Heat dissipation apparatus

Abstract

The present application relates to the technical field of heat dissipation apparatuses, and discloses a heat dissipation apparatus. The heat dissipation apparatus comprises: an apparatus main body, a water inlet, a water outlet, a jet chamber, and a heat dissipation chamber, which are arranged inside the apparatus main body; the jet chamber is provided at a position corresponding to a projection of the water inlet inside the apparatus main body; the water inlet is in communication with the jet chamber; the jet chamber is located between the water inlet and the heat dissipation chamber; an inner wall of the jet chamber is provided with a plurality of circumferentially arrayed jet flow holes; and the jet chamber is configured for introducing a heat dissipation medium, entering through the water inlet, into the heat dissipation chamber by means of the jet flow holes. The present application achieves longitudinal-to-transverse transport of a heat dissipation medium by means of a process in which a heat dissipation medium enters a jet chamber through a water inlet and is then introduced into a heat dissipation chamber. This facilitates uniform fluid distribution of the heat dissipation medium, and fully leverages the heat-removal capability of the heat dissipation medium, thereby improving the overall temperature uniformity of the heat dissipation apparatus and enhancing convective heat transfer capacity.

Description

A heat dissipation device

[0001] Cross-reference to Related Applications

[0002] The present application claims priority to the Chinese patent application No. 202411355072.8, filed on September 27, 2024, and entitled "A heat dissipation device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application belongs to the technical field of heat dissipation devices, and specifically relates to a heat dissipation device. BACKGROUND

[0004] With the development of microelectronic devices, very large scale integrated circuits and electronic products, the heat dissipation of the heat generating devices on the circuit board also increases sharply, thereby the requirement for cooling technology is also higher and higher.

[0005] In the related art, a cold plate with a toothed structure can be used to dissipate heat from the heat generating components on the circuit board.

[0006] In the process of implementing the present application, the inventors found that at least the following problem exists in the related art: the heat generating surface of the toothed cold plate has poor uniformity, and the heat dissipation efficiency for the core heat generating part is low. SUMMARY

[0007] The present application aims to provide a heat dissipation device, which at least solves the problem of poor uniformity of the heat generating surface of the toothed cold plate in the related art, and low heat dissipation efficiency for the core heat generating part.

[0008] In order to solve the above technical problems, the present application is implemented as follows:

[0009] In a first aspect, the embodiments of the present application provide a heat dissipation device, comprising:

[0010] a device body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device body;

[0011] The water inlet and the water outlet are arranged on the surface of the device body, and the jet chamber is arranged at the projection position of the water inlet inside the device body.

[0012] The water inlet is in communication with the jet chamber; the jet chamber is between the water inlet and the heat dissipation chamber, and the inner wall of the jet chamber is provided with a plurality of circumferentially arranged jet holes; the jet chamber is used to introduce the heat dissipation medium entering from the water inlet into the heat dissipation chamber through the jet holes.

[0013] In some embodiments, the heat dissipation chamber is provided with a heat dissipation fin structure, which comprises: a plurality of heat dissipation fins radially and uniformly distributed along a first projection area, the first projection area being an area projected by the water inlet in the heat dissipation chamber.

[0014] In some embodiments, the heat dissipation fin is a rectangular plate structure, and the long side direction of the heat dissipation fin is consistent with the radial direction of the heat dissipation fin.

[0015] One side of the heat dissipation fin is connected to the inner wall of the side of the heat dissipation chamber close to the water inlet, and the opposite side of the heat dissipation fin is connected to the inner wall of the side of the heat dissipation chamber away from the water inlet.

[0016] In some embodiments, the jet flow chamber is a circular structure in the direction towards the bottom inner wall of the jet flow chamber, and a plurality of circular arrangement lines with diameters increasing in sequence are arranged around the center of the bottom inner wall of the jet flow chamber.

[0017] A plurality of jet flow holes are uniformly arranged on each circular arrangement line.

[0018] In some embodiments, the bottom inner wall of the jet flow chamber is a planar structure, and the jet flow hole penetrates the bottom inner wall of the jet flow chamber in the axial direction of the water inlet.

[0019] In some embodiments, the cross-sectional width of the jet flow chamber decreases in sequence in the direction towards the water inlet.

[0020] In some embodiments, the cross-section of the jet flow chamber is a dome structure, or the cross-section of the jet flow chamber is a trapezoidal structure.

[0021] In some embodiments, in the direction towards the bottom inner wall of the heat dissipation chamber, the profile of the heat dissipation chamber comprises two straight lines and two outer arc lines; the two straight lines are oppositely arranged, and the two outer arc lines are oppositely arranged.

[0022] In some embodiments, the heat dissipation fin structure comprises: a circular fin area and a plurality of annular fin areas; the annular fin areas and the circular fin area each comprise a plurality of heat dissipation fins radially and uniformly distributed.

[0023] The circular fin area is arranged at the position of the first projection area, and the plurality of annular fin areas are arranged around the circular fin area and nested in sequence.

[0024] In some embodiments, in the direction towards the bottom inner wall of the heat dissipation chamber, among the plurality of annular fin areas, the extension length of the heat dissipation fins included in the annular fin area close to the circular fin area is smaller than the extension length of the heat dissipation fins included in the annular fin area away from the circular fin area.

[0025] In some embodiments, the heat dissipation chamber is in communication with the water outlet through a flow guide channel.

[0026] In some embodiments, the flow guide channel comprises two outer side channels respectively arranged at opposite sides of the heat dissipation chamber.

[0027] In some embodiments, the flow guide channel comprises a plurality of inner side channels arranged at a side of the heat dissipation chamber close to the water outlet and between the water outlet.

[0028] In some embodiments, the outer side channel comprises a first horizontal section, a second horizontal section, a first bending section, a second bending section and a third bending section.

[0029] One end of the first bending section is in communication with the heat dissipation chamber, and the other end of the first bending section is in communication with one end of the first horizontal section; the first horizontal section is parallel to the long side of the device body.

[0030] The other end of the first horizontal section is in communication with one end of the second horizontal section through the second bending section, and the bending angle of the second bending section is obtuse, so that the included angle between the first horizontal section and the second horizontal section is obtuse.

[0031] The other end of the second horizontal section is in communication with the water outlet through the third bending section.

[0032] In some embodiments, the plurality of inner side channels comprises three straight channels and two curved channels.

[0033] One first straight channel of the three straight channels is arranged on the shortest connecting line between the heat dissipation chamber and the water outlet; the other two second straight channels are symmetrically arranged on both sides of the first straight channel, one end of the second straight channel is in communication with the heat dissipation chamber, and the other end of the second straight channel is in communication with the water outlet through the curved channel.

[0034] In some embodiments, the water inlet and the water outlet are arranged on the same face of the device body.

[0035] In some embodiments, along the axial direction of the water inlet, the water inlet comprises a first section and a second section; the inner diameter of the first section is larger than that of the second section.

[0036] The second section is located between the first section and the jet chamber.

[0037] In some embodiments, in the direction towards the bottom inner wall of the heat dissipation chamber, the spacing between adjacent heat dissipation fins on the outer contour of the heat dissipation fin structure is 0.1-0.3mm.

[0038] In some embodiments, the heat dissipation device is a structure formed by three-dimensional printing.

[0039] In a second aspect, the embodiments of the present application further provide a manufacturing method of the heat dissipation device, comprising:

[0040] performing multiple three-dimensional printing operations to obtain the heat dissipation device;

[0041] wherein each three-dimensional printing operation comprises:

[0042] laying the metal material powder;

[0043] according to the digital modeling corresponding to the heat dissipation device, performing three-dimensional printing on the metal material powder by laser to obtain a printing layer corresponding to the three-dimensional printing operation.

[0044] In some embodiments, laying the metal material powder comprises:

[0045] laying the metal material powder on the substrate when performing the first three-dimensional printing operation;

[0046] laying the metal material powder on the printing layer obtained by the last three-dimensional printing operation when performing the non-first three-dimensional printing operation.

[0047] In some embodiments, after the completion of one three-dimensional printing operation and before the execution of the next three-dimensional printing operation, the method further comprises:

[0048] waiting for a preset time length to wait for the cooling and forming of the printing layer obtained by the three-dimensional printing operation.

[0049] In some embodiments, the height of each printing layer is 0.02-0.06mm.

[0050] In the embodiments of the present application, the heat dissipation device comprises a device body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device body; the jet chamber is arranged at the projection position of the water inlet inside the device body; the water inlet is in communication with the jet chamber; the jet chamber is between the water inlet and the heat dissipation chamber, and the inner wall of the jet chamber is provided with a plurality of circumferentially arranged jet holes; the jet chamber is used to introduce the heat dissipation medium entering from the water inlet into the heat dissipation chamber through the jet holes. In the present application, the heat dissipation medium enters the jet chamber through the water inlet and is then introduced into the heat dissipation chamber, which realizes a heat dissipation medium transmission mode of first longitudinal and then transverse, helps the uniform distribution of the heat dissipation medium, can fully exert the advantage of the heat dissipation medium in taking away heat, and thus improves the overall uniformity and the convective heat exchange capacity of the heat dissipation device. BRIEF DESCRIPTION OF DRAWINGS

[0051] FIG. 1 is a schematic diagram of the external structure of the heat dissipation device according to the embodiments of the present application;

[0052] FIG. 2 is a schematic diagram of a cross-sectional structure of the heat dissipation device according to the embodiments of the present application;

[0053] Fig. 3 is a schematic view of a cross-sectional structure of a heat dissipation device according to an embodiment of the present application;

[0054] Fig. 4 is a schematic view of temperature distribution of a heat dissipation device according to an embodiment of the present application;

[0055] Fig. 5 is a schematic view of a cross-sectional partial structure of a heat dissipation device according to an embodiment of the present application;

[0056] Fig. 6 is a schematic view of another cross-sectional partial structure of a heat dissipation device according to an embodiment of the present application;

[0057] Fig. 7 is a schematic view of another cross-sectional partial structure of a heat dissipation device according to an embodiment of the present application;

[0058] Fig. 8 is a schematic view of a step flow of a manufacturing method of a heat dissipation device according to an embodiment of the present application.

[0059] Fig. 3 is a schematic view of a cross-sectional structure of a heat dissipation device according to an embodiment of the present application; DETAILED DESCRIPTION

[0060] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0061] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be exchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of a kind and are not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0062] In practical applications, the heat dissipation of electronic devices of electronic equipment is a very important research topic. According to statistical data, 55% of electronic equipment failures are caused by temperature, and thermal management has become a key problem to ensure the normal operation of high heat flux electronic devices. Moreover, the power consumption of high-performance electronic devices is gradually increasing and has exceeded 1000W, and there is a problem of local ultra-high heat flux, and it is urgent to carry out research on large-area, non-uniform high heat flux heat dissipation technology. The liquid cooling plate is an important part of the heat dissipation system, and the liquid cooling plate is a closed cavity composed of a cold plate (usually a closed cavity composed of a copper-aluminum heat-conducting metal) that indirectly transfers the heat of the heat-generating device to the cooling liquid enclosed in the circulating pipeline, and a form that removes heat through the cooling liquid.

[0063] Referring to FIGS. 1 and 2, the application provides a heat dissipation device, comprising: a device body 10, a water inlet 20, a water outlet 30, a jet chamber 11 and a heat dissipation chamber 12 arranged inside the device body 10; the water inlet 20 and the water outlet 30 are arranged on the surface of the device body 10, and the jet chamber 11 is arranged at the projection position of the water inlet 20 inside the device body 10; the water inlet 20 is in communication with the jet chamber 11; the jet chamber 11 is between the water inlet 20 and the heat dissipation chamber 12, and the inner wall of the jet chamber 11 is provided with a plurality of circumferentially arranged jet holes 111; the jet chamber 11 is used to introduce the heat dissipation medium entering from the water inlet 20 into the heat dissipation chamber 12 through the jet holes 111.

[0064] In the embodiment of the application, the heat dissipation device can be used to dissipate heat from high-heat electronic devices, which can be a liquid cooling plate. The heat dissipation device includes a device body 10 with a water inlet 20, a water outlet 30 and a chamber, and uses a liquid heat dissipation medium. One side of the device body 10 is provided with a receiving groove matching the size of the electronic device, and the device body 10 can cover the electronic device and place the electronic device in the receiving groove. The heat dissipation medium can enter the chamber of the device body 10 through the water inlet 20 of the device body 10, and the flow of the liquid heat dissipation medium in the chamber can remove the heat generated by the electronic device. The heat dissipation medium eventually flows away from the water outlet 30 of the device body 10, achieving heat dissipation of the electronic device.

[0065] Specifically, it is found that the projection position of the water inlet 20 of the heat dissipation device generally corresponds to the core heat generating area of the electronic device, and the core heat generating area has a prominent and high heat generation. Referring to FIG. 3, which shows a schematic view of a cross-sectional structure of a heat dissipation device, in order to improve the heat dissipation efficiency of the core heat generating area of the electronic device, the embodiment of the present application can be provided at the projection position of the water inlet 20 inside the device main body 10. The jet chamber 11 is provided on the side of the jet chamber 11 away from the water inlet 20. The inner wall of the jet chamber 11 is provided with a plurality of circumferentially arranged jet holes 111. The jet chamber 11 is used to introduce the heat dissipation medium entering from the water inlet 20 into the heat dissipation chamber 12 through the jet holes 111. Of course, the jet holes 111 can also be arranged in other ways.

[0066] Based on such a design, when the core heat generating area of the electronic device generates heat, the liquid heat dissipation medium can enter the jet chamber 11 from the water inlet 20, and after being pressurized to increase the flow rate in the jet chamber 11, it is introduced into the heat dissipation chamber 12 through the jet holes 111. The heat dissipation medium spreads radially in the heat dissipation chamber 12 and flows at high speed, quickly taking away the heat generated by the core heat generating area of the electronic device.

[0067] In the embodiment of the present application, the process of the heat dissipation medium entering the jet chamber 11 through the water inlet 20 and then being introduced into the heat dissipation chamber 12 realizes a heat dissipation medium transmission mode of first longitudinal and then horizontal. This heat dissipation medium transmission mode can be distinguished from the only horizontal transmission mode in the related art, changes the disadvantage of poor uniformity of the heat generating surface of the cold plate with spurs in the related art, helps the uniform distribution of fluid, fully utilizes the advantage of heat dissipation medium in taking away heat, makes the fluid evenly distributed on the entire heat exchange surface, thereby improving the overall uniformity of the heat dissipation device and the convective heat transfer capacity, and helps to increase the service life of the electronic device.

[0068] In summary, in the embodiment of the present application, the heat dissipation device includes: a device main body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device main body; the jet chamber is arranged at the projection position of the water inlet inside the device main body; the water inlet is in communication with the jet chamber; the jet chamber is between the water inlet and the heat dissipation chamber, and the inner wall of the jet chamber is provided with a plurality of circumferentially arranged jet holes. The jet chamber is used to introduce the heat dissipation medium entering from the water inlet into the heat dissipation chamber through the jet holes. In the present application, the process of the heat dissipation medium entering the jet chamber through the water inlet and then being introduced into the heat dissipation chamber realizes a heat dissipation medium transmission mode of first longitudinal and then horizontal. This helps the uniform distribution of fluid of the heat dissipation medium, can fully utilize the advantage of heat dissipation medium in taking away heat, thereby improving the overall uniformity of the heat dissipation device and the convective heat transfer capacity.

[0069] Further, in the design process of the liquid cooling plate type heat dissipation device, single-phase fluid cooling is an efficient heat dissipation technology, and the jet micro-channel cooling technology combining both micro-channels and jet impact is a good solution to the heat dissipation problem of high-power electronic devices. However, many numerical and experimental studies show that micro-channel cooling has obvious disadvantages, that is, the channel pressure drop and heating surface temperature rise along the flow direction are large, and due to the small size of the channel, the processing difficulty is large and the processing cost is high, which to some extent limits the application of micro-channel and micro-channel jet cooling technology. In contrast, the heat dissipation device scheme combining jet impact in the jet chamber and fin structure in the heat dissipation chamber in the embodiments of the present application can better solve the above problems, realize the cooling of local hot spots and ensure the uniformity of the heating surface. The heat dissipation medium is sprayed to the surface to be cooled through the jet hole, so that the impacted wall surface has a much thinner velocity boundary layer than the general wall surface flow, thereby achieving the effect of reducing the forced convection heat transfer resistance, and having extremely strong heat transfer capacity. When strong cooling effect is needed in a local area, jet cooling is suitable.

[0070] In some embodiments, referring to FIG. 2, in some embodiments, the heat dissipation fin structure 40 is arranged in the heat dissipation chamber 12, and the heat dissipation fin structure 40 includes a plurality of heat dissipation fins 41 radially distributed along a first projection area. The first projection area is an area formed by the projection of the water inlet 20 in the heat dissipation chamber 12.

[0071] In some embodiments, the heat dissipation fin 41 is a rectangular plate structure, and the long edge extension direction of the heat dissipation fin 41 is consistent with the radial radiation direction of the heat dissipation fin 41. One side long edge of the heat dissipation fin 41 is connected with the inner wall of one side of the heat dissipation chamber 12 close to the water inlet 20, and the opposite side long edge of the heat dissipation fin 41 is connected with the inner wall of the other side of the heat dissipation chamber 12 away from the water inlet 20.

[0072] In the embodiments of the present application, in order to further improve the heat dissipation efficiency of the heat dissipation device, the heat dissipation fin structure 40 can also be arranged in the heat dissipation chamber 12, and the heat dissipation fin structure 40 includes a plurality of heat dissipation fins 41 radially distributed. Specifically, the heat dissipation fin 41 can be a rectangular plate structure, and the long edge extension direction of each heat dissipation fin 41 is consistent with the radial radiation direction of the heat dissipation fin 41. In some embodiments, the heat dissipation fin 41 is perpendicular to the bottom inner wall surface of the heat dissipation chamber 12.

[0073] The liquid heat dissipation medium is introduced into the heat dissipation chamber 12 through the jet hole 111 after being pressurized and increasing the flow rate in the jet chamber 11, and can directly impact the surface of the heat dissipation fin 41 of the heat dissipation fin structure 40 to take away heat, and then the heat dissipation medium further diverges radially into the laminar heat exchange area to take away heat of other areas. In the embodiment of the application, the heat dissipation medium is sprayed to the surface to be cooled of the heat dissipation fin 41 through the jet hole 111, so that the impacted wall surface has a much thinner velocity boundary layer than the general wall surface flow, thereby achieving the effect of reducing the forced convection heat transfer resistance, and having extremely strong heat exchange capacity. Therefore, when it is necessary to generate a strong cooling effect in a local area, jet cooling is suitable.

[0074] The heat dissipation fin can be a plate-shaped structure perpendicular to the inner wall of the bottom surface of the heat dissipation chamber, and the heat dissipation fin can be made of a metal material with good heat conduction performance, so as to ensure the heat conduction performance of the high heat dissipation fin and the structural strength of the heat dissipation fin.

[0075] Specifically, the core heat dissipation principle of the embodiment of the application is described. The core heat exchange of the embodiment of the application is that the liquid heat dissipation medium entering through the water inlet is sprayed to the heat generating surface of the heat dissipation fin through the jet hole. The high-speed fluid directly impacts the heat generating surface, and a very thin velocity boundary layer can be formed on the impacted surface. Therefore, extremely strong convective heat exchange capacity can be generated in the local area. The local convective heat exchange coefficient is increased by nearly 10 times compared with the related art cold plate with spurs, but the convective heat exchange coefficient gradually decreases away from the jet center area. The flow state of the liquid in the jet area is turbulent flow, and the flow state of the fluid between the heat dissipation fins away from the jet area is laminar flow.

[0076] For the turbulent flow scenario, refer to formula 1. Formula 1 is a local convective heat exchange coefficient calculation formula for the turbulent flow scenario.

[0077] Formula 1:

[0078] Wherein, Nu1 is the Nusselt number, Re is the Reynolds number, Pr is the Prandtl number, D is the diameter of the jet hole, H is the jet distance, λ is the thermal conductivity, r is the radius of the circle with the stagnation point as the center, and h1 is the turbulent cold plate convective heat exchange coefficient. D

[0079] For the laminar flow scenario, refer to formula 2. Formula 2 is a local convective heat exchange coefficient calculation formula for the laminar flow scenario.

[0080] Formula 2:

[0081] Wherein, Nu2 is the Nusselt number, Re is the Reynolds number, Pr is the Prandtl number, D is the distance between the heat dissipation fins, H is the jet distance, λ is the thermal conductivity, and h2 is the laminar cold plate convective heat exchange coefficient. ​

[0082] Further, the calculation formula of the convection heat transfer is formula 3:

[0083] Formula 3: Q = h S1 Delta T;

[0084] Wherein, Q is the power consumption of the electronic device, S1 is the convection heat transfer area, Delta T is the temperature difference between the center temperature of the electronic device surface and the inlet water temperature, and h is the local convection heat transfer coefficient.

[0085] Under the condition of certain power consumption, convection heat transfer area and inlet water temperature, the local convection heat transfer coefficient is improved, so that the center temperature of the electronic device surface is reduced, and good heat dissipation effect is realized. Through experiments, the case temperature of the heat dissipation chamber is 78.81℃, the temperature of the first projection area formed by the projection of the inlet in the heat dissipation chamber is the lowest, and gradually increases along the radial direction, which can meet the design expectation in the early stage.

[0086] In some embodiments, referring to FIGS. 2, 3 and 4, the jet flow chamber 11 is a circular structure in the direction of the bottom inner wall C of the jet flow chamber 11 (i.e. in the overhead view), and a plurality of circular arrangement lines 112 with increasing diameters are arranged around the center B of the bottom inner wall C of the jet flow chamber 11; a plurality of jet flow holes 111 are arranged on each circular arrangement line 112.

[0087] In some embodiments, referring to FIG. 4, the bottom inner wall C of the jet flow chamber 11 is a planar structure, and referring to FIG. 3, the jet flow hole 111 penetrates the bottom inner wall C of the jet flow chamber 11 along the axial direction Y of the inlet.

[0088] In the embodiments of the present application, the liquid heat dissipation medium will be pressurized to increase the flow rate when entering the jet flow chamber 11, and the heat dissipation medium will be further pressurized to increase the flow rate after further entering the jet flow hole 111, so that the high-speed heat dissipation medium can directly impact the heating surface of the heat dissipation fin in the heat dissipation chamber 12 at high speed, thereby achieving the effect of rapid heat dissipation and cooling.

[0089] Specifically, the embodiment of the present application can design the structure of the jet chamber 11 to be circular in the top view. The circular jet chamber 11 can allow the liquid heat dissipation medium to spread along the radial circumference and pressurize to achieve high-speed flow. The bottom inner wall C of the jet chamber 11 can be a planar structure, so that the jet hole 111 can pass through the bottom inner wall C of the jet chamber 11 along the direction Y, thereby connecting the jet chamber 11 and the heat dissipation chamber 12. In addition, the embodiment of the present application is arranged around the center B of the bottom inner wall of the jet chamber 11. A plurality of circular arrangement lines 112 with increasing diameters are arranged in sequence, so that a plurality of jet holes 111 are arranged on each circular arrangement line 112 in a spaced and uniform manner. This can ensure that the jet holes 111 are uniformly distributed in multiple layers on the bottom inner wall of the jet chamber 11, so that the heat dissipation medium is uniformly injected into the heat dissipation chamber through the uniformly distributed jet holes, thereby further ensuring the uniformity of the heat generating surface on the basis of cooling the local hot spots.

[0090] In the embodiment of the present application, the number of circular arrangement lines is not limited, and the number of circular arrangement lines can be increased or decreased according to actual needs. In addition, in some embodiments, a jet hole can also be arranged at the position of the center B.

[0091] In some embodiments, referring to FIG. 5, a cross-sectional partial structure diagram of a heat dissipation device is shown. Along the direction X of the jet chamber 11 pointing to the water inlet 20, the cross-sectional width of the jet chamber 11 decreases in sequence.

[0092] In the embodiment of the present application, as shown in FIG. 5, along the direction X, the cross-sectional width of the jet chamber 11 decreases in sequence. Such design can cause the structure characteristic of the jet chamber 11 being “narrow at the top and wide at the bottom”, so that when the heat dissipation medium enters the jet chamber 11 through the water inlet 20, the change from narrow to wide in space can achieve the effect of pressurization and flow rate improvement.

[0093] In some embodiments, the cross section of the jet chamber is a dome structure, or the cross section of the jet chamber is a trapezoidal structure.

[0094] Referring to FIG. 5, the cross section of the jet chamber is a dome structure. The dome structure can form a structure similar to a “dome” in the jet chamber, that is, a uniform structure changing from narrow to wide, which can further improve the effect of pressurization and flow rate improvement of the heat dissipation medium. Of course, the embodiment of the present application does not specifically limit the shape of the cross section of the jet chamber, and the cross section of the jet chamber can also be a trapezoidal structure, etc.

[0095] In some embodiments, referring to FIG. 6, which shows a schematic diagram of a top view of a heat dissipation fin structure, the outline of the heat dissipation chamber 12 includes two straight edges 402 and two outer arc edges 401 in the direction of the bottom inner wall of the heat dissipation chamber 12 (i.e. in the top view); the two straight edges 402 are oppositely arranged, and the two outer arc edges 401 are oppositely arranged.

[0096] In the embodiments of the present application, in order to match the structural characteristics of the device body 10 having two opposite long edges, the outline of the heat dissipation chamber 12 can be designed to be composed of two straight edges 402 and two outer arc edges 401 in the top view, so that the two straight edges 402 can be parallel to the two opposite long edges of the device body 10, and in addition, the positions between the straight edges 402 and the corresponding long edges of the device body 10 can be used to arrange the flow guide channels 50, and the two outer arc edges 401 extend towards the long edges of the device body 10, which improves the length of the heat dissipation chamber 12 and improves the heat dissipation area of the heat dissipation chamber.

[0097] In some embodiments, referring to FIG. 6, which shows a schematic diagram of a top view of a heat dissipation fin structure, the heat dissipation fin structure 40 includes: a circular fin area 411 and a plurality of annular fin areas 412; the annular fin areas 412 and the circular fin area 411 each include a plurality of heat dissipation fins 41 radially and radiatively distributed to enhance heat exchange; the circular fin area 411 is arranged at a first projection area position, the diameters of the plurality of annular fin areas 412 gradually increase, and the plurality of annular fin areas 412 are arranged in a nested manner around the circular fin area 411.

[0098] In the embodiments of the present application, the outer contour of the heat dissipation fin structure 40 is circular in the top view, which can facilitate the heat dissipation medium entering the heat dissipation chamber 12, and the heat dissipation medium can flow along the radial circumference in a scattered and high-speed manner, thereby rapidly carrying away the heat emitted by the core heat generating area of the electronic device and improving the heat dissipation performance of the heat dissipation device.

[0099] Further, the heat dissipation fin structure 40 can include: a circular fin area 411 and a plurality of annular fin areas 412 (FIG. 6 shows a heat dissipation fin structure 40 including two annular fin areas 412); the annular fin areas 412 and the circular fin area 411 each include a plurality of heat dissipation fins 41 radially and radiatively distributed; the circular fin area 411 is arranged at a first projection area position, and the plurality of annular fin areas 412 are arranged in a nested manner around the circular fin area 411.

[0100] The circular fin area 411 is arranged at a first projection area position of the water inlet 20 on the bottom inner wall of the heat dissipation chamber 12, so that the circular fin area 411 can quickly dissipate heat from the core heat generating part of the electronic device through the plurality of radially distributed heat dissipation fins 41 included therein, and the plurality of annular fin areas 412 are arranged in a nested manner around the circular fin area 411 in sequence, so that the annular fin areas 412 can dissipate heat from other parts around the core heat generating part through the plurality of radially distributed heat dissipation fins 41 included therein, and the plurality of annular fin areas 412 arranged in a nested manner around the circular fin area 411 in sequence can sufficiently increase the heat exchange area.

[0101] In some embodiments, referring to FIG. 6, in the direction towards the bottom inner wall of the heat dissipation chamber 12 (i.e. in the overhead view), the extension length of the heat dissipation fins 41 included in the annular fin area 412 close to the circular fin area 411 is less than the extension length of the heat dissipation fins 41 included in the annular fin area 412 away from the circular fin area 411.

[0102] That is, in the direction diverging outward from the center of the circular fin area 411, the size of the heat dissipation fins 41 included in different areas increases in sequence, thereby further expanding the coverage area of the heat dissipation fins and improving the coverage size of the heat dissipation area of the heat dissipation device.

[0103] In some embodiments, the number of annular fin areas around the circular fin area 411 is 2.

[0104] The embodiments of the present application combine the circular array jet structure in the jet chamber and the nested structure of the annular fin area around the circular fin area in the heat dissipation chamber, and have the excellent characteristics of jet cooling improving the local convective heat transfer coefficient and the fin structure enhancing the heat exchange surface area, so that the heat dissipation performance of the heat dissipation device is further improved.

[0105] In some embodiments, referring to FIG. 2, the heat dissipation chamber 12 is communicated with the water outlet 30 through the flow guide channel 50.

[0106] In the embodiments of the present application, the liquid heat dissipation medium can quickly take away the heat generated by the electronic device during the flow in the heat dissipation chamber 12, and then the heat dissipation medium carrying the heat can flow out from the water outlet 30 through the flow guide channel 50, thereby achieving the purpose of heat exchange.

[0107] In some embodiments, referring to FIG. 2, the flow guide channel 50 includes two outer channels 51 arranged on opposite sides of the heat dissipation chamber 12.

[0108] In the embodiments of the present application, the flow guide channel 50 can include two outer side channels 51 respectively arranged on opposite sides of the heat dissipation chamber 12, and the two outer side channels 51 can guide the heat dissipation medium in the heat dissipation chamber 12 close to the outer side. The symmetrical arrangement of the two outer side channels 51 can improve the guiding efficiency of the heat dissipation medium in the heat dissipation chamber 12 close to the outer side.

[0109] In some embodiments, referring to FIG. 2, the flow guide channel 50 includes a plurality of inner side channels 52 arranged at intervals between the side of the heat dissipation chamber 12 close to the water outlet 30 and the water outlet 30.

[0110] In the embodiments of the present application, the flow guide channel 50 can include a plurality of inner side channels 52 arranged at positions between the heat dissipation chamber 12 and the water outlet 30, and the plurality of inner side channels 52 can guide the heat dissipation medium in the heat dissipation chamber 12 close to the inner side. The uniform interval distribution of the plurality of inner side channels 52 can improve the guiding efficiency of the heat dissipation medium in the heat dissipation chamber 12 close to the inner side.

[0111] In some embodiments, referring to FIG. 7, the outer side channel 51 includes a first horizontal section 512, a second horizontal section 514, a first bending section 511, a second bending section 513 and a third bending section 515. One end of the first bending section 511 is in communication with the heat dissipation chamber 12, and the other end of the first bending section 511 is in communication with one end of the first horizontal section 512. The first horizontal section 512 is parallel to the long side of the device main body 10. The other end of the first horizontal section 512 is in communication with one end of the second horizontal section 514 through the second bending section 513. The bending angle of the second bending section 513 is obtuse, so that the included angle between the first horizontal section 512 and the second horizontal section 514 is obtuse. The other end of the second horizontal section 514 is in communication with the water outlet 30 through the third bending section 515.

[0112] In the embodiments of the present application, the two outer side channels 51 respectively arranged on opposite sides of the heat dissipation chamber 12 can guide the heat dissipation medium in the heat dissipation chamber 12 close to the outer side. The symmetrical arrangement of the two outer side channels 51 can improve the guiding efficiency of the heat dissipation medium in the heat dissipation chamber 12 close to the outer side. Specifically, each outer side channel 51 is composed of a horizontal section and a bending section. The horizontal section ensures the extension of the outer side channel 51 in the length direction of the device main body 10, and the bending section realizes the direction change and connection of the outer side channel 51 with other parts. For example, the first bending section 511 realizes the connection of the outer side channel 51 with the heat dissipation chamber 12, the second bending section 513 realizes the direction change of the outer side channel 51 at the corner, and the third bending section 515 realizes the connection of the outer side channel 51 with the water outlet. Through the reasonable design of the structure of the outer side channel, the transmission efficiency of the outer side channel can be higher, and the adaptability of the outer side channel with other structures in the device main body can be stronger.

[0113] In some embodiments, referring to FIG. 7, the plurality of inner side channels 52 includes three straight channels 521 and two curved channels 522; one first straight channel of the three straight channels 521 is arranged on the shortest line between the heat dissipation chamber 12 and the water outlet 30 in the top view; the other two second straight channels are symmetrically arranged on both sides of the first straight channel, one end of the second straight channel is in communication with the heat dissipation chamber 12, and the other end of the second straight channel is in communication with the water outlet 30 through the curved channel 522.

[0114] In the embodiments of the present application, the plurality of inner side channels 52 can realize the drainage of the heat dissipation medium close to the inner side in the heat dissipation chamber 12, and the plurality of inner side channels 52 are uniformly and spacedly distributed, which can improve the drainage efficiency of the heat dissipation medium close to the inner side in the heat dissipation chamber 12. Specifically, the circumferential array of the three straight channels 521 is between the heat dissipation chamber 12 and the water outlet 30, which can quickly transport the heat dissipation medium along the length direction of the device main body 10, and the curved channel 522 realizes the connection between the inner side channel 52 and the water outlet 30, so as to finally collect the plurality of inner side channels 52 to the water outlet 30.

[0115] In some embodiments, referring to FIG. 1, the water inlet 20 and the water outlet 30 are arranged on the same face of the device main body 10.

[0116] In the embodiments of the present application, the water inlet 20 and the water outlet 30 are arranged on the same face of the device main body 10, which makes the other face of the device main body 10 can be arranged with a containing groove matched with the size of the electronic device, the device main body 10 can cover the electronic device, and the electronic device is arranged in the containing groove. Therefore, arranging the water inlet and the water outlet on the same face of the device main body can make the heat dissipation device more convenient to assemble with the electronic device.

[0117] In some embodiments, the line between the water inlet 20 and the water outlet 30 is parallel to the long side of the circumscribed rectangle of the device main body 10.

[0118] It should be noted that the embodiments of the present application do not specifically limit the arrangement position of the water inlet and the water outlet, and the water inlet and the water outlet can also be arranged at the side face or other positions of the device main body.

[0119] In some embodiments, referring to FIG. 5, along the axial direction Y of the water inlet 20, the water inlet 20 includes a first segment 21 and a second segment 22; the inner diameter of the first segment 21 is greater than the inner diameter of the second segment 22; the second segment 22 is located between the first segment 21 and the jet chamber 11.

[0120] In the embodiment of the present application, the water inlet 20 includes a first section 21 with a wider inner diameter and a second section 22 with a narrower inner diameter. The first section 21 with a wider inner diameter is located on the outer side, so that the liquid heat dissipation medium can be more conveniently introduced into the water inlet 20. The second section 21 with a narrower inner diameter is located on the inner side, so that the liquid heat dissipation medium can experience the effect of pressure increase and flow rate improvement when entering the second section 22 from the first section 21 with a wider inner diameter. The heat dissipation medium with pressure increase and flow rate improvement can achieve better heat exchange effect inside the heat dissipation device.

[0121] In some embodiments, referring to FIG. 6, the outer contour of the heat dissipation fin structure 40 is circular in the direction towards the bottom inner wall of the heat dissipation chamber 12 (i.e. in the overhead view), and the spacing between adjacent heat dissipation fins 41 on the outer contour is 0.1mm-0.3mm.

[0122] In the embodiment of the present application, the spacing between adjacent heat dissipation fins 41 on the outer contour of the heat dissipation fin structure 40 is set to 0.1mm-0.3mm, which can ensure that the heat dissipation fins are densely arranged on the basis of being able to pass through the heat dissipation medium. The densely arranged heat dissipation fins can further increase the heat exchange area of the heat dissipation device and improve the heat exchange efficiency of the heat dissipation device. In some embodiments, the spacing between adjacent heat dissipation fins 41 is 0.2mm.

[0123] In some embodiments, the heat dissipation device is a three-dimensional printing structure.

[0124] In summary, in the embodiment of the present application, the heat dissipation device includes a device main body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device main body. The jet chamber is arranged at the projection position of the water inlet inside the device main body. The water inlet is in communication with the jet chamber. The jet chamber is between the water inlet and the heat dissipation chamber. The inner wall of the jet chamber is provided with a plurality of circumferentially arranged jet holes. The jet chamber is used to introduce the heat dissipation medium entering the water inlet into the heat dissipation chamber through the jet holes. In the present application, the heat dissipation medium enters the jet chamber through the water inlet and then enters the heat dissipation chamber, which realizes a heat dissipation medium transmission mode of first longitudinally and then transversely. This helps to uniformly distribute the heat dissipation medium and fully utilizes the advantage of the heat dissipation medium in carrying away heat, thereby improving the overall uniformity of the heat dissipation device and strengthening the convective heat exchange capacity.

[0125] Referring to FIG. 8, a flow chart of the steps of a manufacturing method of a heat dissipation device is shown. The method includes performing multiple three-dimensional printing operations to obtain the heat dissipation device.

[0126] Each three-dimensional printing operation includes:

[0127] Step 101, laying a metal material powder.

[0128] Step 102, according to the digital modeling corresponding to the heat dissipation device, the metal material powder is three-dimensionally printed by laser to obtain a printing layer corresponding to the three-dimensional printing operation.

[0129] In the embodiment of the present application, the related technology adopts a cold plate with a shovel tooth structure to realize heat dissipation. The shovel tooth cold plate is a device obtained by machining a plurality of parts by brazing. This method may have problems such as poor cold plate machining and easy liquid leakage. The embodiment of the present application can prepare a heat dissipation device by three-dimensional printing. Three-dimensional printing can effectively eliminate the hidden danger. In addition, the three-dimensional printing process can meet the engineering implementation of complex structures. The heat dissipation device is convenient to operate and maintain, and the production scheme of the heat dissipation device has high feasibility.

[0130] The design process of three-dimensional printing is: first, software modeling of the heat dissipation device is performed by a computer, and then the three-dimensional model is "partitioned" into cross sections, i.e., slices, to guide the subsequent layer-by-layer printing of the printer. The standard file format for cooperation between the design software and the printer can be the Standard Template Library (STL) file format. An STL file can use triangular faces to approximate the surface of an object. The smaller the triangular face, the higher the surface resolution generated.

[0131] The slicing process specifically slices the three-dimensional model of the heat dissipation device according to the set layer thickness (such as 0.04 mm) using slicing software, and divides the three-dimensional model into a series of horizontal layers. Each layer can be converted into a two-dimensional image that describes the area that needs to be filled or built during printing. In the slicing software, the position and angle of the model on the printing platform can be adjusted to optimize the printing effect and save materials.

[0132] Then, layer-by-layer printing can be performed. The printer reads the cross-sectional information in the slicing file and prints the cross sections layer by layer using powdered metal materials. The printed layers are then bonded in various ways to manufacture a heat dissipation device.

[0133] Specifically, the manufacturing method of the heat dissipation device includes performing multiple three-dimensional printing operations to obtain the heat dissipation device. That is, each three-dimensional printing operation further prints a new layer of structure on the printing result of the previous operation until the last three-dimensional printing operation is completed, and the heat dissipation device is obtained. The entire process can be implemented without supervision, reducing the dependence on human resources.

[0134] Further, each time the three-dimensional printing operation needs to further lay the metal material powder on the last printing result, and then the three-dimensional printing of the metal material powder can be performed according to the digital modeling corresponding to the heat dissipation device to obtain the printing layer corresponding to the three-dimensional printing operation. The digital modeling can be a three-dimensional modeling file of the heat dissipation device, which represents the all-around structural details of the heat dissipation device in the three-dimensional virtual environment. According to the three-dimensional printing of the digital modeling, the heat dissipation device with accurate structure can be obtained.

[0135] In summary, in the embodiments of the present application, the manufacturing method of the heat dissipation device includes performing multiple three-dimensional printing operations to obtain the heat dissipation device. Each time the three-dimensional printing operation includes laying the metal material powder. According to the digital modeling corresponding to the heat dissipation device, the three-dimensional printing of the metal material powder is performed to obtain the printing layer corresponding to the three-dimensional printing operation. The embodiments of the present application realize the production of the heat dissipation device through three-dimensional printing, which can eliminate the problem of high failure rate and easy leakage in the related art of manufacturing the cold plate with a shovel tooth structure through the machining process of brazing multiple parts into one, and can meet the engineering realization of complex structures through three-dimensional printing technology, so that the heat dissipation device is convenient to operate and maintain, and the production scheme of the heat dissipation device has high feasibility.

[0136] In addition, based on the three-dimensional printing process, more complex structure of the heat dissipation device can be realized in subsequent structure design, thereby meeting the design demand of high efficiency heat exchange to cope with the challenge of gradually increasing heat flux density of electronic devices in the future.

[0137] In some embodiments, step 101 can specifically include:

[0138] Sub-step 1011, laying the metal material powder on the substrate when performing the first three-dimensional printing operation.

[0139] In the embodiments of the present application, when performing the first three-dimensional printing operation, the metal material powder can be laid on the substrate, so that the first printing layer can be formed on the substrate when the first three-dimensional printing operation is completed.

[0140] Sub-step 1012, laying the metal material powder on the printing layer obtained by the last three-dimensional printing operation when performing the non-first three-dimensional printing operation.

[0141] In the embodiments of the present application, when performing the non-first three-dimensional printing operation, the metal material powder can be laid on the printing layer obtained by the last three-dimensional printing operation, so that after the non-first three-dimensional printing operation is completed, a new printing layer can be further superimposed on the printing layer formed by the last three-dimensional printing. Until the last three-dimensional printing operation is completed, the heat dissipation device is obtained.

[0142] In some embodiments, after a three-dimensional printing operation is completed, before the next three-dimensional printing operation is performed, the method further comprises:

[0143] In step 103, a preset time length is waited for to wait for the printed layer obtained by the three-dimensional printing operation to be cooled and formed.

[0144] In the embodiments of the present application, since the three-dimensional printing is a process of melting and reshaping the metal material powder by laser, after a three-dimensional printing operation is completed, before the next three-dimensional printing operation is performed, the next three-dimensional printing operation can be performed after a preset time length is waited for. The purpose of waiting for the preset time length is to ensure that the printed layer obtained by the three-dimensional printing operation can be cooled and formed.

[0145] In some embodiments, the height of each printed layer is 0.02-0.06 mm.

[0146] In a specific example, the manufacturing method of the heat dissipation device comprises the following steps: first, a powder laying device is used to lay copper powder (which can also be other metal materials) evenly on a substrate, then a scanning device emits laser to the copper powder according to the information provided by the digital modeling corresponding to the heat dissipation device to melt the copper powder, and then the copper powder is rapidly condensed and formed. Then the equipment continues to perform the powder laying action to perform the next layer of printing and forming, and the heat dissipation device is printed by accumulating and melting and forming layer by layer, wherein in some embodiments, the height of each printed layer is about 0.04 mm. The three-dimensional printing technology uses small and medium power lasers to quickly and completely melt the selected metal powder and the rapid cooling and solidification technology can obtain a non-equilibrium supersaturated solid solution and a uniform and fine metallographic structure, and the density is nearly 100%. The powder material can be single metal powder, composite powder, and high-melting-point refractory alloy powder, which is not limited in the embodiments of the present application.

[0147] In summary, the heat dissipation device of the embodiment of the present application is integrated with the enhanced heat exchange structure formed by the jet flow chamber with the circumferential array jet flow hole structure and the heat dissipation fin, and is processed by the three-dimensional printing process. The integrated structure can achieve the effect of low leakage. In addition, the circumferential array jet flow hole structure in the jet flow chamber indirectly dissipates heat for the main core area of the electronic device. The array jet flow cooling structure formed by the circumferential array jet flow hole structure and the heat dissipation fin is combined with each other, so that the heat dissipation device combines the excellent characteristics of the local convective heat transfer coefficient and the enhanced heat exchange surface area of the spade tooth structure. In addition, the enhanced jet flow heat exchange is performed in the water inlet area of the heat dissipation device, so as to take away the heat of the core area of the electronic device. The liquid horizontal flow direction of the spade tooth cold plate in the related art is overturned, the disadvantage of poor uniformity of the heating surface of the traditional spade tooth cold plate is changed, and a micro-channel spade tooth structure arranged radially along the inlet area is proposed, which is helpful to uniform distribution of the fluid and fully takes advantage of the heat removal advantage of the refrigerant, so that the fluid is uniformly distributed on the entire heat exchange surface. The heat dissipation capacity of the heat dissipation device based on the embodiment of the present application is improved by more than 20% compared with the traditional spade tooth cold plate.

[0148] In addition, in the embodiment of the present application, the manufacturing method of the heat dissipation device includes performing multiple three-dimensional printing operations to obtain the heat dissipation device. Each three-dimensional printing operation includes laying metal material powder. According to the digital modeling corresponding to the heat dissipation device, the metal material powder is three-dimensionally printed by laser to obtain a printing layer corresponding to the three-dimensional printing operation. The production of the heat dissipation device is realized by three-dimensional printing in the embodiment of the present application, which can eliminate the problem of high failure rate and easy leakage caused by the processing technology of brazing multiple parts into one to manufacture the spade tooth structure cold plate in the related art, and the three-dimensional printing technology can meet the engineering realization of complex structures, so that the heat dissipation device is convenient to operate and maintain, and the production scheme of the heat dissipation device has high feasibility.

[0149] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments. The above specific embodiments are only illustrative, but not limiting. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the protection scope of the claims.

Claims

1. A heat dissipating device, characterized by, The heat dissipation device comprises: a device body, a water inlet, a water outlet, a jet chamber and a heat dissipation chamber arranged inside the device body; the water inlet and the water outlet are arranged on the surface of the device body, and the jet chamber is arranged at the projection position of the water inlet inside the device body; the water inlet is in communication with the jet chamber, and the jet chamber is between the water inlet and the heat dissipation chamber, the inner wall of the jet chamber is provided with a plurality of circumferential arrays of jet holes, and the jet chamber is configured to introduce the heat dissipation medium entering through the water inlet into the heat dissipation chamber through the jet holes.

2. The heat dissipating device according to claim 1, wherein The heat dissipation chamber is provided with a heat dissipation fin structure, which comprises: a plurality of heat dissipation fins radially distributed along a first projection area, and the first projection area is an area projected by the water inlet in the heat dissipation chamber.

3. The heat dissipating device of claim 2, wherein, The heat dissipation fin is a rectangular plate structure, and the extension direction of the long side of the heat dissipation fin is consistent with the radial radiation direction of the heat dissipation fin. One side of the heat dissipation fin is connected with the inner wall of the side of the heat dissipation chamber close to the water inlet, and the opposite side of the heat dissipation fin is connected with the inner wall of the side of the heat dissipation chamber away from the water inlet.

4. The heat dissipating device of claim 1, wherein In the direction towards the bottom inner wall of the jet chamber, the jet chamber is a circular structure, and a plurality of circular arrangement lines with diameters increasing in sequence are arranged around the center of the bottom inner wall of the jet chamber. A plurality of jet holes are uniformly arranged on each circular arrangement line.

5. The heat dissipating device of claim 1, wherein The bottom inner wall of the jet chamber is a plane structure, and the jet holes penetrate the bottom inner wall of the jet chamber along the axial direction of the water inlet.

6. The heat dissipating device of claim 1, wherein In the direction of the jet chamber pointing to the water inlet, the cross-sectional width of the jet chamber decreases in sequence.

7. The heat dissipating device according to claim 6, wherein The cross section of the jet chamber is a dome structure.

8. The heat dissipating device of claim 6, wherein, The cross section of the jet chamber is a trapezoidal structure.

9. The heat dissipating device of claim 1, wherein, In the direction towards the bottom inner wall of the heat dissipation chamber, the profile of the heat dissipation chamber comprises two straight lines and two outer arc lines; the two straight lines are oppositely arranged, and the two outer arc lines are oppositely arranged.

10. The heat dissipating device of claim 2, wherein, The heat dissipation fin structure comprises: a circular fin area and a plurality of annular fin areas; the annular fin area and the circular fin area each comprise a plurality of heat dissipation fins radially distributed; The circular fin area is arranged at the position of the first projection area, and a plurality of annular fin areas are arranged around the circular fin area and nested in sequence.

11. The heat dissipating device according to claim 10, wherein In the direction towards the bottom inner wall of the heat dissipation chamber, among a plurality of annular fin areas, the extension length of the heat dissipation fins included in the annular fin area close to the circular fin area is less than the extension length of the heat dissipation fins included in the annular fin area away from the circular fin area.

12. The heat dissipating device of claim 1, wherein, The heat dissipation chamber and the water outlet are in communication through a flow guide channel.

13. The heat dissipating device of claim 12, wherein, The flow guide channel comprises: two outer channels, and the two outer channels are arranged on opposite sides of the heat dissipation chamber, respectively.

14. The heat dissipating device of claim 12, wherein, The flow guide channel comprises: a plurality of inner channels, and the plurality of inner channels are arranged between the side of the heat dissipation chamber close to the water outlet and the water outlet.

15. The heat dissipating device of claim 13, wherein, The outer side channel comprises a first horizontal section, a second horizontal section, a first bending section, a second bending section and a third bending section; One end of the first bending section is in communication with the heat dissipation chamber, and the other end of the first bending section is in communication with one end of the first horizontal section; the first horizontal section is parallel to the long side of the device body; The other end of the first horizontal section is in communication with one end of the second horizontal section through the second bending section, and the bending angle of the second bending section is obtuse, so that the included angle between the first horizontal section and the second horizontal section is obtuse; The other end of the second horizontal section is in communication with the water outlet through the third bending section.

16. The heat dissipating device of claim 14, wherein, A plurality of the inner side channels comprise three straight channels and two curved channels; One first straight channel of the three straight channels is arranged on the shortest line connecting the heat dissipation chamber and the water outlet; the other two second straight channels are symmetrically arranged on both sides of the first straight channel, one end of the second straight channel is in communication with the heat dissipation chamber, and the other end of the second straight channel is in communication with the water outlet through the curved channel.

17. The heat dissipating device of claim 1, wherein, The water inlet and the water outlet are arranged on the same face of the device body.

18. The heat dissipating device of claim 1, wherein, In the axial direction of the water inlet, the water inlet comprises a first section and a second section; the inner diameter of the first section is larger than that of the second section; The second section is located between the first section and the jet flow chamber.

19. The heat dissipating device of claim 2, wherein, In the direction of the bottom inner wall of the heat dissipation chamber, the spacing between adjacent heat dissipation fins on the outer contour of the heat dissipation fin structure is 0.1mm-0.3mm.

20. The heat dissipating device according to claim 1, wherein The heat dissipation device is a three-dimensional printing structure.

Images