Optical module and optical communication device

Abstract

The present application relates to the technical field of optical communications. Disclosed are an optical module and an optical communication device. The optical module comprises a laser, an optoelectronic conversion assembly and an optical transmission structure, the laser and the optoelectronic conversion assembly being connected to each other by means of the optical transmission structure; the optical transmission structure comprises a hollow housing or an optical adhesive; coherent light emitted by the laser can be transmitted to the optoelectronic conversion assembly by means of a hollow cavity defined by the hollow housing, or can be transmitted to the optoelectronic conversion assembly by means of the optical adhesive. In this way, the overall cost of the optical module can be reduced, making it convenient to deploy in a metropolitan area network a large scale of optical communication devices to be used. In addition, the hollow housing or the optical adhesive can isolate the coherent light from external impurities, thereby helping to improve the transmission quality of the coherent light.

Description

Optical module and optical communication device

[0001] The present application claims priority to the Chinese patent application No. 202411323427.5, filed on September 20, 2024, and entitled "Optical module and optical communication device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of optical communication technology, and in particular to an optical module and an optical communication device. BACKGROUND

[0003] Coherent optical communication is a kind of optical fiber communication technology that uses the coherence of light to improve the performance of communication (such as the capacity and transmission distance of optical communication). The principle is based on the phase and frequency information of light waves, by setting a laser to emit laser light with a specific wavelength (hereinafter referred to as coherent light), and then the coherent light is coherently modulated or demodulated with electrical signals or optical signals, to realize the conversion between optical and electrical signals.

[0004] In the device based on optical communication, the optical module is a core component. The optical module usually includes a laser and an optoelectronic conversion assembly. The optoelectronic conversion assembly can convert electrical signals into optical signals based on the coherent light emitted by the laser and emit them outward, and can also demodulate the received optical signals based on the coherent light emitted by the laser and convert the optical signals into electrical signals.

[0005] At present, the laser and the optoelectronic conversion assembly are two separate devices in the optical module, and the connection cost between the laser and the optoelectronic conversion assembly is relatively high. For example, the laser and the optoelectronic conversion assembly need to be connected through a fusion fiber method, which leads to a high structural cost of the optical module, and limits the application of optical communication in long-distance transmission and sinking to the metropolitan network and other scenarios. SUMMARY

[0006] The embodiments of the present application provide an optical module and an optical communication device, which are used to reduce the structural cost of the optical module, so as to facilitate the application of the optical communication device in long-distance transmission and sinking to the metropolitan network and other scenarios.

[0007] In a first aspect, the present application provides an optical module, comprising: a laser, an optoelectronic conversion assembly, and an optical transmission structure. The laser comprises a first interface, the laser is configured to generate a first light and transmit the first light through the first interface; the optoelectronic conversion assembly comprises a second interface, the optoelectronic conversion assembly is configured to receive the first light through the second interface, and modulate the first light into a signal light according to an electrical signal, or demodulate the signal light into the electrical signal according to the first light; the optical transmission structure comprises an optical transmission channel, the optical transmission channel is configured to transmit the first light from the first interface to the second interface; wherein the optical transmission structure comprises a hollow cover, a hollow cavity surrounded by the hollow cover is configured to form the optical transmission channel; or the optical transmission structure comprises an optical path glue, the optical path glue is configured to form the optical transmission channel.

[0008] According to the embodiments of the present application, the laser and the optoelectronic conversion assembly are not connected by a fusion fiber, but are connected by a hollow cover or an optical path glue. The coherent light emitted by the laser can be transmitted to the optoelectronic conversion assembly through the hollow cavity surrounded by the hollow cover, or can be transmitted to the optoelectronic conversion assembly through the optical path glue. In this way, compared with the fusion fiber, the material cost and the manufacturing cost of the hollow cover or the optical path glue are both low, and the hollow cover or the optical path glue can isolate the coherent light from impurities (such as dust and water vapor, etc.) in the external environment, thereby ensuring the transmission quality of the coherent light.

[0009] In some embodiments of the above aspect, the hollow cover extends along a first direction, the first direction being a line direction of the first interface and the second interface; and the hollow cover has openings at both ends along the first direction, one of the openings being connected with the first interface and the other being connected with the second interface.

[0010] In some embodiments, the hollow cover is made of a light-proof material, for example, the transmittance of the hollow cover is 0%. The material of the hollow cover can be a light-proof material such as stainless steel. Specifically, the model of the stainless steel can be 304, and the composition of the 304 stainless steel includes iron, chromium and nickel. In the 304 stainless steel, the content of chromium ranges from 18% to 20%, and the content of nickel ranges from 8% to 10%.

[0011] In some embodiments of the above aspect, the extension path of the optical path glue is a straight line path parallel to the first direction, the first direction being a line direction of the first interface and the second interface; the optical path glue has a first refractive index, the first refractive index causing the first light to be transmitted linearly along the first direction in the optical path glue or to be totally reflected and transmitted in the optical path glue.

[0012] The extension path of the light path glue is a straight line path parallel to the connecting direction of the first interface and the second interface, and the refractive index of the light path glue ranges from 1.4 to 1.5, for example, the refractive index can be 1.4, 1.42, 1.45, 1.47 or 1.5, etc. The above-mentioned refractive index makes the coherent light transmit in the light path glue along a straight line parallel to the connecting direction of the first interface and the second interface, or totally reflects and transmits in the light path glue.

[0013] In some embodiments of the above aspect, the extension path of the light path glue is a curved path, and the light path glue has a first refractive index, which makes the first light totally reflect and transmit in the light path glue.

[0014] The refractive index of the light path glue ranges from 1.4 to 1.5, for example, the first refractive index can be 1.4, 1.42, 1.45, 1.47 or 1.5, etc. The above-mentioned refractive index makes the coherent light totally reflect and transmit in the light path glue, thereby reducing the scattering of the coherent light and improving the transmission efficiency.

[0015] In some embodiments of the above aspect, the size of each cross section of the hollow cover body is the same, and the cross section is a cross section perpendicular to the extension direction of the hollow cover body.

[0016] In this way, the shape of each position in the hollow cavity is uniform. Specifically, the cross-sectional shape can be circular, square, rectangular or other shapes.

[0017] In some embodiments of the above aspect, the size of each cross section of the light path glue is the same, and the cross section is a cross section perpendicular to the extension direction of the light path glue.

[0018] In this way, the uniformity of the size of the light path glue is facilitated, and the transmission effect of the parallel light or quasi-parallel light in the light path glue is improved. Specifically, the cross-sectional shape can be circular, square, rectangular or other shapes.

[0019] In some embodiments of the above aspect, the optical module further comprises a wavelength detection unit and a wavelength control unit; the wavelength detection unit is located in the light transmission channel or the photoelectric conversion assembly, and is configured to detect the wavelength of the first light; the wavelength control unit is connected with the wavelength detection unit and the laser, and is configured to control the laser according to the detection result of the wavelength detection unit, so that the wavelength of the first light generated by the laser is within a preset wavelength range.

[0020] In this way, the emission wavelength conforms to the ITU standard, so as to ensure the interoperability between different devices and systems, the clarity and transmission quality of signals, and the compatibility and effectiveness of optical communication in the global range.

[0021] In some embodiments of the above aspect, the laser includes a transmitting unit configured to transmit the first light to the optical transmission structure via the first interface; and a wavelength control unit connected to the transmitting unit, the wavelength control unit configured to control the transmitting unit according to the detection result of the wavelength detection unit, so that the wavelength of the first light generated by the transmitting unit is within a preset wavelength range.

[0022] In some embodiments of the above aspect, the photoelectric conversion assembly includes an integrated coherent transceiver configured to modulate the first light into a signal light according to the electrical signal, or demodulate the signal light into the electrical signal according to the first light; and the wavelength detection unit is located in the integrated coherent transceiver.

[0023] In some embodiments of the above aspect, the laser further includes a temperature control unit connected to the transmitting unit, wherein the temperature control unit is configured to control the transmitting unit so that the temperature of the transmitting unit is within a preset temperature range.

[0024] The temperature control unit can be a thermoelectric refrigerator (TEC) to cool or heat the transmitting unit, so that the transmitting unit is kept at a stable temperature. It should be noted that the temperature control unit can also be other devices, and the application does not limit the specific type of the temperature control unit.

[0025] In some embodiments of the above aspect, the laser further includes a first alignment unit connected to the transmitting unit, wherein the transmitting unit is configured to transmit the first light to the second interface via the first alignment unit and the first interface in sequence; or the optical transmission channel is provided with the first alignment unit, and the transmitting unit is connected to the first alignment unit, wherein the transmitting unit is configured to transmit the first light to the second interface via the first alignment unit and the first interface in sequence.

[0026] The first alignment unit can include an optical reflector or an optical transmission mirror, etc., so as to adjust the angle and position of the coherent light or the signal light, to ensure that the light of the coherent light or the signal light propagates along a predetermined path.

[0027] In some embodiments of the above aspect, the photoelectric conversion assembly further includes a signal amplification unit connected to the integrated coherent transceiver, wherein the signal amplification unit is configured to receive and amplify the electrical signal, and transmit the electrical signal to the integrated coherent transceiver, or receive and amplify the electrical signal output by the integrated coherent transceiver.

[0028] The signal amplification unit can be an optical radio frequency integrated circuit (oRFIC). The oRFIC can include a driver function and a transimpedance amplification (TIA) function. The driver function is used for electrical signal amplification in the signal uplink process, and the TIA function is used for electrical signal amplification in the signal downlink process.

[0029] In some embodiments of the above aspect, the optoelectronic conversion assembly further includes a second alignment unit, and the integrated coherent transceiver unit is connected to the second alignment unit. The first light is transmitted to the integrated coherent transceiver unit in sequence via the second interface and the second alignment unit. Alternatively, the second alignment unit is arranged in the optical transmission channel, and the integrated coherent transceiver unit is connected to the second alignment unit. The first light is transmitted to the integrated coherent transceiver unit in sequence via the second alignment unit and the second interface.

[0030] In this way, the second alignment unit can include an optical mirror or an optical lens, etc., so as to adjust the angle and position of the coherent light or the signal light, to ensure that the light of the coherent light or the signal light propagates along a predetermined path.

[0031] In some embodiments of the above aspect, the optical module further includes a digital signal processor connected to the optoelectronic conversion assembly. The digital signal processor is configured to receive an electrical signal output by the terminal device and perform a first processing on the electrical signal, and transmit the processed electrical signal to the optoelectronic conversion assembly, or receive an electrical signal output by the optoelectronic conversion assembly and perform a second processing on the electrical signal, and transmit the processed electrical signal to the terminal device. The first processing includes one or more of decoding, demodulation, recovery, and physical impairment compensation. The second processing includes one or more of decoding, demodulation, recovery, and physical impairment compensation.

[0032] In a second aspect, the present application also provides an optical communication device, which includes a housing and the optical module described in any one of the embodiments of the present application. The optical module is located in the housing.

[0033] The beneficial effects of the above-mentioned second aspect can be referred to the related description of the above-mentioned first aspect and various embodiments of the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the present application, the drawings used in the embodiments will be briefly introduced as follows.

[0035] FIG. 1 shows a schematic diagram of the overall architecture of an optical communication network according to some embodiments of the present application.

[0036] FIG. 2 illustrates a structure diagram of a metropolitan area network 2000, according to some embodiments of the present disclosure;

[0037] FIG. 3 illustrates a structure diagram of an optical module 20', according to some embodiments of the present disclosure;

[0038] FIG. 4A illustrates a structure diagram of a first optical module 20, according to some embodiments of the present disclosure;

[0039] FIG. 4B illustrates a structure diagram of a second optical module 20, according to some embodiments of the present disclosure;

[0040] FIG. 5 illustrates a structure diagram of a second optical module 20', according to some embodiments of the present disclosure;

[0041] FIG. 6A illustrates a structure diagram of a third optical module 20, according to some embodiments of the present disclosure;

[0042] FIG. 6B illustrates a structure diagram of a fourth optical module 20, according to some embodiments of the present disclosure;

[0043] FIG. 6C illustrates a structure diagram of a fifth optical module 20, according to some embodiments of the present disclosure;

[0044] FIG. 7A illustrates a structure diagram of a sixth optical module 20, according to some embodiments of the present disclosure;

[0045] FIG. 7B illustrates a structure diagram of a seventh optical module 20, according to some embodiments of the present disclosure;

[0046] FIG. 7C illustrates a structure diagram of an eighth optical module 20, according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0047] Illustrative embodiments of the present disclosure include, but are not limited to, optical modules, optical communication devices.

[0048] For ease of understanding, the optical communication process is described below based on the overall architecture of the optical communication network.

[0049] FIG. 1 shows a schematic diagram of an overall architecture of an optical communication network. Referring to FIG. 1, the optical communication network includes a terminal device 1000, an access network 5000, a metropolitan area network 2000, a core network 3000, and a data center 4000. In the uplink process of a signal, the terminal device 1000 can output an electrical signal, the access network 5000 can transmit the electrical signal to the metropolitan area network 2000, the electrical signal can be converted into an optical signal in the metropolitan area network 2000, the optical signal can be transmitted to the core network 3000 and delivered to the data center 4000, and can also be stored in the data center 4000. In the downlink process of a signal, the optical signal can be delivered to the metropolitan area network 2000 via the core network 3000, and converted into an electrical signal in the metropolitan area network 2000, and then the electrical signal can be transmitted to the terminal device 1000 via the access network 5000. Therefore, in the architecture of the optical communication network, the metropolitan area network 2000 plays a core role in optical-electrical conversion.

[0050] FIG. 2 shows a schematic diagram of a structure of the metropolitan area network 2000. Referring to FIG. 2, the metropolitan area network 2000 includes an optical communication device 200, the optical communication device 200 includes a shell 21 and an optical module 20, and the optical module 20 is located in a receiving cavity formed by the shell 21. In this application, the optical communication device 200 can be a packet transport network (PTN) device, a base band unit (BBU) device, a network element (NE) device, an internet protocol (IP) device (such as a repeater, a router, a switch, and a server, etc.), an optical transport network (OTN) device, and an optical switching node (OSN) device, etc. The type and form of the optical communication device are not limited in the embodiments of this application. It should be noted that the optical module mentioned in the embodiments of this application can also be applied to other types of optical communication devices. In addition, in some other scenarios, the optical-electrical conversion can also be performed in the core network 3000, and thus the optical communication device 200 and the optical module 20 can also be arranged in the core network 3000.

[0051] The structure and principle of the optical module 20 in the optical communication device 200 are introduced as follows.

[0052] FIG. 3 shows a schematic diagram of a structure of an optical module 20' in some embodiments. The optical module 20' can be an example of the optical module 20 in FIG. 2.

[0053] Referring to FIG. 3, the optical module 20' includes an optical digital signal processor (oDSP) 220, an optoelectronic conversion assembly 210 and a laser 230 connected in sequence. The optoelectronic conversion assembly 210 includes a transmitting end TX1 and a receiving end RX2, the transmitting end TX1 can transmit optical signals, and the receiving end RX2 can receive optical signals. The digital signal processor 220 includes a receiving end RX1 and a transmitting end TX2, the receiving end RX1 can be used to receive electrical signals, and the transmitting end TX2 can transmit electrical signals.

[0054] In the signal uplink process, the digital signal processor 220 receives electrical signals through the receiving end RX1, and can perform digital signal processing (such as decoding, demodulation, recovery or physical damage compensation of the electrical signals) on the received electrical signals, and can also send the processed electrical signals to the optoelectronic conversion assembly 210. The laser 230 can send coherent light to the optoelectronic conversion assembly 210. The optoelectronic conversion assembly 210 can coherently modulate the coherent light based on the processed electrical signals. Specifically, the optoelectronic conversion assembly 210 changes the phase, frequency and amplitude of the coherent light through the electrical signals, so that the coherent light is converted into optical signals (hereinafter referred to as signal light) carrying the information of the electrical signals, and the signal light is transmitted outward through the transmitting end TX1, for example, to the core network 3000.

[0055] In the signal downlink process, the optoelectronic conversion assembly 210 receives signal light (for example, receives signal light from the core network 3000) through the receiving end RX2. The laser 230 can send coherent light to the optoelectronic conversion assembly 210. The optoelectronic conversion assembly 210 can demodulate the signal light based on the coherent light. Specifically, the optoelectronic conversion assembly 210 can interfere between the coherent light and the signal light and generate an interference optical signal, the interference optical signal can reflect the information carried in the signal light, and then the optoelectronic conversion assembly 210 converts the interference optical signal into an electrical signal and sends it to the digital signal processor 220. The digital signal processor 220 can perform digital signal processing (such as decoding, demodulation and recovery of the electrical signals) on the electrical signals, and the processed electrical signals are transmitted through the transmitting end TX2, for example, to the terminal device 1000 through the access network 5000.

[0056] At present, the laser 230 and the optoelectronic conversion assembly 210 are generally connected by fusion splicing optical fibers (fusion fibers), so that the coherent light enters the optoelectronic conversion assembly 210. However, the cost of the optical fiber itself and the cost required by the fusion splicing process of the optical fiber are both high, which will increase the cost of the optical module 20', thereby increasing the cost of the optical communication device 200, which is not conducive to the wide and large-scale application of the optical communication device 200, for example, not conducive to the large-scale sinking of the optical communication device 200 into the metropolitan area network 2000 for application.

[0057] Therefore, in order to solve the problem of high cost of the optical module, the embodiment of the present application provides an optical module, in which the laser and the photoelectric conversion assembly are not connected by a fusion fiber, but are connected by a hollow cover or an optical path glue. The coherent light emitted by the laser can be transmitted to the photoelectric conversion assembly via the hollow cavity surrounded by the hollow cover, or can be transmitted to the photoelectric conversion assembly via the optical path glue. In this way, compared with the fusion fiber, the material cost and the preparation cost of the hollow cover or the optical path glue are both low, and the hollow cover or the optical path glue can isolate the coherent light from impurities (such as dust and water vapor) in the external environment, thereby ensuring the transmission quality of the coherent light.

[0058] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0059] Herein, the reference sign "20'" is used to represent the optical module mentioned in the background art, the reference sign "20" is used to represent the optical module provided by the embodiment of the present application, and in different drawings, the optical module 20 shows different exemplary structures.

[0060] It should be noted that the optical module in each embodiment of the present application can be a coherent light module, which can be used to process coherent light signals, specifically, to generate, analyze, receive, emit and transmit coherent light.

[0061] The first embodiment of the optical module of the present application will be described in detail below with reference to FIG. 4A.

[0062] FIG. 4A shows a structural schematic diagram of the optical module 20 in some embodiments. In the optical module 20, a hollow cover 240 is arranged, and a hollow cavity 241 surrounded by the hollow cover 240 is used to realize the transmission of coherent light. Since the material cost and the preparation cost of the hollow cover 240 are lower than those of the fusion fiber, the overall cost of the optical module 20 can be reduced.

[0063] Referring to FIG. 4A, the optical module 20 includes a digital signal processor 220, a photoelectric conversion assembly 210 and a laser 230 connected in sequence. The photoelectric conversion assembly 210 includes a transmitting end TX1 and a receiving end RX2. The transmitting end TX1 can emit an optical signal to the outside, and the receiving end RX2 can receive an optical signal. The digital signal processor 220 includes a receiving end RX1 and a transmitting end TX2. The receiving end RX1 can be used to receive an electrical signal, and the transmitting end TX2 can send an electrical signal.

[0064] The laser 230 comprises an interface C1 (as an example of a first interface), and the laser 230 is configured to generate coherent light (as an example of first light) and is capable of emitting the coherent light through the interface C1. The photoelectric conversion assembly 210 comprises an interface C2 (as an example of a second interface), and the photoelectric conversion assembly 210 is capable of receiving the coherent light through the interface C2. The interface C1 and the interface C2 have an optical transmission structure, which is a hollow cover 240, and a hollow cavity 241 enclosed by the hollow cover 240 is configured to form an optical transmission channel capable of transmitting the coherent light from the interface C1 to the interface C2.

[0065] In the signal uplink process, the photoelectric conversion assembly 210 is capable of modulating the coherent light into signal light according to an electrical signal (for example, an electrical signal transmitted from the digital signal processor 220); in the signal downlink process, the photoelectric conversion assembly 210 is capable of demodulating the signal light (for example, signal light transmitted from the core network 3000) into an electrical signal according to the coherent light. The modulation process in the signal uplink and the demodulation process in the signal downlink can refer to the related description above, and will not be described here. In the embodiment of the present application, the coherent light is parallel light or quasi-parallel light. Since the light rays of the parallel light remain parallel, and the light rays of the quasi-parallel light are almost parallel, the light beam of the coherent light will not significantly diffuse in the propagation process, and the uniformity of the light beam reduces the influence of the tiny errors in the light source or the system, so that the tolerance of the coherent light in the transmission to the photoelectric conversion assembly 210 is larger, to improve the fault tolerance rate of the coherent light transmission.

[0066] In the embodiment of the present application, the area of each cross section perpendicular to the extension direction of the hollow cavity 241 (that is, the transmission direction of the coherent light) in the hollow cavity 241 is the same or similar, to facilitate the uniformity of the size of the hollow cavity 241 and improve the effect of the parallel light or quasi-parallel light transmission in the hollow cavity 241.

[0067] In the embodiment of the present application, the extension direction of the hollow cavity 241 enclosed by the hollow cover 240 is parallel to the connection direction of the interface C1 and the interface C2 (as an example of a first direction), and the two ends of the extension direction of the hollow cavity 241 are in a non-closed state, that is, the hollow cover 240 has openings at the two ends along the extension direction, one of the two openings is connected with the interface C1, and the other is connected with the interface C2. Specifically, the edge of the opening can be connected and fixed with the edge of the interface, for example, by using glue. Moreover, the coherent light can be transmitted in a straight line from the interface C1 to the interface C2 in the hollow cavity 241, and the parallel light or quasi-parallel light is transmitted in a straight line in the hollow cavity 241 without contacting the inner wall of the hollow cover 240, to avoid causing the loss of the coherent light, thereby improving the transmission efficiency.

[0068] In the embodiments of the present application, the air pressure in the hollow cavity 241 can be the same as or similar to the air pressure outside the optical module 20. For example, when the air pressure of the external environment is atmospheric pressure, the air pressure in the hollow cavity 241 can be near the atmospheric pressure, i.e., near 1.013*10^5 Pa (Pascal). It can be understood that, since the transmission path of the coherent light in the hollow cavity 241 is short, the coherent light will not contact the hollow cover 240 before being transmitted to the interface C2, so as to ensure that the coherent light can be transmitted linearly in the hollow cavity 241.

[0069] In some embodiments, the hollow cover 240 is made of a light-proof material, in particular, a light-proof material such as stainless steel. In particular, the model of the stainless steel can be 304, and the composition of the 304 stainless steel includes iron, chromium and nickel. In the 304 stainless steel, the content of chromium ranges from 18% to 20%, and the content of nickel ranges from 8% to 10%.

[0070] In some embodiments, the size of each cross section of the hollow cover 240 is the same, and the cross section is a section perpendicular to the extension direction of the hollow cover 240, so that the shape of the hollow cavity 241 is uniform.

[0071] With reference to FIG. 4A, the shape of the hollow cover 240 can be a hollow cylinder, and in other embodiments, can also be a hollow cuboid, a hollow square, etc. In addition, the size of the interfaces C1 and C2 can be the same as the size of the openings connected thereto, i.e., the interfaces C1 and C2 can be connected to the openings at both ends of the hollow cover 240 in a full correspondence, so that the coherent light can enter the hollow cavity 241 through the interface C1 and enter the photoelectric conversion assembly 210 through the interface C2.

[0072] For example, in a specific embodiment, when the hollow cover 240 is a hollow cylinder, and the openings at both ends are circular, the interfaces C1 and C2 can be circular with the same size as the openings; when the hollow cover 240 is a hollow cuboid, and the openings at both ends are rectangular, the interfaces C1 and C2 can be rectangular with the same size as the openings; when the hollow cover is a hollow cuboid, and the openings at both ends are square, the interfaces C1 and C2 can be square with the same size as the openings.

[0073] Specifically, in some embodiments, the interface C2 is a square, and the side length of the square can range from greater than or equal to 10 μm. For example, the side length of the square can be 10 μm, 11 μm, or 12 μm, and the like. In some other embodiments, the interface C2 is a circle, and the diameter of the circle can range from greater than or equal to 10 μm. For example, the side length of the circle can be 10 μm, 11 μm, or 12 μm, and the like. Referring to FIG. 3, in the optical module 20', the interfaces at both ends of the fiber, i.e., the interface on the laser 230 and the interface on the photoelectric conversion assembly 210, are usually small in size, for example, the side length of the square interface or the diameter of the circular interface is usually set to about 4 μm. The embodiments of the present application increase the size of the interface C2 on the photoelectric conversion assembly 210 to expand the beam of the coherent light from a small spot to a larger spot size, thereby reducing the spatial power density of the beam. In this way, the energy of the beam is distributed in a larger area, reducing the requirement for the alignment accuracy of the optical path, and better covering the alignment errors or other minor errors in the transmission of the coherent light, thereby increasing the fault tolerance of the optical module 20.

[0074] The second embodiment of the optical module of the present application will be described in detail below in conjunction with FIG. 4B.

[0075] FIG. 4B shows a structural schematic diagram of the optical module 20 in some embodiments. In the optical module 20, the optical path glue 242 is arranged to connect the laser 230 and the photoelectric conversion assembly 210, so that the coherent light is transmitted in the optical path glue 242. Since the material cost and the preparation cost of the optical path glue 242 are lower than those of the fiber, the overall cost of the optical module 20 can be reduced.

[0076] It can be understood that the difference between the structure shown in FIG. 4B and the structure shown in FIG. 4A is that the optical path glue 242 is used as the optical transmission structure in FIG. 4B. Therefore, the remaining structures in FIG. 4B can refer to the related descriptions in the above embodiments, and the following will not be described again.

[0077] Referring to FIG. 4B, the optical transmission structure between the interface C1 and the interface C2 is the optical path glue 242, which is a solid structure. The coherent light is emitted from the interface C1 and transmitted to the interface C2 via the optical path glue 242, i.e., the optical path glue 242 is the transmission medium of the coherent light. In the optical module 20, the refractive index of the optical path glue 242 matches the refractive index at the interface C1 of the laser 230 and the refractive index at the interface C2 of the photoelectric conversion assembly 210, thereby reducing the reflection and scattering loss of the coherent light on the interface of different media and improving the optical transmission efficiency.

[0078] In the embodiments of the present application, the coherent light is parallel light or quasi-parallel light to avoid causing loss of the coherent light, thereby improving the transmission efficiency.

[0079] In the embodiments of the present application, the sizes of the cross sections of the light path glue are the same, and the cross section is a section perpendicular to the extension direction of the light path glue, so as to facilitate the uniformity of the sizes of the light path glue 242 and improve the effect of the parallel light or quasi-parallel light transmission in the light path glue 242. Specifically, the section shape can be circular, square, rectangular or other shapes.

[0080] With continuous reference to FIG. 4B, the extension path of the light path glue 242 can be a curved path, and the range of the refractive index (as an example of the first refractive index) of the light path glue 242 can be 1.4-1.5, for example, the first refractive index can be 1.4, 1.42, 1.45, 1.47 or 1.5, etc. The above refractive index makes the coherent light transmit by total reflection in the light path glue 242, so as to reduce the scattering of the coherent light and improve the transmission efficiency.

[0081] In some other embodiments, the extension path of the light path glue 242 is a straight line path parallel to the connecting direction (as an example of the first direction) of the interface C1 and the interface C2, and the range of the refractive index (as an example of the first refractive index) of the light path glue 242 can be 1.4-1.5, for example, the first refractive index can be 1.4, 1.42, 1.45, 1.47 or 1.5, etc. The above refractive index makes the coherent light transmit in a straight line parallel to the connecting direction of the interface C1 and the interface C2 in the light path glue 242, or transmit by total reflection in the light path glue 242. The coherent light can transmit by total reflection in the light path glue 242 (for example, the coherent light transmission path shown in FIG. 4B), or the coherent light can transmit in a straight line in the light path glue 242 (for example, the coherent light transmission path shown in FIG. 4A).

[0082] In some embodiments, the light path glue is a solid light-transmitting material, and specifically, the material of the light path glue can include one or more of epoxy resin type material, silica gel type material, acrylate type material. It should be noted that the light path glue can also use other light-transmitting materials, which are not limited in the present application.

[0083] In some embodiments, the preparation method of the light path glue can be that the solid reactants directly react to form a solid material, or the solid material can be formed by a liquid curing method. Specifically, the liquid curing method can include one or more of ultraviolet (UV) curing, thermal curing, moisture curing. It should be noted that the light path glue can also be formed by other preparation methods, which are not limited in the present application.

[0084] In some embodiments, the two ends of the light path glue 242 are connected with the interface C1 and the interface C2 respectively, and the end face shape and size of the two ends of the light path glue 242 can refer to the related description of the shape and size of the two end openings of the hollow cover 242, and the shape and size of the interface C1 and the interface C2 can also refer to the related description above, which will not be repeated here.

[0085] In addition, at present, the laser 230 in the optical module 20' shown in FIG. 3 has a high cost, which further increases the cost of the optical module 20'. A specific structure of the laser 230 shown in FIG. 3 will be described in detail below with reference to FIG. 5.

[0086] FIG. 5 shows a structural schematic diagram of the optical module 20' in some embodiments. In FIG. 5, the laser 230 can be an exemplary structure of the laser 230 in FIG. 3, and other structures in FIG. 5 are the same as those in FIG. 3.

[0087] Referring to FIG. 5, the laser 230 includes a transmitting unit 231 and a wavelength locker 232 (WVL) connected with the transmitting unit 231. The transmitting unit 231 is configured to emit continuous wave (CW) laser with a specific wavelength, and the WVL 232 is configured to ensure the wavelength stability of the laser emitted by the transmitting unit 231. Specifically, when the WVL 232 detects that the wavelength of the coherent light emitted by the transmitting unit 231 deviates from a preset target wavelength, the WVL 232 can adjust the working parameters (such as temperature, current, etc.) of the transmitting unit 231, so as to adjust the wavelength of the coherent light emitted by the transmitting unit 231.

[0088] The transmitting unit 231 and the WVL 232 need to be connected and fixed and integrally packaged, for example, packaged by a metal packaging box to form a laser 230 with a packaging box. However, the packaging box has a high cost, and the fixation of the WVL 232 in the packaging box further increases the size of the packaging box, resulting in an increase in packaging cost. In addition, when the laser 230 is tested before leaving the factory, if the WVL 232 is detected to be abnormal, the packaging box needs to be opened to repair or replace the WVL 232, and the laser 230 needs to be integrally packaged again, thereby increasing the cost of the laser 230 before leaving the factory.

[0089] Therefore, in order to solve the problem of high cost of the laser 230, the application provides an optical module, in which the WVL 232 is not arranged in the laser 230, but the function of detecting the wavelength of the WVL 232 is arranged in an optical transmission structure (for example, an optical path glue or a hollow cover) or an optoelectronic conversion assembly, and the function of controlling the wavelength of the WVL 232 is arranged outside the laser 230, so as to reduce the packaging cost and the cost of the laser 230, thereby further reducing the cost of the optical module 20 on the basis of arranging the optical path glue or the hollow cover, and facilitating the large-scale sinking of the optical communication device 200 into the metropolitan area network for application.

[0090] The application provides three different embodiments of the optical module, which will be described in detail below with reference to FIGS. 6A-6C. In FIGS. 6A-6C, the WVL 232 in FIG. 5 is replaced by arranging a wavelength detection unit 250 and a wavelength control unit 260 at different positions, so as to further reduce the cost of the optical module.

[0091] The third embodiment of the optical module of the application will be described in detail below with reference to FIG. 6A.

[0092] FIG. 6A shows a structural schematic diagram of the optical module 20 in some embodiments. The optical module 20 in FIG. 6A is different from the optical module 20' in FIG. 5 in that the optical transmission structure between the laser 230 and the optoelectronic conversion assembly 210 in FIG. 6A is a hollow cover 240, and the WVL is not arranged inside the laser 230 in FIG. 6A, but a wavelength detection unit 250 is arranged in the hollow cavity 241, and a wavelength control unit 260 connected to the wavelength detection unit 250 and the emitting unit 231 is arranged outside the hollow cover 240.

[0093] It can be understood that the hollow cover 240 and other structures in FIG. 6A are the same as those shown in FIG. 4A, and therefore the related description in the above embodiments can be referred to, which will not be described herein again.

[0094] In some embodiments, the emitting unit 231 can include a laser chip, wherein the laser chip is a miniature electronic device integrating a laser emitting source, and is used for emitting coherent light.

[0095] In some embodiments, the wavelength detection unit 250 can be placed or fixed on the inner wall of the hollow cover 240, so that a part of the coherent light can enter the wavelength detection unit 250 when the coherent light is transmitted in the hollow cavity 241, so as to detect the wavelength of the coherent light in the hollow cavity 241 by using the wavelength detection unit 250.

[0096] In some embodiments, the wavelength detection unit 250 can be a spectrum sensor, or can also be other wavelength detection devices, and the application does not make any limitation on the specific structure of the wavelength detection unit 250.

[0097] Specifically, the working principle of the wavelength detection unit 250 and the wavelength control unit 260 is that the wavelength detection unit 250 can detect the wavelength of the coherent light in the hollow cavity 241, compare the detected wavelength with the preset target wavelength, calculate the deviation, generate a deviation signal and transmit it to the wavelength control unit 260, and the wavelength control unit 260 can control the working parameters (such as temperature, current, etc.) of the emission unit 231 according to the deviation signal to adjust the emission wavelength of the emission unit 231 to the target wavelength. Alternatively, in other embodiments, the wavelength detection unit 250 can detect the wavelength of the coherent light in the hollow cavity 241, generate a detection signal (optical signal or electrical signal), and transmit it to the wavelength control unit 260, and the wavelength control unit 260 can generate a deviation signal by comparing the detection signal and the target wavelength, and control the working parameters (such as temperature, current, etc.) of the emission unit 231 according to the deviation signal, so that the emission wavelength of the emission unit 231 is within the preset wavelength range.

[0098] In some embodiments, the above-mentioned preset wavelength range can be a range of ±2.5 gigahertz (GHz) based on the standard wavelength established by the international telecommunication union (ITU), wherein the standard wavelength established by the ITU can refer to the standard in the ITU-T G.694.1 protocol, which will not be described here. Thus, the emission wavelength can conform to the ITU standard to ensure the interoperability between different devices and systems, the clarity and transmission quality of signals, and the compatibility and effectiveness of optical communication worldwide.

[0099] The fourth embodiment of the optical module of the application will be described in detail below in combination with FIG. 6B.

[0100] FIG. 6B shows a structural schematic diagram of the optical module 20 in some embodiments. The optical module 20 of FIG. 6B is different from the optical module 20’ of FIG. 5 in that the optical transmission structure between the laser 230 and the photoelectric conversion assembly 210 in FIG. 6B is an optical path glue 242, and in FIG. 6A, no WVL is arranged inside the laser 230, but a wavelength detection unit 250 is arranged inside the optical path glue 242, and a wavelength control unit 260 connected with the wavelength detection unit 250 and the emission unit 231 is arranged outside the optical path glue 242.

[0101] It can be understood that the optical path glue 242 in FIG. 6A and other structures are the same as those shown in FIG. 4B, and thus the related description in the above embodiments can be referred to and will not be repeated here.

[0102] In some embodiments, the wavelength detection unit 250 can be a spectrum sensor, and specifically can be a flat plate waveguide. In some other embodiments, the wavelength detection unit 250 can also be other structures, and the specific structure of the wavelength detection unit 250 is not limited in the present application.

[0103] Referring to FIG. 6B, the wavelength detection unit 250 can be arranged inside or on the surface of the optical path glue 242 and integrated with the optical path glue 242. For example, a specific pattern can be engraved inside the optical path glue 242 to form a waveguide structure, and the transmission signal or reflection signal at different wavelengths has different intensities through the waveguide structure to achieve the purpose of wavelength detection. Specifically, the specific pattern can be engraved by 3D printing. It should be noted that the specific structure and preparation method of the wavelength detection unit 250 are not limited in the present application.

[0104] Specifically, the working principle of the wavelength detection unit 250 and the wavelength control unit 260 can be that the wavelength detection unit 250 can detect the wavelength of the coherent light in the optical path glue 242. For example, the waveguide structure can generate transmission signals or reflection signals with different intensities at different wavelengths, and the wavelength control unit 260 receives the transmission signals or reflection signals, analyzes the intensity and direction of the signals, generates a deviation signal, and controls the working parameters (such as temperature, current intensity, light intensity, etc.) of the emission unit 231 according to the deviation signal, so that the emission wavelength of the emission unit 231 is within the preset wavelength range.

[0105] In some embodiments, the above-mentioned preset wavelength range is described in the corresponding embodiments of FIG. 6A and will not be repeated here.

[0106] The fifth embodiment of the optical module of the present application will be described in detail below in combination with FIG. 6C.

[0107] FIG. 6C shows a structure schematic diagram of the optical module 20 in some embodiments. It should be noted that the optical transmission structure in the optical module 20 shown in FIG. 6C is a hollow cover 240 as an example, and in the corresponding embodiments of FIG. 6C, the optical transmission structure can also be an optical path glue 242.

[0108] The light module 20 of FIG. 6C is different from the light module 20' of FIG. 5 in that the light transmission structure between the laser 230 and the photoelectric conversion assembly 210 is a hollow cover 240, and a wavelength detection unit 250 is arranged on the transmission path of the coherent light in the photoelectric conversion assembly 210, and a wavelength control unit 260 connected with the wavelength detection unit 250 and the emission unit 231 is arranged outside the photoelectric conversion assembly 210.

[0109] It can be understood that other structures in FIG. 6C are the same as those shown in FIG. 4A, and the related descriptions are the same as above, which will not be repeated here.

[0110] In some embodiments, the wavelength detection unit 250 can be placed or fixed inside the photoelectric conversion assembly 210 (the specific position can be referred to the following embodiments), so that a part of the coherent light can enter the wavelength detection unit 250 before the coherent light is transmitted into the photoelectric conversion assembly 210 and before the coherent modulation or demodulation process, so as to detect the wavelength of the coherent light in the photoelectric conversion assembly 210 by using the wavelength detection unit 250.

[0111] In some embodiments, the wavelength detection unit 250 can be a spectrum sensor, or can also be other wavelength detection devices, and the specific structure of the wavelength detection unit 250 is not limited in the present application.

[0112] Specifically, the working principle of the wavelength detection unit 250 and the wavelength control unit 260 is that the wavelength detection unit 250 can detect the wavelength of the coherent light in the photoelectric conversion assembly 210, compare the detected wavelength with the preset target wavelength, calculate the deviation, generate a deviation signal and transmit it to the wavelength control unit 260, and the wavelength control unit 260 can control the working parameters (such as temperature, current, etc.) of the emission unit 231 according to the deviation signal, so as to adjust the emission wavelength of the emission unit 231 to the target wavelength. Alternatively, in some other embodiments, the wavelength detection unit 250 can detect the wavelength of the coherent light in the photoelectric conversion assembly 210, generate a detection signal (optical signal or electrical signal), and transmit it to the wavelength control unit 260, and the wavelength control unit 260 can generate a deviation signal by comparing the detection signal with the target wavelength, and control the working parameters (such as temperature, current intensity, light intensity, etc.) of the emission unit 231 according to the deviation signal, so as to make the emission wavelength of the emission unit 231 within the preset wavelength range.

[0113] In some embodiments, the above-mentioned preset wavelength range can be ±5 gigahertz (GHz) based on the standard wavelength of the International Telecommunication Union, so as to make the emission wavelength meet the ITU standard.

[0114] The three different embodiments of the optical-electric conversion assembly 210 and the laser 230 in the optical module are described in detail below in combination with FIGS. 7A-7C. It should be noted that the internal structures of the optical-electric conversion assembly 210 and the laser 230 shown in FIGS. 7A-7C are only examples, and the optical-electric conversion assembly 210 and the laser 230 can also have other structures.

[0115] The sixth embodiment of the optical module is described in detail below in combination with FIG. 7A.

[0116] FIG. 7A shows a structural schematic diagram of the optical module 20 in some embodiments. The optical module 20 includes the digital signal processor 220, the optical-electric conversion assembly 210, and the laser 230 connected in sequence, the optical-electric conversion assembly 210 includes the transmitting end TX1 and the receiving end RX2, and the digital signal processor 220 includes the receiving end RX1 and the transmitting end TX2. The optical-electric conversion assembly 210 includes the signal amplification unit 211, the integrated coherent transceiver unit 212, and the alignment unit 213 (as an example of the second alignment unit) connected in sequence, and the laser 230 includes the transmitting unit 231, the temperature control unit 233 connected with the transmitting unit 231, and the alignment unit 234 (as an example of the first alignment unit). In addition, the optical module 20 also includes the wavelength detection unit 250 and the wavelength control unit 260, and the wavelength detection unit 250 is arranged inside the hollow cover 240.

[0117] In the signal uplink process, the digital signal processor 220 can receive an electrical signal and perform a first processing on the electrical signal, the first processing including one or more of decoding, demodulation, recovery, and physical impairment compensation, and send the processed electrical signal to the signal amplification unit 211 in the optical-electric conversion assembly 210, the signal amplification unit 211 amplifies the electrical signal and sends it to the integrated coherent transceiver unit 212. The coherent light emitted by the transmitting unit 231 can pass through the alignment unit 234, the interface C1, the hollow cavity 241, the interface C2, the alignment unit 213, and then reach the integrated coherent transceiver unit 212 in sequence. The temperature control unit 233 is used to maintain the transmitting unit 231 at a stable temperature. The integrated coherent transceiver unit 212 can perform coherent modulation on the coherent light based on the amplified electrical signal, so that the coherent light is converted into signal light, and the signal light is emitted outward through the transmitting end TX1.

[0118] In the signal downlink process, the alignment unit 213 in the photoelectric conversion assembly 210 receives the signal light through the receiving end RX2. The coherent light emitted by the emitting unit 231 can be sequentially sent to the integrated coherent transceiver unit 212 via the alignment unit 234, the interface C1, the hollow cavity 241, the interface C2, and the alignment unit 213. The temperature control unit 233 is configured to control the emitting unit 231, so that the temperature of the emitting unit 231 is within a preset temperature range, which can be -40°C to 85°C. The integrated coherent transceiver unit 212 can demodulate the signal light into an electrical signal based on the coherent light, and send the electrical signal to the digital signal processor 220. The digital signal processor 220 can perform a second processing on the electrical signal and emit it through the transmitting end TX2, for example, to a terminal device. The second processing includes one or more of decoding, demodulation, recovery, and physical impairment compensation.

[0119] It should be noted that in some other embodiments, the alignment unit 234 (as an example of the first alignment unit) and / or the alignment unit 213 (as an example of the second alignment unit) can also be arranged in the optical transmission channel (for example, in the hollow cavity 241 or the optical path glue 242), instead of being arranged in the laser 230 and / or the photoelectric conversion assembly 210. In this case, the transmission requirements of the coherent light can also be met. For example, when the alignment unit 234 is arranged in the optical transmission channel, the coherent light emitted by the emitting unit 231 can be sequentially sent to the integrated coherent transceiver unit 212 via the interface C1, the hollow cavity 241 or the optical path glue 242, the alignment unit 234, the hollow cavity 241 or the optical path glue 242, the interface C2, and the alignment unit 213. When the alignment unit 213 is arranged in the optical transmission channel, the coherent light emitted by the emitting unit 231 can be sequentially sent to the integrated coherent transceiver unit 212 via the alignment unit 234, the interface C1, the hollow cavity 241 or the optical path glue 242, the alignment unit 213, the hollow cavity 241 or the optical path glue 242, and the interface C2. It can be understood that the remaining structures in the optical module are the same as those in the above-mentioned embodiments, and will not be described here.

[0120] The modulation process and the demodulation process have been described in detail in the above-mentioned embodiments, and can be referred to the description of the above-mentioned embodiments, which will not be described here. In the above-mentioned signal uplink and downlink processes, the wavelength detection unit 250 and the wavelength control unit 260 can detect and control the wavelength of the coherent light transmitted in the hollow cavity 241 in real time. The specific process can be referred to the description of the above-mentioned embodiments, which will not be described here.

[0121] In some embodiments, the laser 230 can also be called an integrated tunable laser assembly (ITLA) for emitting continuous wave laser with a specific wavelength.

[0122] In some embodiments, the temperature control unit 233 can be a thermoelectric refrigerator (TEC) to cool or heat the emission unit 231 so that the emission unit 231 is kept at a stable temperature. It should be noted that the temperature control unit 233 can also be other devices, and the specific type of the temperature control unit 233 is not limited in the present application.

[0123] In some embodiments, the laser 230 can include a package, i.e., the emission unit 231 and the temperature control unit 233 can be located in the package, and the interface C1 is provided on the package so that the coherent light emitted by the emission unit 231 can enter the optical transmission structure through the interface C1. Specifically, the material of the package of the laser 230 can include a metal material, including but not limited to pure metals such as gold, silver, copper, aluminum, or alloys formed by different metals, etc.

[0124] In some embodiments, the signal amplification unit 211 can be an optical radio frequency integrated circuit (oRFIC). The optical radio frequency integrated circuit can include an electrical signal driver amplification (driver) function and an electrical signal transimpedance amplification (TIA) function. The electrical signal driver amplification function is used for electrical signal amplification in the signal uplink process, and the electrical signal transimpedance amplification is used for electrical signal amplification in the signal downlink process.

[0125] In some embodiments, the integrated coherent transceiver unit 212 can be an integrated coherent transmitter receiver (ICTR). The integrated coherent transmitter receiver can include a modulation function, a demodulation function, and a detection function. The modulation function is used for coherent modulation in the signal uplink process to convert electrical signals into signal light. The demodulation function is used for interference in the signal downlink process to make coherent light and signal light interfere and generate interference light signals. The detection function is used for converting interference light signals into electrical signals in the signal downlink process.

[0126] In some embodiments, the alignment unit 234 can include an optical mirror or an optical lens, etc.; and the alignment unit 213 can include an optical mirror or an optical lens, etc. Thus, the angles and positions of the coherent light or the signal light can be adjusted by using the alignment unit 234 and the alignment unit 213 to ensure that the light rays of the coherent light or the signal light propagate along the predetermined path.

[0127] It should be noted that when the optical path glue is used in the optical module 20, the refractive index of the optical path glue can be matched with the refractive index of the alignment unit 234 and the alignment unit 213, that is, the refractive index of the optical path glue, the refractive index of the alignment unit 234, and the refractive index of the alignment unit 213 are the same or similar, so as to reduce the loss of the optical fiber inside the optical path glue and the alignment unit, thereby improving the light transmission efficiency of the optical module 20.

[0128] In some embodiments, the photoelectric conversion assembly 210 can be packaged, that is, each device (for example, the signal amplification unit 211, the integrated coherent transceiver unit 212, and the alignment unit 213) in the photoelectric conversion assembly 210 is located in a packaging box. The packaging box can be a metal material, including but not limited to pure metals such as gold, silver, copper, and aluminum, or alloys formed by different metals, and the like. In some other embodiments, the photoelectric conversion assembly 210 can also not be packaged, that is, each device (for example, the signal amplification unit 211, the integrated coherent transceiver unit 212, and the alignment unit 213) in the photoelectric conversion assembly 210 is directly arranged in the optical module 20 without overall packaging, so as to further save the packaging cost of the optical module 20.

[0129] The seventh embodiment of the optical module of the present application will be described in detail below in combination with FIG. 7B.

[0130] FIG. 7B shows a structure schematic diagram of the optical module 20 in some embodiments. The difference between the structures shown in FIG. 7B and FIG. 7A is that the wavelength detection unit 250 in FIG. 7B is arranged in the optical path glue 242, and the rest of the structures are the same as those in FIG. 7A. For details, refer to the description in the above related embodiments, which will not be described here.

[0131] The eighth embodiment of the optical module of the present application will be described in detail below in combination with FIG. 7C.

[0132] FIG. 7C shows a structure schematic diagram of the optical module 20 in some embodiments. It should be noted that in the optical module 20 shown in FIG. 7C, only the hollow cover 240 is taken as an example for the light transmission structure, but the light transmission structure herein can also use the optical path glue 242.

[0133] The difference between the structures shown in FIG. 7C and FIG. 7A is that the wavelength detection unit 250 in FIG. 7C is arranged in the integrated coherent transceiver unit 212, so that the wavelength detection unit 250 can perform wavelength detection on the coherent light before modulation or demodulation in the integrated coherent transceiver unit 212. The other structures in FIG. 7C are the same as those in FIG. 7A. For details, refer to the description in the above embodiments, which will not be described here.

[0134] The integrated coherent transceiver 212 can be an integrated coherent transceiver (ICTR), and the wavelength detection unit 250 can be integrated in the integrated coherent transceiver, so as to reduce the space occupied by the wavelength detection unit 250 in the optical module 20, and further reduce the size and cost of the optical module 20.

[0135] It can be understood that the structure and principle of the wavelength detection unit 250 can refer to the related description in the above embodiments, which will not be repeated here.

[0136] It should be noted that, in the examples and descriptions of the present application, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including one" does not exclude the presence of other identical elements in the process, method, article or equipment including the element.

[0137] Although the present application has been illustrated and described with reference to certain preferred embodiments thereof, it should be understood that various changes in form and detail can be made therein without departing from the scope of the application.

Claims

1. An optical module characterized by comprising: The application relates to a light module. The light module comprises: a laser, which comprises a first interface, and is used for generating first light and emitting the first light through the first interface; a photoelectric conversion component, which comprises a second interface, and is capable of receiving the first light through the second interface, and capable of modulating the first light into signal light according to an electric signal, or capable of demodulating signal light into an electric signal according to the first light; a light transmission structure, which comprises a light transmission channel, and is capable of transmitting the first light from the first interface to the second interface; 2. The optical module according to claim 1, characterized by wherein the light transmission structure comprises a hollow cover body, and a hollow cavity surrounded by the hollow cover body is used for forming the light transmission channel; or the light transmission structure comprises a light path glue, and the light path glue is used for forming the light transmission channel. The hollow cover body extends along a first direction, and the first direction is a connecting direction of the first interface and the second interface; 3. The optical module according to claim 1, characterized by and the hollow cover body has openings at two ends along the first direction, one of the openings is connected with the first interface, and the other opening is connected with the second interface. The light path glue has a straight path extending along a first direction, and the first direction is a connecting direction of the first interface and the second interface; 4. The optical module according to claim 1, characterized by the light path glue has a first refractive index, and the first refractive index enables the first light to be linearly transmitted in the light path glue along the first direction or to be totally reflected and transmitted in the light path glue.

5. The optical module according to claim 1 or 2, characterized by The light path glue has a curved path extending along a first direction, and the light path glue has a first refractive index, and the first refractive index enables the first light to be totally reflected and transmitted in the light path glue.

6. The optical module according to claim 1, 3 or 4, characterized by, The hollow cover body has the same size of cross sections, and the cross sections are cross sections perpendicular to the extending direction of the hollow cover body.

7. The optical module according to any one of claims 1 to 4, characterized by The light path glue has the same size of cross sections, and the cross sections are cross sections perpendicular to the extending direction of the light path glue. The light module further comprises a wavelength detection unit and a wavelength control unit; wherein, the wavelength detection unit is located in the light transmission channel or the photoelectric conversion component, and is used for detecting the wavelength of the first light; 8. The optical module according to claim 7, characterized by the wavelength control unit is connected with the wavelength detection unit and the laser, and is used for controlling the laser according to the detection result of the wavelength detection unit, so that the wavelength of the first light generated by the laser is located in a preset wavelength range. the laser comprises an emission unit, which is used for emitting the first light to the light transmission structure through the first interface; the wavelength control unit is connected with the emission unit, and is used for controlling the emission unit according to the detection result of the wavelength detection unit, so that the wavelength of the first light generated by the emission unit is located in a preset wavelength range.

9. The optical module of claim 7, wherein, The photoelectric conversion assembly comprises an integrated coherent transceiver unit, which is configured to modulate the first light into the signal light according to the electrical signal or demodulate the signal light into the electrical signal according to the first light; and the wavelength detection unit is located in the integrated coherent transceiver unit.

10. The optical module of claim 8, wherein, The laser further comprises a temperature control unit, and the emission unit is connected with the temperature control unit, wherein the temperature control unit is configured to control the emission unit so that the temperature of the emission unit is within a preset temperature range.

11. The optical module of claim 8, wherein, The laser further comprises a first alignment unit, and the emission unit is connected with the first alignment unit, wherein the emission unit is configured to emit the first light to the second interface via the first alignment unit and the first interface in sequence; or The optical transmission channel comprises a first alignment unit, and the emission unit is connected with the first alignment unit, wherein the emission unit is configured to emit the first light to the second interface via the first alignment unit and the first interface in sequence.

12. The optical module of claim 9, wherein, The photoelectric conversion assembly further comprises a signal amplification unit, and the integrated coherent transceiver unit is connected with the signal amplification unit, wherein the signal amplification unit is configured to receive and amplify the electrical signal and transmit the electrical signal to the integrated coherent transceiver unit or receive and amplify the electrical signal output by the integrated coherent transceiver unit.

13. The optical module of claim 9, wherein, The photoelectric conversion assembly further comprises a second alignment unit, and the integrated coherent transceiver unit is connected with the second alignment unit, wherein the first light is transmitted to the integrated coherent transceiver unit via the second interface and the second alignment unit in sequence; or The optical transmission channel comprises a second alignment unit, and the integrated coherent transceiver unit is connected with the second alignment unit, wherein the first light is transmitted to the integrated coherent transceiver unit via the second interface and the second alignment unit in sequence.

14. The optical module according to any one of claims 1 to 4, characterized by The optical module further comprises a digital signal processor, and the digital signal processor is connected with the photoelectric conversion assembly. The digital signal processor is configured to receive the electrical signal output by the terminal device and perform first processing on the electrical signal, and transmit the processed electrical signal to the photoelectric conversion assembly, or receive the electrical signal output by the photoelectric conversion assembly and perform second processing, and transmit the processed electrical signal to the terminal device. The first processing comprises one or more of decoding, demodulation, recovery and physical damage compensation; and the second processing comprises one or more of decoding, demodulation, recovery and physical damage compensation.

15. An optical communication device, comprising: The optical module comprises a housing and the optical module as claimed in any one of claims 1 to 14, and the optical module is located in the housing.

Images