Display panel and manufacturing method therefor, and display device

Abstract

A display panel and a manufacturing method therefor, and a display device, relating to the technical field of display. The display panel comprises: a display substrate having a display area, a binding area and a bending area; a driving chip, the orthographic projection of the driving chip on the display substrate being located in the binding area; a support layer located on the side facing away from a light exit surface of the display substrate; and a bonding layer located on the side of the support layer facing away from the display substrate, and comprising a first bonding substrate and a first adhesive layer. When the bending area is bent, the binding area is located on the side facing away from the light exit surface of the display substrate, and the orthographic projection of the first bonding substrate at least covers the orthographic projection of the driving chip. When the bending area of the display substrate is bent, the orthographic projection of the first bonding substrate in the display area at least covers the orthographic projection of the driving chip in the display area, thereby providing a large elastic modulus by means of the first bonding substrate, further improving the impact resistance of the area where the driving chip is located, and prolonging the service life of the display panel while improving the structural strength of the display panel.

Description

Display panel, manufacturing method, and display device

[0001] Cross-references

[0002] This disclosure claims priority to Chinese patent application number 202410083720.2 filed on January 19, 2024, entitled “Display panel and manufacturing method, display device”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0004] Foldable phones are slowly gaining popularity, thanks to their expandable display area. Whether for daily office communication or simply experiencing new technologies, they're becoming increasingly popular. While the potential for foldable phones has broadened, their foldable nature also presents an unavoidable problem: replacing the traditional candy-bar phone's glass cover with a protective layer of one or more layers of softer material significantly reduces the phone's structural strength, shortening its lifespan.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the Invention

[0006] The present disclosure aims to provide a display panel, a manufacturing method thereof, and a display device, which can improve the impact resistance of the display panel and extend its service life.

[0007] According to one aspect of the present disclosure, there is provided a display panel, comprising:

[0008] A display substrate having a display area and a non-display area located outside the display area, wherein the non-display area includes a binding area and a bending area, and the bending area connects the display area and the binding area;

[0009] a driving chip, the orthographic projection of which on the display substrate is located in the binding area;

[0010] a supporting layer, located on a side away from the light-emitting surface of the display substrate, and having an orthographic projection on the display substrate at least overlapping with the display area;

[0011] The adhesive layer is located on the side of the support layer away from the display substrate and includes a first adhesive substrate and a first adhesive layer located on both surfaces of the first adhesive substrate, wherein the elastic modulus of the first adhesive substrate is greater than or equal to 10 11 Pa;

[0012] After the bending area is bent, the binding area is located on the side away from the light emitting surface of the display substrate, and the driving chip is located on the side of the binding area away from the display area. The two first adhesive layers are respectively bonded to the supporting layer and the binding area of ​​the display substrate, and the orthographic projection of the first adhesive substrate on the display area at least covers the orthographic projection of the driving chip on the display area.

[0013] According to any one of the display panels of the present disclosure, the adhesive layer further comprises a second adhesive substrate, and second adhesive layers located on both surfaces of the second adhesive substrate;

[0014] The thickness of the second adhesive substrate is smaller than that of the first adhesive substrate, and the second adhesive substrate is located on a side of the first adhesive substrate close to the bending area. After the bending area is bent, the two second adhesive layers are respectively bonded to the supporting layer and the binding area of ​​the display substrate.

[0015] According to any display panel described in the present disclosure, there is no overlapping area between the first adhesive substrate and the second adhesive substrate in the rotation axis direction of the bending area.

[0016] According to any display panel described in the present disclosure, the second adhesive substrate is in a U-shaped structure with its opening facing away from the bending area, and the first adhesive substrate is located in the U-shaped groove surrounded by the second adhesive substrate.

[0017] According to any display panel described in the present disclosure, the second adhesive substrate has a ring structure, and at least a portion of the first adhesive substrate is located within the area enclosed by the second adhesive substrate.

[0018] According to any display panel described in the present disclosure, a width of the second adhesive substrate on a side of the first adhesive substrate close to the bending region is greater than or equal to 2 mm and less than or equal to 5 mm.

[0019] According to any display panel described in the present disclosure, a size of the second adhesive substrate located on a side of the first adhesive substrate in the rotation axis direction of the bending region is greater than or equal to 6 mm and less than or equal to 12 mm.

[0020] According to any display panel described in the present disclosure, the adhesive layer also includes a second adhesive layer, which is located on the side of the first adhesive substrate close to the bending area. After the bending area is bent, the second adhesive layer is respectively bonded to the binding area of ​​the support layer and the display substrate.

[0021] According to any display panel described in the present disclosure, the adhesive layer is an integrated whole-layer structure.

[0022] According to any one of the display panels of the present disclosure, the first adhesive substrate has a thickened area and a thinned area;

[0023] After the bending area is bent, the orthographic projection of the thickened area on the display area at least covers the orthographic projection of the driver chip on the display area, and the thinned area is located on a side of the thickened area close to the bending area.

[0024] According to any display panel described in the present disclosure, there is no overlapping area between the thinned area and the thickened area in the rotation axis direction of the bending area.

[0025] According to any display panel described in the present disclosure, the thinned area is in a U-shaped structure with an opening facing away from the bending area, and at least a portion of the thickened area is located in the U-shaped groove surrounded by the thinned area.

[0026] According to any display panel described in the present disclosure, the thinned area has a ring structure, and the thickened area is located in the area surrounded by the thinned area.

[0027] According to any display panel described in the present disclosure, the thickness of the first adhesive substrate in the thickened area is greater than or equal to 0.08 mm.

[0028] According to any display panel described in the present disclosure, the thickness of the first adhesive substrate in the thinned area is less than or equal to 0.06 mm.

[0029] According to any display panel described in the present disclosure, an edge of the first bonding substrate extends out of the first adhesive layer.

[0030] According to any display panel described in the present disclosure, the protruding dimension of the edge of the first adhesive substrate is greater than or equal to 0.1 mm and less than or equal to 0.2 mm.

[0031] According to any display panel described in the present disclosure, an edge of the first bonding substrate is aligned with an edge of the first adhesive layer.

[0032] According to any display panel described in the present disclosure, an edge of the first adhesive substrate has a burr bent to one side, and the burr faces the support layer.

[0033] According to any display panel described in the present disclosure, the first bonding substrate is a metal substrate or a fiber substrate.

[0034] According to any display panel described in the present disclosure, one of the two first adhesive layers closer to the support layer is a conductive adhesive layer, and the other farther from the support layer is a non-conductive adhesive layer.

[0035] According to any display panel described in the present disclosure, the first adhesive substrate is a non-conductive structure, and the adhesive layer further includes a conductive layer located on a side of the first adhesive substrate close to the support layer.

[0036] According to any display panel described in the present disclosure, the thickness of the conductive layer is greater than or equal to 5 micrometers and less than or equal to 10 micrometers.

[0037] According to any display panel described in the present disclosure, the support layer includes a bending-resistant layer and a support substrate;

[0038] The anti-bending layer is located between the display substrate and the supporting substrate, and both surfaces of the anti-bending layer have a third adhesive layer, and the two third adhesive layers are respectively bonded to the display area of ​​the display substrate and the supporting substrate.

[0039] According to any display panel described in the present disclosure, the display area includes a first display sub-area and a second display sub-area, and a folding area located between the first display sub-area and the second display sub-area.

[0040] According to one aspect of the present disclosure, a method for manufacturing a display panel is provided, the method comprising:

[0041] A display substrate is provided, wherein the display panel has a display area and a non-display area located outside the display area, the non-display area includes a binding area and a bending area, and the bending area connects the display area and the binding area;

[0042] Binding a driver chip on a side close to the light emitting surface of the display substrate, wherein the orthographic projection of the driver chip on the display substrate is located in the binding area;

[0043] A support layer is provided on a side away from the light emitting surface of the display substrate, wherein the orthographic projection of the support layer on the display substrate at least overlaps with the display area;

[0044] Provide an adhesive layer, the adhesive layer comprising a first adhesive substrate and first adhesive layers located on both surfaces of the first adhesive substrate, wherein the elastic modulus of the first adhesive substrate is greater than or equal to 10 11 Pa;

[0045] The adhesive layer is provided on a side of the supporting layer away from the display substrate, and the bending area of ​​the display substrate is bent so that the binding area is located on a side away from the light-emitting surface of the display substrate, and the driver chip is located on a side of the binding area away from the display area. At the same time, the two first adhesive layers on the surface of the first adhesive substrate are respectively bonded to the supporting layer and the binding area of ​​the display substrate, and the orthographic projection of the first adhesive substrate in the display area at least covers the orthographic projection of the driver chip in the display area.

[0046] According to any of the methods described in the present disclosure, the method for manufacturing the adhesive layer includes:

[0047] Providing a base substrate and etching it to obtain the first bonding substrate;

[0048] Providing an adhesive substrate and die-cutting it to obtain the first adhesive layer, wherein the size of the first adhesive layer is smaller than the size of the first adhesive substrate;

[0049] The first adhesive layer is bonded to both side surfaces of the first bonding substrate by a transfer process, and the edge of the first bonding substrate extends out of the first adhesive layer.

[0050] According to any of the methods described in the present disclosure, the method for manufacturing the adhesive layer includes:

[0051] Providing a base substrate and a bonding substrate;

[0052] Adhere the adhesive substrate to both sides of the substrate substrate;

[0053] The adhesive substrate and the first base substrate are simultaneously cut by laser cutting or punching to obtain an adhesive layer including the first adhesive substrate and the first adhesive layer, wherein an edge of the first adhesive substrate is aligned with an edge of the first adhesive layer.

[0054] According to one aspect of the present disclosure, a display device is provided, comprising the display panel described in the above aspect.

[0055] The embodiments of the present disclosure include at least the following technical effects:

[0056] In the embodiment of the present disclosure, after the two first adhesive layers of the bonding layer are respectively bonded to the binding areas of the support layer and the display substrate, the orthographic projection of the first bonding substrate in the display area at least covers the orthographic projection of the driver chip in the display area, thereby providing a larger elastic modulus in the area where the driver chip is located through the first bonding substrate, thereby improving the impact resistance of the display panel in the area where the driver chip is located, so as to extend the service life of the display panel on the basis of improving the structural strength of the display panel.

[0057] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0059] FIG1 is a schematic diagram of a cross-sectional structure of a display panel before being bent, provided in an embodiment of the present disclosure.

[0060] FIG2 is a schematic diagram of a cross-sectional structure of a display panel after being bent, provided in an embodiment of the present disclosure.

[0061] FIG3 is a schematic diagram of a cross-sectional structure of another display panel after being bent according to an embodiment of the present disclosure.

[0062] FIG4 is a schematic diagram of a cross-sectional structure of another display panel after being bent according to an embodiment of the present disclosure.

[0063] FIG5 is a schematic diagram of a cross-sectional structure of another display panel after being bent according to an embodiment of the present disclosure.

[0064] FIG6 is a schematic diagram of a cross-sectional structure of another display panel after being bent according to an embodiment of the present disclosure.

[0065] FIG7 is a schematic diagram of a cross-sectional structure of another display panel after being bent, provided in an embodiment of the present disclosure.

[0066] FIG8 is a schematic top view of the structure of a first bonding substrate provided in an embodiment of the present disclosure.

[0067] FIG9 is a schematic top view of another first bonding substrate provided in an embodiment of the present disclosure.

[0068] FIG10 is a schematic top view of another first bonding substrate provided in an embodiment of the present disclosure.

[0069] FIG11 is a schematic diagram of the cross-sectional structure of another display panel after being bent, provided in an embodiment of the present disclosure.

[0070] FIG12 is a schematic diagram of the cross-sectional structure of another display panel after being bent according to an embodiment of the present disclosure.

[0071] FIG13 is a schematic diagram of a top view of a first bonding substrate and a second bonding substrate provided in an embodiment of the present disclosure.

[0072] FIG14 is a schematic top view of another first bonding substrate and a second bonding substrate provided in an embodiment of the present disclosure.

[0073] FIG. 15 is a schematic top view of another first bonding substrate and a second bonding substrate provided in an embodiment of the present disclosure.

[0074] FIG16 is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present disclosure.

[0075] Reference numerals: 100, display panel; AA, display area; BB, non-display area; B1, binding area; B2, bending area; 10, display substrate; 20, driver chip; 30, support layer; 40, adhesive layer; 50, metal tape; 60, cover plate protective layer; 70, flexible circuit; 11, display module; 12, back film protective layer; 121, first back film layer; 122, second back film layer; 21, first adhesive strip; 22, second adhesive strip; 31, supporting substrate; 32, bending-resistant layer; 33, third adhesive layer; 41, first adhesive substrate; 42, first adhesive layer; 43, second adhesive substrate; 44, second adhesive layer; 45, conductive layer; 411, thickened area; 412, thinned area; 413, flashing; 421. First sub-adhesive layer; 422. Second sub-adhesive layer; 423. Conductive adhesive layer; 424. Non-conductive adhesive layer; 61. Thin glass substrate; 62. Hardened protective layer; 63. High-temperature resistant protective layer; 64. Fourth adhesive layer. DETAILED DESCRIPTION

[0076] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent identical or similar structures, and thus their detailed descriptions will be omitted. Furthermore, the figures are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0077] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0078] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0079] Figure 1 illustrates a schematic diagram of the structure of an unbent display panel 100 provided in an embodiment of the present disclosure, Figure 2 illustrates a schematic diagram of the structure of a bent display panel 100 provided in an embodiment of the present disclosure, and Figure 3 illustrates a schematic diagram of the structure of another bent display panel 100 provided in an embodiment of the present disclosure. As shown in Figures 1, 2, or 3, the display panel 100 includes: a display substrate 10, a driver chip 20, a support layer 30, and an adhesive layer 40.

[0080] As shown in Figure 1, the display substrate 10 has a display area AA and a non-display area BB located outside the display area AA, the non-display area BB includes a binding area B1 and a bending area B2, and the bending area B2 connects the display area AA and the binding area B1; the driving chip 20 is located on the side close to the light-emitting surface of the display substrate 10, and its orthographic projection on the display substrate 10 is located in the binding area B1; the supporting layer 30 is located on the side away from the light-emitting surface of the display substrate 10, and its orthographic projection on the display substrate 10 at least overlaps with the display area AA; the adhesive layer 40 is located on the side of the supporting layer 30 away from the display substrate 10.

[0081] As shown in Figures 2 and 3 , after the bending area B2 of the display substrate 10 is bent, the binding area B1 is located on the side away from the light-emitting surface of the display substrate 10, and the driver chip 20 is located on the side of the binding area B1 away from the display area AA. At this point, the driver chip 20 can be bonded to the support layer 30 and the binding area B1 of the display substrate 10 respectively via the adhesive layer 40.

[0082] The bending region B2 can be bent toward a side away from the light-emitting surface of the display substrate 10. After the bending region B2 of the display substrate 10 is bent, the binding region B1 is located on a side away from the light-emitting surface of the display substrate 10. Therefore, when the bending region B2 of the display substrate 10 is not bent, the driver chip 20 can be observed on the light-emitting surface of the display substrate 10; however, when the bending region B2 of the display substrate 10 is bent, the driver chip 20 can be observed on the side away from the light-emitting surface of the display substrate 10.

[0083] Among them, the binding area B1 of the display substrate 10 is used to fix the driver chip 20, and the driver chip 20 may include a driver element for driving the display area AA to display an image, such as a data driver circuit. The driver chip 20 can be fixed by bonding. Optionally, as shown in Figure 2 or Figure 3, the side of the driver chip 20 close to the bending area B2 of the display substrate 10 is fixedly connected to the binding area B1 through a first adhesive strip 21, and the side of the driver chip 20 away from the bending area B2 of the display substrate 10 is fixedly connected to the binding area B1 through a second adhesive strip 22. In this way, the driver chip 20 is wrapped and fixed by the first adhesive strip 21 and the second adhesive strip 22 on both sides of the driver chip 20, which improves the stability of the fixation of the driver chip 20 and reduces the situation where the driver chip 20 is damaged when external force acts on the area where the driver chip 20 is located on the display substrate 10.

[0084] Furthermore, the binding area B1 of the display substrate 10 is also used to bind the flexible circuit 70, thereby transmitting corresponding signals to the various signal lines of the driver chip 20 through the flexible circuit 70. After the flexible circuit 70 is bound to the binding area B1 of the display substrate 10, as shown in Figures 2 and 3, the second adhesive strip 22 on the side of the driver chip 20 away from the bending area B2 can be reused as an adhesive between the flexible circuit 70 and the binding area B1 of the display substrate 10, thereby improving the stability of the binding of the flexible circuit 70 to the display substrate 10.

[0085] In some embodiments, the display area AA includes a first display sub-area and a second display sub-area, and a folding area located between the first display sub-area and the second display sub-area. Thus, by providing the folding area, the entire display panel 100 can be folded, thereby enabling the image display area on the display panel 100 to be freely expanded, thereby improving user engagement.

[0086] Due to the provision of the folding area in the display area AA, in order to facilitate the foldability of the display panel 100 , each film layer structure included in the display panel 100 has a bendable property at least in the folding area.

[0087] In some embodiments, as shown in Figure 1, the display substrate 10 includes a display module 11 and a back film protective layer 12, the display module 11 has a display area AA and a non-display area BB located outside the display area AA, the non-display area BB includes a binding area B1, and a bending area B2 located between the display area AA and the binding area B1; the back film protective layer 12 is located on the side away from the light-emitting surface of the display module 11, and includes a first back film layer 121 and a second back film layer 122, the orthographic projection of the first back film layer 121 on the display module 11 at least coincides with the display area AA, and the orthographic projection of the second back film layer 122 on the display module 11 at least coincides with the binding area B1.

[0088] As shown in FIG1 , before the bending zone B2 is bent, the driver chip 20 is located on the side close to the light-emitting surface of the display module 11, and its orthographic projection on the display module 11 is located in the binding zone B1, so that the driver chip 20 is simultaneously connected to the wiring and the flexible circuit 70 of the display module 11 in the binding zone B1.

[0089] In some embodiments, the support layer 30 includes a support substrate 31 , the orthographic projection of the support substrate 31 on the display substrate 10 at least coincides with the display area AA, and one side of the support substrate 31 is fixedly connected to the display area AA of the display substrate 10 .

[0090] In this way, the supporting performance of the display substrate 10 is improved by the supporting substrate 31 , thereby improving the structural strength of the display panel 100 and extending the service life of the display panel 100 .

[0091] The support layer 30 has a large elastic modulus to ensure its own structural strength, thereby ensuring the structural strength of the display panel 100. For example, the support layer 30 may include a metal material with a large elastic modulus (such as stainless steel), or a carbon fiber material or a glass fiber material with a large elastic modulus.

[0092] In other embodiments, as shown in Figure 2 or Figure 3, the supporting layer 30 includes a bending-resistant layer 32 and a supporting substrate 31. The bending-resistant layer 32 is located between the display substrate 10 and the supporting substrate 31, and both surfaces of the bending-resistant layer 32 have a third adhesive layer 33. The two third adhesive layers 33 are respectively bonded to the display area AA of the display substrate 10 and the supporting substrate 31.

[0093] In this way, the bending resistance of the display substrate 10 is improved by the bending resistance layer 32 , and the support performance of the display substrate 10 is improved by the support substrate 31 , thereby better improving the structural strength of the display panel 100 and extending the service life of the display panel 100 .

[0094] The bending-resistant layer 32 may be a polyimide film or a mixed film of polytetrafluoroethylene propylene and polyimide, as long as the bending-resistant layer 32 has a certain bending resistance. The present disclosure does not limit this. For details regarding the support substrate 31, please refer to the above-described embodiments.

[0095] In some embodiments, as shown in FIG. 2 or FIG. 3 , the display panel 100 further includes a metal tape 50 (such as a copper foil tape), and the metal tape 50 is located between the support layer 30 and the adhesive layer 40 .

[0096] In this way, the metal tape 50 can be provided to improve the bonding strength between the adhesive layer 40 and the supporting layer 30, thereby avoiding the peeling of the supporting layer 30 and the adhesive layer 40, and at the same time improve the structural strength of the display panel 100. The metal tape 50 can also be grounded. At this time, some grounding signal lines in the display panel 100 can be directly electrically connected to the metal tape 50, thereby reducing the difficulty of wiring the grounding signal lines.

[0097] In some embodiments, as shown in FIG. 2 or FIG. 3 , the display panel 100 further includes a cover protective layer 60 , which is located on a side close to the light emitting surface of the display substrate 10 , and whose orthographic projection on the display substrate 10 at least covers the display area AA of the display substrate 10 .

[0098] The cover protective layer 60 has light-transmitting properties to ensure normal display of images on the display panel 100. Thus, the cover protective layer 60 protects the display substrate 10 without affecting the normal display of the display panel 100. This improves the impact resistance of the display panel 100, preventing damage to the display substrate 10 caused by direct impact of foreign objects, thereby extending the service life of the display panel 100.

[0099] Optionally, as shown in FIG2 or FIG3 , the cover protective layer 60 includes a thin glass substrate 61 and a hardened protective layer 62 located on a side of the thin glass substrate 61 away from the display substrate 10 . The hardened protective layer 62 and the thin glass substrate 61 may be bonded together by transparent adhesive.

[0100] The transparent adhesive can be optical adhesive, pressure-sensitive adhesive, or the like, as long as it has a certain degree of adhesion and ensures light transmittance. The hardened protective layer 62 can be a hardened plastic film or a hardened high-temperature-resistant polyester film, as long as it has a certain degree of hardness and exhibits properties such as high light transmittance, wear resistance, and scratch resistance. This is not limited in the present embodiment. In the case where the hardened protective layer 62 is a hardened high-temperature-resistant polyester film, it not only ensures the impact resistance of the display substrate 10, but also ensures its high-temperature resistance, thereby further improving the service life of the display panel 100.

[0101] Furthermore, as shown in Figure 2 or Figure 3, the cover protective layer 60 also includes a high-temperature resistant protective layer 63, which is located between the thin glass substrate 61 and the display substrate 10. Both surfaces of the high-temperature resistant protective layer 63 have a fourth adhesive layer 64, and the two fourth adhesive layers 64 are respectively bonded to the thin glass substrate 61 and the display area AA of the display substrate 10.

[0102] Thus, the high temperature resistant protective layer 63 can effectively ensure the high temperature resistant performance of the display substrate 10, thereby further improving the service life of the display panel 100. The high temperature resistant protective layer 63 can be a high temperature polyester film or the like.

[0103] In the embodiment of the present disclosure, the adhesive layer 40 can be bonded only to the binding area B1 after the bending area B2 is bent, or it can be as shown in Figure 2 or Figure 3, where the adhesive layer 40 extends out of the edge of the binding area B1 after the bending area B2 is bent, thereby bonding to the edges of the binding area B1 and the bending area B2 at the same time.

[0104] As shown in FIG2 or FIG3, the adhesive layer 40 includes a first adhesive substrate 41 and a first adhesive layer 42 located on both surfaces of the first adhesive substrate 41. The elastic modulus of the first adhesive substrate 41 is greater than or equal to 10 11 Pa.

[0105] After the bending area B2 of the display substrate 10 is bent, the two first adhesive layers 42 are respectively bonded to the support layer 30 and the binding area B1 of the display substrate 10, and the orthographic projection of the first adhesive substrate 41 in the display area AA at least covers the orthographic projection of the driver chip 20 in the display area AA.

[0106] In this way, after the two first adhesive layers 42 of the adhesive layer 40 are respectively bonded to the supporting layer 30 and the binding area B1 of the display substrate 10, the orthographic projection of the first adhesive substrate 41 in the display area AA at least covers the orthographic projection of the driving chip 20 in the display area AA, thereby providing a larger elastic modulus in the area where the driving chip 20 is located through the first adhesive substrate 41, thereby improving the impact resistance of the display panel 100 in the area where the driving chip 20 is located, so as to extend the service life of the display panel 100 on the basis of improving the structural strength of the display panel 100.

[0107] The elastic modulus of the first bonding substrate 41 can be, for example, 1.0×10 11 Pa, 1.2×10 11 Pa, 1.5×10 11 Pa, 1.8×10 11 Pa, 2.0×10 11 Pa, 2.2×10 11 Pa, 2.5×10 11 The first adhesive layer 42 can be transferred to the surface of the first adhesive substrate 41 (such as a stainless steel substrate) by a transfer process, or can be formed on the surface of the first adhesive substrate 41 (such as a carbon fiber composite substrate) by a coating method, and the specific method can be determined in combination with the specific material of the first adhesive substrate 41.

[0108] It should be noted that, in combination with the case where the display panel 100 described above also includes the metal tape 50, at this time, as shown in Figure 2 or Figure 3, after the bending area B2 of the display substrate 10 is bent, the two first adhesive layers 42 are respectively bonded to the metal tape 50 and the binding area B1 of the display substrate 10.

[0109] In some embodiments, the first adhesive substrate 41 may be a metal substrate (such as a stainless steel substrate) or a fiber substrate (such as a carbon fiber composite substrate, a glass fiber composite substrate, an aramid fiber composite substrate, etc.). Of course, the first adhesive substrate 41 may also be a substrate of other materials, as long as it has a high elastic modulus to improve the impact resistance of the display panel 100 in the area where the driver chip 20 is located. This is not limited in the embodiments of the present disclosure.

[0110] For example, the first bonding substrate 41 is a stainless steel substrate. In this case, the elastic modulus of the first bonding substrate 41 is 1.94×10 11 Pa; the first bonding substrate 41 is a glass fiber composite board, and the elastic modulus of the first bonding substrate 41 is 1.2×10 11 Pa; the first bonding substrate 41 is a carbon fiber composite board, and the elastic modulus of the first bonding substrate 41 is 2.3×10 11 Pa.

[0111] In some embodiments, the two first adhesive layers 42 on the surface of the first adhesive substrate 41 are both non-conductive adhesive layers, i.e., insulating adhesive layers, to ensure the insulation performance between the binding area B1 and the display area AA, thereby preventing the display area AA from being affected by the binding area B1 when displaying images.

[0112] In other embodiments, as shown in FIG3 , of the two first adhesive layers 42 on the surface of the first adhesive substrate 41, the one closer to the support layer 30 is a conductive adhesive layer 423, and the one farther from the support layer 30 is a non-conductive adhesive layer (i.e., insulating adhesive layer) 424. In this manner, the single-sided impedance data of the display panel 100 can be measured directly through the adhesive layer 40, namely, the impedance data between the bonding area B1 of the folded display panel 100 and the support layer 30, to verify the single-sided impedance requirements of the display panel 100.

[0113] Of course, for the first adhesive layers 42 on the two surfaces of the first adhesive substrate 41, the one of the two first adhesive layers 42 closer to the support layer 30 can be a non-conductive adhesive layer 424, and the one away from the support layer 30 can be a conductive adhesive layer 423. As long as the measurement of the unilateral impedance data of the display panel 100 can be achieved, the embodiment of the present disclosure does not limit this.

[0114] In combination with the above, the first adhesive substrate 41 can be a metal substrate or a fiber substrate. That is, the first adhesive substrate 41 can be a conductive structure or a non-conductive structure. When the first adhesive substrate 41 is a conductive structure, the first adhesive substrate 41 has a certain conductive performance, so that the single-sided impedance data of the display panel 100 can be tested normally. When the first adhesive substrate 41 is a non-conductive structure, in order to facilitate the testing of the single-sided impedance data of the display panel 100, as shown in Figure 4, the adhesive layer 40 also includes a conductive layer 45 located on the side of the first adhesive substrate 41 close to the support layer 30. In this way, through the provision of the conductive layer 45, the local conductive performance of the first adhesive substrate 41 can be guaranteed, thereby ensuring the testing of the single-sided impedance data of the display panel 100.

[0115] The conductive layer 45 may be an electroplated metal layer, such as an electroplated nickel layer. The conductive layer 45 may cover the entire surface of a single side of the first adhesive substrate 41, or may cover a portion of a single side of the first adhesive substrate 41, as long as the first adhesive substrate 41 is locally conductive under the provision of the conductive layer 45.

[0116] Preferably, the edge of the conductive layer 45 can be aligned with the edge of the first adhesive layer 42. In this way, the flatness of the first adhesive layer 42 can be ensured, thereby ensuring the bonding area between the first adhesive layer 42 and the support layer 30, while ensuring the local conductivity of the first adhesive substrate 41.

[0117] The thickness of the conductive layer 45 is greater than or equal to 5 microns and less than or equal to 10 microns. This is to prevent the conductive layer 45 from being too thin, which may affect the conductivity of the first adhesive substrate 41 even when the conductive layer 45 is provided. Furthermore, the conductive layer 45 from being too thick, which may affect the thickness of the first adhesive layer 42 and thus affect the bonding effect between the adhesive layer 40 and the support layer 30. For example, the thickness of the conductive layer 45 is 5 microns, 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, etc.

[0118] In some embodiments, for the first bonding substrate 41 and the first adhesive layer 42 included in the bonding layer 40, combined with the above-mentioned situation of transferring the first adhesive layer 42 to the surface of the first bonding substrate 41, it can be a first method: first cut the size of the first bonding substrate 41 and the first adhesive layer 42, and then transfer the first adhesive layer 42 to the surface of the first bonding substrate 41; it can also be a second method: first cut the size of the first bonding substrate 41, then transfer the first adhesive layer 42 to the surface of the first bonding substrate 41, and finally cut the size of the first adhesive layer 42; it can also be a third method: first transfer the first adhesive layer 42 to the surface of the first bonding substrate 41, and then cut the size of the first bonding substrate 41 and the first adhesive layer 42.

[0119] When the adhesive layer 40 is manufactured according to the first method described above, an etching process can optionally be used to maintain the outer dimensions of the first adhesive substrate 41, while a die-cutting process can be used to maintain the outer dimensions of the first adhesive layer 42. Consequently, as shown in FIG2 , the edge of the first adhesive substrate 41 protrudes beyond the first adhesive layer 42. In other words, the dimensions of the first adhesive layer 42 are smaller than those of the first adhesive substrate 41 to ensure the feasibility of transferring the first adhesive layer 42 to the surface of the first adhesive substrate 41 and to prevent the edge of the first adhesive layer 42 from protruding beyond the first adhesive substrate 41 due to process errors during transfer.

[0120] The edge of the first adhesive substrate 41 protrudes from the first adhesive layer 42 by a dimension greater than or equal to 0.1 mm to ensure the yield of the first adhesive layer 42 being transferred to the surface of the first adhesive substrate 41. For example, the edge of the first adhesive substrate 41 protrudes from the first adhesive layer 42 by a dimension of 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.2 mm, etc. Preferably, the edge of the first adhesive substrate 41 protrudes from the first adhesive layer 42 by a dimension of 0.15 mm.

[0121] Of course, the edge of the first adhesive substrate 41 extending beyond the first adhesive layer 42 may also be slightly less than 0.1 mm, as long as the yield of the first adhesive layer 42 being transferred to the surface of the first adhesive substrate 41 can be guaranteed.

[0122] Furthermore, the edge of the first adhesive substrate 41 extending out of the first adhesive layer 42 is less than or equal to 0.2 mm, which can increase the size of the first adhesive layer 42 and thereby ensure the bonding strength between the adhesive layer 40 and the binding area B1 of the support layer 30 and the display substrate 10.

[0123] Of course, the edge of the first adhesive substrate 41 may extend slightly larger than 0.2 mm from the first adhesive layer 42 , as long as the bonding stability between the adhesive layer 40 and the binding area B1 of the support layer 30 and the display substrate 10 can be ensured.

[0124] When the adhesive layer 40 is manufactured according to the second or third method described above, since the last step includes cutting the first adhesive layer 42, it can be ensured that the edge of the first adhesive substrate 41 is flush with the edge of the first adhesive layer 42 as shown in Figure 5 or Figure 6. In this way, the first adhesive layer 42 can be ensured to have a larger size to increase the bonding area of ​​the binding area B1 of the support layer 30 and the display substrate 10, thereby ensuring the stability of the bonding between the adhesive layer 40 and the binding area B1 of the support layer 30 and the display substrate 10.

[0125] Optionally, when the adhesive layer 40 is manufactured according to the second method described above, the outer dimensions of the first adhesive substrate 41 can be ensured by an etching process, and the outer dimensions of the first adhesive layer 42 can be ensured by a laser cutting process. Optionally, when the adhesive layer 40 is manufactured according to the third method described above, the outer dimensions of the first adhesive substrate 41 and the first adhesive layer 42 can be ensured by a stamping process.

[0126] When the first adhesive substrate 41 and the first adhesive layer 42 are cut through the stamping process, as shown in FIG6 , the edge of the first adhesive substrate 41 forms a flare 413 that bends toward one side. In this case, the flare 413 on the edge of the first adhesive substrate 41 can be positioned toward the support layer 30. This prevents the flare 413 on the first adhesive substrate 41 from contacting the binding region B1 of the display substrate 10 when the adhesive layer 40 is bonded only to the binding region B1, thereby preventing damage to the binding region B1 of the display substrate 10. As shown in FIG6 , when the edge of the adhesive layer 40 extends into the bend region B2, that is, when the adhesive layer 40 is bonded simultaneously to the edges of the binding region B1 and the bend region B2, the flare 413 on the first adhesive substrate 41 can be prevented from contacting the bend region B2 of the display substrate 10, thereby preventing damage to the bend region B2 of the display substrate 10.

[0127] In the embodiment of the present disclosure, the adhesive layer 40 included in the display panel 100 can be an integrated whole layer structure, or a split structure arranged in a direction away from the bending area B2 in conjunction with the position of the driver chip 20. The integrated structure and the split structure are explained below.

[0128] When the adhesive layer 40 is configured as an integrated whole layer structure:

[0129] In some embodiments, the thickness of the entire area of ​​the first adhesive substrate 41 is uniform, which can simplify the processing of the first adhesive substrate 41 and improve the assembly efficiency of the display panel 100.

[0130] In other embodiments, as shown in Figure 7, the first adhesive substrate 41 has a thickened area 411 and a thinned area 412. After the bending area B2 is bent, the orthographic projection of the thickened area 411 in the display area AA at least covers the orthographic projection of the driver chip 20 in the display area AA, and the thinned area 412 is located on the side of the thickened area 411 close to the bending area B2.

[0131] In this way, by setting the thinning area 412 on the first adhesive substrate 41, the thickness of the first adhesive layer 42 in the thinning area 412 can be increased, thereby increasing the bonding strength of the adhesive layer 40 with the binding area B1 of the display substrate 10 and the supporting layer 30 at a position close to the bending area B2, thereby improving the fixing strength of the display area AA and the binding area B1 of the display substrate 10, ensuring the bending effect of the bending area B2 of the display substrate 10, and reducing the radial tension in the bending area B2 and the influence of the high temperature and high humidity environment, which causes the supporting layer 30 and the binding area B1 to partially fall off from the adhesive layer 40, thereby extending the service life of the display panel 100.

[0132] Among them, the thickened area 411 and the thinned area 412 of the first bonding substrate 41 can be obtained through an etching process, and the transition between the thickened area 411 and the thinned area 412 can be a step-like transition or a slope-like transition. As for the case of a slope-like transition, the transition can be made through an inclined plane or an inclined arc surface, and the embodiment of the present disclosure does not limit this. As for the case where the thickened area 411 and the thinned area 412 of the first bonding substrate 41 are a step-like transition, the first adhesive layer 42 on the surface of the first bonding substrate 41 can be obtained by a die-cutting process to obtain the outer dimensions of the first sub-adhesive layer 421 located in the thickened area 411 and the outer dimensions of the second sub-adhesive layer 422 located in the thinned area 412, and then the first sub-adhesive layer 421 and the second sub-adhesive layer 422 are transferred to the thickened area 411 and the thinned area 412 of the first bonding substrate 41 respectively.

[0133] As shown in Figure 7, the first adhesive layer 42 includes a first sub-adhesive layer 421 located in the thickened area 411 of the first adhesive substrate 41, and a second sub-adhesive layer 422 located in the thinned area 412 of the first adhesive substrate 41; the edge of the thickened area 411 of the first adhesive substrate 41 extends out of the edge of the first sub-adhesive layer 421, and the edge of the first adhesive substrate 41 extends out of the edge of the second sub-adhesive layer 422 at the edge of the thinned area 412, so as to ensure the transfer yield when the first sub-adhesive layer 421 is transferred to the thickened area 411 of the first adhesive substrate 41, and the second sub-adhesive layer 422 is transferred to the thinned area 412 of the first adhesive substrate 41.

[0134] It should be noted that the extension of the edge of the thickened region 411 of the first adhesive substrate 41 from the edge of the first sub-adhesive layer 421, and the extension of the edge of the thinned region 412 of the first adhesive substrate 41 from the edge of the second sub-adhesive layer 422, can refer to the extension of the edge of the first adhesive substrate 41 from the edge of the first adhesive layer 42 described in the above embodiment, and this embodiment will not be further described in detail in the present disclosure. For example, the extension of the edge of the thickened region 411 of the first adhesive substrate 41 from the edge of the first sub-adhesive layer 421, and the extension of the edge of the thinned region 412 of the first adhesive substrate 41 from the edge of the second sub-adhesive layer 422, are both 0.15 mm.

[0135] Optionally, the thickness of the first adhesive substrate 41 in the thickened region 411 is greater than or equal to 0.08 mm. By limiting the minimum thickness of the first adhesive substrate 41 in the thickened region 411, the support strength of the thickened region 411 for the area where the driver chip 20 is located is ensured, effectively ensuring the impact resistance of the display panel 100 in the area where the driver chip 20 is located, and reducing the possibility of damage to the driver chip 20. For example, the thickness of the first adhesive substrate 41 in the thickened region 411 can be 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, etc.

[0136] Furthermore, the thickness of the first adhesive substrate 41 in the thickened area 411 can be set to be less than or equal to 0.12 mm. In this way, by limiting the maximum thickness of the first adhesive substrate 41 in the thickened area 411, the first sub-adhesive layer 421 on the surface of the thickened area 411 is prevented from being too thin, thereby ensuring the bonding stability of the first sub-adhesive layer 421 to the binding area B1 of the support layer 30 and the display substrate 10.

[0137] It should be noted that the specific thickness of the first adhesive substrate 41 in the thickened area 411 can also be set with reference to the distance between the support layer 30 and the binding area B1 after the display substrate 10 is bent. To ensure that the thickened area 411 of the first adhesive substrate 41 has sufficient support strength for the area where the driver chip 20 is located, and that the two first sub-adhesive layers 421 in the thickened area 411 have sufficient bonding strength to the support layer 30 and the binding area B1, respectively, the thickness of the first adhesive substrate 41 in the thickened area 411 is set to be slightly less than 0.08 mm or slightly greater than 0.12 mm. For example, the thickness of the first adhesive substrate 41 in the thickened area 411 is 0.07 mm, 0.13 mm, etc.

[0138] Optionally, the thickness of the first adhesive substrate 41 in the thinned region 412 is less than or equal to 0.06 mm. By limiting the maximum thickness of the first adhesive substrate 41 in the thinned region 412, the minimum thickness of the second sub-adhesive layer 422 on the surface of the thinned region 412 is ensured. This, in turn, ensures the stability of the second sub-adhesive layer 422 in bonding to the support layer 30 near the bending region B2 of the display substrate 10 and the binding region B1 of the display substrate 10 near the bending region B2, thereby ensuring the stability of the arc formed by the bending region B2 of the display substrate 10. For example, the thickness of the first adhesive substrate 41 in the thinned region 412 can be 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, etc.

[0139] It should be noted that the specific thickness of the first adhesive substrate 41 in the thinned region 412 can also be set with reference to the distance between the support layer 30 and the binding region B1 after the display substrate 10 is bent. While ensuring sufficient bonding strength between the two second sub-adhesive layers 422 of the first adhesive substrate 41 in the thinned region 412 and the support layer 30 and the binding region B1, the thickness of the first adhesive substrate 41 in the thinned region 412 is set to be slightly greater than 0.06 mm. For example, the thickness of the first adhesive substrate 41 after thinning is 0.07 mm.

[0140] In the case where the first bonding substrate 41 has the thickened area 411 and the thinned area 412 , the distribution of the thickened area 411 and the thinned area 412 on the first bonding substrate 41 can be determined by referring to the size and shape of the binding area B1 of the display substrate 10 .

[0141] Optionally, as shown in FIG8 , the thinned region 412 and the thickened region 411 do not overlap in the direction of the rotation axis O of the bending region B2. For example, if the binding region B1 of the display substrate 10 is relatively large and has a square outer contour, the first bonding substrate 41 can be configured as a square structure, with a portion of the first bonding substrate 41 near the bending region B2 configured as the thinned region 412 and a portion away from the bending region B2 configured as the thickened region 411.

[0142] Optionally, as shown in Figure 9 , the thinned region 412 is a U-shaped structure with its opening facing away from the bend region B2, and at least a portion of the thickened region 411 is located within the U-shaped groove formed by the thinned region 412. For example, if the binding region B1 of the display substrate 10 is relatively small and has a special-shaped outer profile, the first bonding substrate 41 can be configured as a square structure, with a portion of the first bonding substrate 41 adjacent to the bend region B2 and portions on both sides of the bend region B2 in the axial direction being configured as the U-shaped thinned region 412, while the remaining portion is configured as the thickened region 411 located within the U-shaped groove of the thinned region 412.

[0143] Optionally, as shown in FIG10 , the thinning region 412 is annular in structure, and the thickened region 411 is located within the area enclosed by the thinning region 412. For example, if the binding region B1 of the display substrate 10 is relatively large and the outer contour does not define a structure, the first bonding substrate 41 can be configured as a square structure, with the outer ring portion of the first bonding substrate 41 configured as the annular thinning region 412, and the portion within the area enclosed by the thinning region 412 configured as the thickened region 411.

[0144] It should be noted that, for the three aforementioned embodiments, as shown in FIG8 , FIG9 , or FIG10 , the width L1 of the thinned region 412 on the side of the first adhesive substrate 41 near the bending region B2 is greater than or equal to 2 mm and less than or equal to 5 mm. For example, the width L1 of the thinned region 412 on the side of the first adhesive substrate 41 near the bending region B2 is 2 mm, 3 mm, 4 mm, 5 mm, etc. In this way, while ensuring that the thickened region 411 of the first adhesive substrate 41 provides better support for the area where the driver chip 20 is located, the second sub-adhesive layer 422 on the surface of the thinned region 412 of the first adhesive substrate 41 can be stably bonded to the support layer 30 and the binding region B1, thereby ensuring the stability of the arc formed by the bending region B2 of the display substrate 10 after bending.

[0145] It should be noted that, for the latter two embodiments described above, as shown in FIG9 or FIG10 , the dimension L2 of the thinned region 412 on the side of the first adhesive substrate 41 in the direction of the rotation axis O of the bending region B2 is greater than or equal to 6 mm and less than or equal to 12 mm. For example, the dimension L2 of the thinned region 412 on the side of the first adhesive substrate 41 in the direction of the rotation axis O of the bending region B2 is 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, etc. This further increases the distribution range of the thinned region 412 on the first adhesive substrate 41, thereby increasing the bonding area of ​​the second sub-adhesive layer 422. This ensures that the thickened region 411 of the first adhesive substrate 41 provides better support for the area where the driver chip 20 is located, while also ensuring the stability of the bonding between the second sub-adhesive layer 422 on the surface of the thinned region 412 of the first adhesive substrate 41 and the support layer 30 and the binding region B1, thereby ensuring the stability of the arc formed by the bending region B2 of the display substrate 10 after bending.

[0146] For the case where the adhesive layer 40 is configured as a split structure:

[0147] In some embodiments, as shown in FIG11 , the adhesive layer 40 further includes a second adhesive layer 44. The second adhesive layer 44 is located on a side of the first adhesive substrate 41 near the bending region B2. After the bending region B2 is bent, the second adhesive layer is bonded to the support layer 30 and the binding region B1 of the display substrate 10. In this way, the portion of the support layer 30 near the bending region B2 and the portion of the binding region B1 of the display substrate 10 near the bending region B2 are directly bonded via the integrated second adhesive layer 44, effectively ensuring bonding stability and reducing the risk of partial detachment of the support layer 30 and the binding region B1 from the adhesive layer 40 due to radial tension in the bending region B2 and the effects of high temperature and high humidity environments, thereby extending the service life of the display panel 100.

[0148] In other embodiments, as shown in Figures 3, 4 or 12, the bonding layer 40 further includes a second bonding substrate 43 and second adhesive layers 44 located on both surfaces of the second bonding substrate 43; the thickness of the second bonding substrate 43 is less than the thickness of the first bonding substrate 41, and the second bonding substrate 43 is located on the side of the first bonding substrate 41 close to the bending area B2. After the bending area B2 is bent, the two second adhesive layers are respectively bonded to the supporting layer 30 and the binding area B1 of the display substrate 10.

[0149] In this way, the thickness of the second adhesive layer 44 can be ensured to be greater than the thickness of the first adhesive layer 42, thereby further ensuring the stability of the bonding between the support layer 30 near the bending area B2 and the position near the bending area B2 in the binding area B1 of the display substrate 10 and the adhesive layer 40, thereby ensuring the bending effect of the bending area B2 of the display substrate 10, reducing the radial tension in the bending area B2 and the influence of the high temperature and high humidity environment, which causes the support layer 30 and the binding area B1 to partially fall off from the adhesive layer 40, thereby extending the service life of the display panel 100.

[0150] The first adhesive substrate 41 and the second adhesive substrate 43 are spaced apart, and the spacing between the first adhesive substrate 41 and the second adhesive substrate 43 is greater than or equal to 0.2 mm to avoid interference between the first adhesive substrate 41 and the second adhesive substrate 43. For example, the spacing between the first adhesive substrate 41 and the second adhesive substrate 43 is 0.2 mm, 0.3 mm, 0.4 mm, or 0.5 mm. Of course, the spacing between the first adhesive substrate 41 and the second adhesive substrate 43 can also be slightly less than 0.2 mm, such as 0.18 mm, as long as interference between the first adhesive substrate 41 and the second adhesive substrate 43 is avoided.

[0151] The second adhesive layer 44 can be formed on the surface of the second adhesive substrate 43 by coating to improve the tightness of the bonding between the second adhesive layer 44 and the second adhesive substrate 43. Since the second adhesive layer 44 is formed on the surface of the second adhesive substrate 43 by coating, as shown in Figure 12, the edge of the second adhesive substrate 43 can be flush with the edge of the second adhesive layer 44, thereby ensuring that the second adhesive layer 44 has a larger bonding area. The second adhesive substrate 43 can be made of a material with a low elastic modulus, such as a high-temperature resistant polyester film.

[0152] Optionally, the thickness of the first adhesive substrate 41 is greater than or equal to 0.08 mm. By limiting the minimum thickness of the first adhesive substrate 41, the support strength in the area where the driver chip 20 is located is ensured, effectively ensuring the impact resistance of the display panel 100 in the area where the driver chip 20 is located, and reducing the possibility of damage to the driver chip 20. For example, the thickness of the first adhesive substrate 41 can be 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, etc.

[0153] Furthermore, the thickness of the first adhesive substrate 41 can be set to be less than or equal to 0.12 mm. In this way, by limiting the maximum thickness of the first adhesive substrate 41, the first adhesive layer 42 on the first adhesive substrate 41 is prevented from being too thin, thereby ensuring the bonding stability of the first adhesive layer 42 to the binding area B1 of the support layer 30 and the display substrate 10.

[0154] It should be noted that the specific thickness of the first adhesive substrate 41 can also be set with reference to the distance between the support layer 30 and the binding area B1 after the display substrate 10 is bent. To ensure that the first adhesive substrate 41 has sufficient support strength for the area where the driver chip 20 is located, and that the two first adhesive layers 42 have sufficient bonding strength to the support layer 30 and the binding area B1, respectively, the thickness of the first adhesive substrate 41 is set to be slightly less than 0.08 mm or slightly greater than 0.12 mm. For example, the thickness of the first adhesive substrate 41 is 0.07 mm, 0.13 mm, etc.

[0155] Optionally, the thickness of the second adhesive substrate 43 is less than or equal to 0.06 mm. By limiting the maximum thickness of the second adhesive substrate 43, the minimum thickness of the second adhesive layer 44 on the second adhesive substrate 43 is guaranteed. This in turn ensures the stability of the second adhesive layer 44's adhesion to the support layer 30 near the bending region B2 of the display substrate 10 and the binding region B1 of the display substrate 10 near the bending region B2, thereby ensuring the stability of the arc formed by the bending region B2 of the display substrate 10. For example, the thickness of the second adhesive substrate 43 can be 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, etc.

[0156] It should be noted that the specific thickness of the second adhesive substrate 43 can also be set with reference to the distance between the support layer 30 and the binding area B1 after the display substrate 10 is bent. While ensuring sufficient bonding strength between the two second adhesive layers 44 on the surface of the second adhesive substrate 43 and the support layer 30 and the binding area B1, the thickness of the second adhesive substrate 43 is set to be slightly greater than 0.06 mm. For example, the thickness of the second adhesive substrate 43 is 0.07 mm.

[0157] In the case where the adhesive layer 40 includes a first adhesive substrate 41 and a second adhesive substrate 43 , the distribution of the first adhesive substrate 41 and the second adhesive substrate 43 may be determined by referring to the size and shape of the binding area B1 of the display substrate 10 .

[0158] Optionally, as shown in FIG13 , the first bonding substrate 41 and the second bonding substrate 43 do not overlap in the direction of the rotation axis O of the bending region B2. For example, if the binding region B1 of the display substrate 10 is relatively large and has a square outer contour, both the first bonding substrate 41 and the second bonding substrate 43 can be square in structure, with the second bonding substrate 43 positioned closer to the bending region B2 and the first bonding substrate 41 positioned farther from the bending region B2.

[0159] Optionally, as shown in Figure 14 , the second adhesive substrate 43 has a U-shaped structure with its opening facing away from the bending region B2, and the first adhesive substrate 41 is positioned within the U-shaped groove formed by the second adhesive substrate 43. For example, if the binding region B1 of the display substrate 10 is relatively small and has a profiled outer contour, the second adhesive substrate 43 can be configured as a U-shaped structure with its opening facing away from the bending region B2, and the first adhesive substrate 41 can be configured as a square structure and positioned within the U-shaped groove of the second adhesive substrate 43.

[0160] Optionally, as shown in FIG15 , the second bonding substrate 43 has an annular structure, and at least a portion of the first bonding substrate 41 is located within the area enclosed by the second bonding substrate 43. For example, if the binding area B1 of the display substrate 10 is large and the outer contour does not define a structure, the second bonding substrate 43 can be configured as an annular structure, and the first bonding substrate 41 can be configured as a square structure and located within the area enclosed by the second bonding substrate 43.

[0161] It should be noted that, for the three aforementioned embodiments, as shown in FIG13 , FIG14 , or FIG15 , the width L3 of the second adhesive substrate 43 on the side of the first adhesive substrate 41 near the bending region B2 is greater than or equal to 2 mm and less than or equal to 5 mm. For example, the width L3 of the second adhesive substrate 43 on the side of the first adhesive substrate 41 near the bending region B2 is 2 mm, 3 mm, 4 mm, 5 mm, etc. In this way, while ensuring that the first adhesive substrate 41 provides better support for the area where the driver chip 20 is located, the stability of the second adhesive layer 44 on the surface of the second adhesive substrate 43 in bonding to the support layer 30 and the binding region B1 can be ensured, thereby ensuring the stability of the arc formed by the bending region B2 of the display substrate 10 after bending.

[0162] It should be noted that, for the latter two embodiments described above, as shown in FIG14 or FIG15 , the dimension L4 of the second adhesive substrate 43 on the side of the first adhesive substrate 41 in the direction of the rotation axis O of the bending region B2 is greater than or equal to 6 mm and less than or equal to 12 mm. For example, the dimension L4 of the second adhesive substrate 43 on the side of the first adhesive substrate 41 in the direction of the rotation axis O of the bending region B2 is 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, etc. This further increases the distribution range of the second adhesive substrate 43 and, in turn, the bonding area of ​​the second adhesive layer 44. This ensures that the first adhesive substrate 41 provides better support for the area where the driver chip 20 is located, while also ensuring the stability of the second adhesive layer 44 on the surface of the second adhesive substrate 43 in bonding to the support layer 30 and the binding region B1, thereby ensuring the stability of the arc formed by the bending region B2 of the display substrate 10 after bending.

[0163] The present disclosure also provides a method for manufacturing a display panel, which is used to manufacture the display panel described in the above embodiment. As shown in FIG16 , the method includes the following steps: S110 to S150 .

[0164] Step S110 , providing a display substrate, wherein the display panel has a display area and a non-display area located outside the display area, wherein the non-display area includes a binding area and a bending area, and the bending area connects the display area and the binding area.

[0165] Step S120 : Binding a driver chip on a side close to the light emitting surface of the display substrate, wherein the orthographic projection of the driver chip on the display substrate is located in the binding area.

[0166] Step S130 : disposing a support layer on a side away from the light-emitting surface of the display substrate, wherein the orthographic projection of the support layer on the display substrate at least overlaps with the display area.

[0167] Step S140: providing an adhesive layer, the adhesive layer comprising a first adhesive substrate and first adhesive layers located on both surfaces of the first adhesive substrate, the elastic modulus of the first adhesive substrate being greater than or equal to 1011 Pa.

[0168] Step S150: providing an adhesive layer on the side of the supporting layer away from the display substrate, and bending the bending area of ​​the display substrate so that the binding area is located on the side away from the light-emitting surface of the display substrate, and the driving chip is located on the side of the binding area away from the display area. At the same time, the two first adhesive layers on the surface of the first adhesive substrate are respectively bonded to the supporting layer and the binding area of ​​the display substrate, and the orthographic projection of the first adhesive substrate in the display area at least covers the orthographic projection of the driving chip in the display area.

[0169] In the embodiment of the present disclosure, the display panel manufactured through the above steps S110 to S150 can ensure that the orthographic projection of the first adhesive substrate in the display area at least covers the orthographic projection of the driver chip in the display area, thereby providing a larger elastic modulus in the area where the driver chip is located through the first adhesive substrate, thereby improving the impact resistance of the display panel in the area where the driver chip is located, and extending the service life of the display panel on the basis of improving the structural strength of the display panel.

[0170] In step S110, the method for manufacturing the display substrate can refer to related technologies. It is sufficient to ensure that the display substrate has a display area and a non-display area, that the display area has pixels for displaying an image, and that the non-display area has a binding area and a bending area. Furthermore, the display area can also have a first display sub-area and a second display sub-area, as described in the above embodiment, and a folding area located between the first display sub-area and the second display sub-area.

[0171] In the above step S120, the driver chip may include a driver element for driving the display area to display an image, such as a data driver circuit, etc. The driver chip can be fixed by adhesive glue on both sides to improve the stability of the driver chip fixation and reduce the damage to the driver chip when external force acts on the area where the driver chip is located on the display substrate.

[0172] In the above step S130, the specific structure of the support layer can be referred to the above embodiment, and will not be described in detail in the present embodiment. The manufacturing process of the support layer on the side away from the light emitting surface of the display substrate can be referred to the relevant technology.

[0173] In the above step S140 , the method for manufacturing the adhesive layer may refer to the above embodiment, and step S140 may be performed before any one of step S110 , step S120 , and step S130 .

[0174] Optionally, the method for manufacturing the adhesive layer includes: providing a base substrate and etching it to obtain a first adhesive substrate; providing an adhesive substrate and die-cutting it to obtain a first adhesive layer, the size of the first adhesive layer being smaller than the size of the first adhesive substrate; bonding the first adhesive layer to both side surfaces of the first adhesive substrate through a transfer process, and the edge of the first adhesive substrate protruding from the first adhesive layer.

[0175] Optionally, the method for manufacturing the adhesive layer includes: providing a base substrate and an adhesive substrate; bonding the adhesive substrate to both side surfaces of the base substrate; and simultaneously cutting the adhesive substrate and the first base substrate by laser cutting or punching to obtain an adhesive layer including the first adhesive substrate and the first adhesive layer, wherein the edge of the first adhesive substrate is aligned with the edge of the first adhesive layer.

[0176] In step S150 , when bonding the support layer and the binding area of ​​the display substrate to each other through the adhesive layer, the orthographic projection of the first adhesive substrate in the display area at least covers the orthographic projection of the driver chip in the display area.

[0177] It should be noted that although the steps of the method for manufacturing a display panel in the present disclosure are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in this specific order, or that all steps must be performed to achieve the desired results. Additionally or alternatively, certain steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps.

[0178] The present disclosure also provides a display device including the display panel described in the above embodiment. Combined with the display panel described in the above embodiment, the display device including the display panel can ensure the structural strength of the display device and improve the service life of the display device.

[0179] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A display panel, characterized in that, Comprising: A display substrate having a display area and a non-display area located at the periphery of the display area. The non-display area includes a bonding area and a bending area, and the bending area connects the display area and the bonding area; A driving chip, the orthographic projection of which on the display substrate is located in the bonding area; A support layer located on one side of the light-emitting surface facing away from the display substrate, and the orthographic projection of which on the display substrate at least coincides with the display area; The adhesive layer is located on the side of the support layer facing away from the display substrate, and includes a first adhesive substrate and first adhesive layers located on two surfaces of the first adhesive substrate, and the elastic modulus of the first adhesive substrate is greater than or equal to 10 11 Pa; After the bending area is bent, the bonding area is located on the side of the light-emitting surface facing away from the display substrate, and the driving chip is located on the side of the bonding area facing away from the display area. Two first adhesive layers are respectively bonded to the support layer and the bonding area of the display substrate, and the orthographic projection of the first bonding substrate in the display area at least covers the orthographic projection of the driving chip in the display area.

2. The display panel according to claim 1, wherein The adhesive layer further includes a second bonding substrate and second adhesive layers located on two surfaces of the second bonding substrate; The thickness of the second bonding substrate is less than the thickness of the first bonding substrate, and the second bonding substrate is located on the side of the first bonding substrate close to the bending area. After the bending area is bent, the two second adhesive layers are respectively bonded to the support layer and the bonding area of the display substrate.

3. The display panel according to claim 2, wherein There is no overlapping area between the first bonding substrate and the second bonding substrate in the rotation axis direction of the bending area.

4. The display panel according to claim 2, wherein, The second bonding substrate has a U-shaped structure with an opening facing away from the bending area, and the first bonding substrate is located in the U-shaped groove surrounded by the second bonding substrate.

5. The display panel according to claim 2, wherein The second bonding substrate has an annular structure, and at least a part of the first bonding substrate is located in the area surrounded by the second bonding substrate.

6. The display panel according to any one of claims 3-5, characterized in that, The width of the second bonding substrate on the side of the first bonding substrate close to the bending area is greater than or equal to 2 mm and less than or equal to 5 mm.

7. The display panel according to claim 4 or 5, characterized in that, The dimension of the second bonding substrate on one side of the first bonding substrate in the rotation axis direction of the bending area is greater than or equal to 6 mm and less than or equal to 12 mm.

8. The display panel according to claim 1, wherein The adhesive layer further includes a second adhesive layer, and the second adhesive layer is located on the side of the first bonding substrate close to the bending area. After the bending area is bent, the second adhesive layer is respectively bonded to the support layer and the bonding area of the display substrate.

9. The display panel according to claim 1, wherein The adhesive layer is an integrated whole layer structure.

10. The display panel according to claim 9, characterized in that, The first bonding substrate has a thickened area and a thinned area; After the bending area is bent, the orthographic projection of the thickened area in the display area at least covers the orthographic projection of the driving chip in the display area, and the thinned area is located on the side of the thickened area close to the bending area.

11. The display panel according to claim 10, wherein, There is no overlapping area between the thinned area and the thickened area in the rotation axis direction of the bending area.

12. The display panel according to claim 10, characterized in that, The thinned area has a U-shaped structure with an opening facing away from the bending area, and at least a part of the thickened area is located in the U-shaped groove surrounded by the thinned area.

13. The display panel according to claim 10, characterized in that, The thinned area has an annular structure, and the thickened area is located in the area surrounded by the thinned area.

14. The display panel according to any one of claims 10-13, characterized in that, The thickness of the first bonding substrate in the thickened area is greater than or equal to 0.08 mm.

15. The display panel according to any one of claims 10-13, characterized in that, The thickness of the first bonding substrate in the thinned area is less than or equal to 0.06 mm.

16. The display panel according to claim 1, wherein The edge of the first bonding substrate extends out of the first adhesive layer.

17. The display panel according to claim 16, wherein The extension dimension of the edge of the first bonding substrate is greater than or equal to 0.1 mm and less than or equal to 0.2 mm.

18. The display panel according to claim 1, wherein, The edge of the first bonding substrate is aligned with the edge of the first adhesive layer.

19. The display panel according to claim 18, wherein The edge of the first bonding substrate has a burr bent to one side, and the burr faces the support layer.

20. The display panel according to claim 1, characterized in that, The first bonding substrate is a metal substrate or a fiber substrate.

21. The display panel according to claim 1, wherein, Among the two first adhesive layers, the one close to the support layer is a conductive adhesive layer, and the one far from the support layer is a non-conductive adhesive layer.

22. The display panel according to claim 21, wherein The first bonding substrate is a non-conductive structure, and the bonding layer further includes a conductive layer on the side of the first bonding substrate close to the support layer.

23. The display panel according to claim 22, wherein, The thickness of the conductive layer is greater than or equal to 5 μm and less than or equal to 10 μm.

24. The display panel according to claim 1, characterized in that, The support layer includes a bend-resistant layer and a support substrate; The bend-resistant layer is located between the display substrate and the support substrate, and both surfaces of the bend-resistant layer have a third adhesive layer, and the two third adhesive layers are respectively bonded to the display area of the display substrate and the support substrate.

25. The display panel according to claim 1, characterized in that, The display area includes a first display sub-area and a second display sub-area, and a folding area located between the first display sub-area and the second display sub-area.

26. A manufacturing method of a display panel, characterized in that, The method includes: Providing a display substrate, the display panel having a display area and a non-display area located outside the display area, the non-display area including a bonding area and a bending area, and the bending area connecting the display area and the bonding area; Bonding a driving chip on one side close to the light-emitting surface of the display substrate, and the orthographic projection of the driving chip on the display substrate is located in the bonding area; Providing a support layer on one side facing away from the light-emitting surface of the display substrate, and the orthographic projection of the support layer on the display substrate at least coincides with the display area; Provide an adhesive layer, the adhesive layer includes a first adhesive substrate and first adhesive layers located on two surfaces of the first adhesive substrate, and the elastic modulus of the first adhesive substrate is greater than or equal to 10 11 Pa; Providing the bonding layer on the side of the support layer facing away from the display substrate, and bending the bending area of the display substrate so that the bonding area is located on the side away from the light-emitting surface of the display substrate, and the driving chip is located on the side of the bonding area facing away from the display area, and simultaneously bonding the two first adhesive layers on the surface of the first bonding substrate to the support layer and the bonding area of the display substrate respectively, and the orthographic projection of the first bonding substrate in the display area at least covers the orthographic projection of the driving chip in the display area.

27. The method according to claim 26, wherein The manufacturing method of the bonding layer includes: Providing a substrate substrate and performing etching to obtain the first bonding substrate; Providing an adhesive substrate and performing die-cutting to obtain the first adhesive layer, and the size of the first adhesive layer is smaller than the size of the first bonding substrate; Bonding the first adhesive layer on both side surfaces of the first bonding substrate by a transfer process, and the edge of the first bonding substrate extends out of the first adhesive layer.

28. The method according to claim 26, wherein, The manufacturing method of the bonding layer includes: Providing a substrate substrate and an adhesive substrate; Bonding the adhesive substrate on both side surfaces of the substrate substrate; Cut the bonding substrate and the first substrate simultaneously by laser cutting or stamping cutting to obtain a bonding layer including the first bonding substrate and the first adhesive layer, with the edges of the first bonding substrate aligned with the edges of the first adhesive layer.

29. A display device, characterized in that, A display panel according to any one of claims 1-25.

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