Optical module

Abstract

The optical module provided in the present disclosure comprises a MAC chip and an MCU. In order to control the optical module to enter a continuous light emission mode, the MCU comprises a light-emitting state register. When a register value of the light-emitting state register of the MCU is a first register value, the laser chip is instructed to enter the continuous light emission mode, and when the register value is a second register value, the laser chip is instructed to enter a burst mode. When the light-emitting state register value is set from the first register value to the second register value, the laser chip is switched from the continuous light emission mode to the burst mode; and when the light-emitting state register value is set from the second register value to the first register value, the laser chip is switched from the burst mode to the continuous light emission mode.

Description

Optical module

[0001] This application claims priority to the application No. 202411345620.9 filed with the China Patent Office on September 25, 2024; the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to the field of optical fiber communication technology, in particular to an optical module. BACKGROUND

[0003] With the development of new business and application modes such as cloud computing, mobile Internet, and video, the progress of optical communication technology becomes increasingly important. In optical communication technology, optical modules, as one of the key devices in optical communication equipment, can realize optical-electrical signal conversion; in the development process of optical communication technology, the data transmission rate of optical modules is required to be continuously improved.

[0004] With the development of intelligentization and networking of vehicles, vehicle-mounted communication technology becomes more and more important. Vehicle-mounted communication systems mostly use cables for data transmission, but this way has problems such as limited transmission distance, fast signal attenuation, and easy to be affected by electromagnetic interference. Vehicle-mounted optical modules can realize high-speed and long-distance transmission of data, and improve the overall performance of vehicle-mounted communication systems.

[0005] SUMMARY

[0006] The optical module provided by the embodiments of the present disclosure comprises:

[0007] a circuit board;

[0008] a laser chip, electrically connected to the circuit board;

[0009] a laser drive chip, located on the surface of the circuit board, and electrically connected to the laser chip;

[0010] an MCU, located on the surface of the circuit board, and electrically connected to the laser drive chip; the MCU comprises:

[0011] a light emission state register, the light emission state register value being a first register value indicates that the laser chip enters a long light emission mode, and the light emission state register value being a second register value indicates that the laser chip enters a burst mode; the MCU is configured to:

[0012] when the light emission state register value is set from the first register value to the second register value, the laser chip is switched from the long light emission mode to the burst mode;

[0013] when the light emission state register value is set from the second register value to the first register value, the laser chip is switched from the burst mode to the long light emission mode. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative effort based on these drawings.

[0015] FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments of the present disclosure;

[0016] FIG. 2 is a partial structure diagram of a host computer according to some embodiments of the present disclosure;

[0017] FIG. 3 is a structure diagram of an optical module according to some embodiments of the present disclosure;

[0018] FIG. 4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0019] FIG. 5 is a structure diagram of a circuit board surface according to some embodiments of the present disclosure;

[0020] FIG. 6 is an outline structure diagram of an optical emitting component according to some embodiments of the present disclosure;

[0021] FIG. 7 is an internal structure diagram of an optical emitting component according to some embodiments of the present disclosure;

[0022] FIG. 8 is a schematic diagram of a burst light emitting mode principle of an optical emitting component according to some embodiments of the present disclosure;

[0023] FIG. 9 is a schematic diagram of an electrical connection of an optical emitting component according to some embodiments of the present disclosure;

[0024] FIG. 10 is a control flow diagram of a long light emitting mode of an optical emitting component according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0025] The technical solutions in some embodiments of the present disclosure will be described clearly and completely with reference to the drawings. Obviously, the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present disclosure.

[0026] Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise," "comprising," and the like are to be construed in an open, inclusive sense, as opposed to a closed or exclusive sense, so that, for example, the term "comprising" will be understood to mean "including but not limited to." In the description of the specification, the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples" are not necessarily referring to the same embodiment or example. Furthermore, the described features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0027] Hereinafter, the terms "first", "second", etc. are used only for the purpose of description and should not be construed as indicating or implying relative importance or implying the number of the indicated technical features. Thus, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0028] In describing some embodiments, "coupled" and "connected," and variations thereof, can be used. For example, the term "connected" can be used to mean that two or more elements are in direct physical or electrical contact with each other. As another example, the term "coupled" can be used to mean that two or more elements are in direct physical or electrical contact with each other. However, the terms "coupled" or "communicatively coupled" can also mean that two or more elements are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the context.

[0029] "A, B, and C at least one of" has the same meaning as "at least one of A, B, or C", and includes the following combinations of A, B, and C: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0030] "A and / or B" includes the following three combinations: only A, only B, and a combination of A and B.

[0031] The use of “adapted to” or “configured to” herein means open and inclusive language that does not exclude additional devices or steps not explicitly described.

[0032] As used herein, “about,” “approximately,” or “around” includes the recited value and the average value within an acceptable range of deviation from the particular value, as determined by one of ordinary skill in the art taking into account the measurement being discussed and the error associated with measuring the particular quantity (i.e., the limitations of the measurement system).

[0033] In optical communication technology, in order to establish information transmission between information processing devices, information needs to be loaded onto light, and the transmission of information is achieved by utilizing the propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in an information transmission device, and thus high-speed, long-distance, and low-cost information transmission can be achieved. The signal that can be recognized and processed by the information processing device is an electrical signal. The information processing device usually includes an optical network unit (ONU), a gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer, a television, etc., and the information transmission device usually includes an optical fiber and an optical waveguide, etc.

[0034] The optical module can realize the mutual conversion between the optical signal and the electrical signal between the information processing device and the information transmission device. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network unit; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network unit; a second electrical signal from the optical network unit is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since information transmission can be performed between multiple information processing devices through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all the information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is referred to as the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be referred to as an electrical port.

[0035] FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments of the present disclosure. As shown in FIG. 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0036] One end of the optical fiber 101 extends towards the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can maintain the original optical power. The optical signal is totally reflected in the optical fiber 101 multiple times to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance and low-power-loss information transmission.

[0037] The optical communication system can include one or more optical fibers 101, and the optical fiber 101 is detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0038] The host computer 100 includes a housing substantially in the shape of a rectangular cuboid, and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to access the optical module 200 to establish a one-way or two-way electrical signal connection between the host computer 100 and the optical module 200.

[0039] The host computer 100 further comprises an external electrical interface configured to access an electrical signal network. For example, the external electrical interface comprises a Universal Serial Bus (USB) interface or a network cable interface 104 configured to access a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100 to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote server 1000. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for converting optical signals and electrical signals, and the information does not change in the conversion process of the optical signals and the electrical signals, and the encoding and decoding mode of the information can change.

[0040] In addition to the optical network terminal, the host computer 100 further comprises an optical line terminal (OLT), an optical network terminal (ONT), or a data center server, etc.

[0041] FIG. 2 is a partial structure diagram of a host computer according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG. 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG. 2, the host computer 100 further comprises a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector arranged inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a fin or other protruding structure to increase the heat dissipation area.

[0042] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish a bidirectional electrical signal connection. In addition, the optical port of the optical module 200 is connected with the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection.

[0043] FIG. 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and FIG. 4 is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in FIGS. 3 and 4, the optical module 200 includes a shell, a circuit board 300 arranged in the shell, an optical transmitting component 400, and an optical receiving component 500. However, the present disclosure is not limited thereto, and in some embodiments, the optical module 200 includes one of the optical transmitting component 400 and the optical receiving component 500.

[0044] The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 is covered on the lower shell 202 to form the above-mentioned shell having two openings 204 and 205. The outer contour of the shell generally presents a square body.

[0045] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021. The upper shell 201 includes a cover plate 2011, and the cover plate 2011 is covered on the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0046] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021. The upper shell 201 includes a cover plate 2011 and two upper side plates arranged perpendicularly to the cover plate 2011 on both sides of the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to achieve that the upper shell 201 is covered on the lower shell 202.

[0047] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold fingers 301 of the circuit board 300 extend from the electrical port 204 and are inserted into the electrical connector of the host computer 100. The opening 205 is an optical port configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical transmitting component 400 and the optical receiving component 500 in the optical module 200.

[0048] The assembly of the upper shell 201 and the lower shell 202 facilitates the installation of the circuit board 300, the optical transmitting component 400, the optical receiving component 500, etc. in the shells, and the shells 201 and 202 can encapsulate and protect the above-mentioned devices. In addition, when assembling the circuit board 300, the optical transmitting component 400, and the optical receiving component 500, etc., the positioning components, heat dissipation components, and electromagnetic shielding components of these devices can be easily deployed, which facilitates automated production.

[0049] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0050] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside the shell thereof. The unlocking component 600 is configured to achieve fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0051] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202 and includes a clamping component matched with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the clamping component of the unlocking component 600 fixes the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves, thereby changing the connection relationship between the clamping component and the host computer, to release the fixation between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0052] The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to circuit design through the circuit traces to realize power supply, electrical signal transmission, and grounding, etc. The electronic components may, for example, include capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). The chips may, for example, include Microcontroller Units (MCUs), laser drive chips, Transimpedance Amplifiers (TIAs), limiting amplifiers, Clock and Data Recovery (CDR) chips, power management chips, and Digital Signal Processing (DSP) chips.

[0053] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize a bearing function, such as stably bearing the above-mentioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0054] The circuit board 300 also includes a gold finger 301 formed on the surface of the end thereof. The gold finger 301 is composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is in conduction with the electrical connector in the cage 106. The gold finger 301 can be provided only on the surface (e.g., the upper surface shown in FIG. 4) of one side of the circuit board 300, or can be provided on the surfaces of both upper and lower sides of the circuit board 300 to provide a larger number of pins to adapt to occasions requiring a large number of pins. The gold finger 301 is configured to establish electrical connection with the host computer to realize power supply, grounding, Inter-Integrated Circuit (I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

[0055] At least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold finger 301.

[0056] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then are electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively.

[0057] In some embodiments, at least one of the light emitting component or the light receiving component can be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component can be disposed on a surface of the circuit board 300 or a side edge of the circuit board 300.

[0058] In some embodiments, according to different applications, the optical module can be divided into a Passive Optical Network (PON) module, a data communication module, a telecommunication communication module, and a wireless transmission module. Among them, in the PON fiber communication network, an Optical Line Terminator (OLT) and an Optical Net Unit (ONU) are included. The OLT serves as a central device and is responsible for the control and management of the fiber network, while the ONU is connected to the user terminal to provide fiber access services. The optical module is arranged on the OLT and the ONU, thereby realizing the fiber communication connection between the OLT and the ONU. The OLT converges data streams from multiple ONUs and converts the data into optical signals for transmission to multiple ONUs.

[0059] FIG. 5 is a structure diagram of a circuit board surface provided according to some embodiments of the present disclosure. As shown in FIG. 5, in some embodiments, the optical module can include a Media Access Control (MAC) chip 301.

[0060] In some embodiments, the MAC chip 301 is disposed on the surface of the circuit board 300.

[0061] In some embodiments, the MAC chip 301 is used for data encapsulation and decapsulation. During transmission, the MAC chip 301 divides the received data into a specific form-frame. In addition to the original data, some control information and address information are inserted before the data. The address information determines the transmission destination and source address of the frame, and the control information corrects the error when the transmission occurs, to ensure error-free transmission of the frame.

[0062] As shown in FIG. 5, in some embodiments, the optical module can include a laser drive chip 302.

[0063] In some embodiments, the laser drive chip 302 can be located on the surface of the circuit board 300.

[0064] As shown in FIG. 5, in some embodiments, the optical module can include an MCU 303.

[0065] In some embodiments, the MCU 303 can be located on the surface of the circuit board 300.

[0066] In some embodiments, with the development of intelligent and networked vehicles, vehicle-mounted communication technology becomes increasingly important. Vehicle-mounted optical modules can achieve high-speed and long-distance data transmission, improving the overall performance of vehicle-mounted communication systems.

[0067] In some embodiments, when the optical module is applied in a vehicle, since there is no upper computer in the vehicle environment, the optical module applied in the vehicle can use an optical module containing a MAC chip 301.

[0068] In some embodiments, when the optical module is applied in a vehicle, since the optical module is fixed to the interface of the vehicle and does not need to be plugged in and out, the surface of the circuit board 300 can not form a gold finger at this time.

[0069] In some embodiments, when the optical module is applied in a vehicle, the optical signal transmitted by the optical module can be converted into an electrical signal that can be processed by the vehicle-mounted electronic device, or the electrical signal emitted by the vehicle-mounted electronic device can be converted into an optical signal for transmission. Exemplarily, the vehicle-mounted electronic device can include an autonomous driving system, a remote monitoring system, a vehicle-mounted entertainment system, etc. In the autonomous driving system, the vehicle-mounted optical module can transmit high-definition map, real-time traffic, vehicle status, etc. In the remote monitoring system, the status information of the vehicle-mounted device is transmitted to the remote monitoring center through the optical module to realize remote control of the vehicle-mounted device.

[0070] In some embodiments, when the optical module is applied in a vehicle, the vehicle-mounted electronic device first generates data signals that need to be transmitted, which can come from sensor-collected information, controller-issued control instructions, etc. Then the optical emission component 400 converts the data signals into optical signals, which are transmitted to the OLT end through the optical fiber communication network. As a transmission medium, optical fiber has the characteristics of low loss, high bandwidth, and anti-electromagnetic interference, etc., which can ensure that the optical signal maintains a high signal quality and transmission rate during transmission. The reverse process is transmitted in the opposite direction.

[0071] FIG. 6 is an external structure diagram of an optical emission component according to some embodiments of the present disclosure. As shown in FIG. 6, in some embodiments, the optical emission component 400 includes a tube seat 410 and a tube cap 420. The tube cap 420 is connected to the tube seat 410 and forms a relatively sealed space with the tube seat 410, and devices for generating and transmitting optical signals, such as laser chips, lenses, TECs (Thermo Electric Coolers), etc., are arranged in the space.

[0072] In some embodiments, the tube seat 410 is provided with a plurality of tube pins, one end of part of the tube pins extending into the space formed by the tube seat 410 and the tube cap 420, and the plurality of tube pins include, but are not limited to, high-frequency tube pins for transmitting high-frequency signals, ground tube pins for grounding, and first and second tube pins for supplying power to the TEC, etc., to facilitate electrical connection of electrical devices in the light emitting component 400 to the circuit board 300.

[0073] FIG. 7 is a schematic diagram of the internal structure of a light emitting component according to some embodiments of the present disclosure. As shown in FIG. 7, in some embodiments, the light emitting component 400 includes a tube seat 410.

[0074] In some embodiments, the light emitting component 400 can include a laser chip 401. Illustratively, the laser chip 401 emits light in the direction of the tube seat 410.

[0075] In some embodiments, the light emitting component 400 can include a TEC 402. Illustratively, the TEC 402 is located on the surface of the tube seat 410. The TEC 402 can support the laser chip 401.

[0076] In some embodiments, the light emitting component 400 can include a back light detector 403. Illustratively, the back light detector 403 is located on the surface of the TEC 402. The back light detector 403 is used to receive the back light of the laser chip 401 for monitoring the light emitting power of the light emitting component 400.

[0077] In some embodiments, the light emitting component 400 can include a temperature sensor 404. Illustratively, the temperature sensor 404 is located on one side of the laser chip 401.

[0078] In some embodiments, the temperature of the laser chip 401 is monitored by the temperature sensor 404, and the monitored temperature is sent to the MCU. The MCU controls the driving circuit of the TEC 402 to adjust the current provided to the TEC 402 according to the temperature monitoring value, thereby adjusting the temperature of the laser chip 401.

[0079] In some embodiments, the laser driving chip 302 is electrically connected to the laser chip 401.

[0080] In some embodiments, the laser driving chip 302 is configured to convert the received electrical signal into a driving signal and transmit the driving signal to the laser chip 401. The laser chip 401 emits an optical signal under the driving of the driving signal, thereby converting the received electrical signal into an optical signal. The driving signal includes a bias current signal and a modulation current signal.

[0081] In some embodiments, the turning on or off of the laser chip 401 is controlled by the laser driver chip 302. For example, the laser driver chip 302 provides a driving signal to the laser chip 401 through the built-in driving circuit, and then the laser chip 401 is turned on and emits light. The laser driver chip 302 stops outputting the driving signal, and then the laser chip 401 is turned off and stops emitting light.

[0082] In some embodiments, the MAC chip 301 is electrically connected to the laser driver chip 302.

[0083] In some embodiments, the MAC chip 301 performs MAC protocol processing on the received electrical signal and transmits the processed electrical signal to the laser driver chip 302. The electrical signal input and output by the MAC chip 301 is a high-frequency electrical signal.

[0084] In some embodiments, when the optical module is applied to a vehicle, the vehicle control unit transmits a high-frequency electrical signal to the MAC chip 301. The MAC chip 301 performs MAC protocol processing on the high-frequency electrical signal and transmits it to the laser driver chip 302. The laser driver chip 302 converts the high-frequency electrical signal into a driving signal and transmits it to the laser chip 401. The laser chip 401 emits a light signal under the driving of the driving signal, thereby converting the received electrical signal into a light signal.

[0085] In some embodiments, multiple ONU optical modules share one upstream channel and OLT. In order to prevent the transmission signals between the multiple ONU optical modules from conflicting, the ONU optical module adopts a burst light emission mode, that is, whether to emit light, when to emit light, and the light emission duration are controlled by the OLT.

[0086] In some embodiments, the OLT calculates the light emission start time and light emission duration of each ONU optical module according to the broadband demand reported by the ONU optical module, and then notifies the corresponding ONU optical module. The ONU optical module needs to emit light at the light emission window start time allocated by the OLT, and immediately turn off the light at the window end time.

[0087] In some embodiments, in order to control the burst light emission mechanism of the optical module, the MAC chip 301 includes a burst control pin. The MAC chip 301 outputs a burst control signal such as a burst signal to the laser driver chip 302 through the burst control pin. The burst control signal such as the burst signal is an enabling control signal of the ONU burst mode. The laser driver chip 302 controls the burst light emission or light off of the laser chip 401 according to the burst control signal.

[0088] In some embodiments, in the burst mode, the working state of the laser drive chip 302 is controlled by the enablement of the burst control signal, which enables or disables the working of the laser drive chip 302. The working of the laser drive chip 302 refers to that the laser drive chip 302 outputs the driving signal to the laser chip 401. The non-working of the laser drive chip 302 refers to that the laser drive chip 302 stops outputting the driving signal to the laser chip 401.

[0089] In some embodiments, the burst control signal is inputted to the MAC chip 301 from outside. Exemplarily, when the optical module is applied to a vehicle, the burst control signal is inputted to the MAC chip 301 by the vehicle control unit.

[0090] In some embodiments, when the burst control pin presents different level states, the MAC chip 301 outputs different burst control signals to the laser drive chip 302 to control the working state of the laser drive chip 302, thereby controlling the burst light emission or light-off of the laser chip 401.

[0091] FIG. 8 is a schematic diagram of the burst light emission mode principle of the optical transmitting component according to some embodiments of the present disclosure. As shown in FIG. 8, in some embodiments, when the level of the burst control pin is set to the first level state, such as being pulled low, the MAC chip 301 outputs the first burst control signal to the laser drive chip 302; when the level of the burst control pin is set to the second level state, such as being pulled high, the MAC chip 301 outputs the second burst control signal to the laser drive chip 302.

[0092] In some embodiments, under the action of the first burst control signal, the laser drive chip 302 outputs the driving signal to the laser chip 401, thereby causing the burst light emission of the laser chip 401.

[0093] In some embodiments, under the action of the second burst control signal, the laser drive chip 302 stops outputting the driving signal to the laser chip 401, i.e., stops outputting the bias current and the modulation current, thereby causing the light-off of the laser chip 401.

[0094] In some embodiments, the OLT calculates the light emission start time and the light emission duration of each ONU optical module according to the broadband demand reported by the ONU optical module, and then controls the burst control pin of the MAC chip 301 in the ONU optical module. By controlling the burst control pin to present different level states, the working state of the laser drive chip 302 is controlled, thereby controlling the light emission state of the laser chip 401, such as the light emission or the light-off.

[0095] In some embodiments, since the light emission of the ONU optical module is in a burst mode, the ONU optical module is controlled by the OLT and does not actively emit light, and emits light within the authorized time period. However, during the production and commissioning of the optical module, it is necessary to place the light emission state of the optical module in a long light emission state, and the light emission time is longer than the light emission time in the burst mode, to meet the commissioning requirements. The long light emission mode is different from the burst mode, and the light emission mechanism is different from that of the burst mode, and the light emission time can be longer than that of the burst mode.

[0096] In some embodiments, in order to switch the optical module to a long light emission mode, and to switch between the long light emission mode and the burst mode, the MCU 303 is internally provided with a light emission state register, and the laser drive chip 302 includes an enable register. When the register value in the light emission state register is a first register value, the laser chip is instructed to be in a long light emission mode, and when the register value is a second register value, the laser chip is instructed to be in a burst mode, and thus the register value can be adjusted to switch between the two modes. When the light emission state register value is set from the first register value to the second register value, the laser chip is instructed to switch from the long light emission mode to the burst mode; and when the light emission state register value is set from the second register value to the first register value, the laser chip is instructed to switch from the burst mode to the long light emission mode.

[0097] In some embodiments, by maintaining the duration of the first register value, the light emission time can be controlled to be in the long light emission mode.

[0098] In some embodiments, when the register value of the light emission state register is the first register value, the MCU writes a third register value into the enable register of the laser drive chip 302 to enable the laser drive chip 302 to output a drive signal to the laser chip 401, and sends a first control instruction to the MAC chip 301 to instruct the MAC chip 301 to output a high-frequency electrical signal to the laser drive chip 302, thereby causing the laser chip to enter the long light emission mode. When the register value of the light emission state register is the second register value, the MCU writes a fourth register value into the enable register of the laser drive chip 302, and sends a second control instruction to the MAC chip 301 to control the laser chip 401 to exit the long light emission mode and enter the burst light emission mode.

[0099] In some embodiments, by configuring the register value of the light emission state register in the MCU 303, the light emission mode of the laser chip 402 can be switched. For example, when the register value of the light emission state register is set to the first register value, the laser chip 402 is instructed to switch to the long light emission mode. When the register value of the light emission state register is set to the second register value, the laser chip 402 is instructed to switch to the burst mode.

[0100] In some embodiments, when the register value of the light emitting state register in the MCU 303 is adjusted from the first register value to the second register value, it indicates that the light emitting mode of the laser chip 402 is switched from the long light emitting mode to the burst mode. When the register value of the light emitting state register in the MCU 303 is adjusted from the second register value to the first register value, it indicates that the light emitting mode of the laser chip 402 is switched from the burst mode to the long light emitting mode.

[0101] In some embodiments, the first register value can be "1", and the second register value can be "0". Other register values are also possible.

[0102] In some embodiments, the laser drive chip 302 includes an enable register to enable or disable the laser drive chip 302.

[0103] FIG. 9 is a schematic diagram of an electrical connection of a light emitting component according to some embodiments of the present disclosure. As shown in FIG. 9, in some embodiments, the MCU 303 is electrically connected to the laser drive chip 302. For example, the MCU 303 includes an I2C interface. The MCU 303 is electrically connected to the laser drive chip 302 through the I2C interface.

[0104] In some embodiments, in the long light emitting mode, the MCU 303 can enable or disable the laser drive chip 302 by configuring the register value of the enable register in the laser drive chip 302. In the burst mode, the working state of the laser drive chip 302 is controlled by the burst control signal, and the burst control signal enables or disables the laser drive chip 302.

[0105] In some embodiments, when the register value of the light emitting state register in the MCU 303 is the first register value, the MCU 303 writes a third register value to the enable register of the laser drive chip 302 to enable the laser drive chip 302. When the register value of the light emitting state register in the MCU 303 is the second register value, the MCU 303 writes a fourth register value to the enable register of the laser drive chip 302 to disable the laser drive chip 302 from the long light emitting mode. That is, the MCU 303 is electrically connected to the laser drive chip 302 through the I2C interface, so that the MCU 303 can write the third register value or the fourth register value to the enable register of the laser drive chip 302 to enable or disable the laser drive chip.

[0106] In some embodiments, the third register value can be "1", and the fourth register value can be "0". Other register values are also possible.

[0107] In some embodiments, since the MAC chip 301 is electrically connected with the laser drive chip 302, and a high-frequency electrical signal is provided to the laser drive chip 302, the MAC chip 301 needs to be controlled to enter the long hair light mode in the long hair light mode.

[0108] In some embodiments, the MCU 303 is electrically connected with the MAC chip 301.

[0109] In some embodiments, there is an I2C communication connection between the MCU 303 and the MAC chip 301. Exemplarily, at this time, the MAC chip 301 acts as a master, and the MCU 303 acts as a slave. The MAC chip 301 reads some monitoring parameters such as temperature, light emission power, etc. from the registers in the MCU 303 through I2C communication.

[0110] In some embodiments, when the MAC chip 301 reads some monitoring parameters from the registers in the MCU 303 through I2C communication, the master-slave relationship has been determined, so the MCU 303 cannot send control instructions to the MAC chip 301 through I2C communication.

[0111] In some embodiments, the MCU 303 includes a serial port, and the MCU 303 can electrically connect the MAC chip 301 through the serial port, so that the MCU 303 sends control instructions to the MAC chip 301 through the serial port to control the MAC chip to work or not to work. Wherein, the working of the MAC chip 301 refers to that the MAC chip 301 outputs a high-frequency electrical signal to the laser drive chip 302. The non-working of the MAC chip 301 refers to that the MAC chip 301 turns off the output of the high-frequency electrical signal to the laser drive chip 302.

[0112] In some embodiments, in the long hair light mode, the MCU 303 can control the MAC chip 301 to work or not to work by sending corresponding control instructions to the MAC chip 301. While in the burst mode, the working state of the MAC chip 301 is enabled by the burst control pin level state, which can enable the MAC chip 301 to work or not to work.

[0113] In some embodiments, when the register value of the light emission state register in the MCU 303 is a first register value, the MCU 303 sends a first control instruction to the MAC chip 301 through the serial port to control the MAC chip 301 to output an electrical signal to the laser drive chip. When the register value of the light emission state register in the MCU 303 is a second register value, the MCU 303 sends a second control instruction to the MAC chip 301 through the serial port to control the MAC chip 301 to exit the long hair light mode.

[0114] FIG. 10 is a flowchart of a long light emitting mode control according to some embodiments of the present disclosure. As shown in FIG. 10, in some embodiments, the long light emitting mode control includes:

[0115] S110: in response to the light emitting state register value being the first register value, writing the third register value into the enable register to enable the laser driving chip to output the driving signal to the laser chip, and sending the first control instruction to the MAC chip to control the MAC chip to output the electrical signal to the laser driving chip, so that the laser chip enters the long light emitting mode.

[0116] S120: in response to the light emitting state register value being the second register value, writing the fourth register value into the enable register, and sending the second control instruction to the MAC chip, so that the laser driving chip controls the laser chip to burst light emitting or turn off light according to the burst control signal, and the laser chip enters the burst mode.

[0117] The specific embodiments are exemplarily described below.

[0118] In some embodiments, when the register value of the light emitting state register in the MCU 303 is the first register value, the MCU 303 writes the third register value into the enable register of the laser driving chip 302 to enable the laser driving chip 302 to work, i.e., to enable the laser driving chip 302 to output the driving signal to the laser chip 401. And the MCU 303 sends the first control instruction to the MAC chip 301 to control the MAC chip 301 to work, i.e., to control the MAC chip 301 to output the high-frequency electrical signal to the laser driving chip 302. When the laser driving chip 302 and the MAC chip 301 are in the working state, by maintaining the register value of the light emitting state register as the first register value, the laser chip 401 can be in the long light emitting mode.

[0119] In some embodiments, when the register value of the light emitting state register in the MCU 303 is the second register value, the laser driving chip 302 and the MAC chip 301 need to exit the working state, and the laser chip 401 exits the long light emitting mode and enters the burst mode. Exemplarily, when the register value of the light emitting state register in the MCU 303 is the second register value, the MCU 303 writes the fourth register value into the enable register of the laser driving chip 302, and sends the second control instruction to the MAC chip 301, so as to exit the long light emitting mode.

[0120] In some embodiments, when the register value of the light-emitting state register in the MCU 303 is the second register value, the MCU 303 writes the fourth register value to the enable register of the laser driving chip 302 and sends the second control instruction to the MAC chip 301, so as to exit the long light-emitting mode and enter the burst mode, so that the laser driving chip 302 controls the laser chip 401 to burst light-emitting or turn off light-emitting according to the burst control signal, and then the laser chip 401 enters the burst mode.

[0121] In some embodiments, when the MCU 303 writes the fourth register value to the enable register of the laser driving chip 302 and sends the second control instruction to the MAC chip 301 to exit the long light-emitting mode and enter the burst mode, whether the laser driving chip 302 and the MAC chip 301 work depends on the burst control signal sent by the MAC chip 301. That is, when the register value of the light-emitting state register is the second register value, it does not mean that the laser driving chip 302 will definitely stop outputting the driving signal to the laser chip 401, nor does it mean that the MAC chip 301 will definitely stop outputting the electrical signal to the laser driving chip 302. Whether the laser driving chip 302 continues to output the driving signal to the laser chip 401 or stops outputting the driving signal to the laser chip 401 depends on the attribute of the burst control signal. Similarly, whether the MAC chip 301 continues to output the electrical signal to the laser driving chip 302 or stops outputting the electrical signal to the laser driving chip 302 depends on the attribute of the burst control signal.

[0122] In some embodiments, when the register value of the light-emitting state register in the MCU 303 is the second register value, the MCU 303 writes the fourth register value to the enable register of the laser driving chip 302 and sends the second control instruction to the MAC chip 301, so as to exit the long light-emitting mode and enter the burst mode, so that the laser driving chip 302 controls the laser chip 401 to burst light-emitting or turn off light-emitting according to the burst control signal, and then the laser chip 401 enters the burst mode.

[0123] In some embodiments, the laser driving chip 302 continues to output the driving signal to the laser chip 401 according to the first burst control signal, and then the laser chip 401 bursts light-emitting. The laser driving chip 302 stops outputting to the laser chip 401 according to the second burst control chip, and then the laser chip 401 turns off light-emitting.

[0124] In some embodiments, the specific implementation of the laser driving chip 302 controlling the laser chip 401 to burst light-emitting or turn off light-emitting according to the burst control signal is not expanded.

[0125] In some embodiments, when the register value of the light-emitting state register in the MCU 303 is the second register value, the MCU 303 writes a fourth register value to the enable register of the laser driving chip 302 and sends a second control instruction to the MAC chip 301 to exit the long light-emitting mode. If the burst control signal is the first burst control signal at this time, the laser driving chip 302 continues to output the driving signal to the laser chip 401, and the MAC chip 301 continues to output the high-frequency electrical signal to the laser driving chip 302, so that the laser chip 401 emits light. If the burst control signal is the second burst control signal, the laser driving chip 302 stops outputting to the laser chip 401, and the MAC chip 301 stops outputting to the laser driving chip 302, so that the laser chip 401 turns off.

[0126] In some embodiments, for the laser driving chip 302, the priority of the enable controller is higher than the priority of the burst control signal. For the MAC chip 301, the priority of the control instruction sent by the MCU 303 is higher than the priority of the burst control pin level state indication signal. This means that, between the long light-emitting mode and the burst mode, the laser driving chip 302 and the MAC chip 301 prefer to respond to the long light-emitting mode, and the control mechanism prefer to control the laser chip 401 to enter the long light-emitting mode.

[0127] In the present disclosure, in order to control the optical module to enter the long light-emitting mode, the laser driving chip includes an enable register, and the MCU includes a light-emitting state register. When the register value of the light-emitting state register of the MCU is the first register value, it indicates that the laser chip enters the long light-emitting mode, and when the register value is the second register value, it indicates that the laser chip enters the burst mode. By adjusting the register value of the light-emitting state register, the light-emitting mode can be switched. When the register value of the light-emitting state register is the first register value, the MCU writes a third register value into the enable register of the laser driving chip to enable the laser driving chip to output the driving signal to the laser chip, and sends a first control instruction to the MAC chip to control the MAC chip to output the electrical signal to the laser driving chip, so that the laser chip enters the long light-emitting mode. When the register value of the light-emitting state register is the second register value, a fourth register value is written into the enable register, and a second control instruction is sent to the MAC chip to make the laser chip exit the long light-emitting mode and enter the burst mode. In the burst mode, the MAC chip sends a burst control signal to the laser driving chip through the burst control pin, which can enable or disable the laser driving chip, thereby controlling the laser chip to burst or turn off.

[0128] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present disclosure, but not to limit them; although the present disclosure has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module comprising: a circuit board; a laser chip electrically connected to the circuit board; a laser drive chip located on the surface of the circuit board and electrically connected to the laser chip; an MCU located on the surface of the circuit board and electrically connected to the laser drive chip; the MCU comprising: a light-emitting state register, when the light-emitting state register value is a first register value, indicating that the laser chip enters a long light-emitting mode, and when the light-emitting state register value is a second register value, indicating that the laser chip enters a burst mode; the MCU is configured to: when the light-emitting state register value is set from the first register value to the second register value, switch the laser chip from the long light-emitting mode to the burst mode; when the light-emitting state register value is set from the second register value to the first register value, switch the laser chip from the burst mode to the long light-emitting mode.

2. An optical module according to claim 1, wherein the laser drive chip is configured to convert a received electrical signal into a drive signal and transmit the drive signal to the laser chip to drive the laser chip to emit an optical signal; the laser drive chip comprises an enable register; the optical module further comprises a MAC chip located on the surface of the circuit board and electrically connected to the laser drive chip, the MAC chip is configured to output an electrical signal or a burst control signal to the laser drive chip; the MCU is electrically connected to the MAC chip, and the MCU is configured to: in response to the light-emitting state register value being the first register value, write a third register value into the enable register to enable the laser drive chip to output a drive signal to the laser chip; and send a first control instruction to the MAC chip to control the MAC chip to output an electrical signal to the laser drive chip, so that the laser chip enters a long light-emitting mode; in response to the light-emitting state register value being the second register value, write a fourth register value into the enable register; and send a second control instruction to the MAC chip, so that the laser drive chip controls the laser chip to burst light or turn off light based on the burst control signal, so that the laser chip enters a burst mode.

3. The optical module according to claim 1, wherein the MAC chip comprises a burst control pin, through which the burst control signal is output to the laser drive chip, and the burst control pin has a first level state and a second level state; when the burst control pin is in the first level state, the MAC chip outputs an electrical signal and a first burst control signal to the laser drive chip, so that the laser drive chip outputs a drive signal to the laser chip according to the first burst control signal, thereby controlling the laser chip to burst light; when the burst control pin is in the second level state, the MAC chip stops outputting an electrical signal to the laser drive chip and outputs a second burst control signal to the laser drive chip, so that the laser drive chip stops outputting a drive signal to the laser chip according to the second burst control signal, thereby controlling the laser chip to turn off light.

4. The optical module of claim 1, wherein, For the laser drive chip, the priority of the enable register is higher than the priority of the burst control signal.

5. The optical module of claim 1, wherein, The MCU includes an I2C interface and a serial port. The MCU is electrically connected to the laser drive chip through the I2C interface, and the MCU is electrically connected to the MAC chip through the serial port, so as to transmit the first control instruction or the second control instruction to the MAC chip through the serial port.

6. The optical module of claim 1, wherein, There is an I2C communication connection between the MCU and the MAC chip.

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