Electronic device comprising frame, and frame manufacturing method

Abstract

An electronic device according to one embodiment comprises a display and a frame. The frame comprises: an edge part which is formed of a first metal material and which defines the side surface of the electronic device; a bracket formed of a second metal material, which is different from the first metal material; and a porous part which is disposed between the edge part and the bracket so as to couple the edge part to the bracket, and which includes a first portion and a second portion. The first portion includes third portions penetrated by the first metal material. The second portion includes fourth portions penetrated by the second metal material.

Description

Electronic device including a frame and method for manufacturing the frame

[0001] The present disclosure relates to an electronic device including a frame and a method for manufacturing the frame.

[0002] An electronic device may include a housing assembly defining at least a portion of an exterior appearance. The housing assembly may include a frame and a rear cover. The frame may include an edge part defining a side surface of the electronic device and a bracket wrapped around the frame. The bracket may support components located within the electronic device (e.g., a battery, a printed circuit board). The bracket may be coupled to the frame. To provide rigidity to the housing assembly, the frame and the bracket may include a metal material. For example, the metal material may include titanium, stainless steel, aluminum, and / or magnesium. The frame and the bracket may include different metal materials.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is provided. The electronic device may include a display including a display panel and a window attached to the display panel. The electronic device may include a frame supporting at least a portion of the display. The frame may include an edge part formed of a first metal material and defining a side surface of the electronic device. The frame may include a bracket formed of a second metal material different from the first metal material and surrounded by the edge part. The frame may include a porous part disposed between the edge part and the bracket. The porous part may include a first part coupled to the edge part and a second part coupled to the bracket. The first part of the porous part may include third parts permeated with the first metal material forming the edge part. The second part of the porous part may include fourth parts permeated with the second metal material forming the bracket.

[0005] A method of manufacturing a frame used for an electronic device is provided. The method may include providing a porous part including a plurality of pores. The method may include seating the porous part within a first cavity of a first die. The method may include casting a first metal material in a liquid state into the first cavity. In the operation, the first metal material in a liquid state may penetrate into first pores among the plurality of pores of the porous part. The method may include forming a first intermediate structure, which is joined to a first portion of the porous part including the first pores filled with the first metal material, by solidifying the first metal material after casting the first metal material in a liquid state, and which includes an edge part formed of the first metal material. The method may include separating the first intermediate structure from the first die. The manufacturing method may include an operation of settling the first intermediate structure within a second cavity of a second die. The manufacturing method may include an operation of casting a second metal material in a liquid state into the second cavity. In the operation, the second metal material in a liquid state may penetrate into second pores among the plurality of pores of the porous part. The manufacturing method may include an operation of forming a second intermediate structure, which is joined to a second portion of the porous part including the second pores filled with the second metal material, by solidifying the second metal material after casting the second metal material in a liquid state, and which includes a bracket formed of the second metal material. The manufacturing method may include an operation of separating the second intermediate structure from the second die.The above manufacturing method may include an action of filling a gap between the edge part and the bracket with an injection part.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0007] Figure 2 illustrates an electronic device according to an exemplary embodiment.

[0008] Figure 3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

[0009] FIG. 4A illustrates an electronic device according to an exemplary embodiment.

[0010] Figure 4b illustrates an edge part of a frame according to an exemplary embodiment.

[0011] Figure 4c illustrates a bracket of a frame according to an exemplary embodiment.

[0012] FIG. 5a is a cross-sectional view of a frame according to an exemplary embodiment taken along line A-A' of FIG. 4a.

[0013] Figures 5b and 5c illustrate portions of frames according to exemplary embodiments.

[0014] Figure 6 is a flowchart showing a method for manufacturing a frame according to an exemplary embodiment.

[0015] Figure 7a illustrates a porous part according to an exemplary embodiment.

[0016] Figure 7b illustrates a process for manufacturing an edge part according to an exemplary embodiment.

[0017] Figure 7c illustrates the first intermediate structure.

[0018] Figure 7d illustrates a process for manufacturing a bracket according to an exemplary embodiment.

[0019] Figure 7e illustrates a second intermediate structure.

[0020] Figures 7f, 7g, and 7h illustrate the process of injecting resin into the gap between the edge part and the bracket.

[0021] Figure 8 illustrates a frame of an electronic device according to an exemplary embodiment.

[0022] Figures 9a, 9b, 9c, and 9d illustrate various embodiments of porous parts.

[0023] Figures 10a, 10b, 10c, 10d, and 10e illustrate various embodiments of porous parts.

[0024] FIGS. 11A and 11B illustrate an electronic device according to an exemplary embodiment including a porous part.

[0025] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0026] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0027] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0028] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where the artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)).

[0029] There are. The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the above. The artificial intelligence model may additionally or alternatively include a software structure in addition to the hardware structure.

[0030] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0031] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0034] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0035] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0036] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0040] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0042] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0045] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0046] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0047] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] Figure 2 illustrates an electronic device according to an exemplary embodiment.

[0050] Referring to FIG. 2, an electronic device (101) according to an exemplary embodiment may include a housing assembly (210) forming an exterior of the electronic device (101). For example, the housing assembly (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side side) (200C) surrounding a space between the first side (200A) and the second side (200B).

[0051] An electronic device (101) according to an exemplary embodiment may include a display (e.g., a display module (160) of FIG. 1). The display (201) may include a substantially transparent window (e.g., a window (201b) of FIG. 3). The window (201b) may form at least a portion of the first surface (200A). For example, the window (201b) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0052] An electronic device (101) according to an exemplary embodiment may include a substantially opaque rear cover (211). According to an exemplary embodiment, the rear cover (211) may form at least a portion of the second surface (200B). According to an exemplary embodiment, the rear cover (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0053] An electronic device (101) according to an exemplary embodiment may include a peripheral part (218). The peripheral part (218) may be combined with the window (201b) and / or the rear cover (211) to form at least a portion of a third side (200C) of the electronic device (101). For example, the peripheral part (218) may form the entire third side (200C) of the electronic device (101). For example, the peripheral part (218) may form the third side (200C) of the electronic device (101) together with the window (201b) and / or the rear cover (211).

[0054] An electronic device (101) according to an exemplary embodiment may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light-emitting element (not shown), and / or a connector hole (208). According to an exemplary embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)), or may additionally include other components.

[0055] According to an exemplary embodiment, at least a portion of the display (201) may be viewed through a window (201b) forming the first surface (200A). According to an exemplary embodiment, the display (201) may include a display panel (e.g., display panel (201a) of FIG. 3) disposed on the back surface of the window (201b).

[0056] According to an exemplary embodiment, the display (201) may include a display area (201A). According to an exemplary embodiment, the display (201) may provide visual information to a user through the display area (201A).

[0057] According to an exemplary embodiment, the display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). According to an exemplary embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0058] According to an exemplary embodiment, the display (201) may include an area where a first camera module (205) (e.g., camera module (180) of FIG. 1) is positioned. According to an exemplary embodiment, an opening is formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the display area (201A) may surround at least a portion of an edge of the opening. According to an exemplary embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned under the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) can provide visual information to the user through the above area, and additionally, the first camera module (205) can obtain an image corresponding to the direction toward the first surface (200A) through the above area of ​​the display (201).

[0059] According to an exemplary embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0060] According to an exemplary embodiment, the audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1) may include a microphone hole (203, 204) and / or a speaker hole (207).

[0061] According to an exemplary embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and / or a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be arranged inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0062] According to an exemplary embodiment, the second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0063] According to an exemplary embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (101). According to an exemplary embodiment, the external speaker hole (207) may be implemented as a single hole together with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (101), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (101). However, this is not limited thereto, and according to an exemplary embodiment, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the display (201) and the edge part (218).

[0064] According to an exemplary embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing assembly (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0065] According to an exemplary embodiment, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0066] According to an exemplary embodiment, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera module (205) arranged to face a first side (200A) of an electronic device (101), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0067] According to an exemplary embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0068] According to an exemplary embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0069] According to an exemplary embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. According to an exemplary embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0070] According to an exemplary embodiment, a key input device (217) (e.g., input module (150) of FIG. 1) may be disposed on a third side (200C) of the electronic device (101). According to an exemplary embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0071] According to an exemplary embodiment, a connector hole (208) may be formed on the third surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to an exemplary embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0072] According to an exemplary embodiment, the edge part (218) may include a vent hole (206). For example, air outside the housing assembly (210) may be introduced into the housing assembly (210) through the vent hole (206). For example, air inside the housing assembly (210) may be discharged out of the housing assembly (210) through the vent hole (206). The location of the vent hole (206) is not limited to the location illustrated in FIG. 2.

[0073] According to an exemplary embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing assembly (210). The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to an exemplary embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0074] Figure 3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

[0075] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0076] Referring to FIG. 3, an electronic device (101) according to an exemplary embodiment may include an edge part (218), a bracket (243), a printed circuit board (250), a cover plate (260), and / or a battery (270). The printed circuit board (250) may include a first printed circuit board (251), which is a main board, and a second printed circuit board (252), which is a sub board.

[0077] An electronic device (101) according to an exemplary embodiment may include an edge part (218) forming an exterior of the electronic device (101) (e.g., a third surface (200C) of FIG. 2) and a bracket (243) coupled to an inner side of the edge part (218). According to an exemplary embodiment, the edge part (218) and the bracket (243) may be positioned between a display (201) and a rear cover (211). For example, the edge part (218) may surround a space between the rear cover (211) and the display (201). A window (201b) may be attached to the edge part (218).

[0078] According to an exemplary embodiment, the bracket (243) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the bracket (243) facing in one direction (e.g., +z direction). At least a portion of the display (201) may be supported by the bracket (243). For example, a first printed circuit board (251), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the bracket (243) facing in a direction opposite to the one direction (e.g., -z direction). For example, the first printed circuit board (251), the second printed circuit board (252), the battery (270), and the second camera module (212) may be respectively seated in recesses defined by the edge part (218) and / or the bracket (243).

[0079] According to an exemplary embodiment, the first printed circuit board (251), the second printed circuit board (252), and the battery (270) may be respectively coupled to the bracket (243). For example, the first printed circuit board (251) and the second printed circuit board (252) may be fixedly disposed on the bracket (243) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed on the bracket (243) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0080] According to an exemplary embodiment, the cover plate (260) may be disposed between the first printed circuit board (251) and the rear cover (211). According to an exemplary embodiment, the cover plate (260) may be disposed on the first printed circuit board (251). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (251) facing the -z direction.

[0081] According to an exemplary embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (251) with respect to the z-axis. According to an exemplary embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (251). Through this, the cover plate (260) may protect the first printed circuit board (251) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (251).

[0082] According to an exemplary embodiment, the cover plate (260) may be fixedly arranged to the first printed circuit board (251) via a joining member (e.g., a screw), or may be coupled to the bracket (243) together with the first printed circuit board (251) via the joining member.

[0083] According to an exemplary embodiment, the display (201) may be positioned between a bracket (243) and a window (201b). For example, the window (201b) may be positioned on one side (e.g., in the +z direction) of the display panel (201a), and the bracket (243) may be positioned on the other side (e.g., in the -z direction).

[0084] According to an exemplary embodiment, the window (201b) may be coupled with the display panel (201a). For example, the window (201b) and the display panel (201a) may be adhered to each other through an optical adhesive material (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0085] According to an exemplary embodiment, the window (201b) may be coupled with the edge part (218). For example, the window (201b) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the edge part (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the window (201b) and the edge part (218). However, the present invention is not limited to the above-described example.

[0086] According to an exemplary embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (251) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to an exemplary embodiment, the first printed circuit board (251) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0087] According to an exemplary embodiment, a battery (270) (e.g., battery (189) of FIG. 1 ) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (251) and / or the second printed circuit board (252).

[0088] An electronic device (101) according to an exemplary embodiment may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). According to an exemplary embodiment, the antenna module may be disposed between a rear cover (211) and a battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0089] According to an exemplary embodiment, a first camera module (205) (e.g., a front camera) may be positioned on at least a portion of the bracket (243) such that the lens can receive external light through a portion (e.g., the camera area (237)) of the window (201b) (e.g., the front (200A) of FIG. 2).

[0090] According to an exemplary embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the bracket (243) and the rear cover (211). According to an exemplary embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (251) via a connecting member (e.g., a connector). According to an exemplary embodiment, the second camera module (212) may be disposed such that a lens can receive external light through the camera area (284) of the rear cover (211) of the electronic device (101).

[0091] According to an exemplary embodiment, the camera area (284) may be formed on a surface of the rear cover (211) (e.g., the rear surface (200B) of FIG. 2). According to an exemplary embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). According to an exemplary embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear cover (211) by a predetermined height. However, the present invention is not limited thereto, and according to an exemplary embodiment, the camera area (284) may form a substantially same plane as the surface of the rear cover (211).

[0092] According to an exemplary embodiment, the housing assembly (210) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the window (201b), the edge part (218), the bracket (243), and / or the rear cover (211) that form the exterior of the electronic device (101) may be referred to as the housing assembly (210) of the electronic device (101).

[0093] The electronic device (101) described below may include a housing assembly (210) comprising dissimilar metals. According to an exemplary embodiment, the edge part (218) may include a first metal material, and the bracket (243) may include a second metal material. In the examples described below, the first metal is described as titanium or zinc, and the second metal is described as aluminum, but is not limited thereto.

[0094] Fig. 4a illustrates an electronic device according to an exemplary embodiment. Fig. 4b illustrates an edge part of a frame according to an exemplary embodiment. Fig. 4c illustrates a bracket of a frame according to an exemplary embodiment.

[0095] An electronic device (101) according to an exemplary embodiment may include a display (201) and a frame (300).

[0096] According to an exemplary embodiment, the display (201) may be configured to display visual information. The display (201) may include a display panel (e.g., the display panel (201a) of FIG. 3) and a window (e.g., the window (201b) of FIG. 3). For example, the electronic device (101) may include a display driver integrated circuit (DDI) configured to control the display (201). The display driver circuit may be configured to control a plurality of pixels included in the display panel (201a) to display visual information through the display (201). The window (201b) may be disposed at the outermost portion of the display (201) to protect the display (201). The window (201b) may include a substantially transparent material so that the visual information displayed through the display (201) may be viewed from the outside. The window (201b) may be attached to the display panel (201a).

[0097] According to an exemplary embodiment, the frame (300) may support the display (201). For example, the edge of the window (201b) may be attached to the edge of the frame (300). The frame (300) may be positioned below (e.g., in the -z direction) the display (201). According to an exemplary embodiment, the frame (300) may include an edge part (218) and a bracket (243). A rear cover (e.g., the rear cover (211) of FIG. 3) may be coupled below (e.g., in the -z direction) the frame (300). The rear cover (211) may define the back of the electronic device (101). The rear cover (211) may be opposite to the display (201).

[0098] According to an exemplary embodiment, the edge part (218) may at least partially define a side surface (200C) of the electronic device (101). The edge part (218) may be referred to as a side bezel, or a side structure, in terms of defining the side surface (200C) of the electronic device (101).

[0099] According to an exemplary embodiment, the bracket (243) may be surrounded by the edge part (218). For example, the bracket (243) may be coupled to the inner surface of the frame (300). The bracket (243) may be configured to support components of the electronic device (101). For example, electronic components such as a printed circuit board (e.g., printed circuit board (250) of FIG. 3) and a battery (e.g., battery (270) of FIG. 3) may be supported by the bracket (243) by being placed on the bracket (243). The bracket (243) may be referred to as a support member, a support part, or a support plate from the perspective of supporting the components of the electronic device (101). The gap between the edge part (218) and the bracket (243) may be filled with an injection part (310).

[0100] Referring to FIG. 4B, the edge part (218) may have a shape including a hollow space therein. At least a portion of the edge part (218) may include one or more conductive portions (410) to function as an antenna radiator used for communication with an external electronic device.

[0101] When one or more conductive portions (410) operate as antenna radiators, the resonant frequency of a signal transmitted and / or received through one or more conductive portions (410) can be determined based on the electrical length of one or more conductive portions (410). For example, when the wavelength corresponding to the resonant frequency of the signal is w, the electrical length of one or more conductive portions (410) for transmitting and / or receiving a signal having the resonant frequency can be 1 / 4w to 1 / 2w.

[0102] To adjust the electrical length of one or more conductive portions (410), the edge part (218) may include a slot (or slit) (415). The slot (or slit) (415) may be filled with a non-conductive material to determine the electrical length of one or more conductive portions (410) that act as antenna radiators and to electrically isolate one or more conductive portions (410) from other conductive portions. When the slot (or slit) (415) is filled with a non-conductive material, one or more non-conductive portions (e.g., one or more non-conductive portions (420) of FIG. 7h) that contact one or more conductive portions (410) may be formed.

[0103] According to an exemplary embodiment, the edge part (218) may be exposed to the outside of the electronic device (101) because it at least partially defines the side surface (200C) of the electronic device (101). The edge part (218) may be required to have relatively high strength, hardness, and excellent surface properties in order to protect components disposed inside the electronic device (101) from external impact. If the strength of the edge part (218) is low, the electronic device (101) may be easily damaged by external impact, thereby causing damage to the electronic components inside. If the surface properties of the edge part (218) are poor, the edge part (218) may be easily corroded, thereby deteriorating the surface quality of the electronic device (101). For high strength and excellent surface properties, the edge part (218) may include a first metal material having high strength and excellent surface properties. For example, the first metal material may include, but is not limited to, titanium, zinc, and / or stainless steel, which have high strength and excellent corrosion resistance.

[0104] Referring to FIG. 4c, the bracket (243) may be coupled to the inside of an edge part (e.g., an edge part (218) of FIG. 4b) by die casting. The bracket (243) may not be exposed to the outside of the electronic device (101) by being wrapped by the edge part (218). The bracket (243) may be formed of a second metal material having a lower specific gravity than the edge part (218). Since the bracket (243) is disposed inside the electronic device (101) and is not visible from the outside of the electronic device (101), it may be formed of a second metal material having a relatively lower specific gravity, and thus, the overall weight of the electronic device (101) may be reduced.

[0105] For example, if the bracket (243) is formed of titanium, identical to the edge part (218), the overall weight of the electronic device (101) may increase. The specific gravity of titanium (e.g., about 4.5 g / cm 3 ) and the specific gravity of zinc (e.g., about 7.14 g / cm 3 ) is lower than that of metal materials such as iron and stainless steel, but the specific gravity of aluminum (e.g. about 2.7 g / cm 3 ), the relatively high specific gravity of titanium or zinc may cause an increase in the weight of the electronic device (101). If the weight of the electronic device (101) is too heavy, a problem of reduced portability of the electronic device (101) may occur.

[0106] According to an exemplary embodiment, the bracket (243) may include a different metal material from the edge part (218). For example, the bracket (243) may include a second metal material that is relatively lighter than the first metal material included in the edge part (218). The specific gravity of the second metal material may be lower than the specific gravity of the first metal material. Unlike the edge part (218), the bracket (243) wrapped by the edge part (218) is not exposed to the outside of the electronic device (101), but is at least partially wrapped by the edge part (218), thereby being disposed inside the electronic device (101). Since the bracket (243) is disposed inside the electronic device (101), even if the bracket (243) has a lower strength than the edge part (218), the bracket (243) may have a small effect on the rigidity of the electronic device (101).

[0107] According to an exemplary embodiment, the second metal material may include aluminum and / or magnesium, which are relatively lighter than the first metal material (e.g., titanium). However, the present invention is not limited thereto. Since the specific gravity of aluminum is lower than the specific gravity of titanium and the specific gravity of zinc, an electronic device (101) including a bracket (243) including aluminum may be lighter than an electronic device according to a comparative example including a bracket (243) including titanium.

[0108] According to an exemplary embodiment, the edge part (218) and the bracket (243) may be manufactured in separate processes. The bonding strength between the edge part (218) and the bracket (243) may require a bonding strength that is not easily separated by external impact. For example, the bonding strength between the edge part (218) and the bracket (243) may be required to be about 10 MPa or more.

[0109] The edge part (218) and the bracket (243) may be manufactured through separate processes. A separate process may be performed to join the edge part (218) and the bracket (243) manufactured through separate processes. The joining process of the edge part (218) and the bracket (243) may vary. For example, a process may be performed in which the edge part (218) and the bracket (243) are manufactured separately, and then the bracket (243) is welded to the edge part (218). The process for welding dissimilar metals may include laser welding, electron-beam welding, and / or friction stir welding.

[0110] In the process of joining the edge part (218) and the bracket (243) by welding, bubbles may be generated inside the edge part (218) and / or the bracket (243) during the welding process. For example, if the difference in melting points between the first metal material included in the edge part (218) and the second metal material included in the bracket (243) is large, the welding process may be performed at a temperature higher than the higher melting point. In this case, the temperature at which the welding process is performed may cause vaporization of the metal material having the lower melting point. As the metal material having the relatively low melting point vaporizes, gas may be generated. The gas may cause the formation of bubbles inside during the welding process.

[0111] For example, when the first metal material is titanium and the second metal material is aluminum, the melting point of titanium is approximately 2,850°C, and the melting point of aluminum is approximately 659°C. Since the welding process may be performed at a temperature higher than the melting point of titanium (e.g., approximately 2,850°C), the temperature at which the welding process is performed may be too high compared to the melting point of aluminum. Due to the high temperature, the aluminum may vaporize and generate gas, and the gas may create bubbles.

[0112] For example, when the first metal material is zinc and the second metal material is aluminum, the melting point of zinc is about 419°C and the melting point of aluminum is about 659°C. Since the welding process can be performed at a temperature higher than the melting point of aluminum (e.g., about 659°C), the temperature at which the welding process is performed may be too high compared to the melting point of zinc. Due to the high temperature, the zinc may vaporize and generate gas, and the gas may generate bubbles. The generation of bubbles may form an irregular bonding surface. If the bonding surface is irregular, a weakening of the bonding strength may occur. In addition, in the case of the welding process, since an additional welding process is required after each of the edge part (218) and the bracket (243) is manufactured, the manufacturing time and manufacturing cost may increase.

[0113] The process of joining the edge part (218) and the bracket (243) may include a method of die casting a second metal material on the inside of the edge part (218). In the case of the die casting process, the bracket (243) joined to the edge part (218) may be formed by seating the edge part (218) in a die and casting the second metal material forming the bracket (243) on the inside of the edge part (218). When the edge part (218) and the bracket (243) include different metal materials, the bonding force between the edge part (218) and the bracket (243) may be weak due to differences in physical properties and chemical properties between the dissimilar metals. In order to improve the bonding force between dissimilar metals (e.g., titanium and aluminum), a special treatment may be required for the bonding surface. For example, by adjusting the inner roughness of the edge part (218) using a method such as Laser Hatching or Blasting, a concavo-convex portion is formed, and by infiltrating aluminum into the concavo-convex portion, the bracket (243) can be joined to the edge part (218). In the case of the above process, a separate process for forming the concavo-convex portion may be required for roughness.

[0114] According to an exemplary embodiment, a frame (300) of an electronic device (101) may include a porous part (e.g., a porous part (500) of FIG. 5A) for bonding between an edge part (218) and a bracket (243). A plurality of pores may be formed inside the porous part (500). The porous part (500) may be disposed between the edge part (218) and the bracket (243) and bonded to each of the edge part (218) and the bracket (243). The porous part (500) may be bonded to the edge part (218) by solidifying after a first metal material forming the edge part (218) permeates into some of the plurality of pores of the porous part (500). Within the present disclosure, a portion of the porous part (500) that is joined to the edge part (218) by the first metal material penetrating into some of the pores of the porous part (500) and then solidifying is defined as a first portion (e.g., the first portion (510) of FIG. 5A). Within the present disclosure, a portion of the pores of the porous part (500) into which the first metal material penetrating and then solidifying is defined as a third portion.

[0115] In one embodiment, the porous part (500) may be joined to the bracket (243) by the second metal material forming the bracket (243) penetrating into another portion of the plurality of pores of the porous part (500) and then solidifying. Within the present disclosure, the portion of the porous part (500) that is joined to the bracket (243) by the second metal material penetrating into another portion of the plurality of pores of the porous part (500) and then solidifying is defined as the second portion (e.g., the second portion (520) of FIG. 5A). The first metal material and the second metal material may penetrate the porous part (500) in opposite directions. For example, the first metal material may penetrate into one side of the porous part, and the second metal material may penetrate into the other side of the porous part. Within the present disclosure, the other portions of the plurality of pores of the porous part (500) that are solidified after the second metal material has penetrated are defined as fourth portions. The third portions and the fourth portions may be pores before the first metal material or the second metal material has penetrated, and may be portions filled with the first metal material or the second metal material after the first metal material or the second metal material has penetrated and solidified.

[0116] According to an exemplary embodiment, an edge part (218) to be joined with the porous part (500) can be manufactured by die casting a first metal material in a liquid state forming the edge part (218) onto one side of the porous part (500). Thereafter, a bracket (243) to be joined with the porous part (500) can be manufactured by die casting a second metal material in a liquid state forming the bracket (243) onto the other side of the porous part (500). By die casting the first metal material and the second metal material, the first metal material or the second metal material naturally penetrates into the plurality of pores of the porous part (500), thereby forming the edge part (218) and the bracket (243) to be joined with the porous part (500). The edge part (218) and the bracket (243) can be joined firmly and stably by being joined through the porous part (500).

[0117] Fig. 5a is a cross-sectional view of a frame according to an exemplary embodiment taken along line A-A' of Fig. 4a. Figs. 5b and 5c illustrate portions of a frame according to an exemplary embodiment.

[0118] Referring to FIG. 5A, the frame (300) may include an edge part (218), a bracket (243), and a porous part (500). The porous part (500) may be positioned between the edge part (218) and the bracket (243). The porous part (500) may be coupled to each of the edge part (218) and the bracket (243), thereby coupling the edge part (218) and the bracket (243).

[0119] According to an exemplary embodiment, the porous part (500) may include a first portion (510) and a second portion (520). Referring to FIG. 5B, the first portion (510) may be a portion of the porous part (500) that is coupled with the edge portion (218), and may be a portion into which a first metal material forming the edge portion (218) has penetrated. For example, at least some of the pores included in the first portion (510) may be filled with the first metal material, and the pores filled with the first metal material may be referred to as third portions (511). When the first metal material is zinc, the first portion (510) may include third portions (511) filled with zinc. The first metal material may be present across the edge part (218) and the first portion (510) by penetrating into the pores from the edge part (218) and then solidifying. The porous portion (500) may be joined to the edge part (218) via the first portion (510) including the third portions (511).

[0120] According to an exemplary embodiment, the edge part (218) can be formed by die casting a first metal material in a liquid state. A first die (e.g., the first die (720) of FIG. 7B) for forming the edge part (218) can be used. The edge part (218) can be formed by casting a first metal material in a liquid state (e.g., molten metal) into a first cavity (e.g., the first cavity (721) of FIG. 7B) of the first die (720). When manufacturing the edge part (218), when the porous part (500) is placed in the first cavity (721) and the first metal material in a liquid state is cast onto one side of the porous part (500), the first metal material can penetrate into the pores of the porous part (500) while forming the edge part (218). By the above process, a porous part (500) and an edge part (218) that are joined to each other can be manufactured. The above process will be described later.

[0121] Referring to FIG. 5C, the second portion (520) may be another portion of the porous part (500) that is coupled with the bracket (243), and may be a portion into which the second metal material forming the bracket (243) has penetrated. For example, at least some of the pores included in the second portion (520) may be filled with the second metal material, and the pores filled with the second metal material may be referred to as fourth portions (521). When the second metal material is aluminum, the second portion (520) may include fourth portions (521) filled with aluminum. The second metal material may penetrate into the pores from the bracket (243) and then solidify, thereby existing across the bracket (243) and the second portion (520). The porous part (500) can be coupled to the bracket (243) through the second part (520) including the fourth parts (521).

[0122] According to an exemplary embodiment, the bracket (243) may be formed by die casting a second metal material in a liquid state. A second die (e.g., the second die (730) of FIG. 7D) may be used to form the bracket (243). The bracket (243) may be formed by casting the second metal material in a liquid state (e.g., molten metal) into a second cavity (e.g., the second cavity (731) of FIG. 7D) of the second die (730). When manufacturing the bracket (243), the porous part (500) and the edge part (218) that are joined to each other are placed in the second cavity (731), and a second metal material in a liquid state is cast on the other side of the porous part (500) opposite to one side of the porous part (500), so that the second metal material can penetrate into the pores of the porous part (500) while forming the bracket (243). By the above process, the edge part (218) and the bracket (243) that are joined through the porous part (500) can be manufactured. The above process will be described later.

[0123] According to an exemplary embodiment, the edge part (218) and the bracket (243) can be coupled through the porous part (500). Third portions (e.g., third portions (511) in FIG. 5B) filled with the first metal material in the first portion (510) can couple the first portion (510) of the porous part (500) to the edge part (218). Fourth portions (e.g., fourth portions (521) in FIG. 5C) filled with the second metal material in the second portion (520) can couple the second portion (520) of the porous part (500) to the bracket (243). At least some of the plurality of pores of the porous part (500) are filled with the first metal material and the second metal material, thereby stably coupling the edge part (218) and the bracket (243). When the edge part (218) and the bracket (243) including different metal materials are directly bonded, electrochemical corrosion may occur due to contact between the different metal materials, which may weaken the bonding strength or cause uneven bonding strength. According to an exemplary embodiment, the above problems can be solved by indirectly bonding the edge part (218) and the bracket (243) through the porous part (500). The edge part (218) can be bonded to the porous part (500) through the third portions of the porous part (500), and the bracket (243) can be bonded to the porous part (500) through the fourth portions of the porous part (500), so that a stable and firm bonding can be achieved.

[0124] Hereinafter, a method for manufacturing a frame (300) according to an exemplary embodiment is described.

[0125] Figure 6 is a flowchart showing a method for manufacturing a frame according to an exemplary embodiment.

[0126] Referring to FIG. 6, in operation 601, a porous part (e.g., porous part (500) of FIG. 7a) may be provided (prepared).

[0127] According to an exemplary embodiment, the porous part (500) may include a plurality of pores. FIG. 7A illustrates a porous part (500) according to an exemplary embodiment. The porous part (500) may include a plurality of pores (710) having a diameter ranging from about 10 μm to about 1,000 μm. As described below, by performing die casting, at least some of the plurality of pores (710) may be filled with a first metal material forming an edge part (e.g., edge part (218) of FIG. 4A), and other some of the plurality of pores (710) may be filled with a second metal material forming a bracket (e.g., bracket (243) of FIG. 4A).

[0128] The porous part (500) can be manufactured by three-dimensional printing (additive manufacturing) or metal injection molding (MIM). For example, when manufacturing the porous part (500) using metal injection molding, the binder content can be adjusted so that a plurality of pores can be formed after the powders are crystallized through a debinding process and a sintering process. The porous part (500) can be manufactured by a closed-cell casting method or a continuous-cell casting method. The continuous-cell casting method can include various methods such as sintered metal powder, a space holder method, a combustion synthesis method, and CVD (chemical vapor deposition). The method for manufacturing the porous part (500) is not limited to the above-described method, and various methods can be used.

[0129] Referring again to FIG. 6, at operation 603, a porous part (500) may be seated within a first cavity (e.g., the first cavity (721) of FIG. 7b) of a first die (e.g., the first die (720) of FIG. 7b). The first die (720) may be used for die casting to manufacture an edge part (218).

[0130] In operation 605, a first metal material in a liquid state can be cast into the first cavity (721).

[0131] Figure 7b illustrates a process for manufacturing an edge part (218) according to an exemplary embodiment. Die casting is a process of forming a metal material (molten metal) in a liquid state by injecting it into a cavity of a die. Die casting can provide excellent productivity, high dimensional accuracy, and a simple post-processing process. The first cavity (721) of the first die (720) can have a shape for forming the edge part (218). A first metal material in a liquid state can be cast into the first cavity (721). When the first metal material is cast into the first cavity (721), the first metal material can flow along the first cavity (721) for forming the edge part (218). The first metal material in a liquid state can penetrate into the first pores among the plurality of pores of the porous part (500) within the first cavity (721).

[0132] Referring again to FIG. 6, in operation 607, after casting the first metal material in a liquid state, the first intermediate structure (701) can be formed by solidifying the first metal material in a liquid state.

[0133] Fig. 7c illustrates a first intermediate structure (701). Referring to Fig. 7c, the first intermediate structure (701) may be referred to as an intermediate structure in which the edge part (218) is coupled to the first portion (510) of the porous portion (500). The first pores included in the first portion (510) may be filled with the first metal materials by solidifying after the first metal materials forming the edge part (218) have penetrated therein. As described above, the first pores filled with the first metal materials may be referred to as third portions (e.g., the third portions (511) of Fig. 5b). Since the first intermediate structure (701) is in a state before the bracket (243) is formed, the interior of the edge part (218) may be empty. Referring to FIG. 7C, the first metal material forming the edge part (218) can penetrate into the first part (510), thereby firmly bonding the edge part (218) and the porous part (500). In FIG. 7C, the edge part (218) of the first intermediate structure (701) is illustrated as an integrally formed structure, but the embodiment is not limited thereto. For example, the edge part (218) can have a segmented structure including a slot (e.g., a slot or slit (415) of FIG. 4B). The first part (510) of the porous part (500) can be bonded to the inner surface of the edge part (218) having the segmented structure.

[0134] Referring again to FIG. 6, at operation 609, the first intermediate structure (701) may be separated from the first die (720) and placed within the second cavity (731) of the second die (730). The second die (730) may be used for die casting to manufacture the bracket (243).

[0135] In operation 611, a second metal material in a liquid state can be cast into the second cavity (731).

[0136] FIG. 7D illustrates a process for manufacturing a bracket (243) according to an exemplary embodiment. The second cavity (731) of the second die (730) may have a shape for forming the bracket (243). A second metal material in a liquid state may be cast into the second cavity (731). When the second metal material is cast into the second cavity (731), the second metal material may flow along the second cavity (731) for forming the bracket (243). The second metal material in a liquid state may penetrate into the second pores among the plurality of pores of the porous part (500) within the second cavity (731).

[0137] Referring again to FIG. 6, in operation 613, after casting the second metal material in a liquid state, a second intermediate structure (702) can be formed by solidifying the second metal material in a liquid state.

[0138] Fig. 7e illustrates a second intermediate structure (702). Referring to Fig. 7e, the second intermediate structure (702) may be referred to as an intermediate structure in which a bracket (243) is formed inside the first intermediate structure (701). In the second intermediate structure (702), the edge part (218) may be coupled to the first part (510) of the porous part (500), and the bracket (243) may be coupled to the second part (520) of the porous part (500). The second pores included in the second part (520) may be filled with second metal materials by solidifying after the second metal materials forming the bracket (243) have penetrated therein. As described above, the second pores filled with the second metal materials may be referred to as fourth parts (e.g., the fourth parts (521) of Fig. 5c). Since the second intermediate structure (702) is in a state after the bracket (243) is formed, a portion of the interior of the edge part (218) may be filled with the bracket (243). Referring to FIG. 7e, the second metal material forming the bracket (243) extends into the second portion (520), so that the bracket (243) and the porous part (500) may be firmly coupled. According to an exemplary embodiment, the edge part (218) and the bracket (243) may be stably coupled by the porous part (500).

[0139] According to one embodiment, the porous part (500) may be formed of a third metal material. In one embodiment, the melting point of the third metal material may be higher than the melting point of the first metal material and the melting point of the second metal material. If the melting point of the third metal material is lower than the melting point of the first metal material and the melting point of the second metal material, when the first metal material in a liquid state or the second metal material in a liquid state penetrates into the porous part (500), the porous part (500) may be damaged by the first metal material or the second metal material. When die casting the first metal material in a liquid state or the second metal material in a liquid state, in order to prevent deformation or deterioration of the properties of the porous part (500) due to high temperature, the melting point of the third metal material forming the porous part (500) should be higher than the melting point of the first metal material and the melting point of the second metal material. For example, when the second metal material is aluminum, in order to prevent the porous part (500) from being damaged when casting aluminum, the porous part (500) may be formed of a material (e.g., titanium, iron, copper, etc.) having a melting point higher than the melting point of aluminum (e.g., about 659°C).

[0140] Referring again to FIG. 6, at operation 615, the second intermediate structure (702) is separated from the second die (730), and the gap between the edge part (218) and the bracket (243) can be filled with the injection portion (310).

[0141] Figures 7f, 7g, and 7h illustrate the process of injecting resin into the gap between the edge part (218) and the bracket (243).

[0142] Referring to FIG. 7F, a gap may exist between the edge part (218) and the bracket (243). If the edge part (218) is entirely composed of a first metal material that is a conductive material, it may be difficult to use the edge part (218) as an antenna radiator because the resonant frequency of a signal radiated or received through the edge part (218) cannot be controlled. In order to use one or more conductive portions (410) of the edge part (218) as an antenna radiator, the edge part (218) may have a segmented structure. The segmented structure may be referred to as a structure of the edge part (218) that includes a plurality of segments that are separated from each other in order to determine the electrical length of one or more conductive portions (410). The electrical length of one or more conductive portions (410) can determine the frequency characteristics of a signal transmitted and / or received through the antenna radiator, so that one or more conductive portions (410) can be used as an antenna radiator for transmitting and / or receiving a signal on a specified frequency band.

[0143] FIG. 7g illustrates a process in which a resin (740) is injected between an edge part (218) and a bracket (243). Referring to FIG. 7g, the resin (740) may be injected to fill a gap between the edge part (218) and the bracket (243). The resin (740), which is a non-conductive material, fills at least a portion of the gap between the edge part (218) and the bracket (243), thereby allowing the edge part (218) and the bracket (243) to be firmly bonded together. The resin (740) may form one or more non-conductive portions (e.g., one or more non-conductive portions (420) of FIG. 7h) that come into contact with one or more conductive portions (410). By filling the empty portion of the edge part (218) with the resin (470), a segmented structure including one or more conductive portions (410) and one or more non-conductive portions (e.g., one or more non-conductive portions (420) of FIG. 7h) can be formed. For example, a wireless communication module (e.g., the wireless communication module (192) of FIG. 1) can be configured to transmit or receive a signal on a designated band using the one or more conductive portions (410). For example, the resin (740) may include, but is not limited to, polybutyleneterephthalate (PBT), which has excellent electrical properties and flame retardancy. For example, the resin (740) may also include polycarbonate (PC) and / or polyphthalamide (PPA).

[0144] Fig. 7h illustrates the final state of the frame (300) after processing. Referring to Fig. 7h, the resin (740) can form the injection-molded portion (310) of the bracket (243) by filling at least a portion of the gap between the edge part (218) and the bracket (243). After the injection-molded portion (310) is formed, a processing process for improving dimensional accuracy, a polishing process for improving the quality of the outer surface, and / or a coating process (e.g., PVD (physical vapor deposition) coating) for implementing color can be performed. For example, a cutting processing process for rounding the outer surface of the edge part (218) can be performed.

[0145] According to an exemplary embodiment, the porous part (500) and the edge part (218) may be joined by a first metal material that has penetrated into some of the plurality of pores within the porous part (e.g., the porous part (500) of FIG. 7A) and then solidified. The porous part (500) and the bracket (243) may be joined by a second metal material that has penetrated into other of the plurality of pores within the porous part (500) and then solidified. The edge part (218) and the bracket (243) may be indirectly and firmly joined to each other via the porous part (500). An electronic device (101) according to an exemplary embodiment may have a joint structure of an edge part (218) and a bracket (243) using a porous part (500) without having to form a separate uneven portion on the inner side of the edge part (218) or adjust the roughness for jointing between the edge part (218) and the bracket (243). The above-described manufacturing method can improve the joint strength between the edge part (218) and the bracket (243) and reduce unnecessary processes, thereby reducing manufacturing costs.

[0146] According to an exemplary embodiment, the edge part (218) and the bracket (243) may include different metals. The edge part (218) exposed to the outside of the electronic device (101) may include a first metal material (e.g., titanium and / or zinc) having a relatively high strength for the rigidity of the electronic device (101). The bracket (243), which is disposed inside the electronic device (101) and not exposed to the outside, may include a second metal material (e.g., aluminum) having a relatively low specific gravity for the weight lightening of the electronic device (101). The exemplary electronic device (101) may provide a light weight while having a high rigidity.

[0147] Figure 8 illustrates a frame of an electronic device according to an exemplary embodiment.

[0148] Referring to FIG. 8, the frame (300) according to the exemplary embodiment may further include a fifth portion (530) disposed between the first portion (510) and the second portion (520). The fifth portion (530) may be surrounded by the first portion (510) and the second portion (520). The fifth portion (530) may include a plurality of empty pores (531) as a portion of the porous part (500) into which the first metal material and the second metal material do not penetrate.

[0149] According to an exemplary embodiment, the first metal material may penetrate into the third portions of the first portion (510) and then solidify, thereby joining the first portion (510) and the edge portion (218). The second metal material may penetrate into the fourth portions of the second portion (520) and then solidify, thereby joining the second portion (520) and the bracket (243). The fifth portion (530) may include a plurality of empty pores (531) formed so as to prevent the first metal material and the second metal material from penetrating.

[0150] In order to infiltrate the first metal material into the first portion (510) or the second metal material into the second portion (520), the third portions (511) within the first portion (510) and the fourth portions (521) within the second portion (520) may have relatively large sizes. The pores within the first portion (510) before the first metal material infiltrates and the pores within the second portion (520) before the second metal material infiltrates may have relatively large sizes. In the case of the plurality of pores (531) within the fifth portion (530), they may have relatively small sizes to prevent the first metal material and the second metal material from infiltrating.

[0151] According to an exemplary embodiment, within the first portion (510), the first size of the third portions (511) into which the first metal material has penetrated and / or within the second portion (520), the second size of the fourth portions (521) into which the second metal material has penetrated may be larger than the third size of the plurality of pores (531) within the fifth portion (530). Because the third size is smaller than the first size and the second size, the first metal material and the second metal material may not penetrate into the plurality of pores (531) within the fifth portion (530).

[0152] According to an exemplary embodiment, the density of the third portions (511) within the first portion (510), the density of the fourth portions (521) within the second portion (520), and the density of the plurality of voids (531) within the fifth portion (530) may be different due to the differences in the first size, the second size, and the third size. The density may indicate how many voids are present.

[0153] For example, the density of pores in the first portion (510) before the first metal material penetrates and the density of pores in the second portion (520) before the second metal material penetrates may be relatively low because they are not dense due to pores having relatively large sizes. The density of pores in the fifth portion (530) may be relatively high because they are dense due to pores having relatively small sizes. According to an exemplary embodiment, the first density of the third portions (511) in the first portion (510) and the second density of the fourth portions (521) in the second portion (520) may be lower than the third density of the plurality of pores in the fifth portion (530). The pore ratio of the fifth portion (530) may be higher than the pore ratio of the first portion (510) and the pore ratio of the second portion (520). The pore ratio may be higher as more pores are included in a certain volume.

[0154] According to an exemplary embodiment, even if the first metal material and the second metal material do not penetrate the entire porous part (500), the porous part (500) can be joined to the edge part (218) and the bracket (243). If the porous part (500) includes a plurality of pores that are not filled with the metal material, the weight of the frame (300) can be reduced. As illustrated in FIG. 8, if the porous part (500) includes a third portion including a plurality of pores, the weight of the frame (300) can be reduced, thereby enabling a weight reduction of the electronic device (101).

[0155] Figures 9a, 9b, 9c, and 9d illustrate various embodiments of porous parts.

[0156] Referring to FIGS. 9a, 9b, 9c, and 9d, the porous part (500) can have various shapes.

[0157] Referring to FIG. 9A, the porous part (500) may have a rectangular cross-section. The edge part (218) may be joined to the porous part (500) by a first metal material that has penetrated into a portion of the rectangular cross-section.

[0158] Referring to FIG. 9B, the first portion (510) of the porous part (500) may include a groove portion (910). The groove portion (910) may be formed by recessing from an outer surface of the first portion (510) into the interior of the first portion (510). When a first metal material for forming the edge portion (218) is cast, the first metal material may be filled in the groove portion (910) and then solidified. As the first metal material filled in the groove portion (910) solidifies, a contact area between the first portion (510) and the edge portion (218) may increase. An increase in the contact area may improve a bonding force between the porous part (500) and the edge portion (218), so that the edge portion (218) may be firmly and stably bonded to the porous part (500). In FIG. 9B, the groove portion (910) is illustrated as being formed on the side surface of the first portion (510), but the embodiment is not limited thereto. To enhance the bonding strength, the shape of the groove portion (910) may have a dovetail shape or an undercut shape. Since the edge portion (218) can be strongly bonded to the first portion (510) by the groove portion (910), the bonding strength between the edge portion (218) and the porous portion (500) can be enhanced.

[0159] Referring to FIG. 9c, at least a portion of the outer surface (510a) of the first portion (510) may have a shape corresponding to the shape of the outer surface (218a) of the edge part (218). According to an exemplary embodiment, at least a portion of the outer surface (218a) of the edge part (218) may be rounded. If the outer surface (218a) of the edge part (218) is angular, the grip of the electronic device (101) may be reduced, the device may be easily damaged by impact, thereby weakening its durability and deteriorating its design aesthetics. To solve the above problems, a cutting process may be performed so that the edge part (218) has a rounded outer surface (218a).

[0160] According to an exemplary embodiment, at least a portion of the outer surface (510a) of the first portion (510) may have a shape corresponding to the shape of the outer surface (218a) of the edge part (218). Since at least a portion of the outer surface (510a) of the first portion (510) has a shape corresponding to the shape of the outer surface (218a) of the edge part (218), penetration of the first metal material may be facilitated. By facilitating penetration of the first metal material, the bonding force between the edge part (218) and the porous part (500) may be increased. When the outer surface (218a) of the edge part (218) is rounded, the outer surface (510a) of the first portion (510) may also be rounded.

[0161] Referring to FIG. 9d, the first part (510) includes a groove part (910), and at least a portion of an outer surface (510a) of the first part (510) may have a shape corresponding to an outer surface of the edge part (218). According to an exemplary embodiment, the bonding force between the edge part (218) and the first part (510) may be increased through the groove part (910) and at least a portion of the outer surface (510a).

[0162] Figures 10a, 10b, 10c, 10d, and 10e illustrate various embodiments of porous parts.

[0163] Referring to FIGS. 10a, 10b, 10c, 10d, and 10e, the porous part (500) including the third portion may have various shapes.

[0164] Referring to FIG. 10A, the porous part (500) may have a rectangular cross-section. The edge part (218) may be joined to the porous part (500) by a first metal material that has penetrated into a portion of the rectangular cross-section (the first portion (510)). The bracket (243) may be joined to the bracket (243) by a second metal material that has penetrated into another portion of the rectangular cross-section (the second portion (520)). The plurality of pores within the fifth portion (530) may be empty and not filled with the first metal material or the second metal material.

[0165] Referring to FIG. 10B, the first portion (510) of the porous part (500) may include a groove portion (910). The groove portion (910) may be formed by recessing from an outer surface of the first portion (510) into the interior of the first portion (510). By the groove portion (910), the edge portion (218) may be brought into contact with the fifth portion. The plurality of pores within the fifth portion may have a relatively small size to prevent the first metal material or the second metal material from penetrating. When the first metal material for forming the edge portion (218) is cast, the first metal material may be filled in the groove portion (910) and then solidified. As the first metal material filled in the groove portion (910) solidifies, the contact area between the first portion (510) and the edge portion (218) may increase. An increase in the contact area can improve the bonding force between the porous part (500) and the edge part (218), so that the edge part (218) can be firmly and stably bonded to the porous part (500). In FIG. 10b, the groove part (910) is illustrated as being formed on the side surface of the first part (510), but the embodiment is not limited thereto. To improve the bonding force, the shape of the groove part (910) may have a dovetail shape or an undercut shape.

[0166] Referring to FIG. 10c, the first portion (510) and the second portion (520) may be spaced apart from each other. Comparing the example illustrated in FIG. 10a with the example illustrated in FIG. 10c, the weight reduction effect of the frame (300) can be improved by increasing the size of the fifth portion.

[0167] Referring to FIGS. 10d and 10e, at least a portion of the outer surface (510a) of the first portion (510) may have a shape corresponding to the shape of the outer surface (218a) of the edge part (218). The edge part (218) may have a rounded outer surface (218a). At least a portion of the outer surface (510a) of the first portion (510) may be rounded to correspond to the shape of the outer surface (218a) of the edge part (218). Since at least a portion of the outer surface (510a) of the first portion (510) has a shape corresponding to the shape of the outer surface (218a) of the edge part (218), the penetration of the first metal material may be facilitated. By facilitating the penetration of the first metal material, the bonding force between the edge part (218) and the porous part (500) may be increased.

[0168] FIGS. 11A and 11B illustrate an electronic device according to an exemplary embodiment including a porous part.

[0169] Referring to FIG. 11A, an electronic device (101) according to an exemplary embodiment may include a plurality of porous parts (500, 1100). The electronic device (101) may further include other porous parts (1100) that are identical to the porous part (500) described above.

[0170] According to an exemplary embodiment, a plurality of porous parts (500, 1100) may be arranged along and spaced apart from each other between the edge part (218) and the bracket (243). A state (1101) of FIG. 11A illustrates the frame (300) before die casting the second metal material. In the state (1101), the porous part (500) may be positioned at one position on the inner surface of the edge part (218), and other porous parts (1100) may be positioned at other positions of the edge part (218). A state (1102) of FIG. 11A illustrates the frame (300) after die casting the second metal material. Referring to the above state (1102), a bracket (243) can be formed by positioning a plurality of porous parts (500, 1100) at a plurality of points on the inner surface of an edge part (218) and then die casting a second metal material. The edge part (218) and the bracket (243) can be joined through the plurality of porous parts (500, 1100) that are spaced apart from each other. From the perspective that the edge part (218) and the bracket (243) are joined at each of the positions where the plurality of porous parts (500, 1100) are positioned, the structure illustrated in FIG. 11A can be referred to as a point joining structure. Through the plurality of porous parts (500, 1100), the bracket (243) and the edge part (218) can be firmly joined.

[0171] Referring to FIG. 11b, the plurality of porous parts (500, 1100) may extend along at least a portion of the boundary between the edge part (218) and the bracket (243). The plurality of porous parts (500, 1100) may have a relatively wide contact area by extending along the boundary.

[0172] State (1103) of Fig. 11b shows the frame (300) before die casting the second metal material. In the state (1103), the porous part (500) can be positioned at one position on the inner surface of the edge part (218), and other porous parts (1100) can be positioned at other positions of the edge part (218). State (1104) of Fig. 11b shows the frame (300) after die casting the second metal material. Referring to the state (1104), a bracket (243) can be formed by die casting the second metal material after positioning a plurality of porous parts (500, 1100) at a plurality of points on the inner surface of the edge part (218).

[0173] According to an exemplary embodiment, the structure illustrated in FIG. 11B may be referred to as a surface bonding structure in that the edge part (218) and the bracket (243) are joined through the areas of the plurality of elongated porous parts (500, 1100). Since the frame (300) illustrated in FIG. 11B has a relatively large area in which the plurality of porous parts (500, 1100) come into contact with the edge part (218) and the bracket (243), the bracket (243) and the edge part (218) can be firmly joined through the plurality of porous parts (500, 1100).

[0174] An electronic device (101) is provided. The electronic device (101) may include a display (201) including a display panel (201a) and a window (201b) attached to the display panel (201a). The electronic device (101) may include a frame (300) that supports at least a portion of the display (201). The frame (300) may include an edge part (218) formed of a first metal material and defining a side (side exterior surface) (200C) of the electronic device (101). The frame (300) may include a bracket (243) formed of a second metal material different from the first metal material and surrounded by the edge part (218). The frame (300) may include a porous part (500) disposed between the edge part (218) and the bracket (243). The porous part (500) may include a first part (510) coupled to the edge part (218) and a second part (520) coupled to the bracket (243). The first part (510) of the porous part (500) may include third parts (511) permeated with the first metal material forming the edge part (218). The second part (520) of the porous part (500) may include fourth parts (521) permeated with the second metal material forming the bracket (243). According to an exemplary embodiment of the present disclosure, the edge part (218) and the bracket (243) may be strongly coupled to the porous part (500) by the first metal material and the second metal material permeating into the porous part (500). The edge part (218) and bracket (243) containing different metal materials can be strongly bonded through the porous part (500).

[0175] In one embodiment, the first metal material may include titanium or zinc. The second metal material may include aluminum.

[0176] According to one embodiment, the first part (510) can be joined to the edge part (218) by the first metal material forming the edge part (218) penetrating into the third parts and then solidifying. The second part (520) can be joined to the bracket (243) by the second metal material forming the bracket (243) penetrating into the fourth parts and then solidifying.

[0177] According to one embodiment, the porous part (500) may further include a fifth part (530) disposed between the first part (510) and the second part (520). The fifth part (530) may include a plurality of pores (531).

[0178] In one embodiment, the first size of the third portions in which the first metal material has penetrated within the first portion (510) and the second size of the fourth portions in which the second metal material has penetrated within the second portion (520) may be larger than the third size of the plurality of pores in the fifth portion (530). The fifth portion (530) may include a plurality of pores (531) having relatively small sizes, thereby limiting penetration of the first metal material and the second metal material. As the fifth portion (530) is formed as an empty portion, the overall weight of the frame (300) may be reduced.

[0179] According to one embodiment, the first density of the third portions within the first portion (510) and the second density of the fourth portions (521) within the second portion (520) may be lower than the third density of the plurality of voids within the fifth portion (530).

[0180] In one embodiment, the specific gravity of the second metal material may be lower than the specific gravity of the first metal material.

[0181] According to one embodiment, at least a portion of the outer surface of the first portion (510) facing the edge part (218) may have a shape corresponding to the shape of the outer surface of the edge part (218).

[0182] According to one embodiment, the shape of the outer surface of the first portion (510) and the shape of the outer surface of the edge part (218) may be rounded.

[0183] According to one embodiment, the first portion (510) may include a recessed portion (910) that extends from the outer surface of the first portion (510) into the interior of the first portion (510).

[0184] According to one embodiment, the electronic device (101) may further include other porous parts (1100) spaced apart from the porous part (500). The porous part (500) and the other porous parts (1100) may be arranged along a distance between the edge part (218) and the bracket (243).

[0185] In one embodiment, the porous part (500) and the other porous parts (1100) may extend along a portion between the edge part (218) and the bracket (243).

[0186] According to one embodiment, the electronic device (101) may further include an injection part (310) that fills the gap between the edge part (218) and the bracket (243).

[0187] According to one embodiment, the electronic device (101) may further include a rear cover (211) opposite the display (201).

[0188] According to one embodiment, the porous part (500) may be formed of a third metal material. The melting point of the third metal material may be higher than the melting point of the first metal material and the melting point of the second metal material.

[0189] A method of manufacturing a frame (300) used for an electronic device (101) is provided. The method may include an operation of providing a porous part (500) including a plurality of pores (710). The method may include an operation of seating the porous part (500) within a first cavity (721) of a first die (720). The method may include an operation of casting a first metal material in a liquid state into the first cavity (721). In the operation, the first metal material in a liquid state may penetrate into the first pores among the plurality of pores (710) of the porous part (500). The manufacturing method may include an operation of casting the first metal material in a liquid state, and then solidifying the first metal material in a liquid state to form a first intermediate structure (701) that is joined to a first portion of the porous part including the first pores filled with the first metal material and includes an edge part (218) formed of the first metal material. The manufacturing method may include an operation of separating the first intermediate structure (701) from the first die (720). The manufacturing method may include an operation of seating the first intermediate structure (701) within a second cavity (731) of a second die (730). The manufacturing method may include an operation of casting a second metal material in a liquid state into the second cavity (731). In the operation, the second metal material in a liquid state may penetrate into the second pores among the plurality of pores (710) of the porous part (500).The manufacturing method may include an operation of forming a second intermediate structure (702) that includes a bracket formed of the second metal material and is joined to a second portion of the porous part including the second pores filled with the second metal material by casting the second metal material in a liquid state and then solidifying the second metal material in a liquid state. The manufacturing method may include an operation of separating the second intermediate structure (702) from the second die (730). The manufacturing method may include an operation of filling a gap between the edge part (218) and the bracket (243) with an injection portion (310). When the first metal material penetrates into the first pores and then solidifies, the third portions (511) of FIG. 5b may be formed, and when the second metal material penetrates into the second pores and then solidifies, the fourth portions (521) of FIG. 5c may be formed.

[0190] In one embodiment, the first metal material may include titanium or zinc. The second metal material may include aluminum.

[0191] According to one embodiment, the porous part (500) may further include third pores (e.g., a plurality of pores (531) of FIG. 8) positioned between the first pores and the second pores. A first size of the first pores and a second size of the second pores may be larger than a third size of the third pores.

[0192] According to one embodiment, the porous part (500) may be formed of a third metal material. The melting point of the third metal material may be higher than the melting point of the first metal material and the melting point of the second metal material.

[0193] In one embodiment, the specific gravity of the second metal material may be lower than the specific gravity of the first metal material.

[0194] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0195] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0196] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0197] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0198] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or an intermediary server.

[0199] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A display comprising a display panel and a window attached to the display panel; and comprising a frame supporting at least a portion of the display; The above frame is, An edge part formed of a first metal material and defining a side surface of the electronic device, A bracket formed of a second metal material different from the first metal material and surrounded by the edge part, and A porous part disposed between the edge part and the bracket, the porous part including a first part coupled to the edge part and a second part coupled to the bracket, The first part of the above porous part, Including third parts permeated with the first metal material forming the edge part, The second part of the above porous part, Including fourth portions in which the second metal material forming the bracket is penetrated, Electronic devices.

2. In paragraph 1, The above first metal material is, Contains titanium or zinc, The above second metal material is, Containing aluminum, Electronic devices.

3. In paragraph 1 or 2, The above first part is, The first metal material forming the edge part is solidified after penetrating into the third parts, thereby being joined to the edge part, The second part above is, The second metal material forming the bracket is solidified after penetrating into the fourth parts, thereby being joined to the bracket. Electronic devices.

4. In any one of paragraphs 1 to 3, The above porous part, Further comprising a fifth part disposed between the first part and the second part, Part 5, Containing multiple voids, Electronic devices.

5. In paragraph 4, The first size of the third portions in which the first metal material is penetrated within the first portion and the second size of the fourth portions in which the second metal material is penetrated within the second portion are, larger than the third size of the plurality of pores within the fifth section, Electronic devices.

6. In paragraph 5, The first density of the third portions within the first portion and the second density of the fourth portions within the second portion are, lower than the third density of the plurality of pores within the fifth section, Electronic devices.

7. In any one of paragraphs 1 to 6, The specific gravity of the above second metal material is Lower than the specific gravity of the first metal material, Electronic devices.

8. In any one of paragraphs 1 to 7, At least a portion of the outer surface of the first portion facing the edge part, Having a shape corresponding to the shape of the outer surface of the above edge part, Electronic devices.

9. In paragraph 8, The shape of the outer surface of the first part and the shape of the outer surface of the edge part are, Round Jin, Electronic devices.

10. In any one of paragraphs 1 to 9, The above first part is, From the outer surface of the first part, including a recessed groove portion into the interior of the first part, Electronic devices.

11. In any one of paragraphs 1 to 10, Further comprising other porous parts spaced apart from the above porous part, The above porous part and the other porous parts, Positioned along the edge part and the bracket, Electronic devices.

12. In any one of paragraphs 1 to 11, The above porous part and the other porous parts, extending along at least a portion between the edge part and the bracket; Electronic devices.

13. In any one of paragraphs 1 to 12, Further comprising an injection part that fills the gap between the edge part and the bracket. Electronic devices.

14. In any one of paragraphs 1 to 13, The above porous part, Formed from a third metal material, The melting point of the above third metal material is Higher than the melting point of the first metal material and the melting point of the second metal material, Electronic devices.

15. A method for manufacturing a frame used for an electronic device, An operation of providing a porous part containing multiple pores; An operation of placing the above porous part within a first cavity of a first die; An operation of casting a first metal material in a liquid state into the first cavity, wherein the first metal material in a liquid state penetrates into first pores among the plurality of pores of the porous part; An operation of forming a first intermediate structure, which includes a first portion of the porous part including the first pores filled with the first metal material and an edge part formed of the first metal material, by casting the first metal material in a liquid state and solidifying the first metal material in a liquid state; An operation of separating the first intermediate structure from the first die; An operation of placing the first intermediate structure into the second cavity of the second die; An operation of casting a second metal material in a liquid state into the second cavity, wherein the second metal material in a liquid state penetrates into the second pores among the plurality of pores of the porous part; After casting the second metal material in a liquid state, an operation of forming a second intermediate structure including a bracket formed of the second metal material and bonded to a second portion of the porous part including the second pores filled with the second metal material by solidifying the second metal material in a liquid state; An operation of separating the second intermediate structure from the second die; and Including an action of filling the gap between the edge part and the bracket with an injection part, Manufacturing method.

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