Camera module, camera and electronic device

Abstract

The present application relates to the technical field of camera apparatuses. Disclosed is a camera module, comprising a reinforcing plate, an adhesive film and an image sensor chip which are sequentially arranged in a first direction, wherein the first direction is the thickness direction of the reinforcing plate, the adhesive film and the image sensor chip, and the image sensor chip is bonded to the reinforcing plate by means of the adhesive film; a first through hole extending through the reinforcing plate in the first direction is provided in the reinforcing plate, and a second through hole extending through the adhesive film in the first direction is provided in the adhesive film; and in the first direction, the projection of the first through hole, the projection of the second through hole and the projection of the image sensor chip at least partially overlap. The present application can effectively reduce the warpage deformation of an image sensor chip, thereby improving the resolution of the camera module. Further disclosed in the present application are a camera and an electronic device.

Description

Camera module, camera and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411083105.8, filed on August 7, 2024, entitled "Camera module, camera and electronic device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of camera devices, in particular to a camera module, a camera and an electronic device. BACKGROUND

[0003] At present, various portable devices around people, such as smart phones, tablet computers, notebook computers, etc., have integrated many applications. Among them, camera devices have been widely used in various electronic products and have become an indispensable part of people's lives.

[0004] With the continuous progress of technology, people's demand for the resolution of camera devices is also getting higher and higher. However, the resolution of existing camera devices is difficult to improve, which will result in that the camera effect cannot meet the needs of users. SUMMARY

[0005] The present application provides a camera module, a camera and an electronic device, which can improve the resolution of the camera, so as to make the camera effect meet the needs of users.

[0006] In a first aspect, the present application provides a camera module, comprising a reinforcing plate, an adhesive film and an image sensor chip arranged in sequence along a first direction. The first direction is the thickness direction of the reinforcing plate, the adhesive film and the image sensor chip, and the image sensor chip is bonded to the reinforcing plate through the adhesive film.

[0007] The reinforcing plate is provided with a first through hole penetrating the reinforcing plate along the first direction, and the adhesive film is provided with a second through hole penetrating the adhesive film along the first direction; along the first direction, the projection of the first through hole, the projection of the second through hole and the projection of the image sensor chip at least partially coincide.

[0008] The present application sets the first through hole on the reinforcing plate and sets the second through hole on the adhesive film, and makes the projection of the first through hole, the projection of the second through hole and the projection of the image sensor chip along the first direction at least partially coincide, so that the stress of the reinforcing plate and the adhesive film on the image sensor chip in the projection coincidence area is completely released. That is, in the projection coincidence area, the reinforcing plate and the adhesive film will not produce stress effect on the image sensor chip, so as to effectively reduce the warping deformation of the image sensor chip and improve the resolution of the camera module.

[0009] In some implementations of the present application, the number of the first through hole and the second through hole is one, the projection of the first through hole and the second through hole along the first direction coincides, and the projection of the first through hole and the second through hole is within the outline of the image sensor chip. Illustratively, the shape of the first through hole and the second through hole is circular, elliptical or polygonal. The area ratio of the first through hole or the second through hole to the area of the image sensor chip is greater than 1% and less than 90%.

[0010] In some implementations of the present application, the number of the first through hole and the second through hole is one, the projection of the first through hole and the second through hole along the first direction coincides, and the projection of the first through hole and the second through hole is within the outline of the image sensor chip. Illustratively, the shape of the first through hole and the second through hole is circular, elliptical or polygonal. The area ratio of the first through hole or the second through hole to the area of the image sensor chip is greater than 1% and less than 90%.

[0011] In some implementations of the present application, the adhesive film is a chip bonding adhesive film. Illustratively, the thickness of the adhesive film is less than or equal to 30um, and the thickness uniformity of the adhesive film is less than or equal to ±3um.

[0012] In some implementations of the present application, the circuit board, the lead, the bracket, the optical filter and the lens are further included. The circuit board is arranged on one side of the reinforcing plate along the first direction, the reinforcing plate is attached to the circuit board, the circuit board is provided with a groove, and the adhesive film and the image sensor chip are arranged in the groove. One end of the lead is connected to the circuit board, and the other end is connected to the image sensor chip. The bracket is arranged on one side of the circuit board along the first direction, and the bracket is connected to the circuit board. The optical filter is arranged on one side of the image sensor chip along the first direction, and the optical filter is connected to the bracket. The lens is arranged on one side of the optical filter along the first direction, and the lens is connected to the bracket.

[0013] In the second aspect, the present application provides a camera, which comprises a shell and the camera module as in the first aspect, and the camera module is arranged in the shell.

[0014] In the third aspect, the present application provides an electronic device, which comprises a shell and the camera module as in the first aspect, and the camera module is arranged in the shell. BRIEF DESCRIPTION OF DRAWINGS

[0015] FIG. 1 shows a schematic diagram of a camera module in the prior art;

[0016] FIG. 2 shows a schematic diagram of a camera module provided in an embodiment;

[0017] FIG. 3 shows a schematic diagram of a camera module provided in another embodiment;

[0018] Fig. 4(a) shows a schematic diagram of a camera module according to an embodiment of the present application;

[0019] Fig. 4(b) shows a cross-sectional view of Fig. 4(a) along A-A direction;

[0020] Fig. 5(a) shows a schematic diagram of a camera module according to another embodiment of the present application;

[0021] Fig. 5(b) shows a cross-sectional view of Fig. 5(a) along B-B direction;

[0022] Fig. 6(a) shows a lateral cross-sectional view of a camera module according to an embodiment of the present application;

[0023] Fig. 6(b) shows a lateral cross-sectional view of a camera module according to an embodiment of the present application;

[0024] Fig. 6(c) shows a lateral cross-sectional view of a camera module according to an embodiment of the present application;

[0025] Fig. 6(d) shows a lateral cross-sectional view of a camera module according to an embodiment of the present application. DETAILED DESCRIPTION

[0026] In order to make the objects, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0027] The present application provides a camera module, which can be widely applied in electronic devices with camera devices. The electronic device can be a mobile phone, a notebook computer, a tablet computer, a mobile phone accessory, a notebook computer accessory, a tablet computer accessory, etc., which are not limited in the present application. The present application will be described below by taking the application of the camera module in a mobile phone as an example.

[0028] In each of the drawings, the X-axis direction is the thickness direction of the camera module. For the convenience of understanding, the direction pointed by arrow X1 will be referred to as the "upper" direction, and the direction pointed by arrow X2 will be referred to as the "lower" direction. It should be noted that the position relationship of "upper" and "lower" in the present application is only based on the position relationship shown in the drawings, and cannot be regarded as a limitation of the present application.

[0029] FIG. 1 shows a structural schematic diagram of a camera module 100a in the prior art. Referring to FIG. 1, the camera module 100a includes, from bottom to top along an X1 direction, a reinforcing plate 1a, a circuit board 4a, a filter 7a, and a lens 8a. The reinforcing plate 1a is connected to a lower surface of the circuit board 4a. The circuit board 4a is provided with a groove 41a, and an image sensor chip 3a is arranged in the groove 41a. The image sensor chip 3a is adhered to an upper surface of the reinforcing plate 1a by a glue film 2a. A wire 5a is arranged between the image sensor chip 3a and the circuit board 4a, and the wire 5a is used to provide current for the image sensor chip 3a. The filter 7a and the lens 8a are fixed to the circuit board 4a by a support 6a. An upper surface of the image sensor chip 3a is a light receiving surface 31a, and light outside the camera module 100a can enter the light receiving surface 31a through the lens 8a and the filter 7a in sequence, and the light receiving surface 31a is used for light receiving.

[0030] In actual application, the resolution of the camera module 100a is difficult to improve, which will result in that the camera effect of the camera module 100a cannot meet the needs of users. The inventors have found through exploration that the main reason why the resolution of the camera module 100a is difficult to improve is that, in the manufacturing process of the camera module 100a, the glue film 2a needs to be heated to solidify the glue film 2a. During the cooling process of the glue film 2a, the glue film 2a and the reinforcing plate 1a will produce thermal expansion deformation because the temperatures of the glue film 2a and the reinforcing plate 1a are still high. The deformed glue film 2a and the reinforcing plate 1a will generate stress on the image sensor chip 3a through adhesive force, resulting in that the image sensor chip 3a and the light receiving surface 31a are warped and deformed. The warping and deformation of the light receiving surface 31a will directly affect the resolution of the camera module 100a. Especially when the aperture of the camera module 100a becomes larger, the warping and deformation of the light receiving surface 31a will be more sensitive. Therefore, if the warping and deformation of the light receiving surface 31a is large, the resolution of the camera module 100a is difficult to improve.

[0031] In order to solve the problem that the light receiving surface 31a is easy to be warped and deformed, two optional embodiments are provided below to improve the camera module 100a in order to reduce the warping and deformation of the light receiving surface 31a.

[0032] In a first alternative embodiment, the improved camera module 100a is shown in FIG. 2, which is basically the same as the camera module shown in FIG. 1, except that the camera module 100a in FIG. 2 is provided with a through hole 21a on the adhesive film 2a. By providing the through hole 21a on the adhesive film 2a, the contact area between the adhesive film 2a and the image sensor chip 3a can be reduced, so that the stress of the adhesive film 2a on the image sensor chip 3a can be reduced to a certain extent to reduce the warping deformation of the light receiving surface 31a. However, the inventors found that the effect of reducing the warping deformation of the light receiving surface 31a in this embodiment is not significant. Further exploration by the inventors found that the main reason for the insignificant effect of reducing the warping deformation of the light receiving surface 31a is that although the through hole 21a on the adhesive film 2a can reduce the contact area between the adhesive film 2a and the image sensor chip 3a, the reinforcing plate 1a still deforms, so that the reinforcing plate 1a still exerts stress on the image sensor chip 3a through the remaining adhesive film 2a, resulting in a large warping deformation of the light receiving surface 31a.

[0033] In a second alternative embodiment, the improved camera module 100a is shown in FIG. 3, which is basically the same as the camera module shown in FIG. 1, except that the camera module 100a in FIG. 3 is provided with a through hole 11a on the reinforcing plate 1a. By providing the through hole 11a on the reinforcing plate 1a, the rigidity of the reinforcing plate 1a can be reduced, so that when the reinforcing plate 1a deforms, the stress of the reinforcing plate 1a on the image sensor chip 3a can be reduced to a certain extent to reduce the warping deformation of the light receiving surface 31a. However, the inventors found that the effect of reducing the warping deformation of the light receiving surface 31a in this embodiment is also not significant. Further exploration by the inventors found that the main reason for the insignificant effect of reducing the warping deformation of the light receiving surface 31a in this embodiment is that although the through hole 11a on the reinforcing plate 1a can reduce the rigidity of the reinforcing plate 1a, since the through hole 11a is completely covered by the adhesive film 2a, the stress of the reinforcing plate 1a on the image sensor chip 3a is still transmitted to the image sensor chip 3a through the adhesive film 2a covering the through hole 11a, resulting in a large warping deformation of the light receiving surface 31a.

[0034] In summary, the camera module 100a provided in the above first and second alternative embodiments still has the problem of large warping deformation of the light receiving surface 31a.

[0035] To solve the above problems, the present application further provides a camera module 100 which can effectively reduce the warping deformation of the light receiving surface, thereby improving the resolution of the camera module.

[0036] FIG. 4(a) shows a schematic diagram of the camera module 100. Referring to FIG. 4(a), the camera module 100 provided by the present application comprises, in sequence along the X1 direction (as an example of the first direction), the reinforcing plate 1, the adhesive film 2, and the image sensor chip 3. The X1 direction is the thickness direction of the reinforcing plate 1, the adhesive film 2, and the image sensor chip 3. The upper surface of the image sensor chip 3 is the light receiving surface 31, and the lower surface of the image sensor chip 3 is bonded to the reinforcing plate 1 through the adhesive film 2. Exemplarily, the reinforcing plate 1 can be a metal plate, a glass plate, or a printed circuit board. The reinforcing plate 1 is provided with a through hole 11 (as an example of the first through hole) penetrating the reinforcing plate 1 along the X1 direction, and the adhesive film 2 is provided with a through hole 21 (as an example of the second through hole) penetrating the adhesive film 2 along the X1 direction. Along the X1 direction, the projection of the through hole 11, the projection of the through hole 21, and the projection of the image sensor chip 3 at least partially overlap.

[0037] By providing the through hole 11 on the reinforcing plate 1, the through hole 21 on the adhesive film 2, and making the projections of the through hole 11, the through hole 21, and the image sensor chip 3 along the X1 direction at least partially overlap, the present application can completely release the stress in the projection overlap area. That is, in the projection overlap area, neither the reinforcing plate 1 nor the adhesive film 2 will exert stress on the image sensor chip 3, so as to effectively reduce the warping deformation of the light receiving surface 31 and improve the resolution of the camera module.

[0038] In some implementations of the present application, there can be various forms of partial overlap (i.e., the projections of the through hole 11 and the through hole 21 along the X1 direction at least partially overlap) between the through hole 11 and the through hole 21. Hereinafter, the through hole 11 and the through hole 21 are taken as examples of circular holes. Exemplarily, in some embodiments, the centers of the through hole 11 and the through hole 21 coincide, but the sizes are different, as shown in FIG. 6(a). In other embodiments, the centers of the through hole 11 and the through hole 21 can not coincide, but the projection of one of the through holes is completely within the projection range of the other through hole, as shown in FIG. 6(b). In other embodiments, the centers of the through hole 11 and the through hole 21 can not coincide, but part of the projection of one of the through holes is within the projection range of the other through hole, as shown in FIG. 6(c). In other embodiments, the centers and edges of the through hole 11 and the through hole 21 can completely coincide, as shown in FIG. 6(d). The present application does not limit the overlap form of the through hole 11 and the through hole 21, as long as the projections of the through hole 11 and the through hole 21 along the X1 direction at least partially overlap, which are within the protection scope of the present application.

[0039] In some implementations of the present application, the adhesive film 2 is a die bonding adhesive film. For example, the thickness of the adhesive film 2 is less than or equal to 30 um, and the thickness uniformity is less than or equal to ±3 um. Compared with liquid adhesive, the solid adhesive film used in the present application can better ensure the thickness accuracy and thickness uniformity, thereby helping to improve the performance of the camera module 100.

[0040] The present application does not limit the number and shape of the through holes 11 and 21, as long as they can reduce the warping deformation of the light receiving surface 31, which are within the protection scope of the present application. In order to enable those skilled in the art to better understand the technical solutions of the present application, the camera module 100 provided by the present application is described below through several embodiments.

[0041] Embodiment one

[0042] FIG. 4(a) shows a structural schematic diagram of the camera module 100 in the present embodiment, and FIG. 4(b) shows a cross-sectional view of A-A in FIG. 4(a). In the present embodiment, the number of the through hole 11 and the through hole 21 is one. The shape of the through hole 11 and the through hole 21 can be circular, elliptical or polygonal. The shape and size of the through hole 11 and the through hole 21 can be the same or different, as long as the projection of the through hole 11, the through hole 21 and the image sensor chip 3 along the X1 direction at least partially coincides.

[0043] Preferably, the shape and size of the through hole 11 and the through hole 21 are the same, the projection of the through hole 11 and the through hole 21 along the first direction completely coincides, and the projection of the through hole 11 and the through hole 21 is located within the outline range of the image sensor chip 3. Such a design can maximize the area of the projection of the hole body 1, the through hole 21 and the image sensor chip 3, thereby minimizing the stress generated by the reinforcing plate 1 and the adhesive film 2 on the image sensor chip 3.

[0044] In the case where the outline of the through hole 11 and the through hole 21 coincides, that is, coincides, the area ratio of the through hole 11 or the through hole 21 to the image sensor chip 3 is greater than 1% and less than 90%. Preferably, the area ratio of the through hole 11 or the through hole 21 to the image sensor chip 3 is greater than 5% and less than 20%. The applicant has found through exploration that when the area ratio of the through hole 11 or the through hole 21 to the image sensor chip 3 is greater than 5% and less than 20%, the stress generated by the reinforcing plate 1 and the adhesive film 2 on the image sensor chip 3 can be effectively reduced, while the image sensor chip 3 can also be firmly bonded.

[0045] Embodiment two

[0046] Fig. 5(a) shows a schematic diagram of the structure of the camera module 100 in the embodiment, and Fig. 5(b) shows a B-B sectional view of Fig. 5(a). In the embodiment, the number of the through holes 11 and the number of the through holes 21 are both plural, the number of the through holes 11 is equal to the number of the through holes 21, and the positions of the through holes 11 and the through holes 21 are one-to-one corresponding. The projections of the corresponding through holes 11 and the through holes 21 along the X1 direction at least partially coincide. The embodiment does not limit the shape of the through holes 11 and the through holes 21, and the shape of each of the through holes 11 and the through holes 21 can be one of a circle, an ellipse, and a polygon, or can be selected from a plurality of different shapes. For example, the adhesive film 2 in Fig. 5(b) is provided with a plurality of through holes 21 of different shapes. In addition, the embodiment does not limit the size of the through holes 11 and the through holes 21, and the size of each of the through holes 11 and the through holes 21 can be the same or different, as long as the projections of the corresponding through holes 11, the through holes 21, and the image sensor 3 along the X1 direction at least partially coincide.

[0047] Preferably, the shape and the size of the corresponding through holes 11 and the through holes 21 are the same, the projections of the through holes 11 and the through holes 21 along the first direction completely coincide, and the projections of the through holes 11 and the through holes 21 are located within the outline of the image sensor chip 3. Such a design can maximize the area of the projection of the corresponding hole body 1, the through holes 21, and the image sensor chip 3, thereby minimizing the stress generated by the reinforcing plate 1 and the adhesive film 2 on the image sensor chip 3.

[0048] In the case where each of the through holes 11 coincides with the outline of the corresponding through holes 21, the sum of the areas of the through holes 11 or the sum of the areas of the through holes 21 is greater than 1% and less than 90% of the area of the image sensor chip 3. Preferably, the sum of the areas of the through holes 11 or the sum of the areas of the through holes 21 is greater than 5% and less than 20% of the area of the image sensor chip 3. The applicant has found through exploration that when the sum of the areas of the through holes 11 or the sum of the areas of the through holes 21 is greater than 5% and less than 20% of the area of the image sensor chip 3, the stress generated by the reinforcing plate 1 and the adhesive film 2 on the image sensor chip 3 can be effectively reduced, and the image sensor chip 3 can be firmly bonded.

[0049] The above embodiments are further detailed descriptions of the camera module 100, and the specific implementation of the camera module 100 is not limited to these descriptions. Any equivalent implementation or modification made without departing from the present application shall be included in the scope of the present application.

[0050] Referring to FIG. 4(a), in some implementations of the present application, the camera module 100 further comprises a circuit board 4, a wire 5, a support 6, a filter 7 and a lens 8. The circuit board 4 is arranged above the reinforcing plate 1 along the first direction, the upper surface of the reinforcing plate 1 is attached to the lower surface of the circuit board 4, and the reinforcing plate 1 is connected to the circuit board 4. The circuit board 4 is provided with a slot 41 penetrating the circuit board 4 along the X1 direction, and the adhesive film 2 and the image sensor chip 3 are arranged in the slot 41. One end of the wire 5 is connected to the circuit board 4, and the other end is connected to the image sensor chip 3, and the wire 5 is used to provide current for the image sensor chip 3. The support 6 is arranged above the circuit board 4 along the first direction, and the bottom of the support 6 is connected to the upper surface of the circuit board 4. The filter 7 is arranged above the image sensor chip 3 along the first direction, and the lens 8 is arranged above the filter 7 along the first direction. The filter 7 and the lens 8 are connected to the support 6, and the support 6 is used to support the filter 7 and the lens 8. When the camera module 100 is working, the light outside the camera module 100 passes through the lens 8 and the filter 7 in turn and enters the photosensitive surface 31, and the photosensitive surface 31 is used for photosensitive to identify the light image.

[0051] According to the present application, the through hole 11 is arranged on the reinforcing plate 1, the through hole 21 is arranged on the adhesive film 2, and the projection of the through hole 11, the through hole 21 and the image sensor chip 3 along the X1 direction at least partially overlaps, so that the partial stress of the reinforcing plate 1 and the adhesive film 2 on the image sensor chip 3 can be released, thereby reducing the warping deformation of the photosensitive surface 31 and improving the resolution of the camera module 100.

[0052] In a second aspect, the present application provides a camera, comprising a shell and any one of the camera modules introduced in the foregoing embodiments in combination with FIGS. 4(a)-5(b), and the camera module is arranged in the shell.

[0053] In a third aspect, the present application provides an electronic device, comprising a shell and any one of the camera modules introduced in the foregoing embodiments in combination with FIGS. 4(a)-5(b), and the camera module is arranged in the shell.

[0054] The above describes the embodiments of the present application by specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the present application. Although the description of the present application is introduced in combination with some embodiments, it does not mean that the features of the present application are limited to the embodiments. On the contrary, the purpose of introducing the application in combination with the embodiments is to cover other options or modifications that can be extended based on the claims of the present application. The present application can also not use these details. In addition, in order to avoid confusion or obscure the focus of the present application, some specific details are omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0055] In the embodiments of the present application, the terms "first", "second" are used only for descriptive purposes, and cannot be construed as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features.

[0056] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are in an "or" relationship.

[0057] In the description of the embodiments of the present application, it should be explained that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting" should be understood in a broad sense, for example, "connecting" can be detachable connection, or can be non-detachable connection; can be direct connection, or indirect connection through intermediate medium.

[0058] In the description of the present application, it should be explained that the terms "upper", "lower", "top", "bottom" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the present application.

[0059] In the description of the present application, it should be explained that, unless otherwise explicitly specified and limited, the terms "setting", "mounting", "connecting", "fitting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium, can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0060] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.

Claims

1. An image capturing module, comprising: The camera module comprises a reinforcing plate, an adhesive film and an image sensor chip arranged in sequence along a first direction, the first direction being a thickness direction of the reinforcing plate, the adhesive film and the image sensor chip, and the image sensor chip being bonded to the reinforcing plate through the adhesive film; The reinforcing plate is provided with a first through hole penetrating the reinforcing plate along the first direction, and the adhesive film is provided with a second through hole penetrating the adhesive film along the first direction; along the first direction, projections of the first through hole, the second through hole and the image sensor chip at least partially overlap.

2. The camera module of claim 1, wherein, The number of the first through hole and the second through hole is one, the projections of the first through hole and the second through hole along the first direction coincide, and the projections of the first through hole and the second through hole are located within the outline range of the image sensor chip.

3. The camera module of claim 2, wherein, The area ratio of the first through hole or the second through hole to the area of the image sensor chip is greater than 1% and less than 90%.

4. The camera module of claim 2, wherein, The shape of the first through hole and the second through hole is circular, elliptical or polygonal.

5. The camera module of claim 1, wherein, The number of the first through hole and the second through hole is equal and at least two, and the positions of each first through hole and each second through hole correspond one by one; along the first direction, the projections of the corresponding first through hole and the second through hole coincide, and the projections of each first through hole and each second through hole are located within the outline range of the image sensor chip.

6. The camera module of claim 5, wherein, The sum of the area of each first through hole or the sum of the area of each second through hole is greater than 1% and less than 90% of the area of the image sensor chip.

7. The camera module of claim 5, wherein, The shape of the first through hole and the second through hole is one or a combination of circular, elliptical and polygonal.

8. The camera module of claim 1, wherein, The adhesive film is a chip bonding adhesive film.

9. The camera module of claim 8, wherein, The thickness of the adhesive film is less than or equal to 30um.

10. The camera module of claim 8, wherein, The thickness uniformity of the adhesive film is less than or equal to ±3um.

11. The camera module of any one of claims 1-10, wherein, Further comprising: A circuit board is arranged on one side of the reinforcing plate along the first direction, the reinforcing plate and the circuit board are attached, the circuit board is provided with a groove, and the adhesive film and the image sensor chip are arranged in the groove; A wire is connected to the circuit board at one end and to the image sensor chip at the other end; A bracket is arranged on one side of the circuit board along the first direction, and the bracket is connected to the circuit board; A filter is arranged on one side of the image sensor chip along the first direction, and the filter is connected to the bracket; A lens is arranged on one side of the filter along the first direction, and the lens is connected to the bracket.

12. A camera, characterized by The camera module comprises a housing and any one of claims 1 to 11, and the camera module is arranged in the housing.

13. An electronic device, comprising: The camera module comprises an outer shell and any one of claims 1 to 11, and the camera module is arranged in the outer shell.

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