Heat dissipation device, electronic assembly, onboard intelligent module, and vehicle

Abstract

Embodiments of the present application provide a heat dissipation device, an electronic assembly, an onboard intelligent module, and a vehicle. The heat dissipation device comprises a plurality of liquid cooling modules. The liquid cooling modules are used for being in thermally conductive connection with heating elements; the liquid cooling modules are provided with flow channels, and the flow channels are used for circulating a coolant; and the plurality of liquid cooling modules are arranged at intervals. A connecting member is provided between two adjacent liquid cooling modules; and the connecting member is waterproof, is connected to the sides of the liquid cooling modules facing the heating elements, and covers a gap between the two adjacent liquid cooling modules. The connecting members can connect every two adjacent liquid cooling modules as a whole, so that when the coolant leaks, the connecting members can block the coolant from flowing through the gaps to the side where the heating elements are located, thereby reducing the risk of short circuit of the heating elements, and improving the reliability of the electronic assembly and the vehicle.

Description

A heat dissipation device, electronic components, in-vehicle intelligent module, and vehicle.

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411219216.7, filed on August 30, 2024, entitled "A Heat Dissipation Device, Electronic Component, In-Vehicle Intelligent Module and Vehicle", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of heat dissipation, and more particularly to a heat dissipation device, electronic components, in-vehicle intelligent modules, and vehicles. Background Technology

[0004] As autonomous driving technology matures, public acceptance of it is increasing, driving its rapid advancement towards higher levels. To meet the computing power demands of autonomous driving, some manufacturers integrate multiple chips onto a circuit board. These chips generate heat during operation; if this heat cannot be dissipated promptly, the chips may operate in high-temperature environments, affecting their stable operation and lifespan.

[0005] To dissipate heat from the chip, one existing technology involves installing multiple cold plates inside the vehicle, each connected to the chip via a thermally conductive material. The cold plates have flow channels, allowing low-temperature coolant to enter and exchange heat with the chip, thus dissipating heat. However, during operation, if coolant leaks, it can easily flow onto the surface of the circuit board, causing a short circuit and affecting the chip's normal operation, potentially leading to vehicle malfunction. Summary of the Invention

[0006] This application provides a heat dissipation device, electronic component, vehicle-mounted intelligent module, and vehicle, which reduces the risk of coolant leakage to the circuit board during the heat dissipation process of the chip, thereby improving the reliability of the electronic component and the vehicle.

[0007] Firstly, this application provides a heat dissipation device. The heat dissipation device includes multiple liquid-cooled modules, which are thermally connected to a heat-generating element. Each liquid-cooled module has a flow channel for circulating coolant, allowing heat exchange between the coolant and the heat-generating element. The multiple liquid-cooled modules are arranged at intervals, with a connector between adjacent modules. The connector is connected to the side of the liquid-cooled module facing the heat-generating element, and the connector covers the gap between adjacent modules. In terms of material, the connector is waterproof, preventing coolant from easily penetrating its surface. Optionally, the coolant can be water or other liquids. Structurally, the connector is a dense structure without pores, thus acting as a barrier against coolant leakage. In its specific arrangement, the connector extends along the gap between adjacent modules, and the length of the connector is not less than the length of the gap. The connector can connect multiple liquid cooling modules into a whole. When coolant leaks, the connector can prevent coolant from flowing through the gaps to the side where the heat-generating element is located, thereby reducing the risk of short circuit in the heat-generating element and improving the reliability of electronic components and the vehicle.

[0008] In one optional technical solution for configuring liquid cooling modules, the liquid cooling module includes a substrate for thermally conductive connection with a heat-generating element, and the aforementioned flow channel is located on the side of the substrate away from the heat-generating element. For two adjacent liquid cooling modules, the two substrates are also arranged adjacently, and these two substrates are directly connected by a connector. The substrates of multiple liquid cooling modules included in the heat dissipation device are connected by connectors to form a single substrate. The flow channel is located on the side of this single substrate away from the heat-generating element. This single substrate can form a barrier between the coolant and the heat-generating element, thereby preventing the coolant from flowing towards the side where the heat-generating element is located, thus reducing the risk of short circuits in the heat-generating element and improving the reliability of electronic components and the vehicle.

[0009] There are various ways to form the flow channel of the liquid cooling module. For example, in one optional technical solution, the liquid cooling module further includes a top cover located on the side of the substrate away from the heating element, and the top cover and the substrate are fastened together to form the flow channel. Another optional technical solution includes a metal tube, at least a portion of which is located on the surface of the substrate, and the internal channels of the metal tube form the flow channel. Of course, in addition to the two methods mentioned above, other methods can also be used to form the flow channel, which will not be listed here.

[0010] Various connection methods are available when connecting the substrate and the connector. For example, the substrate and the connector can be welded, bonded, or formed as a single unit.

[0011] When specifically setting the substrate, it can be a plate with uniform thickness or a plate with varying thickness. In one optional technical solution, the thickness of the substrate gradually decreases along the direction away from the connector. When mounting the substrate, the bottom surface of the substrate can be in a horizontal state, thereby making the top surface of the substrate in an inclined state. At this time, the distance from the top surface of the substrate to the plane where the heating element is located gradually decreases along the direction away from the connector. When coolant leaks and flows to the top surface of the substrate, the coolant will flow towards the end away from the connector, thereby reducing the accumulation of coolant at the connector and facilitating the discharge of leaked coolant.

[0012] In one optional technical solution for the connector, the connector has a first side and a second side arranged along a first direction. The first side is connected to one liquid cooling module, and the second side is connected to another liquid cooling module. Furthermore, the connector has elastic deformation capability along the first direction. That is, the connector can extend and shorten along the first direction. The aforementioned connector can connect two liquid cooling modules with different spacings through deformation, exhibiting strong adaptability.

[0013] As an example, in one possible implementation, the connector can be flexible due to a special structural design, allowing it to deform. For instance, the connector includes a first protrusion having two first walls facing each other along the thickness direction of the connector, both of which protrude away from the heating element. Visually, the first protrusion forms a first cavity on the side facing the heating element. As another example, the connector includes a second protrusion having two second walls facing each other along the thickness direction of the connector, both of which protrude towards the heating element. Visually, the second protrusion forms a second cavity on the side away from the heating element. Yet another example is that the connector includes both the first and second protrusions, thus exhibiting a serrated or wavy shape. Under compression, tension, or other forces, both the first and second protrusions can deform, causing a change in the dimensions of the connector along the first direction.

[0014] In another possible implementation, the connector can be flexible due to a special design of the material, allowing it to deform. For example, the connector could be a component made of a flexible material.

[0015] To improve the heat transfer efficiency between the heating element and the substrate, one optional technical solution involves providing a first thermally conductive protrusion on the surface of the substrate facing the heating element. The thermal conductivity of the first thermally conductive protrusion is greater than or equal to that of the substrate, and the protrusion is used for thermally conductive connection with the heating element. The first thermally conductive protrusion widens the heat conduction channel, allowing heat to be conducted more quickly in a plane perpendicular to the thickness direction of the substrate, and over a larger area. This enables the coolant to absorb more heat per unit time, thereby improving the heat exchange efficiency between the coolant and the heating element.

[0016] In one optional technical solution, the flow channels of the multiple liquid cooling modules are sequentially connected via connecting pipes. Alternatively, the multiple liquid cooling modules are arranged in series. In another optional technical solution, the heat dissipation device further includes a main inlet pipe, a main outlet pipe, multiple inlet branch pipes, and multiple outlet branch pipes; wherein the flow channels of the multiple liquid cooling modules are connected via different inlet branch pipes and the main inlet pipe, and the flow channels of the multiple liquid cooling modules are connected via different outlet branch pipes and the main outlet pipe. Alternatively, the multiple liquid cooling modules are arranged in parallel between the main inlet pipe and the main outlet pipe.

[0017] Secondly, this application also provides an electronic component. This electronic component includes multiple heating elements and a heat dissipation device as described in any of the technical solutions of the first aspect, wherein the heating elements and the liquid cooling module in the heat dissipation device are thermally connected. The liquid cooling module has a flow channel; when coolant is introduced into the flow channel, the coolant flows along the flow channel and exchanges heat with the heating elements, thereby reducing the temperature of the heating elements and achieving the purpose of heat dissipation. When coolant leakage occurs, for any two adjacent liquid cooling modules, the connector between them can prevent coolant from flowing through the gap between them to the side where the heating element is located, thereby reducing the risk of short circuit in the heating element and improving the reliability of the electronic component and the vehicle.

[0018] In one alternative technical solution, the electronic component further includes a first housing with an opening. A heat-generating element is located within the first housing, and multiple liquid-cooling modules included in the heat dissipation device are connected by connectors to form an integral structure. This integral structure is located on top of the opening and covers it.

[0019] In one specific technical solution, the heat dissipation device includes multiple liquid cooling modules, the substrates and connectors of which are connected to form a first cover plate. The first cover plate is located at the top of the opening and covers the opening. The area of ​​the first cover plate projected onto the plane of the opening is greater than or equal to the area of ​​the opening. After the first cover plate covers the opening, it can completely seal the opening. The flow channel is located on the side of the first cover plate away from the heat-generating element, and the first cover plate does not have any holes communicating with the inner cavity of the first housing. When coolant leaks, the first cover plate can form a barrier between the coolant and the heat-generating element, thereby preventing the coolant from flowing into the interior of the first housing, thus reducing the risk of short circuit in the heat-generating element and improving the reliability of electronic components and the vehicle.

[0020] To further reduce the risk of coolant entering the first housing, one optional technical solution involves a first cover plate having an extension portion. The orthographic projection of the extension portion onto the plane of the opening is located on the outer periphery of the orthographic projection of the first housing onto the plane of the opening. The extension portion forms an annular shape and extends beyond the exterior of the first housing. The extension portion has a predetermined width; optionally, the width can be 2mm, 2.5mm, 3mm, 3.5mm, 4mm, or other values, which are not listed here. That is, the outer contour of the extension portion and the sidewall of the first housing have a predetermined distance. When coolant flows to the edge of the extension portion, the coolant will drip onto the exterior of the first housing, thereby reducing the risk of coolant flowing into the first housing. Another optional technical solution involves a sealing element between the first cover plate and the first housing. The sealing element can seal the gap between the first cover plate and the first housing, preventing coolant from leaking into the interior of the first housing through the gap. In specific implementations, one or both of the above technical solutions can be used, or both can be used simultaneously.

[0021] In one optional technical solution, a flexible member is provided between the substrate covering the edge of the opening and the first housing. The flexible member has elastic deformation capability, which allows the substrate to float relative to the first housing by a certain amount, thereby enabling the height of the corresponding liquid cooling module from the surface of the first circuit board to match the thickness of the heating element, and thus generating a moderate compression between the liquid cooling module and the heating element.

[0022] In one optional technical solution for installing the liquid cooling module, the electronic components further include a first circuit board located within a first housing. The heating element is electrically connected to the first circuit board, and the liquid cooling module is fixed to the first circuit board by a first fastener. During installation, the height of each liquid cooling module from the surface of the first circuit board can be adjusted according to the thickness of the heating element, thereby maintaining appropriate compression between each liquid cooling module and the heating element. Furthermore, during installation, the connector can deform to accommodate the height difference between adjacent liquid cooling modules.

[0023] In the specific installation of the first fixing component, the first fixing component includes a screw and a spring. The screw connects the liquid cooling module and the first circuit board, with the screw head located on the side of the first circuit board facing away from the liquid cooling module. The spring is sleeved on the screw, with one end of the spring abutting against the screw head and the other end abutting against the first circuit board. When the length of the spring changes, the distance between the liquid cooling module and the surface of the first circuit board also changes, thus causing the liquid cooling module to float. During installation, the connector can deform accordingly with the floating of the liquid cooling module. Ultimately, each liquid cooling module and the first circuit board have a suitable distance, thereby maintaining appropriate compression between them and the corresponding heat-generating elements.

[0024] To reduce the risk of deformation of the first circuit board, one optional technical solution includes a first reinforcing plate on the side of the first circuit board facing away from the heating element. When fixing the liquid cooling module, one end of the first fixing member is connected to the liquid cooling module, and the other end of the first fixing member passes through the first circuit board and connects to the first reinforcing plate. The first reinforcing plate is made of a relatively rigid material, which can provide support on the side of the first circuit board facing away from the liquid cooling module, preventing the first circuit board from denting towards the bottom of the first housing, thereby reducing the risk of deformation of the first circuit board and ensuring a reliable connection between the first circuit board and the heating element.

[0025] In addition to the heat dissipation device described in the first aspect and the electronic components described in the second aspect, this application also provides another heat dissipation device and a corresponding electronic component, which will be described in detail below.

[0026] Thirdly, this application also provides another heat dissipation device. This heat dissipation device includes a heat sink and a guide pipe, wherein the heat sink is used for thermally conductive connection with a heat-generating element, and the guide pipe is used for conveying coolant. The guide pipe includes a first portion, the orthographic projection of which onto the plane of the heat sink is at least partially located within the heat sink, and the first portion is thermally connected to the heat sink.

[0027] In the aforementioned heat dissipation device, the guide pipe is a single, continuous pipe, rather than a combination of multiple pipe sections joined together by welding, threaded connections, or flange connections. When the coolant flows along the guide pipe, the absence of internal seams reduces the risk of coolant leakage, thereby lowering the risk of short circuits in the circuit board and heat-generating components, and ultimately improving the reliability of electronic components and the vehicle.

[0028] To improve the heat exchange efficiency between the coolant and the heat sink, one optional technical solution involves extending the first portion along a curve. Optionally, the first portion can extend along a serpentine curve or a U-shaped curve. In the above technical solution, by extending the first portion along a curve, the length of the first portion is increased, and the surface area of ​​the first portion is enlarged, thereby creating a larger heat exchange area between the first portion and the heat sink, thus improving the heat exchange efficiency between the coolant and the heat sink.

[0029] In another alternative technical solution, the guide tube further includes a second part located outside the heat sink. The first part and the aforementioned second part are different sections of the same guide tube, and the cross-sectional area of ​​the first part is larger than that of the second part. In the above technical solution, compared to the second part of the guide tube located outside the heat sink, by increasing the cross-sectional area of ​​the first part, the surface area of ​​the first part is correspondingly increased, thereby increasing the heat exchange area between the first part and the heat sink, and thus improving the heat exchange effect between the coolant and the heat sink.

[0030] In one specific technical solution, the first part includes a first sub-part and a second sub-part, which are located between the inlet end and the outlet end of the first part. The first sub-part is closer to the inlet end, and the second sub-part is farther from the inlet end. Along the direction from the inlet end to the outlet end, the cross-sectional area of ​​the first sub-part gradually increases, and the cross-sectional area of ​​the second sub-part gradually decreases.

[0031] When specifically setting up the flow guide tube, the flow guide tube is flexible, allowing it to be bent. Optionally, the flow guide tube is a metal tube that is easy to bend, such as an aluminum tube.

[0032] In one optional technical solution for assembling the heat pipe and heat sink, the surface of the heat sink facing away from the heat-generating element has a first groove, and a first part is located within the first groove. On one hand, the first groove can increase the heat exchange area between the first part and the heat sink, improving heat exchange efficiency. On the other hand, the first groove can also limit the position of the first part, improving its fixation.

[0033] In one optional technical solution, the guide pipe includes multiple first parts, and the heat dissipation device includes multiple heat dissipation plates. The multiple first parts are arranged sequentially and connected along the extension direction of the guide pipe, or in other words, the multiple first parts are connected in series, wherein each first part is thermally connected to a heat dissipation plate.

[0034] Fourthly, this application also provides another electronic component. This electronic component includes a second housing, a heating element, and a heat dissipation device as described in any of the third aspects above. The heating element and the heat sink are located inside the second housing and are thermally connected. The guide pipe has a first inlet and a first outlet, which are located outside the second housing. That is, the connection between the guide pipe and the external pipeline is located outside the second housing. Thus, even if coolant leaks at the connection between the guide pipe and the external pipeline, the leaked coolant has a minimal impact on the heating element inside the second housing, thereby further reducing the risk of short circuits in the circuit board and the heating element, and improving the reliability of the electronic component and the vehicle.

[0035] To further improve the heat dissipation of the heating element, one optional technical solution includes a second thermally conductive protrusion on the inner wall of the second housing, which is thermally connected to the heat sink. Thus, the heating element includes two heat dissipation paths: one path is heating element-heat sink-coolant, and the other is heating element-heat sink-second thermally conductive protrusion-second housing. The heat generated by the heating element can be conducted outward through these two heat dissipation paths, thereby improving the heat dissipation effect of the heating element.

[0036] In one specific technical solution, the surface of the second housing opposite to the second heat-conducting protrusion has multiple heat dissipation fins, which are arranged at intervals. The heat dissipation fins can increase the surface area of ​​the second housing, thereby increasing the heat exchange area between the second housing and the external environment, and thus improving the heat dissipation effect of the heat-generating element.

[0037] In one optional technical solution for the specific design of the second housing, the second housing includes a middle frame, a rear housing, and a cover plate. The middle frame is located between the rear housing and the cover plate, and the middle frame and the rear housing form a first receiving cavity, while the middle frame and the cover plate form a second receiving cavity. The middle frame can be used to fix some electronic components, and the rear housing and the cover plate serve to provide waterproofing and dustproofing on both sides of the middle frame.

[0038] When the heating element and the heat sink are arranged in the second housing, the heating element is located in the first receiving cavity, and the first receiving cavity is also provided with a second circuit board, to which the heating element is electrically connected. The middle frame has a hollow structure, the heat sink is located within the hollow structure, and the heat sink is connected to the second circuit board via a second fastener.

[0039] When specifically setting the second fixing member, the second fixing member includes a second screw and a second spring.

[0040] To enhance the structural strength of the second circuit board, a second reinforcing plate is provided on the side of the second circuit board away from the heat-generating element. The second reinforcing plate is made of a harder material, which strengthens the structural strength of the second circuit board and improves its support for the heat sink. Simultaneously, the second reinforcing plate reduces the risk of deformation of the second circuit board, ensuring the reliable connection between the second circuit board and the heat-generating element.

[0041] In one optional technical solution, the electronic component further includes a first electronic element fixed to the middle frame. This first electronic element also generates heat during operation. Since the first electronic element is fixed to the middle frame, the heat generated by it can be conducted to the middle frame and dissipated outwards through it. To improve the heat dissipation of the first electronic element, a third thermally conductive protrusion is provided on the surface of the cover plate facing the middle frame, and this protrusion is thermally connected to the middle frame. The third thermally conductive protrusion can conduct the heat generated by the first electronic element to the cover plate, which then exchanges heat with the external environment, thereby achieving the effect of heat dissipation for the electronic element.

[0042] In one optional technical solution, when arranging the guide pipe within the second housing, the guide pipe further includes a third part located outside the heat sink and thermally connected to the second housing. The coolant can exchange heat with the second housing as it flows through the third part. For example, the third part can be thermally connected to the middle frame of the second housing. In one application scenario, where the coolant temperature is low, the coolant exchanges heat with the middle frame as it flows through the third part, lowering the temperature of the middle frame. The middle frame then exchanges heat with the first electronic component, thereby achieving heat dissipation for the first electronic component.

[0043] In another alternative technical solution, the heat pipe further includes a fourth part, located outside the heat sink, adjacent to and connected to the first part, and suspended within the second housing. Compared to the third part, the fourth part is not fitted into the second groove on the surface of the second housing, nor is it adhered to the surface of the second housing by thermally conductive adhesive or fixed to the second housing by other fasteners. In scenarios where the heat pipe is flexible, the aforementioned fourth part can be bent without being restricted by the second housing. This allows the heat sink to be adjusted to an appropriate position during the installation of the heat dissipation device, ensuring close contact between the heat sink and the heating element to improve heat conduction efficiency without excessively compressing and damaging the heating element.

[0044] Fifthly, this application also provides an in-vehicle intelligent module. This in-vehicle intelligent module includes a housing and electronic components as described in any of the technical solutions of the second aspect or the fourth aspect, wherein the electronic components are located within the housing. The electronic components include two different heat dissipation devices. One heat dissipation device fills the gap between two adjacent liquid-cooled modules through a connector, thereby preventing the risk of coolant leakage from the gap to the surface of the heat-generating element, achieving water-electricity separation, ensuring the normal operation of the heat-generating element, and improving the reliability of the electronic components and the vehicle. The other heat dissipation device uses a heat sink and a continuous guide pipe, reducing defects such as gaps in the heat dissipation device, thereby reducing the risk of coolant leakage and achieving the same effect.

[0045] Sixthly, this application also provides a vehicle. The vehicle includes a frame and the on-board intelligent module described in the fifth aspect above, with the on-board intelligent module located within the frame. The on-board intelligent module can employ two different heat dissipation devices to cool the heat-generating elements. These two heat dissipation devices can reduce the flow of coolant to the side where the heat-generating elements are located, thereby reducing the risk of short circuits in the heat-generating elements and improving the reliability of the vehicle. Attached Figure Description

[0046] Figure 1 is a structural schematic diagram of a vehicle provided in an embodiment of this application;

[0047] Figure 2 is a structural schematic diagram of an in-vehicle intelligent module provided in an embodiment of this application;

[0048] Figure 3 is a schematic diagram of an electronic component provided in an embodiment of this application;

[0049] Figure 4 is a schematic diagram of an arrangement of the liquid cooling module provided in an embodiment of this application;

[0050] Figure 5 is a schematic diagram of another arrangement of the liquid cooling module provided in an embodiment of this application;

[0051] Figure 6 is a schematic diagram of a heat dissipation device provided in an embodiment of this application;

[0052] Figure 7 is a schematic diagram of another structure of the heat dissipation device provided in an embodiment of this application;

[0053] Figure 8 is a schematic diagram of another structure of the heat dissipation device provided in an embodiment of this application;

[0054] Figure 9 is a schematic diagram of another structure of the heat dissipation device provided in an embodiment of this application;

[0055] Figure 10 is a schematic diagram of a connector provided in an embodiment of this application;

[0056] Figure 11 is a schematic diagram of another structure of the connector provided in an embodiment of this application;

[0057] Figure 12 is a schematic diagram of an application of the connector provided in an embodiment of this application;

[0058] Figure 13 is a schematic diagram of another structure of the electronic component provided in an embodiment of this application;

[0059] Figure 14 is a schematic diagram of another structure of the electronic component provided in an embodiment of this application;

[0060] Figure 15 is a schematic diagram of another structure of the electronic component provided in an embodiment of this application;

[0061] Figure 16 is a schematic diagram of another structure of the heat dissipation device provided in an embodiment of this application;

[0062] Figure 17 is a schematic diagram of an assembly of the heat dissipation device and the heat-generating element provided in an embodiment of this application;

[0063] Figure 18 is a schematic diagram of another structure of the heat dissipation device provided in an embodiment of this application;

[0064] Figure 19 is a schematic diagram of another structure of the electronic component provided in an embodiment of this application;

[0065] Figure 20 is a schematic diagram of another structure of the electronic component provided in an embodiment of this application;

[0066] Figure 21 is a schematic diagram of another structure of the electronic component provided in an embodiment of this application;

[0067] Figure 22 is a schematic diagram of one arrangement of the guide tube provided in an embodiment of this application;

[0068] Figure 23 is a schematic diagram of another arrangement of the guide tube provided in the embodiment of this application;

[0069] Figure 24 is a schematic diagram of an application of the guide tube provided in an embodiment of this application.

[0070] Reference numerals: 1-Vehicle intelligent module; 2-Frame; 3-Electronic component; 4-Housing shell; 5-Heating element; 6-Heat dissipation device; 7-Liquid cooling module; 7a-First liquid cooling module; 7b-Second liquid cooling module; 701-Flow channel; 71-Substrate; 7101-First surface; 72-Top cover; 73-First fin; 74-First thermally conductive protrusion; 8-Connecting pipe; 9a-Inlet main pipe; 9b-Outlet main pipe; 10a-Inlet branch pipe; 10b-Outlet branch pipe; 11-Connector; 1101-First side; 1102-Second side; 1103-First protrusion; 1104-Second protrusion; 12-First circuit board; 13-First housing; 14-First cover plate; 1401-Extension; 15-Seal; 16-Flexible component; 17-First fixing component; 18-Reinforcing plate; 19-Heat dissipation plate; 20-Heat pipe; 2001-Liquid inlet; 2002-Liquid outlet; 201-First part; 2011-First sub-part; 2012-Second sub-part; 2013-Middle part; 202-Second part; 203-Third part; 204-Fourth part; 21-Second shell; 211-Middle frame; 212-Rear shell; 213-Second cover plate; 22-Second thermally conductive protrusion; 23-Second fin; 24-First electronic component; 25-Third thermally conductive protrusion; 26-Second circuit board; 27-Second reinforcing plate; 28-Second fixing component; 29-Thermal conductive adhesive. Detailed Implementation

[0071] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are for illustrating relative positional relationships only and do not represent actual scale.

[0072] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0073] To facilitate understanding of the technical solutions provided in the embodiments of this application, the application scenarios are first introduced below. With the gradual maturation of autonomous driving technology, public acceptance of autonomous driving is increasing, thus prompting its rapid development towards higher levels. The rapid development of autonomous driving relies heavily on the improvement of chip computing power, which generates a significant amount of heat during operation. If this heat cannot be dissipated in time, the chip may operate in a high-temperature environment, affecting its stable operation and lifespan.

[0074] To dissipate heat from the chip, one existing technology involves a cold plate installed inside the vehicle, connected to the chip via a thermally conductive material. The cold plate has an inlet, an outlet, and a liquid cooling channel connecting the inlet and outlet. An inlet pipe and an outlet pipe are also externally located on the cold plate, connected to the inlet and outlet respectively. Low-temperature coolant enters the cold plate through the inlet pipe and flows along the liquid cooling channel. During this flow, the coolant exchanges heat with the chip, thus dissipating heat. After heat exchange, the coolant's temperature rises and it is discharged through the outlet pipe. During use, the coolant is prone to leakage at the connections between the inlet pipe and the cold plate, and at the connections between the outlet pipe and the cold plate. Structurally, the cold plate includes a substrate and a cover plate, which are welded together to form the liquid cooling channel. As the coolant flows through the liquid cooling channels, it passes over the weld between the substrate and the cover plate, and leaks may occur at the weld. If coolant leaks and flows onto the surface of the circuit board carrying the chip, it will cause a short circuit, affecting the normal operation of the chip, causing malfunctions during vehicle operation, and potentially leading to a safety accident.

[0075] In view of this, embodiments of this application provide a heat dissipation device, an electronic component, and a vehicle, which reduce the risk of coolant leakage to the circuit board during chip cooling and improve the reliability of the electronic component and the vehicle. The structure of the heat dissipation device and its specific arrangement in the electronic component and vehicle will be described in detail below with reference to the accompanying drawings to facilitate understanding of the process by which the heat dissipation device cools the chip.

[0076] Figure 1 is a structural schematic diagram of a vehicle provided in an embodiment of this application. As shown in Figure 1, in one embodiment, the vehicle includes an onboard intelligent module 1 and a frame 2, with the onboard intelligent module 1 located within the frame 2. The onboard intelligent module 1 can be of various types. For example, it can be an onboard autonomous driving module. Alternatively, it can be an onboard entertainment module. Different types of onboard intelligent modules 1 have corresponding functions. Taking an onboard autonomous driving module as an example, this module enables the vehicle to drive autonomously.

[0077] Figure 2 is a schematic diagram of a vehicle-mounted intelligent module provided in an embodiment of this application. As shown in Figure 2, in one embodiment, the vehicle-mounted intelligent module 1 includes an electronic component 3 and a housing 4, with the electronic component 3 located inside the housing 4. The electronic component 3 includes at least one electronic element, which, when operating, can realize the functions of the vehicle-mounted intelligent module 1 and improve the driving experience of the vehicle.

[0078] Figure 3 is a schematic diagram of an electronic component provided in an embodiment of this application. As shown in Figure 3, in one embodiment, the electronic component 3 includes multiple heating elements 5. The heating elements 5 can be chips or other electronic components. In addition to the heating elements 5, the electronic component 3 also includes a heat dissipation device 6. The heat dissipation device 6 includes multiple liquid cooling modules 7, each liquid cooling module 7 being thermally connected to at least one heating element 5. The multiple liquid cooling modules 7 are arranged at intervals, and each liquid cooling module 7 has a flow channel 701 for circulating coolant. During the flow of coolant within the flow channel 701, heat exchange occurs between the coolant and the heating elements 5, reducing the temperature of the heating elements 5 and thus achieving the purpose of heat dissipation for the heating elements 5.

[0079] There are various arrangement methods for the above-mentioned multiple liquid cooling modules 7. Figure 4 is a schematic diagram of one arrangement of the liquid cooling modules provided in an embodiment of this application. As shown in Figure 4, in one embodiment, the flow channels 701 of the multiple liquid cooling modules 7 included in the heat dissipation device 6 are connected sequentially through connecting pipes 8. Alternatively, the above-mentioned multiple liquid cooling modules 7 are connected in series through connecting pipes 8. During the heat dissipation process, the coolant flows sequentially through the above-mentioned multiple liquid cooling modules 7.

[0080] Figure 5 is a schematic diagram of another arrangement of the liquid cooling module provided in an embodiment of this application. As shown in Figure 5, in another embodiment, in addition to the liquid cooling module 7, the heat dissipation device 6 also includes a liquid inlet main pipe 9a, a liquid outlet main pipe 9b, multiple liquid inlet branch pipes 10a, and multiple liquid outlet branch pipes 10b. The flow channels 701 of the multiple liquid cooling modules 7 included in the heat dissipation device 6 are connected to the liquid inlet main pipe 9a through different liquid inlet branch pipes 10a, and the flow channels 701 of the multiple liquid cooling modules 7 are connected to the liquid outlet main pipe 9b through different liquid outlet branch pipes 10b. Alternatively, the multiple liquid cooling modules 7 are connected in parallel between the liquid inlet main pipe 9a and the liquid outlet main pipe 9b. During the heat dissipation process, the coolant in the liquid inlet main pipe 9a is divided into multiple branches, which enter the corresponding liquid cooling modules 7 to dissipate heat from the heat-generating element 5 individually. In a specific embodiment, the number of liquid cooling modules 7 is the same as the number of liquid inlet branch pipes 10a, and the number of liquid cooling modules 7 is also the same as the number of liquid outlet branch pipes 10b.

[0081] Referring to Figures 3, 4, and 5, in some embodiments, among the multiple liquid cooling modules 7 included in the heat dissipation device 6, a connector 11 is provided between two adjacent liquid cooling modules 7. The connector 11 is connected to the side of the liquid cooling module 7 facing the heating element 5, and the connector 11 covers the gap between the two adjacent liquid cooling modules 7. In terms of material, the connector 11 is waterproof, and when there is coolant on the surface of the connector 11, the coolant does not easily pass through the connector 11. Optionally, the coolant can be water or other liquids. In terms of structure, the connector 11 has no holes and is relatively dense, thereby playing a role in blocking the coolant. The connector 11 extends along the gap between two adjacent liquid cooling modules 7, and the length of the connector 11 is greater than or equal to the length of the gap, and the width of the connector 11 is greater than or equal to the width of the gap. If the stacking direction of the liquid cooling module 7 and the heating element 5 is defined as the second direction Y, then the orthographic projection of the connector 11 along the second direction Y completely covers the orthographic projection of the gap along the second direction Y. The two sides of the connector 11 are respectively connected to the side of the adjacent liquid cooling module 7 facing the heating element 5, thereby connecting the two adjacent liquid cooling modules 7 into a whole. When the coolant leaks, the connector 11 can prevent the coolant from flowing to the side where the heating element 5 is located through the above gap, thereby reducing the risk of short circuit of the heating element 5 and improving the reliability of the electronic components 3 and the vehicle.

[0082] Figure 6 is a schematic diagram of a heat dissipation device provided in an embodiment of this application. As shown in Figure 6, in one embodiment, the liquid cooling module 7 includes a substrate 71, which is used for thermally conductive connection with the heating element 5, and the flow channel 701 of the liquid cooling module 7 is located on the side of the substrate 71 away from the heating element 5. After coolant is introduced into the liquid cooling module 7, the coolant flows along the flow channel 701 across the surface of the substrate 71 and exchanges heat with the heating element 5 through the substrate 71. For two adjacent liquid cooling modules 7, the two substrates 71 are also adjacent. Optionally, the orthographic projection of the liquid cooling module 7 along the second direction Y and the orthographic projection of the substrate 71 along the second direction Y completely coincide, and the gap between two adjacent liquid cooling modules 7 is the gap between the two substrates 71. In one embodiment, the connector 11 is located between two adjacent substrates 71, and the connector 11 is directly connected to the two adjacent substrates 71 respectively. In specific implementation of the above embodiments, the connector 11 can be directly connected to the edges of the two adjacent substrates 71 respectively. The substrates 71 of the multiple liquid cooling modules 7 included in the heat dissipation device 6 are connected by the connector 11 to form an integral substrate. The flow channel 701 is located on the side of the integral substrate away from the heat-generating element 5. The integral substrate can form a barrier between the coolant and the heat-generating element 5, thereby preventing the coolant from flowing to the side where the heat-generating element 5 is located, thereby reducing the risk of short circuit of the heat-generating element 5 and improving the reliability of the electronic components 3 and the vehicle.

[0083] In one specific embodiment, the electronic component 3 further includes a first circuit board, to which the heating element 5 is electrically connected. The orthographic projection of the overall substrate along the second direction Y is greater than that of the first circuit board along the second direction Y, thereby making it less likely for coolant flowing down from the edge of the overall substrate to drip onto the surface of the first circuit board. This reduces the risk of coolant dripping onto the surface of the first circuit board, ensuring the normal operation of the heating element 5 and improving the reliability of the electronic component 3 and the vehicle.

[0084] There are various methods for forming the flow channel 701 of the liquid cooling module 7. As shown in FIG6, in one embodiment, in addition to the substrate 71, the liquid cooling module 7 also includes a top cover 72. The top cover 72 is located on the side of the substrate 71 away from the heating element 5. The top cover 72 and the substrate 71 are fastened together to form the flow channel 701. In a specific implementation of the above embodiment, the top cover 72 protrudes towards the side away from the substrate 71, thereby forming a bulge with a cavity. After the top cover 72 and the substrate 71 are fastened together, the bulge and the substrate 71 form the flow channel 701. The surface of the bulge has a liquid inlet and a liquid outlet, which are respectively connected to the flow channel 701. In a specific embodiment, the area of ​​the substrate 71 projected along the second direction Y is larger than the area of ​​the top cover 72 projected along the second direction Y. By increasing the area of ​​substrate 71, the horizontal distance between the edge of substrate 71 and heating element 5 can be increased, thereby reducing the adverse effects of coolant flowing from the edge of substrate 71 on heating element 5 and ensuring the stable operation of heating element 5.

[0085] In another embodiment, in addition to the substrate 71, the liquid cooling module 7 also includes a metal tube, at least a portion of which is located on the surface of the substrate 71, and the internal channels of the metal tube form the aforementioned flow channel 701. For ease of processing, the metal tube can be formed by combining multiple pipe segments, and adjacent pipe segments can be welded, threaded, or connected by flanges.

[0086] Of course, in addition to the two methods mentioned above, other methods can also be used to form the flow channel 701 of the liquid cooling module 7, which will not be listed in this application.

[0087] Referring to Figure 6, to improve the heat exchange efficiency between the substrate 71 and the coolant, in one embodiment, the surface of the substrate 71 has a plurality of first fins 73, which are spaced apart within the flow channel 701. The first fins 73 increase the surface area of ​​the substrate 71, thereby increasing the heat exchange area between the substrate 71 and the coolant, and thus improving the heat exchange efficiency between the substrate 71 and the coolant. Besides providing first fins 73 on the surface of the substrate 71, a plurality of protrusions can also be provided on the surface of the substrate 71 to achieve the above-mentioned effect.

[0088] Figure 7 is a schematic diagram of another structure of the heat dissipation device provided in an embodiment of this application. As shown in Figure 7, in one embodiment, the substrate 71 has a first surface 7101, which is away from the heating element 5. The first surface 7101 is located between a first end and a second end of the substrate 71, wherein the first end is close to the connector 11 and the second end is away from the connector 11. From the first end to the second end, the distance from the first surface 7101 to the plane where the heating element 5 is located gradually decreases. Or, in other words, along the direction away from the connector 11, the distance from the first surface 7101 to the plane where the heating element 5 is located gradually decreases. That is, the first surface 7101 is inclined. When coolant leaks and flows to the first surface 7101, the coolant will flow along the first surface 7101 from the first end to the second end, thereby moving away from the connector 11, thus reducing the accumulation of coolant at the connector 11 and facilitating the discharge of leaked coolant.

[0089] In one specific embodiment, the heat dissipation device 6 includes a first liquid cooling module 7a and a second liquid cooling module 7b, which are adjacent to each other and each includes the aforementioned substrate 71. When coolant leaks from any of the liquid cooling modules 7 and flows to the first surface 7101 of the corresponding substrate 71, the coolant flows from the first end to the second end and eventually slides off from the second end, thereby reducing coolant accumulation at the connector 11. Optionally, a liquid collection tank is provided at the second end of the substrate 71. The liquid collection tank can collect the coolant and discharge it along a set flow path, thereby preventing coolant sliding off the edge of the substrate 71 from flowing around.

[0090] In order to achieve the above-mentioned tilting effect of the first surface 7101, as shown in FIG7, in one embodiment, the thickness of the substrate 71 is basically uniform. During installation, the substrate 71 is tilted slightly as a whole, so that the first surface 7101 is also tilted accordingly, and the distance from the first surface 7101 to the plane where the heating element 5 is located gradually decreases in the direction away from the connector 11.

[0091] Besides the method shown in Figure 7, which gives the first surface 7101 the aforementioned tilted effect, other methods are also included. Figure 8 is a schematic diagram of another structure of the heat dissipation device provided in an embodiment of this application. As shown in Figure 8, in another embodiment, the thickness of the substrate 71 gradually decreases along the direction away from the connector 11. Or, the thickness of the substrate 71 gradually decreases from the first end to the second end. During installation, the side of the substrate 71 facing the heat-generating element 5 is kept horizontal, thereby tilting the first surface 7101 and causing the distance from the first surface 7101 to the plane where the heat-generating element 5 is located to gradually decrease along the direction away from the connector 11.

[0092] In the specific fabrication of substrate 71, substrate 71 can be made of metal or alloy materials, thereby giving substrate 71 good thermal conductivity. The thickness of substrate 71 can be relatively thin to reduce production costs. Optionally, substrate 71 is a sheet metal part. During the process of heat generated by heating element 5 being conducted to coolant through substrate 71, due to the thinness of substrate 71, the heat conduction channels to the surroundings are narrow, resulting in a slower heat conduction speed and higher local temperatures on substrate 71. When coolant flows over the surface of substrate 71, some areas where coolant flows are at higher temperatures, while some areas are at lower temperatures, thus affecting the heat exchange effect between coolant and substrate 71.

[0093] To improve the above-mentioned phenomenon, this application provides another heat dissipation device 6. Figure 9 is a schematic diagram of the structure of this heat dissipation device. As shown in Figure 9, in one embodiment, a first thermally conductive protrusion 74 is provided on the surface of the substrate 71 facing the heating element 5. The thermal conductivity of the first thermally conductive protrusion 74 is greater than or equal to the thermal conductivity of the substrate 71. The first thermally conductive protrusion 74 is used for thermally conductive connection with the heating element 5. The first thermally conductive protrusion 74 widens the heat conduction channel, so that heat can be conducted more quickly in the plane perpendicular to the thickness direction of the substrate 71 to the surrounding area and to a larger area, thereby expanding the heat distribution range and improving the uniformity of heat distribution. In this way, when the coolant flows through different areas of the surface of the substrate 71, the coolant can absorb more heat per unit time, thereby improving the heat exchange effect between the coolant and the substrate 71, and thus improving the cooling effect of the heating element 5.

[0094] When specifically configuring the first thermally conductive protrusion 74, the orthographic projection of the first thermally conductive protrusion 74 onto the plane of the substrate 71 is greater than or equal to the orthographic projection of the heating element 5 onto the plane of the substrate 71. This provides a larger contact area between the first thermally conductive protrusion 74 and the heating element 5, thereby facilitating further expansion of the heat conduction range and improving the heat exchange effect between the substrate 71 and the coolant. The first thermally conductive protrusion 74 can be an integral structure with the substrate 71, or it can be welded or bonded to the substrate 71. The first thermally conductive protrusion 74 can have various structural forms; for example, it can be a cylindrical structure, a prismatic structure, or an irregularly shaped structure.

[0095] When connecting the substrate 71 and the connector 11, the substrate 71 and the connector 11 can be welded, bonded, or formed as a single unit. In one embodiment, the substrate 71 and the connector 11 are formed as a single unit. That is, the substrate 71 of multiple liquid cooling modules 7 is formed as a single unit. Or, multiple liquid cooling modules 7 share a single substrate 71. This reduces the gaps between the substrate 71 and the connector 11, improves the sealing effect, and further reduces the risk of coolant flowing to the side where the heat-generating element 5 is located.

[0096] Figure 10 is a schematic diagram of a connector provided in an embodiment of this application. As shown in Figure 10, in one embodiment, the connector 11 has a first side 1101 and a second side 1102 arranged along a first direction X, with the first side 1101 and the second side 1102 facing each other. The first side 1101 is connected to an adjacent liquid cooling module 7, and the second side 1102 is connected to another adjacent liquid cooling module 7. The connector 11 has elastic deformation capability along the first direction X. The connector 11 can extend outward, thereby increasing the distance between the first side 1101 and the second side 1102; the connector 11 can also contract inward, thereby reducing the distance between the first side 1101 and the second side 1102. The connector 11 can connect two liquid cooling modules 7 with different spacings through deformation, exhibiting strong adaptability.

[0097] In specific configurations of the connector 11, the connector 11 can have various structural forms. As shown in FIG10, in one embodiment, the connector 11 includes a first protrusion 1103, which has two first wall surfaces arranged opposite to each other along the thickness direction of the connector 11. Both of these first wall surfaces protrude in a direction away from the heating element 5. From an external perspective, the first protrusion 1103 forms a first cavity on the side facing the heating element 5. FIG11 is a schematic diagram of another structure of the connector provided in an embodiment of this application. As shown in FIG11, in one embodiment, the connector 11 includes a second protrusion 1104, which has two second wall surfaces arranged opposite to each other along the thickness direction of the connector 11. Both of these second wall surfaces protrude in a direction close to the heating element 5. From an external perspective, the second protrusion 1104 forms a second cavity on the side away from the heating element 5. The connector 11 may include only the second protrusion 1104, or it may include both the first protrusion 1103 and the second protrusion 1104, thus exhibiting a serrated or wavy shape. In the above embodiments, the first protrusion 1103 and / or the second protrusion 1104 both constitute folds in the connector 11. Under compression, tension, or other actions, both the first protrusion 1103 and the second protrusion 1104 can deform, thereby changing the dimensions of the connector 11. For example, under compression, the first protrusion 1103 and the second protrusion 1104 can bulge higher, thus narrowing the connector 11, or in other words, reducing the size of the connector 11 along the first direction X. Under tension, the first protrusion 1103 and the second protrusion 1104 will extend to both sides and gradually become flatter, thus widening the connector 11, or in other words, increasing the size of the connector 11 along the first direction X.

[0098] It is worth noting that, as shown in Figure 10, in this embodiment, the connector 11 includes a first protrusion 1103. The connector 11 has a relatively simple structure, is easy to process, and has low production costs. In addition, the surface of the connector 11 facing away from the heating element 5 is arched, without any recessed areas, which prevents coolant from accumulating in the aforementioned recessed areas. This facilitates the flow of coolant away from the connector 11, thereby allowing the coolant to be discharged or recovered.

[0099] In the specific fabrication of the connector 11, the connector 11 can be made flexible due to the special design of the material, thereby possessing elastic deformation capability. For example, the connector 11 is a component made of a flexible material. Optionally, the flexible material can be rubber. The connector 11 is soft in texture, and in specific applications, the connector 11 can be in an extended state or a wrinkled state. The connector 11 can also be made flexible due to the special design of its structure, thereby allowing it to deform. For example, the connector 11 is in the shape of a thin plate and has wrinkles. Under the action of external force, the connector 11 can be further compressed or extended outward. Optionally, the connector 11 can be formed by bending.

[0100] Figure 12 is a schematic diagram of an application of the connector provided in an embodiment of this application. As shown in Figure 12, in one embodiment, the electronic component 3 includes a first circuit board 12 and a plurality of heating elements 5, which are disposed on the same side of the first circuit board 12. The liquid cooling module 7 and the heating elements 5 are stacked along the second direction Y, and the liquid cooling module 7 is thermally connected to the heating elements 5 through a thermally conductive material. The second direction Y is perpendicular to the plane where the first circuit board 12 is located. Due to manufacturing tolerances, the thickness of the plurality of heating elements 5 is different. Taking the plane where the first circuit board 12 is located as the reference plane, when the liquid cooling modules 7 corresponding to the plurality of heating elements 5 are all at the same height, there may be excessive compression between some liquid cooling modules 7 and heating elements 5, which may cause the heating elements 5 to be damaged; there may also be insufficient compression between some liquid cooling modules 7 and heating elements 5, which may result in a thicker thermally conductive material between them, affecting the heat conduction effect. Therefore, when installing the liquid cooling module 7, the height of the liquid cooling module 7 from the plane of the first circuit board 12 should be matched with the thickness of the heating element 5, so that each liquid cooling module 7 can maintain close contact with the heating element 5 without causing excessive compression to the heating element 5 and damaging it.

[0101] In specific implementation, for two adjacent liquid cooling modules 7, the connector 11 can adjust the height of these two liquid cooling modules 7 from the plane of the first circuit board 12 by deformation. This ensures that the height of the liquid cooling module 7 from the plane of the first circuit board 12 is adapted to the thickness of the heating element 5, thereby allowing each liquid cooling module 7 to maintain appropriate compression with the corresponding heating element 5. In other words, the connector 11, through deformation, can maintain close contact between the liquid cooling module 7 and the heating element 5, thereby improving heat conduction efficiency, without causing excessive compression of the heating element 5 by the liquid cooling module 7 and damaging the heating element 5.

[0102] The electronic component 3 employing the aforementioned heat dissipation device 6 includes various structural forms, with the electronic component shown in Figure 3 being one example. Besides the structural form shown in Figure 3, the electronic component 3 also includes other structural forms. Figure 13 is a schematic diagram of another structure of the electronic component provided in an embodiment of this application. As shown in Figure 13, in one embodiment, the electronic component 3 further includes a first housing 13, with the heating element 5 located inside the first housing 13. The first housing 13 serves to protect the heating element 5 from external impacts. For example, the first housing 13 can reduce the adverse effects of dust and moisture in the external environment on the heating element 5; furthermore, the first housing 13 can also reduce damage to the heating element 5 under vibration, collision, and other scenarios. The first housing 13 has an opening, and the multiple liquid cooling modules 7 included in the heat dissipation device 6 are located at the top of the opening. Furthermore, the multiple liquid cooling modules 7, connected by the connector 11, form an integral structure that covers the opening. When coolant leaks, it is not easy for coolant to flow into the first housing 13 through the gap between two adjacent liquid cooling modules 7, nor is it easy for it to flow into the first housing 13 through the opening. This reduces the risk of coolant leaking into the first housing 13, ensures the normal operation of the heating element 5, and improves the reliability of the electronic components 3 and the vehicle.

[0103] Figure 14 is a schematic diagram of another structure of the electronic component provided in an embodiment of this application. As shown in Figure 14, in one embodiment, the substrate 71 of the plurality of liquid cooling modules 7 included in the heat dissipation device 6 forms a first cover plate 14 under the connection of the connector 11. The first cover plate 14 is located at the top of the opening and covers the opening. The area of ​​the first cover plate 14 projected onto the plane where the opening is located is greater than or equal to the area of ​​the opening. After the first cover plate 14 covers the opening, it can completely seal the opening. The flow channel 701 is located on the side of the first cover plate 14 away from the heat-generating element 5, and the first cover plate 14 does not have a hole communicating with the inner cavity of the first housing 13. When the coolant leaks, the first cover plate 14 can form a barrier between the coolant and the heat-generating element 5, thereby preventing the coolant from flowing into the interior of the first housing 13, thereby reducing the risk of short circuit of the heat-generating element 5 and improving the reliability of the electronic component 3 and the vehicle.

[0104] To further reduce the risk of coolant leakage into the first housing 13, as shown in Figure 14, in one embodiment, a seal 15 is provided between the first cover plate 14 and the first housing 13. The seal 15 can block the gap between the first cover plate 14 and the first housing 13, preventing coolant from leaking into the first housing 13 through this gap. The seal 15 can also prevent dust, moisture, and other external environmental contaminants from entering the first housing 13, thereby reducing the external impact on the heating element 5 and other electronic components inside the first housing 13. Specifically, the seal 15 can be a gasket, sealant, or foam.

[0105] In addition to using seal 15 to further reduce the risk of coolant leakage to the first housing 13, other methods are also included. Referring to Figure 14, in one embodiment, the first cover plate 14 has an extension 1401, which forms an annular shape and extends beyond the outside of the first housing 13. Alternatively, the orthographic projection of the extension 1401 onto the plane of the opening surrounds the outer periphery of the orthographic projection of the first housing 13 onto the plane of the opening. Considering the orthographic projections of the entire first cover plate 14 and the first housing 13 onto the plane of the opening, the area of ​​the orthographic projection of the entire first cover plate 14 onto the plane of the opening is larger than the area of ​​the orthographic projection of the first housing 13 onto the plane of the opening, and the orthographic projection of the entire first cover plate 14 onto the plane of the opening completely covers the orthographic projection of the first housing 13 onto the plane of the opening. That is, the circumferential edge of the orthographic projection of the entire first cover plate 14 onto the plane of the opening is located on the outer periphery of the circumferential edge of the orthographic projection of the first housing 13 onto the plane of the opening. In the above embodiment, when the coolant flows to the edge of the first cover plate 14, the coolant will drip onto the outside of the first housing 13, thereby reducing the risk of coolant flowing into the first housing 13.

[0106] Among the multiple liquid cooling modules 7 included in the heat dissipation device 6, the liquid cooling module 7 located at the edge is located above the side wall of the first housing 13. During installation, when adjusting the height of the liquid cooling module 7 from the surface of the first circuit board 12, the liquid cooling module 7 may be restricted by the first housing 13, thus preventing the liquid cooling module 7 from moving to the required height from the surface of the first circuit board 12, thereby affecting the heat exchange effect between the liquid cooling module 7 and the heat-generating element 5.

[0107] To improve the above-mentioned phenomenon, Figure 15 shows another structural schematic diagram of the electronic component. As shown in Figure 15, in one embodiment, a flexible member 16 is provided between the substrate 71 of the liquid cooling module 7 located at the edge and the first housing 13. When the flexible member 16 is further compressed, the liquid cooling module 7 can move closer to the first circuit board 12. When the flexible member 16 expands, the liquid cooling module 7 can move away from the first circuit board 12. In other words, the flexible member 16 can deform to allow the liquid cooling module 7 to have a certain amount of floating relative to the first housing 13, so that the height of the liquid cooling module 7 from the surface of the first circuit board 12 can be adapted to the thickness of the heating element 5, thereby creating a moderate compression between the liquid cooling module 7 and the heating element 5. That is to say, the liquid cooling module 7 can maintain close contact with the heating element 5, thereby improving the heat conduction efficiency, without causing excessive compression to the heating element 5 and damaging it.

[0108] In the specific fabrication of the flexible component 16, the flexible component 16 can be made of flexible foam or rubber. As for rubber, it not only gives the flexible component 16 flexibility but also a sealing effect.

[0109] As shown in Figure 15, in one embodiment, the liquid cooling module 7 is fixed to the first circuit board 12 by a first fixing member 17. During installation, the height of each liquid cooling module 7 from the plane of the first circuit board 12 can be matched with the thickness of the heating element 5, thus maintaining appropriate compression between each liquid cooling module 7 and the heating element 5. Furthermore, during installation, the connector 11 can deform to accommodate the height difference between adjacent liquid cooling modules 7.

[0110] In one embodiment, the first fixing member 17 includes a screw and a spring. The screw connects the liquid cooling module 7 and the first circuit board 12. The spring is sleeved on the outside of the screw, with one end pressing against the head of the screw and the other end pressing against the first circuit board 12. The longer the spring, the smaller the height of the liquid cooling module 7 from the plane of the first circuit board 12. Conversely, the shorter the spring, the greater the height of the liquid cooling module 7 from the plane of the first circuit board 12. Because the length of the spring is variable, the height of the liquid cooling module 7 from the plane of the first circuit board 12 is variable, thus allowing the liquid cooling module 7 to float. During installation, the connecting member 11 can deform accordingly with the floating of the liquid cooling module 7. Ultimately, each liquid cooling module 7 has a suitable height from the plane of the first circuit board 12, thereby maintaining appropriate compression between it and the corresponding heating element 5.

[0111] In one application scenario, the aforementioned electronic component 3 is used in a vehicle. When the vehicle experiences significant vibration, the liquid cooling module 7 will also frequently vibrate up and down. In this case, the connector 11 will deform along with the vibration of the liquid cooling module 7. However, in this scenario, the connector 11 can still prevent coolant from leaking into the first housing 13 through the gap between two adjacent liquid cooling modules 7, reducing the risk of coolant entering the first housing 13, ensuring the normal operation of the heating element 5, and thus maintaining high reliability for both the electronic component 3 and the vehicle.

[0112] Since the first circuit board 12 bears the weight of the liquid cooling module 7, it is prone to denting towards the bottom of the first housing 13. To mitigate this issue, as shown in Figure 15, in one embodiment, a first reinforcing plate 18 is provided on the side of the first circuit board 12 facing away from the heating element 5. When fixing the liquid cooling module 7, one end of the first fixing member 17 is connected to the liquid cooling module 7, and the other end of the first fixing member 17 passes through the first circuit board 12 and connects to the first reinforcing plate 18. The first reinforcing plate 18 is made of a relatively hard material, which can provide support on the side of the first circuit board 12 facing away from the liquid cooling module 7, preventing the first circuit board 12 from denting towards the bottom of the first housing 13, thereby reducing the risk of deformation of the first circuit board 12 and ensuring a reliable connection between the first circuit board 12 and the heating element 5.

[0113] Referring to Figure 15, in one embodiment, the liquid cooling module 7 includes a substrate 71, which is connected to a first circuit board 12 via a first fastener 17. Furthermore, a connecting boss is provided on the surface of the substrate 71 facing the first circuit board 12. A screw passes through the first circuit board 12 and is fixed to the connecting boss. The end of the screw is located within the connecting boss and does not protrude from the surface of the substrate 71. In other words, the screw does not damage the integrity of the substrate 71 surface and does not create holes on the surface of the substrate 71 that could lead to coolant leakage.

[0114] In the above embodiments, the heat dissipation device 6 fills the gap between two adjacent liquid cooling modules 7 through the connector 11, thereby preventing the risk of coolant leaking from the gap to the surface of the heat-generating element 5, ensuring the normal operation of the heat-generating element 5, and improving the reliability of the electronic components 3 and the vehicle. In addition, other methods can be used to achieve the above effects. For example, when setting up the heat dissipation device 6, the risk of coolant leakage can be reduced by minimizing defects such as gaps in the heat dissipation device 6, thereby achieving the above effects. Specific embodiments will be described in detail below.

[0115] Figure 16 is a schematic diagram of another structure of the heat dissipation device provided in an embodiment of this application, and Figure 17 is a schematic diagram of an assembly of the heat dissipation device and the heating element. As shown in Figures 16 and 17, in some embodiments, the heat dissipation device includes a heat sink 19 and a guide pipe 20. The heat sink 19 is used for thermally conductive connection with the heating element 5. In application, the heat sink 19 can be thermally connected to one heating element 5 or to multiple heating elements 5 simultaneously, depending on the actual situation. The guide pipe 20 is used to transport coolant, and at least a portion of the guide pipe 20 is thermally connected to the heat sink 19. During the flow of the coolant through the guide pipe 20, heat exchange occurs between the coolant and the heat sink 19 through the pipe wall of the guide pipe 20, and the heat sink 19 then exchanges heat with the heating element 5, thereby reducing the temperature of the heating element 5 and achieving the purpose of heat dissipation for the heating element 5.

[0116] In specific configurations, the heat sink 19 can have various structural forms. In one embodiment, the heat sink 19 is a single-layer plate-like structure, with the heat guide pipe 20 located on the surface of the heat sink 19 facing away from the heat-generating element 5. In another embodiment, the heat sink 19 includes a first substrate and a second substrate, which are stacked together. The heat guide pipe 20 is located between the first substrate and the second substrate and is thermally connected to both the first substrate and the second substrate. This application uses the heat sink 19 of the first embodiment described above as an example for specific illustration.

[0117] The number of heat sinks 19 can be one or more. In the scenario where there are multiple heat sinks 19, the multiple heat sinks 19 can share a single heat pipe 20, that is, the multiple heat sinks 19 are thermally connected to different parts of the same heat pipe 20. Alternatively, the multiple heat sinks 19 can also be thermally connected to different heat pipes 20.

[0118] In the specific fabrication of the heat sink 19, the heat sink 19 can be made of a metallic material with excellent thermal conductivity. Optionally, the metallic material can be copper or aluminum. Alternatively, the heat sink 19 can also be made of a non-metallic material with excellent thermal conductivity. Optionally, the non-metallic material can be ceramic.

[0119] In the specific thermally conductive connection between the heat sink 19 and the heating element 5, there are multiple connection methods. In one connection method, the heat sink 19 and the heating element 5 are in direct contact, so that the heat generated by the heating element 5 is directly transferred to the heat sink 19. In another connection method, thermally conductive materials such as thermally conductive adhesive or thermally conductive pads are provided between the heat sink 19 and the heating element 5, so that the heat generated by the heating element 5 is indirectly transferred to the heat sink 19 through the thermally conductive materials.

[0120] When specifically setting up the flow guide pipe 20, it is a single, continuous pipe, not a pipe formed by assembling multiple pipe sections together through welding, threaded connections, or flange connections. The flow guide pipe 20 can be a metal pipe, for example, a copper or aluminum pipe. In addition to metal pipes, the flow guide pipe 20 can also be a non-metallic pipe, for example, a plastic pipe.

[0121] In one embodiment, the guide tube 20 is flexible and easily bends and deforms. Optionally, the guide tube 20 can be a plastic flexible tube or an aluminum tube. During installation, the guide tube 20 can be bent and deformed to adapt to the position of the heat sink 19, so that the heat sink 19 can be in close contact with the heating element 5.

[0122] Referring to Figure 16, in one embodiment, the guide pipe 20 has an inlet 2001 and an outlet 2002, which are respectively used to connect to an external pipeline. The guide pipe 20 includes a first portion 201, which is located between the inlet 2001 and the outlet 2002. The orthographic projection of the first portion 201 onto the plane of the heat sink 19 is at least partially located within the heat sink 19, and the first portion 201 and the heat sink 19 are thermally connected. Alternatively, the first portion 201 passes through the heat sink 19, and the wall of the first portion 201 is in contact with the heat sink 19. During the flow of the coolant through the first portion 201, heat exchange occurs between the coolant and the heat sink 19 via the wall of the first portion 201, and the heat sink 19 then exchanges heat with the heating element 5. After the coolant passes through the first portion 201, the temperature of the heating element 5 decreases, and the temperature of the coolant increases, thereby achieving the purpose of dissipating heat from the heating element 5. Since the guide pipe 20 is a single tube without any internal seams, the risk of coolant leakage when flowing through the guide pipe 20 is low, thereby reducing the risk of short circuits in the circuit board and heat-generating element 5, and thus improving the reliability of electronic components and the vehicle.

[0123] When specifically setting the first part 201, the number of first parts 201 can be one or more. As shown in Figure 16, in one embodiment, the guide pipe 20 includes multiple first parts 201, which are arranged sequentially and connected along the extension direction of the guide pipe 20, so that the coolant can flow through the multiple first parts 201 sequentially during the flow of the guide pipe 20. Correspondingly, the heat dissipation device also includes multiple heat dissipation plates 19, which are arranged at intervals and share the guide pipe 20. Each first part 201 is thermally connected to a heat dissipation plate 19.

[0124] The first part 201 can have various structural forms. For example, in one structural form, the first part 201 is a strip structure. The first part 201 can extend along a straight line or along a curve. Optionally, the curve can be a U-shaped curve or a serpentine curve. As another example, in another structural form, the first part 201 can also be a circular, elliptical, or polygonal structure.

[0125] To improve the heat exchange effect between the coolant and the heat sink 19, as shown in Figure 16, in one embodiment, the first part 201 is a strip structure that extends along a serpentine curve. In the above embodiment, the first part 201 has a longer length and a larger surface area, resulting in a larger heat exchange area between it and the heat sink 19, thereby improving the heat exchange effect between the coolant and the heat sink 19.

[0126] Besides increasing the length of the first portion 201 to increase the heat exchange area between the first portion 201 and the heat sink 19, thereby improving the heat exchange effect between the coolant and the heat sink 19, the above-mentioned objective can also be achieved in other ways. For example, compared to other parts of the guide tube 20 located outside the heat sink 19, the cross-sectional area of ​​the first portion 201 can be increased to correspondingly increase the surface area of ​​the first portion 201, thereby increasing the heat exchange area between the first portion 201 and the heat sink 19.

[0127] Figure 18 is a schematic diagram of another structure of the heat dissipation device provided in an embodiment of this application. In this heat dissipation device, the guide pipe 20 improves the heat exchange effect between the coolant and the heat sink 19 by increasing the cross-sectional area of ​​the first part 201. Specifically, as shown in Figure 18, in one embodiment, in addition to the first part 201, the guide pipe 20 also includes a second part 202. The second part 202 is located outside the heat sink 19, and the pipe wall of the second part 202 does not contact the heat sink 19. That is, no heat exchange occurs between the second part 202 and the heat sink 19. The first part 201 and the second part 202 are different parts of the same guide pipe 20, and the cross-sectional area of ​​the first part 201 is larger than the cross-sectional area of ​​the second part 202. In a specific embodiment, the guide pipe 20 includes multiple first parts 201 and multiple second parts 202. The first parts 201 and the second parts 202 are arranged alternately along the extension direction of the guide pipe 20, and each first part 201 has a second part 202 at both ends.

[0128] In implementing the above embodiments, the height of the first part 201 and the height of the second part 202 can be equal or approximately equal, and the width of the first part 201 can be greater than the width of the second part 202, thereby making the cross-sectional area of ​​the first part 201 greater than the cross-sectional area of ​​the second part 202. The "height" refers to the dimension of the flow tube 20 in the direction perpendicular to the plane of the heat sink 19, and the "width" refers to the dimension of the flow tube 20 in the direction perpendicular to its own centerline and parallel to the plane of the heat sink 19.

[0129] Referring to Figure 18, in one embodiment, the first part 201 includes a first sub-part 2011 and a second sub-part 2012. The first sub-part 2011 and the second sub-part 2012 are located at opposite ends of the first part 201, with the first sub-part 2011 closer to the inlet 2001 and the second sub-part 2012 farther from the inlet 2001. Along the direction from the inlet 2001 to the outlet 2002, the cross-sectional area of ​​the first sub-part 2011 gradually increases, while the cross-sectional area of ​​the second sub-part 2012 gradually decreases. The first sub-part 2011 is located at the inlet end of the first part 201. After the coolant enters the first sub-part 2011, the flow area of ​​the coolant gradually increases, and it flows towards the center of the first part 201. The first sub-part 2011 acts as a guide at the inlet end of the first part 201, preventing coolant from stagnating at the inlet end of the first part 201. The second sub-section 2012 is located at the outlet end of the first section 201. After the coolant enters the second sub-section 2012, the flow area of ​​the coolant gradually decreases, and it eventually flows out of the first section 201. The second sub-section 2012 acts as a guide at the outlet end of the first section 201, making it less likely for the coolant to stagnate at the outlet end of the first section 201. Thus, guided by the first sub-section 2011 and the second sub-section 2012, the coolant can pass smoothly through the first section 201 and is less likely to stagnate there, thereby improving the heat exchange effect between the coolant and the heating element 5.

[0130] In one specific embodiment, along the direction from the inlet 2001 to the outlet 2002, the width of the first sub-part 2011 gradually increases, while the width of the second sub-part 2012 gradually decreases. An intermediate part 2013, with a constant width, is also provided between the first sub-part 2011 and the second sub-part 2012. Visually, the first sub-part 2011, the intermediate part 2013, and the second sub-part 2012 combine to form a polygonal structure.

[0131] There are several assembly methods for assembling the heat pipe 20 and the heat sink 19. In one embodiment, the surface of the heat sink 19 has a first groove, and the first part 201 of the heat pipe 20 is located in the first groove. On the one hand, the first groove can increase the heat exchange area between the first part 201 and the heat sink 19, thereby improving the heat exchange efficiency. On the other hand, the first groove can limit the first part 201, improving the fixing effect of the first part 201. In the specific implementation of the above embodiment, the first part 201 can be directly snapped into the first groove, or thermally conductive adhesive can be applied to the outer wall of the first part 201 and / or the inner wall of the first groove firstly, and then the first part 201 can be placed in the first groove. In another embodiment, the surface of the heat sink 19 is flat, and the first part 201 of the heat pipe 20 is directly bonded to the surface of the heat sink 19 by thermally conductive adhesive.

[0132] When specifically setting the first groove, the shape of the first groove is the same as the shape of the first portion 201. For example, as shown in FIG16, in one embodiment, the first portion 201 is strip-shaped and extends along a serpentine curve, and correspondingly, the first groove is also strip-shaped and extends along a serpentine curve. As another example, as shown in FIG18, in another embodiment, the first portion 201 is polygonal, and correspondingly, the first groove is also polygonal.

[0133] Figure 19 is a schematic diagram of another structure of the electronic component provided in an embodiment of this application. As shown in Figure 19, in one embodiment, the electronic component 3 further includes a second housing 21, and the heating element 5 is located inside the second housing 21. The second housing 21 plays a protective role on the outside of the heating element 5. For example, the second housing 21 can reduce the adverse effects of dust and moisture in the external environment on the heating element 5; for another example, the second housing 21 can also reduce the damage to the heating element 5 in scenarios such as vibration and collision.

[0134] When the aforementioned heat dissipation device 6 is installed on the second housing 21, in one embodiment, the inlet 2001 and outlet 2002 are located outside the second housing 21. That is, the connection between the guide pipe 20 and the external pipeline is located outside the second housing 21. Thus, even if coolant leaks at the connection between the guide pipe 20 and the external pipeline, the leaked coolant has a smaller impact on the heating element 5 inside the second housing 21, thereby further reducing the risk of short circuits in the circuit board and the heating element 5, and improving the reliability of electronic components and the vehicle.

[0135] To further improve the heat dissipation effect of the heating element 5, as shown in Figure 19, in one embodiment, the inner wall of the second housing 21 has a second thermally conductive protrusion 22. The second thermally conductive protrusion 22 is thermally connected to the heat sink 19, so that a portion of the heat generated by the heating element 5 can be transferred to the second housing 21 through the heat sink 19 and the second thermally conductive protrusion 22. The second housing 21 achieves the effect of heat dissipation for the heating element 5 by exchanging heat with the external environment. Therefore, in the above embodiment, the heating element 5 includes two heat dissipation paths: one is: heating element 5 - heat sink 19 - coolant, and the other is: heating element 5 - heat sink 19 - second thermally conductive protrusion 22 - second housing 21. The heat generated by the heating element 5 can be conducted outward through the above two heat dissipation paths, thereby improving the heat dissipation effect of the heating element 5.

[0136] When specifically configuring the second heat-conducting protrusion 22, the second heat-conducting protrusion 22 can be an integral structure with the second housing 21. Alternatively, the second heat-conducting protrusion 22 can be welded or bonded to the second housing 21. The second heat-conducting protrusion 22 has good thermal conductivity; optionally, the thermal conductivity of the second heat-conducting protrusion 22 is greater than or equal to the thermal conductivity of the second housing 21. The orthographic projection of the second heat-conducting protrusion 22 onto the plane of the heat sink 19 is greater than or equal to the orthographic projection of the heating element 5 onto the plane of the heat sink 19, thus enabling the second heat-conducting protrusion 22 to conduct the heat generated by the heating element 5 to a larger area. The second heat-conducting protrusion 22 can have various structural forms; for example, the second heat-conducting protrusion 22 can be a cylindrical structure, a prismatic structure, or an irregular shape.

[0137] Referring to Figure 19, in one embodiment, the second housing 21 has a plurality of second fins 23 on the side of its surface opposite to the second heat-conducting protrusion 22, and these second fins 23 are arranged at intervals. The second fins 23 can increase the surface area of ​​the second housing 21, thereby increasing the heat exchange area between the second housing 21 and the external environment, and thus improving the heat dissipation effect of the heating element 5.

[0138] The structure of the second housing 21 can take various forms when specifically configured. Figure 20 is a schematic diagram of another structure of the electronic component provided in an embodiment of this application. As shown in Figure 20, in one embodiment, the second housing 21 includes a middle frame 211, a rear housing 212, and a second cover plate 213. The middle frame 211 is located between the rear housing 212 and the second cover plate 213. The middle frame 211 and the rear housing 212 form a first receiving cavity, and the middle frame 211 and the second cover plate 213 form a second receiving cavity. The middle frame 211 can be used to fix some electronic components, and the rear housing 212 and the second cover plate 213 serve to provide waterproofing and dustproofing on both sides of the middle frame 211.

[0139] When the heating element 5 and the heat dissipation device 6 are arranged in the second housing 21, as shown in FIG20, in one embodiment, the heating element 5 is located in the first receiving cavity. In addition to the heating element 5, the first receiving cavity also has a second circuit board 26, to which the heating element 5 is electrically connected. The second circuit board 26 can be fixed to the middle frame 211 or to the rear housing 212. The middle frame 211 has a hollow structure, and the heat dissipation plate 19 is located within the hollow structure, and the heat dissipation plate 19 is connected to the second circuit board 26 via a second fixing member 28. Optionally, the second fixing member 28 includes screws. The guide tube 20 is located in the second receiving cavity, and a portion of the guide tube 20 passes through and contacts the heat dissipation plate 19. The inlet 2001 and outlet 2002 of the guide tube 20 extend from the second receiving cavity. Since the guide pipe 20 is a single pipe and the liquid inlet 2001 and liquid outlet 2002 of the guide pipe 20 are located outside the second housing 21, the risk of coolant leakage during the flow of the guide pipe 20 is low. Therefore, when installing the heat sink 19, there is no need to install a seal between the heat sink 19 and the middle frame 211, which simplifies the structure.

[0140] The second circuit board 26 serves as a support below the heat sink 19 and bears the weight of the heat sink 19. During use, the second circuit board 26 is prone to sinking downwards, thus deforming. To reduce the risk of deformation of the second circuit board 26, as shown in Figure 20, in one embodiment, a second reinforcing plate 27 is provided on the side of the second circuit board 26 away from the heat sink 5. The second reinforcing plate 27 is made of a relatively hard material and can provide support on the side of the second circuit board 26 away from the heat sink 19, preventing the second circuit board 26 from sinking downwards, thereby reducing the risk of deformation of the second circuit board 26 and ensuring a reliable connection between the second circuit board 26 and the heat sink 5.

[0141] When the second housing 21 is provided with a second heat-conducting protrusion 22 to further improve the heat dissipation effect of the heating element 5, as shown in FIG20, in one embodiment, the second heat-conducting protrusion 22 is located on the side surface of the second cover plate 213 facing the middle frame 211. That is, a portion of the heat generated by the heating element 5 can be transferred to the second cover plate 213 through the heat dissipation plate 19 and the second heat-conducting protrusion 22, and the second cover plate 213 achieves the purpose of heat dissipation for the heating element 5 by exchanging heat with the external environment. In order to enhance the heat dissipation capacity of the second cover plate 213, the side surface of the second cover plate 213 facing away from the middle frame 211 also has a plurality of second fins 23. The second fins 23 increase the surface area of ​​the second cover plate 213, thereby increasing the heat exchange area between the second cover plate 213 and the external environment, and thus improving the heat dissipation effect of the heating element 5.

[0142] In the above embodiments, since the second cover plate 213 has a heat dissipation function, a material with good thermal conductivity can be selected for its fabrication. The second cover plate 213 and the middle frame 211 can be made of the same material or different materials. Similarly, the second cover plate 213 and the rear shell 212 can be made of the same material or different materials.

[0143] As shown above, the middle frame 211 can be used to fix some electronic components, such as the second circuit board 26. Besides the second circuit board 26, the middle frame 211 can also fix other electronic components. Figure 21 is a schematic diagram of another structure of the electronic assembly provided in an embodiment of this application. As shown in Figure 21, in one embodiment, the electronic assembly further includes a first electronic component 24, which is fixed to the middle frame 211. Optionally, the first electronic component 24 can be soldered or glued to the middle frame 211, or it can be fixed to the middle frame 211 by screws. Similar to the heating element 5, the first electronic component 24 also generates heat during operation. Since the first electronic component 24 is fixed to the middle frame 211, the heat generated by the first electronic component 24 can be conducted to the middle frame 211 and dissipated outwards through the middle frame 211.

[0144] To improve the heat dissipation of the first electronic component 24, as shown in FIG21, in one embodiment, the second cover plate 213 has a third thermally conductive protrusion 25 on the side of the middle frame 211. The third thermally conductive protrusion 25 is thermally connected to the middle frame 211, so that the heat generated by the first electronic component 24 can be conducted to the second cover plate 213 through the middle frame 211 and the third thermally conductive protrusion 25. The second cover plate 213 achieves the effect of heat dissipation for the electronic component by exchanging heat with the external environment.

[0145] When specifically configuring the third thermally conductive protrusion 25, the third thermally conductive protrusion 25 can be an integral structure with the second cover plate 213. Alternatively, the third thermally conductive protrusion 25 can also be welded or bonded to the second cover plate 213. The third thermally conductive protrusion 25 has good thermal conductivity; optionally, the thermal conductivity of the third thermally conductive protrusion 25 is greater than or equal to the thermal conductivity of the second cover plate 213. The third thermally conductive protrusion 25 includes various structural forms; for example, the third thermally conductive protrusion 25 can be cylindrical, prismatic, or irregularly shaped.

[0146] When the guide pipe 20 is arranged within the second housing 21, there are various arrangement methods. Figure 22 is a schematic diagram of one arrangement of the guide pipe provided in an embodiment of this application. As shown in Figure 22, in one embodiment, in addition to the first part 201, the guide pipe 20 also includes a third part 203. The third part 203 is located outside the heat sink 19, and the wall of the third part 203 does not contact the heat sink 19. The third part 203 is located inside the second housing 21, and the third part 203 and the second housing 21 are thermally connected. That is, the third part 203 is in contact with the second housing 21, and heat exchange can occur between the third part 203 and the second housing 21.

[0147] In a specific implementation of the above embodiments, as shown in Figure 22, the third part 203 can be bonded to the surface of the second housing 21 using thermally conductive adhesive 29. Alternatively, the inner wall of the second housing 21 can also be provided with a second groove, in which the third part 203 is engaged, or bonded to the second groove using thermally conductive adhesive 29. The second groove can limit the position of the third part 203, improving its fixation effect.

[0148] In one specific embodiment, the third part 203 is thermally connected to the middle frame 211 of the second housing 21. In one application scenario, the coolant temperature is low, and the coolant exchanges heat with the middle frame 211 during its flow through the third part 203, causing the temperature of the middle frame 211 to decrease. The middle frame 211 then exchanges heat with the first electronic component 24, thereby achieving the effect of heat dissipation for the first electronic component 24. In another application scenario, the coolant temperature is high, and the coolant exchanges heat with the middle frame 211 during its flow through the third part 203, causing its own temperature to decrease. In another specific embodiment, the third part 203 is thermally connected to the cover plate in the second housing 21, allowing the coolant to exchange heat with the cover plate during its flow through the third part 203.

[0149] In the specific configuration of the third part 203, the third part 203 can be directly connected to the first part 201, or the third part 203 and the first part 201 can be indirectly connected by other parts of the guide pipe 20. The third part 203 and the second part 202 described above can be the same pipe section, or the third part 203 and the second part 202 described above contain the same pipe section, or the third part 203 and the second part 202 described above are different pipe sections.

[0150] Figure 23 is a schematic diagram of another arrangement of the heat pipe provided in an embodiment of this application. As shown in Figure 23, in one embodiment, in addition to the first part 201, the heat pipe 20 also includes a fourth part 204. The fourth part 204 is located outside the heat sink 19, and the wall of the fourth part 204 does not contact the heat sink 19. The fourth part 204 is adjacent to and connected to the first part 201, and the fourth part 204 is suspended in the second housing 21. Compared with the third part 203, the fourth part 204 will not be stuck in the second groove on the surface of the second housing 21, nor will it be bonded to the surface of the second housing 21 by thermally conductive adhesive, or fixed to the second housing 21 by other fasteners. In the scenario where the heat pipe 20 is flexible, the above-mentioned fourth part 204 can be bent and will not be restricted by the second housing 21. Thus, during the installation of the heat dissipation device 6, the heat sink 19 can be adjusted to an appropriate position, so that the heat sink 19 can maintain close contact with the heating element 5 to improve the heat conduction efficiency, and will not cause excessive compression to the heating element 5 and damage it.

[0151] Figure 24 is a schematic diagram of an application of the heat dissipation pipe provided in an embodiment of this application. As shown in Figure 24, in one embodiment, the electronic component 3 includes a second circuit board 26 and a plurality of heating elements 5, which are disposed on the same side of the second circuit board 26. Due to manufacturing tolerances, the thickness of the plurality of heating elements 5 is different. The heat dissipation device 6 includes a plurality of heat sinks 19, each heat sink 19 being thermally connected to one or more heating elements 5, and the plurality of heat sinks 19 sharing a single heat dissipation pipe 20, which is an aluminum pipe. The heat dissipation pipe 20 includes a plurality of first portions 201, each first portion 201 being thermally connected to a heat sink 19, and adjacent first portions 201 being connected by a fourth portion 204. For the heat sinks 19 located at both ends, the first portions 201 of these two heat sinks 19 are also connected to an external pipeline via the fourth portion 204, respectively. During the installation of the heat dissipation device, the heat sinks 19 are fixed to the second circuit board 26 by a second fastener 28. For two adjacent heat sinks 19, the fourth portion 204 located between the two heat sinks 19 can be bent, so that the installation height of the two heat sinks 19 is adapted to the thickness of the corresponding heating element 5. In this way, each heat sink 19 can maintain a moderate compression with the corresponding heating element 5. That is to say, each heat sink 19 can maintain close contact with the heating element 5, thereby improving the heat conduction efficiency, without causing excessive compression to the heating element 5 and damaging it.

[0152] In the specific installation of the second fixing member 28, the second fixing member 28 includes a screw and a spring. The screw passes through the heat sink 19 and connects to the circuit board; the spring is sleeved on the outside of the screw, with one end abutting the head of the screw and the other end abutting the heat sink 19. The longer the spring, the smaller the distance between the heat sink 19 and the second circuit board 26. Conversely, the shorter the spring, the larger the distance between the heat sink 19 and the second circuit board 26. Because the length of the spring is variable, the distance between the heat sink 19 and the circuit board is variable, thus allowing the heat sink 19 to float. During installation, the fourth part 204 can deform accordingly with the floating of the heat sink 19, ultimately achieving a suitable distance between each heat sink 19 and the circuit board, thereby maintaining appropriate compression between the heat sink 19 and the corresponding heat-generating element 5.

[0153] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and variations.

Claims

1. A heat dissipation device, characterized in that, It includes multiple liquid cooling modules, which are used to make thermally conductive connections with the heating element; each liquid cooling module has a flow channel for the flow of coolant. The plurality of liquid cooling modules are arranged at intervals, and a connector is provided between two adjacent liquid cooling modules; the connector is waterproof, the connector is connected to the side of the liquid cooling module facing the heating element, and the connector covers the gap between two adjacent liquid cooling modules.

2. The heat dissipation device as described in claim 1, characterized in that, The liquid cooling module includes a substrate for thermally connecting with the heating element, and the flow channel is located on the side of the substrate away from the heating element. The connector is located between two adjacent substrates, and the connector is directly connected to each of the two adjacent substrates.

3. The heat dissipation device as described in claim 2, characterized in that, The substrate and the connector are welded, bonded, or are an integral structure.

4. The heat dissipation device as described in claim 2 or 3, characterized in that, The thickness of the substrate gradually decreases along the direction away from the connector.

5. The heat dissipation device according to any one of claims 2 to 4, characterized in that, The substrate has a first thermally conductive protrusion on the side of its surface facing the heating element, and the thermal conductivity of the first thermally conductive protrusion is greater than or equal to the thermal conductivity of the substrate.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The connector has a first side and a second side arranged along a first direction, the first side being connected to one of the liquid cooling modules, and the second side being connected to another of the liquid cooling modules. The connector has elastic deformation capability along the first direction.

7. The heat dissipation device as described in claim 6, characterized in that, The connector is a component made of flexible material.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that, The connector includes a first protrusion, the first protrusion having two first wall surfaces disposed opposite each other along the thickness direction of the connector, both of the first wall surfaces protruding in a direction away from the heating element; And / or, the connector includes a second protrusion having two second walls disposed opposite to each other along the thickness direction of the connector, both of the second walls protruding toward the heating element.

9. The heat dissipation device according to any one of claims 1 to 8, characterized in that, The flow channels of the plurality of liquid cooling modules are connected sequentially through connecting pipes; Alternatively, the heat dissipation device may further include a main inlet pipe, a main outlet pipe, multiple inlet branch pipes, and multiple outlet branch pipes; the flow channels of the multiple liquid cooling modules are respectively connected through different inlet branch pipes and the main inlet pipe, and the flow channels of the multiple liquid cooling modules are respectively connected through different outlet branch pipes and the main outlet pipe.

10. An electronic component, characterized in that, It includes multiple heating elements and a heat dissipation device as described in any one of claims 1 to 9, wherein the liquid cooling module and at least one of the heating elements are thermally connected.

11. The electronic component as claimed in claim 10, characterized in that, The electronic component also includes a first housing having an opening; The plurality of heating elements are located inside the first housing; The liquid cooling module includes a substrate, which is thermally connected to the heating element. The flow channel is located on the side of the substrate away from the heating element. The connector is located between two adjacent substrates and is directly connected to each of the two adjacent substrates. The substrates and connectors of the plurality of liquid cooling modules are connected to form a first cover plate, which is located on top of the opening and covers the opening.

12. The electronic component as claimed in claim 11, characterized in that, The first cover plate has an extension portion, and the orthographic projection of the extension portion onto the plane where the opening is located is located on the outer periphery of the orthographic projection of the first housing onto the plane where the opening is located.

13. The electronic component as claimed in claim 11 or 12, characterized in that, A flexible element is provided between the substrate covering the edge of the opening and the first housing.

14. The electronic component according to any one of claims 10 to 13, characterized in that, The electronic components also include a first circuit board, the plurality of heating elements are electrically connected to the first circuit board respectively, and the liquid cooling module is connected to the first circuit board through a first fixing member.

15. The electronic component as claimed in claim 14, characterized in that, A first reinforcing plate is provided on the side of the first circuit board away from the heating element; one end of the first fixing member is connected to the liquid cooling module, and the other end of the first fixing member passes through to connect the first circuit board and the first reinforcing plate.

16. A vehicle-mounted intelligent module, characterized in that, It includes a housing and an electronic component as described in any one of claims 10 to 15, wherein the electronic component is located within the housing.

17. A vehicle, characterized in that, It includes a vehicle frame and an on-board intelligent module as described in claim 16, wherein the on-board intelligent module is located within the vehicle frame.

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