Electronic device comprising conductive member having slot and recess in order to operate as antenna

Abstract

An electronic device according to one embodiment may comprise: a display; a rear cover; a side member including a first conductive part that forms a portion of a side surface of the electronic device; and a support member, which is arranged between the display and the rear cover and includes a planar part and a recess part. The recess part can include a second conductive part, which is recessed toward the rear cover with respect to the planar part and extends toward the side surface. The second conductive part of the recess part can form, together with the first conductive part, a slot area that substantially faces the display. The electronic device may comprise a communication circuit for transmitting or receiving a wireless signal through the slot area.

Description

An electronic device comprising a conductive member having a slot and a recess formed therein for operating as an antenna.

[0001] The present disclosure relates to an electronic device including a conductive member having a slot and a recess formed therein for operating as an antenna.

[0002] Electronic devices, such as smartphones, may include an antenna for wireless communication. For example, the electronic device may include a display and a housing that accommodates the display, and the housing may include a conductive portion that at least partially functions as the antenna.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] In one embodiment, an electronic device may include a display, a back cover, a side member including a first conductive portion forming a portion of a side surface of the electronic device, and a support member disposed between the display and the back cover and including a planar portion and a recessed portion. The recessed portion may include a second conductive portion recessed toward the back cover and extending toward the side surface relative to the planar portion. The second conductive portion of the recessed portion may be configured to form a slot region substantially opposite the display together with the first conductive portion. The electronic device may include a communication circuit configured to transmit or receive a wireless signal through the slot region.

[0005] In one embodiment, an electronic device may include a display, and a conductive support member supporting the display. The conductive support member may include a side wall portion adjacent to a side surface of the electronic device, a planar portion, and a recessed portion. The recessed portion may be configured to be recessed toward a rear surface of the electronic device relative to the planar portion and extend toward the side surface of the electronic device, such that the recessed portion, together with the side wall portion, forms a slot area substantially facing the display. The electronic device may include a communication circuit configured to transmit and receive a wireless signal through the slot area.

[0006] In one embodiment, an electronic device may include a housing including a display visible through a front surface of the electronic device, a first conductive portion forming a portion of a side surface of the electronic device, and a second conductive portion positioned below the display and at least partially separated from the first conductive portion by a slot, and wireless communication circuitry configured to transmit and receive a radio frequency (RF) signal through the slot. The second conductive portion may include a first portion and a second portion forming a portion of an edge of the slot. The second portion of the second conductive portion may define a recess that is open toward the first conductive portion to be connected to the slot and is recessed toward a rear surface of the electronic device such that the second portion is spaced further from the display than the first portion.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2A is a diagram illustrating an exemplary electronic device according to one embodiment.

[0009] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0010] FIG. 3A is a drawing showing a frame structure of an electronic device according to one embodiment.

[0011] FIG. 3b is a drawing showing a frame structure of an electronic device according to one embodiment.

[0012] FIG. 3c is a drawing showing a frame structure of an electronic device according to one embodiment.

[0013] FIG. 3D is a drawing showing a frame structure of an electronic device according to one embodiment.

[0014] FIG. 4A is a cross-sectional view of an electronic device according to one embodiment.

[0015] FIG. 4b is a cross-sectional view of an electronic device according to one embodiment.

[0016] FIG. 5 is a drawing showing an antenna area of ​​an electronic device according to one embodiment.

[0017] FIG. 6A illustrates a frame structure, a printed circuit board, and a connecting member of an electronic device according to one embodiment.

[0018] Figure 6b is a cross-sectional view taken along line C-C' of Figure 6a.

[0019] Figure 6c is a cross-sectional view taken along line D-D' of Figure 6a.

[0020] FIG. 7a is a diagram showing the distribution of electric fields of an electronic device according to a comparative example and an electronic device according to an embodiment.

[0021] Figure 7b shows a radiation pattern of an electronic device according to one embodiment.

[0022] FIG. 7c is a graph showing the antenna efficiency of an electronic device according to a comparative example and an electronic device according to an embodiment.

[0023] Figure 8a shows the antenna efficiency according to the height of the recess of an electronic device according to one embodiment.

[0024] FIG. 8b shows antenna efficiency according to the length of the recess of an electronic device according to one embodiment.

[0025] FIG. 9a illustrates examples of electronic devices including slots.

[0026] Fig. 9b is a graph showing antenna efficiency according to the examples of Fig. 9a.

[0027] Figure 9c is a graph showing antenna efficiency according to the examples of Figure 9a.

[0028] Figure 9d is a graph showing antenna efficiency according to the examples of Figure 9a.

[0029] Figure 9e is a graph showing antenna efficiency according to the examples of Figure 9a.

[0030] FIG. 10A illustrates examples of electronic devices including slots.

[0031] Fig. 10b is a graph showing antenna efficiency according to the examples of Fig. 10a.

[0032] Figure 10c is a graph showing antenna efficiency according to the examples of Figure 10a.

[0033] Figure 10d is a graph showing antenna efficiency according to the examples of Figure 10a.

[0034] FIG. 10e is a graph showing antenna efficiency according to the examples of FIG. 10a.

[0035] FIG. 11a illustrates examples of electronic devices having slots of various lengths.

[0036] Figure 11b is a graph showing antenna efficiency according to the examples of Figure 11a.

[0037] Figure 11c is a graph showing antenna efficiency according to the examples of Figure 11a.

[0038] Figure 11d is a graph showing antenna efficiency according to the examples of Figure 11a.

[0039] Figure 11e is a graph showing antenna efficiency according to the examples of Figure 11a.

[0040] Figure 12a is a graph showing antenna efficiency according to the length of the recess.

[0041] Figure 12b is a graph showing antenna efficiency according to the length of the recess.

[0042] Figure 12c is a graph showing antenna efficiency according to the length of the recess.

[0043] Figure 12d is a graph showing antenna efficiency according to the length of the recess.

[0044] FIG. 13a illustrates examples of electronic devices having slots of various heights.

[0045] Fig. 13b is a graph showing antenna efficiency according to the examples of Fig. 13a.

[0046] Figure 13c is a graph showing antenna efficiency according to the examples of Figure 13a.

[0047] Figure 13d is a graph showing antenna efficiency according to the examples of Figure 13a.

[0048] Figure 13e is a graph showing antenna efficiency according to the examples of Figure 13a.

[0049] Figure 14 illustrates examples of the location of recesses according to one embodiment.

[0050] FIG. 15A illustrates various examples of frame structures of an electronic device having recesses and slots formed therein, according to one embodiment.

[0051] FIG. 15b illustrates various examples of frame structures of an electronic device, in which recesses and slots are formed, according to one embodiment.

[0052] FIG. 15c illustrates various examples of frame structures of an electronic device, in which recesses and slots are formed, according to one embodiment.

[0053] FIG. 15d illustrates various examples of frame structures of an electronic device, in which recesses and slots are formed, according to one embodiment.

[0054] FIG. 15e illustrates various examples of frame structures of an electronic device, in which recesses and slots are formed, according to one embodiment.

[0055] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0056] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0057] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0058] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0059] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0060] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0061] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0062] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0063] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0064] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0066] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0067] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0068] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0069] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0070] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0071] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0072] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0073] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0074] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0075] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0076] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0077] FIG. 2A is a diagram illustrating an exemplary electronic device according to an embodiment. Referring to FIG. 2A, an electronic device (200) according to an embodiment may include a housing (210) forming an exterior of the electronic device (200). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side surface) (200C) surrounding a space between the first side (200A) and the second side (200B). In an embodiment, the housing (210) may refer to a structure forming at least a portion of the first side (200A), the second side (200B), and / or the third side (200C).

[0078] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0079] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of the second surface (200B). In one embodiment, the back plate (211) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0080] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member or bracket) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third side (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third side (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third side (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0081] Unlike the illustrated embodiment, when the third side (200C) of the electronic device (200) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a portion extending from its edge and curved toward the rear plate (211) and / or the front plate (202). The extending portion of the front plate (202) and / or the rear plate (211) may be positioned at both ends of a long edge of the electronic device (200), for example, but is not limited to the above-described example.

[0082] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0083] In one embodiment, the electronic device (200) may include a display (201) (e.g., the display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)), or may additionally include other components.

[0084] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first side (200A). The display (201) may be disposed on the back surface of the front plate (202).

[0085] In one embodiment, in order to expand the area to which the display (201) is visually exposed, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). In one embodiment, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0086] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the first surface (200A) (or the front plate (202)).

[0087] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire a user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may refer to an area that, like other areas of the screen display area (201A), can display visual information by the display (201) and additionally acquire the user's biometric information (e.g., a fingerprint). Although the sensing area (201B) is illustrated as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may also be formed in the key input device (217).

[0088] In one embodiment, the display (201) may include an area where a first camera module (205) is positioned. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to a direction facing the first surface (200A) through the area of ​​the display (201).

[0089] In one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0090] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0091] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0092] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to a camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0093] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) may be integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2A, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or, display (201)) and the side bezel structure (218).

[0094] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., an audio output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0095] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0096] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) arranged to face a first side (200A) of the electronic device (200), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0097] In one embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include one camera.

[0098] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0099] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0100] In one embodiment, the key input device (217) may be arranged on the third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0101] In one embodiment, a connector hole (208) may be formed on the third side (200C) of the electronic device (200) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0102] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0103] FIG. 2B is an exploded perspective view of an exemplary electronic device according to an embodiment. Referring to FIG. 2B, an electronic device (200) according to an embodiment may include a frame structure (240) (e.g., the side bezel structure (218) of FIG. 2A), a first printed circuit board (250), a second printed circuit board (252), and a battery (270) (e.g., the battery (189) of FIG. 1).

[0104] In one embodiment, the frame structure (240) may be positioned between the display (201) and the back plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +Z direction). A first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -Z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) may be disposed within recesses formed in the frame structure (240).

[0105] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243). The periphery of the second part (243) may be surrounded by the first part (241). The first part (241) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)). The first part (241) surrounding the space may at least partially form a side surface of the electronic device (200) (e.g., the third side (200C) of FIG. 2A), and the second part (243) positioned within the space may extend inwardly from the first part (241). The second part (243) may be positioned below the display (201) (e.g., in the -Z direction). In one embodiment, the first part (241) and the second part (243) may be formed of metal and / or polymer. For example, the first part (241) may include a portion formed of a conductive material such as a metal (e.g., the first conductive portion (350) of FIG. 3A). For example, the second part (243) may include a portion formed of a conductive material such as a metal (e.g., the second conductive portion (360) of FIG. 3A).

[0106] In one embodiment, a first part (241) of a frame structure (240) forming the side surface of the electronic device (200) may be referred to as a side member, and a second part (243) of the frame structure (240) supporting various components of the electronic device (200) may be referred to as a support member.

[0107] In one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly disposed to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0108] In one embodiment, the display (201) may be positioned between a frame structure (240) and a front plate (202). For example, the front plate (202) may be positioned on one side (e.g., in the +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., in the -Z direction).

[0109] In one embodiment, the front plate (202) can be coupled with the display (201). For example, the display (201) can be attached to the back surface of the front plate (202) via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0110] In one embodiment, the front plate (202) may be coupled to a frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction. The outer portion of the front plate (202) may be coupled to the frame structure (240) (e.g., the first part (241)).

[0111] In one embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (250) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0112] In one embodiment, the battery (270) may power at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0113] In one embodiment, a first camera module (205) (e.g., a front camera) may be disposed in at least a portion of a frame structure (240) (e.g., a second part (243)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 2A).

[0114] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0115] In one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a substantially same plane as the surface of the rear plate (211).

[0116] In one embodiment, the housing (210) of the electronic device (200) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (200). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (200) may be referred to as the housing (210) of the electronic device (200).

[0117] FIGS. 3A, 3B, 3C, and 3D are drawings illustrating a frame structure of an electronic device according to one embodiment. FIG. 3A is a plan view illustrating a rear surface (340B) of a frame structure (340). FIGS. 3B and 3C are perspective views illustrating a rear surface (340B) of a frame structure (340). FIG. 3D is a perspective view illustrating a front surface (340A) of a frame structure (340).

[0118] Referring to FIGS. 3A, 3B, 3C, and 3D, an electronic device according to an embodiment (e.g., electronic device (200) of FIG. 2B) may include a frame structure (340) (e.g., frame structure (240) of FIG. 2B). The frame structure (340) may include a first conductive portion (350) (e.g., first part (241) of FIG. 2B) and a second conductive portion (360) (e.g., second part (243) of FIG. 2B). The first conductive portion (350) and the second conductive portion (360) may include an electrically conductive material, such as a metal. For example, the first conductive portion (350) and the second conductive portion (360) may be formed separately and then coupled to each other, or may be formed integrally.

[0119] In one embodiment, the frame structure (340) may include a front side (340A) (e.g., a side facing the +Z direction), a back side (340B) (e.g., a side facing the -Z direction), and a first side side (340C) (e.g., a side facing in a direction perpendicular to the Z axis). The first side side (340C) may be, for example, one side of the side surfaces of the frame structure (340) that extends substantially straight. In the example of FIG. 3A, the first side side (340C) is illustrated as being the right side (e.g., a side facing the -X direction) of the four side surfaces of the electronic device (200), but is not limited thereto.

[0120] In one embodiment, the first conductive portion (350) can at least partially form a first side (340C) of the frame structure (340). The first side (340C) of the frame structure (340) can be included in a side of the electronic device (e.g., the third side (200C) of FIG. 2A). For example, the first side (340C) of the frame structure (340) can at least partially form the side of the electronic device.

[0121] In one embodiment, the frame structure (340) may include a slot (310) (or slot region). For example, the slot (310) may extend from the front side (340A) of the frame structure (340) to the rear side (340B) so as to penetrate the frame structure (340). For example, the slot (310) may be formed by the second conductive portion (360) being at least partially separated from the first conductive portion (350). For example, the first conductive portion (350) and the second conductive portion (360) may be spaced apart through the slot (310). The first conductive portion (350) and the second conductive portion (360) may form an edge or boundary of the slot (310).

[0122] In one embodiment, the first conductive portion (350) may include a first segment (351) forming a first region (341) of the first side (340C) and a second segment (352) forming a second region (342) of the first side (340C). The first segment (351) and the second segment (352) may be spaced apart from each other with a third region (343) therebetween.

[0123] Additionally or optionally, the frame structure (340) may define a slit (315) (or slit region) connected to the slot (310). For example, the slit (315) may extend from a first side (340C) of the frame structure (340) to the slot (310). For example, the slit (315) may extend from a third region (343) of the first side (340C) between the first region (341) and the second region (342) to the slot (310). For example, the third region (343) may be formed by a non-conductive material or dielectric (e.g., a molded element) that is at least partially disposed within the slit (315).

[0124] In one embodiment, one or more recesses may be formed on the front surface (340A) of the frame structure (340). The one or more recesses may be formed in the first conductive portion (350) and / or the second conductive portion (360) so as to be adjacent to the slot (310). For example, the one or more recesses may include a recess (320) formed in the second conductive portion (360).

[0125] In one embodiment, the second conductive portion (360) may include a first portion (361) forming a portion of an edge of the slot (310) and a second portion (362) forming another portion of the edge of the slot (310). For example, the front (340A) and the back (340B) of the frame structure (340) formed by the first portion (361) may be formed to be substantially flat. In this respect, the first portion (361) may be referred to as a flat portion of the frame structure (340) (or the second conductive portion (360)). For example, the second portion (362) may define a recess (320) of the second conductive portion (360). In this respect, the second portion (362) may be referred to as a recessed portion of the frame structure (340) (or the second conductive portion (360)). The recess (320) may be recessed from the front side (340A) of the frame structure (340) toward the rear side (340B). At least a portion of the recess (320) adjacent to the slot (310) may be open toward the slot (310). For example, the recess (320) may be open toward the first conductive portion (350) positioned opposite the slot (310). In one embodiment, the second portion (362) defining the recess (320) may protrude from the rear side (340B) of the frame structure (340). For example, at least a portion of the second portion (362) may be positioned higher than the first portion (361) in the -Z direction.

[0126] In one embodiment, the first conductive portion (350) and / or the second conductive portion (360) may include point(s), area(s), or portion(s) that are positioned adjacent to the slot (310) and electrically connected to a wireless communication circuit of the electronic device (e.g., the wireless communication module (192) of FIG. 1). For example, the first conductive portion (350) may include feed portions (391, 392) that are adjacent to the slot (310) or form part of an edge of the slot (310). The contact portions (391, 392) may have a shape that protrudes from another portion of the first conductive portion (350) toward the second conductive portion (360), but are not limited thereto. The contact portions (391) and (392) may be, for example, electrically connected to the wireless communication circuit. For another example, one of the contact portion (391) and the contact portion (392) may be electrically connected to the wireless communication circuit, and the other may be electrically connected to the ground of the electronic device. The wireless communication circuit may transmit and / or receive a radio frequency (RF) signal by supplying power through the contact portion (391) and / or the contact portion (392). For example, the wireless communication circuit may transmit and / or receive an RF signal through an antenna using the slot (310). For example, the RF signal transmitted and received through the antenna using the slot (310) may have a frequency band of 2 GHz or higher, but is not limited thereto.

[0127] In one embodiment, the contact portion (391) and / or the contact portion (392) may be referred to as a feeding portion. Additionally or alternatively, the wireless communication circuit may be electrically connected to at least one point (e.g., at least one of the feeding points (P1, P2, P3)) of the second conductive portion (360) corresponding to an edge of the slot (310). The wireless communication circuit may transmit and / or receive the RF signal by feeding power through the at least one point.

[0128] Although not shown, the frame structure (340) may include one or more non-conductive portions, such as holes, openings, recesses (e.g., recesses (320)), slots (e.g., slots (310)), and slits (e.g., slits (315)), formed in the frame structure (340), at least partially disposed within the internal volume of the frame structure (340). The one or more non-conductive portions may be formed integrally, but are not limited thereto.

[0129] FIG. 4A is a cross-sectional view of an electronic device according to one embodiment. FIG. 4A shows a cross-section taken along line A-A' of FIG. 3A.

[0130] Referring to FIG. 4A, in one embodiment, the second conductive portion (360) of the electronic device (200) may be disposed between the display (201) and the rear plate (211) (or rear cover). The second conductive portion (360) may overlap the display (201) in a direction perpendicular to the display (201) (e.g., the Z-axis direction). The display (201) may be visible through the front surface (200A) of the electronic device (200). For example, the display (201) may be visible through the front surface (202) (or window) forming the front surface (200A) of the electronic device (200).

[0131] In one embodiment, the recess (320) of the second portion (362) may be recessed toward the back plate (211) (or the back surface (200B) of the electronic device (200) formed by the back plate (211)) such that the second portion (362) is spaced further from the display (201) than the first portion (361). By being recessed toward the back surface (200B), the second portion (362) may be positioned further from the display (201) than the first portion (361). For example, a first distance (H1) from the display (201) to the second portion (362) may be greater than a second distance (H2) from the display (201) to the first portion (361). The first distance (H1) may be a distance from the back surface of the display (201) to the bottom surface of the recess (320) facing the display (201). The second distance (H2) may be a distance from the back surface of the display (201) to the surface of the first portion (361) facing the display (201) (e.g., the front surface (340A) formed by the first portion (361) of FIG. 3D). The first distance (H1) and the second distance (H2) may be distances based on a direction substantially perpendicular to the display (201).

[0132] For example, the depth (D1) of the recess (320) based on the direction perpendicular to the display (201) (e.g., the Z-axis direction) may be about 0.5 mm or more, but is not limited thereto. For example, the depth (D1) of the recess (320) may be about 1.5 mm or more, but is not limited thereto. For example, the depth (D1) of the recess (320) may be about 1.5 mm or more and about 3.0 mm or less, but is not limited thereto.

[0133] Although not shown, the electronic device (200) according to one embodiment may further include a shielding member disposed between the display (201) and the second conductive portion (362) and arranged to substantially overlap the first portion (361) and the second portion (362) when viewed in a direction substantially perpendicular to the display (201).

[0134] In one embodiment, the recess (320) may have a length (L0) relative to a direction substantially parallel to the display (201), e.g., perpendicular to the Z-axis. For example, the length (L0) may vary depending on the desired characteristics of the antenna using the conductive portion (360). This will be described later with reference to FIGS. 8B and 11A to 12D.

[0135] FIG. 4B is a cross-sectional view of an electronic device according to one embodiment. FIG. 4B shows a cross-section taken along line B-B' of FIG. 3A.

[0136] Referring to FIG. 4B, in one embodiment, the slot (310) may be positioned below the display (201). For example, the slot (310) may substantially face the display (201). For example, the slot (310) may at least partially overlap the display (201) with respect to a direction perpendicular to the display (201).

[0137] In one embodiment, at least a portion of the recess (320) may be open toward the slot (310) or the first conductive portion (350) so as to be connected to the slot (310). For example, the second portion (362) may include a bottom portion (466) that forms a bottom surface of the recess (320) and forms a portion of an edge of the slot (310). Additionally, the second portion (362) may include a side wall portion (467) that extends in a height direction (e.g., in the Z-axis direction) from the bottom portion (466) so as to form a side surface of the recess (320). The side wall portion (467) may not be formed on an edge portion of the bottom portion (466) that forms a boundary of the slot (310) so that the recess (320) is open toward the slot (310). Alternatively, the side wall portion (467) may not be formed on the edge part of the bottom portion (466) facing the first conductive portion (350) so that the recess (320) is opened toward the first conductive portion (350). For example, the bottom portion (466) may be formed to be substantially flat, but is not limited thereto.

[0138] Referring to FIGS. 4A and 4B, in one embodiment, a section (311) of a slot (310) formed by a second portion (362) may be located further from the display (201) than a section (312) of a slot (310) formed by a first portion (361).

[0139] FIG. 5 is a diagram illustrating an antenna region of an electronic device according to an embodiment. Referring to FIG. 5, an electronic device (200) according to an embodiment may include a region (R1) including a slot (310), a slit (315), and / or a recess (320). For example, the region (R1) may have a height (h1) (e.g., a length based on the Y-axis direction) and a width (w1) (e.g., a length based on the X-axis direction).

[0140] According to one embodiment, the electronic device (200) may include an antenna region (R2) including a region (R1). The antenna region (R2) may include a slot (310), a slit (315), a recess (320), and / or conductive portions (e.g., a first conductive portion (350) and a second conductive portion (360)) around the slot (310), the slit (315), the recess (320), and / or conductive portions therearound (e.g., a first conductive portion (350) and a second conductive portion (360)). A height (h2) of the antenna region (R2) may extend further in the +Y direction and the -Y direction than a height (h1) of the region (R1). For example, the height (h2) of the antenna region (R2) may extend by about 2.5 mm in the +Y direction and by about 2.5 mm in the -Y direction than a height (h1) of the region (R1), but is not limited thereto. A width (w2) of the antenna region (R2) may extend further in the +X direction than a width (w1) of the region (R1). For example, the width (w2) of the antenna region (R2) may be extended by about 2.5 mm in the +X direction more than the width (w1) of the region (R1), but is not limited thereto. In one embodiment, the height (h2) of the antenna region (R2) may be about 27.2 mm to about 36.9 mm, but is not limited thereto. For example, the width (w2) of the antenna region (R2) may be about 10.7 mm, but is not limited thereto. In one embodiment, the length (e.g., the length along the Y-axis direction) of the recess (320) may be less than or equal to half the height (h1) of the region (R1), which corresponds to the length of the slot (310), but is not limited thereto.

[0141] The wireless communication circuit can transmit and / or receive RF signals using the antenna region (R2). The RF signals can include, for example, a frequency band for supporting GPS (e.g., GPS L5) and / or a frequency band for supporting Wi-Fi (e.g., 2.4 GHz, 5 GHz, or 6 GHz).

[0142] FIG. 6A illustrates a frame structure, a printed circuit board, and a connecting member of an electronic device according to one embodiment. FIG. 6B is a cross-sectional view taken along line C-C' of FIG. 6A. FIG. 6C is a cross-sectional view taken along line D-D' of FIG. 6A. Example (601) of FIG. 6A illustrates a frame structure (340) in which a printed circuit board (650) and a connecting member (655) are omitted, and example (602) illustrates a frame structure (340) in which a printed circuit board (650) and a connecting member (655) are arranged.

[0143] Referring to FIG. 6A, an electronic device (200) according to one embodiment may include a printed circuit board (650) and a connecting member (655) disposed on a frame structure (340).

[0144] In one embodiment, a printed circuit board (650) (e.g., the first printed circuit board (250) of FIG. 2B) may be disposed on a frame structure (340). For example, the printed circuit board (650) may be disposed on a rear surface (340B) of the frame structure (340). For example, the printed circuit board (650) may be disposed so as to avoid a recess (320) (or a second portion (362) defining the recess (320)). For example, the printed circuit board (650) may be disposed so as not to overlap the recess (320) with respect to a direction perpendicular to the frame structure (340) (e.g., the Z-axis direction). For example, the printed circuit board (650) may be disposed so as to avoid a slot (310). For example, the printed circuit board (650) may be positioned so as not to overlap the slot (310) in a direction perpendicular to the frame structure (340) (e.g., in the Z-axis direction).

[0145] Although not shown, the wireless communication circuit may be arranged on the printed circuit board (650). The connecting member (655) may be connected to the printed circuit board (650) and the contact member (391) to electrically connect the contact member (391) and the wireless communication circuit. For example, the connecting member (655) may include a section extending from an area on the printed circuit board (650), across the slot (310), to the contact member (391). For example, the connecting member (655) may include, but is not limited to, a flexible printed circuit board.

[0146] Referring to FIG. 6B, in one embodiment, the second conductive portion (360) may include a first support portion (663) protruding toward the back plate (211) relative to the first portion (361) forming a portion of the slot (310) and a second support portion (664) extending from the first portion (361). For example, the first support portion (663) may be positioned between the first portion (361) and the second support portion (664). For example, a printed circuit board (650) may be disposed on the second support portion (664) such that a side thereof faces the first support portion (663). For example, the first support portion (663) may support the connecting member (655), and the second support portion (664) may support the printed circuit board (650).

[0147] Referring to FIG. 6C, in one embodiment, the second portion (362) forming the recess (320) may protrude toward the back plate (211) relative to the second support portion (664). For example, the second portion (362) of the second conductive portion (360) may be positioned between the printed circuit board (650) and the slot (310). The printed circuit board (650) may be positioned on the second support portion (664) such that a side surface thereof faces the second portion (362) (e.g., the sidewall portion (467)). For example, the sidewall portion (467) of the second portion (362) may be positioned between the recess (320) and the printed circuit board (650).

[0148] FIG. 7a is a diagram showing the distribution of electric fields of an electronic device according to a comparative example and an electronic device according to an embodiment.

[0149] Example (701) of FIG. 7A illustrates an electronic device according to a comparative example, and example (702) illustrates an electronic device (e.g., electronic device (200) of FIG. 4A) according to an embodiment. Referring to FIG. 7A, the electronic device according to the embodiment of example (702) may include a recess (320) and a slot (310), and the electronic device according to the comparative example of example (701) may include a slot (310) without including the recess (320). Accordingly, the electronic device according to the comparative example of example (701) may have a relatively weak electric field distribution in the middle portion of the slot (310), and the electronic device according to the embodiment of example (702) may have a relatively strong electric field distribution in the middle portion of the slot (310). As a result, the antenna performance (e.g., radiation pattern and antenna efficiency) using the slot (310) of the electronic device according to the embodiment may be improved.

[0150] Fig. 7b illustrates a radiation pattern of an electronic device according to an embodiment. The graph (710) of Fig. 7b illustrates a radiation pattern of an electronic device according to a comparative example (e.g., the electronic device of the example (701) of Fig. 7a), and the graph (720) illustrates a radiation pattern of an electronic device (200) according to an embodiment (e.g., the electronic device of the example (702) of Fig. 7a).

[0151] Referring to FIG. 7B, the graph (720) of the electronic device (200) according to one embodiment may have an improved radiation pattern in the direction of the rear surface (200B) of the electronic device (200) compared to the graph (710) of the comparative example. For example, as indicated by arrow (A1), the peak performance in the direction of the rear surface (200B) may be effectively improved, and as indicated by arrow (A2), the radiation pattern for the null region may be improved. In addition, the electronic device (200) according to one embodiment may have an improved radiation pattern in the direction of the front surface (200A) compared to the comparative example.

[0152] FIG. 7c is a graph showing the antenna efficiency (e.g., total efficiency) of an electronic device according to a comparative example and an electronic device according to an embodiment.

[0153] The graph (711) of FIG. 7c represents the antenna efficiency of an electronic device according to a comparative example (e.g., the electronic device of the example (701) of FIG. 7a), and the graph (722) represents the antenna efficiency of an electronic device according to an embodiment (e.g., the electronic device of the example (702) of FIG. 7a). Referring to FIG. 7c, the antenna efficiency of the electronic device according to an embodiment (i.e., the graph (722)) may be improved over the antenna efficiency of the electronic device of the comparative example (i.e., the graph (711)).

[0154] FIG. 8A illustrates antenna efficiency according to the height of a recess of an electronic device according to an embodiment. Graphs (800, 805, 810, 815, 820, and 825) of FIG. 8A sequentially illustrate antenna efficiency when the height (H) of the recess (320) (e.g., the depth (D1) of FIG. 4A) increases. The height (H) of the recess (320) may be, for example, based on a direction parallel to the Z-axis.

[0155] For example, graph (800) may be the antenna efficiency when there is no recess (320), i.e., when the height (H) of the recess (320) is 0. For example, graph (805) represents the antenna efficiency when the height (H) of the recess (320) is greater than graph (800). For example, graph (805) may be the antenna efficiency when the height (H) of the recess (320) is 0.5 mm. For example, graph (810) represents the antenna efficiency when the height (H) of the recess (320) is greater than graph (805). For example, graph (810) may be the antenna efficiency when the height (H) of the recess (320) is 1.0 mm. For example, graph (815) represents the antenna efficiency when the height (H) of the recess (320) is greater than graph (810). For example, the graph (815) may be the antenna efficiency when the height (H) of the recess (320) is 1.5 mm. For example, the graph (820) represents the antenna efficiency when the height (H) of the recess (320) is greater than the graph (815). For example, the graph (820) may be the antenna efficiency when the height (H) of the recess (320) is 2.0 mm. For example, the graph (825) represents the antenna efficiency when the height (H) of the recess (320) is greater than the graph (820). For example, the graph (825) may be the antenna efficiency when the height (H) of the recess (320) is 2.5 mm. Referring to FIG. 8A, as the height (H) of the recess (320) increases (i.e., from the graph (800) to the graph (825), the antenna efficiency may be improved. This may be because a part of the antenna area (e.g., antenna area (R2) of FIG. 5) is spaced apart from the display (e.g., display (201) of FIG. 4a) due to the recess (320), and because the volume of the antenna using the slot (e.g., slot (310) of FIG. 3a) is expanded due to the recess (320).

[0156] FIG. 8B illustrates antenna efficiency according to the length of a recess of an electronic device according to an embodiment. Graphs (850, 855, 860, 865, and 870) of FIG. 8B sequentially illustrate antenna efficiency when the length (L) of the recess (320) (e.g., the length (L0) of FIG. 4A) increases. The length (L) of the recess (320) may be, for example, based on a direction parallel to the Y-axis. For example, graph (850) may be the antenna efficiency when there is no recess (320), i.e., when the length (L) of the recess (320) is 0. For example, graph (855) illustrates the antenna efficiency when the length (L) of the recess (320) is greater than graph (850). For example, graph (855) may be the antenna efficiency when the length (L) of the recess (320) is 1.0 mm. For example, graph (860) represents the antenna efficiency when the length (L) of the recess (320) is greater than graph (855). For example, graph (860) may be the antenna efficiency when the length (L) of the recess (320) is 3.0 mm. For example, graph (865) represents the antenna efficiency when the length (L) of the recess (320) is greater than graph (860). For example, graph (865) may be the antenna efficiency when the length (L) of the recess (320) is 5.0 mm. For example, graph (870) represents the antenna efficiency when the length (L) of the recess (320) is greater than graph (865). For example, graph (870) may be the antenna efficiency when the length (L) of the recess (320) is 7.0 mm. Referring to FIG. 8B, the radiation efficiencies of graphs (855, 860, 865, 870) may be significantly improved compared to graph (850). That is, the radiation efficiency of the antenna may be improved by forming the recess (320). In one embodiment, the radiation efficiency and bandwidth of the antenna may vary depending on the length (L) of the recess (320).For example, when the length (L) of the recess (320) is within a certain range, the radiation efficiency and bandwidth of the antenna may be improved as the length (L) increases (e.g., graphs (855, 860)). However, the relationship between the length (L) of the recess (320) and the resonant frequency may not be large.

[0157] FIG. 9A illustrates examples of electronic devices including slots. FIGS. 9B, 9C, 9D, and 9E are graphs representing antenna efficiencies (e.g., total efficiency) according to the examples of FIG. 9A. The dotted arrows illustrated in FIG. 9A may be feed lines (e.g., feed lines connected to points indicated by the tip of the arrow) of a frame structure (340) corresponding to the edge of a slot (or slit) (310), but the location of the feed lines is not limited to the illustrated examples. The graphs (910, 920, 930) of FIGS. 9B, 9C, 9D, and 9E may represent antenna efficiencies of the examples (901, 902, 903) of FIG. 9A, respectively. FIG. 9C is an enlarged graph of the graph of the first frequency band of about 0.76 GHz to about 1.46 GHz of FIG. 9B. Figure 9d is an enlarged graph of the second frequency band of about 2.40 GHz to about 3.79 GHz of Figure 9b. Figure 9e is an enlarged graph of the third frequency band of about 4.77 GHz to about 5.60 GHz of Figure 9b. For example, the first frequency band may include the GPS L5 band of 1176.45 GHz. For example, the second frequency band may include the Wi-Fi frequency band of 2.4 GHz. For example, the third frequency band may include the Wi-Fi frequency band of 5.0 GHz.

[0158] Referring to FIG. 9A, in comparative example (901), a slot (310) may be formed between a first conductive portion (350) and a second conductive portion (360) of a frame structure (340), and a slit (315) connected to the slot (310) may be formed in the first conductive portion (350). However, in comparative example (901), the recess (320) may not be formed. In one embodiment (902), compared to comparative example (901), the second conductive portion (360) may further include a second portion (362) that is formed to protrude and define the recess (320). The recess (320) may be connected to the slot (310). Comparative example (903) may not include the recess (320) of one embodiment (902). Comparative example (903) may further include a second portion (362) in which the second conductive portion (360) protrudes in the rear direction (e.g., -Z direction) compared to comparative example (901).

[0159] Referring to FIGS. 9a, 9b and 9c, in the first frequency band, the difference in antenna efficiency according to examples (901, 902, 903) may not be large.

[0160] Referring to FIGS. 9A, 9B, and 9D, in the second frequency band, the graph (920) of one embodiment (902) may have improved antenna efficiency compared to the graph (910) of the comparative example (901). For example, at 2.4 GHz, the graph (920) of one embodiment (902) may have improved antenna efficiency by about 0.5 dB compared to the graph (910) of the comparative example (901).

[0161] Referring to FIGS. 9a, 9b, and 9e, in the third frequency band, the antenna efficiency of the graph (920) of one embodiment (902) may be partially improved compared to the graph (910) of the comparative example (901). In addition, in the third frequency band, the antenna efficiency of the graph (920) of one embodiment (902) and the graph (930) of the comparative example (903) may be improved compared to the graph (910) of the comparative example (901). This may be because the directionality of the field formed by the slot (310) changes as the height (or thickness) of the slot (310) (e.g., the length of the slot (310) along the Z-axis direction of FIG. 4b) increases due to the second portion (362) protruding from the second conductive portion (360).

[0162] FIG. 10A illustrates examples of electronic devices including slots. FIGS. 10B, 10C, 10D, and 10E are graphs representing antenna efficiencies (e.g., total efficiency) according to the examples of FIG. 10A. The dotted arrows illustrated in FIG. 10A may be feed lines connected to points of a frame structure (340) corresponding to edges of slots (or slits) (310), but the location of the feed lines is not limited to the illustrated examples. The graphs (1010, 1020, 1030) of FIGS. 10B, 10C, 10D, and 10E may represent the antenna efficiencies of the examples (1001, 1002, 1003) of FIG. 10A, respectively. Figure 10c is an enlarged graph of the first frequency band of about 0.98 GHz to about 1.35 GHz of Figure 10b. Figure 10d is an enlarged graph of the second frequency band of about 2.42 GHz to about 3.73 GHz of Figure 10b. Figure 10e is an enlarged graph of the third frequency band of about 4.90 GHz to about 6.14 GHz of Figure 10b. The third frequency band may further include a Wi-Fi frequency band of 6.0 GHz.

[0163] Referring to FIG. 10a, examples (1001, 1002, 1003) may further include a display (201) facing the frame structure (340) compared to examples (901, 902, 903) of FIG. 9a.

[0164] Referring to FIGS. 10a, 10b, and 10c, in the first frequency band, the antenna efficiency of the graph (1020) of the embodiment (1002) and the graph (1030) of the comparative example (1003) may be lower than that of the graph (1010) of the comparative example (1001). Referring to FIGS. 10a, 10b, and 10d, in the second frequency band, the antenna efficiency of the graph (1020) of the embodiment (1002) and the graph (1030) of the comparative example (1003) may be lower than that of the graph (1010) of the comparative example (1001). On the other hand, referring to FIGS. 10a, 10b and 10e, in the third frequency band, the graph (1020) of the embodiment (1002) and the graph (1030) of the comparative example (1003) can have improved antenna efficiency compared to the graph (1010) of the comparative example (1001).

[0165] Additionally, in the third frequency band, the graph (1020) of one embodiment (1002) may have improved antenna efficiency compared to the graph (1030) of the comparative example (1003). This may be because the recess (320) moves a portion of the second conductive portion (360) away from the display (201), thereby reducing the impact on antenna performance due to coupling between the frame structure (340) and the display (201).

[0166] FIG. 11A illustrates examples of electronic devices having slots of various lengths. FIGS. 11B, 11C, 11D, and 11E are graphs showing antenna efficiencies (e.g., total efficiency) according to the examples of FIG. 11A. FIG. 11C is an enlarged graph of the graph of the first frequency band of about 0.99 GHz to about 1.38 GHz of FIG. 11B. FIG. 11D is an enlarged graph of the graph of the second frequency band of about 2.74 GHz to about 3.39 GHz of FIG. 11B. FIG. 11E is an enlarged graph of the graph of the third frequency band of about 4.96 GHz to about 6.17 GHz of FIG.

[0167] Referring to FIG. 11a, examples are shown in which a recess (320) is not formed (1101) and examples in which a recess (320) having various lengths (L1, L2, L3) (e.g., length (L0) of FIG. 4a) is formed (1102, 1103, 1104). The lengths (L1, L2, L3) of the recess (320) may be, for example, based on the Y-axis direction.

[0168] In one embodiment, examples (1101, 1102, 1103, 1104) may include a second conductive portion (360) and a display (201) below (e.g., in the +Z direction) the second conductive portion (360). The second conductive portion (360) of example (1101) may not have a recess (320) formed therein. The second conductive portion (360) of example (1102) may have a recess (320) formed therein having a first length (L1). The second conductive portion (360) of example (1103) may have a recess (320) formed therein having a second length (L2) greater than the first length (L1). A recess (320) having a third length (L3) greater than the second length (L2) may be formed in the second challenging portion (360) of the example (1104).

[0169] The graphs (1110) of FIGS. 11b, 11c, 11d, and 11e may represent the antenna efficiency of example (1101). The graphs (1120) of FIGS. 11b, 11c, 11d, and 11e may represent the antenna efficiency when the first length (L1) of the recess (320) of example (1102) is 3.0 mm. The graphs (1130) of FIGS. 11b, 11c, 11d, and 11e may represent the antenna efficiency when the second length (L2) of the recess (320) of example (1103) is 15.0 mm. The graphs (1140) of FIGS. 11b, 11c, 11d, and 11e may be antenna efficiencies when the third length (L3) of the recess (320) of the example (1104) has 22.0 mm.

[0170] Referring to FIGS. 11b, 11c, 11d, and 11e, the graph (1120) of the example (1102) in which the length of the recess (320) is the shortest may show a similar trend to the graph (1110) of the example (1101) in which there is no recess (320). This may be because the recess (320) has an effect on the antenna performance. In particular, referring to FIG. 11e, the graphs (1130, 1140) of the examples (1103, 1104) in which the length of the recess (320) is relatively large may have improved antenna efficiency compared to the graphs (1110, 1120) of the examples (1101, 1102) in which the length of the recess (320) is relatively small.

[0171] Figures 12a, 12b, 12c, and 12d are graphs showing antenna efficiency (e.g., total efficiency) according to the length of the recess.

[0172] Figure 12b is an enlarged graph of the first frequency band of about 1.09 GHz to about 1.26 GHz of Figure 12a. Figure 12c is an enlarged graph of the second frequency band of about 2.50 GHz to about 3.41 GHz of Figure 12a. Figure 12d is an enlarged graph of the third frequency band of about 4.68 GHz to about 6.47 GHz of Figure 12a.

[0173] Referring to FIGS. 12a, 12b, 12c, and 12d, graph (1210) may be a graph showing antenna efficiency when there is no recess (320), like example (1101) of FIG. 11a (e.g., graph (1110) of FIG. 11b). Graph (1220) may be a graph showing antenna efficiency when the first length (L1) of the recess (320) is 3.0 mm, like example (1102) of FIG. 11a (e.g., graph (1120) of FIG. 11b). Graph (1230) may be a graph showing antenna efficiency when the length of the recess (320) is 7.0 mm. Graph (1240) may be a graph showing antenna efficiency when the length of the recess (320) is 10.0 mm. It may be a graph showing the antenna efficiency when the second length (L2) of the recess (320) is 15.0 mm (e.g., graph (1130) of FIG. 11b).

[0174] Referring to FIGS. 12b, 12c, and 12d, in the first frequency band and the second frequency band, as the length of the recess (320) increases (i.e., from the graph (1210) to the graph (1250)), the antenna performance may tend to deteriorate, and in the third frequency band, as the length of the recess (320) increases, the antenna efficiency may tend to improve. In this way, depending on the length of the recess (320), the antenna efficiency for each frequency band may be traded off. Accordingly, by varying the length of the recess (320), the performance of the antenna may be appropriately adjusted.

[0175] FIG. 13A illustrates examples of electronic devices having slots of various heights. FIGS. 13B, 13C, 13D, and 13E are graphs showing antenna efficiencies (e.g., total efficiency) according to the examples of FIG. 13A. FIG. 13C is an enlarged graph of the graph of a first frequency band of about 1.05 GHz to about 1.30 GHz of FIG. 13B. FIG. 13D is an enlarged graph of the graph of a second frequency band of about 2.64 GHz to about 3.41 GHz of FIG. 13B. FIG. 13E is an enlarged graph of the graph of a third frequency band of about 5.14 GHz to about 5.97 GHz of FIG.

[0176] Referring to FIG. 13a, examples are shown in which a recess (320) is not formed (1301), and examples (1302, 1303, 1304) in which a second conductive portion (360) is spaced apart from the display (201) by various distances (H11, H12, H13) (e.g., the first distance (H1) in FIG. 4a) through the recess (320). The distances (H11, H12, H13) may be, for example, based on the Z-axis direction.

[0177] In one embodiment, examples (1301, 1302, 1303, 1304) may include a second conductive portion (360) and a display (201) below the second conductive portion (360). The second conductive portion (360) of example (1301) may not have a recess (320) formed therein. The second conductive portion (360) of example (1302) may be spaced apart from the display (201) by a first distance (H11) due to the formation of the recess (320). The second conductive portion (360) of example (1303) may be spaced apart from the display (201) by a second distance (H12) greater than the first distance (H11) due to the formation of the recess (320). The second conductive portion (360) of the example (1304) can be spaced apart from the display (201) by a third distance (H13) greater than the second distance (H12) by forming a recess (320).

[0178] Graphs (1310) of FIGS. 13b, 13c, 13d, and 13e may represent the antenna efficiency of example (1301). Graphs (1320) of FIGS. 13b, 13c, 13d, and 13e may represent the antenna efficiency of example (1302) when the first distance (H11) is 0.5 mm. Graphs (1330) of FIGS. 13b, 13c, 13d, and 13e may represent the antenna efficiency of example (1303) when the second distance (H12) is 1.5 mm. The graphs (1340) of FIGS. 13b, 13c, 13d, and 13e may be antenna efficiencies when the third distance (H13) of example (1304) has 2.0 mm.

[0179] Referring to FIGS. 13b, 13c, and 13d, in the first frequency band and the second frequency band, as the height of the recess (320) increases (i.e., from the graph (1310) to the graph (1340), the antenna performance may tend to deteriorate, and in the third frequency band, as the height of the recess (320) increases, the antenna efficiency may tend to improve. In this way, the antenna efficiency for each frequency band may be traded off depending on the height of the recess (320) and the distance between the second conductive portion (360) and the display (201). Accordingly, by varying the height of the recess (320), the performance of the antenna may be appropriately adjusted.

[0180] Fig. 14 illustrates examples of locations of recesses according to one embodiment. Examples (1401, 1402, 1403) of Fig. 14 may be views of the second conductive portion (360) viewed from the outside of the recess (320) in the +X direction.

[0181] Referring to example (1401) of FIG. 14, in one embodiment, the recess (320) of the second conductive portion (360) may be located at a first distance (S1) from the feeding point (P). For example, the feeding point (P) of example (1401) (e.g., the feeding point (P1) of FIG. 3A) may be located at a point of the second conductive portion (360).

[0182] Referring to example (1402), in one embodiment, the recess (320) of the second conductive portion (360) may be located at a second distance (S2) from the feeding point (P). For example, the second distance (S2) may be smaller than the first distance (S1). For example, the feeding point (P) of example (1402) (e.g., the feeding point (P2) of FIG. 3A) may be located at a point of the second conductive portion (360).

[0183] Referring to example (1403), in one embodiment, the recess (320) of the second conductive portion (360) may be located at a third distance from the feeding point (P). The third distance may be smaller than the first distance (S1) and the second distance (S2). For example, the feeding point (P) of example (1403) (e.g., the feeding point (P3) of FIG. 3A) may be located at a point of a portion (e.g., the recess portion) of the second conductive portion (360) forming the recess (320). Additionally or alternatively, although not shown, the feeding point (P) may be located at a first conductive portion (e.g., the first conductive portion (350) of FIG. 3A) located opposite the recess (320).

[0184] FIGS. 15A, 15B, 15C, 15D, and 15E illustrate various examples of a frame structure of an electronic device having a recess and a slot formed therein, according to one embodiment. The dotted arrows illustrated in FIGS. 15A, 15B, 15C, 15D, and 15E may be feed lines connected to points of the frame structure (340) corresponding to the edges of the slots (or slits) (310), but the location of the feed lines is not limited to the illustrated examples.

[0185] Referring to FIG. 15A, a recess (1511) may be formed in the frame structure (340). Unlike the recess (320) described above, which is formed in the second conductive portion (360), in one embodiment, the recess (1511) may be formed only in the first conductive portion (350). The recess (320) may be formed only in the first conductive portion (350), only in the second conductive portion (360), or may be formed to extend inward from the first conductive portion (350) toward the second conductive portion (360) (e.g., may be formed in both the first conductive portion (350) and the second conductive portion (360).

[0186] Referring to FIG. 15B, in one embodiment, a frame structure (340) may be formed with a first recess (1521) and a second recess (1522) spaced apart from the first recess (1521). The first recess (1521) and the second recess (1522) may each be formed in the second conductive portion (360). Each of the first recess (1521) and the second recess (1522) may be an example of the recess (320).

[0187] Referring to FIG. 15c, in one embodiment, a frame structure (340) may be formed with a first recess (1531) (e.g., the recess (320) described above) and a second recess (1532) (e.g., the recess (1511)). For example, the first recess (1531) may be formed in the second conductive portion (360), and the second recess (1532) may be formed in the first conductive portion (350). For example, the first recess (1531) and the second recess (1532) may face each other with the slot (310) therebetween.

[0188] Referring to FIG. 15d, unlike the first recess (1531) and the second recess (1532) of FIG. 15c which are positioned to face each other, the first recess (1531) and the second recess (1532) may be positioned to be at least partially misaligned with each other.

[0189] Referring to FIG. 15E, in one embodiment, the second portion (362) of the second conductive portion (360) defining the recesses described above may be formed at a curved edge (1551) of the slot (310), rather than forming an edge of the slot (310) that extends substantially straight. For example, the end portion of the second portion (362) that is open to the slot (310) may have a curved shape (e.g., a step shape).

[0190] According to one embodiment, an electronic device (e.g., an electronic device (200) of FIG. 2a) may include a display (e.g., a display (201) of FIG. 2b), a back cover (e.g., a back plate (211) of FIG. 2b), a side member (e.g., a first part (241) of FIG. 2b) including a first conductive portion (e.g., a first conductive portion (350) of FIG. 3a) forming a part of a side surface (e.g., a third surface (200C) of FIG. 2a) of the electronic device, and a support member (e.g., a second part (243) of FIG. 2b) disposed between the display and the back cover and including a planar portion (e.g., a first portion (361) of FIG. 3a) and a recessed portion (e.g., a second portion (362) of FIG. 3a). The recessed portion may include a second conductive portion that is recessed toward the rear cover and extends toward the side, relative to the flat portion. The second conductive portion of the recessed portion may be configured to form a slot area (e.g., slot (310) of FIG. 3A) substantially facing the display together with the first conductive portion. The electronic device may include a communication circuit (e.g., wireless communication module (192) of FIG. 1) configured to transmit or receive a wireless signal through the slot area.

[0191] In one embodiment, the first conductive portion may include a power supply portion (e.g., contact portion (391) of FIG. 3A) electrically connected to the communication circuit, and configured such that a beam corresponding to the wireless signal is radiated substantially toward at least the rear cover based on current supplied through the power supply portion by the communication circuit.

[0192] In one embodiment, a first vertical distance between the second conductive portion of the recessed portion and the display (e.g., the first distance H1 in FIG. 4A) may be greater than a second vertical distance between the flat portion and the display (e.g., the second distance H2 in FIG. 4A).

[0193] In one embodiment, the side member may include a third conductive portion (e.g., the first segment (351) of FIG. 3A) spaced apart from the first conductive portion, and a slit (e.g., the slit (315) of FIG. 3A) formed between the first conductive portion and the third conductive portion. The slot region may be formed to be continuously connected to the slit.

[0194] In one embodiment, the slot region can be substantially filled with a non-conductive material.

[0195] In one embodiment, the internal space formed by the recessed portion (e.g., recess (320) in FIG. 3d) can be substantially filled with a non-conductive material.

[0196] In one embodiment, the height of the internal space formed by the recessed portion may be 1.5 millimeters or more.

[0197] In one embodiment, the electronic device may include a printed circuit board (e.g., printed circuit board (650) of FIG. 6A) disposed on the support member. The communication circuit may be disposed on the printed circuit board. The printed circuit board may be disposed so as not to overlap the slot area when viewed in a direction substantially perpendicular to the display.

[0198] In one embodiment, the wireless signal may have a high frequency band of 2 GHz or more.

[0199] In one embodiment, the electronic device may further include a shielding member disposed between the display and the support member, the shielding member being disposed to substantially overlap the flat portion and the recessed portion when viewed in a direction substantially perpendicular to the display.

[0200] In one embodiment, the recessed portion may include a first recessed portion and a second recessed portion. The first recessed portion and the second recessed portion may be formed so as not to overlap each other when viewed in a direction substantially perpendicular to the display.

[0201] In one embodiment, the second challenge portion may include a planar side portion and a recessed side portion recessed away from the side member relative to the planar side portion.

[0202] In one embodiment, the first challenge portion may include a protruding portion protruding toward the recess side.

[0203] In one embodiment, the slot region can be formed to be continuously connected to the cut region formed in the flat portion.

[0204] According to one embodiment, an electronic device (e.g., the electronic device (200) of FIG. 2A) may include a display (e.g., the display (201) of FIG. 2B), a conductive support member (e.g., the frame structure (340) of FIG. 3A) supporting the display. The conductive support member may include a side wall portion (e.g., the first conductive portion (350) of FIG. 3A) adjacent to a side surface (e.g., the third surface (200C) of FIG. 2A) of the electronic device, a planar portion (e.g., the first portion (361) of FIG. 3A), and a recessed portion (e.g., the second portion (362) of FIG. 3A). The recessed portion may be configured to be recessed relative to the flat portion toward the rear surface of the electronic device (e.g., the second surface (200B) of FIG. 2A) and extend toward the side surface of the electronic device, such that together with the side wall portion, a slot area (e.g., the slot (310) of FIG. 3A) substantially facing the display is formed. The electronic device may include a communication circuit (e.g., the wireless communication module (192) of FIG. 1) configured to transmit and receive a wireless signal through the slot area.

[0205] In one embodiment, the sidewall portion may include a power supply portion (e.g., contact portion (391) of FIG. 3A) electrically connected to the communication circuit, and configured such that a beam corresponding to the wireless signal is radiated substantially in a direction substantially perpendicular to at least the display based on current supplied through the power supply portion by the communication circuit.

[0206] In one embodiment, the side wall portion may further include another recessed portion recessed toward the rear surface of the electronic device.

[0207] In one embodiment, the other recessed portion may be positioned to at least partially overlap the recessed portion when viewed in a direction substantially parallel to the display.

[0208] In one embodiment, an electronic device (e.g., an electronic device (200) of FIG. 2A) may include a housing (e.g., a housing (210) of FIG. 2A), which includes a display (e.g., a display (201) of FIG. 2B) visible through a front surface (e.g., a first surface (200A) of FIG. 2A) of the electronic device, a first conductive portion (e.g., a first conductive portion (350) of FIG. 3A) forming a portion of a side surface (e.g., a third surface (200C) of FIG. 2A) of the electronic device, and a second conductive portion (e.g., a second conductive portion (360) of FIG. 3A) positioned below the display and at least partially separated from the first conductive portion by a slot (e.g., a slot (310) of FIG. 3A), and a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) configured to transmit and receive a radio frequency (RF) signal through the slot. The second conductive portion may include a first portion (e.g., the first portion (361) of FIG. 3A) and a second portion (e.g., the second portion (362) of FIG. 3A), which form a portion of an edge of the slot. The second portion of the second conductive portion may define a recess (e.g., the recess (320) of FIG. 3D) that is open toward the first conductive portion to be connected to the slot and is recessed toward the rear surface of the electronic device (e.g., the second surface (200B) of FIG. 2A) so that the second portion is spaced further from the display than the first portion.

[0209] In one embodiment, a first distance (e.g., a first distance (H1) in FIG. 4A) between a bottom surface of the recess defined by the second portion and a back surface of the display may be greater than a second distance (e.g., a second distance (H2) in FIG. 4A) between a surface of the first portion facing the display and the back surface of the display.

[0210] In one embodiment, the side surface of the electronic device may include a first region (e.g., the first region (341) of FIG. 3A), a second region (e.g., the second region (342) of FIG. 3A), and a third region (e.g., the third region (343) of FIG. 3A) between the first region and the second region. The first conductive portion may include a first segment (e.g., the first segment (351) of FIG. 3A) forming the first region of the side surface and a second segment (e.g., the second segment (352) of FIG. 3A) forming the second region of the side surface. The first conductive portion may define a slit (e.g., the slit (315) of FIG. 3A) extending from the third region of the side surface to the slot.

[0211] In one embodiment, the housing may include a first non-conductive portion that is at least partially disposed within the slit and forms the third region of the side.

[0212] In one embodiment, the housing may include a second non-conductive portion disposed at least partially within the slot.

[0213] In one embodiment, the housing may include a third non-conductive portion, at least partially disposed within the recess of the second portion.

[0214] In one embodiment, the housing may include a first non-conductive portion at least partially disposed within the slit and forming the third region of the side surface, a second non-conductive portion at least partially disposed within the slot, and a third non-conductive portion at least partially disposed within the recess of the second portion. The first non-conductive portion, the second non-conductive portion, and the third non-conductive portion may be formed integrally.

[0215] In one embodiment, the first conductive portion may include a power supply portion (e.g., contact portion (391) of FIG. 3A) electrically connected to the wireless communication circuit.

[0216] In one embodiment, the feeding portion may protrude toward the second conductive portion.

[0217] In one embodiment, the depth of the recess relative to the direction perpendicular to the display may be greater than or equal to 1.5 mm and less than or equal to 3.0 mm.

[0218] In one embodiment, the electronic device may include a printed circuit board (e.g., printed circuit board (650) of FIG. 6A) on which the wireless communication circuitry is arranged. The printed circuit board may not overlap the slot when viewed in a direction substantially perpendicular to the display.

[0219] In one embodiment, the housing may include a support portion (e.g., a second support portion (664) of FIG. 6C) having a first side facing the display (e.g., a front side (340A) of FIG. 3A) and a second side opposite to the first side and formed substantially flat (e.g., a rear side (340B) of FIG. 3A). The printed circuit board may be disposed on the second side of the support portion. The second portion may extend from the support portion so as to protrude toward the rear side of the electronic device. A portion of a side surface of the printed circuit board may face the second portion.

[0220] In one embodiment, the electronic device may include a flexible printed circuit board (e.g., a connecting member (655) of FIG. 6A) extending from an area on the printed circuit board to an area on the first conductive portion adjacent to the slot. The wireless communication circuit may be electrically connected to the first conductive portion through the flexible printed circuit board.

[0221] In one embodiment, the recess may be a first recess (e.g., the first recess (1521) of FIG. 15b). The second conductive portion may include a third portion forming another portion of an edge of the slot. The third portion may define a second recess (e.g., the second recess (1522) of FIG. 15b) that is open toward the first conductive portion to be connected to the slot and is recessed toward the rear surface of the electronic device such that the third portion is further away from the display than the first portion.

[0222] In one embodiment, the first conductive portion may define a third recess (e.g., the second recess (1532) of FIG. 15c) that is open toward the second conductive portion to be connected to the slot and is recessed toward the rear surface of the electronic device.

[0223] In one embodiment, the first recess and the third recess may be positioned adjacent to each other with the slot therebetween.

[0224] In one embodiment, the edge section of the slot formed by the second portion (e.g., edge (1551) of FIG. 15e) may have a step shape when viewed in a direction substantially perpendicular to the display.

[0225] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0226] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0227] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0228] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0229] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0230] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A display visible through the front of said electronic device; A housing comprising a first conductive portion forming a portion of a side surface of the electronic device and a second conductive portion positioned below the display and at least partially separated from the first conductive portion by a slot; and A wireless communication circuit configured to transmit and receive an RF signal (radio frequency signal) through the above slot is included. The second challenging portion comprises a first portion and a second portion, which form a portion of an edge of the slot, The second portion of the second conductive portion defines a recess that is open toward the first conductive portion so as to be connected to the slot and is recessed toward the rear of the electronic device so that the second portion is spaced further from the display than the first portion. Electronic devices.

2. In claim 1, The first distance between the bottom surface of the recess defined by the second part and the back surface of the display is greater than the second distance between the surface of the first part facing the display and the back surface of the display. Electronic devices.

3. In claim 1 or claim 2, The side of the electronic device comprises a first region, a second region, and a third region between the first region and the second region, The first challenging portion comprises a first segment forming the first region of the side and a second segment forming the second region of the side, The first challenging portion defines a slit extending from the third region of the side to the slot. Electronic devices.

4. In claim 3, The housing comprises a first non-conductive portion at least partially disposed within the slit and forming the third region of the side surface. Electronic devices.

5. In any one of claims 1 to 4, The housing comprises a second non-conductive portion at least partially disposed within the slot. Electronic devices.

6. In any one of claims 1 to 5, The housing comprises a third non-conductive portion, at least partially disposed within the recess of the second portion; Electronic devices.

7. In claim 1 or claim 2, The side of the electronic device comprises a first region, a second region, and a third region between the first region and the second region, The first challenging portion comprises a first segment forming the first region of the side and a second segment forming the second region of the side, The first challenging portion defines a slit extending from the third region of the side to the slot, The above housing: A first non-conductive portion at least partially disposed within the slit and forming the third region of the side surface; a second non-conductive portion at least partially disposed within said slot; and a third non-conductive portion, at least partially disposed within the recess of the second portion; The first non-conductive portion, the second non-conductive portion and the third non-conductive portion are formed integrally. Electronic devices.

8. In any one of claims 1 to 7, The first conductive portion includes a power supply portion electrically connected to the wireless communication circuit. Electronic devices.

9. In claim 8, The above-mentioned power supply portion protrudes toward the second conductive portion, Electronic devices.

10. In any one of claims 1 to 9 of claim 1, The depth of the recess based on the direction perpendicular to the display is 1.5 mm or more and 3.0 mm or less, Electronic devices.

11. In any one of claims 10 of claim 1, A printed circuit board having the wireless communication circuit arranged thereon is included, The printed circuit board, when viewed in a direction substantially perpendicular to the display, does not overlap the slot, Electronic devices 12. In claim 11, The housing comprises a support portion including a first side facing the display and a second side formed substantially flat and opposite to the first side, The above printed circuit board is arranged on the second surface of the above support portion, The second portion extends from the support portion so as to protrude toward the rear surface of the electronic device, A portion of the side of the above printed circuit board faces the second portion, Electronic devices.

13. In claim 11 or claim 12, A flexible printed circuit board extending from an area on the printed circuit board to an area on the first conductive portion adjacent the slot, The above wireless communication circuit is electrically connected to the first conductive portion through the flexible printed circuit board. Electronic devices.

14. In any one of claims 1 to 13, The above recess is the first recess, The second challenging portion comprises a third portion forming another part of the edge of the slot, The third portion defines a second recess that is open toward the first conductive portion to be connected to the slot and is recessed toward the rear surface of the electronic device so that the third portion is further away from the display than the first portion. Electronic devices.

15. In any one of claims 1 to 14, The first conductive portion defines a third recess that is open toward the second conductive portion to be connected to the slot and is recessed toward the rear surface of the electronic device. Electronic devices.

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