Lamella lift-out geometry based on sample plane orientation

Abstract

Systems, methods, or techniques are provided for lamella lift-out based on sample plane orientation. In various embodiments, a method can comprise adjusting, by a scientific instrument, stage tilt and rotation of a sample stage of the scientific instrument based on plane orientation of a sample.

Description

Atty. Docket No. TP388808WO1 / TFSP177WOLAMELLA LIFT-OUT GEOMETRY BASED ON SAMPLE PLANE ORIENTATIONCross-Reference to Related Applications

[0001] This application claims priority to and benefit of U.S. Provisional Application No. 63 / 696,300, entitled, “LAMELLA LIFT-OUT GEOMETRY BASED ON SAMPLE PLANE ORIENTATION,” which was filed on September 18, 2024. The aforementioned application is hereby incorporated herein by reference in its entirety.Background

[0002] Many scientific instruments utilize the milling and manipulation of small lamella of samples as part of analytical experiments or tests. During these manipulations, the orientation (e.g., yaw, roll, pitch, etc.) of the lamella are assumed to be correct. However, the orientation of the lamella can often be askew from the assumed orientation, leading to incorrect or poor-quality experiment results.Summary

[0003] The following presents a summary to provide a basic understanding of one or more embodiments. This summary is not intended to identify key or critical elements, or delineate any scope of the particular embodiments or any scope of the claims. Its sole purpose is to present concepts in a simplified form as a prelude to the more detailed description that is presented later. In one or more embodiments described herein, devices, systems, methods, or apparatus that facilitate lamella manipulation based on sample plane orientation are provided.

[0004] According to one or more embodiments, a scientific instrument is provided. The scientific instrument can comprise an adjustment component that adjusts stage tilt and rotation of a sample stage of the scientific instrument based on a plane orientation of a sample. In some embodiments, the scientific instrument can further comprise a milling component that mills a lamella from the sample, wherein an axis of the lamella is perpendicular to the plane orientation of the sample; and a manipulator needle that removes the lamella from the sample stage to a sample holder, wherein the adjustment component further adjusts the stage tilt and rotationAtty. Docket No. TP388808WO1 / TFSP177WO of the sample stage based on the plane orientation and angle of the manipulator needle.

[0005] An advantage of the system, and / or of a corresponding method can be the ability to enable manipulation of the lamella based on the known plane orientation of the sample, and thus the lamella, allowing for precise and accurate positioning of the lamella during experimentation.Brief Description of the Drawings

[0006] Embodiments will be readily understood by the following detailed description in conjunction with the accompanying drawings. To facilitate this description, like reference numerals designate like structural elements. Embodiments are illustrated by way of example, not by way of limitation, in the figures of the accompanying drawings.

[0007] FIG. 1 is a block diagram of an example scientific instrument module for performing lamella lift-out based on sample plane orientation, in accordance with various embodiments described herein.

[0008] FIG. 2 is a flow diagram of an example, non-limiting, method of performing lamella lift-out based on sample plane orientation, in accordance with various embodiments described herein.

[0009] FIG. 3 illustrates a block diagram of an example, non-limiting scientific instrument that can facilitate lamella alignment and orientation, in accordance with one or more embodiments described herein.

[0010] FIG. 4 illustrates a diagram of a sample stage and relative orientations of samples, in accordance with one or more embodiments described herein.

[0011] FIG. 5 illustrates a diagram of alignment issues between a lamella and a sample holder, in accordance with one or more embodiments described herein.

[0012] FIG. 6 illustrates a dual beam system, in accordance with one or more embodiments described herein.

[0013] FIGS. 7-12 illustrate stages of lamella lift-out based on sample orientation, in accordance with one or more embodiments described herein.

[0014] FIGS. 13A-13B illustrate a flow diagram of an example, non-limiting, method that can facilitate lift-out of lamella from samples based on sample plane orientation, in accordance with one or more embodiments described herein.Atty. Docket No. TP388808WO1 / TFSP177WO

[0015] FIG. 14 illustrates a block diagram of an example, non-limiting, operating environment in which one or more embodiments described herein can be facilitated.Detailed Description

[0016] The following detailed description is merely illustrative and is not intended to limit embodiments and / or application or utilization of embodiments. Furthermore, there is no intention to be bound by any expressed or implied information presented in the preceding Summary section, or in the Detailed Description section. One or more embodiments are now described with reference to the drawings, wherein like reference numerals are utilized to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a more thorough understanding of the one or more embodiments. It is evident, however, in various cases, that the one or more embodiments can be practiced without these specific details.

[0017] In certain scientific instruments, such as various forms of electron or dual beam microscopes, manipulation of lamella, such as milling and positioning of the lamella, are significant preparation steps for executing analytical experiments on the lamella. For example, in the semiconductor industry, detailed imaging and analysis of lamella of wafers is utilized during development and to ensure quality during production. These lamellae are extracted from samples using milling instruments, such as focused ion beams, and attached to sample holders for viewing in transmission electron microscopes (TEMs), scanning TEMs (STEMs), and / or scanning electron microscopes (SEMs). As part of the viewing process, the lamella is gradually sliced or thinned to expose new portions for viewing. During this process, the relative orientation of the lamella is typically assumed to be correct. However, the lamella can often be askew in various axes, both during the removal from the sample and when attached to the sample holder. These alignment issues can impose limitations during the thinning or slicing process of the lamella, thus resulting in poor image quality and the need for additional lamella for imaging.

[0018] To overcome the one or more deficiencies of existing technologies as identified above, one or more embodiments described herein can adjust, by a scientific instrument, stage tilt and rotation of a sample stage of the scientific instrument based on plane orientation of a sample. For example, by adjusting theAtty. Docket No. TP388808WO1 / TFSP177WO stage tilt and rotation of the sample stage based on the plane orientation of the sample, a correct relative orientation between a milling instrument, such as a focused ion beam, and the sample can be maintained, thus ensuring a lamella with a correct or known plane orientation.

[0019] Furthermore, the method can comprise adjusting the stage tilt and rotation of the sample stage based on the plane orientation and an angle of a manipulator needle of the scientific instrument. This enables control of the relative orientations of the manipulator needle and the lamella during transfer of the lamella, by the manipulator needle, to the sample holder. This fine control of the relative orientation of the lamella enables precise alignment between the lamella and the sample holder, and thus improved thinning and imaging of the lamella.

[0020] One or more embodiments are now described with reference to the drawings, where like referenced numerals are used to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth to provide a more thorough understanding of the one or more embodiments. It is evident in various cases, however, that the one or more embodiments can be practiced without these specific details.

[0021] FIG. 1 illustrates an example, non-limiting block diagram of a scientific instrument module 100 in accordance with various embodiments described herein.

[0022] In various embodiments, the scientific instrument module 100 can be implemented by circuitry (e.g., including electrical or optical components), such as a programmed computing device. Logic of the scientific instrument module 100 can be included in a single computing device or can be distributed across multiple computing devices that are in communication with each other as appropriate.Examples of computing devices that may, singly or in combination, implement the scientific instrument module 100 are discussed herein with reference to FIG. 14.

[0023] The scientific instrument module 100 may include first logic 102 and second logic 104. As used herein, the term “logic” may include an apparatus that is to perform a set of operations associated with the logic elements. For example, any of the logic elements included in the scientific instrument module 100 may be implemented by one or more computing devices programmed with instructions to cause one or more processing devices of the computing devices to perform the associated set of operations. In a particular embodiment, a logic element may include one or more non-transitory computer-readable media having instructionsAtty. Docket No. TP388808WO1 / TFSP177WO thereon that, when executed by one or more processing devices of one or more computing devices, cause the one or more computing devices to perform the associated set of operations. As used herein, the term “module” may refer to a collection of one or more logic elements that, together, perform a function associated with the module. Different ones of the logic elements in a module may take the same form or may take different forms. For example, some logic in a module may be implemented by a programmed general-purpose processing device, while other logic in a module may be implemented by an application-specific integrated circuit (ASIC). In another example, different ones of the logic elements in a module may be associated with different sets of instructions executed by one or more processing devices. A module may not include all of the logic elements depicted in the associated drawing; for example, a module may include a subset of the logic elements depicted in the associated drawing when that module is to perform a subset of the operations discussed herein with reference to that module.

[0024] In various embodiments, there can be a scientific instrument corresponding to the scientific instrument module 100. In various aspects, the scientific instrument can be any suitable computerized device that can electronically measure some scientifically-relevant, clinically-relevant, or research-relevant characteristic, property, or attribute of an analytical sample (e.g., of a known or unknown mixture, compound, or collection of matter). As a non-limiting example, a scientific instrument can be an electron microscope, such as a transmission electron microscope, a scanning electron microscope, a dual-beam microscope, or another suitable piece of imaging or analytical equipment.

[0025] The first logic 102 may measure plane orientation of a sample on a sample stage of a scientific instrument. For example, a sample, from which a lamella will be milled, is placed on a sample stage of the scientific instrument, such as a dual-beam microscope. The scientific instrument can comprise components such as a capacitance probe. The first logic 102 can instruct the capacitance probe to measure the distance of the capacitance probe from the sample at three or more points and then generate a plane that passes through the three points. In various embodiments other suitable hardware may be utilized in place of the capacitance probe.

[0026] The second logic 104 may adjust stage tilt and rotation of a sample stage of the scientific instrument based on the plane orientation of the sample. For example,Atty. Docket No. TP388808WO1 / TFSP177WO second logic 104 can instruct an adjustment component to modify or adjust the tilt (e.g., yaw, pitch, or roll) and rotation of the sample stage based on the plane orientation of the sample and the relative positioning of a milling component, such as a focused ion beam, of the scientific instrument. This adjustment can ensure that the lamella is milled with an acceptable plane orientation, thus facilitating minimization of alignment issues relating to the lamella.

[0027] FIG. 2 is a flow diagram of a computer-implemented method 200 in accordance with one or more embodiments described herein. The operations of the computer-implemented method 200 may be used in any suitable setting to perform any suitable operations (e.g., can be performed by or used in conjunction with any of the various modules, computing devices, or graphical user interfaces described with respect to FIGS. 1 , 3, 6, and 14). Operations are illustrated once each and in a particular order in FIG. 2, but the operations may be reordered or repeated as desired and appropriate (e.g., different operations performed may be performed in parallel, as suitable).

[0028] At 202, first operations may be performed. For example, the first logic 102 of scientific instrument module 100 may perform the operations of 202. The first operations may include measuring plane orientation of a sample.

[0029] At 204, second operations may be performed. For example, the first logic 102 of scientific instrument module 100 may perform the operations of 204. The second operations may include adjusting stage tile and rotation of a sample stage of a scientific instrument based on the plane orientation of the sample.

[0030] FIG. 3 illustrates a block diagram of an example, non-limiting scientific instrument that can facilitate lamella alignment and orientation in accordance with one or more embodiments described herein. As shown, scientific instrument 302 can comprise an analytical instrument 306.

[0031] In various aspects, the analytical instrument 306 can comprise any suitable electron microscope. In various instances, the analytical instrument 306 can comprise any suitable constituent hardware 324 for generating electron microscopy images and generating magnetic immersion fields. In various cases, the analytical instrument 306 can comprise a scanning electron microscope that can measure or determine a surface topography of an analytical sample or a dual beam microscope. In another non-limiting example, the analytical instrument 306 can comprise a transmission electron microscope that can measure or determine internal structuralAtty. Docket No. TP388808WO1 / TFSP177WO details of the analytical sample. In various embodiments, the electron microscope can comprise a dual beam microscope. In a further, non-limiting, example, the analytical instrument 306 can comprise any suitable type of charged-particle microscope (e.g., types of microscopes that use beams of non-electron ions to capture images). Further examples of analytical instrument 306 include, but are not limited to, energy dispersive spectroscopy, electron energy loss spectroscopy, and electron backscatter diffraction spectroscopy.

[0032] In any case, when given an analytical sample, the analytical instrument 306 can produce an image of the whole or a portion of the analytical sample or lamella by diffracting a stream of electrons through the analytical sample and onto an electron detector.

[0033] In various embodiments, the scientific instrument 302 can comprise a control system 308. In various cases the control system 308 can facilitate control of analytical instrument 306.

[0034] In various aspects, the control system 308 can comprise a processor 310 (e.g., computer processing unit, microprocessor) and a non-transitory computer- readable memory 312 that is operably or operatively or communicatively connected or coupled to the processor 310. The non-transitory computer-readable memory 312 can store computer-executable instructions which, upon execution by the processor 310, can cause the processor 310 or other components of the control system 308 (e.g., measurement component 314, sample stage control component 316, needle control component 318, milling control component 322, and / or sample holder control component 320) to perform one or more acts. In various embodiments, the non- transitory computer-readable memory 312 can store computer-executable components (e.g., measurement component 314, sample stage control component 316, needle control component 318, milling control component 322, and / or sample holder control component 320), and the processor 310 can execute the computerexecutable components.

[0035] In various embodiments, the control system 308 can comprise a measurement component 314. In various aspects, the measurement component 314 can instruct constituent hardware 324, of analytical instrument 306, to measure plane orientation of a sample located on a sample holder within analytical instrument 306. For example, in one or more embodiments, constituent hardware 324 can comprise a capacitance probe. Measurement component 314 can instruct theAtty. Docket No. TP388808WO1 / TFSP177WO capacitance probe to measure distance between the probe at three or more positions and then generate a plane orientation that fits through all three positions. Additionally, or alternatively, measurement component 314 can instruct the capacitance probe to measure the X, Y, and Z axes of the sample and determine the plane orientation based on the axes. In this manner, the plane orientation can be determined and then stored by measurement component 314 for further use or reference.

[0036] Based on the plane orientation of the sample, sample stage control component 316 can instruct an adjustment component of constituent hardware 324 to adjust the tilt and / or rotation of the sample stage that the sample is located on. For example, based on the plane orientation, a position of a milling component of the constituent hardware, such as a focused ion beam, and a pattern for the lamella milling, sample stage control component 316 can determine an appropriate tilt and rotation such that the relative orientations and positions of the sample and the milling component are appropriate for the pattern for the lamella milling. For example, in some embodiments, the adjustment of the tilt of the sample stage can ensure the plane orientation is level. Once this adjustment is complete, milling control component 322 can instruct the milling component of constituent hardware 324 to mill a lamella from the sample. For example, due to the adjustment of the tilt and rotation of the sample stage, an axis of the lamella can be perpendicular to the plane orientation.

[0037] In various embodiments, needle control component 318 can instruct a manipulator needle of constituent hardware 324 to adjust angle and orientation based on the plane orientation of the lamella. In one or more embodiments, after milling, the plane orientation of the sample can be utilized as the plane orientation of the lamella. Alternatively, measurement component 314 can instruct the capacitance probe of constituent hardware 324 to re-measure the plane orientation of the lamella to account for shift in orientation that may have occurred during the milling process. By adjusting the angle and orientation of the manipulator needle, a good connection with known relative orientations between the lamella and the manipulator needle can be achieved. In one or more embodiments, the stage tilt and rotation can be adjusted a second time in conjunction with or instead of adjustment of the manipulator needle angle and orientation to ensure connection with a known relative orientation. Once the manipulator needle is connected to the lamella, theAtty. Docket No. TP388808WO1 / TFSP177WO lamella is lifted off of the sample stage and moved towards a sample holder. Based on the plane orientation of the lamella and the known relative orientation between the lamella and the manipulator needle, the manipulator needle can rotate and adjust its angle such the lamella is placed with the plane orientation is at a specified angle relative to a sidewall of the sample holder. The specified angle can be specified by an entity, such as a user, based on the type of sample and analysis being performed. For example, in various scenarios, the specified angle can be such that the plane orientation is perpendicular to the sidewall of the sample holder. Once the lamella is positioned appropriately, constituent hardware 324 can weld the lamella to the sample holder.

[0038] In various aspects sample holder control component 320 can instruct a second adjustment component of the constituent hardware 324 to adjust the rotation of the sample holder based on the relative location of the sample holder, an instrument angle specified by and entity, such as a human user, and a target region of the lamella. For example, based on the type of analytical instrument and the experiment or imaging being performed, the sample holder can be rotated such that the relative orientations of a target region of the lamella and the user specified instrument angle (e.g., the angle the instrument should be relative to the lamella) are with an acceptable threshold deviation of an intended value. For example, given that the analytical instrument comprises a transmission electron microscope and the user specified instrument angle is 90°, then the sample holder can be rotated such that the direction of an electron beam of the electron microscope is perpendicular to the plane orientation of the lamella.

[0039] FIG. 4 illustrates a diagram 400 of a sample stage and relative orientations of samples, in accordance with one or more embodiments described herein.

[0040] As shown, diagram 400 comprises sample stage 402 on which samples can be placed as part of a milling process to create lamella for imaging. Traditionally, it was assumed that the samples would lay flat on sample stage 402, as shown by assumed sample orientation 404. However, due to various causes, it is likely that the actual orientation of samples may not match that of sample stage 402, as shown by actual sample orientation 406. Accordingly, sample stage control component 316 can instruct an adjustment component attached to sample stage 402 to adjust the tilt and / or rotation of sample stage 402 to account for the actual plane orientation of the sample.Atty. Docket No. TP388808WO1 / TFSP177WO

[0041] FIG. 5 illustrates a diagram 500 of alignment issues between a lamella and a sample holder in accordance with one or more embodiments described herein. As shown, diagram 500 comprises a sample holder 504 and a lamella 502. As described above, traditional techniques assume the lamella orientation to be the same as the sample stage of FIG. 4. This can lead to issues when attaching the lamella to the sample holder, as the lamella may be misaligned in multiple orientations. For example, as shown, lamella 502 is misaligned in the yaw, roll and pitch tilts. This misalignment can cause issues during imaging operations, as the wrong portion of the lamella may be imaged, or physical limitations to the thinning of the lamella. Accordingly, by managing the plane orientation of the lamella and relative orientations of the lamella and a manipulator needle during transfer operations from sample stage 402 to sample holder 504, misalignment can be prevented, resulting in more accurate and representative imaging of the lamella.

[0042] FIG. 6 illustrates a dual beam in accordance with the present disclosure, illustrating a typical dual beam system 610 with a vertically mounted scanning electron microscope (SEM) column and a focused ion beam (FIB) column mounted at an angle of approximately 52 degrees from the vertical. While an example of suitable hardware is provided below, the invention is not limited to being implemented in any particular type of hardware.

[0043] A scanning electron microscope 641 , along with power supply and control unit 645, is provided with the dual beam system 610. An electron beam 643 is emitted from a cathode 652 by applying voltage between cathode 652 and an anode 654. Electron beam 643 is focused to a fine spot by means of a condensing lens 656 and an objective lens 658. Electron beam 643 is scanned two-dimensionally on the specimen by means of a deflection coil 660. Operation of condensing lens 656, objective lens 658, and deflection coil 660 are controlled by power supply and control unit 645.

[0044] Electron beam 643 can be focused onto substrate 622 (e.g., a sample), which is on movable X-Y sample stage 625 within lower chamber 626. When the electrons in the electron beam strike substrate 622, secondary electrons are emitted. These secondary electrons are detected by charged particle detector 640 (which may be a secondary electron detector) as discussed below. STEM detector 662, located beneath the TEM sample holder 624 and the sample stage 625, can collect electronsAtty. Docket No. TP388808WO1 / TFSP177WO that are transmitted through the sample mounted on the TEM sample holder as discussed above.

[0045] Dual beam system 610 also includes focused ion beam (FIB) system 611 which comprises an evacuated chamber having an upper neck portion 612 of an ion column within which are located an ion source 614 and a focusing column 616 including extractor electrodes and an electrostatic optical system. The upper neck portion 612 includes an ion source 614, an extraction electrode 615, a focusing element 617, deflection elements 620 (which may be deflection plates), and a focused ion beam 618. Focused ion beam 618 passes from ion source 614 through focusing column 616 and between electrostatic deflection means schematically indicated at 620 toward substrate 622, which comprises, for example, a semiconductor device positioned on movable X-Y sample stage 625 within lower chamber 626.

[0046] Sample stage 625 can move in a horizontal plane (X and Y axes) and vertically (Z axis). Stage 625 can also tilt approximately sixty (60) degrees and rotate about the Z axis. In some embodiments, a separate TEM sample stage (not shown) can be used. Such a TEM sample stage will also preferably be moveable in the X, Y, and Z axes. A door 661 is opened for inserting substrate 622 onto X-Y stage 625 and also for servicing an internal gas supply reservoir, if one is used. The door is interlocked so that it cannot be opened if the system is under vacuum.

[0047] An ion pump 668 is employed for evacuating neck portion 612. The chamber 626 is evacuated with turbomolecular and mechanical pumping system 630 under the control of vacuum controller 632. The vacuum system provides within chamber 626 a vacuum of between approximately 1 x 10-7 Torr and 5 x 10-4 Torr. If an etch assisting, an etch retarding gas, or a deposition precursor gas is used, the chamber background pressure may rise, typically to about 1 x 10-5 Torr.

[0048] The high voltage power supply provides an appropriate acceleration voltage to electrodes in focusing column 616 for energizing and focusing ion beam 618. When it strikes substrate 622, material is sputtered, that is physically ejected, from the sample. Alternatively, ion beam 618 can decompose a precursor gas to deposit a material.

[0049] High voltage power supply 634 is connected to liquid metal ion source 614 as well as to appropriate electrodes in ion beam focusing column 616 for forming an approximately 1 keV to 60 keV ion beam 618 and directing the same toward aAtty. Docket No. TP388808WO1 / TFSP177WO sample. Deflection controller and amplifier 636, operated in accordance with a prescribed pattern provided by pattern generator 638, is coupled to deflection elements 620 whereby ion beam 618 may be controlled manually or automatically to trace out a corresponding pattern on the upper surface of substrate 622. In some systems the deflection plates are placed before the final lens, as is well known in the art. Beam blanking electrodes (not shown) within ion beam focusing column 616 cause ion beam 618 to impact onto blanking aperture (not shown) instead of substrate 622 when a blanking controller (not shown) applies a blanking voltage to the blanking electrode.

[0050] The liquid metal ion source 614 typically provides a metal ion beam of gallium. The source typically is capable of being focused into a sub one-tenth micrometer wide beam at substrate 622 for either modifying the substrate 622 by ion milling, enhanced etch, material deposition, or for the purpose of imaging the substrate 622.

[0051] A charged particle detector 640, such as an Everhart Thornley or multichannel plate, used for detecting secondary ion or electron emission is connected to a video circuit 642 that supplies drive signals to video monitor 644 and receiving deflection signals from a system controller 619. The location of charged particle detector 640 within lower chamber 626 can vary in different embodiments. For example, a charged particle detector 640 can be coaxial with the ion beam and include a hole for allowing the ion beam to pass. In other embodiments, secondary particles can be collected through a final lens and then diverted off axis for collection.

[0052] A micromanipulator 647, such as the AutoProbe 1000™ from Omniprobe, Inc., Dallas, Texas, or the Model MM3A from Kleindiek Nanotechnik, Reutlingen, Germany, can precisely move objects within the vacuum chamber. Micromanipulator 647 may comprise precision electric motors 648 positioned outside the vacuum chamber to provide X, Y, Z, and theta control of a portion 649 positioned within the vacuum chamber. The micromanipulator 647 can be fitted with different end effectors for manipulating small objects. In the embodiments described herein, the end effector is a thin probe 650 (e.g., a manipulator needle and / or a lift-out needle).

[0053] A gas delivery system 646 extends into lower chamber 626 for introducing and directing a gaseous vapor toward substrate 622. U.S. Pat. No. 5,851 ,413 to Casella et al. for "Gas Delivery Systems for Particle Beam Processing," assigned to the assignee of the present invention, describes a suitable gas delivery system 646. Another gas delivery system is described in U.S. Pat. No. 5,435,850 to RasmussenAtty. Docket No. TP388808WO1 / TFSP177WO for a "Gas Injection System," also assigned to the assignee of the present invention. For example, iodine can be delivered to enhance etching, or a metal organic compound can be delivered to deposit a metal.

[0054] System controller 619 controls the operations of the various parts of dual beam system 610. Through system controller 619, a user can cause ion beam 618 or electron beam 643 to be scanned in a desired manner through commands entered into a conventional user interface (not shown). Alternatively, system controller 619 may control dual beam system 610 in accordance with programmed instructions stored in a memory 621. In some embodiments, dual beam system 110 incorporates image recognition software, such as software commercially available from Cognex Corporation, Natick, Massachusetts, to automatically identify regions of interest, and then the system can manually or automatically extract samples in accordance with the invention. For example, the system could automatically locate similar features on semiconductor wafers including multiple devices, and take samples of those features on different (or the same) devices.

[0055] In operation, the system 610 forms a lamella chunk in substrate 622 then transfers the lamella chunk to a TEM grid holder on TEM sample holder 624. To ensure the lamella chunk is properly oriented on the TEM sample holder 624, the orientation of substrate 622 is determined prior to the formation of the lamella chunk. For example, measurements are taken to determine a plane of the surface of the substrate 622 as mounted on the stage 625. The plane of the surface can be determined, for example, by using a capacitance probe brought into close proximity of the surface of the substrate 622 in at least 3 locations. This measurement can then determine the orientation of the sample surface with respect to the stage 625, and / or other components of the system 610, such as an optical axis of the FIB system 611 . Understanding the orientation of the sample surface allows the controller to move the stage 625 so that the surface of the substrate 622 is normal to the FIB optical axis. This allows milling to be performed at a desired angle of circuit structures buried in the substrate 622, for example.

[0056] Understanding the surface orientation also allows the thin probe 650 to be oriented in a desired position with respect to the lamella chunk. By orienting the thin probe 650 correctly, orientation of the sample chunk to the TEM sample holder 624 will be correct. As such, determination of the surface orientation of substrate 622 ensures that the sample chunk is correctly oriented on the TEM sample holder 624,Atty. Docket No. TP388808WO1 / TFSP177WO which ensures further processing and imaging of the sample chunk is properly performed.

[0057] FIGS. 7-12 illustrate stages of lamella lift-out based on sample orientation, in accordance with one or more embodiments described herein.

[0058] FIG. 7 illustrates a first stage 700, wherein a sample 702 has been placed on a sample stage 706 of a scientific instrument. As shown, the plane orientation of sample 702 is not the same as sample stage 706. Accordingly, a capacitance probe, or similar hardware, can measure the plane orientation of sample 702 as described above in greater detail in reference to FIGS. 1-6.

[0059] FIG. 8 illustrates a second stage 800, wherein the tilt of sample stage 706 has been adjusted based on the plane orientation of sample 702. As described above in more detail in relation to FIGS. 1-6, an adjustment component of the scientific instrument can adjust the tilt and rotation of sample stage 706 based on the plane orientation of sample 702. In the example shown herein, the milling of a lamella calls for sample 702 to be level. Accordingly, the tilt of sample stage 706 has been adjusted based on the offset between the plane orientation of sample 702 and the plane orientation of sample stage 706 to level sample 702. It should be appreciated that various other milling patterns may call for sample 702 to be at orientations of any angle and the tilt of sample stage 706 can be adjusted to enable such orientations.

[0060] FIG. 9 illustrates a third stage 900, wherein a lamella 902 is milled from sample 702. As described above in more detail in relation to FIGS. 1-6, lamella 902 can be milled from sample 702 by one or more milling components of the scientific instrument, such as a focused ion beam (FIB). As shown, due to the adjustment of the tilt of sample stage 706, lamella 902 is milled such that a central vertical axis of lamella 902 is perpendicular to the plane orientation of sample 702.

[0061] FIG. 10 illustrates a fourth stage 1000, wherein lamella 902 is lifted away from sample 702 by manipulator needle 1002. As described above in relation to FIGS. 1- 6, manipulator needle can attach to lamella 902 to transfer lamella 902 from sample stage 706 to another portion of the scientific instrument. As part of this process, the capacitance probe can re-measure the plane orientation of lamella 902 to account for any changes in alignment that may have occurred during the milling process. Based on this new plane orientation, the orientation of manipulator needle 1002 as well as the tilt and rotation of sample stage 706 can be adjusted to ensure a strongAtty. Docket No. TP388808WO1 / TFSP177WO connection between manipulator needle 1002 and lamella 902, as well as ensuring a known relative orientation between manipulator needle 1002 and lamella 902.

[0062] FIG. 11 illustrates a fifth stage 1100, wherein lamella 902 is attached to a sample holder 1102. As described above in relation to FIGS. 1-6, manipulator needle 1002 can transfer lamella 902 from sample stage 706 to sample holder 1102. Based on the known relative orientations of manipulator needle 1002 and lamella 902, manipulator needle 1002 can position lamella 902 such that the plane orientation of lamella 902 is perpendicular to a sidewall 1104 of sample holder 1102. This results in the central vertical axis of lamella 902 being parallel to sidewall 1104. This orientation enables improved thinning of lamella 902 during imaging operations, thereby enabling improved imaging both in quality and in the amount of lamella 902 that can be accurately imaged.

[0063] FIG. 12 illustrates a sixth stage 1200, wherein lamella 902 has been welded to sample holder 1102. As described above in relation to FIGS. 1-6, once lamella 902 is welded or alternatively attached to sidewall 1104, manipulator needle 1002 can detach from lamella 902. At this stage, sample holder 1102 can adjust its orientation, using a second adjustment component, to position lamella 902 and / or a target region of lamella 902 appropriately to a user specified instrument angle. For example, given that the instrument comprises an electron microscope, sample holder 1102 can adjust its orientation such that lamella 902 is positioned optimally in relation to the direction of an electron beam emitter of the electron microscope.

[0064] FIGS. 13A and 13B illustrate a flow diagram of an example, non-limiting, method 1300 that can facilitate lift-out of lamella from samples based on sample plane orientation in accordance with one or more embodiments described herein.

[0065] In various embodiments, act 1302 can comprise measuring, by a scientific instrument (e.g., scientific instrument 300 and / or dual beam system 610), plane orientation of a sample. For example, as described above in relation to FIGS. 1-6, the scientific instrument can utilize a capacitance probe, or other suitable hardware, to measure the plane orientation of a sample located on a sample stage of the scientific instrument.

[0066] In various embodiments, act 1304 can comprise determining, by the scientific instrument (e.g., scientific instrument 300, measurement component 314, and / or dual beam system 610), if the plane orientation of the sample is the same as the plane orientation of the sample holder. For example, as described above in relationAtty. Docket No. TP388808WO1 / TFSP177WO to FIGS. 1 -6, the plane orientation of the sample may not be the same as the plane orientation of the sample holder. In the event that the plane orientations are the same (e.g., a “YES” determination), method 1300 can proceed to act 1308 and mill the lamella. In the event that the plane orientations are not the same (e.g., a “NO” determination), method 1300 can proceed to act 1306 and adjust the tilt of the sample plane to compensate.

[0067] In various embodiments, act 1306 can comprise adjusting, by the scientific instrument (e.g., scientific instrument 300 and / or dual beam system 610), stage tilt and rotation of the sample holder based on the plane orientation of the sample. In this manner, as described above in greater detail in relation to FIGS. 1-6, scientific instrument 300 can compensate for offsets between the relative plane orientations of the sample and the sample holder.

[0068] In various embodiments, act 1308 can comprise milling, by the scientific instrument (e.g., scientific instrument 300 and / or dual beam system 610), a lamella from the sample, wherein an axis of the lamella is perpendicular to the plane orientation of the sample. For example, as described above in relation to FIGS. 1 -6, by adjusting the tilt of the sample stage, scientific instrument 300 can ensure that the central vertical axis of the lamella is perpendicular to the plane orientation of the lamella.

[0069] In various embodiments, act 1310 can comprise adjusting, by the scientific instrument (e.g., scientific instrument 300 and / or dual beam system 610), the stage tilt and rotation of the sample stage based on the plane orientation of the lamella and angle of the manipulator needle. For example, as described above in greater detail in reference to FIGS. 1-6, to compensate for potential limitations in the movement of the manipulator needle, the tilt and / or rotation of the manipulator needle can be adjusted to ensure an appropriate connection and relative orientation of the manipulator needle and the lamella.

[0070] In various embodiments, act 1312 can comprise adjusting, by the scientific instrument (e.g., scientific instrument 300 and / or dual beam system 610), the angle of the manipulator needle. For example, once the stage tilt has been adjusted, the angle of the manipulator needle can adjust to a proper angle for an appropriate connection to the lamella.

[0071] In various embodiments, act 1314 can comprise removing, by the scientific instrument (e.g., scientific instrument 300 and / or dual beam system 610), the lamellaAtty. Docket No. TP388808WO1 / TFSP177WO from the sample. For example, after adjustments of the relative orientations of the manipulator needle and sample stage of the proceeding acts, the manipulator needle can be attached to the lamella and then lift the lamella out of the sample and to a sample holder.

[0072] In various embodiments, act 1316 can comprise rotating, by the scientific instrument (e.g., scientific instrument 300 and / or dual beam system 610), the manipulator needle such that the plane orientation of the lamella is at a specified angle relative to a sidewall of a sample holder. For example, as described above in relation to FIGS. 1-6, the manipulator needle can position the lamella touching the sample holder, wherein the plane orientation of the lamella is perpendicular to the side wall of the sample holder. This creates a relative orientation between the lamella and the sample holder that optimizes the amount of thinning that can be performed on the lamella, and thus quality of the imaging process.

[0073] In various embodiments, act 1318 can comprise welding, by the scientific instrument (e.g., scientific instrument 300 and / or dual beam system 610), the lamella to the sample holder. Once the lamella is secured to the sample holder, the manipulator needle can detach from the lamella.

[0074] In various embodiments, act 1320 can comprise rotating, by the scientific instrument (e.g., scientific instrument 300 and / or dual beam system 610), the sample holder based relative orientations of the sample holder, a user specified instrument angle, and a target region of the lamella. For example, as described above in relation to FIGS. 1-6, the sample holder can rotate to ensure appropriate relative orientation between imaging equipment of the scientific instrument and the target region of the lamella.

[0075] In various embodiments, act 1322 can comprise imaging, by the scientific instrument (e.g., scientific instrument 300 and / or dual beam system 610), the target region of the lamella.

[0076] An advantage of the systems, and / or of corresponding methods described herein is the ability to improve lamella lift-out processes by making lamella lift-outs repeatable. For example, through the various tilt adjustments and compensations, lamella from different samples can be repeatedly and accurately welded to the sample post, allowing for greater repeatability in imaging of the lamellas.Additionally, the systems and / or corresponding methods described herein enableAtty. Docket No. TP388808WO1 / TFSP177WO more precise attachment of the lamella to the sample holder, thereby improving ease of thinning the lamella during imaging.

[0077] The technical effect of such systems and / or corresponding methods is to enable consistent and accurate milling and positioning of lamella, even when the sample orientation is not equivalent with the orientation of a sample stage.

[0078] In various instances, machine learning algorithms or models can be implemented in any suitable way to facilitate any suitable aspects described herein. To facilitate some of the above-described machine learning aspects of various embodiments, consider the following discussion of artificial intelligence (Al). Various embodiments described herein can employ artificial intelligence to facilitate automating one or more features or functionalities. The components can employ various Al-based schemes for carrying out various embodiments / examples disclosed herein. In order to provide for or aid in the numerous determinations (e.g., determine, ascertain, infer, calculate, predict, prognose, estimate, derive, forecast, detect, compute) described herein, components described herein can examine the entirety or a subset of the data to which it is granted access and can provide for reasoning about or determine states of the system or environment from a set of observations as captured via events or data. Determinations can be employed to identify a specific context or action, or can generate a probability distribution over states, for example. The determinations can be probabilistic; that is, the computation of a probability distribution over states of interest based on a consideration of data and events. Determinations can also refer to techniques employed for composing higher-level events from a set of events or data.

[0079] Such determinations can result in the construction of new events or actions from a set of observed events or stored event data, whether or not the events are correlated in close temporal proximity, and whether the events and data come from one or several event and data sources. Components disclosed herein can employ various classification (explicitly trained (e.g., via training data) as well as implicitly trained (e.g., via observing behavior, preferences, historical information, receiving extrinsic information, and so on)) schemes or systems (e.g., support vector machines, neural networks, expert systems, Bayesian belief networks, fuzzy logic, data fusion engines, and so on) in connection with performing automatic or determined action in connection with the claimed subject matter. Thus, classificationAtty. Docket No. TP388808WO1 / TFSP177WO schemes or systems can be used to automatically learn and perform a number of functions, actions, or determinations.

[0080] A classifier can map an input attribute vector, z = (z1 , z2, z3, z4, zn), to a confidence that the input belongs to a class, as by f(z) = confidence(class). Such classification can employ a probabilistic or statistical-based analysis (e.g., factoring into the analysis utilities and costs) to determinate an action to be automatically performed. A support vector machine (SVM) can be an example of a classifier that can be employed. The SVM operates by finding a hyper-surface in the space of possible inputs, where the hyper-surface attempts to split the triggering criteria from the non-triggering events. Intuitively, this makes the classification correct for testing data that is near, but not identical to training data. Other directed and undirected model classification approaches include, e.g., naive Bayes, Bayesian networks, decision trees, neural networks, fuzzy logic models, or probabilistic classification models providing different patterns of independence, any of which can be employed. Classification as used herein also is inclusive of statistical regression that is utilized to develop models of priority.

[0081] In order to provide additional context for various embodiments described herein, FIG. 14 and the following discussion are intended to provide a brief, general description of a suitable computing environment 1400 in which the various embodiments of the embodiment described herein can be implemented. While the embodiments have been described above in the general context of computerexecutable instructions that can run on one or more computers, those skilled in the art will recognize that the embodiments can be also implemented in combination with other program modules or as a combination of hardware and software.

[0082] Generally, program modules include routines, programs, components, data structures, etc., that perform particular tasks or implement particular abstract data types. Moreover, those skilled in the art will appreciate that the inventive methods can be practiced with other computer system configurations, including singleprocessor or multi-processor computer systems, minicomputers, mainframe computers, Internet of Things (loT) devices, distributed computing systems, as well as personal computers, hand-held computing devices, microprocessor-based or programmable consumer electronics, and the like, each of which can be operatively coupled to one or more associated devices.Atty. Docket No. TP388808WO1 / TFSP177WO

[0083] The illustrated embodiments of the embodiments herein can be also practiced in distributed computing environments where certain tasks are performed by remote processing devices that are linked through a communications network. In a distributed computing environment, program modules can be located in both local and remote memory storage devices.

[0084] Computing devices typically include a variety of media, which can include computer-readable storage media, machine-readable storage media, or communications media, which two terms are used herein differently from one another as follows. Computer-readable storage media or machine-readable storage media can be any available storage media that can be accessed by the computer and includes both volatile and nonvolatile media, removable and non-removable media. By way of example, and not limitation, computer-readable storage media or machine-readable storage media can be implemented in connection with any method or technology for storage of information such as computer-readable or machine-readable instructions, program modules, structured data or unstructured data.

[0085] Computer-readable storage media can include, but are not limited to, random access memory (RAM), read only memory (ROM), electrically erasable programmable read only memory (EEPROM), flash memory or other memory technology, compact disk read only memory (CD ROM), digital versatile disk (DVD), Blu-ray disc (BD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, solid state drives or other solid state storage devices, or other tangible or non-transitory media which can be used to store desired information. In this regard, the terms “tangible” or “non- transitory” herein as applied to storage, memory or computer-readable media, are to be understood to exclude only propagating transitory signals per se as modifiers and do not relinquish rights to all standard storage, memory or computer-readable media that are not only propagating transitory signals per se.

[0086] Computer-readable storage media can be accessed by one or more local or remote computing devices, e.g., via access requests, queries or other data retrieval protocols, for a variety of operations with respect to the information stored by the medium.

[0087] Communications media typically embody computer-readable instructions, data structures, program modules or other structured or unstructured data in a dataAtty. Docket No. TP388808WO1 / TFSP177WO signal such as a modulated data signal, e.g., a carrier wave or other transport mechanism, and includes any information delivery or transport media. The term “modulated data signal” or signals refers to a signal that has one or more of its characteristics set or changed in such a manner as to encode information in one or more signals. By way of example, and not limitation, communication media include wired media, such as a wired network or direct-wired connection, and wireless media such as acoustic, RF, infrared and other wireless media.

[0088] With reference again to FIG. 14, the example environment 1400 for implementing various embodiments of the aspects described herein includes a computer 1402, the computer 1402 including a processing unit 1404, a system memory 1406 and a system bus 1408. The system bus 1408 couples system components including, but not limited to, the system memory 1406 to the processing unit 1404. The processing unit 1404 can be any of various commercially available processors. Dual microprocessors and other multi processor architectures can also be employed as the processing unit 1404.

[0089] The system bus 1408 can be any of several types of bus structure that can further interconnect to a memory bus (with or without a memory controller), a peripheral bus, and a local bus using any of a variety of commercially available bus architectures. The system memory 1406 includes ROM 1410 and RAM 1412. A basic input / output system (BIOS) can be stored in a non-volatile memory such as ROM, erasable programmable read only memory (EPROM), EEPROM, which BIOS contains the basic routines that help to transfer information between elements within the computer 1402, such as during startup. The RAM 1412 can also include a highspeed RAM such as static RAM for caching data.

[0090] The computer 1402 further includes an internal hard disk drive (HDD) 1414 (e.g., EIDE, SATA), one or more external storage devices 1416 (e.g., a magnetic floppy disk drive (FDD), a memory stick or flash drive reader, a memory card reader, etc.) and a drive 1420, e.g., such as a solid state drive, an optical disk drive, which can read or write from a disk 1422, such as a CD-ROM disc, a DVD, a BD, etc. Alternatively, where a solid state drive is involved, disk 1422 would not be included, unless separate. While the internal HDD 1414 is illustrated as located within the computer 1402, the internal HDD 1414 can also be configured for external use in a suitable chassis (not shown). Additionally, while not shown in environment 1400, a solid state drive (SSD) could be used in addition to, or in place of, an HDD 1414. TheAtty. Docket No. TP388808WO1 / TFSP177WOHDD 1414, external storage device(s) 1416 and drive 1420 can be connected to the system bus 1408 by an HDD interface 1424, an external storage interface 1426 and a drive interface 1428, respectively. The interface 1424 for external drive implementations can include at least one or both of Universal Serial Bus (USB) and Institute of Electrical and Electronics Engineers (IEEE) 1494 interface technologies. Other external drive connection technologies are within contemplation of the embodiments described herein.

[0091] The drives and their associated computer-readable storage media provide nonvolatile storage of data, data structures, computer-executable instructions, and so forth. For the computer 1402, the drives and storage media accommodate the storage of any data in a suitable digital format. Although the description of computer- readable storage media above refers to respective types of storage devices, it should be appreciated by those skilled in the art that other types of storage media which are readable by a computer, whether presently existing or developed in the future, could also be used in the example operating environment, and further, that any such storage media can contain computer-executable instructions for performing the methods described herein.

[0092] A number of program modules can be stored in the drives and RAM 1412, including an operating system 1430, one or more applications 1432 (e.g., programs), other program modules 1434 and program data 1436. All or portions of the operating system, applications, modules, or data can also be cached in the RAM 1412. The systems and methods described herein can be implemented utilizing various commercially available operating systems or combinations of operating systems.

[0093] Computer 1402 can optionally comprise emulation technologies. For example, a hypervisor (not shown) or other intermediary can emulate a hardware environment for operating system 1430, and the emulated hardware can optionally be different from the hardware illustrated in FIG. 14. In such an embodiment, operating system 1430 can comprise one virtual machine (VM) of multiple VMs hosted at computer 1402. Furthermore, operating system 1430 can provide runtime environments, such as the Java runtime environment or the .NET framework, for applications 1432.Runtime environments are consistent execution environments that allow applications 1432 to run on any operating system that includes the runtime environment.Similarly, operating system 1430 can support containers, and applications 1432 can be in the form of containers, which are lightweight, standalone, executable packagesAtty. Docket No. TP388808WO1 / TFSP177WO of software that include, e.g., code, runtime, system tools, system libraries and settings for an application.

[0094] Further, computer 1402 can be enable with a security module, such as a trusted processing module (TPM). For instance with a TPM, boot components hash next in time boot components, and wait for a match of results to secured values, before loading a next boot component. This process can take place at any layer in the code execution stack of computer 1402, e.g., applied at the application execution level or at the operating system (OS) kernel level, thereby enabling security at any level of code execution.

[0095] A user can enter commands and information into the computer 1402 through one or more wired / wireless input devices, e.g., a keyboard 1438, a touch screen 1440, and a pointing device, such as a mouse 1442. Other input devices (not shown) can include a microphone, an infrared (IR) remote control, a radio frequency (RF) remote control, or other remote control, a joystick, a virtual reality controller or virtual reality headset, a game pad, a stylus pen, an image input device, e.g., camera(s), a gesture sensor input device, a vision movement sensor input device, an emotion or facial detection device, a biometric input device, e.g., fingerprint or iris scanner, or the like. These and other input devices are often connected to the processing unit 1404 through an input device interface 1444 that can be coupled to the system bus 1408, but can be connected by other interfaces, such as a parallel port, an IEEE 1494 serial port, a game port, a USB port, an IR interface, a BLUETOOTH® interface, etc.

[0096] A monitor 1446 or other type of display device can be also connected to the system bus 1408 via an interface, such as a video adapter 1448. In addition to the monitor 1446, a computer typically includes other peripheral output devices (not shown), such as speakers, printers, etc.

[0097] The computer 1402 can operate in a networked environment using logical connections via wired or wireless communications to one or more remote computers, such as a remote computer(s) 1450. The remote computer(s) 1450 can be a workstation, a server computer, a router, a personal computer, portable computer, microprocessor-based entertainment appliance, a peer device or other common network node, and typically includes many or all of the elements described relative to the computer 1402, although, for purposes of brevity, only a memory / storage device 1452 is illustrated. The logical connections depicted include wired / wirelessAtty. Docket No. TP388808WO1 / TFSP177WO connectivity to a local area network (LAN) 1454 or larger networks, e.g., a wide area network (WAN) 1456. Such LAN and WAN networking environments are commonplace in offices and companies, and facilitate enterprise-wide computer networks, such as intranets, all of which can connect to a global communications network, e.g., the Internet.

[0098] When used in a LAN networking environment, the computer 1402 can be connected to the LAN 1454 through a wired or wireless communication network interface or adapter 1458. The adapter 1458 can facilitate wired or wireless communication to the LAN 1454, which can also include a wireless access point (AP) disposed thereon for communicating with the adapter 1458 in a wireless mode.

[0099] When used in a WAN networking environment, the computer 1402 can include a modem 1460 or can be connected to a communications server on the WAN 1456 via other means for establishing communications over the WAN 1456, such as by way of the Internet. The modem 1460, which can be internal or external and a wired or wireless device, can be connected to the system bus 1408 via the input device interface 1444. In a networked environment, program modules depicted relative to the computer 1402 or portions thereof, can be stored in the remote memory / storage device 1452. It will be appreciated that the network connections shown are example and other means of establishing a communications link between the computers can be used.

[0100] When used in either a LAN or WAN networking environment, the computer 1402 can access cloud storage systems or other network-based storage systems in addition to, or in place of, external storage devices 1416 as described above, such as but not limited to a network virtual machine providing one or more aspects of storage or processing of information. Generally, a connection between the computer 1402 and a cloud storage system can be established over a LAN 1454 or WAN 1456 e.g., by the adapter 1458 or modem 1460, respectively. Upon connecting the computer 1402 to an associated cloud storage system, the external storage interface 1426 can, with the aid of the adapter 1458 or modem 1460, manage storage provided by the cloud storage system as it would other types of external storage. For instance, the external storage interface 1426 can be configured to provide access to cloud storage sources as if those sources were physically connected to the computer 1402.Atty. Docket No. TP388808WO1 / TFSP177WO

[0101] The computer 1402 can be operable to communicate with any wireless devices or entities operatively disposed in wireless communication, e.g., a printer, scanner, desktop or portable computer, portable data assistant, communications satellite, any piece of equipment or location associated with a wirelessly detectable tag (e.g., a kiosk, news stand, store shelf, etc.), and telephone. This can include Wireless Fidelity (Wi-Fi) and BLUETOOTH® wireless technologies. Thus, the communication can be a predefined structure as with a conventional network or simply an ad hoc communication between at least two devices.

[0102] Various non-limiting aspects are described in the following examples.

[0103] EXAMPLE 1 : A method comprising: adjusting, by a scientific instrument, a stage tilt and a rotation of a sample stage of the scientific instrument based on a plane orientation of a sample.

[0104] EXAMPLE 2: The method of any preceding example, further comprising: measuring, by the scientific instrument, the plane orientation of the sample; milling, by the scientific instrument, a lamella from the sample, wherein an axis of the lamella is equal to a specified angle relative to the plane orientation of the sample; and adjusting, by the scientific instrument, the stage tilt of the sample stage based on the plane orientation and angle of a manipulator needle of the scientific instrument.

[0105] EXAMPLE 3: The method of any preceding example, further comprising: adjusting, by the scientific instrument, the angle of the manipulator needle; and removing, by the scientific instrument, the lamella from the sample.

[0106] EXAMPLE 4: The method of any preceding example, further comprising: rotating, by the scientific instrument, the manipulator needle such that the plane orientation of the sample is at a specified angle relative to a sidewall of a sample holder; and welding, by the scientific instrument, the lamella to the sidewall of the sample holder.

[0107] EXAMPLE 5: The method of any preceding example, further comprising: rotating, by the scientific instrument, the sample holder based on relative orientations of the sample holder, a user specified instrument angle, and a target region of the lamella; and imaging, by the scientific instrument, the target region of the lamella.

[0108] EXAMPLE 6: The method of any preceding example, wherein the measuring of the plane orientation of the sample comprises measuring, by the scientific instrument, an X axis, a Y axis, and a Z axis of a surface of the sample.Atty. Docket No. TP388808WO1 / TFSP177WO

[0109] EXAMPLE 7: The method of any preceding example, wherein the measuring of the plane orientation of the sample comprises: measuring, by the scientific instrument, a distance of a capacitance probe from the sample at three points; and based on the distance of the capacitance probe from the sample at the three points, generating, by the scientific instrument, a plane orientation that fits the three points.

[0110] In various aspects, any combination or combinations of EXAMPLES 1-7 can be implemented.

[0111] EXAMPLE 8: A scientific instrument comprising: an adjustment component that adjusts a stage tilt and a rotation of a sample stage of the scientific instrument based on a plane orientation of a sample.

[0112] EXAMPLE 9: The scientific instrument of any preceding example, further comprising: a capacitance probe that measures the plane orientation of the sample; a milling component that mills a lamella from the sample, wherein an axis of the lamella is perpendicular to the plane orientation of the sample; and a manipulator needle that removes the lamella from the sample stage to a sample holder, wherein the adjustment component further adjusts the stage tilt and the rotation of the sample stage based on the plane orientation of the sample and an angle of the manipulator needle.

[0113] EXAMPLE 10: The scientific instrument of any preceding example, further comprising a sample welder that welds the lamella to a sidewall of the sample holder, wherein the manipulator needle rotates the lamella such that the plane orientation of the lamella is equal to a specified angle relative to the sidewall of the sample holder prior to welding.

[0114] EXAMPLE 11 : The scientific instrument of any preceding example, further comprising: an electron beam emitter that passes an electron beam through a target region of the sample; and an electron detector that measures secondary electrons from the target region of the lamella.

[0115] EXAMPLE 12: The scientific instrument of any preceding example, wherein the adjustment component is a first adjustment component, further comprising a second adjustment component that rotates and tilts the sample holder based on relative orientations of the sample holder, a user specified instrument angle, and a target region of the lamella.Atty. Docket No. TP388808WO1 / TFSP177WO

[0116] EXAMPLE 13: The scientific instrument of any preceding example, wherein the capacitance probe measures the plane orientation of the sample by measuring an X axis, a Y axis, and a Z axis of a surface of the sample.

[0117] EXAMPLE 14: The scientific instrument of any preceding example, wherein the capacitance probe measures the plane orientation of the sample by: measuring distance of the capacitance probe from the sample at three or more points; and based on the distance of the capacitance probe from the sample at the three or more points, generating a plane orientation that fits the three or more points.

[0118] In various aspects, any combination or combinations of EXAMPLES 8-14 can be implemented.

[0119] EXAMPLE 15: A method comprising: measuring, by a scientific instrument, a distance of a capacitance probe of the scientific instrument from a sample at three or more points; based on the distance of the capacitance probe from the sample at the three or more points, generating, by the scientific instrument, a plane orientation that fits the three or more points; and adjusting, by the scientific instrument, a stage tilt and a rotation of a sample stage of the scientific instrument.

[0120] EXAMPLE 16: The method of any preceding example, further comprising: milling, by the scientific instrument, a lamella from the sample, wherein an axis of the lamella perpendicular to the plane orientation of the sample; and adjusting, by the scientific instrument, the stage tilt of the sample stage based on the plane orientation of the sample and an angle of a manipulator needle of the scientific instrument.

[0121] EXAMPLE 17: The method of any preceding example, further comprising removing, by the scientific instrument, the lamella from the sample.

[0122] EXAMPLE 18: The method of any preceding example, further comprising: rotating, by the scientific instrument, the lamella such that the plane orientation of the lamella is equal to a specified angle relative to a sidewall of a sample holder; and welding, by the scientific instrument, the lamella to the sidewall of the sample holder.

[0123] EXAMPLE 19: The method of any preceding example, further comprising: rotating, by the scientific instrument, the sample holder based on relative orientations of the sample holder, a user specified instrument angle, and a target region of the lamella; and executing, by the scientific instrument, an analytical experiment on the lamella.Atty. Docket No. TP388808WO1 / TFSP177WO

[0124] EXAMPLE 20: The method of any preceding example, wherein the analytical experiment comprises an imaging, by the scientific instrument, of the target region of the lamella.

[0125] In various aspects, any combination or combinations of EXAMPLES 15-20 can be implemented.

[0126] In various aspects, any combination or combinations of EXAMPLES 1-20 can be implemented.

Claims

Atty. Docket No. TP388808WO1 / TFSP177WOCLAIMSWhat is claimed is:1 . A method comprising: adjusting, by a scientific instrument, a stage tilt and a rotation of a sample stage of the scientific instrument based on a plane orientation of a sample.

2. The method of claim 1 , further comprising: measuring, by the scientific instrument, the plane orientation of the sample; milling, by the scientific instrument, a lamella from the sample, wherein an axis of the lamella is perpendicular to the plane orientation of the sample; and adjusting, by the scientific instrument, the stage tilt of the sample stage based on the plane orientation of the sample and an angle of a manipulator needle of the scientific instrument.

3. The method of claim 2, further comprising: removing, by the scientific instrument, the lamella from the sample.

4. The method of claim 3, further comprising: rotating, by the scientific instrument, the manipulator needle such that the plane orientation of the sample is at a specified angle relative to a sidewall of a sample holder; and welding, by the scientific instrument, the lamella to the sidewall of the sample holder.

5. The method of claim 4, further comprising: rotating, by the scientific instrument, the sample holder based on relative orientations of the sample holder, a user specified instrument angle, and a target region of the lamella; and imaging, by the scientific instrument, the target region of the lamella.Atty. Docket No. TP388808WO1 / TFSP177WO6. The method of claim 2, wherein the measuring of the plane orientation of the sample comprises measuring, by the scientific instrument, an X axis, a Y axis, and a Z axis of a surface of the sample.

7. The method of claim 2, wherein the measuring of the plane orientation of the sample comprises: measuring, by the scientific instrument, a distance of a capacitance probe from the sample at three points; and based on the distance of the capacitance probe from the sample at the three points, generating, by the scientific instrument, a plane orientation that fits the three points.

8. A scientific instrument comprising: an adjustment component that adjusts a stage tilt and a rotation of a sample stage of the scientific instrument based on a plane orientation of a sample.

9. The scientific instrument of claim 8, further comprising: a capacitance probe that measures the plane orientation of the sample; a milling component that mills a lamella from the sample, wherein an axis of the lamella is perpendicular to the plane orientation of the sample; and a manipulator needle that removes the lamella from the sample stage to a sample holder, wherein the adjustment component further adjusts the stage tilt and the rotation of the sample stage based on the plane orientation of the sample and an angle of the manipulator needle.

10. The scientific instrument of claim 9, further comprising a sample welder that welds the lamella to a sidewall of the sample holder, wherein the manipulator needle rotates the lamella such that a plane orientation of the lamella is at a specified angle relative to the sidewall of the sample holder prior to welding.Atty. Docket No. TP388808WO1 / TFSP177WO11 . The scientific instrument of claim 10, further comprising: an electron beam emitter that passes an electron beam through a target region of the sample; and an electron detector that measures secondary electrons from the target region of the lamella.

12. The scientific instrument of claim 10, wherein the adjustment component is a first adjustment component, further comprising a second adjustment component that rotates and tilts the sample holder based on relative orientations of the sample holder, a user specified instrument angle, and a target region of the lamella.

13. The scientific instrument of claim 9, wherein the capacitance probe measures the plane orientation of the sample by measuring an X axis, a Y axis, and a Z axis of a surface of the sample.

14. The scientific instrument of claim 9, wherein the capacitance probe measures the plane orientation of the sample by: measuring distance of the capacitance probe from the sample at three or more points; and based on the distance of the capacitance probe from the sample at the three or more points, generating a plane orientation that fits the three or more points.

15. A method comprising: measuring, by a scientific instrument, a distance of a capacitance probe of the scientific instrument from a sample at three or more points; based on the distance of the capacitance probe from the sample at the three or more points, generating, by the scientific instrument, a plane orientation that fits the three or more points; and adjusting, by the scientific instrument, a stage tilt and a rotation of a sample stage of the scientific instrument.Atty. Docket No. TP388808WO1 / TFSP177WO16. The method of claim 15, further comprising: milling, by the scientific instrument, a lamella from the sample, wherein an axis of the lamella perpendicular to the plane orientation of the sample; and adjusting, by the scientific instrument, the stage tilt of the sample stage based on the plane orientation of the sample and an angle of a manipulator needle of the scientific instrument.

17. The method of claim 16, further comprising removing, by the scientific instrument, the lamella from the sample.

18. The method of claim 17, further comprising: rotating, by the scientific instrument, the lamella such that a plane orientation of the lamella is at a specified angle relative to a sidewall of a sample holder; and welding, by the scientific instrument, the lamella to the sidewall of the sample holder.

19. The method of claim 18, further comprising: rotating, by the scientific instrument, the sample holder based on relative orientations of the sample holder, a user specified instrument angle, and a target region of the lamella; and executing, by the scientific instrument, an analytical experiment on the lamella.

20. The method of claim 19, wherein the analytical experiment comprises imaging, by the scientific instrument, of the target region of the lamella.

Images