Micro-display panel and forming method therefor, and near-eye display device

Abstract

A micro-display panel and a forming method therefor, and a near-eye display device. The forming method comprises: providing a driver backplane, the driver backplane having a first side and a second side; forming a micro-display chip and a plurality of lead boards on the first side; punching the driver backplane from the first side to the second side, so as to form a plurality of lead vias in the driver backplane; forming a plurality of connection lines in the lead vias and on the second side of the driver backplane, each connection line being electrically connected to the corresponding lead board; and forming a connector on the second side, the connector being electrically connected to each connection line. The plurality of lead vias are formed in the driver backplane, and by means of the plurality of connection lines in the lead vias and on the second side, the lead paths of the micro-display panel are transferred to the second side of the driver backplane; if there are other device structures (such as a connector) on the micro-display panel, said device structures can be fixed to the second side of the driver backplane, thereby not only meeting the requirements on circuit design, but also effectively reducing the overall size of the micro-display panel.

Description

Micro display panel and forming method thereof, near-eye display device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 26, 2024, with application number 2024103546482 and invention name “Microdisplay panel and method for forming same, near-eye display device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the field of microdisplay technology, and in particular to a microdisplay panel and a method for forming the same, and a near-eye display device. Background Art

[0003] Inorganic micro-pixel light-emitting diodes, also known as micro-LEDs (Micro LEDs or μ-LEDs), have become increasingly important since they are being used in a variety of applications, including self-luminous micro-displays, visible light communications, and optogenetics. Compared to traditional LEDs, Micro LEDs offer improved strain relaxation, better light extraction efficiency, uniform current spreading, and higher output performance. Micro LEDs also offer improved thermal effects, faster response times, a wider operating temperature range, higher resolution, a wider color gamut, higher contrast, lower power consumption, and higher current density.

[0004] However, there are still many problems with the Micro LED micro display panels in the existing technology.

[0005] Summary of the Invention

[0006] The technical problem solved by the present invention is to provide a micro display panel and a method for forming the same, and a near-eye display device, so as to reduce the volume of the micro display panel.

[0007] To solve the above problems, the technical solution of the present invention provides a micro display panel, comprising: a driving backplane, the driving backplane having a first side and a second side relative to each other; a micro display chip and a plurality of lead plates located on the first side of the driving backplane, the micro display chip and the plurality of lead plates being electrically connected to the driving backplane respectively; a plurality of lead through holes located in the driving backplane, each of the lead through holes extending from the second side of the driving backplane to the first side of the driving backplane, and each of the lead through holes exposing the corresponding lead plate respectively; a plurality of connecting wires located in each of the lead through holes and on the second side of the driving backplane, each of the connecting wires being electrically connected to the corresponding lead plate; and a plurality of conductive bonding structures located on the second side of the driving backplane, each of the conductive bonding structures being connected to the corresponding connecting wire respectively.

[0008] Optionally, the driving backplane includes: a central area and an edge area surrounding the central area; a plurality of the lead plates are located in the edge area of ​​the driving backplane, and the micro display chip is located in the central area of ​​the driving backplane.

[0009] Optionally, the thickness of the edge area of ​​the driving back plate is within a preset perforation thickness range, and the thickness of the central area of ​​the driving back plate is greater than the preset perforation thickness range.

[0010] Optionally, on the second side of the driving backplate, the sidewall of the central area is an inclined surface.

[0011] Optionally, the thickness of the edge area and the thickness of the center area of ​​the driving back plate are both within a preset perforation thickness range.

[0012] Optionally, several of the lead through holes are located in an edge area of ​​the driving backplane.

[0013] Optionally, the material of the lead plate includes: one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum and palladium.

[0014] Optionally, the material of the connecting wire includes: one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum and palladium.

[0015] Optionally, each of the connecting wires includes a first end and a second end opposite to each other, the first end of the connecting wire is electrically connected to the corresponding lead plate, and each of the conductive bonding structures is respectively connected to the second end of the corresponding connecting wire.

[0016] Optionally, the conductive bonding structure includes: a solder ball.

[0017] Optionally, the method further includes: an insulating layer located on the second side of the driving backplane, wherein the insulating layer covers each of the connecting lines.

[0018] Optionally, the device further includes: a glass plate located on the first side of the driving backplane, wherein the glass plate covers the micro display chip and the plurality of lead plates.

[0019] Optionally, it further includes: a connector located on the second side of the driving backplane, wherein the connector is electrically connected to each of the conductive bonding structures respectively.

[0020] Optionally, the lead through hole is formed using a through silicon via process.

[0021] Correspondingly, the technical solution of the present invention also provides a method for forming a micro display panel, including: providing a driving backplane, the driving backplane having a first side and a second side relative to each other; forming a micro display chip and a plurality of lead plates on the first side of the driving backplane, the micro display chip and the plurality of lead plates being electrically connected to the driving backplane respectively; performing a perforation process from the second side of the driving backplane to the first side of the driving backplane, forming a plurality of lead through holes in the driving backplane, each of the lead through holes exposing the corresponding lead plate respectively; forming a plurality of connecting wires in each of the lead through holes and on the second side of the driving backplane, each of the connecting wires being electrically connected to the corresponding lead plate; forming a plurality of conductive bonding structures on the second side of the driving backplane, each of the conductive bonding structures being connected to the corresponding connecting wire respectively.

[0022] Optionally, the driving backplane includes: a central area and an edge area surrounding the central area; a plurality of lead plates are formed in the edge area of ​​the driving backplane, and the micro display chip is formed in the central area of ​​the driving backplane.

[0023] Optionally, the thickness of the edge area and the thickness of the center area of ​​the driving backplate are both greater than a preset perforation thickness range.

[0024] Optionally, before performing the perforation process, the method further includes: thinning the edge area of ​​the driving back plate from the second side of the driving back plate to the first side of the driving back plate until the thickness of the edge area of ​​the driving back plate reaches the preset perforation thickness range.

[0025] Optionally, after the thinning process, on the second side of the driving backplate, the sidewall of the central area is an inclined surface.

[0026] Optionally, the thickness of the edge area and the thickness of the center area of ​​the driving back plate are both within a preset perforation thickness range.

[0027] Optionally, the perforation processing method includes: perforating the edge area of ​​the driving backplate from the second side of the driving backplate to the first side of the driving backplate, and forming a plurality of lead through holes in the edge area of ​​the driving backplate.

[0028] Optionally, the perforation processing process includes a through silicon via process, and the through silicon via process includes: one or more combinations of a laser perforation process and a wet perforation process.

[0029] Optionally, the process of forming the plurality of connecting lines includes: one or a combination of a magnetron sputtering coating process, an electron beam evaporation process and an electroplating process.

[0030] Optionally, each of the connecting wires includes a first end and a second end opposite to each other, the first end of the connecting wire is electrically connected to the corresponding lead plate, and each of the conductive bonding structures is respectively connected to the second end of the corresponding connecting wire.

[0031] Optionally, the conductive bonding structure includes: a solder ball.

[0032] Optionally, after forming the plurality of connecting wires, the method further includes: forming an insulating layer on the second side of the driving backplane, wherein the insulating layer covers each of the connecting wires.

[0033] Optionally, after forming the micro display chip and the plurality of lead plates, the method further includes: attaching a glass plate to the first side of the driving backplane, wherein the glass plate covers the micro display chip and the plurality of lead plates.

[0034] Optionally, the method further includes: forming a connector on the second side of the driving backplane, wherein the connector is electrically connected to each of the conductive bonding structures respectively.

[0035] Correspondingly, the technical solution of the present invention further provides a near-eye display device, comprising: a micro display panel as described in any one of the above technical solutions.

[0036] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0037] In the micro-display panel of the technical solution of the present invention, a plurality of lead through-holes are formed in the driving backplane. The lead path of the micro-display panel is transferred to the second side of the driving backplane by forming a plurality of connecting wires in each lead through-hole and on the second side of the driving backplane. If the micro-display panel also has other device structures (such as connectors) that can be fixed on the second side of the driving backplane, it can not only meet the requirements of circuit design, but also effectively reduce the overall volume of the micro-display panel.

[0038] Furthermore, the device further comprises an insulating layer located on the second side of the driving backplane, the insulating layer covering each connecting wire and being able to cover and protect the exposed connecting wires.

[0039] Furthermore, the invention further comprises: a glass plate located on the first side of the driving back plate, the glass plate covering the micro display chip and the plurality of lead plates. The glass plate can cover and protect the micro display chip and the plurality of lead plates.

[0040] In the method for forming a micro-display panel of the technical solution of the present invention, a plurality of lead through-holes are formed in the driving backplane, and the lead path of the micro-display panel is transferred to the second side of the driving backplane by forming a plurality of connecting wires in each lead through-hole and on the second side of the driving backplane. If the micro-display panel also has other device structures (such as connectors) that can be fixed on the second side of the driving backplane, it can not only meet the requirements of circuit design, but also effectively reduce the overall volume of the micro-display panel.

[0041] Furthermore, after forming the plurality of connection lines, the method further includes: forming an insulating layer on the second side of the driving backplane, wherein the insulating layer covers the connection lines. The insulating layer can cover and protect the exposed connection lines.

[0042] Furthermore, after forming the micro display chip and the plurality of lead plates, the process further includes attaching a glass plate to the first side of the driving backplane, the glass plate covering the micro display chip and the plurality of lead plates. The glass plate can cover and protect the micro display chip and the plurality of lead plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] FIG1 is a schematic structural diagram of a Micro LED micro display panel;

[0044] 2 to 11 are schematic structural diagrams of various steps of a method for forming a micro display panel according to an embodiment of the present invention;

[0045] FIG12 is a schematic structural diagram of a micro display panel according to another embodiment of the present invention. DETAILED DESCRIPTION

[0046] As described in the background art, the existing Micro LED display panels still have many problems, which will be described in detail below with reference to the accompanying drawings.

[0047] FIG1 is a schematic diagram of the structure of a Micro LED micro display panel.

[0048] Please refer to Figure 1. A Micro LED micro display panel includes: a micro display chip 10, a driving backplane (not shown), an outer frame 11, an FPC flexible cable, and a connector 13. The micro display chip 10 is electrically connected to the driving backplane. The outer frame 11 wraps around the driving backplane and is arranged around the micro display chip 10. One end of the FPC flexible cable is electrically connected to the micro display chip 10, and the other end of the FPC flexible cable is electrically connected to the connector 13. The connector 13 is suitable for electrical connection to external matching equipment.

[0049] The current packaging method used for micro display panels is Chips on Board (COB) or Molding on Board (MOC). Both packaging methods leave a section of FPC flexible cable and connector 13, making it impossible to further reduce the volume of the entire micro display panel.

[0050] On this basis, the present invention provides a microdisplay panel and a method for forming the same, as well as a near-eye display device. A plurality of lead through-holes are formed in a driving backplane. A plurality of connecting wires are formed in each lead through-hole and on the second side of the driving backplane, so that the lead path of the microdisplay panel is transferred to the second side of the driving backplane. If the microdisplay panel also has other device structures (such as connectors) that can be fixed to the second side of the driving backplane, it can not only meet the requirements of circuit design, but also effectively reduce the overall volume of the microdisplay panel.

[0051] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0052] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," and "bottom" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate description and simplify the present invention. They are not intended to indicate or imply that the positions or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations of the present invention. Furthermore, the terms "first" and "second" are used solely to distinguish an entity or operation from another entity or operation and do not require or imply any actual relationship, order, or relative importance between these entities or operations.

[0053] 2 to 11 are schematic structural diagrams of various steps of a method for forming a micro display panel according to an embodiment of the present invention.

[0054] Please refer to FIG. 2 and FIG. 3 . FIG. 3 is a schematic cross-sectional view along line AA of FIG. 2 . A driving backplane 200 is provided. The driving backplane 200 has a first side 200 a and a second side 200 b opposite to each other.

[0055] In some embodiments, the driving backplane 200 may be an IC (Integrated Circuit) substrate or a TFT (Thin Film Transistor) substrate.

[0056] In this embodiment, the driving backplane 200 includes a central region I and an edge region II surrounding the central region I. The device structures and circuit structures in the driving backplane 200 are disposed in the central region I of the driving backplane 200 , and no device structures or circuit structures are present in the edge region II of the driving backplane 200 .

[0057] In this embodiment, the thickness of the edge region II and the thickness of the central region I of the driving back plate 200 are both greater than the preset perforation thickness range.

[0058] It should be noted that, in this embodiment, the first side 200 a of the driving backplane 200 is the front side of the driving backplane 200 , and the second side 200 b of the driving backplane 200 is the back side of the driving backplane 200 .

[0059] Please refer to Figures 4 and 5. Figure 5 is a schematic cross-sectional view along line BB of Figure 4. A micro display chip 201 and a plurality of lead plates 202 are formed on the first side 200a of the driving backplane 200. The micro display chip 201 and the plurality of lead plates 202 are electrically connected to the driving backplane 200 respectively.

[0060] In this embodiment, a plurality of lead plates 202 are formed in the edge region II of the driving backplane 200 , and the micro display chip 201 is formed in the central region I of the driving backplane 200 .

[0061] In some embodiments, the material of the lead plate 202 includes one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum, and palladium.

[0062] Please refer to FIG. 6 , which is viewed in the same direction as FIG. 5 . A glass plate 203 is attached to the first side 200 a of the driving backplane 200 . The glass plate 203 covers the micro display chip 201 and a plurality of lead plates 202 .

[0063] In this embodiment, the method of attaching the glass plate 203 to the first side 200a of the driving backplane 200 includes: applying a glue layer 204 to the first side 200a of the driving backplane 200; and attaching the glass plate 203 to the glue layer 204. The glass plate 203 can cover and protect the micro display chip 201 and the plurality of lead plates 202.

[0064] 7 , the edge region II of the driving backplate 200 is thinned from the second side 200b of the driving backplate 200 toward the first side 200a of the driving backplate 200 until the thickness of the edge region II of the driving backplate 200 reaches a predetermined perforation thickness range.

[0065] In this embodiment, since the thickness of the edge area II and the thickness of the center area I of the driving backplane 200 are both greater than the preset perforation thickness, the subsequent perforation processing cannot be completed. Therefore, it is necessary to first thin the area that needs to be perforated so that the thickness of the perforated area reaches the preset perforation thickness.

[0066] In this embodiment, after the thinning process, the sidewalls of the central region I on the second side 200b of the driver backplane 200 are inclined. This is because the thinning process of the edge region II also causes some damage to the edge of the central region I, resulting in the sidewalls of the central region I being inclined.

[0067] 8 , a perforation process is performed from the second side 200 b of the driving back plate 200 toward the first side 200 a of the driving back plate 200 to form a plurality of lead through holes 205 in the driving back plate 200 , each of which exposes a corresponding lead plate 202 .

[0068] In this embodiment, the perforation processing method includes: perforating the edge area II of the driving backplane 200 from the second side 200b of the driving backplane 200 to the first side 200a of the driving backplane 200, and forming a plurality of lead through holes 205 in the edge area II of the driving backplane 200.

[0069] In some embodiments, the perforation process includes a through silicon via (TSV) process, and the TSV process includes one or more combinations of a laser perforation process and a wet perforation process.

[0070] It should be noted that, in this embodiment, each lead through hole 205 exposes the corresponding lead plate 202 , which means that the number of lead through holes 205 is the same as the number of lead plates 202 , and each lead through hole 205 exposes a corresponding lead plate 202 .

[0071] In this embodiment, the diameter of the lead through hole 205 is less than 0.5 mm, and the depth of the lead through hole 205 is less than 0.75 mm.

[0072] 9 , a plurality of connection wires 206 are formed in each lead through hole 205 and on the second side 200 b of the driving back plate 200 . Each connection wire 206 is electrically connected to a corresponding lead plate 202 .

[0073] In some embodiments, the process of forming the plurality of connecting lines 206 includes: a magnetron sputtering coating process, an electron beam evaporation process, and an electroplating process, or a combination thereof.

[0074] In some embodiments, the material of the connection line 206 includes one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum, and palladium.

[0075] In this embodiment, each connecting wire 206 includes a first end (not labeled) and a second end (not labeled) opposite to each other. The first end of the connecting wire 206 is electrically connected to the corresponding lead plate 202 .

[0076] It should be noted that, in this embodiment, each connecting wire 206 is electrically connected to the corresponding lead plate 202 means that the number of connecting wires 206 is the same as the number of lead plates 202 , and each connecting wire 206 is connected to one lead plate 202 .

[0077] Referring to FIG. 10 , after forming a plurality of connection lines 206 , an insulating layer 207 is formed on the second side 200 b of the driving backplane 200 . The insulating layer 207 covers each of the connection lines 206 .

[0078] In this embodiment, the insulating layer 207 can cover and protect the exposed connecting wires 206 .

[0079] Referring to FIG. 11 , a plurality of conductive bonding structures 209 are formed on the second side 200 b of the driving backplane 200 , and each conductive bonding structure 209 is connected to a corresponding connection line 206 .

[0080] In this embodiment, each conductive bonding structure 209 is connected to the second end of the corresponding connection wire 206 .

[0081] In this embodiment, the conductive bonding structure 209 is a solder ball.

[0082] In this embodiment, the present invention further includes forming a connector 208 on the second side 200b of the driving backplane 200, wherein the connector 208 is electrically connected to each conductive bonding structure 209. The connector 208 is used to electrically connect to external matching devices.

[0083] In other embodiments, the connector may not be formed, and the micro display panel with the conductive bonding structure may be directly attached to external matching equipment to achieve electrical connection.

[0084] A plurality of lead through holes 205 are formed in the driving backplane 200. The lead path of the micro display panel is transferred to the second side 200b of the driving backplane 200 by forming a plurality of connecting wires 206 in each lead through hole 205 and on the second side 200b of the driving backplane 200. If the micro display panel also has other device structures (such as a connector 208), it can be fixed on the second side 200b of the driving backplane 200, which can not only meet the requirements of circuit design, but also effectively reduce the overall volume of the micro display panel.

[0085] In this embodiment, the micro display panel is a Micro LED micro display panel.

[0086] The microdisplay panel has a very small size, with length and width dimensions ranging from 500μm to 50,000μm. The light-emitting area of ​​the microdisplay panel is very small, such as 1mm×1mm, 2.64mm×2.02mm, 3mm×5mm, etc. The light-emitting area of ​​the microdisplay panel includes a plurality of micro-LED pixels arranged in an array. The specific pixel arrangement can be one of 320×240, 640×480, 1600×1200, 1920×1080, and 2560×1440. The size of a single micro-LED pixel is between 100nm and 100 microns.

[0087] In some embodiments, the size of a single micro-LED pixel is between 150 nm and 15 microns.

[0088] In some embodiments, the size of a single micro LED pixel can be smaller than 10 microns.

[0089] A driving backplane 200 is provided on the back of the micro-LED pixel array. The driving backplane 200 is electrically connected to the micro-LEDs in the micro-LED pixel array. The driving backplane 200 can obtain signals such as image data from the outside world and can control the corresponding micro-LEDs to emit light or not. For example, the driving backplane 200 of the above-mentioned micro-display panel integrates a frame buffer, a column driving circuit, and a row driving circuit. The frame buffer includes a first pixel storage area, and the micro-LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of ​​the frame buffer. The column driving circuit can load the pixel grayscale data in the first pixel storage area of ​​the frame buffer into the second pixel storage area of ​​the micro-LED pixel array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different grayscales. When driving multiple micro-LED pixels in the micro-LED pixel array, either a single pixel can be driven independently or multiple pixel units can be driven independently. The specific driving method should not constitute a limitation to this application.

[0090] Correspondingly, an embodiment of the present invention further provides a micro display panel, which, please continue to refer to FIG11, includes: a driving backplane 200, the driving backplane 200 having a first side 200a and a second side 200b opposite to each other; a micro display chip 201 and a plurality of lead plates 202 located on the first side 200a of the driving backplane 200, the micro display chip 201 and the plurality of lead plates 202 being electrically connected to the driving backplane 200 respectively; a plurality of lead through holes 205 located in the driving backplane 200, each lead through hole 205 being electrically connected to the driving backplane 200; The second side 200b of the plate 200 extends toward the first side 200a of the driving backplate 200, and each lead through-hole 205 exposes the corresponding lead plate 202 respectively; a number of connecting wires 206 are located in each lead through-hole 205 and on the second side 200b of the driving backplate 200, and each connecting wire 206 is electrically connected to the corresponding lead plate 202; a number of conductive bonding structures 209 are located on the second side 200b of the driving backplate 200, and each conductive bonding structure 209 is connected to the corresponding connecting wire 206 respectively.

[0091] A plurality of lead through holes 205 are formed in the driving backplane 200. The lead path of the micro display panel is transferred to the second side 200b of the driving backplane 200 by forming a plurality of connecting wires 206 in each lead through hole 205 and on the second side 200b of the driving backplane 200. If the micro display panel also has other device structures (such as a connector 208), it can be fixed on the second side 200b of the driving backplane 200, which can not only meet the requirements of circuit design, but also effectively reduce the overall volume of the micro display panel.

[0092] In this embodiment, the driving backplane 200 includes a central region I and an edge region II surrounding the central region I. A plurality of lead plates 202 are located in the edge region II of the driving backplane 200 , and the micro display chip 201 is located in the central region I of the driving backplane 200 .

[0093] In this embodiment, the thickness of the edge region II of the driving back plate 200 is within the predetermined perforation thickness range, and the thickness of the central region I of the driving back plate 200 is greater than the predetermined perforation thickness range.

[0094] In this embodiment, on the second side 200 b of the driving back plate 200 , the sidewall of the central area I is an inclined surface.

[0095] In this embodiment, a plurality of lead through holes 205 are located in the edge region II of the driving backplate 200 .

[0096] In some embodiments, the material of the lead plate 202 includes one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum, and palladium.

[0097] In some embodiments, the material of the connection line 206 includes one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum, and palladium.

[0098] In this embodiment, each connection line 206 includes a first end and a second end opposite to each other. The first end of the connection line 206 is electrically connected to the corresponding lead plate 202 , and each conductive bonding structure 206 is connected to the second end of the corresponding connection line 206 .

[0099] In this embodiment, the conductive bonding structure 209 is a solder ball.

[0100] In this embodiment, the drive backplane 200 further includes an insulating layer 207 located on the second side 200b thereof, the insulating layer 207 covering each connecting wire 206. The insulating layer 207 can cover and protect the exposed connecting wires 206.

[0101] In this embodiment, the present invention further includes a glass plate 203 located on the first side 200a of the driving backplane 200, and the glass plate 203 covers the micro display chip 201 and the plurality of lead plates 202. The glass plate 203 can cover and protect the micro display chip 201 and the plurality of lead plates 202.

[0102] In this embodiment, the connector 208 located on the second side 200b of the driving backplane 200 is electrically connected to each conductive bonding structure 209. The connector 208 is electrically connected to external matching devices.

[0103] In other embodiments, the connector may not be formed, and the micro display panel with the conductive bonding structure may be directly attached to external matching equipment to achieve electrical connection.

[0104] In this embodiment, the lead through-hole 205 is formed by a through-silicon via process.

[0105] FIG12 is a schematic structural diagram of a micro display panel according to another embodiment of the present invention.

[0106] This embodiment further describes a method for forming a microdisplay panel based on the above embodiment. The remaining components are the same as those in the above embodiment, with the exception that the thickness of the edge region II and the thickness of the center region I of the driving backplane 200 are both within a predetermined perforation thickness range. This will be described in detail below.

[0107] Referring to FIG. 12 , the thickness of the edge region II and the thickness of the center region I of the driving back plate 200 are both within the preset perforation thickness range.

[0108] In this embodiment, since the thickness of the edge region II and the thickness of the central region I of the driving back plate 200 are both within the preset perforation thickness range, there is no need to perform a thinning process on the driving back plate 200 before performing the perforation process.

[0109] In this embodiment, the rest of the device structure and formation process are the same as those in the above embodiment. For details, please refer to Figures 2 to 11 and related descriptions, and will not be repeated here.

[0110] Correspondingly, a micro display panel is also provided in an embodiment of the present invention. Please continue to refer to Figure 12. The rest of the structure is the same as the micro display panel recorded in the above embodiment. The difference is that the thickness of the edge area II and the thickness of the center area I of the driving backplane 200 are both within the preset perforation thickness range.

[0111] Correspondingly, the technical solution of the present invention further provides a near-eye display device, comprising: a micro display panel as in any one of the above embodiments.

[0112] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A micro display panel, characterized in that: include: a drive backplate having opposing first and second sides; A micro display chip and a plurality of lead plates located on a first side of the driving backplane, wherein the micro display chip and the plurality of lead plates are electrically connected to the driving backplane respectively; a plurality of lead through holes located in the driving back plate, each of the lead through holes extending from the second side of the driving back plate toward the first side of the driving back plate, and each of the lead through holes respectively exposing the corresponding lead plate; a plurality of connecting wires located in each of the lead through holes and on the second side of the driving back plate, each of the connecting wires being electrically connected to the corresponding lead plate; A plurality of conductive bonding structures are located on the second side of the driving backplane, and each of the conductive bonding structures is connected to a corresponding connecting wire.

2. The micro display panel according to claim 1, wherein: The driving backplane includes: a central area and an edge area surrounding the central area; a plurality of lead plates are located in the edge area of ​​the driving backplane, and the micro display chip is located in the central area of ​​the driving backplane.

3. The micro display panel according to claim 2, wherein: The thickness of the edge area of ​​the driving back plate is within a preset perforation thickness range, and the thickness of the central area of ​​the driving back plate is greater than the preset perforation thickness range.

4. The micro display panel according to claim 3, wherein: On the second side of the driving back plate, the sidewall of the central area is an inclined surface.

5. The micro display panel according to claim 2, wherein: The thickness of the edge area and the thickness of the center area of ​​the driving back plate are both within a preset perforation thickness range.

6. The micro display panel according to claim 2, wherein: A plurality of lead through holes are located at the edge area of ​​the driving back plate.

7. The micro display panel according to claim 1, wherein: The material of the lead plate includes: one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum and palladium.

8. The micro display panel according to claim 1, wherein: The material of the connecting wire includes: one or more combinations of copper, titanium, indium tin oxide, chromium, gold, aluminum, nickel, platinum and palladium.

9. The micro display panel according to claim 1, wherein: Each of the connecting wires includes a first end and a second end opposite to each other. The first end of the connecting wire is electrically connected to the corresponding lead plate, and each of the conductive bonding structures is respectively connected to the second end of the corresponding connecting wire.

10. The micro display panel according to claim 1, wherein: The conductive bonding structure includes: a solder ball.

11. The micro display panel according to claim 1, wherein: Also includes: An insulating layer is located on the second side of the driving backplane, and the insulating layer covers each of the connecting lines.

12. The micro display panel according to claim 1, wherein: Also includes: A glass plate is located on a first side of the driving backplane, and covers the micro display chip and the plurality of lead plates.

13. The micro display panel according to claim 1, wherein: Also includes: A connector is located on the second side of the driving backplane, and the connector is electrically connected to each of the conductive bonding structures.

14. The micro display panel according to claim 1, wherein: The lead through hole is formed by adopting a through silicon via process.

15. A method for forming a micro display panel, characterized in that: include: providing a driver backplate having opposing first and second sides; A micro display chip and several lead plates are formed on the first side of the driving backplane. The display chip and the plurality of lead plates are electrically connected to the driving back plate respectively; Performing a perforation process from the second side of the driving back plate toward the first side of the driving back plate to form a plurality of lead through holes in the driving back plate, wherein each of the lead through holes exposes the corresponding lead plate; A plurality of connecting wires are formed in each of the lead through holes and on the second side of the driving back plate, and each of the connecting wires is electrically connected to the corresponding lead plate; A plurality of conductive bonding structures are formed on the second side of the driving backplane, and each of the conductive bonding structures is connected to a corresponding connecting wire.

16. The method for forming a micro display panel according to claim 15, wherein: The driving backplane includes: a central area and an edge area surrounding the central area; a plurality of lead plates are formed in the edge area of ​​the driving backplane, and the micro display chip is formed in the central area of ​​the driving backplane.

17. The method for forming a micro display panel according to claim 16, wherein: The thickness of the edge area and the thickness of the center area of ​​the driving back plate are both greater than the preset perforation thickness range.

18. The method for forming a micro display panel according to claim 17, wherein: Before performing the perforation process, the method further includes: thinning the edge area of ​​the driving back plate from the second side of the driving back plate to the first side of the driving back plate until the thickness of the edge area of ​​the driving back plate reaches the preset perforation thickness range.

19. The method for forming a micro display panel according to claim 18, wherein: After the thinning process, on the second side of the driving back plate, the sidewall of the central area is an inclined surface.

20. The method for forming a micro display panel according to claim 16, wherein: The thickness of the edge area and the thickness of the center area of ​​the driving back plate are both within a preset perforation thickness range.

21. The method for forming a micro display panel according to claim 18 or 20, wherein: The perforation processing method includes: perforating the edge area of ​​the driving backplate from the second side of the driving backplate to the first side of the driving backplate, and forming a plurality of lead through holes in the edge area of ​​the driving backplate.

22. The method for forming a micro display panel according to claim 15, wherein: The perforation process includes a through silicon via process, and the through silicon via process includes: a laser perforation process and a wet perforation process or a combination of multiple processes.

23. The method for forming a micro display panel according to claim 15, wherein: The process of forming the plurality of connecting lines includes: one or a combination of a magnetron sputtering coating process, an electron beam evaporation process and an electroplating process.

24. The method for forming a micro display panel according to claim 15, wherein: Each of the connecting wires includes a first end and a second end opposite to each other. The first end of the connecting wire is electrically connected to the corresponding lead plate, and each of the conductive bonding structures is respectively connected to the second end of the corresponding connecting wire.

25. The method for forming a micro display panel according to claim 15, wherein: The conductive bonding structure includes: a solder ball.

26. The method for forming a micro display panel according to claim 15, wherein: After forming the plurality of connecting wires, the method further includes: forming an insulating layer on the second side of the driving backplane, wherein the insulating layer covers each of the connecting wires.

27. The method for forming a micro display panel according to claim 15, wherein: After forming the micro display chip and the plurality of lead plates, the method further includes: attaching a glass plate on the first side of the driving backplane, wherein the glass plate covers the micro display chip and the plurality of lead plates.

28. The method for forming a micro display panel according to claim 15, wherein: Also includes: Connectors are formed on the second side of the driving backplane, and the connectors are electrically connected to the conductive bonding structures respectively.

29. A near-eye display device, characterized in that: include: The micro display panel according to any one of claims 1 to 14.

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