following conditions include: The amplitude of the layer electrical signal corresponding to the output optical signal exceeds a first threshold range; The layer electrical signal amplitude corresponding to the laser reflection signal exceeds a second threshold range; The amplitude of the layer electrical signal corresponding to the visible light signal exceeds a third threshold range, and The amplitude of the layer electrical signal corresponding to the infrared light signal exceeds a fourth threshold range; Among them, the layer electrical signal amplitude corresponding to the light output signal is determined based on the first electrical signal, the layer electrical signal amplitude corresponding to the laser reflection signal is determined based on the second electrical signal; the layer electrical signal amplitude corresponding to the visible light signal is determined based on the third electrical signal; the layer electrical signal amplitude corresponding to the infrared light signal is determined based on the fourth electrical signal.

12. An industrial computer, characterized in that: It comprises a processor, the processor is connected to a memory, the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the industrial computer executes the method as described in any one of claims 1-10.

13. A laser processing control system, comprising: A laser welding system, a sensor module, a signal processor and an industrial control computer, wherein the industrial control computer is used to execute the method as described in any one of claims 1 to 10.

14. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement the method according to any one of claims 1 to 10.

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