Support structure, flexible display module, and flexible display device

Abstract

A support structure, a flexible display module, and a flexible display device. The support structure comprises a first adhesive layer (1), a support layer (2), a dustproof structure (3), and support modules (4); each support module (4) comprises a first adhesive portion (42) and a support portion (41); and each support portion (41) is attached to the side of the dustproof structure (3) away from the first adhesive layer (1), eliminating a gap between each support portion (42) and the support layer (2), improving the display effect of the display module.

Description

Supporting structure, flexible display module and flexible display device

[0001] Cross-reference to related applications

[0002] The present disclosure claims priority to Chinese Patent Application No. 202410822758.7, filed on June 24, 2024, entitled “Supporting structure, flexible display module and flexible display device”, the entire contents of which are incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to the technical field of display, in particular to a supporting structure, a flexible display module and a flexible display device. BACKGROUND

[0004] The folding flexible display device has a larger display area, and the larger display area makes it have more application scenarios, which has attracted widespread attention from users, and the market share of the folding flexible display device has also been increasing year by year.

[0005] Due to the gap between the supporting part of the supporting structure and the supporting layer, a bending mold mark extending along the first direction will be formed at the edge of the supporting part during the bonding, which affects the display effect of the flexible display module.

[0006] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present application, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0007] The present application aims to overcome the problem that due to the gap between the supporting part of the supporting structure and the dustproof structure, a bending mold mark extending along the first direction will be formed at the position of the full engraving pattern during the bonding, which affects the display effect of the flexible display module, and to provide a supporting structure, a flexible display module and a flexible display device.

[0008] According to one aspect of the present application, a supporting structure is provided. The supporting structure includes a first adhesive layer, a supporting layer, a dustproof structure, a first adhesive part and a supporting part. The supporting layer is arranged on one side of the first adhesive layer, and the supporting layer is provided with a full engraving pattern extending along a first direction. The dustproof structure is arranged on the side of the supporting layer away from the first adhesive layer, and the dustproof structure covers the full engraving pattern. The first adhesive part is arranged on both sides of the full engraving pattern respectively. The supporting part is arranged on the side of the first adhesive part away from the first adhesive layer, and the supporting part and the side of the dustproof structure away from the first adhesive layer are bonded to each other.

[0009] In one embodiment of the present application, the dustproof structure comprises a first dustproof layer, the first dustproof layer is arranged on the side of the support layer away from the first adhesive layer, the side of the first adhesive part away from the first adhesive layer is flush with the side of the first dustproof layer away from the first adhesive layer, and the support part and the side of the first dustproof layer away from the first adhesive layer are attached to each other.

[0010] In one embodiment of the present application, the dustproof structure comprises a first dustproof layer and a second dustproof layer, the first dustproof layer is arranged on the side of the support layer away from the first adhesive layer, the second dustproof layer is arranged on the side of the first dustproof layer away from the first adhesive layer, the side of the first adhesive part away from the first adhesive layer is flush with the side of the second dustproof layer away from the first adhesive layer, and the support part and the side of the second dustproof layer away from the first adhesive layer are attached to each other.

[0011] In one embodiment of the present application, the dustproof structure comprises a first dustproof layer and a second dustproof layer, the first dustproof layer is arranged on the side of the support layer away from the first adhesive layer, the second dustproof layer is arranged on the side of the first dustproof layer away from the first adhesive layer, the side of the second dustproof layer away from the first adhesive layer is higher than the side of the first adhesive part away from the first adhesive layer, the support part is attached to and compresses the second dustproof layer, so that the side of the second dustproof layer away from the first adhesive layer is flush with the side of the first adhesive part away from the first adhesive layer.

[0012] In one embodiment of the present application, the full-etching pattern comprises a plurality of support strips, the plurality of support strips extend along a first direction, a connecting part is arranged between adjacent two support strips, the connecting part connects the adjacent support strips together to form a support unit, and the connecting parts of adjacent two support units are staggered along the first direction.

[0013] In one embodiment of the present application, the distance between the two connecting parts of the same support unit along the first direction is greater than 5 mm and less than or equal to 10 mm.

[0014] In one embodiment of the present application, the width of the connecting part along the first direction is greater than 0.2 mm and less than or equal to 0.3 mm.

[0015] In one embodiment of the present application, the size of the support strip along the second direction is less than or equal to 0.1 mm, and the second direction intersects the first direction.

[0016] In one embodiment of the present application, the size of the connecting part along the second direction is greater than 0.15 mm and less than or equal to 0.2 mm.

[0017] In one embodiment of the present application, the support layer is provided with at least two half-etching grooves, the at least two half-etching grooves are respectively located on the side of the two first adhesive parts away from the full-etching pattern along a second direction, and the second direction intersects the first direction.

[0018] In an embodiment of the present application, the stress buffer groove extends along the first direction, and a projection of the stress buffer groove on the support layer overlaps with the support strip to be pressed.

[0019] In an embodiment of the present application, the size of the stress buffer groove along the second direction remains unchanged along the thickness direction of the first adhesive layer, and / or the size of the stress buffer groove along the second direction gradually increases or gradually decreases along the thickness direction of the first adhesive layer, and / or the size of the stress buffer groove along the second direction gradually increases and then gradually decreases along the thickness direction of the first adhesive layer.

[0020] In an embodiment of the present application, the support structure further comprises a first filling portion, which is arranged on the side of the dustproof structure away from the first adhesive layer, and the side of the first filling portion away from the first adhesive layer is flush with the side of the support portion away from the first adhesive layer.

[0021] In an embodiment of the present application, the support structure further comprises a second filling portion, which is arranged on the side of the half-etch groove away from the first adhesive layer and fills into the half-etch groove, and the side of the second filling portion away from the first adhesive layer is flush with the side of the support portion away from the first adhesive layer.

[0022] In an embodiment of the present application, the support structure further comprises a buffer portion, which is arranged on the side of the two second filling portions away from the full-etch pattern along the second direction, and the buffer portion is connected together with the support layer through the second adhesive portion.

[0023] According to another aspect of the present application, there is provided a flexible display module, comprising a flexible display panel and the support structure according to any one of the aspects of the present application, and the flexible display panel is bonded to the side of the first adhesive layer away from the support layer.

[0024] According to still another aspect of the present application, there is provided a flexible display device, comprising the flexible display module according to the another aspect of the present application.

[0025] The support structure of the present application comprises a dustproof structure, and the support portion and the dustproof structure are mutually attached on the side away from the first adhesive layer, so that the gap between the support portion and the support layer is eliminated, the possibility of stress concentration on the side of the support portion close to the first adhesive layer is reduced, the case of forming a bending mold along the first direction on the edge of the support portion of the support structure is reduced or eliminated, and the display effect of the flexible display module is avoided.

[0026] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0027] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, further serve to explain the principles of the application. It is to be understood that the drawings are only illustrations of some embodiments of the application and that, to one of ordinary skill in the art, other embodiments can be clearly inferred from the drawings without paying creative labor.

[0028] FIG. 1 is a cross-sectional view of a support structure according to an embodiment of the present application when a gap exists between the support portion and the support layer.

[0029] FIG. 2 is a cross-sectional view of a support structure according to an embodiment of the present application when the dustproof structure includes only a first dustproof layer and the thickness of the first adhesive portion is equal to the thickness of the first adhesive portion.

[0030] FIG. 3 is a cross-sectional view of a support structure according to an embodiment of the present application when the dustproof structure includes a first dustproof layer and a second dustproof layer and the sum of the thickness of the first dustproof layer and the thickness of the second dustproof layer is equal to the thickness of the first adhesive portion.

[0031] FIG. 4 is a cross-sectional view of a support structure according to an embodiment of the present application when the dustproof structure includes a first dustproof layer and a second dustproof layer and the sum of the thickness of the first dustproof layer and the thickness of the second dustproof layer is greater than the thickness of the first adhesive portion.

[0032] FIG. 5 is a plan view of a bending mark on a flexible display panel according to an embodiment of the present application.

[0033] FIG. 6 is a cross-sectional view of a support structure according to an embodiment of the present application when a stress buffer region is provided in the first adhesive layer.

[0034] FIG. 7 is a view of a stack of a dustproof structure, a support layer, and a first adhesive layer according to an embodiment of the present application when the first adhesive layer includes a base material, a first adhesive layer, and a second adhesive layer.

[0035] FIG. 8 is a view of a stack of a dustproof structure, a support layer, and a first adhesive layer according to an embodiment of the present application when the first adhesive layer includes a base material, a first adhesive layer, and a second adhesive layer, and the second adhesive layer has two stress buffer grooves.

[0036] FIG. 9 is a partial view of a first adhesive layer according to an embodiment of the present application when the stress buffer groove has a rectangular cross-sectional shape.

[0037] FIG. 10 is a partial view of a first adhesive layer according to an embodiment of the present application when the stress buffer groove has a right trapezoidal or inverted trapezoidal cross-sectional shape.

[0038] FIG. 11 is a partial view of a first adhesive layer according to an embodiment of the present application when the stress buffer groove has a drum-shaped cross-sectional shape.

[0039] Fig. 12 is a plan view of a full etching pattern according to an embodiment of the present application.

[0040] Fig. 13 is a partial view of a full etching pattern according to an embodiment of the present application.

[0041] Fig. 14 is a structural view of an S1 water droplet state according to an embodiment of the present application.

[0042] Fig. 15 is a structural view of an S2 water droplet state according to an embodiment of the present application.

[0043] Fig. 16 is a structural view of an S3 water droplet state according to an embodiment of the present application.

[0044] Fig. 17 is a structural view of an S4 water droplet state according to an embodiment of the present application.

[0045] Fig. 18 is a structural view of an S5 water droplet state according to an embodiment of the present application.

[0046] Fig. 19 is a structural view of an S6 water droplet state according to an embodiment of the present application.

[0047] Fig. 20 is a structural view of an S7 water droplet state according to an embodiment of the present application.

[0048] In the drawings: 1, first adhesive layer, 11, base material, 12, first adhesive layer, 13, second adhesive layer, 101, stress buffer area, 102, stress buffer groove, 2, support layer, 21, full etching pattern, 211, support unit, 2111, support bar, 2112, connecting portion, 2113, pattern unit, 22, half etching groove, 3, dustproof structure, 31, first dustproof layer, 32, second dustproof layer, 4, support module, 41, support portion, 42, first adhesive portion, 5, first filling portion, 6, second filling portion, 7, buffer structure, 71, buffer portion, 72, second adhesive portion, 8-first protective film, 9-second protective film, 100, support structure, 200, flexible display panel, 2001, bending die mark. DETAILED DESCRIPTION

[0049] Example embodiments now will be described more fully hereinafter with reference to the accompanying drawings; however, these embodiments should not be construed as limiting the application, but merely as illustrating the principles of the application. The example embodiments can be implemented in various forms and should not be construed as limited to the implementations set forth herein; rather, these embodiments are provided as a full and enabling disclosure of the application, and to fully and completely convey the scope of the application to those skilled in the art. Like reference numerals refer to like elements throughout the several views of the drawings, and description of the same elements will be omitted from description of some of the several views.

[0050] Although relative terms are used in this specification, such as "upper", "lower", to describe one component's relative position to another component of the icon, these terms are used in this specification for convenience only, for example, according to the orientation of the examples shown in the drawings. It will be understood that if the device of the icon is turned upside down, the component described as being "upper" will become the component that is "lower". When a structure is "on" another structure, it can mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is disposed "indirectly" on the other structure through another structure.

[0051] The terms "one", "an", "the", "said", and "at least one" are used to denote the presence of one or more elements / components / etc.; the terms "include" and "have" are used to denote an open-ended inclusion in such a way that additional elements / components / etc. can be present in addition to the listed elements / components / etc.; the terms "first", "second", and "third" and the like are used only as labels, not as a numerical limitation on their objects.

[0052] As shown in FIG. 1, the support structure includes a first adhesive layer 1, a support layer 2, a dustproof structure 3, and a support module 4, the support module 4 includes a first adhesive part 42 and a support part 41, the support layer 2 is arranged on one side of the first adhesive layer 1, and the support layer 2 is provided with a full engraving pattern 21 extending along the first direction x; the dustproof structure 3 is arranged on the side of the support layer 2 away from the first adhesive layer 1, and the dustproof structure 3 covers the full engraving pattern 21; the first adhesive part 42 is arranged on both sides of the dustproof structure 3 respectively; and the support part 41 is arranged on the side of the first adhesive part 42 away from the first adhesive layer 1.

[0053] Since there is a gap between the support part 41 and the support layer 2 of the support structure, a bonding mold mark extending along the first direction x will be formed on the edge of the support part 41 during bonding, which will affect the display effect of the flexible display module. When the first protective film 8 is bonded, the roller exerts downward pressure on the support part 41, the edge of the support part 41 is stressed downward, strain is generated on the first adhesive layer 1, and finally the bonding mold mark is formed.

[0054] Based on this, the present application provides a support structure. As shown in FIGS. 2-20, the support structure includes a first adhesive layer 1, a support layer 2, a dustproof structure 3, and a first adhesive part 42, the support layer 2 is arranged on one side of the first adhesive layer 1, and the support layer 2 is provided with a full engraving pattern 21 extending along the first direction x; the dustproof structure 3 is arranged on the side of the support layer 2 away from the first adhesive layer 1, and the dustproof structure 3 covers the full engraving pattern 21; the first adhesive part 42 is arranged on both sides of the full engraving pattern 21 respectively; and the support part 41 is arranged on the side of the first adhesive part 42 away from the first adhesive layer 1, and the support part 41 and the side of the dustproof structure 3 away from the first adhesive layer 1 are bonded to each other.

[0055] The dustproof structure 3 is extended to between the support portion 41 and the first bonding portion 42, so that the support portion 41 and the dustproof structure 3 are attached to each other away from the side of the first bonding layer 1, which reduces the possibility of stress concentration of the edge of the support portion 41 to the side close to the first bonding layer 1, reduces or eliminates the case that the support structure forms an attachment mold mark extending in the first direction x at the edge of the support portion 41, and avoids affecting the display effect of the flexible display module.

[0056] The support structure related to the present application will be described in detail below in combination with specific embodiments.

[0057] As shown in FIGS. 2 to 4, the support structure includes a first bonding layer 1 and a support layer 2, the support layer 2 is arranged on one side of the first bonding layer 1, and the support layer 2 is provided with a full-etch pattern 21 extending in the first direction x. The full-etch pattern 21 formed by etching can greatly reduce the concentrated stress in the folding process, thereby improving the bending performance of the support structure.

[0058] In order to avoid dust entering the full-etch pattern 21 and affecting the peeling between the support layer 2 and the first bonding layer 1, a dustproof structure 3 is usually arranged on the side of the support layer 2 away from the first bonding layer 1, and the dustproof structure 3 covers the full-etch pattern 21. The dustproof structure 3 can include a first dustproof layer 31 arranged on the side of the support layer 2 away from the first bonding layer 1, and the dustproof structure 3 can further include a second dustproof layer 32 arranged on the side of the first dustproof layer 31 away from the first bonding layer 1.

[0059] In the bent state of the flexible display device, the support structure usually needs to present a water drop shape, the support layer 2 is provided with two half-etch grooves 22 located on both sides of the full-etch pattern 21 in the second direction y, so that the support structure can be bent into a U-shaped state. A first bonding portion 42 is arranged between the two half-etch grooves 22 and the full-etch pattern 21, and a support portion 41 is arranged on the side of the first bonding portion 42 away from the first bonding layer 1. When the flexible display device is bent, the support portion 41 will press the hinge connecting portion, so that the two straight sides of the U-shaped flexible display device are concave in the direction of approaching each other, forming a water drop state. It should be noted that the hinge connecting portion is used to connect the whole machine and the flexible display module.

[0060] The support structure further includes a first filling portion 5 and a second filling portion 6, the first filling portion 5 is arranged on the side of the dustproof structure 3 away from the first bonding layer 1, and the side of the first filling portion 5 away from the first bonding layer 1 is flush with the side of the support portion 41 away from the first bonding layer 1. The second filling portion 6 is arranged on the side of the half-etch groove 22 away from the first bonding layer 1 and fills into the half-etch groove 22, and the side of the second filling portion 6 away from the first bonding layer 1 is flush with the side of the support portion 41 away from the first bonding layer 1.

[0061] The support structure further comprises a buffer structure 7, the buffer structure 7 comprising a buffer part 71 and a second adhesive part 72, the buffer part 71 being located on the side away from the full engraving pattern 21 of the two second filling parts 6 respectively along the second direction y, and the buffer part 71 being connected together with the support layer 2 through the second adhesive part 72. In the embodiment, the buffer part 71 and the second adhesive part 72 are located at the edge of the support layer 2. A first protective film 8 can be arranged on the side of the first adhesive layer 1 away from the support layer 2, and a second protective film 9 can be arranged on the side of the support part 41 away from the first adhesive layer 1.

[0062] As shown in FIG. 2, when the dustproof structure 3 only comprises the first dustproof layer 31, the thickness of the first adhesive part 42 can be thinned to be equal to the thickness of the first dustproof layer 31, the side of the first adhesive part 42 away from the first adhesive layer 1 is flush with the side of the first dustproof layer 31 away from the first adhesive layer 1, for example, the thickness of the first adhesive part 42 is thinned from 30 μm to 10 μm. The first dustproof layer 31 is extended to between the support part 41 and the first adhesive part 42, so that the support part 41 and the side of the first dustproof layer 31 away from the first adhesive layer 1 are mutually attached, thereby eliminating the gap between the support part 41 and the support layer 2.

[0063] As shown in FIG. 3, when the dustproof structure 3 comprises the first dustproof layer 31 and the second dustproof layer 32, the side of the second dustproof layer 32 away from the first adhesive layer 1 is arranged to be flush with the side of the first adhesive part 42 away from the first adhesive layer 1, for example, the thickness of the second dustproof layer 32 is H1, which can be 14 μm. The second dustproof layer 32 can be extended to between the support part 41 and the first adhesive part 42, so that the support part 41 and the side of the first dustproof layer 31 away from the first adhesive layer 1 are mutually attached, thereby eliminating the gap between the support part 41 and the support layer 2.

[0064] As shown in FIG. 4, when the dustproof structure 3 comprises the first dustproof layer 31 and the second dustproof layer 32, the side of the second dustproof layer 32 away from the first adhesive layer 1 can also be higher than the side of the first adhesive part 42 away from the first adhesive layer 1. For example, the thickness of the second dustproof layer 32 is H2, which can be 25 μm. The support part 41 is attached to and presses the second dustproof layer 32, so that the side of the second dustproof layer 32 away from the first adhesive layer 1 is flush with the side of the first adhesive part 42 away from the first adhesive layer 1. The support part 41 and the dustproof structure 3 become interference fit, and the interference amount is 10-20 um. In the embodiment, the interference amount can be 10 mm, 11 mm, 13 mm, 17 mm or 20 mm.

[0065] When the support structure is installed on the flexible display device, the first protective film 8 is usually torn off, and the flexible display panel is directly bonded to the first adhesive layer 1. When the flexible display device is bent, the support portion 41 will press the hinge connecting portion, and a bending indentation 2001 will be formed on the flexible display panel 200, as shown in FIG. 5. Therefore, the hinge connecting portion of the flexible display device is tried to be removed, so that the bending area is in a free water drop state in the static bending state. In this state, the flexible display device is tested in the static bending test, and the bending indentation of the bending area of the flexible display panel after unfolding is improved.

[0066] As shown in FIG. 6, it is considered to set a stress buffer area 101 on the first adhesive layer 1, the first adhesive layer 1 is thinned or removed at the stress buffer area 101, and the orthogonal projection of the stress buffer area 101 on the support layer 2 overlaps with the full engraving pattern 21, so that the bending area is in a free water drop state in the static bending state, and the effect of improving the bending indentation of the bending area is achieved.

[0067] As shown in FIG. 7, the first adhesive layer 1 includes a substrate 11, a first adhesive layer 12 and a second adhesive layer 13, the first adhesive layer 12 is located on the side of the substrate 11 close to the support layer 2, and the second adhesive layer 13 is located on the side of the substrate 11 away from the support layer 2. As shown in FIGS. 7 to 10, the second adhesive layer 13 is provided with two stress buffer grooves 102, the two stress buffer grooves 102 extend along the first direction x, and the two stress buffer grooves 102 are arranged at intervals along the second direction y, the second direction y is perpendicular to the first direction x and the third direction z, and the third direction z is the thickness direction of the first adhesive layer 1.

[0068] The depth of the stress buffer groove 102 is less than the thickness of the first adhesive layer 1, and the depth of the stress buffer groove 102 can penetrate the second adhesive layer 13, or can simultaneously penetrate the second adhesive layer 13 and the substrate 11, and can also remove part of the first adhesive layer 12. In this embodiment, the depth of the stress buffer groove 102 can be equal to the thickness of the second adhesive layer 13, so as to avoid affecting the structure of the substrate 11 and the first adhesive layer 12 due to the stress buffer groove 102, and weakening the connection strength of the first adhesive layer 1 and the support layer 2. Of course, the depth of the stress buffer groove 102 can also be less than the thickness of the second adhesive layer 13, that is, part of the second adhesive layer 13 is removed. The orthogonal projection of the stress buffer groove 102 on the first protective film 8 overlaps with the bending indentation.

[0069] As shown in FIGS. 8-11, consider that the stress buffer groove 102 is arranged only at the position where the bending impression is generated. First, the bending impression position is located, and the number of bending impressions is at least one pair, each pair of bending impressions includes two bending impressions, and the positions of the two bending impressions of each pair of bending impressions are symmetrically arranged about the center line of the full engraving pattern 21 in the first direction x, approximately at the positions of the 8th-12th support bars 2111. For example: one bending impression is generated at the position of the 10th support bar 2111 from left to right, and the other bending impression is also generated at the position of the 10th support bar 2111 from right to left. The support bar 2111 at the position of the bending impression is the support bar under compression, and it should be noted that the support bar is under compression by the hinge connection part. The simulation software is used to simulate the maximum strain of the support layer 2, and the simulation result matches the position of the bending impression. Thus, the accuracy of the simulation is verified.

[0070] As shown in FIG. 9, the size of the stress buffer groove 102 along the second direction y remains unchanged along the third direction z, i.e., the cross-sectional shape of the stress buffer groove 102 is rectangular. As shown in FIG. 10, the size of the stress buffer groove 102 along the second direction y gradually increases in the direction away from the support layer 2, i.e., the cross-sectional shape of the stress buffer groove 102 is a right trapezoid. The size of the stress buffer groove 102 along the second direction y can also gradually decrease in the direction away from the support layer 2, i.e., the cross-sectional shape of the stress buffer groove 102 is an inverted trapezoid. As shown in FIG. 11, the size of the stress buffer groove 102 along the second direction y gradually increases first and then gradually decreases in the direction away from the support layer 2, i.e., the cross-sectional shape of the stress buffer groove 102 is drum-shaped.

[0071] As shown in FIG. 12, the full engraving pattern 21 includes a plurality of support bars 2111 extending along the first direction x, and a connection part 2112 is arranged between adjacent two support bars 2111, the connection part 2112 connects the adjacent support bars 2111 together to form a support unit 211. Two connection parts 2112 and the support bar 2111 therebetween form a pattern unit 2113, and two adjacent pattern units 2113 along the first direction x share one connection part 2112, and a plurality of pattern units 2113 form a support unit 211.

[0072] The connecting portions 2112 of two adjacent support units 211 are staggered along the bending direction. A plurality of support units 211 are sequentially numbered as 1...n along the second direction y, wherein the connecting portions 2112 of the support units 211 in the odd-numbered rows are located on the same straight line along the second direction y, and the connecting portions 2112 of the support units 211 in the even-numbered rows are located on the same straight line along the second direction y. The size of the pattern unit 2113 along the second direction y gradually increases from the middle to both ends of the pattern unit 2113 along the first direction x, and the connecting portion 2112 of one of two adjacent pattern units 2113 along the second direction y is located at the middle of the other pattern unit 2113 along the first direction x.

[0073] Since the full-etching pattern 21 also has a great influence on the stress of the bending area, the full-etching pattern 21 of the support layer 2 can be adjusted to improve the bending impression on the flexible display panel. The support structure in the free water droplet state is simulated, the maximum strain of the full-etching pattern 21 simulation is taken as the basis for judgment, and the full-etching pattern 21 of the support layer 2 is adjusted according to the optimization trend of reducing the stress of the bending area.

[0074] As shown in FIG. 13, the distance between two adjacent connecting portions 2112 along the first direction x is A, the width of the connecting portion 2112 along the first direction x is B, and the size of the support strip 2111 along the second direction y is C. The size of the connecting portion 2112 along the second direction y is D.

[0075] As shown in FIG. 14, the S1 water droplet state is the state of the maximum strain point O1 when the flexible display device is bent, and the bending angle of the support structure 100 is 10.9°. The maximum strain of the support layer 2 is -7.7%, and the maximum strain of the first adhesive layer 1 is -24.8%. The free water droplet state is the state of the flexible display device when the hinge connecting portion is removed, and the bending angle of the support structure 100 is 12.6°. The maximum strain of the support layer 2 is -6%, and the maximum strain of the first adhesive layer 1 is -22.8%.

[0076] As shown in FIG. 15, the S2 water droplet state is the state of the maximum strain point O2 when the flexible display device is bent using the support structure 100 in FIG. 5. The maximum strain of the support layer 2 is -3.3%, and the maximum strain of the first adhesive layer 1 is -11.4%. As shown in FIG. 16, the S3 water droplet state is the state of the maximum strain point O3 when the flexible display device is bent using the support structure 100 in FIG. 8. The maximum strain of the support layer 2 is -7%, and the maximum strain of the first adhesive layer 1 is -20.3%.

[0077] With A as 5mm, B as 0.2mm, C as 0.1mm, and D as 0.15mm as the reference, A is increased to 10mm for simulation, C is increased to 0.2mm for simulation, B is decreased to 0.1mm for simulation, and D is decreased to 0.1mm for simulation. The simulation results are shown in FIGS. 17-20.

[0078] As shown in FIG. 17, the S4 water droplet state is a state in which the size A of the support structure 100 in FIG. 13 is increased to 10mm, the maximum strain point of the flexible display device when bent is O4, the maximum strain of the support layer 2 is -7.1%, and the maximum strain of the first adhesive layer 1 is -24.7%. As shown in FIG. 18, the S5 water droplet state is a state in which the size C of the support structure 100 in FIG. 13 is increased to 0.2mm, the maximum strain point of the flexible display device when bent is O5, the maximum strain of the support layer 2 is -40%, and the maximum strain of the first adhesive layer 1 is -70%. As shown in FIG. 19, the S6 water droplet state is a state in which the size B of the support structure 100 in FIG. 13 is decreased to 0.1mm, the maximum strain point of the flexible display device when bent is O6, the maximum strain of the support layer 2 is -9.6%, and the maximum strain of the first adhesive layer 1 is -25.2%. As shown in FIG. 20, the S7 water droplet state is a state in which the size D of the support structure 100 in FIG. 13 is decreased to 0.1mm, the maximum strain point of the flexible display device when bent is O7, the maximum strain of the support layer 2 is -9.4%, and the maximum strain of the first adhesive layer 1 is -25.4%.

[0079] From the simulation results, the following conclusions can be drawn: the strain value of the S3 water droplet state decreases to less than that of the S1 water droplet state, which is better than that of the free water droplet state. The strain value of the S4 water droplet state decreases to less than that of the S1 water droplet state, but is still greater than that of the free water droplet state. The strain value of the S5 water droplet state decreases to less than that of the S1 water droplet state. The strain value of the S6 water droplet state increases to greater than that of the S1 water droplet state. The strain value of the S7 water droplet state increases to greater than that of the S1 water droplet state. The strain value of the S6 water droplet state increases to greater than that of the S1 water droplet state.

[0080] The increase in size A has a positive effect on the reduction of the maximum strain of the support structure. Size A can be greater than 5mm and less than or equal to 10mm. For example, size A can be 5.1mm, 6mm, 7mm, 9mm, or 10mm. By simulating different sizes of size A, size A is preferably 10mm.

[0081] The decrease in size B has a reverse effect on the reduction of the maximum strain of the support structure. However, due to the etching process precision, size B is greater than 0.2mm and less than or equal to 0.3mm. For example, size B can be 0.2mm, 0.23mm, 0.25mm, 0.27mm, or 0.3mm, and size B is preferably 0.2mm.

[0082] In consideration of the bending rebound force of the flexible display module, the bending rebound force is not too large to avoid exceeding the stress range of the support structure. In order to adapt to the bending rebound force, the size C is usually set to 0.1 mm, and reducing the size C is beneficial to further reduce the maximum strain of the support structure. In the range allowed by the process, the size C is less than or equal to 0.1 mm. For example, the size C can be 0.1 mm, 0.09 mm, 0.07 mm, 0.06 mm or 0.05 mm, and the size C is preferably 0.1 mm.

[0083] The reduction of the size D has a positive effect on the reduction of the maximum strain of the support structure. Due to the etching process precision, the size D can be greater than 0.15 mm and less than or equal to 0.2 mm. For example, the size B can be 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm or 0.2 mm. The size D is preferably 0.16 mm.

[0084] Based on the above conclusions, the size A, the size B, the size C and the size D can be combined within the above ranges, and further simulation optimization can be performed to further reduce the maximum strain of the support structure. The size A is 5 mm or 10 mm, and the size B can be 0.2 mm, 0.25 mm or 0.3 mm. S8 water drop state is when the size A is 5 mm and the size B is 0.2 mm, the maximum strain of the support layer 2 is -7.7%, and the maximum strain of the first adhesive layer 1 is -24.8%. S9 water drop state is when the size A is 10 mm and the size B is 0.25 mm, the maximum strain of the support layer 2 is -6%, and the maximum strain of the first adhesive layer 1 is -23.9%. S10 water drop state is when the size A is 10 mm and the size B is 0.3 mm, the maximum strain of the support layer 2 is -5.8%, and the maximum strain of the first adhesive layer 1 is -23.5%. The maximum strain value of the S10 water drop state is equivalent to that in the free water drop state, so it can be used as an optimization scheme of the full etching pattern 21.

[0085] It should be noted that the first direction x is the x direction shown in FIGS. 12 and 13, the second direction y is the y direction shown in FIGS. 1 to 13, and the third direction z is the z direction shown in FIGS. 1 to 10. The third direction z is perpendicular to the first direction x and the second direction y.

[0086] The embodiment of the present application also provides a flexible display module, which can include a flexible display panel and a support structure provided by any one of the aspects of the present application, and the flexible display panel is bonded to the side of the first adhesive layer 1 away from the support layer. The specific structure and beneficial effects of the flexible display module can also refer to the support structure, and therefore, will not be described here.

[0087] The present application also provides a flexible display device, which can include the flexible display module of any one of the embodiments of the present application. The specific structure and advantages of the flexible display device can also refer to the flexible display module, and thus will not be repeated here.

[0088] It should be noted that the flexible display device includes other necessary components and compositions in addition to the flexible display module, such as a housing, a circuit board, a power line, etc. Those skilled in the art can make corresponding supplements according to the specific use requirements of the flexible display device, which will not be repeated here.

[0089] When the flexible display module is the structure mentioned above, the flexible display device can be a conventional electronic device, such as a mobile phone, a computer, a television, and a video recorder, or a new wearable device, such as a virtual reality device and an augmented reality device, which will not be listed one by one.

[0090] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the application being indicated by the following claims.

Claims

1. A support structure, characterized in that, include: First adhesive layer; A support layer is disposed on one side of the first adhesive layer, and the support layer is provided with a fully engraved pattern extending along a first direction; A dustproof structure is provided on the side of the support layer away from the first adhesive layer, and the dustproof structure covers the entire engraved pattern; The first adhesive portion is respectively provided on both sides of the fully engraved pattern; A support portion is provided on the side of the first adhesive portion away from the first adhesive layer, and the support portion and the side of the dustproof structure away from the first adhesive layer are attached to each other.

2. The support structure according to claim 1, characterized in that, The dustproof structure includes a first dustproof layer, which is disposed on the side of the support layer away from the first adhesive layer. The side of the first adhesive portion away from the first adhesive layer is flush with the side of the first dustproof layer away from the first adhesive layer. The support portion is in contact with the side of the first dustproof layer away from the first adhesive layer.

3. The support structure according to claim 1, characterized in that, The dustproof structure includes a first dustproof layer and a second dustproof layer. The first dustproof layer is disposed on the side of the support layer away from the first adhesive layer, and the second dustproof layer is disposed on the side of the first dustproof layer away from the first adhesive layer. The side of the first adhesive portion away from the first adhesive layer is flush with the side of the second dustproof layer away from the first adhesive layer, and the support portion is in contact with the side of the second dustproof layer away from the first adhesive layer.

4. The support structure according to claim 1, characterized in that, The dustproof structure includes a first dustproof layer and a second dustproof layer. The first dustproof layer is disposed on the side of the support layer away from the first adhesive layer, and the second dustproof layer is disposed on the side of the first dustproof layer away from the first adhesive layer. The side of the second dustproof layer away from the first adhesive layer is higher than the side of the first adhesive portion away from the first adhesive layer. The support portion is attached to and presses the second dustproof layer, so that the side of the second dustproof layer away from the first adhesive layer is flush with the side of the first adhesive portion away from the first adhesive layer.

5. The support structure according to claim 1, characterized in that, The fully engraved pattern includes multiple support strips that extend along a first direction. A connecting portion is provided between two adjacent support strips to connect adjacent support strips together to form a support unit. The connecting portions of two adjacent support units are staggered along the first direction.

6. The support structure according to claim 5, characterized in that, The distance between two adjacent connecting portions of the same support unit along the first direction is greater than 5 mm and less than or equal to 10 mm.

7. The support structure according to claim 5 or 6, characterized in that, The width of the connecting portion along the first direction is greater than 0.2 mm and less than or equal to 0.3 mm.

8. The support structure according to claim 7, characterized in that, The dimension of the support bar along the second direction is less than or equal to 0.1 mm, and the second direction intersects with the first direction.

9. The support structure according to claim 7, characterized in that, The dimension of the connecting part along the second direction is greater than 0.15 mm and less than or equal to 0.2 mm.

10. The support structure according to claim 5, characterized in that, The support layer is provided with at least two half grooves, and the at least two half grooves are respectively located on the side of the two first adhesive portions away from the full pattern along the second direction, and the second direction intersects with the first direction.

11. The support structure according to claim 10, characterized in that, The first adhesive layer has a stress buffer groove on the side away from the support layer. The stress buffer groove extends along a first direction, and the orthographic projection of the stress buffer groove on the support layer overlaps with the compressed support strip.

12. The support structure according to claim 10, characterized in that, The dimension of the stress buffer groove along the second direction remains constant along the thickness direction of the first adhesive layer, and / or the dimension of the stress buffer groove along the second direction gradually increases or gradually decreases along the thickness direction of the first adhesive layer, and / or the dimension of the stress buffer groove along the second direction first gradually increases and then gradually decreases along the thickness direction of the first adhesive layer.

13. The support structure according to claim 1, characterized in that, The support structure further includes a first filling portion, which is located on the side of the dustproof structure away from the first adhesive layer. The side of the first filling portion away from the first adhesive layer is flush with the side of the support portion away from the first adhesive layer.

14. The support structure according to claim 10, characterized in that, The support structure further includes a second filling portion, which is located on the side of the semi-groove away from the first adhesive layer and fills the semi-groove. The side of the second filling portion away from the first adhesive layer is flush with the side of the support portion away from the first adhesive layer.

15. The support structure according to claim 14, characterized in that, The support structure further includes a buffer portion, which is located on the side of the two second filling portions away from the full-cut pattern along the second direction. The buffer portion is connected to the support layer through a second adhesive portion.

16. A flexible display module, characterized in that, include: The support structure according to any one of claims 1 to 15; A flexible display panel is bonded to the side of the first adhesive layer away from the support layer.

17. A flexible display device, characterized in that, Includes the flexible display module as described in claim 16.

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