Light-emitting element package and display device using same

Abstract

The present invention is applicable to technical fields related to display devices, and for example, relates to a light-emitting element package and a display device using a light-emitting diode (LED). The present invention may include: a first layer having a terminal unit; a second layer positioned adjacent to the first layer and having a light-emitting unit including light-emitting elements constituting a unit subpixel; a third layer which emits light emitted from the light-emitting unit; and a fourth layer located between the second layer and the third layer and including a scattering unit which is located in a first area locally defining a position corresponding to at least a portion of the light emitting unit, and includes first filler particles.

Description

Light-emitting element package and display device using the same

[0001] The present invention is applicable to the technical field related to display devices, and relates to a light-emitting element package and a display device using an LED (Light Emitting Diode), for example.

[0002] In recent years, display devices with superior characteristics, such as thinness and flexibility, have been developed in the field of display technology. Currently, the major commercially available displays are represented by LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diode).

[0003] Meanwhile, a light-emitting diode (LED) is a semiconductor light-emitting device that is well known for converting electric current into light. Starting with the commercialization of a red LED using GaAsP compound semiconductors in 1962, it has been used as a light source for display images in electronic devices, including information and communication devices, along with green LEDs of the GaP:N series.

[0004] Recently, these light-emitting diodes (LEDs) have been gradually miniaturized and manufactured into micrometer-sized LEDs, which are used as pixels in display devices.

[0005] Compared to other display devices / panels, this type of LED technology boasts low power consumption, high brightness, and high reliability, and can be applied to flexible devices. Therefore, research institutes and companies have been actively researching this technology recently.

[0006] The LED display market is expanding into diverse applications that leverage the high brightness and high reliability of LEDs. Signage displays are leading the market with these characteristics.

[0007] In such displays, LEDs can be manufactured in a packaged form that can be used as unit pixels. When mini LEDs measuring millimeters are used, these LED packages typically include a support layer, typically comprising a sapphire substrate. This support layer can typically be relatively thicker than the light-emitting layer containing the LED.

[0008] Fig. 1 is a schematic diagram showing the viewing angle distribution in an example of a display device using a general light-emitting element. Fig. 2 is a schematic diagram showing another example of a display device using a general light-emitting element.

[0009] Referring to FIG. 1, in a display device (1) using a light source (20, 30, 40) that uses a light-emitting element such as a mini LED, the light sources (20, 30, 40) may be placed on a substrate (50), and an insulating layer (60) covering between the light sources (20, 30, 40) may be positioned.

[0010] When a difference in refractive index occurs between the substrate (20, 30, 40) such as sapphire and the material (60) surrounding the substrate, the light source (20, 30, 40) may have its optical path limited by the side, and thus the brightness of each light source (20, 30, 40) may change depending on the angle at which the user views it.

[0011] Referring to FIG. 1, the thicknesses of the light sources (20, 30, 40) that emit light of each color may be different from each other. For example, the thicknesses of the semiconductor layers (21, 31, 41) of the light sources (20, 30, 40) may be different from each other, and the thicknesses of the substrates (22, 32, 42) may also be different from each other.

[0012] In such cases, changes in the beam angle may occur depending on the difference in thickness of the substrates (22, 32, 42) and the difference in size of the semiconductor layers (21, 31, 41). For example, the thicker the substrates (22, 32, 42), the greater the amount of light emitted laterally, which may result in greater light loss.

[0013] To overcome this phenomenon, as illustrated in Fig. 2, a scattering layer (70) covering the substrate (22, 32, 42) of each light source (20, 30, 40) may be provided. This scattering layer (70) may include scattering particles.

[0014] Meanwhile, as shown in Fig. 3, a lens-shaped scattering layer (71) is also used on the substrate (22, 32, 42) of each light source (20, 30, 40).

[0015] In a light source (20, 30, 40) using a light-emitting element such as a mini LED, when light is emitted only from the flat surface of the light source (20, 30, 40), it has a Lambertian light characteristic in which the amount of light decreases smoothly depending on the angle.

[0016] However, in the case of LEDs, they have different directional angles depending on their various shape structures, and each RGB LED with a different material composition cannot help but have structural differences such as different side shapes.

[0017] Even in light sources in the form of light-emitting element packages including micro LEDs, the angle of light emitted outside the light source in the form of light-emitting element packages may differ for each light source (20, 30, 40) depending on the structure of the electrode pads of the micro LED, the semiconductor layer, and the surrounding structure surrounding the micro LED. This causes a problem in that the color temperature of the display varies depending on the angle at which the viewer views it.

[0018] In addition, when a scattering layer (70, 71) is applied, the directivity characteristics can be improved as the light emitted from each light source (20, 30, 40) is diffracted and scattered by the scattering particles in the scattering layer.

[0019] However, in this process, diffraction may be aggravated, resulting in reflected light and reduced light efficiency.

[0020] Since the beam angles of each light source (20, 30, 40) are different, the required degree of scattering also varies. Accordingly, the type and concentration of scattering particles in the scattering layer can be selected and applied based on the light source whose beam angle characteristics differ significantly from the Lambertian light emission shape. In this case, other light sources with relatively gentle beam angles may experience an unnecessary reduction in efficiency due to excessive scattering conditions.

[0021] Accordingly, a difference in luminous efficiency may occur, as exemplarily illustrated in Fig. 4. In Fig. 4, the horizontal axis represents the viewing angle and the vertical axis represents the relative luminosity.

[0022] Therefore, a solution to these problems is required.

[0023] The present invention aims to provide a light-emitting element package capable of minimizing changes in color temperature due to changes in the viewing angle of a display, and a display device using the same.

[0024] Meanwhile, it is intended to provide a light-emitting element package capable of improving light efficiency and a display device using the same.

[0025] Meanwhile, it is intended to provide a light-emitting element package capable of individually improving light efficiency according to the orientation angle characteristics of the light-emitting element and a display device using the same.

[0026] Furthermore, those skilled in the art will understand from the full intent of the specification and drawings that, according to other embodiments of the present invention, there may be additional technical problems not mentioned herein.

[0027] As a first viewpoint for achieving the above object, the present invention can be configured to include a first layer having a terminal portion; a second layer having a light-emitting portion adjacent to the first layer and including light-emitting elements forming a unit subpixel; a third layer emitting light emitted from the light-emitting portion; and a fourth layer located between the second layer and the third layer, the fourth layer being located within a first region locally defining a position corresponding to at least a portion of the light-emitting portion, and including a scattering portion including first filler particles.

[0028] As an exemplary embodiment, the first region may correspond to a position of at least one of the light-emitting elements.

[0029] As an exemplary embodiment, the fourth layer may further include a second region at least partially overlapping the first region and including second filler particles.

[0030] As an exemplary embodiment, the refractive index of the first filler particle may be different from the refractive index of the second filler particle.

[0031] As an exemplary embodiment, the first-first region may further include a first-first region positioned adjacent to the first region and including third filler particles.

[0032] As an exemplary embodiment, the fourth layer may include a transparent layer forming the first region.

[0033] As an exemplary embodiment, the first region may further include a pillar portion positioned at a position overlapping the light-emitting element.

[0034] As an exemplary embodiment, the pillar portion may include a first pillar portion positioned on the first light-emitting element; and a second pillar portion positioned on the second light-emitting element.

[0035] As an exemplary embodiment, the sizes of the first pillar portion and the second pillar portion may be different from each other.

[0036] As an exemplary embodiment, the light emitting element may include a coating layer comprising fourth filler particles.

[0037] As an exemplary embodiment, the device may further include a connecting electrode positioned between the first layer and the second layer to selectively connect the light-emitting elements and the terminal portion.

[0038] As an exemplary embodiment, the scattering portion may include a transparent insulating layer in which the first filler particles are dispersed.

[0039] As an exemplary embodiment, at least one of the light-emitting elements may include a semiconductor layer; and a scattering structure positioned on the semiconductor layer and having a rough surface formed at an interface facing the semiconductor layer.

[0040] As an exemplary embodiment, the scattering structure may include a fifth filler particle.

[0041] As a second viewpoint for achieving the above object, the present invention can be configured to include a support layer having a terminal portion; a light-emitting layer having a light-emitting portion positioned adjacent to the support layer and including light-emitting elements forming a unit subpixel; a transmission layer through which light emitted from the light-emitting portion is emitted; and a scattering layer positioned between the light-emitting layer and the transmission layer, the scattering portion being positioned at a position corresponding to at least a portion of the light-emitting portion and including a first filler particle.

[0042] As an exemplary embodiment, the scattering portion may be located in a first region locally defined within the scattering layer.

[0043] As an exemplary embodiment, the first region may correspond to a position of at least one of the light-emitting elements.

[0044] As an exemplary embodiment, the scattering layer may further include a second region at least partially overlapping the first region and including second filler particles.

[0045] As an exemplary embodiment, a light extraction unit having a rough surface may be provided on the end side of the scattering layer.

[0046] As a third aspect for achieving the above object, the present invention provides a display device including a light-emitting element package defining individual pixels, wherein the light-emitting element package may be configured to include a second layer positioned adjacent to the first layer and having a light-emitting portion including light-emitting elements forming unit subpixels; a third layer through which light emitted from the light-emitting portion is emitted; and a fourth layer positioned between the second layer and the third layer, and including a scattering portion including first filler particles, the fourth layer being positioned within a first region locally defining a position corresponding to at least a portion of the light-emitting portion.

[0047] According to one embodiment of the present invention, the following effects are achieved.

[0048] First, it can minimize changes in color temperature due to changes in viewing angle, thereby improving light efficiency.

[0049] Meanwhile, the light efficiency can be individually improved depending on the orientation angle characteristics of the light-emitting element.

[0050] Furthermore, according to another embodiment of the present invention, there are additional technical effects not mentioned herein. Those skilled in the art will understand the full scope of the specification and drawings.

[0051] Figure 1 is a schematic diagram showing the viewing angle distribution in an example of a display device using a general light-emitting element.

[0052] Figure 2 is a schematic diagram showing another example of a display device using a general light-emitting element.

[0053] Figure 3 is a schematic diagram showing another example of a display device using a general light-emitting element.

[0054] Figure 4 is a graph showing the difference in luminous efficiency according to the light-emitting element.

[0055] Fig. 5 is a plan view showing a light emitting element package according to the first embodiment of the present invention.

[0056] Figure 6 is a cross-sectional view taken along line A-A' of Figure 5.

[0057] Fig. 7 is a plan view showing a modified example of a light emitting element package according to the first embodiment of the present invention.

[0058] Fig. 8 is a cross-sectional view showing a modified example of a light emitting element package according to the first embodiment of the present invention.

[0059] FIGS. 9 to 13 are plan views showing other modified examples of the light emitting element package according to the first embodiment of the present invention.

[0060] Fig. 14 is a plan view of a light emitting element package according to a second embodiment of the present invention.

[0061] Fig. 15 is a cross-sectional view of a light emitting device package according to a second embodiment of the present invention.

[0062] FIG. 16 and FIG. 17 are plan views showing other modified examples of a light emitting device package according to the second embodiment of the present invention.

[0063] Fig. 18 is a plan view of a light emitting device package according to a third embodiment of the present invention.

[0064] Fig. 19 is a cross-sectional view of a light emitting device package according to a third embodiment of the present invention.

[0065] FIG. 20 and FIG. 21 are plan views showing other modified examples of a light emitting device package according to the third embodiment of the present invention.

[0066] Fig. 22 is a plan view of a light emitting element package according to the fourth embodiment of the present invention.

[0067] Fig. 23 is a cross-sectional view of a light emitting device package according to a fourth embodiment of the present invention.

[0068] FIG. 24 and FIG. 25 are plan views showing other modified examples of a light emitting device package according to the fourth embodiment of the present invention.

[0069] Fig. 26 is a cross-sectional view of a light emitting device package according to the fifth embodiment of the present invention.

[0070] Figures 27 to 29 are cross-sectional views showing a light emitting element of a light emitting element package according to the fifth embodiment of the present invention.

[0071] Fig. 30 is a plan view showing a modified example of a light emitting element package according to the fifth embodiment of the present invention.

[0072] Fig. 31 is a plan view of a light emitting element package according to the sixth embodiment of the present invention.

[0073] Fig. 32 is a cross-sectional view of a light emitting device package according to the sixth embodiment of the present invention.

[0074] Figure 32 shows a cross-section taken along line B-B' of Figure 31.

[0075] Figures 33 to 35 are cross-sectional views briefly showing the manufacturing process of the light extraction part of the light emitting element package according to the sixth embodiment of the present invention.

[0076] Fig. 36 is a cross-sectional schematic diagram showing a display device using a light-emitting element package according to the first embodiment of the present invention.

[0077] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably only for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. In addition, when describing the embodiments disclosed in this specification, if it is determined that a specific description of a related known technology may obscure the gist of the embodiments disclosed in this specification, a detailed description thereof will be omitted. In addition, it should be noted that the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical ideas disclosed in this specification by the attached drawings.

[0078] Furthermore, for the convenience of explanation, each drawing is described, but it is also within the scope of the present invention for a person skilled in the art to implement another embodiment by combining at least two drawings.

[0079] Additionally, when an element such as a layer, region or substrate is referred to as existing "on" another element, it will be understood that this may be directly on the other element, or that there may be intermediate elements in between.

[0080] The semiconductor light-emitting device mentioned in the specification includes LEDs, micro LEDs, etc., and may be used interchangeably.

[0081]

[0082] Fig. 5 is a plan view showing a light emitting device package according to the first embodiment of the present invention. Fig. 6 is a cross-sectional view taken along line A-A' of Fig. 5.

[0083] Referring to FIGS. 5 and 6, a light-emitting device package (200) of a bottom emission type in which light is emitted in a downward direction is shown.

[0084] A light-emitting device package (200) according to the first embodiment may be configured to include a first layer (210; support layer) having terminal portions (211, 212, 213, 214), a second layer (220; light-emitting layer) positioned adjacent to the first layer (210) and including light-emitting devices (261, 262, 263; 260) forming unit subpixels, a third layer (230; transmissive layer) through which light emitted from the light-emitting portion (260) passes, and a fourth layer (240; scattering layer) positioned within a first region (R1) that locally defines a position corresponding to at least a portion of the light-emitting portion (260) and including a scattering portion (242) including filler particles (first filler particles; 243).

[0085] For example, a light-emitting element package (200) according to the first embodiment may include a light-emitting layer (230), a scattering layer (240) provided with a scattering portion (242) that is positioned on the light-emitting layer (230) and scatters light emitted from a light-emitting portion (260), a light-emitting layer (220) provided with a light-emitting portion (260) that includes light-emitting elements (261, 262, 263) that form unit subpixels, and a support layer (210) provided with terminal portions (211, 212, 213, 214) that is positioned on the light-emitting layer (220).

[0086] Here, the refractive index of the first filler particle may be 1.3 or more.

[0087] For example, these first filler particles (243) may include a plurality of particles having sizes in the nanometer (nm) or micrometer (㎛) units.

[0088] For example, the first filler particle (243) may include at least one of TiO2, ZnO2, ZrO2, MgF2, SnO2, ITO, SiNx, Silica, and PMMA.

[0089] The first filler particle (243) can be used for at least one of the purposes of improving the viewing angle and improving reflectivity to prevent color temperature deviation according to the light emission angle of the light emitting portion (260) in the second layer (220).

[0090] The scattering portion (242) may include a transparent insulating layer. For example, at least one of the first layer (210) to the fourth layer (240) may be formed of at least one material among acrylic, epoxy, silicone, Teflon, silicone acrylic, and silicone epoxy composites.

[0091] For example, the scattering part (242) may be provided with the first filler particles (243) dispersed using such a material as a binder.

[0092] For example, the refractive index of the transparent insulating layer forming at least one of the first layer (210) to the fourth layer (240) may be 1.5 or less. In addition, the refractive index of any one of the first filler particles (243) may be 1.6 or more. For example, the first filler particles (243) may include at least one of TiO2, ZnO2, and ZrO2.

[0093] As an exemplary embodiment, the first region (R1) may correspond to a position of at least one of the light emitting elements (261, 262, 263). In the present embodiment, the first region (R1) may correspond to a region including all of the light emitting elements (261, 262, 263). In this case, the density of the first filler particles (243) may vary within the first region (R1). For example, a higher density of first filler particles (243) may be distributed at a position corresponding to a light emitting element requiring a higher scattering degree. As another example, a first filler particle (243) having a higher refractive index may be distributed at a position corresponding to a light emitting element requiring a higher scattering degree.

[0094] For example, a portion of the scattering layer (240) corresponding to each light-emitting element (261, 262, 263) may be applied with one of different filler particles (243), concentrations, thicknesses, and areas depending on the characteristics of each light-emitting element (261, 262, 263). Specific examples thereof will be described later for each embodiment.

[0095] Referring to FIG. 6, the fourth layer (240) forming the scattering layer may include a transparent layer (241) forming a first region (R1). For example, the entire scattering layer (240) may be formed of a transparent material. The scattering layer (240) may be provided with a first region (R1) at a position corresponding to at least one of the light-emitting elements (261, 262, 263). The first region (R1) may be an area excluding the edge side of the scattering layer (240). For example, the scattering layer (240) may include the first region (R1) at a position excluding the edge side.

[0096] Between the first layer (210) and the second layer (220), connecting electrodes (271, 272, 273, 274) that selectively connect the light-emitting elements (261, 262, 263; 260) and the terminal portions (211, 212, 213, 214) may be provided. The terminal portions (211, 212, 213, 214) may be located on the upper surface of the first layer (210).

[0097] The first electrode (e.g., P-electrode; 264) and the second electrode (e.g., N-electrode; 265) of the light emitting element (261, 262, 263; 260) can be electrically connected to the first connecting electrode (272) and the second connecting electrode (274), respectively, by solder.

[0098] At least one of these connecting electrodes (271, 272, 273, 274) can be manufactured using a redistribution layer (RDL) process used in a semiconductor packaging process. Using this layer redistribution (RDL) process, the light-emitting elements (260) can be connected to the connecting electrodes (271, 272, 273, 274).

[0099] The light-emitting element (260) may include a first light-emitting element (261), a second light-emitting element (262), and a third light-emitting element (263) (see FIG. 5). For example, the first light-emitting element (261) may be a red light-emitting element (R), the second light-emitting element (262) may be a green light-emitting element (G), and the third light-emitting element (263) may be a blue light-emitting element (B). In some cases, at least one of the first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may include two or more light-emitting elements.

[0100] When the light-emitting element package (200) is used in a display device, each of the first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may correspond to an individual subpixel. The first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may together constitute a unit pixel.

[0101] The light emitting element (260) may be a mini LED having a size in millimeters or a micro LED having a size in micrometers.

[0102] Although not shown, the light emitting element package (200) may further include a driving element that drives the light emitting elements (261, 262, 263; 260). The driving element may be a micro driver integrated circuit chip (Driver IC) that can selectively drive the light emitting elements (260). In this case, the driving element may be connected to at least one of the light emitting elements (261, 262, 263) and the connection electrodes (271, 272, 273, 274). A detailed description thereof will be omitted.

[0103] As light-emitting elements (261, 262, 263) such as micro LEDs become smaller in overall size, the side emission amount has a significant proportion compared to the front emission amount. In order to change the light path of the side emission amount of the light-emitting elements (261, 262, 263) toward the front, the angle of incidence of light can be controlled by changing the shape and side angle of the micro LED chip.

[0104] In addition, by applying a scattering layer (240) including the first filler particles (231) as described above, light emitted from the light-emitting elements (261, 262, 263; 260) is scattered in the scattering portion (242) including the first filler particles (243), thereby minimizing changes in color temperature according to changes in the viewing angle when viewing the display.

[0105] Since the beam angle is different for each light emitting element (261, 262, 263; 260), the required degree of scattering may also be different. Accordingly, when selecting and applying the type and concentration of scattering particles in the scattering layer based on a light source whose beam angle characteristics are significantly different from the Lambertian light emission shape, excessive scattering conditions may cause an unnecessary reduction in efficiency in other light emitting elements with relatively gentle beam angles.

[0106] However, according to an embodiment of the present invention, one of different filler particles (243), concentration, thickness, and area may be applied to at least some of the light emitting elements (261, 262, 263) depending on the characteristics of each light emitting element (261, 262, 263).

[0107] For example, for a red light emitting element (261) having a relatively non-uniform viewing angle, one of filler particles (243) having a higher refractive index and scattering portions (242) having a larger concentration, thickness, and area can be applied.

[0108] Accordingly, the difference in light distribution according to the viewing angle in the light emitting element package (200) can be compensated, and in addition, the light efficiency can be improved.

[0109] For example, when using a light-emitting element (260) such as a micro LED, light loss due to side emission due to a thinner thickness compared to a mini LED can be minimized.

[0110] Fig. 7 is a plan view showing a modified example of a light emitting device package according to the first embodiment of the present invention. Fig. 8 is a cross-sectional view showing a modified example of a light emitting device package according to the first embodiment of the present invention.

[0111] Referring to FIGS. 7 and 8, in the light-emitting element package (201) according to the modified example, the first region (R1) described above may be limited to a position corresponding to one light-emitting element. Hereinafter, such region will be referred to as a 1-1 region (R1-1). For example, as illustrated, a scattering portion (244) including a first scattering particle (243) may be provided in the 1-1 region (R1-1) corresponding to the position of one light-emitting element.

[0112] As described above, for example, a scattering portion (244) including a first scattering particle (243) may be provided in a first region (R1-1) corresponding to a position of a red light-emitting element (261) having a relatively uneven viewing angle. For example, the first region (R1-1) may be formed at a position facing the red light-emitting element (261) and having a size substantially corresponding to the red light-emitting element (261). Here, substantially may mean a size larger than the red light-emitting element (261) but not overlapping with a neighboring light-emitting element.

[0113] FIGS. 9 to 13 are plan views showing other modified examples of the light emitting element package according to the first embodiment of the present invention.

[0114] Fig. 9 shows an example in which a 1-1 region (R1-1) is positioned at a position corresponding to a blue light-emitting element (263), and a scattering portion (244a) including a first scattering particle (243) is positioned in this 1-1 region (R1-1).

[0115] Fig. 10 shows an example in which a 1-1 region (R1-1) is positioned at a position corresponding to a green light-emitting element (262), and a scattering portion (244b) including a first scattering particle (243) is positioned in this 1-1 region (R1-1).

[0116] Fig. 11 shows an example in which a first-second region (R1-2) is positioned at positions corresponding to a blue light-emitting element (263) and a green light-emitting element (262), and a scattering portion (244c) including a first scattering particle (243) is positioned in this first-second region (R1-2). For convenience of explanation, the region corresponding to the two light-emitting elements will be referred to as a first-second region (R1-2).

[0117] Fig. 12 shows an example in which a first-second region (R1-2) is positioned at a position corresponding to a blue light-emitting element (263) and a red light-emitting element (261), and a scattering portion (244d) including a first scattering particle (243) is positioned in this first-second region (R1-2).

[0118] Fig. 13 shows an example in which a first-first region (R1-1) is positioned at a position corresponding to a red light-emitting element (261) and a green light-emitting element (262), and a scattering portion (244, 244e) including a first scattering particle (243) is positioned in each of the first-first regions (R1-1).

[0119] As described above, at least one of the refractive index and density (concentration) of the first scattering particles (243) included in each scattering portion (244, 244a, 244b, 244c, 244d, 244e) may be different from each other. In addition, at least one of the size and thickness of each scattering portion (244, 244a, 244b, 244c, 244d, 244e) may be different from each other.

[0120] Anything not described above can be equally applied to the description of the first embodiment described above. Therefore, any redundant description will be omitted.

[0121]

[0122] Fig. 14 is a plan view of a light-emitting device package according to a second embodiment of the present invention. Fig. 15 is a cross-sectional view of a light-emitting device package according to a second embodiment of the present invention.

[0123] A light-emitting element package (202) according to a second embodiment may be configured to include a first layer (210; support layer) having terminal portions (211, 212, 213, 214), a second layer (220; light-emitting layer) positioned adjacent to the first layer (210) and including light-emitting elements (261, 262, 263; 260) forming unit subpixels, a third layer (230; transmissive layer) through which light emitted from the light-emitting portion (260) passes, and a fourth layer (240; scattering layer) positioned within a first region (R1) that locally defines a position corresponding to at least a portion of the light-emitting portion (260) and including a scattering portion (242) including filler particles (first filler particles; 243a).

[0124] For example, a light-emitting element package (200) according to the second embodiment may include a light-emitting layer (230), a scattering layer (240) provided with a scattering portion (242) that is positioned on the light-emitting layer (230) and scatters light emitted from a light-emitting portion (260), a light-emitting layer (220) provided with a light-emitting portion (260) that includes light-emitting elements (261, 262, 263) that form unit subpixels, and a support layer (210) provided with terminal portions (211, 212, 213, 214) that is positioned on the light-emitting layer (220).

[0125] Here, the scattering layer (240) may further include a second region (245) that overlaps at least partly with the first region (R1) and includes second filler particles (243).

[0126] As an exemplary embodiment, the refractive index of the first filler particle (243a) may be different from the refractive index of the second filler particle (243).

[0127] At least one of the first filler particles (243a) and the second filler particles (243) may include at least one of a metal oxide, a resin particle, and an inorganic oxide. For example, at least one of the first filler particles (243a) and the second filler particles (243) may include at least one of TiO2, ZnO2, ZrO2, MgF2, SnO2, ITO, SiNx, Silica, and PMMA.

[0128] Meanwhile, the refractive index of the first filler particle (243a) may be the same as the refractive index of the second filler particle (243). For example, when an additional scattering portion (245) corresponding to the second region (245) is positioned at a position corresponding to the red light-emitting element (261), the density of the filler particles (243, 243a) in the second region (245) may substantially increase.

[0129] As an exemplary embodiment, the second region (R2) may correspond to the position of any one of the light emitting elements (261, 262, 263). In the present embodiment, the first region (R1) may correspond to an area including all of the light emitting elements (261, 262, 263).

[0130] Referring to FIG. 14, the fourth layer (240) forming the scattering layer may include a transparent layer (241) forming a first region (R1). For example, the entire scattering layer (240) may be formed of a transparent material. The scattering layer (240) may be provided with a first region (R1) at a position corresponding to at least one of the light-emitting elements (261, 262, 263). In addition, a second region (R2) may be positioned at least partially overlapping the first region (R1) and including second filler particles (243).

[0131] FIG. 16 and FIG. 17 are plan views showing other modified examples of a light emitting device package according to the second embodiment of the present invention.

[0132] Referring to FIG. 16, an example is shown in which a second region (R2) that overlaps at least a portion of a first region (R1) and includes a second filler particle (243) is positioned at the position of a green light-emitting element (262) (245a).

[0133] Referring to FIG. 17, an example is shown in which a second region (R2) that overlaps at least partly with a first region (R1) and includes second filler particles (243) is positioned at the position of a blue light-emitting element (262) (245b).

[0134] Anything not described above can be equally applied to the description of the first embodiment and its variants described above. Therefore, any redundant description will be omitted.

[0135]

[0136] Fig. 18 is a plan view of a light-emitting device package according to a third embodiment of the present invention. Fig. 19 is a cross-sectional view of a light-emitting device package according to a third embodiment of the present invention.

[0137] A light-emitting device package (203) according to a third embodiment may be configured to include a first layer (210; support layer) having terminal portions (211, 212, 213, 214), a second layer (220; light-emitting layer) positioned adjacent to the first layer (210) and including light-emitting devices (261, 262, 263; 260) forming a unit subpixel, a third layer (230; transmissive layer) through which light emitted from the light-emitting portion (260) passes, and a fourth layer (240; scattering layer) positioned within a first-first region (R1-1) that locally defines positions corresponding to at least two or more light-emitting devices among the light-emitting portions (260) and including a plurality of scattering portions (244, 245a, 245b) including filler particles (first filler particles; 243).

[0138] Referring to Fig. 18, it shows a configuration in which three scattering parts (244, 245a, 245b) having a first-first region (R1-1) are independently positioned corresponding to the positions of each light-emitting element (261, 262, 263).

[0139] In this way, three scattering parts (244, 245a, 245b) having the first-first region (R1-1) may include filler particles (243). At this time, at least two or more scattering parts (244, 245a, 245b) may include filler particles (243) having different refractive indices or different densities.

[0140] FIG. 20 and FIG. 21 are plan views showing other modified examples of a light emitting device package according to the third embodiment of the present invention.

[0141] Figure 20 shows a state in which scattering parts (244, 245a) are positioned at the positions of the red light-emitting element (261) and the green light-emitting element (262), respectively.

[0142] Meanwhile, Fig. 21 shows a state in which scattering parts (244, 245b) are positioned at the positions of the red light-emitting element (261) and the blue light-emitting element (263), respectively.

[0143] Anything not described above can be equally applied to the descriptions of the first embodiment, the second embodiment, and their variations described above. Therefore, any redundant descriptions will be omitted.

[0144]

[0145] Fig. 22 is a plan view of a light-emitting device package according to a fourth embodiment of the present invention. Fig. 23 is a cross-sectional view of a light-emitting device package according to a fourth embodiment of the present invention.

[0146] A light-emitting element package (204) according to the fourth embodiment may be configured to include a first layer (210; support layer) having terminal portions (211, 212, 213, 214), a second layer (220; light-emitting layer) positioned adjacent to the first layer (210) and including light-emitting elements (261, 262, 263; 260) forming a unit subpixel, a third layer (230; transmissive layer) through which light emitted from the light-emitting portion (260) passes, and a fourth layer (240; scattering layer) positioned at a position corresponding to at least one light-emitting element among the light-emitting portions (260) and including a scattering portion (242) including filler particles (first filler particles; 243).

[0147] Referring to Fig. 22, the fourth layer (240) forming the scattering layer may include a transparent layer (241) forming a plurality of pillar portions (241a). For example, the entire scattering layer (240) may be formed of a transparent material.

[0148] In this embodiment, a pillar portion (241a) positioned at a position overlapping the light-emitting elements (261, 262, 263) may be provided. Since this pillar portion (241a) is formed transparently like the transparent layer (241), light emitted from the light-emitting elements (261, 262, 263) can be transmitted as is through this pillar portion (241a).

[0149] However, the light emitted from the light emitting elements (261, 262, 263) can be scattered and emitted to the outside through the remaining area of ​​the scattering portion (242) corresponding to the size of the first region (R1) described above.

[0150] Referring to Fig. 23, a first columnar portion (241a) may be positioned at the position of a red light-emitting element (261), a second columnar portion (241c) may be positioned at the position of a green light-emitting element (263), and a third columnar portion (241b) may be positioned at the position of a blue light-emitting element (263). For example, each of these columnar portions (241a, 241b, 241c) may include filler particles (243) having at least one of different refractive indices and densities.

[0151] FIG. 24 and FIG. 25 are plan views showing other modified examples of a light emitting device package according to the fourth embodiment of the present invention.

[0152] Referring to FIGS. 24 and 25, as an exemplary embodiment, the sizes of each pillar portion (241a, 241b, 241c) may be different from each other.

[0153] For example, referring to Fig. 24, the size of the first pillar portion (241a) may be different from the sizes of the second pillar portion (241c) and the third pillar portion (241b). Accordingly, the area through which light emitted from the light-emitting elements (261, 262, 263) passes may vary.

[0154] As another example, referring to FIG. 25, the sizes of the first pillar portion (241a), the second pillar portion (241c), and the third pillar portion (241b) may be different from each other.

[0155] Anything not described above can be equally applied to the descriptions of the first to third embodiments and their variations described above. Therefore, any redundant descriptions will be omitted.

[0156]

[0157] Fig. 26 is a cross-sectional view of a light-emitting device package according to the fifth embodiment of the present invention. Figs. 27 to 29 are cross-sectional views showing a light-emitting device of a light-emitting device package according to the fifth embodiment of the present invention.

[0158] Referring to FIG. 26, a light-emitting device package (205) according to the fifth embodiment may be configured to include a first layer (210; support layer) having terminal portions (211, 212, 213, 214), a second layer (220; light-emitting layer) positioned adjacent to the first layer (210) and including light-emitting devices (261, 262, 263; 260) forming unit subpixels, a third layer (230; transmissive layer) through which light emitted from the light-emitting device (260) passes, and a scattering structure (2613, 2615) included in at least one of the light-emitting devices (261, 262, 263).

[0159] Referring to FIG. 27, at least one (261a) of these light-emitting elements (261, 262, 263) may include a semiconductor layer (2611) and a scattering structure (2613) positioned on the semiconductor layer (2611) and having a rough surface formed at a boundary surface (2612) facing the semiconductor layer (2611). A passivation layer (2614) may be positioned on the outside of the scattering structure (2613) and the semiconductor layer (2611).

[0160] In this way, depending on the embodiment, individual light emitting elements (261, 262, 263) may include a scattering structure (2613) without including a separate scattering layer.

[0161] Meanwhile, referring to FIG. 28, at least one (261b) of these light-emitting elements (261, 262, 263) may include a scattering structure (2615) including scattering particles (2616).

[0162] Referring to Fig. 29, these two types of scattering structures (2613, 2615) can be used together.

[0163] Such scattering structures (2613, 2615) may be formed during the process of transferring the light-emitting elements (261, 262, 263) during the manufacturing process of the light-emitting elements (261, 262, 263). For example, such scattering structures (2613, 2615) may be a polymer bonding layer that attaches a semiconductor layer (2611) formed on a growth substrate to a temporary substrate (not shown).

[0164] Referring again to FIG. 26, a scattering part (244) having the 1-1 region (R1-1) described above may be positioned in a scattering layer (240) corresponding to a light emitting element other than the light emitting element (261, 262, 263) having the scattering structure (2613, 2615).

[0165] Fig. 30 is a plan view showing a modified example of a light emitting element package according to the fifth embodiment of the present invention.

[0166] Referring to FIG. 30, a scattering member (242) including a pillar member (241b, 241c) described in the fourth embodiment may be used together with a light-emitting element (261, 262, 263) having such a scattering structure (2613, 2615).

[0167] For example, a red light-emitting element (261a) may be provided with a scattering structure (2613, 2615), a second pillar portion (241c) may be positioned at the position of the green light-emitting element (263), and a third pillar portion (241b) may be positioned at the position of the blue light-emitting element (263).

[0168] Anything not described above can be equally applied to the descriptions of the first through fourth embodiments and their variations described above. Therefore, any redundant descriptions will be omitted.

[0169]

[0170] Fig. 31 is a plan view of a light-emitting device package according to a sixth embodiment of the present invention. Fig. 32 is a cross-sectional view of a light-emitting device package according to a sixth embodiment of the present invention. Fig. 32 shows a cross-section taken along line B-B' of Fig. 31.

[0171] Referring to FIGS. 31 and 32, a light-emitting device package (200) according to the sixth embodiment is characterized by comprising a first layer (210; support layer) having terminal portions (211, 212, 213, 214), a second layer (220; light-emitting layer) positioned adjacent to the first layer (210) and including light-emitting elements (261, 262, 263; 260) forming unit subpixels, a third layer (230; transmissive layer) through which light emitted from the light-emitting portion (260) passes, and a scattering layer positioned between the light-emitting layer (220) and the transmissive layer (230), and including a scattering portion (242) including first filler particles (243) positioned at a position corresponding to at least a portion of the light-emitting portions (260).

[0172] As an exemplary embodiment, a coating layer (231) including fourth filler particles may be included on the light emitting element (261, 262, 263).

[0173] Referring to FIG. 32, the connecting electrodes (271a, 272a) may have a reflective cup shape that reflects light emitted from the light-emitting elements (261, 262, 263) toward the scattering layer (242).

[0174] As an exemplary embodiment, a light extraction portion (242b) having a rough surface may be provided on the end side of the scattering layer (242). At this time, the connecting electrodes (271a, 272a) may have a shape corresponding to the light extraction portion (242b).

[0175] Figures 33 to 35 are cross-sectional views briefly showing the manufacturing process of the light extraction part of the light emitting element package according to the sixth embodiment of the present invention.

[0176] When dry etching a layer including filler particles (243) in the state of Fig. 33, since the etching selectivity between the binder forming the layer and the filler particles (243) is different, a rough surface may be formed on the etched surface, as shown in Fig. 34. Fig. 35 is an enlarged view of part c of Fig. 34.

[0177] When metal is deposited on such a roughened surface to form a connecting electrode (271a, 272a), the reflectivity of the metal may be reduced. This may be due to increased light absorption by the medium due to the reflection path during the process of light scattering and multiple reflections on the rough surface. This reduction in reflectivity may help improve the contrast ratio of the display device.

[0178]

[0179] Fig. 36 is a cross-sectional schematic diagram showing a display device using a light-emitting element package according to the first embodiment of the present invention.

[0180] FIG. 36 shows an example of a display device (10) in which a light-emitting element package (200) according to the first embodiment described with reference to FIGS. 5 and 6 is used as a unit pixel.

[0181] Referring to FIG. 36, a display device (10) can be configured by arranging light emitting element packages (200) at regular intervals in a reversed state from FIG. 6 on a wiring substrate (100) including a substrate (110) on which a wiring electrode (120) is formed.

[0182] For example, the wiring electrodes (121, 122) and the terminal portions (211 to 214) of the light-emitting element package (202) can be electrically connected by the first wiring (123) and the second wiring (124).

[0183]

[0184] The above description is merely an example of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention.

[0185] Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of ​​the present invention but to explain it, and the scope of the technical idea of ​​the present invention is not limited by these embodiments.

[0186] The scope of protection of the present invention should be interpreted by the claims below, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

[0187] According to the present invention, a light-emitting device package using a light-emitting device and a display device using the same can be provided.

Claims

1. First layer equipped with terminal section; A second layer positioned adjacent to the first layer and having a light-emitting portion including light-emitting elements forming unit subpixels; A third layer from which light emitted from the above light-emitting portion is emitted; and A light-emitting device package characterized by comprising a fourth layer positioned between the second layer and the third layer, the fourth layer including a scattering portion including first filler particles, the scattering portion being positioned within a first region locally defining a position corresponding to at least a portion of the light-emitting portion.

2. A light-emitting element package according to claim 1, characterized in that the first region corresponds to the position of at least one light-emitting element among the light-emitting elements.

3. A light emitting device package according to claim 1, characterized in that the fourth layer further includes a second region at least partially overlapping the first region and including second filler particles.

4. A light emitting device package according to claim 3, characterized in that the refractive index of the first filler particle is different from the refractive index of the second filler particle.

5. A light emitting device package according to claim 1, characterized in that it further includes a 1-1 region positioned adjacent to the first region and including third filler particles.

6. A light emitting device package according to claim 1, characterized in that the fourth layer includes a transparent layer forming the first region.

7. A light-emitting element package according to claim 1, characterized in that it further includes a pillar portion positioned at a position overlapping the light-emitting element within the first region.

8. In paragraph 7, the pillar part, a first pillar portion positioned on the first light-emitting element; and A light-emitting element package characterized by including a second pillar portion positioned on a second light-emitting element.

9. A light emitting device package according to claim 8, characterized in that the sizes of the first pillar portion and the second pillar portion are different from each other.

10. A light-emitting device package according to claim 1, characterized in that the light-emitting device includes a coating layer including fourth filler particles.

11. A light-emitting element package according to claim 1, characterized in that it further comprises a connecting electrode positioned between the first layer and the second layer and selectively connecting the light-emitting elements and the terminal portion.

12. A light emitting device package according to claim 1, characterized in that the scattering portion includes a transparent insulating layer in which the first filler particles are dispersed.

13. In the first paragraph, at least one of the light-emitting elements, semiconductor layer; and A light-emitting device package characterized by including a scattering structure positioned on the semiconductor layer and having a rough surface formed at a boundary facing the semiconductor layer.

14. A light emitting device package according to claim 13, characterized in that the scattering structure includes fifth filler particles.

15. Support layer equipped with terminal portion; A light-emitting layer positioned adjacent to the support layer and having a light-emitting portion including light-emitting elements forming unit subpixels; A transparent layer through which light emitted from the above light-emitting portion is emitted; and A light-emitting device package characterized by comprising a scattering layer positioned between the light-emitting layer and the transparent layer, the scattering layer positioned at a position corresponding to at least a portion of the light-emitting portion and including a scattering portion including first filler particles.

16. A light emitting device package according to claim 15, characterized in that the scattering portion is located in a first region locally defined within the scattering layer.

17. A light-emitting element package according to claim 16, characterized in that the first region corresponds to the position of at least one light-emitting element among the light-emitting elements.

18. A light emitting device package according to claim 16, characterized in that the scattering layer further includes a second region at least partially overlapping the first region and including second filler particles.

19. A light emitting device package according to claim 15, characterized in that a light extraction part having a rough surface is provided on the short side of the scattering layer.

20. A display device including a light-emitting element package defining individual pixels, The above light emitting element package, A second layer positioned adjacent to the first layer and having a light-emitting portion including light-emitting elements forming unit subpixels; A third layer from which light emitted from the above light-emitting portion is emitted; and A display device characterized in that it comprises a fourth layer, which is positioned between the second layer and the third layer, and which includes a scattering portion including first filler particles, the scattering portion being positioned within a first region that locally defines a position corresponding to at least a portion of the light-emitting portion.

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