Flight management systems

The centralized flight management system integrates circuit boards and power supplies with EMI shielding, addressing weight and interference issues in conventional systems, resulting in a more efficient and compact aircraft design.

WO2025221813A1PCT designated stage Publication Date: 2025-10-23SWIFT ENG INC
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Patent Information

Application Number
PCT/US2025/024804
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-04-18
Filing Date
2025-04-15
Publication Date
2025-10-23

AI Technical Summary

Technical Problem

Conventional aircraft control systems face challenges with weight, complexity, and electromagnetic interference (EMI) due to separate control units, power supplies, and wiring, which are not efficiently integrated, leading to increased space requirements and interference among components.

Method used

A centralized flight management system with integrated circuit boards and power supplies, shielded by a frame structure to minimize EMI, allowing for a compact, programmable unit that controls and powers various aircraft components efficiently.

Benefits of technology

The integrated system reduces weight, complexity, and EMI, enabling a more efficient and compact aircraft design by consolidating components and minimizing electromagnetic interference.

✦ Generated by Eureka AI based on patent content.

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Abstract

A flight management system may include a housing configured to be supported in a vehicle, a first circuit board positioned in the housing, a second circuit board positioned in the housing, and one or more cells positioned between the first circuit board and the second circuit board. The cells may be part of a frame structure. The first circuit board may carry a central controller configured to control one or more aspects of the vehicle, a navigation module configured to receive or interpret signals from a global positioning system, a communications module configured to send or receive data for control of the vehicle or data representative of a status of the vehicle, and one or more sensors. The second circuit board may carry power supplies for one or more components on the first circuit board. The cells may receive the power supplies to reduce EMI exposure to other components.
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Description

FLIGHT MANAGEMENT SYSTEMSCROSS-REFERENCE TO RELATED APPLICATION(S)

[0001] The present application claims priority to U.S. Provisional Patent Application No. 63 / 636,092 filed April 18, 2024, and which is incorporated herein by reference in its entirety.BACKGROUND

[0002] Aircraft, including remotely controlled or autonomously controlled aircraft (e.g., unmanned aerial vehicles or“UAVs”) or other unmanned vehicle systems (“UVS”), often require several control units and power supplies for controlling and operating various parameters of the aircraft or vehicle. For example, an aircraft may include one or more control units and power supplies for each of the aerodynamic control surfaces, propulsion, or sensors (e.g., for sensing, directing, or determining location, altitude, heading, speed, acceleration, power draw, etc.). Each of the control units and their corresponding power supplies must be connected to their corresponding devices and to a main onboard control computer by wiring. The separate units, power supplies, wiring, and associated packaging or containers for these components add weight, complexity, and space requirements to the aircraft.

[0003] Some conventional aircraft control systems may combine one or more aspects of conventional control units and power supplies into a single unit or device. However, such conventional systems are designed only to handle limited power or to control a limited subset of aircraft components. As a result, conventional systems still include many control units and power supplies outside of the combined unit or device, and the problem of additional weight, complexity, and space requirements persists inconventional systems. One challenge for system designers is the risk of interference (e.g., electromagnetic interference, or “EMI”) among components positioned near other, such as power supplies near navigational sensors.

[0004] Aspects of embodiments of the present technology address these drawbacks and other drawbacks.SUMMARY

[0005] Representative embodiments of the present technology include a flight management system having a housing configured to be supported in a vehicle, a first circuit board positioned in the housing, a second circuit board positioned in the housing, and one or more cells positioned between the first circuit board and the second circuit board. The cells may be part of a frame structure. The first circuit board may carry a central controller configured to control one or more aspects of the vehicle, a navigation module configured to receive or interpret signals from a global positioning system, a communications module configured to send or receive data for control of the vehicle or data representative of a status of the vehicle, and one or more sensors. The second circuit board may carry power supplies for components on the first circuit board. The cells may receive or shield the power supplies to reduce EMI exposure to other components of the system.

[0006] Other features and advantages will appear hereinafter. The features described herein can be used separately or together, or in various combinations of one or more of them.BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In the drawings, wherein the same reference number indicates the same element throughout the views:

[0008] Figure 1 illustrates a schematic block diagram of a flight management system configured in accordance with embodiments of the present technology;

[0009] Figure 2 illustrates an exploded view of a representative flight management system configured in accordance with embodiments of the present technology;

[0010] Figure 3 illustrates a partially exploded view of the flight management system of Figure 2;

[0011] Figure 4A illustrates a side view of portions of the flight management system of Figure 2;

[0012] Figure 4B illustrates a top view of portions of the flight management system of Figure 2;

[0013] Figure 4C illustrates a side cutaway view of portions of the flight management system of Figure 2;

[0014] Figure 5A illustrates a partially schematic cross-sectional view of a first circuit board in the flight management system of Figure 2;

[0015] Figure 5B illustrates a partially schematic cross-sectional infographic view of the first circuit board in Figure 5A;

[0016] Figure 6A illustrates a partially schematic cross-sectional view of a second circuit board in the flight management system of Figure 2;

[0017] Figure 6B illustrates a partially schematic cross-sectional infographic view of the second circuit board in Figure 6A; and

[0018] Figure 7 illustrates a schematic diagram of a flight management system according to further embodiments of the present technology.DETAILED DESCRIPTION

[0019] The present technology is directed to flight management systems, and associated systems and methods. Various embodiments of the technology will now be described. The following description provides specific details for a thorough understanding and enabling description of these embodiments. One skilled in the art will understand, however, that the invention may be practiced without many of these details. Additionally, some well-known structures or functions, such as structures or functions common to aircraft (including unmanned aerial vehicles (UAVs)), may not be shown or described in detail to avoid unnecessarily obscuring the relevant description of the various embodiments. Accordingly, embodiments of the present technology may include additional elements or exclude some of the elements described below with reference to Figures 1-7, which illustrate examples of the technology.

[0020] The terminology used in this description is intended to be interpreted in its broadest reasonable manner, even though it is being used in conjunction with a detailed description of certain specific embodiments of the technology. Certain terms may even be emphasized below; however, any terminology intended to be interpreted in any restricted manner will be overtly and specifically defined as such in this detailed description section.

[0021] Where the context permits, singular or plural terms may also include the plural or singular term, respectively. Moreover, unless the word “or” is expressly limited to mean only a single item exclusive from the other items in a list of two or more items, then the use of “or” in such a list is to be interpreted as including (a) any single item inthe list, (b) all the items in the list, or (c) any combination of items in the list. Numerical adjectives including “first” and “second,” or the like, as used in the present disclosure, do not convey hierarchy or specific features or functions. Rather, such numerical adjectives are intended to aid the reader in distinguishing between elements which may have similar nomenclature, but which may differ in position, orientation, or structure. Accordingly, such numerical adjectives may be used differently in the claims.

[0022] As used herein, the terms “generally” and “approximately” refer to values or characteristics within a range of ±10% from the stated value or characteristic, unless otherwise indicated. For purposes of the present disclosure, a first element that is positioned “toward” an end of a second element is positioned closer to that end of the second element than to a middle or mid-length location of the second element.

[0023] In general, embodiments of the present technology resolve problems with conventional aircraft control systems by providing an integrated electronic device with circuitry to read and transmit sensor data for various aircraft parameters, including speed, altitude, attitude (pitch, roll, yaw), or other parameters, and to control motors or servos of the aircraft, all from one integral unit with features that overcome challenges associated with integrating the components of the control system, such as challenges associated with magnetic-field interference with sensors.

[0024] Figure 1 illustrates a schematic block diagram of a flight management system 100 configured in accordance with embodiments of the present technology. In some embodiments, the system 100 may include a single package 105 that includes an autopilot controller or central controller 110 in electrical and signal communication with one or more of: a navigation module 115 (e.g., a module for receiving or interpreting signals from a global positioning system or GPS, or another suitable navigation system);a communications module 120 (e.g., radio, cellular, or other suitable wireless protocols for remote control or data transmission); one or more sensors 125 (e.g., an accelerometer, altimeter, etc.); one or more control ports 130 for input or output of control, data, or power into or out of the system 100; one or more development ports 135 for input or output of control, data, or power for programming or adjusting the system 100; one or more expansion ports 140 for connecting with another flight management system for additional control data, or power capacity (e.g. , a system generally similar to, identical to, or compatible with the flight management system 100); one or more status indicators 145 for reporting or displaying a status of the system 100 or components therein; one or more power supplies 150; or a bus 155 for interconnecting one or more components of the system 100.

[0025] As illustrated in part by the POWER and DATA / COMM arrows in Figure 1 , the control ports 130 may be connected to various components of the aircraft that are external to the single package 105 of the system 100, such as speed controllers for propulsion, servos for controlling the control surfaces, sensors for receiving data, or other aircraft components. By integrating the system 100 in one package (e.g., in one chip, one box, one combined unit, etc.), the system 100 may be connected directly to other components of the aircraft such that the system 100 is a centralized, programmable controller for the aircraft, e.g., via programmability of the central controller 110. This is in contrast to conventional systems that include power or data systems located remotely from a central computer, such as in a wing of the aircraft or distributed among other locations in the aircraft.

[0026] Some embodiments of the present technology include multiple power supplies 150 in the system 100. This is in contrast with conventional systems that include only one power supply and fail to accommodate multiple systems, subsystems, or a fullsuite of aircraft components. The system 100 may include a main power input 160 for providing power to the plurality of power supplies 150. In some embodiments, the main power input 160 may be a 48-volt input; however, such a voltage input level is for example only and embodiments of the present technology can include any voltage level suitable for powering the components of the system 100 or other aspects of the aircraft to which the system 100 is connected (e.g., the propulsion motor, servos for control surfaces, etc.).

[0027] In some embodiments, the development ports 135 facilitate programming various aspects of the system 100. For example, the development ports 135 may facilitate controlling the system 100 to interface the system 100 with suitable hardware or software components to which the system 100 may be connected. The development ports 135 may facilitate access to the central controller 110 for programming autopilot features, waypoints, control protocols, etc.

[0028] Figure 2 illustrates an exploded view of a representative flight management system 200 configured in accordance with embodiments of the present technology. In some embodiments, the flight management system 200 shown in Figure 2 may include some or all of the components of the flight management system 100 described above with regard to Figure 1 , or the flight management system 200 shown in Figure 2 may be a construction or implementation of the flight management system 100 shown in Figure 1. Several of the components described above with regard to Figure 1 are shown in Figure 2. In some embodiments, the system 200 includes one or more of: a first circuit board 205 (e.g., a printed circuit board, or “PCB”); a second circuit board 210 (e.g., a PCB); a frame structure 215 positionable between the first circuit board 205 and the second circuit board 210; a base 220 (which may be or include metal material to form a heatsink or ground); or a cover 225 connectable to the base 220 to form a housing 230 of the system 200.

[0029] In an assembled state, the system 200 forms a modular, programmable device (e.g., a single package 105, see Figure 1) that may be implemented in any suitable vehicle, at least because it includes input / output interfaces (e.g., the ports 130, 135, 140) and a plurality of power supplies 150 for controlling or powering various vehicle systems described herein (e.g., aircraft systems). In some embodiments, the overall housing 230 may have dimensions of six inches by 2.5 inches by one inch, or other suitable dimensions, so it is suitably compact for many vehicles, especially vehicles for which space or weight is critical.

[0030] In some embodiments, the first circuit board 205 is positioned adjacent to (e.g., above) the second circuit board 210. The first circuit board 205 may carry data or computational components such as the central controller 110, the navigation module 115, the communications module 120, the sensor(s) 125, the control ports 130, the development port(s) 135, the expansion port(s) 140, or the status indicators 145. The first circuit board 205 may also include an expandable memory 235 (e.g., flash memory or another suitable memory) that can be removed, replaced, or augmented with additional memory to support functions of the central controller 110 or for an additional level of customization.

[0031] The cover 225 may include, carry, or support one or more connectors 240 for engaging wired connections with components outside of the system 200, such as connectors 240a, 240b, 240c for connecting the first circuit board 205 (specifically, the communications module 120, navigation module 115, and one or more sensors 125) with a radio antenna, GPS antenna, or a pitot tube, respectively. Further embodiments may include other connections or sensors. The control port(s) 130 may include or be connected to suitable interfaces for wired connections to components outside of the system 200, such as speed controllers for propulsion, servos for controlling the controlsurfaces, sensors for receiving, sensing, detecting, or otherwise determining data, etc., as described in additional detail above.

[0032] In some embodiments, the second circuit board 210 carries the plurality of power supplies 150 and the main power input 160. The main power input 160 may be operationally (electrically) connected to each of the power supplies 150 via the second circuit board 210 (e.g., via traces in the second circuit board 210). In some embodiments, the system 200 may include eight power supplies 150, or more or fewer power supplies, depending on power needs. The plurality of power supplies 150 advantageously facilities control and power of several components of the aircraft from the system 200, rather than from several discrete power supplies distributed around other portions of the aircraft, which would increase weight and space requirements for the aircraft. Accordingly, the system 200 may provide power for systems outside of the system 200 rather than only to the navigational, computational, or other components inside the system 200 (e.g., inside the housing 230). Carrying the several components and power supplies 150 in the single package 105 or in the housing 230 may also simplify aircraft design by centering weight of these components in a single location as opposed to forcing a designer to distribute the weight of these components throughout an airframe.

[0033] The second circuit board 210 may be referred to as a power distribution board because it may distribute power (via the system 200 and wiring connected to the system 200) to avionics sensors, wing lights, servos, speed controllers, payload hardware, and other components of the aircraft. The first circuit board 205 may be connected to the second circuit board 210 using power interconnects 245, which may include any connection suitable for transmitting power from the second circuit board 210 to the first circuit board 205. In Figure 2, power interconnects 245 on the first circuit board 205 are connectable to power interconnects 245 on the second circuit board 210.

[0034] A known challenge with power supplies is that they create an electromagnetic field (e.g., electromagnetic interference or “EMI”) that extends beyond their packaging and can affect nearby components unless the components are adequately shielded or positioned to avoid the electromagnetic field. Accordingly, conventional systems position power supplies away from a central computer or away from sensors to avoid interference.

[0035] In contrast, according to embodiments of the present technology, the first circuit board 205 is positioned as close as possible or as reasonable to the second circuit board 210 when the system 200 is assembled (e.g., when it is packed in the housing 230 formed by the base 220 and the cover 225). Such a close positioning, along with the design of the frame structure 215 and the circuit boards 205, 210, helps minimize electromagnetic interference (EMI) from the power supplies affecting components on the first circuit board 205.

[0036] As described in additional detail below, the frame structure 215 forms an EMI shield around the power supplies 150. For example, in some embodiments, the frame structure 215 may include a plurality of cells or pockets 250, which may be arranged as a grid 255, for receiving the power supplies 150 when the system 200 is assembled. The frame structure 215 facilitates assembling the system 200 with the first circuit board 205 positioned close to the second circuit board 210, while the grid 255 and the pockets 250 minimize the EMI and radio frequency (RF) interference that may reach components on the first circuit board 205. In some embodiments, the frame structure 215, or at least the grid 255 of pockets 250, may be formed of a metal material or another suitable conductive material to absorb or deflect the EMF.

[0037] The second circuit board 210 may include a power supply monitor interface 260 for receiving signals from the power supplies 150 and transmitting status information about the power supplies 150 to a controller or processor, such as the central controller 110 or another controller (e.g., via a wired or wireless controller).

[0038] Figure 3 illustrates a partially exploded view of the system 200. In Figure 3, the second circuit board 210 is positioned in a cavity of the base 220, the frame structure 215 is positioned over the second circuit board 210 (although it is not visible in this view in Figure 3), and the first circuit board 205 is positioned over the frame structure 215 and connected to the second circuit board 210 via the power interconnects 245. The cover 225 is positioned over the first circuit board 205 but shown separated from the remainder of the system 200 to allow visibility of several components for purposes of their description herein.

[0039] Figure 4A illustrates a side view of the frame structure 215 with the first circuit board 205 attached thereto. Figure 4B illustrates a top view of the frame structure 215 fixed to the second circuit board 210 (the first circuit board 205 is not visible in Figure 4B). Figure 4C illustrates a side cutaway view of a portion of the system 200, including the cover 225, the first circuit board 205, the frame structure 215, the second circuit board 210, and the base 220. With reference to Figures 4A, 4B, and 4C, the power supplies 150 (which may include inductors that generate a magnetic field) are distanced from the first circuit board 205. More specifically, the power supplies 150 are separated from the sensors 125, particularly the sensors 125 that rely on the Earth’s magnetic field for determining position, orientation, or direction, such as magnetometers. As seen in Figure 4C, in some embodiments, the power supplies 150 may be in individual cells or pockets250 of the frame structure 215.

[0040] To further minimize EMI and RF interference, one or both of the first circuit board 205 or the second circuit board 210 may include grounding layers and grounding vias that cooperate with the frame structure 215, as described in additional detail below with regard to Figures 5A, 5B, 6A, and 6B.

[0041] Figure 5A illustrates a schematic cross-sectional view of the first circuit board 205. Figure 5B illustrates a schematic cross-sectional infographic view of the first circuit board 205. With reference to Figures 5A and 5B, the first circuit board 205 may include a suitable number of signal or ground layers between or separated by dielectric layers, all beneath a top overlay 505a or top solder mask 505b. For example, the first circuit board 205 may have, in sequence from an upper portion of Figure 5A to a lower portion of Figure 5A, dielectric layers 505c, 505d, 505e, 505f, 505g, 505h, and 505i, or another suitable quantity or arrangement of dielectric layers, with corresponding signal or ground layers positioned between the dielectric layers.

[0042] A signal and ground layer 500 underneath the top overlay 505a or solder mask 505b may include both signal and ground paths (traces). The ground paths may be electrically connected to the cover 225 (which may include or be formed with metal, such as aluminum), to create a ground cavity to minimize EMI (e.g., by containing the electromagnetic field). One or more additional signal or ground layers may be positioned beneath the signal and ground layer 500, between or separated by the dielectric layers, for example, as follows: ground layer 510a, signal layer 510b, ground layer 510c, signal layer 51 Od, ground layer 51 Oe, signal layer 51 Of (which may also optionally include ground connections), and ground layer 510g. A through-via 515a may connect the layers 510a-g to each other. The layers 510a-g and the through-via 515a form additional EMI shielding for the sensors 125 on the top overlay 505a. A bottom solder mask 505j or a bottom overlay 505k may be positioned beneath the ground layer 510g.

[0043] The first circuit board 205 may further include blind vias 515b, 515c, 515d, 515e, 515f, and 515g for communicating signals between the signal layers. Signals in the blind vias 515b, 515c, 515d, 515e, 515f, and 515g may be further shielded by a bottom ground layer 510g (e.g., a metal / conductive layer). Figure 5B lists example thicknesses of the various layers shown in Figure 5A.

[0044] Figure 6A illustrates a schematic cross-sectional view of the second circuit board 210. Figure 6B illustrates a schematic cross-sectional infographic view of the second circuit board 210. With reference to Figures 6A and 6B, the second circuit board 210 may include a suitable number of signal or ground layers separated by dielectric layers, all beneath a top overlay 605a or top solder mask 605b. For example, the second circuit board 210 may have, in sequence from an upper portion of Figure 6A to a lower portion of Figure 6A, dielectric layers 605c, 605d, 605e, 605f, 605g, or another suitable quantity or arrangement of dielectric layers, with corresponding signal or ground layers positioned between the dielectric layers.

[0045] A signal and ground layer 600 underneath the top overlay 605a or solder mask 605b may include both signal and ground paths (traces). The ground paths may be electrically connected with the frame structure 215 to create a ground cavity to minimize EMI (e.g., by containing the electromagnetic field). One or more additional signal or ground layers may be positioned beneath the signal and ground layer 600, between or separated by the dielectric layers, for example, as follows: ground layer 610a, signal layer 610b, ground layer 610c, signal layer 61 Od, and ground layer 61 Oe. Through- vias 615a, 615b may connect layers 610a-e or 610a-d to each other, respectively. The layers 610a-e and the through-vias 615a, 615b form additional EMI shielding for the sensors 125 on the first circuit board 205. A bottom solder mask 605h or a bottom overlay 605i may be positioned beneath the ground layer 61 Oe.

[0046] In some embodiments, the second ground layer 610a is positioned directly under an inductor of the power supply 150 to further minimize EMF interference from the inductor to the second signal layer 610b. The cavities for the electromagnetic fields disclosed herein may be sized to contain or surround electromagnetic fields corresponding to the power or load through the various power supplies 150.

[0047] Figure 7 illustrates a schematic diagram of the system 200, according to further embodiments of the present technology. Several components described above are also shown and labeled in Figure 7. In some embodiments, the power supplies 150 are adjustable so that an end user can set the maximum voltage available from each individual power supply 150 to the corresponding component powered by the power supply 150, such as components on the first circuit board 205 or connected to the first circuit board 205. In a specific, non-limiting example for illustration only, one of the control ports 130 is shown as receiving 12.0 volts as well as communication from the central controller 110. Other example connections are shown in Figure 7. In general, the ports 130, 135, 140 may receive power from the power supplies 150 and signals from the central controller 110, or from other sources.

[0048] The central controller 110 is connected to each port or device powered by the power supplies 150 and to the power supplies 150 themselves (e.g., via the power supply monitor interface 260). Accordingly, the central controller 110 may also monitor function and health of the ports, devices, circuits, or power supplies within or connected to the system 200. The central controller 110 may also include an internal database for logs of operation of the system 200, such as logs of faults or anomalies.

[0049] Embodiments of the present technology can reduce costs and lead time for assembling a vehicle or UAV, at least because the system 200 can form a single unit thatcan be installed in any suitable vehicle or UAV, connected to the relevant servos, motors, sensors, etc., and programmed to operate for that specific UAV. A designer can design a UAV or other vehicle based on using the system 200 as a central component and implement it in the UAV or other vehicle without having to plan for separate power units that would increase complexity, size, or weight of the overall UAV or other vehicle. The system 200 can form an overall vehicle or UAV computer module that receives information from sensors, manages flight based on the information, and controls power to flight systems to carry out flight activities. In a representative example, embodiments of the present technology can reduce weight in a mid-size UAV by approximately 2 pounds, or by other values, due to the consolidated packaging and reduction in wiring.

[0050] The integrated, unitary nature of the system 200 is facilitated at least in part by the design elements that minimize or eliminate EMI reaching components on the first circuit board 205 from the power supplies 150 on the second circuit board 210 (e.g., by redirecting the EMF).

[0051] Specific details of several embodiments of the present technology are described herein with reference to aircraft. Aircraft that may implement the present technology may include unmanned aircraft such as UAVs or drones, powered aircraft such as aircraft with jet engines, turbofan engines, or propellers, unpowered aircraft such as gliders, or other suitable types of aircraft. Embodiments of the present technology can include, and / or be implemented in, other vehicles such as automobiles, boats, etc.

[0052] Several aspects of the present technology are set forth in the following examples. Embodiments of the present technology may include more or different features than those listed in the examples, they may omit one or more features from the examples, and / or features in some examples may be combined with features in otherexamples. The examples do not limit the scope of the embodiments of the present technology.1. An aerospace system comprising a flight management system, the flight management system comprising:(a) a first circuit board carrying (i) a central controller configured to control one or more aspects of an aircraft, (ii) a navigation module configured to receive or interpret signals from a global positioning system, (iii) a communications module configured to send or receive data for control of an aircraft or data representative of a status of an aircraft, and (iv) one or more sensors;(b) a second circuit board connected to the first circuit board, wherein the second circuit board carries a plurality of power supplies and a main power input connected to the plurality of power supplies, wherein the power supplies are connected or connectable to one or more components on the first circuit board; and(c) a frame structure positioned between the first circuit board and the second circuit board, wherein the frame structure comprises a plurality of pockets, each pocket positionable to receive a power supply of the plurality of power supplies.2. The aerospace system of example 1 , wherein the first circuit board further comprises: one or more control ports for receiving input or sending output of power or data into or out of the central controller;one or more development ports for programming or adjusting the flight management system; and one or more expansion ports for connecting with another flight management system.3. The aerospace system of example 2, further comprising the aircraft, wherein the aircraft comprises one or more sensors, servos, or motors connected to the flight management system via the one or more control ports and controllable by the central controller.4. The aerospace system of any of examples 1-3, further comprising a cover and a base, wherein the cover and the base together form a housing around at least the first circuit board and the second circuit board.5. The aerospace system of example 4, wherein the cover comprises one or more connectors configured to connect one or more components on the first circuit board or one or more components on the second circuit board to at least one of: an antenna, a pitot tube, a speed controller for propulsion, or a servo for a control surface.6. The aerospace system of any of examples 1-5, wherein at least one of the first circuit board or the second circuit board is a printed circuit board (PCB) having a plurality of layers including a plurality of grounding layers, a plurality of signal layers, and one or more vias extending through at least some of the plurality of grounding layers and the plurality of signal layers, wherein the grounding layers and the vias form one or more shields limiting an extent of EMF from the plurality of power supplies.7. The aerospace system of any of examples 1-6, wherein each sensor of the one or more sensors is configured to sense, detect, or determine one or more of: speed, altitude, or attitude.8. The aerospace system of any of examples 1 -7, wherein an electromagnetic field from the power supplies does not interfere with operation of components on the first circuit board.9. An aircraft comprising a flight management system, the flight management system comprising a housing configured to be supported in an aircraft, the flight management system comprising:(a) a first circuit board positioned in the housing, wherein the first circuit board carries (i) a central controller configured to control one or more aspects of an aircraft, (ii) a navigation module configured to receive or interpret signals from a global positioning system, (iii) a communications module configured to send or receive data for control of an aircraft or data representative of a status of an aircraft, and (iv) one or more sensors;(b) a second circuit board positioned in the housing, wherein the second circuit board carries a plurality of power supplies connected or connectable to one or more components on the first circuit board; and(c) a frame structure positioned in the housing between the first circuit board and the second circuit board, wherein the frame structure comprises a grid of cells, wherein each cell is positionable to receive a power supply of the plurality of power supplies.10. The aircraft of example 9, wherein the first circuit board further comprises:one or more control ports for receiving input or sending output of power or data into or out of the central controller; one or more development ports for programming or adjusting the flight management system; and one or more expansion ports for connecting with another flight management system.11 . The aircraft of example 9 or example 10, wherein the housing comprises a cover and a base, and wherein the cover comprises one or more connectors configured to connect one or more components on the first circuit board or one or more components on the second circuit board to at least one of: an antenna, a pitot tube, a speed controller for propulsion, or a servo for a control surface.12. The aircraft of any of examples 9-11 , wherein at least one of the first circuit board or the second circuit board is a printed circuit board (PCB) having a plurality of layers including a plurality of grounding layers, a plurality of signal layers, and one or more vias extending through at least some of the plurality of grounding layers and the plurality of signal layers, wherein the grounding layers and the vias form one or more shields limiting an extent of EMF from the plurality of power supplies.13. The aircraft of any of examples 9-12, wherein each sensor of the one or more sensors is configured to sense, detect, or determine one or more of: speed, altitude, or attitude.14. The aircraft of any of examples 9-13, wherein an electromagnetic field from the power supplies does not interfere with operation of components on the first circuit board.15. A vehicle control unit comprising:(a) a housing configured to be supported in a vehicle:(b) a first circuit board positioned in the housing, wherein the first circuit board carries (i) a central controller configured to control one or more aspects of the vehicle, (ii) a navigation module configured to receive or interpret signals from a global positioning system, (iii) a communications module configured to send or receive data for control of the vehicle or data representative of a status of the vehicle, and (iv) one or more sensors;(c) a second circuit board positioned in the housing, wherein the second circuit board carries a plurality of power supplies connected or connectable to one or more components on the first circuit board; and(d) one or more cells positioned between the first circuit board and the second circuit board, wherein each cell of the one or more cells is positionable to receive a power supply of the plurality of power supplies.16. The vehicle control unit of example 15, further comprising a frame structure positioned in the housing, wherein the frame structure comprises the one or more cells.17. The vehicle control unit of example 15 or example 16, wherein at least one of the first circuit board or the second circuit board is a printed circuit board (PCB) having a plurality of layers including a plurality of grounding layers, a plurality of signal layers, and one or more vias extending through at least some of the plurality of grounding layersand the plurality of signal layers, wherein the grounding layers and the vias form one or more shields limiting an extent of EMF from the plurality of power supplies.18. The vehicle control unit of any of examples 15-17, wherein the first circuit board further comprises: one or more control ports for receiving input or sending output of power or data into or out of the central controller; one or more development ports for programming or adjusting one or more components on the first circuit board; and one or more expansion ports for connecting with another vehicle control unit.19. The vehicle control unit of any of examples 15-18, wherein the housing comprises a cover and a base, and wherein the cover comprises one or more connectors configured to connect one or more components on the first circuit board or one or more components on the second circuit board to at least one of: an antenna or a speed controller for propulsion.20. The vehicle control unit of any of examples 15-19, wherein the vehicle is an aircraft.21. An aerospace system comprising a flight management system, the flight management system comprising: a first board carrying a central controller, a navigation module, a communications module, one or more sensors, one or more control ports for receiving input or sending output of power or data into or out of the central controller, one or more development ports for programming or adjusting the flightmanagement system, and one or more expansion ports for connecting with another flight management system; a second board positioned beneath the first board, the second board carrying a plurality of power supplies and a main power input connected to the plurality of power supplies, wherein the power supplies are connected or connectable to one or more components on the first board; and a frame structure positioned between the first board and the second board, wherein the frame structure comprises a plurality of pockets, each pocket positionable to receive a power supply of the plurality of power supplies.22. The system of example 21 , further comprising a cover and a base, wherein the cover and the base together a housing around at least the first board and the second board.23. The system of example 21 or example 22, wherein at least one of the first board or the second board is a printed circuit board (PCB) having a plurality of layers including a plurality of grounding layers, a plurality of signal layers, and one or more vias extending through at least some of the plurality of grounding layers and the plurality of signal layers, wherein the grounding layers and the vias form one or more shields limiting an extent of EMF from the plurality of power supplies.24. The system of any of examples 21-23, further comprising a vehicle such as an aircraft, wherein the vehicle comprises one or more sensors, servos, or motors connected to the flight management system via the one or more control ports and controllable by the central controller.25. The system of any of examples 21-24, wherein an electromagnetic field from the plurality of the power supplies does not interfere with components on the first board.26. A system, board, component, or device as disclosed herein.27. A method of operating a system, board, component, or device as disclosed herein.

[0053] From the foregoing, it will be appreciated that specific embodiments of the presently disclosed technology have been described herein for purposes of illustration, but that various modifications may be made without deviating from the scope of the technology. Although some figures and description herein may contain dimensions or quantities, such dimensions and quantities are non-limiting, and embodiments of the present technology may include other suitable dimensions or quantities.

[0054] Those skilled in the relevant art will appreciate that technology can be embodied in a special-purpose computer, controller, or data processor that is specifically programmed, configured, or constructed to perform one or more of the computerexecutable instructions or functions described herein. Accordingly, the terms “computer” and “controller,” as generally used herein, may refer to any suitable data processor, and can include memory or other suitable features for connecting with, or controlling, the various components disclosed herein.

[0055] Certain aspects of the technology described in the context of particular embodiments may be combined or eliminated in other embodiments. Further, while advantages associated with certain embodiments of the presently disclosed technology have been described in the context of those embodiments, other embodiments may also exhibit such advantages, and not all embodiments need necessarily exhibit suchadvantages to fall within the scope of the technology. Accordingly, the disclosure and associated technology can encompass other embodiments not expressly shown or described herein. To the extent any materials incorporated herein by reference conflict with the present disclosure, the present disclosure controls.

Claims

CLAIMSWhat is claimed is:

1. An aerospace system comprising a flight management system, the flight management system comprising:(a) a first circuit board carrying (i) a central controller configured to control one or more aspects of an aircraft, (ii) a navigation module configured to receive or interpret signals from a global positioning system, (iii) a communications module configured to send or receive data for control of an aircraft or data representative of a status of an aircraft, and (iv) one or more sensors;(b) a second circuit board connected to the first circuit board, wherein the second circuit board carries a plurality of power supplies and a main power input connected to the plurality of power supplies, wherein the power supplies are connected or connectable to one or more components on the first circuit board; and(c) a frame structure positioned between the first circuit board and the second circuit board, wherein the frame structure comprises a plurality of pockets, each pocket positionable to receive a power supply of the plurality of power supplies.

2. The aerospace system of claim 1 , wherein the first circuit board further comprises: one or more control ports for receiving input or sending output of power or data into or out of the central controller;one or more development ports for programming or adjusting the flight management system; and one or more expansion ports for connecting with another flight management system.

3. The aerospace system of claim 2, further comprising the aircraft, wherein the aircraft comprises one or more sensors, servos, or motors connected to the flight management system via the one or more control ports and controllable by the central controller.

4. The aerospace system of claim 1 , further comprising a cover and a base, wherein the cover and the base together form a housing around at least the first circuit board and the second circuit board.

5. The aerospace system of claim 4, wherein the cover comprises one or more connectors configured to connect one or more components on the first circuit board or one or more components on the second circuit board to at least one of: an antenna, a pitot tube, a speed controller for propulsion, or a servo for a control surface.

6. The aerospace system of claim 1 , wherein at least one of the first circuit board or the second circuit board is a printed circuit board (PCB) having a plurality of layers including a plurality of grounding layers, a plurality of signal layers, and one or more vias extending through at least some of the plurality of grounding layers and the plurality of signal layers, wherein the grounding layers and the vias form one or more shields limiting an extent of EMF from the plurality of power supplies.

7. The aerospace system of claim 1 , wherein each sensor of the one or more sensors is configured to sense, detect, or determine one or more of: speed, altitude, or attitude.

8. The aerospace system of claim 1 , wherein an electromagnetic field from the power supplies does not interfere with operation of components on the first circuit board.

9. An aircraft comprising a flight management system, the flight management system comprising a housing configured to be supported in an aircraft, the flight management system comprising:(a) a first circuit board positioned in the housing, wherein the first circuit board carries (i) a central controller configured to control one or more aspects of an aircraft, (ii) a navigation module configured to receive or interpret signals from a global positioning system, (iii) a communications module configured to send or receive data for control of an aircraft or data representative of a status of an aircraft, and (iv) one or more sensors;(b) a second circuit board positioned in the housing, wherein the second circuit board carries a plurality of power supplies connected or connectable to one or more components on the first circuit board; and(c) a frame structure positioned in the housing between the first circuit board and the second circuit board, wherein the frame structure comprises a grid of cells, wherein each cell is positionable to receive a power supply of the plurality of power supplies.

10. The aircraft of claim 9, wherein the first circuit board further comprises:one or more control ports for receiving input or sending output of power or data into or out of the central controller; one or more development ports for programming or adjusting the flight management system; and one or more expansion ports for connecting with another flight management system.11 . The aircraft of claim 9, wherein the housing comprises a cover and a base, and wherein the cover comprises one or more connectors configured to connect one or more components on the first circuit board or one or more components on the second circuit board to at least one of: an antenna, a pitot tube, a speed controller for propulsion, or a servo for a control surface.

12. The aircraft of claim 9, wherein at least one of the first circuit board or the second circuit board is a printed circuit board (PCB) having a plurality of layers including a plurality of grounding layers, a plurality of signal layers, and one or more vias extending through at least some of the plurality of grounding layers and the plurality of signal layers, wherein the grounding layers and the vias form one or more shields limiting an extent of EMF from the plurality of power supplies.

13. The aircraft of claim 9, wherein each sensor of the one or more sensors is configured to sense, detect, or determine one or more of: speed, altitude, or attitude.

14. The aircraft of claim 9, wherein an electromagnetic field from the power supplies does not interfere with operation of components on the first circuit board.

15. A vehicle control unit comprising:(a) a housing configured to be supported in a vehicle:(b) a first circuit board positioned in the housing, wherein the first circuit board carries (i) a central controller configured to control one or more aspects of the vehicle, (ii) a navigation module configured to receive or interpret signals from a global positioning system, (iii) a communications module configured to send or receive data for control of the vehicle or data representative of a status of the vehicle, and (iv) one or more sensors;(c) a second circuit board positioned in the housing, wherein the second circuit board carries a plurality of power supplies connected or connectable to one or more components on the first circuit board; and(d) one or more cells positioned between the first circuit board and the second circuit board, wherein each cell of the one or more cells is positionable to receive a power supply of the plurality of power supplies.

16. The vehicle control unit of claim 15, further comprising a frame structure positioned in the housing, wherein the frame structure comprises the one or more cells.

17. The vehicle control unit of claim 15, wherein at least one of the first circuit board or the second circuit board is a printed circuit board (PCB) having a plurality of layers including a plurality of grounding layers, a plurality of signal layers, and one or more vias extending through at least some of the plurality of grounding layers and the plurality of signal layers, wherein the grounding layers and the vias form one or more shields limiting an extent of EMF from the plurality of power supplies.

18. The vehicle control unit of claim 15, wherein the first circuit board further comprises: one or more control ports for receiving input or sending output of power or data into or out of the central controller; one or more development ports for programming or adjusting one or more components on the first circuit board; and one or more expansion ports for connecting with another vehicle control unit.

19. The vehicle control unit of claim 15, wherein the housing comprises a cover and a base, and wherein the cover comprises one or more connectors configured to connect one or more components on the first circuit board or one or more components on the second circuit board to at least one of: an antenna or a speed controller for propulsion.

20. The vehicle control unit of claim 15, wherein the vehicle is an aircraft.

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