Laminate and method for manufacturing same, transfer hand, transfer device, and semiconductor manufacturing device

Abstract

The present invention provides a laminate with excellent vibration damping properties and a method for manufacturing the same, a laminate and a method for manufacturing the same, a transfer hand, a transfer device, and a semiconductor manufacturing device. The laminate has a plurality of first layers (a) and a second layer (b). Each of the plurality of first layers (a) is a layer selected from among a layer (a1) of a carbon fiber-reinforced resin, a layer (a2) of a ceramic, and a layer (a3) of a metal. The second layer (b) is a layer selected from out of a layer (b1) mainly containing an epoxy resin (S) (excluding the layer (a1) of a carbon fiber-reinforced resin) and a layer (b2) mainly containing a thermoplastic elastomer (T). The first layers (a) are disposed on both sides of the second layer (b), and the ratio of the thickness of the second layer (b) is equal to or greater than 0.3% and less than 30% of the combined thickness of the first layers (a) and the second layer (b).

Description

Stacked body and its manufacturing method, transport hand, transport device, and semiconductor manufacturing device

[0001] The present invention relates to a laminate, a manufacturing method thereof, a transport hand, a transport device, and a semiconductor manufacturing device. This application claims priority based on Japanese Patent Application No. 2023-219753, filed on December 26, 2023, the contents of which are incorporated herein by reference.

[0002] For example, a transfer robot is used as a transfer device for transferring semiconductor wafers and the like. The transfer robot has a transfer hand, a fork, a pick, and an end effector (hereinafter referred to as the transfer hand) for handling the semiconductor wafer, which is the workpiece. Ceramics, which are isotropic materials, have a high Young's modulus and are generally used as the material for transfer hands because the total amount of self-weight deflection and load deflection when a semiconductor wafer is placed on them is small. Aluminum, on the other hand, is used in applications where a high Young's modulus is not required.

[0003] A transfer hand generates vertical vibrations when a semiconductor wafer is placed on it or when the load is removed after transferring a semiconductor wafer. Vibrations also occur when the transfer device suddenly stops. Furthermore, if a wafer is placed on it without stopping the vibrations, the wafer may shift position. As mentioned above, the operation of a transfer device faces various problems. From the perspective of shortening the takt time in the semiconductor wafer transfer process, it is desirable to quickly suppress vibrations, i.e., to improve vibration damping. Ceramic transfer hands are prone to vibrations when placing or transferring semiconductor wafers. In addition, ceramics have low impact resistance and may be damaged by contact with the semiconductor wafer or the transfer destination during use. Therefore, a transfer hand made of carbon fiber reinforced plastic has been proposed as a transfer hand with excellent vibration damping properties (see, for example, Patent Document 1).

[0004] WO 2005 / 102618

[0005] However, conventional transfer hands made of carbon fiber reinforced plastic, ceramic, etc. do not necessarily have sufficient vibration damping properties. An object of the present invention is to provide a laminate with excellent vibration damping properties, a method for manufacturing the same, a transfer hand, a transfer device, and a semiconductor manufacturing device.

[0006] The present invention has the following aspects: [1] A laminate having a plurality of first layers (a) and second layers (b), wherein the plurality of first layers (a) are each selected from a carbon fiber reinforced resin layer (a1), a ceramic layer (a2), and a metal layer (a3), and the second layers (b) are selected from a layer (b1) containing mainly an epoxy resin (S) (excluding the carbon fiber reinforced resin layer (a1)) and a layer (b2) containing mainly a thermoplastic elastomer (T), the first layers (a) are disposed on both sides of the second layers (b), and the thickness of the second layers (b) is 0.3% or more and less than 30% of the total thickness of the first layers (a) and the second layers (b). [2] The laminate of [1], wherein the total thickness of the laminate is 1.5 to 20 mm. [3] The laminate of [1] or [2] above, wherein the carbon fiber reinforced resin layer (a1) includes both a layer containing pitch-based carbon fiber and a layer containing PAN-based carbon fiber. [4] The laminate of any of [1] to [3] above, wherein the layer (b1) containing the epoxy resin (S) has a breaking elongation of 100% or more and 500% or less. [5] The laminate of any of [1] to [4] above, wherein the layer (b2) containing the thermoplastic elastomer (T) has a breaking elongation of 800% or more and 1200% or less. [6] The laminate of any of [1] to [5] above, wherein the metal layer (a3) ​​is any one of an aluminum layer, a SUS layer, or a titanium alloy layer. [7] The laminate of any of [1] to [6] above, wherein the epoxy resin (S) has an aliphatic hydrocarbon skeleton. [8] The laminate of any one of [1] to [7] above, wherein the thickness of the second layer (b) is 0.03 mm or more and 0.5 mm or less. [9] The laminate precursor of any one of [3] to [8] above, wherein the tensile modulus of the pitch-based carbon fiber is 600 GPa or more and 800 GPa or less.

[10] The laminate of any one of [3] to [9] above, wherein the tensile modulus of the PAN-based carbon fiber is 200 GPa or more and 400 GPa or less.

[11] The carbon fiber reinforced resin layer (a1) is a layer (a11) containing unidirectionally aligned pitch-based carbon fibers and a cured product of an epoxy resin (N1). ０ ) and the layer (a11 ０and a layer (β) containing carbon fibers oriented at an orientation angle of 45° to 90° relative to the orientation of the pitch-based carbon fibers contained in the epoxy resin (N1), wherein the layer (β) includes at least one of a layer (a11) containing unidirectionally aligned pitch-based carbon fibers and a cured product of an epoxy resin (N1) and a layer (a12) containing unidirectionally aligned PAN-based carbon fibers and a cured product of an epoxy resin (N2).

[12] The laminate of any of [1] to

[11] above, wherein the layer (b1) containing the epoxy resin (S) has a tensile modulus of 3 MPa to 12 MPa and a tensile strength of 10 MPa to 50 MPa.

[13] The laminate of any of [1] to

[12] above, wherein the layer (b2) containing the thermoplastic elastomer (T) has a tensile modulus of 3 MPa to 20 MPa and a tensile strength of 8 MPa to 40 MPa.

[14] The laminate of any of [1] to

[13] , wherein the second layer (b) is disposed only in a region including the center in the thickness direction of the laminate.

[15] The laminate of any of [1] to

[14] , wherein the second layer (b) is a layer made of a resin that does not contain fibers.

[16] The laminate of any of [1] to

[15] , wherein the loss tangent (Tan δ) of the second layer (b) is 0.2 or more at 20°C over the entire frequency range between 100 Hz and 4,000 Hz.

[17] The laminate of any of [1] to

[16] , wherein the loss factor of the laminate is 0.01 or more.

[18] The laminate of any of [1] to

[17] , wherein the time required for vibration damping to reach 1 / 4 of the original value is 0.7 seconds or less.

[19] The laminate of any one of [1] to

[18] above, having a fixing portion fixed to a transport device and finger portions extending in a substantially U-shape from the fixing portion.

[20] The laminate of any one of [1] to

[19] above, having a flat plate shape.

[21] The laminate of any one of [1] to

[20] above, further having a layer (c) containing a glass fiber fabric and a matrix resin in at least one of the outermost layers of the laminate.

[22] A transport hand including the laminate of any one of

[17] to

[21] above.

[23] A transport device incorporating the transport hand of

[22] above.

[24] A semiconductor manufacturing device incorporating the transport hand of

[22] above.

[25] A method for producing a laminate, comprising pressing a laminate precursor in which a first layer (A) is disposed on both sides of a second layer (B) to obtain a laminate, wherein the first layers (A) are selected from a carbon fiber prepreg layer (A1), a ceramic layer (A2), and a metal layer (A3), and the second layers (B) are selected from a layer (B1) mainly containing an epoxy resin (S) (excluding a carbon fiber prepreg layer (a1)) and a layer (B2) mainly containing a thermoplastic elastomer (T), and the thickness of the second layer (B) is 0.3% or more and less than 30% of the total thickness of the first layer (A) and the second layer (B).

[0007] According to the present invention, it is possible to provide a laminate having excellent vibration damping properties, a method for manufacturing the same, a transport hand, a transport device, and a semiconductor manufacturing device.

[0008] FIG. 1 is a cross-sectional view showing an example of a laminate of the present invention. FIG. 2 is a plan view showing an example of a laminate of the present invention. FIG. 3 is a cross-sectional view showing an example of a laminate precursor of the present invention. FIG. 4 is an explanatory diagram schematically showing an example of an apparatus used for measuring vibration damping properties. FIG. 5 is a diagram showing the results of the vibration damping properties of the laminate obtained in Example 1. FIG. 6 is a diagram showing the results of the vibration damping properties of the laminate obtained in Example 2. FIG. 7 is a diagram showing the results of the vibration damping properties of the laminate obtained in Example 5. FIG. 8 is a diagram showing the results of the vibration damping properties of the laminate obtained in Example 6. FIG. 9 is a diagram showing the results of the vibration damping properties of the stainless steel plate used in Example 7. FIG. 10 is a diagram showing the results of the vibration damping properties of the laminate obtained in Comparative Example 1. FIG. 11 is a diagram showing the results of the vibration damping properties of the laminate obtained in Comparative Example 2. FIG. 12 is a diagram showing the results of the vibration damping properties of the stainless steel plate used in Comparative Example 3. FIG. 13 is a diagram showing the results of the vibration damping properties of the Al—Mg alloy plate used in Comparative Example 4. FIG. 14 is a diagram showing the results of the vibration damping properties of the ceramic plate used in Comparative Example 5. FIG. 15 is a diagram showing the results of the vibration damping properties of the ceramic plate used in Comparative Example 6.

[0009] The following describes specific embodiments of the present invention, but the present invention is not limited to the following embodiments and can be practiced with various modifications within the scope of the gist. The numerical ranges of the content, various physical property values, and characteristic values ​​disclosed in this specification can be arbitrarily combined with their lower and upper limits to form new numerical ranges. In this invention, the term "epoxy resin" refers to the raw material resin before curing. Note that, since epoxy groups are consumed in the curing reaction, the cured resin may not have epoxy groups (epoxy structure). Furthermore, for the sake of clarity, the drawings used in the following description may show characteristic portions enlarged for convenience, and the dimensional ratios of each component may differ from the actual ones.

[0010] [Laminate] The laminate according to the embodiment has a plurality of first layers (a) and second layers (b), and the first layers (a) are disposed on both sides of the second layer (b). Figure 1 shows an example of a laminate according to the embodiment. The laminate 200 of the example shown in Figure 1 has one second layer (b) 220 and a total of four first layers (a) 210, with two layers disposed on each side of the second layer (b) 220.

[0011] "First layer (a)" The first layer (a) is a layer selected from a carbon fiber reinforced resin layer (a1) (hereinafter also referred to as "layer (a1)"), a ceramic layer (a2), and a metal layer (a3). Examples of the metal layer (a3) ​​include an aluminum layer, a SUS layer, and a titanium alloy layer. From the viewpoint of weight reduction, the first layer (a) is preferably layer (a1). Layer (a1) is a cured product of layer (A1) described later in the laminate precursor description.

[0012] Hereinafter, the carbon fiber used in the layer (a1) will also be referred to as "carbon fiber (M)." The carbon fiber (M) is not particularly limited, and examples thereof include pitch-based carbon fibers such as petroleum-based and coal-based carbon fibers, PAN-based carbon fibers (polyacrylonitrile-based carbon fibers), rayon-based carbon fibers, and lignin-based carbon fibers. From the viewpoint of further improving the vibration damping properties of the laminate, the layer (a1) is preferably a layer containing pitch-based carbon fibers. Furthermore, from the viewpoint of improving strength and reducing production costs, the layer (a1) is preferably a layer containing PAN-based carbon fibers. The layer (a1) preferably includes both a layer containing pitch-based carbon fibers and a layer containing PAN-based carbon fibers.

[0013] The tensile modulus of the pitch-based carbon fiber used in layer (a1) is preferably 600 GPa or more, more preferably 640 GPa or more, even more preferably 760 GPa or more, and preferably 800 GPa or less, more preferably 780 GPa or less, and even more preferably 780 GPa or less. When the tensile modulus of the pitch-based carbon fiber is equal to or greater than the lower limit, the desired deflection performance is easily achieved. When the tensile modulus of the pitch-based carbon fiber is equal to or less than the upper limit, the vibration of the laminate converges more quickly. In other words, the vibration damping properties of the laminate are easily exhibited. The upper and lower limits of the tensile modulus of the pitch-based carbon fiber can be arbitrarily combined, and can be, for example, 600 to 800 GPa, 640 to 780 GPa, or 760 to 780 GPa. The tensile modulus of the pitch-based carbon fiber is a value measured in accordance with JIS R 7601:1986.

[0014] The tensile modulus of the PAN-based carbon fiber used in layer (a1) is preferably 200 GPa or more, more preferably 220 GPa or more, even more preferably 230 GPa or more, and preferably 400 GPa or less, more preferably 350 GPa or less, and even more preferably 320 GPa or less. When the tensile modulus of the PAN-based carbon fiber is equal to or greater than the above-mentioned lower limit, the rigidity of the laminate is improved. When the tensile modulus of the PAN-based carbon fiber is equal to or less than the above-mentioned upper limit, the production cost can be reduced. The upper and lower limits of the tensile modulus of the PAN-based carbon fiber can be arbitrarily combined, and can be, for example, 200 to 400 GPa, 220 to 350 GPa, or 230 to 320 GPa. The tensile modulus of the PAN-based carbon fiber is measured in the same manner as the tensile modulus of the pitch-based carbon fiber.

[0015] The carbon fiber (M) may be a continuous fiber or a discontinuous fiber, but is preferably a continuous fiber. The average fiber diameter of the carbon fiber (M) is preferably 5 μm or more, more preferably 7 μm or more, even more preferably 10 μm or more, and preferably 17 μm or less, more preferably 15 μm or less, and even more preferably 13 μm or less. The upper and lower limits of the average fiber diameter of the carbon fiber (M) can be arbitrarily combined, for example, 5 to 17 μm, 7 to 15 μm, or 10 to 13 μm. The average fiber diameter of the carbon fiber (M) is a value obtained by, for example, photographing the cross section of the carbon fiber at 50 times or more magnification using a microscope such as a scanning electron microscope, measuring the diameter of 50 randomly selected single fibers, and averaging the measured diameters. Note that when the cross section of the carbon fiber has a major axis and a minor axis, the major axis is taken as the fiber diameter of that fiber.

[0016] The carbon fiber (M) is preferably used in the form of a carbon fiber bundle in which a plurality of carbon fibers are bundled together. The number of filaments in the carbon fiber bundle is preferably 3,000 or more, more preferably 6,000 or more, even more preferably 12,000 or more, and preferably 24,000 or less, more preferably 18,000 or less, and even more preferably 15,000 or less. When the number of filaments in the carbon fiber bundle is within the above range, the productivity and mechanical properties on an industrial scale are excellent. The upper and lower limits of the number of filaments in the carbon fiber bundle can be arbitrarily combined, and can be, for example, 3,000 to 24,000, 6,000 to 18,000, or 12,000 to 15,000.

[0017] The shape of the carbon fiber (M) is not particularly limited, and examples thereof include fiber bundles such as chopped strands and roving, woven fabrics such as plain weave and twill weave, knitted fabrics, nonwoven fabrics, fiber paper, sheets in which a plurality of continuous fibers are aligned in one direction (UD material (unidirectional material)), sheets in which short fibers (bundles) cut to a certain length are randomly deposited, etc. Among these, from the viewpoint of mechanical properties such as tensile modulus and tensile strength, the carbon fiber shapes are preferably woven fabrics, knitted fabrics, and UD material, and more preferably UD material.

[0018] The weight of the carbon fiber substrate such as UD material is 75 g / m ２ More than 125 g / m ２ More preferably, 560 g / m ２ Preferably, 450 g / m or less ２ The upper and lower limits of the basis weight of the carbon fiber base material can be arbitrarily combined, and are, for example, 75 to 560 g / m ２ , or 125 to 450 g / m ２ It can be said that:

[0019] The layer (a1) may contain fibers other than carbon fibers. Examples of the other fibers include inorganic fibers other than carbon fibers, organic fibers, metal fibers, or hybrid reinforcing fibers combining these. Examples of inorganic fibers other than carbon fibers include graphite fibers, silicon carbide fibers, alumina fibers, tungsten carbide fibers, boron fibers, and glass fibers. Examples of organic fibers include aramid fibers, high-density polyethylene fibers, and other common nylon fibers and polyester fibers. Examples of metal fibers include stainless steel and iron fibers. Examples of hybrid reinforcing fibers include metal-coated carbon fibers. Among these, glass fibers are preferred as the other fibers, considering the mechanical properties such as the strength of the prepreg. These other fibers may be used alone, or two or more may be mixed in any combination and ratio.

[0020] The matrix resin constituting layer (a1) may be, for example, a thermosetting resin. Specific examples include epoxy resins, phenolic resins, unsaturated imide resins, cyanate resins, isocyanate resins, benzoxazine resins, oxetane resins, amino resins, unsaturated polyester resins, allyl resins, dicyclopentadiene resins, silicone resins, triazine resins, and melamine resins. From the viewpoint of improving adhesion to carbon fibers and the mechanical properties of the composite material, epoxy resins are preferred as the matrix resin. Hereinafter, the epoxy resin used in layer (a1) will also be referred to as "epoxy resin (N)." These matrix resins may be used alone or in any combination and ratio of two or more.

[0021] Examples of the epoxy resin (N) include glycidyl ether epoxy resins such as bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, biphenyl epoxy resins, phenol novolac epoxy resins, and cresol novolac epoxy resins, as well as glycidyl ester epoxy resins, glycidyl amine epoxy resins, linear aliphatic epoxy resins, alicyclic epoxy resins, and heterocyclic epoxy resins. These epoxy resins may be used alone or in any combination and ratio of two or more.

[0022] In addition to the fibers and the matrix resin, the layer (a1) may contain various additives. Examples of the additives include antioxidants, internal mold release agents, low-profile agents, colorants, flame retardants, and modifiers. These additives may be used alone or in any combination and ratio of two or more.

[0023] The carbon fiber content per layer (a1) (hereinafter referred to as "fiber content") is preferably 45% by volume or more, more preferably 50% by volume or more, and even more preferably 55% by volume or more, and is preferably 75% by volume or less, more preferably 70% by volume or less, and even more preferably 65% ​​by volume or less, relative to the total volume of each layer (a1). When the fiber content is equal to or greater than the lower limit, the mechanical properties of the laminate are further improved. When the fiber content is equal to or less than the upper limit, sufficient adhesion between the carbon fiber (M) and the epoxy resin (N) can be ensured. The upper and lower limits of the fiber content per layer (a1) can be arbitrarily combined, and can be, for example, 45 to 75% by volume, 50 to 70% by volume, or 55 to 65% by volume.

[0024] The content of the epoxy resin (N) per layer (a1) (hereinafter also referred to as "resin content") is preferably 20% by mass or more, more preferably 25% by mass or more, even more preferably 30% by mass or more, and preferably 45% by mass or less, more preferably 40% by mass or less, and even more preferably 35% by mass or less, relative to the total mass of each layer (a1). When the resin content is equal to or greater than the lower limit, sufficient adhesion between the carbon fiber (M) and the epoxy resin (N) can be ensured. When the resin content is equal to or less than the upper limit, the mechanical properties of the laminate are further improved. The upper and lower limits of the resin content per layer (a1) can be arbitrarily combined, and can be, for example, 20 to 45% by mass, 25 to 40% by mass, or 30 to 35% by mass.

[0025] The thickness of each layer (a1) is preferably 0.1 mm or more, more preferably 0.15 mm or more, even more preferably 0.2 mm or more, and preferably 1.5 mm or less, more preferably 1.0 mm or less, and even more preferably 0.8 mm or less. When the thickness of each layer (a1) is equal to or greater than the aforementioned lower limit, the desired thickness can be obtained with a relatively small number of layers. When the thickness of each layer (a1) is equal to or less than the aforementioned upper limit, the desired thickness can be obtained with an even smaller number of layers. The upper and lower limits of the thickness of each layer (a1) can be arbitrarily combined, and can be, for example, 0.1 to 1.5 mm, 0.15 to 1.0 mm, or 0.2 to 0.8 mm. The thickness (average thickness) of layer (a1) is measured by observing the cross section of the laminate with a microscope or the like, and is calculated as the arithmetic average of the measurements.

[0026] (Layer Structure of First Layer (a)) The first layer (a) preferably includes, as the carbon fiber reinforced resin layer (a1), a layer (a11) containing unidirectionally aligned pitch-based carbon fibers and a cured product of an epoxy resin (N1). The plurality of first layers (a) may all be composed of the layer (a11), or may include the layer (a11) and a layer other than the layer (a11). For example, the first layer (a) may include the layer (a11) and a layer (a12) containing unidirectionally aligned PAN-based carbon fibers and a cured product of an epoxy resin (N2).

[0027] The first layer (a) is a layer containing carbon fibers oriented at an orientation angle of 0° when the longitudinal direction of the laminate is taken as 0°, i.e., oriented parallel to the longitudinal direction of the laminate, and a cured product of an epoxy resin (hereinafter referred to as “layer (β ０ It is also called "layer (β)." ０ Preferably, the layer (β) contains at least one of the layer (a11) and the layer (a12), more preferably contains at least the layer (a11), and further preferably contains the layer (a11). ０ In the present invention, the layer (a11) in which the orientation angle of the pitch-based carbon fiber is 0° is particularly referred to as "layer (a11)". ０ The layer (a12) in which the orientation angle of the PAN-based carbon fiber is 0° is particularly referred to as the “layer (a12).” ０ ") layer (β ０ ) may be one type or two or more types.

[0028] The plurality of first layers (a) are layers (β ０ ) and layer (β ０ In other words, the plurality of first layers (a) preferably include two or more layers having different carbon fiber orientation angles, specifically, layers (β ０ ) and layer (β), and layer (a11 ０ It is more preferable that the plurality of first layers (a) have a layer (β) and a layer (β). ０ By including the first layer (a) and the layer (β), it is possible to improve the vibration damping property of the laminate and prevent cracking of the laminate. ０ ) and layer (β), ０ ) is preferably located closer to the outermost layer of the laminate than layer (β).

[0029] The layer (β) preferably includes at least one of the layer (a11) and the layer (a12). ０From the viewpoint of suppressing deflection in a direction of 45° or more and 90° or less with respect to the orientation of the carbon fibers contained in the layer (β), the layer (β) is preferably the layer (a11). ０ ) and when the layer (β) is the layer (a11), the layer (β ０ ) layer (a11 ０ The epoxy resin (N1) used in the layer (a11) that is the layer (β) may be the same type as or different from the epoxy resin (N1) used in the layer (a11) that is the layer (β). From the viewpoint of increasing the strength of the laminate and reducing the production cost, the layer (β) is preferably the layer (a12). The layer (β) may be one type or two or more types.

[0030] The orientation angle (θ) of the carbon fibers in the layer (β) is ０ The orientation angle of the carbon fibers (θ ０ When the orientation angle (θ) is set to 0°, the angle is 45° or more and 90° or less, preferably 45°, 60°, or 90°, more preferably 45° or 90°, and particularly preferably 90°. In this specification, a layer containing carbon fibers aligned in one direction so that the orientation angle (θ) is 90° and a cured product of an epoxy resin is referred to as a "layer (β ９０ In particular, when pitch-based carbon fiber is included as the carbon fiber, it is called a "layer (a11)." ９０ ) and when PAN-based carbon fiber is included as the carbon fiber, it is called a "layer (a12 ９０ Other orientation angles (θ) are also expressed in the same way.

[0031] Examples of the configuration of the plurality of first layers (a) include the following combinations: ０ ) and layer (a11 ９０ ) combination. Layer (a11 ０ ) and layer (a12 ９０ ) combination. Layer (a11 ０ ) and layer (a11 ９０ ) and layer (a12 ９０ ) combination. Layer (a11 ０ ) and layer (a11 ４５ ) combination. Layer (a11 ０ ) and layer (a12 ４５) combination. Layer (a11 ０ ) and layer (a11 ４５ ) and layer (a12 ４５ ) combination. Layer (a11 ０ ) and layer (a11 ６０ ) combination. Layer (a11 ０ ) and layer (a12 ６０ ) combination. Layer (a11 ０ ) and layer (a11 ６０ ) and layer (a12 ６０ ) combination. Layer (a11 ０ ) and layer (a11 ９０ ) and layer (a11 ４５ ) combination. Layer (a11 ０ ) and layer (a12 ９０ ) and layer (a12 ４５ ) combination. Layer (a11 ０ ) and layer (a11 ９０ ) and layer (a12 ４５ ) combination. Layer (a11 ０ ) and layer (a12 ９０ ) and layer (a11 ４５ ) combination with layer (a12) ０ ) and layer (a12 ９０ ) in combination.

[0032] The laminate preferably has a symmetrical laminate structure from the viewpoint of suppressing warpage during processing. Therefore, for example, in the case of the laminate 200 shown in Fig. 1, when the four first layers (a) 210 are arranged in order from the bottom as a first a layer 211, a second a layer 212, a third a layer 213, and a fourth a layer 214, it is preferable that the first a layer 211 and the fourth a layer 214 are the same layer (a1), and it is preferable that the second a layer 212 and the third a layer 213 are the same layer (a1). When the plurality of first layers (a) 210 are arranged as a layer (β ０ ), at least the first a layer 211 and the fourth a layer 214 are layers (β ０ ), and the layer (a11 ０ Here, "the same" means that the structure of the layer (a1) is the same, and the thickness of the layer (a1) and the orientation angle of the carbon fibers are also the same.

[0033] <Other Forms> When the first layer (a) is either a ceramic layer (a2) or a metal layer (a3), examples of the configuration of the multiple first layers (a) include the following combinations: - A combination of a ceramic layer (a2) and a ceramic layer (a2). - A combination of an aluminum layer and an aluminum layer. - A combination of a SUS layer and a SUS layer. - A combination of a titanium alloy layer and a titanium alloy layer.

[0034] The thickness per layer of the ceramic layer (a2) and the metal layer (a3) ​​is preferably 0.4 mm or more, more preferably 0.6 mm or more, and preferably 1.5 mm or less, more preferably 1.0 mm or less. When the thickness per layer is equal to or greater than the lower limit, the desired thickness can be obtained with a relatively small number of layers. When the thickness per layer is equal to or less than the upper limit, the desired thickness can be obtained with an even smaller number of layers. The upper and lower limits of the thickness per layer of the ceramic layer (a2) and the metal layer (a3) ​​can be arbitrarily combined, and can be, for example, 0.4 to 1.5 mm or 0.6 to 1.0 mm. The thickness (average thickness) of the ceramic layer (a2) and the metal layer (a3) ​​is measured by observing the cross section of the laminate with a microscope or the like, and is calculated as the arithmetic mean thereof.

[0035] "Second layer (b)" The second layer (b) 220 in the example shown in Figure 1 is located midway between the four first layers (a). The "middle" here refers to the center (intermediate) in the thickness direction (stacking direction) of the laminate 200, and in the example shown in Figure 1, it is between the second a layer 212 and the third a layer 213. In other words, the second layer (b) 220 in the example shown in Figure 1 is a middle layer of the laminate 200, and is disposed only in a region including the center in the thickness direction of the laminate 200.

[0036] The second layer (b) is a layer selected from a layer (b1) containing mainly an epoxy resin (S) (excluding the carbon fiber reinforced resin layer (a1); hereinafter, also referred to as "layer (b1)") and a layer (b2) containing mainly a thermoplastic elastomer (T) (hereinafter, also simply referred to as "layer (b2)"). From the viewpoint of vibration damping effect, the second layer (b) is preferably layer (b1). The layer (b1) and layer (b2) in this embodiment are the same as the layer (B1) and layer (B2), respectively, described in the laminate precursor described below. The second layer (b) is preferably a layer made of a resin that does not contain fibers.

[0037] <Layer (b1)> The layer (b1) is a layer (epoxy resin layer) mainly containing an epoxy resin (S). Here, "mainly containing an epoxy resin (S)" means that the proportion of the epoxy resin (S) relative to the total mass of the layer (b1) is 50% by mass or more. The proportion of the epoxy resin (S) relative to the total mass of the layer (b1) is preferably 70% by mass or more, and more preferably 90% by mass or more. In addition to the epoxy resin (S), the layer (b1) may further contain components other than the epoxy resin (S) (hereinafter also referred to as "other components"), as long as the effects of the present invention are not impaired.

[0038] The layer (b1) is preferably a sheet or film of epoxy resin (S). Generally, a "sheet" is defined in JIS as a thin, flat product whose thickness is small relative to its length and width. Generally, a "film" is a thin, flat product whose thickness is extremely small relative to its length and width, with an arbitrarily limited maximum thickness, and is usually supplied in roll form (JIS K 6900:1994). However, the boundary between "sheet" and "film" is unclear, and there is no need to distinguish between the two terms in this specification. Therefore, in this specification, the term "film" is intended to include "sheet," and the term "sheet" is intended to include "film."

[0039] (Physical Properties) The breaking elongation of the layer (b1) is preferably 100% or more, more preferably 200% or more, and preferably 500% or less, more preferably 400% or less. When the breaking elongation of the layer (b1) is equal to or greater than the lower limit, the vibration damping properties of the laminate are further improved. When the breaking elongation of the layer (b1) is equal to or less than the upper limit, the rigidity of the laminate is further improved. The upper and lower limits of the breaking elongation of the layer (b1) can be arbitrarily combined, and can be, for example, 100 to 500% or 200 to 400%. The breaking elongation of the layer (b1) can be determined as follows. All layers except for layer (b1) are scraped off from the laminate, and a test piece measuring 10 mm in width and 50 mm in length is cut out. A tensile test is performed in accordance with JIS K 7127:1999 at a test speed of 200 mm / min in an environment of 23°C and 50% RH, and the elongation at tensile break is measured.

[0040] The tensile modulus of layer (b1) is preferably 3 MPa or more, more preferably 3.5 MPa or more, even more preferably 4 MPa or more, and preferably 12 MPa or less, more preferably 10 MPa or less, and even more preferably 8 MPa or less. When the tensile modulus of layer (b1) is equal to or greater than the above-mentioned lower limit, the rigidity of the laminate is further improved. When the tensile modulus of layer (b1) is equal to or less than the above-mentioned upper limit, the vibration damping properties of the laminate are further improved. The upper and lower limits of the tensile modulus of layer (b1) can be arbitrarily combined, and can be, for example, 3 to 12 MPa, 3.5 to 10 MPa, or 4 to 8 MPa. The tensile modulus of layer (b1) can be determined as follows. That is, layers other than the layer (b1) are scraped off from the laminate, and a test piece having a width of 10 mm and a length of 50 mm is cut out to prepare a test piece. The tensile modulus of the test piece is measured by the dynamic viscoelasticity measurement method described in JIS K 7244-4:1999 using a dynamic viscoelasticity measuring device (for example, product name "DVA-200" manufactured by IT Measurement & Control Co., Ltd.) under measurement conditions of a frequency of 1 Hz, a temperature rise rate of 3°C / min, and a double-support tensile mode.

[0041] The tensile strength of layer (b1) is preferably 10 MPa or more, more preferably 15 MPa or more, even more preferably 20 MPa or more, and preferably 50 MPa or less, more preferably 45 MPa or less, and even more preferably 40 MPa or less. If the tensile strength of layer (b1) is equal to or greater than the lower limit, the rigidity of the laminate is further improved. If the tensile strength of layer (b1) is equal to or less than the upper limit, the vibration damping properties of the laminate are further improved. The upper and lower limits of the tensile strength of layer (b1) can be arbitrarily combined, and can be, for example, 10 to 50 MPa, 15 to 45 MPa, or 20 to 40 MPa. The tensile strength of layer (b1) can be determined as follows. That is, layers other than the layer (b1) are scraped off from the laminate, and a test piece having a width of 10 mm and a length of 50 mm is cut out to prepare a test piece. The tensile strength of the test piece is measured by the dynamic viscoelasticity measurement method described in JIS K 7244-4:1999 using a dynamic viscoelasticity measuring device (for example, product name "DVA-200" manufactured by IT Measurement & Control Co., Ltd.) under measurement conditions of a frequency of 1 Hz, a heating rate of 3°C / min, and a double-support tensile mode.

[0042] (Epoxy Resin (S)) The epoxy resin (S) is not particularly limited as long as it is an epoxy resin that gives the layer (b1) an elongation at break of 100% or more and 500% or less, but it is preferably an epoxy resin different from the epoxy resin (N). The epoxy resin (S) is preferably an epoxy resin having elasticity (hereinafter also referred to as "elastic epoxy resin"). Here, "elastic epoxy resin" refers to, for example, an epoxy resin whose expansion and contraction can be visually confirmed when a sheet or film of the elastic epoxy resin is pulled by hand.

[0043] The elastic epoxy resin can be obtained, for example, by thermally curing an elastic epoxy resin composition containing an elastic chemical structure. More specifically, it can be obtained by thermally curing an elastic epoxy resin composition containing a curing agent and a main component containing an epoxy resin having a chemical structure that becomes an elastic epoxy resin after curing. Alternatively, it can be obtained by curing a resin raw material that becomes an elastic epoxy resin after curing with radiation such as gamma rays, electron beams, or X-rays.

[0044] The elastic epoxy resin is more preferably an epoxy resin having a block structure of a rigid component and a flexible component (hereinafter also referred to as "epoxy resin (S1)"). By having such a structure, it is likely to have excellent elasticity. The elastic epoxy resin can be obtained, for example, by curing an elastic epoxy resin composition containing a base agent and a curing agent. Below, the elastic epoxy resin composition before curing will be explained.

[0045] The elastic epoxy resin composition preferably contains an elastic epoxy resin as a main component, and more preferably contains an epoxy resin (S1). The rigid component of the epoxy resin (S1) preferably contains an aromatic ring structure, for example, a fused aromatic ring structure such as a benzene ring, a naphthalene ring, an anthracene ring, or a pyrene ring, a structure containing multiple aromatic ring structures such as a biphenol ring, a cardo structure, or a fluorene ring, or a heterocyclic structure such as a pyrrole ring or a thiophene ring. The flexible component of the epoxy resin (S1) preferably contains an aliphatic hydrocarbon group, for example, an alkylene group having 1 to 8 carbon atoms, an ethylene glycol group, a propylene glycol group, or a butylene glycol group. When the elastic epoxy resin composition contains such an epoxy resin (S1), flexibility tends to be imparted to the cured product of the layer (b1).

[0046] The epoxy resin (S1) does not necessarily have to have an epoxy group or an epoxy group-derived structure in both the rigid component and the flexible component. That is, the epoxy resin (S1) only needs to have an epoxy group or an epoxy group-derived structure in at least one of the rigid component and the flexible component. From the viewpoint of imparting flexibility while retaining the inherent properties of epoxy resins, such as excellent heat resistance and mechanical strength, it is preferable that only one of the rigid component and the flexible component has an epoxy group or an epoxy group-derived structure.

[0047] Examples of the epoxy resin (S1) include a copolymer of bisphenol F and 1,6-hexanediol diglycidyl ether, a copolymer of 1,6-hexanediol and bisphenol F diglycidyl ether, a copolymer of bisphenol F and 1,4-butanediol diglycidyl ether, a copolymer of 1,4-butanediol and bisphenol F diglycidyl ether, a copolymer of bisphenol A and 1,6-hexanediol diglycidyl ether, and a copolymer of 1,6-hexanediol and bisphenol A diglycidyl ether. copolymers of bisphenol A and 1,4-butanediol diglycidyl ether, copolymers of 1,4-butanediol and bisphenol A diglycidyl ether, copolymers of tetramethylbiphenol and 1,6-hexanediol diglycidyl ether, copolymers of 1,6-hexanediol and tetramethylbiphenol diglycidyl ether, copolymers of tetramethylbiphenol and 1,4-butanediol diglycidyl ether, copolymers of 1,4-butanediol and tetramethylbiphenol diglycidyl ether, biphenyls, Copolymer of phenol and 1,6-hexanediol diglycidyl ether, copolymer of 1,6-hexanediol and biphenol diglycidyl ether, copolymer of biphenol and 1,4-butanediol diglycidyl ether, copolymer of 1,4-butanediol and biphenol diglycidyl ether, copolymer of 1,4-naphthalenediol and 1,6-hexanediol diglycidyl ether, copolymer of 1,6-hexanediol and 1,4-naphthalenediol diglycidyl ether, copolymer of 1,4-naphthalenediol and 1, copolymers of 1,4-butanediol and 1,4-naphthalenediol diglycidyl ether, copolymers of 1,6-naphthalenediol and 1,6-hexanediol diglycidyl ether, copolymers of 1,6-hexanediol and 1,6-naphthalenediol diglycidyl ether, copolymers of 1,6-naphthalenediol and 1,4-butanediol diglycidyl ether, and copolymers of 1,4-butanediol and 1,6-naphthalenediol diglycidyl ether.From the viewpoint of imparting flexibility, the epoxy resin (S1) preferably contains a copolymer of bisphenol F and 1,6-hexanediol diglycidyl ether. These epoxy resins (S1) may be used alone or in any combination and ratio of two or more.

[0048] The elastic epoxy resin composition may further contain, in addition to the epoxy resin (S1) as the main component, an epoxy resin other than the epoxy resin (S1) (hereinafter also referred to as "another epoxy resin (S2)"), as necessary. Examples of the other epoxy resin (S2) include the above-mentioned epoxy resin (N).

[0049] The stretchable epoxy resin composition may contain only the epoxy resin (S1) as the main component, or may contain the epoxy resin (S1) and another epoxy resin (S2). When the stretchable epoxy resin composition contains the epoxy resin (S1) and another epoxy resin (S2), the content of the epoxy resin (S1) as the solid content in the stretchable epoxy resin composition relative to the total mass of all epoxy components is preferably 50% by mass or more and 99% by mass or less. Here, "solid content" refers to components excluding solvent, and includes not only solid epoxy resins or epoxy compounds, but also semi-solid and viscous liquid substances. Furthermore, "total epoxy components" refers to the sum of the epoxy resin (S1) and the other epoxy resin (S2).

[0050] The curing agent contained in the stretchable epoxy resin composition contributes to the crosslinking reaction between the epoxy groups of the epoxy resin (S1) and groups reactive with the epoxy groups. There are no particular limitations on the curing agent, and any commonly known curing agent for epoxy resins can be used. Examples include phenolic curing agents, amine curing agents such as aliphatic amines, polyetheramines, alicyclic amines, and aromatic amines, acid anhydride curing agents, amide curing agents, tertiary amines, imidazole and its derivatives, organic phosphines, phosphonium salts, tetraphenylboron salts, organic acid dihydrazides, boron halide amine complexes, polymercaptan curing agents, isocyanate curing agents, and blocked isocyanate curing agents. Among these, curing agents having an alicyclic structure are preferred from the viewpoints of high transparency and minimal coloration. These curing agents may be used alone, or two or more may be mixed in any combination and ratio.

[0051] The curing agent having an alicyclic structure may be any substance that has an alicyclic structure and contributes to at least one of the crosslinking reaction and the chain extension reaction between epoxy groups in the epoxy resin (S). Specific examples include alicyclic polyamines and alicyclic acid anhydrides. More specific examples of alicyclic polyamines include 1,4-diazabicyclo[2.2.2]octane, 1,8-diazabicyclo[5.4.0]undec-7-ene, N,N'-dimethylpiperazine, N-aminoethylpiperazine, menthene diamine, isophorone diamine, hexamethylenetetramine, methylenebis(cyclohexanamine), 1,3-bis(aminomethyl)cyclohexane, norbornene diamine, 1,2-diaminocyclohexane, and modified alicyclic polyamines obtained by epoxy-modifying, ethylene oxide-modifying, dimer acid-modifying, Mannich-modifying, Michael addition-modifying, thiourea condensing, or ketiminizing these alicyclic polyamines. Examples of alicyclic acid anhydrides include hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, etc. Among these, alicyclic polyamines are preferred, and among these, isophoronediamine, hexamethylenetetramine, methylenebis(cyclohexanamine), 1,3-bis(aminomethyl)cyclohexane, norbornenediamine, 1,2-diaminocyclohexane, and modified products thereof are particularly preferred.

[0052] As the curing agent having an alicyclic structure, commercially available products can also be used, such as those available under the trade names "jER Cure 113" and "jER Cure ST-14" manufactured by Mitsubishi Chemical Corporation; and those available under the trade name "Rikacid MH-700" manufactured by New Japan Chemical Co., Ltd.

[0053] The content of the curing agent in the stretchable epoxy resin composition is preferably 0.1 parts by mass or more, more preferably 1 part by mass or more, even more preferably 3 parts by mass or more, particularly preferably 5 parts by mass or more, and is preferably 100 parts by mass or less, more preferably 80 parts by mass or less, even more preferably 60 parts by mass or less, particularly preferably 40 parts by mass or less, relative to 100 parts by mass of all epoxy resin components (total content of all epoxy components) contained in the stretchable epoxy resin composition. The upper and lower limits of the content of the curing agent can be arbitrarily combined, and can be, for example, 0.1 to 100 parts by mass, 1 to 80 parts by mass, 3 to 60 parts by mass, or 5 to 40 parts by mass.

[0054] In order to adjust the viscosity appropriately during handling when forming the layer (b1), the stretchable epoxy resin composition may be diluted by blending it with a solvent. The solvent is used to ensure ease of handling and workability during molding of the layer (b1), and there are no particular restrictions on the amount used. Examples of solvents include acetone, methyl ethyl ketone, toluene, xylene, methyl isobutyl ketone, ethyl acetate, ethylene glycol monomethyl ether, N,N-dimethylformamide, N,N-dimethylacetamide, methanol, and ethanol. These solvents may be used alone, or two or more may be mixed in any combination and ratio.

[0055] The elastic epoxy resin composition may contain other components in addition to the base resin and curing agent. The other components can be used in appropriate combinations depending on the desired physical properties of the elastic epoxy resin composition. Examples of the other components include inorganic fillers (e.g., powdered inorganic reinforcing agents and inorganic fillers), organic fillers (e.g., rubber particles, acrylic particles), coupling agents, plasticizers, diluents, flexibility-imparting agents, dispersants, wetting agents, colorants, pigments, UV absorbers, light stabilizers such as hindered amine light stabilizers, antioxidants, defoamers, mold release agents, and flow control agents. These other components may be used alone or in any combination and ratio of two or more.

[0056] <Layer (b2)> The layer (b2) is a layer mainly containing a thermoplastic elastomer (T). "Mainly containing a thermoplastic elastomer (T)" means that the proportion of the thermoplastic elastomer (T) relative to the total mass of the layer (b2) is 50% by mass or more. The proportion of the thermoplastic elastomer (T) relative to the total mass of the layer (b2) is preferably 70% by mass or more, and more preferably 90% by mass or more. In addition to the thermoplastic elastomer (T), the layer (b2) may further contain components other than the thermoplastic elastomer (T) (hereinafter also referred to as "other components") as needed, as long as the effects of the present invention are not impaired. The layer (b2) is preferably a sheet or film of the thermoplastic elastomer (T).

[0057] (Physical Properties) The breaking elongation of layer (b2) is preferably 800% or more, preferably 900% or more, and preferably 1200% or less, more preferably 1100% or less. When the breaking elongation of layer (b2) is equal to or greater than the lower limit, the vibration damping properties of the laminate are further improved. When the breaking elongation of layer (b2) is equal to or less than the upper limit, the rigidity of the laminate is further improved. The upper and lower limits of the breaking elongation of layer (b2) can be arbitrarily combined, and can be, for example, 800 to 1200% or 900 to 1100%. The breaking elongation of layer (b2) can be determined as follows. All layers except for layer (b2) are scraped off from the laminate, and a test piece measuring 10 mm in width and 50 mm in length is cut out. A tensile test is performed in accordance with JIS K 7127:1999 at a test speed of 200 mm / min in an environment of 23°C and 50% RH, and the elongation at tensile break is measured.

[0058] The tensile modulus of layer (b2) is preferably 3 MPa or more, more preferably 3.5 MPa or more, even more preferably 4 MPa or more, and preferably 20 MPa or less, more preferably 15 MPa or less, and even more preferably 10 MPa or less. When the tensile modulus of layer (b2) is equal to or greater than the above-mentioned lower limit, the rigidity of the laminate is further improved. When the tensile modulus of layer (b2) is equal to or less than the above-mentioned upper limit, the vibration damping properties of the laminate are further improved. The upper and lower limits of the tensile modulus of layer (b2) can be arbitrarily combined, and can be, for example, 3 to 20 MPa, 3.5 to 15 MPa, or 4 to 10 MPa. The tensile modulus of layer (b2) can be determined as follows. That is, layers other than layer (b2) are scraped off from the laminate, and a test piece having a width of 10 mm and a length of 50 mm is cut out to prepare a test piece. The tensile modulus of the test piece is measured by the dynamic viscoelasticity measurement method described in JIS K 7244-4:1999 using a dynamic viscoelasticity measuring device (for example, product name "DVA-200" manufactured by IT Measurement & Control Co., Ltd.) under measurement conditions of a frequency of 1 Hz, a temperature rise rate of 3°C / min, and a double-support tensile mode.

[0059] The tensile strength of layer (b2) is preferably 8 MPa or more, more preferably 9 MPa or more, more preferably 10 MPa or more, and preferably 40 MPa or less, more preferably 35 MPa or less, and more preferably 30 MPa or less. If the tensile strength of layer (b2) is equal to or greater than the lower limit, the rigidity of the laminate is further improved. If the tensile strength of layer (b2) is equal to or less than the upper limit, the vibration damping properties of the laminate are further improved. The upper and lower limits of the tensile strength of layer (b2) can be arbitrarily combined, and can be, for example, 8 to 40 MPa, 9 to 35 MPa, or 10 to 30 MPa. The tensile strength of layer (b2) can be determined as follows. All layers except for layer (b2) are scraped off from the laminate, and a test piece measuring 10 mm in width and 50 mm in length is cut out. The tensile strength of the test piece is measured using a dynamic viscoelasticity measuring device (for example, manufactured by IT Measurement & Control Co., Ltd., product name "DVA-200") according to the dynamic viscoelasticity measurement method described in JIS K 7244-4:1999 under measurement conditions of a frequency of 1 Hz, a heating rate of 3°C / min, and a double-support tensile mode.

[0060] (Thermoplastic elastomer (T)) The thermoplastic elastomer (T) is not particularly limited as long as it is a thermoplastic elastomer that gives the layer (b2) an elongation at break of 800% or more and 1200% or less. Examples thereof include styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, urethane-based thermoplastic elastomers, vinyl chloride-based thermoplastic elastomers, ester-based thermoplastic elastomers, amide-based thermoplastic elastomers, silicone-based thermoplastic elastomers, and acrylic-based thermoplastic elastomers. Preferred thermoplastic elastomers (T) are styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, and urethane-based thermoplastic elastomers. One type of thermoplastic elastomer (T) may be used alone, or two or more types may be mixed in any combination and ratio.

[0061] Examples of styrene-based thermoplastic elastomers include styrene-butadiene-styrene copolymer (SBS), styrene-isoprene-styrene copolymer (SIS), styrene-ethylene-butene copolymer (SEB), styrene-ethylene-propylene copolymer (SEP), styrene-ethylene-butene-styrene copolymer (SEBS), styrene-ethylene-propylene-styrene copolymer (SEPS), styrene-ethylene-ethylene-propylene-styrene copolymer (SEEPS), styrene-butadiene-butylene-styrene copolymer (partially hydrogenated styrene-butadiene-styrene copolymer: SBBS), partially hydrogenated styrene-isoprene-styrene copolymer, and partially hydrogenated styrene-isoprene-butadiene-styrene copolymer. A "-" indicates that the monomers forming the unit connected by the "-" are copolymerized, and a "-" indicates that the monomer is randomly modified by hydrogenation or the like after copolymerization. One type of styrene-based thermoplastic elastomer may be used alone, or two or more types may be mixed in any combination and ratio.

[0062] Examples of olefin-based thermoplastic elastomers include ethylene-propylene rubber, ethylene-propylene-diene rubber, ethylene-vinyl acetate copolymer, butyl rubber, butadiene rubber, propylene-butene copolymer, ethylene-acrylic acid ester copolymer, etc. One type of olefin-based thermoplastic elastomer may be used alone, or two or more types may be mixed in any combination and ratio.

[0063] Examples of urethane-based thermoplastic elastomers include reaction products of polymeric diols, organic diisocyanates, and chain extenders. Examples of polymeric diols include polyester diols, polyether diols, polyester ether diols, polycarbonate diols, and polyester polycarbonate diols. Examples of organic diisocyanates include 4,4'-diphenylmethane diisocyanate, toluene diisocyanate, p-phenylene diisocyanate, xylylene diisocyanate, naphthalene diisocyanate, hydrogenated 4,4'-diphenylmethane diisocyanate (4,4'-dicyclohexylmethane diisocyanate), isophorone diisocyanate, and hexamethylene diisocyanate. Examples of chain extenders include ethylene glycol, diethylene glycol, 1,4-butanediol, 1,5-pentanediol, 2-methyl-1,3-propanediol, 1,6-hexanediol, neopentyl glycol, 1,9-nonanediol, cyclohexanediol, 1,4-bis(β-hydroxyethoxy)benzene, etc. The urethane-based thermoplastic elastomer may be used alone or in any combination and ratio of two or more.

[0064] (Other Components) Examples of the other components include the other components exemplified above in the description of the layer (b1).

[0065] <Thickness> The thickness ratio of the second layer (b) is 0.3% or more and less than 30% of the total thickness of the first layer (a) and the second layer (b). When the thickness ratio of the second layer (b) is equal to or greater than the lower limit, sufficient vibration damping performance can be expected. When the thickness ratio of the second layer (b) is less than the upper limit, the impact on load deflection performance can be further suppressed. The thickness ratio of the second layer (b) is preferably 1% or more, more preferably 3% or more. The thickness ratio of the second layer (b) is preferably 20% or less, more preferably 10% or less. The upper and lower limits of the thickness ratio of the second layer (b) can be arbitrarily combined, and can be, for example, 1 to 20% or 3 to 10%. The thickness (average thickness) of the first layer (a) and the thickness (average thickness) of the second layer (b) are measured by observing the cross section of the laminate with a microscope or the like, and are calculated as the arithmetic mean thereof.

[0066] The thickness of the second layer (b) is preferably 0.03 mm or more, more preferably 0.05 mm or more, even more preferably 0.1 mm or more, and preferably 0.5 mm or less, more preferably 0.5 mm or less, and even more preferably 0.4 mm or less. The thinner the thickness of the second layer (b), the more preferable it is as long as the desired vibration damping effect can be obtained. If the thickness of the second layer (b) is equal to or greater than the above-mentioned lower limit, the vibration damping properties of the laminate are improved. If the thickness of the second layer (b) is equal to or less than the above-mentioned upper limit, the effect on the load deflection performance can be suppressed. The upper and lower limits of the thickness of the second layer (b) can be arbitrarily combined, and can be, for example, 0.03 to 0.5 mm, 0.05 to 0.5 mm, or 0.1 to 0.4 mm.

[0067] <Loss Factor> The loss tangent (Tan δ) of the second layer (b) is preferably 0.2 or more, more preferably 0.3 or more, at 20°C over the entire frequency range between 100 Hz and 4,000 Hz. If the loss tangent (Tan δ) of the second layer (b) is equal to or greater than the lower limit, sufficient vibration damping properties can be imparted. The loss tangent (Tan δ) of the second layer (b) can be determined as follows. All layers except the second layer (b) are scraped off from the laminate, and a test piece measuring 10 mm wide x 50 mm long is cut out. The storage modulus and loss modulus are measured using a viscoelasticity measuring device (for example, Anton Paar's MCR301 model) in a torsion measurement mode under a nitrogen atmosphere at temperatures of -20°C, -10°C, 0°C, 10°C, and 20°C, frequencies of 0.1 to 25.1 Hz, and strain of 0.1%, and the ratio of loss modulus / storage modulus is calculated, which is defined as the loss tangent (Tan δ).

[0068] "Physical Properties of Laminate" The loss factor of the laminate is preferably 0.01 or more, more preferably 0.01 or more, even more preferably 0.01 or more, and preferably 0.20 or less, more preferably 0.15 or less, and even more preferably 0.10 or less. If the loss factor of the laminate is equal to or greater than the lower limit, when the laminate vibrates, the vibration converges more quickly. In other words, the vibration damping properties of the laminate are further improved. If the loss factor of the laminate is equal to or less than the upper limit, desired vibration damping performance can be expected. The upper and lower limits of the loss factor of the laminate can be arbitrarily combined, and can be, for example, 0.01 to 0.20, 0.01 to 0.15, or 0.01 to 0.10. The loss factor of the laminate can be determined from a damped free vibration waveform obtained by a one-end fixed impact vibration method in accordance with JIS G 0602:1993.

[0069] The time for the vibration attenuation of the laminate to reach 1 / 4 is preferably 0.7 seconds or less, more preferably 0.5 seconds or less, and even more preferably 0.3 seconds or less. The shorter the time for the vibration attenuation of the laminate to reach 1 / 4, the more preferable, and the lower limit is not particularly limited, but is, for example, 0.01 seconds. The upper and lower limits of the time for the vibration attenuation of the laminate to reach 1 / 4 can be arbitrarily combined, and can be, for example, 0.01 to 0.7 seconds, 0.01 to 0.5 seconds, or 0.01 to 0.3 seconds. The time for the vibration attenuation of the laminate to reach 1 / 4 can be determined by measuring the time waveform of vibration displacement using a one-end fixed impact vibration method in accordance with JIS G 0602:1993, and measuring the time for the amplitude to reach 1 / 4 from the initial value.

[0070] The total thickness of the laminate is preferably 1.5 mm or more, more preferably 2 mm or more, and preferably 20 mm or less, more preferably 5 mm or less, and even more preferably 4 mm or less. If the total thickness of the laminate is equal to or greater than the above-mentioned lower limit, it can be used as a conveying member (conveying substrate) with flexibility. If the total thickness of the laminate is equal to or less than the above-mentioned upper limit, it can be used as a conveying member because it has a desired mass or less. The upper and lower limits of the total thickness of the laminate can be arbitrarily combined, and can be, for example, 1.5 to 20 mm, 1 to 5 mm, or 2 to 4 mm. The total thickness (average thickness) of the laminate is measured by observing the cross section of the laminate with a microscope or the like, and is calculated as the arithmetic average of the measurements.

[0071] "Shape of laminate" The shape of the laminate is not particularly limited, and examples thereof include a flat plate shape, a hollow prism shape, and a hollow cylinder shape. As the shape of the laminate, a flat plate shape is preferred from the viewpoint of ease of punching the laminate into a desired shape.

[0072] When the laminate is used in a transport member such as a transport hand, the laminate preferably has a fixed portion 21 fixed to a transport device and finger portions 22 extending from the fixed portion 21 in an approximately U-shape, as shown in FIG. 2 . The fixed portion 21 is connected to a transport device such as a robot hand. A semiconductor wafer or the like is placed on the finger portions 22. The fixed portion 21 and the finger portions 22 may be provided with a plurality of through holes 23 penetrating in the stacking direction of the laminate 200. Note that the term "approximately U-shaped" is not limited to a U-shape as long as the tip is bifurcated into two in a plan view, and also includes, for example, a V-shape. It is preferable that the tips are bifurcated in the same direction.

[0073] When the plurality of first layers (a) constituting the laminate 200 are layers (a1) and the plurality of first layers (a) include layers (a11), it is preferable that the orientation direction of the pitch-based carbon fiber contained in the layer (a11) is the extension direction of the finger portion 22 (X direction in FIG. 2). ０ It is more preferable that the orientation direction of the pitch-based carbon fibers contained in the layer 200 is the extension direction (X direction) of the finger portions 22. With this configuration, the vibration damping property of the laminate 200 is further improved.

[0074] "Effects" The laminate of this embodiment described above has excellent vibration damping properties because the first layer (a) is disposed on both sides of the second layer (b) and the thickness ratio of the second layer (b) is controlled within a specific range. Because the laminate of this embodiment has excellent vibration damping properties, it is suitable for use as a transport member (transport substrate) such as a transport hand or transport arm. In particular, when the laminate has a flat plate shape, it is suitable for use as a transport hand. When the laminate has a hollow rectangular column or hollow cylindrical shape, it is suitable for use as a transport arm. In the present invention, the term "transport hand" also includes a fork, a pick, and an end effector. When the laminate is used as a transport member such as a transport hand, it is preferable that the laminate has a fixing portion fixed to a transport device and a finger portion extending from the fixing portion in a substantially U-shape. Examples of such shapes include the shape shown in FIG. 2.

[0075] "Other Embodiments" The laminate of this embodiment is not limited to the one described above. For example, the laminate may further include a layer (c) (hereinafter also referred to as "layer (c)") containing a glass fiber fabric and a matrix resin in at least one of the outermost layers. That is, at least one of the outermost layers of the laminate may be layer (c). If the laminate includes layer (c) in the outermost layer, it is easy to prevent chipping on the surface of the laminate 200 when through holes 23 are formed in the laminate 200, for example, as in the example shown in FIG. 2. Only one outermost layer of the laminate may be layer (c), or both outermost layers may be layer (c).

[0076] The layer (c) is a cured cross prepreg in which a woven fabric made of glass fibers is impregnated with a matrix resin. The matrix resin is preferably an epoxy resin (V). Examples of the epoxy resin (V) include the epoxy resin (N) exemplified above.

[0077] Furthermore, when the laminate of this embodiment is used as a transfer hand, the shape of the laminate is not limited to that shown in Fig. 2. For example, the laminate 200 shown in Fig. 2 has a substantially U-shaped finger portion with two branches at the tip, but the tip may be branched into three or more branches. It is preferable that the tips are branched in the same direction.

[0078] Furthermore, while the laminate 200 shown in FIG. 1 has four first layers (a) 210, the total number of first layers (a) is not particularly limited as long as it is two or more. However, to achieve a symmetrical laminate structure, it is preferable that the total number of first layers (a) be an even number. Furthermore, the laminate 200 shown in FIG. 1 has one second layer (b) 220 located midway between the multiple first layers (a) 210, but the position of the second layer (b) does not have to be midway between the multiple first layers (a), i.e., the center (middle) in the thickness direction (stacking direction) of the laminate. As described above, a symmetrical laminate structure is preferable from the viewpoint of suppressing warpage during processing. Therefore, if the second layer (b) is not located midway between the multiple first layers (a), it is preferable to have two second layers (b) to achieve a symmetrical laminate structure. For example, when a second layer (b) is provided between the first a layer 211 and the second a layer 212 shown in Figure 1, it is preferable to also provide a second layer (b) between the third a layer 213 and the fourth a layer 214. However, since the second layer (b) tends to have a lower Young's modulus than the first layer (a), increasing the number of second layers (b) tends to decrease the Young's modulus of the entire laminate and increase the deflection under load. In order to suppress the decrease in the Young's modulus of the entire laminate, it is sufficient to increase the number of first layers (a), but this increases the total thickness of the laminate. From the viewpoint of suppressing a decrease in Young's modulus without increasing the thickness of the laminate, as shown in FIG. 1 , it is preferable that the second layer (b) 220 is provided in the middle of the plurality of first layers (a) 210, i.e., in a single layer only in a region including the center in the thickness direction of the laminate 200, and in particular, it is preferable that it is provided in a region including the center in the thickness direction and within 20% of the thickness length from the center, more preferably within 15% of the thickness length, and even more preferably within 10% of the thickness length.

[0079] [Laminate Manufacturing Method] The laminate manufacturing method according to the embodiment is not particularly limited. For example, the laminate can be manufactured by pressing a laminate precursor in which a first layer (A) is disposed on both sides of a second layer (B). The first layer (A) is a layer selected from a carbon fiber prepreg layer (A1) (hereinafter also referred to as "layer (A1)"), a ceramic layer (A2), and a metal layer (A3). The second layer (B) is a layer selected from a layer (B1) (hereinafter also referred to as "layer (B1)") containing primarily an epoxy resin (S) and a layer (B2) (hereinafter also referred to as "layer (B2)") containing primarily a thermoplastic elastomer (T). The thickness of the second layer (B) is 0.3% or more but less than 30% of the total thickness of the first layer (A) and the second layer (B). The laminate precursor will be described later.

[0080] The laminate precursor can be pressed using, for example, a press. The pressure during pressing is preferably 0.1 MPa or more and 1.0 MPa or less, and more preferably 0.3 MPa or more and 0.8 MPa or less.

[0081] When the first layer (a) is the layer (a1), the laminate according to the embodiment is obtained by applying pressure to the laminate precursor and thermosetting it. For example, it is preferable to produce the laminate by heating and pressing the laminate precursor at a desired temperature and pressure using a press, autoclave, or the like. The temperature during thermosetting is preferably 120°C or higher and 150°C or lower, more preferably 130°C or higher and 140°C or lower.

[0082] Furthermore, for example, methods for producing a laminate in which the first layer (a) is the layer (a1), i.e., a cured product of the layer (A1), and the second layer (b) is the layer (b1) include the following methods (i) to (vi): (i) A method in which the layer (A1) and the layer (B1) are laminated in a desired order, and the resin components are cured and bonded together by heat or the like to form an integrated body. (ii) A method in which the epoxy resin (S) used for the layer (B1) (for example, the above-mentioned stretchable epoxy resin composition) is laminated on the layer (A1), and the layer (A1) is further laminated thereon, and the resin components are cured and bonded together by heat or the like to form an integrated body. (iii): A method in which the epoxy resin (S) used for the layer (B1) (for example, the above-mentioned stretchable epoxy resin composition) is laminated on the layer (A1), the resin component is cured and bonded by heat or the like to form an integrated body, thereby obtaining layers (a1) and (b1), and then the layer (A1) is further laminated on the layer (b1) and the resin component is cured and bonded by heat or the like to form an integrated body. (iv): A method in which the layer (A1) is pre-cured to obtain the layer (a1), the epoxy resin (S) used for the layer (B1) (for example, the above-mentioned stretchable epoxy resin composition) is laminated on the layer (a1), the resin component is cured and bonded by heat or the like to form an integrated body, thereby obtaining layer (b1), and then the layer (A1) is further laminated on the layer (b1) and the resin component is cured and bonded by heat or the like to form an integrated body. (v): A method in which layer (A1) is pre-cured to obtain layer (a1), and then epoxy resin (S) (for example, the above-mentioned stretchable epoxy resin composition) used for layer (B1) is laminated on layer (a1), and layer (A1) or layer (a1) is laminated on top of that, and cured and bonded by heat or the like to form an integrated body. (vi): A method in which an adhesive is laminated between layer (a1) and layer (B1), and the layers are laminated in the desired order to form an integrated body. Note that the resin components in this paragraph refer to epoxy resin (N) and epoxy resin (S).

[0083] Among these, the method (i) in particular has the advantages that a material such as a sheet whose degree of hardening has been appropriately adjusted can be used as the layer (B1), and that it is easy to re-apply when laminated to the layer (A1), that it is difficult to melt even when heated, so that the thickness is easy to control, and that when the material such as a sheet used has elasticity, it is easy to conform to curved surfaces. In addition, there is also the advantage that the adhesive strength at the interface between the layer (a1) and the layer (B1) is higher, especially when bonding by heating. Furthermore, since the layer (A1) is in a semi-hardened state, when forming into an actual product by a forming method such as press molding, it is possible to bond and integrate the layer (a1) and the layer (B1) at the same time as forming, which has the advantage of simplifying the process.

[0084] For example, when the first layer (A) is either the ceramic layer (A2) or the metal layer (A3) and the second layer (B) is the layer (B1) or the layer (B2), a laminate may be produced by laminating multiple first layers (A) to both sides of the second layer (B) with an adhesive to form a laminate precursor, then placing a weight on the laminate precursor and leaving it at room temperature to bond and integrate the first layer (A) and the second layer (B). Alternatively, a laminate may be produced by laminating the layer (C), the first layer (A), and the second layer (B) described below in the desired order, and then curing and bonding the resin components by heat or the like to integrate them. The cured product of layer (C) is also referred to as a "glass cloth resin composite layer."

[0085] When the laminate is used, for example, in a transfer hand, the laminate precursor may be processed in advance to have a desired shape, such as that shown in Fig. 2 , or a rectangular laminate precursor may be heat-cured to obtain a laminate, and the resulting laminate may then be punched using a punching die or the like to have the desired shape. When a laminate is produced by the above-described methods (i) to (vi), it is preferable to punch the resulting laminate using a punching die or the like to have the desired shape. When the plurality of first layers (a) constituting the laminate are layers (a1) and the plurality of first layers (a) are layers (a11), it is preferable to punch the laminate using a punching die or the like so that the orientation direction of the pitch-based carbon fiber contained in at least one layer (a11) is the extension direction of the finger portion (X direction in Fig. 2 ).

[0086] "Laminate precursor" An example of a laminate precursor used in manufacturing a laminate according to an embodiment is shown in Figure 3. The laminate precursor 10 shown in Figure 3 has four first layers (A) 11 and one second layer (B) 12 provided between these first layers (A) 11.

[0087] <First Layer (A)> The first layer (A) is a layer selected from a carbon fiber prepreg layer (A1), a ceramic layer (A2), and a metal layer (A3). Among these, from the viewpoint of weight reduction, the first layer (A) is preferably the layer (A1). The cured product of the layer (A1) is the layer (a1).

[0088] As the layer (A1), a prepreg containing the carbon fiber (M) and the matrix resin described above for the layer (a1) can be used, and a layer of a prepreg containing the carbon fiber (M) and the epoxy resin (N) is preferred. In addition to the carbon fiber (M) and the matrix resin, the layer (A1) may further contain components other than the carbon fiber (M) and the matrix resin (hereinafter also referred to as "other components") as necessary, as long as the effects of the present invention are not impaired.

[0089] The carbon fibers (M) used in the layer (A1) are as described for the layer (a1). In the present invention, the prepreg layer (A1) containing the carbon fibers (M) aligned in one direction is particularly referred to as the "unidirectional prepreg layer (A1)." In particular, the unidirectional prepreg layer (A1) containing the pitch-based carbon fibers aligned in one direction is referred to as the "layer (A11)," and the unidirectional prepreg layer (A1) containing the PAN-based carbon fibers aligned in one direction is referred to as the "layer (A12)." The cured product of the layer (A11) is the layer (a11), and the cured product of the layer (A12) is the layer (a12).

[0090] The matrix resin used in layer (A1) is as described for layer (a1), and is preferably epoxy resin (N). The epoxy resin (N) contained in layer (A11) is epoxy resin (N1), and the epoxy resin (N) contained in layer (A12) is epoxy resin (N2). The epoxy resin (N1) and the epoxy resin (N2) may be the same or different.

[0091] Examples of other components used in the layer (A1) include fibers other than the carbon fibers (M) described in the layer (a1) (other fibers), various additives, and the like.

[0092] For the layer (A1), for example, a prepreg in which carbon fibers (M) are impregnated with a matrix resin, or a so-called semipreg in which carbon fibers (M) are partially impregnated (semi-impregnated) with a matrix resin to control the amount of voids, can be used.

[0093] A prepreg or semipreg containing carbon fiber (M) and a matrix resin can be produced by a known method. For example, a resin composition containing a matrix resin is applied to a carbon fiber substrate such as a sheet in which carbon fibers (M) are aligned in one direction, and then the carbon fiber substrate is sandwiched between release paper or the like as needed, and the carbon fiber substrate is impregnated with the resin composition by passing through a pressure roll to obtain a prepreg or semipreg. Alternatively, a prepreg or semipreg may be produced by supplying a carbon fiber substrate to the surface of a film in which a predetermined amount of resin composition is coated on the surface of release paper or the like, and then passing through a pressure roll to impregnate the carbon fiber substrate with the resin composition.

[0094] The weight of the carbon fiber base material is 75 g / m ２ 560g / m or more ２ Preferably, 125 g / m or less ２ 450g / m or more ２ The following is more preferred: The carbon fiber substrate may contain other fibers as needed.

[0095] The resin composition may contain, in addition to the epoxy resin (N), other thermosetting resins and optional components as necessary.

[0096] The carbon fiber content per layer (A1) (hereinafter referred to as "fiber content") is preferably 45% by volume or more, more preferably 50% by volume or more, and even more preferably 55% by volume or more, and is preferably 75% by volume or less, more preferably 70% by volume or less, and even more preferably 65% ​​by volume or less, relative to the total volume of each layer (A1). When the fiber content is equal to or greater than the lower limit, the mechanical properties of the laminate are further improved. When the fiber content is equal to or less than the upper limit, sufficient adhesion between the carbon fiber (M) and the epoxy resin (N) can be ensured. The upper and lower limits of the fiber content per layer (A1) can be arbitrarily combined, and can be, for example, 45 to 75% by volume, 50 to 70% by volume, or 55 to 65% by volume.

[0097] The content of the epoxy resin (N) per layer (A1) (hereinafter also referred to as "resin content") is preferably 20% by mass or more, more preferably 25% by mass or more, even more preferably 30% by mass or more, and preferably 45% by mass or less, more preferably 40% by mass or less, and even more preferably 35% by mass or less, relative to the total mass of each layer (A1). When the resin content is equal to or greater than the lower limit, sufficient adhesion between the carbon fiber (M) and the epoxy resin (N) can be ensured. When the resin content is equal to or less than the upper limit, the mechanical properties of the laminate are further improved. The upper and lower limits of the resin content per layer (A1) can be arbitrarily combined, and can be, for example, 20 to 45% by mass, 25 to 40% by mass, or 30 to 35% by mass.

[0098] The thickness of each layer (A1) is preferably 0.1 mm or more, more preferably 0.15 mm or more, even more preferably 0.2 mm or more, and preferably 1.5 mm or less, more preferably 1.0 mm or less, and even more preferably 0.8 mm or less. When the thickness of each layer (A1) is equal to or greater than the aforementioned lower limit, the desired thickness can be obtained with a relatively small number of layers. When the thickness of each layer (A1) is equal to or less than the aforementioned upper limit, the desired thickness can be obtained with an even smaller number of layers. The upper and lower limits of the thickness of each layer (A1) can be arbitrarily combined, and can be, for example, 0.1 to 1.5 mm, 0.15 to 1.0 mm, or 0.2 to 0.8 mm. The thickness (average thickness) of layer (A1) is measured by observing the cross section of the laminate precursor with a microscope or the like, and is calculated as the arithmetic average of the measurements.

[0099] As the prepreg used for the layer (A1), commercially available products can be used, and examples thereof include prepregs manufactured by Mitsubishi Chemical Corporation under the trade names "HyEJ43M80QD," "HyEJ28M80QD," "HyEJ12-23," "TR350C 175S," "HyEJ12M80QD," and "HyEJ25M80PD."

[0100] (Layer Structure) When the plurality of first layers (A) are layers (A1), the plurality of first layers (A) preferably include at least a layer (A11). The plurality of first layers (A) may be entirely composed of the layer (A11), or may include the layer (A11) and a layer other than the layer (A11), for example, the layer (A11) and a layer (A12).

[0101] The plurality of first layers (A) are unidirectional prepregs (hereinafter referred to as “layers (α)”) containing carbon fibers oriented at an orientation angle of 0° when the longitudinal direction of the laminate precursor is taken as 0°, i.e., oriented parallel to the longitudinal direction of the laminate precursor. ０ It is also called "a layer (α)." ０ ) is cured into a layer (β ０ ) layer (α ０) preferably includes at least one of layer (A11) and layer (A12), more preferably includes at least layer (A11), and further preferably includes layer (A11). ０ If the layer (A11) includes the layer (A11), the vibration damping properties of the laminate are further improved. Hereinafter, the layer (A11) in which the orientation angle of the pitch-based carbon fiber is 0° will be referred to as "layer (A11)". ０ The layer (A12) in which the orientation angle of the PAN-based carbon fiber is 0° is particularly referred to as the “layer (A12).” ０ ") layer (α ０ ) may be one type or two or more types.

[0102] The plurality of first layers (A) are layers (α ０ ) and layer (α ０ In other words, the plurality of first layers (A) preferably include two or more layers having different carbon fiber orientation angles, specifically, layers (α ０ ) and layer (α), and layer (A11 ０ It is more preferable that the first layer (A) has a layer (α) and a layer (α). ０ By having the first layers (A) and the layer (α), it is possible to improve the vibration damping property of the laminate and prevent cracking of the laminate. ０ ) and layer (α), ０ ) is preferably located closer to the outermost layer of the laminate precursor than the layer (α).

[0103] The layer (α) preferably includes at least one of the layer (A11) and the layer (A12). ０ From the viewpoint of suppressing deflection in a direction of 45° or more and 90° or less with respect to the orientation of the carbon fibers contained in the layer (α), the layer (α) is preferably the layer (A11). ０ ) and when the layer (α) is the layer (A11), the layer (α ０ ) layer (A11 ０The epoxy resin (N1) contained in the layer (A11) that is the layer (α) may be the same type as or different from the epoxy resin (N1) contained in the layer (A11). From the viewpoint of increasing the strength of the laminate and reducing the production cost, the layer (α) is preferably the layer (A12). The layer (α) may be one type or two or more types.

[0104] The orientation angle (θ) of the carbon fibers in the layer (α) is ０ The orientation angle of the carbon fibers (θ ０ ) is set to 0°, the angle is 45° or more and 90° or less, preferably 45°, 60°, or 90°, more preferably 45° or 90°, and particularly preferably 90°. In this specification, the layer (A1) containing carbon fibers having an orientation angle (θ) of 90° and epoxy resin (N) is referred to as the "layer (α ９０ In particular, when pitch-based carbon fiber is included as the carbon fiber, it is called a "layer (A11)." ９０ ) and when PAN-based carbon fiber is included as the carbon fiber, it is called a "layer (A12 ９０ Other orientation angles (θ) are also expressed in the same way.

[0105] Examples of the configuration of the plurality of first layers (A) include the following combinations: ０ ) and layer (A11 ９０ ) combination. Layer (A11 ０ ) and layer (A12 ９０ ) combination. Layer (A11 ０ ) and layer (A11 ９０ ) and layer (A12 ９０ ) combination. Layer (A11 ０ ) and layer (A11 ４５ ) combination. Layer (A11 ０ ) and layer (A12 ４５ ) combination. Layer (A11 ０ ) and layer (A11 ４５ ) and layer (A12 ４５ ) combination. Layer (A11 ０ ) and layer (A11 ６０ ) combination. Layer (A11 ０) and layer (A12 ６０ ) combination. Layer (A11 ０ ) and layer (A11 ６０ ) and layer (A12 ６０ ) combination. Layer (A11 ０ ) and layer (A11 ９０ ) and layer (A11 ４５ ) combination. Layer (A11 ０ ) and layer (A12 ９０ ) and layer (A12 ４５ ) combination. Layer (A11 ０ ) and layer (A11 ９０ ) and layer (A12 ４５ ) combination. Layer (A11 ０ ) and layer (A12 ９０ ) and layer (A11 ４５ ) combination. Layer (A12 ０ ) and layer (A12 ９０ ) in combination.

[0106] The laminate precursor preferably has a symmetrical laminate structure from the viewpoint of suppressing warpage during processing. Therefore, for example, in the case of the laminate precursor 10 shown in FIG. 3, when the four first layers (A) 11 are arranged in order from the bottom as a first A layer 111, a second A layer 112, a third A layer 113, and a fourth A layer 114, it is preferable that the first A layer 111 and the fourth A layer 114 are the same layer (A1), and it is preferable that the second A layer 112 and the third A layer 113 are the same layer (A1). ０ ), at least the first A layer 111 and the fourth A layer 114 are layers (α ０ ), and the layer (A11 ０ Here, the term "same" means that the structure of the layer (A1) is the same, and the thickness of the layer (A1) and the orientation angle of the carbon fibers are also the same.

[0107] When the first layer (A) is either a ceramic layer (A2) or a metal layer (A3), examples of the configuration of the multiple first layers (A) include the following combinations: - A combination of a ceramic layer (A2) with a ceramic layer (A2); - A combination of an aluminum layer with an aluminum layer; - A combination of a SUS layer with a SUS layer; - A combination of a titanium alloy layer with a titanium alloy layer.

[0108] The thickness per layer of the ceramic layer (A2) and the metal layer (A3) is preferably 0.4 mm or more, more preferably 0.6 mm or more, and preferably 1.5 mm or less, more preferably 1.0 mm or less. When the thickness per layer is equal to or greater than the lower limit, the desired thickness can be obtained with a relatively small number of layers. When the thickness per layer is equal to or less than the upper limit, the desired thickness can be obtained with an even smaller number of layers. The upper and lower limits of the thickness per layer of the ceramic layer (A2) and the metal layer (A3) can be arbitrarily combined, and can be, for example, 0.4 to 1.5 mm or 0.6 to 1.0 mm. The thickness (average thickness) of the ceramic layer (A2) and the metal layer (A3) is measured by observing the cross section of the laminate precursor with a microscope or the like, and is calculated as the arithmetic mean thereof.

[0109] <Second Layer (B)> The second layer (B) 12 shown in Fig. 3 is located midway between the four first layers (A). The "middle" here refers to the center (intermediate) in the thickness direction (stacking direction) of the laminate precursor 10, and in the example shown in Fig. 3, it is between the second A layer 112 and the third A layer 113. That is, the second layer (B) 12 in the example shown in Fig. 3 is a middle layer of the laminate precursor 10, and is disposed only in a region including the center in the thickness direction of the laminate precursor 10.

[0110] The second layer (B) is a layer selected from a layer (B1) containing mainly an epoxy resin (S) (excluding the layer (a1) of carbon fiber prepreg) and a layer (B2) containing mainly a thermoplastic elastomer (T). The layer (B1) after compression of the laminate precursor is the layer (b1) in the laminate. Furthermore, the layer (B2) after compression of the laminate precursor is the layer (b2) in the laminate. From the viewpoint of vibration damping effect, the second layer (B) is preferably the layer (B1).

[0111] (Layer (B1)) The layer (B1) is a layer (epoxy resin layer) mainly containing an epoxy resin (S). Here, "mainly containing an epoxy resin (S)" means that the proportion of the epoxy resin (S) relative to the total mass of the layer (B1) is 50% by mass or more. The proportion of the epoxy resin (S) relative to the total mass of the layer (B1) is preferably 70% by mass or more, more preferably 90% by mass or more. In addition to the epoxy resin (S), the layer (B1) may further contain components other than the epoxy resin (S) as needed, as long as the effects of the present invention are not impaired. The epoxy resin (S) and other components are as described for the layer (b1). The layer (B1) is preferably a sheet or film of the epoxy resin (S).

[0112] The breaking elongation of layer (B1) is preferably 100% or more, more preferably 200% or more, and preferably 500% or less, more preferably 400% or less. When the breaking elongation of layer (B1) is equal to or greater than the lower limit, the vibration damping properties of the laminate are further improved. When the breaking elongation of layer (B1) is equal to or less than the upper limit, the rigidity of the laminate is further improved. The upper and lower limits of the breaking elongation of layer (B1) can be arbitrarily combined, for example, 100 to 500% or 200 to 400%. The breaking elongation of layer (B1) can be determined as follows. That is, layers other than layer (B1) are scraped off from the laminate precursor, and a test piece measuring 10 mm wide and 50 mm long is cut out. A tensile test is performed in accordance with JIS K 7127:1999 at 23°C and 50% RH at a test speed of 200 mm / min to measure the elongation at tensile break.

[0113] The tensile modulus of layer (B1) is preferably 3 MPa or more, more preferably 3.5 MPa or more, even more preferably 4 MPa or more, and preferably 12 MPa or less, more preferably 10 MPa or less, and even more preferably 8 MPa or less. When the tensile modulus of layer (B1) is equal to or greater than the above-mentioned lower limit, the rigidity of the laminate is further improved. When the tensile modulus of layer (B1) is equal to or less than the above-mentioned upper limit, the vibration damping properties of the laminate are further improved. The upper and lower limits of the tensile modulus of layer (B1) can be arbitrarily combined, and can be, for example, 3 to 12 MPa, 3.5 to 10 MPa, or 4 to 8 MPa. The tensile modulus of layer (B1) can be determined as follows. That is, layers other than the layer (B1) are scraped off from the laminate precursor, and a test piece having a width of 10 mm and a length of 50 mm is cut out to prepare a test piece. The tensile modulus of the test piece is measured by the dynamic viscoelasticity measurement method described in JIS K 7244-4:1999 using a dynamic viscoelasticity measuring device (for example, product name "DVA-200" manufactured by IT Measurement Control Co., Ltd.) under measurement conditions of a frequency of 1 Hz, a heating rate of 3°C / min, and a double-support tensile mode.

[0114] The tensile strength of layer (B1) is preferably 10 MPa or more, more preferably 15 MPa or more, even more preferably 20 MPa or more, and preferably 50 MPa or less, more preferably 45 MPa or less, and even more preferably 40 MPa or less. When the tensile strength of layer (B1) is equal to or greater than the above-mentioned lower limit, the rigidity of the laminate is further improved. When the tensile strength of layer (B1) is equal to or less than the above-mentioned upper limit, the vibration damping properties of the laminate are further improved. The upper and lower limits of the tensile strength of layer (B1) can be arbitrarily combined, and can be, for example, 10 to 50 MPa, 15 to 45 MPa, or 20 to 40 MPa. The tensile strength of layer (B1) can be determined as follows. That is, layers other than the layer (B1) are scraped off from the laminate precursor, and a test piece having a width of 10 mm and a length of 50 mm is cut out. The tensile strength of the test piece is measured by the dynamic viscoelasticity measurement method described in JIS K 7244-4:1999 using a dynamic viscoelasticity measuring device (for example, product name "DVA-200" manufactured by IT Measurement & Control Co., Ltd.) under measurement conditions of a frequency of 1 Hz, a heating rate of 3°C / min, and a double-support tensile mode.

[0115] The layer (B1) can be obtained, for example, by molding the epoxy resin (S) and, if necessary, other components into a sheet or film. A preferred example of a method for producing the layer (B1) is a method in which the stretchable epoxy resin composition containing the above-mentioned base agent and curing agent, etc., is cured into a sheet or film. The term "curing" as used herein means pre-curing the stretchable epoxy resin composition using heat, light, electron beams, etc. The degree of curing is not particularly limited, and the layer (B1) may be completely or nearly completely cured, or may be semi-cured. The degree of curing can be adjusted appropriately depending on the purpose, application, etc.

[0116] The layer (B1) can be produced, for example, by curing the elastic epoxy resin composition in the form of a sheet or film (hereinafter referred to as a "sheet or the like") of a predetermined thickness. Alternatively, the layer (B1) can be produced by molding a semi-cured product obtained from the elastic epoxy resin composition into a sheet or the like of a predetermined thickness. Specifically, the layer (B1) can be obtained by a method in which the elastic epoxy resin composition is applied to a carrier sheet, the resin composition is cured to form an elastic epoxy resin sheet or the like, and the carrier sheet is then peeled off to obtain an elastic epoxy resin sheet or the like; or a method in which the elastic epoxy resin composition is applied to a first carrier sheet, a second carrier sheet is attached to the surface of the resin composition opposite to the surface on which the first carrier sheet is provided, the resin composition is cured to form an elastic epoxy resin sheet or the like, and both carrier sheets are then peeled off.

[0117] The curing method for the elastic epoxy resin composition varies depending on the components and amounts of components in the elastic epoxy resin composition, or the form of the composition (for example, the thickness of a sheet or film), but typically involves heating at 23°C to 200°C for 5 minutes to 24 hours. This heating is preferably carried out as a one-stage treatment in which a primary heating is carried out at 23°C to 160°C for 5 minutes to 24 hours, a two-stage treatment in which, in addition to the primary heating temperature, a secondary heating is carried out at 80°C to 200°C, which is 40 to 177°C higher than the primary heating temperature, for 5 minutes to 24 hours, or a three-stage treatment in which, in addition to the two-stage treatment, a tertiary heating is carried out at 100°C to 200°C, which is higher than the secondary heating temperature, for 5 minutes to 24 hours.

[0118] When producing the layer (B1) as a semi-cured product, the curing reaction of the elastic epoxy resin composition may be allowed to proceed to an extent that allows the shape to be maintained by heating, etc. When the elastic epoxy resin composition contains a solvent, most of the solvent is removed by techniques such as heating, reduced pressure, air drying, etc., but 5% by mass or less of the solvent may remain in the semi-cured product.

[0119] (Layer (B2)) The layer (B2) is a layer mainly containing a thermoplastic elastomer (T). The phrase "mainly containing a thermoplastic elastomer (T)" means that the proportion of the thermoplastic elastomer (T) relative to the total mass of the layer (B2) is 50% by mass or more. The proportion of the thermoplastic elastomer (T) relative to the total mass of the layer (B2) is preferably 70% by mass or more, and more preferably 90% by mass or more. In addition to the thermoplastic elastomer (T), the layer (B2) may further contain components other than the thermoplastic elastomer (T) as needed, as long as the effects of the present invention are not impaired. The thermoplastic elastomer (T) and other components are as described for the layer (b2). The layer (B2) is preferably a sheet or film of the thermoplastic elastomer (T).

[0120] The breaking elongation of layer (B2) is preferably 800% or more, more preferably 900% to 1100%, and even more preferably 1200% or less, and even more preferably 1100% or less. When the breaking elongation of layer (B2) is equal to or greater than the lower limit, the vibration damping properties of the laminate are further improved. When the breaking elongation of layer (B2) is equal to or less than the upper limit, the rigidity of the laminate is further improved. The upper and lower limits of the breaking elongation of layer (B2) can be arbitrarily combined, and can be, for example, 800 to 1200% or 900 to 1100%. The breaking elongation of layer (B2) can be determined as follows. That is, layers other than the layer (B2) are scraped off from the laminate precursor, and a test piece having a width of 10 mm and a length of 50 mm is cut out. A tensile test is performed in accordance with JIS K 7127:1999 at a test speed of 200 mm / min under an environment of 23°C and 50% RH, and the elongation at tensile break is measured.

[0121] The tensile modulus of layer (B2) is preferably 3 MPa or more, more preferably 3.5 MPa or more, even more preferably 4 MPa or more, and preferably 20 MPa or less, more preferably 15 MPa or less, and even more preferably 10 MPa or less. When the tensile modulus of layer (B2) is equal to or greater than the above-mentioned lower limit, the rigidity of the laminate is further improved. When the tensile modulus of layer (B2) is equal to or less than the above-mentioned upper limit, the vibration damping properties of the laminate are further improved. The upper and lower limits of the tensile modulus of layer (B2) can be arbitrarily combined, and can be, for example, 3 to 20 MPa, 3.5 to 15 MPa, or 4 to 10 MPa. The tensile modulus of layer (B2) can be determined as follows. That is, layers other than the layer (B2) are scraped off from the laminate precursor, and a test piece having a width of 10 mm and a length of 50 mm is cut out to prepare a test piece. The tensile modulus of the test piece is measured by the dynamic viscoelasticity measurement method described in JIS K 7244-4:1999 using a dynamic viscoelasticity measuring device (for example, product name "DVA-200" manufactured by IT Measurement Control Co., Ltd.) under measurement conditions of a frequency of 1 Hz, a temperature rise rate of 3°C / min, and a double-support tensile mode.

[0122] The tensile strength of layer (B2) is preferably 8 MPa or more, more preferably 9 MPa or more, more preferably 10 MPa or more, and preferably 40 MPa or less, more preferably 35 MPa or less, and more preferably 30 MPa or less. When the tensile strength of layer (B2) is equal to or greater than the above-mentioned lower limit, the rigidity of the laminate is further improved. When the tensile strength of layer (B2) is equal to or less than the above-mentioned upper limit, the vibration damping properties of the laminate are further improved. The upper and lower limits of the tensile strength of layer (B2) can be arbitrarily combined, and can be, for example, 8 to 40 MPa, 9 to 35 MPa, or 10 to 30 MPa. The tensile strength of layer (B2) can be determined as follows. That is, layers other than the layer (B2) are scraped off from the laminate precursor, and a test piece having a width of 10 mm and a length of 50 mm is cut out. The tensile strength of the test piece is measured by the dynamic viscoelasticity measurement method described in JIS K 7244-4:1999 using a dynamic viscoelasticity measuring device (for example, product name "DVA-200" manufactured by IT Measurement Control Co., Ltd.) under measurement conditions of a frequency of 1 Hz, a heating rate of 3°C / min, and a double-support tensile mode.

[0123] The layer (B2) can be obtained, for example, by molding the thermoplastic elastomer (T) into a sheet or film. A preferred example of the method for producing the layer (B2) is a method in which an elastomer composition containing the above-mentioned thermoplastic elastomer (T) is extruded into a sheet or film.

[0124] (Thickness) The thickness ratio of the second layer (B) is 0.3% or more and less than 30% of the total thickness of the first layer (A) and the second layer (B). When the thickness ratio of the second layer (B) is equal to or greater than the lower limit, sufficient vibration damping performance can be expected. When the thickness ratio of the second layer (B) is equal to or less than the upper limit, the impact on load deflection performance can be further suppressed. The thickness ratio of the second layer (B) is preferably 1% or more, more preferably 3% or more. The thickness ratio of the second layer (B) is preferably 20% or less, more preferably 10% or less. The upper and lower limits of the thickness ratio of the second layer (B) can be arbitrarily combined, and can be, for example, 1 to 20% or 3 to 10%. The thickness (average thickness) of the first layer (A) and the thickness (average thickness) of the second layer (B) are measured by observing the cross section of the laminate precursor with a microscope or the like, and are calculated as the arithmetic mean thereof.

[0125] The thickness of the second layer (B) is preferably 0.03 mm or more, more preferably 0.05 mm or more, even more preferably 0.1 mm or more, and preferably 0.5 mm or less, more preferably 0.5 mm or less, and even more preferably 0.4 mm or less. The thinner the thickness of the second layer (B), the more preferable it is as long as the desired vibration damping effect can be obtained. If the thickness of the second layer (B) is equal to or greater than the above-mentioned lower limit, the vibration damping properties of the laminate are improved. If the thickness of the second layer (B) is equal to or less than the above-mentioned upper limit, the effect on the load deflection performance can be suppressed. The upper and lower limits of the thickness of the second layer (B) can be arbitrarily combined, and can be, for example, 0.03 to 0.5 mm, 0.05 to 0.5 mm, or 0.1 to 0.4 mm.

[0126] The loss tangent (Tan δ) of the second layer (B) is preferably 0.2 or more, more preferably 0.3 or more, at 20°C over the entire frequency range between 100 Hz and 4,000 Hz. If the loss tangent (Tan δ) of the second layer (B) is equal to or greater than the lower limit, sufficient vibration damping properties can be imparted. The loss tangent (Tan δ) of the second layer (B) can be determined as follows. That is, layers other than the second layer (B) are scraped off from the laminate precursor, and a test piece having a width of 10 mm and a length of 50 mm is cut out. The storage modulus and loss modulus are measured using a viscoelasticity measuring device (for example, an MCR301 model manufactured by Anton Paar) in a torsion measurement mode under a nitrogen atmosphere at temperatures of −20° C., −10° C., 0° C., 10° C., and 20° C., frequencies of 0.1 to 25.1 Hz, and strain of 0.1%, and the ratio of loss modulus / storage modulus is calculated, which is defined as the loss tangent (Tan δ).

[0127] The total thickness of the laminate precursor is preferably 1.5 mm or more, more preferably 2 mm or more, and preferably 20 mm or less, more preferably 5 mm or less, and even more preferably 4 mm or less. If the total thickness of the laminate precursor is equal to or greater than the lower limit, it can be used as a conveying member (conveying substrate) with flexibility. If the total thickness of the laminate precursor is equal to or less than the upper limit, it can be used as a conveying member because it has a desired mass or less. The upper and lower limits of the total thickness of the laminate precursor can be arbitrarily combined, and can be, for example, 1.5 to 20 mm, 1.5 to 5 mm, or 2 to 4 mm.

[0128] The shape of the laminate precursor is not particularly limited, and examples thereof include a flat plate shape, a hollow prismatic shape, a hollow cylindrical shape, etc. Among these, a flat plate shape is preferred from the viewpoint of ease of punching the laminate precursor into a desired shape.

[0129] When the laminate is used as a conveying member such as a conveying hand, it is preferable that the laminate precursor has a shape similar to that of the laminate, having a fixed portion 21 that is fixed to a conveying device and a finger portion 22 that extends from the fixed portion 21 in an approximately U-shape, as shown in Figure 2, for example.

[0130] When the plurality of first layers (A) constituting the laminate precursor 10 are layers (A1) and the plurality of first layers (A) include a layer (A11), it is preferable that the orientation direction of the pitch-based carbon fiber contained in the layer (A11) is the extension direction of the finger portion 22 (the X direction in FIG. 2). ０ It is more preferable that the orientation direction of the pitch-based carbon fibers contained in the layer 22 is the extension direction (X direction) of the finger portions 22. With this configuration, the vibration damping property of the laminate is further improved.

[0131] (Method for manufacturing laminate precursor) The laminate precursor can be obtained, for example, by arranging multiple first layers (A) on both sides of the second layer (B). For example, when the first layer (A) is either a ceramic layer (A2) or a metal layer (A3), multiple first layers (A) may be bonded to both sides of the second layer (B) via an adhesive. When the laminate precursor obtained in this manner is used, for example, for a conveying hand, it can be punched using a punching die or the like to have a desired shape, for example, as shown in FIG. 2. When the multiple first layers (A) constituting the laminate precursor 10 are layers (A1) and the multiple first layers (A) include layers (A11), it is preferable to punch the laminate precursor 10 using a punching die or the like so that the orientation direction of the pitch-based carbon fiber contained in at least one layer (A11) is the extension direction of the finger portion 22 (X direction in FIG. 2).

[0132] In the laminate precursor described above, the first layer (A) is disposed on both sides of the second layer (B), and the thickness ratio of the second layer (B) is controlled within a specific range. Therefore, by applying pressure, a laminate having excellent vibration damping properties can be obtained. Since the laminate precursor of this embodiment can obtain a laminate having excellent vibration damping properties, the laminate precursor of this embodiment is suitable as a precursor for a transport member (transport substrate) such as a transport hand or a transport arm. In particular, when the laminate precursor has a flat plate shape, it is suitable as a precursor for a transport hand. When the laminate precursor has a hollow rectangular pillar shape or a hollow cylindrical shape, it is suitable as a precursor for a transport arm.

[0133] (Other Embodiments) The laminate precursor is not limited to those described above. For example, the laminate precursor may further have a layer (C) (hereinafter also referred to as "layer (C)") of cross prepreg containing glass fiber on at least one of the outermost layers. That is, at least one of the outermost layers of the laminate precursor may be layer (C). If the laminate precursor has layer (C) on the outermost layer, for example, when through holes 23 are formed in the laminate 200 as shown in FIG. 2, chipping on the surface of the laminate precursor can be suppressed. Only one outermost layer of the laminate precursor may be layer (C), or both outermost layers may be layer (C).

[0134] The layer (C) is a cross prepreg in which a woven fabric of glass fibers is impregnated with a matrix resin. The matrix resin is preferably an epoxy resin (V). Examples of the epoxy resin (V) include the epoxy resin (N) exemplified above.

[0135] A laminate precursor having a layer (C) can be obtained, for example, by arranging a plurality of first layers (A) on both sides of a second layer (B) and further arranging a layer (C) on at least one of the outermost layers.

[0136] Furthermore, when the laminate precursor is used as a transport hand, the shape of the laminate precursor is not limited to the shape for producing the laminate shown in Figure 2, and may be set appropriately depending on the shape of the desired laminate.

[0137] Furthermore, the laminate precursor 10 shown in FIG. 3 has four first layers (A) 11, but the total number of first layers (A) is not particularly limited as long as it is two or more. However, to achieve a symmetrical laminate structure, it is preferable that the total number of first layers (A) is an even number. Furthermore, the laminate precursor 10 shown in FIG. 3 has one second layer (B) 12 located between multiple first layers (A) 11. However, as long as the second layer (B) is located between multiple first layers (A), it does not have to be located between the multiple first layers (A), i.e., not at the center (middle) in the thickness direction (stacking direction) of the laminate precursor. As described above, the laminate precursor preferably has a symmetrical laminate structure from the viewpoint of suppressing warpage during processing. Therefore, if the second layer (B) is not located between multiple first layers (A), it is preferable to have two second layers (B) to achieve a symmetrical laminate structure. For example, when a second layer (B) is provided between the first A layer 111 and the second A layer 112 shown in Figure 3, it is preferable to also provide a second layer (B) between the third A layer 113 and the fourth A layer 114. However, since the second layer (B) tends to have a lower Young's modulus than the first layer (A), increasing the number of second layers (B) tends to decrease the Young's modulus of the entire laminate precursor, and the deflection under load tends to increase. In order to suppress the decrease in the Young's modulus of the entire laminate precursor, it is sufficient to increase the number of first layers (A), but this increases the total thickness of the laminate. From the viewpoint of suppressing a decrease in Young's modulus without increasing the thickness of the laminate precursor, as shown in FIG. 3 , it is preferable that the second layer (B) 12 is provided in the middle of the plurality of first layers (A) 11, i.e., in a single layer only in a region including the center in the thickness direction of the laminate precursor 10, and in particular, it is preferable that the second layer (B) 12 is provided in a region including the center in the thickness direction and within 20% of the thickness length from the center, more preferably within 15% of the thickness length, and even more preferably within 10% of the thickness length.

[0138] [Transport Hand] The transport hand according to the embodiment includes the laminate according to the embodiment described above. Since the transport hand according to the embodiment includes the laminate according to the embodiment described above, it has excellent vibration damping properties. The transport hand may be composed of only the laminate according to the embodiment, or may include components other than the laminate according to the embodiment.

[0139] An example of the shape of the transport hand is a shape having a fixed portion fixed to the transport device and finger portions extending from the fixed portion in a substantially U-shape, specifically the shape shown in Fig. 2. When the transport hand has the shape shown in Fig. 2 and the plurality of first layers (a) included in the laminate constituting the transport hand have a layer (a11), it is preferable that the orientation direction of the pitch-based carbon fiber included in the layer (a11) is the extension direction of the finger portions 22 (X direction in Fig. 2). In particular, when the layer (a11) ０ It is more preferable that the orientation direction of the pitch-based carbon fibers contained in the finger portions 22 is the extension direction (X direction) of the finger portions 22. By adopting such a configuration, vibration damping properties are further improved. Note that the shape of the transport hand is not limited to that shown in FIG. 2, and it may have finger portions with, for example, three or more branched tips.

[0140] [Transportation device, semiconductor manufacturing apparatus] The transportation device according to the embodiment is a transportation device incorporating the transport hand according to the embodiment. The transportation device according to the embodiment can employ a known configuration, except that the transport hand according to the embodiment is incorporated. The semiconductor manufacturing apparatus according to the embodiment is a semiconductor manufacturing apparatus incorporating the transport hand according to the embodiment. The semiconductor manufacturing apparatus according to the embodiment can employ a known configuration, except that the transport hand according to the embodiment is incorporated.

[0141] The present invention will be explained in more detail below by way of examples. However, the present invention is not limited to the following examples as long as it does not deviate from the gist of the present invention, and various modifications are possible as long as they do not deviate from the gist of the present invention.

[0142] "Materials Used" <Prepregs, Sheets> A1-1: Pitch-based unidirectional prepreg containing pitch-based carbon fiber and epoxy resin (liquid bisphenol A-type epoxy resin) (manufactured by Mitsubishi Chemical Corporation, product name "DIALEAD (registered trademark)", tensile modulus of pitch-based carbon fiber: 760 GPa). A1-2: PAN-based unidirectional prepreg containing PAN-based carbon fiber and epoxy resin (liquid bisphenol A-type epoxy resin) (manufactured by Mitsubishi Chemical Corporation, product name "PYROFIL (registered trademark)", tensile modulus of PAN-based carbon fiber: 235 GPa). A2-1: Ceramic plate containing 99.9% by mass or more of aluminum oxide (manufactured by Nishimura Porcelain Co., Ltd., Young's modulus: 390 GPa, thickness: 0.74 mm). A2-2: Ceramic plate containing more than 96% by mass of aluminum oxide (manufactured by Nishimura Porcelain Co., Ltd., Young's modulus: 329 GPa, thickness: 0.74 mm). A2-3: Ceramic plate containing 99.9% or more by mass of aluminum oxide (manufactured by Nishimura Porcelain Co., Ltd., Young's modulus 390 GPa, thickness 1.50 mm). A2-4: Ceramic plate containing more than 96% by mass of aluminum oxide (manufactured by Nishimura Porcelain Co., Ltd., Young's modulus 329 GPa, thickness 1.50 mm). A3-1: Al-Mg alloy plate (manufactured by Kobe Steel, Ltd., product number A5052, thickness 0.74 mm). A3-2: Al-Mg alloy plate (manufactured by Kobe Steel, Ltd., product number A5052, thickness 1.50 mm). A4-1: Stainless steel plate (manufactured by Nippon Steel Corporation, SUS304, thickness 1.50 mm). B1-1: Epoxy resin sheet (thickness 0.10 mm) prepared as follows. B1-2: Epoxy resin sheet (thickness 0.20 mm) prepared as follows. B2-1: Thermoplastic elastomer sheet (thickness 0.20 mm) prepared as follows.

[0143] <Preparation of B1-1> (Production of Epoxy Resin (S1)) 141.8 parts by mass of 1,6-hexanediol preheated to 45°C and 0.51 parts by mass of boron trifluoride ethyl ether were charged into a 1 L glass flask equipped with a stirrer, a dropping funnel, and a thermometer, and the mixture was heated to 80°C. 244.3 parts by mass of epichlorohydrin were added dropwise over a period of time so that the temperature did not exceed 85°C. The mixture was aged for 1 hour while maintaining the temperature at 80°C or higher and 85°C or lower, and then cooled to 45°C. 528.0 parts by mass of a 22% by mass aqueous sodium hydroxide solution was added thereto, and the mixture was vigorously stirred at 45°C for 4 hours. The mixture was cooled to room temperature, the aqueous phase was separated and removed, and the mixture was heated under reduced pressure to remove unreacted epichlorohydrin and water, yielding 283.6 parts by mass of crude 1,6-hexanediol diglycidyl ether. This crude 1,6-hexanediol diglycidyl ether was purified by distillation using an Oldershaw distillation column (15 plates), and the fraction at a pressure of 1,300 Pa and a temperature of 170°C or higher and 190°C or lower was taken as the main fraction, thereby obtaining 127.6 parts by mass of 1,6-hexanediol diglycidyl ether having a diglycidyl form purity of 97% by mass as determined by gas chromatography, a total chlorine content of 0.15% by mass, and an epoxy equivalent of 116 g / eq. 100 parts by mass of the 1,6-hexanediol diglycidyl ether, 69.3 parts by mass of bisphenol F (phenolic hydroxyl group equivalent: 100 g / eq), and 0.13 parts by mass of ethyltriphenylphosphonium iodide (30% by mass solution in methyl cellosolve) were placed in a pressure-resistant reaction vessel, and a polymerization reaction was carried out at 165 to 170°C for 5 hours under a nitrogen gas atmosphere, thereby obtaining an epoxy resin (S1) which is a copolymer of bisphenol F and 1,6-hexanediol glycidyl ether having an epoxy equivalent of 1,000 g / eq and a number average molecular weight of 3,000.

[0144] (Preparation of Epoxy Resin Sheet) 100 parts by mass of the above epoxy resin (S1) was blended with 8.5 parts by mass of a curing agent (manufactured by Mitsubishi Chemical Corporation, trade name "jER (registered trademark) Cure ST-14") to prepare a stretchable epoxy resin composition. The composition was sandwiched between separator films (manufactured by Mitsubishi Chemical Corporation, trade name "Diafoil (registered trademark) MRF-75", one-sided silicone-coated polyethylene terephthalate film, thickness 75 μm), adjusted to the desired thickness, subjected to a primary heat treatment at 40°C for 16 hours, and then a secondary heat treatment at 80°C for 6 hours to obtain an epoxy resin sheet with a thickness of 0.1 mm. The resulting epoxy resin sheet had a breaking elongation of 324%, a tensile modulus of elasticity of 4 MPa, and a tensile strength of 37 MPa. The loss tangent (Tan δ) of the resulting epoxy resin sheet was 0.5 or greater at 20°C over the entire frequency range between 100 Hz and 4,000 Hz.

[0145] <Preparation of B1-2> A thick epoxy resin sheet was obtained in the same manner as B1-1, except that the thickness after the secondary heat treatment was changed to 0.2 mm. The resulting epoxy resin sheet had a breaking elongation of 320%, a tensile modulus of elasticity of 4 MPa, and a tensile strength of 37 MPa. The loss tangent (Tan δ) of the resulting epoxy resin sheet was 0.5 or more at 20°C over the entire frequency range between 100 Hz and 4,000 Hz.

[0146] <Preparation of B2-1> (Preparation of thermoplastic elastomer sheet) A commercially available thermoplastic elastomer (manufactured by Mitsubishi Chemical Corporation, product name "TEFABLOC", thickness 0.2 mm) was used. The resulting thermoplastic elastomer sheet had a breaking elongation of 1030%, a tensile modulus of elasticity of 10 MPa, and a tensile strength of 12 MPa.

[0147] "Measurement and Evaluation" <Evaluation of Vibration Damping Property> The laminate was cut to a width of 15 mm and a length of 222 mm to prepare a test specimen. The obtained test specimen was used to evaluate vibration damping property as follows, using a vibration damping measuring device 30 shown in FIG. 4, by a one-end fixed impact vibration method in accordance with JIS G 0602:1993. The test specimen 31 was cantilever-fixed to a fixing jig 32 shown in FIG. 4 so that the effective length of the test specimen 31 was 200 mm and the gripping margin was 22 mm, and impact vibration was applied approximately 20 mm below the fixed end. Using a laser displacement meter (manufactured by Keyence Corporation, product name "CCD laser displacement meter LK-030") 33, the time waveform of the vibration displacement at the lowest point of the test specimen 31 was measured under an analysis frequency range of 400 Hz. The time required for the amplitude to change from 1 mm to 0.25 mm was measured, and this was defined as the time (seconds) at which the vibration damping reached ¼. In addition, the loss factor (23°C) was determined from the damped free vibration waveform obtained by the one-end fixed impact vibration method in accordance with JIS G 0602:1993.

[0148] <Evaluation of Deflection Amount> A laminate having a width of 16 mm and a length of 250 mm was fixed horizontally to a fixing table and held in a cantilevered state (fixed portion: 50 mm, cantilever portion: 200 mm). A weight of 100 gf was placed 10 mm from the tip of the cantilever, and the length by which the tip sagged (deflection amount: mm) was measured.

[0149] Example 1: A PAN-based unidirectional prepreg (A1-2: 90°) and a pitch-based unidirectional prepreg (A1-1: 0°) were laminated in this order on each side of an epoxy resin sheet (B1-1), to obtain a five-layer laminate precursor (total thickness 1.56 mm, A1-1 thickness 0.61 mm, A1-2 thickness 0.12 mm, B1-1 thickness 0.10 mm) laminated in this order: A1-1 (0°) / A1-2 (90°) / B1-1 / A1-2 (90°) / A1-1 (0°). In this specification, the numbers in parentheses after "A1-1" and "A1-2" are the orientation angles of the carbon fibers. The obtained laminate precursor was heated to 150°C at a rate of 2°C / min under a pressure of 0.7 MPa in an autoclave and heat-cured at 150°C for 120 minutes to obtain a laminate having a width of 250 mm, a length of 250 mm, and a total thickness of 1.56 mm. The time (seconds) until the vibration damping of the obtained laminate reached 1 / 4 was measured, and the loss factor was also calculated, and the deflection was also measured. The results are shown in Table 1. The time waveform of the vibration displacement is shown in Figure 5.

[0150] Example 2: A PAN-based unidirectional prepreg (A1-2: 90°) and a PAN-based unidirectional prepreg (A1-2: 0°) were laminated in this order on both sides of an epoxy resin sheet (B1-1), to obtain a laminate precursor (total thickness 1.52 mm, thickness of A1-2 (90°) 0.12 mm, thickness of A1-2 (0°) 0.59 mm, thickness of B1-1 0.1 mm) laminated in this order. The obtained laminate precursor was heated to 150°C at 2°C / min under a pressure of 0.7 MPa in an autoclave and heat-cured at 150°C for 120 minutes to obtain a laminate having a width of 250 mm, a length of 250 mm, and a total thickness of 1.52 mm. The time (seconds) until the vibration attenuation reached 1 / 4 was measured for the resulting laminate, and the loss factor was calculated. The results are shown in Table 1. The time waveform of the vibration displacement is shown in Figure 6.

[0151] Example 3: Pitch-based unidirectional prepregs (A1-1: 0°) were laminated on both sides of an epoxy resin sheet (B1-2), and a laminate precursor (total thickness 2.12 mm, thickness of A1-1 0.96 mm, thickness of B1-2 0.2 mm) was obtained by laminating them in the order A1-1 (0°) / B1-2 / A1-1 (0°). The obtained laminate precursor was heated to 150°C at a rate of 2°C / min under a pressure of 0.7 MPa in an autoclave and heat-cured at 150°C for 120 minutes to obtain a laminate having a width of 250 mm, a length of 250 mm, and a total thickness of 2.12 mm. The loss factor of the obtained laminate was determined. The results are shown in Table 1.

[0152] Example 4: Pitch-based unidirectional prepregs (A1-1: 0°) were laminated on both sides of a thermoplastic elastomer sheet (B2-1), and a laminate precursor (total thickness 2.12 mm, thickness of A1-1 0.96 mm, thickness of B2-1 0.2 mm) was obtained by laminating them in the order A1-1 (0°) / B2-1 / A1-1 (0°). The obtained laminate precursor was heated to 150°C at a rate of 2°C / min under a pressure of 0.7 MPa in an autoclave and heat-cured at 150°C for 120 minutes to obtain a laminate measuring 250 mm wide, 250 mm long, and 2.12 mm thick. The loss factor of the obtained laminate was determined, and the deflection was also measured. The results are shown in Table 1.

[0153] Example 5: A ceramic plate (A2-1) was bonded to each side of an epoxy resin sheet (B1-1) using an adhesive (trade name "XNR3305" manufactured by Nagase ChemteX Corporation), and a laminate precursor (total thickness 1.62 mm) was obtained by laminating the sheets in the following order: A2-1 / adhesive / B1-1 / adhesive / A2-1. The obtained laminate precursor was placed flat on a surface plate, and a 3.74 kg weight was placed on the laminate precursor. The laminate precursor was then left to stand overnight at room temperature, yielding a laminate having a width of 15 mm, a length of 222 mm, and a total thickness of 1.62 mm. The time (seconds) until the vibration attenuation of the obtained laminate reached 1 / 4 was measured, and the loss factor was also calculated. The results are shown in Table 1. The time waveform of the vibration displacement is also shown in FIG. 7.

[0154] Example 6: A ceramic plate (A2-2) was bonded to each side of an epoxy resin sheet (B1-1) using an adhesive (trade name "XNR3305" manufactured by Nagase ChemteX Corporation), and a laminate precursor (total thickness 1.62 mm) was obtained by laminating the layers in the following order: A2-2 / adhesive / B1-1 / adhesive / A2-2. The obtained laminate precursor was placed flat on a surface plate, and a 3.74 kg weight was placed on the laminate precursor. The laminate precursor was then left to stand overnight at room temperature, yielding a laminate having a width of 15 mm, a length of 222 mm, and a total thickness of 1.62 mm. The time (seconds) until the vibration attenuation of the obtained laminate reached 1 / 4 was measured, and the loss factor was also calculated. The results are shown in Table 1. The time waveform of the vibration displacement is also shown in FIG. 8.

[0155] Example 7: An Al-Mg alloy plate (A3-1) was bonded to each side of an epoxy resin sheet (B1-1) using an adhesive (trade name "XNR3305" manufactured by Nagase ChemteX Corporation), and a laminate precursor (total thickness 1.62 mm) was obtained by laminating the sheets in the following order: A3-1 / adhesive / B1-1 / adhesive / A3-1. The obtained laminate precursor was placed flat on a surface plate, and a 3.74 kg weight was placed on the laminate precursor. The laminate precursor was then left to stand overnight at room temperature, yielding a laminate measuring 15 mm in width, 222 mm in length, and 1.62 mm in total thickness. The time (seconds) until the vibration attenuation of the obtained laminate reached ¼ was measured, and the loss factor was also calculated. The results are shown in Table 1. The time waveform of the vibration displacement is shown in FIG. 9.

[0156] Comparative Example 1: Pitch-based unidirectional prepregs (A1-1: 0°) were laminated on both sides of a PAN-based unidirectional prepreg (A1-2: 90°), and a three-layer laminate precursor (total thickness 1.55 mm, thickness of A1-1 (0°) 0.61 mm, thickness of A1-2 (90°) 0.33 mm) was obtained by laminating them in the order A1-1 (0°) / A1-2 (90°) / A1-1 (0°). The obtained laminate precursor was heated to 150°C at a rate of 2°C / min under a pressure of 0.7 MPa in an autoclave and heat-cured at 150°C for 120 minutes to obtain a laminate measuring 250 mm in width, 250 mm in length, and 1.55 mm in total thickness. The time (seconds) until vibration damping reached 1 / 4 was measured for the obtained laminate, and the loss factor was also determined. The deflection was also measured. The results are shown in Table 1. FIG. 10 shows the time waveform of the vibration displacement.

[0157] Comparative Example 2: A PAN-based unidirectional prepreg (A1-2: 0°) was laminated on each side of a PAN-based unidirectional prepreg (A1-2: 90°), and a three-layer laminate precursor (total thickness 1.51 mm, thickness of A1-2 (0°) 0.59 mm, thickness of A1-2 (90°) 0.33 mm) was obtained by laminating the prepreg on both sides of the PAN-based unidirectional prepreg (A1-2: 90°). The laminate was then heated to 150°C at a rate of 2°C / min under a pressure of 0.7 MPa in an autoclave and heat-cured at 150°C for 120 minutes to obtain a laminate measuring 250 mm in width, 250 mm in length, and 1.51 mm in total thickness. The time (seconds) until the vibration damping reached 1 / 4 was measured for the resulting laminate, and the loss factor and deflection were also measured. The results are shown in Table 1. FIG. 11 shows the time waveform of the vibration displacement.

[0158] "Comparative Example 3" A stainless steel plate (A4-1) was used instead of the laminate, and the time (seconds) until the vibration attenuation reached 1 / 4 was measured, the loss factor was calculated, and the amount of deflection was measured. The results are shown in Table 1. The time waveform of the vibration displacement is also shown in Figure 12.

[0159] Comparative Example 4: An Al-Mg alloy plate (A3-2) was used instead of the laminate, and the time (seconds) until the vibration attenuation reached 1 / 4 was measured, and the loss factor was also calculated. The results are shown in Table 1. The time waveform of the vibration displacement is also shown in Figure 13.

[0160] "Comparative Example 5" Using a ceramic plate (A2-3) instead of the laminate, the time (seconds) until the vibration attenuation reached 1 / 4 was measured, the loss factor was calculated, and the amount of deflection was measured. The results are shown in Table 1. The time waveform of the vibration displacement is also shown in Figure 14.

[0161] "Comparative Example 6" Using a ceramic plate (A2-4) instead of the laminate, the time (seconds) until the vibration attenuation reached 1 / 4 was measured, the loss factor was calculated, and the amount of deflection was measured. The results are shown in Table 1. The time waveform of the vibration displacement is also shown in Figure 15.

[0162] Comparative Example 7 A laminate precursor (total thickness 2.16 mm) was obtained by laminating a pitch-based unidirectional prepreg (A1-1:0°). The obtained laminate precursor was heated to 150°C at a rate of 2°C / min under a pressure of 0.7 MPa in an autoclave and heat-cured at 150°C for 120 minutes to obtain a laminate having a width of 250 mm, a length of 250 mm, and a total thickness of 2.16 mm. The loss factor of the obtained laminate was determined. The results are shown in Table 1.

[0163] "Comparative Example 8" Six epoxy resin sheets (B1-1) were laminated with adhesive to form the second layer. The total thickness of the epoxy resin sheets was 0.60 mm, and the total thickness of the adhesive was 0.10 mm. A PAN-based unidirectional prepreg (A1-2: 0°) was laminated on each side of the second layer, resulting in a laminate precursor (total thickness 1.72 mm, second layer thickness 0.70 mm) laminated in the order A1-2 (0°) / B1-1 / A1-2 (0°). The resulting laminate precursor was heated to 150°C at 2°C / min in an autoclave under a pressure of 0.7 MPa and heat-cured at 150°C for 120 minutes, yielding a laminate measuring 250 mm wide, 250 mm long, and 1.52 mm thick. The deflection of the resulting laminate was measured, revealing a large deflection of 8.75 mm.

[0164] "Comparative Example 9" Four epoxy resin sheets (B1-1) were laminated with adhesive to form the second layer. The total thickness of the epoxy resin sheets was 0.40 mm, and the total thickness of the adhesive was 0.06 mm. A PAN-based unidirectional prepreg (A1-2: 0°) was laminated on each side of the second layer, resulting in a laminate precursor (total thickness 1.13 mm, second layer thickness 0.46 mm) laminated in the order A1-2 (0°) / B1-1 / A1-2 (0°). The resulting laminate precursor was heated to 150°C at 2°C / min in an autoclave under a pressure of 0.7 MPa and heat-cured at 150°C for 120 minutes, yielding a laminate with a width of 250 mm, length of 250 mm, and total thickness of 1.52 mm. When the deflection of the resulting laminate was measured, the deflection was so large that the weight fell, making measurement impossible.

[0165]

[0166] As is clear from the results in Table 1, the laminates obtained in Examples 1 and 2 had a shorter time until the vibration attenuation reached 1 / 4, a larger loss factor, and excellent vibration damping properties than those of Comparative Examples 1 to 6. The laminates obtained in Examples 3 and 4 also had a large loss factor and excellent vibration damping properties.

[0167] REFERENCE SIGNS LIST 10 Laminate precursor 11 First layer (A) 111 First A layer 112 Second A layer 113 Third A layer 114 Fourth A layer 12 Second layer (B) 21 Fixing portion 22 Finger portion 23 Through hole 30 Vibration damping measuring device 31 Test piece 32 Fixing jig 33 Laser displacement meter 200 Laminate 210 First layer (a) 211 First a layer 212 Second a layer 213 Third a layer 214 Fourth a layer 220 Second layer (b)

Claims

1. A laminate having a plurality of first layers (a) and a second layer (b), wherein each of the plurality of first layers (a) is a layer selected from a carbon fiber reinforced resin layer (a1), a ceramic layer (a2), and a metal layer (a3), and the second layer (b) is a layer selected from a layer (b1) mainly containing an epoxy resin (S) (excluding the carbon fiber reinforced resin layer (a1)) and a layer (b2) mainly containing a thermoplastic elastomer (T), the first layer (a) is disposed on both sides of the second layer (b), and the ratio of the thickness of the second layer (b) is 0.3% or more and less than 30% with respect to the total thickness of the first layer (a) and the second layer (b).

2. The laminate according to claim 1, wherein the total thickness of the laminate is 1.5 to 20 mm.

3. The laminate according to claim 1, wherein the carbon fiber reinforced resin layer (a1) includes both a layer containing pitch-based carbon fibers and a layer containing PAN-based carbon fibers.

4. The laminate according to claim 1, wherein the elongation at break of the layer (b1) containing the epoxy resin (S) is 100% or more and 500% or less.

5. The laminate according to claim 1, wherein the elongation at break of the layer (b2) containing the thermoplastic elastomer (T) is 800% or more and 1200% or less.

6. The laminate according to claim 1, wherein the metal layer (a3) is any one of an aluminum layer, a SUS layer, or a titanium alloy layer.

7. The laminate according to claim 1, wherein the epoxy resin (S) has an aliphatic hydrocarbon skeleton.

8. The laminate according to claim 1, wherein the thickness of the second layer (b) is 0.03 mm or more and 0.5 mm or less.

9. The laminate according to claim 3, wherein the tensile elastic modulus of the pitch-based carbon fibers is 600 GPa or more and 800 GPa or less.

10. The laminate according to claim 3, wherein the tensile elastic modulus of the PAN-based carbon fibers is 200 GPa or more and 400 GPa or less.

11. The carbon fiber reinforced resin layer (a1) is a layer (a11) containing pitch-based carbon fibers aligned in one direction and a cured product of an epoxy resin (N1). ０ ) and the layer (a11 ０ and a layer (β) containing carbon fibers oriented at an orientation angle of 45° or more and 90° or less with respect to the orientation of the pitch-based carbon fibers contained in the layer (β), wherein the layer (β) contains at least one of a layer (a11) containing pitch-based carbon fibers aligned in one direction and a cured product of an epoxy resin (N1) and a layer (a12) containing PAN-based carbon fibers aligned in one direction and a cured product of an epoxy resin (N2).

12. The laminate according to claim 1, wherein the tensile elastic modulus of the layer (b1) containing the epoxy resin (S) is 3 MPa or more and 12 MPa or less, and the tensile strength is 10 MPa or more and 50 MPa or less.

13. The laminate according to claim 1, wherein the tensile elastic modulus of the layer (b2) containing the thermoplastic elastomer (T) is 3 MPa or more and 20 MPa or less, and the tensile strength is 8 MPa or more and 40 MPa or less.

14. The laminate according to claim 1, wherein the second layer (b) is disposed only in a region including the center in the thickness direction of the laminate.

15. The laminate according to claim 1, wherein the second layer (b) is a layer made of a resin that does not contain fibers.

16. A laminate according to claim 1 or 2, wherein the loss tangent (Tan δ) of the second layer (b) is 0.2 or more at 20° C. over the entire frequency range between 100 Hz and 4,000 Hz.

17. The laminate of claim 1, wherein the loss factor of the laminate is 0.01 or greater.

18. The laminate according to claim 1, in which the time required for vibration damping of the laminate to reach 1 / 4 is 0.7 seconds or less.

19. The laminate according to claim 1, comprising a fixed portion that is fixed to a conveying device, and a finger portion that extends in a generally U-shape from the fixed portion.

20. The laminate of claim 1, which is in the form of a flat plate.

21. The laminate according to claim 1, further comprising a layer (c) containing a woven glass fiber fabric and a matrix resin on at least one of the outermost layers of the laminate.

22. A transport hand comprising a laminate according to any one of claims 1 to 21.

23. A transport device incorporating the transport hand according to claim 22.

24. A semiconductor manufacturing device incorporating the transfer hand according to claim 22.

25. A method for producing a laminate, comprising pressing a laminate precursor in which a first layer (A) is disposed on both sides of a second layer (B) to obtain a laminate, wherein the first layers (A) are selected from a carbon fiber prepreg layer (A1), a ceramic layer (A2) and a metal layer (A3), the second layers (B) are selected from a layer (B1) mainly containing an epoxy resin (S) (excluding a carbon fiber prepreg layer (a1)) and a layer (B2) mainly containing a thermoplastic elastomer (T), and the thickness of the second layer (B) is 0.3% or more and less than 30% of the total thickness of the first layer (A) and the second layer (B).

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