Micro display panel and method for forming same, and near-eye display device

Abstract

A micro display panel and a method for forming same, and a near-eye display device, which relate to the technical field of micro display. The micro display panel comprises: a driving backplane; a micro display chip and a plurality of first lead-out boards, which are located on the driving backplane, wherein the micro display chip and the plurality of first lead-out boards are electrically connected to the driving backplane; a circuit board, which has a first face and a second face opposite to each other, wherein the driving backplane is fixedly connected to the first face of the circuit board; a plurality of second lead-out boards located on the second face of the circuit board, wherein the plurality of second lead-out boards are electrically connected to the circuit board; a plurality of third lead-out boards located on the first face of the circuit board, wherein the third lead-out boards are respectively electrically connected to the corresponding second lead-out boards; and a wire arrangement structure, which is electrically connected to the plurality of first lead-out boards and the plurality of third lead-out boards. The driving backplane is stacked and fixed onto the circuit board, and the electrical connection between the driving backplane and the circuit board is then realized by using the wire arrangement structure, such that requirements in terms of the design of a circuit are met. The manner in which a connection is realized by means of stacking and fixing reduces the space occupied by the micro display panel in a transverse direction, thereby making the overall structure of the micro display panel more compact. In addition, by using a wire arrangement structure as a conduction carrier, a gold-wire welding process is omitted, thereby reducing the overall size of the micro display panel.

Description

Micro display panel and forming method thereof, near-eye display device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 26, 2024, with application number 2024103587919 and invention name “Microdisplay panel and method for forming same, near-eye display device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the field of microdisplay technology, and in particular to a microdisplay panel and a method for forming the same, and a near-eye display device. Background Art

[0003] Inorganic micro-pixel light-emitting diodes, also known as micro-LEDs (Micro LEDs or μ-LEDs), have become increasingly important since they are being used in a variety of applications, including self-luminous micro-displays, visible light communications, and optogenetics. Compared to traditional LEDs, Micro LEDs offer improved strain relaxation, better light extraction efficiency, uniform current spreading, and higher output performance. Micro LEDs also offer improved thermal effects, faster response times, a wider operating temperature range, higher resolution, a wider color gamut, higher contrast, lower power consumption, and higher current density.

[0004] However, there are still many problems with the Micro LED micro display panels in the existing technology.

[0005] Summary of the Invention

[0006] The technical problem solved by the present invention is to provide a micro display panel and a method for forming the same, and a near-eye display device, so as to make the structure of the micro display panel more compact and reduce the overall volume of the micro display panel.

[0007] To solve the above problems, the technical solution of the present invention provides a micro display panel, comprising: a driving backplane; a micro display chip and a plurality of first lead plates located on the driving backplane, the micro display chip and the plurality of first lead plates being electrically connected to the driving backplane respectively; a circuit board, the circuit board having a first surface and a second surface relative to each other, the driving backplane being fixedly connected to the first surface of the circuit board; a plurality of second lead plates located on the second surface of the circuit board, the plurality of second lead plates being electrically connected to the circuit board respectively; a plurality of third lead plates located on the first surface of the circuit board, each of the third lead plates being electrically connected to the corresponding second lead plates respectively; and a wiring structure, the wiring structure being electrically connected to the plurality of first lead plates and the plurality of third lead plates respectively.

[0008] Optionally, the wiring structure includes: a substrate; a plurality of connecting lines located on the substrate, each connecting line having a first connecting portion and a second connecting portion relative to each other; the first connecting portion of each connecting line is electrically connected to the corresponding first lead plate; and the second connecting portion of each connecting line is electrically connected to the corresponding third lead plate.

[0009] Optionally, each of the connecting lines further has a middle portion located between the first connecting portion and the second connecting portion and connected to the first connecting portion and the second connecting portion respectively, and the first connecting portion and the second connecting portion respectively protrude from the middle portion.

[0010] Optionally, the cable arrangement structure further includes a covering film, wherein the covering film covers middle portions of the plurality of connecting wires.

[0011] Optionally, the wiring structure electrically connects the plurality of first lead plates and the plurality of third lead plates through an anisotropic conductive film lamination process or an alignment welding process.

[0012] Optionally, it also includes: a plurality of lead through holes located in the circuit board, each of the lead through holes extending from the first surface to the second surface of the circuit board, and each of the lead through holes respectively exposing the corresponding second lead plate; a conductive column located in each of the lead through holes, and each of the third lead plates is respectively electrically connected to the corresponding conductive column.

[0013] Optionally, the circuit board has a raised portion, each of the lead through holes passes through the raised portion, and a plurality of the third lead plates are located on the raised portion; after the driving back plate is fixedly connected to the circuit board, the height of the first lead plate is flush with that of the third lead plates.

[0014] Optionally, the material of the first lead plate includes: one or more combinations of gold, copper, nickel, aluminum and tin.

[0015] Optionally, the material of the circuit board includes: one or more combinations of alumina ceramics or aluminum nitride ceramics.

[0016] Correspondingly, the technical solution of the present invention also provides a method for forming a micro display panel, including: providing a driving backplane; forming a micro display chip and several first lead plates on the driving backplane, the micro display chip and several first lead plates are electrically connected to the driving backplane respectively; forming a wiring structure; providing a circuit board, the circuit board having a first surface and a second surface relative to each other; forming several second lead plates on the second surface of the circuit board, the several second lead plates are electrically connected to the circuit board respectively; forming several third lead plates on the first surface of the circuit board, each of the third lead plates is electrically connected to the corresponding second lead plates respectively; fixing the driving backplane to the first surface of the circuit board; after fixing the driving backplane to the circuit board, electrically connecting the wiring structure to the several first lead plates and the several third lead plates respectively.

[0017] Optionally, the wiring structure includes: a substrate; a plurality of connecting wires located on the substrate, each of the connecting wires having a first connecting portion and a second connecting portion relative to each other; a method of electrically connecting the wiring structure to a plurality of the first lead plates and a plurality of the third lead plates, respectively, including: electrically connecting the first connecting portion of each of the connecting wires to the corresponding first lead plate; and electrically connecting the second connecting portion of each of the connecting wires to the corresponding third lead plate.

[0018] Optionally, each of the connecting lines further has an intermediate portion located between the first connecting portion and the second connecting portion and connected to the first connecting portion and the second connecting portion respectively, and the first connecting portion and the second connecting portion respectively protrude from the intermediate portion; the wiring structure further includes: a covering film, the covering film covering the intermediate portions of several of the connecting lines; the method for forming the wiring structure includes: providing the substrate; forming several of the connecting lines on the substrate; and forming the covering film on the substrate.

[0019] Optionally, a method of forming a plurality of third lead plates on the first surface of the circuit board, wherein each of the third lead plates is electrically connected to the corresponding second lead plate, includes: performing a perforation process from the first surface of the circuit board to the second surface of the circuit board, forming a plurality of lead through-holes in the circuit board, wherein each of the lead through-holes exposes the corresponding second lead plate; forming a conductive column in each of the lead through-holes; and forming a plurality of third lead plates on the first surface of the circuit board, wherein each of the third lead plates is electrically connected to the corresponding conductive column.

[0020] Optionally, the perforation processing process includes: one or more combinations of a laser perforation process and a wet perforation process.

[0021] Optionally, the process of forming the plurality of first lead plates on the driving backplane includes: one or a combination of a magnetron sputtering coating process, an electron beam evaporation process and an electroplating process.

[0022] Optionally, the wiring structure electrically connects the plurality of first lead plates and the plurality of third lead plates through an anisotropic conductive film lamination process or an alignment welding process.

[0023] Correspondingly, the technical solution of the present invention further provides a near-eye display device, comprising: a micro display panel as described in any one of the above technical solutions.

[0024] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0025] In the microdisplay panel of the present invention, the driver backplane is stacked and fixed to the circuit board, and the electrical connection between the driver backplane and the circuit board is achieved using a wiring structure to meet circuit design requirements. This stacked and fixed connection reduces the lateral volume occupied by the microdisplay panel, making the overall structure of the microdisplay panel more compact. Furthermore, by using the wiring structure as a conductive carrier, the gold wire bonding process is eliminated, reducing the overall volume of the microdisplay panel.

[0026] Furthermore, the circuit board has a raised portion, through which a plurality of lead holes extend, and a plurality of third lead plates are formed on the raised portion; after the driver backplane and the circuit board are fixedly connected, the first lead plate and the third lead plate are flush. The raised portion ensures that the first and third lead plates are at the same level after the driver backplane and the circuit board are fixedly connected, facilitating the connection of the wiring structure and improving the connection stability of the wiring structure.

[0027] In the method for forming a microdisplay panel according to the technical solution of the present invention, the microdisplay panel of the technical solution of the present invention utilizes a stacked driver backplane fixed to a circuit board, and then utilizes a wiring structure to achieve electrical connection between the driver backplane and the circuit board, thereby meeting circuit design requirements. This stacked fixed connection method reduces the lateral volume occupied by the microdisplay panel, making the overall structure of the microdisplay panel more compact. Furthermore, by using the wiring structure as a conductive carrier, the gold wire welding process is eliminated, thereby reducing the overall volume of the microdisplay panel.

[0028] Furthermore, the circuit board has a raised portion, through which a plurality of lead holes extend, and a plurality of third lead plates are formed on the raised portion; after the driver backplane and the circuit board are fixedly connected, the first lead plate and the third lead plate are flush. The raised portion ensures that the first and third lead plates are at the same level after the driver backplane and the circuit board are fixedly connected, facilitating the connection of the wiring structure and improving the connection stability of the wiring structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a schematic structural diagram of a Micro LED micro display panel;

[0030] 2 to 9 are schematic structural diagrams of various steps of a method for forming a micro display panel according to an embodiment of the present invention;

[0031] FIG10 is a schematic structural diagram of a micro display panel according to another embodiment of the present invention. DETAILED DESCRIPTION

[0032] As described in the background art, the existing Micro LED display panels still have many problems, which will be described in detail below with reference to the accompanying drawings.

[0033] FIG1 is a schematic diagram of the structure of a Micro LED micro display panel.

[0034] Please refer to Figure 1. A Micro LED micro display panel includes: a micro display chip 10, a driver backplane 11, an FPC flexible cable 12 and a connector 13. The micro display chip 10 is electrically connected to the driver backplane. One end of the FPC flexible cable 12 is electrically connected to the micro display chip 10 through a plurality of gold wires 14. The other end of the FPC flexible cable is electrically connected to the connector 13. The connector 13 is suitable for electrical connection to external matching equipment.

[0035] Current microdisplay panels utilize Chip on Board (COB) or Molding on Board (MOC) packaging. Both require wire bonding to the gold wires 14, forcing the FPC cable 12 and connector 13 to be connected flat. This significantly increases the horizontal volume of the microdisplay panel. Furthermore, the gold wire bonding also requires a certain amount of space, further increasing the overall size of the microdisplay panel.

[0036] On this basis, the present invention provides a microdisplay panel, a method for forming the same, and a near-eye display device. By stacking and fixing a driver backplane to a circuit board, and then utilizing a wiring structure to achieve electrical connection between the driver backplane and the circuit board, the present invention meets circuit design requirements. This stacked, fixed connection reduces the lateral volume occupied by the microdisplay panel, making the overall structure of the microdisplay panel more compact. Furthermore, by using the wiring structure as a conductive carrier, the gold wire welding process is eliminated, reducing the overall volume of the microdisplay panel.

[0037] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0038] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," and "bottom" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate description and simplify the present invention. They are not intended to indicate or imply that the positions or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations of the present invention. Furthermore, the terms "first" and "second" are used solely to distinguish an entity or operation from another entity or operation and do not require or imply any actual relationship, order, or relative importance between these entities or operations.

[0039] 2 to 9 are schematic structural diagrams of various steps of a method for forming a micro display panel according to one embodiment of the present invention; FIG. 10 is a schematic structural diagram of a micro display panel according to another embodiment of the present invention.

[0040] Please refer to FIG. 2 and FIG. 3 . FIG. 3 is a schematic cross-sectional view taken along line AA of FIG. 2 , showing a driving backplane 200 .

[0041] In some embodiments, the driving backplane 200 may be an IC (Integrated Circuit) substrate or a TFT (Thin Film Transistor) substrate.

[0042] 2 and 3 , a micro display chip 201 and a plurality of first lead plates 202 are formed on the driving backplane 200 , and the micro display chip 201 and the plurality of first lead plates 202 are electrically connected to the driving backplane 200 , respectively.

[0043] In some embodiments, the material of the first lead plate 202 includes one or more combinations of gold, copper, nickel, aluminum, and tin.

[0044] In some embodiments, the process of forming the plurality of first lead plates 202 on the driving back plate 200 includes: one or a combination of a magnetron sputtering coating process, an electron beam evaporation process, and an electroplating process.

[0045] It should be noted that, in this embodiment, the first lead plates 202 may be arranged in one row or multiple rows, and the first lead plates 202 may be located at any position outside the coverage area of ​​the micro display chip 201 .

[0046] Please refer to FIG. 4 and FIG. 5 . FIG. 5 is a schematic cross-sectional view along line BB in FIG. 4 , showing a wiring structure 203 .

[0047] In this embodiment, the wiring structure 203 includes: a substrate 2031 ; and a plurality of connecting wires 2032 located on the substrate 2031 . Each connecting wire 2032 has a first connecting portion 2032 a and a second connecting portion 2032 b opposite to each other.

[0048] In this embodiment, each connecting line 2032 further has a middle portion 2032c located between the first connecting portion 2032a and the second connecting portion 2032b and connected to the first connecting portion 2032a and the second connecting portion 2032b respectively. The first connecting portion 2032a and the second connecting portion 2032b respectively protrude from the middle portion 2032c.

[0049] In this embodiment, the cable structure 203 further includes a covering film 2033 , which covers the middle portions 2032 c of the plurality of connecting wires 2032 .

[0050] In this embodiment, the method for forming the wiring structure 203 includes: providing a substrate 2031 ; forming a plurality of connecting wires 2032 on the substrate 2031 ; and forming a covering film 2033 on the substrate 2031 .

[0051] Please refer to FIG6 and FIG7 . FIG7 is a cross-sectional view taken along line CC in FIG6 . A circuit board 204 is provided. The circuit board 204 has a first surface 204 a and a second surface 204 b opposite to each other.

[0052] It should be noted that, in this embodiment, the circuit board 204 is used to connect the micro display panel with external devices. The first surface 204a of the circuit board 204 is the front surface of the circuit board 204, and the second surface 204b of the circuit board 204 is the back surface of the circuit board 204.

[0053] In some embodiments, the material of the circuit board 204 includes: alumina ceramic or aluminum nitride ceramic or one or more combinations thereof.

[0054] In this embodiment, the circuit board 204 has a protrusion 2041 .

[0055] Please continue to refer to Figures 6 and 7. Several second lead plates 205 are formed on the second surface 204b of the circuit board 204, and the several second lead plates 205 are electrically connected to the circuit board 204 respectively; several third lead plates 206 are formed on the first surface 204a of the circuit board 204, and each third lead plate 206 is electrically connected to the corresponding second lead plate 205.

[0056] In this embodiment, a plurality of third lead plates 206 are formed on the first surface 204a of the circuit board 204, and a method for electrically connecting each third lead plate 206 to the corresponding second lead plate 205 includes: performing a perforation process from the first surface 204a of the circuit board 204 to the second surface 204b of the circuit board 204, forming a plurality of lead through holes (not marked) in the circuit board 204, each lead through hole exposing the corresponding second lead plate 205; forming a conductive column 207 in each lead through hole; and forming a plurality of third lead plates 206 on the first surface 204a of the circuit board 204, each third lead plate 206 being electrically connected to the corresponding conductive column 207.

[0057] In some embodiments, the perforation process includes: a laser perforation process and a wet perforation process, or a combination thereof.

[0058] In this embodiment, a plurality of lead through holes penetrate the protruding portion 2041 , and a plurality of third lead plates 206 are formed on the protruding portion 2041 .

[0059] It should be noted that, in this embodiment, the protrusion 2041 is only used to stack a number of third lead plates 206 . Therefore, in order to avoid surface perforation and damage to the circuit board 204 , no circuit structure is provided in the protrusion 2041 .

[0060] It should be noted that in this embodiment, the number of second lead plates 205 is larger, and the number of third lead plates 206 is smaller, and each third lead plate 206 is electrically connected to only one second lead plate 205; the number of lead through holes is the same as the number of second lead plates 205, and each third lead plate 206 is electrically connected to a lead column in a lead through hole.

[0061] Please refer to Figures 8 and 9. Figure 9 is a cross-sectional diagram along line DD in Figure 8, in which the driver backplane 200 is fixedly connected to the first surface 204a of the circuit board 204. After the driver backplane 200 is fixedly connected to the circuit board 204, the wiring structure 203 is electrically connected to the first lead plates 202 and the third lead plates 206 respectively.

[0062] By stacking and securing the driver backplane 200 onto the circuit board 204, and then utilizing the wiring structure 203 to achieve electrical connection between the driver backplane 200 and the circuit board 204, circuit design requirements are met. This stacked, fixed connection reduces the lateral volume occupied by the microdisplay panel, making the overall structure of the microdisplay panel more compact. Furthermore, by utilizing the wiring structure 203 as a conductive carrier, the gold wire bonding process is eliminated, further reducing the overall volume of the microdisplay panel.

[0063] In this embodiment, the method of electrically connecting the wiring structure 203 to a plurality of first lead plates 202 and a plurality of third lead plates 206 includes: electrically connecting the first connection portion 2032a of each connecting wire 2032 to the corresponding first lead plate 202; and electrically connecting the second connection portion 2032b of each connecting wire 2032 to the corresponding third lead plate 206.

[0064] In this embodiment, after the driver backplane 200 and the circuit board 204 are fixedly connected, the first lead plate 202 and the third lead plate 206 are flush with each other. The raised portion 2041 ensures that after the driver backplane 200 and the circuit board 204 are fixedly connected, the first lead plate 202 and the third lead plate 206 are at the same level, facilitating the connection of the wiring structure 203 and improving the connection stability of the wiring structure 203.

[0065] 9 , in this embodiment, the driver backplane 200 and the circuit board 204 are bonded and fixed together using glue, and the wiring structure 203 utilizes an anisotropic conductive film 208 (ACF) lamination process to electrically connect the plurality of first lead plates 202 and the plurality of third lead plates 206, thereby achieving electrical connection between the driver backplane 200 and the circuit board 204. The anisotropic conductive film 208 is only coated on the surfaces of the first lead plates 202 and the third lead plates 206.

[0066] Referring to FIG. 10 , in other embodiments, the anisotropic conductive adhesive film 208 may also be coated on the surfaces of the first lead plate 202 and the third lead plate 206 , and in the gap between the first lead plate 202 and the third lead plate 206 .

[0067] In other embodiments, the wiring structure may further utilize an alignment welding process to electrically connect a plurality of first lead plates and a plurality of third lead plates, thereby achieving electrical connection between the driving back plate and the circuit board.

[0068] In this embodiment, the micro display panel is a Micro LED micro display panel.

[0069] The microdisplay panel has a very small size, with length and width dimensions ranging from 500μm to 50,000μm. The light-emitting area of ​​the microdisplay panel is very small, such as 1mm×1mm, 2.64mm×2.02mm, 3mm×5mm, etc. The light-emitting area of ​​the microdisplay panel includes a plurality of micro-LED pixels arranged in an array. The specific pixel arrangement can be one of 320×240, 640×480, 1600×1200, 1920×1080, and 2560×1440. The size of a single micro-LED pixel is between 100nm and 100 microns.

[0070] In some embodiments, the size of a single micro-LED pixel is between 150 nm and 15 microns.

[0071] In some embodiments, the size of a single micro LED pixel can be smaller than 10 microns.

[0072] A driving backplane 200 is provided on the back of the micro-LED pixel array. The driving backplane 200 is electrically connected to the micro-LEDs in the micro-LED pixel array. The driving backplane 200 can obtain signals such as image data from the outside world and can control the corresponding micro-LEDs to emit light or not. For example, the driving backplane 200 of the above-mentioned micro-display panel integrates a frame buffer, a column driving circuit, and a row driving circuit. The frame buffer includes a first pixel storage area, and the micro-LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of ​​the frame buffer. The column driving circuit can load the pixel grayscale data in the first pixel storage area of ​​the frame buffer into the second pixel storage area of ​​the micro-LED pixel array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different grayscales. When driving multiple micro-LED pixels in the micro-LED pixel array, either a single pixel can be driven independently or multiple pixel units can be driven independently. The specific driving method should not constitute a limitation to this application.

[0073] Correspondingly, an embodiment of the present invention further provides a micro display panel, please continue to refer to Figures 8 and 9, including: a driving backplane 200; a micro display chip 201 and a plurality of first lead plates 202 located on the driving backplane 200, the micro display chip 201 and the plurality of first lead plates 202 being electrically connected to the driving backplane 200 respectively; a circuit board 204, the circuit board 204 having a first surface 204a and a second surface 204b opposite to each other, the driving backplane 200 being fixedly connected to the first surface 204a of the circuit board 204; a plurality of second lead plates 205 located on the second surface 204b of the circuit board 204, the plurality of second lead plates 205 being electrically connected to the circuit board 204 respectively; a plurality of third lead plates 206 located on the first surface 204a of the circuit board 204, each third lead plate 206 being electrically connected to a corresponding second lead plate 205; and a wiring structure 203, the wiring structure 203 being electrically connected to the plurality of first lead plates 202 and the plurality of third lead plates 206 respectively.

[0074] By stacking and securing the driver backplane 200 onto the circuit board 204, and then utilizing the wiring structure 203 to achieve electrical connection between the driver backplane 200 and the circuit board 204, circuit design requirements are met. This stacked, fixed connection reduces the lateral volume occupied by the microdisplay panel, making the overall structure of the microdisplay panel more compact. Furthermore, by utilizing the wiring structure 203 as a conductive carrier, the gold wire bonding process is eliminated, further reducing the overall volume of the microdisplay panel.

[0075] 4 and 5 , in this embodiment, the cable structure 203 includes: a substrate 2031 ; and a plurality of connecting wires 2032 located on the substrate 2031 . Each connecting wire 2032 has a first connecting portion 2032 a and a second connecting portion 2032 b opposite to each other.

[0076] In this embodiment, the wiring structure 203 is electrically connected to several first lead plates 202 and several third lead plates 206 respectively, including: the first connection portion 2032a of each connecting wire 2032 is electrically connected to the corresponding first lead plate 202; the second connection portion 2032b of each connecting wire 2032 is electrically connected to the corresponding third lead plate 206.

[0077] In this embodiment, each connecting line 2032 further includes a middle portion 2032c located between the first connecting portion 2032a and the second connecting portion 2032b and connected to the first connecting portion 2032a and the second connecting portion 2032b respectively. The first connecting portion 2032a and the second connecting portion 2032b respectively protrude from the middle portion 2032c.

[0078] Continuing to refer to FIG. 4 and FIG. 5 , in this embodiment, the cable structure 203 further includes a covering film 2033 , which covers the middle portions 2032 c of the plurality of connecting wires 2032 .

[0079] Please continue to refer to Figures 6 and 7. In this embodiment, the present invention further includes: a plurality of lead through holes (not shown) located in the circuit board 204, each lead through hole extending from the first surface 204a of the circuit board 204 to the second surface 204b, and each lead through hole exposes the corresponding second lead plate 205; a conductive column 207 located in each lead through hole, and each third lead plate 206 is electrically connected to the corresponding conductive column 207.

[0080] In this embodiment, the circuit board 204 has a raised portion 2041, through which each lead through-hole extends. A plurality of third lead plates 206 are located on the raised portion 2041. After the driver backplane 200 is fixedly connected to the circuit board 204, the first lead plate 202 and the third lead plate 206 are flush. The raised portion 2041 ensures that the first lead plate 202 and the third lead plate 206 are at the same level after the driver backplane 200 and the circuit board 204 are fixedly connected, facilitating the connection of the wiring structure 203 and improving the connection stability of the wiring structure 203.

[0081] In some embodiments, the material of the first lead plate 202 includes one or more combinations of gold, copper, nickel, aluminum, and tin.

[0082] In some embodiments, the material of the circuit board 204 includes: alumina ceramic or aluminum nitride ceramic or one or more combinations thereof.

[0083] 9 , in this embodiment, the driver backplane 200 and the circuit board 204 are bonded and fixed together using glue, and the wiring structure 203 utilizes an anisotropic conductive film 208 (ACF) lamination process to electrically connect the plurality of first lead plates 202 and the plurality of third lead plates 206, thereby achieving electrical connection between the driver backplane 200 and the circuit board 204. The anisotropic conductive film 208 is only coated on the surfaces of the first lead plates 202 and the third lead plates 206.

[0084] Continuing with FIG. 10 , in other embodiments, the anisotropic conductive adhesive film 208 may also be coated on the surfaces of the first lead plate 202 and the third lead plate 206 , and in the gap between the first lead plate 202 and the third lead plate 206 .

[0085] In other embodiments, the wiring structure may further utilize an alignment welding process to electrically connect a plurality of first lead plates and a plurality of third lead plates, thereby achieving electrical connection between the driving back plate and the circuit board.

[0086] Correspondingly, the technical solution of the present invention further provides a near-eye display device, comprising: a micro display panel as in any one of the above embodiments.

[0087] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A micro display panel, characterized in that: include: Driver backplane; A micro display chip and a plurality of first lead plates are located on the driving backplane, wherein the micro display chip and the plurality of first lead plates are electrically connected to the driving backplane respectively; A circuit board having a first surface and a second surface opposite to each other, wherein the driving backplane is fixedly connected to the first surface of the circuit board; a plurality of second lead plates located on the second surface of the circuit board, wherein the plurality of second lead plates are electrically connected to the circuit board respectively; a plurality of third lead plates located on the first surface of the circuit board, each of the third lead plates being electrically connected to a corresponding second lead plate; A wiring structure is electrically connected to the first lead plates and the third lead plates respectively.

2. The micro display panel according to claim 1, wherein: The wiring structure includes: a substrate; a plurality of connecting wires located on the substrate, each connecting wire having a first connecting portion and a second connecting portion relative to each other; the first connecting portion of each connecting wire is electrically connected to the corresponding first lead plate; and the second connecting portion of each connecting wire is electrically connected to the corresponding third lead plate.

3. The micro display panel according to claim 2, wherein: Each of the connecting lines further includes a middle portion located between the first connecting portion and the second connecting portion and connected to the first connecting portion and the second connecting portion respectively, and the first connecting portion and the second connecting portion respectively protrude from the middle portion.

4. The micro display panel according to claim 3, characterized in that: The cable arrangement structure further includes a covering film, wherein the covering film covers the middle portions of the plurality of connecting wires.

5. The micro display panel according to claim 1, wherein: The wiring structure electrically connects a plurality of first lead plates and a plurality of third lead plates through an anisotropic conductive film lamination process or an alignment welding process.

6. The micro display panel according to claim 1, wherein: Also includes: A plurality of lead through holes are located in the circuit board, each of the lead through holes extends from the first surface to the second surface of the circuit board, and each of the lead through holes exposes the corresponding second lead plate; a conductive column is located in each of the lead through holes, and each of the third lead plates is electrically connected to the corresponding conductive column.

7. The micro display panel according to claim 6, characterized in that: The circuit board has a raised portion, each of the lead through holes passes through the raised portion, and a plurality of the third lead plates are located on the raised portion; after the driving back plate is fixedly connected to the circuit board, the first lead plate is flush with the third lead plate.

8. The micro display panel according to claim 1, wherein: The material of the first lead plate includes one or more combinations of gold, copper, nickel, aluminum and tin.

9. The micro display panel according to claim 1, wherein: The material of the circuit board includes: one or more combinations of alumina ceramics or aluminum nitride ceramics.

10. A method for forming a micro display panel, characterized in that: include: Provide driver backplane; A micro display chip and a plurality of first lead plates are formed on the driving backplane, wherein the micro display chip and the plurality of first lead plates are electrically connected to the driving backplane respectively; forming a wiring structure; Providing a circuit board, the circuit board having a first side and a second side opposite to each other; A plurality of second lead plates are formed on the second surface of the circuit board, and the plurality of second lead plates are electrically connected to the circuit board respectively; A plurality of third lead plates are formed on the first surface of the circuit board, and each of the third lead plates is electrically connected to a corresponding second lead plate; The driving back plate is fixedly connected to the first surface of the circuit board; After the driving back plate is fixedly connected to the circuit board, the wiring structure is electrically connected to a plurality of the first lead plates and a plurality of the third lead plates respectively.

11. The method for forming a micro display panel according to claim 10, wherein: The wiring structure includes: a substrate; a plurality of connecting wires located on the substrate, each of the connecting wires having a first connecting portion and a second connecting portion relative to each other; a method for electrically connecting the wiring structure to the plurality of first lead plates and the plurality of third lead plates respectively includes: electrically connecting the first connecting portion of each of the connecting wires to the corresponding first lead plate; and electrically connecting the second connecting portion of each of the connecting wires to the corresponding third lead plate.

12. The method for forming a micro display panel according to claim 11, wherein: Each of the connecting lines further comprises a middle portion located between the first connecting portion and the second connecting portion and connected to the first connecting portion and the second connecting portion respectively, wherein the first connecting portion and the second connecting portion respectively protrude from the middle portion; The wiring structure further includes: a covering film, which covers the middle portions of the plurality of connecting wires. The method for forming the wiring structure includes: providing the substrate; forming the plurality of connecting wires on the substrate; and forming the covering film on the substrate.

13. The method for forming a micro display panel according to claim 10, wherein: A method for forming a plurality of third lead plates on the first surface of the circuit board, wherein each of the third lead plates is electrically connected to the corresponding second lead plates, comprises: performing a perforation process from the first surface of the circuit board to the second surface of the circuit board to form a plurality of lead through-holes in the circuit board, wherein each of the lead through-holes exposes the corresponding second lead plate; forming a conductive column in each of the lead through-holes; and forming a plurality of third lead plates on the first surface of the circuit board, wherein each of the third lead plates is electrically connected to the corresponding conductive column.

14. The method for forming a micro display panel according to claim 13, wherein: The perforation processing process includes: a laser perforation process and a wet perforation process or a combination of multiple processes.

15. The method for forming a micro display panel according to claim 10, wherein: The process of forming the plurality of first lead plates on the driving backplane includes: one or a combination of magnetron sputtering coating process, electron beam evaporation process and electroplating process.

16. The method for forming a micro display panel according to claim 10, wherein: The wiring structure electrically connects a plurality of first lead plates and a plurality of third lead plates through an anisotropic conductive film lamination process or an alignment welding process.

17. A near-eye display device, characterized in that: include: The micro display panel according to any one of claims 1 to 9.

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