Flexible display and electronic device comprising same

Abstract

An electronic device according to one embodiment of the present invention may comprise: a first housing; a second housing; and a display device disposed on the first housing and the second housing. The display device may comprise: a flexible display panel; a digitizer disposed under the flexible display panel; a support plate disposed under the digitizer and including a polymer material; and a conductive layer disposed between the digitizer and the support plate and plated on the surface of the support plate.

Description

Flexible display and electronic device including the same

[0001] One embodiment disclosed in this document relates to a flexible display and an electronic device including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions according to the programs installed on them, including home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] As the use of personal or portable communication devices such as smartphones becomes more widespread, user demand for portability and ease of use is increasing. For example, a touchscreen display, while functioning as an output device that displays visual information, can also provide a virtual keypad that replaces mechanical input devices (e.g., button-type input devices). This allows portable communication devices or electronic devices to be miniaturized while still offering the same or improved usability (e.g., larger screens). On the other hand, the commercialization of flexible displays, such as foldable or rollable displays, is expected to further enhance the portability and ease of use of electronic devices.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0006] An electronic device according to one embodiment of the present disclosure may include a first housing, a second housing, and a display device disposed on the first housing and the second housing. The display device may include a flexible display panel, a digitizer disposed under the flexible display panel, a support plate disposed under the digitizer and including a polymer material, and a conductive layer disposed between the digitizer and the support plate and plated on a surface of the support plate.

[0007] A display device according to one embodiment of the present disclosure may include a flexible display panel, a digitizer disposed under the flexible display panel, a shielding layer disposed under the digitizer and including magnetic metal powder (MMP), a support plate disposed under the shielding layer and including a polymer material, and a conductive layer disposed between the shielding layer and the support plate and plated on a surface of the support plate.

[0008] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0010] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is a cross-sectional view of a flexible display device (230) of an electronic device according to an embodiment of the present disclosure.

[0014] FIG. 6a is an enlarged view of a portion (P) of the structure of the display device (230) disclosed in FIG. 5 according to an embodiment of the present disclosure.

[0015] FIG. 6b is an enlarged view of a portion (P) of the structure of the display device (230) disclosed in FIG. 5 according to an embodiment of the present disclosure.

[0016] FIG. 7a is an enlarged view of a portion (P) of the structure of the display device (230) disclosed in FIG. 5 according to an embodiment of the present disclosure.

[0017] FIG. 7b is an enlarged view of a portion (P) of the structure of the display device (230) disclosed in FIG. 5 according to an embodiment of the present disclosure.

[0018] FIG. 8 is a drawing showing the result of 2D scanning of a support layer structure disposed under a digitizer among a general display device and a display device (230) according to an embodiment of the present disclosure.

[0019] FIG. 9 is a flowchart showing a surface plating treatment process on a support plate of a support layer according to an embodiment of the present disclosure.

[0020] FIG. 10 is a drawing showing a cross-section of a support layer after the surface plating process of the flow chart of FIG. 9 according to an embodiment of the present disclosure.

[0021] Figure 11a is a diagram showing the results of a peel test at room temperature, taking into account rework of a display device.

[0022] Figure 11b is a diagram showing the results of a peel test at high temperature (e.g., approximately 75° C.) considering rework of the display device.

[0023] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0024] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0025] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0026] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0027] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0028] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0029] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0030] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0031] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0035] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0036] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0037] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0041] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0043] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0046] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0047] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0048] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0049] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0050] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0051] FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0052] Referring to FIGS. 2 and 3, the electronic device (101) may include a housing (201), a hinge cover (240) covering a foldable portion of the housing (201), and a display device (230) disposed within a space formed by the housing (201). According to one embodiment, a surface on which a screen output from the display device (230) is exposed is defined as a front surface of the electronic device (101) (e.g., a first front surface (210a) and a second front surface (220a)). A surface opposite to the front surface is defined as a rear surface of the electronic device (101) (e.g., a first rear surface (210b) and a second rear surface (220b)). A surface surrounding a space between the front surface and the rear surface is defined as a side surface of the electronic device (101) (e.g., a first side surface (210c) and a second side surface (220c)). The side of the electronic device (101) may be a side of at least one of the first housing (210) or the second housing (220).

[0053] The electronic device (101) of FIGS. 2 and 3 may be referred to as a foldable electronic device, a portable electronic device, or a portable foldable electronic device. In one embodiment, the housing (201) may be referred to as a foldable housing. The display device (230) may be referred to as a "flexible display."

[0054] According to one embodiment, the housing (201) may include a first housing (210), a second housing (220) rotatable with respect to the first housing (210), a first rear cover (280), and a second rear cover (290). The housing (201) of the electronic device (101) is not limited to the shape and combination shown in FIGS. 2 and 3, and may be implemented by a combination and / or combination of other shapes or parts. For example, the first housing (210) and the first rear cover (280) may be formed integrally, and the second housing (220) and the second rear cover (290) may be formed integrally.

[0055] According to one embodiment, the first housing (210) is connected to a hinge structure (e.g., the hinge assembly (202) of FIG. 4) and may include a first front surface (210a) facing a first direction and a first rear surface (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to the hinge assembly (202) and includes a second front surface (220a) facing a third direction and a second rear surface (220b) facing a fourth direction opposite to the third direction, and may rotate about the hinge assembly (202) with respect to the first housing (210). Accordingly, the electronic device (101) may be variable between a folded state and an unfolded state. The electronic device (101) may have the first front side (210a) facing the second front side (220a) in a folded state, and the third direction may be the same as the first direction in an unfolded state. In the following, unless otherwise stated, the directions are described based on the unfolded state of the electronic device (101).

[0056] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (A) as the center, and may have an overall symmetrical shape with respect to the folding axis (A). As described below, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the state of the electronic device (101) is in an unfolded state, a folded state, or an intermediate state. According to one embodiment, the second housing (220) additionally includes a sensor area (224) in which sensors (e.g., a front camera) are arranged, but may have a mutually symmetrical shape in other areas.

[0057] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (A), and the folding axis (A) may be a plurality of parallel folding axes (e.g., two). In the present disclosure, the folding axis (A) is provided along the longitudinal direction (Y-axis direction) of the electronic device (101), but the direction of the folding axis (A) is not limited thereto. For example (not shown), the electronic device (101) may include a folding axis extending along the width direction (e.g., X-axis direction).

[0058] According to one embodiment, the electronic device (101) may include a structure into which a digital pen can be attached. For example, the electronic device (101) may include a magnetic body configured to attach the digital pen to a side of the first housing (210) or a side of the second housing (220). According to one embodiment, the electronic device (101) may include a structure into which a digital pen can be inserted. For example, a hole (not shown) into which the digital pen can be inserted may be formed in a side of the first housing (210) or a side of the second housing (220) of the electronic device (101).

[0059] According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic or non-metallic material having a rigidity of a size selected to support the display device (230). At least a portion formed of the metallic material may provide a ground plane of the electronic device (101) and may be electrically connected to a ground line formed on a printed circuit board (e.g., the board portion (260) of FIG. 4).

[0060] According to one embodiment, the sensor area (224) may be formed to have a predetermined area adjacent to one edge or one corner of the second housing (220). However, the arrangement, shape, and size of the sensor area (224) are not limited to the illustrated example. For example, in one embodiment, the sensor area (224) may be provided in another corner of the second housing (220) or any area between the upper and lower corners or in the first housing (210). In one embodiment, components for performing various functions built into the electronic device (101) may be exposed to the front of the electronic device (101) through the sensor area (224) or through one or more openings provided in the sensor area (224). In one embodiment, the components may include various types of sensors. The sensors may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

[0061] In one embodiment, the first rear cover (280) may be disposed on one side of the folding axis (A) on the rear of the electronic device (101). The first rear cover (280) may have a substantially rectangular periphery, and the periphery may be wrapped by the first housing (210). In one embodiment, the second rear cover (290) may be disposed on the other side of the folding axis (A) on the rear of the electronic device (101), and the periphery thereof may be wrapped by the second housing (220).

[0062] According to one embodiment, the first rear cover (280) and the second rear cover (290) may have substantially symmetrical shapes with respect to the folding axis (A axis). However, the first rear cover (280) and the second rear cover (290) do not necessarily have mutually symmetrical shapes, and in other embodiments, the electronic device (101) may include the first rear cover (280) and the second rear cover (290) of various shapes.

[0063] According to one embodiment, the first rear cover (280), the second rear cover (290), the first housing (210), and the second housing (220) may form a space in which various components (e.g., a printed circuit board or a battery) of the electronic device (101) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of a sub-display device (e.g., the sub-display device (244) of FIG. 4) may be visually exposed through at least a portion of the first rear cover (280). According to one embodiment, one or more components or sensors may be visually exposed through at least a portion of the second rear cover (290). According to one embodiment, the sensor may include a proximity sensor and / or a camera module (206) (e.g., a rear camera).

[0064] According to one embodiment, a front camera exposed to the front of the electronic device (101) through one or more openings provided in the sensor area (224) or a camera module (206) exposed through at least a portion of the second rear cover (290) may include one or more lenses, image sensors, and / or image signal processors. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0065] According to one embodiment, the hinge cover (240) may be disposed between the first housing (210) and the second housing (220) to cover internal components (e.g., the hinge assembly (202) of FIG. 4). According to one embodiment, the hinge cover (240) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the state of the electronic device (101) (flat state or folded state).

[0066] According to one embodiment, as illustrated in FIG. 2, when the electronic device (101) is in an unfolded state, the hinge cover (240) may be covered by the first housing (210) and the second housing (220) and may not be exposed. As another example, as illustrated in FIG. 3, when the electronic device (101) is in a folded state (e.g., a fully folded state), the hinge cover (240) may be exposed to the outside between the first housing (210) and the second housing (220). As another example, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded at a certain angle, the hinge cover (240) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be less than that in the fully folded state. According to one embodiment, the hinge cover (240) may include a curved surface.

[0067] According to one embodiment, the display device (230) may be placed on a space formed by the housing (201). For example, the display device (230) may be mounted on a recess formed by the housing (201) and may constitute most of the front surface of the electronic device (101). Accordingly, the front surface of the electronic device (101) may include the display device (230), a portion of the first housing (210) adjacent to the display device (230) and a portion of the second housing (220). The rear surface of the electronic device (101) may include a first rear cover (280), a portion of the first housing (210) adjacent to the first rear cover (280), a second rear cover (290), and a portion of the second housing (220) adjacent to the second rear cover (290).

[0068] According to one embodiment, the display device (230) may include a plurality of displays spaced apart from each other. For example, the display device (230) may include a first display area (231) disposed on a first housing (210) and a second display area (232) disposed on a second housing (220). According to one embodiment, the first display area (231) and the second display area (232) may rotate about a folding axis (A).

[0069] According to one embodiment, the display device (230) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. For example, the display device (230) may be a foldable or flexible display. According to one embodiment, the display device (230) may include a folding area (233), a first display area (231) arranged on one side (e.g., the left side of the folding area (233) illustrated in FIG. 2) with respect to the folding area (233), and a second display area (232) arranged on the other side (e.g., the right side of the folding area (233) illustrated in FIG. 2). However, the division of the areas of the display device (230) is exemplary, and the display device (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the display device (230) may be divided into regions by a folding region (233) extending parallel to the Y-axis or a folding axis (A-axis), but in other embodiments, the display device (230) may be divided into regions based on another folding region (e.g., a folding region parallel to the X-axis) or another folding axis (e.g., a folding axis parallel to the X-axis). According to one embodiment, the display device (230) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer configured to detect a magnetic field-type stylus pen (e.g., a digitizer (340) of FIG. 5).

[0070] According to one embodiment, the first display area (231) and the second display area (232) may have an overall symmetrical shape centered on the folding area (233). According to one embodiment (not shown), the second display area (232), unlike the first display area (231), may include a cut notch depending on the presence of the sensor area (224), but may have a shape symmetrical with respect to the first display area (231) in other areas. In other words, the first display area (231) and the second display area (232) may include a portion having a symmetrical shape and a portion having an asymmetrical shape.

[0071] Hereinafter, the operation of the first housing (210) and the second housing (220) and each area of ​​the display device (230) according to the state of the electronic device (101) (e.g., flat state or unfolded state and folded state) will be described.

[0072] According to one embodiment, when the electronic device (101) is in a flat state (e.g., FIG. 2), the first housing (210) and the second housing (220) may be arranged to face the same direction at a substantially 180-degree angle. The surface of the first display area (231) of the display device (230) and the surface of the second display area (232) may form a 180-degree angle with each other and face the same direction (e.g., toward the front of the electronic device). The folding area (233) may form the same plane as the first display area (231) and the second display area (232).

[0073] According to one embodiment, when the electronic device (101) is in a folded state (e.g., FIG. 3), the first housing (210) and the second housing (220) may be arranged to face each other. The surface of the first display area (231) of the display device (230) and the surface of the second display area (232) may form a narrow angle (e.g., between 0 and 10 degrees) with each other and may face each other. The folding area (233) may be formed as a curved surface having at least a portion of a predetermined curvature.

[0074] According to one embodiment, when the electronic device (101) is in an intermediate state (not shown), the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. The surface of the first display area (231) and the surface of the second display area (232) of the display device (230) may form an angle that is larger than the angle in the folded state and smaller than the angle in the unfolded state. The folding area (233) may be formed as a curved surface having at least a portion of a certain curvature, and the curvature at this time may be smaller than that in the folded state.

[0075] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0076] Referring to FIG. 4, the electronic device (101) may include a housing (201), a display device (230), a hinge assembly (202), a battery (250), and a substrate (260). The housing (201) may include a first housing (210), a second housing (220), a first rear cover (280), and a second rear cover (290). The configurations of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 4 may be all or part of the same as the configurations of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 2 and / or FIG. 3.

[0077] According to one embodiment, the first housing (210) and the second housing (220) can be assembled to each other so as to be coupled to both sides of the hinge assembly (202). According to one embodiment, the first housing (210) can include a first support area (212) capable of supporting a component of the electronic device (101) (e.g., the first circuit board (262) and / or the first battery (252)) and a first side wall (211) surrounding at least a portion of the first support area (212). The first side wall (211) can include a first side surface of the electronic device (101) (e.g., the first side surface (210c) of FIG. 2). According to one embodiment, the second housing (220) may include a second support area (222) capable of supporting components of the electronic device (101) (e.g., a second circuit board (264) and / or a second battery (254)) and a second side wall (221) surrounding at least a portion of the second support area (222). The second side wall (221) may include a second side surface of the electronic device (101) (e.g., the second side surface (220c) of FIG. 2).

[0078] According to one embodiment, the display device (230) may include a first display area (231), a second display area (232), a folding area (233), and a sub-display device (244). The configuration of the first display area (231), the second display area (232), and the folding area (233) of FIG. 3 may be all or part of the same as the configuration of the first display area (231), the second display area (232), and the folding area (233) of FIG. 1 and / or FIG. 2.

[0079] According to one embodiment, the sub-display device (244) can display a screen in a different direction from the display areas (231, 232). For example, the sub-display device (234) can output a screen in a direction opposite to the first display area (231). According to one embodiment, the sub-display device (234) can be placed on the first rear cover (280).

[0080] In one embodiment, the battery (250) may include a first battery (252) disposed within the first housing (210) and a second battery (254) disposed within the second housing (220). In one embodiment, the first battery (252) may be connected to the first circuit board (262), and the second battery (254) may be connected to the second circuit board (264). In one embodiment, the battery (250) may supply power to at least one component of the electronic device (101). In one embodiment, the battery (250) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0081] In one embodiment, the substrate (260) may include a first circuit board (262) disposed within a first housing (210) and a second circuit board (264) disposed within a second housing (220). In one embodiment, the first circuit board (262) and the second circuit board (264) may be electrically connected by at least one flexible circuit board (266). In one embodiment, at least a portion of the flexible circuit board (266) may be disposed across the hinge assembly (202). In one embodiment, the first circuit board (262) and the second circuit board (264) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). Components for implementing various functions of the electronic device (101) can be placed on the first circuit board (262) and the second circuit board (264).

[0082] According to one embodiment, the electronic device (101) may include speakers (208a, 208b). According to one embodiment, the speakers (208a, 208b) may convert electrical signals into sound. According to one embodiment, the speakers (208a, 208b) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). According to one embodiment, the speakers (208a, 208b) may include an upper speaker (208a) positioned at the top (+Y direction) of the electronic device (101) and a lower speaker (208b) positioned at the bottom (-Y direction) of the electronic device (101). In the present disclosure, the speakers (208a, 208b) are illustrated as being positioned within one housing (e.g., the first housing (210) of FIG. 4), but this is an optional structure. For example, the speakers (208a, 208b) may be located within at least one of the first housing (210) or the second housing (220). The configuration of the speakers (208a, 208b) of FIG. 4 may be all or part of the same as the configuration of the sound output module (155) of FIG. 1.

[0083] In one embodiment, the electronic device (101) may include a rear member (270) (or rear case). In one embodiment, the rear member (270) may be disposed within a housing (201) (e.g., a second housing (220)). In one embodiment, the rear member (270) may accommodate at least one antenna (275).

[0084] According to one embodiment, the electronic device (101) may include an antenna (275). The antennas (275a, 275b) may include, for example, an ultra wide band (UWB) antenna (275a), a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna (275b). The antenna (275) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0085] In one embodiment, an antenna structure may be formed by a portion or a combination of the housing (201). For example, the antenna (275) may include a communication antenna (275c) that is at least partially exposed to the exterior of the electronic device (101) and forms at least a portion of the exterior of the electronic device (101). The communication antenna (275c) may be used for communication with an external electronic device (e.g., Wi-Fi). The communication antenna (275c) may be connected to the upper portion (271a) or the lower portion (271b) of the rear member (270).

[0086] In the detailed description below, a configuration in which a pair of housings (or, "housings") are rotatably coupled by a hinge structure (or, "hinge structure") may be exemplified. However, it should be noted that this embodiment does not limit the electronic device according to various embodiments disclosed in the present document. For example, the electronic device according to various embodiments disclosed in the present document may include three or more housings, and "a pair of housings" in the embodiments disclosed below may mean "two housings rotatably coupled to each other among the three or more housings."

[0087] Below, the structure of the display device (230) will be described in detail.

[0088] FIG. 5 is a cross-sectional view of a flexible display device (230) of an electronic device according to an embodiment of the present disclosure.

[0089] FIG. 6a is an enlarged view of a portion (P) of the structure of the display device (230) disclosed in FIG. 5 according to one embodiment of the present disclosure.

[0090] FIG. 6b is an enlarged view of a portion (P) of the structure of the display device (230) disclosed in FIG. 5, according to one embodiment of the present disclosure.

[0091] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 1 to 4) may include a flexible display device (230).

[0092] The configuration of the flexible display device (230) of FIGS. 5, 6A, and 6B may be partially or entirely identical to the configuration of the display module (160) of FIG. 1 and / or the configuration of the display device (230) of FIGS. 2 to 4. The embodiments of FIGS. 5, 6A, and 6B may be optionally combined with the embodiments of FIGS. 7A to 10.

[0093] According to one embodiment, the display device (230) may include a first layer (310), a second layer (320), a reinforcing layer (330), a digitizer (340), a shielding layer (350), and a support layer (360).

[0094] According to one embodiment, the display device (230) may include a first layer (310). The first layer (310) may be a portion exposed to the outside of the electronic device (101).

[0095] According to one embodiment, the first layer (310) may include a protective film (311). The protective film (311) may be a portion exposed to the outside of the electronic device (101). According to one embodiment, the first layer (310) may include a window (312). The window (312) may be combined with the protective film (311). The window (312) may be thin glass or ultra-thin glass. The first layer (310) may include a first adhesive layer (313). The first adhesive layer (313) may combine the protective film (311) and the window (312). The first layer (310) may include a second adhesive layer (314). The second adhesive layer (314) may combine the window (312) and the second layer (320).

[0096] According to one embodiment, the display device (230) may include a second layer (320). The second layer (320) may be coupled with the first layer (310). A second adhesive layer (314) may couple the window (312) and the second layer (320). The second layer (320) may include a polarizing layer (321). An upper surface of the polarizing layer (321) may be coupled with the second adhesive layer (314). The second layer (320) may include a panel (322). The panel (322) may be coupled with the polarizing layer (321). The second layer (320) may include a third adhesive layer (324). The third adhesive layer (324) may couple the polarizing layer (321) and the panel (322). The second layer (320) may include an inner film (323). The inner film (323) may be bonded to the panel (322). The second layer (320) may include a fourth adhesive layer (325). The fourth adhesive layer (325) may bond the inner film (323) to the reinforcing layer (330). The panel (322) may be referred to as a “flexible display panel.”

[0097] According to one embodiment, the display device (230) may include a reinforcing layer (330). The reinforcing layer (330) may be disposed between the panel (322) and the digitizer (340). The reinforcing layer (330) may be configured. The reinforcing layer (330) may be configured of a carbon fiber reinforced plastics (CFRP) material. The reinforcing layer (330) may support the panel (322) and include a pattern (e.g., a lattice pattern) in which a plurality of openings or recesses are formed in a central region (e.g., a folding region (233) of FIG. 4) to facilitate bending. The reinforcing layer (330) may be coupled to the digitizer (340) via a fifth adhesive layer (331).

[0098] According to one embodiment, the display device (230) may include a digitizer (340). The digitizer (340) may be disposed between the reinforcing layer (330) and the shielding layer (350). The digitizer (340) may detect an electronic pen (not shown) (e.g., a stylus pen) outside the electronic device (101) by way of touch detection, pressure detection, or magnetic field detection. For example, the digitizer (340) may detect movement or contact of an electronic pen (not shown) (e.g., a stylus pen) outside the electronic device (101).

[0099] In one embodiment, the digitizer (340) may include a first digitizer (341). The digitizer (340) may include a second digitizer (342). The first digitizer (341) and the second digitizer (342) may be spaced apart from each other. For example, the first digitizer (341) and the second digitizer (342) may be spaced apart from each other with a folding axis (FX) (or folding line) therebetween. The first digitizer (341) may be disposed between at least a portion of the connector (392) and the second digitizer (342). The digitizer (340) may be divided into a first digitizer (341) positioned adjacent to the connector (392) and a second digitizer (342) positioned away from the connector (392).

[0100] According to one embodiment, the display device (230) may include a shielding layer (350). The shielding layer (350) may be disposed between the digitizer (340) and the support layer (360). The shielding layer (350) may be a conductive sheet including magnetic metal powder (MMP). The shielding layer (350) may reduce or limit noise and electromagnetic interference generated from the panel (322) and the digitizer (340).

[0101] According to one embodiment, the shielding layer (350) may include a first shielding layer (351). The shielding layer (350) may include a second shielding layer (352). The first shielding layer (351) and the second shielding layer (352) may be spaced apart from each other with the folding axis (FX) therebetween. The first shielding layer (351) may be arranged to correspond to the first digitizer (341). The second shielding layer (352) may be arranged to correspond to the second digitizer (342). The first shielding layer (351) may be arranged between at least a portion of the connector (392) and the second shielding layer (352).

[0102] According to one embodiment, the display device (230) may be disposed under the shielding layer (350) and may include an anti-corrosion layer (380) for anti-corrosion of the shielding layer. The anti-corrosion layer (380) may be disposed between the shielding layer (350) and the support layer (360). For example, the anti-corrosion layer (380) may include a first anti-corrosion layer (381) adhered to a lower surface of a first shielding layer (351) and a second anti-corrosion layer (382) adhered to a lower surface of a second shielding layer (352). The anti-corrosion layer (380) may have a structure in which a polyethylene terephthalate film (PET) is laminated with a pressure sensitive adhesive (PSA).

[0103] According to one embodiment, the display device (230) may include a support layer (360). The support layer (360) may be disposed between the shielding layer (350) and the support body (370). The support layer (360) may provide rigidity to the electronic device (101) having a foldable or unfoldable structure. For example, the support layer (360) may support the load of structures (e.g., 310, 320, 330, 340, 350) disposed on the upper side of the support layer (360). For example, the support layer (360) may be formed of at least a portion of a metal material having high rigidity, thereby reducing or limiting bending (e.g., distortion) that occurs in the area adjacent to the folding axis (FX) of the structures (e.g., 310, 320, 330, 340, 350, 360) when the electronic device (101) is folded or unfolded. The support layer (360) may provide a grounding structure to the panel (322) and the digitizer (340).

[0104] According to one embodiment, the support layer (360) may include a first support layer (361). The support layer (360) may include a second support layer (362). The first support layer (361) and the second support layer (362) may be spaced apart from each other. For example, the first support layer (361) and the second support layer (362) may be spaced apart from each other with the folding axis (FX) therebetween. The first support layer (361) may be disposed between at least a portion of the connector (392) and the folding area (S). The support layer (360) may be divided into a first support layer (361) adjacent to the connector (392) and a second support layer (362) located further from the connector (392) than the first support layer (361). The first support layer (361) and the second support layer (362) may be spaced apart from each other with the folding area (S) therebetween. The first support layer (361) may be arranged to correspond to the first digitizer (341). The second support layer (362) may be arranged to correspond to the second digitizer (342).

[0105] According to one embodiment, the electronic device (101) may include a support body (370). The support body (370) may be a part of a housing (e.g., 210, 220 of FIG. 4), a part of a hinge assembly (e.g., 202 of FIG. 4), or a separate structure (e.g., a hinge cover) disposed between the hinge assembly and the support layer (360). A portion of the support body (370) located in the folding area (S) may be a part of the hinge assembly (e.g., 202 of FIG. 4) and may provide a folding axis (FX) along which the electronic device (101) is folded or unfolded. The support body (370) may support structures (e.g., 310, 320, 330, 340, 350, 360) that fold or unfold based on the folding axis (FX).

[0106] According to one embodiment, the support body (370) may include a first support body (371). The support body (370) may include a second support body (372). The first support body (371) and the second support body (372) may be spaced apart from each other with the folding axis (FX) therebetween. The first support body (371) may be arranged to correspond to the first digitizer (341). The second support body (372) may be arranged to correspond to the second digitizer (342). The first support body (371) may correspond to a first support area (e.g., 212 of FIG. 4) of a first housing (e.g., 210 of FIG. 4) located below the display device (230). The second support body (372) may correspond to a second support area (e.g., 222 in FIG. 4) of a second housing (e.g., 220 in FIG. 4) located below the display device (230).

[0107] According to one embodiment, the support body (370) may include a first support cover (373). The support body (370) may include a second support cover (374). The first support cover (373) may be coupled to the first support body (371). The second support cover (374) may be coupled to the second support body (372). The first support cover (373) and the second support cover (374) may be spaced apart from each other with the folding axis (FX) therebetween. The first support cover (373) and the second support cover (374) may be positioned within the folding area (S) of the electronic device (101). The first support cover (373) may be positioned below the folding area (e.g., 233 of FIG. 4) of the display device (230) and may be a portion (e.g., a wing plate) that covers one side of the hinge assembly. The second support cover (374) is located below the folding area (e.g., 233 in FIG. 4) of the display device (230) and may be a part (e.g., a wing plate) that covers the other side of the hinge assembly.

[0108] According to one embodiment, the first support layer (361) may be disposed between the first digitizer (341) and the first support body (371). The second support layer (362) may be disposed between the second digitizer (342) and the second support body (372).

[0109] According to one embodiment, the display device (230) may include a grounding member (not shown). The grounding member may provide a grounding structure to the panel (322) or the digitizer (340). A plurality of the grounding members may be arranged spaced apart from each other. The grounding members may be connected to the support layer (360).

[0110] According to one embodiment, the display device (230) may include a circuit board (391). The circuit board (391) may be an FPCB. The circuit board (391) may be made of a flexible material. The circuit board (391) may be electrically connected to the panel (322). The circuit board (391) may be electrically connected to the digitizer (340).

[0111] According to one embodiment, the electronic device (101) may include a connector (392). The connector (392) may be made of a flexible material. The connector (392) may electrically connect the circuit board (391) and the panel (322). The connector (392) may extend from a position spaced apart from one side of the plurality of layers (320, 330, 340, 350, 360).

[0112] According to one embodiment, the electronic device (101) may include a folding axis (FX). The folding axis (FX) may be a reference along which structures of the electronic device (101), including a housing (e.g., 210, 220 of FIG. 4), are folded or unfolded. A hinge assembly (e.g., 202 of FIG. 4) may provide the folding axis (FX) of the electronic device (101) (e.g., the display device (230)). The folding axis (FX) may be formed between a first digitizer (341) and a second digitizer (342). The folding axis (FX) may be formed between a first shielding layer (351) and a second shielding layer (352). The folding axis (FX) may be formed between a first support layer (361) and a second support layer (362). The folding axis (FX) may be formed between the first support body (371) and the second support body (372). The folding axis (FX) may be formed between the first support cover (373) and the second support cover (374). The folding axis (FX) may be formed between the first inner shielding layer (353) and the second inner shielding layer (354).

[0113] According to one embodiment, the electronic device (230) may include a folding area (S). A folding axis (FX) may extend through the folding area (S). The folding area (S) may be a space in which structures of the electronic device (101), including a housing (e.g., 210, 220 of FIG. 4), are folded or unfolded. The folding area (S) may be a portion of a space of the electronic device (101) that includes the folding axis (FX). The folding area (S) may be formed between the first shielding layer (351) and the second shielding layer (352). The folding area (S) may be formed between the first support layer (361) and the second support layer (362). The folding area (S) may be defined as a space formed between the first support layer (361) and the second support layer (362). The first inner shielding layer (353) and the second inner shielding layer (354) may be positioned within the folding area (S). The first support cover (373) and the second support cover (374) may be positioned within the folding area (S).

[0114] According to one embodiment, the shielding layer (350) may include a first inner shielding layer (353). The first inner shielding layer (353) may be spaced apart from the first shielding layer (351). The first inner shielding layer (353) may be positioned within the folding area (S), and the first shielding layer (351) may be positioned outside the folding area (S). The shielding layer (350) may include a second inner shielding layer (354). The second inner shielding layer (354) may be spaced apart from the second shielding layer (352). The second inner shielding layer (354) may be positioned within the folding area (S), and the second shielding layer (352) may be positioned outside the folding area (S).

[0115] According to one embodiment, the first support layer (361) and the second support layer (362) may be spaced apart from each other with a folding area (S) therebetween. The first support layer (361) may be disposed between the connector (392) and the folding area (S). The second support layer (362) may be disposed on the outside of the folding area (S).

[0116] According to one embodiment, the first support layer (361) and the second support layer (362) may be configured to include corresponding materials. The display device (230) may include a driving unit (391, 392). The driving unit (391, 392) may include a circuit board (391) and a connector (392). The first support layer (361) may be positioned adjacent to the driving unit (391, 392), and the second support layer (362) may be positioned further from the driving unit (391, 392) than the first support layer (361).

[0117] According to one embodiment with reference to FIGS. 6A and 6B, the first support layer (361) may be disposed under the digitizer (340) (e.g., the first digitizer (341)), and may include a first support plate (3613) including a polymer material, and a first conductive layer (3611) disposed between the digitizer (340) and the first support plate (3613), the first conductive layer (3611) being plated on the surface of the first support plate (3613). The first support layer (361) may include a first bonding layer (3612) disposed on the first conductive layer (3611).

[0118] According to one embodiment with reference to FIGS. 6A and 6B, the second support layer (362) may be disposed under the digitizer (340) (e.g., the second digitizer (342)), and may include a second support plate (3623) including a polymer material, and a second conductive layer (3621) disposed between the digitizer (340) and the second support plate (3623), the second conductive layer being plated on the surface of the second support plate (3623). The second support layer (362) may include a second bonding layer (3622) disposed on the second conductive layer (3621).

[0119] The first conductive layer (3611) and / or the second conductive layer (3621) may be referred to as conductive layers, and the configuration of the first conductive layer (3611) and the configuration of the second conductive layer (3621) may be the same or similar to each other. The first bonding layer (3612) and / or the second bonding layer (3622) may be referred to as bonding layers, and the configuration of the first bonding layer (3612) and the configuration of the second bonding layer (3622) may be the same or similar to each other. According to one embodiment, the first support plate (3613) and / or the second support plate (3623) may be referred to as support plates, and the configuration of the first support plate (3613) and the configuration of the second support plate (3623) may be the same or similar to each other. Hereinafter, the configuration of the first conductive layer (3611), the first bonding layer (3612), and the first support plate (3613) will be described, and the configuration of the second conductive layer (3621), the second bonding layer (3622), and the second support plate (3623) can be applied thereto.

[0120] In one embodiment, the first conductive layer (3611) may be composed of a conductive material. The first conductive layer (3611) may include copper (Cu). The first conductive layer (3611) may be disposed between the first bonding layer (3612) and the first support plate (3613).

[0121] According to one embodiment, the first conductive layer (3611) may be a layer formed by plating metal on the surface of a non-conductive first support plate (3613) using an electroless plating method. The first conductive layer (3611) may be a Cu-plated layer, and when the first support plate (3613) has a thickness of approximately 50 μm, for example, the first conductive layer (3611) may be formed on an upper surface (e.g., one side in the +Z-axis direction) of the first support plate (3613) to a thickness of approximately 1 μm to 6 μm. For example, the first conductive layer (3611) may be formed on an upper surface (e.g., one side in the +Z-axis direction) of the first support plate (3613) to a thickness of approximately 6 μm.

[0122] According to one embodiment, the first bonding layer (3612) may be disposed between the first shielding layer (351) and the first conductive layer (3611). The first bonding layer (3612) may have Ni-P plating and / or a synthetic resin film (PET film) attached to the surface of the copper (Cu) to prevent corrosion of the first conductive layer (3611) including copper (Cu).

[0123] According to an example referring to FIG. 6a, the first bonding layer (3612) may include a layer (3612aa) in which a polyethylene terephthalate (PET) film is laminated with a pressure sensitive adhesive (PSA), and may be disposed on a copper (Cu) surface (e.g., the surface of the first conductive layer (3611)) for rust prevention. According to one embodiment, the first bonding layer (3612) may be disposed on the layer (3612aa) in which the pressure sensitive adhesive and the PET film are laminated, and may include a coating layer (3612ab) in which a pressure sensitive adhesive is applied for additional rust prevention to prevent rust of the copper (Cu) and / or the shielding layer (350) (e.g., magnetic metal powder (MMP)). For example, when the first bonding layer (3612) is formed of a pressure-sensitive adhesive and a PET film, the layer (3612aa) in which the pressure-sensitive adhesive and the PET film of the first bonding layer (3612) are laminated may be formed to a thickness of approximately 6 μm (3 μm + 3 μm) on the first support plate (3613) having a thickness of approximately 50 μm and the first conductive layer (3611) plated to a thickness of approximately 6 μm, and the coating layer (3612ab) may be formed to a thickness of approximately 50 μm. According to an example referring to FIG. 6b, the first bonding layer (3612) may include a Ni-P plating layer (3612ac) formed on a copper (Cu) surface (e.g., the surface of the first conductive layer (3611)) for rust prevention. In one embodiment, the first bonding layer (3612) may be disposed over a Ni-P plating layer (3612ac) and may include a coating layer (3612ab) that applies a pressure-sensitive adhesive for additional rust prevention to prevent copper (Cu) and / or a shielding layer (350) (e.g., magnetic metal powder (MMP)) from rusting.For example, when the first bonding layer (3612) is formed of a pressure-sensitive adhesive and a Ni-P plating layer, the Ni-P plating layer (3612ac) of the first bonding layer (3612) can be formed to a thickness of approximately 1 μm and the coating layer (3612ab) to a thickness of approximately 50 μm on the first support plate (3613) having a thickness of approximately 50 μm and the first conductive layer (3611) plated to a thickness of approximately 6 μm.

[0124] In one embodiment, the first support plate (3613) may be formed of a non-conductive material. In one embodiment, the first support plate (3613) may be formed of a composite polymer material. For example, the first support plate (3613) includes a polymer composite material reinforced with a filler material, and may be at least one of carbon fiber reinforced plastics (CFRP) or glass fiber reinforced plastics (GFRP). The first support plate (3613) may be disposed between the first conductive layer (3611) and the first support body (371). The first support plate (3613) may be disposed between the first conductive layer (3611) and the circuit board (391).

[0125] According to one embodiment, the first support plate (3613) may provide weight reduction of the display device (230) by being composed of a composite polymer material rather than stainless steel (SUS), which is generally used to support each layer of the display device. For example, the density of CFRP (carbon fiber reinforced plastics), which is one of the materials of the first support plate (3613), is 1.6 g / cm³, which may provide weight reduction of the component by approximately 20 to 25% compared to the density of SUS (7.9 g / cm³). When the thickness of the material is approximately 50 ㎛, the weight of the CFRP of the present disclosure may be approximately 0.8 g, compared to the weight of SUS, which is approximately 4 g. For example, the density of GFRP (glass fiber reinforced plastics), which is one of the materials of the first support plate (3613), is 2.3 g / cm³, which can provide a weight reduction of the component by approximately 25 to 30% compared to the density of SUS (7.9 g / cm³). When the thickness of the material is approximately 50 ㎛, the weight of the CFRP of the present disclosure can be approximately 1.0 g, compared to the weight of SUS, which is approximately 4 g.

[0126] According to one embodiment, the first support plate (3613) is made of a composite polymer material rather than stainless steel (SUS), which is generally used to support each layer of the display device, thereby providing improved tensile strength along with a reduction in the weight of the display device (230). For example, it can be confirmed that the tensile strength of CFRP (carbon fiber reinforced plastics), which is one of the materials of the first support plate (3613), is 2860 MPa (T700), which is a large value compared to the tensile strength of SUS (500 MPa). For example, it can be confirmed that the tensile strength of GFRP (glass fiber reinforced plastics), which is one of the materials of the first support plate (3613), is 250 to 950 MPa, which is a similar or large value compared to the tensile strength of SUS (500 MPa).

[0127] According to one embodiment, the first support plate (3613) is made of a composite polymer material rather than stainless steel (SUS), which is generally used to support each layer of the display device, thereby providing improved elasticity to the display device (230), which may be advantageous for flexibility (or bending). For example, it can be confirmed that the elastic modulus of CFRP (carbon fiber reinforced plastics), which is one of the materials of the first support plate (3613), is 134 GPa (T700), which is a small value compared to the elastic modulus of SUS (180 GPa). For example, it can be confirmed that the elastic modulus of GFRP (glass fiber reinforced plastics), which is one of the materials of the first support plate (3613), is 10 to 40 GPa, which is a small value compared to the elastic modulus of SUS (180 GPa). According to one embodiment, the first support layer (361) can reduce the overall thickness and enhance the flexural rigidity of the display device (230) by plating a conductive material (e.g., copper (Cu)) on the surface of the first support plate (3613) (e.g., the first conductive layer (3611)). In a general display device, a Cu film is attached on stainless steel (SUS; stainless steel) and used. In this case, a thick adhesive (e.g., an adhesive film having a thickness of at least 50 μm (e.g., a pressure-sensitive adhesive)) is required for the attachment, and an additional PET film is required to prevent oxidation of the Cu film. In contrast, the display device (230) of the present disclosure directly plates copper (Cu) on the surface of the first support plate (3613), so that when Cu is plated, a thickness of approximately 6 ㎛ or less and a weight of approximately 0.8 g are applied, which can provide a significant thickness reduction and weight reduction effect compared to a Cu film (thickness of approximately 12 ㎛ and weight of approximately 1.4 g).For example, even when comparing the overall thickness of the laminated structure under the digitizer (340), the thickness and weight of the structure of the present disclosure (thickness of approximately 106 μm, weight of approximately 1.6 g (e.g., approximately 1.3 g to 2.0 g)) can be reduced compared to the thickness and weight of a general structure (thickness of approximately 125 μm, weight of approximately 5.4 g), which can provide a lighter and thinner electronic device.

[0128] FIG. 7A is an enlarged view of a portion (P) of the structure of the display device (230) disclosed in FIG. 5 according to one embodiment of the present disclosure.

[0129] FIG. 7b is an enlarged view of a portion (P) of the structure of the display device (230) disclosed in FIG. 5 according to one embodiment of the present disclosure.

[0130] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 1 to 4) may include a flexible display device (230).

[0131] The configuration of the flexible display device (230) of FIGS. 7A and 7B may be partially or entirely identical to the configuration of the display module (160) of FIG. 1 and / or the configuration of the display device (230) of FIGS. 2 to 6B. The embodiment of FIGS. 7A and 7B may be optionally combined with the embodiments of FIGS. 5, 6A, 6B, and 8 to 10.

[0132] According to one embodiment, the display device (230) includes a structure in which a digitizer (340), a shielding layer (350), and a support layer (360) are sequentially laminated, and the support layer (360) may include a first support layer (361) and a second support layer (362). Each of the first support layer (361) and the second support layer (362) may include a support plate (3613, 3623), a conductive layer (3611, 3612), and a bonding layer (3612, 3622). Hereinafter, a specific configuration of the support layer that is different from that of FIGS. 6A and 6B will be described.

[0133] According to one embodiment, the support layer (360) of the display device (230) may be disposed below the digitizer (340) and the shielding layer (350). The support layer (360) may provide rigidity to the electronic device (101) having a foldable or unfoldable structure. For example, the support layer (360) may support the load of structures (e.g., the digitizer (340) and the shielding layer (350)) disposed on the upper side of the support layer (360). For example, the support layer (360) may be formed of at least a portion of a metal material having high rigidity, thereby reducing or limiting a bending phenomenon (e.g., a distortion phenomenon) that occurs in an area of ​​the structures adjacent to the folding axis (FX) when the electronic device (101) is folded or unfolded.

[0134] In one embodiment, the support layer (360) may include a first support layer (361). The support layer (360) may include a second support layer (362). The first support layer (361) and the second support layer (362) may be spaced apart from each other. For example, the first support layer (361) and the second support layer (362) may be spaced apart from each other with the folding axis (FX) therebetween.

[0135] According to one embodiment, the first support layer (361) may be disposed between the first digitizer (341) and the first support body (371). The second support layer (362) may be disposed between the second digitizer (342) and the second support body (372).

[0136] According to one embodiment, the first support layer (361) may be disposed below the first digitizer (341) and may include a first support plate (3613) including a polymer material, a first-first conductive layer (3611a) plated on an upper surface of the first digitizer (341), and a first-second conductive layer (3611b) plated on a lower surface of the first digitizer (341). The first support layer (361) may include a first-first bonding layer (3612a) disposed on the first-first conductive layer (3611a). The first support layer (361) may include a first-second bonding layer (3612b) disposed on (e.g., on a lower surface) of the first-second conductive layer (3611b).

[0137] According to one embodiment, the second support layer (362) may be disposed below the second digitizer (342) and may include a second support plate (3623) including a polymer material, a second-first conductive layer (3621a) plated on an upper surface of the second digitizer (342), and a second-second conductive layer (3621b) plated on a lower surface of the second digitizer (342). The second support layer (362) may include a second-first bonding layer (3622a) disposed on the second-first conductive layer (3621a). The second support layer (361) may include a second-second bonding layer (3622b) disposed on (e.g., on a lower surface) of the second-second conductive layer (3621b). Hereinafter, a specific laminated structure for the first support layer (361) will be described, and the configuration of the second support layer (362) can be applied to the configuration of the first support layer (361).

[0138] According to one embodiment, the first conductive layer (3611) may be composed of a conductive material. The first conductive layer (3611) may include a first-first conductive layer (3611a) and a first-second conductive layer (3611b) arranged on the upper and lower surfaces of the first support plate (3613). The first conductive layer (3611) may include copper (Cu). For rust prevention of the copper (Cu), the first conductive layer (3611) may be provided with Ni-P plating and / or a synthetic resin film (PET film) attached to the copper (Cu) surface.

[0139] According to one embodiment, the first-first conductive layer (3611a) may be disposed between the first-first bonding layer (3612a) and the first support plate (3613). The first-second conductive layer (3611b) may be disposed between the first-second bonding layer (3612b) and the first support plate (3613). The first conductive layer (3611) may be a layer formed by plating metal on the upper and lower surfaces of the non-conductive first support plate (3613) using an electroless plating method. The first-first conductive layer (3611a) and the first-second conductive layer (3611b) may be Cu-plated layers, and when the first support plate (3613) has a thickness of approximately 50 µm, for example, the first-first conductive layer (3611a) and the first-second conductive layer (3611b) may have a thickness of approximately 1 µm to 6 µm on each of the upper and lower surfaces of the first support plate (3613), and may form a total thickness of 2 µm to 12 µm. For example, the first-first conductive layer (3611a) and the first-second conductive layer (3611b) may have a thickness of approximately 1 µm to 3 µm on each of the upper and lower surfaces of the first support plate (3613), and may form a total thickness of 2 µm to 6 µm.

[0140] According to one embodiment, the first-first bonding layer (3612a) may be disposed between the first shielding layer (351) and the first-first conductive layer (3611a). The first bonding layer (3612a) may have Ni-P plating and / or a synthetic resin film (PET film) attached on the surface of the first-first conductive layer (3611a) including copper (Cu) to prevent corrosion.

[0141] According to an example referring to FIG. 7a, the first bonding layer (3612a) may include a layer (3612aa) in which a polyethylene terephthalate (PET) film is laminated with a pressure-sensitive adhesive (PSA), and may be disposed on a copper (Cu) surface (e.g., the surface of the first-first conductive layer (3611a)) for rust prevention. According to one embodiment, the first bonding layer (3612a) may be disposed on the layer (3612aa) in which the pressure-sensitive adhesive and the PET film are laminated, and may include a coating layer (3612ab) in which a pressure-sensitive adhesive is applied for additional rust prevention to prevent rust of the copper (Cu) and / or the shielding layer (350) (e.g., magnetic metal powder (MMP)). According to one embodiment, the first-second bonding layer (3612b) may be disposed between the first support body (371) and the first-second conductive layer (3611b). For example, the first-second bonding layer (3612b) may have a structure in which a PET film (polyethylene terephthalate film) is laminated together with a pressure-sensitive adhesive.

[0142] According to one embodiment, the first-first bonding layer (3612a) may have a greater thickness than the first-second bonding layer (3612b) because it is positioned adjacent to the digitizer (340). For example, when the first-first bonding layer (3612a) is formed of a pressure-sensitive adhesive (PSA) and a PET film, a layer (3612aa) in which the pressure-sensitive adhesive of the first-first bonding layer (3612a) and the PET film are laminated on the first support plate (3613) having a thickness of approximately 50 μm and the first-first conductive layer (3611a) plated to a thickness of approximately 3 μm may be formed to a thickness of approximately 6 μm (3 μm + 3 μm), and the coating layer (3612ab) may be formed to a thickness of approximately 50 μm. For example, when the first-second bonding layer (3612b) is formed with a laminated structure of a pressure-sensitive adhesive (PSA) and a PET film (polyethylene terephthalate terephthalate film), the first-second bonding layer (3612b) can be formed on (e.g., the lower surface) of the first support plate (3613) having a thickness of approximately 50 μm and the first-second conductive layer (3611b) plated to a thickness of approximately 3 μm, with a total thickness of 6 μm, which is the sum of the pressure-sensitive adhesive (PSA) having a thickness of approximately 3 μm and the PET film (polyethylene terephthalate film) having a thickness of approximately 3 μm.

[0143] According to an example with reference to FIG. 7b, the first-first bonding layer (3612a) may include a Ni-P plating layer (3612ac) formed on a copper (Cu) surface (e.g., the surface of the first-first conductive layer (3611a)) for rust prevention. In one embodiment, the first-first bonding layer (3612a) may be disposed on the Ni-P plating layer (3612ac) and may include a coating layer (3612ab) that applies a pressure-sensitive adhesive for additional rust prevention to prevent the copper (Cu) and / or shielding layer (350) (e.g., magnetic metal powder (MMP)) from rusting. In one embodiment, the first-second bonding layer (3612b) may be disposed between the first support body (371) and the first-second conductive layer (3611b). For example, the first-second bonding layer (3612b) may include a Ni-P plating layer (3612ac) formed on a copper (Cu) surface (e.g., the lower surface of the first-second conductive layer (3611b)) for rust prevention. For example, when the first-first bonding layer (3612a) is formed of a pressure-sensitive adhesive and a Ni-P plating layer, the Ni-P plating layer (3612ac) of the first-first bonding layer (3612a) may be formed to a thickness of approximately 1 μm and the coating layer (3612ab) to a thickness of approximately 50 μm on the upper surface of the first support plate (3613) having a thickness of approximately 50 μm and the first-first conductive layer (3611a) plated to a thickness of approximately 3 μm. For example, when the first-second bonding layer (3612b) is formed of a Ni-P plating layer, the Ni-P plating layer (3612ac) of the first-second bonding layer (3612b) can be formed with a thickness of approximately 1 μm on the lower surface of the first support plate (3613) having a thickness of approximately 50 μm and the first-second conductive layer (3611b) plated with a thickness of approximately 3 μm.

[0144] In one embodiment, the first support plate (3613) may be formed of a non-conductive material. In one embodiment, the first support plate (3613) may be formed of a composite polymer material. For example, the first support plate (3613) may be a polymer composite material reinforced with a filler material, and may be at least one of carbon fiber reinforced plastics (CFRP) or glass fiber reinforced plastics (GFRP). The first support plate (3613) may be disposed between the first conductive layer (3611) and the first support body (371). The first support plate (3613) may be disposed between the first conductive layer (3611) and the circuit board (391).

[0145] According to one embodiment, the first support plate (3613) is composed of a composite polymer material, and thus can provide a weight reduction of the display device (230) compared to commonly used stainless steel (SUS). For example, the density of CFRP (carbon fiber reinforced plastics), which is one of the materials of the first support plate (3613), is 1.6 g / cm³, which can provide a weight reduction of the component by about 20 to 25% compared to the density of SUS (7.9 g / cm³). When the thickness of the material is about 50 ㎛, the weight of the CFRP of the present disclosure can be about 0.8 g, compared to the weight of SUS, which is about 4 g. For example, the density of GFRP (glass fiber reinforced plastics), which is one of the materials of the first support plate (3613), is 2.3 g / cm³, which can provide a weight reduction of the component by about 25 to 30% compared to the density of SUS (7.9 g / cm³). When the thickness of the material is approximately 50 ㎛, the weight of the CFRP of the present disclosure can be approximately 1.0 g, compared to the weight of SUS, which is approximately 4 g.

[0146] According to one embodiment, the first support layer (361) can reduce the overall thickness and enhance the bending rigidity of the display device (230) by plating a conductive material (e.g., copper (Cu)) on the upper and lower surfaces of the first support plate (3613) (e.g., the first-first conductive layer (3611a) and the first-second conductive layer (3611b)). In a typical display device, a Cu film is attached to stainless steel (SUS; stainless steel) and used. In this case, a thick adhesive (e.g., an adhesive film of at least 50 μm (e.g., a pressure-sensitive adhesive)) is required for the attachment, and an additional PET film is required to prevent oxidation of the Cu film. In contrast, the display device (230) of the present disclosure directly plates copper (Cu) on the upper and lower surfaces of the first support plate (3613), so that when Cu is plated, only a total thickness of approximately 6 ㎛ and a weight of approximately 0.8 g are applied, which can provide a significant thickness reduction and weight reduction effect compared to a Cu film (thickness of approximately 12 ㎛ and weight of approximately 1.4 g). For example, even when comparing the overall thickness of the laminated structure under the digitizer (340), the thickness and weight of the structure of the present disclosure (thickness of approximately 106 ㎛ and weight of approximately 1.6 g (e.g., approximately 1.3 g to 2.0 g)) can be reduced compared to the thickness and weight of a general structure (thickness of 125 ㎛ and weight of 5.4 g), which can provide a lightweight and thin electronic device.

[0147] FIG. 8 is a drawing showing the result of 2D scanning of a support layer structure disposed under a digitizer among a general display device and a display device (230) according to an embodiment of the present disclosure.

[0148] According to one embodiment, an electronic device (e.g., electronic device (101) of FIGS. 1 to 4) may include a flexible display device (e.g., 230 of FIGS. 5 to 7B).

[0149] The configuration of the flexible display device of FIG. 8 may be partially or entirely identical to the configuration of the display module (160) of FIG. 1 and / or the display device (230) of FIGS. 2 to 6B. The embodiment of FIG. 8 may be optionally combined with the embodiments of FIGS. 5 to 7B and FIGS. 9 to 10.

[0150] According to one embodiment, the display device (230) may include a first layer (e.g., 310 of FIG. 5), a second layer (e.g., 320 of FIG. 5), a reinforcing layer (e.g., 330 of FIG. 5), a digitizer (e.g., 340 of FIG. 5), a shielding layer (e.g., 350 of FIG. 5), and a support layer (e.g., 360 of FIG. 5). The support layer (360) may provide a laminated structure together with the digitizer (340) and the shielding layer (350). The support layer (360) may include a support plate and a conductive layer plated on a surface of the support plate.

[0151] Referring to Fig. 8, (a) is a drawing showing the result of a 2D scan of a support layer of a general display device, wherein the support layer is composed of only stainless steel (SUS; stainless steel) or a structure in which a Cu sheet (or Cu film) is arranged on stainless steel (SUS; stainless steel). The left drawing of Fig. 8 (a) is a 2D scan of a structure in which a Cu sheet is not arranged, and the right drawing of Fig. 8 (a) is a 2D scan of a structure in which a Cu sheet is arranged on stainless steel.

[0152] Referring to FIG. 8, (b) is a drawing showing the result of 2D scanning the support layer (360) of the display device (230) of the present disclosure, wherein the support layer (360) has a structure in which a conductive layer is plated on the surface of the support plate. The support plate may be at least one of CFRP (carbon fiber reinforced plastics) or GFRP (glass fiber reinforced plastics). The conductive layer may be a layer created by plating Cu to approximately 6 μm on the upper surface of the CFRP or GFRP, or a layer created by plating Cu to 3 μm on each of the upper and lower surfaces of the CFRP or GFRP. The left drawing of FIG. 8 (b) is a 2D scan of a structure in which only Cu plating is performed on the plating layer, and the right drawing of FIG. 8 (b) is a 2D scan of a structure in which Ni / P plating is additionally performed in addition to Cu plating.

[0153] Comparing (a) and (b) of FIG. 8, it can be seen that when Cu is plated on the surface of a substrate (e.g., CFRP or GFRP) rather than simply placing a Cu sheet on a substrate (e.g., SUS), the flexural rigidity of the display device (230) can be strengthened, and accordingly, it can be confirmed that the support layer (360) of the present disclosure can be easily used as a rigidity reinforcing plate of a flexible display panel. If the rigidity of the support layer is insufficient, a part of the housing (e.g., a die casting injection part) on the rear side of the flexible display device can be recognized in the 2D scan result. The part of the housing (e.g., a die casting injection part) is a part indicated by a circle, and whether it is recognized or not can be confirmed based on whether the parts indicated by the circles have the same / similar values ​​(e.g., similar colors). For example, if the parts indicated by the circles have different values, it can be understood that it is recognized, and if the parts indicated by the circles have the same / similar values, it can be understood that it is difficult to recognize.

[0154] The left drawing of Fig. 8 (a) shows a structure in which the support layer is made solely of stainless steel (SUS). As can be seen, the circled portions have different numerical values, indicating a difference in color. This indicates that a portion of the housing (e.g., a die-cast injection portion) is visible, suggesting that the support layer lacks sufficient rigidity to be considered unsuitable as a component.

[0155] The right drawing of Fig. 8 (a) shows a structure in which a Cu sheet with a thickness of 12 μm is arranged on a support layer of stainless steel (SUS). As the parts indicated by circles have identical / similar values, it can be confirmed that the colors are also identical / similar. In general, it can be confirmed that a Cu sheet with a minimum thickness of 12 μm is required in order for a part of the housing (e.g., a die casting injection part) to not be visible.

[0156] The left drawing of Fig. 8 (b) shows a structure in which a support layer (360) is plated with Cu with a thickness of 6 μm on (or above and below) a support plate (CFRP or GFRP). Since the parts indicated by circles have the same / similar values, it can be confirmed that the colors are also the same / similar. It can be confirmed that a Cu plating process with a minimum thickness of 6 μm is required so that a part of the housing (e.g., a die casting injection part) is not visible. Compared to a general structure (e.g., the right drawing of Fig. 8 (a)), it can be confirmed that the structure of the support layer of the present disclosure provides sufficient flexural rigidity by using a small thickness of Cu, and thus provides an overall weight reduction and thinning of the electronic device.

[0157] The right picture of Fig. 8 (b) shows a structure in which the support layer is subjected to 6 μm thick Cu plating and Ni / P plating on (or above and below) the support plate (CFRP or GFRP). Since the parts indicated by circles have identical / similar values, it can be confirmed that the colors are also identical / similar. Compared to the right picture of Fig. 8 (a) and the left picture of Fig. 8 (b), it can be confirmed that the parts indicated by circles have more identical values. This confirms that, compared to a general structure (e.g., the right picture of Fig. 8 (a)), the structure of the support layer of the present disclosure provides sufficient flexural rigidity by using a small thickness of Cu, and thus provides overall weight reduction and thinning of the electronic device.

[0158] FIG. 9 is a flowchart showing a surface plating treatment process on a support plate of a support layer according to an embodiment of the present disclosure.

[0159] FIG. 10 is a drawing showing a cross-section of a support layer after the surface plating process of the flow chart of FIG. 9 according to an embodiment of the present disclosure.

[0160] According to one embodiment, an electronic device (e.g., electronic device (101) of FIGS. 1 to 4) may include a flexible display device (230). The display device (230) may include a first layer (e.g., 310 of FIG. 5), a second layer (e.g., 320 of FIG. 5), a reinforcing layer (e.g., 330 of FIG. 5), a digitizer (e.g., 340 of FIG. 5), a shielding layer (e.g., 350 of FIG. 5), and a support layer (e.g., 360 of FIG. 5). The support layer (360) may provide a laminated structure together with the digitizer (340) and the shielding layer (350). The support layer (360) may include a support plate and a conductive layer plated on a surface of the support plate.

[0161] The configuration of the support layer of the flexible display device (230) of FIGS. 9 and 10 may be partially or entirely identical to the configuration of the support layer of FIGS. 5 to 8. The embodiment of FIG. 10 may be optionally combined with the embodiments of FIGS. 5 to 8, FIG. 11a, and FIG. 11b.

[0162] According to one embodiment, the support layer (360) may be a structure in which a conductive layer is plated on (or above and below) the support plate. According to one embodiment, the support plate may be at least one of carbon fiber reinforced plastics (CFRP) or glass fiber reinforced plastics (GFRP). According to one embodiment, the conductive layer may be a layer created by plating Cu to a thickness of approximately 6 μm on the upper surface of the CFRP or GFRP, or a layer created by plating Cu to a thickness of 3 μm on each of the upper and lower surfaces of the CFRP or GFRP. According to one embodiment, the conductive layer may be a layer created by additionally plating Ni / P after plating Cu on the surface of the CFRP or GFRP.

[0163] Referring to Fig. 9, first, a surface pretreatment process (process 10) may be performed to improve the adhesion of a conductive layer (e.g., a plating layer) on the surface of a support plate (e.g., a plated object). The pretreatment process may be referred to as a cleaner process. For example, the pretreatment process may be performed to remove foreign substances attached when forming a plated object composed of one of polymer composite materials (CFRP, GFRP), thereby densely adjusting the surface of the plated object during electroless plating and improving the adhesion of the plating layer.

[0164] The above support plate (e.g., the plated object) can be immersed in a cleaner treatment solution at a temperature of approximately 20°C to 50°C for approximately 30 seconds to 5 minutes and then washed to remove unnecessary dust adhering to the plated object. The cleaner treatment solution can be composed of 5 to 10 parts by weight of sodium bisulfite, 85 to 90 parts by weight of pure water, 1 to 5 parts by weight of sulfuric acid (H2SO4), and other non-hazardous substances.

[0165] Thereafter, a process (process 20) of etching the surface by immersing the pretreated support plate (e.g., the plated object) in an acidic solution may be performed. The etching process may etch the surface (e.g., the upper surface, or the upper / lower surface) of the plated object by immersing the plated object in a mixed solution containing a strong acid such as phosphoric acid. The etching process may be performed at room temperature or a high temperature (approximately 75° C.) for approximately 5 to 10 minutes (min). For example, the etching process may be performed at room temperature for approximately 5 to 9 minutes (min). The etching process may be a process for facilitating the adsorption process (process 40) performed thereafter.

[0166] Thereafter, a process (process 30) for neutralizing the support plate (e.g., the plated material) may be performed. The neutralization process may be a process of neutralizing the support plate (e.g., the plated material) that has undergone the etching process in a hydrochloric acid solution at room temperature for several minutes and then rinsing it with water.

[0167] Afterwards, an adsorption process (process 40) for adsorbing Pd / Sn onto the surface of the neutralized support plate (e.g., plated material) can be performed. The Pd / Sn adsorption can be a catalytic process for increasing the surface adhesion of the electroless Cu plating layer. For example, the Pd / Sn colloid can be adsorbed onto the surface of the plated material (CFRP, GFRP) to serve as a catalyst for the subsequent plating process. When the amount of Pd / Sn colloid adsorbed onto the surface of a non-conductive material such as plastic increases, a uniform and good conductive film can be formed on the non-conductive material (e.g., plated material) in the subsequent plating process.

[0168] Thereafter, an electroless Cu plating process (process 50) can be performed. Cu plating can be performed through an oxidation-reduction reaction on the Pd adsorbed on the surface of a support plate (e.g., a plated object). Referring to Fig. 10, through the electroless Cu plating process, Cu can penetrate into the plated object, maintain a strong bond with the plated object, and form a film.

[0169] Afterwards, by performing a drying process (process 60), the support layer can be completed.

[0170] According to one embodiment, after the electroless Cu plating process (process 50), a Ni / P plating process may be additionally performed before the drying process (process 60). The Ni / P plating process may be performed as an electroless process similar to the electroless Cu plating process. The Ni / P plating process may be a process for rust prevention of the plated Cu layer. After the Ni / P plating process is performed, the support layer (360) may provide improved flexural rigidity of the support layer, as confirmed in the right picture of (b) of FIG. 8 and FIG. 10. The Pt in FIG. 10 may be understood as a sputtered layer to confirm the surface quality using SEM.

[0171] Figure 11a is a diagram showing the results of a peel test at room temperature, taking into account rework of a display device.

[0172] Figure 11b is a diagram showing the results of a peel test at high temperatures (e.g., approximately 75° C.) considering rework of the display device.

[0173] According to one embodiment, an electronic device (e.g., electronic device (101) of FIGS. 1 to 4) may include a flexible display device (e.g., 230 of FIGS. 5 to 7B). The display device (230) may include a first layer (e.g., 310 of FIG. 5), a second layer (e.g., 320 of FIG. 5), a reinforcing layer (e.g., 330 of FIG. 5), a digitizer (e.g., 340 of FIG. 5), a shielding layer (e.g., 350 of FIG. 5), and a support layer (e.g., 360 of FIG. 5). The support layer (360) may provide a laminated structure together with the digitizer (340) and the shielding layer (350). The support layer (360) may include a support plate and a conductive layer plated on the surface of the support plate.

[0174] The configuration of the support layer of the flexible display device (230) of FIGS. 11A and 11B (e.g., etching 9 minutes (min) drawing) may be partially or entirely identical to the configuration of the support layer of FIGS. 5 to 10. The embodiment of FIGS. 11A and 11B may be optionally combined with the embodiment of FIGS. 5 to 9.

[0175] An electronic device (101) may undergo rework to check the performance of a component (e.g., a display device (230)) or for repair, and the results of the rework may be confirmed in advance through a peel test before the finished product is manufactured. The peel test may be called a surface adhesive tape peeling test or a repairability test.

[0176]

[0177] [Table 1] shows the results of peel tests performed at room temperature and high temperature (e.g., approximately 75°C) for each of experimental examples (#1) in which etching was performed for 9 minutes (min) and experimental examples (#2) in which etching was performed for 10 minutes (min). Referring to FIG. 5, the peel test was performed as a test to separate the shielding layer (350) and the support layer (360) in the display device (230).

[0178] Referring to [Table 1] and the left picture of Fig. 11a, considering the experimental example (#1) in which the etching process was performed for 9 minutes (min), the peel test performed at room temperature showed that the conductive layer (e.g., 3611 in Figs. 6a to 7b) plated on the surface of the support plate (e.g., 3613 in Figs. 6a to 7b) was not peeled off, confirming that the plating process was performed well (e.g., passed the peel test).

[0179] Referring to [Table 1] and the left picture of Fig. 11b, when considering the experimental example (#1) in which the etching process was performed for 9 minutes (min), the peel test performed at a high temperature (e.g., approximately 75°C) showed that the conductive layer (e.g., 3611 in Figs. 6a to 7b) plated on the surface of the support plate (e.g., 3613 in Figs. 6a to 7b) was not peeled off, confirming that the plating process was performed well (e.g., passed the peel test).

[0180] Referring to [Table 1] and the right-hand picture of Fig. 11a, when considering the experimental example (#2) in which the etching treatment was performed for 10 minutes (min), it can be confirmed that the plating treatment did not proceed well (e.g., did not pass the peel test) as the conductive layer plated on the surface of the support plate was peeled off as a result of the peel test performed at room temperature.

[0181] Referring to [Table 1] and the right picture of Fig. 11b, when considering the experimental example (#2) in which the etching treatment was performed for 10 minutes (min), the peel test performed at a high temperature (e.g., approximately 75°C) showed that the conductive layer plated on the surface of the support plate was not peeled off, confirming that the plating treatment was performed well (e.g., passed the peel test).

[0182] Generally, when reworking, room temperature processing is preferable to high temperature processing, as it reduces damage to other components of the electronic device and facilitates processing. Considering the peel test results, the sample in Experimental Example (#1), which underwent etching for 9 minutes, demonstrated excellent adhesion and passed the peel test without any peeling of the plating layer (e.g., conductive layer).

[0183] A display device of an electronic device according to one embodiment of the present disclosure can provide weight reduction and thinning of the display device by improving the material and structure of a support layer disposed under a digitizer.

[0184] The support layer of the display device according to one embodiment of the present disclosure can provide weight reduction of the display device by configuring the support plate that supports the digitizer with a structure made of a polymer composite material having a low density compared to metal (e.g., SUS).

[0185] According to one embodiment of the present disclosure, a support layer of a display device can be formed by plating a conductive layer on the surface of a support plate for flattening the electric and magnetic fields of a digitizer. Accordingly, the conductive layer can be provided with a thickness thinner than that of a commonly used metal film (e.g., Cu film), and the thickness of an adhesive used to attach the metal film can be reduced. In addition, the display device can be provided with a reduced weight due to the reduced thickness.

[0186] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0187] An electronic device (e.g., 101 of FIG. 1) according to one embodiment of the present disclosure may include a first housing (210), a second housing (220), and a display device (230) disposed on the first housing and the second housing. The display device (230) may include a flexible display panel (322), a digitizer (340) disposed under the flexible display panel, a support plate (3613; 3623) disposed under the digitizer and including a polymer material, and a conductive layer (3611; 3621) disposed between the digitizer and the support plate and plated on a surface of the support plate.

[0188] According to one embodiment, the support plate (3613; 3623) may include a first support plate (3613) spaced apart from the digitizer and positioned over the first housing, and a second support plate (3623) spaced apart from the digitizer and positioned over the second housing.

[0189] According to one embodiment, when the electronic device is unfolded, the first support plate (3613) and the second support plate (3623) can be arranged parallel to each other with respect to the folding axis (FX).

[0190] According to one embodiment, the conductive layer (3611; 3621) may include a first conductive layer (3611) spaced apart from the digitizer and positioned on at least one of the upper surface or the lower surface of the first support plate, and a second conductive layer (3621) spaced apart from the digitizer and positioned on at least one of the upper surface or the lower surface of the second support plate.

[0191] According to one embodiment, when the electronic device is unfolded, the first conductive layer (3611) and the second conductive layer (3621) can be arranged parallel to each other with respect to the folding axis (FX).

[0192] According to one embodiment, the first conductive layer is formed on the upper surface of the first support plate, and the thickness of the first conductive layer may be 1 µm to 6 µm, and the second conductive layer is formed on the upper surface of the second support plate, and the thickness of the second conductive layer may be 1 µm to 6 µm.

[0193] According to one embodiment, the first conductive layer is formed on the upper surface and the lower surface of the first support plate, respectively, and the thickness of each of the first conductive layers formed on the upper surface and the lower surface may be 1 ㎛ to 3 ㎛. The second conductive layer is formed on the upper surface and the lower surface of the second support plate, respectively, and the thickness of each of the second conductive layers formed on the upper surface and the lower surface may be 1 ㎛ to 3 ㎛.

[0194] According to one embodiment, the display device may further include a shielding layer (350) disposed under the digitizer and including magnetic metal powder (MMP), and a bonding layer (3612; 3622) disposed between the shielding layer and the conductive layer.

[0195] According to one embodiment, the bonding layer (3612; 3622) may include at least one of a pressure sensitive adhesive or a polyethylene terephthalate (PET) layer.

[0196] According to one embodiment, the support plate (3613; 3623) may include at least one of carbon fiber reinforced plastics (CFRP) or glass fiber reinforced plastics (GFRP).

[0197] According to one embodiment, the density of the support plate (3613; 3623) may be 1.6 g / cm³ to 2.3 g / cm³.

[0198] According to one embodiment, the conductive layer (3611; 3621) may include a copper (Cu) plating layer.

[0199] According to one embodiment, the conductive layer (3611; 3621) may further include a Ni / P plating layer plated on one surface of the copper (Cu) plating layer.

[0200] According to one embodiment, the display device may further include a reinforcing layer (330) disposed between the flexible display panel and the digitizer and supporting the flexible display panel.

[0201] According to one embodiment, the support plate (3613; 3623) of the reinforcing layer and the support layer may be formed of the same material.

[0202] According to one embodiment, the reinforcing layer may include a lattice pattern corresponding to a folding area of ​​the display device.

[0203] According to one embodiment, the support layer (360) structure formed by a laminated configuration of the support plate (3613; 3623), the conductive layer (3611; 3621), and the bonding layer (3612; 3622) may have a thickness of 106 μm to 112 μm.

[0204] According to one embodiment, the support layer (360) structure formed by a laminated configuration of the support plate (3613; 3623), the conductive layer (3611; 3621), and the bonding layer (3612; 3622) may have a weight of 1.3 g to 2.0 g.

[0205] A display device (230) according to one embodiment of the present disclosure may include a flexible display panel (230), a digitizer (340) disposed under the flexible display panel, a shielding layer (350) disposed under the digitizer and including magnetic metal powder (MMP), a support plate (3613; 3623) disposed under the shielding layer and including a polymer material, and a conductive layer (3611; 3621) disposed between the shielding layer and the support plate and plated on a surface of the support plate.

[0206] According to one embodiment, the conductive layer is formed on the upper surface of the support plate, and the thickness of the conductive layer may be 1 μm to 6 μm.

[0207] According to one embodiment, the conductive layers are formed on the upper and lower surfaces of the support plate, respectively, and the thickness of each of the conductive layers formed on the upper and lower surfaces may be 1 μm to 3 μm.

[0208] According to one embodiment, the support plate (3613; 3623) may include at least one of carbon fiber reinforced plastics (CFRP) or glass fiber reinforced plastics (GFRP).

[0209] According to one embodiment, the density of the support plate (3613; 3623) is 1.6 g / cm³ to 2.3 g / cm³, and the conductive layer (3611; 3621) may include a copper (Cu) plating layer.

[0210] It should be understood that the various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but rather to encompass various modifications, equivalents, or alternatives of the embodiments.

Claims

1. In an electronic device (101), First housing (210); Second housing (220); and Including a display device (230) arranged on the first housing and the second housing, The above display device (230) is Flexible display panel (322); A digitizer (340) positioned below the flexible display panel; A support plate (3613; 3623) positioned below the digitizer and comprising a polymer material; and An electronic device comprising a conductive layer (3611; 3621) disposed between the digitizer and the support plate and plated on the surface of the support plate.

2. In paragraph 1, The above support plate (3613; 3623) includes a first support plate (3613) spaced apart from the digitizer and positioned above the first housing, and a second support plate (3623) spaced apart from the digitizer and positioned above the second housing. An electronic device in which, when the electronic device is unfolded, the first support plate (3613) and the second support plate (3623) are arranged parallel to each other with respect to the folding axis (FX).

3. In paragraph 2, The above conductive layer (3611; 3621) includes a first conductive layer (3611) spaced apart from the digitizer and located on at least one of the upper surface or lower surface of the first support plate, and a second conductive layer (3621) spaced apart from the digitizer and located on at least one of the upper surface or lower surface of the second support plate. An electronic device in which, when the electronic device is unfolded, the first conductive layer (3611) and the second conductive layer (3621) are arranged parallel to each other with respect to the folding axis (FX).

4. In paragraph 3, The first conductive layer is formed on the upper surface of the first support plate, and the thickness of the first conductive layer is 1 ㎛ to 6 ㎛. An electronic device wherein the second conductive layer is formed on the upper surface of the second support plate, and the second conductive layer has a thickness of 1 ㎛ to 6 ㎛.

5. In paragraph 3, The first conductive layer is formed on the upper and lower surfaces of the first support plate, respectively, and each of the first conductive layers formed on the upper and lower surfaces has a thickness of 1 ㎛ to 3 ㎛. An electronic device wherein the second conductive layers are formed on the upper and lower surfaces of the second support plate, respectively, and each of the second conductive layers formed on the upper and lower surfaces has a thickness of 1 ㎛ to 3 ㎛.

6. In any one of paragraphs 1 to 5, The above display device, A shielding layer (350) disposed under the digitizer and including magnetic metal powder (MMP); and An electronic device further comprising a bonding layer (3612; 3622) disposed between the shielding layer and the conductive layer.

7. In paragraph 6, An electronic device, wherein the bonding layer (3612; 3622) comprises at least one of a pressure sensitive adhesive or a PET (polyethylene terephthalate) layer.

8. In any one of paragraphs 1 to 7, An electronic device, wherein the support plate (3613; 3623) comprises at least one of CFRP (carbon fiber reinforced plastics) or GFRP (glass fiber reinforced plastics).

9. In any one of paragraphs 1 to 8, An electronic device, wherein the density of the support plate (3613; 3623) is 1.6 g / cm³ to 2.3 g / cm³.

10. In any one of paragraphs 1 to 9, An electronic device in which the above-mentioned challenge layer (3611; 3621) includes a copper (Cu) plating layer.

11. In Article 10, An electronic device in which the above-mentioned conductive layer (3611; 3621) further includes a Ni / P plating layer plated on one surface of the above-mentioned copper (Cu) plating layer.

12. In any one of paragraphs 1 to 10, The above display device, It further includes a reinforcing layer (330) disposed between the flexible display panel and the digitizer and supporting the flexible display panel, An electronic device in which the support plate (3613; 3623) of the above reinforcing layer and the above support layer are formed of the same material.

13. In paragraph 11, An electronic device, wherein the reinforcing layer includes a lattice pattern corresponding to a folding area of ​​the display device.

14. In any one of paragraphs 6 to 13, An electronic device, wherein the support layer (360) structure formed by laminating the support plate (3613; 3623), the conductive layer (3611; 3621), and the bonding layer (3612; 3622) has a thickness of 106 ㎛ to 112 ㎛.

15. In any one of paragraphs 6 to 13, An electronic device having a support layer (360) structure formed by a laminated configuration of the support plate (3613; 3623), the conductive layer (3611; 3621), and the bonding layer (3612; 3622) and having a weight of 1.3 g to 2.0 g.

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