Vehicle-mounted cabin‑intelligent driving integrated heat dissipation structure and domain controller

Abstract

A vehicle-mounted cabin‑intelligent driving integrated heat dissipation structure and a domain controller, for use in solving the technical problem in the prior art that the performances of a cabin control board and an intelligent driving control board cannot be maximized due to the poor heat dissipation effect caused by the fact that the cabin control board and the intelligent driving control board are generally cooled by means of air‑cooled heat dissipation. The vehicle-mounted cabin‑intelligent driving integrated heat dissipation structure in the present invention comprises a housing, and a cabin control board, an intelligent driving control board and a liquid cooling plate which are arranged in the housing. Cooling liquid circulates within the liquid cooling plate, the liquid cooling plate has a first surface and a second surface arranged opposite to the first surface, the cabin control board is arranged on the first surface, and the intelligent driving control board is arranged on the second surface. By means of the design above, the first surface and the second surface of the liquid cooling plate are respectively in contact with the cabin control board and the intelligent driving control board at the same time, thereby making full use of the heat dissipation area of the liquid cooling plate, enabling a single liquid cooling plate to perform effective heat dissipation on the cabin control board and the intelligent driving control board at the same time, and ensuring that the cabin control board and the intelligent driving control board can work normally.

Description

A vehicle-mounted cabin integrated heat dissipation structure and domain controller

[0001] This application claims priority to Chinese Patent Application No. 202411205870.2, filed on August 29, 2024, entitled "An Integrated Heat Dissipation Structure and Domain Controller for Vehicle Cabin", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of heat dissipation design technology for electronic devices, and in particular to an integrated heat dissipation structure for vehicle cabin and a domain controller. Background Technology

[0003] Cockpit-driver integration refers to integrating the functions of the cockpit domain and the intelligent driving domain into a single high-performance computing unit to improve the overall performance and efficiency of the system. This technology achieves a more efficient system design by merging cockpit control and intelligent driving functions, thereby improving the level of vehicle intelligence. Cockpit domain functions are handled by the cockpit control board, while intelligent driving domain functions are handled by the intelligent driving domain control board. Both the cockpit control board and the intelligent driving domain control board are integrated into the domain controller.

[0004] Because the domain controller integrates a large number of computing tasks and data processing from both the cockpit and autonomous driving domains, its power consumption is not simply 1+1=2, but rather the sum of the functions of the two domains, resulting in higher heat generation and placing greater demands on heat dissipation capabilities. Current technologies generally employ air cooling to cool the domain controller. However, since the cockpit and autonomous driving control boards handle a large number of computing tasks and data processing in actual operation, generating enormous amounts of heat, existing air cooling capabilities are limited and cannot effectively dissipate heat, preventing the cockpit and autonomous driving control boards from reaching their full potential.

[0005] Therefore, finding a technical solution that can solve the above-mentioned technical problems has become an important research topic for those skilled in the art. Summary of the Invention

[0006] This invention discloses an integrated heat dissipation structure and domain controller for vehicle cabin and driver, which solves the technical problem that the existing general method of using air cooling to dissipate heat from the cabin control board and intelligent driving control board has poor heat dissipation effect, resulting in the inability to unleash the maximum potential of the cabin control board and intelligent driving control board.

[0007] The present invention provides an integrated heat dissipation structure for vehicle cabin and driver, including a housing and a cabin control board, a smart driving control board and a liquid cooling plate disposed within the housing;

[0008] Coolant circulates within the liquid cooling plate. The liquid cooling plate has a first surface and a second surface disposed opposite to the first surface. The cockpit control panel is disposed on the first surface, and the intelligent driving control panel is disposed on the second surface.

[0009] Optionally, the liquid cooling plate is provided with a liquid inlet and a liquid outlet, both of which are connected to the interior of the liquid cooling plate. The liquid inlet is used to allow coolant to flow into the interior of the liquid cooling plate, and the liquid outlet is used to allow coolant to flow out of the interior of the liquid cooling plate.

[0010] Optionally, the cockpit control panel includes a first circuit board and a first high-heat-generating element electrically connected to the first circuit board;

[0011] A first heat-conducting protrusion is provided on the first surface of the liquid cooling plate at a position corresponding to the first high-heat-generating element, and the first heat-conducting protrusion is fitted to the first high-heat-generating element.

[0012] Optionally, a thermally conductive gel is filled between the first thermally conductive protrusion and the first high-heat-generating element.

[0013] Optionally, the liquid cooling plate is provided with a first heat dissipation fin, which is correspondingly arranged with the first heat-conducting protrusion.

[0014] Optionally, the intelligent driving control board includes a second circuit board and a second high-heat-generating element electrically connected to the second circuit board;

[0015] A second heat-conducting protrusion is provided on the second surface of the liquid cooling plate at a position corresponding to the second high-heat-generating element, and the second heat-conducting protrusion is fitted to the second high-heat-generating element.

[0016] Optionally, thermally conductive gel is filled between the second thermally conductive protrusion and the second high-heat-generating element.

[0017] Optionally, the liquid cooling plate is provided with a second heat dissipation fin, which is correspondingly arranged with the second heat-conducting protrusion.

[0018] Optionally, the housing includes a top shell and a bottom shell;

[0019] The top cover is fixedly fitted onto the surface of the cockpit control panel away from the liquid cooling plate, and the bottom cover is fixedly fitted onto the surface of the intelligent driving control panel away from the liquid cooling plate.

[0020] The present invention provides a domain controller, including the above-described integrated heat dissipation structure for the vehicle body.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] In this embodiment of the integrated vehicle cabin cooling structure, coolant circulates within the liquid cooling plate. The cabin control board is mounted on the first surface, and the intelligent driving control board is mounted on the second surface. The coolant on the liquid cooling plate effectively absorbs the heat released by the cabin control board and the intelligent driving control board during operation, thereby achieving heat dissipation for both boards. This design fully utilizes the heat dissipation area of ​​the liquid cooling plate, enabling a single plate to effectively dissipate heat from both the cabin control board and the intelligent driving control board simultaneously. This ensures the normal operation of both boards, and they function independently within the cooling structure, without interfering with each other during operation. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 is an overall schematic diagram of a vehicle-mounted cabin integrated heat dissipation structure provided in an embodiment of the present invention;

[0025] Figure 2 is an exploded view of an integrated heat dissipation structure for vehicle cabin provided in an embodiment of the present invention;

[0026] Illustration: 1. Liquid cooling plate; 201. Liquid inlet and outlet; 202. 3. First thermally conductive boss; 4. Cockpit control panel; 5. Thermal conductive gel; 6. Intelligent driving control panel; 7. Bottom shell; 8. Top shell; 801. Mounting groove; 802. Cover plate. Detailed Implementation

[0027] This invention discloses an integrated heat dissipation structure and domain controller for vehicle cabin and driver, which solves the technical problem that the existing general method of using air cooling to dissipate heat from the cabin control board and intelligent driving control board has poor heat dissipation effect, resulting in the inability to unleash the maximum potential of the cabin control board and intelligent driving control board.

[0028] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Please refer to Figures 1 and 2. An embodiment of the present invention provides a vehicle-mounted cabin integrated heat dissipation structure, including a housing and a cabin control board 4, an intelligent driving control board 6 and a liquid cooling plate 1 disposed within the housing;

[0030] Coolant circulates within the liquid cooling plate 1. The liquid cooling plate 1 has a first surface and a second surface disposed opposite to the first surface. The cockpit control panel 4 is disposed on the first surface, and the intelligent driving control panel 6 is disposed on the second surface.

[0031] In the integrated vehicle cabin cooling structure of this embodiment, coolant circulates within the liquid cooling plate 1. The cabin control board 4 is disposed on the first surface, and the intelligent driving control board 6 is disposed on the second surface. The coolant on the liquid cooling plate 1 can fully absorb the heat released by the cabin control board 4 and the intelligent driving control board 6 during operation, thereby achieving heat dissipation for the cabin control board 4 and the intelligent driving control board 6. In the above design, the heat dissipation area of ​​the liquid cooling plate 1 is fully utilized, enabling a single liquid cooling plate 1 to effectively dissipate heat from both the cabin control board 4 and the intelligent driving control board 6 simultaneously, ensuring that the cabin control board 4 and the intelligent driving control board 6 can operate normally. Furthermore, the cabin control board 4 and the intelligent driving control board 6 are independent of each other in the above cooling structure, and they do not affect each other during operation.

[0032] Furthermore, in this embodiment, the liquid cooling plate 1 is provided with a liquid inlet 201 and a liquid outlet 202. Both the liquid inlet 201 and the liquid outlet 202 are connected to the interior of the liquid cooling plate 1. The liquid inlet 201 is used to allow coolant to flow into the interior of the liquid cooling plate 1, and the liquid outlet 202 is used to allow the coolant to flow out of the interior of the liquid cooling plate 1.

[0033] It should be noted that in this embodiment, the coolant can be connected to the inlet 201 via an inlet pipe. The inlet pipe is connected to a liquid pump, which is used to draw in the coolant and pump it into the interior of the liquid cooling plate 1 through the inlet pipe and the inlet 201. The outlet 202 can be connected to an outlet pipe. The coolant that has exchanged heat with the cockpit control board 4 and the intelligent driving control board 6 flows from the outlet 202 into the outlet pipe, and finally flows from the outlet pipe into the coolant storage tank. After the coolant temperature in the coolant storage tank reaches a preset value, the liquid pump pumps the coolant back into the liquid cooling plate 1, and so on, in a cycle.

[0034] Furthermore, in this embodiment, the liquid cooling plate 1 can also be provided with a flow channel for the flow of coolant. In order to extend the heat exchange time between the coolant and the cockpit control board 4 and the intelligent driving control board 6, the flow channel can be configured as a curved structure.

[0035] Furthermore, the cockpit control panel 4 in this embodiment includes a first circuit board and a first high-heat-generating element electrically connected to the first circuit board;

[0036] A first heat-conducting protrusion 3 is provided on the first surface of the liquid cooling plate 1 at a position corresponding to the first high-heat-generating element, and the first heat-conducting protrusion 3 is fitted to the first high-heat-generating element.

[0037] It should be noted that, through the above design, the first heat-conducting protrusion 3 contacts the first high-heat-generating element, and the heat of the first high-heat-generating element is quickly carried away by the circulating coolant inside the liquid cooling plate 1, thereby achieving rapid cooling of the first high-heat-generating element. Specifically, the first high-heat-generating element can be a control chip, etc.

[0038] Furthermore, in this embodiment, the space between the first thermally conductive protrusion 3 and the first high-heat-generating element is filled with thermally conductive gel 5.

[0039] It should be noted that the thermal conductive gel 5 is designed to reduce the contact thermal resistance between the first thermal conductive protrusion 3 and the first high-heat-generating element, enhance the thermal conductivity, and help accelerate the cooling of the first high-heat-generating element.

[0040] Furthermore, in this embodiment, the liquid cooling plate 1 is provided with a first heat dissipation fin, which is correspondingly arranged with the first heat-conducting protrusion 3.

[0041] It should be noted that the design of the first heat dissipation fins can improve the structural strength of the liquid cooling plate 1 and guide the flow of coolant within the liquid cooling plate 1, thereby enhancing the flow and heat transfer of the coolant. Furthermore, the corresponding positions of the first heat dissipation fins and the first heat-conducting protrusion 3 can effectively improve the heat dissipation effect of the first high-heat-generating component.

[0042] Furthermore, the intelligent driving control board 6 in this embodiment includes a second circuit board and a second high-heat-generating element electrically connected to the second circuit board;

[0043] A second heat-conducting protrusion is provided on the second surface of the liquid cooling plate 1 at a position corresponding to the second high-heat-generating element, and the second heat-conducting protrusion is fitted to the second high-heat-generating element.

[0044] It should be noted that, through the above design, the second heat-conducting protrusion contacts the second high-heat-generating element, and the heat from the second high-heat-generating element is quickly carried away by the circulating coolant inside the liquid cooling plate 1, thereby achieving rapid cooling of the second high-heat-generating element. Specifically, the second high-heat-generating element can be a control chip, etc.

[0045] Furthermore, thermally conductive gel 5 is filled between the second thermally conductive protrusion and the second high-heat-generating element.

[0046] It should be noted that the thermal conductive gel 5 is designed to reduce the contact thermal resistance between the second thermal conductive protrusion and the second high-heat-generating element, enhance the thermal conductivity, and help accelerate the cooling of the second high-heat-generating element.

[0047] Furthermore, in this embodiment, the liquid cooling plate 1 is provided with a second heat dissipation fin, which is correspondingly arranged with the second heat-conducting protrusion.

[0048] It should be noted that the design of the second heat dissipation fins improves the structural strength of the liquid cooling plate 1 in two ways: firstly, it guides the flow of coolant within the liquid cooling plate 1, thus enhancing the flow and heat transfer of the coolant. Furthermore, the corresponding positions of the second heat dissipation fins and the second heat-conducting protrusions effectively improve the heat dissipation of the second high-heat-generating element.

[0049] Furthermore, the shell in this embodiment specifically includes a top shell 8 and a bottom shell 7;

[0050] The top cover 8 is fixedly fitted onto the surface of the cockpit control panel 4 away from the liquid cooling plate 1, and the bottom cover is fixedly fitted onto the surface of the intelligent driving control panel 6 away from the liquid cooling plate 1.

[0051] It should be noted that in this embodiment, mounting holes are provided at the four corners and the middle of the first surface of the top shell 8, the cockpit control panel 4, and the liquid cooling plate 1. The top shell 8, the cockpit control panel 4, and the first surface of the liquid cooling plate 1 are fixedly fastened to the mounting holes by fixing screws to complete the fixed assembly of the three.

[0052] In this embodiment, mounting holes are provided at the four corners and the middle of the second surface of the bottom shell 7, the intelligent driving control board 6, and the liquid cooling plate 1. The bottom shell 7, the cockpit control board 4, and the second surface of the liquid cooling plate 1 are fixedly fastened to the mounting holes by fixing screws to complete the fixed assembly of the three.

[0053] The above assembly method ensures the compactness of the heat dissipation structure while also facilitating assembly by installers.

[0054] Furthermore, in this embodiment, a mounting groove 801 is provided on the surface of the top shell 8 away from the cockpit control panel 4. A battery is placed in the mounting groove 801, and a cover plate 802 is fixed to the mounting groove 801 by screws.

[0055] Please refer to Figure 1. An embodiment of the present invention provides a domain controller, including the above-described integrated heat dissipation structure for the vehicle body.

[0056] It should be noted that the domain controller in this embodiment is mainly used in vehicles, and it essentially integrates the functions of the cockpit domain and the intelligent driving domain.

[0057] The above design makes the domain controller structure more compact and the overall weight lighter; it is easy to install, the cockpit control board 4 and the intelligent driving control board 6 are independent of each other and do not affect each other during operation; the liquid cooling plate 1 has higher reliability, and the cockpit control board 4 and the intelligent driving control board 6 can be cooled by a single liquid cooling plate 1, which has a high heat dissipation area utilization rate, lower cost, and helps to unleash the maximum potential of the cockpit control board 4 and the intelligent driving control board 6.

[0058] The above provides a detailed description of the vehicle-mounted cabin integrated heat dissipation structure and domain controller provided by the present invention. For those skilled in the art, based on the ideas of the embodiments of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A vehicle-mounted cabin integrated heat dissipation structure, characterized in that, It includes a housing and a cockpit control panel (4), a smart driving control panel (6), and a liquid cooling plate (1) disposed within the housing; Coolant circulates within the liquid cooling plate (1). The liquid cooling plate (1) has a first surface and a second surface disposed away from the first surface. The cockpit control panel (4) is disposed on the first surface, and the intelligent driving control panel (6) is disposed on the second surface.

2. The vehicle-mounted cabin integrated heat dissipation structure according to claim 1, characterized in that, The liquid cooling plate (1) is provided with a liquid inlet (201) and a liquid outlet (202). Both the liquid inlet (201) and the liquid outlet (202) are connected to the interior of the liquid cooling plate (1). The liquid inlet (201) is used to allow coolant to flow into the interior of the liquid cooling plate (1), and the liquid outlet (202) is used to allow coolant to flow out of the interior of the liquid cooling plate (1).

3. The vehicle-mounted cabin integrated heat dissipation structure according to claim 1, characterized in that, The cockpit control panel (4) includes a first circuit board and a first high-heat-generating element electrically connected to the first circuit board; A first heat-conducting protrusion (3) is provided on the first surface of the liquid cooling plate (1) at a position corresponding to the first high-heat-generating element, and the first heat-conducting protrusion (3) is attached to the first high-heat-generating element.

4. The vehicle-mounted cabin integrated heat dissipation structure according to claim 3, characterized in that, The space between the first thermally conductive protrusion (3) and the first high-heat-generating element is filled with thermally conductive gel (5).

5. The vehicle-mounted cabin integrated heat dissipation structure according to claim 3, characterized in that, The liquid cooling plate (1) is provided with a first heat dissipation fin, which is correspondingly arranged with the first heat-conducting protrusion (3).

6. The vehicle-mounted cabin integrated heat dissipation structure according to claim 1, characterized in that, The intelligent driving control board (6) includes a second circuit board and a second high-heat-generating element electrically connected to the second circuit board; A second heat-conducting protrusion is provided on the second surface of the liquid cooling plate (1) at a position corresponding to the second high-heat-generating element, and the second heat-conducting protrusion is fitted to the second high-heat-generating element.

7. The vehicle-mounted cabin integrated heat dissipation structure according to claim 6, characterized in that, The space between the second thermally conductive protrusion and the second high-heat-generating element is filled with thermally conductive gel (5).

8. The vehicle-mounted cabin integrated heat dissipation structure according to claim 6, characterized in that, The liquid cooling plate (1) is provided with a second heat dissipation fin inside, and the second heat dissipation fin is correspondingly arranged with the second heat-conducting protrusion.

9. The integrated heat dissipation structure for the vehicle and driver compartment according to claim 1, characterized in that, The shell includes a top shell (8) and a bottom shell (7); The top cover (8) is fixedly fitted onto the surface of the cockpit control panel (4) away from the liquid cooling plate (1), and the bottom cover is fixedly fitted onto the surface of the intelligent driving control panel (6) away from the liquid cooling plate (1).

10. A domain controller, characterized in that, Includes the integrated heat dissipation structure of the vehicle and driver as described in any one of claims 1 to 9.

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