Electronic device comprising frame and manufacturing method therefor

Abstract

This electronic device comprises a display and a housing assembly, wherein the housing assembly includes a rear cover and a frame attached to the rear cover. The frame includes: a peripheral part which is formed of a first metal material, and which includes an outer portion that defines the side surface of the electronic device and an inner portion that includes a recess; a porous part integrally formed with the recess of the peripheral part; and a bracket which supports the display and which is formed of a second metal material that differs from the first metal material. The bracket is integrally formed with the peripheral part and the porous part. A portion of the second metal material forming the bracket at least partially fills gaps between surfaces that define the porous part and the recess of the peripheral part, and at least partially fills pores included in the porous part.

Description

Electronic device including a frame and method for manufacturing the same

[0001] The present disclosure relates to an electronic device including a frame and a method for manufacturing the same.

[0002] An electronic device may include a housing assembly defining an exterior appearance of the electronic device. The housing assembly may include a frame. The frame may include a bracket that supports components (e.g., a battery, a printed circuit board) disposed within the electronic device, and an edge part coupled to the bracket. The edge part may at least partially define a side surface of the electronic device. To provide rigidity to the housing assembly, the frame and the bracket may include a metal material. For example, the metal material may include titanium, stainless steel, aluminum, and / or magnesium. The frame and the bracket may include different metals.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a display. The electronic device may include a housing assembly. The housing assembly may include a rear cover and a frame attached to the rear cover. The frame may include a peripheral part formed of a first metal material and including an outer portion defining a side surface of the electronic device and an inner portion including a recess. The frame may include a porous part formed integrally with the recess of the peripheral part. The frame may include a bracket formed of a second metal material different from the first metal material and supporting the display. The bracket may be formed integrally with the peripheral part and the porous part. A portion of the second metal material forming the bracket may at least partially fill a gap between the porous part and a surface defining the recess of the peripheral part, and may at least partially fill voids included within the porous part.

[0005] A method for manufacturing a frame of a housing assembly used for an electronic device is disclosed. The method may include preparing an edge part including a recess. The method may include arranging the edge part within a first mold. The method may include injecting a mixture of first metal powders and a binder into the recess of the edge part using the first mold. After the injection, the method may include separating the edge part having the mixture disposed within the recess from the first mold. After the separation, the method may include debinding to remove the binder from the mixture disposed within the recess. After the debinding, the method may include sintering to crystallize the first metal powders and form a porous part including pores within the recess. By debinding and sintering, a gap may be formed between the porous part and a surface defining the recess of the edge part. The manufacturing method may include an operation of placing an edge part having the porous part formed within the recess into a second mold. The manufacturing method may include an operation of die casting a second metal molten metal using the second mold in which the frame is placed, so as to form a bracket including a first part contained within the gap and a second part contained within the pores.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0007] Figure 2 illustrates an electronic device according to an exemplary embodiment.

[0008] Figure 3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

[0009] FIG. 4A illustrates an example of a housing assembly of an electronic device including a frame.

[0010] Figure 4b illustrates a frame according to an exemplary embodiment.

[0011] Figure 4c illustrates a bracket according to an exemplary embodiment.

[0012] FIG. 5 illustrates an example of a cross-sectional view taken along line A-A' of the housing assembly of FIG. 4a.

[0013] Figure 6 is a flow chart showing an example of a process for manufacturing a frame.

[0014] Figure 7 illustrates the body of the edge part.

[0015] Figure 8a illustrates a first mold for forming a porous part.

[0016] Figures 8b and 8c illustrate an edge part including a porous part metal injection molded using a first mold.

[0017] Figure 9 illustrates the edge part during the process of performing the degreasing process and sintering process after forming the porous part.

[0018] Figure 10a illustrates a second mold for forming a bracket.

[0019] Figures 10b and 10c illustrate a frame including a bracket formed using a second mold.

[0020] Figure 11a illustrates a housing assembly in which a frame and bracket are formed.

[0021] Figure 11b illustrates a housing assembly in which resin is injected into a frame.

[0022] Figure 11c illustrates a housing assembly of a final product that has been machined into the shape of the housing assembly of Figure 11b.

[0023] Figure 12 illustrates a manufacturing process of a frame manufactured in a state where the first surface of the recess is positioned perpendicular to the direction of gravity.

[0024] Figure 13 illustrates a manufacturing process of a frame in which a porous part is manufactured to have a roughness, with the first surface of the recess positioned perpendicular to the direction of gravity.

[0025] Figure 14 illustrates a manufacturing process of a frame manufactured in a state where the first side of the recess is positioned parallel to the direction of gravity.

[0026] Figure 15 illustrates a manufacturing process of a frame in which a porous part is manufactured to have a roughness, with the first surface of the recess positioned parallel to the direction of gravity.

[0027] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0028] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0029] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0030] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0031] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0035] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0036] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0037] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0041] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0043] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0046] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0047] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0048] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0049] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0050] Figure 2 illustrates an electronic device according to an exemplary embodiment.

[0051] Referring to FIG. 2, an electronic device (101) according to an exemplary embodiment may include a housing assembly (210) forming an exterior of the electronic device (101). For example, the housing assembly (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side side) (200C) surrounding a space between the first side (200A) and the second side (200B).

[0052] An electronic device (101) according to an exemplary embodiment may include a substantially transparent cover plate (202). According to an exemplary embodiment, the cover plate (202) may form at least a portion of the first surface (200A). According to an exemplary embodiment, the cover plate (202) may include, but is not limited to, a glass plate including various coating layers or a polymer plate.

[0053] An electronic device (101) according to an exemplary embodiment may include a substantially opaque rear cover (211). According to an exemplary embodiment, the rear cover (211) may form at least a portion of the second surface (200B). According to an exemplary embodiment, the rear cover (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0054] An electronic device (101) according to an exemplary embodiment may include an edge part (218). According to an exemplary embodiment, the edge part (218) may be attached (or coupled) to a rear cover (211) to form at least a portion of a third side (200C) of the electronic device (101). For example, the edge part (218) may form the entire third side (200C) of the electronic device (101). For example, the edge part (218) may form the third side (200C) of the electronic device (101) together with the cover plate (202) and / or the rear cover (211).

[0055] An electronic device (101) according to an exemplary embodiment may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light-emitting element (not shown), and / or a connector hole (208). According to an exemplary embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)), or may additionally include other components.

[0056] According to an exemplary embodiment, at least a portion of the display (201) (e.g., the display module (160) of FIG. 1) may be visible through a cover plate (202) forming the first surface (200A). According to an exemplary embodiment, the display (201) may be disposed on the back surface of the cover plate (202).

[0057] According to an exemplary embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the cover plate (202) adjacent to the display (201). According to an exemplary embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the cover plate (202) may be formed to be substantially the same.

[0058] According to an exemplary embodiment, the display (201) (or the first surface (200A) of the electronic device (101)) may include a screen display area (201A). According to an exemplary embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. According to an exemplary embodiment, when the first surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the first surface (200A) (or the cover plate (202)).

[0059] According to an exemplary embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). According to an exemplary embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0060] According to an exemplary embodiment, the display (201) may include an area where a first camera module (205) (e.g., camera module (180) of FIG. 1) is positioned. According to an exemplary embodiment, an opening is formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. According to an exemplary embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned under the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) can provide visual information to the user through the above area, and additionally, the first camera module (205) can obtain an image corresponding to the direction toward the first surface (200A) through the above area of ​​the display (201).

[0061] According to an exemplary embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0062] According to an exemplary embodiment, the audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1) may include a microphone hole (203, 204) and / or a speaker hole (207).

[0063] According to an exemplary embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and / or a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be arranged inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0064] According to an exemplary embodiment, the second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0065] According to an exemplary embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (101). According to an exemplary embodiment, the external speaker hole (207) may be implemented as a single hole together with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (101), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (101). However, the present invention is not limited thereto, and according to an exemplary embodiment, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the cover plate (202) (or, the display (201)) and the edge part (218).

[0066] According to an exemplary embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing assembly (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0067] According to an exemplary embodiment, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0068] According to an exemplary embodiment, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera module (205) arranged to face a first side (200A) of an electronic device (101), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0069] According to an exemplary embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0070] According to an exemplary embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0071] According to an exemplary embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. According to an exemplary embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0072] According to an exemplary embodiment, a key input device (217) (e.g., input module (150) of FIG. 1) may be disposed on a third side (200C) of the electronic device (101). According to an exemplary embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0073] According to an exemplary embodiment, a connector hole (208) may be formed on the third surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to an exemplary embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0074] According to an exemplary embodiment, the edge part (218) may include a vent hole (206). For example, air outside the housing assembly (210) may be introduced into the housing assembly (210) through the vent hole (206). For example, air inside the housing assembly (210) may be discharged out of the housing assembly (210) through the vent hole (206). The location of the vent hole (206) is not limited to the location illustrated in FIG. 2.

[0075] According to an exemplary embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing assembly (210). The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to an exemplary embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0076] Figure 3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

[0077] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0078] Referring to FIG. 3, an electronic device (101) according to an exemplary embodiment may include a frame (240) including an edge part (218) and a bracket (243), a printed circuit board (250), a support member (260), and / or a battery (270). The printed circuit board (250) may include a first printed circuit board (251), which is a main board, and a second printed circuit board (252), which is a sub board.

[0079] An electronic device (101) according to an exemplary embodiment may include a frame (240) defining an exterior of the electronic device (101) (e.g., a third side (200C) of FIG. 2). The frame (240) may include an edge part (218) defining a lateral side of the electronic device (101) and a bracket (243) extending inwardly from the edge part (218). According to an exemplary embodiment, the edge part (218) and the bracket (243) may be positioned between a display (201) and a rear cover (211). For example, the edge part (218) may surround a space between the rear cover (211) and the cover plate (202) (and / or the display (201)). For example, the bracket (243) may extend from the edge part (218) within the space. The bracket (243) can be formed integrally with the edge part (218).

[0080] According to an exemplary embodiment, the bracket (243) may support or accommodate components included in the electronic device (101). For example, a display (201) may be disposed on one side of the bracket (243) facing one direction (e.g., +z direction). The display (201) may be supported by the bracket (243). For example, a first printed circuit board (251), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the bracket (243) facing the opposite direction (e.g., -z direction). For example, the first printed circuit board (251), the second printed circuit board (252), the battery (270), and the second camera module (212) may be respectively seated in recesses defined by the edge part (218) and / or the bracket (243).

[0081] According to an exemplary embodiment, the first printed circuit board (251), the second printed circuit board (252), and the battery (270) may be respectively coupled to the bracket (243). For example, the first printed circuit board (251) and the second printed circuit board (252) may be fixed to the bracket (243) via a coupling member such as a screw. For example, the battery (270) may be fixed to the bracket (243) via an adhesive member (e.g., double-sided tape). However, the embodiments of the present disclosure are not limited to the above-described examples.

[0082] According to an exemplary embodiment, the support member (260) may be disposed between the first printed circuit board (251) and the rear cover (211). According to an exemplary embodiment, the support member (260) may be disposed on the first printed circuit board (251). For example, the support member (260) may be disposed on a surface of the first printed circuit board (251) facing the -z direction.

[0083] According to an exemplary embodiment, the support member (260) may at least partially overlap the first printed circuit board (251) with respect to the z-axis. The support member (260) may cover at least a portion of the first printed circuit board (251). The support member (260) may protect the first printed circuit board (251) from physical impact or prevent connectors coupled to the first printed circuit board (251) from being detached.

[0084] According to an exemplary embodiment, the support member (260) may be secured to the first printed circuit board (251) via a joining member (e.g., a screw), or may be joined to the bracket (243) together with the first printed circuit board (251) via the joining member.

[0085] According to an exemplary embodiment, the display (201) may be positioned between a bracket (243) and a cover plate (202). For example, the cover plate (202) may be positioned on one side (e.g., in the +z direction) of the display (201), and the bracket (243) may be positioned on the other side (e.g., in the -z direction).

[0086] According to an exemplary embodiment, the cover plate (202) may be coupled with the display (201). For example, the cover plate (202) and the display (201) may be adhered to each other via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween. The cover plate (202) may include a substantially transparent window.

[0087] According to an exemplary embodiment, the cover plate (202) may be coupled (or attached) to the edge part (218). For example, the cover plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be attached to the edge part (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the cover plate (202) and the edge part (218). However, the present invention is not limited to the above-described example.

[0088] According to an exemplary embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (251) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to an exemplary embodiment, the first printed circuit board (251) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0089] According to an exemplary embodiment, a battery (270) (e.g., battery (189) of FIG. 1 ) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (251) and / or the second printed circuit board (252).

[0090] An electronic device (101) according to an exemplary embodiment may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). According to an exemplary embodiment, the antenna module may be disposed between a rear cover (211) and a battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0091] According to an exemplary embodiment, a first camera module (205) (e.g., a front camera) may be positioned on at least a portion of a bracket (243) such that the lens can receive external light through a portion (e.g., a camera area (237)) of a cover plate (202) (e.g., the front (200A) of FIG. 2).

[0092] According to an exemplary embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the bracket (243) and the rear cover (211). According to an exemplary embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (251) via a connecting member (e.g., a connector). According to an exemplary embodiment, the second camera module (212) may be disposed such that a lens can receive external light through the camera area (284) of the rear cover (211) of the electronic device (101).

[0093] According to an exemplary embodiment, the camera area (284) may be formed on a surface of the rear cover (211) (e.g., the rear surface (200B) of FIG. 2). According to an exemplary embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). According to an exemplary embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear cover (211) by a predetermined height. However, the present invention is not limited thereto, and according to an exemplary embodiment, the camera area (284) may form a substantially same plane as the surface of the rear cover (211).

[0094] According to an exemplary embodiment, the housing assembly (210) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the cover plate (202), the edge part (218), the bracket (243), and / or the rear cover (211) that form the exterior of the electronic device (101) may be referred to as the housing assembly (210) of the electronic device (101).

[0095] The electronic device (101) described below may include a housing assembly (e.g., housing assembly (210) of FIG. 4A) comprising dissimilar metals. According to an exemplary embodiment, the edge part (218) may include a first metal, and the bracket (243) may include a second metal. In the examples described below, the first metal is described as titanium, and the second metal is described as aluminum, but is not limited thereto.

[0096] FIG. 4A illustrates an example of a housing assembly of an electronic device including a frame. FIG. 4B illustrates an edge part according to an exemplary embodiment. FIG. 4C illustrates a bracket according to an exemplary embodiment.

[0097] Referring to FIG. 4A, an electronic device (101) according to an exemplary embodiment may include a housing assembly (210) defining an exterior appearance of the electronic device (101). The housing assembly (210) may include a frame (240). The frame (240) may include an edge part (218) that at least partially forms a side surface of the electronic device (101), and a bracket (243) that supports electronic components and / or a display (e.g., the display (201) of FIG. 3).

[0098] According to an exemplary embodiment, the edge part (218) may define at least a portion of a side surface of the electronic device (101). For example, the edge part (218) may be attached to a cover plate (e.g., cover plate (202) of FIG. 3) that at least partially defines a front surface of the electronic device (101) and a rear cover (e.g., rear cover (211) of FIG. 3) that at least partially defines a rear surface of the electronic device (101). The edge part (218) may be wrapped between the cover plate and the rear cover to form an internal space of the electronic device (101) together with the cover plate and the rear cover. For example, the edge part (218) may include a speaker hole (401) for providing an audio signal to the outside of the electronic device (101), a connector hole (402) for coupling a connector of an external electronic device, and / or a hole (403) that may accommodate an electronic pen (e.g., a stylus pen). The edge part (218) may be referred to as a side bezel or a side structure in terms of forming the side surface of the electronic device (101).

[0099] According to an exemplary embodiment, the bracket (243) may be configured to support components of the electronic device (101). For example, electronic components such as a printed circuit board (e.g., printed circuit board (250) of FIG. 3), a battery (e.g., battery (270) of FIG. 3), and a camera (e.g., second camera module (212) of FIG. 3) may be supported by the bracket (243) by being placed on the bracket (243). According to an exemplary embodiment, the bracket (243) may be at least partially surrounded by the edge part (218). The bracket (243) may be coupled to an inner surface of the edge part (218). The bracket (243) may be referred to as a support member, a support portion, or a support plate from the perspective of supporting components of the electronic device (101). The bracket (243) may be formed integrally with the edge part (218).

[0100] According to an exemplary embodiment, each of the edge part (218) and the bracket (243) may be manufactured in a separate process. Referring to FIG. 4B, the edge part (218) may have a substantially rectangular ring shape including a hollow space therein. At least a portion of the edge part (218) may include one or more conductive portions (404) to operate as an antenna radiator used for communication with an external electronic device. When the one or more conductive portions (404) operate as an antenna radiator, a resonant frequency of a signal transmitted and / or received through the one or more conductive portions (404) may be determined based on an electrical length of the one or more conductive portions (404). For example, when a wavelength corresponding to a resonant frequency of a signal is w, an electrical length of the one or more conductive portions (404) for transmitting and / or receiving a signal having the resonant frequency may be w / 4 to w / 2. To adjust the electrical length of one or more conductive portions (404), the edge part (218) may include a slot (405) (or slit). The slot (405) (or slit) may be filled with a non-conductive material to determine the electrical length of one or more conductive portions (404) that act as an antenna radiator and to electrically isolate one or more conductive portions (404) from other conductive portions.

[0101] According to an exemplary embodiment, the edge part (218) may be exposed to the outside of the electronic device (101) because it at least partially defines a side surface of the electronic device (101). The portion of the edge part (218) that is exposed to the outside of the electronic device (101) may be referred to as an outer portion (e.g., outer portion (218a) of FIG. 5), and the portion of the edge part (218) that is located inside the electronic device (101) and is not exposed to the outside of the electronic device (101) may be referred to as an inner portion (e.g., inner portion (218b) of FIG. 5).

[0102] The outer portion (or outer surface) of the edge part (218) may be required to have relatively high strength, hardness, and excellent surface properties in order to protect the components of the electronic device (101) from external impacts because it is exposed to the outside of the electronic device (101). If the strength of the edge part (218) is low, the electronic device (101) may be easily damaged by external impacts, which may cause damage to the electronic components inside. If the surface properties of the edge part (218) are poor, the edge part (218) may be easily corroded, which may deteriorate the surface quality of the electronic device (101). In order to have high strength and excellent surface properties, the edge part (218) may include a first metal material having high strength and excellent surface properties. The edge part (218) may be manufactured by injection molding (MIM, metal injection molding) first metal powders and a binder into a mold having a cavity having the shape of the edge part (218). For example, the first metal material may include, but is not limited to, titanium and / or stainless steel, which have high strength and excellent corrosion resistance.

[0103] Referring to FIG. 4c, the bracket (243) can be joined to an inner part (e.g., an inner part (218b) of FIG. 5) of an edge part (e.g., an edge part (218) of FIG. 4b). The bracket (243) can be formed integrally with the edge part (218) through a manufacturing method described below. For example, a portion of the second metal material forming the bracket (243) can at least partially fill a gap between a porous part (e.g., a porous part (520) of FIG. 5) and a surface (e.g., a first surface (511a) and a second surface (511b) of FIG. 5) defining a recess (e.g., a recess (511) of FIG. 5) of the edge part (218), and can at least partially fill voids (e.g., voids (910) of FIG. 9) included in the porous part (520).

[0104] Since the bracket (243) supports electronic components, the bracket (243) may be required to have relatively high strength. If the bracket (243) is made of a metal material that is substantially the same as the first metal material forming the edge part (218), the overall weight of the electronic device (101) may become too heavy. For example, if the bracket (243) is made of titanium, which is the same as the edge part (218), the overall weight of the electronic device (101) may increase. Since the density of titanium (e.g., about 4.5 g / cm3) is lower than that of metal materials such as iron and stainless steel, but higher than the density of aluminum (e.g., about 2.7 g / cm3), the relatively high density of titanium may cause an increase in the weight of the electronic device (101). If the weight of the electronic device (101) is too heavy, the portability of the electronic device (101) may be deteriorated.

[0105] According to an exemplary embodiment, the bracket (243) may be formed of a different metal material (e.g., a second metal material) than the metal material forming the edge part (218) (e.g., a first metal material). For example, the bracket (243) may include a second metal material that is relatively lighter than the first metal material included in the edge part (218). For example, the density of the second metal material may be less than the density of the first metal material. For example, the specific gravity of the second metal material may be less than the specific gravity of the first metal material.

[0106] The bracket (243) wrapped by the edge part (218) is not exposed to the outside of the electronic device (101), unlike the edge part (218), but is at least partially wrapped by the edge part (218), so that it can be placed inside the electronic device (101). Since the bracket (243) is placed inside the electronic device (101), even if the bracket (243) has lower strength than the edge part (218), the bracket may have a small effect on the rigidity of the electronic device (101). According to an exemplary embodiment, the second metal material may include aluminum and / or magnesium, which are relatively lighter than the first metal material (e.g., titanium). However, the present invention is not limited thereto. Since the density of aluminum is lower than that of titanium, an electronic device (101) including a bracket (243) including aluminum may be lighter than an electronic device (101) including a bracket (243) including titanium.

[0107] According to an exemplary embodiment, the edge part (218) and the bracket (243) may be manufactured in separate processes. The bonding strength between the edge part (218) and the bracket (243) may require a bonding strength that is not easily separated by external impact. For example, the bonding strength between the edge part (218) and the bracket (243) may be required to be about 10 MPa or more.

[0108] The method for manufacturing the frame (240) including the edge part (218) and the bracket (243) may vary. For example, a process may be possible in which the edge part (218) and the bracket (243) are manufactured separately, and then the bracket (243) is welded to the edge part (218). The process for welding dissimilar metals may include laser welding, electron-beam welding, and / or friction stir welding. In the process of joining the edge part (218) and the bracket (243) by welding, bubbles may be generated within the edge part (218) and / or the bracket (243) during the welding process. For example, when the melting point difference between the first metal material included in the edge part (218) and the second metal material included in the bracket (243) is large, the welding process may be performed at a temperature higher than the higher melting point. In this case, the temperature at which the welding process is performed may cause vaporization of a metal material having a lower melting point. As a metal material with a relatively low melting point vaporizes, gas may be generated. The gas may cause bubbles to form inside the welding process. For example, if the first metal material is titanium and the second metal material is aluminum, the melting point of titanium is about 1,668°C and the melting point of aluminum is about 660°C. Since the welding process may be performed at a temperature higher than the melting point of titanium (e.g., about 1,668°C), the temperature at which the welding process is performed may be too high compared to the melting point of aluminum. The high temperature may cause the aluminum to vaporize, generating gas, and the gas may generate bubbles. The formation of bubbles may cause an irregular bonding surface to form. An irregular bonding surface may result in a weakening of the bonding strength. In addition, in the case of the welding process, an additional welding process is required after manufacturing the edge part (218) and the bracket (243), respectively, which may result in an increase in manufacturing time and manufacturing cost.

[0109] A die casting process may be used as a joining process between the edge part (218) and the bracket (243). In the case of the die casting process, the bracket (243) joined to the edge part (218) may be formed by casting a second metal material that forms the bracket (243) on the inside of the edge part (218). If the edge part (218) and the bracket (243) include different metal materials, the bonding force between the edge part (218) and the bracket (243) may be weak due to differences in physical and chemical properties between the dissimilar metals. In order to improve the bonding force between dissimilar metals (e.g., titanium and aluminum), a special treatment may be required for the joining surface. For example, by adjusting the inner roughness of the edge part (218) using a method such as Laser Hatching or Blasting, a concavo-convex portion can be formed, and by infiltrating aluminum into the concavo-convex portion, the bracket (243) can be joined to the edge part (218). In the case of the above process, since a process for forming the concavo-convex portion at a temperature higher than the melting point of titanium (e.g., about 1,668°C) may be required, there may be difficulty in controlling the temperature at which the process is performed.

[0110] According to an exemplary embodiment, a recess (e.g., recess (511) of FIG. 5) for coupling a bracket (243) may be formed on the inner side of the edge part (218), and a porous part (e.g., porous part (520) of FIG. 5) including a first metal material may be formed within the recess (511). The porous part may include pores. After the porous part is formed, the bracket (243) coupled to the edge part (218) may be formed by die casting a second metal material such that the second metal material penetrates into the pores of the porous part. By this process, the problem of bubble generation caused by the welding process may be solved. When the bracket (243) is formed by die casting, the second metal material naturally penetrates into the pores of the porous part, thereby forming the bracket (243) coupled to the inner side of the edge part (218). The bracket (243) coupled to the inner side of the edge part (218) can be formed integrally with the edge part (218) through the manufacturing method described below.

[0111] FIG. 5 illustrates an example of a cross-sectional view taken along line A-A' of the housing assembly of FIG. 4a.

[0112] Referring to FIG. 5, the frame (240) may include an edge part (218), a porous part (520), and a bracket (243). The edge part (218) may include an outer part (218a) and an inner part (218b). The inner part (218b) may include a recess (511).

[0113] According to an exemplary embodiment, the edge part (218) may be formed of a first metal material (501). As described above, the outer portion (218a) (e.g., the outer surface) of the edge part (218), which at least partially forms the outer surface of the electronic device (101), is exposed to the outside of the electronic device (101), and therefore, the first metal material (501) may include titanium, which has relatively high strength. However, titanium is merely described as an example, and the first metal material (501) is not limited to titanium.

[0114] According to an exemplary embodiment, the outer portion (218a) of the edge part (218) may correspond to a portion of the body (510) of the edge part (218) that is exposed to the outside of the electronic device (e.g., the electronic device (101) of FIG. 2). The inner portion (218b) of the edge part (218) may correspond to another portion of the body (510) of the edge part (218) that is not exposed to the outside. The outer surface of the body (510) facing the outside may be referred to as the outer portion (218a), and the inner surface of the body (510) facing the inside of the electronic device (101) may be referred to as the inner portion (218b).

[0115] According to an exemplary embodiment, the recess (511) may be included in the inner portion (218b), which corresponds to the inner surface of the body (510). For example, the recess (511) may be formed by removing a portion of the inner portion (218b) of the edge part (218) through computerized numerical control (CNC) machining. The edge part (218) may be coupled to the bracket (243) through a porous part (520) that is integrally formed with the recess (511). In order to improve the bonding strength between the edge part (218) and the recess (511), which include different metals, the recess (511) may be implemented in an undercut shape, but is not limited thereto.

[0116] According to an exemplary embodiment, the recess (511) may be defined by a first surface (511a) of the edge part (218) and a second surface (511b) of the edge part (218). The first surface (511a) and the second surface (511b) may be a portion of the inner portion (218b) of the edge part (218). For example, the first surface (511a) may be a surface of the recess (511) facing inwardly of the edge part (218), and may form a bottom surface of the recess (511) when the recess (511) is viewed from above. For example, the second surface (511b) may be a surface of the recess (511) extending inwardly from the first surface (511a), and may form a side surface of the recess (511) when the recess (511) is viewed from above. For example, when the recess (511) is implemented in an undercut shape, the second surface (511b) can be extended to have a slope with respect to the first surface (511a).

[0117] According to an exemplary embodiment, a porous part (520) may be included within the recess (511). The porous part (520) may be formed integrally with the recess (511) of the edge part (218) and may include a first metal material (501). The porous part (520) formed integrally with the recess (511) may be formed by metal injection molding the first metal material within the recess (511). For example, the porous part (520) formed integrally with the recess (511) may be formed by metal injection molding a mixture of first metal powders and a binder for forming the porous part (520) within the recess (511). The first metal powders forming the porous part (520) may be shrunk by a debinding process and a sintering process. By the above shrinkage, a gap (550) can be formed between the porous part (520) and the recess (511). For example, the porous part (520) can be bonded to the first surface (511a) and spaced apart from the second surface (511b), thereby forming a gap (550) between the porous part (520) and the second surface (511b).

[0118] According to an exemplary embodiment, the bracket (243) may be formed inside the edge part (218). For example, the edge part (218) may have a substantially rectangular ring shape with an interior that is hollow. However, the present invention is not limited thereto. For example, the edge part (218) may be manufactured by manufacturing a plurality of parts and then joining the parts. The bracket (243) may at least partially fill the hollow interior of the edge part (218). A portion of the bracket (243) may be disposed within the recess (511). For example, a portion of the bracket (243) may be joined to the edge part (218) by being included within the gap (550) between the porous part (520) and the recess (511) and the pores of the porous part (520) disposed within the recess (511). For example, a portion of the second metal material (502) forming the bracket (243) may at least partially fill a gap (550) between the porous part (520) and a surface (e.g., the first surface (511a) and / or the second surface (511b)) defining a recess (511) of the edge part (218), and may at least partially fill voids contained within the porous part (520).

[0119] For example, in FIG. 5, which is a cross-sectional view of a final product, a bracket (243) is illustrated as being included within a porous part (520), but before being joined to the bracket (243), the porous part (520) may include voids. The bracket (243) joined to the porous part (520) may be formed by die casting a second metal material (502) into the voids. For example, after an edge part (218) including a porous part (520) integrally formed with a recess (511) is placed in a mold for forming the bracket (243), the second metal material (502) may be die cast so that the second metal material (502) forming the bracket (243) may penetrate into the voids. After die casting of the second metal material (502), when the second metal material (502) is sintered, the second metal material (502) that has penetrated into the pores solidifies, thereby forming a bracket (243) joined to the edge part (218). The bracket (243) can be formed integrally with the edge part (218) and the porous part (520).

[0120] According to an exemplary embodiment, the bracket (243) may be formed integrally with the edge part (218) by being formed integrally with the surface defining the recess (511) and the porous part (520). According to an exemplary embodiment, the bracket (243) may include a first part (530) and a second part (540).

[0121] For example, the first portion (530) of the bracket (243) may be a portion of the bracket (243) that is joined to the edge portion (218) by at least partially filling a gap (550) between a surface defining the porous portion (520) and the recess (511). The second metal material (502) may penetrate into the gap (550) by die casting. As the second metal material (502) that has penetrated into the gap (550) solidifies, the first portion (530) of the bracket (243) that is included in the gap (550) may be formed. The first portion (530) of the bracket (243) may be joined to the recess (511) to join the bracket (243) to the edge portion (218).

[0122] For example, the second portion (540) of the bracket (243) may be a portion of the bracket (243) that is joined to the edge portion (218) by at least partially filling the pores included in the porous portion (520). The second metal material (502) may penetrate into the pores formed in the porous portion (520) by die casting. As the second metal material (502) that has penetrated into the pores solidifies, the second portion (540) of the bracket (243) that is joined to the porous portion (520) that is integrally formed with the recess (511) may be joined to the bracket (243) to the edge portion (218).

[0123] According to an exemplary embodiment, the bracket (243) may be coupled to the edge part (218) via a first portion (530) and a second portion (540). For example, the first portion (530) may be included within the gap (550) to provide a primary coupling, and the second portion (540) may be included within the pores of the porous portion (520) to provide a secondary coupling.

[0124] According to an exemplary embodiment, the body (510) of the edge part (218) may substantially not include voids, and the porous part (520) disposed within the recess (511) may include voids. The body (510) exposed to the outside may have a relatively uniform and smooth surface, and thus may have high strength and excellent surface properties. The porous part (520) may include voids filled with a second metal material (502). Since the porous part (520) is disposed within the recess (511) and is not exposed to the outside, it may not affect the rigidity of the electronic device (101). The porous part (520) may provide a firm bond between the bracket (243) and the edge part (218). The bracket (243) may be formed by die casting the second metal material (502) into the voids. As the second metal material (502) penetrates into the pores of the porous part (520), fills the pores, and solidifies, a portion of the bracket (243) may be included in the porous part (520). For bonding between the bracket (243) and the edge part (218), even without forming a separate protruding portion on the edge part (218), the bracket (243) may be firmly bonded to the edge part (218) by the second metal material (502) that penetrates into the pores. According to an exemplary embodiment, an electronic device (101) having a high bonding strength between the edge part (218) and the bracket (243) may be provided.

[0125] According to an exemplary embodiment, the bracket (243) may not be substantially contained within the body (510). The second metal material (502) may penetrate into the pores formed within the porous part (520), but may not be contained within the body (510) because pores are not substantially formed within the body (510). Since the body (510) and the porous part (520) include the same first metal material (501), the physical and chemical properties of the interface between the body (510) and the porous part (520) may be substantially the same. Even without a separate treatment process for bonding the body (510) and the porous part (520), the body (510) and the porous part (520) may be bonded by a high bonding force. In the case of the first metal material (501) and the second metal material (502), which are dissimilar metals, it may be difficult to have a high bonding strength because they have different physical and chemical properties. According to an exemplary embodiment, the second metal material (502) penetrates into the gap (550) between the porous part (520) and the recess (511) and the pores of the porous part (520), so that the bracket (243) can be firmly bonded to the edge part (218). Through the above structure, the bracket (243) and the edge part (218) can have a high bonding strength, so that the rigidity of the electronic device (101) can be improved. For example, the bonding strength between the edge part (218) and the bracket (243) can be at least about 10 Mpa or more.

[0126] Below, the process of manufacturing the edge part (218) and bracket (243) of the structure illustrated in FIG. 5 is described.

[0127] Figure 6 is a flow chart showing an example of a process for manufacturing a frame.

[0128] The operations described in FIG. 6 may be referred to as a manufacturing method for manufacturing the housing assembly (210) of the electronic device (101) described above. The electronic device (101) described above has been described as an electronic device including a bar-type housing assembly (210), but is not limited thereto. For example, the housing assembly (210) manufactured by the manufacturing method of FIG. 6 may be referred to as a manufacturing method for manufacturing not only a bar-type housing assembly (210), but also a foldable-type housing or a rollable-type housing. Each of the operations described below represents a process for manufacturing the housing assembly (210) of the electronic device (101), and may be referred to as a step or a process.

[0129] Referring to FIG. 6, in operation 601, an edge part (e.g., edge part (218) of FIG. 5) including a recess (e.g., recess (511) of FIG. 5) can be prepared.

[0130] Figure 7 illustrates the body of the edge part.

[0131] Referring to FIG. 7, a body (510) having the overall structure of the edge part (218) can be manufactured. The body (510) can be manufactured by metal injection molding a mixture of first metal powders and a binder into a mold corresponding to the shape of the edge part (218). For example, the mold can be a mold in which, when the first metal powders are metal injection molded, a recess (511) can be formed on the inner surface of the body (510) having a substantially square ring shape. However, the present invention is not limited thereto. For example, after a bar-shaped body (510) is manufactured, a recess (511) can be formed on the inner surface of the body (510) through CNC machining, and the body (510) of the edge part (218) can be manufactured by bending the bar-shaped body (510). The recess (511) can be formed along the edge of the inner surface of the body (510). The shape of the recess (511) may vary. As described above, the shape of the recess (511) may include, but is not limited to, an undercut shape. As described above, the recess (511) may include a first side (511a) and a second side (511b). In the final product, the portion of the body (510) that is exposed to the outside may be referred to as an outer portion, and the portion of the body (510) that is not exposed to the outside may be referred to as an inner portion.

[0132] Referring again to FIG. 6, at operation 602, an edge part may be placed within a first mold (e.g., the first mold (810) of FIG. 8a).

[0133] In operation 603, a mixture of first metal powders and a binder can be injected into a recess (511) of an edge part (218) using a first mold (810).

[0134] Figure 8a illustrates a first mold for forming a porous part.

[0135] Referring to FIG. 8A, the first mold (810) may be a mold including a cavity (811) corresponding to the shape of a porous part (520) disposed within a recess (511). The first mold (810) illustrated in FIG. 8A is merely a schematic mold for explaining a manufacturing method, and the embodiment is not limited to the drawing illustrated in FIG. 8A. To form the porous part (520), the body (510) of the edge part (218) may be placed on the first mold (810). To form the porous part (520), first metal powders and a binder may be mixed. By mixing the first metal powders and the binder, a raw material to be injected into the first mold (810) may be prepared. The content of the binder injected into the first mold (810) may be about 15 wt% to about 40 wt% based on the raw material injected into the first mold (810), but is not limited thereto. The binder may include, but is not limited to, polyethylene (PE), polypropylene (PP), stearic acid, or a mixed resin. As described above, the first metal material may include titanium. A porous part (520) may be formed by injecting a mixture of titanium powders and the binder into the cavity (811) of the first mold (810). The titanium powders and the binder may be evenly spread within the cavity (811).

[0136] Figures 8b and 8c illustrate an edge part including a porous part metal injection molded using a first mold.

[0137] Referring to FIG. 8B, a porous part (520) may be formed within a recess (511) by metal injection molding of first metal powders. The shape of the porous part (520) may be formed by binding the first metal powders by a binder. For example, when the recess (511) is formed along an edge of the inner surface of the body (510), the porous part (520) may be formed within the recess (511) formed along the edge. The porous part (520) may be formed along the inner surface of the body (510). Within a state in which the porous part (520) is metal injection molded by the first mold (810), the porous part (520) may fill the recess (511). According to an exemplary embodiment, a binder may remain within the porous part (520) before the debinding process and the sintering process are performed. The interior of the edge part (218) can be hollow by a body (510) having a substantially rectangular ring shape and a porous part (520) formed along the inner edge of the body (510). The edge part (218) in which the porous part (520) is formed can be separated from the first mold (810). The ratio of the binder in the mixture can have a ratio with respect to the first metal powders so as to form pores in the porous part (520).

[0138] Referring to FIG. 8C, the body (510) and the porous part (520) may include a plurality of parts. For example, referring to the first example (801) of FIG. 8C, the body (510) may include one part, and the porous part (520) may include a plurality of parts. For example, the porous part (520) may be disposed on a portion of the inner surface of the body (510). For example, referring to the second example (802) of FIG. 8C, the body (510) may include one part, and the porous part (520) may include a plurality of parts. The plurality of parts of the porous part (520) may extend along a portion of an edge of the body (510). The plurality of parts of the porous part (520) may be spaced apart from each other. Each of the plurality of parts of the porous part (520) may be formed through a debinding process and a sintering process after injection molding the first metal material. According to one embodiment, the body (510) may include a plurality of parts, and the porous part (520) may include a plurality of parts. For example, referring to the third example (803) and the fourth example (804) of FIG. 8C, each of the plurality of parts of the body (510) may be spaced apart from each other. The plurality of parts of the porous part (520) may be coupled to each of the plurality of parts of the body (510). In addition to the examples (801, 802, 803, and 804) illustrated in FIG. 8C, various embodiments may be possible.

[0139] Referring again to FIG. 6, at operation 604, after the edge part having the mixture disposed within the recess is separated from the first mold, a degreasing process may be performed.

[0140] In one embodiment, after separating the edge part (218) from the first mold (810), a debinding process may be performed. The edge part (218) may have a mixture contained within the recess (511). The debinding process is a process of vaporizing the binder by applying high temperature heat for about 3 hours to about 20 hours. In an exemplary embodiment, the debinding process may include a first debinding process, a second debinding process, and a third debinding process. The first debinding process may be performed at about 400°C. The second debinding process may be performed at about 500°C. The third debinding process may be performed at about 800°C. The third debinding process may be referred to as pre-sintering. The above-described debinding process is merely exemplary, and the embodiment is not limited thereto. For example, the temperature and time of the degreasing process can be set based on the materials of the powders being input. For example, the temperature and time of the degreasing process can be changed depending on the components and content of the binder. For example, the degreasing process may include only the first degreasing process and the second degreasing process. During the degreasing process, the binder can be removed by vaporization, and the first metal powders can shrink. For example, during the degreasing process, the volume of the first metal powders can shrink by about 5% to about 20%. However, the present invention is not limited thereto, and the shrinkage can be less than about 5% or more than about 20%.

[0141] In operation 605, a sintering process can be performed to form a porous part including voids within the recess.

[0142] The sintering process is a process of combining metal powders by heating a semi-finished product (e.g., a green body). Through the sintering process, mechanical strength, durability, and corrosion resistance can be enhanced. By combining the first metal powders through the sintering process, first metal crystals can be formed. The sintering process can be performed at a crystallization temperature of the first metal to crystallize the first metal powders. For example, when the first metal material includes titanium, the sintering process can be performed at about 1,000°C. The temperature can vary depending on the grade of titanium and / or the binder content and is not limited to the crystallization temperature described above. According to an exemplary embodiment, the time for performing the sintering process can be set to a time required to crystallize the first metal powders. During the sintering process, the volume of the first metal powders can shrink by, for example, about 5% to 15%. However, the present invention is not limited thereto, and may have a residual amount of less than about 5% or greater than about 20%. The first metal powders may ultimately shrink by about 10% to about 30% due to the degreasing and sintering processes. However, the present invention is not limited thereto. The shrinkage ratio may vary depending on the composition of the metal powders, the grade of the metal powders, the metal injection molding process, etc. The numerical ranges described in the present invention are merely exemplary, and the embodiments are not limited thereto.

[0143] Figure 9 illustrates the edge part during the process of performing the degreasing process and sintering process after forming the porous part.

[0144] Referring to FIG. 9, in order to form a porous part (520), a first metal material is subjected to metal injection molding, and then a post-processing process (e.g., a degreasing process and a sintering process) is performed, so that a gap (550) can be formed between the porous part (520) and the recess (511).

[0145] The first structure (901) of FIG. 9 shows the edge part (218) before the first metal material for forming the porous part (520) is metal injection molded. Referring to the first structure (901) of FIG. 9, the edge part (218) may include a recess (511). For example, the recess (511) may be formed by removing a portion of the body (510). The recess (511) may include a first surface (511a) and a second surface (511b). As described above, when the recess (511) is viewed from above, the first surface (511a) may form a bottom surface of the recess (511), and the second surface (511b) may form a side surface extending from the recess (511). For example, a recess (511) can be formed by rolling or extruding a bar-shaped body (510) including a first metal material.

[0146] The second structure (902) of FIG. 9 represents an edge part (218) into which a first metal material is injected to form a porous part (520). Referring to the second structure (902) of FIG. 9, the porous part (520) can be formed by injecting the first metal material into the recess (511). The shape of the porous part (520) can be maintained by binding the first metal powders by a binder. The porous part (520) prior to undergoing a post-processing process can fill the recess (511).

[0147] The third structure (903) of FIG. 9 shows the edge part (218) after the degreasing and sintering processes are performed. Referring to the third structure (903) of FIG. 9, as the degreasing and sintering processes are performed, the binder included in the porous part (520) can be removed by vaporization. As the binder is removed and the first metal powders shrink, first metal crystals can be formed. When the first metal powders shrink, a portion of the space occupied by the binder can be vacated. Due to the vacant space, voids (910) can be formed in the porous part (520). As described below, when a second metal material is die-cast, the second metal can penetrate into the voids (910), thereby including the second portion (540) of the bracket (243) in the porous part (520).

[0148] According to an exemplary embodiment, a gap (550) may be formed between the recess (511) and the porous part (520) by shrinkage of the first metal powders. For example, in the case of the second structure (902), the porous part (520) may substantially fill the recess (511). As the debinding process and the sintering process are performed, the volume of the porous part (520) may be reduced by shrinkage of the first metal powders. Even if the debinding process and the sintering process are performed, the volume of the recess (511) does not substantially change, and only the volume of the porous part (520) is reduced, so that a gap (550) may be formed between the porous part (520) and the recess (511). As described below, when the second metal material is die cast, the second metal can penetrate into the gap (550) formed between the porous part (520) and the recess (511), thereby allowing the first part (530) to be included within the gap (550).

[0149] The shape of the gap (550) may vary depending on the direction of gravity. For example, as illustrated in FIG. 9, when the direction of gravity is perpendicular to the first surface (511a), the first metal powders may shrink while in contact with the first surface (511a). As the first metal powders shrink while in contact with the first surface (511a), the porous part (520) of the third structure (903) may come into contact with a portion of the first surface (511a) and be entirely separated from the second surface (511b). The gap (550) may be formed between the porous part (520) and the second surface (511b). However, the present invention is not limited thereto. Other shapes of the gap (550) will be described later.

[0150] Referring again to FIG. 6, at operation 606, the edge part (218) may be placed in a second mold (1010) to form a bracket (243).

[0151] In operation 607, a bracket (243) can be formed by die casting a second metal melt using a second mold (1010). An edge part (218) placed in the second mold (1010) can have a porous part (520). Through die casting, a bracket (243) can be formed that includes a first part (530) contained within a gap (550) and a second part (540) contained within the pores.

[0152] Figure 10a illustrates a second mold for forming a bracket.

[0153] According to one embodiment, a bracket (243) can be formed inside the edge part (218) by die casting of a second metal.

[0154] Referring to Fig. 10a, in order to form a bracket (243), an edge part (218) may be placed in a second mold (1010). The second mold (1010) may include a cavity (1011) corresponding to the shape of the bracket (243). The second mold (1010) illustrated in Fig. 10a is merely a schematic mold for explaining a manufacturing method, and the embodiment is not limited to the drawing illustrated in Fig. 10a. In order to die cast a second metal material, a molten metal of a second metal may be prepared by melting the second metal material at a high temperature. For example, when the second metal material is aluminum, a molten aluminum may be prepared by melting aluminum in a melting furnace. The molten metal of the second metal material may be injected into a cavity (1011) of the second mold (1010) corresponding to the shape of the bracket (243). The second metal melt can penetrate into the gap (550) between the porous part (520) and the recess (511) and the pores of the porous part (520). In the case of the body (510), since it does not include pores, the second metal melt may not penetrate into the interior of the body (510).

[0155] Figures 10b and 10c illustrate a frame including a bracket formed using a second mold.

[0156] Referring to FIG. 10b, after the pouring of the second metal molten metal is completed, a cooling process may be performed to form a bracket (243). As the cooling process is performed while the second metal molten metal has penetrated into the gap (550) and the pores (e.g., the pores (910) of FIG. 9), a portion of the bracket (243) may be included in the gap (550) and the porous part (520). After the casting of the second metal material solidified by the cooling process is separated from the second mold (1010), the residue may be removed, and the surface may be polished, thereby forming the bracket (243). By including a portion of the bracket (243) in the gap (550) and the porous part (520), the bracket (243) may be coupled to the inside of the edge part (218). The bracket (243) can be manufactured in a form at least partially wrapped by the edge part (218).

[0157] According to an exemplary embodiment, the bracket (243) may include a first portion (530) and a second portion (540). The first portion (530) may be formed by cooling a second metal material that has penetrated into a gap (550) formed between the porous portion (520) and the recess (511). The second portion (540) may be formed by cooling a second metal material that has penetrated into pores within the porous portion (520). The first portion (530) may be coupled to the gap (550), and the second portion (540) may be coupled to the porous portion (520). The bracket (243) may be firmly coupled to the edge portion (218) through the first portion (530) and the second portion (540).

[0158] Referring to FIG. 10c, the body (510) may include one part, and the porous part (520) may include multiple parts. Referring to the first example (1001) and the second example (1002) of FIG. 10c, the body (510) may include one part, and the porous part (520) may include multiple parts. The bracket (243) may be coupled to the edge part (218) by being coupled to each of the multiple parts of the porous part (520). Referring to the third example (1003) and the fourth example (1004) of FIG. 10c, the body (510) may include multiple parts, and the porous part (520) may include multiple parts. The bracket (243) can be joined to the edge part (218) by being joined to each of the plurality of parts of the porous part (520). For example, when the second metal melt is die cast, the second metal material can be inserted into the pores within the plurality of parts of the porous part (520), thereby forming the bracket (243) joined to the edge part (218).

[0159] Referring again to FIG. 6, at operation 608, resin may be injected into the edge part (218).

[0160] Figure 11a illustrates a housing assembly in which a frame and bracket are formed.

[0161] Referring to FIG. 11A, as described above, the edge part (218) may include a slot (or slit). If the edge part (218) is entirely filled with a first metal material that is a conductive material, it may be difficult to use one or more of the conductive parts as an antenna radiator because the resonant frequency of a signal radiated or received through one or more of the conductive parts of the edge part (218) cannot be adjusted. As the slot (or slit) is formed within the edge part (218), the electrical length of one or more of the conductive parts can be adjusted. Since the electrical length of one or more of the conductive parts can determine the frequency characteristics of a signal transmitted and / or received through the antenna radiator, one or more of the conductive parts can be used as an antenna radiator for transmitting and / or receiving a signal in a specified frequency band.

[0162] Figure 11b illustrates a housing assembly in which resin is injected into a frame.

[0163] Referring to FIG. 11B, a resin (1110) may be injected to fill the slot (or slit) of the edge part (218). By filling at least a portion of the slot (or slit) with the resin (1110), which is a non-conductive material, a segmented structure including one or more conductive portions (404) and one or more non-conductive portions may be formed on the side surface of the housing assembly (210). The segmented structure may function as an antenna radiator for communicating with an external electronic device. For example, a wireless communication module (e.g., the wireless communication module (192) of FIG. 1) may be configured to transmit or receive a signal in a designated band by using one or more conductive portions forming a portion of the side surface of the housing assembly (210).

[0164] Figure 11c illustrates a housing assembly of a final product that has been machined into the shape of the housing assembly of Figure 11b.

[0165] Referring to FIG. 11c, the resin (1110) can fill at least a portion of the empty space between the edge part (218) and the bracket (243). After the resin (1110) is injected, processing (e.g., cutting processing) can be performed in the form of a final product, thereby providing the housing assembly (210). For example, the resin (1110) may include, but is not limited to, polybutyleneterephthalate (PBT), which has excellent electrical properties and flame retardancy. For example, the resin (1110) may also include polycarbonate (PC) and / or polyphthalamide (PPA). By combining a cover plate (e.g., cover plate (202) of FIG. 3) and a rear cover (e.g., rear cover (211) of FIG. 3) with the housing assembly (210) illustrated in FIG. 11c, a housing assembly (210) used in a final product can be formed.

[0166] According to an exemplary embodiment, the housing assembly (210) may include an edge part (218) and a bracket (243). The edge part (218) may include a body (510) and a porous part (520). For example, the body (510) may at least partially form an outer surface of the edge part (218). The body (510) may include a first metal material having high strength and excellent surface properties. Since the body (510) is less likely to be damaged by external impact, the strength of the electronic device (101) may be improved. The porous part (520) may be formed by metal injection molding the first metal material into a recess (511) formed on the inside of the body (510). The porous part (520) may be formed by metal injection molding into the recess (511). Within the porous part (520), gaps (550) and pores can be formed through a degreasing process and a sintering process. To form the bracket (243), a second metal material can be die-cast. As the second metal material penetrates into the gap (550) and pores, the bracket (243) can be firmly bonded to the edge part (218). The exemplary electronic device (101) can have a bonding structure of the edge part (218) and the bracket (243) as the second metal material that penetrates into the gap (550) and pores solidifies. According to an exemplary embodiment, the bracket (243) can be bonded to the edge part (218) through the first part (530) and the second part (540). The above-described manufacturing method can improve the bonding strength between the edge part (218) and the bracket (243) and reduce unnecessary processes, thereby reducing manufacturing costs.

[0167] According to an exemplary embodiment, the edge part (218) and the bracket (243) may include different metal materials. The edge part (218) exposed to the outside of the electronic device (101) may include a first metal material (e.g., titanium) having a relatively high strength for the rigidity of the electronic device (101). The bracket (243), which is disposed inside the electronic device (101) and not exposed to the outside, may include a second metal material (e.g., aluminum) having a relatively low specific gravity for the weight lightening of the electronic device (101). The exemplary electronic device (101) may achieve a light weight while having high rigidity.

[0168] Figure 12 illustrates a manufacturing process of a frame manufactured in a state where the first surface of the recess is positioned perpendicular to the direction of gravity.

[0169] Referring to FIG. 12, the gap (550) between the porous part (520) and the recess (511) can be formed substantially uniformly. According to an exemplary embodiment, the shape of the gap (550) can vary depending on the relative positional relationship between the first surface (511a) of the recess (511) that the porous part (520) contacts and the direction of gravity (e.g., direction (D) of FIG. 12).

[0170] The first structure (1201) of Fig. 12 shows an edge part (218) in which a first metal material for forming a porous part (520) is injected into a recess (511). The second structure (1202) of Fig. 12 shows an edge part (218) after a degreasing process and a sintering process are performed. The third structure (1203) of Fig. 12 shows an edge part (218) to which a bracket (243) is coupled. The fourth structure (1204) of Fig. 12 shows an edge part (218) in a state in which processing is completed.

[0171] Referring to the first structure (1201) of FIG. 12, a porous part (520) can be formed by injecting a first metal material into a recess (511). The shape of the porous part (520) can be maintained by binding the first metal powders by a binder. The porous part (520) prior to undergoing a post-processing process can fill the recess (511).

[0172] According to an exemplary embodiment, the housing assembly (210) can be manufactured with the first surface (511a) of the recess (511) positioned perpendicular to the direction of gravity. As illustrated in FIG. 12, when the direction of gravity is perpendicular to the first surface (511a), the first metal powders can be contracted while in contact with the first surface (511a). Since the gravity is perpendicular to the first surface (511a), the porous part (520) can remain in contact with the first surface (511a) due to gravity and be spaced apart from the second surface (511b). As the first metal powders are contracted while in contact with the first surface (511a), the porous part (520) of the second structure (1202) can be in contact with a portion of the first surface (511a) and be substantially uniformly spaced apart from the second surface (511b). With respect to the second surface (511b) that surrounds the porous part (520) and is spaced apart from the porous part (520), the porous part (520) may be arranged symmetrically. A gap (550) may be formed between the porous part (520) and the entire second surface (511b).

[0173] Figure 13 illustrates a manufacturing process of a frame in which a porous part is manufactured to have a roughness, with the first surface of the recess positioned perpendicular to the direction of gravity.

[0174] Referring to FIG. 13, the porous part (520) may include a roughened portion (1310) formed on a surface of the porous part (520) facing inward of the edge part (218). The roughened portion (1310) may be formed by adjusting the roughness of the surface of the porous part (520).

[0175] The first structure (1301) of Fig. 13 shows an edge part (218) in which a first metal material for forming a porous part (520) is injected into a recess (511). The second structure (1302) of Fig. 13 shows an edge part (218) after a degreasing process and a sintering process are performed. The third structure (1303) of Fig. 13 shows an edge part (218) to which a bracket (243) is coupled. The fourth structure (1304) of Fig. 13 shows an edge part (218) in a state in which processing is completed.

[0176] Referring to the first structure (1301) of FIG. 13, a porous part (520) can be formed by injecting a first metal material into a recess (511). The shape of the porous part (520) can be maintained by combining the first metal powders by a binder. The shape of the porous part (520) can be based on the shape of a cavity (e.g., the cavity (811) of FIG. 8A) of a first mold (e.g., the first mold (810) of FIG. 8A) for injecting the first metal material. The cavity can have a shape that can form a recessed portion (1310). The porous part (520) injected by the cavity can include the recessed portion (1310) on a surface facing inward of the edge part (218). Referring to the second structure (1302) of FIG. 13, after the degreasing process and the sintering process are performed, the uneven portion (1310) is maintained, so that the porous part (520) can include the uneven portion (1310). As described above, since the direction of gravity (e.g., direction (D) of FIG. 13) is perpendicular to the first surface (511a), as the first metal powders shrink, the porous part (520) can be spaced apart from the entire second surface (511b). Referring to the third structure (1303) of FIG. 13, when the second metal material is die-casted, the uneven portion (1310) can be positioned inside the bracket (243). The uneven portion (1310) can increase the contact area of ​​the porous part (520) that comes into contact with the bracket (243), so that the bonding area between the bracket (243) and the porous part (520) can increase. As the bracket (243) and the porous part (520) come into contact over a wider area, the bonding force between the bracket (243) and the edge part (218) can increase. According to an exemplary embodiment, the bonding strength between the bracket (243) and the edge part (218) can be improved by the uneven portion (1310).

[0177] Figure 14 illustrates a manufacturing process of a frame manufactured in a state where the first side of the recess is positioned parallel to the direction of gravity.

[0178] Referring to FIG. 14, the gap (550) between the porous part (520) and the recess (511) may be formed substantially non-uniformly. According to an exemplary embodiment, the shape of the gap (550) may vary depending on the relative positional relationship between the first surface (511a) of the recess (511) that the porous part (520) contacts and the direction of gravity (e.g., direction (D) of FIG. 14).

[0179] The first structure (1401) of Fig. 14 shows an edge part (218) in which a first metal material for forming a porous part (520) is injected into a recess (511). The second structure (1402) of Fig. 14 shows an edge part (218) after a degreasing process and a sintering process are performed. The third structure (1403) of Fig. 14 shows an edge part (218) to which a bracket (243) is coupled. The fourth structure (1404) of Fig. 14 shows an edge part (218) in a state in which processing is completed.

[0180] Referring to the first structure (1401) of FIG. 14, a porous part (520) can be formed by injecting a first metal material into a recess (511). The shape of the porous part (520) can be maintained by binding the first metal powders by a binder. The porous part (520) prior to undergoing a post-processing process can fill the recess (511).

[0181] According to an exemplary embodiment, the housing assembly (210) can be manufactured with the first surface (511a) of the recess (511) positioned parallel to the direction of gravity. As illustrated in FIG. 14, when the direction of gravity is parallel to the first surface (511a), the first metal powders can be contracted by gravity to a state in which they are in contact with a portion of the first surface (511a) and the second surface (511b). When the first metal powders are contracted, the first metal powders can remain in contact with a portion of the first surface (511a) and a portion of the second surface (511b) corresponding to the direction of gravity, and can be spaced apart from the remaining portion of the second surface (511b) opposite to the direction of gravity. As the first metal powders shrink while in contact with a portion of the second surface (511b), the porous part (520) of the second structure (1402) may be in contact with a portion of the second surface (511b) facing the direction of gravity and may be spaced apart from the remaining portion of the second surface (511b). The porous part (520) may be arranged asymmetrically with respect to the second surface (511b). A gap (550) may be formed between the porous part (520) and the remaining portion of the second surface (511b).

[0182] Figure 15 illustrates a manufacturing process of a frame in which a porous part is manufactured to have a roughness, with the first surface of the recess positioned parallel to the direction of gravity.

[0183] Referring to FIG. 15, the porous part (520) may include a roughened portion (1310) formed on a surface of the porous part (520) facing inward of the edge part (218). The roughened portion (1310) may be formed by adjusting the roughness of the surface of the porous part (520).

[0184] The first structure (1501) of Fig. 15 shows an edge part (218) in which a first metal material for forming a porous part (520) is injected into a recess (511). The second structure (1502) of Fig. 15 shows an edge part (218) after a degreasing process and a sintering process are performed. The third structure (1503) of Fig. 15 shows an edge part (218) to which a bracket (243) is coupled. The fourth structure (1504) of Fig. 15 shows an edge part (218) in a state in which processing is completed.

[0185] Referring to the first structure (1501) of FIG. 15, a porous part (520) can be formed by injecting a first metal material into a recess (511). The shape of the porous part (520) can be maintained by combining the first metal powders by a binder. The shape of the porous part (520) can be based on the shape of a cavity (e.g., the cavity (811) of FIG. 8A) of a first mold (e.g., the first mold (810) of FIG. 8A) for injecting the first metal material. The cavity can have a shape that can form a protruding portion (1310). The porous part (520) injected by the cavity can include the protruding portion (1310) on a surface facing inward of the edge part (218). Referring to the second structure (1502) of FIG. 15, after the degreasing process and the sintering process are performed, the uneven portion (1310) is maintained, so that the porous part (520) can include the uneven portion (1310). As described above, since the gravity direction (e.g., the gravity direction (D) of FIG. 15) is parallel to the first surface (511a), as the first metal powders shrink, the porous part (520) can come into contact with a portion of the second surface (511b) and be spaced apart from the remaining portion of the second surface (511b). Referring to the third structure (1503) of FIG. 15, when the second metal material is die-casted, the uneven portion (1310) can be positioned inside the bracket (243). The uneven portion (1310) can increase the contact area of ​​the porous part (520) that comes into contact with the bracket (243), so that the bonding area between the bracket (243) and the porous part (520) can increase. As the bracket (243) and the porous part (520) come into contact over a wider area, the bonding force between the bracket (243) and the edge part (218) can increase. According to an exemplary embodiment, the bonding strength between the bracket (243) and the edge part (218) can be improved by the uneven portion (1310).

[0186] An electronic device (101) is disclosed. The electronic device (101) may include a display (201). The electronic device (101) may include a housing assembly (210). The housing assembly (210) may include a rear cover (211) and a frame (240) attached to the rear cover (211). The frame (240) may include a peripheral part (218) formed of a first metal material and including an outer portion (218a) defining a side surface of the electronic device (101) and an inner portion (218b) including a recess (511). The frame (240) may include a porous part (520) formed integrally with the recess (511) of the peripheral part (218). The frame (240) may include a bracket (243) that supports the display (201) and is formed of a second metal material different from the first metal material. The bracket (243) may be formed integrally with the edge part (218) and the porous part (520). A portion of the second metal material forming the bracket (243) may at least partially fill a gap between a surface defining a recess (511) of the edge part (218) and the porous part (520), and at least partially fill pores included in the porous part (520) (e.g., pores (910) of FIG. 9).

[0187] According to one embodiment, the first metal material may include titanium.

[0188] In one embodiment, the second metal material may include aluminum.

[0189] According to one embodiment, the porous part (520) of the frame (240) may include titanium having pores filled with aluminum.

[0190] According to one embodiment, the inner portion (218b) includes a first face (511a) opposite to the side surface, and second faces (511b) extending from the first face (511a), wherein the first face (511a) and the second faces (511b) may define the recess (511). The porous part (520) may be coupled to a portion of the first face (511a) and spaced apart from a portion of the second faces (511b).

[0191] According to one embodiment, the porous part (520) may include a protruding portion (1310) formed on a surface of the porous part (520) facing inward of the frame (240) opposite to the direction of the side surface.

[0192] According to one embodiment, the first portion of the bracket (243) can be joined to the porous part (520) by allowing the second metal material to penetrate into the pores.

[0193] In one embodiment, the specific gravity of the second metal material may be lower than the specific gravity of the first metal material.

[0194] According to one embodiment, the bonding strength of the bracket (243) and the frame (240) may be 10 MPa or more.

[0195] In one embodiment, the second metal material may be included within the porous part (520) and not included within the edge part (218).

[0196] In one embodiment, the density of the second metal material may be lower than the density of the first metal material.

[0197] A method for manufacturing a frame (240) of a housing assembly (210) used for an electronic device (101) is disclosed. The method may include an operation of preparing an edge part (218) including a recess (511). The method may include an operation of placing the edge part (218) in a first mold (810). The method may include an operation of injecting a mixture of first metal powders and a binder into the recess (511) of the edge part (218) using the first mold (810). After the injection, the method may include an operation of separating the edge part (218) having the mixture placed in the recess (511) from the first mold (810). After the separation, the method may include an operation of debinding to remove the binder from the mixture placed in the recess (511). The manufacturing method may include an operation of sintering, after degreasing, to crystallize the first metal powders to form a porous part (520) including pores within the recess (511). By degreasing and sintering, a gap may be formed between the porous part (520) and a surface of the edge part (218) defining the recess (511). The manufacturing method may include an operation of placing the edge part (218) having the porous part (520) formed within the recess (511) in a second mold (1010). The manufacturing method may include an operation of die casting a second metal molten metal using the second mold (1010) in which the frame (240) is placed, to form a bracket (243) including a first portion included within the gap and a second portion included within the pores.

[0198] In one embodiment, the ratio of the binder in the mixture may have a ratio to the first metal powders so as to form the pores.

[0199] According to one embodiment, the voids may be formed by shrinking the first metal powders by the degreasing and sintering.

[0200] In one embodiment, the second metal material may be included in the pores by solidifying after the second metal melt penetrates into the pores.

[0201] An electronic device (101) is disclosed. The electronic device (101) may include a display (201). The electronic device (101) may include an edge part (218) formed of a first metal material and at least partially forming an outer surface (e.g., a side surface) of the electronic device (101). The electronic device (101) may include a bracket (243) that supports the display (201), is formed of a second metal material, and is at least partially surrounded by the edge part (218). The edge part (218) may include a body (510). The edge part (218) may include a recess (511) formed on an inner surface of the body (510). The edge part (218) may include a porous part (520) disposed within the recess (511), coupled to a portion of the recess (511), and including pores (910). The bracket (243) may include a first part (530) coupled to the edge part (218) by being included within a gap (550) between the porous part (520) and the recess (511). The bracket (243) may include a second part (540) coupled to the edge part (218) by being included within the pores (910) of the porous part (520).

[0202] For example, the first metal material may include titanium.

[0203] For example, the second metal material may include aluminum.

[0204] For example, the bracket (243) can be coupled to the edge part (218) through the first part (530) and the second part (540). The bracket (243) can be formed integrally with the edge part (218).

[0205] For example, the recess (511) may include a first surface (511a) facing inwardly of the edge part (218). The recess (511) may include a second surface (511b) extending inwardly from the first surface (511a). The gap (550) may be formed as the porous part (520) contacts a portion of the first surface (511a) and is spaced apart from the second surface (511b). The recess (511) may be defined by the first surface (511a) and the second surface (511b).

[0206] For example, the recess (511) may include a first surface (511a) facing inwardly of the edge part (218). The recess (511) may include a second surface (511b) extending inwardly from the first surface (511a). The gap (550) may be formed as the porous part (520) contacts a portion of the first surface (511a) and a portion of the second surface (511b), and is spaced apart from the remaining portion of the second surface (511b).

[0207] For example, the porous part (520) may include a rough portion (1310) formed on a surface of the porous part (520) facing inward of the edge part (218).

[0208] For example, the first part (530) of the bracket (243) can be joined to the porous part (520) by the second metal material penetrating into the pores (910).

[0209] For example, the specific gravity of the second metal material may be lower than the specific gravity of the first metal material.

[0210] For example, the bonding strength of the bracket (243) and the edge part (218) may be 10 MPa or more.

[0211] A method for manufacturing a housing assembly (210) including an edge part (218) and a bracket (243) is disclosed. The method may include an operation of preparing a body (510) of the edge part (218) including a recess (511). The method may include an operation of forming the porous part (520) within the recess (511) by metal injection molding (MIM) first metal powders and a binder using a first mold (810) for forming the porous part (520). The method may include an operation of degreasing to remove the binder. The method may include an operation of sintering to crystallize the first metal powders. The above manufacturing method may include an operation of forming a gap (550) between the recess (511) and the porous part (520) and the bracket (243) coupled to the porous part (520) by die casting a second metal molten metal using a second mold (1010) for forming the bracket (243). The bracket (243) may be coupled to the edge part (218) as the second metal material is included in the gap (550) and the pores (910) of the porous part (520).

[0212] For example, the edge part (218) may be formed of a first metal material.

[0213] For example, the above pores (910) can be formed as the first metal powders shrink by the degreasing operation and the sintering operation.

[0214] For example, the second metal may be included in the pores (910) as the second metal molten metal solidifies after penetrating into the pores (910).

[0215] For example, the gap (550) can be formed as the binder is removed and the first metal powders shrink by the degreasing operation and the sintering operation.

[0216] For example, the first metal material may include titanium. The second metal material may include aluminum.

[0217] For example, the specific gravity of the second metal material may be lower than the specific gravity of the first metal material.

[0218] For example, the recess (511) may include a first surface (511a) facing inwardly of the edge part (218). The recess (511) may include a second surface (511b) extending inwardly from the first surface (511a). The gap (550) may be formed as the porous part (520) contacts a portion of the first surface (511a) and is spaced apart from the second surface (511b).

[0219] For example, the recess (511) may include a first surface (511a) facing inwardly of the edge part (218). The recess (511) may include a second surface (511b) extending inwardly from the first surface (511a). The gap (550) may be formed as the porous part (520) contacts a portion of the first surface (511a) and a portion of the second surface (511b), and is spaced apart from the remaining portion of the second surface (511b).

[0220] For example, the manufacturing method may further include an operation of forming a protruding portion (1310) formed on the surface of the porous part (520) facing inward of the edge part (218).

[0221] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0222] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0223] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0224] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0225] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or a relay server.

[0226] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, display; and including a housing assembly, The above housing assembly, rear cover, and Including a frame attached to the above rear cover, The above frame is, A peripheral part formed of a first metal material and including an outer portion defining a side surface of the electronic device and an inner portion including a recess, A porous part formed integrally with the recess of the edge part, and Supporting the display, the bracket comprises a second metal material different from the first metal material, wherein the bracket is formed integrally with the edge part and the porous part. A portion of the second metal material forming the bracket, At least partially filling the gap between the surface defining the recess of the porous part and the edge part, and at least partially filling the pores contained within the porous part, Electronic devices.

2. In paragraph 1, The above first metal material is, Containing titanium, Electronic devices.

3. In paragraph 1 or 2, The above second metal material is, Containing aluminum, Electronic devices.

4. In any one of paragraphs 1 to 3, The porous part of the above frame, Containing titanium having pores filled with aluminum, Electronic devices.

5. In any one of paragraphs 1 to 4, The inner part above is, A first side opposite to the above side, and comprising second faces extending from the first face, wherein the first face and the second face define the recess; The above porous part, coupled to a portion of the first surface and spaced apart from a portion of the second surfaces, Electronic devices.

6. In any one of paragraphs 1 to 5, The above porous part, Including a protruding portion formed on the surface of the porous part facing the inside of the frame opposite to the direction of the side surface, Electronic devices.

7. In any one of paragraphs 1 to 6, The first part of the above bracket, By the second metal material penetrating into the pores, the bracket is joined to the porous part. Electronic devices.

8. In any one of paragraphs 1 to 7, The specific gravity of the above second metal material is Lower than the specific gravity of the first metal material, Electronic devices.

9. In any one of paragraphs 1 to 8, The joint strength of the above bracket and the above frame is 10MPa or more, Electronic devices.

10. In any one of paragraphs 1 to 9, The above second metal material is, Included within the above porous part and not included within the above edge part, Electronic devices.

11. In any one of paragraphs 1 to 10, The density of the second metal material is: Lower than the density of the first metal material, Electronic devices.

12. A method for manufacturing a frame of a housing assembly used for an electronic device, An action to prepare an edge part including a recess; An action of placing the edge part within the first mold; An operation of injecting a mixture of first metal powders and a binder into the recess of the edge part using the first mold; After injection, an operation of separating the edge part having the mixture placed within the recess from the first mold; After separation, a debinding operation is performed to remove the binder from the mixture placed within the recess; After degreasing, a sintering operation is performed to crystallize the first metal powders to form a porous part including pores within the recess, and by degreasing and sintering, a gap is formed between the porous part and the surface defining the recess of the edge part; An operation of placing an edge part having the porous part formed within the recess into a second mold; and An operation of die casting a second metal molten metal using the second mold in which the frame is arranged, so as to form a bracket including a first part included in the gap and a second part included in the voids, Manufacturing method.

13. In paragraph 12, The ratio of the binder in the above mixture is, having a ratio for the first metal powders to form the above pores, Manufacturing method.

14. In paragraph 12 or 13, The above gaps are, The above first metal powders are formed by shrinking through the above degreasing and the above sintering. Manufacturing method.

15. In any one of paragraphs 12 to 14, The second metal material forming the bracket is, After the second metal melt penetrates into the pores and solidifies, it is contained within the pores. Manufacturing method.

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