Light-emitting element and light-emitting device including same

Abstract

According to one aspect of the present invention, provided is a light-emitting element comprising: a light source that generates light; a package substrate that supports the light source; a package substrate cover layer that does not overlap a lower portion of the light source. Also, the package substrate cover layer has a package substrate-exposing region exposing a portion of the package substrate. When a first length is defined as the length of overlap between a first virtual line, extending in one direction from the center of the package substrate, and the other side of the package substrate cover layer, a second length is defined as the length of overlap between the first virtual line and one side of the package substrate cover layer, and a third length is defined as the length of overlap between the first virtual line of the package substrate and the package substrate-exposing region, the value obtained by dividing the third length by the sum of the first length and the second length is greater than 1 and less than 2.

Description

Light-emitting element and light-emitting device including the same

[0001] The present invention relates to a light-emitting element and a light-emitting device including the same.

[0002] Light-emitting diodes (LEDs) are increasingly being used. These diodes utilize the properties of compound semiconductors to convert electrical signals into light, such as infrared, visible light, and ultraviolet light. As the luminous efficiency of LEDs increases, they are being applied to a wide range of fields, including display devices, lighting equipment, and vehicles.

[0003] Light-emitting diodes (LEDs) generate light through the recombination of holes and electrons in a conductive semiconductor. However, the light generated from an LED can be reflected by surrounding objects, reducing its luminous efficiency. Therefore, there is a need to develop technologies that can improve luminous efficiency after light is generated in the LED.

[0004] Embodiments of the present invention aim to provide a light-emitting element having improved light efficiency by reducing light reflection and a light-emitting device including the same.

[0005] According to one aspect of the present invention, a light-emitting device may be provided, comprising: a light source that generates light; a package substrate that supports the light source; and a package substrate cover layer that is arranged so as not to overlap with a lower portion of the light source.

[0006] In addition, when the package substrate cover layer provides a package substrate exposure area exposing a part of the package substrate, and a first virtual line, which is an imaginary line extending in one direction from the center of the package substrate, is defined as a length by which the first length overlaps the other side of the package substrate cover layer, a second length is defined as a length by which the first virtual line overlaps one side of the package substrate cover layer, and a third length is defined as a length by which the first virtual line of the package substrate overlaps the package substrate exposure area, a light emitting element may be provided in which a value obtained by dividing the third length by the sum of the first length and the second length is greater than 1 and less than 2.

[0007] Additionally, the light source may be provided with a light-emitting element disposed in the exposed area of ​​the package substrate.

[0008] In addition, a light emitting element may be provided in which the thickness of the package substrate cover layer is the difference between the thickness of the molding layer and the distance from the top of the package substrate cover layer to the top of the molding layer.

[0009] In addition, the light source may include a light-transmitting substrate through which light is transmitted; and a conductive semiconductor layer through which light is formed, and a light-emitting element may be provided in which a thickness of the package substrate cover layer is smaller than a difference between a length in the thickness direction of the light-transmitting substrate and a length in the thickness direction of the conductive semiconductor layer.

[0010] In addition, a light emitting element may be provided that further includes a molding layer disposed on the upper side of the package substrate cover layer while surrounding the light source, and a value of the length of the package substrate in one direction divided by the distance from the bottom of the package substrate to the top of the molding layer is greater than 1.52 and less than 1.73.

[0011] In addition, a light emitting element may be provided that further includes a molding layer disposed on the upper side of the package substrate cover layer while surrounding the light source, and has a protrusion formed on the upper surface of the molding layer.

[0012] In addition, the light source may include a light-emitting substrate through which light is transmitted; and a conductive semiconductor layer through which light is formed, and a light-emitting element may be provided in which a value of a length in the thickness direction of the light-emitting substrate divided by a length in one direction of the light-emitting substrate is greater than 0.61 and less than 0.85.

[0013] In addition, the light source may further include a wavelength conversion layer that converts the wavelength of light emitted from the light-transmitting substrate, and a light-emitting element may be provided in which the wavelength conversion layer is laminated on an upper side than the light-transmitting substrate and has a thickness thinner than the light-transmitting substrate.

[0014] In addition, a light-emitting device may be provided, including a circuit board including a circuit board body, and a plurality of circuit electrodes supported by the circuit board body and formed to be electrically conductive; a plurality of light-emitting elements arranged on the circuit board to generate light; and a circuit board cover layer covering the circuit board body while exposing at least a portion of the plurality of circuit electrodes.

[0015] In addition, a light emitting device may be provided in which the distance between the light emitting elements is divided by the length of an imaginary line extending in one direction from the center of the package substrate and overlapping the other side of the package substrate cover layer, and is greater than 1.1 and less than 1.55.

[0016] Additionally, a light emitting device may be provided in which the edge of the circuit electrode is spaced apart from the edge of the circuit board cover layer.

[0017] In addition, a light emitting device may be provided in which a side surface of the circuit board cover layer includes a cover layer slope, a side surface of the circuit electrode includes an electrode body slope, and the cover layer slope and the electrode body slope are spaced apart from each other.

[0018] In addition, a light emitting device may be provided, which further includes a connector disposed between the circuit board and the package board to separate the circuit board and the package board, and the circuit board cover layer and the connector are disposed to be spaced apart in the horizontal direction.

[0019] In addition, a light emitting device may be provided in which a distance between the upper surface of the circuit board cover layer and the lower surface of the package board is greater than 25% and less than 50% of the length in the thickness direction of the package board body.

[0020] Additionally, a light emitting device may be provided in which the thickness of the circuit board cover layer is greater than 70% of the thickness of the package board cover layer and less than 130% of the thickness of the package board cover layer.

[0021] In addition, a light emitting device may be provided in which the circuit board includes a circuit electrode, the package board includes a substrate electrode, and the circuit electrode and the substrate electrode include at least one of C, N, O, Au, Ag, Sn, Ca, Ni, and Cu.

[0022] In addition, a light emitting device may be provided in which the circuit board cover layer and the package board cover layer include at least one of C, O, Si, S, and Ba.

[0023] In addition, a light-emitting device may be provided, including a circuit board; and a light-emitting element disposed on the circuit board to generate light, wherein the light-emitting element includes a light source that generates light; a package substrate that supports the light source; and a package substrate cover layer disposed so as to be spaced apart from a region directly below the light source.

[0024] In addition, a light emitting device may be provided in which the light emitting elements are provided in a plurality, and at least some of the light emitting elements have different height positions of the package substrate cover layer.

[0025] Embodiments of the present invention have the effect of improving light efficiency by reducing light reflection.

[0026] FIG. 1 is a top view of a light emitting device according to a first embodiment of the present invention.

[0027] FIG. 2 is a cross-sectional view taken along line AA' of a light emitting device according to the first embodiment of the present invention.

[0028] FIG. 3 is an enlarged view of a portion of the light emitting device according to the first embodiment of FIG. 2.

[0029] Figure 4 is a front view of a light source according to the first embodiment of the present invention.

[0030] Figure 5 is a front view of a light source according to a second embodiment of the present invention.

[0031] In the following description, for purposes of explanation, numerous specific details are set forth to provide a thorough understanding of various embodiments or implementations of the present disclosure. As used herein, the terms "embodiment" and "implementation" are interchangeable to refer to non-limiting examples of devices or methods that utilize one or more of the inventive concepts disclosed herein. However, it will be apparent that various embodiments may be practiced without utilizing these specific details or using one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, while the various embodiments may vary from one another, they are not necessarily exclusive. For example, specific features, configurations, and characteristics of an embodiment may be utilized or implemented in other embodiments without departing from the scope of the inventive concepts.

[0032] Unless otherwise specified, the illustrated embodiments should be understood to provide exemplary features of varying details of some ways in which the concepts of the present invention may be practically implemented. Therefore, unless otherwise specified, the features, components, modules, layers, membranes, panels, regions, and / or aspects (hereinafter, individually or collectively referred to as "elements") of the various embodiments may be differently combined, separated, interchanged, and / or rearranged without departing from the scope of the concepts of the present invention.

[0033] The use of cross-hatching and / or shading in the accompanying drawings is generally provided to clarify boundaries between adjacent elements. As such, the presence or absence of cross-hatching or shading, unless expressly stated, does not imply or indicate any preference or requirement for any particular material, material properties, dimensions, proportions, commonality between the illustrated elements, and / or any other features, properties, or characteristics of the elements. Furthermore, in the accompanying drawings, the dimensions and relative sizes of elements may be exaggerated for clarity and / or illustrative purposes. When embodiments are implemented differently, certain process sequences may be performed differently from the illustrated sequence. For example, two consecutively illustrated processes may be performed substantially simultaneously or in a reverse order from the illustrated sequence. Furthermore, like reference numerals designate like elements.

[0034] When an element, such as a layer, is referred to as being "on," "connected to," or "joined to" another element or layer, the element may be directly on, connected to, or joined to the other element or layer, or there may be intervening elements or layers present. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly joined to" another element or layer, there are no intervening elements or layers present. For this purpose, the term "connected" may refer to a physical, electrical, and / or fluid connection, with or without intervening elements. Furthermore, the DR1-axis, DR2-axis, and DR3-axis are not limited to the three axes of a Cartesian coordinate system, such as the x, y, and z-axes, and may be interpreted in a broader sense. For example, the DR1-axis, DR2-axis, and DR3-axis may be perpendicular to one another, or may represent different directions that are not perpendicular to one another. For purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items.

[0035] Although the terms "first," "second," and the like may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be referred to as the second element without departing from the teachings of the present disclosure.

[0036] Spatially relative terms such as "beneath," "beneath," "directly beneath," "lower," "above," "upper," "above," "higher than," "side" (as in, for example, a "side wall"), and the like may be used for descriptive purposes and thereby to describe the relationship of one element to other element(s) as depicted in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the drawings. For example, if the device in the drawings were turned over, an element described as "beneath" or "beneath" another element or feature would then be oriented "above" the other element or feature. Therefore, the exemplary term "beneath" can encompass both orientations above and below. Furthermore, the device can be oriented differently (e.g., rotated 90° or oriented in other orientations), and thus the spatially relative descriptors used herein can also be interpreted accordingly.

[0037] The terminology used herein is for the purpose of describing particular embodiments and is not limiting. The singular forms "a," "an," and "the" as used herein also include the plural forms unless the context clearly dictates otherwise. Furthermore, the terms "comprises," "comprising," "includes," and / or "comprising" as used herein specify the presence of stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Furthermore, the terms "substantially," "about," and other similar terms as used herein are used as terms of approximation rather than degrees, and as such, are used to describe inherent deviations from measured, calculated, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0038] Various embodiments are described below with reference to cross-sectional and / or exploded illustrations, which are schematic illustrations of idealized embodiments and / or intermediate structures. As such, variations from the shapes of the illustrated drawings may be expected, for example, as a result of manufacturing techniques and / or tolerances. Therefore, the embodiments disclosed herein should not necessarily be construed as limited to the shapes of specific illustrated regions, but should be construed to include, for example, deviations in shape resulting from manufacturing. In this way, the regions depicted in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of regions of the device, and as such, are not necessarily intended to have a limiting meaning.

[0039] As is conventional in the art, some embodiments may be illustrated and described in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will appreciate that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, wiring circuits, memory elements, and wiring connections formed using semiconductor-based or other manufacturing techniques. When the blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and optionally, may be driven by firmware and / or software. Furthermore, each block, unit, and / or module may be implemented by dedicated hardware, or by a combination of dedicated hardware for performing some functions and processors (e.g., one or more programmed processors and associated circuitry) for performing other functions. Additionally, the blocks, units, and / or modules of some embodiments may be physically separated into two or more interacting and individual blocks, units, and / or modules without departing from the scope of the present invention. Additionally, the blocks, units, and / or modules of some embodiments may be physically combined into more complex blocks, units, and / or modules without departing from the scope of the present invention.

[0040] Unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms defined in commonly used dictionaries, such as terms defined in commonly used dictionaries, should be interpreted to have a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealistic or overly formal sense unless explicitly defined herein.

[0041] Hereinafter, a light-emitting element (30) according to the first embodiment of the present invention and a light-emitting device (1) including the same will be described.

[0042] Referring to FIGS. 1 and 2, a light-emitting device (1) according to a first embodiment of the present invention can generate light and emit it to the outside. As an example, the light-emitting device (1) can be mounted on a display. The light-emitting device (1) can be controlled according to an external signal and thus can be driven in various ways. The light-emitting device (1) can include a circuit board (10), a connector (20), a light-emitting element (30), a circuit board cover layer (40), and a filler (50).

[0043] Referring further to FIG. 3, the circuit board (10) may support the light emitting element (30). As an example, the circuit board (10) may be a printed circuit board (PCB) on which an electric circuit is printed. In addition, the circuit board (10) may be a thin-film transistor (TFT) backplane. The circuit board (10) may include an alloy including one or more or some of Cu, Zn, Au, Ni, Al, Mg, Cd, Be, W, Mo, Si, Ag, and Fe having thermal conductivity, thereby increasing the conductivity of heat and electricity. However, this is merely an example, and the circuit board (10) may also include one or more of insulating materials such as FR1, CEM-1, FR-4, PMMA, PCT, and PPA, and short circuits between each circuit can be prevented through these insulating materials. Here, FR1 is a material in which copper foil and laminated paper are laminated, and CEM-1 is a material in which copper foil, glass fiber fabric, laminated paper, and glass fiber fabric are sequentially laminated. In addition, FR-4 is a material in which copper foil and glass fiber fabric or glass fiber fabric are laminated. In addition, the circuit board (10) may include ceramics such as alumina (Al2O3), aluminum nitride (AlN), and Zirconia Toughened Alumina (ZTA). This circuit board (10) may include a circuit board body (11) and a circuit electrode (12).

[0044] The circuit board body (11) can support a plurality of light-emitting elements (30). In other words, the light-emitting elements (30) can be arranged on the upper side of the circuit board body (11). The circuit board body (11) can be covered by a circuit board cover layer (40). The circuit board body (11) can extend in one direction. The one direction in the present specification can be, for example, the x-direction illustrated in the drawing. At least a portion of a metal layer electrically connected to a connector (20) through a circuit electrode (12) can be arranged inside the circuit board body (11). This metal layer can be arranged on the upper side of the circuit board body (11), and when the metal layer is arranged on the upper side of the circuit board body (11), the metal layer may not be exposed to the outside by the circuit board cover layer (40).

[0045] The circuit electrode (12) can be electrically connected to the connector (20). In other words, the circuit electrode (12) can be electrically connected to the light emitting element (30) through the connector (20). The edge of the circuit electrode (12) can be spaced apart from the edge of the circuit board cover layer (40). In other words, the circuit electrode (12) can be exposed to the outside without being covered by the circuit board cover layer (40). In addition, an electrode body slope (12a) can be formed at the edge of the circuit electrode (12). This electrode body slope (12a) can be arranged in a side region of a cover layer slope (40a) to be described later, or the electrode body slope (12a) and the cover layer slope (40a) can be spaced apart from each other. In other words, an imaginary line extending directly upward from the upper surface of the circuit electrode (12) may be spaced apart from the circuit board cover layer (40). The circuit electrode (12) may include one or more of C, N, O, Au, Ag, Sn, Ca, Ni, and Cu.

[0046] A connector (20) may be disposed between a circuit board (10) and a light emitting element (30) and may be electrically connected to a circuit electrode (12) and the light emitting element (30). The connector (20) may be disposed on the circuit board (10) so as to separate the package board (100) from the circuit board (10). A distance (e) between the upper surface of the circuit board cover layer (40) and the lower surface of the package board (100) may be greater than 25% and less than 50% of a length (d) in the thickness direction of the package board body (110). The thickness direction in the present specification may be a direction that is opposite to one direction and another direction to be described later, and may be, for example, the z direction illustrated in the drawing. Since the connector (20) separates the package board (100) from the circuit board (10), heat generated from the circuit board (10) may be more easily dissipated. The connector (20) can prevent thermal deformation caused by excessive heat load on the light-emitting element (30). In addition, the connector (20) can prevent peeling of the light-emitting element (30). The connector (20) may be made of a meltable metal or metal alloy.

[0047] The light-emitting element (30) can generate light. The light-emitting element (30) can be arranged above the circuit board (10). The light-emitting element (30) can be provided in multiple pieces. The multiple light-emitting elements (30) can have a distance between each other so that optical interference can be further reduced and resolution degradation and contrast reduction can be more effectively prevented. For example, the distance (k) between the multiple light-emitting elements (30) divided by the second length (b) at which an imaginary line (o-o') extending in one direction from the center of the package substrate (100) overlaps one side of the package substrate cover layer (300) can be greater than 1.1 and less than 1.55. In other words, k / b can be greater than 1.1 and less than 1.55.

[0048] In addition, at least some of the plurality of light-emitting elements (30) may have different vertical distances (lengths in the thickness direction) from the upper surface of the circuit board (10) to the upper surface of the package board cover layer (300). In other words, at least some of the plurality of light-emitting elements (30) may have different height positions of the package board cover layer (300), and further, the levels of the package board cover layer (300) may be different. Such light-emitting elements (30) may include a package board (100), a light source (200), a package board cover layer (300), and a molding layer (400).

[0049] The package substrate (100) can support multiple light sources (200). In the drawings and examples, the number of light sources (200) is described as multiple, but it is not limited thereto, and it is obvious that a single light source (200) can also be applied. The lower surface of the package substrate (100) can be spaced apart from the circuit substrate (10) by a connector (20). The package substrate (100) can transmit current, voltage, or electrical signal obtained from the circuit substrate (10) to the light source (200). The package substrate (100) can include a package substrate body (110) and a substrate electrode (120).

[0050] The package substrate body (110) can support the substrate electrode (120) and the light source (200). The package substrate body (110) can include an opening exposing the upper surface of the package substrate (100) to provide a package substrate exposure area (110a). In other words, the package substrate exposure area (110a) can be an area of ​​the package substrate body (110) that is exposed and not covered by the package substrate cover layer (300).

[0051] When the first length (a) is defined as the length by which an imaginary line (o-o', hereinafter referred to as the 'first imaginary line') extending in one direction from the center of the package substrate (100) overlaps the other side of the package substrate cover layer (300), the second length (b) is defined as the length by which the first imaginary line (o-o') overlaps one side of the package substrate cover layer (300), and the third length (c) is defined as the length by which the first imaginary line (o-o') overlaps the package substrate exposed area (110a), the package substrate (100) may have a ratio among the first length (a), the second length (b), and the third length (c) that further prevents excessive light absorption and further enhances contrast. In the present specification, one side may be, for example, the +x direction illustrated in the drawing. In addition, the other side in the present specification may be, for example, the -x direction illustrated in the drawing. In other words, the package substrate (100) may have a ratio between the first length (a), the second length (b), and the third length (c) that further improves contrast, allowing the user to perceive distinct contrast. For example, the value of the third length (c) divided by the sum of the first length (a) and the second length (b) may be greater than 1 and less than 2. In other words, c / (a+b) may be greater than 1 and less than 2.

[0052] In addition, the package substrate body (110) may have a separation distance (e) in the thickness direction to increase the heat capacity of the package substrate (100) so that the package substrate (100) effectively absorbs and disperses heat generated from the circuit substrate (10) and prevents deformation of the light-emitting element (30) due to heat generation. For example, the separation distance (e) between the upper surface of the circuit substrate cover layer (40) and the lower surface (20) of the package substrate (100) may be greater than 25% and less than 50% of the thickness (d) of the package substrate body (110). Therefore, it is possible to prevent the light-emitting element (30) from being deformed due to heat generation and detached from the circuit substrate (10).

[0053] The substrate electrode (120) can electrically connect the package substrate (100) and the light source (200). The substrate electrode (120) can transmit current between the package substrate (100) and the light source (200). The substrate electrode (120) can include a conductive material. The substrate electrode (120) can include one or more of C, N, O, Au, Ag, Sn, Ca, Ni, and Cu.

[0054] Referring further to FIGS. 4 and 5, the light source (200) may be supported on the package substrate (100) to generate light. In other words, the light source (200) may be disposed on the upper side of the package substrate (100). For example, the light source (200) may be disposed on the package substrate (100). In addition, the light source (100) may be disposed so that its lower portion does not overlap with the package substrate cover layer (300). The area directly below the light source (200) and the package substrate cover layer (300) may not overlap. In other words, the package substrate (100) in the area directly below the light source (200) may be exposed without being covered by the package substrate cover layer (300). The light source (200) may be provided in multiple units. Additionally, a plurality of light sources (200) may be arranged in the package substrate exposure area (110a). In another embodiment, the light source (200) may include a light-transmitting substrate (210), a conductive semiconductor layer (220), a light source electrode body (230), and a wavelength conversion layer (240).

[0055] The light-transmitting substrate (210) can transmit light. The light-transmitting substrate (210) can be formed of a material with high light transmittance. For example, the light-transmitting substrate (210) can be a sapphire substrate. The light-transmitting substrate (210) can have a length (m) in the thickness direction and a length (n) in one direction, which can stabilize the balance of the light source (200) and prevent light from leaking to the side of the light source (200). For example, the value obtained by dividing the length (m) in the thickness direction of the light-transmitting substrate (210) by the length (n) in one direction of the light-transmitting substrate (210) can be greater than 0.61 and less than 0.85. In other words, m / n can be greater than 0.61 and less than 0.85. Accordingly, when the light source (200) is tilted and bonded using the light source electrode body (230) described later, the light source electrode body (230) can be prevented from overflowing onto the upper surface of the light source (200).

[0056] Light can be generated from the conductive semiconductor layer (220). The conductive semiconductor layer (220) can receive current from the package substrate (100). The conductive semiconductor layer (220) can generate light by recombination of electrons and holes. The conductive semiconductor layer (220) can be a semiconductor layer.

[0057] As an example, the conductive semiconductor layer (220) may be formed in a single-layer or multi-layer structure. When the conductive semiconductor layer (220) has a multi-layer structure, the conductive semiconductor layer (220) may include a substrate, a first conductive semiconductor layer, a light-emitting layer, and a second conductive semiconductor layer.

[0058] The substrate can support at least one of the first conductive semiconductor layer, the light-emitting layer, and the second conductive semiconductor layer. The substrate can be arranged on the lowermost or uppermost side of the conductive semiconductor layer (200). For example, the substrate can be one of an insulating substrate, a sapphire substrate, a GaN substrate, a SiC substrate, and a Si substrate. In addition, various types of substrates (100) can be applied to the conductive semiconductor layer (220).

[0059] The first conductive semiconductor layer can be N-type or P-type. For example, the first conductive semiconductor layer can have electrons as the main charge carrier. In addition, the first conductive semiconductor layer can inject electrons into the light-emitting layer. For another example, the first conductive semiconductor layer can have holes as the main charge carrier. In addition, the first conductive semiconductor layer can inject holes into the light-emitting layer. The first conductive semiconductor layer can be disposed on the upper portion of the substrate. For example, the first conductive semiconductor layer (200) can be laminated on the substrate (100). Meanwhile, the expressions of upper and lower in this specification are described based on the drawings, and it is to be noted in advance that the expressions may be different if the direction of the corresponding object is changed.

[0060] The light-emitting layer can generate light to be emitted to the outside. The light-emitting layer can be disposed between the first conductive semiconductor layer and the second conductive semiconductor layer. At least one of electrons and holes emitted from either the first conductive semiconductor layer or the second conductive semiconductor layer can flow into the light-emitting layer. In the light-emitting layer, electrons and holes can recombine to emit light. In other words, light formed in the light-emitting layer can be emitted to the outside. The light-emitting layer can generate any one of visible light wavelengths, ultraviolet wavelengths, and infrared wavelengths.

[0061] The second conductive semiconductor layer may be N-type or P-type and may include various materials. For example, the second conductive semiconductor layer may have holes as the main charge carrier. Furthermore, the second conductive semiconductor layer may inject holes into the light-emitting layer. For another example, the second conductive semiconductor layer may have electrons as the main charge carrier. Furthermore, the second conductive semiconductor layer may inject electrons into the light-emitting layer. The second conductive semiconductor layer may be stacked on top of the light-emitting layer. For example, the second conductive semiconductor layer may be stacked on the light-emitting layer.

[0062] As an example, the conductive semiconductor layer (220) may be a UV-emitting semiconductor layer. This conductive semiconductor layer (220) may be positioned below the light-transmitting substrate (210). The thickness of this conductive semiconductor layer (220) may not be constant. For example, the conductive semiconductor layer (220) may have a non-uniform thickness, and one side of the conductive semiconductor layer (220) may be thicker than the other side of the conductive semiconductor layer (220).

[0063] The light source electrode body (230) can electrically connect the light source (200) and the package substrate (100). In other words, the light source electrode body (230) can transmit the current received from the package substrate (100) to the conductive semiconductor layer (220) through the light source electrode body (230). The light source electrode body (230) can be formed of a material that conducts electricity well.

[0064] The wavelength conversion layer (240) can convert the wavelength of light emitted from the light-transmitting substrate (210). As an example, the wavelength conversion layer (240) can convert the wavelength of light emitted from the light-transmitting substrate (210) into red (R), green (G), and blue (B) wavelengths to convert the color of light. The wavelength conversion layer (240) can be arranged above the light-transmitting substrate (210). In addition, the wavelength conversion layer (240) can have a thinner thickness than the light-transmitting substrate (210).

[0065] The package substrate cover layer (300) can absorb light generated by the package substrate (100). The package substrate cover layer (300) can be arranged so as not to overlap with the directly lower region of the plurality of light sources (200). For example, the plurality of light sources (200) can be arranged above the package substrate exposed region (110a), and the package substrate cover layer (300) can surround the periphery of the package substrate exposed region (110a). The package substrate cover layer (300) can cover at least a portion of the region of the package substrate body (110) excluding the package substrate exposed region (110a) so that the interior of the package substrate (100) is not exposed to the outside. The package substrate cover layer (300) can be black. The package substrate cover layer (300) can include one or more of C, O, Si, S, and Ba.

[0066] The thickness (l) of the package substrate cover layer (300) may be the difference between the thickness (g) of the light-emitting device molding layer (400) and the distance (f) from the uppermost side of the package substrate cover layer (300) to the uppermost side of the light-emitting device molding layer (500). In addition, the thickness (l) of the package substrate cover layer (300) may be smaller than the difference between the length (m) of the light-transmitting substrate (210) in the thickness direction and the length (h) of the conductive semiconductor layer (220) in the thickness direction. The outer surface of the package substrate cover layer (300) may be exposed to the outside between the molding layer (400) and the package substrate body (110). Therefore, the package substrate cover layer (300) may have a thickness that prevents the package substrate cover layer (300) from becoming too thick and causing excessive light absorption, and prevents the package substrate cover layer (300) from becoming too thin and exposing the inside.

[0067] In addition, the upper surface of the package substrate cover layer (300) may be arranged higher than the lower surface of the conductive semiconductor layer (220). In other words, the vertical distance from the upper surface of the package substrate body (110) to the upper surface of the package substrate cover layer (300) may be greater than the vertical distance from the upper surface of the package substrate body (110) to the lower surface of the conductive semiconductor layer (220). Furthermore, the upper surface of the package substrate cover layer (300) may be arranged lower than the upper surface of the light-transmitting substrate (210). Therefore, the side surface of the conductive semiconductor layer (220) may be arranged to face the side surface of the package substrate cover layer (300), thereby preventing excessive light dispersion.

[0068] The molding layer (400) may be disposed on the upper side of the package substrate cover layer (300) while surrounding the light source (200). The molding layer (400) may extend upward from the upper surface of the package substrate (100) and surround the light source (200) and the package substrate cover layer (300). In addition, the molding layer (400) may prevent the light source (200) and the package substrate cover layer (300) from being separated from the package substrate (100). Unevenness may be formed on the upper surface of the molding layer (400).

[0069] In addition, the molding layer (400) may have a distance (j) from the bottom of the package substrate (100) to the top of the molding layer (400) to prevent the light emitting elements (30) from tilting, to make the upper surfaces of the plurality of light emitting elements (30) flat, and to maintain the balance of the light emitting elements (30). For example, the molding layer (400) may be arranged at a position where the value of the length (i) of the package substrate (100) in one direction divided by the distance (j) from the bottom of the package substrate (100) to the top of the molding layer (400) is greater than 1.52 and less than 1.73. The length (i) of the package substrate (100) in one direction may be the longer side among the lengths of the package substrate (100) in one direction and the other direction. The other direction in the present specification may be a direction that is opposite to the one direction, and may be, for example, the y direction illustrated in the drawing.

[0070] The circuit board cover layer (40) can cover the circuit board body (11). The circuit board cover layer (40) can expose at least a portion of the circuit electrode (12). For example, the circuit board cover layer (40) can cover at least a portion of an area of ​​the circuit board body (11) excluding an area where the circuit electrode (12) is arranged, so that the interior of the circuit board (10) is not exposed to the outside. As a more detailed example, the circuit board cover layer (40) can expose at least a portion of the circuit electrode (12). The circuit board cover layer (40) can be black. As an example, when the light-emitting device (1) is installed in a display, when the current to the light-emitting element (30) is cut off, the light-emitting device (1) can appear black.

[0071] A cover layer slope (40a) may be formed at the edge of the circuit board cover layer (40). An electrode body slope (12a) may be arranged on the side of the cover layer slope (40a). The cover layer slope (40a) and the electrode body slope (12a) may be spaced apart from each other. In other words, the cover layer slope (40a) formed at the edge of the circuit board cover layer (40) may be inclined to form a reverse slope. In addition, the circuit board cover layer (40) and the connector (20) may be arranged to be spaced apart from each other in the horizontal direction. In other words, the circuit board cover layer (40) may be formed so that even if a liquid or filler (50) overflows during the process of connecting the connector (20), the connector (20) spreads downward of the cover layer slope (40a) and prevents it from going over the circuit board cover layer (40). The circuit board cover layer (40) may include one or more of C, O, Si, S, and Ba.

[0072] A filler (50) may be disposed between the connector (20) and the circuit board cover layer (40). One side of the filler (50) may be in contact with the side of the connector (20), and the other side of the filler (50) may be in contact with the side of the circuit board cover layer (40). At least a portion of one side of the filler (50) may be formed into a curved surface. Materials having different thermal expansion coefficients or thermal reactivity are physically connected to each other on the upper surface of the circuit board body (11), thereby effectively preventing peeling. When viewed in cross-section, the filler (50) may be in contact with at least a portion of the upper peripheral surface and at least a portion of the lower peripheral surface of the connector (20). For example, the filler (50) may be in contact with both lower sides and both upper sides of the connector (20). Therefore, the electrical and physical coupling between the light-emitting element (30) and the circuit board (10) can be increased by the connector (20).

[0073] The circuit board cover layer (40) may have a thickness (p) that can prevent a difference in contrast in the light-emitting device (1). In other words, the circuit board cover layer (40) can prevent a difference in contrast in the circuit board cover layer (40) and in the package board cover layer (300). For example, the thickness (p) of the circuit board cover layer (40) may be greater than 70% of the thickness (l) of the package board cover layer (300) and less than 130% of the thickness (l) of the package board cover layer (300).

[0074] Hereinafter, the operation and effect of a light emitting device (1) according to one embodiment of the present invention will be described.

[0075] The light emitting device (1) can supply current to the circuit board (10) and supply current to the light emitting element (30) through the connector (20). The light emitting device (1) can emit some of the light generated from the light source (200) to the outside, and the other part can be absorbed by the package board cover layer (300) and the circuit board cover layer (40) to reduce optical interference.

[0076] Although the embodiments of the present invention have been described as specific embodiments, these are merely examples, and the present invention is not limited thereto, but should be construed to have the broadest scope in accordance with the technical concepts disclosed in this specification. Those skilled in the art may combine / substitute the disclosed embodiments to implement patterns of shapes not specified, but this also does not depart from the scope of the present invention. In addition, those skilled in the art may easily modify or alter the disclosed embodiments based on this specification, and it is clear that such modifications or alterations also fall within the scope of the present invention.

Claims

1. A light source that generates light; A package substrate supporting the above light source; and Including a package substrate cover layer arranged so as not to overlap with the lower portion of the light source, Light-emitting element.

2. In paragraph 1, The above package substrate cover layer provides a package substrate exposure area that exposes a portion of the package substrate, When the first virtual line, which is an imaginary line extending in one direction from the center of the package substrate, is defined as a length that overlaps the other side of the package substrate cover layer, the second length is defined as a length that overlaps the first virtual line with one side of the package substrate cover layer, and the third length is defined as a length that overlaps the first virtual line of the package substrate with the exposed area of ​​the package substrate, The value obtained by dividing the third length by the sum of the first length and the second length is greater than 1 and less than 2. Light-emitting element.

3. In paragraph 2, The above light source is placed in the exposed area of ​​the package substrate, Light-emitting element.

4. In paragraph 1, The thickness of the package substrate cover layer is the difference between the thickness of the molding layer and the distance from the top of the package substrate cover layer to the top of the molding layer. Light-emitting element.

5. In paragraph 1, The above light source is, A light-transmitting substrate through which light is transmitted; and Contains a conductive semiconductor layer in which light is formed, The thickness of the package substrate cover layer is smaller than the difference between the length in the thickness direction of the light-transmitting substrate and the length in the thickness direction of the conductive semiconductor layer. Light-emitting element.

6. In paragraph 1, It further includes a molding layer disposed on the upper side of the package substrate cover layer while surrounding the light source, The value of the length of the package substrate in one direction divided by the distance from the bottom of the package substrate to the top of the molding layer is greater than 1.52 and less than 1.

73. Light-emitting element.

7. In paragraph 1, It further includes a molding layer disposed on the upper side of the package substrate cover layer while surrounding the light source, The upper surface of the above molding layer has unevenness formed, Light-emitting element.

8. In paragraph 1, The above light source is, A light-transmitting substrate through which light is transmitted; and Contains a conductive semiconductor layer in which light is formed, The value of the length in the thickness direction of the light-transmitting substrate divided by the length in one direction of the light-transmitting substrate is greater than 0.61 and less than 0.

85. Light-emitting element.

9. In paragraph 8, The above light source is, It further includes a wavelength conversion layer that converts the wavelength of light emitted from the above-mentioned light-transmitting substrate, The wavelength conversion layer is laminated on the upper side of the light-transmitting substrate and has a thickness thinner than the light-transmitting substrate. Light-emitting element.

10. A circuit board including a circuit board body and a plurality of circuit electrodes formed to be electrically conductive and supported on the circuit board body; A plurality of light-emitting elements arranged on the circuit board to generate light; and A circuit board cover layer that covers the circuit board body while exposing at least a portion of the plurality of circuit electrodes, Light-emitting device.

11. In paragraph 10, The value obtained by dividing the distance between the above light-emitting elements by the length of an imaginary line extending in one direction from the center of the package substrate and overlapping the other side of the package substrate cover layer is greater than 1.1 and less than 1.

55. Light-emitting device.

12. In paragraph 10, The edge of the circuit electrode is spaced apart from the edge of the circuit board cover layer. Light-emitting device.

13. In paragraph 10, The side surface of the circuit board cover layer includes a cover layer slope, the side surface of the circuit electrode includes an electrode body slope, and the cover layer slope and the electrode body slope are spaced apart from each other. Light-emitting device.

14. In paragraph 10, It further includes a connector disposed between the circuit board and the package board to separate the circuit board and the package board, The circuit board cover layer and the connector are arranged horizontally apart from each other. Light-emitting device.

15. In paragraph 14, The distance between the upper surface of the circuit board cover layer and the lower surface of the package substrate is Greater than 25% and less than 50% of the length in the thickness direction of the package substrate body, Light-emitting device.

16. In paragraph 10, The thickness of the circuit board cover layer is greater than 70% of the thickness of the package board cover layer and less than 130% of the thickness of the package board cover layer. Light-emitting device.

17. In paragraph 10, The above circuit board includes circuit electrodes, The above package substrate includes a substrate electrode, The above circuit electrode and the above substrate electrode, Containing one or more of C, N, O, Au, Ag, Sn, Ca, Ni and Cu, Light-emitting device.

18. In paragraph 10, The circuit board cover layer and the package board cover layer include at least one of C, O, Si, S, and Ba. Light-emitting device.

19. Circuit board; and It includes a light-emitting element that is arranged on the circuit board and generates light, The above light emitting element is, A light source that generates light; A package substrate supporting the above light source; and Including a package substrate cover layer arranged to be spaced apart from the direct lower region of the light source, Light-emitting device.

20. In paragraph 19, The above light emitting element is provided in multiple pieces, At least some of the plurality of light emitting elements have different height positions of the package substrate cover layer. Light-emitting device.

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