Photometric / colorimetric device

Abstract

Provided is a photometric / colorimetric device in which a circuit board other than an analog board can be mounted at any position.　This photometric / colorimetric device comprises: an objective lens; a light-receiving unit having a plurality of sensors that receive light from the objective lens; an analog board on which is mounted a circuit that converts an analog signal from the light-receiving unit into a digital signal; a first circuit board that is separate from the analog board; a support plate extending in the optical axis direction of the objective lens on the optical path forward side of the objective lens; and a fixation plate that is directly or indirectly held by the support plate. The analog board is directly or indirectly held by the support plate, and the first circuit board is directly or indirectly held by the fixation plate.

Description

Photometric colorimeter

[0001] The present disclosure relates to a photometric and colorimetric device.

[0002] 2. Description of the Related Art A photometric and colorimetric device is known as a device for measuring the brightness and color of light on an object to be measured (see Patent Document 1).

[0003] International Publication No. 2017 / 094562

[0004] A photometric and colorimetric device includes multiple circuit boards, such as an analog board carrying a circuit that converts analog signals detected by a sensor into digital signals, and a CPU board carrying a circuit that calculates photometric and colorimetric values ​​from the digital signals. Conventionally, multiple circuit boards have been positioned to extend along the optical axis of the objective lens, and the photometric and colorimetric device has a long shape along the optical axis of the objective lens. Therefore, when attempting to install a photometric and colorimetric device inside a more complex measuring device, the measuring device tends to become larger, and there is a demand for a photometric and colorimetric device with a lower profile. In other words, there is a demand for the circuit board to be mounted in any position other than the position extending along the optical axis of the objective lens.

[0005] An object of the present disclosure is to provide a photometric and colorimetric device in which a circuit board other than an analog board can be attached at any position.

[0006] In order to solve the above problems, the photometric and colorimetric device disclosed herein comprises an objective lens; a light receiving unit having a plurality of sensors that receive light from the objective lens; an analog board mounted with a circuit that converts an analog signal from the light receiving unit into a digital signal; a first circuit board separate from the analog board; a support plate that extends in the optical axis direction of the objective lens on the optical path progression side of the objective lens; and a fixed plate that is held directly or indirectly by the support plate, wherein the analog board is held directly or indirectly by the support plate, and the first circuit board is held directly or indirectly by the fixed plate.

[0007] According to the present disclosure, a circuit board other than an analog board can be attached at any position in a photometric and colorimetric device.

[0008] 1 is a perspective view showing the appearance of a photometric colorimetric device; FIG. 2 is a block diagram showing the functional configuration of the photometric colorimetric device; FIG. 3 is a diagram showing the specific configuration of a measurement optical system and a light receiving unit; FIG. 4 is a diagram showing the irradiation range of a light beam emitted from an optical fiber; FIG. 5 is a cross-sectional schematic diagram of the photometric colorimetric device of this embodiment; FIG. 6 is a cross-sectional schematic diagram of a photometric colorimetric device of a conventional example; FIG. 7 is a schematic diagram for explaining the positional relationship of various substrates; FIG. 8 is a schematic diagram for explaining the positional relationship of various substrates; FIG. 9 is an explanatory diagram of a light receiving unit envelope area; FIG. 10 is a cross-sectional schematic diagram of the photometric colorimetric device; FIG. 11 is a schematic diagram for explaining the positional relationship of various substrates (Modification 1); FIG. 12 is a schematic diagram for explaining the positional relationship of various substrates (Modification 2);

[0009] One or more embodiments of the present disclosure will be described below with reference to the drawings, however, the scope of the present disclosure is not limited to the disclosed embodiments.

[0010] 1 is a perspective view showing the appearance of a photometric and colorimetric device 1. FIG. 2 is a block diagram showing the functional configuration of the photometric and colorimetric device 1.

[0011] The photometric and colorimetric device 1 is used, for example, in the inspection process of a manufacturing line for liquid crystal displays or organic light-emitting diode (OLED) displays. The photometric and colorimetric device 1 measures, for example, the color, luminance, light waveform (change in light amount), flicker, etc. of a display surface 12, which is an object to be measured. The photometric and colorimetric device 1 is placed, for example, facing the display surface 12 of the display at a predetermined distance (for example, 3 cm).

[0012] The configuration of the photometric and colorimetric device 1 will be described. The photometric and colorimetric device 1 includes a measurement optical system 27, a light receiving unit 25, an integrating unit 26, an A / D conversion unit 31, a memory unit 32, a control unit 36, a power supply unit 37, and a communication unit 38. The measurement optical system 27 includes an objective lens 21 and a beam splitter 24. Light from the display surface 12 of the display is photoelectrically converted into an electrical signal (analog signal), the converted analog signal is converted into a digital signal, and the converted digital signal undergoes various processes. In addition, the photometric and colorimetric device 1 may include an operation unit and a display unit (not shown).

[0013] The photometric and colorimetric device 1 may be connected to a personal computer (not shown) etc. In this case, the operation unit and display unit (not shown) may be provided in the personal computer.

[0014] Each part will be explained in detail.

[0015] 3 is a diagram showing a specific configuration of the measurement optical system 27 and the light receiving unit 25. Note that, although the following describes measurement using a direct tristimulus value reading method, the measurement method is not limited to this and may also be a spectrophotometric colorimetric method.

[0016] The objective lens 21 is provided as an incident portion for receiving light from the display. The objective lens 21 is, for example, a plano-convex lens, and has a single positive power.

[0017] The beam splitter 24 is provided as a light guide portion that guides the light incident on the objective lens 21. The beam splitter 24 splits the beam that has passed through the objective lens 21 into three beams.

[0018] The beam splitting member 24 is disposed on the optical axis L of the light incident by the objective lens 21. Hereinafter, the "optical axis L of the light incident by the objective lens 21" will also be simply referred to as the "optical axis L of the objective lens 21" or the "optical axis L." The beam splitting member 24 has an optical fiber 55 that propagates light, and lenses 56p, 56q, and 56r having positive power.

[0019] The optical fiber 55 is formed by bundling a plurality of optical fibers. The bundled optical fibers are split into three at a midpoint, resulting in the optical fiber 55 having one light beam incident surface A and three light beam exit surfaces B1, B2, and B3. The optical fiber 55 is disposed such that the light beam incident surface A is located at a position separated from the image-side principal point PP of the objective lens 21 by the focal length f of the objective lens 21. In other words, the objective lens 21 and the optical fiber 55 form a telecentric optical system. For ease of explanation, this embodiment illustrates an example in which the image-side principal point substantially coincides with the object-side principal point.

[0020] In this embodiment, the optical fiber 55 is used as the light beam splitting member 24, but the configuration is not limited to this. For example, other optical components that perform the same function as the optical fiber, such as an optical pipe, may be used as the light beam splitting member 24.

[0021] The photometric and colorimetric device 1 is disposed a predetermined distance away from the display surface 12 of the display. At this time, among the light beams emitted from each portion of the measurement area AR, only those light beams having an emission angle equal to or smaller than the maximum emission angle α relative to the normal direction of the measurement area AR are incident on the light beam incident surface A of the optical fiber 55. The normal direction of the measurement area AR is the direction parallel to the optical axis L in FIG. 5 , which will be described later. Hereinafter, the maximum emission angle α will also be referred to as the "maximum emission angle α." The maximum emission angle α is determined by the focal length f of the objective lens 21 and the diameter R of the optical fiber 55 at the light beam incident surface A. The incident light beam is split into three light beams within the optical fiber 55, which are respectively emitted from the light beam emission surfaces B1, B2, and B3.

[0022] Each optical fiber that makes up the optical fiber 55 has a two-layer structure consisting of a core located in the center and a cladding that surrounds the core. The core is designed to have a higher refractive index than the cladding, so light propagates while being confined within the core by total internal reflection.

[0023] The light receiving section 25 receives the light guided by the beam splitter 24 and converts it into an electrical signal.

[0024] The light receiving unit 25 has sensors 62p, 62q, and 62r that have the spectral sensitivity characteristics of a standard observer. The sensors 62p, 62q, and 62r receive the three light beams emitted from the light beam splitter 24, and photoelectrically convert the received light beams into electrical signals corresponding to the incident intensities, and output the electrical signals.

[0025] 4 is a diagram showing the irradiation range of the light beam emitted from the optical fiber 55. The lens 56p focuses the light beam emitted from the light beam emission surface B1 of the optical fiber 55 onto the sensor 62p, and makes the irradiation range LA of the light beam approximately coincident with the light receiving range SA of the sensor 62p.

[0026] Similarly, the lens 56q focuses the light beam emitted from the light beam emission surface B2 of the optical fiber 55 onto the sensor 62q, and the irradiation range of the light beam approximately coincides with the light receiving range of the sensor 62q. The lens 56r focuses the light beam emitted from the light beam emission surface B3 of the optical fiber 55 onto the sensor 62r, and the irradiation range of the light beam approximately coincides with the light receiving range of the sensor 62r.

[0027] In this way, the light beam emitted from the optical fiber 55 is focused within the light receiving range of the sensors 62p, 62q, and 62r. ​​One-third of the light beam incident on the optical fiber 55 is incident on the sensors 62p, 62q, and 62r, respectively. Note that the light beam here refers to all light beams emitted from each part of the measurement area AR of the display at angles equal to or smaller than the maximum emission angle α with respect to the normal direction of the measurement area AR. This prevents a decrease in the amount of light received by the sensors 62p, 62q, and 62r.

[0028] 3, the plurality of sensors 62p, 62q, and 62r further include spectral sensitivity correction filters 61p, 61q, and 61r, respectively, in the light receiving unit 25. The spectral sensitivity correction filters 61p, 61q, and 61r are filters for imparting the spectral sensitivity of the standard observer defined by the CIE.

[0029] The sensors 62p, 62q, and 62r include, for example, silicon photocells (SPCs) having substantially the same light-receiving sensitivity. The sensors 62p, 62q, and 62r are located on the optical axes of the lenses 56p, 56q, and 56r, respectively. The sensors 62p, 62q, and 62r are also located so that the illumination ranges of light collected by the lenses 56p, 56q, and 56r, respectively, are within the light-receiving ranges of the sensors 62p, 62q, and 62r. ​​Spectral sensitivity compensation filters 61p, 61q, and 61r are located in appropriate positions between the sensors 62p, 62q, and 62r and the lenses 56p, 56q, and 56r, respectively.

[0030] Spectral sensitivity compensation filter 61p is sensitive to the R (red) wavelength region. Due to this filter characteristic, sensor 62p is corrected to have a light receiving sensitivity of a color matching function (X bar lambda) that has high sensitivity in the red wavelength region. Spectral sensitivity compensation filter 61q is sensitive to the G (green) wavelength region. Due to this filter characteristic, sensor 62q is corrected to have a light receiving sensitivity of a color matching function (W bar lambda) that has high sensitivity in the green wavelength region. Spectral sensitivity compensation filter 61r is sensitive to the B (blue) wavelength region. Due to this filter characteristic, sensor 62r is corrected to have a light receiving sensitivity of a color matching function (Z bar lambda) that has high sensitivity in the blue wavelength region. Sensors 62p, 62q, and 62r each output light receiving signals corresponding to tristimulus values ​​(X, Y, Z).

[0031] The integrating unit 26 integrates the electrical signals output from the sensors 62p, 62q, and 62r. ​​By simultaneously integrating the electrical signals output from the sensors 62p, 62q, and 62r, the tristimulus value (X, Y, Z) signals can be converted into synchronous time-series signals. In other words, simultaneity can be ensured. Even if the integrating unit 26 does not ensure simultaneity, if the delay time of each signal is known in advance, the simultaneity of each signal can be ensured by correcting the time difference between each signal of the stimulus value that is finally output. In other words, if the time difference between each signal of the stimulus value that is finally output can be corrected, each signal can be considered to be a synchronous time-series signal. Note that the signals here may be measurement data or superimposed stimulus value data. Details of each data will be described later.

[0032] The A / D converter 31 converts the electrical signal (analog signal) input from the integrator 26 into a digital signal. The calculator also performs predetermined calculations such as correction of dark output, and calculations such as tristimulus values ​​(X, Y, Z) or xyY (chromaticity coordinates, luminance) established by the International Commission on Illumination (CIE).

[0033] The memory unit 32 stores the digital signal output from the A / D conversion unit 31. The control unit 36 ​​controls the measurement operation by centrally controlling the operation of each unit in the photometric and colorimetric device 1. The control unit 36 ​​uses the measurement data stored in the memory unit 32 to calculate tristimulus values ​​(X, Y, Z), xyY (chromaticity coordinates, luminance) established by CIE, and the like.

[0034] The control unit 36 ​​controls the light receiving unit 25, the integrating unit 26, the A / D converting unit 31, the storage unit 32, the power supply unit 37, and the communication unit 38. The control unit 36 ​​also generates superimposed stimulus value data and derives flicker indexes. The control unit 36 ​​may be connected to the object to be measured. By connecting to the object to be measured, the light emission conditions of the object during measurement can be set.

[0035] The power supply unit 37 transforms the voltage of the power supplied from an external AC adapter (not shown) and supplies the power to each component via the control unit 36 ​​.

[0036] The communication unit 38 outputs the calculation results of the control unit 36 ​​to the outside. The output calculation results are displayed in the form of a data list, graph, etc. on a personal computer (not shown) or the like. In addition, various information related to the measurement is input from the personal computer via the communication unit 38. Examples of the various information include measurement instructions, display mode settings, and measurement range.

[0037] [Arrangement of Various Substrates] The following describes the arrangement of various substrates provided in the photometric and colorimetric device 1. "Parallel" and "orthogonal" below mean "substantially parallel" and "substantially orthogonal" within the range of manufacturing error, etc., and specifically include an error range of ±5°.

[0038] Fig. 5 is a cross-sectional schematic diagram of the photometric and colorimetric device 1 of this embodiment. In the drawings described below, the direction of the optical axis L of the objective lens 21 is referred to as the X-axis, a first direction perpendicular to the optical axis L is referred to as the Y-axis, and a second direction perpendicular to both the optical axis L and the first direction is referred to as the Z-axis. Fig. 5 illustrates the internal configuration of the photometric and colorimetric device 1 when viewed from the second direction (Z-axis direction), with the Z-axis being perpendicular to the plane of the paper.

[0039] The photometric and colorimetric device 1 includes a first circuit board 41, a second circuit board 42, an analog board 43, etc. The analog board 43 is equipped with an integrator 26 and an A / D converter 31. The first circuit board 41 serves as a CPU board and is equipped with a memory unit 32 and a controller 36. The second circuit board 42 serves as a power supply board and is equipped with a power supply unit 37 and a communication unit 38.

[0040] 5, the first circuit board 41 may be a power supply board and the second circuit board 42 may be a CPU board, or the first circuit board 41 may be a CPU board and the second circuit board 42 may be a power supply board. Although the CPU board and the power supply board are separate boards, they may be combined into a single board. Also, they may be divided into three or more boards.

[0041] The CPU board is more likely to generate heat than other circuit boards such as the power supply board. Therefore, it is preferable that the CPU board be located farthest from the analog board 43 compared to the other circuit boards. This reduces the impact of heat on the analog board 43. In the example shown in FIG. 5, it is preferable that the second circuit board 42 is the CPU board.

[0042] In the photometric and colorimetric device 1, the above-mentioned components and circuit boards are provided inside a housing 49. The housing 49 forms the exterior of the photometric and colorimetric device 1. Furthermore, when the photometric and colorimetric device 1 is installed inside a combined measurement device, the housing 49 comes into contact with and is fixed to other components of the combined measurement device. In the example shown in Fig. 5, the housing 49 is a rectangular box, but the shape is not particularly limited.

[0043] The housing 49 includes a reference plate 45 and a support plate 30. The reference plate 45 is interposed between the barrel of the objective lens 21 and the beam splitter 24 in the direction of the optical axis L of the objective lens 21, and directly or indirectly holds the objective lens 21 and the beam splitter 24. The support plate 30 extends in the direction of the optical axis L on the optical path traveling side of the objective lens 21, and directly or indirectly holds the beam splitter 24, the light receiving unit 25, and the analog board 43. The support plate 30 also directly or indirectly holds the fixing plate 44.

[0044] In this embodiment, when the object to be held is referred to as a first object and the object holding it is referred to as a second object, "directly holding" means that the first object and the second object have a contact surface, while "indirectly holding" means that the first object and the second object do not have a contact surface, but that a third object is interposed between the first object and the second object.

[0045] 5, the reference plate 45 preferably has a principal surface positioned perpendicular to the optical axis L of the objective lens 21. The support plate 30 preferably has a principal surface positioned parallel to the optical axis L of the objective lens 21. In this specification, the term "principal surface" refers to the surface with the largest area among a plurality of surfaces.

[0046] 5 , the light beam incident surface A side of the light beam splitting member 24 is indirectly held by the reference plate 45 via a first support member 46. The light beam exit surfaces B1 to B3 of the light beam splitting member 24 and the light receiving unit 25 are indirectly held by the support plate 30 via a second support member 48.

[0047] The analog board 43 extends in the direction of the optical axis L of the objective lens 21. In other words, it is preferable that the main surface of the analog board 43 is positioned parallel to the support plate 30. It is preferable that the analog board 43 is positioned near the side of the light receiving unit 25 opposite to the beam splitter 24. This allows the wiring between the light receiving unit 25 and the analog board 43 to be short, and makes it less susceptible to the influence of noise even if the light receiving signal output from the light receiving unit 25 is weak.

[0048] The material of the housing 49 is not particularly limited. However, from the viewpoint of directly or indirectly connecting the support plate 30 to the analog board 43, it is preferable that the support plate 30 be made of a conductive material. This makes it possible to align the ground levels of various boards. In the example shown in FIG. 5 , the analog board 43 is indirectly held to the support plate 30 via a third support column 73. The material of the third support column 73 is also not particularly limited, but it is preferable that the third support column 73 contain a conductive material.

[0049] The photometric and colorimetric device 1 includes a fixing plate 44. In this embodiment, the term "fixing plate" refers to a member provided for directly or indirectly holding a circuit board separate from the analog board 43. The fixing plate 44 is indirectly held to the support plate 30 via the first support posts 71. By including the fixing plate 44, the photometric and colorimetric device 1 can attach a circuit board separate from the analog board 43 at any position, that is, at a position relatively far from the support plate 30. In other words, because there is no need to extend the circuit board separate from the analog board 43 in the direction of the optical axis L of the objective lens 21, the length of the photometric and colorimetric device 1 in the direction of the optical axis L (X-axis direction) can be shortened, resulting in a low profile.

[0050] 5 , the photometric and colorimetric device 1 includes a first circuit board 41 and a second circuit board 42 as circuit boards separate from the analog board 43. The first circuit board 41 and the second circuit board 42 are both indirectly held to the fixing plate 44 via second support posts 72.

[0051] The fixing plate 44 is preferably longer than the first circuit board 41 in the direction of the optical axis L of the objective lens 21. This allows the first circuit board 41 to be stably held. Similarly, the fixing plate 44 is preferably longer than the first circuit board 41 in the second direction (Z-axis direction). This allows the first circuit board 41 to be stably held. The first support pillar 71 that holds the fixing plate 44 needs to be attached so as to avoid the light receiving unit 25 and the analog board 43, so the fixing plate 44 has a certain size. On the other hand, the first circuit board 41 does not necessarily need to be approximately the same size as the fixing plate 44, as long as it has the desired function. Therefore, from the perspective of easier manufacturing, the first circuit board 41 is preferably smaller than the fixing plate 44. Furthermore, by providing the first support pillar 71 and the second support pillar 72 separately rather than integrally, the first circuit board 41 and the fixing plate 44, which is larger than the first circuit board 41, can be stably attached.

[0052] The first circuit board 41 and the second circuit board 42 may be held directly by the fixing plate 44 without using the second support posts 72. In this case, the first circuit board 41 and the second circuit board 42 are positioned so as not to contact or overlap with each other.

[0053] It is preferable that the fixing plate 44, the first support column 71, and the second support column 72 also contain a conductive material, which allows the ground levels of various substrates to be uniform.

[0054] If the fixing plate 44 contains a conductive material, there is a possibility of a short circuit occurring if patterns, solder joints, mounted parts, etc. included in various boards come into contact with the fixing plate 44. Therefore, the first circuit board 41 and the second circuit board 42 are indirectly held to the fixing plate 44 via the second support posts 72, thereby reducing the occurrence of a short circuit. Note that if the second support posts 72 are made of a conductive material, the points where the first circuit board 41 and the second support posts 72 contact each other and the points where the second circuit board 42 and the second support posts 72 contact each other become grounds. The analog board 43 is also indirectly held to the support plate 30 via the third support posts 73, thereby reducing the occurrence of a short circuit.

[0055] In this embodiment, the area bounded by two surfaces perpendicular to the optical axis L of the objective lens 21 and including both ends of the analog board 43 is referred to as the analog board envelope area AR1. It is preferable that at least a portion of the first circuit board 41 is located within the analog board envelope area. This shortens the length of the photometric and colorimetric device 1 in the optical axis L direction (X-axis direction), thereby reducing its height. Furthermore, in this embodiment, it is preferable that the first circuit board 41, the fixing plate 44, and the analog board 43 are positioned parallel to each other. In this case, it is preferable that the analog board 43 and the first circuit board 41 at least partially overlap when viewed from the first direction (Y-axis direction). This shortens the length of the photometric and colorimetric device 1 in the optical axis L direction (X-axis direction), thereby reducing its height.

[0056] An example of this embodiment will be compared with a conventional example. FIG. 6 is a cross-sectional schematic diagram of a conventional photometric and colorimetric device 100. In the example shown in FIG. 6, the analog board 43 is indirectly held to the support plate via a third support column 73. The first circuit board 41 and the second circuit board 42 extend farther from the objective lens 21 in the direction of the optical axis L (X-axis direction) of the objective lens 21 than the analog board 43 and are not located within the analog board envelope area AR1. The first circuit board 41 and the second circuit board 42 are indirectly held to the support plate 30 via a fourth support column 74. In other words, the conventional photometric and colorimetric device 100 indirectly holds all of the various boards by the support plate 30 and does not include a fixing plate 44.

[0057] 5 of this embodiment, a fixing plate 44 is provided on the analog board 43 in the first direction (Y-axis direction). The first circuit board 41 and the second circuit board 42 are held by the fixing plate 44 via the second support columns 72, and are positioned within the analog board envelope area AR1, and are stacked on top of each other on the analog board 43 when viewed from the first direction (Y-axis direction). This allows the photometric and colorimetric device 1 to have a low profile.

[0058] 7 and 8 are schematic diagrams for explaining the positional relationship of the various boards. Similar to FIG. 5, FIGS. 7 and 8 illustrate the positional relationship of the various boards when the photometric and colorimetric device 1 is viewed from the second direction (Z-axis direction), where the Z-axis is perpendicular to the paper surface. In FIG. 7, the photometric and colorimetric device 1 includes a first circuit board 41 in addition to the analog board 43. In FIG. 8, the photometric and colorimetric device 1 includes a second circuit board 42 in addition to the analog board 43 and the first circuit board 41.

[0059] In this embodiment, in the direction of the optical axis L of the objective lens 21, the end of the first circuit board 41 closest to the objective lens 21 is referred to as a first front end EA1, and the end farthest from the objective lens 21 is referred to as a first rear end EB1. Similarly, the end of the second circuit board 42 closest to the objective lens 21 is referred to as a second front end EA2, and the end farthest from the objective lens 21 is referred to as a second rear end EB2. The end of the analog board 43 closest to the objective lens 21 is referred to as a third front end EA3, and the end farthest from the objective lens 21 is referred to as a third rear end EB3. Hereinafter, in the direction of the optical axis L of the objective lens 21, the side closer to the objective lens will also be referred to as the front, and the side farther from the objective lens will also be referred to as the rear. Furthermore, the length W1 of the analog board 43 in the direction of the optical axis L corresponds to the distance between the third front end EA3 and the third rear end EB3.

[0060] In this embodiment, the "analog substrate envelope area" refers to an area bounded by two planes P1 and P2 that are perpendicular to the optical axis L of the objective lens 21 and include the third front end EA3 and the third rear end EB3 of the analog substrate 43, respectively. Planes P1 and P2 are parallel to the YZ plane. As long as at least a portion of the first circuit board 41 is located within the analog substrate envelope area AR1, there are no restrictions on its position in the first direction (Y-axis direction) or the second direction (Z-axis direction).

[0061] The second rear end EB2 of the second circuit board 42 is preferably located closer to the objective lens 21, i.e., further forward, than the first rear end EB1 of the first circuit board 41. This allows for a low profile of the photometric and colorimetric device 1. The second circuit board 42 may or may not be located within the analog board envelope area AR1.

[0062] The larger the area of ​​the first circuit board 41 located within the analog board envelope area AR1, the more preferable. Furthermore, the analog board 43 and the first circuit board 41 may completely overlap when viewed from the first direction (Y-axis direction). In the direction of the optical axis L of the objective lens 21, the area in which the analog board 43 is located is the area from the third front end EA3 to the third rear end EB3, and the area in which the first circuit board 41 is located is the area from the first front end EA1 to the first rear end EB1. As shown in FIG. 8 , the area from the third front end EA3 to the third rear end EB3 is preferably included in the area from the first front end EA1 to the first rear end EB1. This allows the photometric and colorimetric device 1 to be even thinner.

[0063] The photometric and colorimetric device 1 preferably includes a shield cover 63 that covers the periphery of the analog board 43. By covering with the shield cover 63, it is possible to make the analog board 43 less susceptible to the influence of noise even if the light receiving signal output from the light receiving unit 25 is weak. In this embodiment, it is preferable to include the shield cover 63 in the light receiving unit envelope area AR2.

[0064] FIG. 9 is an explanatory diagram of the light receiving unit envelope area in this embodiment. In this embodiment, the "light receiving unit envelope area" refers to a region that is located farther from the objective lens 21 (rearward) than the light receiving unit 25, among regions that are tangent to the edge of the light receiving unit 25 and have a boundary surface defined by a set of lines parallel to the optical axis L direction of the objective lens 21. The light receiving unit envelope area AR2 envelops the outer shape (edge ​​of the light receiving unit 25) of the light receiving unit 25 when viewed from the X-axis direction. Note that the edge of the light receiving unit 25 here refers to a circle that tangents the sensors 62p, 62q, and 62r included in the light receiving unit 25 at points and includes these sensors. The edge of the light receiving unit 25 includes the point farthest from the optical axis L on the edge of each of the sensors 62p, 62q, and 62r included in the light receiving unit 25.

[0065] The sensors 62p, 62q, and 62r provided in the light receiving unit 25 have anode and cathode terminals that extend elongated in the direction of the optical axis L. The first circuit board 41 and the second circuit board 42 are preferably located outside the light receiving unit envelope area AR2, avoiding the anode and cathode terminals of the sensors 62p, 62q, and 62r. ​​This allows the photometric and colorimetric device 1 to have a low profile. The light receiving unit envelope area AR2 can also be provided with a shield cover 63, reducing the influence of noise. In the conventional photometric and colorimetric device 100 shown in FIG. 6 , the first circuit board 41 and the second circuit board 42 are located within the light receiving unit envelope area AR2.

[0066] Fig. 10 is a cross-sectional schematic diagram of the photometric and colorimetric device 1 of this embodiment. Fig. 10 illustrates the internal configuration of the photometric and colorimetric device 1 when viewed from behind in the direction of the optical axis L (X-axis direction), where the X-axis is perpendicular to the paper surface.

[0067] In the first direction (Y-axis direction), the second circuit board 42, the first circuit board 41, the fixed plate 44, the analog board 43, and the support plate 30 are positioned in this order. The light receiving unit 25, which includes sensors 62p, 62q, and 62r, is positioned between the fixed plate 44 and the analog board 43. The fixed plate 44 is indirectly held to the support plate 30 via a first support column 71 that is longer than the light receiving unit 25 in the first direction (Y-axis direction). The fixed plate 44 is positioned between the first circuit board 41 and the light receiving unit 25.

[0068] There is no particular limitation on the length W2 of the analog board 43 in the second direction (Z-axis direction) perpendicular to the optical axis L. However, by making the length W2 in the second direction longer, the length W1 in the optical axis L direction can be shortened, and the photometric and colorimetric device 1 can be made even thinner.

[0069] The main surface of the analog board 43 and the main surface of the first circuit board 41 are preferably positioned parallel to each other. This allows the length of the photometric and colorimetric device 1 in the first direction (Y-axis direction) to be shortened, thereby enabling miniaturization. When the photometric and colorimetric device 1 includes the second circuit board 42, the main surface of the analog board 43, the main surface of the first circuit board 41, and the main surface of the second circuit board 42 are preferably positioned parallel to each other. This allows the length of the photometric and colorimetric device 1 in the first direction (Y-axis direction) to be shortened, thereby enabling miniaturization. In other words, from the perspective of miniaturization, it is preferable that the various boards are positioned parallel to each other, and it is also preferable that the fixing plate 44 and the support plate 30 are positioned parallel to each other. In the example shown in FIGS. 7, 8, and 10, the main surfaces of the various boards are parallel to the XZ plane.

[0070] 13 shows an example of a case in which the main surface of the analog substrate 43 and the main surfaces of the various substrates are not positioned parallel to each other. As will be described in detail later, in this modification, the fixing plate 44 has a cantilever structure relative to the support plate 30. Therefore, from the perspective of improving strength, the fixing plate 44 needs to be relatively thick, and the length of the photometric and colorimetric device 1 in the second direction (Z-axis direction) becomes relatively long. On the other hand, when the main surface of the analog substrate 43 and the main surfaces of the various substrates are positioned parallel to each other, the fixing plate 44 can be relatively thin, and the length of the photometric and colorimetric device 1 in the first direction (Y-axis direction) can be relatively short.

[0071] When viewed from a direction (Y-axis direction) perpendicular to the main surface of the analog board 43, it is preferable that the analog board 43 and the first circuit board 41 at least partially overlap. If the photometric and colorimetric device 1 includes the second circuit board 42, it is preferable that the analog board 43, the first circuit board 41, and the second circuit board 42 at least partially overlap. This allows the photometric and colorimetric device 1 to have a low profile. Furthermore, the support plate 30 can be made smaller, allowing the photometric and colorimetric device 1 to be made lighter.

[0072] The positions of the various substrates are not limited to the above examples, and other examples will be described below.

[0073] Fig. 11 is a schematic diagram (Variation 1) for explaining the positional relationship of the various substrates. Like Fig. 8, Fig. 11 illustrates the positional relationship of the various substrates when the photometric and colorimetric device 1 is viewed from the second direction (Z-axis direction), where the Z-axis is perpendicular to the paper surface.

[0074] In Modification 1, the fixed plate 44 is held to the support plate 30 via first support columns 71. The first circuit board 41 and the second circuit board 42 are indirectly held to the fixed plate 44 via second support columns 72. The first circuit board 41 is located within the analog board envelope area AR1. Furthermore, when viewed from the first direction (Y-axis direction), the analog board 43 and the first circuit board 41 overlap. This allows the length of the photometric and colorimetric device 1 in the optical axis L direction (X-axis direction) to be shortened, thereby reducing its height.

[0075] The second circuit board 42 is located in front of the first circuit board 41. That is, in the direction of the optical axis L of the objective lens 21, the region from the first front end EA1 to the first rear end EB1 in which the first circuit board 41 is located does not overlap with the region from the second front end EA2 to the second rear end EB2 in which the second circuit board 42 is located. With this configuration, the length of the photometric and colorimetric device 1 in the first direction (Y-axis direction) can be shortened, allowing for miniaturization.

[0076] <<Modification 2>> Figures 12 and 13 are schematic diagrams (Modification 2) for explaining the positional relationship of the various boards. Like Figure 8, Figure 12 illustrates the positional relationship of the various boards when the photometric and colorimetric device 1 is viewed from the second direction (Z-axis direction), with the Z-axis being perpendicular to the paper surface. In Figure 12, the first circuit board 41 located behind the fixing plate 44 is indicated by a dotted line. Figure 13 illustrates the positional relationship of the various boards when the photometric and colorimetric device 1 is viewed from the optical axis L direction (X-axis direction) of the objective lens 21, with the X-axis being perpendicular to the paper surface.

[0077] In Modification 2, the fixed plate 44 is held directly by the support plate 30. The main surfaces of the fixed plate 44 and the support plate 30 are perpendicular to each other. The first circuit board 41 and the second circuit board 42 are indirectly held by the fixed plate 44 via the second support posts 72. The first circuit board 41 is located within the analog board envelope area AR1. This shortens the length of the photometric and colorimetric device 1 in the optical axis L direction (X-axis direction), allowing for a low profile.

[0078] In the second modification, the fixed plate 44 has a cantilever structure relative to the support plate 30, and therefore, from the viewpoint of improving strength, it is preferable to make the fixed plate 44 thick. On the other hand, in the example shown in Fig. 8, the fixed plate 44 is firmly held via the four first support columns 71, and therefore, even if the fixed plate 44 is relatively thin, it still has sufficient strength.

[0079] In this embodiment, the photometric and colorimetric device 1 includes an objective lens 21, a light-receiving unit 25, an analog board 43, a first circuit board 41 separate from the analog board 43, a support plate 30, and a fixing plate 44. The light-receiving unit 25 has a plurality of sensors 62p, 62q, and 62r that receive light from the objective lens 21. The analog board 43 is equipped with a circuit that converts an analog signal from the light-receiving unit 25 into a digital signal. The support plate 30 extends in the direction of the optical axis L of the objective lens 21 on the optical path traveling side of the objective lens 21. The fixing plate 44 is held directly or indirectly by the support plate 30. The analog board 43 is held directly or indirectly by the support plate 30. The first circuit board 41 is held directly or indirectly by the fixing plate 44. This allows a circuit board separate from the analog board 43 to be attached at any position, even at a position relatively distant from the support plate 30. As a result, the length of the photometric and colorimetric device 1 in the optical axis L direction (X-axis direction) can be shortened, and the height can be reduced.

[0080] In this embodiment, the analog board envelope area is the area bounded by two surfaces (P1, P2) that are perpendicular to the optical axis L direction of the objective lens 21 and include both ends (EA3, EB3) of the analog board 43. In this case, it is preferable that at least a portion of the first circuit board 41 is located within the analog board envelope area AR1. This allows the length of the photometric and colorimetric device 1 in the optical axis L direction (X-axis direction) to be shortened, thereby reducing its height.

[0081] In this embodiment, it is preferable that the fixing plate 44 is indirectly held to the support plate 30 via the first support column 71. This allows a circuit board separate from the analog board 43 to be attached at a position relatively far away from the support plate 30. As a result, the length of the photometric and colorimetric device 1 in the optical axis L direction (X-axis direction) can be shortened, allowing for a low profile.

[0082] In the present embodiment, it is preferable that the first circuit board 41 be indirectly held to the fixing plate 44 via the second support posts 72. This can reduce the occurrence of a short circuit due to contact between the first circuit board 41 and the fixing plate 44.

[0083] In this embodiment, it is preferable that the main surface of the fixing plate 44 and the main surface of the support plate 30 are positioned parallel to each other. This allows the length of the photometric and colorimetric device 1 in the first direction (Y-axis direction) to be shortened, thereby enabling miniaturization.

[0084] In this embodiment, it is preferable that the main surface of the first circuit board 41, the main surface of the fixing plate 44, and the main surface of the analog board 43 are positioned parallel to each other, thereby shortening the length of the photometric and colorimetric device 1 in the first direction (Y-axis direction), and thereby enabling miniaturization.

[0085] In this embodiment, it is preferable that the analog board 43 and the first circuit board 41 at least partially overlap when viewed from a first direction (Y-axis direction) perpendicular to the optical axis L direction of the objective lens 21. This allows the length of the photometric and colorimetric device 1 in the optical axis L direction (X-axis direction) to be shortened, thereby making it possible to reduce its height.

[0086] In this embodiment, in the first direction (Y-axis direction), it is preferable that the fixing plate 44 be located between the first circuit board 41 and the light receiving unit 25. This allows the length of the photometric and colorimetric device 1 in the optical axis L direction (X-axis direction) to be shortened, thereby allowing for a low profile.

[0087] In this embodiment, the fixing plate 44 is preferably longer than the first circuit board 41 in a second direction (Z-axis direction) that is perpendicular to both the optical axis L direction of the objective lens 21 and the first direction (Y-axis direction). This allows the first circuit board 41 to be stably held.

[0088] In this embodiment, it is preferable to provide a second circuit board 42 that is separate from the analog board 43 and the first circuit board 41, and to have the fixing plate 44 hold both the first circuit board 41 and the second circuit board 42. This allows the length of the photometric and colorimetric device 1 in the optical axis L direction (X-axis direction) to be shortened, thereby enabling a low profile.

[0089] In this embodiment, it is preferable that the main surface of the first circuit board 41, the main surface of the second circuit board 42, and the main surface of the analog board 43 are positioned parallel to each other, thereby shortening the length of the photometric and colorimetric device 1 in the first direction (Y-axis direction), and thereby enabling miniaturization.

[0090] In this embodiment, the fixing plate 44 preferably contains a conductive material, which allows the ground levels of various substrates to be uniform.

[0091] In this embodiment, the first circuit board 41 is preferably a CPU board equipped with a circuit that calculates photometric and colorimetric values ​​from the digital signals converted by the analog board 43. This makes it possible to output photometric and colorimetric values ​​as measurement values.

[0092] In this embodiment, the first circuit board 41 or the second circuit board 42 is preferably a CPU board equipped with a circuit that calculates photometric and colorimetric values ​​from the digital signals converted by the analog board 43. This makes it possible to output photometric and colorimetric values ​​as measurement values.

[0093] In addition, the detailed configuration of each device that constitutes the photometric and colorimetric device can be modified as appropriate without departing from the spirit of the present disclosure.

[0094] The present disclosure makes it possible to provide a low-profile photometric and colorimetric device in which a circuit board other than an analog board can be attached at any position.

[0095] 1 Photometric and colorimetric device 12 Display surface 21 Objective lens 24 Light beam splitter 25 Light receiving unit 26 Integration unit 27 Measurement optical system 28 Light receiving system 30 Support plate 31 A / D conversion unit 32 Memory unit 37 Power supply unit 38 Communication unit 41 First circuit board 42 Second circuit board 43 Analog board 44 Fixing plate 45 Reference plate 46 First support member 48 Second support member 49 Housing 55 Optical fiber 56p, 56q, 56r Lens 61p, 61q, 61r Spectral sensitivity compensation filter 62p, 62q, 62r Sensor 63 Shield cover 71 First support pillar 72 Second support pillar 73 Third support pillar 74 Fourth support pillar AR1 Analog board envelope area AR2 Light receiving unit envelope area EA1 First front end EB1 First rear end EA2 Second front end EB2 Second rear end EA3 Third front end EB3 Third rear end

Claims

1. A photometric and colorimetric device comprising: an objective lens; a light receiving unit having a plurality of sensors that receive light from the objective lens; an analog board mounted with a circuit that converts an analog signal from the light receiving unit into a digital signal; a first circuit board separate from the analog board; a support plate extending in the optical axis direction of the objective lens on the optical path traveling side of the objective lens; and a fixed plate held directly or indirectly on the support plate, wherein the analog board is held directly or indirectly on the support plate, and the first circuit board is held directly or indirectly on the fixed plate.

2. The photometric and colorimetric device according to claim 1, wherein, when an area defined by two surfaces that are perpendicular to the optical axis direction of the objective lens and that include both ends of the analog board as boundary surfaces is defined as an analog board envelope area, at least a portion of the first circuit board is located within the analog board envelope area.

3. The photometric and colorimetric device according to claim 1, wherein the fixed plate is indirectly held to the support plate via a first support post.

4. The photometric and colorimetric device according to claim 1, wherein the first circuit board is indirectly held to a fixed plate via a second support.

5. The photometric and colorimetric device according to claim 1, wherein the main surface of said fixed plate and the main surface of said support plate are positioned parallel to each other.

6. The photometric and colorimetric device according to claim 1, wherein the main surface of said first circuit board, the main surface of said fixing plate, and the main surface of said analog board are positioned parallel to each other.

7. The photometric and colorimetric device according to claim 6, wherein the analog board and the first circuit board at least partially overlap when viewed from a first direction perpendicular to the optical axis direction of the objective lens.

8. The photometric and colorimetric device according to claim 7, wherein the fixing plate is located between the first circuit board and the light receiving unit in the first direction.

9. The photometric and colorimetric device according to claim 7, wherein the fixing plate is longer than the first circuit board in a second direction perpendicular to both the optical axis direction of the objective lens and the first direction.

10. The photometric and colorimetric device according to claim 1, further comprising a second circuit board separate from said analog board and said first circuit board, and said fixing plate holds said first circuit board and said second circuit board together.

11. The photometric and colorimetric device according to claim 10, wherein the main surface of the first circuit board, the main surface of the second circuit board, and the main surface of the analog board are positioned parallel to each other.

12. The photometric and colorimetric device according to claim 1, wherein the fixing plate contains a conductive material.

13. The photometric and colorimetric device according to claim 1, wherein the first circuit board is a CPU board on which a circuit is mounted that calculates photometric and colorimetric values ​​from the digital signals converted by the analog board.

14. The photometric and colorimetric device according to claim 10, wherein the first circuit board or the second circuit board is a CPU board equipped with a circuit that calculates photometric and colorimetric values ​​from the digital signals converted by the analog board.

Images