Pad and house having same
The pad addresses the challenge of uniform temperature distribution and health monitoring by using a thermoelectric element and heat transfer sheet, ensuring efficient thermal performance and durability.
Patent Information
- Application Number
- PCT/KR2024/007212
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-12-04
AI Technical Summary
Existing pet pads lack the ability to efficiently monitor pet health, provide uniform temperature distribution, and enhance thermal performance while ensuring durability and reducing heat concentration.
A pad comprising a case with a thermoelectric element, a heat transfer sheet, and a plate that indirectly transfers heat through the sheet to provide uniform temperature distribution, includes a body temperature sensor at the center, and is designed to minimize direct heat transfer to the top plate.
The pad effectively senses pet body temperature, provides a comfortable temperature gradient, enhances thermal performance, and reduces rapid temperature changes, while maintaining durability and minimizing performance degradation of sensors.
Smart Images

Figure KR2024007212_04122025_PF_FP_ABST
Abstract
Description
Pads and houses with them
[0001] The present disclosure relates to a pad. More specifically, the present disclosure relates to a pad comprising a graphite sheet.
[0002] As the market for pets, such as dogs and cats, continues to grow, research and development into pet supplies and products is actively underway. As the perception of pets as family members grows, the pet industry is expected to continue growing, achieving even higher added value.
[0003] Recently, amidst the growth of the pet industry, pet health management has emerged as a promising future industry. A significant amount of research is being conducted to monitor the health of pets and prevent or diagnose diseases.
[0004] The present disclosure aims to solve the above-mentioned and other problems.
[0005] Another purpose may be to provide a home for your pet.
[0006] Another purpose could be to provide a pad that can detect the condition of the pet.
[0007] Another purpose may be to sense the pet's body temperature or weight, or to provide a pad that can provide a cool or warm feeling to the pet.
[0008] Another purpose may be to provide a structure that allows the pad to be assembled into or disassembled from the pet house.
[0009] Another purpose may be to provide a pad that forms a uniform temperature distribution over the heating surface.
[0010] Another purpose may be to provide a pad that forms a gentle temperature gradient.
[0011] Another purpose may be to provide a pad that indirectly heats or cools the top plate.
[0012] Another purpose may be to provide a pad with improved thermal performance.
[0013] Another purpose may be to provide pads with improved durability.
[0014] Another purpose may be to provide a pad that reduces the amount of heat applied to the battlefield components.
[0015] Another purpose may be to provide various examples of the decomposition structure of the pad.
[0016] According to one aspect of the present disclosure for achieving the above or other purposes, a pad includes: a case having an upper plate; a thermoelectric element disposed inside the case; a plate contacting the thermoelectric element and disposed below the upper plate; and a heat transfer sheet disposed between the plate and the upper plate, wherein an upper surface of the heat transfer sheet contacts the upper plate, and a lower surface of the heat transfer sheet can contact the plate.
[0017] The effects of the pad according to the present disclosure and the house equipped with the pad are described as follows.
[0018] According to at least one of the embodiments of the present disclosure, a house for a companion animal can be provided.
[0019] According to at least one of the embodiments of the present disclosure, a pad capable of detecting the condition of a companion animal can be provided.
[0020] According to at least one of the embodiments of the present disclosure, a pad can be provided that can sense the body temperature or weight of a pet or provide a cool or warm feeling to the pet.
[0021] According to at least one embodiment of the present disclosure, the amount of heat directly transferred from the heated or cooled plate to the top plate can be reduced due to a heat transfer sheet disposed between the plate receiving heat from the thermoelectric element and the top plate of the case. That is, the heat of the plate can be indirectly transferred to the top plate through the heat transfer sheet. This can reduce rapid temperature changes of the top plate.
[0022] According to at least one embodiment of the present disclosure, during the process of heat being transferred from the plate to the top plate via the heat transfer sheet, the time for the heat to spread in the width direction or transverse direction of the top plate can be increased. This can form a more uniform temperature distribution over the heat transfer area of the top plate.
[0023] According to at least one of the embodiments of the present disclosure, a heat transfer area with a more uniform temperature distribution can be provided due to a heat transfer sheet formed of a graphite material having a better thermal conductivity in the width direction or width direction than in the thickness direction.
[0024] According to at least one embodiment of the present disclosure, the top plate is aligned vertically with the thermoelectric element and has a recessed portion spaced upwardly from the heat transfer sheet, thereby minimizing the phenomenon of heat generated from the thermoelectric element being concentrated in a portion of the top plate. This allows for the provision of a pad that forms a uniform temperature distribution.
[0025] According to at least one of the embodiments of the present disclosure, the thermoelectric element can be arranged at the center of the lower surface of the plate to form a heat transfer area having a uniform temperature distribution in the horizontal direction.
[0026] According to at least one embodiment of the present disclosure, the body temperature sensor can be positioned at the center of the heating area due to the body temperature sensor being positioned adjacent to the thermoelectric element. This allows for easy detection of the body temperature of a pet attracted to the heating area. In other words, since the body temperature sensor is positioned at the center of the heating area, the likelihood of the pet being located on the body temperature sensor can be increased.
[0027] According to at least one embodiment of the present disclosure, the body temperature sensor is positioned so as to penetrate the plate and the heating sheet, thereby minimizing the influence of the heated plate or heating sheet on the body temperature sensor. This can reduce performance degradation of the body temperature sensor.
[0028] According to at least one embodiment of the present disclosure, a first region where a plate and a heat transfer sheet are arranged and a second region where a main substrate is arranged are partitioned, so that the influence of a heated plate or heat transfer sheet on the main substrate can be reduced. This can reduce performance degradation of the main substrate.
[0029] Further scope of the applicability of the present disclosure will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present disclosure will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present disclosure, are given by way of example only.
[0030] FIGS. 1 to 13 are drawings illustrating examples of pads and pet houses equipped therewith according to embodiments of the present disclosure.
[0031] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components are given the same reference numbers and redundant descriptions thereof will be omitted.
[0032] The suffixes "module" and "part" used for components in the following description are given or used interchangeably only for the convenience of writing specifications, and do not have distinct meanings or roles in themselves.
[0033] In addition, when describing the embodiments disclosed in this specification, if it is determined that a detailed description of a related known technology may obscure the gist of the embodiments disclosed in this specification, the detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of the present disclosure.
[0034] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.
[0035] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.
[0036] Singular expressions include plural expressions unless the context clearly indicates otherwise.
[0037] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.
[0038] The direction indications of up (U), down (D), left (Le), right (Ri), front (F), and back (R) shown in the drawings are only for convenience of explanation, and the technical ideas disclosed in this specification are not limited thereby.
[0039]
[0040] Referring to FIGS. 1 and 2, the interior space (1S) of the pet house (1) may be opened forward. A companion animal, such as a dog or a cat, may enter or exit the interior space (1S) through the opening (1P) of the pet house (1). The opening (1P) may be referred to as an entrance (1P), and the interior space (1S) may be referred to as a room (1S). The pet house (1) may be referred to as a companion animal house (1), a dog house (1), a cat house (1), a kennel (1), or a house (1). The pet house (1) may include a base (2) and a cover (3). The base (2) and the cover (3) may be collectively referred to as a housing (2, 3).
[0041] The base (2) may form the bottom of the pet house (1). The base (2) may have a square plate shape. Alternatively, the base (2) may have various shapes, such as a circular plate. The base (2) may be referred to as a bottom part (2), a lower part (2), or a floor (2).
[0042] The cover (3) can form the side and top of the pet house (1). The cover (3) can be an arched cover (3). Alternatively, the cover (3) can have an angled frame shape. The cover (3) can be positioned over the base (2). The cover (3) can cover the base (2). The cover (3) can be coupled to the base (2). The interior space (1S) of the pet house (1) can be formed between the base (2) and the cover (3). The housings (2, 3) can provide an interior space (1S) that is open toward the front. The cover (3) can include walls (3a, 3b) and a roof (3c). The first wall (3a) can form the left side of the cover (3) and can be coupled to the base (2) adjacent to the left side of the base (2). The second wall (3b) can form the right side of the cover (3) and can be joined to the base (2) adjacent to the right side of the base (2). The loop (3c) can connect the upper end of the first wall (3a) and the upper end of the second wall (3b) and can form the upper side of the cover (3). The walls (3a, 3b) and the loop (3c) can be separated from each other or formed as one body. The cover (3) can be called a top part (3), an upper part (3), or a roof (3).
[0043] The rear panel (7) can be attached to the rear end of the cover (3) and can cover the rear of the internal space (1S) of the housing (2, 3). The rear panel (7) can be detachably attached to the cover (3) or can be an integral part of the cover (3).
[0044]
[0045] Referring to FIGS. 3 and 4, a pad (pad, 9) will be described. The pad (9) may be referred to as a smart pad.
[0046] The pad (9) may be a square pad. Alternatively, the pad (9) may have various shapes such as a circle, an ellipse, or a polygon. The corners of the pad (9) may be rounded. The pad (9) may include two long sides (9La, 9Lb) that are opposite to each other and two short sides (9Sa, 9Sb) that are opposite to each other. The first long side (9La) may form a left side of the pad (9), and the second long side (9Lb) may form a right side of the pad (9). The first short side (9Sa) may form a front side of the pad (9), and the second short side (9Sb) may form a rear side of the pad (9).
[0047] The groove (2G) may be formed by recessing from the upper surface of the base (2) and may have a shape corresponding to the pad (9). The base (2) having the groove (2G) may have a tub shape. The groove (2G) may be referred to as a receiving groove (2G). The pad (9) may be positioned on the groove (2G) of the base (2).
[0048] A pin (2P) may be formed in a groove (2G). A protrusion (2Q) may protrude from the bottom of the groove (2G), and the pin (2P) may protrude from the top of the protrusion (2Q). An electronic component embedded in the base (2) may be electrically connected to the pin (2P). The pin (2P) may be a pogo pin.
[0049] A terminal (9P) may be formed at the bottom of the pad (9) and aligned with the pin (2P). The terminal (9P) may be adjacent to the second short side (9Sb). The recessed portion (9Q) may be recessed from the bottom of the pad (9), and the terminal (9P) may be formed in the recessed portion (9Q). An electronic component embedded in the pad (9) may be electrically connected to the terminal (9P).
[0050] When the pad (9) is inserted into the receiving groove (2G) of the base (2), the terminal (9P) of the pad (9) can be electrically connected by contacting the pin (2P) of the base (2). Alternatively, the terminal may be formed in the base (2) and the pin may be formed in the pad (9). The protrusion (2Q) may be inserted into the recess (9Q) and may guide the coupling of the base (2) and the pad (9).
[0051] Accordingly, the pad (9) can be electrically connected to the base (2). For example, the base (2) can be connected to an external power source via a power cable, and the base (2) can provide power and signals to the pad (9) via pins (2P) and terminals (9P).
[0052] The feet (9R) may be formed at the bottom of the pad (9). The feet (9R) may be adjacent to corners where the long sides (9La, 9Lb) and the short sides (9Sa, 9Sb) of the pad (9) meet. The feet (9R) may protrude downward from the bottom of the pad (9). Accordingly, when the pad (9) having the feet (9R) is placed on the ground, the bottom of the pad (9) may be spaced apart from the ground by a thickness of the feet (9R).
[0053] The recessed portions (2R) can be formed in the grooves (2G) and aligned with the feet (9R). When the pad (9) is inserted into the grooves (2G), the feet (9R) can be positioned on the recessed portions (2R).
[0054] The pad (9) can detect the weight of an object. The pad (9) can include a weight sensor (not shown) that detects the weight of the object. The weight sensor can be built into the pad (9). The weight sensor can detect the weight of the object on the pad (9). For example, the weight sensor can be mounted on the pad (9) adjacent to the corners of the pad (9). In another example, the weight sensor can be mounted on the pad adjacent to the center of the pad (9).
[0055] The pad (9) may include an intake port (143) through which air is drawn into the interior, and an outlet port (145) through which air inside the pad is discharged to the exterior. The intake port (143) may be formed on one surface of the pad (9), and the outlet port (145) may be formed on the other surface of the pad (9). For example, the intake port (143) may be formed on the lower surface of the pad (9), and the outlet port (145) may be formed on the side surface of the pad (9).
[0056] The base (2) may include a first communication hole (2X) connected to the suction port (143) of the pad (9). The first communication hole (2X) may be formed on the bottom surface of the base (2). The first communication hole (2X) may be formed in a groove (2G). For example, the first communication hole (2X) may be formed on the bottom surface of the groove (2G). The first communication hole (2X) may be communicated with the suction port (143) of the pad (9). For example, the suction port (143) of the pad (9) may be located above the first communication hole (2X) formed in the groove (2G). Through this, even when the pad (9) is mounted on the base (2), air may be introduced into the interior of the pad (9) through the first communication hole (2X) and the suction port (143).
[0057] The base (2) may include a second communication hole (2Y) connected to the discharge port (145) of the pad (9). The second communication hole (2Y) may be formed on a side surface of the base (2). The second communication hole (2Y) may be formed in a groove (2G). For example, the second communication hole (2Y) may be formed on a peripheral wall of the groove (2G). The second communication hole (2Y) may be in communication with the discharge port (145) of the pad (9). For example, the discharge port (145) of the pad (9) may be located next to the second communication hole (2Y) formed in the groove (2G). Through this, even when the pad (9) is mounted on the base (2), air inside the pad (9) may be discharged to the outside through the second communication hole (2Y) and the discharge port (145).
[0058]
[0059] Referring to FIG. 5, the base (2) may include a bottom case (2A) and a top case (2B). The bottom case (2A) may form the bottom of the base (2), and the top case (2B) may be coupled to the base (2) to form the top of the base (2). A groove (2G) may be formed in the top case (2B). Electronic components of the base (2) may be placed in an internal space (2S) of the base (2) formed between the bottom case (2A) and the top case (2B).
[0060] The pad (9) may include a bottom case (9A) and a top case (9B). The bottom case (9A) may form the bottom of the pad (9), and the top case (9B) may be coupled to the bottom case (9A) to form the top of the pad (9). Electronic components of the pad (9) may be placed in an internal space (9S) of the pad (9) formed between the bottom case (9A) and the top case (9B).
[0061] The depth (D2, see Fig. 3) of the groove (2G) can correspond to the thickness (t9, see Fig. 4) of the pad (9). The upper surface (9U) of the pad (9) inserted into the groove (2G) can be parallel to the upper surface (2U) of the base (2) or form a slight step. The lateral side of the pad (9) can be spaced apart from the side wall of the groove (2G) by a gap (G9). For example, the gap (G9) can be 2 mm or less. Accordingly, it is possible to prevent the pet's paw from falling between the pad (9) and the groove (2G). It may also be difficult to insert the user's finger between the pad (9) and the groove (2G).
[0062]
[0063] Referring to FIGS. 6 and 7, the schematic structure of the pad (9) is described.
[0064] The pad (9) may include a case (10) forming an outer shape. The case (10) may include an upper case (12) and a lower case (14). The upper case (12) may form a part of the case (10), and the lower case (14) may form the remaining part of the case (10). For example, the upper case (12) may form an upper part of the case (10), and the lower case (14) may form a lower part of the case (10).
[0065] The upper case (12) may include a top plate (121). The top plate (121) may include a surface positioned on the upper side of the upper case (12). The top plate (121) may refer to a portion including the upper surface of the upper case (12). The top plate (121) may include a flat upper surface. The companion animal may be positioned on the top plate (121).
[0066] The lower case (14) may include the bottom surface or the lower surface of the pad (9). The lower case (14) may be coupled to the upper case (12). The lower case (14) may be positioned under the upper case (12). For example, the lower case (14) may be coupled under the upper case (12), and the upper case (12) and the lower case (14) may be coupled to form the outer shape of the pad (9).
[0067] The pad (9) may include a first sensor (60) placed on the top plate (121). The first sensor (60) may detect the body temperature of the companion animal. The first sensor (60) may be located in the center of the top plate (121). The first sensor (60) may be located at the center of the top plate (121).
[0068] The pad (9) may include a plate (30) placed inside the case (10). The plate (30) may transfer heat to the case (10). The plate (30) may be formed of a material with high thermal conductivity. The plate (30) may be formed of a metal material. For example, the plate (30) may be formed of an aluminum material.
[0069] The pad (9) may include a main board (70) that controls the operation. The pad (9) may include a control unit that controls the operation of various components. The control unit may be mounted on the main board (70). The main board (70) may be placed inside the case (10). The main board (70) may be coupled to the lower case (14).
[0070] The main substrate (70) may be spaced apart from the plate (30). The main substrate (70) may be spaced apart from the plate (30) in the vertical direction. The main substrate (70) may be spaced apart from the plate (30) in the left-right direction. The main substrate (70) may be located on the lower side of the plate (30). For example, the main substrate (70) may be spaced apart from the plate (30) in the right direction and may be located lower than the plate (30).
[0071] The case (10) may include an internal space in which various components are built-in. The internal space may be formed between the lower case (14) and the upper case (12). The internal space may include a first region (100a) through which heat is transferred, and a second region (100b) which is the remaining space. The first region (100a) may be a space in which a plate (30) is placed. The first region (100a) may overlap with the plate (30) in a vertical direction. The second region (100b) may be a space in which a main substrate (70) is placed. The second region (100b) may overlap with the main substrate (70) in a vertical direction. For example, the internal space of the case (10) may include a first region (100a) located on the left side, and a second region (100b) located on the right side of the first region (100a).
[0072]
[0073] Referring to Fig. 8, the internal structure of the case (10) is described.
[0074] The pad (9) may include a fan module (40) coupled to the plate (30). The fan module (40) may cool a portion of the plate (30). The fan module (40) may be coupled to the lower side of the plate (30). The fan module (40) may be positioned between the plate (30) and the lower case (14). The fan module (40) may be coupled to the upper case (12).
[0075] The fan module (40) may include a fan (42) that forms an airflow. The fan (42) may form an airflow flowing inside the case (10). The fan (42) may be placed between an intake port (143) formed in the case (10) and the plate (30). The fan (42) may be aligned with the intake port (143) in a vertical direction. Through this, the fan (42) may form an airflow that flows into the interior of the case (10) through the intake port (143).
[0076] The fan module (40) may include a duct (44) forming a flow path. The duct (44) may guide airflow introduced by the fan (42) to an outlet (145). The outlet (145) may be formed on a side or peripheral surface of the case (10).
[0077] The duct (44) can be coupled to the fan (42). The duct (44) can be coupled to the upper case (12). The duct (44) can be positioned on the lower side of the upper case (12). The duct (44) can be coupled to the plate (30). The duct (44) can be positioned on the lower side of the plate (30).
[0078] A fan (42) may be coupled to a duct (44) coupled to the lower side of the plate (30). The fan (42) may be positioned on the upstream side of a flow path formed inside the duct (44). The duct (44) may have a wider width as it goes downstream of the flow path.
[0079] The pad (9) may include a first sensor substrate (62) connected to a first sensor (60). The first sensor substrate (62) may be coupled to the upper case (12). The first sensor substrate (62) may be coupled to the lower side of the upper case (12). The first sensor substrate (62) may be located on the lower side of the plate (30). The first sensor substrate (62) may be adjacent to the fan module (40).
[0080] The lower case (14) may be formed with an intake port (143) through which air is introduced. The intake port (143) may be formed on the bottom surface or lower surface of the lower case (14). The intake port (143) may be located below the plate (30). A fan (42) may be located between the intake port (143) and the plate (30). The fan (42) may introduce external air into the interior of the case (10) through the intake port (143).
[0081] The lower case (14) may include a support (146) arranged on the lower surface. The support (146) may support the lower case (14). The support (146) may include a plurality of supporters (146) arranged spaced apart from each other on the lower surface of the lower case (14). The supporters (146) may space the lower case (14) from the ground. Through this, air may flow to the intake (143) through the spaced apart space between the lower surface of the lower case (14) and the ground.
[0082]
[0083] Referring to Fig. 9, the components laminated inside the case (10) are described.
[0084] The plate (30) can be placed under the upper case (12). The plate (30) can be placed under the top plate (121). The plate (30) can be coupled to the upper case (12).
[0085] The pad (9) may include a thermoelectric module (20) that heats or cools the plate (30). The thermoelectric module (20) may include a thermoelectric element (22, see FIG. 12) that converts electrical energy and thermal energy into each other. For example, the thermoelectric element (22) may be a Peltier element (22) that converts electrical energy into thermal energy.
[0086] The pad (9) may include a heat transfer sheet (50) disposed between the plate (30) and the upper case (12). The heat transfer sheet (50) may be disposed between the upper plate (121) and the plate (30). For example, the heat transfer sheet (50), the upper plate (121), and the plate (30) may be aligned in the vertical direction. The heat transfer sheet (50) may space the upper plate (121) and the plate (30). Through this, the plate (30) may not directly contact the upper plate (121).
[0087] The heat transfer sheet (50) can be placed on the plate (30). The heat transfer sheet (50) can be adhered to the plate (30). For example, the heat transfer sheet (50) can be adhered to the upper surface of the plate (30). The heat transfer sheet (50) can cover the upper surface of the plate (30).
[0088] The heat transfer sheet (50) can be in contact with the upper case (12). The heat transfer sheet (50) can also be spaced apart from the upper case (12). The heat transfer sheet (50) can be in contact with the plate (30). The thermal energy of the plate (30) can be transferred to the upper plate (121) through the heat transfer sheet (50).
[0089] The first sensor (60) disposed on the upper plate (121) can be coupled to the upper case (12). The first sensor (60) can be coupled to the lower side of the upper case (12) and exposed to the upper plate (121).
[0090] The first sensor (60) can penetrate the plate (30). The first sensor (60) can penetrate the heat transfer sheet (50). The first sensor (60) can penetrate the plate (30) and the heat transfer sheet (50) in the thickness direction and be coupled to the upper case (12).
[0091] The plate (30) may include a plate hole (300) through which the first sensor (60) passes. The plate hole (300) may be located below the center of the upper plate (121). The plate hole (300) may be spaced apart from the center of the plate (30). The plate hole (300) may be spaced apart from the thermoelectric module (20). The plate hole (300) may be spaced apart from the center of the plate (30) to which the thermoelectric module (20) is coupled.
[0092] The heat transfer sheet (50) may include a sheet hole (500) through which the first sensor (60) passes. The sheet hole (500) may be located below the center of the top plate (121). The sheet hole (500) may be spaced apart from the center of the sheet. The sheet hole (500) may be located over the plate hole (300). The sheet hole (500) may be spaced apart from the thermoelectric module (20).
[0093] The first sensor (60) is coupled to the upper case (12) by penetrating the plate hole (300) and the sheet hole (500), and can be exposed to the top plate (121). The first sensor substrate (62) coupled to the lower side of the first sensor (60) can be located under the plate (30). The first sensor substrate (62) can be located under the plate hole (300).
[0094] The thermoelectric module (20) can be in contact with the plate (30). The thermoelectric element (22) can be in contact with the plate (30). One surface of the thermoelectric element (22) can be in contact with the plate (30). The other surface of the thermoelectric element (22) can be opposite to the one surface.
[0095] One side of the thermoelectric element (22) may be a high-temperature part that generates heat. Conversely, one side of the thermoelectric element (22) may be a low-temperature part that absorbs heat. One side of the thermoelectric element (22) may form a high temperature or a low temperature. When a high temperature is formed on one side of the thermoelectric element (22), the plate (30) may be heated. The heated plate (30) may heat the upper plate (121) through the heat transfer sheet (50). When a low temperature is formed on one side of the thermoelectric element (22), the plate (30) may be cooled. The cooled plate (30) may cool the upper plate (121) through the heat transfer sheet (50).
[0096] The other surface of the thermoelectric element (22) may be a low-temperature portion that absorbs heat. Conversely, the other surface of the thermoelectric element (22) may be a high-temperature portion that generates heat. For example, if a high-temperature portion is formed on one surface of the thermoelectric element (22), a low-temperature portion may be formed on the other surface of the thermoelectric element (22). Conversely, if a low-temperature portion is formed on one surface of the thermoelectric element (22), a high-temperature portion may be formed on the other surface of the thermoelectric element (22).
[0097] The other surface of the thermoelectric element (22) may not be in contact with the plate (30). The other surface of the thermoelectric element (22) may be spaced apart from the plate (30).
[0098] The thermoelectric module (20) may include a heat sink (24) that contacts the other surface of the thermoelectric element (22). The heat sink (24) may cool the other surface of the thermoelectric element (22). For example, when heat is generated on the other surface of the thermoelectric element (22), the heat sink (24) may absorb the heat generated on the other surface of the thermoelectric element (22). The fan (42) may cool the heat sink (24) that has absorbed the heat. An airflow that cools the heat sink (24) may be introduced through the intake port (143) and discharged through the outlet port (145).
[0099] The heat sink (24) can be aligned vertically with the thermoelectric element (22). The heat sink (24) can be placed below the thermoelectric element (22). The heat sink (24) can be placed inside the duct (44). The duct (44) can accommodate the heat sink (24). For example, the heat sink (24) can be placed in a duct passage (447) formed inside the duct (44).
[0100] The duct (44) may include a duct housing (444) forming a duct passage (447). The duct housing (444) may be coupled to the plate (30).
[0101] The duct (44) may include an inlet (445) through which air is introduced into the duct passage (447). The inlet (445) may be formed in the duct housing (444). The inlet (445) may be open to the duct housing (444) toward the fan (42). The fan (42) may be disposed in the inlet (445). The fan (42) may introduce air into the duct passage (447) through the inlet (445).
[0102] The duct housing (444) may include a bracket (442) to which a fan (42) is coupled. The bracket (442) may be coupled to a plate (30). The fan (42) may be coupled to the plate (30) via the bracket (442). The bracket (442) may be positioned between the fan (42) and the plate (30). The bracket (442) may extend from the inlet (445).
[0103] A fan (42) may be coupled to a duct housing (444). The fan (42) may form an airflow that flows through the duct passage (447). The fan (42) may form an airflow to cool or dehumidify the heat sink (24). For example, when the thermoelectric module (20) forms a high temperature on the upper plate (121), a low temperature may be formed on the other surface of the thermoelectric element (22). Condensation may be formed on the other surface of the thermoelectric element (22) where the low temperature is formed and on the heat sink (24) that contacts the other surface of the thermoelectric element (22). The fan (42) may supply an airflow to reduce the amount of condensation formed on the other surface of the thermoelectric element (22) or the heat sink (24). Conversely, when a low temperature is formed on the upper plate (121), a high temperature may be formed on the other surface of the thermoelectric element (22). Heat generated on the other side is transferred to the heat sink (24), and the fan (42) can supply airflow to cool the other side of the thermoelectric element (22) or the heat sink (24).
[0104]
[0105] Referring to FIGS. 10 and 11, the structure of the upper plate (121) will be described.
[0106] The upper case (12) may include a protruding rib (124) protruding downward from the upper plate (121). The protruding rib (124) may protrude downward from the lower surface of the upper case (12).
[0107] The protruding rib (124) can define a placement surface (125) on which the plate (30) is placed. The placement surface (125) can be located above the first region (100a). That is, the placement surface (125) and the first region (100a) can be aligned in the vertical direction. The placement surface (125) can be a part of the lower surface of the upper case (12).
[0108] The upper case (12) may include a recessed portion (122) positioned on the placement surface (125). The recessed portion (122) may be recessed from the lower surface of the upper case (12). The recessed portion (122) may be recessed upward from the lower surface of the upper case (12). For example, the recessed portion (122) may be recessed upward from the placement surface (125) of the upper case (12). The recessed portion (122) may be aligned with the thermoelectric element (22) in the vertical direction.
[0109] The thickness (d1) of the recessed portion (122) may be thinner than the thickness (d2) of the upper case (12). The thickness of the recessed portion (122) may be thinnest at the center. The thickness of the recessed portion (122) may become thicker as it goes toward the edge of the recessed portion (122).
[0110] The upper case (12) may include a sensor holder (126) to which the first sensor (60) is coupled. The sensor holder (126) may protrude from the upper case (12). The sensor holder (126) may be positioned on the placement surface (125). The sensor holder (126) may protrude from the placement surface (125). The sensor holder (126) may have a hollow space formed therein. The first sensor (60) may be placed inside the sensor holder (126).
[0111] The upper case (12) may include a sensor coupling portion (127) to which a first sensor (60) is coupled. The first sensor substrate (62) may be fastened to the sensor coupling portion (127). The sensor coupling portion (127) may protrude from the upper case (12). The sensor coupling portion (127) may be positioned on the placement surface (125). The sensor coupling portion (127) may be spaced apart from the sensor holder (126). The sensor coupling portion (127) may be a plurality of sensor coupling portions (127) arranged along the periphery of the sensor holder (126).
[0112]
[0113] Referring to FIGS. 12 and 13, the cross-sectional structure of the pad (9) is described.
[0114] The first sensor (60) may be arranged at the center of the upper plate (121). For example, the first sensor (60) may be located at the center of the upper plate (121). The thermoelectric element (22) may be spaced apart from the center of the upper plate (121). The thermoelectric element (22) may be spaced apart from the first sensor (60). The thermoelectric element (22) may be arranged at the center of the plate (30). The thermoelectric element (22) and the first sensor (60) may be arranged adjacent to each other. For example, the distance between the thermoelectric element (22) and the first sensor (60) may be shorter than the thickness (t9) of the pad (9).
[0115] The main substrate (70) may not overlap with the plate (30) in the vertical direction. The main substrate (70) may be spaced apart from the plate (30). For example, the main substrate (70) may be spaced apart from the plate (30) in the left-right direction. The main substrate (70) may be placed in the second region (100b), and the plate (30) may be placed in the first region (100a).
[0116] The thermoelectric module (20) may be placed under the plate (30). The fan module (40) may be placed under the plate (30). The duct housing (444) may accommodate the heat sink (24). The duct housing (444) may be coupled to the plate (30). The duct housing (444) may be coupled to the lower case (14).
[0117] The lower case (14) may include a duct holder (142) that supports a duct housing (444). The duct holder (142) may protrude from the lower case (14) toward the plate (30). For example, the duct holder (142) may protrude upward from the lower case (14).
[0118] A heat sink (24) may be in contact with a thermoelectric element (22). The heat sink (24) may include a hub panel (242) that is in contact with the thermoelectric element (22). The hub panel (242) may exchange heat with the other surface of the thermoelectric element (22). The heat sink (24) may include a plurality of heat transfer panels (244) extending from the hub panel (242). The plurality of heat transfer panels (244) may increase a heat transfer area of the sheet sink. The plurality of heat transfer panels (244) may extend in the thickness direction of the thermoelectric element (22). The plurality of heat transfer panels (244) may be arranged to be spaced apart from each other in the width direction or the width direction of the hub panel (242).
[0119] The recessed portion (122) may be positioned above the thermoelectric element (22). The recessed portion (122) may be positioned above the heat sink (24). The top plate (121) may be in contact with the heat transfer sheet (50). The recessed portion (122) may not be in contact with the heat transfer sheet (50). The recessed portion (122) may be spaced apart from the heat transfer sheet (50) in an upward direction. A separation space (123) may be formed between the recessed portion (122) and the heat transfer sheet (50). Through this, the phenomenon of heat generated in the thermoelectric element (22) directly moving upward can be reduced.
[0120]
[0121] Referring to FIGS. 1 to 13, the pad (9) includes: a case (10) having an upper plate (121); a thermoelectric element (22) disposed inside the case (10); a plate (30) contacting the thermoelectric element (22) and disposed below the upper plate (121); and a heat transfer sheet (50) disposed between the plate (30) and the upper plate (121), wherein an upper surface of the heat transfer sheet (50) contacts the upper plate (121), and a lower surface of the heat transfer sheet (50) can contact the plate (30).
[0122] The above-mentioned heat transfer sheet (50) can be formed of graphite material.
[0123] A part of the above top plate (121) may be spaced apart from the heat transfer sheet (50).
[0124] The gap between a portion of the upper plate (121) and the heat transfer sheet (50) can be aligned vertically with the thermoelectric element (22).
[0125] The above upper plate (121) includes a recessed portion (122) that is recessed upward from the lower surface, and the recessed portion (122) can be spaced upward from the plate (30).
[0126] The above thermoelectric element (22) can be placed at the center of the lower surface of the plate (30).
[0127] It may further include a first sensor (60) that is placed on the above top plate (121) and detects temperature.
[0128] The above first sensor (60) may be adjacent to the thermoelectric element (22).
[0129] The above first sensor (60) can penetrate the plate (30) and the heat transfer sheet (50).
[0130] The above plate (30) may include a plate hole (300) through which the first sensor (60) passes.
[0131] The above-mentioned heat transfer sheet (50) may include a sheet hole (500) through which the first sensor (60) passes.
[0132] The above sheet hole (500) may be located above the plate hole (300).
[0133] The above first sensor (60) can be placed at the center of the upper plate (121).
[0134] The above thermoelectric element (22) can be placed at the center of the plate (30).
[0135] The above upper plate (121) may include a protruding rib (124) that protrudes downward from the lower surface and defines a first area where the plate (30) and the heat transfer sheet (50) are arranged.
[0136] It may further include a main board (70) placed inside the case (10) and controlling the thermoelectric element (22).
[0137] The above upper plate (121) includes a second region, which is the remaining region excluding the first region, and the main substrate (70) can be placed below the second region.
[0138] The above pad (9) may further include: a heat sink (24) that contacts the thermoelectric element (22); a duct housing (444) that accommodates the heat sink (24) and is coupled to the plate (30); and a fan (42) that forms an airflow inside the duct housing (444).
[0139] The above case (10) may include: an intake port (143) formed on the lower surface; and an outlet port (145) formed on the side.
[0140]
[0141] Any or all of the embodiments of the present disclosure described above are not mutually exclusive or distinct. Any or all of the embodiments of the present disclosure described above may have their respective components or functions combined or used together.
[0142] For example, it means that a configuration A described in a particular embodiment and / or drawing can be combined with a configuration B described in another embodiment and / or drawing. That is, even if a combination between configurations is not directly described, it means that a combination is possible, except in cases where a combination is described as impossible.
[0143] The above detailed description should not be construed as limiting in any respect and should be considered illustrative only. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are intended to be included within the scope of the present invention.
Claims
1. Case with top plate; A thermoelectric element placed inside the case; a plate in contact with the thermoelectric element and positioned below the upper plate; and Including a heat transfer sheet disposed between the above plate and the above top plate, A pad in which the upper surface of the above-mentioned heat transfer sheet contacts the upper plate and the lower surface of the above-mentioned heat transfer sheet contacts the plate.
2. In paragraph 1, The above heat sheet, A pad made of graphite material.
3. In paragraph 1, Part of the above top plate, Separated from the above heat sheet, The gap between a portion of the above top plate and the above heat transfer sheet is A pad aligned vertically with the above thermoelectric element.
4. In paragraph 3, The above top plate: It includes a recessed portion that is recessed upward from the bottom, The above-mentioned depression is, A pad spaced upward from the above plate.
5. In paragraph 1, The above thermoelectric element, A pad placed at the center of the lower surface of the above plate.
6. In paragraph 1, further comprising a first sensor disposed on the top plate and detecting temperature, The above first sensor, A pad adjacent to the above thermoelectric element.
7. In paragraph 6, The above first sensor, A pad penetrating the above plate and the above heat transfer sheet.
8. In paragraph 7, The above plate: The first sensor includes a plate hole through which it penetrates, The above heat sheet: including a sheet hole through which the first sensor penetrates; The above seat hole is, A pad located above the above plate hole.
9. In paragraph 6, The above first sensor, It is placed in the center of the above top plate, The above thermoelectric element, A pad placed at the center of the above plate.
10. In paragraph 1, The above top plate: A pad including a protruding rib protruding downward from the bottom and defining a first area where the plate and the heat transfer sheet are arranged.
11. In paragraph 10, It further includes a main board arranged inside the case and controlling the thermoelectric element, The above top plate: Including the second area, which is the remaining area excluding the first area, The above main board is, A pad placed below the second area.
12. In paragraph 1, A heat sink in contact with the above thermoelectric element; a duct housing that accommodates the heat sink and is coupled to the plate; and A pad further comprising a fan for forming airflow inside the duct housing.
13. In paragraph 1, The above case is: A suction port formed on the lower surface; and A pad including a discharge port formed on the side.
Citation Information
Patent Citations
Cooler for pet
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