Lighting device and method for producing a lighting device

Abstract

A lighting device (10) comprises: a carrier (100), wherein a recess (105) is formed in a first main surface (101) of the carrier (100); an insert element (110) which is formed in the region of a first main surface (111) of the insert element (100) in correspondence with the recess (105); and a luminescent film (120) which comprises a light-permeable material (122) in which a plurality of light-emitting elements (121) are embedded, which luminescent film is arranged over the first main surface (111) of the insert element (110). The insert element (110) is arranged in the recess (105) such that the luminescent film (120) is arranged on a side facing away from the first main surface (101) of the carrier (100).

Description

[0001] LIGHTING DEVICE AND METHOD FOR MANUFACTURING A LIGHTING DEVICE

[0002] DESCRIPTION

[0003] Display or control elements, for example in automotive interiors, can be implemented using LEDs (light-emitting diodes), for instance by directly mounting the LEDs onto rigid circuit boards and appropriately arranging other optical elements. Generally, the search is on for concepts that can provide improved lighting devices.

[0004] The present invention is based on the objective of providing an improved lighting device and an improved method for manufacturing a lighting device.

[0005] According to the implementation forms, the problem is solved by the subject matter of the independent patent claims. Further developments are defined in the dependent patent claims.

[0006] According to the embodiments, a luminaire comprises a carrier, wherein a recess is formed in a first main surface of the carrier, an insert element shaped in the region of a first main surface of the insert element corresponding to the recess, and a luminescent film comprising a translucent material in which a plurality of light-emitting elements are embedded and arranged above the first main surface of the insert element. The insert element is arranged in the recess such that the luminescent film is located on a side facing away from the first main surface of the carrier. In the context of this disclosure, the term "translucent" means that the corresponding material may be, for example, completely or partially translucent, i.e., transparent (see-through), tinted, or translucent.

[0007] For example, an opening can be formed in a second main surface of the carrier in the area of ​​the recess.

[0008] The lighting device may also have a separating layer made of a material different from a material of the carrier on a side of the light-emitting film facing away from the insert element.

[0009] For example, there can be no air gap between the luminescent film and the separating layer.

[0010] According to the design specifications, the vertical distance between a second main surface of the substrate and a top surface of the luminescent film facing the second main surface is less than 100 pm.

[0011] For example, the remaining layer thickness of the carrier in the area of ​​the recess may be less than 1 mm.

[0012] For example, it is possible that there is no air gap between the luminescent film and the adjacent substrate in a direction perpendicular to the first main surface of the substrate.

[0013] The luminaire may further comprise a cover layer made of a material different from that of the substrate, positioned over the second main surface of the substrate. According to the design specifications, there is no air gap between the luminaire film and the adjacent cover layer.

[0014] For example, the recess can have a first part adjacent to the first main surface of the beam and a second part on a side of the first part facing away from the first main surface of the beam. The second part can have a smaller horizontal dimension than the first part, and the second part can be completely covered by the second part.

[0015] According to the execution forms, a horizontal dimension of the insert element in the area of ​​a second main surface of the insert element can be larger than a maximum horizontal dimension of the recess in the beam.

[0016] For example, the material of the insert element can match the material of the carrier.

[0017] According to the implementing regulations, a method for manufacturing a luminescent device comprises forming a recess in a first main surface of a carrier, forming an insert element in the area of ​​a first main surface of the insert element corresponding to the recess, applying a luminescent film comprising a translucent material in which a plurality of light-emitting elements with associated leads are embedded, over the first main surface of the insert element, and arranging the insert element in the recess such that the luminescent film is positioned on a side facing away from the first main surface of the carrier. The method may further comprise machining a second main surface of the carrier after forming the recess in the first main surface of the carrier.

[0018] According to the implementation forms, the method may further include the insertion of a dummy insert element, which is shaped in the area of ​​a first main surface of the dummy insert element according to the recess, into the recess.

[0019] Additionally, the process can include applying a top layer over a second main surface of the substrate.

[0020] For example, the top layer can be applied before or after the insertion of the insert element.

[0021] The accompanying drawings serve to illustrate exemplary embodiments of the invention. The drawings depict these embodiments and, together with the description, serve to explain them. Further exemplary embodiments and many of the intended advantages will become apparent from the detailed description below. The elements and structures shown in the drawings are not necessarily drawn to scale. Identical reference symbols refer to identical or corresponding elements and structures.

[0022] Figures 1A to ID are schematic cross-sectional views of lighting devices according to various designs.

[0023] Fig. 2 is a vertical cross-sectional view of a light-emitting film, which may be part of a lighting device.

[0024] Figures 3A to 3C illustrate a method for manufacturing a lighting device according to embodiments. Figures 4A and 4B illustrate a method according to further embodiments.

[0025] Fig. 5 summarizes a method according to implementation forms.

[0026] The following detailed description refers to the accompanying drawings, which form part of the disclosure and show specific embodiments for illustrative purposes. In this context, directional terminology such as "top," "bottom," "front," "back," "over," "on," "in front," "behind," "front," "back," etc., refers to the orientation of the figures just described. Since the components of the embodiments can be positioned in different orientations, the directional terminology serves only for explanation and is in no way restrictive.

[0027] The description of the exemplary embodiments is not limiting, as other exemplary embodiments exist and structural or logical modifications can be made without deviating from the scope defined by the patent claims. In particular, elements of the exemplary embodiments described below can be combined with elements of other described exemplary embodiments, unless otherwise indicated by the context.

[0028] The term "vertical," as used in this description, is intended to describe an orientation that is essentially perpendicular to the first surface of a substrate or semiconductor body. The vertical direction may, for example, correspond to a growth direction in the growth of layers. The terms "lateral" and "horizontal," as used in this description, are intended to describe an orientation or alignment that is essentially parallel to a first surface of a substrate or semiconductor body. This may, for example, be the surface of a support described herein.

[0029] The horizontal direction can, for example, lie in a plane perpendicular to a growth direction when layers are growing.

[0030] Fig. 1A shows a vertical cross-sectional view of a lighting device 10 according to embodiments. The lighting device 10 has a support 100. A recess 105 is formed in a first main surface 101 of the support. The lighting device further comprises an insert element 110, which is shaped in the region of a first main surface 111 of the insert element 110 corresponding to the recess 105. The lighting device 10 further comprises a light-emitting film 120, which comprises a translucent material 122 in which a plurality of light-emitting elements 121 are embedded. The light-emitting film 120 is arranged over the first main surface 111 of the insert element 110.

[0031] The insert element 110 is arranged in the recess 105 such that the luminescent film 120 is positioned on a side facing away from the first main surface of the carrier 100. For example, as illustrated in Fig. 1A, the luminescent film 120 can be arranged between the insert element 110 and the carrier 100. For example, a top surface 127 of the luminescent film can be directly adjacent to or adjacent to the carrier 100. The carrier 100 can be made of a suitable carrier material. For example, the carrier material can be a plastic, such as an opaque plastic or a substantially opaque plastic. According to further embodiments, the carrier material can also comprise a transparent or translucent material.According to further specifications, the substrate material can also include wood or a wood-based material, for example, particleboard, plastic, metal, or glass. According to further specifications, the substrate material can also be a composite material.

[0032] For example, the remaining layer thickness d of the substrate in the area of ​​the recess can be several hundred pm. For example, the remaining layer thickness of the substrate 100 in the area of ​​the recess 105 can be less than 1 mm. In general, the remaining layer thickness of the substrate 100 can be selected taking into account the transparency of the substrate material, the horizontal size of the recess, and the required mechanical stability of the lighting device 10.

[0033] As shown in Fig. 1A, the recess can have a first part 108 adjacent to the first main surface 101 of the beam 100 and a second part 109 on a side of the first part 108 facing away from the first main surface 101 of the beam 100. The second part 109 can have a smaller horizontal dimension than the first part 108. Furthermore, the second part 109 can be completely covered by the first part 108. In other words, in the vertical cross-sectional view, the second part 109 is completely within the first recess 108 and does not protrude laterally. As shown in Fig. 1A, the recess 105 can, for example, be stepped. The side walls of the recesses 108, 109, 105 can each run perpendicular to the first main surface 101 of the support 100. However, according to further embodiments, other angles of the side walls are also conceivable.A horizontal shape of the recess 105 can, for example, correspond to a desired shape of the resulting lighting device. For example, the horizontal shape can be square, round, oval, square with rounded corners, etc. According to further embodiments, the horizontal shape can also represent a symbol.

[0034] The insert element 110 is shaped in the area of ​​a first main surface 111 of the insert element 110 according to the recess. That is, a part of the insert element 110 corresponds to the inverted shape of the recess 105 or essentially corresponds to the inverted shape of the recess 105. For example, a horizontal dimension of the part of the insert element 110 can correspond approximately to the horizontal dimension of the recess 105. The horizontal direction here corresponds to a direction in the xy-plane. For example, a lateral dimension of the insert element 110 can be slightly smaller than the horizontal dimension of the recess. A deviation can be in the range of < 5%. According to further embodiments, a deviation can be in the range of up to a maximum of 1%.

[0035] According to the design specifications, the vertical dimension of the insert element can correspond to the vertical depth of the recess 105. As a result, a first main surface of the beam can be flush with the back of the insert element 110. According to further design specifications, the back of the insert element 110 can also project from the first main surface 101 of the beam 100. Furthermore, the angle of inclination of the side walls of the insert element 110 can substantially correspond to the angle of inclination of the side walls of the recess 105 or deviate from it by a maximum of 5°.

[0036] Details of the luminescent film 120, which is arranged above the first main surface 111 of the insert element 110, will be explained in more detail below with reference to Fig. 2.

[0037] For example, the insert element 110 can be positioned in the recess 105 such that there is no air gap between the translucent material 122 of the luminescent film 120 and the adjacent support 110 in the vertical direction, i.e., along the z-direction. The individual light-emitting elements 121 of the luminescent film 120 can, for example, be connected via electrical leads 124 to a control device 125 for controlling some or all of the light-emitting elements 121. The leads 124 can, for example, extend through the insert element 110 in any direction, such as vertically or horizontally.

[0038] The material of the insert element 110 can, for example, correspond to the material of the carrier 100. For example, the insert element 110 can be made of PMMA (polymethyl methacrylate), another plastic such as polycarbonate, another engineering polymer such as cyclo-olefin polymer, wood, metal, 3D-printed plastic, resin, or silicone.

[0039] The substrate material can, for example, have a thickness greater than 2 mm. For example, the thickness of the substrate 100 can be less than 4 mm. The insert element 110 can, for example, have a thickness greater than 1 mm measured vertically. For example, the thickness of the insert element 110 can be less than 3.5 mm or less than 3 mm. The thickness of the luminescent film can, for example, be greater than 0.5 µm. For example, the thickness of the luminescent film 120 can be less than 1 µm. For example, a suitable layer, optionally a separating material, such as a silicone layer or a layer of another material, can be arranged between the luminescent film 120 and the vertically adjacent substrate 100.

[0040] Fig. 1B shows a vertical cross-sectional view of a lighting device 10 according to further embodiments. Fig. 1B contains essentially similar or identical elements as described with reference to Fig. 1A. In contrast to the embodiments shown in Fig. 1A, an opening 107 is formed here in a second main surface 102 of the support 100 in the area of ​​the recess 105. More precisely, as shown in Fig. 1B, the recess 105 can extend to the second main surface 102, so that the opening 107 is directly adjacent to the recess 105. A lateral dimension of the opening 107 can correspond to a lateral dimension of the recess 105.

[0041] A cover layer 118 can be applied over the second main surface 102 of the carrier 100. The cover layer 118 can, for example, comprise a translucent material. According to further embodiments, the cover layer 118 can also be a decorative film, a sheet, a veneer, or another suitable covering, such as a lacquer. For example, according to embodiments shown in Fig. 1B, a thin layer, for example, a separating layer, can also be arranged between the luminescent film 120 and the cover layer 118. Optionally, as indicated by dashed lines in Fig. 1B, a shadow mask 128 can be arranged over or within the translucent material 122 of the luminescent film 120. The shadow mask can also be arranged in an intermediate plane or layer of the translucent material 122 of the luminescent film 120.For example, the shadow mask can have 128 sections of an opaque layer. As a result, structures can be rendered more sharply.

[0042] Fig. IC shows a schematic cross-sectional view of a lighting device 10 according to further embodiments. The lighting device 10 shown in Fig. IC comprises similar or identical components to the lighting device shown in Fig. 1A. Additionally, a cover layer 118, as described with reference to Fig. 1B, can also be arranged here. For example, the thickness of the cover layer can be several hundred µm. For example, the thickness of the cover layer 118 can be less than 1 mm. Unlike in Fig. 1B, here a remaining part of the carrier 100 is located between the cover layer 118 and a top surface 127 of the luminescent film 120. The remaining part of the carrier 100 can, for example, have a thickness of less than 1 mm, for example, several hundred µm.

[0043] Fig. ID shows a vertical cross-sectional view of a lighting device 10 according to further embodiments. In addition to elements shown with reference to Fig. 1B, an opening 107 is formed here in the second main surface 102 of the support 100, which has a larger horizontal dimension than the recess 105. For example, the opening 107 can project laterally opposite the recess 105. Furthermore, a separating layer 119 can be arranged in this opening 107. A material of the separating layer can be, for example, an oily film, a film of another separating material, for example, silicone, another transparent plastic such as polycarbonate, another engineering polymer such as cyclo-olefin polymer, glass, or a combination of several materials, for example, glass and silicone.For example, in a combination of glass and silicone, the silicone can face the light-emitting film 120 to prevent an air gap. This makes it possible to easily remove the insert element 110 from the light-emitting device 10, for example, to replace the light-emitting film 120. For example, the thickness of the separating layer 119 can be less than 1 µm, for example, less than 0.8 µm. According to other embodiments, the insert element 120 can, for example, be attached to the recess 105 by adhesive.

[0044] Depending on the embodiment, a shadow mask 128 can optionally be arranged in the area of ​​the separating layer 119. For example, the shadow mask 128 can be arranged adjacent to the top layer 118 or adjacent to the luminescent film 120. According to further embodiments, the separating layer 119 can be realized by the shadow mask 128.

[0045] Fig. 2 shows a vertical cross-sectional view of the light-emitting film 120. A multitude of light-emitting elements 121, which are, for example, LEDs or p-LEDs (i.e., LEDs with a lateral size in the range of 1 pm), are arranged over a base material 123. The individual light-emitting elements 121 can be controlled by conductive traces 124. For example, a network (mesh) or grid of thin wires, for example made of copper, can be provided through which the conductive traces 124 are realized. A translucent layer 122 can be arranged over and between the light-emitting elements 121.The material of the translucent layer 122 and also of the base material can be, for example, PET (polyethylene terephthalate) or another engineering plastic such as cyclo-olefin polymer or polyamide, printed circuit board materials such as FR4, ceramic, or a metal core. For example, the translucent material 122 can correspond to the base material 123. Accordingly, the individual light-emitting elements 121 are embedded and sealed by the translucent layer 122. For example, a surface of the light-emitting elements 121 is not exposed but is covered and sealed by the translucent material 122. The light-emitting film 120 is flexible.

[0046] A control device 125 can be configured to control the individual light-emitting elements 121 via the electrical supply lines 124. The control device 125 can be located outside the light-emitting film 120, for example, laterally or below the light-emitting film 120. The light-emitting film 120 can have a thickness of less than 1 / 2µm. As a result, it has a low profile. The light-emitting film 120 can also have optical layers, for example, a diffusing film (n), a filter layer (en), or lenses.

[0047] Furthermore, the insert element 110 with the applied luminescent film 120 can have a shadow mask, through which structures can be displayed even more sharply.

[0048] Figures 3A to 30 are cross-sectional views of a carrier 100 illustrating a method for manufacturing the lighting device 10 shown in Figures 1A to 1ID. According to the embodiments, the carrier can be manufactured by an injection molding process. For example, a recess 105 can first be formed in a first main surface 101 of the carrier 100, for example by any machining process, such as milling or another method. Furthermore, a removable dummy insert 115 can be provided in the recess for processing the carrier 100. Similar to the insert 110 with luminescent film 120 as described above, the dummy insert 115 can be shaped in the area of ​​a first main surface of the dummy insert according to the recess 105.Subsequently, a second main surface 102 of the carrier 100 can be machined, for example by grinding, milling, etching, or another process or thinning process to form an opening in the second main surface. Alternatively, a layer thickness of 100 to 1000 pm of the carrier 100 can remain above the recess 105.

[0049] Due to the presence of the dummy insert 115, the mechanical stability of the carrier 100 can be ensured during the processing steps. Compared to processes where the insert 110 is used with the luminescent film 120, damage to the luminescent film 120 during the processing steps is avoided. Subsequently, a top layer can be applied, for example, using 3D printing. The dummy insert 115 is then removed.

[0050] As shown in Fig. 3B, a light-emitting film 120 is formed over an insert element 110. For example, the insert element 110 can be made of PMMA (polymethyl methacrylate). For example, a portion of the insert element 110 can have a width or extent in a direction parallel to a main surface of the insert element 110, corresponding to a horizontal width t of the recess 105. Other portions of the insert element 110, for example, those that later protrude from the first main surface 101, can be wider. The insert element 110 with the light-emitting film 120 is then placed in the recess 105.

[0051] The result can be, for example, the lighting device 10 shown in Fig. 3C. For example, the insert element 110 can be fastened using fasteners 126, such as screws or similar elements. As shown in Fig. 3C, the support 100 does not have to be planar, but can be curved.

[0052] Figures 4A to 4B illustrate an alternative method starting with the carrier 100, which has been processed using the method described with reference to Figure 3A. However, unlike the method described with reference to Figure 3A, here the insert element 110 with the luminescent film 120 is first joined to the carrier 100, in which the recess 105 is formed. After joining, the top layer 118 is applied.

[0053] According to the embodiments shown in Figs. 4A and 4B, for example, an opening 107 can be formed in the second main surface 102 of the support 100 using the dummy insert element 115. When using the dummy insert element 115, the support 100 can, for example, be ground down in the area of ​​the second main surface 102 without any problems with stability.

[0054] As shown in Fig. 4B, after joining the insert element 110 with the luminescent film 120 and the carrier 100, the top layer 118 can be applied.

[0055] As described, it is possible to eliminate the air gap between the luminescent film 120 and the substrate or top layer. Accordingly, the light-emitting elements 121 can be positioned very close to the surface to be backlit. This allows the luminance to be increased. Because the individual light-emitting elements 121 are arranged within the luminescent film 120, it is possible to display any desired pattern or representation. In particular, using a luminescent film with a translucent base material, a flexible and, if necessary, translucent surface illumination with an effective distribution of light points can be provided.

[0056] Because the light-emitting elements 121 are positioned close to the surface of the lighting device 10, energy-efficient illumination with high accuracy can be provided. Due to its construction with an insert element 110, the lighting device 10 also exhibits increased mechanical strength in the area of ​​the recess 105.

[0057] The described method makes it possible to manufacture the lighting device 10 in a simple manner. A two-stage manufacturing process is used, in which, on the one hand, the recess 105 is formed, and on the other hand, the luminescent film 120 is applied over the insert element 110. Furthermore, the luminescent film can be easily replaced if necessary.

[0058] The lighting device 10 described here can be used, for example, as a display element, control element, for HMI (“Human Machine Interface”) or for interior or exterior lighting of vehicles (Automotive Interior / Exterior).

[0059] Fig. 5 summarizes a method according to implementation forms.

[0060] A method for manufacturing a luminous device comprises forming (S 100 ) a recess in a first main surface of a carrier, forming (S 110 ) an insert element in the region of a first main surface of the insert element corresponding to the recess, applying (S 120 ) a luminous film comprising a translucent material in which a plurality of light-emitting elements with associated leads are embedded, over the first main surface of the insert element, and arranging (S 130 ) the insert element in the recess such that the luminous film is arranged on a side facing away from the first main surface of the carrier.

[0061] The procedure may further include machining (S 105 ) a second main surface of the support after forming the recess in the first main surface of the support .

[0062] Although specific embodiments have been illustrated and described herein, those skilled in the art will recognize that the specific embodiments shown and described can be replaced by a multitude of alternative and / or equivalent embodiments without departing from the scope of protection of the invention. The application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, the invention is limited only by the claims and their equivalents.

[0063] REFERENCE MARK LIST

[0064] Light device

[0065] Carrier first main surface second main surface

[0066] recess

[0067] Opening, first part of the recess, second part of the recess, insert element, first main surface

[0068] Dummy insert element

[0069] Top layer

[0070] Separating layer

[0071] Luminous film, light-emitting element, translucent material, base material, electrical leads

[0072] Control device

[0073] Fastener

[0074] Top side of the luminescent film shadow mask

Claims

REQUIREMENTS 1. Lighting device (10) , comprising: a carrier (100) , wherein a recess (105) is formed in a first main surface (101) of the carrier (100), an insert element (110) which is shaped in the region of a first main surface (111) of the insert element (100) according to the recess (105), a luminescent film (120) comprising a translucent material (122) in which a plurality of light-emitting elements (121) are embedded, which is arranged above the first main surface (111) of the insert element (110), wherein the insert element (110) is arranged in the recess (105) such that the luminescent film (120) is arranged on a side facing away from the first main surface (101) of the carrier (100).

2. Lighting device (10) according to claim 1, wherein an opening (107) is formed in a second main surface (102) of the carrier (100) in the area of ​​the recess (105).

3. Lighting device (10) according to claim 2, further comprising a separating layer (119) made of a material different from a material of the carrier (100) on a side of the light-emitting film (120) facing away from the insert element (110).

4. Lighting device (10) according to claim 3, wherein there is no air gap between the luminous film (120) and the separating layer (119).

5. Lighting device (10) according to one of the preceding Claims, wherein a vertical distance between a second Main surface (102) of the support (100) and a top surface (127) of the luminescent film (120) , which forms the second main surface (102) is facing, is less than 100 pm.

6. Lighting device (10) according to claim 1, wherein a remaining layer thickness of the carrier (100) in the area of ​​the recess (105) is less than 1 mm.

7. Lighting device (10) according to claim 6, wherein between the luminous film (120) and the adjacent carrier (100) in a direction perpendicular to the first main surface (101) of the Carrier (100) has no air gap.

8. Lighting device (10) according to one of the preceding Claims, further comprising a cover layer (118) made of a material different from a material of the support (100) over the second main surface (102) of the support (100).

9. Lighting device (10) according to claim 8, wherein there is no air gap between the luminous film (120) and the adjacent cover layer (118).

10. Lighting device (10) according to one of the preceding claims, wherein the recess (105) forms a first part (108) adjacent to the first main surface (101) of the carrier (100) and a second part (109) on a side of the first part (108) facing away from the first main surface (101) of the support (100), wherein the second part (109) has a smaller horizontal dimension than the first part (108) and the second part (109) is completely covered by the second part (108).

11. Lighting device (10) according to one of the preceding Claims, wherein a horizontal dimension of the insert element- ments (110) in the area of ​​a second main surface of the insert element (110) is larger than a maximum horizontal dimension of the recess in the support (100).

12. Lighting device (10) according to one of the preceding claims, wherein a material of the insert element (110) corresponds to the material of the carrier (100).

13. Lighting device (10) according to one of the preceding claims, wherein the light-emitting elements (121) are designed as LEDs.

14. Method for manufacturing a lighting device, comprising forming (S100) a recess (105) in a first Main surface (101) of a support (100) , Forms (S110) of an insert element (110) in the area of ​​a first main surface (111) of the insert element (110) corresponding to the recess (105) , Applying (S120) a luminescent film (120) comprising a translucent material (122) in which a plurality of light-emitting elements (121) with associated leads are embedded, over the first main surface (111) of the insert element (110) , Arrange (S130) the insert element (110) in the recess (105) so that the luminescent film (120) is arranged on a side facing away from the first main surface (101) of the carrier (100).

15. Method according to claim 14, further comprising machining (S105) a second main surface (102) of the carrier (100) after forming the recess (105) in the first main surface (101) of the carrier (100).

16. Method according to claim 15, further comprising inserting a dummy insert element (115) which is shaped in the area of ​​a first main surface of the dummy insert element according to the recess (105) into the recess (105).

17. A method according to any one of claims 14 to 16, further comprising applying a cover layer (118) over a second main surface (102) of the carrier (100).

18. A method according to claim 17, wherein the cover layer (118) is applied before the insert element (110) is arranged in the recess (105).

19. Method according to claim 17, wherein the cover layer (118) is arranged in the recess after the insert element (110) has been placed. (105) is applied.

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