Composition, adhesive agent, cured product manufacturing method, and cured product

Abstract

The present invention addresses the problem of providing a composition having a low viscosity and exhibiting excellent adhesive strength to various plastic films.　The present invention pertains to a composition comprising an alicyclic epoxy compound (A), a monofunctional epoxy compound (B), an oxetane compound (C), and a cationic polymerization initiator (D). The composition contains 50 parts by mass or more of the alicyclic epoxy compound (A) with respect to 100 parts by mass of the total amount of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C). The alicyclic epoxy compound (A) is preferably a compound (A1) having two or more alicyclic epoxy groups.

Description

Composition, adhesive, method for producing cured product, and cured product

[0001] The present invention relates to a composition containing an alicyclic epoxy compound, a monofunctional epoxy compound, an oxetane compound, and a cationic polymerization initiator, as well as an adhesive using the composition, a method for producing a cured product, and the cured product.

[0002] Compositions containing alicyclic epoxy compounds or oxetane compounds have been used in various fields, such as inks, paints, various coating agents, adhesives, optical components, etc. From the viewpoint of adhesive performance of the composition, examples of compositions using alicyclic epoxy compounds or oxetane compounds under predetermined conditions include Patent Documents 1 to 6.

[0003] US2004 / 218117 A1 JP 2008-257199 A International Publication No. 2021 / 132234 A1 US2021 / 047542 A1 JP 2020-011487 A JP 2020-056988 A

[0004] However, the compositions described in Patent Documents 1 to 6 do not have sufficient adhesive strength to various plastic films. In particular, there is a demand for compositions that have low viscosity and excellent adhesive strength to plastic films.

[0005] Therefore, an object of the present invention is to provide a composition that has excellent adhesive strength to various plastic films and has a low viscosity.

[0006] The inventors of the present invention have conducted extensive research to solve the above-mentioned problems. As a result, the present invention provides the following items [1] to

[10] . [1] A composition containing an alicyclic epoxy compound (A), a monofunctional epoxy compound (B), an oxetane compound (C), and a cationic polymerization initiator (D), wherein the alicyclic epoxy compound (A) is contained in an amount of 50 parts by mass or more per 100 parts by mass of the total amount of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C). [2] The composition according to [1], wherein the alicyclic epoxy compound (A) is a compound (A1) having two or more alicyclic epoxy groups. [3] The composition according to [1] or [2], wherein the monofunctional epoxy compound (B) is at least one selected from a compound represented by the following general formula (I) and a compound represented by the following general formula (II): (R in general formula (I) Ｂ１ represents an alkyl group having 1 to 20 carbon atoms or an alkoxy group having 1 to 20 carbon atoms, and Y in formula (I) １ represents a direct bond, an alkylene group having 1 to 20 carbon atoms, an oxyalkylene group having 1 to 20 carbon atoms, or a polyoxyalkylene group having 4 to 20 carbon atoms, and s represents a number from 0 to 5. (R in general formula (II) Ｂ２ represents an alkyl group having 1 to 20 carbon atoms, and Y in general formula (II) ２ represents an ether bond or an ester bond. [4] The monofunctional epoxy compound (B) is a compound represented by the above formula (I), and Y in the above general formula (I) １ [5] The composition according to any one of [1] to [3], wherein R is a branched alkylene group, a branched oxyalkylene group, or a branched polyoxyalkylene group. Ｂ２is a branched alkyl group. [6] The composition according to any one of [1] to [5], wherein the oxetane compound (C) is a polyfunctional oxetane compound (C2). [7] The composition according to any one of [1] to [6], wherein the cationic polymerization initiator (D) is a photocationic polymerization initiator (D1). [8] An adhesive containing the composition according to any one of [1] to [7]. [9] A method for producing a cured product, comprising at least one of a step of irradiating the composition according to any one of [1] to [7] with active energy rays and a step of heating the composition according to any one of [1] to [7].

[10] A cured product of the composition according to any one of [1] to [7].

[0007] The composition of the present invention can produce a cured product that has low viscosity and excellent adhesion to various plastic films.

[0008] 1. Composition The composition of the present invention will be described in detail below. <Alicyclic Epoxy Compound (A)> In the present disclosure, an alicyclic epoxy compound is a compound having at least one alicyclic epoxy group in its molecule, i.e., a compound having a cycloalkene oxide structure. It may have multiple alicyclic epoxy groups in one molecule, or may have an epoxy group other than an alicyclic epoxy group. Two or more of the above alicyclic epoxy compounds may be used in combination. Compounds having an aromatic ring also fall under the category of alicyclic epoxy compounds as long as they have an alicyclic epoxy group. The cycloalkene oxide structure is a structure in which an aliphatic ring and an epoxy ring share a portion of the ring structure, such as a cyclohexene oxide structure or a cyclopentene oxide structure obtained by epoxidizing a cyclohexene ring-containing compound or a cyclopentene ring-containing compound with an oxidizing agent.

[0009] Among the alicyclic epoxy compounds (A), examples of compounds having one alicyclic epoxy group, that is, compounds having one cycloalkene oxide structure, include 3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexylmethyl methacrylate, dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, and 1,2-epoxy-2-epoxyethylcyclohexane.

[0010] Furthermore, compounds having two alicyclic epoxy groups, i.e., compounds having two cycloalkene oxide structures, include compounds having a structure in which two cycloalkene oxide structures are condensed via a cycloalkane structure, and compounds having a structure in which two cycloalkene oxide structures are linked by a linking group. Specific examples of compounds having a structure in which two cycloalkene oxide structures are condensed via a cycloalkane structure include compounds represented by any of the following general formulas (1-1) to (1-4), and specific examples of compounds having a structure in which two cycloalkene oxide structures are linked by a linking group include compounds represented by the following general formula (1-5).

[0011]

[0012] In general formula (1-1), R １ , R ２ , R ３ , R ４ , R ５ , R ６ , R ７ , R ８ , R ９ and R １０ each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 20 carbon atoms, or an alkoxy group having 1 to 20 carbon atoms. １１ , R １２ , R １３ , R １４ , R １５ , R １６ , R １７ , R １８ , R １９ , R２０ , R ２１ , R ２２ , R ２３ , R ２４ , R ２５ and R ２６ each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 20 carbon atoms, or an alkoxy group having 1 to 20 carbon atoms. ３１ , R ３２ , R ３３ , R ３４ , R ３５ , R ３６ , R ３７ , R ３８ , R ３９ , R ４０ , R ４１ , R ４２ , R ４３ , R ４４ , R ４５ , R ４６ , R ４７ and R ４８ each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 20 carbon atoms, or an alkoxy group having 1 to 20 carbon atoms. ５１ , R ５２ , R ５３ , R ５４ , R ５５ , R ５６ , R ５７ , R ５８ , R ５９ , R ６０ , R ６１ , R ６２ , R ６３ , R ６４ , R ６５ , R ６６ , R ６７ and R ６８ each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 20 carbon atoms, or an alkoxy group having 1 to 20 carbon atoms. ７１ , R ７２ , R ７３ , R ７４ , R ７５ , R ７６ , R ７７ , R ７８ , R ７９ , R８０ , R ８１ , R ８２ , R ８３ , R ８４ , R ８５ , R ８６ , R ８７ and R ８８ each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 20 carbon atoms, or an alkoxy group having 1 to 20 carbon atoms, and X represents a direct bond, an alkylene group having 1 to 4 carbon atoms, a carbonyl group, an ether bond, an ester bond, an amide group, or a group in which two or more of these are linked together. In addition, two or more of the same type of group may be combined, such as an ester bond-alkylene group-ester bond-alkylene group.

[0013] R in the above general formula (1-1) １ ~R １０ , R in the above general formula (1-2) １１ ~R ２６ , R in the above general formula (1-3) ３１ ~R ４８ , R in the above general formula (1-4) ５１ ~R ６８ and R in the above general formula (1-5) ７１ ~R ８８ Examples of the halogen atom represented by the formula (I) include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

[0014] R in the above general formula (1-1) １ ~R １０ , R in the above general formula (1-2) １１ ~R ２６ , R in the above general formula (1-3) ３１ ~R ４８ , R in the above general formula (1-4) ５１ ~R ６８ and R in the above general formula (1-5) ７１ ~R ８８Examples of the alkyl group having 1 to 20 carbon atoms represented by the formula (I) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a sec-butyl group, a tert-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a tert-pentyl group, a hexyl group, a 2-hexyl group, a 3-hexyl group, a heptyl group, a 2-heptyl group, a 3-heptyl group, an isoheptyl group, a tert-heptyl group, an octyl group, and an isooctyl group. group, tert-octyl group, 2-ethylhexyl group, nonyl group, isononyl group, decyl group, n-undecyl group, 1-methyldecyl group, n-dodecyl group, 4-ethyloctyl group, 1,3,5,7-tetramethyloctyl group, tridecyl group, 1-hexylheptyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, and n-eicosyl group.

[0015] R in the above general formula (1-1) １ ~R １０ , R in the above general formula (1-2) １１ ~R ２６ , R in the above general formula (1-3) ３１ ~R ４８ , R in the above general formula (1-4) ５１ ~R ６８ and R in the above general formula (1-5) ７１ ~R ８８Examples of the alkoxy group having 1 to 20 carbon atoms represented by the formula (I) include a methoxy group, an ethoxy group, a propoxy group, a butoxy group, an isobutoxy group, a sec-butoxy group, a tert-butoxy group, an allyloxy group, an isoallyloxy group, a tert-allyloxy group, a hexyloxy group, a heptyloxy group, an octyloxy group, an isooctyloxy group, a 2-ethylhexyloxy group, a tert-octyloxy group, a nonyloxy group, an isononyloxy group, a decyloxy group, a methyl ... Examples of the octyloxy group include an n-octyloxy group, an isodecyloxy group, an n-undecyloxy group, a 1-methyldecyloxy group, an n-dodecyloxy group, a 4-ethyloctyloxy group, a 1,3,5,7-tetramethyloctyloxy group, an n-tridecyloxy group, a 1-hexylheptyloxy group, an n-tetradecyloxy group, an n-pentadecyloxy group, an n-hexadecyloxy group, an n-heptadecyloxy group, an n-octadecyloxy group, and an n-eicosyloxy group.

[0016] Examples of the alkylene group having 1 to 4 carbon atoms represented by X in the general formula (1-5) include groups in which one hydrogen atom has been removed from an alkyl group having 1 to 4 carbon atoms. Specific examples include a methylene group, an isopropylidene group, an ethylene group, a trimethylene group, and a tetramethylene group. When X is a group in which multiple groups selected from alkylene groups having 1 to 4 carbon atoms, carbonyl groups, ether bonds, ester bonds, carbonate groups, and amide groups are linked together, the total number of carbon atoms in X can be 2 or more and 20 or less.

[0017] Examples of methods for producing the compounds represented by the general formulas (1-1) to (1-5) include the production method described in JP 2019-189844 A. Examples of commercially available compounds represented by the general formula (1-1) include THI-DE (manufactured by ENEOS Corporation). Examples of commercially available compounds represented by the general formula (1-2) include DE-102 (manufactured by ENEOS Corporation). Examples of commercially available compounds represented by the general formula (1-3) include DE-103 (manufactured by ENEOS Corporation). Examples of commercially available compounds represented by the general formula (1-5) include CELLOXIDE 2021P and CELLOXIDE 8000 (manufactured by Daicel Corporation).

[0018] In the present disclosure, the number of reactive groups in the alicyclic epoxy compound (A) is preferably two or more, since this results in a composition with excellent adhesion to various plastic films. The reactive group here refers to an epoxy group, an acrylic group, a methacrylic group, or a vinyl group, with an epoxy group being preferred. Among these, it is more preferred that the alicyclic epoxy compound (A) is a compound (A1) having two or more alicyclic epoxy groups.

[0019] Of the compounds (A1) having two or more alicyclic epoxy groups, compounds having two alicyclic epoxy groups are particularly preferred, as they result in a composition having low viscosity and excellent adhesion to various plastic films.

[0020] In the present disclosure, the alicyclic epoxy compound (A1) preferably contains at least one compound represented by a chemical formula selected from the general formulas (1-1), (1-2), (1-3), (1-4), and (1-5), and more preferably contains at least one compound represented by a chemical formula selected from the general formulas (1-1) and (1-5), in order to provide a composition having excellent adhesion to various plastic films.

[0021] Since the composition has excellent adhesiveness to various plastic films, R １ ~R １０, R in the above general formula (1-2) １１ ~R ２６ , R in the above general formula (1-3) ３１ ~R ４８ , R in the above general formula (1-4) ５１ ~R ６８ and R in the above general formula (1-5) ７１ ~R ８８ are each independently preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and particularly preferably a hydrogen atom. In order to obtain a composition having excellent adhesion to various plastic films, X in the above general formula (1-5) is preferably a direct bond, an alkylene group having 1 to 4 carbon atoms, an ester bond, or a group in which an alkylene group having 1 to 4 carbon atoms is linked to an ester bond, more preferably a direct bond or a group in which an alkylene group having 1 to 4 carbon atoms is linked to an ester bond, and particularly preferably a group in which an alkylene group having 1 to 2 carbon atoms is linked to an ester bond.

[0022] In order to obtain a composition having excellent adhesion to various plastic films, the molecular weight of the alicyclic epoxy compound (A) is preferably 100 or more and 400 or less, more preferably 120 or more and 350 or less, and particularly preferably 150 or more and 300 or less.

[0023] In the present disclosure, in order to obtain a composition having excellent adhesion to various plastic films, the content of the alicyclic epoxy compound (A) needs to be 50 parts by mass or more, more preferably 50 to 90 parts by mass, and particularly preferably 60 to 85 parts by mass, relative to 100 parts by mass of the total amount of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C).

[0024] In the present disclosure, since a composition having excellent adhesion to various plastic films is obtained, the alicyclic epoxy compound (A) preferably contains 70% by mass or more and 100% by mass or less of the compound (A1) having two or more alicyclic epoxy groups, more preferably 80% by mass or more and 100% by mass or less, and particularly preferably 90% by mass or more and 100% by mass or less. In particular, the proportion of the compound represented by formula (1-1) or formula (1-5) in the alicyclic epoxy compound (A) is preferably 70% by mass or more and 100% by mass or less, more preferably 80% by mass or more and 100% by mass or less, and particularly preferably 90% by mass or more and 100% by mass or less.

[0025] In order to obtain a composition having excellent adhesion to various plastic films, the content of the alicyclic epoxy compound (A) in the composition is preferably from 15% by mass to 95% by mass, more preferably from 20% by mass to 95% by mass, even more preferably from 45% by mass to 95% by mass, still more preferably from 50% by mass to 90% by mass, and particularly preferably from 55% by mass to 85% by mass.

[0026] In order to obtain a composition having excellent adhesion to various plastic films, the content of the alicyclic epoxy compound (A) is preferably 15% by mass or more and 95% by mass or less, more preferably 20% by mass or more and 95% by mass or less, even more preferably 45% by mass or more and 95% by mass or less, still more preferably 50% by mass or more and 90% by mass or less, and particularly preferably 55% by mass or more and 85% by mass or less, of the solid content of the composition. In this specification, the solid content of the composition refers to the total amount of components excluding the solvent.

[0027] <Monofunctional Epoxy Compound (B)> The monofunctional epoxy compound (B) is a compound having only one epoxy group and no alicyclic epoxy group.

[0028] In the present disclosure, the monofunctional epoxy compound (B) is preferably at least one compound represented by a chemical formula selected from the following general formulas (2-1) and (2-2), since this results in a composition having excellent adhesion to various plastic films.

[0029] R in general formula (2-1) Ｂ１ represents an alkyl group having 1 to 20 carbon atoms or an alkoxy group having 1 to 20 carbon atoms. １ represents a direct bond, an alkylene group having 1 to 20 carbon atoms, an oxyalkylene group having 1 to 20 carbon atoms, or a polyoxyalkylene group having 4 to 20 carbon atoms. s represents a number from 0 to 5.

[0030] R in general formula (2-2) Ｂ２ represents an alkyl group having 1 to 20 carbon atoms. ２ represents an ether bond or an ester bond.

[0031] R in general formula (2-1) Ｂ１ and R in general formula (2-2) Ｂ２ Examples of the alkyl group having 1 to 20 carbon atoms represented by the formula (I) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a sec-butyl group, a tert-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a tert-pentyl group, a hexyl group, a 2-hexyl group, a 3-hexyl group, a heptyl group, a 2-heptyl group, a 3-heptyl group, an isoheptyl group, a tert-heptyl group, an octyl group, and an isooctyl group. group, tert-octyl group, 2-ethylhexyl group, nonyl group, isononyl group, decyl group, n-undecyl group, 1-methyldecyl group, n-dodecyl group, 4-ethyloctyl group, 1,3,5,7-tetramethyloctyl group, tridecyl group, 1-hexylheptyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, and n-eicosyl group.

[0032] R in general formula (2-1) Ｂ１Examples of the alkoxy group having 1 to 20 carbon atoms represented by the formula (I) include a methoxy group, an ethoxy group, a propoxy group, a butoxy group, an isobutoxy group, a sec-butoxy group, a tert-butoxy group, a hexyloxy group, a heptyloxy group, an octyloxy group, an isooctyloxy group, a 2-ethylhexyloxy group, a tert-octyloxy group, a nonyloxy group, an isononyloxy group, a decyloxy group, an isodecyloxy group, an n-undecyloxy group, a 1-methyldecyloxy group, an n-dodecyloxy group, a 4-ethyloctyloxy group, a 1,3,5,7-tetramethyloctyloxy group, an n-tridecyloxy group, a 1-hexylheptyloxy group, an n-tetradecyloxy group, an n-pentadecyloxy group, an n-hexadecyloxy group, an n-heptadecyloxy group, an n-octadecyloxy group, and an n-eicosyloxy group.

[0033] Y in general formula (2-1) １ Examples of the alkylene group having 1 to 20 carbon atoms represented by the formula (I) include a methylene group, an ethylene group, an n-propylene group, an isopropylene group, an n-butylene group, a sec-butylene group, a tert-butylene group, an n-propylene group, a 1-methylbutylene group, a 2-methylbutylene group, a 3-methylbutylene group, a 1,1-dimethylpropylene group, an n-hexylene group, an isohexylene group, a sec-hexylene group, a tert-hexylene group, an n Examples of the alkylene group include a 1-heptylene group, a 2-heptylene group, a 3-heptylene group, an n-octylene group, a 2-ethylhexylene group, an n-nonylene group, a decylene group, an n-undecylene group, a 1-methyldecylene group, an n-dodecylene group, a 4-ethyloctylene group, a 1-hexylheptylene group, an n-tetradecylene group, an n-pentadecylene group, an n-hexadecylene group, an n-heptadecylene group, an n-octadecylene group, and an n-eicosylene group.

[0034] Y in general formula (2-1) １Examples of the oxyalkylene group having 1 to 20 carbon atoms represented by the formula (I) include an oxymethylene group, an oxyethylene group, an n-oxypropylene group, an oxyisopropylene group, an n-oxybutylene group, an oxyisobutylene group, an oxysec-butylene group, an oxytert-butylene group, an oxy-n-propylene group, an oxy1-methylbutylene group, an oxy2-methylbutylene group, an oxy3-methylbutylene group, an oxy1,1-dimethylpropylene group, an n-oxyhexylene group, an n-oxyheptylene group, an n-oxyoctylene group, an n-oxynonylene group, an oxydecylene group, an n-oxyundecylene group, an n-oxydodecylene group, an n-oxytetradecylene group, an n-oxypentadecylene group, an n-oxyhexadecylene group, an n-oxyheptadecylene group, an n-oxyoctadecylene group, and an n-oxyeicosylene group.

[0035] Y in general formula (2-1) １ Examples of polyoxyalkylene groups having 4 to 20 carbon atoms and represented by the formula (2-1-1) include groups in which multiple oxyalkylene groups are bonded to each other to form a group having 4 to 20 carbon atoms, and are groups represented by the following general formula (2-1-1): １ -(O-R B3 ) ｋ -*2 (2-1-1) (wherein, * １ is a bond attached to the benzene ring, and * ２ is a bond bonded to the oxygen atom. k is a number of 2 or more. R B３ is an alkylene group having 2 to 4 carbon atoms.

[0036] In the present disclosure, s is preferably 0 to 3, more preferably 0 to 2, and particularly preferably 0 to 1, in order to provide a composition with excellent adhesion to various plastic films.

[0037] In the present disclosure, the composition has excellent adhesiveness to various plastic films, and therefore, R Ｂ１is preferably an alkyl group having 1 to 10 carbon atoms or an alkoxy group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, and particularly preferably an alkyl group having 1 to 5 carbon atoms.

[0038] In the present disclosure, the composition has excellent adhesiveness to various plastic films, and therefore, Y １ is preferably a single bond, an alkylene group having 1 to 10 carbon atoms, an oxyalkylene group having 1 to 10 carbon atoms, or a polyoxyalkylene group having 4 to 10 carbon atoms, more preferably a single bond, an alkylene group having 1 to 6 carbon atoms, an oxyalkylene group having 1 to 6 carbon atoms, or a polyoxyalkylene group having 4 to 10 carbon atoms, and particularly preferably an oxyalkylene group having 2 to 5 carbon atoms, or a polyoxyalkylene group having 4 to 10 carbon atoms.

[0039] In the present disclosure, the composition has excellent adhesiveness to various plastic films, and therefore, Y １ is preferably a branched alkylene group, an oxyalkylene group or a polyoxyalkylene group, and in particular, Y １ is more preferably a branched alkylene group, a branched oxyalkylene group or a branched polyoxyalkylene group, and even more preferably a branched oxyalkylene group or a branched polyoxyalkylene group. B３ is a branched alkylene group.

[0040] In the present disclosure, the composition has excellent adhesiveness to various plastic films, and therefore, R Ｂ２ is preferably an alkyl group having 4 to 20 carbon atoms, and more preferably an alkyl group having 6 to 18 carbon atoms.

[0041] In the present disclosure, R Ｂ２ is preferably a branched alkyl group.

[0042] In the present disclosure, among the monofunctional epoxy compounds (B), R Ｂ２ It is particularly preferred that is a branched alkyl group.

[0043] In the present disclosure, since the composition has excellent adhesion to various plastic films, the monofunctional epoxy compound (B) is preferably contained in an amount of 1 to 45 parts by mass, more preferably 1 to 40 parts by mass, even more preferably 1 to 30 parts by mass, still more preferably 3 to 25 parts by mass, and particularly preferably 5 to 20 parts by mass, of 100 parts by mass of the total amount of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C).

[0044] In order to obtain a composition having excellent adhesion to various plastic films, the content of the monofunctional epoxy compound (B) in the composition is preferably 1% by mass or more and 30% by mass or less, more preferably 3% by mass or more and 25% by mass or less, and particularly preferably 3% by mass or more and 20% by mass or less.

[0045] Since the composition has excellent adhesion to various plastic films, the content of the monofunctional epoxy compound (B) is preferably 1% by mass or more and 30% by mass or less, more preferably 3% by mass or more and 25% by mass or less, and particularly preferably 3% by mass or more and 20% by mass or less, based on the solid content of the composition.

[0046] In the present disclosure, the monofunctional epoxy compound (B) is preferably Y because it provides a composition with excellent adhesion to various plastic films. １ is a branched alkylene group, a branched oxyalkylene group, or a branched polyoxyalkylene group, or Ｂ２ The epoxy resin preferably contains 70% by mass or more and 100% by mass or less, more preferably 80% by mass or more and 100% by mass or less, and particularly preferably 90% by mass or more and 100% by mass or less, of a monofunctional epoxy compound in which R is a branched alkyl group.

[0047] <Oxetane Compound (C)> In the present disclosure, the oxetane compound (C) refers to a compound having at least one oxetanyl group in the molecule and no epoxy group. Examples of the oxetane compound include monofunctional oxetane compounds and polyfunctional oxetane compounds. Two or more oxetane compounds may be used in combination.

[0048] <Monofunctional Oxetane Compound (C1)> The monofunctional oxetane compound refers to an oxetane compound having only one oxetanyl group in the molecule. Examples of the monofunctional oxetane compound include compounds represented by the following general formula (3-1):

[0049]

[0050] In the above general formula (3-1), R Ｃ１ represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms which may be substituted with a hydroxy group; R Ｃ２ represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.

[0051] R in the above general formula (3-1) Ｃ１ and R Ｃ２ Examples of the alkyl group having 1 to 10 carbon atoms represented by the formula (I) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a sec-butyl group, a tert-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a tert-pentyl group, a hexyl group, a 2-hexyl group, a 3-hexyl group, a heptyl group, a 2-heptyl group, a 3-heptyl group, an isoheptyl group, a tert-heptyl group, an octyl group, an isooctyl group, a tert-octyl group, a 2-ethylhexyl group, a nonyl group, an isononyl group, a decyl group, etc. In addition, one or more hydrogen atoms in the alkyl group may be substituted with a hydroxy group.

[0052] Since it is a composition with excellent adhesion to various plastic films, Ｃ１ is preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 5 carbon atoms, and particularly preferably an alkyl group having 1 to 3 carbon atoms.

[0053] Since it is a composition with excellent adhesion to various plastic films, Ｃ２ is preferably a hydrogen atom or an alkyl group having 3 to 10 carbon atoms, more preferably a hydrogen atom or an alkyl group having 5 to 10 carbon atoms, and particularly preferably a hydrogen atom or an alkyl group having 6 to 9 carbon atoms.

[0054] Specific examples of the compound represented by the general formula (3-1) include 3-ethyl-3-hydroxymethyloxetane (oxetane alcohol), 3-ethyl-3-(methoxymethyl)oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, and 3-ethyl-3-(cyclohexyloxymethyl)oxetane.

[0055] Commercially available products of the monofunctional oxetane compound include Aron Oxetane OXT-101 and Aron Oxetane OXT-212 (manufactured by Toagosei Co., Ltd.), EHO, and HBOX (manufactured by UBE Co., Ltd.).

[0056] <Polyfunctional Oxetane Compound (C2)> The polyfunctional oxetane compound refers to an oxetane compound having two or more oxetanyl groups in the molecule. Examples of the compound having two oxetanyl groups include a compound represented by the following general formula (3-2):

[0057]

[0058] In the above general formula (3-2), R Ｃ３ and R Ｃ４ each independently represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms which may be substituted with a hydroxy group; Z １ represents an alkylene group having 2 to 20 carbon atoms or an aromatic ring-containing group having 8 to 20 carbon atoms; and n represents an integer of 0 to 3.

[0059] R in the above general formula (3-2) Ｃ３ and R Ｃ４Examples of the alkyl group having 1 to 10 carbon atoms represented by the formula (I) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a sec-butyl group, a tert-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a tert-pentyl group, a hexyl group, a 2-hexyl group, a 3-hexyl group, a heptyl group, a 2-heptyl group, a 3-heptyl group, an isoheptyl group, a tert-heptyl group, an octyl group, an isooctyl group, a tert-octyl group, a 2-ethylhexyl group, a nonyl group, an isononyl group, a decyl group, etc. Furthermore, one or more hydrogen atoms in the alkyl group may be substituted with a hydroxy group.

[0060] Z in the above general formula (3-2) １ Examples of the alkylene group having 2 to 20 carbon atoms represented by the formula (3-2) include an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group, an n-heptylene group, a 2-heptylene group, a 3-heptylene group, an n-octylene group, a 2-ethylhexylene group, an n-nonylene group, a decylene group, an n-undecylene group, a 1-methyldecylene group, an n-dodecylene group, a 4-ethyloctylene group, a 1-hexylheptylene group, an n-tetradecylene group, an n-pentadecylene group, an n-hexadecylene group, an n-heptadecylene group, an n-octadecylene group, and an n-eicosylene group. １ Examples of the aromatic ring-containing group having 8 to 20 carbon atoms represented by the formula (3-1) include groups represented by a chemical formula selected from the following formulas (3-3), (3-4), (3-5) and (3-6).

[0061] (* indicates a bond.)

[0062] Specific examples of the compound represented by the general formula (3-2) include 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 3-ethyl-3-(3-ethyl-3-oxetanylmethyloxymethyl)oxetane, xylylene bisoxetane, bis[(3-ethyl-3-oxetanyl)methyl]isophthalate, and 4,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl.

[0063] In the present disclosure, n is preferably 0 to 3, more preferably 0 to 2, and particularly preferably 0 to 1, in order to provide a composition with excellent adhesion to various plastic films.

[0064] Commercially available products of the polyfunctional oxetane compound include Aronoxetane OXT-121 and OXT-221 (manufactured by Toagosei Co., Ltd.), OXBP, and OXIPA (manufactured by UBE Co., Ltd.).

[0065] The oxetane compound (C) is preferably a polyfunctional oxetane compound (C2), more preferably a compound having two oxetanyl groups, in order to provide a composition with low viscosity and excellent adhesion to various plastic films.

[0066] Since the composition has excellent adhesion to various plastic films, it preferably contains 1 to 45 parts by mass, more preferably 3 to 45 parts by mass, and particularly preferably 5 to 40 parts by mass of the oxetane compound (C) relative to 100 parts by mass of the total amount of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C).

[0067] In order to obtain a composition having excellent adhesion to various plastic films, the oxetane compound (C) preferably contains the polyfunctional oxetane compound (C2) in an amount of 70% by mass or more and 100% by mass or less, more preferably 80% by mass or more and 100% by mass or less, and particularly preferably 90% by mass or more and 100% by mass or less.

[0068] In order to obtain a composition having excellent adhesion to various plastic films, the content of the oxetane compound (C) in the composition is preferably 1% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 45% by mass or less, and particularly preferably 3% by mass or more and 40% by mass or less.

[0069] In order to obtain a composition having excellent adhesion to various plastic films, the content of the oxetane compound (C) is preferably from 1 to 50% by mass, more preferably from 1 to 45% by mass, and particularly preferably from 3 to 40% by mass, of the solid content of the composition.

[0070] <Cationic Polymerization Initiator (D)> In the present disclosure, the cationic polymerization initiator (D) is a material that initiates the polymerization reaction of a polymerizable composition by generating cations in response to a stimulus such as light or heat.

[0071] As the cationic polymerization initiator (D), a photocationic polymerization initiator (D1) is more preferred because of its excellent reactivity.

[0072] The photocationic polymerization initiator (D1) may be any compound capable of releasing a substance that initiates cationic polymerization upon irradiation with light. However, a double salt that is an onium salt that releases a Lewis acid upon irradiation with light, or a derivative thereof, is preferred because it allows a polymerizable composition with excellent curability to be obtained.

[0073] Examples of double salts that are onium salts or derivatives thereof include salts of a cation and anion represented by the following general formula (i): [A] ｍ＋ [B] ｍ－ (i)

[0074] Here, the cation [A] ｍ＋ is an onium ion, and its structure can be represented, for example, by the following general formula (ii): [(R Ｄ１ ) ｘ Q] ｍ＋ (ii) In the above general formula (ii), R Ｄ１ represents an organic group having 1 to 60 carbon atoms and may contain any number of atoms other than carbon atoms. x represents an integer of 1 to 5. x number of R Ｄ１ are each independently the same or different. x R Ｄ1 At least one of the above organic groups having an aromatic ring is represented by Q, which represents an atom or an atomic group selected from the group consisting of S, N, P, As, O, I, Br, Cl, F, and N=N. In addition, the cation [A]ｍ＋ When the valence of Q in the formula is q, the relationship m = x - q must hold. However, N = N is treated as having a valence of 0.

[0075] The cation [A] of the above general formula (ii) ｍ＋ Specific examples of the above include a phenyldiazonium cation, a 4-methoxyphenyldiazonium cation, a 4-methylphenyldiazonium cation, a diphenyliodonium cation, a di(4-methylphenyl)iodonium cation, a di(4-tert-butylphenyl)iodonium cation, a tolylcumyliodonium cation, and sulfonium cations represented by Group I or Group II below.

[0076]

[0077]

[0078] Also, the anion [B] ｍ－ can be represented by, for example, the following general formula (iii): ｙ ] ｍ－ (iii) In the general formula (iii), L represents a metal or semimetal (metalloid), and is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, or Co. X represents a halogen atom. y represents an integer of 3 to 7. In addition, the anion [B] ｍ－ When the valence of L in the formula is p, it is necessary that the relationship m=y-p holds.

[0079] The anion of the general formula (iii) [LX ｙ ] ｍ－ Specific examples of the fluoroborate include tetrafluoroborate (BF ４ ) － , hexafluorophosphate (PF ６ ) － , hexafluoroantimonate (SbF ６ ) － , hexafluoroarsenate (AsF ６ ) － , hexachloroantimonate (SbCl ６ ) － etc.

[0080] Also, the anion [B] ｍ－ may have a structure represented by the following general formula (iv): ｙ－１ (OH)] ｍ－ (iv) where L, X, and p are the same as above. Other anions include tetrakis(pentafluorophenyl)borate [(C ６ F ５ ) ４ B] － , perchlorate ion (ClO ４ ) － , trifluoromethyl sulfite ion (CF ３ SO ３ ) － , fluorosulfonate ion (FSO ３ ) － , toluenesulfonate anion, trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctanesulfonate, tetraarylborate, tetrakis(pentafluorophenyl)borate, tris(pentafluoromethyl)trifluorophosphate ion (FAP anion), and the like.

[0081] Among these onium salts, the following aromatic onium salts (A) to (C) are particularly effective in the present invention. One of these may be used alone, or two or more may be used in combination.

[0082] (a) Aryldiazonium salts such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, and 4-methylphenyldiazonium hexafluorophosphate

[0083] (b) Diaryl iodonium salts such as diphenyl iodonium hexafluoroantimonate, di(4-methylphenyl)iodonium hexafluorophosphate, di(4-tert-butylphenyl)iodonium hexafluorophosphate, and tolylcumyl iodonium tetrakis(pentafluorophenyl)borate.

[0084] (c) Sulfonium cations represented by Group I or Group II and sulfonium salts such as hexafluoroantimony ion, hexafluorophosphate ion, and tetrakis(pentafluorophenyl)borate ion

[0085] Other examples of the photoacid generator include iron-arene complexes such as (η5-2,4-cyclopentadien-1-yl)[(1,2,3,4,5,6-η)-(1-methylethyl)benzene]-iron-hexafluorophosphate, and mixtures of aluminum complexes such as tris(acetylacetonato)aluminum, tris(ethylacetonatoacetato)aluminum, and tris(salicylaldehydato)aluminum with silanols such as triphenylsilanol.

[0086] Among these, aromatic iodonium salts, aromatic sulfonium salts, and iron-arene complexes are preferred as the photoacid generator, as they result in a composition with excellent adhesion to various plastic films. Among these, aromatic sulfonium salts are preferred, triarylsulfonium salts having a structure in which three aromatic rings are bonded to a sulfur atom (S) are more preferred, and triarylsulfonium salts represented by the following general formula (4-1) are particularly preferred.

[0087] In the above general formula (4-1), R Ｄ１ , R Ｄ2 , R Ｄ３ , R Ｄ４ , R Ｄ５ , R Ｄ６ , R Ｄ７ , R Ｄ８ , R Ｄ９ , R Ｄ１０ , R Ｄ１１ , R Ｄ１２ , R Ｄ１３ and R Ｄ１４ each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms; R Ｄ１５ represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or any substituent selected from the following general formulae (4a) to (4c), An ｕ－represents a u-valent anion, and t represents a coefficient for neutralizing the charge.

[0088]

[0089] In the above general formulas (4a) to (4c), R Ｄ２１ , R Ｄ２２ , R Ｄ２３ , R Ｄ２４ , R Ｄ２５ , R Ｄ２６ , R Ｄ２７ , R Ｄ２８ , R Ｄ２９ , R Ｄ３０ , R Ｄ３１ , R Ｄ３２ , R Ｄ３３ , R Ｄ３４ , R Ｄ３５ , R Ｄ３６ , R Ｄ３７ , R Ｄ３８ , R Ｄ３９ , R Ｄ４０ , R Ｄ４１ , R Ｄ４２ , R Ｄ４３ , R Ｄ４４ , R Ｄ４５ , R Ｄ４６ , R Ｄ４７ and R Ｄ４８ each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, and * represents the bonding position with S.

[0090] R in the above general formula (4-1) Ｄ１ , R Ｄ２ , R Ｄ３ , R Ｄ４ , R Ｄ５ , R Ｄ６ , R Ｄ７ , R Ｄ８ , R Ｄ９ , R Ｄ１０ , R Ｄ１１ , R Ｄ１２ , R Ｄ１３ and R Ｄ１４ and R in the above general formulas (4a) to (4c) Ｄ２１ , R Ｄ２２ , R Ｄ２３ , R Ｄ２４ , R Ｄ２５ , R Ｄ２６ , R Ｄ２７ , R Ｄ２８ , RＤ２９ , R Ｄ３０ , R Ｄ３１ , R Ｄ３２ , R Ｄ３３ , R Ｄ３４ , R Ｄ３５ , R Ｄ３６ , R Ｄ３７ , R Ｄ３８ , R Ｄ３９ , R Ｄ４０ , R Ｄ４１ , R Ｄ４２ , R Ｄ４３ , R Ｄ４４ , R Ｄ４５ , R Ｄ４６ , R Ｄ４７ and R Ｄ４８ Examples of the halogen atom represented by the formula include fluorine, chlorine, bromine, and iodine.

[0091] R in the above general formula (4-1) Ｄ１ , R Ｄ２ , R Ｄ３ , R Ｄ４ , R Ｄ５ , R Ｄ６ , R Ｄ７ , R Ｄ８ , R Ｄ９ , R Ｄ１０ , R Ｄ１１ , R Ｄ１２ , R Ｄ１３ and R Ｄ１４ and R in the above general formulas (4a) to (4c) Ｄ２１ , R Ｄ２２ , R Ｄ２３ , R Ｄ２４ , R Ｄ２５ , R Ｄ２６ , R Ｄ２７ , R Ｄ２８ , R Ｄ２９ , R Ｄ３０ , R Ｄ３１ , R Ｄ３２ , R Ｄ３３ , R Ｄ３４ , R Ｄ３５ , R Ｄ３６ , R Ｄ３７ , R Ｄ３８ , R Ｄ３９ , R Ｄ４０ , R Ｄ４１ , R Ｄ４２ , R Ｄ４３ , R Ｄ４４ , R Ｄ４５ , R Ｄ４６ , R Ｄ４７and R Ｄ４８ Examples of the alkyl group having 1 to 10 carbon atoms represented by the formula (3-1) include the same as the "alkyl group having 1 to 10 carbon atoms" in the general formula (3-1) above.

[0092] R in the above general formula (4-1) Ｄ１ , R Ｄ２ , R Ｄ３ , R Ｄ４ , R Ｄ５ , R Ｄ６ , R Ｄ７ , R Ｄ８ , R Ｄ９ , R Ｄ１０ , R Ｄ１１ , R Ｄ１２ , R Ｄ１３ and R Ｄ１４ and R in the above general formulas (4a) to (4c) Ｄ２１ , R Ｄ２２ , R Ｄ２３ , R Ｄ２４ , R Ｄ２５ , R Ｄ２６ , R Ｄ２７ , R Ｄ２８ , R Ｄ２９ , R Ｄ３０ , R Ｄ３１ , R Ｄ３２ , R Ｄ３３ , R Ｄ３４ , R Ｄ３５ , R Ｄ３６ , R Ｄ３７ , R Ｄ３８ , R Ｄ３９ , R Ｄ４０ , R Ｄ４１ , R Ｄ４２ , R Ｄ４３ , R Ｄ４４ , R Ｄ４５ , R Ｄ４６ , R Ｄ４７ and R Ｄ４８ Examples of the alkoxy group having 1 to 10 carbon atoms represented by the formula (I) include a methoxy group, an ethoxy group, a propoxy group, a butoxy group, an isobutoxy group, a sec-butoxy group, a tert-butoxy group, a hexyloxy group, a heptyloxy group, an octyloxy group, an isooctyloxy group, a 2-ethylhexyloxy group, a tert-octyloxy group, a nonyloxy group, an isononyloxy group, a decyloxy group, and an isodecyloxy group.

[0093] An in the above general formula (4-1) ｕ－ Examples of the u-valent anion represented by the formula (I) include tetrakis(pentafluorophenyl)borate [(C ６ F ５ ) ４ B] － , tetrafluoroborate (BF ４ ) － , hexafluorophosphate (PF ６ ) － , hexafluoroantimonate (SbF ６ ) － , hexafluoroarsenate (AsF ６ ) － , hexachloroantimonate (SbCl ６ ) － , tris(pentafluoromethyl)trifluorophosphate ion (FAP anion), perchlorate ion (ClO ４ ) － , trifluoromethyl sulfite ion (CF ３ SO ３ ) － , fluorosulfonate ion (FSO ３ ) － toluenesulfonate anion, trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctanesulfonate, tetraarylborate, tetrakis(pentafluorophenyl)borate, and the like.

[0094] In the present disclosure, R Ｄ１５ is preferably selected from the above general formulas (4a) to (4c), and more preferably is the above general formula (4a) or (4c).

[0095] Since it is a composition with excellent adhesion to various plastic films, Ｄ１ , R Ｄ2 , R Ｄ３ , R Ｄ４ , R Ｄ５ , R Ｄ６ , R Ｄ７ , R Ｄ８ , R Ｄ９, R Ｄ１０ , R Ｄ１１ , R Ｄ１２ , R Ｄ１３ and R Ｄ１４ is preferably a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, and more preferably a hydrogen atom or a halogen atom.

[0096] Since it is a composition with excellent adhesion to various plastic films, Ｄ２１ , R Ｄ２２ , R Ｄ２３ , R Ｄ２４ , R Ｄ２５ , R Ｄ２６ , R Ｄ２７ , R Ｄ２８ , R Ｄ２９ , R Ｄ３０ , R Ｄ３１ , R Ｄ３２ , R Ｄ３３ , R Ｄ３４ , R Ｄ３５ , R Ｄ３６ , R Ｄ３７ , R Ｄ３８ , R Ｄ３９ , R Ｄ４０ , R Ｄ４１ , R Ｄ４２ , R Ｄ４３ , R Ｄ４４ , R Ｄ４５ , R Ｄ４６ , R Ｄ４７ and R Ｄ４８ is preferably a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, and more preferably a hydrogen atom or a halogen atom.

[0097] In the present invention, any compound that generates a cationic species or a Lewis acid upon heating can be used as the thermal cationic polymerization initiator, without any particular limitation. Examples of thermal cationic polymerization initiators include benzylsulfonium salts, phenylmethylsulfonium salts, thiophenium salts, quaternary ammonium salts, and aromatic iodonium salts. These thermal cationic polymerization initiators can be readily available commercially available products. Commercially available products that can be used as component (D) include, by trade name, ADEKA OPTOMER CP-77 and ADEKA OPTOMER CP-66 (manufactured by ADEKA Corporation); TA-100 and TA-160 (manufactured by San-Apro Co., Ltd.); and SAN-AID SI-60L, SAN-AID SI-80L, and SAN-AID SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.).

[0098] In order to provide a composition having excellent adhesiveness to various plastic films, the content of the cationic polymerization initiator (D) in the composition is preferably 0.1 to 20 mass%, more preferably 0.5 to 15 mass%, and particularly preferably 1 to 10 mass%.

[0099] In order to provide a composition having excellent adhesiveness to various plastic films, the content of the cationic polymerization initiator (D) is preferably 0.1 to 20 mass%, more preferably 0.5 to 15 mass%, and particularly preferably 1 to 10 mass%, of the solid content of the composition.

[0100] <Others> Various resin additives, such as solvents, other monomers, other polymerization initiators (radical polymerization initiators, etc.), inorganic fillers, organic fillers, colorants such as pigments and dyes, photosensitizers, antifoaming agents, thickeners, surfactants, leveling agents, flame retardants, thixotropic agents, diluents, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow adjusters, and adhesion promoters, may be added to the composition of the present invention as needed.

[0101] The solvent may be either water or an organic solvent. Examples of the organic solvent include carbonates such as propylene carbonate and diethyl carbonate; ketones such as acetone and 2-heptanone; polyhydric alcohols and derivatives thereof such as ethylene glycol, propylene glycol, propylene glycol monoacetate, dipropylene glycol, and the monomethyl ether or monophenyl ether of dipropylene glycol monoacetate; cyclic ethers such as dioxane; esters such as ethyl formate and 3-methyl-3-methoxybutyl acetate; aromatic hydrocarbons such as toluene and xylene; and lactones such as γ-caprolactone and δ-caprolactone. The content of the solvent in the composition of the present invention is preferably 20 parts by mass or less, more preferably 10 parts by mass or less, and particularly preferably 5 parts by mass or less, per 100 parts by mass of the composition. When a solvent is contained, the amount is preferably 0.1 parts by mass or more per 100 parts by mass of the composition.

[0102] The other monomers may include other polymerizable compounds in addition to the curable components of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C). Examples of the other polymerizable compounds include epoxy compounds other than the alicyclic epoxy compound (A) and the monofunctional epoxy compound (B). Examples of such epoxy compounds include polyfunctional epoxy compounds that do not contain alicyclic epoxy groups. Examples of such polyfunctional epoxy compounds include polyfunctional aromatic epoxy compounds that contain an aromatic ring and two or more epoxy groups, and polyfunctional aliphatic epoxy compounds that do not contain an aromatic ring and have two or more epoxy groups. From the viewpoint of further enhancing the effects of the present invention, the content of the polyfunctional aromatic epoxy compounds in the composition of the present disclosure is preferably 0 to 50 parts by mass in total, more preferably 0 to 30 parts by mass, and particularly preferably 0 to 20 parts by mass, per 100 parts by mass of the total amount of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C). Furthermore, the total amount of the polyfunctional aromatic epoxy compound and the polyfunctional aliphatic epoxy compound is preferably 0 parts by mass or more and 100 parts by mass or less, more preferably 0 parts by mass or more and 75 parts by mass or less, even more preferably 0 parts by mass or more and 50 parts by mass or less, and even more preferably 0 parts by mass or more and 30 parts by mass or less, and particularly preferably 0 parts by mass or more and 20 parts by mass or less, relative to 100 parts by mass of the total amount of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C).

[0103] Furthermore, in the present invention, polymerizable compounds other than epoxy compounds and oxetane compounds can also be used without any particular limitation, as long as they are components that are cured by energy ray irradiation. Examples of polymerizable compounds other than epoxy compounds and oxetane compounds include radical polymerizable compounds such as acrylic compounds, vinyl ether compounds, unsaturated carboxylic acids, unsaturated acid anhydrides, aromatic vinyl compounds, N-substituted maleimides, conjugated dienes, N-vinyl compounds, and unsaturated isocyanates, as well as alcohol monomers.

[0104] The acrylic compound is a compound having an acrylic group or a methacrylic group, but not having an epoxy group or an oxetanyl group, and examples thereof include monofunctional (meth)acrylates and polyfunctional (meth)acrylates.

[0105] Examples of monofunctional (meth)acrylates include isoamyl (meth)acrylate, stearyl (meth)acrylate, lauryl (meth)acrylate, octyl (meth)acrylate, decyl (meth)acrylate, isomyristyl (meth)acrylate, isostearyl (meth)acrylate, 2-ethylhexyl-diglycol (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-(meth)acryloyloxyethylhexahydrophthalate, butoxyethyl (meth)acrylate, ethoxydiethylene glycol (meth)acrylate, methoxydiethylene glycol (meth)acrylate, and methoxypolyethylene glycol. Examples of the acrylates include ethylene glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, isobornyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-(meth)acryloyloxyethyl succinate, 2-(meth)acryloyloxyethyl phthalate, 2-(meth)acryloyloxyethyl-2-hydroxyethyl phthalate, and t-butylcyclohexyl (meth)acrylate.

[0106] Examples of polyfunctional (meth)acrylates include triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, bisphenol A PO adduct di(meth)acrylate, and hydroxypivalic acid neopentyl glycol di(meth)acrylate. and difunctional (meth)acrylates including trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, glycerin propoxy tri(meth)acrylate, and pentaerythritol ethoxy tetra(meth)acrylate.

[0107] The vinyl ether compound is a compound that has a vinyl ether structure and does not have an epoxy group, an acrylic group, or an oxetanyl group, and examples thereof include methyl vinyl ether, ethyl vinyl ether, propyl vinyl ether, butyl vinyl ether, 2-ethylhexyl vinyl ether, n-nonyl vinyl ether, lauryl vinyl ether, cyclohexyl vinyl ether, methoxyethyl vinyl ether, ethoxyethyl vinyl ether, methoxyethoxyethyl vinyl ether, methoxypolyethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, and 4-hydroxybutyl vinyl ether.

[0108] Specific examples of the unsaturated carboxylic acids include crotonic acid, cinnamic acid, vinylbenzoic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, and mesaconic acid.

[0109] Specific examples of the unsaturated acid anhydride include maleic anhydride, phthalic anhydride, and itaconic anhydride.

[0110] Specific examples of the aromatic vinyl compound include styrene, α-methylstyrene, vinyltoluene, and methoxystyrene.

[0111] Specific examples of the N-substituted maleimide include methylmaleimide, ethylmaleimide, isopropylmaleimide, cyclohexylmaleimide, phenylmaleimide, benzylmaleimide, and naphthylmaleimide.

[0112] Specific examples of the conjugated diene include 1,3-butadiene, isoprene, and chloroprene.

[0113] Specific examples of the N-vinyl compound include N-vinylpyrrolidone, N-vinylcaprolactam, N-vinylimidazole, N-vinylmorpholine, and N-vinylacetamide.

[0114] Specific examples of the unsaturated isocyanate include isocyanatoethyl (meth)acrylate and allyl isocyanate.

[0115] The alcohol monomer is a compound having a hydroxyl group, and examples of the polyhydric alcohol include aliphatic diols such as ethylene glycol, neopentyl glycol, 1,2-propanediol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, diethylene glycol, triethylene glycol, polyethylene glycol, 2-methyl-2-ethyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, and 2-butyl-2-ethyl-1,3-propanediol; Examples of the polyhydroxymethyl benzene include alicyclic diols such as hexanediol, sorbitol, 1,2,3,6-hexanetetraol, 1,4-sorbitan, pentaerythritol, dipentaerythritol, tripentaerythritol, sucrose, 1,2,4-butanetriol, 1,2,5-pentatriol, glycerol, 2-methylpropanetriol, 2-methyl-1,2,4-butanetriol, trimethylolethane, trimethylolpropane, 1,3,5-trihydroxymethylbenzene, polycaprolactone diol having two terminal hydroxyl groups, and polycaprolactone triol having three terminal hydroxyl groups.

[0116] When the composition of the present invention contains a radical polymerizable compound, from the viewpoint of obtaining a composition with low viscosity and excellent adhesion to various plastic films, the total amount of the radical polymerizable compound is preferably 60 parts by mass or less, more preferably 55 parts by mass or less, particularly preferably 50 parts by mass or less, even more preferably 15 parts by mass or less, and particularly preferably 5 parts by mass or less, per 100 parts by mass of the solid content of the composition. When the composition of the present invention contains a radical polymerizable compound, the content of the radical polymerizable compound in the composition may be 1 part by mass or more, or may be 3 parts by mass or more.

[0117] When the composition of the present invention contains a radical polymerizable compound, from the viewpoint of obtaining a composition with low viscosity and excellent adhesion to various plastic films, the total amount of the radical polymerizable compound is preferably 60 parts by mass or less, more preferably 55 parts by mass or less, particularly preferably 50 parts by mass or less, even more preferably 15 parts by mass or less, and particularly preferably 5 parts by mass or less, per 100 parts by mass of the composition. When the composition of the present invention contains a radical polymerizable compound, the content of the radical polymerizable compound in the composition may be 1 part by mass or more, or may be 3 parts by mass or more.

[0118] Examples of the radical polymerization initiator include a photoradical polymerization initiator and a thermal radical polymerization initiator. As the photoradical polymerization initiator and the thermal radical polymerization initiator, known radical polymerization initiators can be used without any particular limitation. However, from the viewpoint of further accelerating the polymerization reaction, it is particularly preferable to use a photoradical polymerization initiator as the radical polymerization initiator. Preferred examples of the photoradical polymerization initiator include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyl dimethyl ketal, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)ketone, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)methyl]propionyl}propionyl acetophenones such as {2-methyl-2-propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-2-morpholino(4-thiomethylphenyl)propan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, and 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone oligomer; benzoin, benzoin methyl ether, benzoin ether, and benzoin methyl ether. benzoins such as benzoin diethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, 4-benzoyl-N,N-dimethyl-N-[2-(1-oxo-2-propenyloxy) benzophenones such as (4-benzoylbenzyl)trimethylammonium chloride, (4-benzoylbenzyl)trimethylammonium chloride, etc.; thioxanthones such as 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, 2-(3-dimethylamino-2-hydroxy)-3,4-dimethyl-9H-thioxanthone-9-one mesochloride, etc.;Examples of the photoradical polymerization initiator include acylphosphine oxides such as 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and oxime esters described in JP-A Nos. 2018-172495, 2020-139136, and JP-A No. 2020 / 004601. However, the photoradical polymerization initiator is not limited to the exemplified compounds. One type of photoradical polymerization initiator may be used alone, or two or more types may be used in combination.

[0119] When the composition of the present invention contains a radical polymerization initiator, the total amount of the radical polymerization initiator is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, and particularly preferably 8 parts by mass or less, per 100 parts by mass of the solid content of the composition, in order to obtain a composition with low viscosity and excellent adhesion to various plastic films. The lower limit may be 0.1 parts by mass or more, 0.5 parts by mass or more, or 1 part by mass or more.

[0120] When the composition of the present invention contains a radical polymerization initiator, the total amount of the radical polymerization initiator is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, and particularly preferably 8 parts by mass or less, per 100 parts by mass of the composition, in order to obtain a composition with low viscosity and excellent adhesion to various plastic films. The lower limit may be 0.1 parts by mass or more, 0.5 parts by mass or more, or 1 part by mass or more.

[0121]

[0044] In the composition of the present invention, the total amount of optional components other than the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), the oxetane compound (C), and the cationic polymerization initiator (D) varies depending on the application of the present invention, etc., but from the viewpoint of further enhancing the effects of the present invention, it is preferably 0 parts by mass or more and 200 parts by mass or less, more preferably 0 parts by mass or more and 175 parts by mass or less, even more preferably 0 parts by mass or more and 150 parts by mass or less, still more preferably 0 parts by mass or more and 50 parts by mass or less, particularly preferably 0 parts by mass or more and 30 parts by mass or less, and most preferably 0 parts by mass or more and 20 parts by mass or less, relative to 100 parts by mass of the total amount of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C).

[0122]

[0047] In addition, in the composition of the present invention, the total amount of components other than the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), the oxetane compound (C), the cationic polymerization initiator (D), the radical polymerizable compound, and the radical polymerization initiator varies depending on the application of the present invention, etc., but from the viewpoint of further enhancing the effects of the present invention, it is preferably 0 parts by mass or more and 150 parts by mass or less, more preferably 0 parts by mass or more and 70 parts by mass or less, even more preferably 0 parts by mass or more and 30 parts by mass or less, and even more preferably 0 parts by mass or more and 20 parts by mass or less, relative to 100 parts by mass of the total amount of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C).

[0123] From the viewpoint of handleability and coatability, the composition of the present invention preferably has a viscosity of 200 mPa s or less as measured with an E-type viscometer at 25° C. Even with such a low viscosity, the composition of the present invention can form a cured product with superior adhesiveness.

[0124] Specific applications of the composition of the present invention include optical materials such as eyeglasses and imaging lenses, paints, coating agents, lining agents, inks, resists, liquid resists, adhesives, printing plates, insulating varnishes, insulating sheets, laminates, printed circuit boards, sealants for semiconductor devices, LED packages, liquid crystal injection ports, organic electroluminescence (EL) devices, optical elements, electrical insulation, electronic components, and separation membranes, etc., molding materials, putties, glass fiber impregnating agents, fillers, passivation films for semiconductors, solar cells, etc., interlayer insulating films, protective films, lens portions of lens sheets such as prism lens sheets used in the backlights of liquid crystal display devices, Fresnel lens sheets used in screens of projection televisions, etc., and lenticular lens sheets, or backlights using such sheets, optical lenses such as microlenses, optical elements, optical connectors, optical waveguides, and casting agents for optical shaping. For example, substrates to which the composition of the present invention can be applied as a coating agent include metal, wood, rubber, plastic, glass, and ceramic products.

[0125] 2. Adhesives The composition of the present invention has excellent adhesive strength. Furthermore, the composition of the present invention also has excellent optical properties in the cured product. Therefore, the composition of the present invention is particularly useful as an adhesive. The adhesive of the present invention contains the composition of the present invention. Because the adhesive of the present invention contains the composition of the present invention, it has excellent adhesive strength and can have a low viscosity. In addition, the adhesive of the present invention also has excellent optical properties such as total light transmittance.

[0126] The adhesive is preferably a laminating adhesive for forming a laminated film. When the adhesive is a photocurable adhesive, it is desirable that at least one of the films used is a light-transmitting film. Examples of such light-transmitting films include polyester films, polycarbonate films, acrylic films, polyamide films, polyimide films, amorphous polyolefin films, cycloolefin films, PVA films, and cellulose films.

[0127] In combination with a light-transmitting film, a light-impermeable or light-slightly permeable film can also be used as the substrate film of the laminated film. Examples of such films include resins containing coloring pigments, coloring dyes, carbon black, inorganic particles, or polymeric fine particles for coloring or light blocking, and polyimide-based films that are not light-transmitting in the wavelength range of 450 nm or less. When the laminated film is a polarizing plate, protective films or optical compensation films such as PVA-based polarizer films, cellulose-based films such as triacetyl cellulose, and cycloolefin-based films can be used.

[0128] 3. Method for Producing a Cured Product The method for producing a cured product of the present invention includes either or both of a step of irradiating the composition of the present invention with active energy rays and a step of heating the composition. Preferably, the method includes a step of irradiating with active energy rays.

[0129] The light source of the active energy rays used to cure the composition can be high-energy rays such as electromagnetic wave energy having a wavelength of 2000 angstroms to 7000 angstroms, electron beams, X-rays, and radioactive rays obtained from ultra-high pressure mercury lamps, high pressure mercury lamps, medium pressure mercury lamps, low pressure mercury lamps, mercury vapor arc lamps, xenon arc lamps, carbon arc lamps, metal halide lamps, fluorescent lamps, tungsten lamps, excimer lamps, germicidal lamps, light-emitting diodes, CRT light sources, etc. Preferably, ultra-high pressure mercury lamps, mercury vapor arc lamps, carbon arc lamps, xenon arc lamps, light-emitting diodes, etc. that emit light with a wavelength of 300 to 450 nm are used.

[0130] The irradiation dose of the energy ray is not particularly limited and can be appropriately determined depending on the composition of the composition. From the viewpoint of preventing deterioration of the components in the composition, the irradiation dose is set to 100 mJ / cm at 365 nm. ２ ~2000mJ / cm ２ is preferred.

[0131] In this step, the method of irradiating with energy rays and the method of heating may be used in combination, or the two methods may be performed in this order, because this allows the composition to be cured efficiently.

[0132] Examples of a method for heating the composition in this step include a method using a hot plate or other hot plate, an atmospheric oven, an inert gas oven, a vacuum oven, a hot air circulation oven, etc. The heating temperature when heating the composition is not particularly limited, but is preferably 70°C or higher and 200°C or lower, and more preferably 90°C or higher and 180°C or lower.

[0133] 4. Cured Product The cured product of the present invention can be produced by irradiating the composition of the present invention described above with active energy rays or by heating the composition. The conditions for irradiating the active energy rays and the heating conditions are not limited and known conditions can be used. For example, the irradiation conditions and heating conditions described above can be used.

[0134] The present invention will be described in more detail below based on examples, but the present invention is not limited to these examples.

[0135] [Examples 1 to 44 and Comparative Examples 1 to 8] The components were thoroughly mixed according to the formulations shown in Tables 1 to 9 below to prepare compositions of Examples 1 to 44 and Comparative Examples 1 to 8. The symbols in the tables represent the following components. The numerical values ​​in the tables represent parts by mass.

[0136] Alicyclic epoxy compounds (A) A-1: ​​Compounds represented by the following formula (A-1) (compounds represented by formula (1-5)) A-2: Compounds represented by the following formula (A-2) (compounds represented by formula (1-1)) Monofunctional epoxy compounds (B) B-1: Compounds represented by the following formula (B-1) (compounds represented by formula (2-2)) B-2: Compounds represented by the following formula (B-2) (compounds represented by formula (2-1)) B-3: Compounds represented by the following formula (B-3) (compounds represented by formula (2-1)) B-4: Compounds represented by the following formula (B-4) (compounds represented by formula (2-2))

[0137]

[0138] Oxetane compounds (C) C-1: OXT-221 (Toagosei Co., Ltd.), a compound represented by the following formula (C-1) C-2: OXT-101 (Toagosei Co., Ltd.), a compound represented by the following formula (C-2)

[0139]

[0140] Cationic polymerization initiator (D) D-1: a 50% by mass propylene carbonate solution of a mixture represented by the following formulas (D-1-1) and (D-1-2): D-2: a 50% by mass propylene carbonate solution of a compound represented by the following formula (D-1-2):

[0141]

[0142] Others (E) E-1: Viscoat #230 (Osaka Organic Chemical Industry Co., Ltd.), a compound represented by the following formula (E-1) E-2: NK Ester A-DCP (Shin-Nakamura Chemical Co., Ltd.), a compound represented by the following formula (E-2) E-3: a compound represented by the following formula (E-3) E-4: NK Ester A-NPG (Shin-Nakamura Chemical Co., Ltd.), a compound represented by the following formula (E-4) E-5: NK Ester A-DOD-N (Shin-Nakamura Chemical Co., Ltd.), a compound represented by the following formula (E-5) E-6: a compound represented by the following formula (E-6) E-7: M-120 (Toagosei Co., Ltd.), a compound represented by the following formula (E-7) E-8: NK Ester APG-700 (Shin-Nakamura Chemical Co., Ltd.), a compound represented by the following formula (E-8) E-9: Placcel 220EB (Daicel Corporation), a bifunctional polyol E-10: A compound represented by the following formula (E-10):

[0143]

[0144]

[0145] Other epoxy compounds (F) F-1: Compound represented by the following formula (F-1) F-2: EP-4100E (ADEKA Corporation), bisphenol A type epoxy resin F-3: Compound represented by the following formula (F-3)

[0146]

[0147]

[0148] <Evaluation Methods> The compositions obtained in the Examples and Comparative Examples were evaluated by the following methods. The results are shown in Tables 1 to 4.

[0149] (Viscosity) The viscosity of the compositions obtained in the examples and comparative examples was measured by the following method. Equipment used: TVE-25L manufactured by Toki Sangyo Co., Ltd. Measurement temperature: 25°C Measurement method: Approximately 1.1 mL of sample was placed in a cup attached to an E-type viscometer, and this cup was set in a thermostatic bath / liquid delivery device set at a temperature of 25°C. Measurement of the rotational viscosity of the sample was started using the E-type viscometer, and the rotational viscosity value was read at the point where the rotational viscosity reading stabilized. Evaluation was made using the above method according to the following evaluation criteria. A: Less than 100 mPa·s B: 100 mPa·s or more and 200 mPa·s or less C: More than 200 mPa·s

[0150] (Preparation of Test Pieces for Adhesion Test) (1) Adhesion Strength / COP Each of the compositions obtained in the Examples and Comparative Examples was applied to one corona discharge-treated cycloolefin polymer (COP) film (manufactured by Zeon Corporation: product number Zeonorfilm 14-060) so that the film thickness after curing would be 3 μm. The applied film was then laminated to another corona discharge-treated cycloolefin polymer (COP) film (manufactured by Zeon Corporation: product number Zeonorfilm 14-060) using a laminator, and the applied film was then exposed to 1000 mJ / cm using an electrodeless ultraviolet lamp. ２ The specimens were bonded together by irradiating light equivalent to 1000 kJ / cm 2 through the COP film to obtain test pieces for adhesion tests.

[0151] Adhesion test pieces were also obtained for triacetyl cellulose (TAC) film (FUJITAC TD80 manufactured by FUJIFILM Corporation) and polyethylene terephthalate (PET) film (LUMIRROR 75T60 manufactured by Toray Industries, Inc.) in the same manner as for the COP film. Specifically, the following procedure was performed. (2) Adhesion strength / TAC The compositions obtained in the examples and comparative examples were each applied to one triacetyl cellulose (TAC) film (FUJITAC TD80 manufactured by FUJIFILM Corporation) so that the film thickness after curing would be 3 μm, and then this was laminated with another corona discharge-treated cycloolefin polymer (COP) film (ZEON Corporation: product number ZEONORFILM 14-060) using a laminator, and the resulting film was exposed to 1000 mJ / cm using an electrodeless ultraviolet lamp. ２The compositions obtained in the examples and comparative examples were each applied to a polyethylene terephthalate (PET) film (Lumirror 75T60, manufactured by Toray Industries, Inc.) so that the film thickness after curing would be 3 μm, and then the film was laminated with another corona discharge-treated cycloolefin polymer (COP) film (Zeon Corporation, product number Zeonorfilm 14-060) using a laminator, and the film was then irradiated with 1000 mJ / cm using an electrodeless ultraviolet lamp. ２ The specimens were bonded together by irradiating light equivalent to 1000 kJ / cm 2 through the COP film to obtain test pieces for adhesion tests.

[0152] (Adhesion) The obtained adhesion test specimen was cut into a 20 mm width 120 hours after exposure under conditions of 30°C, 50% RH, and atmospheric pressure to obtain a sample for evaluating adhesion strength. The obtained sample was subjected to a 90-degree peel test at a load rate of 50 mm / min using an FTN3000 tester manufactured by Aiko Engineering Co., Ltd., to measure peel adhesion strength. The evaluation was performed according to the following criteria: A: 3 N / 20 mm or more or substrate failure B: More than 1.5 N / 20 mm, 3 N / 20 mm or less C: More than 1 N / 20 mm, 1.5 N / 20 mm or less D: More than 0.5 N / 20 mm, 1 N / 20 mm or less E: 0.5 N / 20 mm or less

[0153]

[0154]

[0155]

[0156]

[0157]

[0158]

[0159]

[0160]

[0161]

[0162] As shown in Tables 1 to 9, the viscosity, COP, TAC, and adhesion to various plastic films of each Example were evaluated as B or higher. In contrast, the comparative examples that did not contain any of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C) showed poor adhesion to various plastic films.

Claims

1. A composition containing an alicyclic epoxy compound (A), a monofunctional epoxy compound (B), an oxetane compound (C), and a cationic polymerization initiator (D), wherein the composition contains 50 parts by mass or more of the alicyclic epoxy compound (A) with respect to 100 parts by mass of the total amount of the alicyclic epoxy compound (A), the monofunctional epoxy compound (B), and the oxetane compound (C).

2. The composition according to claim 1, wherein the alicyclic epoxy compound (A) is a compound (A1) having two or more alicyclic epoxy groups.

3. The composition according to claim 1, wherein the monofunctional epoxy compound (B) is at least one selected from the compound represented by the following general formula (I) and the compound represented by the following general formula (II). (In general formula (I), R Ｂ１ represents an alkyl group having 1 to 20 carbon atoms or an alkoxy group having 1 to 20 carbon atoms, and Y in general formula (I) １ represents a direct bond, an alkylene group having 1 to 20 carbon atoms, an oxyalkylene group having 1 to 20 carbon atoms, or a polyoxyalkylene group having 4 to 20 carbon atoms, and s represents a number from 0 to 5.) (In general formula (II), R Ｂ２ represents an alkyl group having 1 to 20 carbon atoms, and Y in general formula (II) ２ represents an ether bond or an ester bond.) 4. The monofunctional epoxy compound (B) is a compound represented by the above formula (I), and Y in the above general formula (I) １ is a branched alkylene group, a branched oxyalkylene group or a branched polyoxyalkylene group. The composition according to claim 1 5. The monofunctional epoxy compound (B) is a compound represented by the above formula (II), and R in the above general formula (II) Ｂ２ The composition according to claim 1, wherein is a branched alkyl group.

6. The composition according to claim 1, wherein the oxetane compound (C) is a polyfunctional oxetane compound (C2).

7. The composition according to claim 1, wherein the cationic polymerization initiator (D) is a photo cationic polymerization initiator (D1).

8. An adhesive containing the composition according to any one of claims 1 to 7.

9. A method for producing a cured product, comprising at least one of the steps of irradiating the composition according to any one of claims 1 to 7 with active energy rays and heating the composition according to any one of claims 1 to 7.

10. A cured product of the composition according to any one of claims 1 to 7.

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